Mini LED chip detection method and device based on multi-channel probe set

Abstract

The application discloses a kind of based on the Mini LED chip detection method and device of multi-channel probe group, the method includes: the LED chip to be detected is scanned, and the position information of the LED chip to be detected is determined by recognizing the LED chip to be detected after scanning using image recognition technology;According to position information, control multi-channel probe group moves to the LED chip to be detected, and control multi-channel probe group is built into the top of the die in the preset area of the LED chip to be detected with the standard control needle frame;When detecting that the die appearance is normal, control multi-channel probe group falls needle, and each channel probe group is sequentially powered on test after needle, and after multi-channel probe group is all tested, the LED chip to be detected is detected using multi-channel probe group.The application solves the problem that in the prior art, when testing, multi-channel probe group channel wiring error and probe offset cannot be found in time, resulting in low test accuracy.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, and in particular to a method and apparatus for testing Mini LED chips based on a multi-channel probe group. Background Technology

[0002] As the LED wafer industry develops and product sizes become smaller, the technical challenges of testing Mini LEDs are increasing. In actual production, wafer testing anomalies are caused by testing equipment and external factors. To increase production capacity, LED chip point testing has adopted an 8-pin or more pin interleaved parallel testing method. The number of probes is large and densely arranged, and the circuit is complex, which requires higher accuracy in personnel adjusting the probes and in the wiring of the equipment.

[0003] In existing technologies, operators manually adjust the probes. However, due to the large number of probe groups and the small die size, problems such as overall misalignment and misalignment of a certain channel often occur. Furthermore, the wiring of each channel of the machine relies on personnel to check the wiring. If the personnel are slightly careless, a certain channel may be connected incorrectly, and the abnormality is difficult to detect, resulting in chaotic product test data and affecting product quality. Summary of the Invention

[0004] In view of this, the purpose of the present invention is to provide a Mini LED chip testing method and apparatus based on a multi-channel probe group, which aims to solve the problems in the prior art where it is impossible to detect channel wiring errors of the multi-channel probe group in a timely manner and the low test accuracy caused by probe misalignment during testing.

[0005] This invention provides a method for detecting Mini LED chips based on a multi-channel probe group, the method comprising:

[0006] The LED chip to be tested is scanned on the wafer, and image recognition technology is used to identify the LED chip after scanning to determine the position information of the LED chip to be tested.

[0007] Based on the location information, the multi-channel probe group is controlled to move to the LED chip to be tested, and the multi-channel probe group is controlled to be mounted above the die in the preset area of ​​the LED chip to be tested, with the probe frame as the standard.

[0008] When the appearance of the chip is found to be normal, the multi-channel probe group is controlled to drop the probes and each channel probe group is powered on sequentially for testing. After all the multi-channel probe groups have passed the test, the multi-channel probe group is used to test the LED chip to be tested.

[0009] Furthermore, in the aforementioned Mini LED chip detection method based on a multi-channel probe group, the step of performing on-chip scanning on the LED chip to be detected and using image recognition technology to identify and determine the position information of the scanned LED chip includes:

[0010] Traverse all the LED chips to be tested on the wafer and obtain the initial position information of each LED chip relative to the preset target position;

[0011] Based on the layout and quantity of all LED chips to be tested on the wafer, a corresponding scanning path is planned, and then the LED chips to be tested are scanned according to the scanning path to determine the position information of each LED chip to be tested.

[0012] Furthermore, in the aforementioned Mini LED chip detection method based on a multi-channel probe group, the step prior to detecting a normal crystal appearance further includes:

[0013] Acquire a grain image of the grain and preprocess the grain image, the preprocessing including noise reduction and contrast enhancement;

[0014] Key feature information of the grains is extracted from the preprocessed grain image, and the key feature information is compared with a preset defect template;

[0015] If the key feature information fails to match the preset defect template, the grain appearance is determined to be normal.

[0016] Furthermore, in the aforementioned Mini LED chip detection method based on a multi-channel probe group, the steps of controlling the multi-channel probe group to be inserted, sequentially powering on and testing each channel probe group after insertion, and then using the multi-channel probe group to detect the LED chip to be tested after all multi-channel probe groups have passed the test, include:

[0017] After each channel probe group is powered on and tested, a test image of the probe frame position is acquired.

[0018] The test image is used to identify whether the corresponding chip is lit.

[0019] If so, the current channel probe group is determined to be normal, and the power supply test of the next channel probe group is executed;

[0020] If not, a prompt message will be issued to indicate the presence of a channel anomaly in the current channel probe group.

[0021] Furthermore, in the aforementioned Mini LED chip detection method based on a multi-channel probe group, the step of acquiring a test image of the probe frame position after power-on testing includes:

[0022] A test image is obtained by capturing light using a CCD sensor and converting the light into an electrical signal to generate a corresponding digital image.

[0023] Furthermore, in the aforementioned Mini LED chip detection method based on a multi-channel probe group, the step of identifying and determining whether the corresponding chip in the test image is lit includes:

[0024] The test image is subjected to preliminary processing, which includes noise reduction, filtering, graying, and binarization.

[0025] Key features are extracted from the pre-processed test image, including shape, color, and texture;

[0026] The key features are identified using a preset recognition algorithm to determine whether the corresponding chip is lit.

[0027] Furthermore, the Mini LED chip detection method based on the above multi-channel probe group further includes, before the step of traversing all the LED chips to be detected on the wafer and obtaining the initial position information of each LED chip to be detected relative to the preset target position:

[0028] The internal and external parameters of the image acquisition device that traverses all the LED chips to be tested on the wafer are calibrated, and lens distortion is corrected.

[0029] Another object of the present invention is to provide a Mini LED chip detection device based on a multi-channel probe group, the device comprising:

[0030] The scanning module is used to scan the LED chip to be tested, and uses image recognition technology to identify the LED chip after scanning to determine the position information of the LED chip to be tested.

[0031] The moving module is used to control the multi-channel probe group to move to the LED chip to be tested according to the position information, and to control the multi-channel probe group to be mounted above the chip in the preset area of ​​the LED chip to be tested, with the probe frame as the standard.

[0032] The detection module is used to control the multi-channel probe group to drop the probes after detecting that the appearance of the chip is normal, and to sequentially power on each channel probe group for testing. After all the multi-channel probe groups have passed the test, the multi-channel probe group is used to detect the LED chip to be tested.

[0033] Another object of the present invention is to provide a readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the method described above.

[0034] Another object of the present invention is to provide an electronic device including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor, when executing the program, implements the steps of the method described above.

[0035] This invention involves scanning the LED chip under test and using image recognition technology to identify and determine its position. Based on this position information, a multi-channel probe group is moved to the LED chip and positioned above the die in a predetermined area of ​​the chip, using a probe alignment frame as a reference. Once the die's appearance is confirmed to be normal, the multi-channel probe group is lowered and each channel is sequentially powered for testing. After all channels pass the test, the multi-channel probe group is used to inspect the LED chip. The system automatically aligns the probes with the die on the chip and verifies the multi-channel probe group using a portion of the die before chip testing, ensuring proper probe wiring before proceeding with chip inspection. This solves the problems of low testing accuracy caused by the inability to detect multi-channel probe group wiring errors and probe misalignment during testing in existing technologies. Attached Figure Description

[0036] Figure 1 This is a flowchart of the Mini LED chip detection method based on a multi-channel probe group in the first embodiment of the present invention;

[0037] Figure 2 This is a schematic diagram of the probe group performing power supply testing in a Mini LED chip detection method based on a multi-channel probe group according to an embodiment of the present invention;

[0038] Figure 3 This is a structural block diagram of a Mini LED chip detection device based on a multi-channel probe group in the third embodiment of the present invention.

[0039] The following detailed description, in conjunction with the accompanying drawings, will further illustrate the present invention. Detailed Implementation

[0040] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of the invention are illustrated in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

[0041] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0043] The following will describe in detail how to improve the accuracy of chip testing, with reference to specific embodiments and accompanying drawings.

[0044] Example 1

[0045] Please see Figure 1 The figure shows a Mini LED chip detection method based on a multi-channel probe group in the first embodiment of the present invention, the method including steps S10 to S12.

[0046] Step S10: Perform on-chip scanning on the LED chip to be tested, and use image recognition technology to identify the scanned LED chip to determine its position information.

[0047] Before the spot testing begins, the LED chips to be tested must first be loaded into the testing equipment; this is called "chip loading." At this point, the scanning system performs preliminary inspection and recording on each chip, ensuring that the positional information and characteristic data of each chip are accurately stored in the equipment's storage medium. This data is then used for subsequent test positioning and analysis. The automatic scanning ensures that each Mini LED chip meets predetermined performance standards during testing. Through fully automated chip scanning, the system can accurately locate each Mini LED chip, using an image recognition system to determine the chip's precise position, thus ensuring the accuracy of the test.

[0048] Specifically, the image acquisition devices within the scanning system, such as cameras, can be calibrated to ensure accurate capture and identification of chips on the wafer. Calibration includes steps such as calibrating the camera's intrinsic and extrinsic parameters and correcting lens distortion. The camera can traverse all chips on the wafer to acquire images. Image recognition technologies, including edge detection, feature extraction, and image segmentation, are then used to accurately extract the chip's position and shape information from complex backgrounds. The initial position information of each chip relative to a preset target position (such as the wafer center or a specific reference point) is obtained and recorded. Furthermore, based on the layout and number of chips on the wafer, an optimal scanning path can be planned to reduce scanning time and improve efficiency. The chips are scanned according to the scanning path to obtain relevant parameter information, such as chip position information, the die distribution on the chip, and the corresponding die images.

[0049] Step S11: Based on the position information, control the multi-channel probe group to move to the LED chip to be tested, and control the multi-channel probe group to be mounted on the die of the LED chip in the preset area, using the probe frame as the standard.

[0050] After scanning, preparation work is carried out before probe testing. Specifically, the multi-channel probe group is moved to the LED chip to be tested, and a preset area is selected on the LED chip. The chip in the preset area is used as the self-test chip for the probe group pre-test. The multi-channel probe group is placed above the chip with the probe alignment frame as the standard to ensure accurate alignment between the probe group and the chip. The probe alignment frame provides a reference coordinate system for the probe group, so that the test equipment can accurately align the probe with the key contact point of each chip, avoiding probe offset or incomplete contact, which would lead to inaccurate measurement.

[0051] Step S12: When the appearance of the chip is detected to be normal, the multi-channel probe group is controlled to drop the probes and each channel probe group is powered on sequentially for testing. After all the multi-channel probe groups have passed the test, the multi-channel probe group is used to test the LED chip to be tested.

[0052] After confirming that the selected chip has a normal appearance, the multi-channel probe group is controlled to start the power supply test by dropping the probes. The test results are then used to check whether the wiring of the probe group is normal. Specifically, the multi-channel probe group is tested in turn. Once the wiring of the multi-channel probe group is confirmed to be normal after testing, the self-test of the multi-channel probe group is completed. Then, the LED chip is tested, which ensures the accuracy of the chip test.

[0053] In addition, in some optional embodiments of the present invention, image processing technology can be used to determine whether the appearance of the current die is normal. Specifically, the acquired die image is preprocessed, including noise reduction and contrast enhancement, to improve image quality. Key feature information, such as edges and corners, is extracted from the preprocessed image. The extracted feature information is compared with a preset defect template to detect whether there are defects on the chip die.

[0054] Furthermore, to facilitate analysis, during chip on-wafer scanning and inspection, defects detected during the scanning process can be statistically analyzed, including defect type, quantity, and distribution. A detailed inspection report is generated based on the statistical results, including defect images, location information, and inspection results, for subsequent analysis and processing.

[0055] In summary, the Mini LED chip detection method based on a multi-channel probe group in the above embodiments of the present invention performs on-chip scanning of the LED chip to be tested, uses image recognition technology to identify the scanned LED chip to determine its position information, controls the multi-channel probe group to move to the LED chip to be tested based on the position information, and controls the multi-channel probe group to be positioned above the die in a preset area of ​​the LED chip to be tested, using the probe alignment frame as a standard; when the die appearance is detected to be normal, the multi-channel probe group is controlled to drop the probes and each channel probe group is sequentially powered on for testing, and the LED chip to be tested is tested using the multi-channel probe group after all multi-channel probe groups have passed the test. The method automatically controls the alignment of the probes with the die on the chip, and uses a portion of the die to verify the multi-channel probe group before chip testing, ensuring that the probe group wiring is correct before chip testing. This solves the problems in the prior art where it is impossible to detect multi-channel probe group channel wiring errors and probe misalignment during testing, leading to low test accuracy.

[0056] Example 2

[0057] This embodiment also proposes a Mini LED chip detection method based on a multi-channel probe group. The difference between the Mini LED chip detection method based on a multi-channel probe group in this embodiment and the Mini LED chip detection method based on a multi-channel probe group in Embodiment 1 is as follows:

[0058] The steps of controlling the multi-channel probe group to be lowered, sequentially powering on each channel probe group for testing, and using the multi-channel probe group to test the LED chip to be tested after all the multi-channel probe groups have passed the test include:

[0059] After each channel probe group is powered on and tested, a test image of the probe frame position is acquired.

[0060] The test image is used to identify whether the corresponding chip is lit.

[0061] If so, the current channel probe group is determined to be normal, and the power supply test of the next channel probe group is executed;

[0062] If not, a prompt message will be issued to indicate the presence of a channel anomaly in the current channel probe group.

[0063] In this process, each probe is sequentially tested for electrical power supply. For example, as shown below... Figure 2 As shown, eight channel probes are tested for power supply. First, one channel probe is tested for power supply, and CCD image is taken for evidence to determine whether the chip at the probe frame position is lit. If the light is lit, the system automatically determines that the corresponding position of the probe in that channel group is accurate and the wiring is normal, and then the next channel probe is tested. If the light is not lit, the system issues a prompt message to indicate that there is a channel abnormality in the current channel probe group.

[0064] Specifically, during the detection process of photographic evidence collection, a CCD sensor captures light and converts it into an electrical signal to generate a corresponding digital image for testing. The acquired image undergoes preliminary processing, including noise reduction, filtering, grayscale conversion, and binarization, to remove noise and unnecessary details, improve image quality, and facilitate subsequent processing and analysis. Key features, such as shape, color, and texture, are extracted from the preprocessed image. These features will be used for subsequent image recognition and analysis.

[0065] Based on the extracted features, classification and recognition algorithms are used to judge and identify target objects in the image, and the recognition results are provided. The recognition results are output in an appropriate form, such as displayed on a screen, stored in a file, or sent as a control signal to other devices. It should be noted that the recognition and classification algorithm can be selected according to the actual situation, which is understandable to those skilled in the art and will not be elaborated here.

[0066] In summary, the Mini LED chip detection method based on a multi-channel probe group in the above embodiments of the present invention performs on-chip scanning of the LED chip to be tested, uses image recognition technology to identify the scanned LED chip to determine its position information, controls the multi-channel probe group to move to the LED chip to be tested based on the position information, and controls the multi-channel probe group to be positioned above the die in a preset area of ​​the LED chip to be tested, using the probe alignment frame as a standard; when the die appearance is detected to be normal, the multi-channel probe group is controlled to drop the probes and each channel probe group is sequentially powered on for testing, and the LED chip to be tested is tested using the multi-channel probe group after all multi-channel probe groups have passed the test. The method automatically controls the alignment of the probes with the die on the chip, and uses a portion of the die to verify the multi-channel probe group before chip testing, ensuring that the probe group wiring is correct before chip testing. This solves the problems in the prior art where it is impossible to detect multi-channel probe group channel wiring errors and probe misalignment during testing, leading to low test accuracy.

[0067] Example 3

[0068] Please see Figure 3 The image shows a Mini LED chip detection device based on a multi-channel probe group proposed in the third embodiment of the present invention. The device includes:

[0069] The scanning module 100 is used to perform on-chip scanning of the LED chip to be tested, and uses image recognition technology to identify the LED chip to be tested after scanning to determine the position information of the LED chip to be tested.

[0070] The moving module 200 is used to control the multi-channel probe group to move to the LED chip to be tested according to the position information, and to control the multi-channel probe group to be mounted above the chip in the preset area of ​​the LED chip to be tested, with the probe frame as the standard.

[0071] The detection module 300 is used to control the multi-channel probe group to drop the probes after detecting that the appearance of the chip is normal, and to sequentially power on each channel probe group for testing. After all the multi-channel probe groups have passed the test, the multi-channel probe group is used to detect the LED chip to be tested.

[0072] Furthermore, in some optional embodiments of the present invention, the scanning module includes:

[0073] The traversal unit is used to traverse all the LED chips to be tested on the wafer and obtain the initial position information of each LED chip to be tested relative to the preset target position.

[0074] Based on the layout and quantity of all LED chips to be tested on the wafer, a corresponding scanning path is planned, and then the LED chips to be tested are scanned according to the scanning path to determine the position information of each LED chip to be tested.

[0075] Furthermore, in some optional embodiments of the present invention, the apparatus further includes:

[0076] The comparison unit is used to acquire a grain image of the grain and preprocess the grain image, the preprocessing including noise reduction and contrast enhancement.

[0077] Key feature information of the grains is extracted from the preprocessed grain image, and the key feature information is compared with a preset defect template;

[0078] If the key feature information fails to match the preset defect template, the grain appearance is determined to be normal.

[0079] Furthermore, in some optional embodiments of the present invention, the detection module includes:

[0080] The test unit is used to acquire test images of the probe frame position after the power-on test of each channel probe group;

[0081] The test image is used to identify whether the corresponding chip is lit.

[0082] If so, the current channel probe group is determined to be normal, and the power supply test of the next channel probe group is executed;

[0083] If not, a prompt message will be issued to indicate the presence of a channel anomaly in the current channel probe group.

[0084] Furthermore, in some optional embodiments of the present invention, the step of acquiring a test image of the pin frame position after the power-on test includes:

[0085] A test image is obtained by capturing light using a CCD sensor and converting the light into an electrical signal to generate a corresponding digital image.

[0086] Furthermore, in some optional embodiments of the present invention, the step of identifying and determining whether the corresponding chip in the test image is lit includes:

[0087] The test image is subjected to preliminary processing, which includes noise reduction, filtering, graying, and binarization.

[0088] Key features are extracted from the pre-processed test image, including shape, color, and texture;

[0089] The key features are identified using a preset recognition algorithm to determine whether the corresponding chip is lit.

[0090] Furthermore, in some optional embodiments of the present invention, the apparatus further includes:

[0091] The correction module is used to calibrate the internal and external parameters of the image acquisition device that traverses all the LED chips to be tested on the wafer, and to correct lens distortion.

[0092] The functions or operation steps implemented by the above modules are largely the same as those in the above method embodiments, and will not be repeated here.

[0093] Example 4

[0094] In another aspect, the present invention provides a readable storage medium having a computer program stored thereon, wherein the program, when executed by a processor, implements the steps of the method described in any one of the above embodiments one to two.

[0095] Example 5

[0096] In another aspect, the present invention provides an electronic device, the electronic device including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the steps of any one of the methods described in embodiments one to two above.

[0097] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0098] Those skilled in the art will understand that the logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequential list of executable instructions for implementing logical functions, and can be embodied in any computer-readable storage medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (such as a computer-based system, a processor-included system, or other system that can fetch and execute instructions from, an instruction execution system, apparatus, or device). For the purposes of this specification, "computer-readable storage medium" can mean any means that can contain, store, communicate, propagate, or transmit programs for use by, or in conjunction with, an instruction execution system, apparatus, or device.

[0099] More specific examples (a non-exhaustive list) of computer-readable storage media include: electrical connections (electronic devices) having one or more wires, portable computer disk drives (magnetic devices), random access memory (RAM), read-only memory (ROM), erasable and editable read-only memory (EPROM or flash memory), fiber optic devices, and portable optical disc read-only memory (CDROM). Furthermore, computer-readable storage media can even be paper or other suitable media on which the program can be printed, since the program can be obtained electronically, for example, by optically scanning the paper or other medium, followed by editing, interpreting, or otherwise processing as necessary, and then stored in computer memory.

[0100] It should be understood that various parts of the present invention can be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented in software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0101] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0102] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of this patent should be determined by the appended claims.

Claims

1. A method for detecting Mini LED chips based on a multi-channel probe array, characterized in that, The method includes: The LED chip to be tested is scanned on the wafer, and image recognition technology is used to identify the LED chip after scanning to determine the position information of the LED chip to be tested. Based on the location information, the multi-channel probe group is controlled to move to the LED chip to be tested, and the multi-channel probe group is controlled to be mounted above the die in the preset area of ​​the LED chip to be tested, with the probe frame as the standard. When the appearance of the chip is found to be normal, the multi-channel probe group is controlled to drop the probes and each channel probe group is powered on and tested in sequence. After all the multi-channel probe groups have passed the test, the multi-channel probe group is used to test the LED chip to be tested. The steps of performing on-chip scanning on the LED chip to be tested and using image recognition technology to identify and determine the position information of the LED chip to be tested after scanning include: Traverse all the LED chips to be tested on the wafer and obtain the initial position information of each LED chip relative to the preset target position; Based on the layout and quantity of all LED chips to be tested on the wafer, a corresponding scanning path is planned, and then the LED chips to be tested are scanned according to the scanning path to determine the position information of each LED chip to be tested. The step prior to detecting that the grain appearance is normal also includes: Acquire a grain image of the grain and preprocess the grain image, the preprocessing including noise reduction and contrast enhancement; Key feature information of the grains is extracted from the preprocessed grain image, and the key feature information is compared with a preset defect template; If the key feature information fails to match the preset defect template, the grain appearance is determined to be normal.

2. The Mini LED chip detection method based on a multi-channel probe group according to claim 1, characterized in that, The steps of controlling the multi-channel probe group to be lowered, sequentially powering on each channel probe group for testing, and using the multi-channel probe group to test the LED chip to be tested after all the multi-channel probe groups have passed the test include: After each channel probe group is powered on and tested, a test image of the probe frame position is acquired. The test image is used to identify whether the corresponding chip is lit. If so, the current channel probe group is determined to be normal, and the power supply test of the next channel probe group is executed; If not, a prompt message will be issued to indicate the presence of a channel anomaly in the current channel probe group.

3. The Mini LED chip detection method based on a multi-channel probe group according to claim 2, characterized in that, The step of acquiring a test image of the pin frame position after the power-on test includes: A test image is obtained by capturing light using a CCD sensor and converting the light into an electrical signal to generate a corresponding digital image.

4. The Mini LED chip detection method based on a multi-channel probe group according to claim 3, characterized in that, The step of identifying and determining whether the corresponding chip in the test image is lit includes: The test image is subjected to preliminary processing, which includes noise reduction, filtering, graying, and binarization. Key features are extracted from the pre-processed test image, including shape, color, and texture; The key features are identified using a preset recognition algorithm to determine whether the corresponding chip is lit.

5. The Mini LED chip detection method based on a multi-channel probe group according to claim 1, characterized in that, Before the step of traversing all the LED chips to be tested on the wafer and obtaining the initial position information of each LED chip relative to the preset target position, the method further includes: The internal and external parameters of the image acquisition device that traverses all the LED chips to be tested on the wafer are calibrated, and lens distortion is corrected.

6. A Mini LED chip detection device based on a multi-channel probe group, characterized in that, The apparatus for implementing the Mini LED chip detection method based on a multi-channel probe group as described in any one of claims 1 to 5, the apparatus comprising: The scanning module is used to scan the LED chip to be tested, and uses image recognition technology to identify the LED chip after scanning to determine the position information of the LED chip to be tested. The moving module is used to control the multi-channel probe group to move to the LED chip to be tested according to the position information, and to control the multi-channel probe group to be mounted above the chip in the preset area of ​​the LED chip to be tested, with the probe frame as the standard. The detection module is used to control the multi-channel probe group to drop the probes after detecting that the appearance of the chip is normal, and to sequentially power on each channel probe group for testing. After all the multi-channel probe groups have passed the test, the multi-channel probe group is used to detect the LED chip to be tested.

7. A readable storage medium having a computer program stored thereon, characterized in that, When the program is executed by the processor, it implements the steps of the method as described in any one of claims 1 to 5.

8. An electronic device, characterized in that, It includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor, when executing the program, implements the steps of the method as described in any one of claims 1 to 5.

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