Radiation imaging apparatus, radiation imaging system, and method for manufacturing radiation imaging apparatus

Abstract

The invention discloses a radiation imaging apparatus, a radiation imaging system, and a method of manufacturing the radiation imaging apparatus. There is provided a radiation imaging apparatus including: a sensor panel including a first surface and a second surface provided with a pixel array and an electrical connection portion; and a base configured to support the second surface through the first member and the second member. In an orthogonal projection of the first surface, an electrical connection is provided between a region provided with a first member and an outer edge of the panel, the first member being provided to overlap with the pixel array, and a second member being provided to overlap with the electrical connection. The second member is secured to at least one of the second surface, the base, and the first member, and a passage extending from the first member to the outer edge is provided between the second surface and the base so as not to overlap with the second member in an orthogonal projection to the first surface.

Description

Technical Field

[0001] The present invention relates to a radiation imaging apparatus, a radiation imaging system, and a method for manufacturing a radiation imaging apparatus. Background Art

[0002] Japanese Patent Publication No. 2015-052535 discloses a radiation detection device including a sensor panel provided with a pixel array and an electrical connection portion, to which a wiring member for reading out a signal from the pixel array to the outside is connected. According to Japanese Patent Publication No. 2015-052535, when the wiring member is crimped to the electrical connection portion, damage and deformation of the sensor panel are suppressed by supporting the electrical connection portion with a frame-like support member. Summary of the invention

[0003] In the arrangement shown in Japanese Patent Publication No. 2015-052535, when the ambient temperature changes, a pressure difference may occur between the space surrounded by the frame-shaped support member, the sensor panel and the support substrate and the external space. If the sensor panel is deformed due to the pressure difference, artifacts may appear in the image obtained by the sensor panel.

[0004] Some embodiments of the present invention provide techniques that are useful for suppressing degradation of image quality.

[0005] According to some embodiments, a radiation imaging device is provided, which includes: a sensor panel, the sensor panel including a first surface provided with a pixel array and an electrical connection portion, and a second surface located on an opposite side to the first surface; a wiring member, the wiring member connected to the electrical connection portion; and a support base, the support base being configured to support the second surface through a first support member and a second support member, wherein in an orthogonal projection of the first surface, the electrical connection portion is provided between an area provided with the first support member and an outer edge of the sensor panel, the first support member is provided so as to overlap with the pixel array, and the second support member is provided so as to overlap with the electrical connection portion, the second support member is fixed to at least one of the second surface, the support base and the first support member, and a passage extending from the first support member to the outer edge is provided between the second surface and the support base so as not to overlap with the second support member in an orthogonal projection of the first surface.

[0006] According to some other embodiments, a manufacturing method for a radiation imaging device is provided, the method comprising: preparing a sensor panel, the sensor panel comprising a first surface provided with a pixel array and an electrical connection portion and a second surface located on an opposite side to the first surface; and fixing the sensor panel to a supporting base, the supporting base supporting the second surface by a first supporting member, wherein in an orthogonal projection of the first surface, the electrical connection portion is provided between an area provided with the first supporting member and an outer edge of the sensor panel, the first supporting member being provided so as to overlap with the pixel array, the method further comprising providing a second supporting member between the second surface and the supporting base so as to overlap with the electrical connection portion to support the electrical connection portion, and connecting a wiring member to the electrical connection portion, the second supporting member being fixed to at least one of the second surface, the supporting base and the first supporting member, and a passage extending from the first supporting member to the outer edge being provided between the second surface and the supporting base so as not to overlap with the second supporting member in an orthogonal projection of the first surface.

[0007] Further features of the present invention will become apparent from the following description of exemplary embodiments (with reference to the attached drawings). BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 is a diagram showing an example of the arrangement of a radiation imaging system including the radiation imaging apparatus according to the embodiment;

[0009] FIG. 2A to FIG. 2C is a diagram showing an example of the arrangement of a radiation imaging apparatus according to the present embodiment;

[0010] Figure 3A and Figure 3B is a diagram showing an example of the arrangement of a radiation imaging apparatus according to the present embodiment;

[0011] FIG. 4A to FIG. 4C is a diagram showing an example of the arrangement of a radiation imaging apparatus according to the present embodiment;

[0012] FIG. 5A to FIG. 5C is a diagram showing an example of the arrangement of a radiation imaging apparatus according to the present embodiment;

[0013] FIG. 6A to FIG. 6C is a diagram showing an example of the arrangement of a radiation imaging apparatus according to the present embodiment;

[0014] FIG. 7A to FIG. 7C is a diagram showing an example of a method of manufacturing a radiation imaging apparatus according to the present embodiment;

[0015] Figure 8is a diagram showing an example of a method of manufacturing a radiation imaging apparatus according to the present embodiment;

[0016] Fig. 9 is a diagram illustrating an example of a method of manufacturing the radiation imaging apparatus according to the present embodiment; and

[0017] Fig. 10A and Fig. 10B is a diagram illustrating an example of a method of manufacturing the radiation imaging apparatus according to the present embodiment. DETAILED DESCRIPTION

[0018] Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments are not intended to limit the scope of the claimed invention. A plurality of features are described in the embodiments, but no limitation is imposed on the invention requiring all such features, and a plurality of such features may be appropriately combined. In addition, in the accompanying drawings, the same reference numerals are given to the same or similar configurations, and redundant descriptions thereof are omitted.

[0019] Note that radiation according to the present disclosure may include not only alpha rays, beta rays and gamma rays which are beams generated by particles (including photons) emitted by radioactive decay, but also beams having energies equal to or higher than these beams, such as X-rays, particle rays and cosmic rays.

[0020] Reference Figures 1 to 10A and Fig. 10B A radiation imaging apparatus according to an embodiment of the present disclosure is described. Figure 1 1 is a schematic diagram showing an example of the arrangement of a radiation imaging system SYS using the radiation imaging device 150 according to the present embodiment. The radiation imaging system SYS may include the radiation imaging device 150, a radiation generating device 152, and a processing device 153. The radiation imaging device 150 and the radiation generating device 152 are connected to the processing device 153. The radiation generating device 152 emits radiation under the control of the processing device 153. The radiation imaging device 150 detects the radiation emitted from the radiation generating device 152 and transmitted through the subject 151. The radiation imaging device 150 transmits the information of the detected radiation to the processing device 153 as a signal. The processing device 153 performs desired arithmetic processing. The processing device 153 generates a radiographic image for diagnosis, for example, from the information of the radiation detected by the radiation imaging device 150. Figure 1 It is shown that a wired connection is made between the radiation imaging apparatus 150 and the processing apparatus 153 and between the radiation generating apparatus 152 and the processing apparatus 153. However, this is not exhaustive, and a wireless connection may be made therebetween.

[0021] FIG. 2A to FIG. 2Cis a schematic diagram showing an example of the arrangement of a radiation imaging apparatus 150 according to the present embodiment. Figure 2A is a plan view of the radiation imaging apparatus 150 . Figure 2B It is along Figure 2A A cross-sectional view taken along line AA' is shown in FIG. Figure 2C It is along Figure 2A A cross-sectional view taken along line BB' shown in FIG.

[0022] The radiation imaging device 150 includes a sensor panel 100, a wiring member 110, and a support base 300. The sensor panel 100 includes a surface 131 provided with a pixel array 102 and an electrical connection portion 111, and a surface 132 on the opposite side of the surface 131. The support base 300 supports the surface 132 of the sensor panel 100 through a support member 301 and a support member 401. The sensor panel 100 includes a substrate 101 made of a semiconductor such as silicon, glass, plastic, etc. The pixel array 102 is provided on the surface 131 of the sensor panel 100 (substrate 101). Pixels each including a conversion element that converts radiation or light into an electrical signal and a switching element such as a TFT are provided on the pixel array 102 in, for example, a two-dimensional pattern.

[0023] For example, amorphous selenium (a-Se) that directly converts radiation into an electrical signal may be used for each conversion element provided on the pixel array 102. Alternatively, as Figure 2B As shown in , for example, a combination of a scintillator 200 and a photosensor (photoelectric conversion element) such as a photodiode or a photocapacitor that converts light converted from radiation by the scintillator 200 into an electrical signal can be used for each conversion element provided on the pixel array 102. The photoelectric conversion element can be formed of a semiconductor such as amorphous silicon or an oxide semiconductor such as IGZO.

[0024] The electrical connection portion 111 is provided on the periphery of the pixel array 102 on the surface 131 of the sensor panel 100. More specifically, in an orthogonal projection of the surface 131 of the sensor panel 100, the electrical connection portion 111 is provided between a region where a support member 301 supporting the pixel array 102 is provided and an outer edge 133 of the sensor panel 100. The wiring member 110 is connected to the electrical connection portion 111 provided on the surface 131 of the sensor panel 100. Signals and power for operating the pixel array 102 are supplied via the wiring member 110 and the electrical connection portion 111, and signals generated by the pixel array 102 are output from the sensor panel 100 to the outside.

[0025] As described above, the wiring member 110 is located outside the pixel array 102 and is electrically connected to the pixel array 102. In this embodiment, a plurality of electrical connection portions 111 are provided on the surface 131 of the sensor panel 100, and a plurality of wiring members 110 are provided to correspond to the electrical connection portions 111, respectively. Figure 2A As shown in , the electrical connection portions 111 and the wiring members 110 may be provided on the respective four sides of the rectangular pixel array 102. However, this is not exhaustive, and the electrical connection portions 111 and the wiring members 110 may be provided only along one side, along two adjacent or opposite sides, or along three sides. In addition, the wiring members 110 may be connected to all the electrical connection portions 111 provided on the sensor panel 100. However, depending on the design of the sensor panel 100, etc., some of the electrical connection portions 111 may not be connected to the wiring members 110.

[0026] exist FIG. 2A to FIG. 2C In the case shown in , the sensor panel 100 is formed of one sensor chip. However, this is not exhaustive, and the sensor panel 100 may be formed of a plurality of sensor chips. The pixel array 102 may be covered with a protective layer using an inorganic film such as a silicon oxide film or a silicon nitride film. In addition, a passivation film using an organic film such as a polyimide film may be provided on the protective film to flatten the surface of the sensor panel 100.

[0027] A flexible board or the like may be used for the wiring member 110. For example, the wiring member 110 is connected to a circuit board (not shown) provided with a circuit, which is provided on the surface 132 of the sensor panel 100 and is used to operate the pixel array 102. For example, a printed wiring board on which a semiconductor chip including a desired circuit is mounted is used for the circuit board. A circuit 113 for operating the pixel array 102 may be provided on the wiring member 110. The circuit 113 may include, for example, a driving circuit for driving the pixel array 102 and a signal processing circuit for performing signal processing such as amplification of an electrical signal read out from the pixel array 102. The wiring member 110 utilizes a bonding member 112 ( Figure 8 ) is bonded to an electrical connection portion 111 provided on a surface 131 of the sensor panel 100 and is electrically connected to the pixel array 102.

[0028] In the present embodiment, as described above, the scintillator 200 is provided as a part of the conversion element. The scintillator 200 can be shared by a plurality of photoelectric conversion elements. The scintillator 200 is provided on the surface 131 of the sensor panel 100 so as to cover the pixel array 102 provided on the surface 131 of the sensor panel 100. However, this is not exhaustive, and for example, in the case where the substrate 101 is transparent, such as Figure 3A and Figure 3BAs in the arrangement shown in , the scintillator 200 may also be provided on the surface 132 of the sensor panel 100. In an orthogonal projection to the surface 131 of the sensor panel 100, the scintillator 200 is provided at a position covering the pixel array 102 on the surface 131 of the sensor panel 100 (also on the surface 132).

[0029] The scintillator 200 converts radiation entering the radiation imaging device 150 into light (e.g., visible light) having a wavelength that can be detected by the photoelectric conversion element provided on the pixel array 102. An alkali halide material represented by CsI:TI obtained by doping cesium iodide with thallium (Tl) can be used for the scintillator 200. Alternatively, a powder phosphor (also referred to as GOS) obtained by doping a matrix of a metal oxysulfide (e.g., Gd2O2S) with a small amount of trivalent rare earth (such as terbium or europium) as a luminescent center can be used for the scintillator 200. As described above, when the conversion element provided on the pixel array 102 directly converts radiation into an electrical signal, the scintillator 200 is omitted.

[0030] The surface of the scintillator 200 that is not in contact with the sensor panel 100 may be covered with a scintillator protective layer 201. The scintillator protective layer 201 is provided to suppress a reduction in the amount of luminescence and sharpness due to the hygroscopicity of the scintillator 200. The scintillator protective layer 201 may be formed by bonding a resin having low moisture permeability or a sheet having low moisture permeability to the surface of the scintillator 200 via an adhesive layer such as an adhesive or an adhesive compound. Examples of resins having low moisture permeability include chlorine-based resins such as polyparaxylene and polyvinylidene chloride and fluorine-based resins such as polychlorotrifluoroethylene and polyvinylidene fluoride. In addition to resin sheets, examples of sheets having low moisture permeability include metal foils such as aluminum, silver, and copper. In the Figure 2B and Figure 3A In the arrangement shown in , the scintillator protection layer 201 is formed by bonding an aluminum sheet to the scintillator 200 using a bonding compound.

[0031] The support member 301 is provided so as to overlap with the pixel array 102 in an orthogonal projection to the surface 131 of the sensor panel 100. Figure 2B As shown in , the size of the pixel array 102 may be the same as that of the support member 301. The support member 301 is a member for supporting the region of the substrate 101 including at least the pixel array 102 from the surface 132 side of the sensor panel 100. In other words, the support base 300 supports the pixel array 102 from the surface 132 side of the sensor panel 100 through the support member 301. Metal materials such as stainless steel, aluminum, or molybdenum, glass, ceramics, etc. may be used for the support base 300. The support member 301 may be a member for bonding the support base 300 to the sensor panel 100.

[0032] The support member 401 is provided so as to overlap with at least one of the electrical connection parts 111 provided on the sensor panel 100. The support member 401 supports the sensor panel 100 from the surface 132 side in a region where the support member 301 is not provided. The support member 401 is fixed to at least one of the surface 132 of the sensor panel 100, the support base 300, and the support member 301.

[0033] like Figure 2A As shown in , a plurality of support members 401 may be provided. For example, in an orthogonal projection of the surface 131 of the sensor panel 100, a plurality of support members 401 may be provided intermittently so as to surround the pixel array 102. In any case, the via 140 is provided between the surface 132 of the sensor panel 100 and the support base 300 so as to extend from the support member 301 to the outer edge 133 of the sensor panel 100 without overlapping the support member 301 in the orthogonal projection of the surface 131 of the sensor panel 100. That is, as Figure 2A As shown in , even though the support member 401 is provided so as to surround the pixel array 102 , the support member 401 does not continuously surround the pixel array 102 .

[0034] When the support member 401 continuously surrounds the pixel array 102, changes in ambient temperature may cause an air pressure difference between the space surrounded by the support member 401, the sensor panel 100, and the support base 300 and the external space. If an air pressure difference occurs, artifacts may appear in the acquired image due to deformation of the sensor panel 100, etc. In addition, when, for example, the support member 401 is fixed to the sensor panel 100 and the support base 300, changes in ambient temperature may cause deformation due to the difference in expansion coefficient between the sensor panel 100 and the support base 300. This may cause artifacts. Such mechanical deformation may cause damage and failure of the sensor panel 100.

[0035] In this embodiment, a passage 140 extending from the support member 301 to the outer edge 133 of the sensor panel 100 is provided between the surface 132 of the sensor panel 100 and the support base 300 without providing any support member 401. The passage 140 is used to prevent the difference in air pressure between the space surrounded by the support member 401, the sensor panel 100 and the support base 300 and the external space. Even if the support member 401 is fixed to the sensor panel 100 and the support base 300, providing the passage 140 can reduce deformation caused by the difference in expansion coefficient between the sensor panel 100 and the support base 300 with changes in ambient temperature. This enables the radiation imaging device 150 according to the present embodiment to suppress degradation of image quality due to, for example, the occurrence of artifacts. It is also possible to suppress damage and malfunction of the sensor panel 100 provided in the radiation imaging device 150.

[0036] The support member 401 may be, for example, a resin that bonds the surface 132 of the sensor panel 100 to the support base 300. Alternatively, for example, the support member 401 may be a sheet-like member having an adhesive surface. In addition, the support member 401 may be formed by a plurality of members. For example, the support member 401 may be formed by a plate-like member provided on the support base 300 so as to overlap with the electrical connection portion 111, and a bonding member using a hardened resin that bonds the plate-like member to the surface 132 of the sensor panel 100. In this case, the support member 401 is fixed to the surface 132 of the sensor panel 100 using the bonding member. Therefore, the support member 401 may be fixed to at least one of the support member 301 and the support base 300, or may not be fixed to the support member 301 and the support base 300.

[0037] exist Figure 2A In the arrangement shown in , a support member 401 is provided separately for each side of the rectangular sensor panel 100. However, this is not exhaustive. FIG. 4A to FIG. 4C As shown in , at least two support members 401 may be provided intermittently along one side of the outer edge 133 of the sensor panel 100. FIG. 5A to FIG. 5C As shown in , the support member 401 may be provided so as to span across both sides of the outer edge 133 of the sensor panel 100. Alternatively, one support member 401 may be provided so as to support one electrical connection portion 111 or to support two or more electrical connections 111. The passage 140 may be provided at any position. The passage 140 extending from the support member 301 to the outer edge 133 of the sensor panel 100 may be provided between the surface 132 of the sensor panel 100 and the support base 300 without providing any support member 401.

[0038] like FIG. 6A to FIG. 6CAs shown in , the support member 401 does not need to be provided so as to overlap with all the electrical connections 111. Although described in detail later, the support member 401 may be provided so as to overlap with at least one electrical connection 111. In other words, in an orthogonal projection of the surface 131 of the sensor panel 100, the plurality of electrical connections 111 may include an electrical connection 111 provided at a position that does not overlap with the support member 401. In addition, the electrical connection 111 does not need to be provided along all sides of the outer edge 133 of the sensor panel 100. Depending on the design of the sensor panel 100, the electrical connection 111 may be provided as shown in FIG. Fig. 6A The electrical connection portions 111 are provided only along two sides as shown in FIG. 1 , or the electrical connection portions 111 may be provided along one side or three sides.

[0039] The elastic modulus of the support member 401 may be equal to or higher than the elastic modulus of the support member 301. Providing the support member 401 may improve the impact resistance near the outer edge 133 of the sensor panel 100 not provided with the support member 301 and suppress damage and failure of the sensor panel 100. For example, the material of the support member 401 may be selected so that when a pressure of 0.5 MPa is applied to the electrical connection portion 111 supported by the support member 401 in the direction from the surface 131 to the surface 132 of the sensor panel 100, the displacement amount of the outer edge of the sensor panel 100 becomes equal to or less than the thickness of the sensor panel 100 (substrate 101). Alternatively, for example, the material of the support member 401 may be selected so that when a pressure of 0.5 MPa is applied to the electrical connection portion 111 supported by the support member 401 in the direction from the surface 131 to the surface 132 of the sensor panel 100, the displacement amount of the outer edge of the sensor panel 100 becomes equal to or less than 100 μm. This makes it possible to suppress damage to the sensor panel 100 when, for example, the wiring member 110 is connected to the electrical connection portion 111 by crimping.

[0040] Next, an example of a manufacturing method for the radiation imaging device 150 will be described. First, as FIG. 7A to FIG. 7C As shown in , the sensor panel 100 is prepared. The sensor panel 100 includes a surface 131 provided with a pixel array 102 and an electrical connection portion 111 and a surface 132 on the opposite side of the surface 131. In this step, various types of existing techniques can be used.

[0041] For example, the pixel array 102 and the electrical connection portion 111 are formed on a substrate 101 such as a glass substrate by using various types of semiconductor processes. Subsequently, the scintillator 200 is formed so as to cover the pixel array 102. The scintillator 200 is formed by heating and depositing CsI and TlI simultaneously in a vacuum chamber. When a powder phosphor is used as the scintillator 200, the scintillator 200 is formed by, for example, applying and drying GOS or the like.

[0042] The scintillator protective layer 201 is formed so as to cover the scintillator 200. For example, the scintillator protective layer 201 is formed by bonding an aluminum sheet coated with an adhesive compound to the scintillator 200 using a roll laminator so as to cover it. As the scintillator protective layer 201, a polyparaxylene layer or the like can be formed by using a CVD method. In this case, for example, the sensor panel 100 formed with the scintillator 200 is installed in a CVD chamber, and after the chamber is evacuated to about 30 Pa, while the stage on which the sensor panel 100 is installed is rotated at 5 rpm, a polyparaxylene film is formed.

[0043] After the formation of the scintillator 200 and the scintillator protection layer 201, the wiring member 110 is connected to the electrical connection portion 111. For example, Figure 8 As shown in , the wiring member 110 is connected to the electrical connection portion 111 provided on the surface 131 of the sensor panel 100 through a bonding member 112 such as an anisotropic conductive film (ACF) or a gold bump. For example, the wiring member 110 is connected to the electrical connection portion 111 by performing thermal compression bonding for 5 seconds to 5 minutes under the conditions of a temperature of 100° C. to 200° C. and a pressure of 0.5 MPa to 5 MPa using a compression bonding device 600. In the case where compression bonding is not used, the wiring member 110 can be connected to the electrical connection portion 111 by a method without heating and pressurization. The wiring member 110 can be connected to the electrical connection portion 111 before the formation of the scintillator 200 and the scintillator protective layer 201.

[0044] The next step includes fixing the sensor panel 100 to a support base 300, which supports the surface 132 of the sensor panel 100 by means of a support member 301 and a support member 401. The support member 301 may be, for example, a silicon-based adhesive compound having a thickness of 100 μm. The support member 301 is provided to contact an area overlapping with a portion of the surface 132 of the sensor panel 100 where the pixel array 102 is provided.

[0045] When the sensor panel 100 is fixed to the support base 300 by the support member 301, the support member 401 may be provided between the support base 300 and the surface 132 of the sensor panel 100. Alternatively, the support member 401 may be formed after the sensor panel 100 is fixed to the support base 300 by the support member 301. As described above, the support member 401 is provided at a position where it overlaps with the electrical connection portion 111. The support member 401 may be coated only with a two-component epoxy resin that promotes its hardening by mixing two types of liquids. Alternatively, a plate may be arranged on the support base 300, and the epoxy resin may be applied to the plate.

[0046] The radiation imaging device 150 is manufactured by using the above steps. Providing the support member 401 will increase the rigidity near the outer edge 133 of the sensor panel 100. This can suppress damage to the sensor panel 100 even when an impact is applied to the radiation imaging device 150, for example, when the radiation imaging device 150 is moved or moved. As a result, the reliability of the radiation imaging device 150 is improved. In addition, as Fig. 6A As shown in , the support member 401 is provided even in the vicinity of the electrical connection portion 111 where the support member 401 is not provided directly thereunder. Therefore, damage to the sensor panel 100 can be suppressed compared to a case where the support member 401 is not provided.

[0047] As described above, the passage 140 extending from the support member 301 to the outer edge 133 of the sensor panel 100 is provided between the surface 132 of the sensor panel 100 and the support base 300, and the support member 401 discontinuously surrounds the pixel array 102. This can suppress deformation of the sensor panel 100 due to, for example, a change in ambient temperature and suppress the occurrence of artifacts. That is, it is possible to suppress degradation of the image quality of the image obtained by the radiation imaging device 150.

[0048] According to the above manufacturing method, when the sensor panel 100 is fixed to the support base 300, the support members 301 and 401 are provided at similar timing. However, the manufacturing method is not limited thereto. An example of a manufacturing method for the radiation imaging apparatus 150 different from the above manufacturing method will be described below.

[0049] The steps before the step of fixing the sensor panel 100 to the support base 300 may be similar to the steps in the above-mentioned manufacturing method. In this case, the sensor panel 100 having the wiring member 110 connected to the electrical connection portion 111 is prepared. Next, the sensor panel 100 is fixed to the support base 300 that supports the surface 132 of the sensor panel 100 by the support member 301. At this time, the support member 401 has not yet been provided.

[0050] Subsequently, the radiation imaging apparatus 150 is manufactured by using appropriate steps, and a completion inspection of the radiation imaging apparatus 150 is performed. In this inspection, for example, a failure in connection through the wiring member 110 or a failure in the circuit 113 provided on the wiring member 110 is sometimes found. Fig. 9A fault is found in the wiring member 110 of the electrical connection portion 111 at the position R shown. In this case, from the viewpoint of cost, it is necessary to replace only the wiring member 110 in which the fault is found. Therefore, based on the result obtained in the inspection step, the wiring member 110 provided at the position R is disassembled from the electrical connection portion 111. Subsequently, the bonding member 112 remaining on the surface 131 of the sensor panel 100 is removed by using a solvent such as acetone or methyl ethyl ketone (MEK).

[0051] Next, a wiring member 110 different from the detached wiring member 110 is connected to the electrical connection portion 111 provided at the position R. In this case, due to the support member 301 provided so as to overlap with the pixel array 102, a space is formed between the electrical connection portion 111 provided at the position R and the support base 300. Therefore, when the wiring member 110 is connected to the electrical connection portion 111 provided at the position R, the pressure generated when the wiring member 110 is subjected to crimping may damage a portion of the sensor panel 100 located near the position R.

[0052] Before the wiring member 110 is connected to the electrical connection portion 111, as shown in Fig. 10, the support member 401 is arranged in a region overlapping at least the electrical connection portion 111 provided at the position R in the orthogonal projection of the surface 131 of the sensor panel 100. The support member 401 may be formed by being coated with epoxy resin, or may be formed by arranging a plate on the support base 300 and applying epoxy resin to the plate.

[0053] After the formation of the support member 401, a new wiring member 110 is connected to the electrical connection portion 111. Steps and references for connecting the wiring member 110 Figure 8 The steps described are similar. When the wiring member 110 is connected, a support member 401 is provided between the sensor panel 100 and the support base 300. This makes it possible to ensure the rigidity of the sensor panel 100 (substrate 101) at the position R and suppress connection failures between the electrical connection portion 111 and the new wiring member 110 and damage to the sensor panel 100. As a result, the reliability of the radiation imaging device 150 can be improved and the yield can be improved. In addition, as described above, the passage 140 is provided between the surface 132 of the sensor panel 100 and the support base 300, and the support member 401 discontinuously surrounds the pixel array 102. This makes it possible to suppress deformation of the sensor panel 100 due to changes in ambient temperature and suppress the occurrence of artifacts.

[0054] While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.

Claims

1. A radiation imaging device, comprising: a sensor panel comprising a first surface provided with a pixel array and electrical connections and a second surface located on an opposite side to the first surface; a wiring member connected to the electrical connection portion; as well as a support base configured to support the second surface via a first support member and a second support member, wherein in an orthogonal projection of the first surface, the electrical connection portion is provided between an area where the first supporting member is provided and an outer edge of the sensor panel, the first supporting member is provided so as to overlap with the pixel array, and the second supporting member is provided so as to overlap with the electrical connection portion, the second support member is fixed to at least one of the second surface, the support base, and the first support member, and A passage extending from the first support member to the outer edge is provided between the second surface and the support base so as not to overlap with the second support member in an orthogonal projection of the first surface. 2 . The device according to claim 1 , wherein when a pressure of 0.5 MPa is applied to the electrical connection portion in a direction from the first surface to the second surface, a displacement amount of the outer edge is not greater than a thickness of the sensor panel. 3 . The device according to claim 1 , wherein in a case where a pressure of 0.5 MPa is applied to the electrical connection portion in a direction from the first surface to the second surface, a displacement amount of the outer edge is not more than 100 μm. 4 . The device according to claim 1 , wherein an elastic modulus of the second supporting member is not less than an elastic modulus of the first supporting member.

5. The apparatus of claim 1, wherein a plurality of second support members including the second support member are provided. 6 . The device according to claim 5 , wherein at least two second supporting members among the plurality of second supporting members are provided intermittently along one of the outer edges. 7 . The device according to claim 5 , wherein the plurality of second supporting members are provided intermittently so as to surround the pixel array in an orthogonal projection on the first surface.

8. The device according to claim 5, wherein the first surface is provided with a plurality of electrical connections including the electrical connection, and The plurality of second support members include one second support member configured to support no less than two electrical connections.

9. The device of claim 1, wherein the first surface is provided with a plurality of electrical connections including the electrical connection, and The second supporting member supports no less than two electrical connecting portions among the plurality of electrical connecting portions. 10 . The device of claim 8 , wherein the plurality of electrical connections include an electrical connection provided at a position where the electrical connection does not overlap with the second support member in an orthogonal projection of the first surface.

11. The device according to claim 1, wherein the wiring member is provided with a circuit configured to operate the pixel array.

12. The device according to claim 1, wherein a scintillator is provided so as to cover the first surface.

13. A radiation imaging system, comprising: The radiation imaging device according to any one of claims 1 to 12; as well as A processing device configured to process a signal output from the radiation imaging device.

14. A method for manufacturing a radiation imaging device, the method comprising: preparing a sensor panel including a first surface provided with a pixel array and electrical connections and a second surface located on an opposite side to the first surface; as well as fixing the sensor panel to a support base, the support base supporting the second surface via a first support member, wherein in an orthogonal projection of the first surface, the electrical connection is provided between an area provided with the first support member and an outer edge of the sensor panel, the first support member being provided so as to overlap with the pixel array, The method further comprises: providing a second supporting member between the second surface and the supporting base so as to overlap with the electrical connecting portion to support the electrical connecting portion, and connecting a wiring member to the electrical connection portion, the second support member is fixed to at least one of the second surface, the support base, and the first support member, and A passage extending from the first support member to the outer edge is provided between the second surface and the support base so as not to overlap with the second support member in an orthogonal projection of the first surface.

15. The method according to claim 14, wherein said connecting is performed after said providing, In the preparation, a wiring member different from the wiring member is connected to the electrical connection portion, and The method further includes detaching a different wiring member from the electrical connection portion between the fixing and the providing.

16. The method according to claim 15, further comprising inspecting the radiation imaging device between the fixing and the removing, wherein the different wiring members are removed based on a result of the inspection.

Images