A method, device, electronic device and storage medium for detecting defects of a reed switch

Abstract

The present invention relates to the field of magnetic reed switch testing technology, and discloses a magnetic reed switch defect detection method, device, electronic device and storage medium, the method comprising obtaining the expansion coefficient of the magnetic reed switch; using a gas pressure test device to obtain a first pressure drop value after the sealed magnetic reed switch is inflated and a second pressure drop value after the unsealed magnetic reed switch is inflated, obtaining a first gap width and a second gap width between the end of the moving contact reed and the static contact, and obtaining a first deformation distance from the moving contact to the static contact after the end of the moving contact reed is deformed at a preset high temperature test temperature through a preset contact distance formula; according to the expansion coefficient, through a quantitative relationship model of the moving contact, obtaining a second deformation distance between the static contact and the base; comparing the first deformation distance and the second deformation distance with a preset distance reference value respectively, to determine whether the magnetic reed switch is qualified. The method can improve the detection efficiency of magnetic reed switch products.

Description

Technical Field

[0001] The present invention relates to the field of reed switch testing technology, and in particular to a reed switch defect detection method, device, electronic equipment and storage medium. Background Art

[0002] Some reed switch products disclosed in the prior art generally include a base, a moving contact, a stationary contact, a fixed contact, and a moving contact spring. The base is fixedly connected to the fixed contact, and one end of the moving contact is fixed to one end of the moving contact spring to form a moving contact disposed between the base and the fixed contact; the other end of the moving contact spring is disposed between the stationary contact and the base, and the stationary contact is fixed to the fixed contact. In the above patent, the fixed contact and the stationary contact are both fixed to the base. In actual applications, the stationary contact needs to be connected to an external wire, and a plug-in needs to be designed, which is inserted into the stationary contact to connect to the external wire.

[0003] When the reed switch is used in an environment with electromagnetic interference, its working state will be affected by the influence of electromagnetic interference, which in turn affects the normal operation of the switch. The reed switches disclosed in the above two patents are both made of plastic material. This material belongs to polymer material, and its thermal expansion coefficient (DTE) is in the range of 10-5 / K. At the same time, the internal components of the reed switch are generally made of metal and its alloy materials, and its thermal expansion coefficient is (DTE) 10-6 / K. The working temperature of the reed switch is 20-30℃. At low temperatures, the thermal expansion degree of the internal components of the reed switch is much lower than that at 20℃. After the instantaneous conversion of high and low temperatures, the thermal expansion and contraction cause the static contact and the moving contact reed to deform. The moving contact reed presses the static contact to a static position, resulting in instantaneous deformation. If the switch is switched multiple times, the static contact will fatigue under the action of multiple deformations, and the product is prone to failure.

[0004] The fatigue mentioned above refers to the reciprocating deformation of the static contact piece, which causes the static contact piece and the moving contact piece spring to wear and fail. The failure of the product cannot be reflected when it leaves the factory, but it will become a problem after suddenly working in a high-temperature closed environment, such as an oven, in a specific high-temperature environment. For example, in high-temperature environments such as automobile motor environments, ovens, sheet metal cavities, etc., working in high-temperature and high-vibration environments is prone to fatigue or failure.

[0005] In the prior art, there is no effective technical means to screen out unqualified reed switch products. Most of them are to put the products into operation for a long time, determine whether the reed switch is invalid, and then screen them. This prolongs the service life of the products, has a negative impact on downstream customers, and causes low efficiency in reed switch product testing. Summary of the invention

[0006] The present invention provides a reed switch defect detection method, device, electronic equipment and storage medium to improve the detection efficiency of reed switch products.

[0007] In a first aspect, in order to solve the above technical problems, the present invention provides a reed switch defect detection method, comprising:

[0008] Obtaining the expansion coefficient of the reed switch; wherein the reed switch comprises a moving contact spring, a moving contact, a stationary contact, a fixed contact and a base;

[0009] Using an air pressure testing device to obtain a first air pressure drop value after the sealed reed switch is inflated and a second air pressure drop value after the unsealed reed switch is inflated;

[0010] According to the first air pressure drop value and the second air pressure drop value, a first gap width and a second gap width between the end of the moving contact spring and the stationary contact are obtained;

[0011] According to the first gap width and the second gap width, a first deformation distance from the moving contact piece to the stationary contact piece after the end of the moving contact piece spring is deformed at a preset high temperature test temperature is obtained by using a preset contact piece distance formula;

[0012] According to the expansion coefficient, the first gap width and the second gap width, a second deformation distance between the fixed contact piece and the base is obtained through a quantitative relationship model of the movable contact piece;

[0013] The first deformation distance and the second deformation distance are respectively compared with preset distance reference values. When the first deformation distance and the second deformation distance are both greater than the distance reference values, the reed switch is determined to be qualified.

[0014] Preferably, the base is fixedly connected to the fixed contact piece; one end of the moving contact piece is fixed to one end of the moving contact piece spring to form a moving contact piece, and the moving contact piece is arranged between the base and the fixed contact piece; the other end of the moving contact piece spring is arranged between the static contact piece and the base; the static contact piece is fixed on the fixed contact piece.

[0015] In an optional embodiment, the method of using an air pressure testing device to obtain a first air pressure drop value after the sealed reed switch is inflated and a second air pressure drop value after the unsealed reed switch is inflated includes:

[0016] obtaining an internal pressure of the unsealed reed switch;

[0017] Filling the unsealed reed switch with gas of a preset pressure to obtain a second gas pressure drop value;

[0018] The sealed reed switch is filled with gas of a preset pressure to obtain a first gas pressure drop value.

[0019] In an optional embodiment, obtaining the first gap width and the second gap width between the end of the moving contact spring and the stationary contact according to the first air pressure drop value and the second air pressure drop value includes:

[0020] Raising the temperature of the unsealed magnetic reed switch to a preset high temperature, and using the first air pressure drop value as the first gap width between the end of the moving contact reed and the stationary contact;

[0021] The temperature of the sealed magnetic reed switch is raised to a preset high temperature, and the second air pressure drop value is used as the second gap width between the end of the moving contact reed and the stationary contact.

[0022] In an optional embodiment, the first deformation distance from the moving contact piece to the stationary contact piece after the end of the moving contact piece spring is deformed at a preset high temperature test temperature is obtained according to the first gap width and the second gap width by a preset contact piece distance formula, including:

[0023] The first deformation distance from the moving contact piece to the stationary contact piece after deformation at high temperature test temperature is calculated by the following formula:

[0024]

[0025] in is the first deformation distance, is the first gap width, is the second gap width, is the initial distance from the moving contact spring to the stationary contact after deformation at a preset room temperature, It is the distance from the end of the moving contact spring to the stationary contact after deformation at preset high temperature.

[0026] In an optional implementation, obtaining the second deformation distance between the fixed contact piece and the base according to the expansion coefficient, the first gap width and the second gap width through a quantitative relationship model of the moving contact piece spring includes:

[0027] Get the distance between the base and the fixed contact piece ;

[0028] Get the initial distance between the moving contact piece and the stationary contact piece

[0029] According to the quantitative relationship model of the moving contact spring:

[0030]

[0031]

[0032]

[0033] get ;

[0034] The expansion coefficient of the moving contact spring is ε; the expansion coefficient of the stationary contact is ; The expansion coefficient of the base is ; The expansion coefficient of the moving contact piece is ; is the second deformation distance.

[0035] In an optional embodiment, the distance between the moving contact piece and the stationary contact piece and the distance between the fixed contact piece and the base are respectively compared with preset reference values. When both the first deformation distance and the second deformation distance are greater than the distance reference values, after judging as qualified, the method further includes:

[0036] When one of the first deformation distance or the second deformation distance is smaller than the distance reference value, it is determined to be unqualified, wherein the distance reference value is the distance between the fixed contact piece and the base under a preset high temperature;

[0037] By using machine vision, the surface of the reed switch is scanned and image analysis is performed, bubbles or structural defects are detected, and the reed switch is determined to be unqualified.

[0038] In a second aspect, the present invention provides a reed switch defect detection device, comprising:

[0039] An expansion coefficient module, used to obtain the expansion coefficient of the reed switch; wherein the reed switch includes a moving contact spring, a moving contact, a stationary contact, a fixed contact and a base;

[0040] An air pressure testing module, used to obtain a first air pressure drop value after the sealed reed switch is inflated and a second air pressure drop value after the unsealed reed switch is inflated by using an air pressure testing device;

[0041] A gap width module, for obtaining a first gap width and a second gap width between the end of the moving contact spring and the stationary contact according to the first pressure drop value and the second pressure drop value;

[0042] A first distance module, for obtaining, according to the first gap width and the second gap width, a first deformation distance from the moving contact piece to the stationary contact piece after the end of the moving contact piece spring piece is deformed at a preset high temperature test temperature by a preset contact piece distance formula;

[0043] A second distance module, for obtaining a second deformation distance between the fixed contact piece and the base according to the expansion coefficient, the first gap width and the second gap width through a quantitative relationship model of the moving contact piece spring;

[0044] The qualified judgment module is used to compare the first deformation distance and the second deformation distance with preset distance reference values ​​respectively, and when the first deformation distance and the second deformation distance are both greater than the distance reference values, it is determined that the reed switch is qualified.

[0045] In a third aspect, the present invention further provides an electronic device comprising a processor, a memory, and a computer program stored in the memory and configured to be executed by the processor, wherein the processor implements any one of the above-mentioned reed switch defect detection methods when executing the computer program.

[0046] In a fourth aspect, the present invention further provides a computer-readable storage medium, wherein the computer-readable storage medium includes a stored computer program, wherein when the computer program is running, the device where the computer-readable storage medium is located is controlled to execute any one of the above-mentioned reed switch defect detection methods.

[0047] Compared with the prior art, the present invention has the following beneficial effects:

[0048] The present invention discloses a method for detecting defects of a reed switch, the method comprising obtaining an expansion coefficient of the reed switch; wherein the reed switch comprises a moving contact piece, a moving contact piece, a stationary contact piece, a fixed contact piece and a base; using an air pressure testing device to obtain a first air pressure drop value after the sealed reed switch is inflated and a second air pressure drop value after the unsealed reed switch is inflated; according to the first air pressure drop value and the second air pressure drop value, a first gap width and a second gap width between the end of the moving contact piece and the stationary contact piece are obtained; according to the first gap width and the second gap width, a first deformation distance from the moving contact piece to the stationary contact piece after the end of the moving contact piece is deformed at a preset high temperature test temperature is obtained through a preset contact piece distance formula; according to the expansion coefficient, the first gap width and the second gap width, a second deformation distance from the stationary contact piece to the base is obtained through a quantitative relationship model of the moving contact piece; the first deformation distance and the second deformation distance are respectively compared with a preset distance reference value, and when the first deformation distance and the second deformation distance are both greater than the distance reference value, it is determined to be qualified. This method uses the bending of the reed end of the moving contact reed of the reed switch at the preset temperature and the high temperature test temperature, combined with the change in the gap width to calculate the distance at the high temperature test temperature. By testing the performance of the reed switch under high temperature conditions, its stability in high temperature and high vibration environments is ensured, thereby improving the reliability and safety of the product and extending its service life. This detection process is relatively simple and easy to operate, which improves the efficiency of reed switch product detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1It is a schematic flow chart of a reed switch defect detection method provided by the first embodiment of the present invention;

[0050] Figure 2 It is a structural schematic diagram of a reed switch defect detection device provided in the second embodiment of the present invention. DETAILED DESCRIPTION

[0051] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0052] Some reed switch products disclosed in the prior art generally include a base, a moving contact, a stationary contact, a fixed contact, and a moving contact spring. The base is fixedly connected to the fixed contact, and one end of the moving contact is fixed to one end of the moving contact spring to form a moving contact disposed between the base and the fixed contact; the other end of the moving contact spring is disposed between the stationary contact and the base, and the stationary contact is fixed to the fixed contact. In the above patent, the fixed contact and the stationary contact are both fixed to the base. In actual applications, the stationary contact needs to be connected to an external wire, and a plug-in needs to be designed, which is inserted into the stationary contact to connect to the external wire.

[0053] When the reed switch is used in an environment with electromagnetic interference, its working state will be affected by the influence of electromagnetic interference, which in turn affects the normal operation of the switch. The reed switches disclosed in the above two patents are both made of plastic material. This material belongs to polymer material, and its thermal expansion coefficient (DTE) is in the range of 10-5 / K. At the same time, the internal components of the reed switch are generally made of metal and its alloy materials, and its thermal expansion coefficient is (DTE) 10-6 / K. The working temperature of the reed switch is 20-30℃. At low temperatures, the thermal expansion degree of the internal components of the reed switch is much lower than that at 20℃. After the instantaneous conversion of high and low temperatures, the thermal expansion and contraction cause the static contact and the moving contact reed to deform. The moving contact reed presses the static contact to a static position, resulting in instantaneous deformation. If the switch is switched multiple times, the static contact will fatigue under the action of multiple deformations, and the product is prone to failure.

[0054] The fatigue mentioned above refers to the reciprocating deformation of the static contact piece, which causes the static contact piece and the moving contact piece spring to wear and fail. The failure of the product cannot be reflected when it leaves the factory, but it will become a problem after suddenly working in a high-temperature closed environment, such as an oven, in a specific high-temperature environment. For example, in high-temperature environments such as automobile motor environments, ovens, sheet metal cavities, etc., working in high-temperature and high-vibration environments is prone to fatigue or failure.

[0055] In the prior art, there is no effective technical means to screen out unqualified reed switch products. Most of them are to put the products into operation for a long time, determine whether the reed switch is invalid, and then screen them. This prolongs the service life of the products, has a negative impact on downstream customers, and causes low efficiency in reed switch product testing.

[0056] The present invention provides a reed switch defect detection method, device, electronic equipment and storage medium to improve the detection efficiency of reed switch products.

[0057] Reference Figure 1 The first embodiment of the present invention provides a reed switch defect detection method, comprising the following steps:

[0058] S11, obtaining an expansion coefficient of a magnetic reed switch; wherein the magnetic reed switch comprises a moving contact spring, a moving contact, a stationary contact, a fixed contact and a base;

[0059] S12, using an air pressure testing device to obtain a first air pressure drop value after the sealed reed switch is inflated and a second air pressure drop value after the unsealed reed switch is inflated;

[0060] S13, obtaining a first gap width and a second gap width between the end of the moving contact spring and the stationary contact according to the first air pressure drop value and the second air pressure drop value;

[0061] S14, according to the first gap width and the second gap width, by using a preset contact distance formula, obtaining a first deformation distance from the moving contact piece to the stationary contact piece after the end of the moving contact piece spring is deformed at a preset high temperature test temperature;

[0062] S15, obtaining a second deformation distance between the fixed contact piece and the base through a quantitative relationship model of the movable contact piece according to the expansion coefficient, the first gap width, and the second gap width;

[0063] S16, comparing the first deformation distance and the second deformation distance with preset distance reference values ​​respectively, and when the first deformation distance and the second deformation distance are both greater than the distance reference values, determining that the reed switch is qualified.

[0064] In step S11, the expansion coefficient of the reed switch is obtained; wherein the reed switch comprises a moving contact spring, a moving contact, a stationary contact, a fixed contact and a base.

[0065] It is worth noting that the base is fixedly connected to the fixed contact piece; one end of the moving contact piece is fixed to one end of the moving contact piece spring to form a moving contact piece, and the moving contact piece is arranged between the base and the fixed contact piece; the other end of the moving contact piece spring is arranged between the static contact piece and the base; the static contact piece is fixed on the fixed contact piece.

[0066] In step S12, a first pressure drop value after the sealed reed switch is inflated and a second pressure drop value after the unsealed reed switch is inflated are obtained by using an air pressure testing device. The internal pressure of the unsealed reed switch is obtained; the unsealed reed switch is inflated with gas of a preset pressure to obtain the second pressure drop value; the sealed reed switch is inflated with gas of a preset pressure to obtain the first pressure drop value.

[0067] In one embodiment, prepare an air pressure testing device, which should be provided with a pressure gauge for detecting the air pressure value. At the same time, prepare a ejector pin, which should include an inflation end connected to the pressure gauge and an air release end connected to the reed switch; connect the pressure gauge to the air inlet of the unsealed reed switch through the inflation end at the top of the ejector pin; fill the unsealed reed switch with gas of preset pressure through the inflation end of the ejector pin, and detect the air pressure drop value in the pressure gauge, which is the second air pressure drop value; connect the inflation end at the top of the unsealed reed switch to the exhaust pipe, and detect the air pressure drop value in the pressure gauge again. Perform the same inflation operation on the sealed reed switch, and detect the air pressure drop value in the pressure gauge, which is the first air pressure drop value. In the unsealed state, the pressure inside the reed switch is called the internal pressure. In this way, the pressure drop value of the sealed reed switch and the unsealed reed switch after inflation can be effectively obtained, and the sealing of the reed switch can be further judged. If the pressure is less than the first critical value or the second critical value, it indicates that the reed switch is not sealed; otherwise, it is confirmed that the reed switch is sealed. This method can help to quickly and accurately detect the sealing of the reed switch, ensure product quality, and help to discover potential defects in a timely manner.

[0068] In step S13, the first gap width and the second gap width between the end of the moving contact reed and the stationary contact are obtained according to the first air pressure drop value and the second air pressure drop value. The temperature of the unsealed reed switch is raised to a preset high temperature, and the first air pressure drop value is used as the first gap width between the end of the moving contact reed and the stationary contact; the temperature of the sealed reed switch is raised to a preset high temperature, and the second air pressure drop value is used as the second gap width between the end of the moving contact reed and the stationary contact.

[0069] It is worth noting that the preset high temperature is 55 The preset room temperature is 25 .

[0070] In one embodiment, the reed switch is placed in a test environment at a preset temperature and left to stand for at least 24 hours, allowing the moving contact reed to deform to its initial position due to the heating of the static contact. Subsequently, the pressure gauge is connected to the air inlet of the reed switch through the inflation end at the top of the ejector pin, and gas of a preset pressure is filled into the reed switch through the inflation end of the ejector pin, and the pressure drop in the pressure gauge is detected, which is the first pressure drop. The reed switch is placed in a high-temperature test box, and the high-temperature test box is heated from the initial temperature to the first temperature at a preset first heating rate. During this process, the pressure drop is recorded, which is the second pressure drop. Similarly, the reed switch is placed in a low-temperature test box, and the low-temperature test box is heated from the initial temperature to the second temperature at a preset second heating rate, and the temperature display value in the temperature test box is recorded, which is a test of the second pressure drop under another temperature condition. The gas pressure change value at the second temperature is used as the gap width ( ); The gas pressure change value at the first temperature is used as the gap width between the end of the moving contact spring and the static contact at the high temperature test temperature ( ). By using the change of gas pressure in the reed switch under different temperature conditions, the gap width between the end of the moving contact reed and the static contact under different temperature conditions can be indirectly obtained, thereby evaluating the performance of the reed switch under temperature changes.

[0071] In step S14, according to the first gap width and the second gap width, a first deformation distance from the moving contact piece to the stationary contact piece after the end of the moving contact piece spring is deformed at a preset high temperature test temperature is obtained by a preset contact piece distance formula. The first deformation distance from the moving contact piece to the stationary contact piece after deformation at the high temperature test temperature is calculated by the following formula:

[0072]

[0073] in is the first deformation distance, is the first gap width, is the second gap width, is the initial distance from the moving contact spring to the stationary contact after deformation at a preset room temperature, It is the distance from the end of the moving contact spring to the stationary contact after deformation at preset high temperature.

[0074] It is worth mentioning that is the first deformation distance, i.e., the first deformation distance from the moving contact piece to the stationary contact piece after the end of the moving contact piece spring is deformed at the preset high temperature test temperature. By knowing the gap width change and the initial distance at the preset room temperature, we can calculate the distance after the end of the moving contact piece spring is deformed at the high temperature test temperature.

[0075] In step S15, according to the expansion coefficient, the first gap width and the second gap width, a second deformation distance between the fixed contact piece and the base is obtained through a quantitative relationship model of the movable contact piece. ; Get the initial distance between the moving contact piece and the static contact piece

[0076] According to the quantitative relationship model of the moving contact spring:

[0077]

[0078]

[0079]

[0080] get ; The expansion coefficient of the moving contact spring is ; The expansion coefficient of the stationary contact is ; The expansion coefficient of the base is ; The expansion coefficient of the moving contact piece is ; is the second deformation distance.

[0081] In one embodiment, the temperature expansion coefficient of the moving contact spring is first obtained when the temperature rises from the preset temperature to the high temperature test temperature. , the thermal expansion coefficient of the base , the expansion coefficient of the stationary contact temperature , the expansion coefficient of the moving contact temperature If the material of the moving contact spring is the same as that of the base, = . is the distance between the base and the fixed contact piece; is the initial distance between the moving contact piece and the stationary contact piece according to = , get the distance difference between the fixed contact piece and the base. Through this calculation, the distance between the fixed contact piece and the base at the high temperature test temperature and the distance after cooling can be determined, and the distance can be compared with the preset reference distance to determine whether the reed switch is qualified.

[0082] It is worth mentioning that the expansion coefficient is used as part of the model for the following reasons: the expansion coefficient is a measure of the ability of a material to change size as the temperature changes. In the detection of reed switches, the expansion coefficient can quantify the dimensional change of the material at different temperatures, which is crucial for evaluating the performance of the reed switch under different temperature conditions. At the same time, different components of the reed switch (such as the base, the moving contact reed, the stationary contact, etc.) may be made of different materials, each of which has its own unique thermal expansion coefficient. By considering the expansion coefficient of these materials, the deformation behavior of the reed switch under temperature changes can be more accurately predicted. Reed switches may experience temperature fluctuations in actual applications, especially in environments with high temperatures or frequent temperature changes. By introducing the expansion coefficient, the thermal stability of the reed switch under these conditions can be evaluated to ensure that it can maintain its structural and functional integrity under high temperature conditions. As part of the model, the expansion coefficient can help improve the effectiveness of the detection method and ensure that the detection results are more accurate and reliable. By incorporating the expansion coefficient into the model, the behavior of the reed switch under different temperature conditions can be more accurately predicted, thereby ensuring its performance in various working environments. Using the expansion coefficient as a model parameter allows reed switches from different batches or designs to be compared under the same testing standards, which is beneficial for quality control and standardized production. In summary, using the expansion coefficient as part of the model can more scientifically and accurately evaluate the performance and stability of reed switches under different temperature conditions, thereby ensuring their reliability and safety in practical applications.

[0083] In step S16, the first deformation distance and the second deformation distance are respectively compared with preset distance reference values. When the first deformation distance and the second deformation distance are both greater than the distance reference values, it is determined to be qualified. The method further includes: when one of the first deformation distance or the second deformation distance is less than the distance reference value, it is determined to be unqualified, wherein the distance reference value is the distance between the fixed contact piece and the base under a preset high temperature; using machine vision, scanning the surface of the reed switch and performing image analysis, detecting bubbles or structural defects, and determining that the reed switch is unqualified.

[0084] It is worth noting that the qualified first deformation distance means that under high temperature conditions, the distance change between the end of the moving contact reed and the static contact does not exceed expectations, indicating that the reed switch can still maintain certain working performance under high temperature. The qualified second deformation distance means that under high temperature conditions, the distance change between the fixed contact and the base does not exceed expectations, indicating that the reed switch can still maintain sufficient stability under high temperature. Therefore, if both are greater than the preset reference value, it means that the reed switch can still maintain its due performance and stability under high temperature conditions, so the reed switch can be judged as a qualified product.

[0085] It is worth noting that the preset reference values ​​are usually determined based on the following factors: the design requirements of the reed switch, such as the operating temperature range, expected life, etc. The expansion coefficient, strength and other characteristics of the materials used in the reed switch at different temperatures. Through a series of experimental tests on the reed switch, data is collected to find out the boundary conditions under which the reed switch can work normally under different temperature conditions.

[0086] In one embodiment, the preset reference value is obtained through experiments and calculations. For example, the gap width between the end of the moving contact reed and the static contact is obtained by testing the reed switch at a preset temperature, and the reed switch is immersed in boiling water, the temperature is raised to the high temperature test temperature, and the gap width is recorded; then the temperature-distance data is obtained through a formula, and a temperature-distance curve is drawn to finally determine the reference value. In this way, the preset reference value provides a scientific and reasonable basis for the quality control of the reed switch, ensuring the reliability and safety of the product in actual use.

[0087] In order to facilitate the understanding of the present invention, some preferred embodiments of the present invention are further described below.

[0088] In one embodiment, machine vision is used to scan the surface of the reed switch and perform image analysis, and bubbles or structural defects are detected, and the reed switch is determined to be unqualified. Using a high-resolution camera or other suitable image acquisition equipment, the details of the surface of the reed switch can be captured. The acquired image data will be input into the image analysis software for processing. The software will process the image and identify the features in the image, such as edges, shapes, color changes, etc. The image analysis software will check whether there are abnormalities in the image, such as bubbles, cracks, missing parts or other structural defects. These defects may be caused by mistakes in the production process or defects in the material itself. If any bubbles or structural defects are found during the image analysis process, the reed switch is judged to be unqualified. This means that the reed switch cannot meet the quality standards and may affect its function or life. Through the above steps, machine vision technology can efficiently and accurately detect the surface quality of the reed switch, which helps to realize automated detection on the production line, improve detection efficiency, reduce human errors, and also helps to accumulate a large number of defective samples. Through continuous learning and optimization of algorithms, the accuracy and reliability of detection can be further improved. With the development of technology, machine vision systems can also be combined with other testing methods to jointly ensure the overall quality of reed switches.

[0089] In another embodiment, the reed switch internal pressure is used to If the pressure is less than the first critical pressure value or the second critical pressure value, it indicates that the reed switch is not sealed. Otherwise, the reed switch is determined to be a reed switch with qualified sealing performance, wherein the first critical pressure value and the second critical pressure value are respectively the airtightness value detected by the airtightness tester when the pressure of the reed switch is greater than the first critical pressure value and reaches the first preset pressure after the reed switch is inflated with the test pressure of the reed switch at the preset temperature or the high temperature test temperature, and the airtightness value detected by the airtightness tester when the reed switch is inflated with the test pressure of the reed switch at the preset temperature or the high temperature test temperature and reaches the second preset pressure; wherein the first preset pressure is greater than or equal to a preset value; wherein the preset value and is an inverse relationship; the second pressure threshold is less than a preset value, the is a fixed value; The smaller it is, the smaller the preset value is.

[0090] In summary, the present invention discloses a method for detecting defects in a reed switch. By detecting the distance between the fixed contact piece and the base and comparing it with a preset reference value, it is possible to accurately determine whether the reed switch is qualified. This allows the identification of problematic products at an early stage, prevents them from entering the market, and ensures product quality. The method uses the bending of the end of the moving contact reed of the reed switch at a preset temperature and a high temperature test temperature, combined with the change in the gap width to calculate the distance at the high temperature test temperature. Such a detection process is relatively simple, easy to operate, and reduces the complexity of detection. At the same time, since the moving contact reed of the reed switch has good elastic properties, even if the gap width is very small, it can be accurately determined whether it is qualified by this method, thereby improving the sensitivity and reliability of the detection. The detection method is not only applicable to the design of a specific fixed contact piece and a base, but can also be applied to reed switches in other design schemes. It has high versatility and flexibility and is applicable to the design of a variety of reed switches. The present invention not only improves the quality level of the reed switch, but also brings significant advantages to production and quality control, ensuring the reliability and performance stability of the product in various use environments.

[0091] Reference Figure 2 The second embodiment of the present invention provides a reed switch defect detection device, comprising:

[0092] An expansion coefficient module, used to obtain the expansion coefficient of the reed switch;

[0093] An air pressure testing module, used to obtain a first air pressure drop value after the sealed reed switch is inflated and a second air pressure drop value after the unsealed reed switch is inflated by using an air pressure testing device;

[0094] A gap width module, for obtaining a first gap width and a second gap width between the end of the moving contact spring and the stationary contact according to the first pressure drop value and the second pressure drop value;

[0095] A first distance module, for obtaining, according to the first gap width and the second gap width, a first deformation distance from the moving contact piece to the stationary contact piece after the end of the moving contact piece spring piece is deformed at a preset high temperature test temperature by a preset contact piece distance formula;

[0096] A second distance module, for obtaining a second deformation distance between the fixed contact piece and the base according to the expansion coefficient, the first gap width and the second gap width through a quantitative relationship model of the moving contact piece spring;

[0097] The qualified judgment module is used to compare the distance from the moving contact piece to the static contact piece and the distance from the fixed contact piece to the base with preset reference values ​​respectively, and judge that it is qualified when the first deformation distance and the second deformation distance are both greater than the distance reference value.

[0098] Preferably, the expansion coefficient module is used for:

[0099] The expansion coefficient of the reed switch is obtained; wherein the reed switch includes a moving contact spring, a moving contact, a stationary contact, a fixed contact and a base.

[0100] Preferably, the air pressure testing module is used to:

[0101] The air pressure test device is used to obtain a first air pressure drop value after the sealed reed switch is inflated and a second air pressure drop value after the unsealed reed switch is inflated, including:

[0102] Obtain the internal pressure of the unsealed reed switch ;

[0103] Filling the unsealed reed switch with gas of a preset pressure to obtain a second gas pressure drop value;

[0104] The sealed reed switch is filled with gas of a preset pressure to obtain a first gas pressure drop value.

[0105] Preferably, the gap width module is used for:

[0106] According to the first air pressure drop value and the second air pressure drop value, a first gap width and a second gap width between the end of the moving contact spring and the stationary contact are obtained, including:

[0107] The temperature of the unsealed magnetic reed switch is raised to a preset high temperature, and the first pressure drop value is used as the first gap width between the end of the moving contact reed and the stationary contact ;

[0108] The temperature of the sealed magnetic reed switch is raised to a preset high temperature, and the second pressure drop value is used as the second gap width between the end of the moving contact reed and the stationary contact .

[0109] Preferably, the first distance module is used for:

[0110] According to the first gap width and the second gap width, a first deformation distance from the moving contact piece to the stationary contact piece after the end of the moving contact piece spring is deformed at a preset high temperature test temperature is obtained by a preset contact piece distance formula, including:

[0111] The first deformation distance from the moving contact piece to the stationary contact piece after deformation at high temperature test temperature is calculated by the following formula:

[0112]

[0113] in is the first deformation distance, is the first gap width, is the second gap width, is the initial distance from the moving contact spring to the stationary contact after deformation at a preset room temperature, It is the distance from the end of the moving contact spring to the stationary contact after deformation at preset high temperature.

[0114] Preferably, the second distance module is used for:

[0115] According to the expansion coefficient, the first gap width and the second gap width, a second deformation distance between the fixed contact piece and the base is obtained through a quantitative relationship model of the moving contact piece spring, including:

[0116] Get the distance between the base and the fixed contact piece ;

[0117] Get the initial distance between the moving contact piece and the stationary contact piece

[0118] According to the quantitative relationship model of the moving contact spring:

[0119]

[0120]

[0121]

[0122] get ;

[0123] The expansion coefficient of the moving contact spring is ε; the expansion coefficient of the stationary contact is ; The expansion coefficient of the base is ; The expansion coefficient of the moving contact piece is ; is the second deformation distance.

[0124] Preferably, the qualification judgment module is used to:

[0125] The distance between the moving contact piece and the stationary contact piece and the distance between the fixed contact piece and the base are respectively compared with preset reference values. When both the first deformation distance and the second deformation distance are greater than the distance reference values, it is determined to be qualified, and further includes:

[0126] When one of the first deformation distance or the second deformation distance is smaller than the distance reference value, it is determined to be unqualified, wherein the distance reference value is the distance between the fixed contact piece and the base under a preset high temperature;

[0127] By using machine vision, the surface of the reed switch is scanned and image analysis is performed, bubbles or structural defects are detected, and the reed switch is determined to be unqualified.

[0128] It should be noted that a reed switch defect detection device provided in an embodiment of the present invention is used to execute all process steps of a reed switch defect detection method in the above embodiment, and the working principles and beneficial effects of the two correspond one to one, so they will not be repeated here.

[0129] The embodiment of the present invention also provides an electronic device. The electronic device includes: a processor, a memory, and a computer program stored in the memory and executable on the processor, such as a qualification judgment program. When the processor executes the computer program, the steps in the above-mentioned embodiments of the reed switch defect detection method are implemented, such as Figure 1 Alternatively, when the processor executes the computer program, the functions of the modules / units in the above-mentioned device embodiments are realized, such as the second distance module.

[0130] Exemplarily, the computer program may be divided into one or more modules / units, which are stored in the memory and executed by the processor to implement the present invention. The one or more modules / units may be a series of computer program instruction segments capable of implementing specific functions, which are used to describe the execution process of the computer program in the electronic device.

[0131] The electronic device may be a computing device such as a desktop computer, a notebook, a PDA, and a smart tablet. The electronic device may include, but is not limited to, a processor and a memory. Those skilled in the art will appreciate that the above components are merely examples of electronic devices and do not constitute a limitation on the electronic device. The electronic device may include more or fewer components than the above components, or may combine certain components, or different components. For example, the electronic device may also include input and output devices, network access devices, buses, etc.

[0132] The processor may be a central processing unit (CPU), other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc. The processor is the control center of the electronic device, and uses various interfaces and lines to connect various parts of the entire electronic device.

[0133] The memory can be used to store the computer program and / or module, and the processor realizes various functions of the electronic device by running or executing the computer program and / or module stored in the memory, and calling the data stored in the memory. The memory can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, an application required for at least one function (such as a sound playback function, an image playback function, etc.), etc.; the data storage area can store data created according to the use of the mobile phone (such as audio data, a phone book, etc.), etc. In addition, the memory can include a high-speed random access memory, and can also include a non-volatile memory, such as a hard disk, a memory, a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), at least one disk storage device, a flash memory device, or other volatile solid-state storage devices.

[0134] Wherein, if the module / unit integrated in the electronic device is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on such an understanding, the present invention implements all or part of the processes in the above-mentioned embodiment method, and can also be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium, and the computer program can implement the steps of the above-mentioned various method embodiments when executed by the processor. Wherein, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may include: any entity or device capable of carrying the computer program code, recording medium, U disk, mobile hard disk, disk, optical disk, computer memory, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), electric carrier signal, telecommunication signal and software distribution medium. It should be noted that the content contained in the computer-readable medium can be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, computer-readable media do not include electric carrier signals and telecommunication signals.

[0135] It should be noted that the device embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. In addition, in the accompanying drawings of the device embodiments provided by the present invention, the connection relationship between the modules indicates that there is a communication connection between them, which may be specifically implemented as one or more communication buses or signal lines. A person of ordinary skill in the art may understand and implement it without paying any creative effort.

[0136] The specific embodiments described above further illustrate the purpose, technical solutions and beneficial effects of the present invention. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the scope of protection of the present invention. It is particularly pointed out that for those skilled in the art, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of protection of the present invention.

Claims

1. A reed switch defect detection method, characterized in that: include: Obtaining the expansion coefficient of the reed switch; wherein the reed switch comprises a moving contact spring, a moving contact, a stationary contact, a fixed contact and a base; Using an air pressure testing device to obtain a first air pressure drop value after the sealed reed switch is inflated and a second air pressure drop value after the unsealed reed switch is inflated; According to the first air pressure drop value and the second air pressure drop value, a first gap width and a second gap width between the end of the moving contact spring and the stationary contact are obtained; According to the first gap width and the second gap width, a first deformation distance from the moving contact piece to the stationary contact piece after the end of the moving contact piece spring is deformed at a preset high temperature test temperature is obtained by using a preset contact piece distance formula; According to the expansion coefficient, the first gap width and the second gap width, a second deformation distance between the fixed contact piece and the base is obtained through a quantitative relationship model of the movable contact piece; Compare the first deformation distance and the second deformation distance with preset distance reference values ​​respectively, and when both the first deformation distance and the second deformation distance are greater than the distance reference values, determine that the reed switch is qualified; Wherein, obtaining the first gap width and the second gap width between the end of the moving contact spring and the stationary contact according to the first air pressure drop value and the second air pressure drop value includes: Raising the temperature of the unsealed magnetic reed switch to a preset high temperature, and using the first air pressure drop value as the first gap width between the end of the moving contact reed and the stationary contact; Raising the temperature of the sealed magnetic reed switch to a preset high temperature, and using the second pressure drop value as the second gap width between the end of the moving contact reed and the stationary contact; Wherein, according to the expansion coefficient, the first gap width and the second gap width, the second deformation distance between the fixed contact piece and the base is obtained through the quantitative relationship model of the moving contact piece spring, including: Get the distance between the base and the fixed contact piece ; Get the initial distance between the moving contact piece and the stationary contact piece According to the quantitative relationship model of the moving contact spring: get ; The expansion coefficient of the moving contact spring is ε; the expansion coefficient of the stationary contact is ; The expansion coefficient of the base is ; The expansion coefficient of the moving contact is ; is the second deformation distance.

2. The reed switch defect detection method according to claim 1, characterized in that: The base is fixedly connected to the fixed contact piece; one end of the moving contact piece is fixed to one end of the moving contact piece spring to form a moving contact member, and the moving contact member is arranged between the base and the fixed contact piece; the other end of the moving contact piece spring is arranged between the static contact piece and the base; the static contact piece is fixed on the fixed contact piece.

3. The reed switch defect detection method according to claim 1, characterized in that: The method of using the air pressure testing device to obtain a first air pressure drop value after the sealed reed switch is inflated and a second air pressure drop value after the unsealed reed switch is inflated includes: obtaining an internal pressure of the unsealed reed switch; Filling the unsealed reed switch with gas of a preset pressure to obtain a second gas pressure drop value; The sealed reed switch is filled with gas of a preset pressure to obtain a first gas pressure drop value.

4. The reed switch defect detection method according to claim 1, characterized in that: The first deformation distance from the moving contact piece to the stationary contact piece after the end of the moving contact piece spring is deformed at a preset high temperature test temperature is obtained according to the first gap width and the second gap width by using a preset contact piece distance formula, including: The first deformation distance from the moving contact piece to the stationary contact piece after deformation at high temperature test temperature is calculated by the following formula: in is the first deformation distance, is the first gap width, is the second gap width, is the initial distance from the moving contact spring to the stationary contact after deformation at a preset room temperature, It is the distance from the end of the moving contact spring to the stationary contact after deformation at preset high temperature.

5. The reed switch defect detection method according to claim 1, characterized in that: The distance between the moving contact piece and the stationary contact piece and the distance between the fixed contact piece and the base are respectively compared with preset reference values. When both the first deformation distance and the second deformation distance are greater than the distance reference values, after judging as qualified, the method further includes: When one of the first deformation distance or the second deformation distance is smaller than the distance reference value, it is determined to be unqualified, wherein the distance reference value is the distance between the fixed contact piece and the base under a preset high temperature; By using machine vision, the surface of the reed switch is scanned and image analysis is performed, bubbles or structural defects are detected, and the reed switch is determined to be unqualified.

6. A reed switch defect detection device, characterized in that: include: An expansion coefficient module, used to obtain the expansion coefficient of the reed switch; wherein the reed switch includes a moving contact spring, a moving contact, a stationary contact, a fixed contact and a base; An air pressure testing module, used to obtain a first air pressure drop value after the sealed reed switch is inflated and a second air pressure drop value after the unsealed reed switch is inflated by using an air pressure testing device; A gap width module, for obtaining a first gap width and a second gap width between the end of the moving contact spring and the stationary contact according to the first pressure drop value and the second pressure drop value; A first distance module, for obtaining, according to the first gap width and the second gap width, a first deformation distance from the moving contact piece to the stationary contact piece after the end of the moving contact piece spring piece is deformed at a preset high temperature test temperature by a preset contact piece distance formula; A second distance module, for obtaining a second deformation distance between the fixed contact piece and the base according to the expansion coefficient, the first gap width and the second gap width through a quantitative relationship model of the moving contact piece spring; A qualified judgment module, used for comparing the first deformation distance and the second deformation distance with preset distance reference values ​​respectively, and judging that the reed switch is qualified when both the first deformation distance and the second deformation distance are greater than the distance reference values; Wherein, obtaining the first gap width and the second gap width between the end of the moving contact spring and the stationary contact according to the first air pressure drop value and the second air pressure drop value includes: Raising the temperature of the unsealed magnetic reed switch to a preset high temperature, and using the first air pressure drop value as the first gap width between the end of the moving contact reed and the stationary contact; Raising the temperature of the sealed magnetic reed switch to a preset high temperature, and using the second pressure drop value as the second gap width between the end of the moving contact reed and the stationary contact; Wherein, according to the expansion coefficient, the first gap width and the second gap width, the second deformation distance between the fixed contact piece and the base is obtained through the quantitative relationship model of the moving contact piece spring, including: Get the distance between the base and the fixed contact piece ; Get the initial distance between the moving contact piece and the stationary contact piece According to the quantitative relationship model of the moving contact spring: get ; The expansion coefficient of the moving contact spring is ε; the expansion coefficient of the stationary contact is ; The expansion coefficient of the base is ; The expansion coefficient of the moving contact is ; is the second deformation distance.

7. An electronic device, characterized in that: The invention comprises a processor, a memory, and a computer program stored in the memory and configured to be executed by the processor, wherein the processor implements the reed switch defect detection method according to any one of claims 1 to 5 when executing the computer program.

8. A computer-readable storage medium, characterized in that: The computer-readable storage medium includes a stored computer program, wherein when the computer program is executed, the device where the computer-readable storage medium is located is controlled to execute the reed switch defect detection method according to any one of claims 1 to 5.

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