An apparatus for assisting in the application of an insulating back adhesive and a method of using the same
By designing an automated adhesive bonding device, which utilizes components such as drive motors and cylinders to achieve automated positioning and pressing, the problems of low efficiency and poor safety of manual operation are solved, and the bonding efficiency and quality of stamped shielding covers are improved.
CN118927758BActive Publication Date: 2026-03-27KUNSHAN KERSEN SCI & TECH
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-14
- Publication Date
- 2026-03-27
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Figure CN118927758B_ABST
Abstract
The application relates to the technical field of back adhesive bonding, in particular to an auxiliary bonding device for insulating back adhesive and a use method thereof, which solves the problems that in the process of bonding the back adhesive and the stamping shielding cover, manual operation is adopted to position and bond the back adhesive and the stamping shielding cover, the bonding efficiency is low, the hands are easily hurt, and the bonding quality cannot be conveniently maintained, and the auxiliary bonding device comprises a protection mounting mechanism, an automatic pressing mechanism and a back adhesive positioning mechanism, the inner side of the protection mounting mechanism is provided with the automatic pressing mechanism, the lower end surface of the automatic pressing mechanism is provided with the back adhesive positioning mechanism, the rear side of the back adhesive positioning mechanism is provided with a positioning and placing mechanism, the protection mounting mechanism comprises a mounting box body, and the upper end surface of the mounting box body is fixedly provided with a protection upper cover. The back adhesive and the stamping shielding cover are positioned and pressed, automatic bonding operation can be realized, the risk of hurting the hands is effectively avoided, and the bonding quality can be maintained.
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Citation Information
Patent Citations
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