Chip cleaning device and cleaning method based on pulse-free pump liquid supply

Abstract

The present invention relates to the field of semiconductor device manufacturing and processing, and specifically to a chip cleaning device and cleaning method based on pulse-free pump liquid supply. The chip cleaning device based on pulse-free pump liquid supply includes a control cabinet and a box body arranged on the control cabinet, and also includes: a horizontal table, rotatably installed in the box body, for placing wafers to be cleaned, and the horizontal table is provided with a plurality of stabilizing mechanisms for limiting the wafers, the rotating shaft of the horizontal table is connected to a variable speed drive mechanism installed in the box body, and the variable speed drive mechanism can drive the horizontal table to rotate at different speeds; this device can integrate cleaning and rinsing functions, and when the spray medium is switched from cleaning liquid to ultrapure water, the rotation speed of the wafer can be automatically increased, avoiding the problem of needing to use different equipment due to different requirements for cleaning and rinsing treatments, thereby simplifying the chip production process.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor device manufacturing and processing, and in particular to a chip cleaning device and a cleaning method based on liquid supply without a pulse pump. Background Art

[0002] The chip manufacturing process involves performing photolithography, etching, metallization, and other process steps on a wafer to form tiny circuit structures. Ultimately, the multiple chips on the wafer are separated through dicing, packaging, and testing. Wafer cleaning is a crucial step in the chip manufacturing process, removing various contaminants from the wafer surface to ensure that subsequent process steps can be performed on a clean surface.

[0003] In the cleaning of chip wafers, the wafer surface is usually cleaned first with a cleaning fluid, and then ultrapure water is used to rinse off the residual chemicals on the wafer. Usually, during cleaning, the wafer needs to be rotated at a relatively low speed to ensure that the cleaning fluid evenly wets the wafer surface. During rinsing and drying, the wafer needs to be rotated at a relatively high speed to help remove particles and impurities attached to the wafer surface through centrifugal force and improve the efficiency of the drying process.

[0004] In this regard, the current processing method is usually to use two different devices for cleaning and rinsing separately (that is, the wafer is transferred from the cleaning equipment to the rinsing equipment). This involves the position transfer of the wafer, which complicates the cleaning process and makes it difficult to achieve the ideal use effect. Summary of the Invention

[0005] The object of the present invention is to provide a chip cleaning device and a cleaning method based on liquid supply without a pulse pump, so as to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A chip cleaning device based on liquid supply without a pulse pump comprises a control cabinet and a box body arranged on the control cabinet, and further comprises:

[0008] A horizontal table is rotatably mounted in the box body and is used to place wafers to be cleaned. The horizontal table is provided with a plurality of stabilizing mechanisms for limiting the position of the wafers. The rotating shaft of the horizontal table is connected to a variable speed drive mechanism mounted in the box body. The variable speed drive mechanism can drive the horizontal table to rotate at different speeds.

[0009] A threaded fitting mechanism is installed in the housing and connected to the variable speed drive mechanism. The threaded fitting mechanism is also connected to a medium switching mechanism. The housing is provided with a pumping mechanism for spraying cleaning liquid or ultrapure water onto the wafer.

[0010] During cleaning, the threaded fitting mechanism can trigger the medium switching mechanism, so that the medium sprayed by the pump mechanism is switched from cleaning liquid to ultrapure water. At the same time, the speed-changing drive mechanism causes the rotation speed of the horizontal table to increase.

[0011] As a further solution of the present invention: the threaded engagement mechanism includes a second screw rotatably mounted in the housing, a second slider disposed on the second screw and threadably engaged with the second screw, and a second drive motor mounted in the housing;

[0012] One end of the second screw rod is connected to the output end of the second drive motor, and the other end is connected to the medium switching mechanism. A drive column is also fixed on the second slider, and the drive column is connected to the speed change drive mechanism.

[0013] As a further solution of the present invention: the speed change drive mechanism includes a two-way matching component installed in the box and connected to the horizontal table rotation shaft, a circumferential rotation component connected to the two-way matching component, and a driven structure connected to the drive column. When the medium switching mechanism is triggered, the drive column can cause the driven structure to move.

[0014] As a further solution of the present invention: the bidirectional matching assembly includes a ratchet wheel rotatably mounted in the box body and a frame body movably arranged in the box body via a guide structure, and the rotating shafts of the ratchet wheel and the horizontal platform are connected by a first transmission belt;

[0015] The ratchet is located in the frame, and two ratchet plates are provided in the frame. The two ratchet plates are arranged opposite to each other, and the directions of the ratchets on the two plates are opposite.

[0016] As a further solution of the present invention, the circumferential rotation assembly includes a vertical shaft rotatably mounted in the box body and an assembly plate fixed to one end of the vertical shaft, the other end of the vertical shaft is connected to the second screw rod via a transmission member, the assembly plate is provided with a placement groove, a driven block is slidably engaged in the placement groove, and a follower column is fixed to the driven block;

[0017] A transmission rod is fixedly mounted on the frame, and a strip groove adapted to the follower column is provided on the transmission rod. The follower column extends into the strip groove and is slidably connected to the transmission rod.

[0018] As a further embodiment of the present invention, a guide plate is fixed in the box body, and the driven structure includes a transmission plate slidably connected to the guide plate and a sleeve slidably sleeved on the vertical shaft and rotatably connected to the transmission plate, the sleeve being connected to the driven block via a connecting rod, and the ends of the connecting rod being hinged to the sleeve and the driven block respectively;

[0019] In which, a driven plate is fixed to the end of the transmission plate away from the guide plate, and a folded line groove adapted to the driving column is provided on the driven plate. The driving column extends into the folded line groove and is slidingly connected to the driven plate. The folded line groove includes a second trough body arranged obliquely and a first trough body and a third trough body arranged along the length direction of the driven plate. The two ends of the second trough body are respectively connected to the first trough body and the third trough body.

[0020] As a further solution of the present invention: please refer to Figures and Figures again, the liquid pumping mechanism includes a pump body installed in the box body, the liquid outlet of the pump body is connected to a liquid spray pipe, and the liquid inlet is connected to a liquid inlet pipe, and the liquid inlet pipe is connected to a first pipe and a second pipe through the medium switching mechanism, and the first pipe and the second pipe are used to pump cleaning liquid and ultrapure water, respectively.

[0021] As a further embodiment of the present invention, the medium switching mechanism includes a conduit rotatably mounted in the housing and a spherical shell fixed in the housing, the first pipe and the second pipe being in communication with the spherical shell, one end of the conduit being sealingly rotatably connected to the liquid inlet pipe, and the other end being fixed to a sphere disposed within the spherical shell;

[0022] The outer wall of the sphere is sealed and slidably fitted with the inner wall of the spherical shell, the conduit is connected to an "L"-shaped passage provided in the sphere, and the conduit is also connected to the second slider through an angle conversion structure.

[0023] As a further solution of the present invention: the angle conversion structure includes a transmission shaft rotatably mounted in the box body and a transverse movement cylinder slidably sleeved on the transmission shaft and fixedly connected to the second slider, a protrusion is fixedly provided on the inner wall of the transverse movement cylinder, and an outer wall of the transmission shaft is provided with a direction-changing groove adapted to the protrusion, the protrusion extends into the direction-changing groove and is slidably connected to the transmission shaft;

[0024] In which, the transmission shaft is connected to the conduit through a second bevel gear set, the changing groove includes a spirally arranged second slide groove and a first slide groove and a third slide groove arranged axially along the transmission shaft, and the two ends of the second slide groove are respectively connected to the first slide groove and the third slide groove.

[0025] A chip cleaning method, using the chip cleaning device based on pulse-free pump liquid supply, comprises the following steps:

[0026] Step 1: Place the wafer to be processed on the horizontal table, and use a stabilizing mechanism to limit the position of the wafer;

[0027] Step 2: The pump mechanism and the threaded matching mechanism work together to spray the cleaning liquid onto the wafer. The threaded matching mechanism drives the horizontal table to rotate through the variable speed drive mechanism, so that the wafer remains in a rotating state.

[0028] Step 3: The medium switching mechanism and the speed-changing drive mechanism are triggered, the medium sprayed by the pump mechanism is switched from cleaning liquid to ultrapure water, and the speed-changing drive mechanism causes the wafer to rotate faster;

[0029] Step 4: The pumping mechanism stops working and the wafer keeps rotating to dry the moisture on its surface.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] The present application adopts the spraying method in wet cleaning to clean the wafer. When the cleaning device is working, the pump mechanism sprays the cleaning liquid or ultrapure water onto the wafer. The medium switching mechanism can flexibly switch the cleaning liquid or ultrapure water and make adaptive adjustments according to the actual working conditions.

[0032] Secondly, the present invention uses a variable speed switching mechanism to drive the wafer to be cleaned to rotate at different speeds. When the medium switching mechanism changes the cleaning liquid to ultrapure water according to the current working conditions, the threaded mating mechanism simultaneously causes the variable speed drive mechanism to move, thereby increasing the rotation speed of the wafer.

[0033] Therefore, during the actual wafer cleaning process using this device, the wafer rotates at two different speeds. A relatively low speed ensures that the cleaning liquid evenly wets the wafer surface. Due to the low speed and low centrifugal force, the cleaning liquid can adhere to the wafer surface. The chemical properties of the cleaning liquid are used to reduce the adhesion between the attached matter and the wafer, thereby ensuring the subsequent cleaning effect. Correspondingly, a relatively high speed can utilize the greater centrifugal force to effectively remove particles and residual chemical reagents attached to the wafer surface. Moreover, during the subsequent drying process, due to the high-speed rotation of the wafer, its surface contacts the surrounding air at a higher speed, which is also beneficial to the efficiency of its own surface drying.

[0034] In summary, this device can integrate the cleaning and rinsing functions into one, and when the spray medium is switched from cleaning liquid to ultrapure water, the rotation speed of the wafer can be automatically increased, avoiding the problem of needing to use different equipment due to different requirements for cleaning and rinsing treatments, and simplifying the chip production process. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 The figure is a schematic structural diagram of an embodiment of a chip cleaning device based on liquid supply without a pulse pump.

[0036] Figure 2This is a structural schematic diagram from another angle of an embodiment of a chip cleaning device based on liquid supply without a pulse pump.

[0037] Figure 3 This is a schematic diagram of the internal structure of the control cabinet and the box body in an embodiment of a chip cleaning device based on liquid supply without a pulse pump.

[0038] Figure 4 for Figure 3 Schematic diagram of the structure from another angle.

[0039] Figure 5 for Figure 4 A magnified view of the structure at point A.

[0040] Figure 6 This is an exploded view of the structure of the stabilizing mechanism in one embodiment of a chip cleaning device based on liquid supply without a pulse pump.

[0041] Figure 7 This is a schematic diagram of the connection relationship between the threaded fitting mechanism and the variable speed drive mechanism in one embodiment of a chip cleaning device based on liquid supply without a pulse pump.

[0042] Figure 8 This is a partial structural diagram of a variable speed drive mechanism in an embodiment of a chip cleaning device based on liquid supply without a pulse pump.

[0043] Figure 9 for Figure 8 Schematic diagram of the structure from another angle.

[0044] Figure 10 This is a schematic diagram of the connection relationship between the pump mechanism and the medium switching mechanism in an embodiment of a chip cleaning device based on a pulse-free pump liquid supply.

[0045] In the figure: 1, control cabinet; 2, box body; 3, horizontal table; 301, through slot; 4, first drive motor; 5, first screw rod; 6, movable block; 601, limit column; 7, first transmission belt; 8, ratchet; 9, frame; 10, ratchet plate; 11, first guide rail; 12, second guide rail; 13, transmission rod; 1301, strip groove; 14, first slider; 15, second slider; 1501, drive column; 16, second drive motor; 17, second screw rod; 18, first bevel gear set; 19, second transmission belt; 20, assembly plate; 2001, placement slot; 2 1. Follower block; 2101. Follower column; 22. Vertical shaft; 23. Connecting rod; 24. Sleeve; 25. Guide plate; 26. Transmission plate; 27. Follower plate; 2701. First trough; 2702. Second trough; 2703. Third trough; 28. Transverse cylinder; 29. Transmission shaft; 2901. First slide; 2902. Second slide; 2903. Third slide; 30. Second bevel gear set; 31. Liquid inlet pipe; 32. Liquid spray pipe; 33. Conduit; 34. Sphere; 35. Ball shell; 36. First pipeline; 37. Second pipeline; 38. Pump body. DETAILED DESCRIPTION

[0046] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0047] In addition, when an element in the present invention is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0048] See also Figures 1-10 In an embodiment of the present invention, a chip cleaning device based on liquid supply without a pulse pump includes a control cabinet 1 and a box 2 provided on the control cabinet 1, and further includes:

[0049] A horizontal table 3 is rotatably mounted in the box 2 and is used to place wafers to be cleaned. The horizontal table 3 is provided with a plurality of stabilizing mechanisms for limiting the position of the wafers. The rotating shaft of the horizontal table 3 is connected to a variable speed drive mechanism mounted in the box 2. The variable speed drive mechanism can drive the horizontal table 3 to rotate at different speeds.

[0050] A threaded fitting mechanism is installed in the housing 2 and connected to the variable speed drive mechanism. The threaded fitting mechanism is also connected to a medium switching mechanism. The housing 2 is provided with a pumping mechanism for spraying cleaning liquid or ultrapure water onto the wafer;

[0051] During cleaning, the threaded fitting mechanism can trigger the medium switching mechanism, so that the medium sprayed by the pump mechanism is switched from cleaning liquid to ultrapure water. At the same time, the speed-changing drive mechanism causes the rotation speed of the horizontal platform 3 to increase.

[0052] Furthermore, the commonly used cleaning solution includes a mixed solution of sulfuric acid and hydrogen peroxide, with a ratio ranging from 1:1 to 1:4, a cleaning time of about ten minutes, and a temperature condition maintained at 100 to 150 degrees Celsius. In addition, the SC used in the RCA cleaning method -1 (NH4OH / H2O2 / H2O) and SC -2 (HCl / H2O2 / H2O) cleaning solution is also a common choice.

[0053] Secondly, the stabilizing mechanism includes a first drive motor 4 installed at the bottom of the horizontal platform 3, a first screw rod 5 connected to the output end of the first drive motor 4, and a movable block 6 provided on the first screw rod 5 and threadedly connected to the first screw rod 5. A limiting column 601 is fixed on the movable block 6, and a through groove 301 is provided on the horizontal platform 3, which is parallel to the axial direction of the first screw rod 5 and adapted to the limiting column 601. The limiting column 601 extends to the upper part of the horizontal platform 3;

[0054] During operation, the wafer to be processed is placed on the horizontal table 3, and the first drive motor 4 drives the first screw 5 to rotate. The movable block 6 facilitates the threaded engagement of the first screw 5 and drives the limiting column 601 to move toward the center position of the horizontal table 3. Then, the multiple limiting columns 601 on the horizontal table 3 perform a retraction action to limit the wafer on the horizontal table 3. During the subsequent cleaning process, the horizontal table 3 can drive the wafer to rotate.

[0055] During specific operation, the pump mechanism first sprays the cleaning liquid onto the wafer. At the same time, the threaded matching mechanism works to drive the horizontal table 3 to rotate through the variable speed drive mechanism, so that the wafer rotates at a relatively low speed. This ensures that the cleaning liquid evenly wets the wafer surface and ensures the cleaning effect.

[0056] Subsequently, the threaded fitting mechanism will prompt the medium switching mechanism to be triggered, and the liquid pumping mechanism will change the spraying medium, that is, from cleaning liquid to ultrapure water, so as to use ultrapure water to flush out the residual chemical substances on the wafer. At the same time, the threaded fitting mechanism will also prompt the variable speed drive mechanism to increase the rotation speed of the horizontal table 3. Through high-speed rotation, the particles and residual chemical reagents attached to the surface of the wafer can be effectively removed. Moreover, in the subsequent drying process, the high-speed rotation of the wafer is also beneficial to the efficiency of its own surface drying.

[0057] Please refer again Figure 7 and Figure 8 The threaded engagement mechanism includes a second screw rod 17 rotatably mounted in the housing 2, a second slider 15 provided on and threadedly engaged with the second screw rod 17, and a second drive motor 16 installed in the housing 2. One end of the second screw rod 17 is connected to the output end of the second drive motor 16, and the other end is connected to the medium switching mechanism. A drive column 1501 is also fixed to the second slider 15, and the drive column 1501 is connected to the speed change drive mechanism.

[0058] It should be supplemented that, in order to ensure the stability of the threaded fit between the second slider 15 and the second screw rod 17 , a second guide rail 12 is fixedly provided in the box body 2 , and the second slider 15 is slidably engaged on the second guide rail 12 .

[0059] Please refer again Figure 5-Figure 9 The speed-changing drive mechanism includes a two-way matching component installed in the housing 2 and connected to the rotating shaft of the horizontal platform 3, a circumferential rotating component connected to the two-way matching component, and a driven structure connected to the driving column 1501. When the medium switching mechanism is triggered, the driving column 1501 can cause the driven structure to move. The two-way matching component includes a ratchet 8 rotatably installed in the housing 2 and a frame 9 movably arranged in the housing 2 through a guide structure. The rotating shafts of the ratchet 8 and the horizontal platform 3 are connected by a first transmission belt 7. The ratchet 8 is located in the frame 9, and two ratchet plates 10 are provided in the frame 9. The two ratchet plates 10 are arranged opposite to each other, and the ratchets on the two plates face opposite directions.

[0060] The guide structure includes a first guide rail 11 fixed in the box body 2 and two first sliders 14 slidably engaged on the first guide rail 11 . The two first sliders 14 are fixedly connected to the frame body 9 to guide the movement of the frame body 9 .

[0061] When the second drive motor 16 drives the second screw rod 17 to rotate, the second screw rod 17 will drive the circumferential rotation component to move, and the circumferential rotation component drives the frame 9 to reciprocate along the length direction of the first guide rail 11;

[0062] It should be noted that the two ratchet plates 10 and the ratchets thereon are connected with torsion springs to facilitate the reset of the ratchets after flipping. Assuming that the two ratchet plates 10 are the first plate and the second plate respectively, when the frame 9 moves toward one side, the ratchet on the first plate does not flip when passing the ratchet 8, and the ratchet on the second plate flips when passing the ratchet 8. Therefore, the ratchet on the first plate will drive the ratchet 8 to rotate. When the frame 9 moves toward the other side, the ratchet on the second plate does not flip when passing the ratchet 8, and the ratchet on the first plate flips when passing the ratchet 8. Therefore, the ratchet on the second plate will drive the ratchet 8 to rotate, and the rotation direction of the ratchet 8 remains unchanged. Therefore, the rotation axis of the ratchet 8 can drive the horizontal table 3 to rotate through the first transmission belt 7, so that the wafer remains in a rotating state during the cleaning process.

[0063] The circumferential rotation assembly includes a vertical shaft 22 rotatably mounted in the box body 2 and an assembly plate 20 fixed to one end of the vertical shaft 22. The other end of the vertical shaft 22 is connected to the second screw rod 17 via a transmission member. The assembly plate 20 is provided with a placement groove 2001. A driven block 21 is slidably engaged in the placement groove 2001. A follower column 2101 is fixed to the driven block 21.

[0064] In detail, the transmission member includes a second transmission belt 19 and a first bevel gear set 18 provided between the second screw 17 and the vertical shaft 22. The first bevel gear set 18 includes a first bevel gear fixedly mounted on the second screw 17 and a second bevel gear rotatably mounted in the housing 2. The second bevel gear meshes with the first bevel gear. The second transmission belt 19 is used to connect the rotating shaft of the second bevel gear and the vertical shaft 22.

[0065] A transmission rod 13 is fixedly mounted on the frame 9 , and a strip groove 1301 adapted to the follower column 2101 is provided on the transmission rod 13 . The follower column 2101 extends into the strip groove 1301 and is slidably connected to the transmission rod 13 .

[0066] When the second drive motor 16 drives the second screw rod 17 to rotate, the second screw rod 17 will drive the vertical shaft 22 to rotate through the first bevel gear set 18 and the second transmission belt 19. Then, the assembly plate 20 drives the driven block 21 and the follower column 2101 to perform circular motion. Accordingly, during the movement of the follower column 2101, the strip-shaped groove 1301 is slidably engaged with the transmission rod 13, so that the transmission rod 13 drives the frame 9 to perform reciprocating linear motion, thereby achieving the effect of continuous directional rotation of the ratchet 8.

[0067] When the driving column 1501 causes the driven structure to move, the driven structure will drive the driven block 21 to slide in the placement groove 2001. Specifically, when the injection medium of the pumping mechanism is changed from cleaning liquid to ultrapure water, the driven block 21 slides away from the vertical shaft 22 in the placement groove 2001. As a result, the trajectory radius of the circular motion of the follower column 2101 increases, that is, the stroke range of the reciprocating linear motion of the frame 9 increases, and the number of ratchets that can cooperate with the ratchet 8 increases. Therefore, the rotation speed of the ratchet 8 and the horizontal table 3 can be improved.

[0068] A guide plate 25 is fixed to the housing 2. The driven structure includes a transmission plate 26 slidably connected to the guide plate 25 and a sleeve 24 slidably sleeved on the vertical shaft 22 and rotatably connected to the transmission plate 26. The sleeve 24 is connected to the driven block 21 via a connecting rod 23. The ends of the connecting rod 23 are hinged to the sleeve 24 and the driven block 21, respectively. A driven plate 27 is also fixed to the end of the transmission plate 26 away from the guide plate 25. The driven plate 27 is provided with a folding groove adapted to fit the drive post 1501. The drive post 1501 extends into the folding groove and slidably connected to the driven plate 27. The folding groove includes a second groove body 2702 arranged obliquely, and a first groove body 2701 and a third groove body 2703 arranged along the length of the driven plate 27. The ends of the second groove body 2702 are connected to the first groove body 2701 and the third groove body 2703, respectively.

[0069] When the second slider 15 slides along the second guide rail 12, the driving column 1501 slides in the first groove 2701, the second groove 2702 and the third groove 2703 in sequence. When the driving column 1501 slides along the first groove 2701, the liquid pumping mechanism sprays cleaning liquid to the wafer. When the medium switching mechanism is triggered, the driving column 1501 enters the second groove 2702. Then, the driving column 1501 slides with the driven plate 27 through the second groove 2702, causing the driven plate 27 to move downward. Accordingly, The driven plate 27 drives the sleeve 24 to slide downward on the vertical shaft 22. The sleeve 24 pushes the driven block 21 to slide away from the vertical shaft 22 in the placement groove 2001 through the connecting rod 23, so that the trajectory radius of the circular motion of the follower column 2101 increases. Therefore, when the driving column 1501 slides along the third groove body 2703 subsequently, the liquid pumping mechanism sprays ultrapure water for a part of the time and stops working for the latter part. During this process, the rotation speed of the wafer is improved, which can achieve better particle and residual chemical reagent removal effect and drying treatment effect.

[0070] Please refer again Figure 5 and Figure 10 The liquid pumping mechanism includes a pump body 38 installed in the box body 2, the liquid outlet of the pump body 38 is connected to the liquid spray pipe 32, and the liquid inlet is connected to the liquid inlet pipe 31. The liquid inlet pipe 31 is connected to the first pipe 36 and the second pipe 37 through the medium switching mechanism. The first pipe 36 and the second pipe 37 are used to pump cleaning liquid and ultrapure water respectively.

[0071] Among them, it should be emphasized that the pump body 38 is a pulse-free pump. A pulse-free pump is a device that can achieve smooth and continuous fluid delivery. Its main feature is that it avoids the pulsation and vibration caused by mechanical movement of traditional pumps, thereby greatly reducing the shear force and mechanical loss of the fluid, which helps to protect the properties and quality of fragile fluids. Therefore, when cleaning chips, the use of a pulse-free pump can effectively improve the uniformity of wafer cleaning, and at the same time ensure that the wafer is evenly stressed.

[0072] The medium switching mechanism includes a conduit 33 rotatably mounted within the housing 2 and a spherical housing 35 fixed thereto. A first conduit 36 and a second conduit 37 are connected to the spherical housing 35. One end of the conduit 33 is in sealed rotational connection with the liquid inlet pipe 31, and the other end is fixed to a sphere 34 disposed within the spherical housing 35. The outer wall of the sphere 34 is in sealed sliding engagement with the inner wall of the spherical housing 35. The conduit 33 is connected to an L-shaped passage within the sphere 34 and is further connected to the second slider 15 via an angle conversion mechanism.

[0073] The angle conversion structure includes a transmission shaft 29 rotatably mounted within the housing 2, and a transverse cylinder 28 slidably sleeved on the transmission shaft 29 and fixedly connected to the second slider 15. A boss is fixedly mounted on the inner wall of the transverse cylinder 28, and a direction-changing groove adapted to fit the boss is defined on the outer wall of the transmission shaft 29. The boss extends into the direction-changing groove and is slidably connected to the transmission shaft 29. The transmission shaft 29 is connected to the guide tube 33 via a second bevel gear set 30. The direction-changing groove includes a helically arranged second chute 2902, and a first chute 2901 and a third chute 2903 arranged axially along the transmission shaft 29. The second chute 2902 has two ends connected to the first chute 2901 and the third chute 2903, respectively.

[0074] Specifically, the second bevel gear set 30 includes a number three bevel gear fixedly mounted on one end of the transmission shaft 29 close to the guide tube 33 and a number four bevel gear fixedly mounted on the guide tube 33 , wherein the number four bevel gear meshes with the number three bevel gear.

[0075] When the second slider 15 slides along the second guide rail 12, it will drive the transverse cylinder 28 to slide on the transmission shaft 29 along the axial direction of the transmission shaft 29. Correspondingly, the boss passes through the first slide groove 2901, the second slide groove 2902 and the third slide groove 2903 in sequence. Since the first slide groove 2901 and the third slide groove 2903 are arranged along the axial direction of the transmission shaft 29, when the boss moves along the first slide groove 2901 and the third slide groove 2903, the transmission shaft 29 remains stationary, and when the boss moves in the second slide groove 2902, the same , the driving column 1501 slides in the second groove 2702. At this time, the boss will slide with the transmission shaft 29 through the second slide groove 2902, causing the transmission shaft 29 to rotate. Then, the transmission shaft 29 drives the conduit 33 to rotate through the second bevel gear set 30, and the ball 34 rotates in the ball shell 35. The "L"-shaped passage changes direction from the docking state with the first pipe 36 to the docking state with the second pipe 37, thereby realizing the switching of the spray medium at the spray pipe 32.

[0076] As another embodiment of the present invention, a chip cleaning method is also proposed, which uses the chip cleaning device based on pulse-free pump liquid supply, including the following steps:

[0077] Step 1: Place the wafer to be processed on the horizontal table 3 and limit the wafer by the stabilizing mechanism;

[0078] Step 2: The pump mechanism and the thread matching mechanism work, the pump mechanism sprays the cleaning liquid to the wafer, and the thread matching mechanism drives the horizontal table 3 to rotate through the variable speed drive mechanism, so that the wafer remains in a rotating state;

[0079] Step 3: The medium switching mechanism and the speed-changing drive mechanism are triggered, the medium sprayed by the pump mechanism is switched from cleaning liquid to ultrapure water, and the speed-changing drive mechanism causes the wafer to rotate faster;

[0080] Step 4: The pumping mechanism stops working and the wafer keeps rotating to dry the moisture on its surface.

[0081] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0082] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A chip cleaning device based on a pulse-free pump liquid supply, characterized in that: It includes a control cabinet and a box body installed on the control cabinet; a horizontal table, which is rotatably installed in the box body and is used to place wafers to be cleaned. The horizontal table is provided with multiple stabilizing mechanisms for limiting the position of the wafers. The rotating shaft of the horizontal table is connected to a variable speed drive mechanism installed in the box body. The variable speed drive mechanism drives the horizontal table to rotate at different speeds; a threaded fitting mechanism, which is installed in the box body and connected to the variable speed drive mechanism. The threaded fitting mechanism is also connected to a medium switching mechanism. The box body is provided with a pumping mechanism for spraying cleaning liquid or ultrapure water onto the wafers; The threaded matching mechanism includes a second screw rod rotatably installed in the box body, a second slider provided on the second screw rod and threadedly matched with the second screw rod, and a second driving motor installed in the box body; one end of the second screw rod is connected to the output end of the second driving motor, and the other end is connected to the medium switching mechanism, and a driving column is also fixedly provided on the second slider, and the driving column is connected to the speed-changing driving mechanism; the speed-changing driving mechanism includes a two-way matching component installed in the box body and connected to the horizontal table rotation shaft, a circumferential rotation component connecting the two-way matching component, and a driven structure connected to the driving column. When the medium switching mechanism is triggered, the driving column prompts the driven structure to move; the liquid pumping mechanism includes a pump body installed in the box body, the liquid outlet of the pump body is connected to the spray pipe, the liquid inlet is connected to the liquid inlet pipe, and the liquid inlet pipe is connected to the medium The medium switching mechanism is connected with a first pipe and a second pipe, and the first pipe and the second pipe are used for pumping cleaning liquid and ultrapure water respectively; the medium switching mechanism includes a conduit rotatably installed in the box and a spherical shell fixed in the box, the first pipe and the second pipe are connected with the spherical shell, one end of the conduit is sealed and rotatably connected with the liquid inlet pipe, and the other end is fixed to the sphere arranged inside the spherical shell; the outer wall of the sphere is sealed and slidably fitted with the inner wall of the spherical shell, the conduit is connected with the "L"-shaped passage arranged in the sphere, and the conduit is also connected to the second slider through an angle conversion structure; during cleaning, the threaded matching mechanism prompts the medium switching mechanism to be triggered, so that the medium sprayed by the pumping mechanism is switched from cleaning liquid to ultrapure water, and the speed change drive mechanism prompts the rotation of the horizontal table to increase, realizing the integration of cleaning and flushing functions.

2. A chip cleaning device based on liquid supply without a pulse pump according to claim 1, characterized in that: The bidirectional matching assembly includes a ratchet rotatably mounted in the box and a frame movably arranged in the box via a guide structure, and the rotating shafts of the ratchet and the horizontal platform are connected via a first transmission belt; The ratchet is located in the frame, and two ratchet plates are provided in the frame. The two ratchet plates are arranged opposite to each other, and the ratchets on the two plates face opposite directions.

3. A chip cleaning device based on liquid supply without a pulse pump according to claim 2, characterized in that: The circular rotation assembly includes a vertical shaft rotatably mounted in the box and an assembly plate fixed to one end of the vertical shaft. The other end of the vertical shaft is connected to the second screw rod through a transmission member. A placement groove is provided on the assembly plate. A driven block is slidably engaged in the placement groove. A follower column is fixed to the driven block. A transmission rod is fixedly installed on the frame. The transmission rod is provided with a strip groove adapted to the follower column. The follower column extends into the strip groove and is slidably connected with the transmission rod.

4. A chip cleaning device based on liquid supply without a pulse pump according to claim 3, characterized in that: A guide plate is fixed in the box body, and the driven structure includes a transmission plate slidably connected to the guide plate and a sleeve slidably sleeved on the vertical shaft and rotatably connected to the transmission plate. The sleeve is connected to the driven block through a connecting rod, and the two ends of the connecting rod are hinged to the sleeve and the driven block respectively; A driven plate is also fixed to the end of the transmission plate away from the guide plate. The driven plate is provided with a folding groove adapted to the driving column. The driving column extends into the folding groove and is slidingly connected to the driven plate. The folding groove includes a second trough body arranged obliquely and a first trough body and a third trough body arranged along the length direction of the driven plate. The two ends of the second trough body are respectively connected to the first trough body and the third trough body.

5. The chip cleaning device based on pulse-free pump liquid supply according to claim 4, characterized in that: The angle conversion structure includes a transmission shaft rotatably mounted in the housing and a transverse cylinder slidably sleeved on the transmission shaft and fixedly connected to the second slider. A protrusion is fixedly provided on the inner wall of the transverse cylinder. A direction-changing groove adapted to the protrusion is provided on the outer wall of the transmission shaft. The protrusion extends into the direction-changing groove and is slidably connected to the transmission shaft. The transmission shaft is connected to the conduit through the second bevel gear set. The changing groove includes a spirally arranged second groove and a first groove and a third groove arranged along the axial direction of the transmission shaft. The two ends of the second groove are respectively connected to the first groove and the third groove.

6. A chip cleaning method, using the chip cleaning device based on pulse-free pump liquid supply as claimed in claim 5, characterized in that: The following steps are involved: Step 1: Place the wafer to be processed on the horizontal table, and use a stabilizing mechanism to limit the position of the wafer; Step 2: The pump mechanism and the threaded matching mechanism work together to spray the cleaning liquid onto the wafer. The threaded matching mechanism drives the horizontal table to rotate through the variable speed drive mechanism, so that the wafer remains in a rotating state. Step 3: The medium switching mechanism and the speed-changing drive mechanism are triggered, the medium sprayed by the pump mechanism is switched from cleaning liquid to ultrapure water, and the speed-changing drive mechanism causes the wafer to rotate faster; Step 4: The pumping mechanism stops working and the wafer keeps rotating to dry the moisture on its surface.

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