Display panel, display device, and method for manufacturing display panel

Abstract

The present application relates to a display panel, a display device and a method for preparing a display panel, wherein the display panel comprises: a substrate; a driving circuit layer located on the substrate; a first electrode located on the driving circuit layer; a pixel definition layer located on a side of the first electrode away from the substrate; the pixel definition layer is patterned to form a pixel opening and a partition groove; the pixel opening exposes the first electrode; the partition groove is located between adjacent pixel openings; the inner diameter of the partition groove gradually decreases in a direction away from the substrate; a light-emitting functional layer formed on the pixel definition layer; at least part of the light-emitting functional layer is disconnected at the side wall of the partition groove; wherein the driving circuit layer includes a reflective structure; in a direction perpendicular to the substrate, the reflective structure at least partially overlaps with the side wall of the partition groove. Based on the above scheme, the present application can avoid the light-emitting functional layers between adjacent light-emitting devices from being connected to each other to generate lateral leakage current, thereby improving the display effect of the display panel.

Description

Technical Field

[0001] The present application relates to the technical field of display panels, and in particular to a display panel, a display device, and a method for manufacturing a display panel. Background Art

[0002] OLED, or Organic Light-Emitting Diode, is also called an organic electroluminescent device. It refers to the phenomenon that the luminescent material emits light through carrier injection and recombination under the drive of an electric field.

[0003] The organic light emitting diode (OLED) display panel includes a light emitting device, which includes an anode, a light emitting layer, a light emitting functional layer (exemplarily, an electron transport layer, a hole transport layer, etc.) and a cathode. The light emitting layers of each light emitting device are independent of each other, but the light emitting functional layers are interconnected. The interconnected light emitting functional layers will cause lateral leakage current between the light emitting functional layers corresponding to different light emitting devices, which will eventually affect the display effect of the display panel. Summary of the invention

[0004] In order to solve the above technical problems, the present application provides a display panel, a display device and a method for manufacturing a display panel.

[0005] In a first aspect, the present application provides a display panel, comprising:

[0006] substrate;

[0007] a driving circuit layer located on the substrate;

[0008] a first electrode located on the driving circuit layer;

[0009] A pixel definition layer located on a side of the first electrode away from the substrate; the pixel definition layer is patterned to form a pixel opening and a partition groove; the pixel opening exposes the first electrode; the partition groove is located between adjacent pixel openings; and the inner diameter of the partition groove gradually decreases in a direction away from the substrate;

[0010] A light-emitting functional layer is formed on the pixel definition layer; at least a portion of the light-emitting functional layer is disconnected at the sidewall of the partition groove;

[0011] The driving circuit layer includes a reflective structure; in a direction perpendicular to the substrate, the reflective structure at least partially overlaps with a side wall of the partition groove.

[0012] In a second aspect, based on the same inventive concept, the present application also provides a display device, comprising a display panel as described in any one of the first aspects.

[0013] In a third aspect, based on the same inventive concept, the present application also provides a method for preparing a display panel, comprising:

[0014] forming a driving circuit layer on a substrate, wherein the driving circuit layer includes a reflective structure;

[0015] forming a first electrode on the driving circuit layer;

[0016] A pixel definition layer is formed on the first electrode, and the pixel definition layer is patterned into a pixel opening and a partition groove by exposure, development and etching; wherein the pixel opening exposes the first electrode; the partition groove is located between adjacent pixel openings; the reflective structure at least partially overlaps with the sidewall of the partition groove; and the inner diameter of the partition groove gradually decreases in a direction away from the substrate;

[0017] A light-emitting functional layer is formed on the pixel definition layer, wherein at least a portion of the light-emitting functional layer is disconnected at a sidewall of the partition groove.

[0018] Compared with the prior art, the technical solution provided by this application has the following advantages:

[0019] In the display panel provided by the present application, the pixel definition layer is provided with a pixel opening and a partition groove, wherein the partition groove is located between adjacent pixel openings. The driving circuit layer includes a reflective structure, and the reflective structure and the side wall of the partition groove of the pixel definition layer overlap at least partially. Therefore, when exposing the pixel definition layer, due to the reflection effect of the reflective structure on light, the exposure amount of the pixel definition layer at the corresponding position of the reflective structure is greater, forming an exposure enhancement area. In the process of developing and etching the pixel definition layer to form the partition groove, the etching rate of the exposure enhancement area is faster, so that the inner diameter of the partition groove gradually decreases in the direction away from the substrate. When the light-emitting functional layer is formed by full-surface evaporation, since the inner diameter of the partition groove gradually decreases in the direction away from the substrate, at least part of the light-emitting functional layer will be disconnected at the side wall of the partition groove. Since at least part of the light-emitting functional layer is disconnected at the side wall of the partition groove, the problem of lateral leakage current between light-emitting devices through the light-emitting functional layer can be avoided, thereby improving the display effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0022] Figure 1 A schematic diagram of the structure of a display panel provided in an embodiment of the present application;

[0023] Figure 2 A schematic diagram of the principle of forming a partition groove provided in an embodiment of the present application;

[0024] Figure 3 A schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0025] Figure 4 A schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0026] Figure 5 A schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0027] Figure 6 A schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0028] FIG. 7( a ) is a schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0029] FIG7( b ) is an enlarged view of a region of FIG7( a );

[0030] Figure 8 It is another enlarged view of the region of FIG7( a );

[0031] Fig. 9 A schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0032] Fig.10 A schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0033] Fig.11 A schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0034] Fig.12 A schematic diagram of the structure of a display device provided in an embodiment of the present application;

[0035] Fig.13 A schematic flow chart of a method for manufacturing a display panel provided in an embodiment of the present application;

[0036] Fig.14A schematic diagram of a process for forming a driving circuit layer on a substrate provided in an embodiment of the present application;

[0037] Figure 15(a)-Figure 15(k) A schematic cross-sectional view of a display panel in a preparation process provided in an embodiment of the present application.

[0038] Reference numerals:

[0039] 000, substrate; 100, driving circuit layer; 101, first electrode; PDL, pixel definition layer; 102, pixel opening; 103, partition groove; 200, light-emitting functional layer; 201, hole injection layer; 202, hole transport layer; 203, electron transport layer; 204, electron injection layer; 300, light-emitting device; 301, light-emitting layer; 104, reflective structure; 400, exposure enhancement area; 1041, reflective metal wiring; 105, second electrode; 1042, notch; 500, virtual wiring; 600, fracture ; PVDD, positive power signal line; AA, display area; NA, non-display area; CE, middle area; ED, edge area; 106, data line; 107, adapter line; 108, connecting part; PLN1, first insulating layer; PLN2, second insulating layer; 109, first through hole; 110, second through hole; 111, reflective metal layer; 112, semi-transparent and semi-reflective metal layer; POLY, active layer; M1, first metal layer; M2, second metal layer; M3, third metal layer; M4, fourth metal layer; 113, third through hole. DETAILED DESCRIPTION

[0040] In order to more clearly understand the above-mentioned purposes, features and advantages of the present application, the scheme of the present application will be further described below. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0041] In the following description, many specific details are set forth to facilitate a full understanding of the present application, but the present application may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only part of the embodiments of the present application, rather than all of the embodiments.

[0042] It is obvious to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention. Therefore, the present invention is intended to cover modifications and variations of the present invention that fall within the scope of the corresponding claims (technical solutions claimed for protection) and their equivalents. It should be noted that the implementation methods provided in the embodiments of the present invention can be combined with each other without contradiction.

[0043] The display panel, the display device and the method for manufacturing the display panel provided in the embodiments of the present application are exemplarily described below with reference to the accompanying drawings.

[0044] In some existing technical solutions, an organic light emitting diode (OLED) display panel includes a light emitting device, which includes an anode, a light emitting layer, a light emitting functional layer (exemplarily, an electron transport layer, a hole transport layer, etc.) and a cathode. The light emitting layers of each light emitting device are independent of each other, but the light emitting functional layers are interconnected. The interconnected light emitting functional layers will cause lateral leakage current between the light emitting functional layers corresponding to different light emitting devices, which will eventually affect the display effect of the display panel.

[0045] Based on this, embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel. Figure 1 A schematic diagram of the structure of a display panel provided in an embodiment of the present application includes:

[0046] Substrate 000.

[0047] The driving circuit layer 100 is located on the substrate 000 .

[0048] The first electrode 101 is located on the driving circuit layer 100 .

[0049] The pixel definition layer PDL is located on the side of the first electrode 101 away from the substrate 000. The pixel definition layer PDL is patterned to form a pixel opening 102 and a partition groove 103. The pixel opening 102 exposes the first electrode 101. The partition groove 103 is located between adjacent pixel openings 102. Along the direction away from the substrate 000, the inner diameter of the partition groove 103 gradually decreases.

[0050] The light emitting function layer 200 is formed on the pixel definition layer PDL. At least a portion of the light emitting function layer 200 is disconnected at the sidewall of the partition groove 103.

[0051] The driving circuit layer 100 includes a reflective structure 104. In a direction perpendicular to the substrate 000, the reflective structure 104 at least partially overlaps with a sidewall of the partition groove 103.

[0052] like Figure 1As shown, for the sake of simplicity of illustration and description, some film layer structures in the display panel are omitted in at least part of the illustrations of the embodiments of the present application. Among them, the substrate 000 can be a rigid substrate such as glass, or a flexible substrate such as PI. The specific material of the substrate 000 can be selected according to actual design requirements, and the embodiments of the present application do not make specific limitations. The driving circuit layer 100 is used to provide a driving signal to the first electrode 101. The various light-emitting devices 300 of the display panel can be arranged in an array. The light-emitting device 300 also includes a light-emitting layer 301, and the light-emitting layer 301 is located in the pixel opening 102. The pixel opening 102 of the pixel definition layer PDL is used to define the light-emitting area of ​​the light-emitting device 300. The light-emitting function layer 200 may, for example, include the following: Figure 1 The hole injection layer 201, the hole transport layer 202, the electron transport layer 203 and the electron injection layer 204 shown in FIG.

[0053] Figure 2 This is a schematic diagram of the principle of forming a partition groove provided in an embodiment of the present application. Figure 1 as well as Figure 2 , the driving circuit layer 100 ( Figure 2 The reflective structure 104 is not shown in the figure. The reflective structure 104 has a reflective effect on the light that exposes the pixel definition layer PDL. When exposing the pixel definition layer PDL, the position where the reflective structure 104 is located has a greater exposure amount of the pixel definition layer PDL due to the reflective effect of the reflective structure 104, forming an exposure enhancement area 400. Then, when the pixel definition layer PDL is subsequently developed and etched, the etching rate of the exposure enhancement area 400 is faster. Therefore, in the embodiment of the present application, the reflective structure 104 is arranged to overlap at least partially with the sidewall of the partition groove 103, so that the sidewall of the partition groove 103 is at least partially overlapped with the sidewall of the partition groove 103 in the direction away from the substrate ( Figure 2 The inner diameter of the partition groove 103 gradually decreases. Figure 1 Due to the morphology of the partition groove 103, when the light-emitting functional layer 200 is evaporated on the entire surface, at least part of the light-emitting functional layer 200 can be disconnected at the side wall of the partition groove 103. Since at least part of the light-emitting functional layer 200 can be disconnected at the side wall of the partition groove 103, the light-emitting functional layers 200 of adjacent light-emitting devices 300 are disconnected, so that the problem of lateral leakage current between the light-emitting devices 300 through the light-emitting functional layer 200 can be avoided, thereby improving the display effect of the display panel.

[0054] It should be noted that, in the descriptions of the above and below in the embodiments of the present application, unless otherwise specified, the above in the embodiments of the present application generally refers to the side away from the substrate 000, and the below generally refers to the side close to the substrate 000. Figure 1The middle pixel opening 102 is filled with the light emitting layer 301 and the light emitting functional layer 200 , so the reference numeral of the pixel opening 102 is exemplarily marked at the location of the light emitting functional layer 200 .

[0055] One of the purposes of the embodiment of the present application is to form a partition groove 103 having a characteristic of gradually decreasing inner diameter in a direction away from the substrate 000. In order to achieve this purpose, the embodiment of the present application provides a reflective structure 104. The reflective structure 104 is defined as a functional structure capable of reflecting light. It can be a metal layer capable of achieving a reflective effect, etc., which is not limited here.

[0056] Figure 3 A schematic diagram of the structure of another display panel provided by an embodiment of the present application. In some embodiments, the reflective structure 104 is disposed around the pixel opening 102. In a direction perpendicular to the substrate, the pixel opening 102 is located in the area surrounded by the reflective structure 104.

[0057] like Figure 3 As shown, in the embodiment of the present application, a circle of reflective structures 104 can be set around the pixel opening 102, and two groups of reflective structures 104 are equivalent to being set between adjacent pixel openings 102. Since the exposure enhancement area can be formed at the location of the reflective structure 104, the etching rate of the pixel definition layer corresponding to the exposure enhancement area can be made faster, and the reflective structure 104 at least partially overlaps with the side wall of the partition groove, so the partition groove formed by the above structure gradually decreases in the direction away from the substrate. When the light-emitting functional layer is subsequently formed above the pixel definition layer, at least part of the light-emitting functional layer can be disconnected at the side wall of the partition groove, thereby avoiding the problem of lateral leakage current between light-emitting devices through the light-emitting functional layer, thereby improving the display effect of the display panel.

[0058] Since the reflective structure 104 is arranged around the pixel opening 102, for the pixel opening 102 area, it actually forms a partition groove arranged around the pixel opening 102. Therefore, it is possible to avoid the generation of lateral leakage current between the light-emitting functional layers of adjacent light-emitting devices from all directions, thereby avoiding the problem of affecting the display effect of the display panel.

[0059] Figure 4 A schematic diagram of another display panel structure provided for the implementation of the present application. In some embodiments, the reflective structure 104 includes two reflective metal wirings 1041 located between adjacent pixel openings 102. The reflective metal wirings 1041 along the pixel row direction and the pixel column direction are connected to form a grid.

[0060] like Figure 4 As shown, in the embodiment of the present application, two reflective metal traces 1041 can be arranged in adjacent pixel openings 102, and the cross-sectional structure thereof is similar to Figure 1, a partition groove whose inner diameter gradually decreases in a direction away from the substrate can also be formed between adjacent pixel openings 102.

[0061] After the reflective metal wiring 1041 extends along the row direction and the column direction, it can form a reflective structure 104 arranged around the pixel opening 102, and further form a partition groove arranged around the pixel opening 102, so as to avoid leakage between the light-emitting functional layers between adjacent light-emitting devices from all directions, thereby avoiding the problem of affecting the display effect of the display panel.

[0062] Figure 5 A schematic diagram of the structure of another display panel provided in an embodiment of the present application. In some embodiments, a second electrode 105 is further included, and the second electrode 105 is located on the side of the light-emitting functional layer away from the substrate. A notch 1042 is provided in the reflective structure 104 between adjacent pixel openings 102. The second electrodes 105 corresponding to adjacent pixel openings 102 are connected at the notch 1042.

[0063] Specifically, Figure 1 The first electrode 101 is generally an anode, and the second electrode 105 disposed on the side of the light-emitting functional layer away from the substrate is generally a cathode. The cathode generally presents a whole-surface structure, and in order to ensure that the cathode potential is consistent, the cathode generally needs to be set as a whole-surface structure.

[0064] Since an isolation groove is provided between adjacent light-emitting devices, the inner diameter of the isolation groove gradually decreases in the direction away from the substrate, so the entire film layer prepared after the pixel definition layer will be disconnected at the side wall of the isolation groove. Since the potential of the second electrode 105 of each light-emitting device is consistent, in order to avoid the isolation groove separating the second electrode 105 of each light-emitting device, such as Figure 5 As shown, in this embodiment, the reflective structure 104 between adjacent pixel openings 102 is provided with a notch 1042, so that the second electrode 105 prepared above the pixel definition layer can be connected at the notch 1042 to achieve interconnection of the second electrodes 105 of each light-emitting device to maintain consistent potential.

[0065] In addition, even if the light-emitting functional layer at the position of the notch 1042 is connected together due to the existence of the notch 1042, since the connection area of ​​the electrode layer corresponding to the notch 1042 is relatively small, the leakage current generated by the light-emitting functional layer at the position of the notch 1042 is very small, and the display effect of the display panel is slightly affected.

[0066] In summary, the embodiment of the present application can realize the electrical connection of the second electrodes 105 of each light-emitting device based on the above solution, while avoiding leakage current, or at least ensuring that the leakage current generated is very small, thereby improving the display effect of the display panel.

[0067] Figure 6 In some embodiments, when the gaps 1042 between adjacent pixel openings 102 are located at two reflective metal traces 1041, the gaps 1042 have an angle of less than 90° with the pixel arrangement direction in the connection direction parallel to the substrate 000.

[0068] When the distance between the two notches 1042 is short, adjacent light-emitting devices are prone to generate leakage current between the short paths between the two notches 1042 , which may affect the display effect of the display panel.

[0069] In order to further reduce leakage current, the embodiment of the present application makes the angle between the connecting line between the gaps 1042 and the pixel arrangement direction smaller than 90°. Figure 6 The gaps 1042 of the two reflective metal traces 1041 are exemplarily illustrated in the connection direction L1 parallel to the substrate, the first pixel arrangement direction L2, and the second pixel arrangement direction L3, and the angle between the connection direction L1 and the first pixel arrangement direction L2 is indicated as β, and the angle between the connection L1 and the second pixel arrangement direction L3 is indicated as γ. In the embodiment of the present application, β and / or γ are set to be less than 90°, so that the connection distance between the gaps 1042 corresponding to the two reflective metal traces 1041 between adjacent pixel openings 102 can be as large as possible, that is, the two gaps 1042 are not in a straight line parallel to the pixel arrangement direction, thereby increasing the distance of the current transmission path. Under the effect of the impedance of the light-emitting functional layer itself, the longer the transmission path of the electrons, the smaller the leakage current transmitted to the light-emitting functional layer of the light-emitting device adjacent to it, and the more conducive to reducing the leakage current caused by the presence of the gaps 1042.

[0070] It should be noted that although Figure 6 The structure and Figure 4 The structures in FIG. 1 are similar except for the notch 1042, and can be considered to be two reflective metal traces 1041 arranged between adjacent pixel openings 102 along the row direction and the column direction. However, it should be understood that this is only because the embodiment of the present application must necessarily illustrate the implementation through a certain structure. The notch 1042 is not limited to Figure 6 In the structure shown in FIG. 1 , the position of the notch 1042 can be flexibly set, and the shape of the reflective structure 104 can also be flexibly set. For example, the reflective structure 104 can also be Figure 3 The shape of the.

[0071] In summary, the embodiment of the present application can reduce the leakage current generated by the existence of the notch 1042 based on the above technical solution, and improve the display effect of the display panel.

[0072] FIG. 7(a) is a schematic diagram of the structure of another display panel provided in an embodiment of the present application. FIG. 7(b) is an enlarged view of the DD' area in FIG. 7(a). In some embodiments, the display panel includes a display area AA and a non-display area NA located on opposite sides of the display area AA, and the non-display area NA and the display area AA are arranged along a first direction. The display area AA includes an edge area ED and a middle area CE, and the edge area ED is closer to the non-display area NA than the middle area CE.

[0073] The display panel also includes a plurality of data lines 106 and adapter lines 107. The data lines 106 extend along the second direction and are arranged along the first direction. The adapter lines 107 are electrically connected to the data lines 106 located in the edge area ED. The adapter lines 107 extend from the edge area ED to the middle area CE. Figure 7(a)-Figure 7(b) The first direction is indicated as the X direction, and the second direction is indicated as the Y direction. In the embodiment of the present application, at least part of the reflective structure 104 can be multiplexed as the adapter line 107 . Part of the reflective structure 104 is multiplexed as at least part of the adapter line 107 .

[0074] In the existing related technologies, the data lines in the display panel generally need to be connected to the driver chip at the bottom of the display panel through fan-out lines. For the fan-out lines, since the fan-out lines connect the driver chip and the data lines, the number of fan-out lines is large, and the fan-out lines need to have a certain angle to arrange enough fan-out lines between the driver chip and the display area, so that the fan-out lines occupy a large space in the vertical direction.

[0075] In order to compress the lower frame of the display panel, the embodiment of the present application adopts the method of setting a transfer line 107 in the display area AA, and the transfer line 107 is connected to the data line 106. The connection position is indicated by the shadow filled with a black circle in FIG7. The transfer line 107 and the data line 106 can be connected through a via hole. In FIG7, no connection is made at other overlapping positions. The data line 106 located in the edge area ED of the display area AA is led to the middle area CE (fanout in AA, FIAA) of the display area AA, thereby further compressing the lower frame of the display panel and reducing the width of the lower frame of the display panel. In addition, since part of the reflective structure 104 is reused as part of the transfer line 107, it is also possible to avoid the problem of additionally preparing a new film layer to form the transfer line 107, which leads to an increase in the display panel process and an increase in the thickness of the display panel.

[0076] Figure 8 7( a ) is another enlarged view of the region. In some embodiments, the partial reflective structure 104 is reused as a virtual line 500 , and a break 600 exists between the virtual line 500 and the adapter line 107 .

[0077] The virtual wiring 500 is electrically connected to the constant voltage signal line of the display panel. The constant voltage signal line includes a positive power signal line, a negative power signal line or a reset signal line.

[0078] In addition to being partially multiplexed as the adapter line 107 , the reflective structure 104 of the embodiment of the present application can also partially multiplex the reflective structure 104 as a virtual line 500 connected to a constant voltage signal line in the display panel. Figure 8 In the figure, the virtual wiring 500 is schematically connected to the positive power signal line PVDD through a via hole, and the via hole is schematically shown as a black filled circle. It should be noted that, Figure 8 In order to simplify the diagram as much as possible, only part of the positive power signal line PVDD is simply illustrated in the display area AA.

[0079] Since the adapter line 107 is connected to part of the data line 106 , in order to prevent the electrical signal of the virtual wiring 500 from affecting the signal transmitted on the adapter line 107 , a break 600 is provided between the virtual wiring 500 and the adapter line 107 .

[0080] In some scenarios, if the reflective structure 104 is made of metal, it is necessary to consider that the reflective structure 104 set in a floating state may accumulate static electricity, and excessive accumulation of static electricity will affect the display effect of the display panel. In the embodiment of the present application, part of the reflective structure 104 can be reused as a virtual routing. On the one hand, the static electricity accumulated in the virtual routing can be conducted through the constant voltage signal line to avoid the accumulation of static electricity in the virtual routing. On the second hand, since the virtual routing is connected to the constant voltage signal line, and the electrical signal in the constant voltage signal line is constant voltage, the accumulation of static electricity in the virtual routing has little effect on the voltage of the constant voltage signal in the constant voltage signal line, and has little effect on the display effect of the display panel. On the third hand, since the virtual routing is electrically connected to the constant voltage signal line, the cross-sectional area of ​​the transmission path of the constant voltage signal line can be increased to a certain extent. It can be seen from the impedance area calculation formula of the conductor that the impedance of the conductor is inversely proportional to the cross-sectional area of ​​its transmission path. Therefore, based on the above scheme, the impedance of the constant voltage signal line can be reduced, and then the voltage drop of the constant voltage signal line at different positions can be reduced, which can achieve the purpose of improving the display effect of the display panel.

[0081] In other embodiments, the virtual wiring may also be electrically connected to other constant voltage signal lines of the display panel, such as a negative power signal line PVEE or a reset signal line Vref. The negative power signal line PVEE is used to transmit a cathode signal to the second electrode of the light-emitting device, and the reset signal line Vref is used to provide a reset signal to the driving circuit layer.

[0082] Fig. 9This is a schematic diagram of the structure of another display panel provided in an embodiment of the present application. In some embodiments, the display panel further includes a connecting portion 108. The connecting portion 108 and the first electrode 101 are located in the same film layer.

[0083] A first insulating layer PLN1 is disposed between the first electrode 101 and the reflective structure 104 , and a second insulating layer PLN2 is disposed between the reflective structure 104 and the data line 106 .

[0084] The first insulating layer PLN1 includes a first through hole 109, and the first through hole 109 exposes the adapter line 107. The second insulating layer PLN2 includes a second through hole 110, and the second through hole 110 exposes the data line 106. The first through hole 109 is connected to the second through hole 110. The connecting portion 108 is located in the first through hole 109 and the second through hole 110, and electrically connects the adapter line 107 to the data line 106.

[0085] Specifically, the adapter line 107 is used to connect the data line 106 to the binding area at the bottom of the display panel. In this solution, when the reflective structure 104 is reused as the adapter line 107, the reflective structure 104 reused as the adapter line 107 needs to be electrically connected to the data line 106.

[0086] like Fig. 9 As shown, in the embodiment of the present application, the connection part 108 can be prepared simultaneously during the process of preparing the first electrode 101, that is, the connection part 108 is arranged in the same layer as the first electrode 101. Since the first insulating layer PLN1 and the second insulating layer PLN2 are actually in contact with each other, and the first through hole 109 and the second through hole 110 are interconnected, in the process of preparing the connection part 108, the connection part 108 can be overlapped on the exposed surface of the data line 106 on the one hand, can be overlapped on the exposed surface of the reflective structure 104 on the other hand, and can be arranged on the inner wall of the first through hole 109 and the second through hole 110 on the other hand. As a result, the purpose of electrically connecting the reflective structure 104 with the data line 106 through the connection part 108 is actually achieved.

[0087] In some embodiments, the first insulating layer PLN1 and the second insulating layer PLN2 are organic layers of the same material.

[0088] Depend on Fig. 9 It can be understood from the structure shown that the order of preparing the data line 106 (corresponding film layer), the first insulating layer PLN1, the second insulating layer PLN2, the reflective structure 104 (corresponding film layer) and the connecting part 108 (corresponding film layer) is: ① prepare the data line 106; ② prepare the second insulating layer PLN2; ③ prepare the reflective structure 104; ④ prepare the first insulating layer PLN1; ⑤ prepare the connecting part 108.

[0089] In the embodiment of the present application, the second insulating layer PLN2 is not subjected to separate etching to open holes after the entire surface is formed, but is directly prepared to form the reflective structure 104. After the reflective structure 104 is formed, the entire surface of the first insulating layer PLN1 is formed, and then etching to open holes is performed. Since the first insulating layer PLN1 and the second insulating layer PLN2 are made of the same organic material, and the pattern of the reflective structure 104 does not block the etching of the organic layer, the etching will directly penetrate the first insulating layer PLN1 and the second insulating layer PLN2, so that the upper surface of the data line 106 is exposed, and then the connecting portion 108 is formed. See Fig.10 The lower surface of the connecting portion 108 overlaps the upper surface of the reflective structure 104 multiplexed as the adapter line 107 and the upper surface of the data line 106 , thereby achieving electrical connection between the reflective structure 104 multiplexed as the adapter line 107 and the data line 106 .

[0090] In the embodiment of the present application, since the materials of the first insulating layer PLN1 and the second insulating layer PLN2 are the same, the same photomask can be used in the process of preparing the first through hole 109 and the second through hole 110, saving one mask process. The first insulating layer PLN1 and the second insulating layer PLN2 can be completed in one etching process instead of the two etching processes that originally required them, thereby simplifying the process flow.

[0091] Fig.10 A schematic diagram of another display panel structure provided by an embodiment of the present application. In some embodiments, a first insulating layer PLN1 between the first electrode 101 and the reflective structure 104 may be provided on a surface facing away from the substrate 000 , and a protrusion may be formed at the location of the reflective structure 104 .

[0092] Since a protrusion is formed on the surface of the first insulating layer PLN1 facing away from the substrate 000 at the location of the reflective structure 104, a sharp-angle structure can be formed at the junction of the side wall and the bottom surface of the partition groove 103. When the light-emitting functional layer 200 is evaporated, the light-emitting functional layer 200 is discontinuous at the junction of the side wall and the bottom surface of the partition groove 103, so that the light-emitting functional layer 200 of adjacent light-emitting devices is disconnected, thereby preventing leakage of the light-emitting functional layer 200 between adjacent light-emitting devices.

[0093] The embodiment of the present application does not limit the manner in which a protrusion is formed on the surface of the first insulating layer PLN1 facing away from the substrate 000 . For example, this can be achieved by providing a relatively thin first insulating layer PLN1 .

[0094] In some embodiments, the first insulating layer PLN1 is thinner than the second insulating layer PLN2.

[0095] like Fig.10 As shown, the embodiment of the present application can make the thickness of the first insulating layer PLN1 smaller than the thickness of the second insulating layer PLN2. Fig.10The thickness of the first insulating layer PLN1 is indicated as h1, and the thickness of the second insulating layer PLN2 is indicated as h2, where h1<h2. Since the thickness of the first insulating layer PLN1 is relatively thin, and a reflective structure 104 is provided on the side of the first insulating layer PLN1 facing the substrate 000, under the influence of these two factors, a certain protrusion is formed on the first insulating layer PLN1 at the position corresponding to the reflective structure 104.

[0096] The reflective structure 104 at least partially overlaps with the sidewall of the partition groove 103. Due to the reflective effect of the reflective structure 104, the pixel definition layer PDL at the corresponding position of the reflective structure 104 has a larger exposure amount. When the pixel definition layer PDL is subsequently developed and etched, the pixel definition layer PDL corresponding to the position with a larger exposure amount has a faster etching rate. Since the first insulating layer PLN1 is thinner than the second insulating layer PLN2, the first insulating layer PLN1 forms a bulge at the corresponding position of the reflective structure 104. When the pixel definition layer PDL is developed and etched to form the partition groove 103, the bottom surface of the partition groove 103 can also approximately form an upward convex shape, so that the light-emitting functional layer 200 is disconnected at the sidewall of the partition groove 103, thereby preventing the light-emitting functional layer 200 from leaking between adjacent light-emitting devices.

[0097] Continue to see Fig.10 In the display panel provided in the embodiment of the present application, the side wall of the partition groove 103 can be set to be concave arc-shaped. Since the side wall of the partition groove 103 is concave, when the light-emitting functional layer 200 is evaporated, the light-emitting functional layer 200 is discontinuous at the junction of the side wall and the bottom surface of the partition groove 103, so that the light-emitting functional layer 200 of adjacent light-emitting devices is disconnected, thereby preventing the light-emitting functional layer 200 from leaking between adjacent light-emitting devices.

[0098] Specifically, Fig.10 The principle is described based on the corresponding implementation method as an example. Since a protrusion is formed on the surface of the first insulating layer PLN1, a corresponding depression is formed on the pixel definition layer PDL at the position where the protrusion is formed with the first insulating layer PLN1. Furthermore, the embodiment of the present application can prepare the partition groove 103 by wet etching. Under the effect of the reflective structure 104 to enhance the exposure, the organic matter in the exposure enhancement area reacts more quickly with the etching liquid. The wet etching is isotropic. While the exposure enhancement area is being etched, the etching liquid will also diffuse and react toward the tip, making the side wall of the partition groove present an inwardly concave arc shape. For example Fig.10 The bottom angle where the bottom meets the side wall is a crescent-shaped tip similar to an acute angle.

[0099] In some embodiments, the reflective structure includes a reflective metal layer.

[0100] Specifically, the reflective structure in the embodiment of the present application may be made of a single-layer reflective metal layer, and the single-layer reflective metal layer may be made of a metal material with a high reflectivity, such as silver (Ag) material.

[0101] By using a single-layer reflective metal material, the reflective structure is relatively simple, the number of process steps is relatively small, and the cost is relatively low.

[0102] Fig.11 A schematic diagram of another display panel structure provided by an embodiment of the present application. In some embodiments, the reflective structure 104 includes a stacked reflective metal layer 111 and a semi-transparent and semi-reflective metal layer 112. The semi-transparent and semi-reflective metal layer 112 is located on the side of the reflective metal layer 111 facing away from the substrate.

[0103] The distance between the side of the semi-transmissive and semi-reflective metal layer 112 away from the substrate and the side of the reflective metal layer 111 away from the substrate is an integer multiple of the exposure wavelength of the pixel definition layer.

[0104] like Fig.11 As shown, in order to improve the stability of the reflective structure, the embodiment of the present application can prepare the reflective structure 104 by using multiple film layers. Fig.11 The reflective structure 104 is exemplarily shown as being made of a metal reflective layer with a high reflectivity and two semi-transparent and semi-reflective metal layers.

[0105] In the case of adopting this structure, the overall stability of the reflective structure 104 is higher. In addition, since the distance between the side of the semi-transparent and semi-reflective metal layer 112 away from the substrate and the side of the reflective metal layer 111 away from the substrate is an integer multiple of the exposure wavelength of the pixel definition layer, under the effect of constructive interference of the exposure light, it is beneficial to further enhance the exposure amount, form a more ideal upper narrow and lower wide partition groove, and improve the problem of interconnection between the light-emitting functional layers of adjacent light-emitting devices. The material of the semi-transparent and semi-reflective metal layer 112 can be, for example, metal molybdenum (Mo), etc., which is not particularly limited here.

[0106] Fig.12 A schematic diagram of the structure of a display device provided in an embodiment of the present application. The display device may include a display panel according to any one of the above display panel embodiments.

[0107] The above-mentioned display panel embodiment can be referred to. Since the display device provided in the embodiment of the present application includes the above-mentioned display panel, it can also achieve the same or at least similar technical effects as the above-mentioned display panel, which will not be repeated here.

[0108] Based on the display panel in the above embodiment, the embodiment of the present application further provides a method for preparing a display panel. Fig.13A schematic flow chart of a method for preparing a display panel provided in an embodiment of the present application. The method comprises:

[0109] S101, forming a driving circuit layer on a substrate, wherein the driving circuit layer includes a reflective structure.

[0110] S102, forming a first electrode on the driving circuit layer.

[0111] S103, forming a pixel definition layer on the first electrode, exposing, developing and etching the pixel definition layer to pattern pixel openings and partition grooves.

[0112] The pixel opening exposes the first electrode. The partition groove is located between adjacent pixel openings. The reflective structure overlaps at least partially with the sidewall of the partition groove. The inner diameter of the partition groove gradually decreases in a direction away from the substrate.

[0113] S104, forming a light-emitting functional layer on the pixel definition layer, wherein at least a portion of the light-emitting functional layer is disconnected at the sidewall of the partition groove.

[0114] The preparation method provided in the embodiment of the present application comprises a reflective structure in the prepared driving circuit layer, and the reflective structure has a reflective effect on the light of the exposed pixel definition layer. When exposing the pixel definition layer, due to the reflective effect of the reflective structure, the pixel definition layer is exposed more at the position where the reflective structure is present, forming an exposure enhancement area. Then, when the pixel definition layer is subsequently developed and etched, the etching rate of the exposure enhancement area is faster. Therefore, in the embodiment of the present application, the reflective structure is arranged to overlap at least partially with the side wall of the partition groove, so that the inner diameter of the partition groove gradually decreases in the direction away from the substrate. Due to the above-mentioned partition groove morphology, when the light-emitting functional layer is evaporated on the entire surface, at least part of the light-emitting functional layer can be disconnected at the side wall of the partition groove. Since at least part of the light-emitting functional layer can be disconnected at the side wall of the partition groove, the light-emitting functional layers of adjacent light-emitting devices are disconnected, so that the problem of lateral leakage current generated between the light-emitting devices through the light-emitting functional layer can be avoided, thereby improving the display effect of the display panel.

[0115] Fig.14 A schematic diagram of a process of forming a driving circuit layer on a substrate provided in an embodiment of the present application. In some embodiments, step S101 of forming a driving circuit layer on a substrate may include:

[0116] S201, forming a data line.

[0117] S202 , forming a second insulating layer above the data line.

[0118] S203 , forming a reflective structure above the second insulating layer.

[0119] S204 , forming a first insulating layer above the reflective structure.

[0120] S205, etching the first insulating layer and the second insulating layer, so that a first through hole is formed in the first insulating layer, a second through hole is formed in the second insulating layer, and the first through hole and the second through hole are connected, wherein the first through hole exposes the transfer line, and the second through hole exposes the data line.

[0121] For example, Figure 15(a)-Figure 15(k) The cross-sectional view of a display panel in a manufacturing process provided by an embodiment of the present application is shown in FIG. 1 . The driving circuit layer 100 is used to send a driving signal to the first electrode as described in some of the above embodiments. The driving circuit layer 100 includes, for example, an active layer, a plurality of metal layers, such as Figure 15(a)-Figure 15(k) The first metal layer M1, the second metal layer M2, the third metal layer M3 and the fourth metal layer M4 (including but not limited to). Among them, the active layer is used to prepare the channel layer in the thin film transistor; the first metal layer M1 can be used to prepare the gate of the thin film transistor; the second metal layer M2 can be used to prepare the source and drain of the thin film transistor. In addition, according to the actual design requirements and wiring arrangement of the display panel, the first metal layer, the second metal layer, the third metal layer or the fourth metal layer may be selectively set to prepare the scanning signal line SCAN, the light control signal line EMIT, the data line, the reset signal line, the positive power signal line PVDD, the negative power signal line PVEE and the reset signal line Vref. It should be noted that the present application does not limit which layer of metal is used to prepare the signal lines such as the scanning signal line SCAN, the light control signal line EMIT, the data line, the reset signal line, the positive power signal line PVDD, the negative power signal line PVEE and the reset signal line Vref. The technicians in this field can select the metal film layer used according to the actual needs, as long as the reasonable wiring and electrical insulation of each signal line are guaranteed.

[0122] As shown in FIG. 15( a ), illustratively, a data line 106 is formed on a substrate 000 using a third metal layer M3 .

[0123] As shown in FIG. 15( b ), a second insulating layer PLN2 is disposed above the data line 106 .

[0124] As shown in FIG. 15( c ), a fourth metal layer M4 is prepared on the second insulating layer PLN2 and patterned to form a reflective structure 104 .

[0125] In some embodiments, the reflective structure 104 may be made of a single-layer reflective metal layer, and the single-layer reflective metal layer may be made of a metal material with a high reflectivity. For example, silver (Ag) material, etc. In some embodiments, the reflective structure 104 includes a stacked reflective metal layer and a semi-transparent and semi-reflective metal layer. The semi-transparent and semi-reflective metal layer is located on the side of the reflective metal layer away from the substrate. The distance between the side of the semi-transparent and semi-reflective metal layer away from the substrate and the side of the reflective metal layer away from the substrate is an integer multiple of the exposure wavelength of the pixel definition layer.

[0126] As shown in FIG. 15( d ), a first insulating layer PLN1 is formed above the reflective structure 104 .

[0127] As shown in FIG15( e), the first insulating layer PLN1 and the second insulating layer PLN2 are etched to form the first through hole 109 and the second through hole 110. In addition, in addition to forming the first through hole 109 and the second through hole 110, it is also necessary to etch on the first insulating layer PLN1 and the second insulating layer PLN2 to form a third through hole 113, which is used to connect the first electrode 101 to the third metal layer M3, so as to realize the connection between the first electrode 101 and the transistor in the driving circuit layer 100.

[0128] In the embodiment of the present application, the second insulating layer PLN2 is not subjected to separate etching and opening after the entire surface is formed, but is directly prepared to form the reflective structure 104. After the reflective structure 104 is formed, the entire surface of the first insulating layer PLN1 is formed, and then etching and opening are performed. Since the first insulating layer PLN1 and the second insulating layer PLN2 are made of the same organic material, and the pattern of the reflective structure 104 does not block the etching of the organic layer, the etching will directly penetrate the first insulating layer PLN1 and the second insulating layer PLN2, so that the upper surface of the data line 106 is exposed. In the process of preparing the first through hole 109 and the second through hole 110, the same mask can be used to prepare, saving one mask process, so that the first insulating layer PLN1 and the second insulating layer PLN2, which originally required two layers of etching process, can be completed in one time, simplifying the process flow.

[0129] Furthermore, the present application can use a partial reflection structure 104 to multiplex as a partial adapter line 107, so as to use the FIAA technology to reduce the width of the lower frame of the display panel. For example, referring to FIG. 7 above, the display panel includes a display area AA and a non-display area NA located on opposite sides of the display area AA, and the non-display area NA and the display area AA are arranged along the first direction. The display area AA includes an edge area ED and a middle area CE, and the edge area ED is closer to the non-display area NA relative to the middle area CE. The data line 106 extends along the second direction, and a plurality of data lines 106 are arranged along the first direction. The adapter line 107 is electrically connected to the data line 106 located in the edge area ED through the connecting portion 108. The adapter line 107 extends from the edge area ED to the middle area CE to realize the electrical connection between the data line 106 and the adapter line 107. As shown in FIG. 15(f), a first electrode 101 is prepared on the surface of the first insulating layer PLN1. When forming the first electrode 101 on the driving circuit layer 100, the process also includes: forming a connecting portion 108, so that the connecting portion 108 is located in the first through hole 109 and the second through hole 110, and electrically connecting the adapter 107 to the data line 106. Since the first insulating layer PLN1 exposes the reflective structure 104, and the second insulating layer PLN2 exposes the data line 106, the prepared connecting portion 108 overlaps the surface of the reflective structure 104 on the one hand, overlaps the surface of the data line 106 on the other hand, and is arranged on the inner walls of the first through hole 109 and the second through hole 110, so that the reflective structure 104 is connected to the data line 106 through the connecting portion 108.

[0130] Furthermore, a pixel definition layer PDL is formed above the first electrode 101 , as shown in FIG. 15( g ).

[0131] As shown in FIG15(h), a mask is used to expose the pixel definition layer PDL for patterning, and the mask pattern is the pattern used to prepare the partition groove 103 and the pixel opening 102. As shown in FIG15(h), the region S1 corresponds to the pattern of the pixel opening 102, and the region S2 corresponds to the pattern of the partition groove 103. Since the reflective structure 104 is provided at the corresponding position of the region S2, due to the reflection effect of the reflective structure 104, the exposure amount of the pixel definition layer PDL is greater, forming an exposure enhancement area 400.

[0132] In addition, in the direction perpendicular to the substrate 000, the reflective effect of the relatively flat connection portion 108 (region P1 in FIG. 15(h)) formed above the reflective structure 104 is better than the reflective effect of the concave connection portion 108 (region P2 in FIG. 15(h)) formed in the first through hole 109 and the second through hole 110. Therefore, there is a difference in the exposure amount of the pixel definition layer PDL in the region P1 in FIG. 15(h) and the region P2 in FIG. 15(h), and an etched cross-sectional structure similar to the aforementioned sidewall of the partition groove 103 with an inwardly concave arc shape is formed.

[0133] Further, after the exposure is completed, the pixel definition layer PDL is developed and etched to form a pixel opening 102 and a partition groove 103. Based on the influence of the embodiment of FIG15(h) above, the pixel definition layer PDL in a region with a larger exposure amount is developed and etched faster, and a partition groove 103 with a narrow top and a wide bottom can be formed, as shown in FIG15(i).

[0134] Further, a light-emitting layer 301 and a light-emitting functional layer 200 are formed above the pixel definition layer PDL, as shown in FIG15(j). In FIG15(j), the exemplary light-emitting functional layer 200 includes a hole injection layer 201, a hole transport layer 202, an electron transport layer 203, and an electron injection layer 204. After forming the partition groove 103, the hole injection layer 201 and the hole transport layer 202 are first evaporated on the entire surface, and then the light-emitting layer 301 is formed in the pixel opening 102, and then the electron transport layer 203 and the electron injection layer 204 are evaporated on the entire surface. Since the inner diameter of the partition groove 103 gradually decreases in the direction away from the substrate 000, for example, as shown in FIG15(j), the side wall of the partition groove 103 is concave arc-shaped. When the entire light-emitting functional layer 200 is subsequently formed above the pixel definition layer PDL, at least part of the light-emitting functional layer 200 can be disconnected at the side wall of the partition groove 103, thereby avoiding the problem of lateral leakage current between light-emitting devices through the light-emitting functional layer 200, thereby improving the display effect of the display panel.

[0135] As shown in FIG15( k ), the second electrode 105 can be formed by full-surface evaporation. The first electrode 101 is generally an anode, and the second electrode 105 disposed on the side of the light-emitting functional layer 200 away from the substrate 000 is generally a cathode. In order to ensure that the cathode potential is consistent, the cathode is generally also required to be set as a full-surface structure.

[0136] Since a partition groove 103 is provided between adjacent light emitting devices 300 , and the inner diameter of the partition groove 103 gradually decreases in a direction away from the substrate, the entire film layer prepared after the pixel definition layer PDL will be disconnected at the side wall of the partition groove 103 .

[0137] In order to prevent the partition groove 103 from separating the second electrodes 105 of each light-emitting device 300, in some embodiments, when forming the reflective structure 104, a notch 1042 can be provided in the reflective structure 104 between adjacent pixel openings 102, so that the second electrodes 105 corresponding to the adjacent pixel openings 102 are connected at the notch 1042 (see Figure 5 structure).

[0138] It should be noted that the display panel manufacturing method provided in the present application and the above-mentioned display panel are based on the same inventive concept, and the structure involved in the manufacturing method can adopt a similar structure in the above-mentioned display panel embodiments, and has the same beneficial effects, and will not be repeated in the embodiment of the display panel manufacturing method.

[0139] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0140] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments described herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display panel, characterized in that: include: substrate; a driving circuit layer located on the substrate; a first electrode located on the driving circuit layer; a pixel definition layer located on a side of the first electrode away from the substrate; The pixel definition layer is patterned to form a pixel opening and a partition groove; the pixel opening exposes the first electrode; the partition groove is located between adjacent pixel openings; and the inner diameter of the partition groove gradually decreases in a direction away from the substrate; A light-emitting functional layer is formed on the pixel definition layer; at least a portion of the light-emitting functional layer is disconnected at the sidewall of the partition groove; Wherein, the driving circuit layer includes a reflective structure; in a direction perpendicular to the substrate, the reflective structure at least partially overlaps with a side wall of the partition groove; The reflective structure includes two reflective metal traces located between adjacent pixel openings.

2. The display panel according to claim 1, characterized in that: The reflective structure is arranged around the pixel opening; in a direction perpendicular to the substrate, the pixel opening is located in the area surrounded by the reflective structure.

3. The display panel according to claim 1, characterized in that: The reflective metal wirings along the pixel row direction and the pixel column direction are connected to form a grid.

4. The display panel according to claim 1, characterized in that: It also includes a second electrode, which is located on the side of the light-emitting functional layer away from the substrate; the reflective structure between adjacent pixel openings is provided with a gap; and the second electrodes corresponding to adjacent pixel openings are connected at the gap.

5. The display panel according to claim 4, characterized in that: When the gaps between adjacent pixel openings are located at the two reflective metal wirings respectively, the gaps have an angle of less than 90° between the connection direction parallel to the substrate and the pixel arrangement direction.

6. The display panel according to claim 1, characterized in that: The display panel comprises a display area and non-display areas located on opposite sides of the display area, wherein the non-display area and the display area are arranged along a first direction; the display area comprises an edge area and a middle area, wherein the edge area is closer to the non-display area than to the middle area; The display panel further includes a plurality of data lines and adapter lines, the data lines extending along the second direction, and the plurality of data lines arranged along the first direction, the adapter lines being electrically connected to the data lines located in the edge area, and the adapter lines extending from the edge area to the middle area; Part of the reflective structure is multiplexed into at least part of the adapter.

7. The display panel according to claim 6, characterized in that: Part of the reflective structure is multiplexed into a virtual routing line, and there is a break between the virtual routing line and the adapter line; The virtual wiring is electrically connected to the constant voltage signal line of the display panel; the constant voltage signal line includes a positive power signal line, a negative power signal line or a reset signal line.

8. The display panel according to claim 6, characterized in that: The display panel further includes a connecting portion; the connecting portion and the first electrode are located in the same film layer; A first insulating layer is disposed between the first electrode and the reflective structure; a second insulating layer is disposed between the reflective structure and the data line; The first insulating layer includes a first through hole, which exposes the adapter line; the second insulating layer includes a second through hole, which exposes the data line; the first through hole and the second through hole are connected; the connecting part is located in the first through hole and the second through hole, electrically connecting the adapter line with the data line.

9. The display panel according to claim 8, characterized in that: The first insulating layer and the second insulating layer are organic layers made of the same material.

10. The display panel according to claim 8, characterized in that: The first insulating layer is thinner than the second insulating layer.

11. The display panel according to any one of claims 1 to 10, characterized in that: The side wall of the partition groove is in an inwardly concave arc shape.

12. The display panel according to any one of claims 1 to 10, characterized in that: The reflective structure includes a reflective metal layer.

13. The display panel according to any one of claims 1 to 10, characterized in that: The reflective structure comprises a stacked reflective metal layer and a semi-transparent and semi-reflective metal layer; the semi-transparent and semi-reflective metal layer is located on a side of the reflective metal layer away from the substrate; The distance between a side of the semi-transmissive and semi-reflective metal layer away from the substrate and a side of the reflective metal layer away from the substrate is an integral multiple of an exposure wavelength of the pixel definition layer.

14. The display panel according to any one of claims 1 to 10, characterized in that: A protrusion is formed at a position where the reflective structure is located on a surface of a first insulating layer between the first electrode and the reflective structure that is away from the substrate.

15. A display device, characterized in that: Comprising the display panel as claimed in any one of claims 1 to 14.

16. A method for preparing a display panel, characterized in that: include: forming a driving circuit layer on a substrate, wherein the driving circuit layer includes a reflective structure; forming a first electrode on the driving circuit layer; A pixel definition layer is formed on the first electrode, and the pixel definition layer is etched by exposure, development and etching to form a pixel opening and a partition groove; wherein the pixel opening exposes the first electrode; the partition groove is located between adjacent pixel openings; the reflective structure at least partially overlaps with the sidewall of the partition groove; and the inner diameter of the partition groove gradually decreases in a direction away from the substrate; A light-emitting functional layer is formed on the pixel definition layer, wherein at least a portion of the light-emitting functional layer is disconnected at the sidewall of the partition groove; and the reflective structure includes two reflective metal traces located between adjacent pixel openings.

17. The method for manufacturing a display panel according to claim 16, characterized in that: The step of forming a driving circuit layer on the substrate comprises: forming a data line; forming a second insulating layer above the data line; forming the reflective structure above the second insulating layer; forming a first insulating layer above the reflective structure; Etching the first insulating layer and the second insulating layer to form a first through hole in the first insulating layer and a second through hole in the second insulating layer, wherein the first through hole is connected to the second through hole, wherein the first through hole exposes the adapter line and the second through hole exposes the data line; When forming the first electrode on the driving circuit layer, the method further includes: forming a connecting portion so that the connecting portion is located in the first through hole and the second through hole to electrically connect the adapter line with the data line; Wherein, the display panel includes a display area and a non-display area located on opposite sides of the display area, and the non-display area and the display area are arranged along a first direction; the display area includes an edge area and a middle area, and the edge area is closer to the non-display area than the middle area; the data line extends along a second direction, and a plurality of the data lines are arranged along the first direction, the adapter line is electrically connected to the data line located in the edge area through the connecting portion, and the adapter line extends from the edge area to the middle area.

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