Data communication method, device and equipment and computer readable storage medium

Abstract

The invention relates to the technical field of communication, and discloses a data communication method, device and equipment and a computer readable storage medium, and the method comprises the steps: building at least two communication links in a data transmission link layer; the communication link comprises a fixed length format data communication link and a non-fixed length format data communication link; after the data issued by the protocol processing layer is received, when a data communication link with a fixed length format is selected, the data issued by the protocol processing layer is uniformly packaged into a data packet with a fixed length format, and the data packet is transmitted to a chip physical bottom layer; and when a data communication link in a non-fixed length format is selected, uniformly transmitting data issued by the protocol processing layer to a chip physical bottom layer in a transparent transmission mode. The mode is convenient, rapid and uniform, the original communication protocol can be compatible in a data link, basic interface communication is realized, communication data can be unified into a format of data with a fixed length, and a uniform data packet is applicable to a multi-chip logic interface, so that interconnection communication among multiple chips is completed.

Description

Technical Field

[0001] The present invention relates to the field of communication technology, and in particular to a data communication method, device, equipment and computer-readable storage medium. Background Art

[0002] The monolithic chip approach is to place each component on a single bare die, resulting in the larger silicon chip size as more functions are added. With the rapid development of semiconductor technology, the integration and processing power of a single chip have reached their limits. In order to further improve the performance and functionality of chips, chip designers have begun to adopt the design method of chiplet architecture. The chiplet approach is to disperse the large-scale multi-core design into individual tiny bare chips, such as processors, analog components, storage, etc., and then use a three-dimensional stacking method to package multiple chip fragments in the same package with advanced packaging technology to make a chip system, in which data and signals are transmitted through a high-speed interconnect network.

[0003] Although chip fragments have advantages such as flexible design and cost savings, when a large chip system is composed of multiple chip fragments, it still faces communication problems such as the increase in the number of chip interfaces, the increase in the types of protocols, and the increase in the scale of interconnection link topology. Summary of the invention

[0004] The purpose of the present invention is to provide a data communication method, device, equipment and computer-readable storage medium, which are convenient, fast and unified, can not only realize basic interface communication, but also unify the communication data into a fixed-length data format and be applicable to multi-chip logic interfaces, thereby solving the problem of interconnection link communication in multi-chip systems.

[0005] In order to solve the above technical problems, the present invention provides a data communication method, the method comprising:

[0006] Establishing at least two communication links in the data transmission link layer; the communication links include fixed-length format data communication links and non-fixed-length format data communication links;

[0007] After receiving the data sent by the protocol processing layer, selecting the fixed-length format data communication link or the non-fixed-length format data communication link;

[0008] When the fixed-length format data communication link is selected, the data sent by the protocol processing layer are uniformly packaged into fixed-length format data packets and transmitted to the physical bottom layer of the chip;

[0009] When the non-fixed length format data communication link is selected, the data sent down by the protocol processing layer is uniformly transmitted to the physical bottom layer of the chip in a transparent transmission manner.

[0010] In a first aspect, in the above-mentioned data communication method provided by the present invention, at least two communication links are established in the data transmission link layer, including:

[0011] A multiplex selection path module is configured in the data transmission link layer, and the multiplex selection path module is used to connect at least two communication links.

[0012] On the other hand, in the above-mentioned data communication method provided by the present invention, after receiving the data sent by the protocol processing layer, selecting the fixed-length format data communication link or the non-fixed-length format data communication link includes:

[0013] Determine whether corresponding fixed-length format data configuration information is received;

[0014] If yes, after receiving the data sent by the protocol processing layer, the fixed-length format data communication link is selected according to the fixed-length format data configuration information by using the multi-path selection path module;

[0015] If not, after receiving the data sent by the protocol processing layer, the non-fixed length format data communication link is selected by default.

[0016] On the other hand, in the above-mentioned data communication method provided by the present invention, when the fixed-length format data communication link is selected, the data sent by the protocol processing layer is uniformly packaged into a fixed-length format data packet and transmitted to the physical bottom layer of the chip, including:

[0017] When the fixed-length format data communication link is selected, the data sent by the protocol processing layer are uniformly packaged to obtain a fixed-length format data packet;

[0018] Transmitting the uniformly packaged data packets to the physical bottom layer of the chip in a flow control mode;

[0019] Using the chip physical bottom layer to convert the uniformly packaged data packets into corresponding first analog signals, and sending the first analog signals to a communication interface between two bare chips in the same package at a remote end;

[0020] Correspondingly, when the non-fixed length format data communication link is selected, the data sent by the protocol processing layer is uniformly transmitted to the physical bottom layer of the chip in a transparent transmission manner, including:

[0021] When the non-fixed length format data communication link is selected, the original state of the data sent by the protocol processing layer is maintained, and the data sent by the protocol processing layer is uniformly transmitted in a transparent transmission manner to be transmitted to the physical bottom layer of the chip;

[0022] The chip physical bottom layer is used to convert the data sent down by the protocol processing layer into a corresponding second analog signal, and the second analog signal is sent to a communication interface between two bare chips in the same package at a remote end.

[0023] On the other hand, in the above data communication method provided by the present invention, after sending the first analog signal to the communication interface between two bare chips in the same package at the remote end, it also includes:

[0024] Converting the first analog signal into a corresponding target data packet using a physical bottom layer in a communication interface between two bare chips in the same package at a remote end;

[0025] The target data packet is unpacked using the data transmission link layer in the communication interface between two bare chips in the same package at the remote end, and the unpacked data of the target data packet is obtained and sent to the protocol processing layer in the communication interface between the two bare chips in the same package at the remote end.

[0026] On the other hand, in the above data communication method provided by the present invention, after sending the second analog signal to the communication interface between two bare chips in the same package at the remote end, it also includes:

[0027] Converting the second analog signal into corresponding target data by using a physical bottom layer in a communication interface between two bare chips in the same package at a remote end;

[0028] The target data is sent to the protocol processing layer in the communication interface between the two bare chips in the same package at the remote end by utilizing the data transmission link layer in the communication interface between the two bare chips in the same package at the remote end.

[0029] On the other hand, in the above-mentioned data communication method provided by the present invention, the data packet in the fixed-length format is divided into a first part, a second part and a third part;

[0030] The first part is a data packet header; the second part is a data packet block; and the third part is a data check.

[0031] In order to solve the above technical problems, the present invention further provides a data communication device, the device comprising:

[0032] A link establishment module, used to establish at least two communication links in the data transmission link layer; the communication links include fixed-length format data communication links and non-fixed-length format data communication links;

[0033] A link selection module, configured to select the fixed-length format data communication link or the non-fixed-length format data communication link after receiving the data sent by the protocol processing layer;

[0034] A packaging processing module, used for packaging the data sent by the protocol processing layer into fixed-length format data packets and transmitting them to the physical bottom layer of the chip when the fixed-length format data communication link is selected;

[0035] The data transmission module is used to uniformly transmit the data sent by the protocol processing layer to the physical bottom layer of the chip in a transparent transmission manner when the non-fixed length format data communication link is selected.

[0036] In order to solve the above technical problems, the present invention further provides a data communication device, the device comprising:

[0037] Memory for storing computer programs;

[0038] A processor is used to implement the steps of the above-mentioned data communication method when executing the computer program.

[0039] In order to solve the above technical problem, the present invention also provides a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, the steps of the above data communication method are implemented.

[0040] It can be seen from the above technical scheme that a data communication method provided by the present invention includes: establishing at least two communication links in the data transmission link layer; the communication link includes a fixed-length format data communication link and a non-fixed-length format data communication link; after receiving the data sent by the protocol processing layer, selecting a fixed-length format data communication link or a non-fixed-length format data communication link; when the fixed-length format data communication link is selected, the data sent by the protocol processing layer is uniformly packaged into a fixed-length format data packet and transmitted to the physical bottom layer of the chip; when the non-fixed-length format data communication link is selected, the data sent by the protocol processing layer is uniformly transmitted to the physical bottom layer of the chip in a transparent manner.

[0041] The beneficial effect of the present invention lies in that the above-mentioned data communication method provided by the present invention is configured with a link communication mode in the data link layer, and solves the problem of interconnection link communication in a multi-chip system by selecting a fixed-length data segment communication or a non-fixed-length data segment communication. When a fixed-length data segment communication link is selected, there is no need to consider the type of chip interface protocol. It is only necessary to uniformly package the data sent by the protocol processing layer into a fixed-length format data packet and then transmit it. When a non-fixed-length format data communication link is selected, the data sent by the protocol processing layer is uniformly transmitted in a transparent manner without special processing, and the original data transmission protocol is uniformly used for transmission. The above method is convenient, fast and unified, and can not only be compatible with the original communication protocol in the data link to realize basic interface communication, but also can unify the communication data into a fixed-length data format, and the unified data packet is applicable to the multi-chip logic interface, thereby completing the interconnection communication between multiple chips.

[0042] In addition, the present invention also provides a corresponding data communication device, data communication equipment and computer-readable storage medium for the data communication method, which have the same or corresponding technical features as the above-mentioned data communication method and have the same effects as above. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0044] Figure 1 A flow chart of a data communication method provided by an embodiment of the present invention;

[0045] Figure 2 An architectural diagram of data transmission provided by an embodiment of the present invention;

[0046] Figure 3 An architectural diagram of data processing at the data transmission link layer provided in an embodiment of the present invention;

[0047] Figure 4 A schematic diagram of the structure of fixed-length format data provided by an embodiment of the present invention;

[0048] Figure 5 A schematic diagram of a chip fragment architecture provided by an embodiment of the present invention;

[0049] Figure 6 A schematic diagram of the structure of a data communication device provided by an embodiment of the present invention;

[0050] Figure 7 A schematic diagram of the structure of a data communication device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0051] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0052] In order to enable those skilled in the art to better understand the solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Figure 1 A flow chart of a data communication method provided by an embodiment of the present invention, such as Figure 1 As shown, the method includes:

[0053] S101. Establish at least two communication links in a data transmission link layer; the communication links include a fixed-length format data communication link and a non-fixed-length format data communication link.

[0054] It should be noted that the present invention optimizes the logical functions of the data transmission link layer. The above-mentioned fixed-length format data communication link can be a Flit (fixed-format fixed-length data packet) communication link. The non-fixed-length format data communication link can be understood as a conventional communication link. The present invention quickly configures at least two communication link modes in the data transmission link layer, one of which can be a Flit communication link mode, and the other can be an original conventional communication link mode, that is, the communication of the data transmission link layer is mainly divided into Flit data communication and conventional data communication, ensuring that the interconnection link between multiple chips always exists, greatly simplifying the multi-chip communication process. Link establishment initialization, data communication, and interrupt and error handling can all be completed through the communication link of the data transmission link layer.

[0055] S102: After receiving data sent by the protocol processing layer, select a fixed-length format data communication link or a non-fixed-length format data communication link.

[0056] In implementation, the present invention can mainly solve the problem of interconnection link communication in a multi-chip system by selecting Flit communication or original conventional communication after receiving data sent by the protocol processing layer.

[0057] S103: When a fixed-length format data communication link is selected, the data sent by the protocol processing layer are uniformly packaged into fixed-length format data packets and transmitted to the physical bottom layer of the chip.

[0058] In implementation, when the Flit communication link is selected, the data sent by the protocol processing layer (i.e., the upper layer) can be uniformly packaged into the Flit format, processed and transmitted in Flit mode, and transmitted to the physical bottom layer of the chip. In a multi-core system, the unified Flit format has the function of fixing some bytes and reserving most bytes to provide custom extensions for special functions, which can greatly reduce the protocol conversion due to interface protocol mismatch, reduce data transmission delay, and make the multi-interface logic simple and unified.

[0059] S104. When a data communication link with a non-fixed length format is selected, the data sent by the protocol processing layer is uniformly transmitted to the physical bottom layer of the chip in a transparent transmission manner.

[0060] In implementation, when a conventional communication link is selected, the data sent from the protocol processing layer can be uniformly transmitted in a transparent manner without doing any special processing on the data. The original data transmission protocol is still maintained and uniformly transmitted downward using the original data transmission protocol to transmit it to the physical bottom layer of the chip, thereby meeting the special protocol and bandwidth requirements in the multi-chip interface and quickly establishing connections and communications.

[0061] In the above-mentioned data communication method provided by the embodiment of the present invention, a link communication mode is configured in the data link layer. By selecting a fixed-length data segment communication or a non-fixed-length data segment communication method, the problem of interconnection link communication in a multi-chip system is solved. When a fixed-length data segment communication link is selected, there is no need to consider the type of chip interface protocol. The data sent by the protocol processing layer only needs to be uniformly packaged into a fixed-length format data packet and then transmitted. When a non-fixed-length format data communication link is selected, the data sent by the protocol processing layer is uniformly transmitted in a transparent manner without special processing. The original data transmission protocol is uniformly used for transmission. The above-mentioned method is convenient, fast and unified. It can not only be compatible with the original communication protocol in the data link to realize basic interface communication, but also can unify the communication data into a fixed-length data format. The unified data packet is applicable to the multi-chip logic interface, thereby completing the interconnection communication between multiple chips.

[0062] Furthermore, in a specific implementation, in the above-mentioned data communication method provided in an embodiment of the present invention, step S101 establishes at least two communication links in the data transmission link layer, which may specifically include: configuring a multi-way selection path module in the data transmission link layer, and connecting at least two communication links by the multi-way selection path module.

[0063] Figure 2 The data transmission architecture diagram provided by the embodiment of the present invention. Figure 2As shown, the present invention can configure a multiplexer (MUX) selection path module in the data transmission link layer, so that the most suitable link can be flexibly selected through the multiplexer (MUX) selection path module for data transmission and signal processing, without having to establish link communication through a link path, thereby ensuring the communication link bandwidth and speeding up the communication speed.

[0064] Figure 3 The data transmission link layer data processing architecture diagram provided by the embodiment of the present invention. In implementation, Figure 3 As shown, the above-mentioned multi-path selection path module can be connected to the fixed-length format data communication link and the non-fixed-length format data communication link respectively. That is, there are at least two paths in the data transmission link layer of the present invention, and the processing logic of at least two selection paths is different, so that multiple protocols are compatible and a unified Flit transmission data is used under a multi-chip interface, simplifying the multi-chip interface logic relationship.

[0065] Further, in a specific implementation, in the above-mentioned data communication method provided in an embodiment of the present invention, after step S102 receives the data sent by the protocol processing layer, selecting a fixed-length format data communication link or a non-fixed-length format data communication link may specifically include: determining whether the corresponding fixed-length format data configuration information is received; if so, after receiving the data sent by the protocol processing layer, selecting a fixed-length format data communication link according to the fixed-length format data configuration information using a multi-way selection path module; if not, after receiving the data sent by the protocol processing layer, selecting a non-fixed-length format data communication link by default.

[0066] In implementation, when executing step S102, it can be determined whether the corresponding fixed-length format data configuration information, i.e., the Flit configuration information, is received. If the corresponding Flit configuration information is not received, it means that the present invention has selected the default mode, i.e., the non-fixed-length format data communication link, i.e., the conventional communication link, is selected by default, the original transmission protocol is maintained, and the upper layer data is not processed to ensure that the original protocol link layer communication is established. If the corresponding Flit configuration information is received, it means that the present invention needs to select a fixed-length format data communication link, i.e., the Flit communication link. At this time, the fixed-length format data communication link can be selected according to the fixed-length format data configuration information, and the data is transmitted through a unified Flit data. The multi-chip interface uses a unified protocol and data format to ensure efficient interconnection and intercommunication between multi-chip systems.

[0067] Figure 4 A schematic diagram of the structure of fixed-length format data provided by an embodiment of the present invention. Figure 4As shown, a data packet in a fixed-length format can be divided into a first part, a second part and a third part; the first part is a data packet header; the second part is a data packet block; and the third part is a data check.

[0068] In implementation, Figure 4 As shown, the fixed length format (i.e., Flit format) can be 256 bytes in size, and the byte size can be compatible with the high-speed serial computer expansion bus standard (Peripheral Component Interconnect Express, PCIE) 6.0 protocol and the industry interconnection standard (Universal Chiplet Interconnect Express, UCIE) protocol. The Flit designed here can be mainly divided into three parts: the data packet header occupies 4 bytes, the data packet block 250 bytes, and the data check 2 bytes. In the present invention, the byte size of each part of Flit can be adjusted according to the actual situation, and the specific byte bit function is not mandatory.

[0069] Furthermore, in a specific implementation, in the above-mentioned data communication method provided in an embodiment of the present invention, in step S103, when a fixed-length format data communication link is selected, the data sent down by the protocol processing layer is uniformly packaged into a fixed-length format data packet and transmitted to the physical bottom layer of the chip. Specifically, it may include: when a fixed-length format data communication link is selected, the data sent down by the protocol processing layer is uniformly packaged to obtain a fixed-length format data packet; the uniformly packaged data packet is transmitted to the physical bottom layer of the chip in a flow control mode; the uniformly packaged data packet is converted into a corresponding first analog signal by using the physical bottom layer of the chip, and the first analog signal is sent to the communication interface (Die-to-Die) between two bare chips in the same package at the remote end.

[0070] Correspondingly, in step S104, when a non-fixed-length format data communication link is selected, the data sent by the protocol processing layer is uniformly transmitted to the physical bottom layer of the chip in a transparent transmission manner, which may specifically include: when a non-fixed-length format data communication link is selected, the original state of the data sent by the protocol processing layer is maintained, and the data sent by the protocol processing layer is uniformly transmitted to the physical bottom layer of the chip in a transparent transmission manner; the data sent by the protocol processing layer is converted into a corresponding second analog signal by using the physical bottom layer of the chip, and the second analog signal is sent to the communication interface (Die-to-Die) between two bare chips in the same package at the remote end.

[0071] In implementation, the present invention can provide a Die-to-Die dual-mode communication interface, namely a method of Flit data communication and conventional data communication, at the data link layer. When Flit data communication is selected, the interface logic is unified between the multi-chip Die-to-Die interfaces, and communication is performed through the Flit data packet format. In this way, by configuring the Die-to-Die interface communication dual mode, the high-speed transmission link circuit logic and different protocol conversion logic are greatly simplified, and the extended interconnection communication between multiple chips can be realized quickly and dynamically, reducing the interface protocol conversion delay, and facilitating the link layer to communicate quickly. It plays a key role in improving the link communication performance and ensuring the availability of related products of the chiplet architecture.

[0072] Furthermore, in a specific implementation, in the above-mentioned data communication method provided in an embodiment of the present invention, after sending the first analog signal to the communication interface between two bare chips in the same package at the remote end in the above-mentioned step, it may also include: first, converting the first analog signal into a corresponding target data packet using the physical bottom layer in the communication interface (Die-to-Die) between the two bare chips in the same package at the remote end; then, unpacking the target data packet using the data transmission link layer in the communication interface (Die-to-Die) between the two bare chips in the same package at the remote end, obtaining the unpacked data of the target data packet and sending it to the protocol processing layer in the communication interface (Die-to-Die) between the two bare chips in the same package at the remote end.

[0073] Figure 5 Schematic diagram of a chip fragment architecture provided by an embodiment of the present invention. In implementation, Figure 5 As shown, the present invention can dynamically configure multi-chip interface link channels, establish high-speed links and dynamically adjust link topology by simplifying the link layer circuit logic and two-way communication processes. The communication interface (Die-to-Die) between two bare chips in the same package at the far end can be analyzed by the inverse process of the above method. After the first analog signal is sent to the communication interface (Die-to-Die) between two bare chips in the same package at the far end, the interface can specifically convert the first analog signal into a corresponding target data packet by the physical bottom layer, and then use the data transmission link layer to unpack the target data packet, obtain the unpacked data of the target data packet and send it to the protocol processing layer, thereby completing the communication process between the interfaces.

[0074] Furthermore, in a specific implementation, in the above-mentioned data communication method provided in an embodiment of the present invention, after sending the second analog signal to the communication interface between two bare chips in the same package at the remote end in the above-mentioned step, it may also include: first, converting the second analog signal into corresponding target data using the physical bottom layer in the communication interface (Die-to-Die) between the two bare chips in the same package at the remote end; and then, sending the target data to the protocol processing layer in the communication interface (Die-to-Die) between the two bare chips in the same package at the remote end using the data transmission link layer in the communication interface (Die-to-Die) between the two bare chips in the same package at the remote end.

[0075] In implementation, when sending the second analog signal to a communication interface (Die-to-Die) between two bare chips in the same package at the far end, the interface can specifically convert the second analog signal into corresponding target data by the physical bottom layer; and then use the data transmission link layer to send the target data to the protocol processing layer without any special processing of the target data.

[0076] This method of dual-mode fast interconnection based on fixed-length format data communication and non-fixed-length format data communication ensures fast and smooth communication of interconnection links between interfaces in a multi-chip system, supports multiple high-speed protocol types and unified Flit data interface transmission, supports switching transmission channels, reduces transmission delays, and meets high bandwidth requirements for data communication. The fixed-length format data packet in the present invention, i.e., the unified Flit data packet, can simplify and unify the internal logical functions of the Die-to-Die communication link layer, ensuring that the communication signal can quickly perform related functional logic and data processing.

[0077] Furthermore, in the specific implementation, in the above data communication method provided by the embodiment of the present invention, when an error occurs in the fixed-length format data communication link, the non-fixed-length format data communication link is directly selected; and when an error occurs in the non-fixed-length format data communication link, the fixed-length format data communication link is directly selected. In the implementation, when an uncontrollable unexpected error occurs, there is no need to disconnect the link, and another path can be directly selected. This is simple and fast, will not affect communication, and ensures the security of data communication.

[0078] In the above embodiments, the data communication method is described in detail, and the present invention also provides corresponding embodiments of the data communication device and the data communication equipment. It should be noted that the present invention describes the embodiments of the device part from two perspectives, one is based on the perspective of the functional module, and the other is based on the perspective of the hardware.

[0079] Figure 6 Schematic diagram of the structure of a data communication device provided by an embodiment of the present invention. This embodiment is based on the perspective of functional modules, such as Figure 6 As shown, the device comprises:

[0080] The link establishment module 10 is used to establish at least two communication links in the data transmission link layer; the communication links include fixed-length format data communication links and non-fixed-length format data communication links;

[0081] The link selection module 11 is used to select a fixed-length format data communication link or a non-fixed-length format data communication link after receiving data sent by the protocol processing layer;

[0082] The packaging processing module 12 is used to package the data sent by the protocol processing layer into fixed-length format data packets and transmit them to the chip physical bottom layer when a fixed-length format data communication link is selected;

[0083] The data transmission module 13 is used to uniformly transmit the data sent by the protocol processing layer to the physical bottom layer of the chip in a transparent transmission manner when a data communication link with a non-fixed length format is selected.

[0084] In the above-mentioned data communication device provided in the embodiment of the present invention, a link communication mode can be configured in the data link layer through the interaction of the above-mentioned four modules. By selecting the fixed-length data segment communication or the non-fixed-length data segment communication method, the problem of interconnection link communication in the multi-chip system is solved. When the fixed-length data segment communication link is selected, there is no need to consider the type of chip interface protocol. It is only necessary to uniformly package the data sent by the protocol processing layer into a fixed-length format data packet and then transmit it. When the non-fixed-length format data communication link is selected, the data sent by the protocol processing layer is uniformly transmitted in a transparent manner without special processing. The original data transmission protocol is uniformly used for transmission. The whole process is convenient, fast and unified. It can not only be compatible with the original communication protocol in the data link to realize basic interface communication, but also can unify the communication data into a fixed-length data format. The unified data packet is applicable to the multi-chip logic interface, thereby completing the interconnection communication between multiple chips.

[0085] Since the embodiments of the device part correspond to the embodiments of the method part, the embodiments of the device part refer to the description of the embodiments of the method part, which will not be described here. And it has the same beneficial effects as the above-mentioned data communication method.

[0086] Furthermore, in a specific implementation, in the above-mentioned data communication device provided by the embodiment of the present invention, the link establishment module 10 can be specifically used to configure a multiplex path module in the data transmission link layer, and the multiplex path module connects at least two communication links.

[0087] Furthermore, in a specific implementation, in the above-mentioned data communication device provided in an embodiment of the present invention, the link selection module 11 can be specifically used to determine whether the corresponding fixed-length format data configuration information is received; if so, after receiving the data sent by the protocol processing layer, the fixed-length format data communication link is selected according to the fixed-length format data configuration information using the multi-path selection path module; if not, after receiving the data sent by the protocol processing layer, a non-fixed-length format data communication link is selected by default.

[0088] Furthermore, in a specific implementation, in the above-mentioned data communication device provided in an embodiment of the present invention, the packaging processing module 12 can be specifically used to uniformly package the data sent down by the protocol processing layer when a fixed-length format data communication link is selected to obtain a data packet in a fixed-length format; transmit the uniformly packaged data packet to the chip physical bottom layer in a flow control mode; use the chip physical bottom layer to convert the uniformly packaged data packet into a corresponding first analog signal, and send the first analog signal to the communication interface between two bare chips in the same package at the remote end.

[0089] Furthermore, in a specific implementation, in the above-mentioned data communication device provided in an embodiment of the present invention, the packet processing module 12 can also be specifically used to convert the first analog signal into a corresponding target data packet by utilizing the physical bottom layer in the communication interface between the two bare chips in the same package at the remote end; unpack the target data packet by utilizing the data transmission link layer in the communication interface between the two bare chips in the same package at the remote end, obtain the unpacked data of the target data packet and send it to the protocol processing layer in the communication interface between the two bare chips in the same package at the remote end.

[0090] Furthermore, in a specific implementation, in the above-mentioned data communication device provided in an embodiment of the present invention, the data transmission module 13 can be specifically used to maintain the original state of the data sent by the protocol processing layer when a non-fixed length format data communication link is selected, and uniformly adopt a transparent transmission method to transmit the data sent by the protocol processing layer to the physical bottom layer of the chip; use the physical bottom layer of the chip to convert the data sent by the protocol processing layer into a corresponding second analog signal, and send the second analog signal to the communication interface between two bare chips in the same package at the remote end.

[0091] Furthermore, in specific implementation, in the above-mentioned data communication device provided in an embodiment of the present invention, the data transmission module 13 can also be specifically used to convert the second analog signal into corresponding target data by utilizing the physical bottom layer in the communication interface between two bare chips in the same package at the remote end; and to send the target data to the protocol processing layer in the communication interface between the two bare chips in the same package at the remote end by utilizing the data transmission link layer in the communication interface between the two bare chips in the same package at the remote end.

[0092] Figure 7 The structure diagram of the data communication device provided by the embodiment of the present invention is shown in FIG. Figure 7 As shown, the data communication equipment includes:

[0093] A memory 20, used for storing computer programs;

[0094] The processor 21 is used to implement the steps of the data communication method mentioned in the above embodiment when executing the computer program.

[0095] Among them, the processor 21 may include one or more processing cores, such as a 4-core processor, an 8-core processor, etc. The processor 21 can be implemented in at least one hardware form of a digital signal processor (DSP), a field-programmable gate array (FPGA), and a programmable logic array (PLA). The processor 21 may also include a main processor and a coprocessor. The main processor is a processor for processing data in the awake state, also known as a CPU; the coprocessor is a low-power processor for processing data in the standby state. In some embodiments, the processor 21 may be integrated with a graphics processing unit (GPU), which is responsible for rendering and drawing the content to be displayed on the display screen. In some embodiments, the processor 21 may also include an artificial intelligence (AI) processor, which is used to process computing operations related to machine learning.

[0096] The memory 20 may include one or more computer-readable storage media, which may be non-transitory. The memory 20 may also include a high-speed random access memory, and a non-volatile memory, such as one or more disk storage devices, flash memory storage devices. In this embodiment, the memory 20 is at least used to store the following computer program 201, wherein, after the computer program is loaded and executed by the processor 21, it can implement the relevant steps of the data communication method disclosed in any of the aforementioned embodiments. In addition, the resources stored in the memory 20 may also include an operating system 202 and data 203, etc., and the storage method may be temporary storage or permanent storage. Among them, the operating system 202 may include Windows, Unix, Linux, etc. The data 203 may include, but is not limited to, the data involved in the above-mentioned data communication method, etc.

[0097] In some embodiments, the data communication device may further include a display screen 22, an input / output interface 23, a communication interface 24, a power supply 25, and a communication bus 26. Those skilled in the art will appreciate that Figure 7 The structure shown in the figure does not constitute a limitation on the data communication device, and may include more or fewer components than shown in the figure. The data communication device provided by the embodiment of the present invention includes a memory and a processor. When the processor executes the program stored in the memory, it can implement the data communication method mentioned above, and the effect is the same as above.

[0098] Finally, the present invention also provides an embodiment corresponding to a computer-readable storage medium. The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps recorded in the above method embodiment are implemented.

[0099] It is understandable that if the method in the above embodiment is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium to execute all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM), random access memory (RAM), disk or optical disk and other media that can store program code. The computer-readable storage medium provided by the present invention can implement the above-mentioned data communication method, and the effect is the same as above.

[0100] Finally, the present invention also provides an embodiment corresponding to a computer program product. The computer program product includes a computer program / instruction, and when the computer program / instruction is executed by a processor, the steps described in the above data communication method embodiment are implemented. The computer program product provided by the present invention can implement the above-mentioned data communication method, and the effect is the same as above.

[0101] It should also be noted that, in this specification, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0102] The data communication method, device, equipment and computer-readable storage medium provided by the present invention are described in detail above. The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same and similar parts between the various embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part description. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the present invention, the present invention can also be improved and modified in a number of ways, and these improvements and modifications also fall within the scope of protection of the present invention.

Claims

1. A data communication method, characterized in that: The method comprises: Establishing at least two communication links in the data transmission link layer; the communication links include fixed-length format data communication links and non-fixed-length format data communication links; After receiving the data sent by the protocol processing layer, selecting the fixed-length format data communication link or the non-fixed-length format data communication link; When the fixed-length format data communication link is selected, the data sent by the protocol processing layer are uniformly packaged into fixed-length format data packets and transmitted to the physical bottom layer of the chip; When the non-fixed length format data communication link is selected, the data sent down by the protocol processing layer is uniformly transmitted to the physical bottom layer of the chip in a transparent transmission manner.

2. The data communication method according to claim 1, characterized in that: At least two communication links are established in the data transmission link layer, including: A multiplex selection path module is configured in the data transmission link layer, and the multiplex selection path module is used to connect at least two communication links.

3. The data communication method according to claim 2, characterized in that: After receiving the data sent by the protocol processing layer, selecting the fixed-length format data communication link or the non-fixed-length format data communication link includes: Determine whether corresponding fixed-length format data configuration information is received; If yes, after receiving the data sent by the protocol processing layer, the fixed-length format data communication link is selected according to the fixed-length format data configuration information by using the multi-path selection path module; If not, after receiving the data sent by the protocol processing layer, the non-fixed length format data communication link is selected by default.

4. The data communication method according to claim 3, characterized in that: When the fixed-length format data communication link is selected, the data sent by the protocol processing layer is uniformly packaged into a fixed-length format data packet and transmitted to the chip physical bottom layer, including: When the fixed-length format data communication link is selected, the data sent by the protocol processing layer are uniformly packaged to obtain a fixed-length format data packet; Transmitting the uniformly packaged data packets to the physical bottom layer of the chip in a flow control mode; Using the chip physical bottom layer to convert the uniformly packaged data packets into corresponding first analog signals, and sending the first analog signals to a communication interface between two bare chips in the same package at a remote end; Correspondingly, when the non-fixed length format data communication link is selected, the data sent by the protocol processing layer is uniformly transmitted to the physical bottom layer of the chip in a transparent transmission manner, including: When the non-fixed length format data communication link is selected, the original state of the data sent by the protocol processing layer is maintained, and the data sent by the protocol processing layer is uniformly transmitted in a transparent transmission manner to be transmitted to the physical bottom layer of the chip; The chip physical bottom layer is used to convert the data sent down by the protocol processing layer into a corresponding second analog signal, and the second analog signal is sent to a communication interface between two bare chips in the same package at a remote end.

5. The data communication method according to claim 4, characterized in that: After sending the first analog signal to a communication interface between two bare chips in the same package at a remote end, the method further includes: Converting the first analog signal into a corresponding target data packet using a physical bottom layer in a communication interface between two bare chips in the same package at a remote end; The target data packet is unpacked using the data transmission link layer in the communication interface between two bare chips in the same package at the remote end, and the unpacked data of the target data packet is obtained and sent to the protocol processing layer in the communication interface between the two bare chips in the same package at the remote end.

6. The data communication method according to claim 5, characterized in that: After sending the second analog signal to a communication interface between two bare chips in the same package at a remote end, the method further includes: Converting the second analog signal into corresponding target data by using a physical bottom layer in a communication interface between two bare chips in the same package at a remote end; The target data is sent to the protocol processing layer in the communication interface between the two bare chips in the same package at the remote end by utilizing the data transmission link layer in the communication interface between the two bare chips in the same package at the remote end.

7. The data communication method according to claim 1, characterized in that: The data packet in the fixed-length format is divided into a first part, a second part and a third part; The first part is a data packet header; the second part is a data packet block; and the third part is a data check.

8. A data communication device, characterized in that: The device comprises: A link establishment module, used to establish at least two communication links in the data transmission link layer; the communication links include fixed-length format data communication links and non-fixed-length format data communication links; A link selection module, configured to select the fixed-length format data communication link or the non-fixed-length format data communication link after receiving the data sent by the protocol processing layer; A packaging processing module, used for packaging the data sent by the protocol processing layer into fixed-length format data packets and transmitting them to the physical bottom layer of the chip when the fixed-length format data communication link is selected; The data transmission module is used to uniformly transmit the data sent by the protocol processing layer to the physical bottom layer of the chip in a transparent transmission manner when the non-fixed length format data communication link is selected.

9. A data communication device, characterized in that: The device comprises: Memory for storing computer programs; A processor, configured to implement the steps of the data communication method according to any one of claims 1 to 7 when executing the computer program.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the data communication method according to any one of claims 1 to 7 are implemented.

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