Cubesat integrated stack heat dissipation structure
By designing an integrated stack heat dissipation structure in the cubic star, the heat generated by the circuit board is used to guide the heat dissipation surface by using thermally conductive copper columns and copper sheets, the problem of difficulty in heat dissipation in the cubic star is solved, and efficient heat dissipation and weight optimization are achieved.
Patent Information
- Application Number
- CN202411325415.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-23
- Publication Date
- 2024-12-10
AI Technical Summary
The dense electronic components in the Cube Star lead to difficulty in dissipating heat, difficulty in conducting heat to the heat dissipation surface, affecting the satellite's life and weight requirements.
A cubic star integrated stack heat dissipation structure is designed, through the combination of multiple circuit boards, thermally conductive copper columns, stack screws and support frames, heat is used to direct heat dissipate to the heat dissipation surface, realizing integrated heat dissipation.
Improve heat dissipation efficiency, maximize the use of narrow spaces, avoid local high temperatures, and meet the balance between weight and heat dissipation needs.
Smart Images
Figure CN119110481A_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of cubic satellite temperature control, and in particular relates to a cubic satellite integrated stack heat dissipation structure. Background Art
[0002] For cubic satellites, the most important design pursuit is compactness and miniaturization. As a result, more and more electronic components and equipment are integrated into smaller and smaller spaces, which causes the local heat flux density to increase many times, making it more difficult to dissipate heat from electronic devices, seriously shortening their lifespan, which is directly related to the satellite's on-orbit lifespan. On the other hand, due to the low thermal inertia of cubic satellites and the fact that most cubic satellites operate in low orbits, the external heat flux in each orbit changes dramatically, making the satellite surface more susceptible to large fluctuations due to the external environment. In order to achieve the need to reduce the weight of cubic satellites, cubic satellites often use stacked assemblies integrated with several circuit boards. The circuit boards are connected in series through common electrical interfaces and mechanical interfaces, and the heat is concentrated together, so the heat dissipation of the stack is a great challenge. Summary of the invention
[0003] The technical problem solved by the present invention is: to overcome the deficiencies of the prior art, to provide a cubic satellite integrated stack heat dissipation structure, and to solve the problems of low heat dissipation efficiency of the cubic satellite stack and difficulty in heat conduction to the heat dissipation surface.
[0004] The objective of the present invention is achieved through the following technical solutions: A cubic satellite integrated stack heat dissipation structure, comprising: a plurality of circuit board assemblies, a first support frame, a second support frame, a stack screw and a thermally conductive copper column; wherein the plurality of circuit board assemblies are plugged in sequence, and the plurality of circuit board assemblies are arranged in parallel; the thermally conductive copper column is arranged on each circuit board assembly; the stack screw is inserted into the thermally conductive copper column; the first support frame is connected to one end of the stack screw, and the first support frame is connected to the other end of the stack screw.
[0005] In the above-mentioned cubic satellite integrated stack heat dissipation structure, the circuit board combination includes a circuit board with a shielding box and a first thermally conductive copper sheet; wherein the thermally conductive copper column is arranged at the four vertex positions of the circuit board with the shielding box; one board surface of the first thermally conductive copper sheet is connected to the shielding box of the circuit board with the shielding box; the other board surface of the first thermally conductive copper sheet is connected to the thermally conductive copper column arranged on the circuit board with the shielding box.
[0006] In the above-mentioned cubic satellite integrated stack heat dissipation structure, the circuit board with shielding box includes a first circuit board and a shielding box; wherein the shielding box is connected to the first circuit board.
[0007] In the above-mentioned cubic satellite integrated stack heat dissipation structure, the first thermally conductive copper sheet includes a first thermally conductive plate and a second thermally conductive plate; wherein, one end of the first thermally conductive plate is connected to one side of the second thermally conductive plate; the first thermally conductive plate is connected to the shielding box of the circuit board with the shielding box, and the second thermally conductive plate is connected to a thermally conductive copper column arranged on the circuit board with the shielding box; the plane direction of the first thermally conductive plate is perpendicular to the plane direction of the second thermally conductive plate; the area of the first thermally conductive plate is greater than the area of the second thermally conductive plate, and the area of the first thermally conductive plate is equal to the area of the shielding box.
[0008] In the above cubic satellite integrated stack heat dissipation structure, the length of the second heat conducting plate is 10 to 15 mm, and the width of the second heat conducting plate is 8 to 10 mm.
[0009] In the above-mentioned cubic satellite integrated stack heat dissipation structure, the circuit board combination includes a circuit board without a shielding box and a second thermally conductive copper sheet; wherein the thermally conductive copper columns are arranged at the four vertex positions of the circuit board without a shielding box; the circuit board without a shielding box is provided with a heat dissipation area; one board surface of the second thermally conductive copper sheet is connected to the heat dissipation area of the circuit board without a shielding box; and the other board surface of the second thermally conductive copper sheet is connected to the thermally conductive copper column arranged on the circuit board without a shielding box.
[0010] In the above-mentioned cubic satellite integrated stack heat dissipation structure, the second thermally conductive copper sheet includes a third thermally conductive plate and a fourth thermally conductive plate; wherein one end of the third thermally conductive plate is connected to one side of the fourth thermally conductive plate; the third thermally conductive plate is connected to the heat dissipation area of the circuit board without a shielding box, and the fourth thermally conductive plate is connected to the thermally conductive copper column arranged on the circuit board without a shielding box; the plane direction of the third thermally conductive plate is perpendicular to the plane direction of the fourth thermally conductive plate.
[0011] In the above cubic satellite integrated stack heat dissipation structure, the area of the third heat conducting plate is smaller than the area of the fourth heat conducting plate, and the area of the third heat conducting plate is equal to the area of the heat dissipation region.
[0012] In the above cubic satellite integrated stack heat dissipation structure, the length of the fourth heat conducting plate is 10-15 mm, and the width of the fourth heat conducting plate is 8-10 mm.
[0013] In the above-mentioned cubic satellite integrated stack heat dissipation structure, the surface of the first thermally conductive copper sheet is coated with thermally conductive silicone grease.
[0014] Compared with the prior art, the present invention has the following beneficial effects:
[0015] (1) The present invention integrates the stack heat dissipation structure with the stack assembly, maximizing the use of the narrow space in the cubic satellite and also having an advantage in weight;
[0016] (2) The present invention conducts the heat generated by the circuit board to the shielding box or the heat dissipation fins, and then conducts it to the heat dissipation surface through the heat-conducting copper sheet, so the heat dissipation path is short and the heat dissipation effect is good;
[0017] (3) The present invention can isothermally stabilize the stack assembly and avoid local high temperature by using heat-conducting copper pillars. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:
[0019] Figure 1 It is a structural schematic diagram of a cubic satellite integrated stack heat dissipation structure provided by an embodiment of the present invention;
[0020] FIG. 2( a ) is a schematic structural diagram of a circuit board with a shielding box provided in an embodiment of the present invention;
[0021] FIG2( b ) is a schematic structural diagram of a circuit board without a shielding box provided in an embodiment of the present invention;
[0022] FIG3( a ) is a schematic structural diagram of a first thermally conductive copper sheet provided in an embodiment of the present invention;
[0023] FIG3( b ) is a schematic structural diagram of a second thermally conductive copper sheet provided in an embodiment of the present invention;
[0024] FIG4( a ) is a schematic structural diagram of the installation of a circuit board with a shielding box and a first thermally conductive copper sheet provided in an embodiment of the present invention;
[0025] FIG. 4( b ) is a schematic structural diagram of the installation of a circuit board without a shielding box and a second thermally conductive copper sheet provided by an embodiment of the present invention. DETAILED DESCRIPTION
[0026] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to be able to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that, in the absence of conflict, the embodiments of the present invention and the features described in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.
[0027] Figure 1 Schematic diagram of the structure of the cubic satellite integrated stack heat dissipation structure provided by the embodiment of the present invention. Figure 1 As shown, the cubic satellite integrated stack heat dissipation structure includes: a plurality of circuit board assemblies, a first support frame 21, a second support frame 22, a stack screw 3 and a thermal conductive copper column 5; wherein,
[0028] Multiple circuit board assemblies are plugged in sequence, and multiple circuit board assemblies are arranged in parallel; a thermal conductive copper column 5 is set on each circuit board assembly; the stacking screw 3 is passed through the thermal conductive copper column 5; the first support frame 21 is connected to one end of the stacking screw 3, and the first support frame 21 is connected to the other end of the stacking screw 3.
[0029] There are two types of circuit board combinations, such as Figure 2a , Figure 3a and Figure 4a As shown, a circuit board assembly includes a circuit board with a shielding box 1 and a first thermal conductive copper sheet 41; wherein,
[0030] The thermally conductive copper pillars 5 are arranged at the four vertex positions of the circuit board 1 with a shielding box; one board surface of the first thermally conductive copper sheet 41 is connected to the shielding box 11 of the circuit board 1 with a shielding box; the other board surface of the first thermally conductive copper sheet 41 is connected to the thermally conductive copper pillars 5 arranged on the circuit board 1 with a shielding box.
[0031] like Figure 3a As shown, the first heat-conducting copper sheet 41 includes a first heat-conducting plate 411 and a second heat-conducting plate 412; wherein one end of the first heat-conducting plate 411 is connected to one side of the second heat-conducting plate 412; the first heat-conducting plate 411 is connected to the shielding box 11 of the circuit board with the shielding box 1, and the second heat-conducting plate 412 is connected to the heat-conducting copper column 5 arranged on the circuit board with the shielding box 1; the plane direction of the first heat-conducting plate 411 is perpendicular to the plane direction of the second heat-conducting plate 412; the area of the first heat-conducting plate 411 is greater than the area of the second heat-conducting plate 412, and the area of the first heat-conducting plate 411 is equal to the area of the shielding box 11. The length of the second heat-conducting plate 412 is 10 to 15 mm, and the width of the second heat-conducting plate 412 is 8 to 10 mm.
[0032] like Figure 2b , Figure 3b and Figure 4b As shown, another circuit board combination includes a circuit board 6 without a shielding box and a second thermally conductive copper sheet 42; wherein, thermally conductive copper columns 5 are arranged at the four top corners of the circuit board 6 without a shielding box; the circuit board 6 without a shielding box is provided with a heat dissipation area 12; one board surface of the second thermally conductive copper sheet 42 is connected to the heat dissipation area 12 of the circuit board 6 without a shielding box; and the other board surface of the second thermally conductive copper sheet 42 is connected to the thermally conductive copper column 5 arranged on the circuit board 6 without a shielding box.
[0033] like Figure 3bAs shown, the second heat-conducting copper sheet 42 includes a third heat-conducting plate 421 and a fourth heat-conducting plate 422; wherein one end of the third heat-conducting plate 421 is connected to one side of the fourth heat-conducting plate 422; the third heat-conducting plate 421 is connected to the heat-dissipating area 12 of the circuit board 6 without a shielding box, and the fourth heat-conducting plate 422 is connected to the heat-conducting copper column 5 provided on the circuit board 6 without a shielding box; the plane direction of the third heat-conducting plate 421 is perpendicular to the plane direction of the fourth heat-conducting plate 422. The area of the third heat-conducting plate 421 is smaller than the area of the fourth heat-conducting plate 422, and the area of the third heat-conducting plate 421 is equal to the area of the heat-dissipating area 12. The length of the fourth heat-conducting plate 422 is 10 to 15 mm, and the width of the fourth heat-conducting plate 422 is 8 to 10 mm.
[0034] The surfaces of the first heat-conducting copper sheet 41 and the second heat-conducting copper sheet are coated with thermal grease.
[0035] Specifically, holes are opened at the four corners of each circuit board and the support frame, and stacking screws are passed through the support frame, thermal conductive copper pillars, circuit board, thermal conductive copper pillars, circuit board, thermal conductive copper pillars...support frame in sequence, and the circuit boards are plugged into each other to achieve the fixation of the stacking assembly.
[0036] The support frame is installed at both ends of the integrated stack heat dissipation structure to fix the stack structure; there are 4 stack screws, which pass through the support frame, thermal conductive copper column, circuit board, thermal conductive copper column, circuit board, thermal conductive copper column...support frame in sequence; every 2 circuit boards are connected by 2 cylindrical thermal conductive copper columns and 2 prismatic thermal conductive copper columns, and the prismatic thermal conductive copper columns are installed close to one side of the circuit board's heat dissipation fins.
[0037] The circuit board without a shielding box has a heat dissipation area, i.e., heat dissipation fins, on the board body to conduct the heat loss of the board to the heat dissipation area; the circuit board with a shielding box can use the shielding box as a heat dissipation area to conduct the heat loss to the outer surface of the shielding box shell. The shielding box circuit board has 4 mounting holes on the shielding box for mounting the thermal conductive copper sheet. The circuit board without a shielding box contains heat dissipation fins, and 2 mounting holes are opened on the heat dissipation fins for mounting the thermal conductive copper sheet.
[0038] The circuit boards with shielding boxes and the circuit boards without shielding boxes are collectively referred to as circuit boards. Four heat-conducting copper pillars are installed at the four corners of the circuit board. The heat-conducting copper pillars close to the side of the heat-conducting copper sheet are prism-shaped and are used to fix and install the heat-conducting copper sheet. The heat-conducting copper pillars are hollow.
[0039] Taking the assembly of the circuit board 1 with the shielding box and the first heat-conducting copper sheet 41 as an example, the heat conduction Q from the shielding box to the mounting surface of the assembly complies with the following formula:
[0040]
[0041] Wherein, T1 is the temperature of the shielding box, T2 is the temperature of the mounting surface of the assembly, R1 is the contact thermal resistance between the first heat conducting plate and the shielding box, R2 is the thermal resistance of the first heat conducting copper sheet itself, R3 is the contact thermal resistance between the second heat conducting plate and the mounting surface, R C1 and R C2 are the corresponding contact thermal resistance coefficients, H1 and H2 are the length and width of the first heat conducting plate, L1 and L2 are the length and width of the second heat conducting plate, d is the thickness of the heat conducting copper sheet, and λ is the thermal conductivity of copper.
[0042] Effect: By applying this formula, the thermal conductivity of each thermally conductive copper sheet can be calculated, and the thermal conductivity of the entire stack heat dissipation structure can be further obtained to meet the heat dissipation required by the stack assembly. By designing the geometric dimensions H1, H2, L1, L2 and d, a balance can be achieved between meeting the required thermal conductivity and reducing weight, making the heat dissipation structure optimal.
[0043] The first thermally conductive copper sheet and the second thermally conductive copper sheet are both L-shaped. The first thermally conductive copper sheet and the second thermally conductive copper sheet are collectively referred to as thermally conductive copper sheets. The thermally conductive copper sheet is a 2mm thick L-shaped copper sheet, one end of which is mounted on the circuit board shielding box (or the heat dissipation area of the circuit board), and the other end is mounted on the prismatic thermally conductive copper column. The size of the thermally conductive copper sheet is designed according to the height of the prismatic thermally conductive column and the height of the circuit board shielding box (heat dissipation fin). The portion of the thermally conductive copper sheet surrounded by H1 and H2 is connected to the circuit board, and the size of H1 and H2 is determined by the size of the heat dissipation area of the circuit board. One side of the portion surrounded by L1 and L2 is fixedly mounted on the thermally conductive copper column, and the other side is the stack assembly mounting surface, which can be directly mounted on the cabin board. L1 is generally 10-15mm, and L2 is generally 8-10mm.
[0044] Thermal grease can be applied between the thermal copper sheet and each mounting surface according to actual conditions to increase heat exchange efficiency. Specifically, the thermal copper sheet is installed at one end of the circuit board shielding box, and thermal grease can be applied to the mounting surface; it is installed at the heat dissipation end of the circuit board and installed directly. The thermal copper sheet is installed at one end of the prismatic heat-conducting column, and thermal grease can be applied between the prismatic heat-conducting column and the thermal copper sheet. The thermal copper sheet is installed at one end of the prismatic heat-conducting column, and can be directly installed with the satellite cabin board, and the cabin board heat dissipation surface is used for heat dissipation.
[0045] This embodiment integrates the stack heat dissipation structure with the stack assembly, maximizes the use of the narrow space in the cubic satellite, and also has an advantage in weight; this embodiment conducts the heat generated by the circuit board to the shielding box or the heat dissipation fins, and then conducts it to the heat dissipation surface through the thermal conductive copper sheet, with a short heat dissipation path and good heat dissipation effect; the present invention uses thermal conductive copper columns to isotherm the stack assembly and avoid local high temperature.
[0046] Although the present invention has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art may make possible changes and modifications to the technical solution of the present invention by using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall fall within the protection scope of the technical solution of the present invention.
Claims
1. A cubic satellite integrated stack heat dissipation structure, Features include: A plurality of circuit board assemblies, a first support frame (21), a second support frame (22), a stacking screw (3) and a heat-conducting copper column (5); wherein: Multiple circuit board assemblies are plugged in sequentially, and multiple circuit board assemblies are arranged in parallel; The heat-conducting copper pillar (5) is arranged on each circuit board assembly; The stack screw (3) is inserted into the heat-conducting copper column (5); The first support frame (21) is connected to one end of the stack screw rod (3), and the first support frame (21) is connected to the other end of the stack screw rod (3).
2. The cubic satellite integrated stack heat dissipation structure according to claim 1, Features: The circuit board assembly comprises a circuit board with a shielding box (1) and a first heat-conducting copper sheet (41); wherein: The heat-conducting copper pillars (5) are arranged at four vertex positions of the circuit board with a shielding box (1); A plate surface of the first heat-conducting copper sheet (41) is connected to the shielding box (11) of the circuit board with a shielding box (1); The other plate surface of the first heat-conducting copper sheet (41) is connected to a heat-conducting copper column (5) provided on the circuit board (1) with a shielding box.
3. The cubic satellite integrated stack heat dissipation structure according to claim 2, Features: The circuit board with a shielding box (1) comprises a first circuit board and a shielding box (11); wherein the shielding box (11) is connected to the first circuit board.
4. The cubic satellite integrated stack heat dissipation structure according to claim 2, Features: The first heat-conducting copper sheet (41) comprises a first heat-conducting plate (411) and a second heat-conducting plate (412); wherein: One end of the first heat conducting plate (411) is connected to one side of the second heat conducting plate (412); The first heat conducting plate (411) is connected to the shielding box (11) of the circuit board with a shielding box (1), and the second heat conducting plate (412) is connected to a heat conducting copper column (5) provided on the circuit board with a shielding box (1); The plane direction of the first heat conducting plate (411) and the plane direction of the second heat conducting plate (412) are perpendicular to each other; The area of the first heat conducting plate (411) is greater than the area of the second heat conducting plate (412), and the area of the first heat conducting plate (411) is equal to the area of the shielding box (11).
5. The cubic satellite integrated stack heat dissipation structure according to claim 4, Features: The length of the second heat conducting plate (412) is 10 to 15 mm, and the width of the second heat conducting plate (412) is 8 to 10 mm.
6. The cubic satellite integrated stack heat dissipation structure according to claim 1, Features: The circuit board assembly comprises a circuit board without a shielding box (6) and a second heat-conducting copper sheet (42); wherein: The heat-conducting copper pillars (5) are arranged at four vertex positions of the circuit board (6) without a shielding box; The circuit board without a shielding box (6) is provided with a heat dissipation area (12); A plate surface of the second heat-conducting copper sheet (42) is connected to the heat dissipation area (12) of the circuit board (6) without a shielding box; The other plate surface of the second heat-conducting copper sheet (42) is connected to a heat-conducting copper column (5) provided on a circuit board (6) without a shielding box.
7. The cubic satellite integrated stack heat dissipation structure according to claim 6, Features: The second heat-conducting copper sheet (42) comprises a third heat-conducting plate (421) and a fourth heat-conducting plate (422); wherein: One end of the third heat conducting plate (421) is connected to one side of the fourth heat conducting plate (422); The third heat conducting plate (421) is connected to the heat dissipation area (12) of the circuit board (6) without a shielding box, and the fourth heat conducting plate (422) is connected to a heat conducting copper column (5) provided on the circuit board (6) without a shielding box; The plane direction of the third heat conducting plate (421) and the plane direction of the fourth heat conducting plate (422) are perpendicular to each other.
8. The cubic satellite integrated stack heat dissipation structure according to claim 7, Features: The area of the third heat conducting plate (421) is smaller than the area of the fourth heat conducting plate (422), and the area of the third heat conducting plate (421) is equal to the area of the heat dissipation area (12).
9. The cubic satellite integrated stack heat dissipation structure according to claim 7, Features: The length of the fourth heat conducting plate (422) is 10 to 15 mm, and the width of the fourth heat conducting plate (422) is 8 to 10 mm.
10. The cubic satellite integrated stack heat dissipation structure according to claim 2, Features: The surface of the first heat-conducting copper sheet (41) is coated with heat-conducting silicone grease.