A post-plating preparation method for LED bracket without glue removal

Abstract

The present invention discloses a post-plating preparation method of an LED bracket exempt from glue removal, including the steps of substrate molding, film pasting, injection molding, curing and film tearing, and electroplating. Before the injection molding step, a sealing film is pasted on the front and back sides of the LED bracket substrate, and then a thermosetting material is injected into the groove and hollow part of the LED bracket substrate through the injection molding port on the sealing film, and the sealing films on both sides are removed after the thermosetting material solidifies. Through the preparation method of the present invention, no glue removal step is required, thereby avoiding the technical defects of the injection molding material not being able to be completely removed, affecting the brightness, poor conductivity, and affecting the air tightness of the structure.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor devices, and in particular to a post-plating preparation method for a glue-free LED bracket. Background Art

[0002] In the prior art, LED brackets can be manufactured using two processes: front plating and back plating. The process of the front plating process is as follows: first, the LED bracket substrate is engraved on the substrate by etching or punching, and then the metal material is plated on the LED bracket substrate by electroplating, and then the thermosetting material is injection molded on the surface of the LED bracket substrate. Finally, the burrs and residual thermosetting materials on the top of the LED bracket substrate are removed by chemical agents or sandblasting, and the finished product is combined with the injection layer with the electroplating layer. The disadvantages of the front plating process are: the bonding between the plating layer and the injection molding adhesive is poor and easy to fall off; the degumming process using chemical agents may destroy the airtightness of the bracket structure, causing the LED chip to fail to work properly; the residual excess glue in the injection molding process cannot be completely removed, which affects the surface brightness of the product and may also cause poor conductivity.

[0003] The process of post-plating is as follows: first, the LED bracket substrate is carved out on the substrate by etching or punching, and then the thermosetting material is injection molded on the surface of the LED bracket substrate, and then the burrs and residual thermosetting material on the LED bracket substrate are removed by chemical agents or sandblasting, and finally the metal material is plated on the LED bracket substrate by electroplating. The bracket substrate is combined with the injection layer in the finished product. The disadvantages of post-plating process are: the degumming process using chemical agents may destroy the airtightness of the bracket structure, causing the LED chip to fail to work properly; the residual glue overflow during the injection molding process cannot be completely removed, which affects the surface brightness of the product and may also cause poor conductivity.

[0004] It can be seen that in the prior art, whether the pre-plating process or the post-plating process is used, a degumming process is required. However, in the actual production process, the degumming process cannot completely remove the residual glue, and the degumming process may also affect the airtightness of the LED bracket structure. Summary of the invention

[0005] The purpose of the present invention is to provide a post-plating preparation method for an LED bracket that does not require any glue removal process, thereby solving the problem that the glue removal process may affect the airtightness of the LED bracket structure.

[0006] According to the present invention, a post-plating preparation method of a glue-free LED bracket comprises the following steps:

[0007] Step A, forming a substrate, forming an LED bracket substrate on a metal substrate by etching or punching, wherein the LED bracket substrate is formed with a plurality of grooves and hollow parts that are interconnected;

[0008] Step B, film pasting, pasting sealing films on the front and rear sides of the LED bracket substrate prepared in step A respectively, and opening at least one injection port in each sealing film that is connected to the groove and the hollow part;

[0009] Step C, injection molding, injecting a molten thermosetting material into the injection molding port of the LED bracket substrate after the film is applied in step B, so as to fill the multiple grooves and hollow parts of the LED bracket substrate;

[0010] Step D, curing and tearing the film, cooling the LED bracket substrate after injection molding in step C to cool and solidify the thermosetting material in a molten state, and then tearing off the sealing film;

[0011] Step E: electroplating: electroplating the LED bracket substrate in step D using electroplating equipment to form a metal reflective layer on the surface of the LED bracket substrate.

[0012] Wherein, the metal substrate in step A is a copper substrate or an iron substrate.

[0013] Wherein, the LED bracket substrate in step A is prepared by etching.

[0014] Wherein, in step A, the following steps are included:

[0015] Step a, primary dust removal, first perform dust removal on the front and rear sides of the metal substrate, put the metal substrate into a dust collecting machine for dust removal, and the pressure of the dust collecting paper of the dust collecting machine is 0.2-0.4Mpa;

[0016] Step b, preheating, the dust-removed metal substrate enters a preheating machine for preheating, and the preheating temperature is 90-110°C;

[0017] Step c, attaching the dry film, the preheated metal substrate enters the laminating machine, and the front and rear sides of the metal substrate are pressed with dry film, the conveying speed of the laminating machine is 2.3-3.3 m / min, the temperature of the hot laminating wheel for laminating is 110-120°C, and the pressure of the hot laminating wheel is 0.3-0.5 MPa, and the temperature of the laminating strip for cutting is 40-60°C;

[0018] Step d, exposure, after the dry film is attached to the metal substrate, a partial area of ​​the dry film is exposed to form a pattern on the dry film;

[0019] Step e, developing, removing the unexposed area of ​​the dry film with a developer, the developer being a potassium carbonate solution, and the mass concentration of potassium carbonate being 8 to 14 g / L;

[0020] Step f, washing once, using pure water to clean the developer remaining on the surface of the dry film;

[0021] Step g, etching, using an etching solution to etch the metal substrate into hollow parts and grooves, the etching solution comprising the following components in mass concentration: Cu 2+ The concentration is 120-150 g / L, the hydrochloric acid concentration is 0.7-1.3 mol / L, and the rest is pure water;

[0022] Step h, secondary water washing, using pure water to clean the etching solution remaining on the metal substrate;

[0023] Step i, removing the dry film, using a film removal accelerator to remove the dry film on the front and back sides of the metal substrate;

[0024] Step j, washing three times with water, using pure water to clean the film removal accelerator remaining on the metal substrate;

[0025] Step k, pickling, using a pickling solution to clean the residual film removal accelerator, the pickling solution can be 3-5% sulfuric acid, 6-20g / L hydrogen peroxide and Cu 2+ One or a combination of two or more micro-etching solutions with a concentration of 5 to 45 g / L;

[0026] Step 1, washing four times with water, using pure water to clean the acid wash solution remaining on the metal substrate;

[0027] Step m: drying: drying the metal substrate at a temperature of 80 to 100° C. to form an LED bracket substrate.

[0028] Wherein, the method may further include step n, performing a semi-etching roughening treatment on the LED bracket substrate prepared in step m; in step n, the following steps are included:

[0029] Step S1, pure water cleaning, using pure water to clean the LED bracket substrate prepared in step n;

[0030] Step S2, degreasing, degreasing the LED bracket substrate cleaned in step S1 with sulfuric acid having a concentration of 3 to 5%;

[0031] Step S3, super roughening, spraying the roughening liquid onto the area of ​​the LED bracket substrate to be roughened, the super roughening temperature is 24-28°C, and the Cu 2+ The concentration is 15-45 g / L, and the micro-etching amount is 0.6-1 μm;

[0032] Step S4, pickling, the pickling solution is a hydrochloric acid solution, wherein the concentration of hydrochloric acid is 3-4%, Cu 2+ Content ≤2g / L, pickling temperature 80~100℃;

[0033] Step S5, drying, drying the LED bracket substrate at a drying temperature of 80-100° C.;

[0034] Step S6, water break test, the LED bracket base after acid washing is subjected to water break test, and the water hanging time is ≥30s.

[0035] The metal reflective layer is one of gold, silver, copper, nickel, and palladium.

[0036] The present invention has the following beneficial effects: before the injection molding step, a layer of sealing film is firstly applied to the front and rear sides of the LED bracket substrate, and then a thermosetting material is injected into the groove and the hollow part of the LED bracket substrate through the injection molding port on the sealing film, and the sealing films on both sides are removed after the thermosetting material is solidified; through the preparation method of the present invention, no glue removal step is required, thereby avoiding the technical defects of the injection molding material not being able to be completely removed, affecting the brightness, poor conductivity and affecting the air tightness of the structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 Schematic diagram of the LED bracket substrate formed after etching or punching in this embodiment.

[0038] Figure 2 Schematic diagram of the LED bracket substrate after being covered with a sealing film in this embodiment.

[0039] Figure 3 Schematic diagram of the LED bracket substrate after injection molding in this embodiment.

[0040] Figure 4 It is a schematic diagram of the LED bracket substrate after the film is torn off in this embodiment.

[0041] Figure 5 It is a schematic diagram of the LED bracket substrate after electroplating in this embodiment.

[0042] Figure 6 It is a partial view of the LED bracket substrate in this embodiment.

[0043] Figure 7 yes Figure 6 Cross-sectional view at BB in . DETAILED DESCRIPTION

[0044] For better understanding and implementation, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0045] In the description of the present invention, it should be noted that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0047] This embodiment provides a method for preparing a post-plating LED bracket without glue. Figures 1 to 7 As shown, the preparation method comprises the following steps:

[0048] Step A, substrate molding, using etching or punching to form an LED bracket substrate 1 on a metal substrate, wherein the LED bracket substrate 1 is formed with a plurality of mutually conductive grooves 11 and hollow portions 12. Optionally, the metal substrate can be a copper substrate or an iron substrate or other metal materials.

[0049] Step B, film pasting, pasting sealing films 2 on the front and rear sides of the LED bracket substrate 1 prepared in step A respectively, and opening at least one injection port on each sealing film 2 that is in communication with the groove 11 and the hollow portion 12;

[0050] Step C, injection molding, injecting a molten thermosetting material into the injection molding port of the LED bracket substrate 1 after the film is applied in step B, so as to fill the multiple grooves 11 and hollow parts 12 of the LED bracket substrate 1;

[0051] Step D, curing and tearing the film, cooling the LED bracket substrate 1 after injection molding in step C, so that the thermosetting material in a molten state is cooled and solidified, and then the sealing film 2 is torn off;

[0052] Step E: electroplating: electroplating the LED bracket substrate 1 in step D using electroplating equipment to form a metal reflective layer on the surface of the LED bracket substrate 1 .

[0053] As an improvement, Figure 1 As shown, firstly, the LED bracket substrate 1 is formed on the metal substrate by etching or punching in step A according to the design scheme. The specific etching or punching scheme can be designed according to the requirements of the LED bracket substrate. Figure 6 and Figure 7 , Figure 6It is a partial plan view of the LED bracket substrate 1 and a cross-sectional view at BB. Figure 7 A plurality of mutually conductive grooves 11 and hollow portions 12 have been etched or punched out on the metal substrate.

[0054] like Figure 2 As shown, in step B, a layer of sealing film 2 is respectively applied to the front and rear sides of the LED bracket substrate 1 prepared in step A, and the coating can be performed by using a coating device. The sealing film 2 needs to be tightly fitted to the side of the LED bracket substrate 1 to prevent the thermosetting material from penetrating into the outer surface of the bracket substrate during the injection molding process. An injection molding port 10 is provided on the sealing film 2. The number of injection molding ports 10 can be selectively set according to actual needs. The opening of the injection molding port 10 can be performed by opening a hole, or during the coating process of the sealing film 2, a part of the edge of the sealing film 2 is not bonded to the LED bracket substrate 1, thereby forming the injection molding port 10.

[0055] In step C, the injection molding device is connected to the injection molding port 10, and the injection molding device injects injection molding material, such as a thermosetting material, into the grooves 11 and hollow portions 12 between the sealing films 2. The injection molding material flows through each groove 11 and hollow portion 12 in sequence until the fillable space between the sealing films 2 is filled.

[0056] In step D, if Figure 3 and Figure 4 As shown, Figure 3 The sealing film 2 is marked with a wire frame, and the injection molding is stopped and the injection molding material is completely solidified. Optionally, the curing can be carried out by natural air drying or cold air cooling. When the film is torn off, the sealing film 2 attached to the front and back sides of the LED bracket substrate 1 can be peeled off manually or by a robot, so as to obtain Figure 4 As shown, the LED support substrate 1 has the groove 11 and the hollow portion 12 filled with injection molding material.

[0057] In step E, the obtained sheet-like LED bracket substrate 1 is placed in an electroplating station for electroplating, thereby forming a metal reflective layer on the surface of the LED bracket substrate 1. Since the injection molding material is not a metal material, the metal reflective layer will not be plated on the surface of the injection molding material, thereby completing the production of the entire LED bracket substrate 1.

[0058] The preparation method of the above steps A to E is applicable to the production of LED brackets without reflective cups. In other embodiments, if the LED bracket needs to be molded with a reflective cup, step F can be added to form a cup body. The reflective cup is injection molded on the surface of the LED bracket substrate 1 after electroplating in step E using injection molding equipment. Specifically, the injection molding method in the prior art can be used, which will not be described in detail here.

[0059] In the preparation method of this embodiment, a sealing film 2 is first applied to the front and rear sides of the LED bracket substrate 1 before the injection molding step, and then a thermosetting material is injected into the groove 11 and the hollow portion 12 of the LED bracket substrate 1 through the injection molding port on the sealing film 2, and the sealing films 2 on both sides are removed after the thermosetting material solidifies. With the preparation method of the present invention, no glue removal step is required, thereby avoiding the technical defects of the injection molding material not being completely removed, affecting the brightness, poor conductivity, and affecting the airtightness of the structure.

[0060] As a preferred solution, the LED bracket substrate 1 in step A is prepared by etching. Specifically, in step A, the following steps are included:

[0061] Step a, primary dust removal, first perform dust removal on the front and back sides of the metal substrate, specifically by using a dust sticking machine, put the metal substrate into the dust sticking machine for dust removal, the dust sticking machine drives the sticky paper to move toward the metal substrate so that the dust on the metal substrate adheres to the sticky paper, optionally, the pressure of the sticky paper of the dust sticking machine is 0.2~0.4Mpa.

[0062] Step b, preheating, the dust-removed metal substrate enters a preheating machine for preheating, the preheating temperature is 90-110° C., and preheating can facilitate subsequent bonding with the dry film.

[0063] Step c, attaching dry film, the preheated metal substrate enters the laminating machine, and the laminating machine presses the dry film on the front and back sides of the metal substrate. The conveying speed of the laminating machine is 2.3-3.3 m / min, the temperature of the hot laminating wheel used for laminating is 110-120°C, and the pressure of the hot laminating wheel is 0.3-0.5 MPa, and the temperature of the laminating strip used for cutting is 40-60 degrees Celsius. After the laminating machine completes the laminating of each metal substrate, it hot presses an indentation area on the dry film (the upper dry film and the lower dry film are pressed together, and there is no metal substrate between the two), so that the indentation area is formed between two adjacent laminating stations of the dry film, and the width tolerance of the indentation area is ≤2 mm. The width of the indentation area can be measured by using a ruler to determine whether the width of the indentation area is within the tolerance range. It can be observed whether the indentation area is flat, clean, and free of bubbles, so as to determine whether the lamination of the dry film and the metal substrate is uniform and whether the lamination quality meets the production standards.

[0064] Step d, exposure, after the dry film is attached to the metal substrate, partial areas of the dry film on the front and back sides of the metal substrate are exposed to form a pattern on the dry film. Optionally, a secondary dust removal process can be performed before exposure.

[0065] Step e: developing, removing the unexposed areas of the dry film with a developer, wherein the developer is a potassium carbonate solution, and the mass concentration of potassium carbonate is 8 to 14 g / L.

[0066] Step f: washing once, using pure water to clean the developer remaining on the surface of the dry film.

[0067] Step g, etching, using an etching solution to etch the metal substrate into the hollow portion 12 and the groove 11, the etching solution includes the following components in mass concentration: Cu 2+ The concentration is 120-150 g / L, the hydrochloric acid concentration is 0.7-1.3 mol / L, and the rest is pure water.

[0068] Step h: secondary water washing, using pure water to clean the etching solution remaining on the metal substrate.

[0069] Step i, removing the dry film, using a film removal accelerator to remove the dry film on the front and back sides of the metal substrate.

[0070] Step j, three water washes, using pure water to clean the film removal accelerator remaining on the metal substrate.

[0071] Step k, pickling, using a pickling solution to clean the residual film removal accelerator, the pickling solution can be 3-5% sulfuric acid, 6-20g / L hydrogen peroxide and Cu 2+ One or a combination of two or more micro-etching solutions with a concentration of 5 to 45 g / L. Optionally, the pickling can be divided into two pickling steps and performed separately.

[0072] Step 1: four water washes, using pure water to clean the acid wash solution remaining on the metal substrate.

[0073] Step m: drying: drying the metal substrate at a temperature of 80 to 100° C. to form an LED bracket substrate.

[0074] Preferably, a semi-etching roughening process can be added in step A. That is, step n is added to perform semi-etching roughening on the LED bracket substrate 1 prepared in step m. The residual etchant is removed and the surface quality is improved by roughening the hollowed-out and semi-etched positions. Roughening in this application refers to the formation of etching marks or textures of a certain depth on the surface of the material. The etching depth and texture type can be controlled by adjusting the concentration, temperature, exposure time and properties of the etchant itself. After etching is completed, further treatment such as cleaning and drying may be required. It processes the surface of the workpiece by mechanical or chemical methods to change the morphology and structure of the material surface and increase the surface roughness. The purpose of this process is mainly to improve the friction performance, adhesion, fatigue resistance and corrosion resistance of the material; mechanical methods usually include sandblasting, grinding wheel grinding and other methods, which cause tiny protrusions and depressions on the surface of the material through physical action, thereby increasing the surface roughness. The chemical method uses chemical reactions to form tiny protrusions and shell-like structures on the surface of the material to achieve a roughening effect. For example, an acidic or alkaline solution can be used to chemically etch the metal surface to make the surface rough, which can improve the bonding strength between the epoxy resin and the substrate, thereby improving the air tightness of the bracket. The roughening process can be performed using an acidic or alkaline solution.

[0075] Optionally, in the step n of half-etching and roughening, the following steps are included:

[0076] Step S1, pure water cleaning, using pure water to clean the LED bracket substrate prepared in step m.

[0077] Step S2, degreasing, degreasing the LED bracket substrate cleaned in step S1 with sulfuric acid having a concentration of 3-5%.

[0078] Step S3, super roughening, spraying the roughening liquid onto the area of ​​the LED bracket substrate to be roughened, the super roughening temperature is 24-28°C, and the Cu 2+ The concentration is 15-45 g / L, and the micro-etching amount is 0.6-1 μm.

[0079] Step S4, pickling, the pickling solution is a hydrochloric acid solution, wherein the concentration of the hydrochloric acid is 3-4%, Cu 2+ Content ≤2g / L, pickling temperature 80~100℃.

[0080] Step S5, drying, drying the LED bracket substrate 1, the drying temperature is 80-100°C.

[0081] Step S6, water break test, the LED bracket base after pickling is subjected to water break test, and the water hanging time is ≥30s. Specifically, take a piece of LED bracket substrate 1 and put it into pure water, and then take it out vertically. If the entire LED bracket substrate 1 is still hanging with water after 30s, it is qualified. If the water breaks in advance, it means that the board surface is not clean, or even has oil. Such workpieces will affect product quality if placed in the later process.

[0082] In this embodiment, the thermosetting material is preferably epoxy resin or silicone. The metal material can be gold, silver, copper, nickel, palladium, etc., and the electroplating layer can be at least one of the above metal material plating layers.

[0083] Although the embodiments disclosed in the present invention are as above, the contents described are only embodiments adopted for facilitating the understanding of the present invention and are not intended to limit the present invention. Any technician in the technical field to which the present invention belongs can make any modifications and changes in the form and details of the implementation without departing from the spirit and scope disclosed in the present invention, but the patent protection scope of the present invention shall still be subject to the scope defined in the attached claims.

Claims

1. A post-plating preparation method for a glue-free LED bracket, characterized in that: The following steps are involved: Step A, forming a substrate, forming an LED bracket substrate on a metal substrate by etching or punching, wherein the LED bracket substrate is formed with a plurality of grooves and hollow parts that are interconnected; Step B, film pasting, pasting sealing films on both sides of the LED bracket substrate prepared in step A, and opening at least one injection port on the sealing film to communicate with the groove and the hollow part; the sealing film is tightly fitted to the side of the LED bracket substrate; Step C, injection molding, injecting a molten thermosetting material into the injection molding port of the LED bracket substrate after the film is applied in step B, so as to fill the multiple grooves and hollow parts of the LED bracket substrate; Step D, curing and tearing the film, cooling the LED bracket substrate after injection molding in step C to cool and solidify the thermosetting material in a molten state, and then tearing off the sealing film; Step E: electroplating: electroplating the LED bracket substrate in step D using electroplating equipment to form a metal reflective layer on the surface of the LED bracket substrate.

2. The post-plating preparation method of the LED bracket without glue according to claim 1, characterized in that: The metal substrate in step A is a copper substrate or an iron substrate.

3. The post-plating preparation method of the LED bracket without glue according to any one of claims 1-2, characterized in that: The LED support substrate in step A is prepared by etching.

4. The post-plating preparation method of the LED bracket without glue according to claim 3 is characterized in that: In step A, the following steps are included: Step a, primary dust removal, first dust removal on the front and back sides of the metal substrate, put the metal substrate into a dust collecting machine for dust removal, the pressure of the dust collecting paper of the dust collecting machine is 0.2-0.4Mpa; Step b, preheating, the dust-removed metal substrate enters a preheating machine for preheating, and the preheating temperature is 90-110°C; Step c, attaching the dry film, the preheated metal substrate enters the laminating machine, and the front and rear sides of the metal substrate are pressed with dry film, the conveying speed of the laminating machine is 2.3-3.3 m / min, the temperature of the hot laminating wheel for laminating is 110-120°C, and the pressure of the hot laminating wheel is 0.3-0.5 MPa, and the temperature of the laminating strip for cutting is 40-60°C; Step d, exposure, after the dry film is attached to the metal substrate, a partial area of ​​the dry film is exposed to form a pattern on the dry film; Step e, developing, removing the unexposed area of ​​the dry film with a developer, the developer being a potassium carbonate solution, and the mass concentration of potassium carbonate being 8 to 14 g / L; Step f, washing once, using pure water to clean the developer remaining on the surface of the dry film; Step g, etching, using an etching solution to etch the metal substrate into hollow parts and grooves, the etching solution comprising the following components in mass concentration: Cu 2+ The concentration is 120-150 g / L, the hydrochloric acid concentration is 0.7-1.3 mol / L, and the rest is pure water; Step h, secondary water washing, using pure water to clean the etching solution remaining on the metal substrate; Step i, removing the dry film, using a film removal accelerator to remove the dry film on the front and back sides of the metal substrate; Step j, washing three times with water, using pure water to clean the film removal accelerator remaining on the metal substrate; Step k, pickling, using a pickling solution to clean the residual film removal accelerator, the pickling solution is 3-5% sulfuric acid, 6-20g / L hydrogen peroxide and Cu 2+ One or a combination of two or more micro-etching solutions with a concentration of 5 to 45 g / L; Step 1, washing four times with water, using pure water to clean the acid wash solution remaining on the metal substrate; Step m: drying: drying the metal substrate at a temperature of 80 to 100° C. to form an LED bracket substrate.

5. The post-plating preparation method of the LED bracket without glue according to claim 4, characterized in that: The method further comprises the step n of performing a semi-etching roughening treatment on the LED bracket substrate prepared in the step m; In step n, the following steps are included: Step S1, pure water cleaning, using pure water to clean the LED bracket substrate prepared in step n; Step S2, degreasing, degreasing the LED bracket substrate cleaned in step S1 with sulfuric acid having a concentration of 3 to 5%; Step S3, super roughening, spraying the roughening liquid onto the area of ​​the LED bracket substrate to be roughened, the super roughening temperature is 24-28°C, and the Cu 2+ The concentration is 15-45 g / L, and the micro-etching amount is 0.6-1 μm; Step S4, pickling, the pickling solution is a hydrochloric acid solution, wherein the concentration of hydrochloric acid is 3-4%, Cu 2+ Content ≤2g / L, pickling temperature 80~100℃; Step S5, drying, drying the LED bracket substrate at a drying temperature of 80-100° C.; Step S6, water break test, the LED bracket base after acid washing is subjected to water break test, and the water hanging time is ≥30s.

6. The post-plating preparation method of the LED bracket without glue according to any one of claims 1-2, 4-5, characterized in that: The metal reflective layer is one of gold, silver, copper, nickel and palladium.

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