Backlight module and display device

Abstract

The present disclosure belongs to the field of display technology, and specifically relates to a backlight module and a display device. The middle frame in the backlight module includes a frame side wall and a frame top wall that are connected to each other. The frame side wall is arranged around the light-emitting structure, and the frame top wall covers the edge area of ​​the top surface of the light-emitting structure and is spaced apart from the edge area of ​​the top surface of the light-emitting structure; the conductive structure is opposite to the side surface of the light-emitting structure and / or the edge area of ​​the top surface of the light-emitting structure, and is used to receive the light emitted by the light-emitting structure to generate heat; the shading structure is arranged between the top surface of the light-emitting structure and the frame top wall, and the shading structure expands under the heat generated by the conductive structure. The present disclosure arranges a shading structure between the frame top wall and the top surface of the light-emitting structure, and arranges a conductive structure opposite to the side surface and / or top surface edge area of ​​the light-emitting structure, so that the shading structure can expand under the heat generated by the conductive structure, thereby reducing the problem of light leakage in the edge area of ​​the backlight module.

Description

Technical Field

[0001] The present disclosure belongs to the field of display technology, and particularly relates to a backlight module and a display device. Background Art

[0002] In the backlight module, due to the gap between the middle frame and the light-emitting structure in the backlight module, light leakage occurs in the edge area of ​​the backlight module, which in turn causes deviations in the display effect. Summary of the Invention

[0003] The purpose of the present disclosure is to provide a backlight module and a display device, by arranging a shading structure between the top wall of the frame and the top surface of the light-emitting structure, and arranging a conductive structure opposite to the side and / or top edge area of ​​the light-emitting structure, so that the shading structure can expand under the heat generated by the conductive structure, thereby strengthening the sealing of the edge area of ​​the top wall of the frame and the top surface of the light-emitting structure, and reducing the problem of light leakage in the edge area of ​​the backlight module.

[0004] The present disclosure provides a backlight module, comprising:

[0005] Light-emitting structure;

[0006] a middle frame, comprising side walls and a top wall, wherein the side walls surround the light-emitting structure, the top wall is connected to the side walls and is located on the top surface of the light-emitting structure, and covers an edge area of ​​the top surface of the light-emitting structure and is spaced apart from the edge area of ​​the top surface of the light-emitting structure;

[0007] a conductive structure, opposite to a side surface of the light-emitting structure and / or an edge region of a top surface of the light-emitting structure, and configured to receive light emitted by the light-emitting structure to generate heat;

[0008] A light shielding structure is provided between the top surface of the light emitting structure and the frame top wall. The light shielding structure can expand under the heat generated by the conductive structure to achieve sealing between the light emitting structure and the frame top wall.

[0009] In an exemplary embodiment of the present disclosure, the conductive structure is embedded in the frame wall of the middle frame, and the frame wall is provided with a light guide hole for guiding the light emitted by the light-emitting structure into the conductive structure, and the frame wall includes at least one of the frame side wall and the frame top wall.

[0010] In an exemplary embodiment of the present disclosure, the light shielding structure has a first cavity;

[0011] A heat-conducting layer is embedded in the frame top wall, the heat-conducting layer has a greater heat-conducting efficiency than the frame top wall, and a first connecting channel is opened on the frame top wall, and the first connecting channel is located on a side of the heat-conducting layer close to the light-emitting structure;

[0012] Among them, one end of the first connecting channel is opposite to the heat-conducting layer, and the other end of the first connecting channel is connected to the first cavity. The heat generated by the conductive structure is transferred to the first cavity through the heat-conducting layer and the first connecting channel in sequence to cause the shading structure to expand.

[0013] In an exemplary embodiment of the present disclosure, the frame top wall is provided with an assembly channel for assembling the heat-conducting layer, and the assembly channel comprises a first section channel, a middle section channel, and a second section channel sequentially arranged in a direction away from the frame side wall;

[0014] The portion of the heat-conducting layer located in the first section of the channel is in contact with the inner wall surface of the first section of the channel;

[0015] The portion of the heat-conducting layer located in the second section of the channel is in contact with the inner wall surface of the second section of the channel;

[0016] A gap is formed between a portion of the heat-conducting layer located in the middle channel and a wall surface of the middle channel close to the light-emitting structure to form a first heat-conducting cavity, which is connected to the first connecting channel.

[0017] In an exemplary embodiment of the present disclosure, the backlight module includes a buffer structure, which is provided on the top surface of the frame top wall and is used to support the display panel, and the buffer structure has a second cavity;

[0018] The frame top wall is provided with a second connecting channel, and the second connecting channel is located on a side of the heat conducting layer away from the light emitting structure;

[0019] Among them, one end of the second connecting channel is opposite to the heat-conducting layer, and the other end of the second connecting channel is connected to the second cavity. The heat generated by the conductive structure is transferred to the second cavity through the heat-conducting layer and the second connecting channel in sequence, so that the buffer structure expands, thereby realizing buffering between the display panel and the top wall of the frame.

[0020] In an exemplary embodiment of the present disclosure, the frame top wall is provided with an assembly channel for assembling the heat-conducting layer, and the assembly channel comprises a first section channel, a middle section channel, and a second section channel sequentially arranged in a direction away from the frame side wall;

[0021] The portion of the heat-conducting layer located in the first section of the channel is in contact with the inner wall surface of the first section of the channel;

[0022] The portion of the heat-conducting layer located in the second section of the channel is in contact with the inner wall surface of the second section of the channel;

[0023] A gap is formed between a portion of the heat-conducting layer located in the middle channel and a wall surface of the middle channel facing away from the light-emitting structure to form a second heat-conducting cavity. The second heat-conducting cavity is connected to the second connecting channel.

[0024] In an exemplary embodiment of the present disclosure, the second connecting channel includes a first connecting section, a heat storage section, and a second connecting section arranged in sequence along the direction from the heat conductive layer to the buffer structure, and the channel area of ​​the first connecting section and the channel area of ​​the second connecting section are both smaller than the channel area of ​​the heat storage section.

[0025] In an exemplary embodiment of the present disclosure, the light-emitting structure includes a light board and a light conversion layer provided on a side of the light board close to the top wall of the frame, the light board is used to generate a first color light, and the light conversion layer is used to convert the first color light into a second color light;

[0026] The frame top wall is provided with a light exit channel, the light entrance side of the light exit channel is opposite to one end of the conductive structure, and the light exit side of the light exit channel extends to the side end surface of the frame top wall, and the side end surface is the surface of the frame top wall away from the frame side wall;

[0027] In which, a filtering structure is provided in the light output channel, and the conducting structure is located on the side of the shading structure away from the side end face. The conducting structure can receive the first color light generated by the edge of the lamp board through the light guide hole, and can conduct the first color light to the filtering structure. The filtering structure can at least convert the first color light into the second color light and emit it through the light output side of the light output channel.

[0028] In an exemplary embodiment of the present disclosure, a diffusion film is provided on the side end surface, and the diffusion film covers the light output side of the light output channel.

[0029] In an exemplary embodiment of the present disclosure, the light output channel includes an assembly channel and a diffusion channel located in the assembly channel close to the side end surface, the filtering structure is assembled in the assembly channel, and the cross-sectional area of ​​the diffusion channel increases in the direction close to the side end surface.

[0030] In an exemplary embodiment of the present disclosure, a heat-conducting layer is provided between the light filtering structure and the inner wall of the assembly channel.

[0031] In an exemplary embodiment of the present disclosure, a reflective layer is provided on at least one of the outer sidewall of the conductive structure, the inner sidewall of the heat conductive layer, and the inner sidewall of the diffusion channel.

[0032] In an exemplary embodiment of the present disclosure, a side of the light-shielding structure away from the frame side wall is flush with a side of the frame top wall away from the frame side wall.

[0033] In an exemplary embodiment of the present disclosure, the backlight module includes a back plate, the back plate including a bottom plate and a side plate, the bottom plate is provided on the bottom surface of the light-emitting structure, the side plate is provided between the side wall of the frame and the light-emitting structure, the side plate is connected to the bottom plate, and the side of the side plate facing away from the bottom plate abuts against the top wall of the frame;

[0034] Wherein, the light guide hole is located at least on the side wall of the frame, and a plurality of light holes are provided on the side plate, the light holes pass through the side plate and are arranged opposite to the light guide hole, and the light emitted by the light-emitting structure passes through the light holes and the light guide holes in sequence and enters the conductive structure; and / or

[0035] The aperture of the light guide hole increases gradually along a direction approaching the light emitting structure.

[0036] The present disclosure provides a display device, comprising a display panel and any one of the above-mentioned backlight modules, wherein the display panel is supported on a frame top wall of the backlight module.

[0037] The disclosed solution has the following beneficial effects:

[0038] The present disclosure provides a light-shielding structure between the frame top wall and the top surface of the light-emitting structure to block light emitted from the gap between the frame top wall and the top surface of the light-emitting structure, thereby reducing or avoiding light leakage in the edge area of ​​the backlight module. Furthermore, the present disclosure provides a conductive structure opposite the side and / or top edge areas of the light-emitting structure to receive light emitted by the light-emitting structure and generate heat. The light-shielding structure then expands in volume under the heat generated by the conductive structure, thereby achieving a seal between the light-emitting structure and the frame top wall, further reducing or avoiding light leakage in the edge area of ​​the backlight module.

[0039] Other features and advantages of the present disclosure will become apparent from the following detailed description, or may be learned in part by practice of the present disclosure.

[0040] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The accompanying drawings are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification, serve to explain the principles of the present disclosure. Obviously, the drawings described below are only some embodiments of the present disclosure, and it is clear that those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0042] Figure 1Schematic diagram of the cross-sectional structure of a display device in the related art.

[0043] Figure 2 Schematic diagram of the cross-sectional structure of the backlight module in the embodiment of the present disclosure.

[0044] Figure 3 Schematic diagram of the cross-sectional structure of the display panel in the embodiment of the present disclosure.

[0045] Figure 4 It is a schematic diagram of a partially enlarged cross-sectional structure of the conductive structure in the disclosed embodiment.

[0046] Figure 5 Schematic diagram of the light conduction path in the edge area of ​​the backlight module in the embodiment of the present disclosure.

[0047] Figure 6 It is a schematic diagram of a partially enlarged cross-sectional structure of the light output channel in the embodiment of the present disclosure.

[0048] Figure 7 It is a schematic diagram of a partially enlarged cross-sectional structure of the assembly channel in the embodiment of the present disclosure.

[0049] Figure 8 It is a schematic diagram of a partially enlarged cross-sectional structure of the second connecting channel in an embodiment of the present disclosure.

[0050] Figure 9 Schematic diagram of the heat conduction path in the light output channel in the embodiment of the present disclosure.

[0051] Description of reference numerals:

[0052] 1. Display device;

[0053] 2. Backlight module;

[0054] 21. Light-emitting structure; 211. Light board; 2111. Light-emitting portion; 212. Light conversion layer; 212a. Edge failure region; 213. Optical film layer; 214. Diffuser; 215. Support layer; 2151. Bracket;

[0055] 22, middle frame; 221, frame side wall; 222, frame top wall; 223, light guide hole;

[0056] 23. Conductive structure;

[0057] 24. Light-shielding structure; 241. First cavity;

[0058] 25. Light channel;

[0059] 251, assembly channel; 2511, first section channel; 2512, middle channel; 2513, second section channel;

[0060] 252, diffusion channel; 2521, diffusion membrane;

[0061] 253, thermal conductive layer;

[0062] 254, first connecting channel;

[0063] 255, first heat conduction cavity;

[0064] 256, second connecting channel; 2561, first connecting section; 2562, heat storage section; 2563, second connecting section;

[0065] 257, second heat conduction cavity;

[0066] 258, filter structure; 2581, first filter; 2582, second filter;

[0067] 26. Buffer structure; 261. Second cavity;

[0068] 27, back panel; 271, side panel; 272, bottom panel; 273, light hole;

[0069] 3. Display panel. DETAILED DESCRIPTION

[0070] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art.

[0071] In addition, the described features, structures or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure can be practiced without one or more of the specific details, or other methods, components, devices, steps, etc. can be adopted. In other cases, well-known methods, devices, implementations or operations are not shown or described in detail to avoid blurring various aspects of the present disclosure.

[0072] The present disclosure is further described below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the technical features involved in the various embodiments of the present disclosure described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present disclosure, and should not be construed as limiting the present disclosure.

[0073] With the maturity of display technology and the reduction of costs, various display devices have gradually entered people's daily lives. Among them, the advantages of MiniLED display devices in image quality: high color gamut, high brightness, high contrast, etc., can bring people a better visual experience. Figure 1 As shown, although the display device 1 has the above advantages, the light-emitting structure 21 and the middle frame 22 in the display device 1 cannot be completely sealed, and the backlight module 2 in the display device 1 adopts a solution in which the light board 211 in the light-emitting structure 21 emits blue light, and the blue light is converted into white light through the light conversion layer 212 in the light-emitting structure 21 to provide a light source for the display panel 3. When the edge area of ​​the light conversion layer 212 fails (that is, an edge failure area 212a is generated), the blue light is emitted through the gap between the middle frame 22 and the light-emitting structure 21, thereby causing the edge area of ​​the backlight module 2 to turn blue.

[0074] like Figures 2 to 9 As shown, in order to solve the above technical problems, the embodiment of the present disclosure provides a backlight module 2, including: a light-emitting structure 21, a middle frame 22, a conductive structure 23 and a shading structure 24, the middle frame 22 includes a frame side wall 221 and a frame top wall 222, the frame side wall 221 is arranged around the light-emitting structure 21, the frame top wall 222 is connected to the frame side wall 221, and is located on the top surface of the light-emitting structure 21, the frame top wall 222 covers the edge area of ​​the top surface of the light-emitting structure 21, and is spaced apart from the edge area of ​​the top surface of the light-emitting structure 21; the conductive structure 23 is opposite to the side surface of the light-emitting structure 21 and / or the edge area of ​​the top surface of the light-emitting structure 21, and is used to receive the light emitted by the light-emitting structure 21 to generate heat; the shading structure 24 is arranged between the top surface of the light-emitting structure 21 and the frame top wall 222, and the shading structure 24 can expand under the heat generated by the conductive structure 23 to achieve sealing between the light-emitting structure 21 and the frame top wall 222.

[0075] It should be noted that the top surface of the light-emitting structure 21 refers to the light-emitting surface of the light-emitting structure 21, and the side surface of the light-emitting structure 21 refers to the side of the light-emitting structure 21 opposite the frame sidewall 221. The top surface of the light-emitting structure 21 is arranged opposite the display panel 3, so that the light-emitting structure 21 can provide a light source for the display panel 3 to realize the display function of the display panel 3.

[0076] Among them, such as Figures 2 to 5 As shown, the light-emitting structure 21 may include a light board 211 and a light conversion layer 212 provided on the side of the light board 211 close to the frame top wall 222. The light board 211 may be used to emit a first color light, and the light conversion layer 212 may be used to convert the first color light into a second color light.

[0077] It should be noted that the first color light mentioned above can be blue light. After conversion by the light conversion layer 212, the blue light can be converted into light of colors such as white, red, and green, thereby realizing color display on the display panel 3. However, the present invention is not limited thereto. The first color light can also be light of other colors besides blue, for example, red light. After conversion by the light conversion layer 212, the red light can be converted into light of colors such as blue, green, and white, etc. The specific color can be determined according to actual conditions.

[0078] like Figure 2 As shown, the light board 211 may include a plurality of light-emitting portions 2111 arranged in an array. The light-emitting structure 21 may include a diffuser plate 214 and a support layer 215 disposed between the light conversion layer 212 and the light board 211. The diffuser plate 214 is located on the side of the support layer 215 near the light conversion layer 212 to evenly diffuse the light emitted from the light board 211 across the entire display panel 3, thereby effectively preventing uneven brightness distribution phenomena such as light spots and light beams, thereby ensuring the uniformity of the displayed image. The support layer 215 may include a plurality of brackets 2151 arranged in an array. The brackets 2151 may be disposed between two adjacent light-emitting portions 2111. The height of the brackets 2151 is greater than the thickness of the light-emitting portions 2111. The brackets 2151 may support the diffuser plate 214 to reduce or prevent the possibility of the diffuser plate 214 squeezing the light-emitting portions 2111 under external forces, thereby extending the service life of the light-emitting portions 2111.

[0079] In addition, the light-emitting structure 21 may further include an optical film layer 213 disposed on the side of the light conversion layer 212 near the frame top wall 222. The orthographic projection of the light conversion layer 212 on the optical film layer 213 may overlap with the orthographic projection of the light board 211 on the optical film layer 213, thereby enabling the light emitted from the light board 211 to undergo color conversion under the action of the light conversion layer 212.

[0080] The optical film layer 213 may include a reflector, a diffuser, a brightness enhancement sheet, and a composite brightness enhancement sheet. The optical film layer 213 reflects and diffuses light, thereby enhancing light utilization and uniformity. The optical film layer 213 is light-transmissive, allowing light emitted from the light panel 211 to pass through the light conversion layer 212 and the optical film layer 213 and reach the display panel 3, providing a light source for the display panel 3 and enabling the display function of the display panel 3.

[0081] The conductive structure 23 in the embodiment of the present disclosure may include, but is not limited to, an optical fiber. Other conductive structures 23 that can absorb light and generate heat may also be included in the embodiment of the present disclosure. By positioning the conductive structure 23 relative to at least one of the side surface of the light-emitting structure 21 or the edge region of the top surface of the light-emitting structure 21, the conductive structure 23 receives light emitted from the top surface or side surface of the light-emitting structure 21 and generates heat, thereby causing the light-shielding structure 24 to expand in volume and achieve a seal between the frame top wall 222 and the top surface of the light-emitting structure 21.

[0082] Specifically, the conductive structure 23 in the embodiment of the present disclosure can be set in the gap between the middle frame 22 and the light-emitting structure 21. For example, the conductive structure 23 can be set in the gap between the frame top wall 222 and the top surface of the light-emitting structure 21, or the conductive structure 23 can be set in the gap between the frame side wall 221 and the side of the light-emitting structure 21 to receive the light emitted by the light-emitting structure 21.

[0083] However, the present invention is not limited thereto. The conductive structure 23 may also be embedded in the frame wall of the middle frame 22. A light guide hole 223 is formed in the frame wall to guide the light emitted by the light emitting structure 21 into the conductive structure 23. The frame wall may include at least one of a frame side wall 221 and a frame top wall 222.

[0084] For example, when there is no gap between the frame side wall 221 and the side of the light-emitting structure 21, the conductive structure 23 can be embedded only in the frame top wall 222. At this time, the light guide hole 223 is also provided on the frame top wall 222, and the conductive structure 23 receives the light emitted from the edge area of ​​the light-emitting structure 21 and generates heat. The embodiment of the present disclosure can reduce or avoid the volume occupied by the conductive structure 23 when it is provided outside the middle frame 22 by embedding the shading structure 24 in the middle frame 22, thereby reducing the size of the backlight module 2 and achieving a thinner and lighter backlight module 2. In addition, by utilizing the conductive structure 23 to guide the light from the edge area of ​​the top surface of the light-emitting structure 21 into the middle frame 22, the internal temperature of the light-emitting structure 21 can be reduced, thereby extending the service life of the light board 211.

[0085] When a gap exists between the frame sidewalls 221 and the sides of the light-emitting structure 21, the conductive structure 23 can be embedded in both the frame top wall 222 and the frame sidewalls 221. Light from the light-emitting structure 21 is directed into the conductive structure 23 through the light-guiding holes 223. Heat is generated by the conductive structure 23, causing the volume of the light-shielding structure 24 to expand, thereby strengthening the seal between the frame top wall 222 and the top surface of the light-emitting structure 21. However, the conductive structure 23 can also be embedded only in the frame top wall 222 or only in the frame sidewalls 221 to reduce or avoid the volume occupied by the conductive structure 23 when it is located outside the middle frame 22, thereby reducing the size of the backlight module 2. In addition, by using the conductive structure 23 to guide light from the side of the light-emitting structure 21 into the middle frame 22, the internal temperature of the light-emitting structure 21 can be reduced, thereby extending the service life of the light board 211.

[0086] It should be noted that when the conductive structure 23 is embedded in both the frame top wall 222 and the frame side walls 221, the light guide hole 223 can be provided only in the frame side wall 221. Light from the side of the light-emitting structure 21 is conducted into the conductive structure 23 through the light guide hole 223, and then transferred from the frame side walls 221 to the frame top wall 222 by the conductive structure 23, thereby generating heat. However, the present invention is not limited to this. The light guide holes 223 can also be provided in both the frame top wall 222 and the frame side walls 221 to increase the area of ​​the conductive structure 23 receiving light emitted by the light-emitting structure 21, thereby increasing the rate of light reception at the edge of the light-emitting structure 21 and accelerating the rate of heat generation by the conductive structure 23. When the backlight module 2 emits light, the conductive structure 23 can quickly absorb the light and generate heat. In addition, the light shielding structure 24 can quickly expand in volume due to the heat generated by the conductive structure 23, thereby strengthening the seal between the frame top wall 222 and the top surface of the light-emitting structure 21, thereby reducing or preventing the problem of first color light leakage at the edge of the backlight module 2. At the same time, when there is a gap between the frame side wall 221 and the side of the light-emitting structure 21, by embedding the conductive structure 23 in the frame top wall 222 and the frame side wall 221, and providing light guide holes 223 on both the frame top wall 222 and the frame side wall 221, the light in the edge area of ​​the top surface of the light-emitting structure 21 and the light on the side of the light-emitting structure 21 can be absorbed at the same time, so as to improve the utilization rate of the light in the edge area of ​​the light-emitting structure 21, reduce energy loss, and allow more light in the edge area of ​​the top surface of the light-emitting structure 21 and the side of the light-emitting structure 21 that fails to be emitted to the display panel 3 to pass through the heat generated by the conductive structure 23, thereby strengthening the sealing between the frame top wall 222 and the top surface of the light-emitting structure 21, and reducing the possibility of leakage of the first color light in the edge area of ​​the backlight module 2.

[0087] Furthermore, the aperture of the light guide hole 223 in the embodiment of the present disclosure increases in the direction approaching the light emitting structure 21, so that more light in the edge area of ​​the light emitting structure 21 can be gathered on the light guide hole 223 and introduced into the conductive structure 23 through the light guide hole 223, thereby improving the utilization rate of the light emitted from the edge area of ​​the light emitting structure 21 and reducing the energy loss of the backlight module 2.

[0088] In the embodiment of the present disclosure, the display panel 3 arranged opposite to the light-emitting structure 21 may include a display area and a non-display area, and the positive projection of the frame top wall 222 on the display panel 3 may be entirely located within the non-display area to reduce or avoid the frame top wall 222 blocking the light emitted from the light-emitting structure 21 to the display area, thereby improving the display brightness of the display panel 3.

[0089] For example, in the embodiment of the present disclosure, the side of the frame top wall 222 facing away from the frame side wall 221 can be flush with the side of the non-display area close to the display area, so as to enhance the shielding of the first color light at the edge and reduce the possibility of the edge area of ​​the top surface of the light-emitting structure 21 and the first color light emitted from the side of the light-emitting structure 21 and not subjected to color conversion by the light conversion layer 212 leaking from the edge area of ​​the backlight module 2.

[0090] Furthermore, the side of the shading structure 24 in the embodiment of the present disclosure that is away from the frame side wall 221 can also be flush with the side of the frame top wall 222 that is away from the frame side wall 221. While avoiding the shading structure 24 from blocking the light emitted from the light-emitting structure 21 to the display area, the shading structure 24 can also avoid the problem of leakage of the first color light in the gap between the light-emitting structure 21 and the frame top wall 222 to the greatest extent, thereby reducing or avoiding the problem of leakage of the first color light in the edge area of ​​the backlight module 2.

[0091] The shading structure 24 in the embodiment of the present disclosure can be made of shading material. By setting the shading structure 24 between the frame top wall 222 and the top surface of the light-emitting structure 21, the light emitted from the edge area of ​​the light-emitting structure 21 can be blocked, thereby reducing or avoiding the first color light emitted by the light-emitting structure 21 from leaking from the gap between the frame top wall 222 and the top surface of the light-emitting structure 21, thereby improving or avoiding the problem of the first color light leaking from the edge area of ​​the backlight module 2, and enhancing the display effect of the display panel 3.

[0092] Specifically, the light shielding structure 24 can be made of a light-absorbing material. The light shielding structure 24 absorbs the first color light leaking from the edge region of the backlight module 2 to reduce the possibility of the first color light leaking from the edge region of the backlight module 2. However, the light shielding structure 24 can also be made of an opaque material such as a reflective material, and the specific material can be determined according to actual conditions.

[0093] Furthermore, the shading structure 24 in the embodiment of the present disclosure can be made of an opaque thermal expansion material or an elastic material, so that when the conductive structure 23 receives the light emitted by the light-emitting structure 21 and generates heat, the shading structure 24 can expand in volume, so that the shading structure 24 can be tightly abutted against the top wall 222 of the frame and the top surface of the light-emitting structure 21 to strengthen the sealing between the top wall 222 of the frame and the top surface of the light-emitting structure 21, thereby reducing or avoiding the possibility of leakage of the first color light in the edge area of ​​the backlight module 2.

[0094] For example, the shading structure 24 in the embodiment of the present disclosure can be made of silicone to reduce the impact of the shading structure 24 on the frame top wall 222 and the top surface of the light-emitting structure 21 under the action of external force, thereby extending the service life of the middle frame 22 and the light-emitting structure 21, but not limited to this. Other materials that can expand under the heat generated by the conductive structure 23 can be used as the manufacturing material of the shading structure 24 in the present disclosure.

[0095] In the embodiment of the present disclosure, the shading structure may include a first cavity 241, which is filled with air. After the conductive structure 23 receives the light emitted by the light-emitting structure 21 and generates heat, the gas in the first cavity 241 expands in volume under the heat generated by the conductive structure 23, so as to strengthen the seal between the light-emitting structure 21 and the frame top wall 222, thereby reducing or avoiding the possibility of leakage of the first color light in the edge area of ​​the backlight module 2.

[0096] Further, such as Figures 6 to 9 As shown, the frame top wall 222 may include a heat-conducting layer 253 and a first connecting channel 254, wherein the first connecting channel 254 is located on a side of the heat-conducting layer 253 close to the light-emitting structure 21, one end of the first connecting channel 254 is opposite to the heat-conducting layer 253, and the other end of the first connecting channel 254 is connected to the first cavity 241. The heat generated by the conductive structure 23 is transferred to the first cavity 241 through the heat-conducting layer 253 and the first connecting channel 254 in sequence, so as to expand the light-shielding structure 24.

[0097] It should be noted that the thermal conductivity efficiency of the heat-conducting layer 253 is greater than that of the frame top wall 222. Specifically, the heat-conducting layer 253 in the embodiment of the present disclosure can be made of materials with good thermal conductivity such as copper foil. By setting the heat-conducting layer 253, the heat loss generated by the conductive structure 23 can be reduced while the rate of heat transfer to the shading structure 24 can be accelerated, thereby accelerating the volume expansion of the shading structure 24 and reducing or avoiding the problem of leakage of the first color light in the edge area of ​​the backlight module 2.

[0098] like Figure 7As shown, in one embodiment of the present disclosure, the frame top wall 222 may be provided with an assembly channel 251 for assembling the heat-conducting layer 253. The assembly channel 251 may have a first section channel 2511, an intermediate channel 2512, and a second section channel 2513 arranged in sequence in a direction away from the frame side wall 221. The portion of the heat-conducting layer 253 located in the first section channel 2511 may be in contact with the inner wall surface of the first section channel 2511, and the portion of the heat-conducting layer 253 located in the second section channel 2513 may be in contact with the inner wall surface of the second section channel 2513. A gap may exist between the portion of the heat-conducting layer 253 located in the intermediate channel 2512 and the wall surface of the intermediate channel 2512 close to the light-emitting structure 21 to form a first heat-conducting cavity 255. The first heat-conducting cavity 255 is connected to the first connecting channel 254.

[0099] Among them, the heat conduction area between the first heat conduction cavity 255 and the middle channel 2512 is larger than the channel area of ​​the first connecting channel 254. When the backlight module 2 is working, the light in the edge area of ​​the light-emitting structure 21 is introduced into the conductive structure 23 and generates heat. The heat is accumulated in the assembly channel 251 and transferred to the first heat conduction cavity 255 through the heat conduction layer 253.

[0100] It should be noted that the heat conduction area between the first heat conduction cavity 255 and the intermediate channel 2512 mentioned above refers to the area of ​​the positive projection of the first heat conduction cavity 255 on the outer wall of the assembly channel 251, and the assembly channel 251 transfers heat to the first cavity 241 through the first heat conduction cavity 255.

[0101] By providing the first heat conduction cavity 255, the embodiment of the present disclosure can increase the area of ​​heat transfer from the assembly channel 251 to the first cavity 241, thereby accelerating the rate of heat transfer from the assembly channel 251 to the first cavity 241, and reducing or avoiding the possibility of leakage of the first color light from the edge area when the backlight module 2 is in the working state.

[0102] It should also be noted that the heat-conducting layer 253 in the embodiment of the present disclosure can be a thin film arranged around the inner wall of the assembly channel 251, but is not limited to this. The heat-conducting layer 253 can also be a solid cylinder embedded in the assembly channel 251, which can be determined according to actual conditions.

[0103] When the heat-conducting layer 253 is a thin film arranged around the inner wall of the assembly channel 251, the thickness of the heat-conducting layer 253 ranges from 0.05 mm to 0.1 mm, for example, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.1 mm, etc., but is not limited thereto and can be determined according to actual conditions.

[0104] In the embodiment of the present disclosure, the backlight module 2 may further include a buffer structure 26 . The buffer structure 26 is disposed on the top surface of the frame top wall 222 to support the display panel 3 .

[0105] It should be noted that the top surface of the frame top wall 222 refers to the side of the frame top wall 222 facing away from the light emitting structure 21 .

[0106] The buffer structure 26 in the present disclosure can be made of silicone to form a flexible support for the display panel 3 and the backlight module 2, but is not limited to this. Other materials that can form a flexible support for the display panel 3 and the backlight module 2 can be used as the manufacturing material of the buffer structure 26 in the present disclosure.

[0107] The present disclosure provides a buffer structure 26 to reduce the impact between the display panel 3 and the backlight module 2 in the event of a collision, thereby reducing or avoiding the risk of damage to the display panel 3 and the backlight module 2, thereby extending the service life of the display panel 3 and the backlight module 2, and effectively preventing light leakage caused by external pressure on the display panel 3.

[0108] The buffer structure 26 can also be made of thermal expansion material, so that when the conductive structure 23 receives the light emitted by the light-emitting structure 21 and generates heat, the buffer structure 26 can expand in volume to enhance the buffering performance of the buffer structure 26, thereby reducing the possibility of damage to the display panel 3 and the frame top wall 222 when subjected to external force.

[0109] Furthermore, the buffer structure 26 in the embodiment of the present disclosure may include a second cavity 261, which is filled with air. After the conductive structure 23 receives the light emitted by the light-emitting structure 21 and generates heat, the gas in the second cavity 261 expands in volume under the heat generated by the conductive structure 23, thereby improving the buffering performance of the buffer structure 26.

[0110] In one embodiment of the present disclosure, a second connecting channel 256 may be further provided on the top wall of the frame. The second connecting channel 256 is located on the side of the heat-conducting layer 253 away from the light-emitting structure 21. One end of the second connecting channel 256 is opposite to the heat-conducting layer 253, and the other end of the second connecting channel 256 is connected to the second cavity 261. The heat generated by the conductive structure 23 is transferred to the second cavity 261 through the heat-conducting layer 253 and the second connecting channel 256 in sequence, so as to expand the buffer structure 26 and realize buffering between the display panel 3 and the top wall of the frame 222.

[0111] Among them, such as Figure 8 As shown, the second connecting channel 256 may include a first connecting section 2561, a heat storage section 2562 and a second connecting section 2563 arranged in sequence along the direction from the heat conductive layer 253 to the buffer structure 26, and the channel area of ​​the first connecting section 2561 and the channel area of ​​the second connecting section 2563 are both smaller than the channel area of ​​the heat storage section 2562.

[0112] Specifically, the diameter of the heat storage segment 2562 can be three times the diameter of the first connecting segment 2561 and the second connecting segment 2563, and the height of the heat storage segment 2562 can be twice the diameter of the first connecting segment 2561 and the second connecting segment 2563. The provision of the heat storage segment 2562 can increase the amount of heat stored in the second connecting channel 256, thereby enhancing the buffering performance of the buffer structure 26 on the display panel 3 and the light-emitting structure 21, reducing the possibility of impact and damage between the backlight module 2 and the display panel 3, and thus extending the service life of the backlight module 2 and the display panel 3.

[0113] In addition, when an assembly channel 251 for assembling the heat-conducting layer 253 is opened in the frame top wall 222, the portion of the heat-conducting layer 253 located in the middle channel 2512 can have a gap with the wall surface of the middle channel 2512 facing away from the light-emitting structure 21 to form a second heat-conducting cavity 257, and the second heat-conducting cavity 257 is connected to the second connecting channel 256.

[0114] Among them, the heat conduction area between the second heat conduction cavity 257 and the middle channel 2512 is larger than the channel area of ​​the second connecting channel 256. When the backlight module 2 is working, the light in the edge area of ​​the light-emitting structure 21 is introduced into the conductive structure 23 and generates heat. The heat is accumulated in the assembly channel 251 and transferred to the second heat conduction cavity 257 through the heat conduction layer 253.

[0115] It should be noted that the heat conduction area between the second heat conduction cavity 257 and the intermediate channel 2512 mentioned above refers to the area of ​​the positive projection of the second heat conduction cavity 257 on the outer wall of the assembly channel 251, and the assembly channel 251 transfers heat to the second cavity 261 through the second heat conduction cavity 257.

[0116] By providing the second heat conduction cavity 257 , the embodiment of the present disclosure can increase the area of ​​heat transfer from the assembly channel 251 to the second cavity 261 , thereby accelerating the rate of heat transfer from the assembly channel 251 to the second cavity 261 and improving the buffering performance of the buffer structure 26 on the display panel 3 and the backlight module 2 .

[0117] Furthermore, when the embodiment of the present disclosure has both the first heat conduction cavity 255 and the second heat conduction cavity 257, the second heat conduction cavity 257 can be connected to the first heat conduction cavity 255, but is not limited thereto. The second heat conduction cavity 257 can also be isolated from the first heat conduction cavity 255, and the specific setting can be made according to actual conditions.

[0118] In one embodiment of the present disclosure, a light exit channel 25 may be provided on the top wall of the frame, and the light incident side of the light exit channel 25 is opposite to one end of the conductive structure 23, and the light exit side of the light exit channel 25 extends to the side end surface of the frame top wall 222, and the side end surface is the surface of the frame top wall 222 away from the frame side wall 221.

[0119] A filtering structure 258 may be provided in the light output channel 25. At this time, the filtering structure 258 is located at the end of the conductive structure 23 away from the frame side wall 221, and the conductive structure 23 is located on the side of the side end surface of the shading structure 24 away from the frame top wall 222, so that the conductive structure 23 can receive the first color light generated by the edge of the lamp board 211 through the light guide hole 223, and can transmit the first color light to the filtering structure 258.

[0120] It should be noted that the filtering structure 258 in the embodiment of the present disclosure includes at least a first filter 2581 for converting the first color light into the second color light. The second color light is emitted to the top surface of the light-emitting structure 21 through the light-emitting side of the light-emitting channel 25. While reducing or avoiding the problem of leakage of the first color light in the edge area of ​​the backlight module 2, it can also enhance the light output brightness of the edge area of ​​the backlight module 2, so as to reduce or avoid the problem of the brightness of the edge area of ​​the backlight module 2 being too dark and forming a dark band, thereby improving the display brightness of the display panel 3 and the uniformity of the display brightness.

[0121] For example, when the first color light in the embodiment of the present disclosure is blue light, the color of the first filter 2581 can be made yellow, and correspondingly, the second color light is white light, that is, when the light board 211 emits blue light, the blue light in the edge area of ​​the light-emitting structure 21 can be introduced into the conductive structure 23 and filtered by the first filter 2581 to form white light. While reducing the edge blue light problem of the backlight module 2, the light output brightness of the backlight module 2 can also be compensated by the white light converted in the light output channel 25 to improve the overall light output brightness of the backlight module 2, thereby improving the display brightness and color contrast of the display panel 3. However, it is not limited to this. The first color light in the embodiment of the present disclosure can be other color light except blue light, and then the first filter 2581 of the corresponding color can be set in the light output channel 25 according to the first color light, so that the second color light emitted through the light output channel 25 can improve the display brightness and color contrast of the display panel 3.

[0122] In the embodiment of the present disclosure, the first optical filter 2581 and the conductive structure 23 may be spaced apart to avoid collision between the conductive structure 23 and the first optical filter 2581 and damage to the first optical filter 2581 .

[0123] In addition, the filtering structure 258 may further include a second filter 2582, which is located between the conductive structure 23 and the first filter 2581. The second filter 2582 is spaced apart from the conductive structure 23, and the color of the second filter 2582 is the same as the color of the first color light.

[0124] By setting up a second filter 2582, the light transmitted from the edge area of ​​the light-emitting structure 21 to the conductive structure 23 can be purified, that is: the second filter 2582 is used to filter to remove light other than the first color light, so as to ensure that after filtering by the first filter 2581, the light emitted from the light output channel 25 is all the second color light. While compensating for the luminous brightness of the backlight module 2, it can also avoid the occurrence of noise, thereby improving the display contrast of the display panel 3.

[0125] It should be noted that the first filter 2581 and the second filter 2582 in the embodiment of the present disclosure can be one, two, three, etc., and no specific limitation is made here.

[0126] The light output channel 25 in the embodiment of the present disclosure may include an assembly channel 251 and a diffusion channel 252 located near the side end face of the assembly channel 251. At this time, the light incident side of the light output channel 25 is located on the side of the assembly channel 251 away from the diffusion channel 252, and the light output side of the light output channel 25 is located on the side of the diffusion channel 252 away from the assembly channel 251. The light incident side of the light output channel 25 is opposite to one end of the conductive structure 23. The filter structure 258 is assembled in the assembly channel 251, and the conductive structure 23 is located on the side of the filter structure 258 close to the frame side wall 221. After the filter structure 258 filters the first color light introduced by the conductive structure 23 into the second color light, the second color light can be emitted through the diffusion channel 252 to the top surface of the light-emitting structure 21 to compensate for the light output brightness of the backlight module 2.

[0127] It should be noted that the light incident side of the light output channel 25 is opposite to one end of the conductive structure 23, which may mean that the conductive structure 23 is partially embedded in the light output channel 25, but is not limited to this. It may also mean that the end of the conductive structure 23 is arranged close to the light incident side of the light output channel 25 to ensure that the heat generated by the conductive structure 23 can be introduced into the light output channel 25.

[0128] When the conductive structure 23 is partially embedded in the light exit channel 25 , the aperture of the end where the light exit channel 25 and the conductive structure 23 meet can be larger than or equal to the aperture of the conductive structure 23 to ensure that the conductive structure 23 can be embedded in the light exit channel 25 .

[0129] Furthermore, the aperture of the end where the light output channel 25 is connected to the conductive structure 23 can be made equal to the aperture of the conductive structure 23, so that the conductive structure 23 and the inner side wall of the light output channel 25 can be tightly connected to reduce or avoid light leakage at the connection between the light output channel 25 and the conductive structure 23, thereby reducing or avoiding the problem of first color light leakage at the edge of the backlight module 2.

[0130] Specifically, the aperture of the assembly channel 251 in the embodiment of the present disclosure may range from 3 mm to 5 mm, for example, 3 mm, 3.5 mm, 4 mm, 4.5 mm, 5 mm, etc., but is not limited thereto and may be determined according to actual conditions.

[0131] In the embodiment of the present disclosure, the cross-sectional area of ​​the diffusion channel 252 can increase gradually along the direction close to the side end face of the frame top wall 222, so that the diffusion channel 252 can be used to disperse the light to reduce the concentration of the light emitted from the light-emitting side, and to achieve uniform fill light on the light-emitting surface of the backlight module 2.

[0132] In the embodiment of the present disclosure, a diffusion film 2521 may also be provided on the side end surface of the frame top wall 222. The diffusion film 2521 covers at least the light-exiting side of the light-exiting channel 25. By providing the diffusion film 2521, the light emitted from the light-exiting side can be dispersed to avoid the problem of bright lines on the display of the display panel 3 caused by the concentration of light emitted from the light-exiting side, thereby achieving uniform fill light on the light-exiting surface of the backlight module 2.

[0133] It should be noted that when the heat conducting layer 253 and the light filtering structure 258 are simultaneously installed in the assembly channel 251, and the heat conducting layer 253 is a thin film arranged around the inner wall of the assembly channel 251, the heat conducting layer 253 is located between the light filtering structure 258 and the inner wall of the assembly channel 251.

[0134] In the embodiment of the present disclosure, a reflective layer may be further provided on at least one of the outer wall of the conductive structure 23 , the inner wall of the heat conductive layer 253 , and the inner wall of the diffusion channel 252 .

[0135] The inner sidewall of the heat conducting layer 253 refers to a side of the heat conducting layer 253 facing away from the inner sidewall of the assembly channel 251 when the heat conducting layer 253 is a thin film disposed around the inner sidewall of the assembly channel 251 .

[0136] The reflective layer can be made of a reflective material with a high refractive index, such as barium sulfate, to enhance light guiding efficiency, thereby increasing the brightness of the second color light emitted through the light exit channel 25, thereby improving the display brightness of the display panel 3. It should be noted that when both the reflective layer and the heat conductive layer 253 are provided in the assembly channel 251, the reflective layer can be provided on the side of the heat conductive layer 253 facing away from the inner sidewall of the assembly channel 251, so as to accelerate the heat transfer rate in the assembly channel 251 while improving the light guiding efficiency in the assembly channel 251, thereby increasing the brightness of the light emitted from the light exit side of the light exit channel 25, thereby improving the display brightness of the display panel 3.

[0137] The reflective layer can also be opaque, thereby reducing or avoiding the possibility of light leakage from the middle frame 22 when light is transmitted in the conductive structure 23 and the light output channel 25, and further reducing or avoiding the problem of first color light leakage in the edge area of ​​the backlight module 2.

[0138] In the embodiment of the present disclosure, the backlight module 2 may further include a back panel 27, which includes a bottom panel 272 and a side panel 271. The bottom panel 272 is arranged on the bottom surface of the light-emitting structure 21 to provide support for the light-emitting structure 21. The side panel 271 is arranged between the frame side wall 221 and the light-emitting structure 21. The side panel 271 is connected to the bottom panel 272, and the side of the side panel 271 facing away from the bottom panel 272 is in contact with the frame top wall 222, so that the side panel 271 can provide support for the frame top wall 222.

[0139] It should be noted that the bottom surface of the light emitting structure 21 refers to a surface of the light emitting structure 21 away from the frame top wall 222 .

[0140] Among them, when there is a gap between the side panel 271 and the side of the light-emitting structure 21, the embodiment of the present disclosure can set a light guide hole 223 on the frame side wall 221, and set a plurality of light holes 273 on the side panel 271. The light holes 273 pass through the side panel 271 and are set one-to-one corresponding to the light guide holes 223 on the side panel 271. The light emitted from the side of the light-emitting structure 21 passes through the light holes 273 and the light guide holes 223 on the side panel 271 in turn and enters the conductive structure 23.

[0141] It should be noted that the shape of the light hole 273 can be cylindrical, but is not limited to this. Prismatic, columnar, etc. shapes of the light hole 273 that can facilitate the passage of light from the side of the light-emitting structure 21 and be introduced into the conductive structure 23 are all included in the embodiments of the present disclosure.

[0142] The embodiment of the present disclosure also provides a display device 1, which includes a display panel 3 and any backlight module 2 as described above, wherein the display panel 3 is located on the light-emitting side of the backlight module 2, and the display panel 3 is supported on the frame top wall 222 of the backlight module 2. When the backlight module 2 is working, it can provide a light source for the display panel 3, thereby enabling the display device 1 to realize the display function.

[0143] It should be noted that the display device 1 in the embodiment of the present disclosure may be a MiniLED display device, but is not limited thereto. Other display devices 1 besides the MiniLED display device may also be included in the embodiment of the present disclosure.

[0144] In the description of this specification, the reference terms "some embodiments", "other embodiments", etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment of the present disclosure. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.

[0145] Although the embodiments of the present disclosure have been shown and described above, it is understood that the above embodiments are illustrative and cannot be understood as limitations on the present disclosure. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present disclosure. Therefore, any changes or modifications made in accordance with the claims and description of the present disclosure shall fall within the scope of the patent of the present disclosure.

Claims

1. A backlight module, characterized in that: include: Light-emitting structure; a middle frame, comprising side walls and a top wall, wherein the side walls surround the light-emitting structure, the top wall is connected to the side walls and is located on the top surface of the light-emitting structure, and covers an edge area of ​​the top surface of the light-emitting structure and is spaced apart from the edge area of ​​the top surface of the light-emitting structure; a conductive structure, opposite to a side surface of the light-emitting structure and / or an edge region of a top surface of the light-emitting structure, and configured to receive light emitted by the light-emitting structure to generate heat; A light shielding structure is provided between the top surface of the light emitting structure and the frame top wall. The light shielding structure can expand under the heat generated by the conductive structure to achieve sealing between the light emitting structure and the frame top wall.

2. The backlight module according to claim 1, wherein: The conductive structure is embedded in the frame wall of the middle frame, and the frame wall is provided with a light guide hole for guiding the light emitted by the light emitting structure into the conductive structure. The frame wall includes at least one of the frame side wall and the frame top wall.

3. The backlight module according to claim 2, wherein: The light shielding structure has a first cavity; A heat-conducting layer is embedded in the frame top wall, the heat-conducting layer has a greater heat-conducting efficiency than the frame top wall, and a first connecting channel is opened on the frame top wall, and the first connecting channel is located on a side of the heat-conducting layer close to the light-emitting structure; Among them, one end of the first connecting channel is opposite to the heat-conducting layer, and the other end of the first connecting channel is connected to the first cavity. The heat generated by the conductive structure is transferred to the first cavity through the heat-conducting layer and the first connecting channel in sequence to cause the shading structure to expand.

4. The backlight module according to claim 3, wherein: The top wall of the frame is provided with an assembly channel for assembling the heat-conducting layer, and the assembly channel comprises a first section channel, a middle section channel and a second section channel which are sequentially arranged in a direction away from the side wall of the frame; The portion of the heat-conducting layer located in the first section of the channel is in contact with the inner wall surface of the first section of the channel; The portion of the heat-conducting layer located in the second section of the channel is in contact with the inner wall surface of the second section of the channel; A gap is formed between a portion of the heat-conducting layer located in the middle channel and a wall surface of the middle channel close to the light-emitting structure to form a first heat-conducting cavity, which is connected to the first connecting channel.

5. The backlight module according to claim 3, wherein: The backlight module includes a buffer structure, which is provided on the top surface of the frame top wall and is used to support the display panel, and the buffer structure has a second cavity; The frame top wall is provided with a second connecting channel, and the second connecting channel is located on a side of the heat conducting layer away from the light emitting structure; Among them, one end of the second connecting channel is opposite to the heat-conducting layer, and the other end of the second connecting channel is connected to the second cavity. The heat generated by the conductive structure is transferred to the second cavity through the heat-conducting layer and the second connecting channel in sequence, so that the buffer structure expands, thereby realizing buffering between the display panel and the top wall of the frame.

6. The backlight module according to claim 5, wherein: The top wall of the frame is provided with an assembly channel for assembling the heat-conducting layer, and the assembly channel comprises a first section channel, a middle section channel and a second section channel which are sequentially arranged in a direction away from the side wall of the frame; The portion of the heat-conducting layer located in the first section of the channel is in contact with the inner wall surface of the first section of the channel; The portion of the heat-conducting layer located in the second section of the channel is in contact with the inner wall surface of the second section of the channel; A gap is formed between a portion of the heat-conducting layer located in the middle channel and a wall surface of the middle channel facing away from the light-emitting structure to form a second heat-conducting cavity. The second heat-conducting cavity is connected to the second connecting channel.

7. The backlight module according to claim 5, wherein: The second connecting channel includes a first connecting section, a heat storage section and a second connecting section arranged in sequence along the direction from the heat conductive layer to the buffer structure. The channel area of ​​the first connecting section and the channel area of ​​the second connecting section are both smaller than the channel area of ​​the heat storage section.

8. The backlight module according to claim 2, wherein: The light-emitting structure includes a light board and a light conversion layer provided on a side of the light board close to the top wall of the frame, wherein the light board is used to generate a first color light, and the light conversion layer is used to convert the first color light into a second color light; The frame top wall is provided with a light exit channel, the light entrance side of the light exit channel is opposite to one end of the conductive structure, and the light exit side of the light exit channel extends to the side end surface of the frame top wall, and the side end surface is the surface of the frame top wall away from the frame side wall; In which, a filtering structure is provided in the light output channel, and the conducting structure is located on the side of the shading structure away from the side end face. The conducting structure can receive the first color light generated by the edge of the lamp board through the light guide hole, and can conduct the first color light to the filtering structure. The filtering structure can at least convert the first color light into the second color light and emit it through the light output side of the light output channel.

9. The backlight module according to claim 8, wherein: The side end surface is provided with a diffusion film, and the diffusion film covers the light output side of the light output channel.

10. The backlight module according to claim 8, wherein: The light exit channel includes an assembly channel and a diffusion channel located in the assembly channel close to the side end surface. The filter structure is assembled in the assembly channel. The cross-sectional area of ​​the diffusion channel increases gradually along the direction close to the side end surface.

11. The backlight module according to claim 10, wherein: A heat-conducting layer is provided between the light filtering structure and the inner wall of the assembly channel.

12. The backlight module according to claim 11, wherein: A reflective layer is provided on at least one of the outer wall of the conductive structure, the inner wall of the heat conductive layer, and the inner wall of the diffusion channel.

13. The backlight module according to claim 1, wherein: A side of the light-shielding structure away from the frame side wall is flush with a side of the frame top wall away from the frame side wall.

14. The backlight module according to claim 2, wherein: The backlight module includes a back plate, which includes a bottom plate and a side plate. The bottom plate is provided on the bottom surface of the light-emitting structure, and the side plate is provided between the side wall of the frame and the light-emitting structure. The side plate is connected to the bottom plate, and the side of the side plate facing away from the bottom plate abuts against the top wall of the frame. Wherein, the light guide hole is located at least on the side wall of the frame, and a plurality of light holes are provided on the side plate, the light holes pass through the side plate and are arranged opposite to the light guide hole, and the light emitted by the light-emitting structure passes through the light holes and the light guide holes in sequence and enters the conductive structure; and / or The aperture of the light guide hole increases gradually along a direction approaching the light emitting structure.

15. A display device, characterized in that: The device comprises a display panel and the backlight module according to any one of claims 1 to 14, wherein the display panel is supported on the top wall of the frame of the backlight module.

Images