Chip structure, chip encoding method, chip processing method and program product

Abstract

The present application provides a chip structure, a chip encoding method, a chip processing method and a program product, which relate to the field of chip testing technology. The chip structure includes: a chip body and an encoding unit; wherein the encoding unit is arranged on the chip body; a color-changing device that changes color based on the applied current is provided in the encoding unit; the encoding unit is used to present the target encoding information of the chip structure based on the color change of multiple color-changing devices. The chip encoding method includes: determining the target encoding information of the chip structure to be encoded; determining the target current signal output by the encoding control terminal based on the target encoding information; outputting the target current signal to the encoding unit provided on the connected chip structure through the encoding control terminal, and obtaining a target encoding chip with the target encoding information. The chip can be encoded by utilizing the color change generated by the encoding unit under a large current impact, which effectively reduces the cost of chip encoding and improves the efficiency, accuracy and durability of chip encoding.

Description

Technical Field

[0001] The present application relates to the field of chip testing technology, and in particular to a chip structure, a chip encoding method, a chip processing method, and a program product. Background Art

[0002] In the current chip manufacturing industry, every chip may fail after packaging. Troubleshooting requires knowing the wafer batch and wafer location of the chip production, so as to locate the test data of the chip. Therefore, each chip produced needs to be specially encoded as an identity identifier for traceability.

[0003] Current chip encoding methods are typically based on processing methods for electronic chips, such as memory, laser marking, or probe marking. However, in the field of optical chips, because the process flow of optical chips differs significantly from that of traditional electronic chips and they lack a CMOS tube structure, the chips cannot be encoded using the memory structure. Furthermore, laser encoding and probe drilling methods have high equipment costs, low encoding efficiency, and are prone to contamination or damage to the optical chip during the encoding process. This results in poor encoding results for current optical chips, which cannot meet the encoding requirements of optical chips and have an adverse impact on the troubleshooting and traceability of optical chip issues. Summary of the Invention

[0004] In view of this, the purpose of the embodiments of the present application is to provide a chip structure, a chip encoding method, a chip processing method and a program product to improve the problem of poor encoding effect of the chip in the prior art.

[0005] In order to solve the above problems, in a first aspect, an embodiment of the present application provides a chip structure, the chip structure comprising: a chip body and a coding unit; wherein the coding unit is provided on the chip body;

[0006] The encoding unit is provided with a color-changing device that changes color based on the applied current;

[0007] The encoding unit is used to present target encoding information of the chip structure based on the color change conditions of the multiple color change devices.

[0008] In the above implementation, a corresponding encoding unit can be provided on the chip body to encode the chip and represent its unique identity information. The encoding unit is equipped with a color-changing device that changes color in response to an applied current. The color change of the color-changing device reveals the target encoding information of the chip structure, thereby identifying the chip body. The ability to use the color change of the encoding unit under current impact to present the chip's encoding information effectively improves the accuracy and durability of the chip encoding, reduces damage to the chip during the encoding process and interference with the preparation process, reduces the difficulty of encoding, and improves the ease of operation of chip encoding.

[0009] Optionally, a plurality of the color-changing devices are separately connected, and each of the color-changing devices is provided with a corresponding current input port.

[0010] In the above implementation process, multiple color-changing devices in the encoding unit can be connected separately to work independently. Therefore, in order to realize the color-changing modulation of the color-changing device by current, each color-changing device can be provided with a corresponding current input port to realize relatively independent color-changing control, thereby effectively improving the effectiveness and accuracy of the target coding information of the chip structure.

[0011] Optionally, a plurality of the color-changing devices are connected in combination, and a single current input port is provided in the encoding unit;

[0012] Each of the color-changing devices is connected to a corresponding switching device, and the current input port is connected to a plurality of the switching devices.

[0013] In the above implementation process, multiple color-changing devices in the encoding unit can be connected together for unified control. Therefore, in order to realize the color-changing modulation of the color-changing device by current, a unified single current input port can be set to control multiple color-changing devices to achieve unified color-changing control. In addition, in order to improve the control effectiveness of each color-changing device under unified control, a corresponding switching device can be set to connect with each color-changing device, and the current input port can be connected with the switching device, so as to control the conduction of the current path of each color-changing device, effectively simplifying the number of current input ports and improving the encoding efficiency of the chip structure.

[0014] Optionally, the color-changing device includes a color-changing metal or a color-changing polycrystalline material based on current modulation.

[0015] In the above implementation process, the color-changing device may include various types of color-changing metals or color-changing polycrystalline materials that can produce color changes based on current modulation, so as to feedback corresponding coding information through the color change conditions, thereby presenting the final target coding information.

[0016] In a second aspect, an embodiment of the present application further provides a chip encoding method, the method comprising:

[0017] Determining target coding information of a chip structure to be encoded; wherein the chip structure is any one of the chip structures described above;

[0018] Determining a target current signal output by the encoding control terminal based on the target encoding information;

[0019] The target current signal is outputted to the encoding unit provided on the connected chip structure through the encoding control terminal, thereby obtaining a target encoding chip having the target encoding information.

[0020] In the above implementation process, due to the uniqueness of each chip structure to be encoded, the target encoding information of the chip structure to be encoded can be determined first. Since the encoding unit on the chip structure can present the target encoding information based on current modulation, the target current signal output by the encoding control terminal when performing chip encoding can be determined based on the target encoding information. The corresponding target current signal is then output to the encoding unit provided on the connected chip structure via the encoding control terminal to obtain a target encoding chip with the target encoding information. The ability to encode and control the chip structure through current output effectively reduces the cost of chip encoding and improves the efficiency, accuracy, and durability of chip encoding. It also reduces damage to the chip during the encoding process or interference with the preparation process, reduces the difficulty of encoding, and improves the ease of operation of chip encoding.

[0021] Optionally, determining target coding information of the chip structure to be encoded includes:

[0022] Determining the identity information of the chip body in the chip structure to be encoded; wherein the identity information includes a wafer number or location information;

[0023] The target coding information is determined according to a preset coding rule, the identity information and the arrangement information of the color-changing devices in the coding unit.

[0024] In the above implementation process, due to the uniqueness of each chip structure, in order to obtain unique target coding information, the target coding information representing the unique identity of the chip structure can be determined based on the identity information of the chip body in the chip structure, such as the wafer number, location information, and other information that represents the actual situation of the chip body on the wafer structure, combined with preset coding rules and the arrangement information of the color-changing devices in the coding unit. The ability to determine the target coding information for each chip structure to be encoded based on the actual situation of the chip structure effectively improves the target coding information and rationality. It is also possible to reversely analyze the actual situation of the chip structure on the wafer from the target coding information, facilitating subsequent fault detection and other processing.

[0025] Optionally, if the encoding control terminal has multiple current source output ports, determining the target current signal output by the encoding control terminal based on the target encoding information includes:

[0026] determining a sub-current signal of each color-changing device in the encoding unit according to the target encoding information;

[0027] The target current signals output by the multiple current source output ports are determined according to the multiple sub-current signals and arrangement information of the multiple current source output ports.

[0028] In the above implementation, the encoding control terminal can be equipped with multiple current source output ports, each connected to the current input port of each discrete color-changing device in the encoding unit. The color change state of each color-changing device can be determined based on the target encoding information, thereby determining multiple corresponding sub-current signals. Based on these multiple sub-current signals and the arrangement of the multiple current source output ports, the overall target current signal output by the multiple current source output ports is determined. This allows for individual current control of the multiple discrete color-changing devices in the encoding unit, effectively improving the efficiency and accuracy of chip encoding.

[0029] Optionally, if the encoding control terminal has a single current source output port, determining the target current signal output by the encoding control terminal based on the target encoding information includes:

[0030] determining a switching signal of each color-changing device according to the target coding information and a connection relationship between the plurality of color-changing devices in the coding unit;

[0031] The target current signal outputted by the current source output port is determined according to the plurality of switching signals.

[0032] In the above implementation, the encoding control terminal can be provided with a single current source output port, which connects to a single current input port in the encoding unit to achieve unified control of multiple color-changing devices. The color change status of each color-changing device can be determined based on the target encoding information. The switching signal of the corresponding switching device for each color-changing device can then be determined based on the connection relationship of the multiple color-changing devices. Based on the switching signal, the target current signal output by the current source output port for unified control of the multiple color-changing devices is then determined. This enables unified current control of multiple jointly connected color-changing devices in the encoding unit, effectively reducing the number of current output ports and improving chip encoding efficiency.

[0033] In a third aspect, an embodiment of the present application further provides a chip processing method, the method comprising:

[0034] Acquire a detection image of the target encoding chip;

[0035] Performing image recognition on a region of a coding unit of the target coding chip in the detection image to determine a color change condition of each color-changing device in the coding unit;

[0036] Analyze the color change and preset coding rules to determine the target coding information;

[0037] Fault processing is performed based on the target coding information.

[0038] In the above implementation process, if it is necessary to perform fault detection or traceability on the encoded target coding chip, a detection image of the target coding chip can be first obtained. By performing image recognition on the area of ​​the coding unit in the detection image, the color change of each color-changing device in the coding unit can be obtained. Then, combining the color change situation with the preset coding rules, the target coding information corresponding to the target coding chip can be parsed to perform corresponding data location and other fault processing based on the target coding information. When a fault occurs, the corresponding target coding information can be determined through image recognition and rule parsing, and subsequent fault processing can be performed based on the target coding information, effectively improving the efficiency and accuracy of chip code recognition and acquisition, as well as the efficiency of fault processing based on chip codes.

[0039] In a fourth aspect, an embodiment of the present application further provides a computer program product, which includes a computer program / instruction, and when the computer program / instruction is executed by a processor, the steps of any one of the above-mentioned chip encoding methods or chip processing methods are implemented.

[0040] In summary, the embodiments of the present application provide a chip structure, a chip encoding method, a chip processing method and a program product, which can encode the chip by utilizing the discoloration of the encoding unit under large current impact, effectively reducing the cost of chip encoding, and improving the efficiency, accuracy and durability of chip encoding, reducing the damage to the chip during the encoding process or the intervention in the preparation process, reducing the difficulty of encoding, and improving the operability of chip coding. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0042] Figure 1 A schematic diagram of a chip structure provided in an embodiment of the present application;

[0043] Figure 2 A schematic diagram of the structure of a coding unit provided in an embodiment of the present application;

[0044] Figure 3 A schematic structural diagram of another encoding unit provided in an embodiment of the present application;

[0045] Figure 4 A schematic flow chart of a chip encoding method provided in an embodiment of the present application;

[0046] Figure 5 A detailed flowchart of step S310 provided in an embodiment of the present application;

[0047] Figure 6 A detailed flowchart of step S320 provided in an embodiment of the present application;

[0048] Figure 7 A detailed flowchart of another step S320 provided in an embodiment of the present application;

[0049] Figure 8 A schematic flow chart of a chip processing method provided in an embodiment of the present application.

[0050] Icon: 100-chip body; 200-encoding unit; 210-color changing device; 220-current input port; 230-switch device. DETAILED DESCRIPTION

[0051] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of them. Based on the embodiments of the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the embodiments of the present application.

[0052] Current chip encoding methods typically target electronic chips. For example, a series of CMOS transistors are placed around a designed CMOS transistor array. These transistors can be designed as EFUSE (electronic fuses), EPROM (Erasable Programmable Read-Only Memory), E2PROM (Electrically Erasable Programmable Read-Only Memory), or other memory devices. After the chip is manufactured, the chip code is directly written into it and read out when powered on. Chip encoding can also be achieved by etching identification information on the chip surface using a laser beam or by probing metal pads one by one using a probe.

[0053] However, in the field of optical chips, since the process flow of optical chips is very different from that of traditional electrical chips and there is no CMOS tube structure, the chip cannot be encoded through the memory structure. In addition, the equipment cost of laser coding and probe punching coding is high, the coding efficiency is low, and it is easy to cause contamination or damage to the optical chip during the encoding process. As a result, the current coding effect of optical chips is poor, which cannot meet the coding needs of optical chips and has an adverse impact on the problem investigation and traceability of optical chips.

[0054] In order to solve the above problems, the embodiments of the present application provide a chip structure, a chip encoding method, a chip processing method and a program product. The chip encoding method and the chip processing method are applied to the encoding control end, and the encoding control end can be set as a corresponding test machine and other equipment.

[0055] See also Figure 1 , Figure 1 This is a schematic structural diagram of a chip structure provided in an embodiment of the present application. The chip structure may include: a chip body 100 and a coding unit 200.

[0056] The encoding unit 200 is disposed on the chip body 100 .

[0057] Optionally, the chip body 100 can be configured as various types of optical chips or other types of electrical chips. In order not to affect the normal use of the chip body 100, the encoding unit 200 can be fixed to the edge of the chip body 100 by pasting, bonding, welding, etc. For example, Figure 1 , an embodiment in which the chip body 100 is a rectangle is shown. The encoding unit 200 can be arranged at the corners of the rectangle, which is convenient for observation and preparation and does not cause adverse conditions such as contamination to the chip.

[0058] It should be noted that the encoding unit 200 is provided with a color-changing device 210 that changes color based on the applied current. The encoding unit 200 is used to present the target coding information of the chip structure based on the color change of multiple color-changing devices 210.

[0059] Optionally, the number of color-changing devices 210 can be set according to actual coding requirements. Figure 1 Only three feasible embodiments are shown, and the other quantities will not be repeated. The color-changing device 210 may include a color-changing metal or a color-changing polycrystalline material based on current modulation, such as titanium nitride metal, polycrystalline silicon and other materials. The color-changing device 210 can undergo electromigration under a large current impact, and has a burning and discoloring phenomenon. For example, titanium nitride metal will produce a blue discoloration phenomenon under a large current impact. When using titanium nitride metal for chip encoding, a current of 2-5A can be used for a current impact with a duration range of 2-10ns to cause the titanium nitride metal to produce a blue discoloration phenomenon, so as to present the target coding information of the chip structure according to the color change of the color-changing device 210, thereby identifying the chip body 100.

[0060] exist Figure 1 In the embodiment shown, the color change of the coding unit 200 under the current impact can be used to present the coding information of the chip, which effectively improves the accuracy and durability of the chip coding, reduces the damage to the chip during the coding process or the intervention in the preparation process, reduces the difficulty of coding, and improves the operability of the chip coding.

[0061] Optionally, see Figure 2 , Figure 2 This is a schematic diagram of the structure of a coding unit 200 provided in an embodiment of the present application. Figure 2 Only one embodiment of the encoding unit 200 having five color-changing devices 210 is shown, and embodiments with other numbers of color-changing devices 210 are not described in detail. The multiple color-changing devices 210 are connected separately, and each color-changing device 210 is provided with a corresponding current input port 220.

[0062] exist Figure 2 In the embodiment shown, the multiple color-changing devices 210 in the encoding unit 200 can be connected separately to work independently. Therefore, in order to realize the color change modulation of the color-changing device 210 by current, each color-changing device 210 can be provided with a corresponding current input port 220 to realize relatively independent color change control, thereby effectively improving the effectiveness and accuracy of the target coding information of the chip structure.

[0063] Optionally, see Figure 3 , Figure 3This is a schematic diagram of the structure of another encoding unit 200 provided in an embodiment of the present application. Figure 3 Only one embodiment of an encoding unit 200 having five color-changing devices 210 is shown; embodiments with other numbers of color-changing devices 210 are not described in detail. Multiple color-changing devices 210 are connected together, and a single current input port 220 is provided in the encoding unit 200. Each color-changing device 210 is connected to a corresponding switch device 230, and the current input port 220 is connected to multiple switch devices 230.

[0064] exist Figure 3 In the embodiment shown, the multiple color-changing devices 210 in the encoding unit 200 can be connected together, for example, they can be connected in parallel, etc., for unified control. Therefore, in order to achieve color change modulation of the color-changing device 210 by current, a unified single current input port 220 can be set to control the multiple color-changing devices 210 to achieve unified color change control. In addition, in order to improve the control effectiveness of each color-changing device 210 under unified control, a corresponding switching device 230 can be set to connect with each color-changing device 210, and the current input port 220 can be connected with the switching device 230, so as to control the conduction of the current path of each color-changing device 210, effectively simplifying the number of current input ports 220 and improving the encoding efficiency of the chip structure.

[0065] Optionally, the switch device 230 may be configured as various types of electrical switches.

[0066] Optionally, in Figure 2 and Figure 3 In the embodiment, the corresponding color-changing device 210, the current source input port and the corresponding switch device 230 can be connected through metal wires, such as metal aluminum wires.

[0067] See also Figure 4 , Figure 4 A schematic flow chart of a chip encoding method provided in an embodiment of the present application, the method may include steps S310-S330.

[0068] Step S310: determining target coding information of the chip structure to be encoded.

[0069] Among them, the chip structure is as above Figure 1-Figure 3 Since each chip structure to be encoded is unique, the target encoding information of the current chip structure to be encoded can be determined first to perform differentiated processing on multiple chip structures.

[0070] Alternatively, the target coding information can be determined by a random unique coding method, or uniquely based on the actual chip structure. The target coding information can be determined based on the color change of the color-changing device. For example, when the color-changing device changes color, the corresponding code is 1, and when the color-changing device does not change color, the corresponding code is 0. A string of 1s and 0s corresponding to the color change conditions of multiple color-changing devices is used as the corresponding target coding information. For example, for five color-changing devices, when the color change conditions of the color-changing devices are color change, no color change, color change, color change, and no color change, the corresponding target coding information is "10110."

[0071] It should be noted that 1 and 0 are only a feasible encoding representation method, and other characters such as letters and symbols can also be used to represent the two situations of color change and no color change respectively.

[0072] Step S320 , determining a target current signal output by the encoding control terminal based on the target encoding information.

[0073] Since the encoding unit on the chip structure can present target encoding information based on current modulation, the target current signal output by the encoding control terminal when performing chip encoding can be determined according to the target encoding information.

[0074] It should be noted that the target current signal can determine whether to output a large current based on the 1 and 0 in the target coding information. When the code is 1, a large current is output to change the color of the color-changing device. When the code is 0, no large current is output to prevent the color-changing device from changing color.

[0075] Step S330 , outputting a target current signal to a coding unit provided on a connected chip structure through the coding control terminal, thereby obtaining a target coding chip having target coding information.

[0076] Among them, the corresponding target current signal is output to the coding unit set on the connected chip structure through the coding control end to control the color-changing device in the coding unit to achieve the corresponding color change or no color change, so that the corresponding target coding information is presented through the coding unit to obtain the target coding chip with the target coding information.

[0077] exist Figure 4 In the illustrated embodiment, the chip structure can be coded and controlled by current output, which effectively reduces the cost of chip coding and improves the efficiency, accuracy and durability of chip coding.

[0078] Optionally, see Figure 5 , Figure 5 A detailed flow chart of step S310 is provided in an embodiment of the present application. Step S310 may include steps S311-S312.

[0079] Step S311 : determining the identity information of the chip body in the chip structure to be encoded.

[0080] Among them, the identity information may include the wafer number or location information. The wafer number may be the number of the chip body on the wafer. The wafer location may include the area number, coordinates and other unique data of the chip body on the wafer to determine the unique target coding information based on the information characterizing the actual situation of the chip body on the wafer structure.

[0081] For example, when the wafer number of a chip body is 10 and the area number of the wafer position is 100, the corresponding target code information is 10100.

[0082] Step S312: determining target coding information according to a preset coding rule, identity information, and arrangement information of the color-changing devices in the coding unit.

[0083] The preset coding rule can be a correspondence between the color change of the color-changing device and the coded character, for example, 1 represents a color change of the color-changing device, and 0 represents no color change of the color-changing device. Because the number of color-changing devices, connection method and other arrangement information are different, the preset coding rule and the arrangement information of the color-changing devices in the coding unit can be combined to determine the target coding information representing the unique identity of the chip structure.

[0084] It should be noted that, based on some color-changing materials with controllable color change, target current signals of varying magnitudes can be set to control the color-changing device to produce varying degrees of color change. This allows for different codes to be represented based on the varying degrees of color change, enabling more complex chip encoding processing. For example, if the color-changing device can produce light, medium, and dark color changes, the preset encoding rules may be: 0 represents no color change, 1 represents light color change, 2 represents medium color change, 3 represents deep color change, and so on.

[0085] exist Figure 5 In the embodiment shown, the target coding information of each chip structure to be encoded can be determined according to the actual situation of the chip structure, which effectively improves the target coding information and rationality, and can reversely analyze the actual situation of the chip structure on the wafer from the target coding information, which facilitates subsequent fault detection and other processing.

[0086] Optionally, see Figure 6 , Figure 6This is a detailed flowchart of step S320 in an embodiment of the present application. In the case where the color-changing devices of the encoding unit are discretely connected, the encoding control terminal may have multiple current source output ports, each connected to the current input port of each discretely connected color-changing device in the encoding unit. Step S320 may include steps S321-S322.

[0087] Step S321 : determining the sub-current signal of each color-changing device in the encoding unit according to the target encoding information.

[0088] Among them, the color change of each color-changing device can be determined first according to the target coding information, thereby determining multiple corresponding sub-current signals. For example, the code of the first color-changing device in the target coding information is 1, that is, it changes color, then the corresponding sub-current signal is to output a large current signal that can change the color of the color-changing device; the code of the second color-changing device is 0, that is, it does not change color, then the corresponding sub-current signal is not to output a large current signal, etc.

[0089] Step S322 : determining target current signals output by the multiple current source output ports according to the multiple sub-current signals and arrangement information of the multiple current source output ports.

[0090] Since the encoding unit has multiple current source input ports and the encoding control terminal has multiple current source output ports, to ensure correspondence between the current source input ports and the current source output ports, the overall target current signal output by the multiple current source output ports can be determined based on the multiple sub-current signals and the arrangement information of the multiple current source output ports. For example, the first current source input port can be associated and connected to the first current source output port to control multiple different color-changing devices in a one-to-one manner.

[0091] Optionally, the multiple current source output ports in the encoding control terminal can be configured as corresponding probe needle row structures to transmit current.

[0092] It should be noted that a single current output port may also be provided, and multiple color-changing devices may be individually controlled in sequence by being connected to multiple current source input ports respectively.

[0093] exist Figure 6 In the illustrated embodiment, current control can be performed separately for a plurality of discretely connected color-changing devices in the encoding unit, thereby effectively improving the effectiveness and accuracy of chip encoding.

[0094] Optionally, see Figure 7 , Figure 7This is another detailed flowchart of step S320 provided in an embodiment of the present application. In this embodiment, when the color-changing devices of the encoding unit are connected together, the encoding control terminal can have a single current source output port that is connected to a single current input port in the encoding unit to achieve unified control of multiple color-changing devices. Step S320 can include steps S323-S324.

[0095] Step S323 : determining a switching signal of each color-changing device according to the target coding information and the connection relationship between the multiple color-changing devices in the coding unit.

[0096] Among them, when multiple color-changing devices are connected together, since the connection relationship of the multiple color-changing devices will affect the reception of the current signal, the color change of each color-changing device can be determined based on the target coding information, and the switching signal of the switching device corresponding to each color-changing device can be determined in combination with the connection relationship of the multiple color-changing devices.

[0097] Optionally, taking 5 color-changing devices connected in parallel as an example, if the corresponding target coding information is 10100, the switching signals of the switching devices corresponding to the 5 color-changing devices are on, off, on, off, and off respectively.

[0098] Step S324 , determining a target current signal outputted by the current source output port according to the plurality of switch signals.

[0099] Among them, the direction of the current can be determined according to multiple switching signals, so as to calculate the current value of the required target current signal, and determine the target current signal output by the current source output port for unified control of multiple color-changing devices to provide sufficient current to enable the corresponding color-changing devices to change color.

[0100] Optionally, for complex coding scenarios with a large number of color-changing devices, multiple current output ports can be set up and connected to some of the color-changing devices respectively to reduce the current output pressure of a single current output port and improve the efficiency and accuracy of coding control.

[0101] exist Figure 7 In the illustrated embodiment, unified current control can be performed on multiple jointly connected color-changing devices in the encoding unit, effectively streamlining the number of current output ports and improving chip encoding efficiency.

[0102] See also Figure 8 , Figure 8 A schematic flow chart of a chip processing method provided in an embodiment of the present application, the method may include steps S410-S440.

[0103] Step S410: Acquire a detection image of the target encoding chip.

[0104] Among them, the target encoding chip is Figure 4-Figure 7 If it is necessary to perform fault detection or source tracing on the encoded target encoding chip, a detection image of the target encoding chip may be obtained first. For example, the detection image of the target encoding chip may be acquired by an image sensor such as a camera.

[0105] Step S420 , performing image recognition on the region of the coding unit of the target coding chip in the detection image, and determining the color change condition of each color-changing device in the coding unit.

[0106] The color change condition of each color-changing device in the coding unit can be obtained by performing image recognition on the area of ​​the coding unit in the detection image.

[0107] Optionally, when performing image recognition, the target area where the coding unit is located in the detection image can be determined by area positioning, so as to identify the corresponding areas of multiple color-changing devices from the image of the target area, and then perform pixel recognition and other processing on the corresponding areas of each color-changing device to determine the color change of each color-changing device.

[0108] For example, a corresponding pixel value threshold can be set according to the degree of color change of the color-changing device. When the pixel value of the corresponding area of ​​the color-changing device is greater than or equal to the pixel value threshold, it is determined that it has changed color. When the pixel value of the corresponding area of ​​the color-changing device is less than the pixel value threshold, it is determined that it has not changed color.

[0109] Optionally, the image of the target area may be processed with corresponding grayscale values, noise removal, etc. to improve the recognition accuracy of the color change.

[0110] Step S430: Analyze based on the color change situation and the preset coding rules to determine the target coding information.

[0111] Step S440: perform fault processing based on the target coding information.

[0112] Among them, the color change situation and the preset coding rules can be combined to analyze the target coding information corresponding to the target coding chip, so as to perform corresponding data positioning and other fault processing according to the target coding information.

[0113] exist Figure 8 In the embodiment shown, when a fault occurs, the corresponding target coding information can be determined through image recognition and rule parsing, so that subsequent fault processing can be performed according to the target coding information, effectively improving the efficiency and accuracy of chip code recognition and acquisition, as well as the efficiency of fault processing based on chip coding.

[0114] An embodiment of the present application also provides a computer program product, which includes a computer program / instruction. When the computer program / instruction is executed by a processor, the steps of any one of the above-mentioned chip encoding methods or chip processing methods are implemented.

[0115] In the several embodiments provided in this application, it should be understood that the disclosed structure can also be implemented in other ways. The structural embodiments described above are merely schematic. For example, the block diagrams in the accompanying drawings show the possible architecture, functions and operations of the devices according to the multiple embodiments of the present application. In this regard, each box in the block diagram can represent a module, a program segment or a part of a code, and the module, program segment or a part of the code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in an order different from that marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram, and the combination of the block diagrams, can be implemented with a dedicated hardware-based system that performs the specified function or action, or can be implemented with a combination of dedicated hardware and computer instructions.

[0116] In addition, the functional modules in each embodiment of the present application can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.

[0117] If the functions are implemented in the form of software function modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0118] The foregoing is merely an embodiment of the present application and is not intended to limit the scope of protection of the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included within the scope of protection of the present application. It should be noted that similar reference numerals and letters represent similar items in the following figures. Therefore, once an item is defined in one figure, it does not need to be further defined or explained in subsequent figures.

[0119] The above is only a specific implementation method of the present application, but the scope of protection of the present application is not limited thereto. Any technician familiar with this technical field can easily think of changes or replacements within the technical scope disclosed in this application, which should be covered by the scope of protection of the present application.

[0120] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, the elements defined by the phrase "comprising..." do not exclude the presence of other identical elements in the process, method, article, or device comprising the elements.

Claims

1. A chip structure, characterized in that: The chip structure includes: a chip body and a coding unit; wherein the chip body is an optical chip, and the coding unit is arranged on the chip body; The encoding unit is provided with a color-changing device that changes color based on the applied current; The encoding unit is used to present the target encoding information of the chip structure based on the color change conditions of the plurality of color change devices; wherein the color change conditions include: color change and no color change; Wherein, the color-changing device includes a color-changing metal or a color-changing polycrystalline material based on current modulation.

2. The chip structure according to claim 1, characterized in that: in, The plurality of color-changing devices are connected separately, and each of the color-changing devices is provided with a corresponding current input port.

3. The chip structure according to claim 1, wherein: in, A plurality of the color-changing devices are connected in combination, and a single current input port is provided in the encoding unit; Each of the color-changing devices is connected to a corresponding switching device, and the current input port is connected to multiple switching devices.

4. A chip encoding method, characterized in that: The method comprises: Determining target encoding information of a chip structure to be encoded; wherein the chip structure is the chip structure according to any one of claims 1 to 3; Determining a target current signal output by the encoding control terminal based on the target encoding information; The target current signal is outputted to the encoding unit provided on the connected chip structure through the encoding control terminal, thereby obtaining a target encoding chip having the target encoding information.

5. The method according to claim 4, characterized in that The determining target coding information of the chip structure to be encoded includes: Determining the identity information of the chip body in the chip structure to be encoded; wherein the identity information includes a wafer number or location information; The target coding information is determined according to a preset coding rule, the identity information and the arrangement information of the color-changing devices in the coding unit.

6. The method according to claim 4, characterized in that If the encoding control terminal has a plurality of current source output ports, determining the target current signal output by the encoding control terminal based on the target encoding information includes: determining a sub-current signal of each color-changing device in the encoding unit according to the target encoding information; The target current signals output by the multiple current source output ports are determined according to the multiple sub-current signals and arrangement information of the multiple current source output ports.

7. The method according to claim 4, characterized in that If the encoding control terminal has a single current source output port, determining the target current signal output by the encoding control terminal based on the target encoding information includes: determining a switching signal of each color-changing device according to the target coding information and a connection relationship between the plurality of color-changing devices in the coding unit; The target current signal outputted by the current source output port is determined according to the plurality of switching signals.

8. A chip processing method, characterized in that: The method comprises: Acquire a detection image of the target encoding chip according to any one of claims 4 to 7; Performing image recognition on a region of a coding unit of the target coding chip in the detection image to determine a color change condition of each color-changing device in the coding unit; Analyze the color change and preset coding rules to determine the target coding information; Fault processing is performed based on the target coding information.

9. A computer program product, characterized in that The computer program product comprises a computer program / instructions, which, when executed by a processor, implement the steps of the method according to any one of claims 4 to 8.

Images