Batch packaging structure and batch packaging process for sensor

Abstract

The invention relates to the technical field of sensor packaging, in particular to a batch packaging structure and a batch packaging process for sensors, the batch packaging structure comprises a substrate and a packaging cover, the windowing position of the substrate is provided with a mounting area, the mounting area is divided into a plurality of packaging stations arranged in a rectangular array, and the packaging stations are arranged on the substrate. First positioning holes are formed in two opposite sides of the mounting area of the substrate; the surface, provided with the mounting area, of the substrate is connected with a packaging layer, the packaging layer comprises a plurality of packaging tube shells, and the packaging tube shells are in one-to-one correspondence with the packaging stations; the packaging cover comprises a cover plate area, the cover plate area is provided with a plurality of window covers arranged in a rectangular array, the window covers correspond to the packaging stations one to one, windows are formed in the window covers, waterproof films are attached to the windows, second positioning holes are formed in the positions, on the two opposite sides of the installation area, of the packaging cover, and the second positioning holes are opposite to the first positioning holes in position. According to the invention, the sensors can be packaged in batches, the production efficiency is improved, and the packaging cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of sensor packaging, and in particular to a batch packaging structure and a batch packaging process for sensors. Background Art

[0002] At present, the differential pressure sensors widely available in the market mainly adopt the packaging form of single products. The production process is relatively fixed and cumbersome, and the specific steps include: first, it is necessary to carefully select a suitable substrate as the basis of the sensor; then, the chip loading operation is carried out, that is, the core components are installed on the substrate; then, the single products are separated to ensure that each sensor unit is independent and complete; then, the unit bottomless box cover is produced. This step is crucial for the packaging of the sensor, and the material of the box cover is mostly steel, and sometimes a plastic-sealed tube shell is used as an alternative; next, the steel cover is bonded to the sensor body by dispensing to ensure its sealing and stability; finally, the sensor semi-finished product is encapsulated using a specific colloid to complete the entire production process.

[0003] However, this packaging form is not without disadvantages. Among them, the most significant problem is that the production cost of the steel bottomless box cover and the steel cover is relatively high, which not only increases the overall manufacturing cost of the sensor, but also has a certain impact on its market competitiveness. At the same time, there are also shortcomings in production efficiency. The cumbersome production process and high material costs make it difficult to improve production efficiency. Therefore, this packaging form is more suitable for the packaging of a single sensor, and it obviously has certain limitations for large-scale, high-efficiency production needs. Summary of the invention

[0004] In order to solve the technical problem that the existing packaging form is more suitable for the packaging of a single sensor, but obviously has certain limitations for large-scale and high-efficiency production needs, the present invention provides a batch packaging structure for sensors on the one hand, and provides a batch packaging process for sensors on the other hand.

[0005] To achieve the above-mentioned purpose, a technical solution adopted by a batch packaging structure for sensors in the present invention is: A batch packaging structure for sensors comprises a substrate and a packaging cover, wherein the substrate is a windowed substrate, a mounting area is provided at the window position of the substrate, the mounting area is divided into a plurality of packaging stations arranged in a rectangular array, the substrate is provided with first positioning holes on two opposite sides of the mounting area, and the packaging stations are used to install sensor chips; a side of the substrate provided with the mounting area is connected with a packaging layer, the packaging layer comprises a plurality of packaging tube shells, and the packaging tube shells correspond to the packaging stations one by one; the packaging cover comprises a cover plate area, the cover plate area is provided with a plurality of window covers arranged in a rectangular array, the window covers correspond to the packaging stations one by one, the window covers are protrudingly arranged, a window is provided on the window cover, a waterproof film is attached to the window, second positioning holes are provided on two opposite sides of the mounting area of ​​the packaging cover, the second positioning holes are opposite to the first positioning holes, and a side of the packaging cover away from the protruding direction of the window cover is bonded to a side of the substrate provided with the packaging stations.

[0006] By adopting the above structural solution, sensors can be packaged in batches, thus improving production efficiency and reducing packaging costs.

[0007] As a preferred implementation of a batch packaging structure for sensors, the material of the packaging tube shell is oxidized resin.

[0008] As a preferred implementation of a batch packaging structure for sensors, a plurality of cutting lines are drawn on the side of the packaging cover away from the substrate, and the cutting lines pass through the lateral gaps and longitudinal gaps between the plurality of window covers.

[0009] The above structural solution is adopted to facilitate monomer cutting.

[0010] As a preferred implementation of a batch packaging structure for sensors, a plurality of mounting areas are provided.

[0011] By adopting the above structural solution, the substrate area is increased, the operation range for batch production can be flexibly adjusted, and the output can be increased.

[0012] As a preferred implementation of a batch packaging structure for sensors, the substrate and the packaging cover have the same shape and size.

[0013] As a preferred implementation of a batch packaging structure for sensors, the sensor chip is pasted to a packaging station.

[0014] A technical solution adopted in a batch packaging process for sensors in the present invention is: A batch packaging process for sensors uses any of the above batch packaging structures for sensors for packaging, and includes the following steps: Dispense glue and place the sensor chip on the packaging station of the substrate; Covering the side of the substrate provided with the mounting area with a packaging layer and curing the layer; Perform wire bonding process inside each package shell; Dispense glue on the semi-finished sensor after wire bonding, align the package cover with the substrate, make the window cover correspond to the package station one by one, make the second positioning hole and the first positioning hole position opposite, adhere the package cover to the substrate, and cure; Cut along the gaps between the window covers to obtain a single finished sensor.

[0015] As a preferred implementation method for a batch packaging process for sensors, the substrate and the packaging cover are made of the same material, and the window cover and the packaging station array are arranged in the same manner.

[0016] The beneficial effects of the present invention include: This application can package sensors in batches, improve production efficiency and reduce packaging costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solution of the present invention, the accompanying drawings required for use in the description will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0018] Figure 1 is a schematic diagram of the three-dimensional structure of the substrate in Example 1 of the present invention; Figure 2 This is a schematic diagram of the three-dimensional structure after the substrate is covered with a packaging layer in Example 1 of the present invention; Figure 3 is a schematic diagram of the three-dimensional structure of the packaging cover in Example 1 of the present invention; Figure 4 It is a schematic diagram of the three-dimensional structure when the substrate and the packaging cover are bonded together in Example 1 of the present invention; Figure 5 It is a schematic diagram of the three-dimensional structure of the substrate in Example 2 of the present invention.

[0019] List of parts and reference numerals: 1. Substrate; 2. Packaging cover; 3. Installation area; 4. Sensor chip; 5. First positioning hole; 6. Packaging layer; 7. Cover area; 8. Window cover; 9. Waterproof membrane; 10. Second positioning hole; 11. Positioning pin. DETAILED DESCRIPTION

[0020] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the technical scheme of the present invention will be clearly and completely described below in conjunction with the drawings in this specific embodiment. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0021] Embodiment 1: Reference Figure 1-4 The present embodiment proposes a batch packaging structure for sensors, including a substrate 1 and a packaging cover 2. The substrate 1 is a window substrate 1. A mounting area 3 is provided on the substrate 1. The mounting area 3 is divided into a plurality of packaging stations arranged in a rectangular array. The substrate 1 is provided with first positioning holes 5 on opposite sides of the mounting area 3. The packaging stations are used to install sensor chips 4. The sensor chips 4 are pasted on the packaging stations. A side of the substrate 1 provided with the mounting area 3 is connected with a packaging layer 6. The packaging layer 6 includes a plurality of packaging tube shells. The material of the packaging tube shells is oxidized resin. The packaging tube shells correspond to the packaging stations one by one.

[0022] The material of the packaging cover 2 is the same as that of the packaging tube shell. The packaging cover 2 and the substrate 1 have the same shape, size and material. The packaging cover 2 includes a cover plate area 7, and the cover plate area 7 is provided with a plurality of window covers 8 arranged in a rectangular array. The window covers 8 correspond to the packaging stations one by one, and the array method is the same. The window covers 8 are protruding, and windows are opened on the window covers 8. A waterproof film 9 is attached to the windows. The packaging cover 2 is provided with second positioning holes 10 on the opposite sides of the installation area 3. The second positioning holes 10 are opposite to the first positioning holes 5. The side of the packaging cover 2 away from the protruding direction of the window covers 8 is bonded to the side of the substrate 1 where the packaging stations are provided. A plurality of cutting lines are drawn on the side of the packaging cover 2 away from the substrate 1, and the cutting lines pass through the horizontal gaps and vertical gaps between the plurality of window covers 8.

[0023] The working principle of this embodiment is: Glue is dispensed on the packaging station of the substrate 1 and the sensor chip 4 is placed; the side of the substrate 1 provided with the mounting area 3 is covered with a packaging layer 6, the material of the packaging tube shell is oxidized resin, and then cured; after curing and molding, a wire bonding process is performed in each packaging tube shell; glue is dispensed on the semi-finished sensor after wire bonding, the packaging cover 2 is aligned with the substrate 1, the window cover 8 and the packaging station correspond one by one, the second positioning hole 10 and the first positioning hole 5 are opposite, the positioning needle 11 is inserted into the first positioning hole 5 and the second positioning hole 10, the substrate 1 and the packaging cover 2 are fixed, the packaging cover 2 is bonded to the substrate 1, and cured; cutting is performed along the gap between each window cover 8, and finally a single finished sensor is obtained.

[0024] Therefore, the sensors can be packaged in batches, the production efficiency can be improved, the packaging cost can be reduced, and the stress problem caused by the different materials of the packaging shell and the steel parts can be prevented.

[0025] This embodiment can be used for batch packaging of air pressure sensors. The sensor chip 4 of the air pressure sensor is composed of two chips, SENSOR and ASIC.

[0026] Embodiment 2: This embodiment provides a batch packaging structure for sensors, which is different from the embodiment 1 in that a plurality of mounting areas 3 are provided. Figure 5 , increasing the area of ​​the substrate 1, each mounting area 3, can flexibly adjust the operating range for batch production, and can increase output.

[0027] Embodiment 3: This embodiment provides a batch packaging process for sensors, which uses a batch packaging structure for sensors in Embodiment 1 or Embodiment 2 for packaging, and includes the following steps: Dispense glue and place the sensor chip 4 on the packaging station of the substrate 1; Covering the side of the substrate 1 provided with the mounting area 3 with a packaging layer 6 and curing the same; Perform wire bonding process inside each package shell; Glue is dispensed on the semi-finished sensor after the wire bonding, the packaging cover 2 is aligned with the substrate 1, the window cover 8 is aligned with the packaging station one by one, the second positioning hole 10 is positioned opposite to the first positioning hole 5, the positioning pin 11 is inserted into the first positioning hole 5 and the second positioning hole 10, the substrate 1 and the packaging cover 2 are fixed, the packaging cover 2 is bonded to the substrate 1, and then cured; Cutting is performed along the gaps between the window covers 8 to finally obtain a single finished sensor.

[0028] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A batch packaging structure for sensors, comprising a substrate (1) and a packaging cover (2), characterized in that: The substrate (1) is a windowed substrate (1), a mounting area (3) is provided at the window position of the substrate (1), the mounting area (3) is divided into a plurality of packaging stations arranged in a rectangular array, the substrate (1) is provided with first positioning holes (5) on two opposite sides of the mounting area (3), and the packaging stations are used to install sensor chips (4); a side of the substrate (1) provided with the mounting area (3) is connected to a packaging layer (6), the packaging layer (6) comprises a plurality of packaging tube shells, and the packaging tube shells correspond to the packaging stations one by one; The packaging cover (2) comprises a cover plate area (7), the cover plate area (7) is provided with a plurality of window covers (8) arranged in a rectangular array, the window covers (8) correspond to the packaging stations one by one, the window covers (8) are protrudingly arranged, a window is formed on the window cover (8), a waterproof film (9) is affixed to the window, the packaging cover (2) is provided with second positioning holes (10) on two opposite sides of the installation area (3), the second positioning holes (10) are opposite to the first positioning holes (5), and a side of the packaging cover (2) away from the protruding direction of the window covers (8) is bonded to a side of the substrate (1) provided with the packaging stations.

2. A batch packaging structure for sensors according to claim 1, characterized in that: The material of the package shell is oxidized resin.

3. A batch packaging structure for sensors according to claim 1, characterized in that: A plurality of cutting lines are drawn on the side of the packaging cover (2) away from the substrate (1), and the cutting lines pass through the transverse gaps and longitudinal gaps between the plurality of window covers (8).

4. A batch packaging structure for sensors according to claim 1, characterized in that: There are several installation areas (3).

5. The batch packaging structure for sensors according to claim 1, characterized in that: The substrate (1) and the packaging cover (2) have the same shape and size.

6. The batch packaging structure for sensors according to claim 1, characterized in that: The sensor chip (4) is pasted on the packaging station.

7. A batch packaging process for sensors, characterized in that: The method of packaging a sensor using any one of claims 1 to 6 comprises the following steps: Dispensing glue and placing a sensor chip (4) on a packaging station of the substrate (1); Covering a side of the substrate (1) provided with the mounting area (3) with a packaging layer (6), and curing the surface; Perform wire bonding process inside each package shell; Dispensing glue on the semi-finished sensor after the wire bonding, aligning the packaging cover (2) with the substrate (1), making the window cover (8) correspond to the packaging station one by one, making the second positioning hole (10) and the first positioning hole (5) opposite to each other, bonding the packaging cover (2) to the substrate (1), and curing; Cutting is performed along the gaps between the window covers (8) to finally obtain a single finished sensor.

8. A batch packaging process for sensors according to claim 7, characterized in that: The substrate (1) and the packaging cover (2) are made of the same material, and the window cover 8 is arranged in the same manner as the packaging station array.

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