A high-density digital jumper for IDC and its core wire processing device

By combining twisted wires and shielding structure with nitrogen-filled honeycomb insulation of plastic sheath, the problems of high-frequency transmission medium loss and large size in jumper structures are solved, achieving efficient signal transmission and miniaturized design.

CN119008107BActive Publication Date: 2025-10-28GUANGDONG SIMPACT CABLE IND
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Patent Information

Application Number
CN202411277888.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-09-12
Publication Date
2025-10-28
Estimated Expiration
2044-09-12

AI Technical Summary

Technical Problem

Existing jumper structures result in high losses and large size of high-frequency transmission media, affecting the bit throughput efficiency of IDC.

Method used

It adopts a twisted wire and shielding structure, combined with nitrogen-filled honeycomb insulation treatment of plastic sheath, and is covered with a flexible solid plastic layer and metal wire braided mesh tube. The winding of wire and shielding tape is achieved by a special core wire processing device.

Benefits of technology

It reduces the dielectric loss of high-frequency transmission, reduces signal attenuation and delay, increases the bit rate per unit cross-section of the jumper, and improves the bit throughput efficiency of the IDC.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention discloses a high-density digital patch cord for IDC (Internet Data Center) and its core wire processing apparatus. The high-density digital patch cord for IDC includes several core wires and a sheathing layer covering the surfaces of the core wires. Each core wire includes two twisted conductors and a shielding layer covering the surfaces of the two conductors. Each conductor includes several twisted conductors and a plastic sheath covering the surfaces of the conductors. The plastic sheath is treated with nitrogen-filled honeycomb insulation. By adopting the above configuration, the patch cord can achieve low high-frequency transmission loss and minimize size during use.
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Description

Technical Field

[0001] This invention relates to the technical field of digital jumper structures and their processing apparatus, specifically to a high-density digital jumper for IDC and its core wire processing apparatus. Background Technology

[0002] Data centers are hubs with extremely high densities of data transmission, switching, and storage. Their bit density represents the space utilization efficiency of a data center, and the related energy efficiency per unit bit. The bit rate per unit cross-section of patch cords is a key factor affecting the bit throughput efficiency of an IDC. Taking a 40Gbps patch cord as an example, a product with a diameter of 5.0mm has 2.56 times the space efficiency of a product with a diameter of 8.0mm.

[0003] The structure of existing patch cords typically consists of logarithmic conductors wrapped in an insulating layer to form the core wire, and then several core wires wrapped in corresponding protective layers to form the patch cord. The conductors are bundled together and then wrapped in a plastic sheath. However, the plastic sheath inevitably leads to dielectric loss in high-frequency transmission. Furthermore, the patch cord's multi-layer structure results in a large size (i.e., large cross-sectional area), which in turn reduces the bit rate per unit cross-section and decreases the bit throughput efficiency of the data center. Therefore, product design strives to achieve low high-frequency transmission loss and minimal size. Summary of the Invention

[0004] In order to overcome the shortcomings of the prior art, the purpose of this invention is to provide a high-density digital patch cord for IDC and its core wire processing device, which enables the patch cord to have low high-frequency transmission loss and small size when in use.

[0005] The objective of this invention is achieved through the following technical solution:

[0006] A high-density digital patch cord for IDC includes a plurality of core wires and a sheathing layer wrapped around the surface of the plurality of core wires. Each core wire includes two twisted wires and a shielding layer wrapped around the surface of the two wires. Each wire includes a plurality of twisted conductors and a plastic sheath wrapped around the surface of the conductors. The plastic sheath is treated with nitrogen-filled honeycomb insulation.

[0007] Furthermore, the shielding layer is made of shielding tape, which is wrapped around the surface of a pair of twisted wires.

[0008] Furthermore, a solid plastic layer is provided between the plastic sheath and the several stranded conductors. The solid plastic layer is made of flexible plastic and is attached to the surface of the stranded conductors and the inner wall of the plastic sheath. The thickness of the solid plastic layer is 1 / 8 to 1 / 10 of the thickness of the plastic sheath.

[0009] Furthermore, a conductive foil is disposed between the covering layer and the plurality of core wires.

[0010] Furthermore, the covering layer is made of a metal wire braided mesh.

[0011] A core wire processing device for high-density digital jumpers for IDC (Internet Data Center) includes a support, a rotating component, a turntable, a receiving and pulling component, a pushing component, and a feeding wheel. The rotating component is mounted on the support and has a through hole. The turntable is connected to the rotating end of the rotating component. Two through holes are provided on opposite sides of the rotating component, with both through holes facing the through hole. The two through holes allow wires to pass through. When the rotating component drives the turntable to rotate, the two wires are twisted together. The receiving and pulling component is mounted on one side of the support and receives and pulls the twisted wires. The pushing component is mounted on the support, with its pushing end facing the twisted wires. The feeding wheel is rotatably mounted on the pushing end of the pushing component. The outer circumference of the feeding wheel is wrapped with the shielding tape, and the shielding tape on the outer circumference of the feeding wheel abuts against the twisted wires.

[0012] Furthermore, the rotating component includes an annular platform and a rotation drive component. The annular platform is disposed on the bracket, and the axis of the annular platform is parallel to the horizontal plane. The through hole is an annular through hole of the annular platform. The turntable is rotatably mounted on the side of the annular platform and is coaxially disposed with the annular platform. The rotation drive component is disposed on the bracket and drives the turntable to rotate.

[0013] Furthermore, the rotation drive includes a motor assembly and a drive gear. The motor assembly is mounted on the bracket, and the drive gear is connected to the drive end of the motor assembly. The outer circumferential surface of the turntable is provided with a toothed surface, which meshes with the drive gear.

[0014] Furthermore, it also includes a guide coiling ring disposed on the bracket, the guide coiling ring being positioned between the turntable and the feeding wheel, the guide coiling ring allowing the two wires to pass through, the guide coiling ring being truncated cone-shaped, and the cross-sectional size of the guide coiling ring gradually decreasing towards the feeding wheel.

[0015] Furthermore, the support is provided with an upright plate, which is opposite to the pusher. The pusher includes an elastic element and a slider. The slider is slidably connected to the support and slides toward the upright plate. The feeding wheel is rotatably connected to the slider. One end of the elastic element is connected to the slider, and the other end of the elastic element is connected to the upright plate. The feeding wheel uses the elastic element to press the twisted wire against the side of the upright plate.

[0016] The present invention has the following beneficial effects:

[0017] 1. The high-density digital patch cord for IDC of the present invention, wherein the logarithmic conductors in the core wire are twisted and wound together and then wrapped in a shielding layer, thus greatly reducing the cross-sectional area (volume) of the conductors. Simultaneously, several conductors in the conductor are also twisted into bundles, which further reduces the cross-sectional area of ​​the conductors. Therefore, the cross-sectional area of ​​the patch cord produced is also reduced, thereby increasing the bit rate per unit cross-section. In addition, the plastic sheath of the conductors in the core wire undergoes nitrogen-filled honeycomb insulation treatment, creating numerous nitrogen gas pockets within the plastic sheath to reduce the plastic content. This reduces dielectric loss in high-frequency transmission, effectively reducing signal attenuation and latency.

[0018] 2. The core wire processing apparatus of the present invention, by setting up a rotating component and a receiving and traction component, drives a turntable to rotate under the action of the driving component of the rotating component, so that a pair of wires passing through the wire hole are continuously twisted together. Simultaneously, the ends of the pair of twisted wires are placed on the receiving and traction component to continuously receive and pull the wires forward. During this process, the shielding tape on the surface of the feeding wheel abuts against the twisted wires, so that the feeding wheel, under the traction of the wires, continuously wraps the shielding tape on the feeding wheel around the surface of the twisted wires, thereby enabling the receiving and traction component to finally obtain the core wire product. Moreover, the core wire product adopts twisting and winding technology, which can reduce the gap between the wires and between the wires and the shielding tape, thereby reducing the cross-sectional volume of the core wire. Therefore, when the core wire is used to process jumpers, the cross-sectional volume of the jumpers can also be reduced. Therefore, the core wire processed by the core wire processing apparatus of the present invention, when applied to jumpers, can reduce the dielectric loss of high-frequency transmission, while reducing signal attenuation and latency, and significantly improving the IDC bit throughput efficiency. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the jumper structure of the present invention.

[0020] Figure 2 This is a schematic diagram of the core wire structure of the present invention.

[0021] Figure 3 This is a schematic diagram of the conductor structure of the present invention.

[0022] Figure 4 This is a schematic diagram of the processing apparatus of the present invention.

[0023] Figure 5 This is an exploded view of the processing apparatus of the present invention.

[0024] In the diagram: 1. Core wire; 2. Conductive foil; 3. Covering layer; 4. Wire; 41. Conductor; 42. Plastic sheath; 43. Solid plastic layer; 5. Shielding layer; 6. Support; 61. Ring platform; 611. Through hole; 62. Turntable; 621. Wire hole; 622. Toothed surface; 63. Guide and gathering ring; 7. Motor assembly; 71. Drive gear; 8. Vertical plate; 81. Positioning groove; 9. Slider; 91. Feeding wheel; 92. Elastic element. Detailed Implementation

[0025] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. Terms such as “upper,” “inner,” “middle,” “left,” “right,” and “one” used in this specification are merely for clarity of description and are not intended to limit the scope of the invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention.

[0026] Example 1

[0027] The high-density digital jumper cable for IDC in this invention reduces the dielectric loss of high-frequency transmission and minimizes the size to reduce signal attenuation and delay. Therefore, the bit rate per unit cross-section of the jumper cable is increased, which significantly improves the bit throughput efficiency of the IDC.

[0028] The following is a detailed introduction to the structure of high-density digital jumpers used in IDC:

[0029] One type of IDC uses high-density digital patch cords, such as Figures 1 to 3 As shown, it includes several core wires 1 and a covering layer 3 wrapped around the entire surface of the several core wires 1. The core wire 1 includes two twisted wires 4 and a shielding layer 5 wrapped around the entire surface of the two wires 4. The wires 4 include several twisted conductors 41 and a plastic sheath 42 wrapped around the entire surface of the several conductors 41. The plastic sheath 42 is treated with nitrogen-filled honeycomb insulation using nitrogen-filled insulation technology to generate a large number of nitrogen gas pockets inside the plastic sheath 42.

[0030] It can be seen that the logarithmic conductors 4 in core wire 1 are twisted and wrapped inside the shielding layer 5, which greatly reduces the cross-sectional area (volume) of conductors 4. At the same time, several conductors 41 in conductors 4 are also twisted into bundles, which can also better reduce the cross-sectional area of ​​conductors 4. Therefore, the cross-sectional area of ​​the resulting jumper is also reduced, thereby increasing the bit rate per unit cross-section of the jumper. In addition, the plastic sheath 42 of conductors 4 in core wire 1 undergoes nitrogen-filled honeycomb insulation treatment, which generates a large number of nitrogen gas pockets inside the plastic sheath 42 to reduce the plastic content of the plastic sheath 42. Therefore, it can reduce the dielectric loss of high-frequency transmission, thereby reducing signal attenuation and latency.

[0031] In the conductor 4, a solid plastic layer 43 is provided between the plastic sheath 42 and the stranded conductors 41. The solid plastic layer 43 is made of flexible plastic (such as polyvinyl alcohol, polyester, polyimide, polyurethane, flexible ABS plastic, etc.) and is attached to the surface of the stranded conductors 41 and the inner wall of the plastic sheath 42. The thickness of the solid plastic layer 43 is 1 / 8 to 1 / 10 of the thickness of the plastic sheath 42. Therefore, by providing the solid plastic layer 43, the stranded conductors 41 and the plastic sheath 42 can form a relatively compact structure, and the thinness of the solid plastic layer 43 can reduce the impact of dielectric loss in high-frequency transmission.

[0032] In core wire 1, the shielding layer 5 is made of shielding tape, which is wrapped around the surface of a pair of twisted conductors 4. Thus, by wrapping the shielding tape around the surface of the twisted conductors 4, the gaps between the conductors 4 and between the conductors 4 and the shielding layer 5 are reduced during the wrapping process, thereby helping to reduce the cross-sectional area of ​​the jumper. At the same time, the shielding layer 5 formed by the wrapped shielding tape can effectively resist inter-group crosstalk caused by high-frequency transmission and reduce the bit error rate.

[0033] In the patch cord, after several core wires 1 are twisted together, a conductive foil film 2 is wrapped around the entire surface of the twisted core wires 1. Then, a covering layer 3 is made of metal wire braided mesh sleeved on the surface of the conductive foil film 2 to form a comprehensive sleeve shielding cavity. This allows the core wires 1 to be concentrated in the shielding cavity, which can effectively prevent external crosstalk and improve the electromagnetic compatibility of the product when the IDC is densely wired.

[0034] Based on the description of the high-density digital jumper structure for IDC in Example 1, it can be understood that the core wire 1 is the main unit constituting the jumper. The following describes the apparatus for processing the core wire 1.

[0035] Example 2

[0036] A core wire processing device for high-density digital jumpers used in IDC, such as Figure 2 , Figure 4 , Figure 5As shown, the device includes a bracket 6, a rotating component, a turntable 62, a receiving and traction component (not shown), a pushing component, and a feeding wheel 91. The bracket 6 is a support panel fixedly mounted on a horizontal plane. The rotating component is mounted on the bracket 6 and has a through hole 611. The turntable 62 is connected to the rotating end of the rotating component, and wire-passing holes 621 are provided on opposite sides. Both wire-passing holes 621 are directly opposite the through hole 611, allowing the wires 4, as in Embodiment 1, to pass through. When the rotating component drives the turntable 62 to rotate, the two wires 4 are twisted together. The receiving and traction component is located on one side of the bracket 6, receiving and tractioning the twisted wires 4. The pushing component is mounted on the bracket 6, with its pushing end facing the twisted wires 4. The feeding wheel 91 is rotatably mounted on the pushing end of the pushing component. The outer circumference of the feeding wheel 91 is wrapped with a shielding strip, as in Embodiment 1, and the shielding strip on the outer circumference of the feeding wheel 91 abuts against the twisted wires 4.

[0037] Therefore, by setting up a rotating component and a receiving and traction component, the rotating component drives the turntable 62 to rotate, so that a pair of wires 4 passing through the wire hole 621 are continuously twisted and wound together. Simultaneously, the ends of the pair of twisted wires 4 are placed on the receiving and traction component to continuously receive and pull the wires 4 forward. During this process, the shielding strip on the surface of the feeding wheel 91 abuts against the twisted wires 4, so that the feeding wheel 91, under the traction of the wires 4, continuously winds the shielding strip on the surface of the twisted wires 4, thereby enabling the receiving and traction component to finally obtain the core wire 1 product. Moreover, the core wire 1 product adopts twisting and winding technology, which can reduce the gap between the wires 4 and between the wires 4 and the shielding strip, thereby reducing the cross-sectional volume of the core wire 1. Therefore, when the core wire 1 is processed into a jumper wire, the cross-sectional volume of the jumper wire can also be reduced. Therefore, the core wire 1 processed by the core wire 1 processing device of the present invention, when applied to jumper wires, can reduce the dielectric loss of high-frequency transmission, while reducing signal attenuation and delay, and significantly improving the IDC bit throughput efficiency.

[0038] In this embodiment, the rotating component includes an annular platform 61 and a rotation drive component. The annular platform 61 is mounted on the support 6, and its axis is parallel to the horizontal plane. A through hole 611 is an annular through hole in the annular platform 61. A turntable 62 is rotatably mounted on the side of the annular platform 61, coaxially arranged with the annular platform 61. The outer circumferential surface of the turntable 62 is provided with a toothed surface 622. The rotation drive component includes a motor assembly 7 and a drive gear 71. The motor assembly 7 is mounted on the support 6, and the drive gear 71 is connected to the drive end of the motor assembly 7. The toothed surface 622 of the turntable 62 meshes with the drive gear 71. Therefore, under the driving action of the motor assembly 7, the drive gear 71 drives the turntable 62 to rotate, thereby rotating the two wire-passing holes 621 of the turntable 62 to achieve the twisting process of the two wires 4. Simultaneously, the operating rate of the motor assembly 7 needs to be matched with the operating power of the traction component to reduce the possibility of the two wires 4 becoming too tightly twisted or too loosely twisted.

[0039] In this embodiment, the core wire 1 processing device also includes a guide coiling ring 63 disposed on the support 6. The guide coiling ring 63 is disposed between the turntable 62 and the feeding wheel 91, and is located on the side closer to the turntable 62. The guide coiling ring 63 allows two wires 4 to pass through. The guide coiling ring 63 is truncated cone-shaped, and its cross-sectional area gradually decreases towards the feeding wheel 91. Thus, by providing the guide coiling ring 63 between the turntable 62 and the feeding wheel 91, and due to the shape limitation of the guide coiling ring 63, the two wires 4 passing through the turntable 62 can be brought closer to each other and continuously twisted together. This reduces the possibility of partial untwisted or overly tight twisting of the two wires 4 during twisting. At the same time, when the two wires 4 are coiled closer together, the truncated cone-shaped guide coiling ring 63 can reduce the damage to the surface of the wires 4.

[0040] In this embodiment, a vertical plate 8 is provided on the support 6. The vertical plate 8 can be installed on the support 6 by screw fastening, welding, or integral molding. The vertical plate 8 is opposite to the pushing end of the pushing component. The pushing component includes an elastic element 92 and a slider 9. The elastic element 92 can be a spring or a tension spring. The slider 9 is slidably connected to the top surface of the support 6 and slides towards the vertical plate 8. The feeding wheel 91 is rotatably mounted on the slider 9. One end of the elastic element 92 is connected to the slider 9, and the other end of the elastic element 92 is connected to the vertical plate 8. The feeding wheel 91 uses the elastic element 92 to press the twisted wire 4 against the side of the vertical plate 8. The side of the vertical plate 8 facing the pushing component has a positioning groove 81 with an arc-shaped cross-section. The feeding wheel 91 uses the elastic element 92 to press the twisted wire 4 against the positioning groove 81 of the vertical plate 8. The depth of the positioning groove 81 is less than the outer diameter of the twisted wire 4. Therefore, under the traction of the receiving traction component, the shielding tape on the feeding wheel 91 can be wound around the surface of the twisted wire 4, while the positioning groove 81 can restrict the twisted wire 4 to improve the stability of the shielding tape winding process.

[0041] The embodiments of the present invention are not limited thereto. Based on the above description of the present invention, and using common technical knowledge and conventional means in the field, the present invention can be modified, replaced or combined in various other forms without departing from the basic technical idea of ​​the present invention, and all such modifications, replacements or combinations fall within the scope of protection of the present invention.

Claims

1. A core wire processing device for high-density digital jumpers for IDC (Internet Data Center), characterized in that, include: support; A rotating component, which is mounted on the bracket, has a through hole; A turntable is connected to the rotating end of the rotating component. Wire holes are provided on opposite sides of the turntable, with both wire holes facing the through hole. Wires pass through the two wire holes, and when the rotating component drives the turntable to rotate, the two wires are twisted together. A traction receiver is provided on one side of the bracket, which receives and pulls the twisted wires. A pusher, which is mounted on the bracket, with its pusher end facing the twisted wires; A feeding wheel is rotatably mounted on the pushing end of the pushing member. A shielding strip is wound around the outer circumferential surface of the feeding wheel, and the shielding strip on the outer circumferential surface of the feeding wheel abuts against the twisted wires. The rotating component includes a ring-shaped platform and a rotation driving component. The ring-shaped platform is mounted on the bracket, and the axis of the ring-shaped platform is parallel to the horizontal plane. The through hole is an annular through hole of the ring-shaped platform. The turntable is rotatably mounted on the side of the ring-shaped platform and is coaxially arranged with the ring-shaped platform. The rotation driving component is mounted on the bracket and drives the turntable to rotate. The rotation drive includes a motor assembly and a drive gear. The motor assembly is mounted on the bracket, and the drive gear is connected to the drive end of the motor assembly. The outer circumferential surface of the turntable is provided with a toothed surface, which meshes with the drive gear.

2. The core wire processing apparatus for high-density digital jumpers for IDC as described in claim 1, characterized in that, It also includes a guide coiling ring disposed on the bracket, the guide coiling ring being disposed between the turntable and the feeding wheel, the guide coiling ring allowing the two wires to pass through, the guide coiling ring being truncated cone-shaped, and the cross-sectional size of the guide coiling ring gradually decreasing towards the feeding wheel.

3. The core wire processing apparatus for high-density digital jumpers for IDC as described in claim 1, characterized in that, The support is provided with an upright plate, which is opposite to the pusher. The pusher includes an elastic element and a slider. The slider is slidably connected to the support and slides toward the upright plate. The feeding wheel is rotatably connected to the slider. One end of the elastic element is connected to the slider, and the other end of the elastic element is connected to the upright plate. The feeding wheel uses the elastic element to press the twisted wire against the side of the upright plate.

Citation Information

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