A live-line cleaning machine for communication equipment and its control system

Abstract

This invention discloses a live-line cleaning machine for communication equipment and its control system. This invention relates to the field of communication equipment cleaning technology, solving the problems of traditional cleaning methods being too labor-intensive and having poor cleaning effects. This invention performs a second-stage cleaning process, targeting the gaps and crevices of the circuit board. It sequentially processes the empty areas of the circuit board, identifying relevant empty areas and determining whether these areas need cleaning based on their area. Based on this determination, the subsequent cleaning route and spray rate are determined to ensure proper spraying of the circuit board in the second stage. Through the cleaning work in the first or second stage, better processing results are achieved for the circuit board during the spraying process.

Description

Technical Field

[0001] This invention relates to the field of communication equipment cleaning technology, specifically to a live-line cleaning machine for communication equipment and its control system. Background Technology

[0002] Communication equipment enclosures are enclosed structures used to install and protect communication equipment such as switches and servers. They are usually made of metal or other sturdy materials. Inside the enclosure are a large number of electronic components and circuit boards, making them relatively difficult to clean.

[0003] Application CN207577079U discloses a chassis internal cleaning device. This relates to cleaning devices in the mechanical field, and more particularly to a chassis internal cleaning device. It provides a chassis internal cleaning device with good cleaning effect and long service life. The chassis internal cleaning device includes a filter device, a booster pump, a water pipe, and a switch. The filter device, booster pump, and switch are connected in series via the water pipe. The filter device is connected to a water source, and one end of the water pipe extends into the chassis. This utility model has the advantages of good cleaning effect and long service life.

[0004] When cleaning the internal chassis of communication equipment, the general method is to use probes to identify the specific condition of the electronic components inside the chassis, and then manually control the corresponding nozzles to clean the electronic components inside the chassis. However, this cleaning method takes a long time, which can cause excessive fatigue to the arms of the personnel outside, and there are also blind spots in the monitoring, resulting in incomplete cleaning of the inside of the chassis and poor cleaning effect. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a live-line cleaning machine for communication equipment and its control system, which solves the problems of the original cleaning method being too labor-intensive and having poor cleaning effect.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a control system for a live-line cleaning machine for communication equipment, comprising:

[0007] On the machine vision side, the surface image of the circuit board inside the communication device is scanned and recognized, and a board model of the circuit board is generated based on the scanning and recognition results.

[0008] At the initial circuit board segmentation stage, the generated circuit board model is processed to determine the front side of the model and segment it into several regions. The total number of electronic devices within each segment is then determined, and the segmented regions are marked based on this total number. The marked segmented regions are then transmitted to the circuit board routing stage. The specific method is as follows:

[0009] The face containing the electronic components in the substrate model is determined and marked as the front side. The front side area is then divided into several equal-area segments, with the equal area being a preset value.

[0010] Confirm the total number G of electronic devices contained within each segmented region. i Where i represents different segmented regions, and the total number of confirmed regions G is... i Mark the segmented regions;

[0011] The substrate route planning end receives the substrate model, sets the substrate cleaning route, and determines the movement speed of the cleaning nozzles in different segmented areas based on the marked segmented areas. The determined parameters are then transmitted to the cleaning control center. Specifically:

[0012] Determine the front side of the substrate model, mark the segmented areas belonging to the same horizontal line as the same partition area, and determine the total number G of electronic devices in the segmented areas of the same partition area. i Confirmation will be made using V. i =G i ×C1 determines the moving speed of the cleaning nozzle in the corresponding segmented area, where C1 is a preset fixed coefficient factor;

[0013] Several contiguous areas are sorted from top to bottom to generate a sorting sequence. The generated sorting sequence and the moving speed V of the cleaning nozzles in the corresponding segmented areas are then recorded. i Transmitted to the cleaning control center;

[0014] Preferably, the cleaning control center, based on the determined sorting sequence, performs sequential cleaning of the same partition areas ordered from front to back within the sequence, and uses a determined moving speed V in each different partition area. i The moving speed of the cleaning nozzle is controlled to complete the first stage of cleaning the circuit board.

[0015] In the empty area route planning stage, based on the constructed substrate model, the empty areas on the front of the substrate model are confirmed. Based on the specific display of the empty area area, the area to be cleaned is determined. Then, based on the relevant outline of the area to be cleaned, a corresponding cleaning route is generated for that area, and the generated cleaning route is transmitted to the cleaning control center. The specific method is as follows:

[0016] Based on the location of the electronic components on the front of the substrate model, the area covered by the electrical components is determined, and the covered area is replaced by a shaded area. After the replacement is completed, other areas on the front of the substrate model that do not belong to the shaded area are marked as areas to be extracted.

[0017] Based on the top and bottom edges of the substrate model, the distance L between the two sets of edges is determined. Several sets of related lines parallel to the top edge are constructed on the front of the substrate model, and the distance between each set of related lines is X1. L and X1 are divisible by each other, and X1 is a preset value.

[0018] Based on the generated sets of correlation lines, the region to be extracted is divided into multiple micro-extraction regions, and the area parameter of each micro-extraction region is determined and denoted as M. k Where k represents different micro-extraction regions, satisfying: M k The micro-extraction region ≤ Y1 is marked as the area to be cleaned, where Y1 is a preset value. Regions that do not meet M... k The micro-extraction region ≤Y1 is not calibrated.

[0019] Based on the relevant lines on the upper and lower sides of the area to be cleaned, the area to be cleaned is decomposed into several parallel line segments, which are parallel to the relevant lines. The center point of each parallel line segment is then marked to determine the feature points. Then, according to the connection direction from one side of the relevant line to the other side, several sets of feature points are connected in sequence to confirm the cleaning route of the area to be cleaned.

[0020] and the area parameter M of the area to be cleaned. k V k =M k ×C2 determines the spray rate V of its cleaning nozzle. k C2 is a preset fixed coefficient factor. The smaller its area parameter Mk, the higher its spray rate. The cleaning route of the determined area to be cleaned and the related spray rate V are then used. k The data is transmitted to the cleaning control center.

[0021] Preferably, the cleaning control center, based on the determined cleaning route for the corresponding area to be cleaned, controls the cleaning nozzles to clean the circuit board according to this cleaning route, and the spray rate during the cleaning process is V. k .

[0022] Preferably, a live-line cleaning machine for communication equipment includes:

[0023] Machine vision probes scan and identify surface images of circuit boards inside communication equipment;

[0024] The relevant processor generates a substrate model of the corresponding substrate based on the scanning and recognition results, and controls its cleaning nozzle to perform the first or second stage of cleaning work on the circuit board based on the specific display of the substrate model.

[0025] The robotic arm, based on the processing results of the relevant processor, adjusts the angle and spray direction of the cleaning nozzle to clean the circuit board;

[0026] The water pump and water tank, based on the processing results of the relevant processor, the water pump generates a corresponding jet rate to clean the circuit board. The water tank contains special cleaning water for the circuit board, and the cleaning water carries relevant static electricity, which is a specific circuit board cleaning agent.

[0027] It also includes: casters or a motor, the motor of which controls the casters to move the cleaning machine to the designated work area.

[0028] This invention provides a live-line cleaning machine for communication equipment and its control system. Compared with the prior art, it has the following advantages:

[0029] This invention uses a faster moving speed to clean areas with relatively few electronic components, resulting in a faster cleaning rate. Conversely, it uses a slower moving speed to clean areas with relatively many electrical components, resulting in a slower cleaning rate. This approach ensures a better cleaning effect and guarantees that the circuit board will achieve both high cleaning efficiency and good cleaning results during the first cleaning.

[0030] The second stage of cleaning is then performed, targeting the gaps and hollow areas of the circuit board. This involves sequentially processing these areas to identify and determine if they require cleaning. Based on this determination, the subsequent cleaning route and spray rate are established to ensure proper spraying of the circuit board in the second stage. By combining the cleaning work of the first and second stages, a better treatment effect is achieved during the spraying process. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the principle framework of the present invention;

[0032] Figure 2 This is a schematic diagram of the processing flow of the area to be cleaned in this invention. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] Example 1

[0035] Please see Figure 1This application provides a control system for a live-line cleaning machine for communication equipment, including a machine vision end, a circuit board initial sorting end, a board route planning end, a gap area route planning end, and a cleaning control center. The machine vision end is electrically connected to the input nodes of the circuit board initial sorting end or the gap area route planning end, and the circuit board initial sorting end is electrically connected to the input node of the board route planning end. The board route planning end is electrically connected to the input node of the cleaning control center, and the gap area route planning end and the cleaning control center are bidirectionally connected.

[0036] In the machine vision section, the surface image of the circuit board inside the communication device is scanned and recognized, and a board model of the circuit board is generated based on the scanning and recognition results. The generated board model is then transmitted to the circuit board initial segmentation end or the gap area route planning end. Based on the multi-view image of the corresponding board, the relevant feature points of the board are determined. The feature points are corners, edges, etc. Then, image registration, stereo matching, and triangulation are performed to generate the board model of the circuit board. Since generating the stereo model of the object based on the acquired object image is an existing technology, it will not be described in detail here.

[0037] In the initial segmentation stage of the circuit board, the generated board model is processed to determine the front side of the board model and segment it to identify several segmented areas. The total number of electronic components in each segmented area is then confirmed, and the segmented areas are marked based on the total number of components. The marked segmented areas are then transmitted to the board route planning stage. Specifically, this is the initial cleaning stage of the corresponding circuit board. The initial cleaning stage uses different spraying cleaning methods based on the deployment of electronic components. For areas with a large number of electronic components, a slower spray gun movement is required to ensure the cleanliness of the corresponding board surface.

[0038] The specific method for marking the segmented regions is as follows:

[0039] The face containing the electronic components in the substrate model is determined and marked as the front side. The front side area is then divided into several equal-area segments. The equal area is a preset value, and the specific value is determined by the operator based on experience.

[0040] Confirm the total number G of electronic devices contained within each segmented region. i Where i represents different segmentation regions (if the electronic device is divided into multiple parts during the segmentation process and is located in different segmentation regions, it is also counted as one electronic device), and the confirmed total number G is... i Mark the segmented regions.

[0041] The substrate route planning end receives the substrate model, sets the substrate cleaning route, and determines the movement speed of the cleaning nozzles in different segmented areas based on the marked segmented areas. The determined parameters are then transmitted to the cleaning control center. The specific method for determining these parameters is as follows:

[0042] Determine the front side of the substrate model, mark the segmented areas belonging to the same horizontal line as the same partition area, and determine the total number G of electronic devices in the segmented areas of the same partition area. i Confirmation will be made using V. i =G i ×C1 determines the moving speed of the cleaning nozzle in the corresponding segmented area, where C1 is a preset fixed coefficient factor, the specific value of which is determined by the operator based on experience;

[0043] Several contiguous areas are sorted from top to bottom to generate a sorting sequence. The generated sorting sequence and the moving speed V of the cleaning nozzles in the corresponding segmented areas are then recorded. i The data is transmitted to the cleaning control center.

[0044] The cleaning control center, based on the determined sorting sequence, sequentially cleans the same partitioned areas from front to back within the sequence, and uses a determined movement rate V in each different partitioned area. i The moving speed of the cleaning nozzle is controlled to complete the first stage of cleaning the circuit board.

[0045] Specifically, this cleaning method is adopted to ensure the cleaning effect of the circuit board. Areas with relatively few electronic components are cleaned at a faster moving speed, resulting in a faster cleaning rate. Areas with relatively more electronic components are cleaned at a slower moving speed, resulting in a slower cleaning rate. This ensures a better cleaning effect and guarantees that the circuit board can achieve both cleaning efficiency and cleaning effect during the first cleaning.

[0046] Example 2

[0047] The cleaning control center, after completing the first stage of cleaning the circuit board, executes the empty area route planning terminal to generate the relevant cleaning route for the second stage. Subsequently, the cleaning control center performs the second stage of cleaning on the circuit board based on the relevant cleaning route for the second stage.

[0048] Combination Figure 2In the empty area route planning stage, based on the constructed substrate model, the empty area on the front of the substrate model is confirmed, and the area to be cleaned is determined according to the specific display of the empty area area. Then, based on the relevant outline of the area to be cleaned, the corresponding cleaning route for the area to be cleaned is generated, and the generated cleaning route is transmitted to the cleaning control center. The specific method for generating the cleaning route for the area to be cleaned is as follows:

[0049] Based on the location of the electronic components on the front of the substrate model, the area covered by the electrical components is determined, and the covered area is replaced by a shaded area (which can be understood as a mosaic). After the replacement is completed, other areas on the front of the substrate model that do not belong to the shaded area are marked as areas to be extracted.

[0050] Based on the top and bottom edges of the substrate model, the distance L between the two sets of edges is determined. Several sets of related lines parallel to the top edge are constructed on the front of the substrate model, and the distance between each set of related lines is X1. L and X1 are divisible by an integer, that is, the result of L ÷ X1 is an integer, and X1 is a preset value. Its specific value is determined by the operator based on experience. Specifically, the area to be extracted here is the area where there are no electronic components. When electronic components are installed, there may be gaps between them. During the first stage of cleaning, some dust will fall into these areas. Therefore, in order to identify whether the gap area meets the standard, it is necessary to construct the corresponding related lines to turn the originally open gap area into a closed gap area. Then the area value of the gap area can be confirmed, and it can be determined whether the corresponding gap area needs to be cleaned.

[0051] Based on the generated sets of correlation lines, the region to be extracted is divided into multiple micro-extraction regions, and the area parameter of each micro-extraction region is determined and denoted as M. k Where k represents different micro-extraction regions, satisfying: M k Micro-extraction areas with a value ≤Y1 are designated as areas to be cleaned. Related micro-extraction areas that do not meet this evaluation condition will not be marked. Y1 is a preset value, and its specific value is determined by the operator based on experience.

[0052] Based on the relevant lines connecting the upper and lower sides of the area to be cleaned, the area to be cleaned is decomposed into several parallel line segments (since a surface is composed of lines, it can be decomposed into several parallel line segments). The parallel line segments are parallel to the relevant lines. The center point of each parallel line segment is then marked to determine the feature points. Then, according to the connection direction from one side of the relevant line to the other side, several sets of feature points are connected in sequence to confirm the cleaning route of the area to be cleaned.

[0053] and the area parameter M of the area to be cleaned. k Vk =M k ×C2 determines the spray rate V of its cleaning nozzle. k C2 is a preset fixed coefficient factor. The smaller its area parameter Mk, the higher its spray rate (the area parameter Mk of the area to be cleaned). k The smaller the value, the narrower the corresponding area to be cleaned. This determines the cleaning route for the area to be cleaned and the associated spray rate V. k The data is transmitted to the cleaning control center.

[0054] Specifically, after the first stage of cleaning, the surface of the circuit board is kept relatively clean. After cleaning, the second stage of cleaning is performed. The second stage targets the gaps and empty areas of the circuit board, processing them sequentially to identify the relevant empty areas. Based on the area of ​​these empty areas, it is determined whether they need to be cleaned. Based on the determination, the subsequent cleaning route and spray rate are determined to ensure the normal spraying of the circuit board in the second stage. Through the relevant cleaning work in the first or second stage, the circuit board achieves better treatment results during the spraying process.

[0055] Its cleaning control center, based on the determined cleaning route for the corresponding area to be cleaned, controls the cleaning nozzles to clean the circuit board according to this route. The spray rate during the cleaning process is V. k .

[0056] Example 3

[0057] A live-line cleaning machine for communication equipment, comprising:

[0058] Machine vision probes scan and identify surface images of circuit boards inside communication equipment;

[0059] The relevant processor generates a substrate model of the corresponding substrate based on the scanning and recognition results, and controls its cleaning nozzle to perform the first or second stage of cleaning work on the circuit board based on the specific display of the substrate model.

[0060] The robotic arm, based on the processing results of the relevant processor, adjusts the angle and spray direction of the cleaning nozzle to clean the circuit board;

[0061] The water pump and water tank, based on the processing results of the relevant processor, the water pump generates a corresponding jet rate to clean the circuit board. The water tank contains special cleaning water for the circuit board, and the cleaning water carries relevant static electricity, which is a specific circuit board cleaning agent.

[0062] The machine is equipped with casters or a motor, which controls the casters to move the cleaning machine to the designated work area.

[0063] Example 4

[0064] In its specific implementation, this embodiment includes all the implementation processes of the above three sets of embodiments.

[0065] Some of the data in the above formulas are numerical calculations with dimensions removed, and the contents not described in detail in this specification are all prior art known to those skilled in the art.

[0066] The above embodiments are only used to illustrate the technical methods of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical methods of the present invention without departing from the spirit and scope of the technical methods of the present invention.

Claims

1. A control system for a live-line cleaning machine for communication equipment, characterized in that, include: On the machine vision side, the surface image of the circuit board inside the communication device is scanned and recognized, and a board model of the circuit board is generated based on the scanning and recognition results. The initial circuit board segmentation end processes the generated board model, determines the front side of the board model, and segments the front side of the board model to identify several segmented regions. It then sequentially identifies the total number of electronic devices corresponding to each segmented region and marks the segmented regions based on their total number. The marked segmented regions are then transmitted to the board route planning end. The substrate route planning end receives the substrate model, sets the substrate cleaning route, and determines the moving speed of the relevant cleaning nozzles in different segmented areas based on the marked segmented areas, and transmits the determined relevant parameters to the cleaning control center. In the empty area route planning stage, based on the constructed substrate model, the empty areas on the front of the substrate model are confirmed. Based on the specific display of the empty area area, the area to be cleaned is determined. Then, based on the relevant outline of the area to be cleaned, a corresponding cleaning route is generated for that area, and the generated cleaning route is transmitted to the cleaning control center. The specific method is as follows: Based on the location of the electronic components on the front of the substrate model, the area covered by the electrical components is determined, and the covered area is replaced by a shaded area. After the replacement is completed, other areas on the front of the substrate model that do not belong to the shaded area are marked as areas to be extracted. Based on the top and bottom edges of the substrate model, the distance L between the two sets of edges is determined. Several sets of related lines parallel to the top edge are constructed on the front of the substrate model, and the distance between each set of related lines is X1. L and X1 are divisible by each other, and X1 is a preset value. Based on the generated sets of correlation lines, the region to be extracted is divided into multiple micro-extraction regions, and the area parameter of each micro-extraction region is determined and denoted as M. k Where k represents different micro-extraction regions, which will satisfy: M k The micro-extraction region ≤ Y1 is marked as the area to be cleaned, where Y1 is a preset value; Based on the relevant lines on the upper and lower sides of the area to be cleaned, the area to be cleaned is decomposed into several parallel line segments, which are parallel to the relevant lines. The center point of each parallel line segment is then marked to determine the feature points. Then, according to the connection direction from one side of the relevant line to the other side, several sets of feature points are connected in sequence to confirm the cleaning route of the area to be cleaned. Based on the area parameter M of the corresponding area to be cleaned k Determine the spray rate V of its cleaning nozzle. k The smaller the area parameter Mk, the higher the spray rate. This determines the cleaning route for the area to be cleaned and the associated spray rate V. k The data is transmitted to the cleaning control center.

2. The control system for a live-line cleaning machine for communication equipment according to claim 1, characterized in that, The specific method for marking the segmented areas at the initial segmentation end of the circuit board is as follows: The face containing the electronic components in the substrate model is determined and marked as the front side. The front side area is then divided into several equal-area segments, with the equal area being a preset value. Confirm the total number G of electronic devices contained within each segmented region. i Where i represents different segmented regions, and the total number of confirmed regions G is... i Mark the segmented regions.

3. The control system for a live-line cleaning machine for communication equipment according to claim 2, characterized in that, The substrate route planning terminal sets the substrate cleaning route in the following specific way: Determine the front side of the substrate model, mark the segmented areas belonging to the same horizontal line as the same partition area, and determine the total number G of electronic devices in the segmented areas of the same partition area. i For areas with fewer electronic components, a faster moving speed should be used for cleaning; for areas with more electrical components, a slower moving speed should be used for cleaning. Several contiguous areas are sorted from top to bottom to generate a sorting sequence. The generated sorting sequence and the moving speed V of the cleaning nozzles in the corresponding segmented areas are then recorded. i The data is transmitted to the cleaning control center.

4. The control system for a live-line cleaning machine for communication equipment according to claim 3, characterized in that, The cleaning control center, based on the determined sorting sequence, sequentially cleans the same partitioned areas from front to back within the sequence, and uses a determined movement rate V in each different partitioned area. i The moving speed of the cleaning nozzle is controlled to complete the first stage of cleaning the circuit board.

5. The control system for a live-line cleaning machine for communication equipment according to claim 1, characterized in that, The cleaning control center, based on the determined cleaning route for the corresponding area to be cleaned, controls the cleaning nozzles to clean the circuit board according to this route. The spray rate during the cleaning process is V. k .

6. The control system for a live-line cleaning machine for communication equipment according to claim 1, characterized in that, M will not be satisfied k The micro-extraction region ≤Y1 is not calibrated.

7. A live-line cleaning machine for communication equipment, wherein the live-line cleaning machine operates based on the control system of the live-line cleaning machine for communication equipment according to any one of claims 1-6, characterized in that, include: Machine vision probes scan and identify surface images of circuit boards inside communication equipment; The relevant processor generates a substrate model of the corresponding substrate based on the scanning and recognition results, and controls its cleaning nozzle to perform the first or second stage of cleaning work on the circuit board based on the specific display of the substrate model. The robotic arm, based on the processing results of the relevant processor, adjusts the angle and spray direction of the cleaning nozzle to clean the circuit board; The water pump and water tank, based on the processing results of the relevant processor, the water pump generates a corresponding jet rate to clean the circuit board. The water tank contains special cleaning water for the circuit board, and the cleaning water carries relevant static electricity, making it a specific circuit board cleaning agent.

8. A live-line cleaning machine for communication equipment according to claim 7, characterized in that, Also includes: The machine is equipped with casters or a motor, which controls the casters to move the cleaning machine to the designated work area.

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