A pressure sensing structure and a pressure touch device

Abstract

The present invention belongs to the technical field of pressure sensing, and discloses a pressure sensing structure and a pressure touch control device. The pressure sensing device includes a frame structure, a pressure sensing component, and a bearing plate. The pressure sensing component is composed of an arc-shaped elastic sheet and an FPC pressure sensing film attached to the lower curved surface of the elastic sheet. The FPC pressure sensing film is printed with electrodes of low resistivity and a semiconductor conductive film of high resistivity. When the bearing plate is subjected to an external pressure, the arc-shaped elastic sheet deforms under the pressure, causing the electrodes on the FPC to contact the semiconductor part to form a circuit. And as the pressure increases, the contacted part is short-circuited, resulting in a decrease in the circuit resistance. Thus, the magnitude of the pressure is reflected by the change in the resistance value. The pressure sensing structure proposed by the present invention has a sensitive and linear signal response, has good stability, and has the ability to detect forces in multiple directions.

Description

Technical Field

[0001] The present invention relates to the technical field of pressure sensing, and particularly relates to a pressure sensing structure and a touch control device applying the pressure sensing structure. Background Art

[0002] With the development of the consumer electronics and engineering control fields, pressure sensing technology has been increasingly widely applied in related products and industrial equipment. The main function of pressure sensing technology is to accurately sense information such as the magnitude, direction, and position of the applied force, helping the system to identify pressure information, thereby formulating different pressure response strategies and enabling electronic devices to achieve various functions.

[0003] Existing pressure sensing devices use a variety of pressure sensor components for pressure detection, including MEMS pressure sensors, flexible pressure sensors (resistive, capacitive, piezoelectric), resistance strain gauges, fiber optic sensors, etc. These sensors detect the magnitude of pressure based on different sensing principles and have wide applications in the fields of consumer electronics, medical devices, industrial control, etc. However, the above-mentioned pressure sensors have the following disadvantages, which limit the practicality of this type of sensing technology. MEMS sensors are not suitable for portable sensing devices due to their large size; it is difficult for flexible sensors to achieve a balance between sensitivity and range, and their durability is significantly insufficient compared to other sensors; the signal change range of resistance strain gauges is small, making it difficult to be used in high-precision pressure detection scenarios; fiber optic sensors require an additional readout system, increasing the complexity of the sensing system.

[0004] For the above reasons, existing pressure sensing solutions still have deficiencies in terms of structural size, sensing performance, and durability. Developing pressure sensor components with high performance, easy implementation, and stable durability remains a challenge. Summary of the Invention

[0005] To solve the defects and deficiencies in the prior art, the present invention proposes a pressure sensing structure and a pressure touch control device applying the pressure sensing structure.

[0006] The pressure sensing structure of the present invention includes an arc-shaped elastic piece and a pressure sensing component disposed on the outer surface of the arc-shaped elastic piece; a point on the arc-shaped elastic piece is a fixed point.

[0007] The pressure sensing component includes a first film section, a second film section, a semiconductor conductive film, and an electrode; the arc-shaped elastic piece is made of materials such as stainless steel, prepared by bending or stamping processes, and has good elasticity. It will deform under pressure and can return to its original state after the pressure is removed;

[0008] The electrode is a strip-shaped electrode;

[0009] The first section of the thin film is arranged on the outer surface of the arc-shaped elastic piece along the length direction of the arc-shaped elastic piece;

[0010] The semiconductor conductive thin film is located on the surface of the first section of the thin film, and the electrode is located on the surface of the second section of the thin film.

[0011] The semiconductor conductive thin film has a high resistivity, and the strip-shaped electrode has a low resistivity. The two parts are led out through wires at both ends, and there is a gap between the two parts;

[0012] The position of the semiconductor conductive thin film corresponds to that of the electrode, and the shape of the semiconductor conductive thin film can also be the same as that of the electrode.

[0013] A point or an area on the arc-shaped elastic piece is set as a fixed point or a fixed area for fixing the arc-shaped elastic piece; in the initial state, the semiconductor conductive thin film and the electrode do not contact. When pressure is applied to one end of the arc-shaped elastic piece, the semiconductor conductive thin film and the electrode approach each other. As the pressure increases, the semiconductor conductive thin film and the electrode contact, and the contact area between the semiconductor conductive thin film and the electrode increases.

[0014] Specifically: when pressure is applied to one end of the arc-shaped elastic piece, the arc-shaped elastic piece with a curvature is compressed downward and deforms, and the FPC sensor deforms together with the thin sheet, so that the semiconductor conductive thin film and one end of the electrode come into contact, thereby forming a conductive loop between the electrode and the semiconductor conductive thin film, and the resistance value is the largest at this time. As the pressure further increases, the arc-shaped elastic piece bends further, and the contact area between the semiconductor conductive thin film and the electrode increases under the extrusion of the arc-shaped structure, resulting in the short-circuit of the already contacted part. At this time, the effective length between the electrode and the semiconductor conductive thin film is shortened, and the resistance value of the loop decreases. Therefore, this pressure sensing structure reflects the magnitude of the pressure through the change of the resistance signal to realize the detection of the pressure.

[0015] Further, the electrode part can be formed by preparing electrode materials such as copper, silver, and conductive silver paste on one end of the thin film through processes such as copper plating and screen printing;

[0016] The semiconductor conductive thin film can be obtained by printing semiconductor ink on the other end of the thin film through methods such as screen printing, scraping, and spraying, and there is a gap between the electrode and the semiconductor conductive thin film. And the resistivity of the semiconductor ink is much greater than that of the electrode material, so the resistance of the semiconductor conductive thin film is much greater than that of the electrode at the other end.

[0017] Further, a pressure sensing structure of the present invention further includes a first flat plate; one end of the arc-shaped elastic piece is connected to the upper surface of the first flat plate, and the other end of the arc-shaped elastic piece is a free end; the second section of the thin film is arranged on the upper surface of the first flat plate, and the electrode on the second section of the thin film corresponds to the position of the semiconductor conductive thin film.

[0018] Further, the first section of the thin film and the second section of the thin film are connected by a bending part. It is convenient for integral molding.

[0019] Furthermore, a second flat plate is also connected to the free end of the arc-shaped elastic piece; the second flat plate is parallel to the first flat plate. When pressure is applied to the pressure sensing structure, pressure can be directly applied to the surface of the second flat plate, which is equivalent to increasing the pressure surface where pressure can be applied.

[0020] The pressure sensing structure can be made by pasting an FPC sensing component on the arc-shaped elastic piece and then bending them together. While maintaining consistent pressure sensing performance, its structure and process are simpler;

[0021] Furthermore, the pressure sensing structure of the present invention further includes a bottom plate; when fixing the arc-shaped elastic piece, the midpoint of the arc-shaped elastic piece is fixedly connected to the upper surface of the bottom plate, and both ends of the arc-shaped elastic piece are free ends; the second section of the thin film is arranged on the upper surface of the flat plate, and the electrodes on the second section of the thin film correspond to the positions of the semiconductor conductive thin film. There are two pressure sensing components; the pressure sensing components are symmetrically arranged;

[0022] Furthermore, a pressure sensing structure of the present invention further includes a bearing plate; second flat plates are connected to both free ends of the arc-shaped elastic piece, and the second flat plates are parallel to the bottom plate; the bearing plate is located on the upper surfaces of the two second flat plates. The bearing plate is detachably connected to the pressure sensing structure.

[0023] Furthermore, a cylinder is vertically arranged on the bottom plate; the arc-shaped elastic piece and the pressure sensing components are both located in the cylinder; the cross-section of the bearing plate is similar to that of the cylinder and smaller than the cross-section of the cylinder.

[0024] The area of the bearing plate is slightly smaller than the cross-section of the cylinder, so that it can move longitudinally and deflect inside the cylinder. The connection between the bearing plate and the top of the pressure sensing structure is a detachable connection by abutting or magnetic adsorption.

[0025] The pressure sensing structure has two pressure sensing components and can be assembled in the installation groove of an electronic device or on the surface of a touch object. The cylinder is used to protect the overall structure of the pressure touch device and enables the pressure sensing components and the bearing plate to move longitudinally along the structural frame.

[0026] Since both ends of the sensing structure have pressure sensing components, electrical signals that change with the pressure action will be generated at both ends of the sensing structure. The sensing structure can simultaneously measure the changes in resistance at both ends and calculate the position where the pressure acts on the bearing plate, thereby realizing the detection of the magnitude and position of the pressure.

[0027] Based on the pressure sensing structure of the present invention, the present invention also proposes a pressure touch device, which includes a bottom plate, a cylinder, a bearing plate, and a plurality of pressure sensing structures; the cylinder and the plurality of pressure sensing structures are both arranged on the surface of the bottom plate, and the pressure sensing structures are all located in the cylinder; the bearing plate is located on the upper surface of the plurality of pressure sensing structures and is connected to the upper surface of the two flat plates of the pressure sensing component. The cross-section of the bearing plate is similar to that of the cylinder and smaller than that of the cylinder.

[0028] A pressure sensing structure is a pressure sensing unit. Therefore, a single pressure sensing structure can only detect the magnitude of the pressure. However, the combination of multiple such sensing structures can achieve more specific pressure sensing functions. For example: two pressure sensing structures are placed opposite to each other in a straight line, and the composed dual-sensing unit array can detect the magnitude of the pressure and the uniaxial direction; three or more sensing structures are placed in a circular array, and the composed multi-sensing unit array can detect the magnitude of the pressure and any direction in the plane, with higher flexibility and scenario adaptability.

[0029] Beneficial effects: Compared with the prior art, the pressure sensing structure and the pressure touch device proposed by the present invention have the following beneficial effects:

[0030] (1) It has the characteristics of simple structure, lightness and thinness, and can be used in various portable devices; (2) The pressure sensing method realized by the resistance short-circuit method has high sensitivity and good linearity. In the initial state, the two conductive regions are separated from each other, avoiding the zero-drift influence of the sensing structure; (3) The arc-shaped structure thin sheet has good elasticity and can still return to its original state after multiple deformations, greatly improving the service life of the sensor device; more durable than flexible sensors; (4) Different moduli can be selected, and the pressure deformation characteristics of the sensing structure can be changed by adjusting the thickness of the arc-shaped thin sheet, so as to customize the sensitivity and range of the pressure sensing device; (5) The pressure touch device adopts a multi-sensor combination method to realize the detection functions of single-point acting force and multi-directional force, and can be designed and assembled according to the application scenario, with high flexibility. Description of the Drawings

[0031] The following further describes the technical solutions of the embodiments of the present invention in detail through the drawings and embodiments.

[0032] Figure 1 It is a schematic diagram of the pressure sensing structure in Embodiment 1 of the present invention;

[0033] Figure 2 It is a schematic diagram of the pressure sensing structure in Embodiment 1;

[0034] Figure 3 It is a wire leading-out diagram of the pressure sensing component of the present invention;

[0035] Figure 4It is a schematic diagram of the pressure sensing structure in Embodiment 3;

[0036] Figure 5 It is a schematic diagram of the pressure touch device in Embodiment 4;

[0037] Among them, 11 is an arc-shaped elastic piece; 12 is the first flat plate; 13 is the second flat plate;

[0038] 2 is a pressure sensing component; 21 is the first section of the film; 22 is the second section of the film; 23 is a bending part; 24 is a semiconductor conductive film; 25 is an electrode;

[0039] 3 is a frame structure; 31 is a bottom plate; 32 is a cylinder;

[0040] 4 is a bearing plate. Specific embodiments

[0041] In order to more clearly illustrate the technical solutions and advantages of the present invention, the present invention will be further described in detail below in conjunction with embodiments and drawings. It should be understood that the drawings described herein are only some embodiments of the present application and do not limit the present invention.

[0042] Embodiment 1

[0043] As Figure 1 shown, the pressure sensing structure of the present invention includes an arc-shaped elastic piece 11 and an FPC pressure sensing component 2 provided on the outer surface of the arc-shaped elastic piece 11; the surface facing the center of the arc-shaped elastic piece 11 is set as the inner surface of the arc-shaped elastic piece 11, and the other side is the outer surface of the arc-shaped elastic piece 11.

[0044] The FPC pressure sensing component 2 includes a first section of the film 21, a second section of the film 22, a semiconductor conductive film 24, and an electrode 25;

[0045] The semiconductor conductive film 24 is located on the surface of the first section of the film 21, and the electrode 25 is located on the second section of the film 22; the shape of the semiconductor conductive film 24 is the same as that of the electrode 25, and the positions are opposite;

[0046] The first section of the film 21 is arranged along the length direction of the arc-shaped elastic piece 11 on the outer surface of the arc-shaped elastic piece 11;

[0047] The first section of the film 21 and the second section of the film 22 are made of the same material, both being PI or PET film.

[0048] One end of the arc-shaped elastic piece 11 is fixed on a plane, and the second section of the film 22 is also fixed on this plane, and the semiconductor conductive film 24 and the electrode 25 are opposite in position; the other end of the arc-shaped elastic piece 11 is a free end;

[0049] Wires are respectively connected to the semiconductor conductive film 24 and the electrode 25 and used as lead-out ends to be connected to the reading circuit. During use, under the action of pressure, the free end moves downward, and the arc-shaped elastic piece 11 drives the first section 21 of the film and the semiconductor conductive film 24 to move downward. When the pressure increases to a certain extent, the end of the semiconductor conductive film 24 close to the plane first contacts the electrode 25, and the semiconductor conductive film 24 and the electrode 25 form a connected circuit. When the pressure is further increased, the contact area between the semiconductor conductive film 24 and the electrode 25 further increases, and the resistance of the circuit further decreases until the contact area between the semiconductor conductive film 24 and the electrode 25 no longer changes, reaching the maximum range of pressure measurement.

[0050] Embodiment 2

[0051] As Figure 2 shown, the pressure sensing structure in this embodiment is based on the pressure sensing structure in Embodiment 1 and adds a first flat plate 12 and a second flat plate 13; the first section 21 of the film and the second section 22 of the film are connected by a bending portion 23.

[0052] One end of the arc-shaped elastic piece 11 is connected to the upper surface of the first flat plate 12, and the other end of the arc-shaped elastic piece 11 is a free end and is connected to the second flat plate 13. The first flat plate 12 and the second flat plate 13 are parallel; the bending portion 23 is located at the included angle portion of the connection between the arc-shaped elastic piece 11 and the first flat plate 12.

[0053] The first section 21 of the film, the second section 22 of the film, and the bending portion 23 are all made of PI film or PET film.

[0054] Preparation process of the FPC pressure sensing film structure: Print the strip-shaped electrode 25 and the semiconductor conductive film 24 on a PI film with a thickness of 0.05 mm, with a gap left between the electrode 25 and the semiconductor conductive film 24, and one wire is led out from each end of the electrode 25 and the semiconductor conductive film 24, as Figure 3 shown.

[0055] The electrode 25 can be prepared in the following way: Print the conductive silver paste on the PI film by screen printing through a screen printing stencil with 300 - 400 mesh, and after heating at 80°C - 100°C for 30 minutes, the strip-shaped silver paste electrode 25 is obtained.

[0056] The semiconductor conductive film 24 can be prepared in the following way: Print the semiconductor conductive ink on the other end of the PI film printed with the electrode 25 by screen printing through a screen printing stencil with 300 - 350 mesh, and after heating at 80°C - 100°C for 2 hours, the semiconductor conductive film 24 is obtained.

[0057] Preferably, the semiconductor conductive ink can be one or more conductive particles such as carbon black, graphene, carbon nanotubes, or metal powder, which are dispersed and mixed with a flexible resin solution and a corresponding curing agent to obtain a semiconductor ink. This kind of ink has certain conductivity, but its resistivity is much higher than that of the electrode material.

[0058] In this embodiment, the pressure sensing structure can be prepared by bending the arc-shaped elastic sheet 11 and the FPC pressure sensor together after they are attached, and both ends remain straight.

[0059] In the initial state, the electrode 25 of the FPC sensing component does not contact the semiconductor conductive film 24. Under the action of pressure, the upper end of the elastic sheet bends downward, causing the FPC semiconductor conductive film 24 to come into contact with one end of the electrode 25. And as the pressure increases, the contact area also increases, resulting in the short circuit of the contact part and the reduction of the loop resistance, thereby reflecting the magnitude of the pressure.

[0060] Embodiment III

[0061] As Figure 4 shown, the pressure sensing structure includes a detachable bearing plate 4, an arc-shaped elastic sheet 11, a frame structure 3, and two FPC pressure sensing components 2 arranged on the outer surface of the arc-shaped elastic sheet 11; the surface facing the center of the arc-shaped elastic sheet 11 is set as the inner surface of the arc-shaped elastic sheet 11, and the other side is the outer surface of the arc-shaped elastic sheet 11.

[0062] The frame structure 3 is a structure with one end open, including a bottom plate 31 and a cylinder 32, and the interface of the cylinder 32 is circular or square, etc.; the arc-shaped elastic sheet 11 and the two FPC pressure sensing components 2 are both located in the frame structure 3. The midpoint of the arc-shaped elastic sheet 11 is fixedly connected to the upper surface of the bottom plate 31, and both ends of the arc-shaped elastic sheet 11 are free ends; one end of the cylinder 32 is connected to the upper surface of the bottom plate 31, and the arc-shaped elastic sheet 11 and the two FPC pressure sensing components 2 are both located in the area surrounded by the cylinder 32. Specifically, the arc-shaped elastic sheet 11 and the bottom plate 31 are adhesively connected.

[0063] The FPC pressure sensing component 2 includes a first film section 21, a second film section 22, a semiconductor conductive film 24, and an electrode 25; the first film section 21 and the second film section 22 are connected by a bending part 23; the first film section 21, the second film section 22, and the bending part 23 can be integrally formed during production.

[0064] The semiconductor conductive film 24 is located on the surface of the first film section 21, and the electrode 25 is located on the surface of the second film section 22; the shape of the semiconductor conductive film 24 is opposite to that of the electrode 25 and the positions are relative, and the shapes can be the same;

[0065] The two FPC pressure sensing components 2 have the same structure and are symmetrically arranged; the first section of the thin film 21 is arranged on the outer surface of the arc-shaped elastic piece 11 along the length direction of the arc-shaped elastic piece 11; the second section of the thin film 22 is arranged on the surface of the bottom plate 31.

[0066] The FPC pressure sensing component 2 further includes two second flat plates 13, which are connected to the two free ends of the arc-shaped elastic piece 11; and the second flat plates 13 are parallel to the bottom plate 31.

[0067] The bearing plate 4 is located on the surface of the pressure sensing component 2 and is connected by magnetic adsorption. Relative sliding can occur between the lower surface of the bearing plate 4 and the second flat plate 13;

[0068] Specifically, the arc-shaped elastic piece 11 is obtained by stamping a stainless steel sheet with a thickness of 0.1 - 0.3 mm through a circular arc-shaped mold and is fixed on the bottom plate 31 of the frame structure 3 by welding. The elasticity of the arc-shaped elastic piece 11 is related to the material and thickness. The greater the modulus and the thicker the thickness, the more difficult it is for the thin sheet to deform. Therefore, the force deformation characteristics of the sensing structure can be changed by changing the material and thickness of the thin sheet, and further the pressure detection performance of the pressure sensing device of the present invention can be changed.

[0069] Based on the above, the working principle of the pressure sensing structure is as follows: Connect the leads at both ends of the PFC sensor to the reading circuit. In the initial state Figure 3 the middle electrode 25 is not in contact with the semiconductor conductive thin film 24, so the loop can be regarded as an open circuit; when pressure acts on the bearing plate 4, the arc-shaped elastic piece 11 deforms under the extrusion force, and the included angle formed by it and the bottom plate 31 of the frame structure 3 decreases. When the pressure increases to a certain extent, the electrode 25 near the bending part 23 comes into contact with the semiconductor conductive thin film 24. At this time, a connected loop is formed between the electrode 25 and the semiconductor conductive thin film 24. However, since the loop is the longest at this time, the measured resistance value is relatively large. At this time, the pressure value can be recorded as the trigger pressure; as the pressure further increases, the arc-shaped elastic piece 11 further deforms, and under the extrusion of the arc-shaped structure, the contact area between the electrode 25 and the semiconductor conductive thin film 24 increases, so that the already contacted part causes a short circuit and the loop resistance decreases; when the pressure further increases, the electrode 25 and the semiconductor conductive thin film 24 are completely attached, and at this time the loop is completely covered by the short-circuit unit, and the loop resistance reaches the minimum value. At this time, the pressure value is the maximum range of pressure detection of this pressure sensing unit.

[0070] When the pressure on the bearing plate 4 is removed, the arc-shaped elastic piece 11 returns to the initial state under the action of elasticity. During this process, the contact area between the electrode 25 and the semiconductor gradually decreases until they are separated. At this time, the electrical signal output by the pressure sensing structure also returns to the initial value without pressure. To sum up, the output resistance value of this pressure sensing structure decreases with the increase of pressure, so as to be able to reflect the information of the applied pressure magnitude.

[0071] Furthermore, the pressure sensing structure can also detect the acting point of the pressure on the bearing plate 4, and the specific method is as follows: Since the width of the pressure-bearing member is slightly smaller than the inner groove of the frame structure 3, the pressure-bearing member can move vertically and tilt inside the frame structure 3. Specifically, when the pressure acts on the midpoint of the bearing plate 4, the deformation amplitudes of the left and right elastic sheets of the pressure sensing structure are the same, so the moving distances of the two FPC pressure sensing components 2 pasted on the arc-shaped elastic sheet 11 are also the same. Therefore, the extrusion areas between the upper electrodes 25 of the two FPC sensors and the semiconductor conductive film 24 are also the same. At this time, the two FPC pressure sensing components 2 have the same or similar resistance changes; when the pressure acts on one end of the bearing plate 4, the elastic sheet at this end deforms more, resulting in a larger resistance change amplitude of the FPC sensor at this end, while the elastic sheet at the other end deforms less, so the resistance change amplitude is also smaller. By the ratio of the resistance change amounts ΔR1 and ΔR2 of the two FPC pressure sensing components 2, the acting point of the pressure on the bearing plate 4 can be calculated. In summary, the pressure sensing structure described in the first embodiment can detect the magnitude and acting position of the pressure under the combined action of the two end pressure sensing units.

[0072] Embodiment 4

[0073] As Figure 5 shown, in this specific embodiment, on the basis of the pressure sensing structure in Embodiment 2, a pressure touch device is designed. In Embodiment 2, there is only one pressure sensing structure as the pressure sensing unit, so it is impossible to detect the acting position of the pressure.

[0074] The bottom surface of the pressure sensing unit can be connected and fixed to the surface of the electronic device by methods such as welding and gluing.

[0075] The pressure touch device provided in this embodiment includes a bearing plate 4, a frame structure 3, and multiple pressure sensing structures; the multiple pressure sensing structures are all arranged in the frame structure 3, and the bearing plate 4 is arranged on the upper surface of the pressure sensing structure; specifically, the bearing plate 4 is located on the upper surface of the second flat plate 13 of the pressure sensing structure.

[0076] The frame structure 3 includes a bottom plate 31 and a cylinder 32. The cylinder 32 is open at both ends, and one end of the cylinder 32 is fixedly connected to the bottom plate 31; the pressure sensing structures are evenly arranged on the same circumference, and the pressure sensing structures are fixed to the bottom plate 31 by gluing. The cylinder 32 plays a protective role for the multiple pressure sensing structures inside, and at the same time enables the top bearing plate 4 to move longitudinally along the cylinder 32 under the action of pressure. There is a magnetic adsorption between the bearing plate 4 and the multiple pressure sensing structures. In this embodiment, the number of pressure sensing structures is four.

[0077] In addition to detecting the magnitude of the pressure, the above four pressure sensing structures can also detect the position where the pressure acts. The specific implementation method is as follows: When the pressure acts on the center position of the top bearing plate 4, the arc-shaped elastic pieces 11 of the four pressure sensing structures show the same deformation amplitude, thereby squeezing the four FPC pressure sensing films so that the communication circuit formed between the upper electrodes 25 and the semiconductor conductive film 24 on the film has the same or similar resistance signal. This process is consistent with the corresponding part in Embodiment 3; When the pressure acts on the edge position of the bearing plate 4, at this time, the pressure sensing structure near the pressure action point bears a larger deformation, and the sensing structure at a farther distance has a smaller deformation. Therefore, the resistance of the FPC pressure sensing film closer to the pressure action point is smaller. Thus, by calculating the mutual ratio between the resistance signal change amounts ΔR1, ΔR2, ΔR3, and ΔR4 of the four pressure sensing structures, the position of the pressure action point can be determined.

[0078] Further, a flexible contact point can be pasted on the top bearing plate 4 of the touch device. By pressing, gently pushing, etc. on the contact point, the bearing plate 4 can be driven to slide up and down and tilt, so as to detect the magnitude and direction of the acting force through the coordinated action of the four pressure sensing units, and realize the detection of any direction of the planar force.

[0079] The above are only the preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Any modifications, equivalent replacements, and improvements made in the specific implementation manners based on the idea provided by the present invention within the spirit and principle of this application shall be included within the protection scope of the present invention.

Claims

1. A pressure sensing structure, characterized in that: It comprises an arc-shaped spring piece (11) and a pressure sensing component (2) arranged on the outer surface of the arc-shaped spring piece (11); The pressure sensing component (2) comprises a first film section (21), a second film section (22), a semiconductor conductive film (24), and an electrode (25); The first section (21) of the film is arranged on the outer surface of the arc-shaped elastic sheet (11) along the length direction of the arc-shaped elastic sheet (11); The semiconductor conductive film (24) is located on the surface of the first section (21) of the film, and the electrode (25) is located on the second section (22) of the film; the positions of the semiconductor conductive film (24) and the electrode (25) correspond to each other; The pressure sensing structure further comprises a first plate (12); One end of the arc-shaped spring piece (11) is connected to the upper surface of the first flat plate (12), and the other end of the arc-shaped spring piece (11) is a free end; The second section (22) of the thin film is arranged on the upper surface of the first flat plate (12), and the electrode (25) on the second section (22) of the thin film corresponds to the position of the semiconductor conductive thin film (24); The first film section (21) and the second film section (22) are connected via a bent portion (23).

2. A pressure sensing structure according to claim 1, characterized in that: The free end of the arc-shaped elastic sheet (11) is also connected to a second flat plate (13); the second flat plate (13) is parallel to the first flat plate (12).

3. A pressure sensing structure according to claim 1, characterized in that: Also includes a bottom plate (31); The midpoint of the arc-shaped spring piece (11) is fixedly connected to the upper surface of the bottom plate (31), and both ends of the arc-shaped spring piece (11) are free ends. The second section (22) of the thin film is arranged on the upper surface of the flat plate, and the electrode (25) on the second section (22) of the thin film corresponds to the position of the semiconductor conductive thin film (24).

4. A pressure sensing structure according to claim 3, characterized in that: There are two pressure sensing components (2); and the two pressure sensing components (2) are symmetrically arranged.

5. A pressure sensing structure according to claim 4, characterized in that: It also includes a pressure plate (4); The two free ends of the arc-shaped spring piece (11) are connected to a second flat plate (13), and the second flat plate (13) is parallel to the bottom plate (31); The pressure plate (4) is located on the upper surfaces of the two second flat plates (13).

6. A pressure sensing structure according to claim 5, characterized in that: A cylinder (32) is disposed on the bottom plate (31); the arc-shaped spring piece (11) and the pressure sensing component (2) are both located in the cylinder (32); The cross section of the pressure plate (4) is similar to the cross section of the cylinder (32), and is smaller than the cross section of the cylinder (32).

7. A pressure touch device based on the pressure sensing structure as claimed in claim 2, characterized in that: A bottom plate (31), a cylinder (32), a pressure-bearing plate (4), and a plurality of pressure sensing structures; The cylinder (32) and the plurality of pressure sensing structures are all arranged on the surface of the bottom plate (31), and the pressure sensing structures are all located in the cylinder (32); The pressure plate (4) is located on the upper surfaces of the plurality of pressure sensing structures and is connected to the upper surface of the second flat plate of the pressure sensing assembly (2). The cross section of the pressure plate (4) is similar to the cross section of the cylinder (32) and is smaller than the cross section of the cylinder (32).

8. The pressure touch device according to claim 7, characterized in that: A plurality of pressure sensing structures are evenly distributed on the same circumference.

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