Method for manufacturing light-emitting glass substrate and display device

Abstract

The application discloses a manufacturing method of a light-emitting glass substrate and a display device. The manufacturing method comprises the following steps: providing a glass substrate; processing a fixing hole in a hollow area, pouring transparent glue into the fixing hole, and waiting for the transparent glue to solidify to a semi-fluid state; arranging a conduction circuit layer on a region corresponding to a wiring area on a first surface, and fixing a to-be-fixed element electrically connected with the conduction circuit layer on the conduction circuit layer; wherein the to-be-fixed element at least comprises a light-emitting unit; coating a first transparent layer on the first surface, so that the first transparent layer is combined with the transparent glue in the fixing hole, and the first transparent layer wraps the light-emitting unit. The above scheme can increase the connection reliability between the to-be-fixed element and the glass substrate, and reduce the risk of the to-be-fixed element falling off.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a manufacturing method of a light-emitting glass substrate and a display device. BACKGROUND

[0002] At present, when manufacturing upper and lower substrates of a liquid crystal panel, a glass plate will have residual glass after cutting, which will cause considerable waste and increase production cost. Manufacturing the residual glass into a glass-based light bar is an effective way of waste utilization and can generate considerable income.

[0003] However, the light bar manufactured by the residual glass has low fixing strength between the elements (light-emitting units and connectors) soldered and bound on the glass substrate and the glass substrate, and is easy to fall off, which increases the rework rate of the light bar and also increases the production cost. SUMMARY

[0004] The present application provides a manufacturing method of a light-emitting glass substrate and a display device to solve the problem that the elements bound on the glass substrate are easy to fall off from the glass substrate.

[0005] To solve the above technical problems, the technical solution provided by the present application is:

[0006] The present application provides a manufacturing method of a light-emitting glass substrate, which comprises:

[0007] Providing a glass substrate; wherein the glass substrate is provided with a wiring area and a hollow area, the hollow area is arranged around the wiring area, and the glass substrate comprises opposite first and second surfaces;

[0008] Processing a fixing hole in the hollow area, and pouring a transparent gel into the fixing hole, and waiting for the transparent gel to solidify to a semi-liquid state;

[0009] Laying a conductive circuit layer on the region of the first surface corresponding to the wiring area, and fixing a to-be-fixed element electrically conductive with the conductive circuit layer; wherein the to-be-fixed element at least comprises a light-emitting unit;

[0010] Coating a first transparent layer on the first surface, so that the first transparent layer is combined with the transparent gel in the fixing hole, and the first transparent layer wraps the light-emitting unit.

[0011] According to an embodiment of the present application, the step of coating a first transparent layer on the first surface, so that the first transparent layer is combined with the transparent gel in the fixing hole, and the first transparent layer wraps the light-emitting unit comprises:

[0012] coating a bottom transparent layer on the first surface, so that the bottom transparent layer is combined with the transparent colloid in the fixed hole, and the bottom transparent layer is solidified to a semi-solid state;

[0013] coating a top transparent layer on the bottom transparent layer solidified to a semi-solid state, so that the top transparent layer wraps the light-emitting unit.

[0014] According to an embodiment of the present application, after the step of machining the fixed hole in the hollowed-out area and pouring the transparent colloid into the fixed hole, and waiting for the transparent colloid to solidify to a semi-liquid state, the manufacturing method further comprises:

[0015] coating a second transparent layer on the second surface, so that the second transparent layer is fused with the transparent colloid in the fixed hole.

[0016] According to an embodiment of the present application, the to-be-fixed element further comprises a connector having a pin; and the bottom transparent layer at least wraps the pin of the connector.

[0017] According to an embodiment of the present application, the top transparent layer is coated in one layer or multiple layers.

[0018] According to an embodiment of the present application, the fixed hole comprises a first end and a second end, and the two ends respectively extend through the first surface and the second surface; or the first end extends through the first surface, and the second end extends to the second surface without penetrating through.

[0019] According to an embodiment of the present application, the fixed hole comprises a first end and a second end, and the second end is located on the side of the first end away from the to-be-fixed element, and the aperture of the second end is greater than the minimum aperture of the fixed hole.

[0020] According to an embodiment of the present application, the step of machining the fixed hole in the hollowed-out area and pouring the transparent colloid into the fixed hole, and waiting for the transparent colloid to solidify to a semi-liquid state comprises:

[0021] machining the fixed hole in the hollowed-out area;

[0022] arranging the glass substrate in a state that the second surface is on top and the first surface is on the bottom;

[0023] pouring the transparent colloid into the fixed hole from the side of the second surface away from the first surface, and waiting for the transparent colloid to solidify to a semi-liquid state;

[0024] The step of coating a conductive circuit layer on the region of the first surface corresponding to the wiring area, and fixing the to-be-fixed element electrically conductive with the conductive circuit layer comprises:

[0025] flip the glass substrate to have the first surface on top and the second surface on bottom;

[0026] a conductive circuit layer is disposed on the first surface corresponding to the trace area from the side of the first surface away from the second surface, and a to-be-fixed element electrically connected to the conductive circuit layer is fixed on the conductive circuit layer.

[0027] According to an embodiment of the present application, after the step of processing a fixing hole in the hollowed-out area and filling the fixing hole with transparent gel until the transparent gel solidifies to a semi-liquid state, the manufacturing method further comprises: removing the transparent gel overflowing from the fixing hole to the first surface.

[0028] The present application also provides a display device, comprising a display panel and a backlight module, the backlight module is electrically connected with the display panel, for providing a light source for the display panel; wherein the backlight module comprises at least one light-emitting glass substrate, the light-emitting glass substrate is manufactured by the above manufacturing method.

[0029] The present application has the following beneficial effects:

[0030] The light-emitting glass substrate and the manufacturing method thereof provided by the present application can wrap the light-emitting unit of the to-be-fixed element in the first transparent layer after the to-be-fixed element is fixed to the conductive circuit layer, the first transparent layer has a larger bonding area with the surface of the glass substrate and a larger bonding force, so that the connection reliability between the light-emitting unit and the glass substrate can be increased, the risk of the light-emitting unit falling off can be reduced, and the first transparent layer will not affect the outward emission of the light emitted by the light-emitting unit. In addition, a hole is punched in the glass substrate, and transparent gel is filled in the hole, so that the grip between the first transparent layer coated on the surface of the glass substrate and the glass substrate can be further increased, and the risk of the light-emitting unit falling off can be further reduced. BRIEF DESCRIPTION OF DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort on the basis of these drawings.

[0032] Figure 1 is a method flow diagram of an exemplary embodiment of the manufacturing method of the light-emitting glass substrate of the present application;

[0033] Figure 2 is a process flow diagram of an exemplary embodiment of the manufacturing method of the light-emitting glass substrate of the present application;

[0034] Figure 3ais a schematic diagram of a region division structure of a glass substrate according to an embodiment of the present application;

[0035] Figure 3b is Figure 3a is a schematic diagram of a structure after a fixed hole is processed on a glass substrate;

[0036] Figure 4 is a method flow chart of another embodiment of a method for manufacturing a luminescent glass substrate provided by the present application;

[0037] Figure 5 is Figure 4 is a process flow chart corresponding to the method flow chart of

[0038] Figure 6a is a first embodiment of a fixed hole in the present application;

[0039] Figure 6b is a second embodiment of a fixed hole in the present application;

[0040] Figure 6c is a third embodiment of a fixed hole in the present application;

[0041] Figure 6d is a fourth embodiment of a fixed hole in the present application;

[0042] Figure 6e is a fifth embodiment of a fixed hole in the present application;

[0043] Figure 7 is Figure 2 is an enlarged view of a connector in

[0044] Figure 8 is a method flow chart of yet another embodiment of a method for manufacturing a luminescent glass substrate provided by the present application;

[0045] Figure 9 is Figure 8 is a process flow chart corresponding to the method flow chart of

[0046] Figure 10 is a schematic diagram of another embodiment of a glass substrate of the present application.

[0047] Legend of reference signs:

[0048] glass substrate 100

[0049] first surface 101

[0050] second surface 102

[0051] wiring region 103

[0052] first region 103a

[0053] second region 103b

[0054] Hollowed-out region 104

[0055] Fixing hole 105

[0056] First end 105a

[0057] Second end 105b

[0058] Element to be fixed 200

[0059] Light-emitting unit 210

[0060] Connector 220

[0061] Pin 221

[0062] Soldering leg 222

[0063] First transparent layer 300

[0064] Bottom transparent layer 310

[0065] Top transparent layer 320

[0066] Second transparent layer 400 DETAILED DESCRIPTION

[0067] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work are within the scope of protection of the present application.

[0068] Reference herein to “an embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase that the phrase in various places in the specification are not necessarily all referring to the same embodiment, or are necessarily referring to different or alternative embodiments. It is explicitly contemplated that embodiments described herein can be combined with other embodiments.

[0069] The present application provides a method for manufacturing a light-emitting glass substrate. Please refer to Figure 1 and Figure 2 , Figure 1 is a method flowchart of an exemplary embodiment of the method for manufacturing a light-emitting glass substrate of the present application, Figure 2 is a process flowchart of an exemplary embodiment of the method for manufacturing a light-emitting glass substrate of the present application. Specifically, the method of the present application can include the following steps:

[0070] S1, providing a glass substrate; wherein the glass substrate is provided with a wiring area and a hollow area, the hollow area is arranged around the wiring area, and the glass substrate comprises a first surface and a second surface opposite to each other.

[0071] In the field of liquid crystal panel manufacturing, generally, the substrates of the liquid crystal panel, i.e. the upper substrate and the lower substrate, i.e. the TFT (Thin Film Transistor) substrate and the CF (Color Filter) substrate, are prepared on a glass large plate. After the upper and lower substrates are prepared, the remaining glass large plate is discarded because its shape and size do not meet the preparation requirements of the upper and lower substrates. In the embodiments of the present application, the leftover material of the glass large plate after the TFT substrate or the CF substrate is prepared can be used as a glass substrate. The glass substrate is prepared into a luminescent glass substrate through subsequent steps, which not only improves the utilization rate of the glass leftover material, but also reduces the production cost of the luminescent glass substrate. The glass leftover material is usually in the form of a strip.

[0072] The luminescent glass substrate prepared from the glass leftover material can be used as a light source, for example, it can be used to provide a backlight source for a display panel, which can be a liquid crystal panel or an electrophoretic panel, etc.

[0073] Figure 2 Figure (a) shows a cross-sectional view of the glass substrate, which is combined with Figure 3a , Figure 3a is a schematic diagram of the area division structure of the glass substrate of the embodiments of the present application, and Figure 3a is Figure 2 Figure (a) is a top view of the glass substrate 100, which is provided with a wiring area 103 and a hollow area 104, the hollow area 104 is arranged around the wiring area 103, and the glass substrate 100 comprises a first surface 101 and a second surface 102 opposite to each other. It should be noted that the concept of the hollow area 104 in the present application only refers to the area divided on the glass substrate 100, and the hollow structure with holes is formed in the hollow area by fixing holes through subsequent steps.

[0074] S2, fixing holes in the hollow area and pouring transparent gel into the fixed holes, and waiting for the transparent gel to solidify to a semi-liquid state.

[0075] Specifically, please refer to Figure 2 Figures (b) and (c) and Figure 3b , Figure 2 Figures (b) and Figure 3b is a schematic diagram of the structure of the glass substrate 100 after the fixing holes 105 are processed in the embodiments of the present application, Figure 3b is also Figure 2The top view of (b). The fixed hole 105 is processed in the hollowed-out area 104. The fixed hole 105 can be processed by laser cutting or mechanical processing. When mechanical processing is used, the fixed hole 105 is first positioned and pre-punched, and then drilled.

[0076] The transparent colloid is a colloid with high transmittance, which can be melted into a liquid state at high temperature and gradually cooled and solidified into a liquid state as the temperature decreases. The transparent colloid can be epoxy resin and other materials, or can be a material containing glass fibers, PP (polypropylene), PC (polycarbonate), etc. It should be understood that in other embodiments, the transparent colloid is not limited to the characteristics of high-temperature melting and low-temperature solidification, but can also be in a flowing state in a normal state and gradually solidified in a certain processing environment, such as ultraviolet irradiation.

[0077] S3, disposing a conductive circuit layer in the area of the first surface corresponding to the wiring area, and fixing a to-be-fixed element electrically conductive with the conductive circuit layer in the conductive circuit layer; wherein the to-be-fixed element at least includes a light-emitting unit.

[0078] Specifically, please refer to Figure 2 (d) and Figure 3a The wiring area 103 includes a first area 103a, and the light-emitting unit 210 in the to-be-fixed element 200 is fixed to the conductive circuit layer in the first area 103a. The light-emitting unit 210 can be fixed to the conductive circuit layer by soldering and achieve electrical conduction between the conductive circuit layer. The light-emitting unit 210 can be a plurality of LED (light-emitting diode) chips arranged along the length direction of the glass substrate 100 to obtain the desired lighting effect. The light-emitting unit 210 can be a LED (light-emitting diode) chip, and the light-emitting unit 210 has a soldering leg to connect the conductive circuit layer.

[0079] The glass substrate 100 is divided into a wiring area 103 and a hollowed-out area 104. The to-be-fixed element 200 is installed in the wiring area 103, and the fixed hole 105 is processed in the hollowed-out area 104. The hollowed-out area 104 avoids the wiring area 103, so that the processing of the fixed hole 105 and the installation of the to-be-fixed element 200 are performed in different areas, avoiding mutual influence between them.

[0080] S4, coating a first transparent layer on the first surface, so that the first transparent layer is combined with the transparent colloid in the fixed hole, and the first transparent layer wraps the light-emitting unit.

[0081] Specifically, please refer to Figure 2 (e), Figure 2 (e) shows the structure after the first transparent layer 300 is coated on the first surface 101. The first transparent layer 300 can be made of the same material as the transparent colloid in the fixed hole 105.

[0082] It can be seen that the manufacturing method of the light-emitting glass substrate provided by the present application can wrap the light-emitting unit 210 of the to-be-fixed element 200 in the first transparent layer 300 after the to-be-fixed element 200 is fixed to the conduction circuit layer, and the first transparent layer 300 has a larger bonding area and a larger bonding force with the surface of the glass substrate 100, so that the connection reliability between the light-emitting unit 210 and the glass substrate 100 can be increased, the risk of the light-emitting unit 210 falling off can be reduced, the first transparent layer 300 will not affect the outward emission of the light emitted by the light-emitting unit 210. And punching holes in the glass substrate 100 and filling transparent gel in the holes, so that the grip between the first transparent layer 300 coated on the surface of the glass substrate 100 and the glass substrate 100 can be further increased, the risk of the light-emitting unit 210 falling off can be further reduced, and the yield of the light-emitting glass substrate is improved.

[0083] It should be noted that the order of steps S2 and S3 can be exchanged, that is, the conduction circuit layer and the to-be-fixed element 200 can be laid first, and then the fixing hole 105 is processed and the transparent gel is filled into the fixing hole 105. Of course, it is also not excluded that the two steps are performed simultaneously and crosswise, but it can be understood that since the processing of the fixing hole 105 will produce debris that will affect the work of the conduction circuit layer and the to-be-fixed element 200, and it is also possible that the conduction circuit layer and the to-be-fixed element 200 will be damaged in the process of processing the fixing hole 105. Therefore, step S2 can be performed first, and then step S3 is performed.

[0084] And after step S2 is completed, since the process of processing the fixing hole 105 will produce debris, the glass substrate 100 on which the fixing hole 105 is processed can be cleaned and dried to avoid the influence of the debris on the subsequent steps.

[0085] In some embodiments, since the transparent gel filled into the fixing hole 105 may overflow the fixing hole 105 and remain on the first surface 101 after step S2 is completed, it will affect the laying of the conduction circuit layer and the to-be-fixed element 200 in step S3. After step S2 is completed, the transparent gel remaining on the first surface 101 can be cleaned, and the first surface 101 can be flattened so that the first transparent layer 300 can be better laid on the first surface 101.

[0086] The light-emitting glass substrate obtained by the manufacturing method can be used as a light source of a display device, which can be direct-view or side-in. When the display device is side-in, the light-emitting glass substrate can be used in combination with a light guide plate / diffusion plate. The first transparent layer 300 can have a thickness that reaches a preset value, and the light guide plate / diffusion plate can be isolated from the light-emitting unit 210 by the first transparent layer 300, so as to avoid direct contact between the light guide plate / diffusion plate and the light-emitting unit 210, thereby preventing damage to the light-emitting unit 210.

[0087] Please refer to Figure 4 and Figure 5 , Figure 4 is a method flow chart of another embodiment of the manufacturing method of the light-emitting glass substrate provided by the present application, Figure 5 is Figure 4 a process flow chart corresponding to the method flow chart. Specifically, the manufacturing method of the present embodiment can include the following steps:

[0088] S1, providing a glass substrate; wherein the glass substrate is provided with a wiring area and a hollow area, the hollow area is arranged around the wiring area, and the glass substrate includes opposite first and second surfaces.

[0089] S2, processing a fixing hole in the hollow area, and pouring a transparent gel into the fixing hole, and waiting for the transparent gel to solidify to a semi-liquid state.

[0090] S3, arranging a conductive circuit layer on the first surface corresponding to the wiring area, and fixing a to-be-fixed element in electrical conduction with the conductive circuit layer; wherein the to-be-fixed element at least includes a light-emitting unit.

[0091] S4, coating a first transparent layer on the first surface, so that the first transparent layer is combined with the transparent gel in the fixing hole, and the first transparent layer wraps the light-emitting unit.

[0092] The steps S1 to S3 in the present embodiment are the same as those in the foregoing embodiments, and will not be described here.

[0093] On the basis of the foregoing embodiments, the step S4 of the present embodiment includes:

[0094] S41, coating a bottom transparent layer on the first surface, so that the bottom transparent layer is combined with the transparent gel in the fixing hole, and the bottom transparent layer is solidified to a semi-solid state.

[0095] Figure 5 (e) in the figure shows the structure after coating the bottom transparent layer 310 on the first surface 101, and the bottom transparent layer 310 is combined with the transparent gel in the fixing hole 105.

[0096] S42, coating the top transparent layer on the bottom transparent layer which is solidified to semi-solid state, so that the top transparent layer wraps the light emitting unit.

[0097] Figure 5 In the middle (f), the structure after coating the top transparent layer 320 on the bottom transparent layer 310 is shown, and the bottom transparent layer 310 and the top transparent layer 320 jointly constitute the first transparent layer 300. In this embodiment, the first transparent layer 300 includes the bottom transparent layer 310 and the top transparent layer 320, that is, the first transparent layer 300 is divided into two times of coating, which facilitates the control of the coating amount of the transparent colloid and better control of the overall thickness of the transparent colloid. Moreover, the top transparent layer 320 is coated after the bottom transparent layer 310 is solidified to semi-solid state, so that the top transparent layer 320 and the semi-solid bottom transparent layer 310 are more easily combined, and the bonding force between them is better.

[0098] In some embodiments, the top transparent layer 320 can be coated in one layer, or can be coated in multiple layers. By coating in multiple layers, the fixed element 200 is less likely to loosen during the coating process. The reason is that if the coating is in one layer, the amount of coating is relatively large. When this layer is coated, only the bottom transparent layer 310 contacts the fixed element 200, and the contact area between the bottom transparent layer 310 and the fixed element 200 is small, so the fixed element 200 is prone to loosen. By coating in multiple layers, since the previous layer has been coated and fixed with the fixed element 200 when the next layer is coated, the fixed element 200 is fixed in more positions during coating, so the fixed element 200 is less likely to loosen.

[0099] Again refer to Figure 3b , the fixing holes 105 are multiple around the trace area 103. The more the number of fixing holes 105, the greater the bonding force between the first transparent layer 300 coated on the first surface 101 and the glass substrate 100. The specific number and aperture size of the fixing holes 105 can be designed according to the actual required bonding force between the first transparent layer 300 and the glass substrate 100.

[0100] Please refer to Figures 6a to 6e , Figures 6a to 6e different structures of the fixing hole 105 are shown. The fixing hole 105 includes a first end 105a and a second end 105b, and the first end 105a and the second end 105b respectively extend to penetrate the first surface 101 and the second surface 102, that is, the fixing hole 105 is a through hole. It can also be that the first end 105a extends to penetrate the first surface 101, and the second end 105b extends to not penetrate the second surface 102, that is, the fixing hole 105 is a non-through hole. It can be understood that the process of processing a through hole is simpler than that of processing a non-through hole. The cross-sectional shape of the fixing hole 105 is not limited to circular, square and other shapes.

[0101] Figure 6a For the first embodiment of the fixed hole 105 in the present application, in the embodiment, the hole diameter of the fixed hole 105 at the first end 105a is smaller than the hole diameter of the fixed hole 105 at the second end 105b, the shape of the fixed hole 105 is tapered, and the hole diameter of the fixed hole 105 gradually increases from the first end 105a to the second end 105b. Since the transparent colloid is filled in the fixed hole 105 to increase the adhesion between the first transparent layer 300 coated on the first surface 101 and the glass substrate 100, the transparent colloid in the fixed hole 105 should be difficult to be pulled out from the fixed hole 105, and the tapered structure of the fixed hole 105 in the embodiment makes the transparent colloid in the fixed hole 105 difficult to be pulled out, further increasing the connection reliability between the first transparent layer 300 and the glass substrate 100.

[0102] Figure 6b For the second embodiment of the fixed hole 105 in the present application, in the embodiment, the hole diameter of the fixed hole 105 at the first end 105a is equal to the hole diameter of the fixed hole 105 at the second end 105b, and the shape of the fixed hole 105 is hourglass-shaped, that is, the hole diameter of the fixed hole 105 is smallest at the middle part of the fixed hole 105, and gradually increases from the middle part of the fixed hole 105 to both ends. The fixed hole 105 in the embodiment is divided into two parts, that is, the fixed hole 105 includes a first part and a second part, and the first part and the second part are two symmetrical circular truncated cone-shaped holes. Figure 6b The fixed hole 105 in the embodiment presents a shape of wide at the top and bottom and narrow at the middle, which can not only ensure that the transparent colloid in the fixed hole 105 is difficult to be pulled out from the fixed hole 105, but also can expand the bonding area between the transparent colloid in the fixed hole 105 and the first transparent layer 300, improving the bonding reliability.

[0103] Figure 6c For the third embodiment of the fixed hole 105, in the embodiment, the hole diameter of the first end 105a is equal to the hole diameter of the second end 105b, and the shape of the fixed hole 105 is waist-shaped, that is, the hole diameter of the fixed hole 105 is smallest at the middle part of the fixed hole 105, and gradually increases from the middle part of the fixed hole 105 to both ends. The embodiment can also ensure that the transparent colloid in the fixed hole 105 is difficult to be pulled out from the fixed hole 105.

[0104] Figure 6d For the fourth embodiment of the fixed hole 105 in the present application, Figure 6d the hole diameter of the first end 105a is smaller than the hole diameter of the second end 105b, and the shape of the fixed hole 105 is stepped. The embodiment can also ensure that the transparent colloid in the fixed hole 105 is difficult to be pulled out from the fixed hole 105.

[0105] Figures 6a to 6dThe structures of the fixed holes 105 can all achieve the effect that the transparent gel in the fixed holes 105 is difficult to pull out of the fixed holes 105. Further, as long as the hole diameter of the fixed hole 105 at the second end 105b is greater than the minimum hole diameter of the fixed hole 105, the effect can be achieved.

[0106] Figure 6e For the fifth embodiment of the fixed hole 105 in the present application, the hole diameter of the fixed hole 105 at the first end 105a is equal to the hole diameter of the fixed hole 105 at the second end 105b, and the hole diameter of the fixed hole 105 is the same at each position. In this embodiment, since the hole diameter of the fixed hole 105 is the same at each position, the processing of the fixed hole 105 is simpler.

[0107] When the fixed hole 105 is processed by laser cutting, the specific processing procedure of the fixed hole 105 is described by taking Figure 6a and Figure 6b as examples.

[0108] For the processing of the fixed hole 105 in Figure 6a , since the hole diameter of the fixed hole 105 at the first end 105a is smaller than the hole diameter of the fixed hole 105 at the second end 105b, and the shape of the fixed hole 105 is conical, in order to facilitate the processing of the fixed hole 105, the glass substrate 100 can be flipped over for processing, i.e., the second surface 102 of the glass substrate 100 faces upward, and the first surface 101 faces downward, so as to facilitate the processing and forming of the fixed hole 105 of this kind of conical shape. After the fixed hole 105 is processed and formed, the glass substrate 100 is flipped over again, so that the first surface 101 of the glass substrate 100 faces upward, and the second surface 102 faces downward, so as to facilitate the coating of the first transparent layer 300 on the first surface 101.

[0109] For the processing of the fixed hole 105 in Figure 6b , the second surface 102 of the glass substrate 100 can face upward, and the first surface 101 can face downward, and the first part of the fixed hole 105 can be processed by laser. Then, the glass substrate 100 is flipped over, so that the first surface 101 faces upward, and the second surface 102 faces downward, and the second part of the fixed hole 105 can be processed by laser. Figure 6b The processing difficulty of the fixed hole 105 in Figure 6a is greater than that of the fixed hole 105 in .

[0110] In some embodiments, referring again to Figure 2 , the fixed element 200 further includes a connector 220, and the wiring area 103 further includes a second area 103b, and the connector 220 is bound to the second area 103b. Please refer to Figure 7 , Figure 7is a structural schematic diagram of the connector 220 in the embodiment of the present application. The connector 220 has a pin 221 and a soldering leg 222. The first transparent layer 300 at least wraps the pin 221 and the soldering leg 222 of the connector 220, preventing them from falling off and loosening. The connector 220 is tightly bound to the glass substrate 100, and can meet the requirements of the push-pull force required for the plugging operation of the connector 220. Moreover, the bottom layer of the first transparent layer 300 at least wraps the pin 221 and the soldering leg 222 of the connector 220. The transparent gel is more likely to flow in the gap between the pin 221 and the soldering leg 222. The pin 221 and the soldering leg 222 have small resistance to the flow of the transparent gel, which is beneficial to the rapid spreading of the first transparent layer 300 and can also reduce the impact of the transparent gel on the light-emitting unit 210 and the connector 220 when the transparent gel is added.

[0111] The connector 220 is also electrically connected to the conductive circuit layer, for wiring between the light-emitting glass substrate of the present application and the outside. The light-emitting glass substrate of the present application can be connected to an external power supply (not shown) through the connector 220.

[0112] Again referring to Figure 3b Since the connector 220 is more likely to fall off relative to the light-emitting unit 210 during the plugging operation of the connector 220, in the embodiment, the four corners of the connector 220 are respectively provided with fixing holes 105 to enhance the anti-falling effect of the connector 220. The number of the fixing holes 105 around the connector 220 can be appropriately increased according to the size of the plugging force.

[0113] Please refer to Figure 8 , Figure 8 is a method flow chart of another embodiment of the manufacturing method of the light-emitting glass substrate provided by the present application. Specifically, the manufacturing method of the embodiment can include the following steps:

[0114] S1, providing a glass substrate; wherein the glass substrate is pre-provided with a wiring area and a hollow area, the hollow area is arranged around the wiring area, and the glass substrate includes opposite first and second surfaces.

[0115] S2, processing fixing holes in the hollow area, and pouring transparent gel into the fixing holes, and waiting for the transparent gel to solidify to a semi-liquid state.

[0116] S3, arranging a conductive circuit layer on the region of the first surface corresponding to the wiring area, and fixing a to-be-fixed element electrically conductive with the conductive circuit layer on the conductive circuit layer; wherein the to-be-fixed element at least includes a light-emitting unit.

[0117] S4, coating a first transparent layer on the first surface, so that the first transparent layer is combined with the transparent gel in the fixing holes, and the first transparent layer wraps the light-emitting unit.

[0118] The steps S1 to S4 in the embodiment are the same as those in the foregoing embodiments, and will not be described here again.

[0119] On the basis of the above-mentioned embodiment, after step S2, the manufacturing method of the present embodiment further comprises:

[0120] S5, coating a second transparent layer on the second surface, and making the second transparent layer melt with the transparent glue in the fixing hole, and waiting for the second transparent layer to solidify to a solid state.

[0121] Referring to Figure 8 , Figure 8 is a process flow chart of the manufacturing method of the present application. In the present embodiment, a second transparent layer 400 is coated on the second surface 102, and the second transparent layer 400 is made to melt with the transparent glue in the fixing hole 105, and the second transparent layer 400 is waited to solidify to a solid state. Therefore, in the present embodiment, transparent glue is coated on both surfaces of the glass substrate 100, and the transparent glue on both surfaces can be connected through the transparent glue in the fixing hole 105, further increasing the anti-falling effect between the transparent glue on the first surface 101 and the first surface 101. Step S5 can be performed after step S3, or can be performed before step S3, or can be performed after step S5. It can be understood that, in order to avoid affecting the to-be-fixed element 200 when coating the second transparent layer 400 on the second surface 102, step S5 can be performed before step S3 as shown in the figure. Figure 8

[0122] In the present embodiment, the second surface 102 of the glass substrate 100 can be first upward, and the first surface 101 downward. After the fixing hole 105 of the glass substrate 100 is processed and formed, the transparent glue is poured into the fixing hole 105. After the transparent glue solidifies to a semi-solid state, the second transparent layer 400 is coated on the second surface 102. After the second transparent layer 400 completely solidifies, the glass substrate 100 is turned over, so that the first surface 101 of the glass substrate 100 is upward, and the second surface 102 is downward, so as to coat the first transparent layer 300 on the first surface 101.

[0123] Referring to Figure 10 , Figure 8 is a structure schematic view of another embodiment of the glass substrate in the present application. The light-emitting glass substrate is generally used for side-in display panels, which means that its width is limited, and it is difficult to process complete fixing holes 105 in the hollowed-out area 104. In the present embodiment, each fixing hole 105 is located at the edge of the glass substrate 100, and a semicircular hole structure can be used. Especially for some narrow-edge light-emitting glass substrates, the structure of the fixing hole 105 of the present embodiment can be used.

[0124] ​The application also provides a display device, comprising a display panel and a backlight module, the backlight module is electrically connected with the display panel and used for providing a light source for the display panel; wherein the backlight module comprises at least one luminescent glass substrate, and the luminescent glass substrate is prepared by the preparation method of the above-mentioned embodiments. Since the display device adopts all the technical solutions of the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here. Wherein, the display panel can be a liquid crystal panel or an electrophoretic panel and other panels that need a backlight source.

[0125] The terms "first", "second", "third" in the application are only for descriptive purposes, and cannot be understood as indicating the number of the technical features indicated. Therefore, the features defined with "first", "second", "third" can explicitly or implicitly include at least one of the features. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the application are only used to explain the relative position relationship, movement condition, etc. between components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications will also change accordingly. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but can optionally include steps or units not listed, or can optionally include other steps or units inherent to the process, method, product or device.

[0126] The above is only an embodiment of the application, and does not limit the patent scope of the application, and any equivalent structure or equivalent process transformation using the content of the specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the application.

Claims

1. A method for manufacturing a luminescent glass substrate, characterized in that: The production method comprises: A glass substrate is provided; wherein a wiring area and a hollow area are preset on the glass substrate, the hollow area is arranged around the wiring area and avoids the wiring area, and the glass substrate includes a first surface and a second surface opposite to each other; Processing fixing holes in the hollow area, and pouring transparent colloid into the fixing holes, and waiting for the transparent colloid to solidify into a semi-fluid state; wherein the fixing holes are multiple and arranged around the wiring area; Then, coating the second transparent layer on the second surface so that the second transparent layer is fused with the transparent colloid in the fixing hole; Then, a conductive circuit layer is arranged in an area of ​​the first surface corresponding to the wiring area, and a component to be fixed that is electrically connected to the conductive circuit layer is fixed on the conductive circuit layer; wherein the component to be fixed includes at least a light-emitting unit; Then, a first transparent layer is coated on the first surface, so that the first transparent layer is combined with the transparent colloid in the fixing hole, and the first transparent layer wraps the light-emitting unit.

2. The method for manufacturing a luminescent glass substrate according to claim 1, wherein: The step of coating the first surface with a first transparent layer so that the first transparent layer is combined with the transparent colloid in the fixing hole and the first transparent layer wraps the light-emitting unit includes: Applying a bottom transparent layer on the first surface so that the bottom transparent layer is combined with the transparent colloid in the fixing hole, and waiting for the bottom transparent layer to solidify into a semi-solid state; A top transparent layer is coated on the bottom transparent layer solidified to a semi-solid state, so that the top transparent layer wraps the light-emitting unit.

3. The method for manufacturing a luminescent glass substrate according to claim 2, wherein: The element to be fixed further comprises a connector having pins; the bottom transparent layer at least wraps the pins of the connector.

4. The method for manufacturing a luminescent glass substrate according to claim 2, wherein: The top transparent layer is coated in one layer or in multiple layers.

5. The method for manufacturing a luminescent glass substrate according to claim 1, wherein: The fixing hole includes a first end and a second end, and the two ends extend to penetrate the first surface and the second surface respectively.

6. The method for manufacturing a luminescent glass substrate according to claim 1, wherein: The fixing hole includes a first end and a second end, the second end is located on a side of the first end away from the element to be fixed, and the aperture of the second end is larger than the minimum aperture of the fixing hole.

7. The method for manufacturing a luminescent glass substrate according to claim 5 or 6, wherein: The step of machining a fixing hole in the hollow area, pouring a transparent colloid into the fixing hole, and waiting for the transparent colloid to solidify into a semi-fluid state comprises: Processing fixing holes in the hollow area; Arranging the glass substrate with the second surface on top and the first surface on the bottom; pouring a transparent colloid into the fixing hole from a side of the second surface facing away from the first surface, and waiting for the transparent colloid to solidify into a semi-fluid state; The step of laying out a conductive circuit layer in an area of ​​the first surface corresponding to the wiring area, and fixing a component to be fixed that is electrically connected to the conductive circuit layer on the conductive circuit layer comprises: Turning the glass substrate over so that the first surface is on top and the second surface is on the bottom; A conductive circuit layer is arranged in a region of the first surface corresponding to the routing region on a side of the first surface away from the second surface, and a component to be fixed that is electrically connected to the conductive circuit layer is fixed on the conductive circuit layer.

8. The method for manufacturing a luminescent glass substrate according to claim 1, wherein: After the steps of machining a fixing hole in the hollow area, filling the fixing hole with a transparent colloid, and allowing the transparent colloid to solidify into a semi-fluid state, the manufacturing method further includes: cleaning the transparent colloid that overflows from the fixing hole to the first surface.

9. A display device, characterized in that: It comprises a display panel and a backlight module, wherein the backlight module is electrically connected to the display panel and is used to provide a light source for the display panel; wherein the backlight module comprises at least one luminescent glass substrate, and the luminescent glass substrate is manufactured by the manufacturing method according to any one of claims 1-8.

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