A non-scanning large-area defect detection and defect location and parameter inversion method

Abstract

The present invention discloses a non-scanning large-area defect detection and defect location and parameter inversion method. The method includes: providing a plurality of array element coils with shielding devices, arranging the plurality of array element coils with shielding devices on the surface to be detected; controlling the excitation of any array element coil to generate a voltage signal by time-sharing excitation, so that the array element coils adjacent to the array element coil collect far-field eddy current signals; sequentially stimulating the array element coils and repeating the detection process until the detection of the surface to be tested is completed; detecting defects based on the output signals of different receiving coils or the differential signals between the output signals and the output signals of the receiving coils on a defect-free reference test block; if a defect exists, comparing the output signal or differential signal with a pre-established database of output signals of different receiving coils or the differential signals and defect location / parameter relationships, and locating and quantitatively detecting the defect. The present invention reduces the number of array element coils by stimulating the far-field eddy current effect in traditional array eddy current detection, thereby achieving online, efficient, non-scanning defect detection of large-area metal flat plates and accurate inversion of defect locations and parameters.

Description

Technical Field

[0001] The present invention relates to the technical field of conductive material defect detection, and in particular to a large-area defect detection and parameter inversion system. Background Art

[0002] With the continuous development of science and technology, conductive materials are widely used in many industries, such as aircraft skins and oil tank floors. After long-term use, conductive materials are prone to corrosion, cracks, or other defects, which can lead to accidents and endanger people's lives and property. To prevent accidents, timely safety inspections should be carried out.

[0003] In the existing technology, traditional self-inductance and mutual inductance eddy current detection probes require scanning, which is time-consuming and labor-intensive. The two-dimensional array eddy current detection array element coils commonly used for non-scanning detection of large-area workpiece defects have a large number of coil elements and place high requirements on the number of instrument signal channels. Summary of the Invention

[0004] In view of this, the purpose of the present invention is to propose a non-scanning large-area defect detection and defect position and parameter inversion method, which can reduce the number of array coils and realize online, efficient, non-scanning large-area metal flat plate defect detection and accurate inversion of defect position and parameters.

[0005] According to one aspect of the present invention, a non-scanning large-area defect detection and defect location and parameter inversion method is provided, comprising:

[0006] A plurality of array element coils with shielding devices, wherein the plurality of array element coils with shielding devices are arranged on the surface to be detected;

[0007] By controlling the excitation voltage signal of any array element coil in a time-sharing excitation manner, the array element coils adjacent to the array element coil collect eddy current signals;

[0008] The array coils are excited in sequence and the detection process is repeated until the detection is completed;

[0009] Detecting defects based on the collected output signals of different receiving coils or the differential signal between the output signals and the output signal of the receiving coil on a defect-free reference test block;

[0010] If there is a defect, the output signal or differential signal is compared with the pre-established database of output signals or differential signals of different receiving coils and defect position / parameter relationships to locate and quantitatively detect the defect.

[0011] In the above technical solution, the present invention proposes an array far-field eddy current detection technology. The basic principle of array far-field eddy current detection is to use electromagnetic shielding technology to generate far-field eddy current phenomena on the basis of array eddy current detection, place the receiving coil in the far-field area for detection, and determine the position and parameters of the defect within the coverage range of the probe through positioning and quantitative algorithms. Because the receiving coil is placed in the far-field area during detection, the distance between two adjacent coils is farther than that of conventional array eddy current detection. When detecting flat plates of the same area, the number of array element coils required is smaller, which can achieve the purpose of reducing the number of signal channels. By analyzing the far-field eddy current signals of the receiving coils at different positions, the accuracy of the inversion of the defect position and parameters can be improved.

[0012] Compared with traditional array eddy current testing technology, this method, due to the greater distance between coils, can reduce the number of array coils within the same detection range, simplifying probe fabrication and signal acquisition and processing, improving detection efficiency and reducing costs. By analyzing the far-field eddy current signals from receiving coils at different locations, the accuracy of defect location and parameter inversion can be improved.

[0013] In some embodiments, the plurality of array coils including shielding devices are arranged on the surface to be detected, specifically:

[0014] The array element coils form a detection unit in a 2×2 manner, and several detection units are arranged on the surface to be detected.

[0015] In the above technical solution, the arrangement of the array coils can be changed according to the workpiece to be tested. When testing workpieces of the same area, this method can reduce costs and improve detection efficiency. The lower limit of the detection area is the range covered by a 2×2 array, and the upper limit is theoretically determined by the number of pins of the time-sharing control chip. Furthermore,

[0016] In some embodiments, a database of relationships between output signals or differential signals of different receiving coils and defect locations / parameters is obtained, and the establishment method is specifically as follows:

[0017] By simulating and calculating the far-field eddy current signals of different receiving coils, changing the position / parameters of the defect, and repeating the simulation process, a basic database of the relationship between the far-field eddy current signals of different receiving coils and the defect position / parameters is established;

[0018] Alternatively, multiple defects with different positions or parameters are produced, and a basic database of the relationship between the far-field eddy current signals of different receiving coils and the defect positions / parameters is established through experiments;

[0019] The establishment method also includes, based on the basic database, using the numerical fitting method to obtain an extended database that more accurately describes the relationship between the far-field eddy current signal and the defect position / parameters, providing a basis for the defect position / parameter inversion.

[0020] In this technical solution, simulation and numerical fitting methods are used for data processing to generate an expanded database of the relationship between far-field eddy current signals and defect locations / parameters, reducing the simulation workload. It should be noted that establishing a quantitative basic database for defect location in workpieces with different electromagnetic characteristics requires re-simulation. Since the expanded database is established through data fitting, the new database can be established more quickly.

[0021] In some embodiments, when locating and quantitatively detecting defects, if the database is obtained by simulation, it also includes:

[0022] The conversion ratio k is obtained by dividing the value of the array far-field eddy current signal obtained by experiment when there is no defect by the value obtained by simulation;

[0023] Subtract the far-field eddy current signal of the array without defects from the measured far-field eddy current signal of the array, and convert the measured far-field eddy current signal of the array into the magnitude of the simulation result based on the conversion ratio k;

[0024] The converted far-field eddy current signal is compared with the extended database to obtain the location / parameters of the defect.

[0025] In the above technical solution, the inversion result has a smaller error than the actual defect situation. At the same time, the inversion is relatively simple. The far-field eddy current signal obtained by two adjacent array element coils can be used to invert the defect position and parameters, which is convenient and efficient. The database is obtained by using a numerical fitting method, so that the method can quickly establish a new database when the electromagnetic characteristics of the workpiece to be measured change. It should be noted that if a differential signal is used to detect defects, a reference block without defects is required to obtain the initial eddy current signal for workpieces with different electromagnetic characteristics. Replacing the material requires recalibration to obtain the eddy current signal in the actual defect-free state. The inversion of the defect is based on the comparison of the far-field eddy current signals of the two receiving coils in the database. There is no situation where the far-field eddy current signals of the two receiving coils are the same at different defect positions and parameters.

[0026] According to another aspect of the present invention, a non-scanning large-area defect detection and defect location and parameter inversion device is provided. The device is based on the above-mentioned non-scanning large-area defect detection and defect location and parameter inversion method, and includes the following sequentially connected devices:

[0027] An array far-field eddy current probe is provided with a plurality of array element coils with shielding devices, wherein the plurality of array element coils with shielding devices are arranged on the surface to be detected;

[0028] An excitation device, used to control the array element coils to generate excitation voltage signals in sequence through time-sharing excitation;

[0029] An acquisition device, used for acquiring far-field eddy current signals of the array element coil;

[0030] An analysis device is used to detect defects based on the collected output signals of different receiving coils or the differential signal between the output signal and the output signal of the receiving coil on a defect-free reference test block; if a defect exists, the output signal or differential signal is compared with a pre-established database of the relationship between the output signals of different receiving coils or the differential signal and the defect position / parameters to locate and quantitatively detect the defect.

[0031] In the above technical solution, in order to better use the above method, this application proposes a non-scanning large-area defect detection and defect position and parameter inversion device. Each module corresponds to each step of the above method. The specific principles have been described above and will not be repeated here.

[0032] According to another aspect of the present invention, there is provided a non-scanning large-area defect detection and defect location and parameter inversion device, comprising:

[0033] at least one processor and a memory communicatively coupled to the at least one processor;

[0034] The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method as described above.

[0035] In the above technical solution, in order to better run and process the method, the program implementing the above method is stored in a memory, and the stored program is executed by a processor. It should be noted that the principle and effect of each step have been described above and will not be further explained here.

[0036] According to another aspect of the present invention, a computer-readable storage medium is provided, storing a computer program, wherein the computer program implements the above method when executed by a processor. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0038] Figure 1 This is a flow chart of an embodiment of a non-scanning large-area defect detection and defect location and parameter inversion method of the present invention;

[0039] Figure 2This is a schematic diagram of array element coils arranged on a surface to be inspected according to an embodiment of a method for non-scanning large-area defect detection and defect location and parameter inversion of the present invention;

[0040] Figure 3 This is a principle block diagram of a detection system according to an embodiment of a method for non-scanning large-area defect detection and defect location and parameter inversion according to the present invention;

[0041] Figure 4 It is a structural schematic diagram of an embodiment of a non-scanning large-area defect detection and defect position and parameter inversion device of the present invention. DETAILED DESCRIPTION

[0042] The present invention will be described in further detail below with reference to the accompanying drawings and examples. It is particularly noted that the following examples are intended only to illustrate the present invention and are not intended to limit the scope of the present invention. Similarly, the following examples are only some embodiments of the present invention and are not intended to be exhaustive. All other embodiments obtained by those of ordinary skill in the art without creative effort are intended to fall within the scope of protection of the present invention.

[0043] The present invention provides a non-scanning large-area defect detection and defect position and parameter inversion method, which can reduce the number of array coils and realize online, efficient, non-scanning defect detection of large-area metal flat plates and accurate inversion of defect position and depth parameters.

[0044] Example 1

[0045] See also Figure 1 , a non-scanning large-area defect detection and defect location and parameter inversion method, including:

[0046] S1. Providing a plurality of array element coils with shielding devices, wherein the plurality of array element coils with shielding devices are arranged on a surface to be detected;

[0047] In this embodiment, several array coils are arranged on a surface to be inspected. Specifically, the arrangement of the basic array far-field eddy current probe can be modified based on the characteristics of the surface to be inspected to improve inspection efficiency. More specifically, several array coils form a detection unit. For example, several detection units are arranged in a 2×2 pattern on the surface to be inspected.

[0048] S2. Control the excitation voltage signal of any array element coil by time-sharing excitation, so that the array element coils adjacent to the array element coil collect eddy current signals;

[0049] S3, energizing the array coils in sequence and repeating the detection process until the detection of the surface to be tested is completed;

[0050] S4. Detecting defects based on the collected far-field eddy current signal or the differential signal between the far-field eddy current signal and the output signal of the receiving coil on the defect-free reference test block;

[0051] In this embodiment, S4, detecting defects based on the collected far-field eddy current signal or the differential signal between the far-field eddy current signal and the output signal of the receiving coil on the defect-free reference block, specifically:

[0052] Defects are detected based on the amplitude or phase of the far-field eddy current signal from the receiving coil, or by subtracting the far-field eddy current signal from the far-field eddy current signal from the far-field eddy current signal when there is a defect from the far-field eddy current signal when there is no defect, and defects are detected based on the amplitude or phase of the differential output signal. Determine whether the difference between the measured far-field eddy current signal and the output signal of the receiving coil on the defect-free reference test block is within the error range. If so, it is considered that there is no defect within the coverage area of ​​the detection unit; otherwise, it is considered that there is a defect;

[0053] S5. If a defect exists, the output signal or differential signal is compared with a pre-established database of output signals or differential signals of different receiving coils and defect position / parameter relationships to locate and quantitatively detect the defect.

[0054] In this embodiment, S5 compares the output signal or differential signal with a pre-established database of output signals or differential signals of different receiving coils and defect positions / parameters to locate and quantify the defect. Specifically:

[0055] S51. By simulation, the position and parameters of the defect are changed to calculate the far-field eddy current signals of different receiving coils. The far-field eddy current signal of the receiving coil with the defect is subtracted from the far-field eddy current signal of the receiving coil without the defect to obtain a differential signal. A database of the relationship between the differential output signals of different receiving coils and the defect parameters is established by numerical fitting.

[0056] Alternatively, multiple defects with different positions or parameters are produced, and a basic database of the relationship between the far-field eddy current signals of different receiving coils and the defect positions / parameters is established through experiments.

[0057] S52. Based on the basic database, a numerical fitting method is used to obtain an extended database that more accurately describes the relationship between the far-field eddy current signal and the defect position / parameters, providing a basis for the defect position / parameter inversion.

[0058] When locating and quantitatively detecting defects, if the database is obtained from simulation, it also includes:

[0059] S53. Divide the far-field eddy current signal of the array element coil obtained by the experiment when there is no defect by the value obtained by simulation to obtain a conversion ratio k.

[0060] S54 , converting the measured array far-field eddy current signal or the differential signal obtained by subtracting the measured eddy current signal in a defect-free state from the measured array far-field eddy current signal into a simulation result magnitude based on a conversion ratio k.

[0061] S55. Compare the converted far-field eddy current signal with the database to obtain the position / parameters of the defect.

[0062] The present invention addresses the problems of traditional array eddy current testing, which requires a large number of array element coils and has high requirements for signal channels. It stimulates the far-field eddy current effect in array eddy current testing, reduces the number of array element coils, and realizes online, efficient, non-scanning defect detection of large-area metal flat plates and accurate inversion of defect location and depth parameters.

[0063] 1. Array far-field eddy current detection principle

[0064] The basic principle of array far-field eddy current testing is to use electromagnetic shielding technology to generate far-field eddy current phenomena based on array eddy current testing. The receiving coil is placed in the far-field area for testing, and the location and parameters of defects within the probe coverage area are determined through positioning and quantitative algorithms. The receiving coil is placed in the far-field area for testing, and the location and parameters of defects within the probe coverage area are determined through positioning and quantitative algorithms. Because the receiving coil is placed in the far-field area during testing, the distance between two adjacent coils is greater than that of conventional array eddy current testing. When testing flat plates of the same area, fewer array element coils are required, which can achieve the purpose of reducing the number of signal channels. By analyzing the far-field eddy current signals of the receiving coils at different positions, the accuracy of the inversion of the defect position and parameters can be improved.

[0065] 2. Array far-field eddy current probe design

[0066] The structure of the array far-field eddy current probe designed by this patent is as follows Figure 2 As shown, the probe consists of a number of array coils with shielding devices. The basic detection unit of this probe consists of two adjacent array coils, one serving as an excitation coil and the other as a receiving coil. Defects within the coverage area of ​​these two coils are detected. The array coils are switched on and off using a time-sharing excitation mechanism. This ensures that only one coil is excited at a time, preventing signal interference caused by stimulating multiple array coils simultaneously.

[0067] 3. Array far-field eddy current defect positioning and quantitative detection system

[0068] The present invention proposes a system for defect detection and quantitative positioning of large-area conductive workpieces. The principle block diagram of the system is as follows: Figure 3As shown in the figure, the signal generation module first provides an excitation voltage signal to the array far-field eddy current probe. Time-sharing excitation controls the excitation of the array element coils at different positions. Adjacent coils in different directions of the excitation coil serve as receiving coils to collect the corresponding eddy current signals. After amplification and filtering, the signals are transmitted to a PC for display and voltage data is obtained. The obtained voltage data is used to locate and quantitatively analyze defects, and the defect location and parameters are obtained.

[0069] The specific implementation steps of the defect location quantitative inversion technology proposed in this patent are as follows:

[0070] Step 1: Establish a defect signal database. Through simulation, change the position and parameters of the defect, calculate the far-field eddy current signals of different receiving coils, subtract the far-field eddy current signal of the receiving coil when there is a defect from the far-field eddy current signal of the receiving coil when there is no defect, and obtain a differential signal. Establish a basic database of the relationship between the differential output signals of different receiving coils and the defect position / parameters. Alternatively, create multiple defects with different positions or parameters and establish a basic database of the relationship between the far-field eddy current signals of different receiving coils and the defect position / parameters through experiments. Based on the basic database, through numerical fitting methods, an expanded database that more accurately describes the relationship between the far-field eddy current signal and the defect position / parameters is obtained, providing a basis for defect position / parameter inversion.

[0071] Step 2: Determine the conversion ratio k between the simulation and experimental results. Divide the numerical value of the array far-field eddy current signal obtained experimentally when there is no defect by the numerical value obtained by simulation to obtain the conversion ratio k.

[0072] Step 3: Convert experimental results to simulation results. Divide the far-field eddy current signal of the receiving coil when there is a defect, or the differential output signal obtained by subtracting the far-field eddy current signal when there is no defect, by the coefficient k to convert the measured array far-field eddy current signal to the simulation result level.

[0073] Step 4: Invert to obtain the defect position and parameters. Compare the far-field eddy current signal converted in step 3 with the defect signal database in step 1 to obtain the defect position / parameters and achieve quantitative inversion of defect location. Figure 2 For example, 6 is the excitation coil, 7 and 10 are the receiving coils, and the far-field eddy current signals or differential signals of 7 and 10 are converted and compared with the defect signal database in step 1 to obtain the location and parameters of the defect.

[0074] It should be noted that the entire surface can be inspected simultaneously in different areas. For example, 1 and 11 are excited, and 2, 5, 12, and 15 are received. Because the mutual inductance between coils that are far apart is relatively weak, the effect on the detection signal is very small. In order to ensure the sensitivity of the received signal, two coils adjacent to the excitation coil are used for reception. It should be noted that the diagonally arranged array element coils can be used not to receive far-field eddy current signals. For example, 6 is excited, and 1, 3, 9, and 11 can be excluded from the detection because the sensitivity and signal amplitude of the diagonal array element detection are not as good as those of the horizontally and vertically adjacent coils, and the signals obtained by the horizontally and vertically adjacent receiving coils can already invert the defects. The inspected parts do not need to be inspected again, which can ensure the efficiency of the detection and the simplicity of the circuit design.

[0075] It should be noted that the array far-field eddy current used in the prior art mainly uses one excitation and multiple receptions to detect and locate the defects of small-area workpieces such as bolt structures, and cannot perform non-scanning detection on large-area workpieces. At the same time, in order to accurately invert the defects of the workpiece to be tested, the prior art uses a large number of channels (one excitation coil with eight or more receiving coils), and does not achieve the purpose of reducing the number of channels. The array far-field eddy current method proposed in the present invention is aimed at the problem that the current array eddy current detection has a large number of channels and complex signal processing when detecting large-area workpieces. On the basis of array eddy current detection, the far-field eddy current detection method is integrated, and the characteristics of the far distance between the excitation and receiving coils in the far-field eddy current detection are utilized to achieve the purpose of non-scanning detection of large-area workpieces while using fewer signal channels. In terms of data processing, the present invention not only uses simulation, but also uses numerical fitting methods to obtain a comprehensive database of the relationship between the far-field eddy current signal and the defect position and depth, which greatly reduces the workload of simulation, and verifies through experiments that the inversion result has a smaller error than the actual defect position and parameters, and the positioning and quantification have good accuracy.

[0076] Example 2

[0077] See also Figure 4 A non-scanning large-area defect detection and defect location and parameter inversion device, based on a non-scanning large-area defect detection and defect location and parameter inversion method described in one embodiment, comprises:

[0078] An array far-field eddy current probe is provided with a plurality of array element coils with shielding devices, wherein the plurality of array element coils with shielding devices are arranged on the surface to be detected;

[0079] An excitation device, used to control the array element coils to generate excitation voltage signals in sequence through time-sharing excitation;

[0080] An acquisition device, used for acquiring far-field eddy current signals of the array element coil;

[0081] An analysis device is used to detect defects based on the collected output signals of different receiving coils or the differential signal between the output signal and the output signal of the receiving coil on a defect-free reference test block; if a defect exists, the output signal or differential signal is compared with a pre-established database of the relationship between the output signals of different receiving coils or the differential signal and the defect position / parameters to locate and quantitatively detect the defect.

[0082] In the above technical solution, in order to better use the above method, this application proposes a non-scanning large-area defect detection and defect position and parameter inversion device. Each module corresponds to each step of the above method. The specific principles have been described above and will not be repeated here.

[0083] Embodiment 3

[0084] A non-scanning large-area defect detection and defect location and depth inversion device, comprising:

[0085] at least one processor and a memory communicatively coupled to the at least one processor;

[0086] The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the method as described in one of the embodiments.

[0087] In the above technical solution, in order to better run and process the method, the program implementing the above method is stored in a memory, and the stored program is executed by a processor. It should be noted that the principle and effect of each step have been described above and will not be elaborated here.

[0088] Example 4

[0089] A computer-readable storage medium stores a computer program, which, when executed by a processor, implements the method described in one of the embodiments.

[0090] In the above technical solution, in order to better execute and use the method described in one of the embodiments, a program implementing the above method is stored in a computer-readable storage medium and executed by a processor. It should be noted that the principles and effects of each step have been described above and will not be further explained here.

[0091] The above descriptions are only some embodiments of the present invention and do not limit the scope of protection of the present invention. Any equivalent device or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A non-scanning large-area defect detection and defect location and parameter inversion method, characterized in that: include: Providing a plurality of array element coils with shielding devices, wherein the plurality of array element coils with shielding devices are arranged on a surface to be detected; The array element coils are controlled to generate excitation voltage signals in sequence by means of time-sharing excitation, so that the array element coils adjacent to the array element coil collect far-field eddy current signals; The array coils are excited in sequence and the detection process is repeated until the detection is completed; Defects are detected based on the collected output signals of different receiving coils or the differential signals between the output signals and the output signals of the receiving coils on a defect-free reference test block. Specifically: Defects are detected according to the amplitude or phase of the far-field eddy current signal of the receiving coil, or the far-field eddy current signal of the receiving coil when there is a defect is subtracted from the far-field eddy current signal of the receiving coil when there is no defect to obtain a differential output signal, and the defect is detected according to the amplitude or phase of the differential output signal; if a defect exists, the output signal or differential signal is compared with a pre-established database of output signals of different receiving coils or the relationship between differential signals and defect positions / parameters to locate and quantitatively detect the defect, wherein the method of establishing a database of the relationship between output signals or differential signals of different receiving coils and defect positions / parameters is specifically as follows: far-field eddy current signals of different receiving coils are calculated by simulation, the position / parameters of the defect are changed, and the simulation process is repeated to establish a basic database of the relationship between far-field eddy current signals of different receiving coils and defect positions / parameters; or, multiple test blocks containing defects of different positions or parameters are made, and a basic database of the relationship between far-field eddy current signals of different receiving coils and defect positions / parameters is established through experiments; When locating and quantitatively detecting defects, if the database is obtained by simulation, it also includes: dividing the value of the array far-field eddy current signal obtained by the experiment when there is no defect with the value obtained by simulation to obtain the conversion ratio k ; Subtract the far-field eddy current signal of the array without defects from the measured far-field eddy current signal of the array without defects, and calculate the far-field eddy current signal based on the conversion ratio. k The measured array far-field eddy current signal is converted into the simulation result level; the converted far-field eddy current signal is compared with the extended database to obtain the location / parameters of the defect.

2. The non-scanning large-area defect detection and defect location and parameter inversion method according to claim 1, characterized in that: The plurality of array element coils including the shielding device are arranged on the surface to be detected, specifically: Several array element coils form a detection unit, and several detection units are arranged on the surface to be detected.

3. The non-scanning large-area defect detection and defect location and parameter inversion method according to claim 1, characterized in that: The establishment methods include: Based on the basic database, an extended database that more accurately describes the relationship between far-field eddy current signals and defect locations / parameters is obtained through numerical fitting methods.

4. A non-scanning large-area defect detection and defect location and parameter inversion device, characterized in that: A non-scanning large-area defect detection and defect position / parameter inversion method according to any one of claims 1 to 3, comprising: An array far-field eddy current probe is provided with a plurality of array element coils with shielding devices, wherein the plurality of array element coils with shielding devices are arranged on the surface to be detected; An excitation device, used to control the array element coils to generate excitation voltage signals in sequence through time-sharing excitation; An acquisition device, used for acquiring far-field eddy current signals of the array element coil; An analysis device is used to detect defects based on the collected output signals of different receiving coils or the differential signal between the output signal and the output signal of the receiving coil on a defect-free reference test block; if a defect exists, the output signal or differential signal is compared with a pre-established database of the relationship between the output signals of different receiving coils or the differential signal and the defect position / parameters to locate and quantitatively detect the defect.

5. A non-scanning large-area defect detection and defect position / parameter inversion device, characterized in that: include: at least one processor and a memory communicatively coupled to the at least one processor; The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method according to any one of claims 1 to 3.

6. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the method according to any one of claims 1 to 3 is implemented.

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