Display panel and electronic equipment

Abstract

The invention relates to a display panel and electronic equipment. The display panel comprises a color filter layer, a black matrix and an optical modulation layer. The black matrix and the color filter layer are arranged on the same layer, and the black matrix is provided with via holes. The projection of the optical modulation layer on the black matrix at least covers the via hole, and the optical modulation layer can reduce the reflectivity difference between the area, corresponding to the via hole, of the black matrix and other areas. According to the display panel, the reflectivity difference between the via hole area and other areas can be reduced, so that the reflection hue difference between the via hole area and other areas is reduced, and the appearance visual effect of the display panel is improved.

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and in particular to a display panel and an electronic device. Background Art

[0002] In order to avoid the problem of excessive power consumption of OLED display panels due to low transmittance of polarizers, some OLED display panels are made using COE (Color Filter On Encaplation) technology in related technologies. The black matrix is ​​used to block light, and the color filter film can effectively improve the transmittance while replacing the function of the polarizer, thereby reducing the power consumption of the OLED display panel. However, in related technologies, OLED display panels using COE technology may have the problem of poor visual effects. Summary of the invention

[0003] Embodiments of the present application provide a display panel and an electronic device to enhance the visual effect of the display panel.

[0004] A display panel, comprising:

[0005] Color filter layer;

[0006] A black matrix is ​​disposed on the same layer as the color filter layer, and the black matrix is ​​provided with via holes; and

[0007] An optical modulation layer, wherein a projection of the optical modulation layer on the black matrix at least covers the via hole, and the optical modulation layer can reduce the difference in reflectivity between the area of ​​the black matrix corresponding to the via hole and the remaining area.

[0008] The above-mentioned display panel is provided with an optical modulation layer to reduce the reflectivity difference between the area corresponding to the via hole of the black matrix and the remaining areas, thereby avoiding the problem that the reflectivity of the via hole area of ​​the display panel made using COE technology is much higher than that of other areas. It is beneficial to reduce the difference in reflective hue between the via hole area and other areas, and further helps to improve the appearance visual effect of the display panel.

[0009] An electronic device comprises the display panel as described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0011] Figure 1 FIG. 4 is a schematic cross-sectional view of a display panel in some embodiments.

[0012] Figure 2 FIG. 4 is a cross-sectional schematic diagram of an optical modulation layer disposed in an array layer in some embodiments.

[0013] Figure 3 It is a schematic diagram of the structure of the display panel in some embodiments.

[0014] Figure 4 The reflectivity curve diagram of the display panel after the optical modulation layer is set in some embodiments.

[0015] Figure 5 Schematic diagram of the structure of electronic equipment in some embodiments.

[0016] Reference numerals:

[0017] 10. Display panel; 11. Cover layer; 12. Optical adhesive layer; 13. Touch layer; 14. Color filter layer; 15. Black matrix; 151. Via hole; 16. Encapsulation layer; CVD1. First inorganic layer; IJP. Organic layer; CVD2. Second inorganic layer; PDL. Pixel definition layer; 171. Cathode; 172. Organic light-emitting layer; 173. Anode; 18. Array layer; PLN. Planarization layer; ILD. Interlayer insulation layer; ILD1. First insulation layer; ILD2. Second insulation layer; CI. Capacitor insulation layer; GI. Gate insulation layer; B1. First buffer layer; B2. Second buffer layer; 19. Substrate; 191. Fingerprint recognition module; 192. Optical modulation layer; 1921. Sub-modulation layer; M1. Gate metal layer; M2. Capacitor metal layer; M3. Source and drain metal layer; S. Source region; D. Drain region; P. Channel region; 20. Electronic device. DETAILED DESCRIPTION

[0018] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0019] As used herein, "electronic device" refers to a device that can receive and / or send communication signals, including but not limited to a device that is connected via any one or more of the following connection methods:

[0020] (1) Connection via wired lines, such as Public Switched Telephone Networks (PSTN), Digital Subscriber Line (DSL), digital cable, and direct cable connection;

[0021] (2) Via wireless interfaces, such as cellular networks, wireless local area networks (WLAN), digital television networks such as DVB-H networks, satellite networks, and AM-FM broadcast transmitters.

[0022] An electronic device configured to communicate via a wireless interface may be referred to as a "mobile terminal". Examples of mobile terminals include, but are not limited to, the following electronic devices:

[0023] (1) Satellite phone or cellular phone;

[0024] (2) Personal Communications System (PCS) terminals that can combine cellular radio telephones with data processing, fax, and data communications capabilities;

[0025] (3) Radiotelephone, pager, Internet / intranet access, Web browser, notepad, calendar, Personal Digital Assistant (PDA) equipped with a Global Positioning System (GPS) receiver;

[0026] (4) conventional laptop and / or palmtop receivers;

[0027] (5) Conventional laptop and / or palmtop radio telephone transceivers, etc.

[0028] See also Figure 1 and Figure 2 , Figure 1 is a cross-sectional schematic diagram of a display panel 10 in some embodiments, Figure 2Schematic diagram of the structure of the display panel 10 in some embodiments. The display panel 10 provided in the present application can be used in electronic devices 20 such as smart phones, tablet computers, and e-readers, and the display panel 10 can be an OLED display panel. In some embodiments, the display panel 10 can be made using COE technology. In other words, the display panel 10 uses a color filter layer 14 and a black matrix 15 arranged in the same layer to replace the polarizer in the traditional display panel. The transmittance of the combination of the color filter layer 14 and the black matrix 15 is much higher than that of the polarizer, so that the display panel 10 can obtain sufficient display brightness with lower power consumption, which is beneficial to reduce the power consumption of the display panel 10, increase the service life of the display panel 10, and improve the heating condition of the display panel 10.

[0029] In some embodiments, the black matrix 15 of the display panel 10 is further provided with a via hole 151, and the display panel 10 may further include a fingerprint recognition module 191 opposite to the via hole 151, and the display panel 10 receives light through the via hole 151 for identification by the fingerprint recognition module 191. Of course, the display panel 10 may also be provided with a camera module opposite to the via hole 151, and the display panel 10 receives light through the via hole 151 for the camera module to take pictures. In some embodiments, the black matrix 15 may also be provided with a plurality of via holes 151, and the display panel 10 may include a fingerprint recognition module 191 and a camera module at the same time, and the fingerprint recognition module 191 and the camera module are respectively opposite to different via holes 151.

[0030] It is understandable that ambient light may enter the display panel 10 through the via 151. The combination of the color filter layer 14 and the black matrix 15 has a lower absorption effect on ambient light and / or reflected light of ambient light in the via 151 area than the polarizer. In other words, the reflection effect of the via 151 area on ambient light is higher than the reflection effect of other areas of the black matrix 15 on ambient light, resulting in a difference in reflection hue between the via 151 area and other areas of the black matrix 15, which in turn leads to a decrease in the appearance of the display panel 10. To solve this problem, in some embodiments, the display module further includes an optical modulation layer 192, the projection of the optical modulation layer 192 on the black matrix 15 at least covers the area where the via 151 is located, and the optical modulation layer 192 is configured to reduce the difference in reflectivity between the area of ​​the black matrix 15 corresponding to the via 151 and other areas.

[0031] The above-mentioned display panel 10 is provided with an optical modulation layer 192 to reduce the difference in reflectivity between the area of ​​the black matrix 15 corresponding to the via 151 and the remaining areas, thereby avoiding the problem that the reflectivity of the via 151 area of ​​the display panel 10 manufactured using the COE technology is much higher than that of other areas, which is beneficial to reducing the difference in reflective hue between the via 151 area and other areas, and further beneficial to improving the appearance visual effect of the display panel 10.

[0032] It should be noted that the specific location of the optical modulation layer 192 in the display panel 10 is not limited, as long as the difference in reflectivity between the via hole 151 area and other areas can be reduced. For example, in some embodiments, the display panel 10 further includes an encapsulation layer 16, a pixel definition layer PDL, an array layer 18 and a substrate 19 sequentially arranged on one side of the color filter layer 14, and the optical modulation layer 192 is arranged between any two adjacent layer structures of the color filter layer 14, the encapsulation layer 16, the pixel definition layer PDL, the array layer 18 and the substrate 19, or is arranged in the layer structure of the encapsulation layer 16 and / or the array layer 18. Of course, the optical modulation layer 192 can be arranged only in the area corresponding to the via hole 151, which is conducive to saving the material of the optical modulation layer 192, and the projection of the optical modulation layer 192 can also cover the color filter layer 14 and the black matrix 15, that is, the optical modulation layer 192 can be substantially the same size as other layer structures in the display panel 10 and can be stacked in sequence, which is conducive to simplifying the setting process of the optical modulation layer 192.

[0033] It can be understood that when the optical modulation layer 192 is disposed in the layer structure of the packaging layer 16 and / or the array layer 18, the packaging layer 16 and / or the array layer 18 may include a multi-layer structure, and the optical modulation layer 192 may be disposed between any two layers of the packaging layer 16 and / or the array layer 18. Figure 1 and Figure 2 As shown, in some embodiments, the array layer 18 includes an interlayer insulating layer ILD, a capacitor insulating layer CI, and a gate insulating layer GI, which are sequentially arranged in the direction from the color filter layer 14 to the substrate 19. The optical modulation layer 192 may be arranged between the interlayer insulating layer ILD and the capacitor insulating layer CI, or between the capacitor insulating layer CI and the gate insulating layer GI. Of course, the optical modulation layer 192 may also be arranged between the interlayer insulating layer ILD and the capacitor insulating layer CI, and between the capacitor insulating layer CI and the gate insulating layer GI.

[0034] In some embodiments, the refractive index of the optical modulation layer 192 is between the refractive indexes of two layer structures disposed on both sides of the optical modulation layer 192 and adjacent to the optical modulation layer 192, for example, Figure 2 As shown, when the optical modulation layer 192 is disposed between the interlayer insulating layer ILD and the capacitor insulating layer CI, the interlayer insulating layer ILD and the capacitor insulating layer CI can be regarded as two layer structures adjacent to the optical modulation layer 192, and the refractive index of the optical modulation layer 192 is between the interlayer insulating layer ILD and the capacitor insulating layer CI.

[0035] It is understandable that when light is incident on the interface of two adjacent layer structures in the display panel 10, transmission and reflection will occur simultaneously at the interface of the two layer structures to form refracted light and reflected light, and the incident light energy of the interface is equal to the sum of the reflected light energy and the transmitted light energy. The reflectivity of the incident light at the interface depends on the refractive index difference between the two adjacent layer structures. The greater the refractive index difference between the two layer structures, the higher the reflectivity of the incident light at the interface. When ambient light is reflected between two adjacent layer structures in the display panel 10, at least part of the reflected light corresponding to the area where the black matrix 15 is located is absorbed by the black matrix 15, while the reflected light corresponding to the via 151 area is not absorbed by the black matrix 15 and emitted, resulting in an increase in the reflectivity difference between the via 151 area and other areas of the display panel 10. Based on this, an optical modulation layer 192 is added between any two adjacent layer structures of the display panel 10, and the refractive index of the optical modulation layer 192 is set between the refractive indices of the two layer structures adjacent to the optical modulation layer 192. Since the refractive index difference between the optical modulation layer 192 and the two adjacent layer structures is smaller than the refractive index difference between the two adjacent layer structures of the optical modulation layer 192, it is beneficial to reduce the reflectivity of light at the interface between the optical modulation layer 192 and the two adjacent layer structures, thereby achieving the effect of reducing the overall reflectivity of the via 151 area to ambient light.

[0036] For example, in Figure 2 In the illustrated embodiment, the optical modulation layer 192 is disposed between the interlayer insulating layer ILD and the capacitor insulating layer CI, and the refractive index of the optical modulation layer 192 is between that of the interlayer insulating layer ILD and the capacitor insulating layer CI. The refractive index difference between the interlayer insulating layer ILD and the optical modulation layer 192 and the refractive index difference between the optical modulation layer 192 and the capacitor insulating layer CI are both smaller than the reflectivity difference between the interlayer insulating layer ILD and the capacitor insulating layer CI. Therefore, adding the optical modulation layer 192 between the interlayer insulating layer ILD and the capacitor insulating layer CI can reduce the reflectivity of the ambient light in the area corresponding to the via 151 on the array layer 18, thereby reducing the reflectivity difference between the via 151 area and other areas. It can be understood that the refractive index difference between the interlayer insulating layer ILD, the capacitor insulating layer CI and the gate insulating layer GI in the display panel 10 is usually large. Therefore, the optical modulation layer 192 is arranged between any two or three of the interlayer insulating layer ILD, the capacitor insulating layer CI and the gate insulating layer GI of the display panel 10. It can minimize the difference in reflectivity between the via 151 area and other areas to the light incident on the via 151.

[0037] The optical modulation layer 192 disposed between two adjacent layer structures may be a layered structure, and the optical modulation layer 192 may also include a plurality of sub-modulation layers 1921 stacked in sequence, wherein the refractive indexes of the plurality of sub-modulation layers 1921 are different, and the refractive indexes of the plurality of sub-modulation layers 1921 are all between the two layer structures adjacent to the optical modulation layer 192. Figure 2 In the embodiment shown, in the direction from the interlayer insulating layer ILD to the capacitor insulating layer CI, the optical modulation layer 192 includes two sub-modulation layers 1921 stacked in sequence. Further, in some embodiments, the refractive indexes of the two layer structures adjacent to the optical modulation layer 192 and at least the two sub-modulation layers 1921 are in a gradual relationship, for example, Figure 2 As shown, the refractive indexes of the interlayer insulating layer ILD, the two sub-modulation layers 1921, and the capacitor insulating layer CI are gradually changed, and gradually increase or decrease. For example, the refractive index of the interlayer insulating layer ILD is greater than the refractive index of the sub-modulation layer 1921 close to the interlayer insulating layer ILD, greater than the refractive index of the sub-modulation layer 1921 far from the interlayer insulating layer ILD, and greater than the refractive index of the capacitor insulating layer CI. By providing multiple layers of sub-modulation layers 1921, the difference in refractive index between the two layer structures adjacent to the optical modulation layer 192 and the two adjacent layer structures in the multiple sub-modulation layers 1921 is further reduced, which is beneficial to further reduce the reflectivity of the light of the via hole 151 in the area corresponding to the via hole 151 of the display panel 10.

[0038] In some embodiments, the material of an optical modulation layer 192 or multiple sub-modulation layers 1921 disposed between the interlayer insulating layer ILD and the capacitor insulating layer CI includes silicon oxynitride (SiON or SiOxNx). Silicon oxynitride has a moderate refractive index and is an insulating material. It can reduce the refractive index difference between the via 151 area and other areas to ambient light, and will not affect the performance of the display panel 10.

[0039] Further, in some embodiments, the optical modulation layer 192 satisfies the conditional formula: nc2 = n1*n2; Tc*nc = (2m+1)*λ / 4; wherein nc is the refractive index of the optical modulation layer 192, n1 and n2 are respectively the refractive indexes of the two layer structures adjacent to the optical modulation layer 192, Tc is the thickness of the optical modulation layer 192, λ is the wavelength of the incident light of the via hole 151, and m is an integer, for example, 1, 2 or 3, which can be specifically designed according to the thickness of the optical modulation layer 192 and the preparation process. Among them, λ can be set according to the incident light targeted by the via hole 151. For example, when the via hole 151 is opposite to the fingerprint recognition module 191, λ can be the wavelength of the infrared light sensed by the fingerprint recognition module 191, and when the via hole 151 is opposite to the camera module for shooting visible light, λ can also be the wavelength of the visible light of the ambient light. When the above two conditional expressions are met, the refractive index and thickness of the optical modulation layer 192 can be reasonably designed according to the refractive index of the two adjacent layer structures and the wavelength of the incident light, so that the optical path difference of the incident light reflected on the two opposite surfaces of the optical modulation layer 192 can offset each other, thereby effectively reducing the reflectivity of the reflected light. It can be understood that when the optical modulation layer 192 includes multiple sub-modulation layers 1921, the multiple sub-modulation layers 1921 can all meet the above two conditional expressions to obtain a good anti-reflection effect.

[0040] refer to Figure 1 As shown, in some embodiments, the optical modulation layer 192 may also be arranged in the layer structure of the interlayer insulating layer ILD. For example, in the direction in which the pixel definition layer PDL points to the substrate 19, the interlayer insulating layer ILD may include a first insulating layer ILD1 and a second insulating layer ILD2 in sequence. The optical modulation layer 192 may be arranged between the first insulating layer ILD1 and the second insulating layer ILD2, which is beneficial to reduce the reflection effect of the interlayer insulating layer ILD on ambient light.

[0041] In some embodiments, when the optical modulation layer 192 is arranged in the layer structure of the encapsulation layer 16, in the direction in which the pixel definition layer PDL points to the color filter layer 14, the encapsulation layer 16 sequentially includes a first inorganic layer CVD1, an organic layer IJP and a second inorganic layer CVD2, and the optical modulation layer 192 is arranged between the first inorganic layer CVD1 and the organic layer IJP, or between the organic layer IJP and the second inorganic layer CVD2. Of course, the optical modulation layer 192 may also be provided between the first inorganic layer CVD1 and the organic layer IJP and between the organic layer IJP and the second inorganic layer CVD2.

[0042] In some embodiments, when the optical modulation layer 192 is disposed between the color filter layer 14 and the encapsulation layer 16, the display panel 10 may also include a touch layer 13 disposed between the color filter layer 14 and the encapsulation layer 16. The touch layer 13 may include a touch electrode for sensing a user's touch action. The optical modulation layer 192 is disposed between the touch layer 13 and the encapsulation layer 16, for example, between the touch layer 13 and the second inorganic layer CVD2.

[0043] In some embodiments, when the optical modulation layer 192 is disposed between the array layer 18 and the substrate 19, the optical modulation layer 192 may also be disposed in a multi-layer structure between the array layer 18 and the substrate 19. For example, in some embodiments, the display panel 10 may also include a first buffer layer B1 and a second buffer layer B2 disposed between the array layer 18 and the substrate 19, the first buffer layer B1 being disposed on a side of the second buffer layer B2 facing away from the array layer 18, and the optical modulation layer 192 being disposed between the first buffer layer B1 and the second buffer layer B2. Further, in some embodiments, the material of the first buffer layer B1 may include silicon nitride (SiNx), the material of the second buffer layer B2 may include silicon oxide (SiOx), and the material of the optical modulation layer 192 may include silicon oxynitride (SiOxNx). In this way, the material of the optical modulation layer 192 can adapt to the material of the first buffer layer B1 and the second buffer layer B2, so that the refractive index of the optical modulation layer 192 is between the first buffer layer B1 and the second buffer layer B2, so as to reduce the difference in reflectivity of the via 151 area and other areas to the ambient light. At the same time, the optical modulation layer 192 can also cooperate with the first buffer layer B1 and the second buffer layer B2 to play a buffering role, thereby improving the performance of the display panel 10. Of course, when the optical modulation layer 192 is disposed between the first buffer layer B1 and the second buffer layer B2, the optical modulation layer 192 can be a layered structure, or it can include a multi-layer sub-modulation layer 1921 with a gradient refractive index, and a single optical modulation layer 192 or multiple sub-modulation layers 1921 can satisfy the above-mentioned conditional formula: nc2 = n1*n2; and Tc*nc = (2m+1)*λ / 4; to improve the anti-reflection effect on the ambient light. When the optical modulation layer 192 includes multiple layers of sub-modulation layers 1921, the material of the multiple layers of sub-modulation layers 1921 can include silicon oxynitride (SiOxNx), as long as the refractive index of the multiple layers of sub-modulation layers 1921 can be gradually changed to achieve a good anti-reflection effect.

[0044] It should be noted that, in the above embodiments, the description that the optical modulation layer 192 is arranged between two layer structures of the display panel 10 cannot be understood as a limitation on the number and position of the optical modulation layer 192. In fact, the optical modulation layer 192 may be arranged between any one or more of the touch layer 13 and the second inorganic layer CVD2, between the second inorganic layer CVD2 and the organic layer IJP, between the organic layer IJP and the first inorganic layer CVD1, between the second insulating layer ILD2 and the first insulating layer ILD1, between the first insulating layer ILD1 and the capacitor insulating layer CI, between the capacitor insulating layer CI and the gate insulating layer GI, between the gate insulating layer GI and the second buffer layer B2, and between the second buffer layer B2 and the first buffer layer B1. The optical modulation layer 192 may also be arranged between all the layer structures mentioned above. The specific number and setting positions of the optical modulation layer 192 can be designed according to the requirements of the display panel 10. For example, when it is necessary to minimize the difference in reflectivity of the via 151 area and other areas to ambient light, an optical modulation layer 192 can be provided between all the above-mentioned layer structures. When it is necessary to reduce the size of the display panel 10, the optical modulation layer 192 is provided only between some of the layer structures mentioned above, or the optical modulation layer 192 can be provided only between the first insulating layer ILD1 and the capacitor insulating layer CI, and / or between the capacitor insulating layer CI and the gate insulating layer GI. This is beneficial for reducing the size of the display panel 10, and can also effectively reduce the difference in reflectivity of the via 151 area and other areas to ambient light, thereby improving the appearance and visual effect of the display panel 10. Of course, the optical modulation layer 192 between any two layer structures can be a layer-by-layer structure, and can also include multiple layers of sub-modulation layers 1921. When multiple layers of optical modulation layers 192 are provided at different positions of the display panel 10, some of the optical modulation layers 192 can be a layer-by-layer structure, and other parts of the optical modulation layer 192 can include multiple layers of sub-modulation layers 1921.

[0045] In some embodiments, in the direction from the color filter layer 14 to the array layer 18, the pixel definition layer PDL includes a cathode 171, an organic light emitting layer 172, and an anode 173 arranged in sequence, the cathode 171 may be a surface electrode, the projection of the cathode 171 may cover at least a portion of the black matrix 15, and the thickness of the portion of the cathode 171 corresponding to the via hole 151 is less than the thickness of the other portions of the cathode 171. Such an arrangement is conducive to reducing the reflectivity of the portion of the cathode 171 corresponding to the via hole 151 to the incident light of the via hole 151, thereby also helping to reduce the difference in reflectivity of the via hole 151 region and other regions to the incident light of the via hole 151, thereby further improving the appearance visual effect of the display panel 10. In some embodiments, in the preparation process of the cathode 171 of the display panel 10, the via hole 151 region may be shielded by using a CMM (Common Metal Mask) through multiple evaporation processes, so that the thickness of the cathode 171 in the via hole 151 region is less than the thickness of other portions. In some embodiments, the preparation process of each layer structure of the array layer 18 can be removed by photolithography using a yellow light mask. Of course, during the preparation process of the cathode 171, a high-precision metal mask (Fine Metal Mask, FFM) can also be used to block the via 151 area, or laser processing can be used.

[0046] Please see again Figure 1 The display panel 10 may further include an optical adhesive layer 12 and a cover layer 11 stacked in sequence on the side of the touch layer 13 facing away from the color filter layer 14. The color filter layer 14 and the black matrix 15 may be covered by a protective layer. The array layer 18 may further include a gate metal layer M1, a capacitor metal layer M2, a source and drain metal layer M3, a source region S, a drain region D, and a channel region P. The materials and the arrangement positions of the above structures are not limited, as long as the display panel 10 can perform display operations normally, and they will not be elaborated in this application.

[0047] In some embodiments, the array layer 18 may further include a planarization layer PLN disposed on the side of the interlayer insulating layer ILD facing away from the capacitor insulating layer CI. The encapsulation layer 16 may be manufactured using a thin film encapsulation (TFE) process. The materials of the anode 173 and the cathode 171 include but are not limited to transparent conductive oxide materials such as indium tin oxide (ITO), indium zinc oxide (IZO), tin dioxide (SnO2), and zinc oxide (ZnO). The substrate 19 may be made of glass. The specific configuration of each layer structure may be designed according to the requirements of the display panel 10, and will not be elaborated in this application.

[0048] Combination Figure 1 and Figure 4 As shown, Figure 4The figure shows the difference in reflectivity of light between the display panel 10 provided with the optical modulation layer 192 of the present application and the traditional display panel without the optical modulation layer, wherein the horizontal axis is the wavelength in nm and the vertical axis is the reflectivity. Figure 4 It can be seen that the display panel 10 provided with an optical modulation layer 192 provided in the present application has a lower reflectivity to light of various wavelengths than the traditional display panel 10, which is beneficial to improving the display performance of the display panel 10. At the same time, the difference in reflectivity to light between the via 151 area and other areas is reduced, which is beneficial to improving the appearance and visual effect of the display panel 10.

[0049] Combination Figure 1 and Figure 5 The present application also provides an electronic device 20, comprising a display panel 10 as described in any of the above embodiments. The electronic device 20 includes but is not limited to a smart phone, a tablet computer, an e-reader, etc. The electronic device 20 may also include a middle frame, and the display panel 10 may be disposed in the middle frame.

[0050] refer to Figure 5 , Figure 5 A schematic diagram of the structure of an electronic device 20 provided in an embodiment of the present application. The electronic device 20 may include a radio frequency (RF) circuit 501, a memory 502 including one or more computer-readable storage media, an input unit 503, a display unit 504, a sensor 505, an audio circuit 506, a wireless fidelity (WiFi) module 507, a processor 508 including one or more processing cores, and a power supply 509. Those skilled in the art will understand that Figure 5 The structure of the electronic device 20 shown in the figure does not constitute a limitation on the electronic device 20, and may include more or less components than shown in the figure, or combine certain components, or arrange the components differently.

[0051] The radio frequency circuit 501 can be used to send and receive information, or receive and send signals during a call. In particular, after receiving the downlink information of the base station, it is handed over to one or more processors 508 for processing; in addition, the data related to the uplink is sent to the base station. Usually, the radio frequency circuit 501 includes but is not limited to an antenna, at least one amplifier, a tuner, one or more oscillators, a subscriber identity module (SIM) card, a transceiver, a coupler, a low noise amplifier (LNA), a duplexer, etc. In addition, the radio frequency circuit 501 can also communicate with the network and other devices through wireless communication. The wireless communication can use any communication standard or protocol, including but not limited to the global system for mobile communications (GSM), the general packet radio service (GPRS), the code division multiple access (CDMA), the wideband code division multiple access (WCDMA), the long term evolution (LTE), email, the short message service (SMS), etc.

[0052] The memory 502 can be used to store applications and data. The applications stored in the memory 502 include executable codes. The applications can be composed of various functional modules. The processor 508 executes various functional applications and data processing by running the applications stored in the memory 502. The memory 502 can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, an application required for at least one function (such as a sound playback function, an image playback function, etc.), etc.; the data storage area can store data created according to the use of the electronic device 20 (such as audio data, a phone book, etc.), etc. In addition, the memory 502 can include a high-speed random access memory, and can also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other volatile solid-state storage devices. Accordingly, the memory 502 can also include a memory controller to provide the processor 508 and the input unit 503 with access to the memory 502.

[0053] The input unit 503 can be used to receive input digital, character information or user feature information (such as fingerprints), and generate keyboard, mouse, joystick, optical or trackball signal input related to user settings and function control. Specifically, in a specific embodiment, the input unit 503 may include a touch-sensitive surface and other input devices. The touch-sensitive surface, also known as a touch display screen or a touch pad, can collect user touch operations on or near it (such as operations performed by users using fingers, styluses, or any other suitable objects or accessories on or near the touch-sensitive surface), and drive corresponding connection devices according to a pre-set program. Optionally, the touch-sensitive surface may include a touch detection device and a touch controller. Among them, the touch detection device detects the user's touch orientation, detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts it into touch point coordinates, and then sends it to the processor 508, and can receive and execute commands sent by the processor 508.

[0054] The display unit 504 can be used to display information input by the user or information provided to the user and various graphical user interfaces of the electronic device 20, which can be composed of graphics, text, icons, videos and any combination thereof. The display unit 504 may include a display panel. Optionally, the display panel can be configured in the form of a liquid crystal display (LCD, Liquid Crystal Display), an organic light-emitting diode (OLED, Organic Light-Emitting Diode), etc. Further, the touch-sensitive surface can cover the display panel, and when the touch-sensitive surface detects a touch operation on or near it, it is transmitted to the processor 508 to determine the type of touch event, and then the processor 508 provides a corresponding visual output on the display panel according to the type of touch event. Although in Figure 5 In the embodiment, the touch sensitive surface and the display panel are used as two independent components to implement input and output functions, but in some embodiments, the touch sensitive surface and the display panel can be integrated to implement input and output functions. It can be understood that the display screen 110 can include an input unit 503 and a display unit 504.

[0055] The electronic device 20 may also include at least one sensor 505, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor and a proximity sensor, wherein the ambient light sensor may adjust the brightness of the display panel according to the brightness of the ambient light, and the proximity sensor may turn off the display panel and / or backlight when the electronic device 20 is moved to the ear. As a type of motion sensor, the gravity acceleration sensor can detect the magnitude of acceleration in each direction (generally three axes), and can detect the magnitude and direction of gravity when stationary. It can be used for applications that identify the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tapping), etc.; as for other sensors such as gyroscopes, barometers, hygrometers, thermometers, infrared sensors, etc. that can also be configured in the electronic device 20, they will not be repeated here.

[0056] The audio circuit 506 can provide an audio interface between the user and the electronic device 20 through a speaker and a microphone. The audio circuit 506 can convert the received audio data into an electrical signal, transmit it to the speaker, and convert it into a sound signal for output; on the other hand, the microphone converts the collected sound signal into an electrical signal, which is received by the audio circuit 506 and converted into audio data, and then the audio data is output to the processor 508 for processing, and then sent to another electronic device 20 through the radio frequency circuit 501, or the audio data is output to the memory 502 for further processing. The audio circuit 506 may also include an earphone socket to provide communication between an external earphone and the electronic device 20.

[0057] Wireless Fidelity (WiFi) is a short-range wireless transmission technology. The electronic device 20 can help users send and receive emails, browse web pages, and access streaming media through the wireless fidelity module 507, which provides users with wireless broadband Internet access. Figure 5 The wireless fidelity module 507 is shown, but it is understandable that it is not a necessary component of the electronic device 20 and can be omitted as needed without changing the essence of the invention.

[0058] The processor 508 is the control center of the electronic device 20. It uses various interfaces and lines to connect various parts of the entire electronic device 20. By running or executing applications stored in the memory 502 and calling data stored in the memory 502, it executes various functions of the electronic device 20 and processes data, thereby monitoring the electronic device 20 as a whole. Optionally, the processor 508 may include one or more processing cores; preferably, the processor 508 may integrate an application processor and a modem processor, wherein the application processor mainly processes the operating system, user interface, and application programs, and the modem processor mainly processes wireless communications. It is understandable that the above-mentioned modem processor may not be integrated into the processor 508.

[0059] The electronic device 20 also includes a power supply 509 for supplying power to various components. Preferably, the power supply 509 can be logically connected to the processor 508 through a power management system, so that the power management system can manage charging, discharging, and power consumption. The power supply 509 can also include one or more DC or AC power supplies, recharging systems, power failure detection circuits, power converters or inverters, power status indicators, and other arbitrary components.

[0060] although Figure 5 Not shown, the electronic device 20 may also include a Bluetooth module, etc., which will not be described in detail here. In specific implementation, the above modules can be implemented as independent entities, or can be arbitrarily combined and implemented as the same or several entities. The specific implementation of the above modules can refer to the previous method embodiment, which will not be described in detail here.

[0061] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0062] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A display panel, characterized in that: The display panel comprises: Color filter layer; A black matrix is ​​disposed on the same layer as the color filter layer, and the black matrix is ​​provided with via holes; and An optical modulation layer, wherein a projection of the optical modulation layer on the black matrix at least covers the via hole, and the optical modulation layer can reduce the difference in reflectivity between the area of ​​the black matrix corresponding to the via hole and the remaining area.

2. The display panel according to claim 1, characterized in that: The display panel also includes an encapsulation layer, a pixel definition layer, an array layer and a substrate which are sequentially arranged on one side of the color filter layer; the optical modulation layer is arranged between any two adjacent layer structures among the color filter layer, the encapsulation layer, the pixel definition layer, the array layer and the substrate, or is arranged within the layer structure of the encapsulation layer and / or the array layer.

3. The display panel according to claim 2, characterized in that: The refractive index of the optical modulation layer is between the refractive indices of two layer structures disposed on both sides of the optical modulation layer and adjacent to the optical modulation layer.

4. The display panel according to claim 3, characterized in that: The optical modulation layer satisfies the following conditions: nc2=n1*n2; Tc*nc=(2m+1)*λ / 4; wherein nc is the refractive index of the optical modulation layer, n1 and n2 are respectively the refractive indices of the two layer structures adjacent to the optical modulation layer, Tc is the thickness of the optical modulation layer, λ is the wavelength of the incident light of the via hole, and m is an integer.

5. The display panel according to claim 2, characterized in that: The optical modulation layer includes at least two sub-modulation layers stacked in sequence, the refractive indexes of at least two of the sub-modulation layers are different, and the refractive indexes of two layer structures adjacent to the optical modulation layer and at least two of the sub-modulation layers are in a gradual relationship.

6. The display panel according to claim 2, characterized in that: The array layer comprises an interlayer insulating layer, a capacitor insulating layer and a gate insulating layer which are sequentially arranged in a direction from the color filter layer to the substrate; The optical modulation layer is arranged between the interlayer insulating layer and the capacitor insulating layer or between the capacitor insulating layer and the gate insulating layer, or an optical modulation layer is arranged between the interlayer insulating layer and the capacitor insulating layer and between the capacitor insulating layer and the gate insulating layer.

7. The display panel according to claim 6, characterized in that: In the direction from the pixel definition layer to the substrate, the interlayer insulating layer includes a first insulating layer and a second insulating layer in sequence, and the optical modulation layer is arranged between the first insulating layer and the second insulating layer.

8. The display panel according to claim 2, characterized in that: The display panel further includes a touch layer disposed between the color filter layer and the encapsulation layer, and the optical modulation layer is disposed between the touch layer and the encapsulation layer.

9. The display panel according to claim 2, characterized in that: The display panel further includes a first buffer layer and a second buffer layer disposed between the array layer and the substrate, the first buffer layer being disposed on a side of the second buffer layer facing away from the array layer, and the optical modulation layer being disposed between the first buffer layer and the second buffer layer.

10. The display panel according to claim 9, characterized in that: The first buffer layer includes silicon nitride, the second buffer layer includes silicon oxide, and the optical modulation layer includes silicon oxynitride.

11. The display panel according to claim 2, characterized in that: In the direction from the pixel definition layer to the color filter layer, the encapsulation layer includes a first inorganic layer, an organic layer and a second inorganic layer in sequence, and the optical modulation layer is arranged between the first inorganic layer and the organic layer or between the organic layer and the second inorganic layer, or the optical modulation layer is arranged between the first inorganic layer and the organic layer and between the organic layer and the second inorganic layer.

12. The display panel according to claim 2, characterized in that: In the direction from the color filter layer to the array layer, the pixel definition layer includes a cathode, an organic light-emitting layer and an anode arranged in sequence, and the thickness of the cathode portion corresponding to the via hole is smaller than the thickness of other portions.

13. The display panel according to claim 1, characterized in that: The projection of the optical modulation layer covers the color filter layer and the black matrix.

14. The display panel according to claim 1, characterized in that: The display panel further includes a fingerprint recognition module, which is opposite to the via hole, and / or the display panel further includes a camera module, which is opposite to the via hole.

15. An electronic device, characterized in that: Comprising a display panel as described in any one of claims 1-14.

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