Laser drilling and in-situ measurement device and method of use

Abstract

The application provides a laser drilling and in-situ measuring device and a use method thereof. When laser drilling is performed, the machining laser is focused by a long-focus focusing lens once, transmitted to a short-focus focusing lens by a three-dimensional scanning galvanometer, focused by the short-focus focusing lens twice to form a smaller spot machining laser, and the smaller spot machining laser is ablated to remove the material of a part on the part by a machining moving path formed by the three-dimensional scanning galvanometer to form a small hole. When laser measurement is performed, the integrated nozzle is removed, the measurement laser is focused by the long-focus focusing lens once, transmitted to the small hole by the three-dimensional scanning galvanometer, and the measurement scanning pattern formed by the three-dimensional scanning galvanometer fully covers the small hole and is reflected back to an optical coherence tomography measuring instrument by a second bivector mirror, and the three-dimensional topography size of the small hole is obtained by interference imaging of the reference laser of the optical coherence tomography measuring instrument. The application can realize in-situ measurement after laser drilling, and is convenient to operate.

Description

Technical Field

[0001] The present invention relates to the technical field of laser hole making, and more particularly to a laser hole making and in-situ measurement device and a method for using the same. Background Art

[0002] Realizing online measurement of the three-dimensional morphology and aperture of complexly distributed small holes in laser processing space has always been a technical challenge in the industry. In order to realize online measurement of the three-dimensional morphology and size of complexly distributed air film holes on ultrafast laser processed blades, optical coherence tomography (OCT) technology is generally used. In the existing technology, the existing ultrafast laser processing head and the OCT measurement device are arranged separately on the equipment. The OCT measurement device needs to be repeatedly translated and aligned, which is inconvenient to operate. In addition, the two sets of devices are arranged in parallel, which takes up a large space and has a large Z-axis mechanism size. It also requires a large stroke of the workpiece translation movement mechanism, which is not suitable for the miniaturization and compact design requirements of small-size workpiece laser hole making equipment. Summary of the Invention

[0003] (1) Technical issues to be resolved

[0004] The technical problem to be solved by the present invention is that the existing ultrafast laser processing head and the OCT measurement device are set separately, which requires repeated translation and alignment, is inconvenient to operate, and does not meet the existing measurement requirements of small-sized workpieces.

[0005] (2) Technical solution

[0006] To achieve the above object, the technical solution adopted by the present invention is:

[0007] In a first aspect, the present invention provides a method comprising a first laser source, a first dichroic mirror, a second laser source, an optical coherence tomography instrument, a second dichroic mirror, a long focal length focusing lens, a three-dimensional scanning galvanometer, and an integrated nozzle, wherein the first laser source is used to output a processing laser, the second laser source is used to output a measuring laser, and the second dichroic mirror is used to transmit the processing laser and reflect the measuring laser so that the processing laser and the measuring laser are output coaxially; a short focal length focusing lens is installed in the integrated nozzle, and when laser drilling is performed, the processing laser is focused once by the long focal length focusing lens and then transmitted to the short focal length focusing lens by the three-dimensional scanning galvanometer, The short focal length focusing lens focuses the processing laser twice to form a smaller spot processing laser. The smaller spot processing laser ablates and removes the material of the part through the processing movement path formed by the three-dimensional scanning galvanometer on the part to form a small hole. When performing laser measurement, the integrated nozzle is removed, and the measuring laser is focused only once by the long focal length focusing lens and then transmitted to the small hole through the three-dimensional scanning galvanometer. The measurement scanning pattern formed by the three-dimensional scanning galvanometer fully covers the small hole and is reflected back to the optical coherence tomography measuring instrument through the second dichroic mirror. The three-dimensional shape and size of the small hole are obtained by interference imaging with the reference laser of the optical coherence tomography measuring instrument.

[0008] Preferably, the focal length of the long focal length focusing lens is 400 mm.

[0009] Preferably, the focal length of the short focal length focusing lens can be selected within the range of 100 mm to 200 mm.

[0010] Preferably, a camera is further included. When laser drilling is performed, the first dichroic mirror can reflect visible light generated in the processing area to the camera, thereby realizing video dynamic monitoring of the small hole processing process.

[0011] Preferably, it further comprises a multi-optical wedge rotating mechanism, which is provided on the optical path of the processing laser and is used to rotate the processing laser off-axis and emit it at a certain angle inclined to the rotation axis.

[0012] Preferably, the laser drilling and in-situ measuring device is mounted on a Z-direction slide, and the Z-direction slide can be moved along the Z direction to adjust the focal positions of the processing laser and the measuring laser acting on the part.

[0013] Preferably, it further comprises a mounting bracket and an adjustment mechanism, wherein the mounting bracket is used to mount and fix the integrated nozzle, the adjustment mechanism connects the mounting bracket and the Z-direction slide, and the adjustment mechanism is used to adjust the placement position of the integrated nozzle.

[0014] In a second aspect, the present invention further provides a method for using the laser drilling and in-situ measurement device according to any one of the above technical solutions, comprising the following steps:

[0015] Laser hole making process: The first laser source is activated to output a processing laser. The processing laser is focused once by the long focal length focusing lens and then transmitted to the short focal length focusing lens through the three-dimensional scanning galvanometer for secondary focusing to form a processing laser with a smaller spot. The processing laser with a smaller spot ablates the material of the part through the processing movement path formed by the three-dimensional scanning galvanometer on the part to form a small hole.

[0016] Laser measurement process: After the laser hole making process is completed, the first laser source is turned off, the integrated nozzle is removed, and the second laser source is started. The second laser source outputs a measuring laser. The measuring laser is focused only once by the long focal length focusing lens and then transmitted to the small hole through the three-dimensional scanning galvanometer. The measurement scanning pattern formed by the three-dimensional scanning galvanometer fully covers the small hole and is reflected back to the optical coherence tomography instrument through the second dichroic mirror. Interference imaging with the reference laser of the optical coherence tomography instrument is used to obtain the three-dimensional shape and size of the small hole.

[0017] In a third aspect, the present invention further provides a method for using a laser drilling and in-situ measurement device, comprising the following steps:

[0018] The first laser source is started to output a processing laser. The multi-wedge rotation mechanism rotates the processing laser off-axis and emits it at a certain angle to the rotation axis to form a deflected processing laser. The deflected processing laser is focused once by the long-focal-length focusing lens and then transmitted to the short-focal-length focusing lens through the three-dimensional scanning galvanometer. The short-focal-length focusing lens focuses the deflected processing laser a second time to form a deflected processing laser with a smaller spot. The deflected processing laser with a smaller spot ablates and removes material of the part through a processing movement path formed by the three-dimensional scanning galvanometer on the part, thereby forming a positive conical hole, an inverted conical hole, or a non-conical hole on the part.

[0019] (3) Beneficial effects

[0020] The above technical solution of the present invention has at least the following advantages:

[0021] 1. In the present invention, both the machining laser and the measuring laser are focused through the same long-focal-length focusing lens. After being focused by the long-focal-length focusing lens, the measuring laser forms a measuring laser with a large focal depth, enabling measurement of deeper locations in small holes. After being focused by the long-focal-length focusing lens, the machining laser is refocused by a short-focal-length focusing lens. The focal position of the machining laser after this refocusing is consistent with the focal position of the measuring laser, which is focused solely by the long-focal-length focusing lens. This solves the problem of a large spot size and insufficient energy density of the machining laser after being focused by the long-focal-length focusing lens.

[0022] 2. In the present invention, the processing laser is focused twice by a long-focal-length focusing lens and a short-focal-length focusing lens to form a smaller spot processing laser. A short-focal-length focusing lens with a small aperture is selected, and a small-diameter nozzle is selected to form an integrated structure in combination with the short-focal-length focusing lens. The protective glass is eliminated, thereby realizing the miniaturization of the overall structure of the nozzle, thereby facilitating the hole-making operation in a small space.

[0023] 3. In the present invention, the integrated structure formed by the short-focal-length focusing lens and the nozzle (i.e., the integrated nozzle) can be quickly and accurately positioned and installed. After the hole making of the part is completed, the short-focal-length focusing lens can be quickly removed, and the measurement function of the morphology and size of the small hole can be realized, thereby realizing in-situ measurement of the processed small hole. There is no need to move the parts and perform measurement and alignment operations, which simplifies the operation process and improves the detection accuracy.

[0024] 4. In the present invention, the processing laser and the measuring laser share a three-dimensional scanning galvanometer. The processing laser cooperates with the three-dimensional scanning galvanometer through a multi-optical wedge rotation mechanism and a three-dimensional scanning galvanometer to realize the processing of the cylindrical section and the diffusion section of the special-shaped hole. The measuring laser is deflected by the three-dimensional scanning galvanometer to realize the measurement of various positions of the small holes on the parts. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0026] Figure 1 It is a structural schematic diagram of the laser hole making and in-situ measurement device provided in an embodiment of the present invention.

[0027] Figure 2 It is a schematic diagram of the implementation principle of the multi-optical wedge rotation mechanism provided in an embodiment of the present invention.

[0028] Figure 3 Schematic diagram of the structure of a long focal length focusing lens provided by an embodiment of the present invention.

[0029] Figure 4 It is a structural schematic diagram of the special-shaped hole provided by an embodiment of the present invention.

[0030] Figure 5 It is a schematic structural diagram of an integrated nozzle provided in an embodiment of the present invention.

[0031] Figure 6 It is the three-dimensional morphology of the straight circular hole and the irregular-shaped hole obtained by fitting the point cloud data obtained by OCT provided in the embodiment of the present invention.

[0032] Figure 7 It is a numerical schematic diagram of the hole depth obtained by data processing software provided in an embodiment of the present invention.

[0033] Figure 8 It is a numerical schematic diagram of the hole entrance obtained by data processing software provided in an embodiment of the present invention.

[0034] Figure 9 It is a numerical schematic diagram of the hole outlet obtained by data processing software provided in an embodiment of the present invention.

[0035] The reference numerals in the figures are:

[0036] 1. First dichroic mirror; 2. Second dichroic mirror; 3. Long-focal-length focusing lens; 4. Short-focal-length focusing lens; 5. Camera; 6. Processing laser; 7. Measuring laser; 8. Parts; 9. Multi-wedge rotation mechanism; 10. Three-dimensional scanning galvanometer; 11. Optical path adjustment structure; 12. Z-axis slide; 13. Integrated nozzle; 14. Workbench; 15. Guide rail; 17. Colored light; 81. Diffuser hole section; 82. Circular hole section; 131. Shielding gas outlet. DETAILED DESCRIPTION

[0037] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0038] It should be noted that when an element is referred to as being “fixed to” or “disposed on” another element, it may be directly located on the other element or indirectly located on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0039] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention, and do not indicate that the device or element must have a specific orientation, be constructed and operate in a specific orientation. Therefore, it should not be understood as a limitation on the present invention.

[0040] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating relative importance or the number of technical features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined. The following is a more detailed description of the specific implementation of the present invention in conjunction with specific embodiments:

[0041] like Figure 1An embodiment of the present invention provides a laser drilling and in-situ measurement device, including a first laser source (not shown), a first dichroic mirror 1, a second laser source (not shown), an optical coherence tomography measuring instrument (not shown), a second dichroic mirror 2, a long focal length focusing lens 3, a three-dimensional scanning galvanometer 10 and an integrated nozzle 13. The first laser source is used to output a processing laser 6, and the second laser source is used to output a measuring laser 7. The second dichroic mirror 2 is used to transmit the processing laser 6 and reflect the measuring laser 7 so that the processing laser 6 and the measuring laser 7 are output coaxially; a short focal length focusing lens 4 is installed in the integrated nozzle 13. When performing laser drilling, the processing laser 6 is focused once by the long focal length focusing lens 3 and then passes through the three-dimensional scanning galvanometer 10. The scanning galvanometer 10 transmits the laser light to the short-focal-length focusing lens 4, which refocuses the processing laser light to form a smaller spot. The smaller spot laser light ablates and removes material from the part 8 through the processing path formed by the three-dimensional scanning galvanometer 10, forming a small hole. During laser measurement, the integrated nozzle 13 is removed, and the measuring laser light 7 is focused only once by the long-focal-length focusing lens 3 before being transmitted to the small hole through the three-dimensional scanning galvanometer 10. The measurement scanning pattern formed by the three-dimensional scanning galvanometer 10 fully covers the small hole and is reflected back to the optical coherence tomography instrument through the second dichroic mirror 2. Interference imaging with the reference laser of the optical coherence tomography instrument is used to obtain the three-dimensional topography and dimensions of the small hole. Furthermore, the laser hole making and in-situ measurement device also includes an optical path adjustment structure 11. The processing laser light 6 is vertically incident on the optical path adjustment structure 11, which deflects the processing laser light 6, thereby making the optical path of the processing laser light 6 coaxial with the optical path of the measuring laser light 7. Specifically, the optical path adjustment structure 11 can be a 45-degree reflector. More specifically, both the first dichroic mirror 1 and the second dichroic mirror 2 are 45-degree dichroic mirrors. The second dichroic mirror 2 transmits the machining laser 6 and reflects the measuring laser 7, ensuring that the optical paths of the machining laser 6 and the measuring laser 7 are coaxial. The machining laser 6 is a high-power laser with a wavelength of 1064 nm, while the measuring laser is a low-power laser with a wavelength of 800 nm.

[0042] Specifically, since the laser spot of the processing laser 6 is already small after being focused by the long focal length focusing lens 3, even if the multi-optical wedge rotation mechanism 9 is used to rotate the laser off-axis, the required aperture is not large. The diameter or aperture of the short focal length focusing lens 4 can be very small, and a small focusing lens with a diameter of 20mm or even 10mm can be selected. The diameter of the corresponding integrated nozzle 13 can be made thinner, and the integrated nozzle 13 can be inserted into a relatively narrow space for hole making operations, and the problem of interference in the front space of the processing head is small. Also, because ultrafast laser processing has less molten material splashing, the integrated nozzle 13 can be combined with the short focal length focusing lens 4 to form a Figure 5 The integrated airtight structure shown eliminates the protective glass that is usually installed at the lower end of the focusing lens.

[0043] Furthermore, the three-dimensional scanning galvanometer 10 can cooperate with the measuring laser 7 to generate a scanning measurement path for the measuring laser 7 according to the measurement requirements, and can also cooperate with the processing laser 6 to generate a hole-making path for the processing laser 6 according to the hole-making requirements, and can process round holes and special-shaped holes. Figure 4 As shown in the figure, it is a schematic diagram of the structure of a special-shaped hole, which includes a circular hole segment 82 and a diffusion hole segment 81 connected to each other. Since there is an obvious taper when processing a deeper circular hole through the three-dimensional scanning galvanometer 10, in order to avoid the taper, a multi-light wedge rotation mechanism 9 can be used to generate the processed circular hole segment 82. The lens of the three-dimensional scanning galvanometer 10 only serves as a reflector. After processing the circular hole segment 82, the three-dimensional scanning galvanometer 10 is used to scan and process the diffusion hole segment 81.

[0044] In one embodiment, the focal length of the long focal length focusing lens 3 is 400 mm. Figure 3 As shown, the long-focal-length focusing lens 3 can be a combination lens with adjustable focus. This long-focal-length focusing lens 3 comprises a concave lens 31 and a convex lens 32. By adjusting the distance between the concave lens 31 and the convex lens 32, the focal position of the measurement laser 7 after focusing can be adjusted. Due to the addition of the multi-wedge rotation mechanism 9, a larger clear aperture is required after the light spot is rotated. The diameter of the long-focal-length focusing lens 3 is typically 50 mm or larger to ensure a clear aperture greater than 40 mm. The clear apertures of the first dichroic mirror 1, the second dichroic mirror 2, and the optical path adjustment structure 11 should also be greater than 40 mm.

[0045] In one embodiment, the focal length of the short-focal-length focusing lens 4 can be selected within a range of 100 mm to 200 mm. To obtain a sufficiently deep three-dimensional morphology of the small hole, the imaging focal depth of the measuring laser 7 needs to be increased. For this purpose, a long-focal-length focusing lens 3 with a focal length of 400 mm is selected. However, the actual pulse energy of the processing laser 6 used is less than 1 mJ. If the focal length is longer than 200 mm, the focused spot of the processing laser will increase significantly, resulting in insufficient energy density and more prominent energy density non-uniformity. Furthermore, during laser drilling, the laser spot of the processing laser 6, after being focused by the long-focal-length focusing lens 3, assumes an oblong shape with a significant difference between the major and minor axes. This shape of laser spot seriously affects the morphology, depth, and quality of the hole when drilling on the part 8. Experiments have shown that drilling small holes deeper than 2 mm is difficult, and the hole taper is very large. Rotary cutting also fails to guarantee roundness, and the heat-affected zone around the hole is significant. In this embodiment, under the premise that the long focal length focusing lens 3 can focus the measuring laser 7 and increase the focal depth of the measuring laser 7, the processing laser 6 is ensured to achieve normal laser hole making. The short focal length focusing lens 4 is used to further focus the processing laser 6 after being focused by the long focal length focusing lens 3 to ensure that the spot of the processing laser 6 after the second focusing is sufficiently small. This not only significantly improves the energy density, but also reduces the negative impact of the ellipticity and energy non-uniformity of the laser spot itself on the processing of small holes, thereby achieving precise processing of small holes on small-sized parts. The short focal length focusing lens 4 can be a detachable structure. When performing laser hole making, the short focal length focusing lens 4 is used to perform secondary focusing on the processing laser 6. When performing laser measurement, the short focal length focusing lens 4 is removed and the measuring laser is focused only by the long focal length focusing lens 3. Alternatively, the short focal length focusing lens 4 can be connected to the XY axis motion structure of the machine tool. When performing laser measurement, the short focal length focusing lens 4 is driven away by the XY axis motion structure.

[0046] In one embodiment, a camera 5 is also included. During laser drilling, the first dichroic mirror 1 can reflect visible light generated in the processing area to the camera 5, enabling dynamic video monitoring of the drilling process. Specifically, the first dichroic mirror 1 can transmit the processing laser 6 and reflect colored light 17, allowing the colored light 17 to enter the camera 5. The camera 5 can monitor the drilling process in real time, observe the part surface and the hole through video magnification, and achieve precise alignment of the processed hole during secondary processing.

[0047] In one embodiment, a multi-optical wedge rotating mechanism 9 is further included. The multi-optical wedge rotating mechanism 9 is disposed on the optical path of the processing laser 6 and is used to rotate the processing laser 6 off-axis and emit it at a certain angle inclined to the rotation axis.

[0048] In one embodiment, the laser drilling and in-situ measurement device is mounted on a Z-axis slide 12, which is movable in the Z direction to adjust the focal position of the machining laser and the measuring laser on the part 8. By driving the Z-axis slide 12 to move, the entire laser drilling and in-situ measurement device can be driven to move in the Z-axis direction, thereby adjusting the focal position of the machining laser 6 or the measuring laser 7 on the part 8, thereby achieving drilling of the part or measurement along the depth direction of the small hole.

[0049] In one embodiment, it also includes a mounting bracket (not shown) and an adjustment mechanism (not shown), the mounting bracket is used to install and fix the integrated nozzle 13, the adjustment mechanism connects the mounting bracket and the Z-direction slide 12, and the adjustment mechanism is used to adjust the placement position of the integrated nozzle 13. Specifically, the integrated nozzle 13 is installed on an adjustment mechanism that can move in three directions X / Y / Z, so that the focal position of the processing laser 6 after being focused by the long focal length focusing lens 3 is as consistent as possible with the focal position of the measurement laser 7 focused by the long focal length focusing lens 3 alone when the short focal length focusing lens 4 is removed for OCT measurement; the short focal length focusing lens 4 and the integrated nozzle 13 can be installed and connected using a positioning pin, which is easy to manually and quickly position, fix or remove from the adjustment mechanism. Furthermore, a protective gas outlet 131 is provided on the integrated nozzle 13, and the protective gas outlet 131 is connected to a protective gas source to form a protective gas atmosphere to prevent the parts from being oxidized and nitrided when the processing laser acts on the parts. At the same time, the protective gas can prevent splashes from splashing into the integrated nozzle 13 when the parts are holed.

[0050] An embodiment of the present invention further provides a method for using any one of the laser hole-making and in-situ measurement devices in the above embodiments, comprising the following steps:

[0051] Laser hole making process: The first laser source is started and outputs a processing laser 6. The processing laser 6 is focused once by the long focal length focusing lens 3 and then transmitted to the short focal length focusing lens 4 through the three-dimensional scanning galvanometer 10 for secondary focusing to form a smaller spot processing laser. The smaller spot processing laser ablates and removes the material of the part 8 through the processing movement path formed by the three-dimensional scanning galvanometer 10 on the part 8 to form a small hole.

[0052] Laser measurement process: After the laser hole making process is completed, the first laser source is turned off, the integrated nozzle 13 is removed, and the second laser source is started. The second laser source outputs a measuring laser. The measuring laser is focused only once by the long focal length focusing lens 3 and then transmitted to the small hole through the three-dimensional scanning galvanometer 10. The measurement scanning pattern formed by the three-dimensional scanning galvanometer 10 fully covers the small hole and is reflected back to the optical coherence tomography measuring instrument through the second dichroic mirror 2. Interference imaging with the reference laser of the optical coherence tomography measuring instrument is used to obtain the three-dimensional morphology size of the small hole.

[0053] The optical coherence tomography analyzes the reflected light of the measuring laser based on the optical coherence tomography (OCT) technology. Optical coherence tomography is a technology that uses the basic principle of weak coherent light interferometer to detect the back reflection or several scattered signals of the incident weak coherent light at different depths of the part. By scanning, a two-dimensional or three-dimensional structural image of the small hole on the part 8 is obtained. The data obtained by the optical coherence tomography technology can be fitted to obtain the following Figure 6 The image shown, where Figure 6 The left side shows the three-dimensional appearance of the straight circular hole embodiment. Figure 6 The right side shows the three-dimensional morphology of the special-shaped hole embodiment. The data obtained by optical coherence tomography technology will be processed by data processing software to obtain the following Figure 7 、 Figure 8 as well as Figure 9 Data image shown. Figure 7 shows the depth data of the hole, Figure 8 Shows the dimensional data of the hole entrance, Figure 9 The dimensional data of the hole outlet are shown.

[0054] An embodiment of the present invention further provides a method for using a laser drilling and in-situ measurement device, comprising the following steps:

[0055] The first laser source is started and outputs a processing laser. The multi-wedge rotating mechanism 9 rotates the processing laser off-axis and emits it at a certain angle to the rotating axis to form a deflected processing laser. The deflected processing laser is focused once by the long-focal-length focusing lens 3 and then transmitted to the short-focal-length focusing lens 4 through the three-dimensional scanning galvanometer 10. The short-focal-length focusing lens 4 focuses the deflected processing laser twice to form a deflected processing laser with a smaller spot. The deflected processing laser with a smaller spot ablates and removes the material of the part 8 through the processing moving path formed by the three-dimensional scanning galvanometer 10 on the part 8, forming a positive conical hole, an inverted conical hole, or a non-conical hole on the part 8.

[0056] In one embodiment, the laser drilling and in-situ measurement apparatus further includes a worktable 14 and a guide rail 15. The worktable 14 is slidably connected to the guide rail 15, and the part 8 is clamped to the worktable 14. The worktable 14 can move on the guide rail 15, thereby controlling the movement of the part 8, allowing the processing laser to act on different locations on the part, thereby achieving hole processing at different locations on the part.

[0057] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A laser drilling and in-situ measurement device, characterized in that: The invention comprises a first laser source, a first dichroic mirror, a second laser source, an optical coherence tomography instrument, a second dichroic mirror, a long focal length focusing lens, a three-dimensional scanning galvanometer and an integrated nozzle. The first laser source is used to output a processing laser, the second laser source is used to output a measuring laser, the second dichroic mirror is used to transmit the processing laser and reflect the measuring laser so that the processing laser and the measuring laser are output coaxially. A short focal length focusing lens is installed in the integrated nozzle. When laser drilling is performed, the processing laser is focused once by the long focal length focusing lens and then transmitted to the short focal length focusing lens by the three-dimensional scanning galvanometer. The short focal length focusing lens The focusing lens focuses the processing laser a second time to form a smaller spot processing laser. The smaller spot processing laser ablates and removes the material of the part through the processing movement path formed by the three-dimensional scanning galvanometer on the part to form a small hole. When performing laser measurement, the integrated nozzle is removed, and the measuring laser is focused only once by the long-focal-length focusing lens and then transmitted to the small hole through the three-dimensional scanning galvanometer. The measurement scanning pattern formed by the three-dimensional scanning galvanometer fully covers the small hole and is reflected back to the optical coherence tomography measuring instrument through the second dichroic mirror. The three-dimensional shape and size of the small hole are obtained by interference imaging with the reference laser of the optical coherence tomography measuring instrument.

2. The laser drilling and in-situ measurement device according to claim 1, characterized in that: The focal length of the long focal length focusing lens is 400 mm.

3. The laser drilling and in-situ measurement device according to claim 1, characterized in that: The focal length of the short focal length focusing lens is selected within the range of 100 mm to 200 mm.

4. The laser drilling and in-situ measurement device according to claim 1, characterized in that: It also includes a camera. When laser drilling is performed, the first dichroic mirror can reflect visible light generated in the processing area to the camera, thereby realizing video dynamic monitoring of the small hole processing process.

5. The laser drilling and in-situ measurement device according to claim 1, characterized in that: It also includes a multi-optical wedge rotating mechanism, which is arranged on the optical path of the processing laser and is used to rotate the processing laser off-axis and emit it at a certain angle to the rotation axis.

6. The laser drilling and in-situ measurement device according to claim 1, characterized in that: The laser drilling and in-situ measuring device is installed on a Z-direction slide, and the Z-direction slide can move along the Z direction to adjust the focal positions of the processing laser and the measuring laser acting on the part.

7. The laser drilling and in-situ measurement device according to claim 6, characterized in that: It also includes a mounting bracket and an adjustment mechanism, wherein the mounting bracket is used to install and fix the integrated nozzle, the adjustment mechanism connects the mounting bracket and the Z-direction slide, and the adjustment mechanism is used to adjust the placement position of the integrated nozzle.

8. A method for using the laser drilling and in-situ measurement device according to any one of claims 1 to 7, characterized in that: The following steps are involved: Laser hole making process: The first laser source is activated to output a processing laser. The processing laser is focused once by the long focal length focusing lens and then transmitted to the short focal length focusing lens through the three-dimensional scanning galvanometer for secondary focusing to form a processing laser with a smaller spot. The processing laser with a smaller spot ablates the material of the part through the processing movement path formed by the three-dimensional scanning galvanometer on the part to form a small hole. Laser measurement process: After the laser hole making process is completed, the first laser source is turned off, the integrated nozzle is removed, and the second laser source is started. The second laser source outputs a measuring laser. The measuring laser is focused only once by the long focal length focusing lens and then transmitted to the small hole through the three-dimensional scanning galvanometer. The measurement scanning pattern formed by the three-dimensional scanning galvanometer fully covers the small hole and is reflected back to the optical coherence tomography instrument through the second dichroic mirror. Interference imaging with the reference laser of the optical coherence tomography instrument is used to obtain the three-dimensional shape and size of the small hole.

9. A method for using the laser drilling and in-situ measurement device according to claim 5, characterized in that: The following steps are involved: The first laser source is started to output a processing laser. The multi-wedge rotation mechanism rotates the processing laser off-axis and emits it at a certain angle to the rotation axis to form a deflected processing laser. The deflected processing laser is focused once by the long-focal-length focusing lens and then transmitted to the short-focal-length focusing lens through the three-dimensional scanning galvanometer. The short-focal-length focusing lens focuses the deflected processing laser a second time to form a deflected processing laser with a smaller spot. The deflected processing laser with a smaller spot ablates and removes material of the part through a processing movement path formed by the three-dimensional scanning galvanometer on the part, thereby forming a positive conical hole, an inverted conical hole, or a non-conical hole on the part.

Images