Underfill adhesive, method of making and use thereof
By combining modified multifunctional epoxy resin with toughening resin, curing agent and filler, a dense three-dimensional network structure is formed, which solves the problems of glue overflow and insufficient modulus of epoxy resin bottom filler adhesive, and achieves better encapsulation and protection effect.
CN118956309BActive Publication Date: 2026-06-19XIAMEN WELDTONE TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- XIAMEN WELDTONE TECH CO LTD
- Filing Date
- 2024-07-29
- Publication Date
- 2026-06-19
AI Technical Summary
Technical Problem
Existing epoxy resin underfill adhesives are prone to overflow during dispensing and have a low modulus, which cannot meet the protection requirements of semiconductor packaging.
Method used
By combining modified multifunctional epoxy resin with toughening resin, curing agent and filler, a dense three-dimensional network structure is formed, which improves the uniformity and modulus of the colloid and reduces the overflow phenomenon.
Benefits of technology
It improves the problem of adhesive overflow during the dispensing process, increases the modulus of the adhesive, meets the requirements of encapsulation applications, and provides good protection.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN118956309B_ABST
Abstract
This invention belongs to the field of underfill adhesives, specifically relating to an underfill adhesive, its preparation method, and its application. The underfill adhesive provided by this invention comprises an epoxy resin, a toughening resin, a curing agent, a filler, and optionally a colorant; the epoxy resin includes at least a modified multifunctional epoxy resin with a specific structure. The key to this invention lies in using an epoxy resin that includes at least a modified multifunctional epoxy resin with a specific structure, while simultaneously coordinating it with the toughening resin, curing agent, and filler. The resulting underfill adhesive significantly improves the uniformity of the colloid and the degree of crosslinking after curing, reduces adhesive overflow during dispensing, and increases the modulus of the underfill adhesive, thereby meeting the requirements of various encapsulation applications and providing good protection for substrates requiring encapsulation.
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