Display panel and its manufacturing method, display device

Abstract

This disclosure relates to the field of display technology, and in particular to a display panel, a method for manufacturing the same, and a display device. The display panel includes: a substrate; a metal wiring layer located on one side of the substrate, the metal wiring layer forming a plurality of wiring openings, the metal wiring layer including a first top surface facing away from the substrate; a plurality of light-emitting structures spaced apart on one side of the substrate, the light-emitting structures at least partially located within corresponding wiring openings; and a first encapsulation layer disposed on the side of the plurality of light-emitting structures facing away from the substrate, the first encapsulation layer including a second top surface facing away from the substrate, the orthographic projection of the second top surface on the substrate being outside the orthographic projection of the first top surface on the substrate. By setting the orthographic projection of the second top surface on the substrate to be outside the orthographic projection of the first top surface on the substrate, when the second encapsulation layer is formed on the side of the metal wiring layer and the first encapsulation layer facing away from the substrate, it is beneficial for the second encapsulation layer to level out, thereby allowing the second encapsulation layer to completely encapsulate the metal wiring layer and the first encapsulation layer.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display panel, a method for manufacturing the same, and a display device. Background Technology

[0002] Display panels often consist of multiple layers of films and structures, resulting in an uneven surface. Consequently, during the encapsulation process, the encapsulation layers are difficult to level on the display panel surface, thus affecting the encapsulation effect. Summary of the Invention

[0003] Therefore, it is necessary to provide a display panel, its manufacturing method, and a display device that address the problem of the encapsulation layer being difficult to level on the surface of the display panel in the prior art.

[0004] To achieve the above objectives, a display panel is provided, comprising:

[0005] substrate;

[0006] A metal trace layer is located on one side of the substrate. The metal trace layer encloses and forms a plurality of trace openings. The metal trace layer includes a first top surface facing away from the substrate.

[0007] Multiple light-emitting structures are spaced apart on one side of the substrate, and at least part of the light-emitting structures are located within the corresponding trace openings;

[0008] A first encapsulation layer is disposed on the side of the plurality of light-emitting structures facing away from the substrate. The first encapsulation layer includes a second top surface facing away from the substrate, and the orthographic projection of the second top surface on the substrate is outside the orthographic projection of the first top surface on the substrate.

[0009] In one embodiment, the display panel further includes:

[0010] A pixel definition layer is located on one side of the substrate, and the metal trace layer is located on the side of the pixel definition layer opposite to the substrate. The first encapsulation layer at least partially covers the pixel definition layer.

[0011] Wherein, the first top surface has a first distance from the substrate, the second top surface located on the pixel definition layer has a second distance from the substrate, and the difference between the first distance and the second distance is not greater than a first preset value;

[0012] Optionally, the first preset value is not greater than 20% of the thickness of the first encapsulation layer;

[0013] Optionally, in the thickness direction of the display panel, the thickness of the first encapsulation layer is 1.6 μm, and the first preset value is not greater than 0.32 μm;

[0014] Optionally, the first encapsulation layer is in contact with the metal trace layer;

[0015] Optionally, the first encapsulation layer includes a plurality of encapsulation units, the encapsulation units covering the side of the corresponding light-emitting structure facing away from the substrate;

[0016] Optionally, the first top surface is flush with the second top surface located on the pixel definition layer.

[0017] In one embodiment, the metal trace layer includes a first trace layer and a second trace layer stacked sequentially in a direction away from the substrate, wherein the orthographic projection of the second trace layer on the substrate is located within the orthographic projection of the first trace layer on the substrate.

[0018] Optionally, the light-emitting structure includes a light-emitting functional layer and a first electrode, wherein the first electrode is disposed on the side of the light-emitting functional layer opposite to the substrate, and the first electrode is in contact with the first wiring layer;

[0019] Optionally, the first wiring layer includes a side surface facing the wiring opening and a third top surface facing away from the substrate, and the first electrode extends from the side surface to the third top surface;

[0020] Optionally, the third top surface is the surface of the first wiring layer that faces away from the substrate and exposes the second wiring layer;

[0021] Optionally, the material of the first trace layer is different from the material of the second trace layer;

[0022] Optionally, the material of the first trace layer includes molybdenum, and the material of the second trace layer includes aluminum;

[0023] Optionally, the first wiring layer includes a first sub-part extending in a first direction, a second sub-part extending in a second direction, and a third sub-part contacting the first sub-part and the second sub-part, wherein the first direction and the second direction intersect, and the width of the first sub-part and / or the second sub-part is not less than a second preset value, and / or the width of the first sub-part and / or the second sub-part is not greater than a third preset value.

[0024] Optionally, the second preset value is 11.34 μm, and / or the third preset value is 13.6 μm;

[0025] Optionally, the width of the first sub-part and / or the second sub-part is 12.6 μm;

[0026] Optionally, the second wiring layer includes a fourth sub-part extending in a first direction, a fifth sub-part extending in a second direction, and a sixth sub-part contacting the fourth sub-part and the fifth sub-part, wherein the first direction and the second direction intersect, and the width of the fourth sub-part and / or the fifth sub-part is not less than a fourth preset value, and / or the width of the fourth sub-part and / or the fifth sub-part is not greater than a fifth preset value.

[0027] Optionally, the fourth preset value is 4.5 μm, and / or the fifth preset value is 5.5 μm;

[0028] Optionally, the width of the fourth sub-part and / or the fifth sub-part may include 5 μm.

[0029] In one embodiment, the first routing layer and the second routing layer extend in a first direction and a second direction, the first direction and the second direction intersecting, wherein:

[0030] The length of the first electrode extending along the first direction and / or along the second direction on the third top surface is not less than a sixth preset value, and / or the length of the first electrode extending along the first direction and / or along the second direction on the third top surface is not greater than a seventh preset value;

[0031] Optionally, the sixth preset value is 1.62 μm, and / or the seventh preset value is 1.98 μm;

[0032] Optionally, the first electrode extends 1.8 μm along a first direction on the third top surface, and / or the first electrode extends 1.8 μm along a second direction on the third top surface.

[0033] In one embodiment, a first gap is provided between the first electrode and the second wiring layer, and the first encapsulation layer is also located within the first gap;

[0034] Optionally, the first routing layer and the second routing layer extend in a first direction and a second direction, the first direction and the second direction intersect, the distance of the first interval in the first direction and / or the second direction is not less than an eighth preset value, and / or the distance of the first interval in the first direction and / or the second direction is not greater than a ninth preset value.

[0035] Optionally, the eighth preset value is 1.8 μm, and / or the ninth preset value is 2.2 μm;

[0036] Optionally, the distance of the first interval in the first direction is 2 μm, and / or the distance of the first interval in the second direction is 2 μm.

[0037] In one embodiment, the metal trace layer extends in a first direction and a second direction, the first direction and the second direction intersecting, wherein:

[0038] There is a second gap between the light-emitting structure and the metal trace layer, and the distance of the second gap in the first direction and / or the second direction is not less than a tenth preset value, and / or the distance of the second gap in the first direction and / or the second direction is not greater than an eleventh preset value.

[0039] Optionally, the tenth preset value is 0.45 μm, and / or the eleventh preset value is 0.55 μm;

[0040] Optionally, the distance of the second interval in the first direction is 0.5 μm, and / or the distance of the second interval in the second direction is 0.5 μm.

[0041] In one embodiment, the display panel further includes:

[0042] The second encapsulation layer covers at least the side of the isolation layer facing away from the substrate and the side of the first encapsulation layer facing away from the substrate.

[0043] On the one hand, a method for manufacturing a display panel is provided, comprising:

[0044] Provide substrate;

[0045] A metal trace material layer and an isolation material layer are sequentially prepared on one side of the substrate;

[0046] The isolation material layer and the metal trace material layer are patterned sequentially to obtain the isolation part and the support part, wherein the orthographic projection of the isolation part on the substrate covers the orthographic projection of the support part on the substrate, and the isolation part encloses a plurality of isolation openings;

[0047] Multiple light-emitting structures are formed within the corresponding isolation openings;

[0048] A first packaging structure is formed on the side of the plurality of light-emitting structures that is away from the substrate;

[0049] By removing the isolation portion and a portion of the first encapsulation structure, a first encapsulation layer is obtained, the first encapsulation layer including a second top surface facing away from the substrate;

[0050] Wherein, at least a portion of the support portion serves as a metal trace layer, the metal trace layer including a first top surface facing away from the substrate, and the orthographic projection of the second top surface on the substrate is located outside the orthographic projection of the first top surface on the substrate.

[0051] In one embodiment, the support portion serves as the metal trace layer, and the surface of the support portion facing away from the substrate is the first top surface.

[0052] In one embodiment, the step of removing the isolation portion and a portion of the first encapsulation structure to obtain the first encapsulation layer includes:

[0053] By removing the isolation portion, a portion of the first packaging structure, and a portion of the support portion, a first packaging layer and the remaining support portion are obtained, with the remaining support portion serving as the metal trace layer.

[0054] On one hand, a display device is provided, the display device including a display panel as described in any of the foregoing embodiments.

[0055] The display panel, its fabrication method, and the display device described in this specification have the following advantages: By setting the orthographic projection of the second top surface onto the substrate to be outside the orthographic projection of the first top surface onto the substrate, the metal trace layer and the first encapsulation layer do not overlap in the thickness direction of the display panel. When the second encapsulation layer is formed on the side of the metal trace layer and the first encapsulation layer away from the substrate, this facilitates the leveling of the second encapsulation layer, thereby allowing the second encapsulation layer to completely encapsulate the metal trace layer and the first encapsulation layer. Attached Figure Description

[0056] To more clearly illustrate the technical solutions in the embodiments or conventional technologies of this disclosure, the accompanying drawings used in the description of the embodiments or conventional technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0057] Figure 1 This is a schematic diagram of a display panel provided in one embodiment;

[0058] Figure 2 This is a schematic diagram of a display panel provided in another embodiment;

[0059] Figure 3 This is a flowchart illustrating the fabrication process of a display panel provided in one embodiment;

[0060] Figure 4 This is a schematic diagram of a substrate provided in one embodiment;

[0061] Figure 5 This is a schematic diagram of the metal trace material layer and the isolation part material layer provided in one embodiment;

[0062] Figure 6 This is a schematic diagram of the isolation section and support section provided in one embodiment;

[0063] Figure 7 This is a schematic diagram of a pixel definition layer provided in one embodiment;

[0064] Figure 8 This is a schematic diagram of the first packaging structure provided in one embodiment;

[0065] Figure 9 This is a schematic diagram of a mask layer provided in one embodiment;

[0066] Figure 10 This is a schematic diagram of the removal of the isolation section provided in one embodiment;

[0067] Figure 11 This is a schematic diagram of the second encapsulation layer provided in one embodiment;

[0068] Figure 12 This is an enlarged schematic diagram of the isolation section and the support section provided in one embodiment;

[0069] Figure 13 This is an enlarged schematic diagram of the support portion provided in one embodiment.

[0070] Explanation of reference numerals in the attached drawings: Display panel - 100; Substrate - 110; Metal trace layer - 120; Metal trace material layer - 121; Support portion - 1210; Isolation material layer - 122; Isolation portion - 1220; First trace layer - 1221; Second trace layer - 1222; Light-emitting structure - 130; First encapsulation layer - 140; First encapsulation structure - 141; Second encapsulation layer - 150; First electrode - 160; Second electrode - 161; Pixel definition layer - 170; Pixel definition material layer - 1700; Mask layer - 190.

[0071] To better describe and illustrate embodiments and / or examples of the inventions disclosed herein, reference may be made to one or more accompanying drawings. Additional details or examples used to describe the drawings should not be considered as limiting the scope of any of the disclosed inventions, the currently described embodiments and / or examples, or the best mode of these inventions as currently understood. Detailed Implementation

[0072] To facilitate understanding of this disclosure, a more complete description will now be given with reference to the accompanying drawings, in which preferred embodiments of the present disclosure are shown. However, this disclosure may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

[0073] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure.

[0074] Please see Figure 1 and Figure 2 In one embodiment, a display panel 100 is also provided. The display panel 100 includes a substrate 110, a metal wiring layer 120, a light-emitting structure 130, and a first encapsulation layer 140.

[0075] As an example, substrate 110 may include encapsulation substrate 110, etc. The material of substrate 110 may include silicon, germanium silicon, etc.

[0076] The metal wiring layer 120 may be located on one side of the substrate 110. The metal wiring layer 120 may enclose and form a plurality of wiring openings. The wiring openings may expose at least a portion of the light-emitting structure 130. The material of the metal wiring layer 120 may include a conductive material. For example, the material of the metal wiring layer 120 may include titanium, aluminum, or molybdenum. The metal wiring layer 120 may include a first top surface facing away from the substrate 110.

[0077] Multiple light-emitting structures 130 are spaced apart on one side of the substrate 110. In one possible example, the light-emitting structures 130 can emit light of multiple colors. For example, the light-emitting structures 130 may include red, green, and blue light-emitting structures, etc. In another possible example, the light-emitting structures 130 can emit monochromatic light. For example, the light-emitting structures 130 may include white light-emitting structures, etc.

[0078] The light-emitting structure 130 may be at least partially located within the corresponding trace opening. As an example, each trace opening corresponds to one light-emitting structure 130. The light-emitting structure 130 may be located at the bottom of the trace opening, and the light-emitting structure 130 may be located on the sidewall of the trace opening.

[0079] The first encapsulation layer 140 may be disposed on the side of the light-emitting structure 130 facing away from the substrate 110. The material of the first encapsulation layer 140 may include inorganic materials, etc. The first encapsulation layer 140 includes a second top surface facing away from the substrate 110. As an example, in the thickness direction of the display panel 100, the second top surface may be the surface facing away from the substrate 110 at the highest point of the first encapsulation layer 140.

[0080] The orthographic projection of the second top surface on the substrate 110 lies outside the orthographic projection of the first top surface on the substrate 110. In one possible example, the orthographic projection of the second top surface on the substrate 110 may be connected to the orthographic projection of the first top surface on the substrate 110. In another possible example, the orthographic projection of the second top surface on the substrate 110 may be spaced apart from the orthographic projection of the first top surface on the substrate 110. Accordingly, in one possible example, the side surface of the metal trace layer 120 may contact the side surface of the first encapsulation layer 140, while the first top surface of the metal trace layer 120 and the second top surface of the first encapsulation layer 140 do not overlap. In another possible example, the metal trace layer 120 may be spaced apart from the first encapsulation layer 140.

[0081] In this embodiment, by setting the orthographic projection of the second top surface on the substrate 110 to be outside the orthographic projection of the first top surface on the substrate 110, the metal trace layer 120 and the first encapsulation layer 140 do not overlap in the thickness direction of the display panel 100. When the second encapsulation layer 150 is formed on the side of the metal trace layer 120 and the first encapsulation layer 140 away from the substrate 110, this embodiment facilitates the leveling of the second encapsulation layer 150, thereby enabling the second encapsulation layer 150 to completely encapsulate the metal trace layer 120 and the first encapsulation layer 140.

[0082] In one embodiment, the display panel 100 further includes a pixel definition layer 170.

[0083] The pixel definition layer 170 is located on one side of the substrate 110, and the metal wiring layer 120 is located on the side of the pixel definition layer 170 opposite to the substrate 110. The pixel definition layer 170 has a pixel opening, and the light-emitting structure 130 is at least partially located within the pixel opening. It is understood that the pixel opening may communicate with the wiring opening.

[0084] The first encapsulation layer 140 at least partially covers the pixel definition layer 170. The first encapsulation layer 140 may include multiple encapsulation units, each encapsulation unit covering the side of the corresponding light-emitting structure 130 facing away from the substrate 110, thereby protecting the light-emitting structure 130. In this case, the first encapsulation layer 140 may extend from the light-emitting structure 130 through the sidewall of the pixel opening to the side of the pixel definition layer 170 facing away from the substrate 110.

[0085] The metal trace layer 120 has a first top surface facing away from the substrate 110 with a first distance from the substrate 110, and the first encapsulation layer 140 has a second top surface on the pixel definition layer 170 with a second distance from the substrate 110. The difference between the first distance and the second distance is not greater than a first preset value. In one possible example, the difference between the first distance and the second distance can be zero, in which case the first top surface of the metal trace layer 120 and the second top surface of the first encapsulation layer 140 on the pixel definition layer 170 are flush. In another possible example, the difference between the first distance and the second distance can be no greater than 20% of the thickness of the first encapsulation layer 140. For example, in the thickness direction of the display panel 100, the thickness of the first encapsulation layer 140 can be 1.6 μm, in which case the first preset value can be no greater than 0.32 μm. For example, the first preset value can be 0.1 μm, 0.15 μm, 0.2 μm, etc. The above data are only for illustrative purposes, and in actual embodiments, the first preset value is not based on the above data. At this time, by setting the difference between the first distance and the second distance to be less than the first preset value, the height difference between the top surface of the metal trace layer 120 away from the substrate 110 and the top surface of the first encapsulation layer 140 away from the substrate 110 is reduced. This is beneficial for the leveling of the second encapsulation layer 150 covering the first encapsulation layer 140 and the metal trace layer 120, so that the second encapsulation layer 150 can completely encapsulate the metal trace layer 120 and the first encapsulation layer 140.

[0086] Furthermore, the first encapsulation layer 140 may contact the metal trace layer 120. For example, the metal trace layer 120 may be higher than the first encapsulation layer 140, so that the second encapsulation layer 150 can surround the first top surface and sidewalls of the metal trace layer 120, thereby increasing the encapsulation effect of the second encapsulation layer 150 on the metal trace layer 120.

[0087] In one embodiment, the metal trace layer 120 includes a first trace layer 1221 and a second trace layer 1222 sequentially stacked in a direction away from the substrate 110.

[0088] The orthographic projection of the second wiring layer 1222 onto the substrate 110 lies within the orthographic projection of the first wiring layer 1221 onto the substrate 110. It is understood that the width of the second wiring layer 1222 can be smaller than the width of the first wiring layer 1221. The materials of the first wiring layer 1221 and the second wiring layer 1222 are different; for example, the material of the first wiring layer 1221 may include molybdenum, and the material of the second wiring layer 1222 may include aluminum. Of course, the materials of the first wiring layer 1221 and the second wiring layer 1222 can also be the same. For example, both the material of the first wiring layer 1221 and the material of the second wiring layer 1222 may be molybdenum.

[0089] The light-emitting structure 130 may include a light-emitting functional layer and a first electrode 160. As an example, the light-emitting functional layer may include a transport layer and an injection layer. The first electrode 160 may include a cathode. The first electrode 160 is disposed on the side of the light-emitting functional layer opposite to the substrate 110, and the first electrode 160 may at least contact the first wiring layer 1221, through which the electrical connection of the first electrodes 160 of the multiple light-emitting structures 130 is realized.

[0090] The first wiring layer 1221 may include a side facing the wiring opening and a third top surface facing away from the substrate 110. The third top surface may be the surface of the first wiring layer 1221 facing away from the substrate 110 and exposing the second wiring layer 1222. It is understood that the third top surface is not covered by the second wiring layer 1222. In this case, the first electrode 160 may extend from the side of the first wiring layer 1221 to the third top surface. At this time, the orthographic projection of the first electrode 160 on the substrate 110 and the orthographic projection of the first wiring layer 1221 on the substrate 110 may overlap. As an example, the first electrode 160 may at least cover part of the third top surface, or it may cover the entire third top surface.

[0091] In the top view of the display panel, the metal wiring layers 120 (first wiring layer 1221 and second wiring layer 1222) can be in a mesh-like structure. In this case, in the top view of the display panel, both the first wiring layer 1221 and the second wiring layer 1222 can extend along the first direction and the second direction. The first direction and the second direction can be perpendicular, and the wiring openings can be arranged in an array. When the first electrode 160 can at least cover a portion of the third top surface (e.g., ... Figure 1 As shown in the middle distance b), the length of the first electrode 160 extending along the first direction and / or the second direction on the third top surface is not less than a sixth preset value. The length of the first electrode 160 extending along the first direction and / or the second direction on the third top surface is not greater than a seventh preset value. For example, the sixth preset value is 1.62 μm, and the seventh preset value is 1.98 μm. As an example, the length of the first electrode 160 extending along the first direction on the third top surface is 1.8 μm, and the length of the first electrode 160 extending along the second direction on the third top surface is 1.8 μm. Further, the length of the first electrode 160 extending along the first direction and / or the second direction on the third top surface can be 1.7 μm, 1.85 μm, 1.9 μm, etc. It can be understood that the first wiring layer 1221 extends along both the first and second directions simultaneously, and the first electrode 160 can cover the third top surface of the first wiring layer 1221 in at least one direction, or it can cover the third top surface of the first wiring layer 1221 in both directions simultaneously.

[0092] In this embodiment, by setting the first electrode 160 to extend from the side of the first wiring layer 1221 to the third top surface, the contact area between the first electrode 160 and the first wiring layer 1221 is increased, thereby reducing the contact resistance between the first electrode 160 and the first wiring layer 1221.

[0093] In one possible example, the first wiring layer 1221 may include a first sub-part extending in a first direction, a second sub-part extending in a second direction, and a third sub-part contacting the first and second sub-parts. The first and second directions intersect; for example, the first and second directions may be perpendicular. In this case, the width of the first sub-part and / or the second sub-part is not less than a second preset value. The width of the first sub-part and / or the second sub-part is not greater than a third preset value. For example, the second preset value is 11.34 μm, and the third preset value is 13.6 μm. As an example, the width of the first sub-part and / or the second sub-part is 12.6 μm. Further, the width of the first sub-part and / or the second sub-part can be 11.5 μm, 12 μm, 13 μm, etc.

[0094] In another possible example, the second wiring layer 1222 includes a fourth sub-part extending in a first direction, a fifth sub-part extending in a second direction, and a sixth sub-part contacting the fourth and fifth sub-parts. The first and second directions intersect; for example, the first and second directions can be perpendicular. In this case, the width of the fourth sub-part and / or the fifth sub-part is not less than a fourth preset value. The width of the fourth sub-part and / or the fifth sub-part is not greater than a fifth preset value. The width of the fourth sub-part and / or the fifth sub-part can be expressed as... Figure 1 The distance d in the text. For example, the fourth preset value is 4.5 μm, and the fifth preset value is 5.5 μm. As an example, the width of the fourth sub-part and / or the fifth sub-part includes 5 μm. Further, the width of the fourth sub-part and / or the fifth sub-part can be 4.7 μm, 5.2 μm, etc.

[0095] In the two examples above, firstly, by setting the metal trace layer 120 to include a first trace layer 1221 and a second trace layer 1222, the metal trace layer 120 has a larger cross-sectional area. This reduces the resistance of the metal trace layer 120, thereby helping to solve the voltage drop problem of the display panel 100. Furthermore, in the two examples above, setting the second trace layer 1222 further reduces the difference between the first distance and the second distance. This difference can also be precisely controlled by adjusting the thickness of the second trace layer 1222, which is more conducive to the leveling of the first encapsulation layer 140 and the second encapsulation layer 150 of the metal trace layer 120. Furthermore, the first top surface of the metal trace layer 120 being flush with the second top surface of the first encapsulation layer 140 located on the pixel definition layer 170 can be achieved by having the top surface of the second trace layer 1222 facing away from the substrate 110 and the top surface of the first encapsulation layer 140 facing away from the substrate 110 being flush.

[0096] In one embodiment, a first gap exists between the first electrode 160 and the second wiring layer 1222 (the first gap can be...). Figure 1 (a) The first encapsulation layer 140 is still located within the first gap. At this time, the orthographic projection of the first electrode 160 on the substrate 110 is separated from the orthographic projection of the second wiring layer 1222 on the substrate 110. This first gap can expose the first wiring layer 1221. It can be understood that the first encapsulation layer 140 can cover the first wiring layer 1221 exposed by the first gap.

[0097] As an example, the first routing layer 1221 and the second routing layer 1222 extend in a first direction and a second direction, and the first direction and the second direction intersect; for example, the first direction and the second direction can be perpendicular. In this case, the distance of the first interval in the first direction is not less than an eighth preset value. The distance of the first interval in the second direction is not greater than a ninth preset value. For example, the eighth preset value is 1.8 μm, and the ninth preset value is 2.2 μm. As an example, the distance of the first interval in the first direction is 2 μm, and the distance of the first interval in the second direction is 2 μm. Further, the distance of the first interval in the first direction and / or the second direction can be 1.9 μm, 2.1 μm, etc.

[0098] In this embodiment, a first gap is provided between the first electrode 160 and the second wiring layer 1222, thereby facilitating the first encapsulation layer 140 to cover the first wiring layer 1221 exposed by the first gap. At this time, the first encapsulation layer 140 can extend to the sidewall of the second wiring layer 1222 facing the light-emitting structure 130, so that the first encapsulation layer 140 completely covers the first electrode 160 and the light-emitting structure 130, further reducing the probability of moisture intrusion into the first electrode 160 and the light-emitting structure 130. Secondly, in this embodiment, the first encapsulation layer 140 covers the first wiring layer 1221 exposed between the first electrode 160 and the second wiring layer 1222, which also reduces the probability of moisture intrusion into the first wiring layer 1221.

[0099] In one embodiment, the metal wiring layer 120 extends in a first direction and a second direction, and the first and second directions intersect; for example, the first and second directions can be perpendicular. In this case, a second gap exists between the light-emitting structure 130 and the metal wiring layer 120 (the second gap can be...). Figure 1 The distance c in the middle.

[0100] It can be understood that the orthographic projection of the light-emitting structure 130 on the substrate 110 is spaced apart from the orthographic projection of the metal wiring layer 120 on the substrate 110. Alternatively, in the thickness direction of the display panel 100, the light-emitting structure 130 may be lower than the metal wiring layer 120, or the light-emitting structure 130 may be lower than the pixel definition layer 170.

[0101] The second interval is not less than a tenth preset value in the first direction. The second interval is not greater than an eleventh preset value in the second direction. For example, the tenth preset value is 0.45 μm. The eleventh preset value is 0.55 μm. For example, the second interval is 0.5 μm in the first direction. The second interval is 0.5 μm in the second direction. As an example, the distance of the second interval in the first direction and / or the second direction can be 0.46 μm, 0.51 μm, etc.

[0102] In this embodiment, by setting a second gap between the light-emitting structure 130 and the metal trace layer 120, the possibility of crosstalk between the light-emitting structure 130 and the metal trace layer 120 is reduced.

[0103] Furthermore, this embodiment may also provide a shielding layer covering at least a portion of the metal trace layer 120 toward the sidewall of the light-emitting structure 130. The material of the shielding layer may include an insulating material to further reduce the possibility of crosstalk between the light-emitting structure 130 and the metal trace layer 120.

[0104] Based on the same inventive concept, in one embodiment, please refer to Figure 3 This embodiment provides a method for manufacturing a display panel 100. Figures 4 to 11 This is a schematic diagram of an intermediate structure obtained by the fabrication method of the display panel 100. The fabrication method of the display panel 100 includes the following steps:

[0105] Step S100: Provide substrate 110.

[0106] Step S200: A metal trace material layer 121 and an isolation material layer 122 are sequentially prepared on one side of the substrate 110.

[0107] Step S300: Pattern the isolation material layer 122 and the metal trace material layer 121 in sequence to obtain the isolation part 1220 and the support part 1210. The orthographic projection of the isolation part 1220 on the substrate 110 covers the orthographic projection of the support part 1210 on the substrate 110, and the isolation part 1220 encloses a plurality of isolation openings.

[0108] Step S400: Form multiple light-emitting structures 130 located within the corresponding isolation openings.

[0109] Step S500: Form a first encapsulation structure 141 located on the side of the plurality of light-emitting structures 130 away from the substrate.

[0110] Step S600: Remove portions of the isolation portion 1220 and the first packaging structure 141 to obtain a first packaging layer 140. The first packaging layer 140 includes a second top surface facing away from the substrate 110. At least a portion of the support portion 1210 serves as a metal trace layer 120. The metal trace layer 120 includes a first top surface facing away from the substrate 110, and the orthographic projection of the second top surface onto the substrate 110 is outside the orthographic projection of the first top surface onto the substrate 110.

[0111] In step S100, please refer to Figure 4 The substrate 110 can be a packaging substrate or the like. The material of the substrate 110 can include silicon, germanium silicon, etc. Multiple second electrodes can be formed on one side of the substrate 110. For example, the second electrode can be an anode.

[0112] In step S200, please refer to Figure 5 A metal trace material layer 121 and an isolation layer 122 can be formed on one entire side of the substrate 110. In one possible example, the material of the metal trace material layer 121 may include molybdenum, aluminum, etc. The material of the isolation layer 122 may include titanium, etc. Furthermore, the metal trace material layer 121 may include multiple film layers. For example, the metal trace material layer 121 may include a molybdenum layer and an aluminum layer formed sequentially. This embodiment does not limit the specific materials and number of layers of the metal trace material layer 121 and the isolation layer 122. In another possible example, the metal trace material layer 121 and the isolation layer 122 may have different thicknesses. For example, the thickness of the metal trace material layer 121 may be greater than the thickness of the isolation layer 122. Further, when the metal trace material layer 121 includes multiple film layers, the thickness of each film layer may also be different. For example, when the metal trace material layer 121 includes a molybdenum layer and an aluminum layer, the thickness of the aluminum layer may be greater than the thickness of the molybdenum layer.

[0113] In step S300, please refer to Figure 6The metal trace material layer 121 and the isolation layer 122 can have different etching ratios, allowing the isolation portion 1220 and the support portion 1210 to be formed in a single etching process. As an example, the orthographic projection of the isolation portion 1220 onto the substrate 110 overlaps the orthographic projection of the support portion 1210 onto the substrate 110. The cross-sectional view of the isolation portion 1220 can be rectangular or inverted trapezoidal, etc. The isolation portion 1220 encloses multiple isolation openings, which can be used to form the light-emitting structure 130 and the first electrode 160, etc. The composition and preparation of the isolation portion 1220 and the support portion 1210 mentioned in one or more embodiments of this application are further described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 100935, PCT / CN2024 / 102785, PCT / CN2024 / 099419, PCT / CN2024 / 099072, and CN116685174A, for reference.

[0114] In addition, please see Figure 5 and Figure 6 Before step S200, a pixel definition material layer 1700 may be formed on the substrate 110. Then, a metal trace material layer 121 and an isolation material layer 122 covering the pixel definition material layer 1700 are sequentially formed. Correspondingly, in step S300, please refer to... Figure 7 After forming the isolation portion 1220 and the support portion 1210, the pixel defining material layer 1700 can be further patterned to form a pixel opening within the pixel defining material layer 1700. The pixel opening can expose at least a portion of the second electrode 161. The pixel opening can communicate with a corresponding isolation opening, thereby facilitating the formation of the light-emitting structure 130.

[0115] In step S400, please refer to Figure 8 A light-emitting structure 130 is formed within at least a partially isolated opening. In one possible example, the light-emitting structure 130 can emit light of multiple colors. For example, the light-emitting structure 130 may include a red light-emitting structure, a green light-emitting structure, and a blue light-emitting structure, etc. In another possible example, the light-emitting structure 130 can emit monochromatic light. For example, the light-emitting structure 130 may include a white light-emitting structure 130, etc.

[0116] The following exemplarily describes the formation process of the light-emitting structure 130. In step S400, a light-emitting material layer can be deposited over the entire surface. At this time, at least a portion of the light-emitting material layer is located within the isolation opening (or pixel opening), and at least a portion of the light-emitting material layer is located on the top surface of the isolation portion facing away from the substrate 110. Moreover, the orthographic projection of the isolation portion 1220 onto the substrate 110 covers the orthographic projection of the support portion 1210 onto the substrate 110, which allows the light-emitting material layers located within adjacent isolation openings to be spaced apart, thereby reducing the possibility of crosstalk between the light-emitting material layers within adjacent isolation openings. It is understood that the light-emitting material layer located within the isolation opening (or pixel opening) forms the light-emitting structure 130, and the light-emitting structure 130 can be connected to at least a portion of the second electrode 161. Of course, after forming the light-emitting structure 130, a first electrode 160 can also be formed by vapor deposition, and the first electrode 160 can be a cathode. The first electrode 160 can cover the side of the light-emitting structure 130 facing away from the substrate 110. At the same time, the first electrode 160 can be connected to the support portion 1210.

[0117] In step S500, a first encapsulation structure 141 can be formed on the side of the light-emitting structure 130 facing away from the substrate 110. For example, the material of the first encapsulation structure 141 may include a transparent material, thereby not affecting the light emission efficiency of the light-emitting structure 130. The first encapsulation structure 141 may include multiple spaced-apart encapsulation units, each encapsulation unit covering its corresponding light-emitting structure 130. (See also...) Figure 12 , Figure 12 for Figure 8 The enlarged schematic diagram of structure A shows that the first packaging structure 141 may also cover at least a portion of the top surface of the isolation portion 1220 away from the substrate 110, the sidewall of the isolation portion 1220, and the sidewall of the support portion 1210.

[0118] In step S600, please refer to Figure 9 and Figure 10 The removed portion of the first package structure 141 may include at least the top surface of the isolation portion 1220 facing away from the substrate 110 and the sidewall of the isolation portion 1220. In one possible example, a mask layer 190 may be used to cover multiple package units, and the mask layer 190 may expose a portion of the first package structure 141 surrounding the isolation portion 1220. For example, the mask layer 190 may include a photoresist layer. Then, the isolation portion 1220 and a portion of the first package structure 141 are removed using methods such as dry etching. In another possible example, a portion of the isolation portion 1220 and the first package structure 141 may also be removed using methods such as polishing. This embodiment does not specifically limit the method for removing the portion of the isolation portion 1220 and the first package structure 141.

[0119] Please see Figure 10After removing portions of the isolation portion 1220 and the first packaging structure 141, the remaining first packaging structure 141 forms the first packaging layer 140. The first packaging layer 140 includes a second top surface facing away from the substrate 110. At this time, at least a portion of the support portion 1210 can serve as a metal trace layer 120. The metal trace layer 120 includes a first top surface facing away from the substrate 110. Moreover, the orthographic projection of the second top surface onto the substrate 110 is outside the orthographic projection of the first top surface onto the substrate 110.

[0120] After step S600, please refer to Figure 2 and Figure 11 , Figure 2 for Figure 11 The diagram illustrates the method for the B structure. As an example, inkjet printing (IJP) can also be used to form a second encapsulation layer 150 covering the first encapsulation layer 140 and the metal wiring layer 120. Furthermore, the second encapsulation layer 150 can initially have a certain degree of fluidity. After the second encapsulation layer 150 has leveled off the surface of the first encapsulation layer 140, the metal wiring layer 120, and the remaining film layers away from the substrate 110, it is then cured to form the second encapsulation layer 150.

[0121] In this embodiment, by removing portions of the isolation portion 1220 and the first encapsulation structure 141, the support portion 1210 and the first encapsulation layer 140 are obtained. At this time, the orthographic projection of the second top surface on the substrate 110 is outside the orthographic projection of the first top surface on the substrate 110. When the second encapsulation layer 150 is formed on the side of the metal wiring layer 120 and the first encapsulation layer 140 away from the substrate 110, this facilitates the leveling of the second encapsulation layer 150, thereby allowing the second encapsulation layer 150 to completely encapsulate the metal wiring layer 120 and the first encapsulation layer 140.

[0122] In one embodiment, see Figure 13 In step S600, when removing the portion of the isolation part 1220 and the first encapsulation structure 141, the isolation part 1220 and the first encapsulation structure 141 surrounding the isolation part 1220 can be removed, thereby retaining the complete support part 1210 and the first encapsulation structure 141 surrounding the support part 1210. At this time, the complete support part 1210 can serve as the metal trace layer 120.

[0123] In one possible example, a mask layer 190 can be used to cover all film layers except for the isolation portion 1220 and the first encapsulation structure 141 surrounding the isolation portion 1220, and then the isolation portion 1220 and the first encapsulation structure 141 surrounding the isolation portion 1220 can be removed using methods such as dry etching. In another possible example, the support portion 1210 can be used as a polishing stop layer, and the isolation portion 1220 and the first encapsulation structure 141 surrounding the isolation portion 1220 can be removed by polishing.

[0124] In this embodiment, by providing a mask layer 190, other film layer structures can be prevented from being damaged when the isolation portion 1220 and the first encapsulation structure 141 are removed. Moreover, since the isolation portion 1220 is removed, the thickness of the display panel 100 is reduced, which is beneficial to the thinning of the display panel 100.

[0125] In one embodiment, see Figure 10 Step S600 may include:

[0126] Step S610: After removing the isolation portion 1220, a portion of the first encapsulation structure 141 and a portion of the support portion 1210, the first encapsulation layer 140 and the remaining support portion 1210 are obtained, and the remaining support portion 1210 serves as the metal trace layer 120.

[0127] As an example, please participate in the reading Figure 12 The support portion 1210 can be removed up to line segment AB. This embodiment does not impose specific limitations on the amount of support portion 1210 removed or retained.

[0128] As an example, mask layer 190 can be used to cover all layers except for the isolation portion 1220, at least a portion of the support portion 1210, and the first encapsulation structure 141 surrounding the isolation portion 1220 and at least a portion of the support portion 1210. It can be understood that the thickness of mask layer 190 can be used to control the height of the support portion 1210 that needs to be removed.

[0129] In this embodiment, by setting a mask layer 190, the amount of support portion 1210 removed can be more precisely controlled, thereby obtaining the required height of the support portion 1210. Moreover, by removing part of the support portion 1210 in this embodiment, the thickness of the display panel 100 is further reduced, which is more conducive to the thinning of the display panel 100.

[0130] In addition, in one possible example, please see Figure 1In step S400, when the light-emitting structure 130 is formed, the light-emitting structure may have a second gap with the support portion. At this time, the orthographic projection of the light-emitting structure 130 on the substrate 110 is spaced from the orthographic projection of the metal wiring layer 120 on the substrate 110. Alternatively, in the thickness direction of the display panel 100, the light-emitting structure 130 may be lower than the metal wiring layer 120, or the light-emitting structure 130 may be lower than the pixel definition layer 170. As an example, the distance of the second gap in the first direction is not less than a tenth preset value. The distance of the second gap in the second direction is not greater than an eleventh preset value. For example, the tenth preset value is 0.45 μm. The eleventh preset value is 0.55 μm. For example, the distance of the second gap in the first direction is 0.5 μm. The distance of the second gap in the second direction is 0.5 μm. As an example, the distance of the second gap in the first direction and / or the second direction may be 0.46 μm, 0.51 μm, etc. In this example, by setting a second gap between the light-emitting structure 130 and the metal trace layer 120, the possibility of crosstalk between the light-emitting structure 130 and the metal trace layer 120 is reduced.

[0131] In another possible example, see Figure 1 In step S200, the metal trace material layer may include multiple layers. Correspondingly, the metal trace layer 120 may also include multiple layers. For example, the metal trace layer 120 may include a first trace layer 1221 and a second trace layer 1222. In step S600, the surface of the second trace layer 1222 facing away from the substrate 110 may be flush with the surface of the first encapsulation layer 140 located on the pixel definition layer 170 and facing away from the substrate 110. In this example, by controlling the surface of the second trace layer 1222 facing away from the substrate 110 to be flush with the surface of the first encapsulation layer 140 located on the pixel definition layer 170 and facing away from the substrate 110, it is more conducive to the leveling of the second encapsulation layer 150 covering the first encapsulation layer 140 and the metal trace layer 120. Of course, in this example, the surface of the second wiring layer 1222 facing away from the substrate 110 may be flush with the surface of the first encapsulation layer 140 located on the pixel definition layer 170 and facing away from the substrate 110, which may include process tolerances. For example, the second wiring layer 1222 may be higher than the first encapsulation layer 140, and the thickness of the second wiring layer 1222 exceeding the first encapsulation layer 140 may be 20% of the thickness of the first encapsulation layer 140. For example, when the thickness of the first encapsulation layer 140 may be 1.6 μm, the thickness of the second wiring layer 1222 exceeding the first encapsulation layer 140 may not be greater than 0.32 μm.

[0132] In yet another possible example, please refer to Figure 1The orthographic projection of the second wiring layer 1222 onto the substrate 110 lies within the orthographic projection of the first wiring layer 1221 onto the substrate 110. At this time, the first wiring layer 1221 may include a side surface and a third top surface that faces away from the substrate 110 and exposes the second wiring layer 1222. Then, in step S400, when the first electrode 160 of the light-emitting structure 130 is formed by vapor deposition, the first electrode 160 may extend from the side surface of the first wiring layer 1221 to the third top surface. As an example, the first electrode 160 may at least cover a portion of the third top surface. The first wiring layer 1221 extends simultaneously along a first direction and a second direction, and the first electrode 160 may cover the third top surface of the first wiring layer 1221 in at least one direction, or simultaneously cover the third top surface of the first wiring layer 1221 in two directions. For example, the length of the first electrode 160 extending along the first direction on the third top surface is not less than a sixth preset value. The length of the first electrode 160 extending along the second direction on the third top surface is not greater than a seventh preset value. For example, the sixth preset value is 1.62 μm, and the seventh preset value is 1.98 μm. As an example, the length of the first electrode 160 extending along the first direction on the third top surface is 1.8 μm, and the length of the first electrode 160 extending along the second direction on the third top surface is also 1.8 μm. Further, the length of the first electrode 160 extending along the first and / or second directions on the third top surface can be 1.7 μm, 1.85 μm, 1.9 μm, etc. In this example, by setting the first electrode 160 to extend from the side of the first wiring layer 1221 to the third top surface, the contact area between the first electrode 160 and the first wiring layer 1221 is increased, thereby reducing the contact resistance between the first electrode 160 and the first wiring layer 1221.

[0133] In another possible example, please refer to Figure 1In step S400, when the first electrode 160 of the light-emitting structure 130 is formed by vapor deposition, a first gap can be controlled between the first electrode 160 and the second wiring layer 1222. The first gap can expose the first wiring layer 1221. The first wiring layer 1221 and the second wiring layer 1222 extend in a first direction and a second direction, and the first direction and the second direction intersect, for example, the first direction and the second direction can be perpendicular. At this time, the distance of the first gap in the first direction is not less than an eighth preset value. The distance of the first gap in the second direction is not greater than a ninth preset value. For example, the eighth preset value is 1.8 μm, and the ninth preset value is 2.2 μm. As an example, the distance of the first gap in the first direction is 2 μm, and the distance of the first gap in the second direction is 2 μm. Further, the distance of the first gap in the first direction and / or the second direction can be 1.9 μm, 2.1 μm, etc. Afterwards, in step S500, the first encapsulation layer 140 can cover the first wiring layer 1221 exposed by the first gap. In this example, a first gap is provided between the first electrode 160 and the second wiring layer 1222, so that the first encapsulation layer 140 can cover the first wiring layer 1221 exposed by the first gap. At this time, the first encapsulation layer 140 can extend to the sidewall of the second wiring layer 1222 facing the light-emitting structure 130, thereby completely encapsulating the first electrode 160 and the light-emitting structure 130, further reducing the probability of moisture intrusion into the first electrode 160 and the light-emitting structure 130. Secondly, in this example, the first encapsulation layer 140 covering the first wiring layer 1221 exposed between the first electrode 160 and the second wiring layer 1222 also reduces the probability of moisture intrusion into the first wiring layer 1221.

[0134] It should be understood that although Figure 1 The steps in the flowchart are shown in sequence as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this document, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. In addition, Figure 1 At least part of the steps may include multiple steps or multiple stages. These steps or stages are not necessarily performed at the same time, but can be performed at different times. The order of execution of these steps or stages is not necessarily one by one, but can be performed in turn or alternately with other steps or at least part of the steps or stages in other steps.

[0135] In one embodiment, a display device (not shown) is provided, the display device including the display panel 100 provided in any of the above embodiments or combinations thereof.

[0136] It is understood that the display device in the embodiments of this application can be any product or component with display function, such as OLED display device, QLED display device, electronic paper, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, navigator, wearable device, Internet of Things device, etc., and the embodiments disclosed in this application do not limit this.

[0137] The scope of protection of this patent application shall be determined by the appended claims. The above description is only a preferred embodiment of this disclosure and does not limit the scope of this patent. All equivalent structural transformations made based on the inventive concept of this disclosure and the contents of this specification and drawings, or direct / indirect applications in other related technical fields, are included within the scope of patent protection of this disclosure.

Claims

1. A display panel, characterized in that, include: substrate; A metal trace layer is located on one side of the substrate. The metal trace layer encloses and forms a plurality of trace openings. The metal trace layer includes a first top surface facing away from the substrate. Multiple light-emitting structures are spaced apart on one side of the substrate, and at least part of the light-emitting structures are located within the corresponding trace openings; A first encapsulation layer is disposed on the side of the plurality of light-emitting structures facing away from the substrate. The first encapsulation layer includes a second top surface facing away from the substrate, and the orthographic projection of the second top surface on the substrate is located outside the orthographic projection of the first top surface on the substrate. The second encapsulation layer covers at least the side of the metal trace layer facing away from the substrate and the side of the first encapsulation layer facing away from the substrate.

2. The display panel according to claim 1, characterized in that, The display panel also includes: A pixel definition layer is located on one side of the substrate, and the metal trace layer is located on the side of the pixel definition layer opposite to the substrate. The first encapsulation layer at least partially covers the pixel definition layer. Wherein, the first top surface has a first distance from the substrate, the second top surface located on the pixel definition layer has a second distance from the substrate, and the difference between the first distance and the second distance is not greater than a first preset value.

3. The display panel according to claim 2, characterized in that, The first preset value is no greater than 20% of the thickness of the first encapsulation layer.

4. The display panel according to claim 3, characterized in that, In the thickness direction of the display panel, the thickness of the first encapsulation layer is 1.6 μm, and the first preset value is no greater than 0.32 μm.

5. The display panel according to claim 2, characterized in that, The first encapsulation layer is in contact with the metal trace layer.

6. The display panel according to claim 2, characterized in that, The first encapsulation layer includes multiple encapsulation units, each encapsulation unit covering the side of the corresponding light-emitting structure facing away from the substrate.

7. The display panel according to claim 2, characterized in that, The first top surface is flush with the second top surface located on the pixel definition layer.

8. The display panel according to claim 1, characterized in that, The metal trace layer includes a first trace layer and a second trace layer stacked sequentially in a direction away from the substrate, wherein the orthographic projection of the second trace layer on the substrate is located within the orthographic projection of the first trace layer on the substrate.

9. The display panel according to claim 8, characterized in that, The light-emitting structure includes a light-emitting functional layer and a first electrode. The first electrode is disposed on the side of the light-emitting functional layer away from the substrate, and the first electrode is in contact with the first wiring layer.

10. The display panel according to claim 9, characterized in that, The first trace layer includes a side surface facing the trace opening and a third top surface facing away from the substrate, wherein the first electrode extends from the side surface to the third top surface.

11. The display panel according to claim 10, characterized in that, The third top surface is the surface of the first wiring layer that is away from the substrate and exposes the second wiring layer.

12. The display panel according to claim 8, characterized in that, The material of the first trace layer is different from the material of the second trace layer.

13. The display panel according to claim 12, characterized in that, The material of the first trace layer includes molybdenum, and the material of the second trace layer includes aluminum.

14. The display panel according to claim 8, characterized in that, The first routing layer includes a first sub-part extending in a first direction, a second sub-part extending in a second direction, and a third sub-part contacting the first sub-part and the second sub-part. The first direction and the second direction intersect. The width of the first sub-part and / or the second sub-part is not less than a second preset value, and / or the width of the first sub-part and / or the second sub-part is not greater than a third preset value.

15. The display panel according to claim 14, characterized in that, The second preset value is 11.34 μm, and / or the third preset value is 13.6 μm.

16. The display panel according to claim 14, characterized in that, The width of the first sub-part and / or the second sub-part is 12.6 μm.

17. The display panel according to claim 8, characterized in that, The second routing layer includes a fourth sub-part extending in a first direction, a fifth sub-part extending in a second direction, and a sixth sub-part contacting the fourth sub-part and the fifth sub-part. The first direction and the second direction intersect. The width of the fourth sub-part and / or the fifth sub-part is not less than a fourth preset value, and / or the width of the fourth sub-part and / or the fifth sub-part is not greater than a fifth preset value.

18. The display panel according to claim 17, characterized in that, The fourth preset value is 4.5 μm, and / or the fifth preset value is 5.5 μm.

19. The display panel according to claim 17, characterized in that, The width of the fourth sub-part and / or the fifth sub-part includes 5 μm.

20. The display panel according to claim 10, characterized in that, The first routing layer and the second routing layer extend in a first direction and a second direction, the first direction and the second direction intersect, wherein: The length of the first electrode extending on the third top surface along the first direction and / or along the second direction is not less than a sixth preset value, and / or the length of the first electrode extending on the third top surface along the first direction and / or along the second direction is not greater than a seventh preset value.

21. The display panel according to claim 20, characterized in that, The sixth preset value is 1.62 μm, and / or the seventh preset value is 1.98 μm.

22. The display panel according to claim 20, characterized in that, The first electrode extends 1.8 μm along a first direction on the third top surface, and / or the first electrode extends 1.8 μm along a second direction on the third top surface.

23. The display panel according to claim 20, characterized in that, There is a first gap between the first electrode and the second wiring layer, and the first encapsulation layer is also located within the first gap.

24. The display panel according to claim 23, characterized in that, The first routing layer and the second routing layer extend in a first direction and a second direction, the first direction and the second direction intersect, the distance of the first interval in the first direction and / or the second direction is not less than an eighth preset value, and / or, the distance of the first interval in the first direction and / or the second direction is not greater than a ninth preset value.

25. The display panel according to claim 24, characterized in that, The eighth preset value is 1.8 μm, and / or the ninth preset value is 2.2 μm.

26. The display panel according to claim 24, characterized in that, The distance of the first interval in the first direction is 2 μm, and / or the distance of the first interval in the second direction is 2 μm.

27. The display panel according to claim 1, characterized in that, The metal trace layer extends in a first direction and a second direction, wherein the first direction and the second direction intersect, and: There is a second gap between the light-emitting structure and the metal trace layer, wherein the distance of the second gap in the first direction and / or the second direction is not less than a tenth preset value, and / or the distance of the second gap in the first direction and / or the second direction is not greater than an eleventh preset value.

28. The display panel according to claim 27, characterized in that, The tenth preset value is 0.45 μm, and / or the eleventh preset value is 0.55 μm.

29. The display panel according to claim 27, characterized in that, The second interval is 0.5 μm in the first direction, and / or the second interval is 0.5 μm in the second direction.

30. A method for manufacturing a display panel, characterized in that, include: Provide substrate; A metal trace material layer and an isolation material layer are sequentially prepared on one side of the substrate; The isolation material layer and the metal trace material layer are patterned sequentially to obtain the isolation part and the support part, wherein the orthographic projection of the isolation part on the substrate covers the orthographic projection of the support part on the substrate, and the isolation part encloses a plurality of isolation openings; Multiple light-emitting structures are formed within the corresponding isolation openings; A first packaging structure is formed on the side of the plurality of light-emitting structures that is away from the substrate; By removing the isolation portion and a portion of the first encapsulation structure, a first encapsulation layer is obtained, the first encapsulation layer including a second top surface facing away from the substrate; Wherein, at least a portion of the support portion serves as a metal trace layer, the metal trace layer including a first top surface facing away from the substrate, and the orthographic projection of the second top surface on the substrate is located outside the orthographic projection of the first top surface on the substrate; A second encapsulation layer is formed that at least covers the side of the metal trace layer opposite to the substrate and the side of the first encapsulation layer opposite to the substrate.

31. The method for manufacturing a display panel according to claim 30, characterized in that, The support portion serves as the metal trace layer, and the surface of the support portion facing away from the substrate is the first top surface.

32. The method for manufacturing a display panel according to claim 30, characterized in that, The step of removing the isolation portion and the portion of the first encapsulation structure to obtain the first encapsulation layer includes: By removing the isolation portion, a portion of the first packaging structure, and a portion of the support portion, a first packaging layer and the remaining support portion are obtained, with the remaining support portion serving as the metal trace layer.

33. A display device, characterized in that, The display device includes a display panel as described in any one of claims 1-29, or the display device includes a display panel obtained using the method for preparing a display panel as described in any one of claims 30-32.

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