Piezoelectric composite, method of manufacture and ultrasonic transducer

Abstract

The present application relates to the field of piezoelectric composite material, and provides a piezoelectric composite material, a manufacturing method and an ultrasonic transducer. The piezoelectric composite material comprises a piezoelectric material, an insulating material, a conductive material and a plating layer, the piezoelectric material is provided with a first cut groove, the insulating material is arranged in the first cut groove, the insulating material is further provided with a second cut groove, the conductive material is arranged in the second cut groove, the plating layer comprises a positive electrode plating layer and a negative electrode plating layer, the positive electrode plating layer and the negative electrode plating layer are respectively provided with a third cut groove and a fourth cut groove, so that adjacent positive electrode plating layers and negative electrode plating layers are adapted to be connected in series or connected in parallel through or without the conductive material. The manufacturing method is used for preparing the piezoelectric composite material. The ultrasonic transducer comprises the piezoelectric composite material. According to different use scenarios of the transducer, the present application simply changes the electrical conduction mode of the plating layer on the surface of the piezoelectric composite material, so as to meet the electrical impedance matching requirements of the ultrasonic system for the transducer, greatly accelerate the research and development cycle, and save the research and development cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of piezoelectric composite material, further relates to a piezoelectric composite material, a manufacturing method and an ultrasonic transducer. BACKGROUND

[0002] The ultrasonic transducer is a kind of sensor that can convert electrical signals and ultrasonic signals, and is widely used in industrial nondestructive testing, sonar and medical ultrasonic examination, and the internal core device is usually piezoelectric polycrystal or piezoelectric single crystal material with piezoelectric effect. Taking medical ultrasonic application as an example, the acoustic impedance of piezoelectric material is usually about 33 MRayl, and the acoustic impedance of human tissue is 1.5 MRayl, and the acoustic reflectivity is 0.834, which means that 83.4% of ultrasonic energy is reflected back to the piezoelectric material without entering the human body. In order to make most of the ultrasonic waves generated by the vibration of the piezoelectric material enter the human body, several layers of acoustic impedance matching layer need to be added between the piezoelectric material and the human tissue, so that the acoustic impedance difference between the piezoelectric material and the human tissue is reduced. In addition to adding acoustic impedance matching layer, reducing the acoustic impedance of piezoelectric material can also reduce the acoustic reflectivity, so using piezoelectric composite material has become the design method of many ultrasonic transducers. The conventional piezoelectric composite material is filled with epoxy resin between the piezoelectric materials to form 2-2 type, 1-3 type or even 0-3 type composite material, which effectively reduces the acoustic impedance of piezoelectric material.

[0003] However, the conventional piezoelectric composite material has a single function, and the structure of the piezoelectric materials is electrically connected in parallel. For some special application transducers, the electrical impedance of the internal array element is significantly smaller than the electrical impedance of the whole system (usually 50 ohms), which is not conducive to the electrical impedance matching of the transducer array element and the system. Even if piezoelectric composite material is used to reduce the capacitance of the transducer array element, the electrical impedance of the transducer array element is still small. If the volume ratio of piezoelectric material in the piezoelectric composite material is further reduced, the piezoelectric performance of the piezoelectric composite material will be affected. SUMMARY

[0004] In view of the above technical problems, the purpose of the present application is to provide a piezoelectric composite material, a manufacturing method and an ultrasonic transducer, which can change the electrical conduction mode of the surface plating layer of the piezoelectric composite material according to different use scenarios of the transducer, so as to meet the electrical impedance matching requirements of the ultrasonic system for the transducer, greatly speed up the research and development cycle and save research and development costs.

[0005] In order to achieve the above purpose, the present application provides a piezoelectric composite material, which comprises piezoelectric material, insulating material, conductive material and plating layer, and a plurality of first cut grooves are arranged on the piezoelectric material.

[0006] The insulating material is arranged in the first cut groove, and a second cut groove is further arranged on the insulating material.

[0007] The conductive material is arranged in the second cut groove; the plating layer includes positive and negative plating layers arranged on two sides of the piezoelectric material, and the positive and negative plating layers are respectively provided with third and fourth cut grooves, so that the adjacent positive and negative plating layers are adapted to be connected in series through the conductive material or connected in parallel without the conductive material.

[0008] In some embodiments, the third cut groove is arranged above the piezoelectric material and close to one side of the insulating material, and the fourth cut groove is adapted to be arranged below the piezoelectric material and close to the other side of the insulating material, and the third and fourth cut grooves are oppositely located on the left and right sides of the insulating material, so that the adjacent positive and negative plating layers of the piezoelectric material are connected in series through the conductive material.

[0009] In some embodiments, the third and fourth cut grooves are respectively located at the upper and lower ends of the insulating material, so that the adjacent positive and negative plating layers of the piezoelectric material are not connected through the conductive material, and the piezoelectric material is connected in parallel.

[0010] In some embodiments, the width of the third and fourth cut grooves is greater than the width of the first cut groove.

[0011] In some embodiments, the piezoelectric composite material is any one of 2-2 type, 1-3 type, and 0-3 type.

[0012] According to another aspect of the present application, a manufacturing method of a piezoelectric composite material is further provided for manufacturing any one of the piezoelectric composite materials of the preferred embodiments, and the manufacturing method comprises:

[0013] Processing a plurality of first cut grooves on the piezoelectric material, and adding insulating material in the first cut grooves;

[0014] Processing a second cut groove on the insulating material, and adding conductive material in the second cut groove;

[0015] Thinning the piezoelectric material on both sides to a specified thickness, so that the conductive material and the insulating material on both sides of the piezoelectric material are exposed;

[0016] Forming a plating layer on both sides of the piezoelectric material, and forming third and fourth cut grooves on the plating layer, so that the piezoelectric material is connected in series or in parallel.

[0017] In some embodiments, the piezoelectric material is provided with a plating layer on both sides, and third and fourth cut grooves are formed on the plating layer, so that the piezoelectric material is connected in series or in parallel, specifically comprising:

[0018] According to different use scenarios, the conduction mode of the plating layer is selected,

[0019] If the piezoelectric materials need to be connected in series, the third cut groove and the fourth cut groove are arranged on the left and right sides of the insulating material, so that the positive electrode plating layer and the negative electrode plating layer of the adjacent piezoelectric materials are connected through the conductive material.

[0020] If the piezoelectric materials need to be connected in parallel, the third cut groove and the fourth cut groove are arranged at the upper and lower ends of the insulating material respectively, so that the positive electrode plating layer and the negative electrode plating layer of the adjacent piezoelectric materials are not connected.

[0021] In some embodiments, after the piezoelectric material is plated on both sides with the plating layer, the third cut groove and the fourth cut groove are cut on the plating layer;

[0022] Or, before or while the piezoelectric material is plated on both sides with the plating layer, a mask plate is arranged on both sides of the piezoelectric material, the mask plate covers the positions of the third cut groove and the fourth cut groove, and then the piezoelectric material is plated on both sides with the plating layer.

[0023] In some embodiments, the width w of the first cut groove satisfies w < v / (4√2*f), v is the transverse wave speed of the insulating material, and f is the resonance frequency of the piezoelectric composite material.

[0024] According to another aspect of the present application, an ultrasonic transducer is further provided, which comprises the piezoelectric composite material of any one of the preferred embodiments.

[0025] Compared with the prior art, the piezoelectric composite material, the manufacturing method and the ultrasonic transducer provided by the present application have at least one of the following beneficial effects:

[0026] 1. The electrical conduction mode of the plating layer on the surface of the piezoelectric composite material can be simply changed according to different use scenarios of the transducer, so that the electrical impedance matching requirement of the ultrasonic system for the transducer can be met, the research and development period is greatly accelerated, and the research and development cost is saved.

[0027] 2. The addition of the insulating material can make the piezoelectric materials not form an electrical series structure, and can also prevent the possible electric field excitation formed by the conductive material in the second cut groove from affecting the vibration mode of each piezoelectric material.

[0028] 3. The third cut groove and the fourth cut groove are located on the left and right sides of the insulating material, the positive electrode plating layer and the negative electrode plating layer of the adjacent piezoelectric materials are connected, an electrical series structure between the piezoelectric materials in the piezoelectric composite material is realized, the capacitance of the transducer array element is significantly reduced, and the electrical impedance is improved.

[0029] 4. The third and fourth cut grooves are respectively located at the upper and lower ends of the insulating material, and the positive and negative electrode plating layers of the adjacent piezoelectric materials are not connected, so as to realize the structure of electrical parallel connection between the piezoelectric materials in the piezoelectric composite material and reduce the electrical impedance. BRIEF DESCRIPTION OF DRAWINGS

[0030] The above-mentioned features, technical characteristics, advantages and implementation modes of the present application will be further described in a clear and understandable manner in combination with the preferred embodiments and the accompanying drawings.

[0031] Figure 1 It is a whole diagram of piezoelectric composite material in series;

[0032] Figure 2 It is a whole diagram of piezoelectric composite material in parallel;

[0033] Figure 3 It is a structure diagram of the first cut groove;

[0034] Figure 4 It is an installation diagram of the insulating material;

[0035] Figure 5 It is a structure diagram of the second cut groove;

[0036] Figure 6 It is an installation diagram of the conductive material;

[0037] Figure 7 It is a structure diagram of the piezoelectric material after double-sided thinning;

[0038] Figure 8 It is a structure diagram of piezoelectric composite material in series;

[0039] Figure 9 It is a structure diagram of piezoelectric composite material in parallel;

[0040] Figure 10 It is a flow chart of the manufacturing method of piezoelectric composite material.

[0041] Explanation of the drawings:

[0042] Piezoelectric material 1, first cut groove 10, conductive material 2, insulating material 3, second cut groove 30, positive electrode plating layer 4, third cut groove 40, negative electrode plating layer 5, fourth cut groove 50. DETAILED DESCRIPTION

[0043] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the specific embodiments of the present application will be described below with reference to the drawings. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained from these drawings without creative labor, and other embodiments can also be obtained.

[0044] For simplicity and conciseness of the drawings, only the parts related to the present application are shown in the drawings, which do not represent the actual structure of the product. In addition, for simplicity and ease of understanding, in some drawings, only one of the components with the same structure or function is shown schematically, or only one of them is marked. In this document, "one" not only means "only one", but also means "more than one" in some cases.

[0045] It should be further understood that the term "and / or" used in the present application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes these combinations.

[0046] In this document, it should be noted that unless otherwise explicitly specified and limited, the terms "mount", "connect", "connect" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or internal communication of two elements. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0047] In addition, in the description of the present application, the terms "first", "second" and the like are only used to distinguish the description, and cannot be understood as indicating or implying relative importance. It should be noted that the above examples can be freely combined according to the needs. The above is only the preferred embodiment of the present application, and it should be pointed out that for ordinary skilled in the art, without departing from the principles of the present application, a number of improvements and refinements can be made, which should be considered as the protection scope of the present application.

[0048] Reference Figure 1 , Figure 2 , Figure 3 and Figure 5 The present application provides a piezoelectric composite material, comprising a piezoelectric material 1, an insulating material 3, a conductive material 2 and a plating layer, the piezoelectric material 1 is provided with a plurality of first cut grooves 10; the insulating material 3 is arranged inside the first cut groove 10, and the insulating material 3 is further provided with a second cut groove 30, and the conductive material 2 is arranged in the second cut groove 30; the plating layer comprises a positive electrode plating layer 4 and a negative electrode plating layer 5 arranged on both sides of the piezoelectric material 1, and the positive electrode plating layer 4 and the negative electrode plating layer 5 are respectively provided with a third cut groove 40 and a fourth cut groove 50, so that the adjacent positive electrode plating layer 4 and negative electrode plating layer 5 are adapted to be connected in series through the conductive material 2 or connected in parallel without the conductive material 2.

[0049] In this embodiment, the electrical conduction mode of the surface plating layer of the piezoelectric composite material can be simply changed according to different use scenarios of the transducer, so as to meet the electrical impedance matching requirements of the ultrasonic system for the transducer, greatly accelerate the research and development cycle, and save the research and development cost.

[0050] Specifically, the application uses two media of the conductive material 2 and the insulating material 3 as the non-piezoelectric phase of the piezoelectric composite material, and changes the electrical connection structure of the piezoelectric composite material according to different use scenarios: when the transducer has no special requirements for the electrical impedance of the array element, the piezoelectric composite material can be used as a general piezoelectric composite material; if the transducer needs to improve the electrical impedance of the array element, the piezoelectric composite material of the application only needs to change the connection mode of the surface plating layer, so as to realize the electrical series connection structure between the piezoelectric materials 1 in the piezoelectric composite material, significantly reduce the capacitance of the transducer array element, and improve the electrical impedance. The insulating material 3 includes but is not limited to epoxy resin material. The addition of the insulating material 3 can make the piezoelectric material 1 not form an electrical series connection structure, and also will not be affected by the possible electric field excitation formed by the conductive material 2 in the second cut groove 30, thereby affecting the vibration mode of each piezoelectric material 1. The conductive material 2 includes but is not limited to conductive silver epoxy material, and can also be a solid conductive material 2 such as graphite and metal.

[0051] It is worth noting that the side view of the piezoelectric material 1 is used in this embodiment, and only one direction of the cut groove is shown. In actual application, there can be multiple cut groove directions to form a 2-2, 1-3 or even 0-3 type piezoelectric composite material structure. That is, the piezoelectric composite material includes but is not limited to any one of 2-2, 1-3 and 0-3 types.

[0052] Further, the third cut groove 40 is arranged above the piezoelectric material 1 and close to one side of the insulating material 3, and the fourth cut groove 50 is arranged below the piezoelectric material 1 and close to the other side of the insulating material 3. The third cut groove 40 and the fourth cut groove 50 are oppositely located on the left and right sides of the insulating material 3, so that the positive plating layer 4 and the negative plating layer 5 of the adjacent piezoelectric material 1 are conducted through the conductive material 2. In the later stage, all the positive plating layers 4 and the negative plating layers 5 are connected respectively to form the series connection of the piezoelectric materials 1.

[0053] In this embodiment, the third cut groove 40 and the fourth cut groove 50 are oppositely located on the left and right sides of the insulating material 3, so that the positive plating layer 4 and the negative plating layer 5 of the adjacent piezoelectric material 1 are conducted through the conductive material 2. The electrical series connection structure between the piezoelectric materials 1 in the piezoelectric composite material is realized, the capacitance of the transducer array element is significantly reduced, and the electrical impedance is improved.

[0054] Specifically, the third cut groove 40 and the fourth cut groove 50 are located on the left and right sides of the insulating material 3. In the embodiment, the third cut groove 40 is located on the left side of the insulating material 3, and the fourth cut groove 50 is located on the right side of the insulating material 3. In a variant, the third cut groove 40 is located on the right side of the insulating material 3, and the fourth cut groove 50 is located on the left side of the insulating material 3. That is, the third cut groove 40 and the fourth cut groove 50 are located on the left and right sides of the insulating material 3. The positive electrode plating layer 4 and the negative electrode plating layer 5 of the adjacent piezoelectric material 1 are connected through the conductive material 2, so that the piezoelectric materials 1 in the piezoelectric composite material are electrically connected in series, which can significantly reduce the capacitance of the transducer array element and improve the electrical impedance. Assuming that the length, width and thickness of a piece of rectangular piezoelectric material 1 are L*W*T, and the capacitance is C, when the piezoelectric material 1 is divided into two pieces of rectangular piezoelectric material 1, that is, the size of each piece of piezoelectric material 1 is L1*W*T and L2*W*T, or the size of each piece is L*W1*T and L*W2*T, and the capacitance is C1 and C2 respectively, wherein L=L1+L2, W=W1+W2, C=C1+C2. After the two pieces of piezoelectric material 1 are electrically connected in series, the total capacitance becomes C1*C2 / (C1+C2). If C1=C2=C / 2, the total capacitance after series connection is C / 4, that is, the capacitance is reduced to one fourth of the original. By changing the size of L1, L2 or W1, W2, the capacitance can be reduced to any specified value in theory.

[0055] Further, the third cut groove 40 and the fourth cut groove 50 are located at the upper and lower ends of the insulating material 3, so that the positive electrode plating layer 4 and the negative electrode plating layer 5 of the adjacent piezoelectric material 1 are not connected through the conductive material 2. By connecting all the positive electrode plating layers 4 and the negative electrode plating layers 5, the piezoelectric materials 1 are connected in parallel.

[0056] In the embodiment, the third cut groove 40 and the fourth cut groove 50 are located at the upper and lower ends of the insulating material 3, so that the positive electrode plating layer 4 and the negative electrode plating layer 5 of the adjacent piezoelectric material 1 are not connected through the conductive material 2. By connecting all the positive electrode plating layers 4 and the negative electrode plating layers 5, the piezoelectric materials 1 are connected in parallel.

[0057] Specifically, the third cut groove 40 and the fourth cut groove 50 are located at the upper and lower ends of the insulating material 3, so that the positive electrode plating layer 4 and the negative electrode plating layer 5 of the adjacent piezoelectric material 1 are not connected through the conductive material 2. By connecting all the positive electrode plating layers 4 and the negative electrode plating layers 5, the piezoelectric materials 1 are connected in parallel.

[0058] Further, reference is made to Figure 10, the present invention provides a method for manufacturing a piezoelectric composite material for preparing a piezoelectric composite material in any one of the above embodiments. In this embodiment, for the novel piezoelectric composite material of the present invention, only by changing the connection mode of its surface coating, the application of pure composite material or the composite material with an electrical series structure can be achieved. That is, those skilled in the art can, according to the application scenario of the transducer, without changing the thickness of the composite material, only by changing the coating connection mode, reduce the capacitance of the transducer element to any specified value, meeting the requirements of different ultrasonic systems for the electrical impedance of the transducer. Thus, the R & D cycle can be greatly accelerated and the R & D cost can be saved. It should be noted that the schematic diagram of the present invention is a side view of a single piezoelectric composite material. Those skilled in the art can decide whether to cut the piezoelectric composite material into several strip-shaped blocks (elements) according to the number of elements, whether the transducer is a single element or an array structure, which does not affect the generality of the present invention.

[0059] A method for manufacturing a piezoelectric composite material specifically includes:

[0060] S101 Process a number of first grooves 10 on the piezoelectric material 1 and add an insulating material 3 into the first grooves 10. In this embodiment, referring to Figure 3 and Figure 4 , the processing method of the first grooves 10 can be cutting with a blade, or can be processed by etching or laser, and this application does not make further limitations. The same is true for the subsequent formation method of the second grooves 30. The depth of the first grooves 10 is related to the resonance frequency f of the piezoelectric composite material, and the width w of the first grooves 10 is related to the resonance frequency f of the piezoelectric composite material and the shear wave velocity v of the insulating material 3 filled later, and should satisfy w < v / (4√2*f). In this embodiment, the insulating material 3 is epoxy resin, and the conductive material 2 is conductive silver epoxy. Usually, the shear wave velocities of epoxy resin and conductive silver epoxy are close. Therefore, the groove width can be determined according to the shear wave velocity of epoxy resin and the resonance frequency of the piezoelectric material 1; there is 1 first groove 10 in the figure, and in actual application, any specified number of first grooves 10 arranged at the same interval or different intervals can be cut according to needs.

[0061] S102 Process a second groove 30 on the insulating material 3 and add a conductive material 2 into the second groove 30. Specifically, referring to Figure 5 and Figure 6In the embodiment, the conductive material 2 is a conductive silver epoxy material which needs to be cured at a specified temperature. The width of the second cut groove 30 is smaller than that of the first cut groove 10, and the depth of the second cut groove 30 is generally smaller than that of the first cut groove 10, and the depth of the second cut groove 30 can also be greater than that of the first cut groove 10, but the depth of the second cut groove 30 should be smaller than the total thickness of the piezoelectric material 1. In the illustration, there is one second cut groove 30, and in actual application, the second cut groove 30 can be formed in the first cut groove 10 at any specified position according to the volume ratio or electrical impedance requirements of the composite material. The second cut groove 30 can be filled with the conductive material 2 by sputtering, vacuum evaporation, physical vapor deposition, arc vapor deposition, ion plating or vacuum deposition.

[0062] S103, the piezoelectric material 1 is thinned on both sides to a specified thickness, so that the conductive material 2 and the insulating material 3 on both sides of the piezoelectric material 1 are exposed. Specifically, referring to Figure 7 The conductive material 2 and the insulating material 3 on both sides of the piezoelectric material 1 are exposed, which is for the subsequent surface plating process of the piezoelectric material 1 on both sides.

[0063] S104, a plating layer is formed on both sides of the piezoelectric material 1, and a third cut groove 40 and a fourth cut groove 50 are formed on the plating layer, so that the piezoelectric material 1 is arranged in series or in parallel. Specifically, referring to Figure 8 and Figure 9 The plating layer is usually two layers but is not limited to two layers, the base layer is a material such as nickel, chromium or nickel-chromium layer, and the outer layer is a material such as gold, silver, copper, aluminum or titanium alloy, so that the surface plating layer and the conductive material 2 in the second cut groove 30 are electrically conductive. The plating material of the piezoelectric material 1 is not further limited in the present application. The plating layer can be formed by sputtering, vacuum evaporation, physical vapor deposition, arc vapor deposition, ion plating or vacuum deposition, as long as it can form a plating layer. Figure 8 and Figure 9 The upper surface and the lower surface of the piezoelectric material 1 are provided with a plating layer, and in actual application, the side edges of the piezoelectric material 1 can also be provided with a plating layer according to needs.

[0064] Specifically, the skilled person can select the conduction mode of the plating layer according to different use scenarios, and cut the surface of the plating layer.

[0065] If the piezoelectric materials 1 are connected in series, the third cut groove 40 and the fourth cut groove 50 are arranged on the left and right sides of the insulating material 3, so that the positive electrode plating layer 4 and the negative electrode plating layer 5 of the adjacent piezoelectric materials 1 are connected through the conductive material 2. In this embodiment, the third cut groove 40 and the fourth cut groove 50 separate the adjacent positive electrode plating layer 4 and the adjacent negative electrode plating layer 5 of the adjacent piezoelectric materials 1, and the positive electrode plating layer 4 of one piezoelectric material 1 and the negative electrode plating layer 5 of another piezoelectric material 1 are connected through the conductive material 2 in the second cut groove 30, forming a piezoelectric material 1 electrical series structure. In specific applications, the transducer signal pole is connected to the positive electrode plating layer 4 of one piezoelectric material 1, and the ground pole is connected to the negative electrode plating layer 5 of another piezoelectric material 1, or the signal pole is connected to the negative electrode plating layer 5 of one piezoelectric material 1, and the ground pole is connected to the positive electrode plating layer 4 of another piezoelectric material 1, and according to the number and interval of the first cut groove 10 and the second cut groove 30, any specified piezoelectric material 1 electrical series structure is formed, for example Figure 8 is a multi-stage series piezoelectric composite material structure. In practical applications, only the last-stage positive electrode plating layer 4 and the last-stage negative electrode plating layer 5 in the series electrical path need to be extracted, and the width of the cut plating layer has no special requirements, and is usually as small as possible. It is worth noting that according to different distances of plating layer surface cutting or mask, the piezoelectric material 1 capacity can be reduced to any specified value under the condition of fixed piezoelectric material 1 thickness.

[0066] If the piezoelectric materials 1 are connected in parallel, the third cut groove 40 and the fourth cut groove 50 are arranged at the upper and lower ends of the insulating material 3, respectively, so that the positive electrode plating layer 4 and the negative electrode plating layer 5 of the adjacent piezoelectric materials 1 are not connected through the conductive material 2. In this embodiment, the positive electrode plating layer 4 and the negative electrode plating layer 5 of one piezoelectric material 1 are not connected to the positive electrode plating layer 4 and the negative electrode plating layer 5 of another piezoelectric material 1, that is, the upper and lower ends of the conductive material 2 of the second cut groove 30 do not contact the positive electrode plating layer 4 and the negative electrode plating layer 5. At this time, the piezoelectric composite material of the present application is only used as a composite material, and according to the number and interval of the first cut groove 10 and the second cut groove 30, any volume ratio of the piezoelectric composite material is formed, and the width of the third cut groove 40 and the fourth cut groove 40 is greater than the width of the second cut groove 30. For example Figure 9 is a conventional piezoelectric composite material structure. Unlike the multi-stage series structure, which only needs to extract the last-stage positive electrode plating layer 4 and the last-stage negative electrode plating layer 5, the conventional piezoelectric composite material structure needs to connect all the positive electrode plating layers 4 to connect the transducer signal pole or the ground pole, and all the negative electrode plating layers 5 to connect the transducer ground pole or the signal pole, and the positive electrode plating layer 4 and the negative electrode plating layer 5 of the piezoelectric composite material are not connected.

[0067] It is worth noting that the third cut 40 and the fourth cut 50 can be formed by cutting the third cut 40 and the fourth cut 50 on the plating layer after plating the piezoelectric material 1 on both sides, or the third cut 40 and the fourth cut 50 can be formed by setting a mask plate on both sides of the piezoelectric material 1 before or while plating the piezoelectric material 1 on both sides. The mask plate covers the third cut 40 and the fourth cut 50 positions, that is, the parts that need to be cut in the above manner. The mask plate covers the third cut 40 and the fourth cut 50 positions so that no plating layer is formed at these positions, but a plating layer is formed on other positions of the piezoelectric material 1 on both sides.

[0068] Further, the present application provides an ultrasonic transducer comprising a piezoelectric composite material according to any one of the above embodiments, a signal electrode and a ground electrode. When the piezoelectric material 1 is electrically connected in series, the signal electrode is connected to the positive electrode plating layer 4 of one piezoelectric material 1, and the ground electrode is connected to the negative electrode plating layer 5 of another piezoelectric material 1, or the signal electrode is connected to the negative electrode plating layer 5 of one piezoelectric material 1, and the ground electrode is connected to the positive electrode plating layer 4 of another piezoelectric material 1. When the piezoelectric material 1 is electrically connected in parallel, the positive electrode plating layer 4 of all piezoelectric materials 1 is connected to the signal electrode or the ground electrode; the negative electrode plating layer 5 of all piezoelectric materials 1 is connected to the ground electrode or the signal electrode, and the positive electrode plating layer 4 and the negative electrode plating layer 5 of the piezoelectric composite material are not connected.

[0069] It should be noted that the above embodiments can be freely combined as needed. The above is only a preferred embodiment of the present application, and it should be noted that for those skilled in the art, without departing from the principles of the present application, a number of improvements and refinements can be made, and these improvements and refinements should also be considered within the scope of the present application.

Claims

1. A piezoelectric composite material, characterized by, The piezoelectric material is provided with a plurality of first cut grooves; An insulating material is arranged in the first cut groove, and a second cut groove is further arranged on the insulating material; A conductive material is arranged in the second cut groove; A plating layer is arranged on both sides of the piezoelectric material, and a positive electrode plating layer and a negative electrode plating layer are arranged on both sides of the piezoelectric material, and a third cut groove and a fourth cut groove are arranged on the positive electrode plating layer and the negative electrode plating layer respectively, so that adjacent positive electrode plating layers and negative electrode plating layers are adapted to be connected in series through the conductive material or connected in parallel without the conductive material; When the third cut groove is arranged above the piezoelectric material and close to one side of the insulating material, and the fourth cut groove is arranged below the piezoelectric material and close to the other side of the insulating material, the third cut groove and the fourth cut groove are arranged on the left and right sides of the insulating material, so that the positive electrode plating layer and the negative electrode plating layer of the adjacent piezoelectric material are connected in series through the conductive material. When the third cut groove and the fourth cut groove are arranged at the upper and lower ends of the insulating material respectively, the positive electrode plating layer and the negative electrode plating layer of the adjacent piezoelectric material are not connected through the conductive material, and all the positive electrode plating layers and the negative electrode plating layers are connected respectively to form a parallel connection structure.

2. The piezoelectric composite material according to claim 1, wherein the width of the third cut groove and the fourth cut groove is greater than the width of the first cut groove.

3. The piezoelectric composite material according to claim 1, wherein the piezoelectric composite material is any one of 2-2 type, 1-3 type and 0-3 type. The first cut groove is machined on the piezoelectric material, and the insulating material is added in the first cut groove; The second cut groove is machined on the insulating material, and the conductive material is added in the second cut groove; The piezoelectric material is thinned to a specified thickness on both sides, so that the conductive material and the insulating material on both sides of the piezoelectric material are exposed; 4. A method for producing a piezoelectric composite material for producing a piezoelectric composite material according to any one of claims 1 to 3, characterized by, The plating layer is formed on both sides of the piezoelectric material, and the third cut groove and the fourth cut groove are formed on the plating layer, so that the piezoelectric material is connected in series or in parallel.

5. The piezoelectric composite material manufacturing method according to claim 4, wherein the plating layer is added on both sides of the piezoelectric material, and the third cut groove and the fourth cut groove are formed on the plating layer, so that the piezoelectric material is connected in series or in parallel, and the method specifically comprises: According to different use scenarios, the conduction mode of the plating layer is selected; If the piezoelectric material is connected in series, the third cut groove and the fourth cut groove are arranged on the left and right sides of the insulating material, so that the positive electrode plating layer and the negative electrode plating layer of the adjacent piezoelectric material are connected through the conductive material; If the piezoelectric material is connected in parallel, the third cut groove and the fourth cut groove are arranged at the upper and lower ends of the insulating material respectively, so that the positive electrode plating layer and the negative electrode plating layer of the adjacent piezoelectric material are not connected, and all the positive electrode plating layers and the negative electrode plating layers are connected respectively to form a parallel connection structure. ​ ​ ​ ​ ​ 6. The method of claim 5, wherein, after the plating layer is plated on both sides of the piezoelectric material, the third and fourth slits are cut on the plating layer; or, before or while the plating layer is plated on both sides of the piezoelectric material, a mask plate is arranged on both sides of the piezoelectric material, the mask plate covers the third and fourth slits, and then the plating layer is plated on both sides of the piezoelectric material.

7. The method of claim 4, wherein, the width w of the first slit satisfies w < v / (4√2*f), where v is the transverse wave speed of the insulating material and f is the resonance frequency of the piezoelectric composite material.

8. An ultrasonic transducer, characterized by, The piezoelectric composite material of any one of claims 1-3.

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