Display panel and display device

Abstract

The invention relates to a display panel and a display device. The display panel comprises a first substrate; a first buffer layer; the first substrate is located on one side of the first substrate; a second substrate; the first buffer layer is located on one side, deviating from the first substrate, of the first buffer layer; a second buffer layer; the first substrate is located on one side, deviating from the first substrate, of the second substrate; wherein the display panel comprises a display area and a non-display area; the non-display area surrounds the display area; the non-display area comprises a cutting area; the cutting area comprises a cutting channel; and the second buffer layer in the cutting area is provided with a first groove. Connection between the cutting position and the display area is weakened through the first groove, the situation that cracks extend to the display area is improved, rainbow lines of the display panel are reduced, and the display effect is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] When manufacturing a display panel, it is necessary to cut the display panel motherboard into individual panels, and then cut and trim the individual panels again to obtain a display panel that meets the required shape.

[0003] When the display panel is cut for the second time, the cutting path is closer to the display area of ​​the display panel, and the energy generated by the laser can easily cause the film layer on the substrate in the display area to fall off. To solve this problem, a buffer layer is added, and the downward stress of the buffer layer itself is used to apply force to other film layers and the substrate to reduce the problem of film layer falling off. However, this also means that when cutting the panel, the buffer layer needs to be cut, and cracks will appear on the added buffer layer. Because the buffer layer extends to the display area, the cracks may extend to the display area, and light will be reflected when it hits the cracks, causing rainbow patterns on the display panel, affecting the display effect. Summary of the invention

[0004] In order to solve the above technical problems, the present disclosure provides a display panel and a display device.

[0005] In a first aspect, the present disclosure provides a display panel, comprising:

[0006] a first substrate;

[0007] A first buffer layer; located on one side of the first substrate;

[0008] a second substrate; located on a side of the first buffer layer facing away from the first substrate;

[0009] A second buffer layer; located on a side of the second substrate facing away from the first substrate;

[0010] Wherein, the display panel includes a display area and a non-display area; the non-display area surrounds the display area; the non-display area includes a cutting area; the cutting area includes a cutting path; the second buffer layer in the cutting area is provided with a first groove.

[0011] In a second aspect, the present disclosure further provides a display device, comprising a display panel as described in any one of the first aspects.

[0012] Compared with the prior art, the technical solution provided by the present invention has the following advantages:

[0013] The display panel provided by the present disclosure includes: a first substrate; a first buffer layer; located on one side of the first substrate; a second substrate; located on the side of the first buffer layer away from the first substrate; a second buffer layer; located on the side of the second substrate away from the first substrate; wherein the display panel includes a display area and a non-display area; the non-display area surrounds the display area; the non-display area includes a cutting area; and the second buffer layer in the cutting area is provided with a first groove. When preparing the display panel, the edge of the display panel needs to be cut, so the display panel is provided with a cutting area, the cutting area is located in the non-display area of ​​the display panel, the non-display area surrounds the display area, and the non-display area is connected to the display area. In order to prevent the cracks generated by the cutting from spreading toward the display area through the second buffer layer, the present disclosure provides a first groove in the second buffer layer in the cutting area, and the connection between the cutting position and the display area is weakened by the first groove, so as to improve the situation that the cracks extend to the display area, and avoid the cracks in the display area from being emitted when the light is irradiated, resulting in rainbow lines on the display panel, thereby improving the display effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0016] Figure 1 A schematic diagram of a display panel structure provided by an embodiment of the present disclosure;

[0017] Figure 2 A method provided in the embodiment of the present disclosure Figure 1 A magnified schematic diagram of the middle A1 region;

[0018] Figure 3 A method for providing an embodiment of the present disclosure Figure 2 A schematic cross-sectional view of the display panel taken at B1B2;

[0019] Figure 4 A method for providing an embodiment of the present disclosure Figure 2 A schematic cross-sectional view of the display panel taken at B3B4;

[0020] Figure 5 Another embodiment of the present disclosure provides a Figure 2 A schematic cross-sectional view of the display panel taken at B1B2;

[0021] Figure 6Another embodiment of the present disclosure provides a Figure 2 A schematic cross-sectional view of the display panel taken at B3B4;

[0022] Figure 7 Another embodiment of the present disclosure provides a Figure 2 A schematic cross-sectional view of the display panel taken at B1B2;

[0023] Figure 8 Another embodiment of the present disclosure provides a Figure 2 A schematic cross-sectional view of the display panel taken at B3B4;

[0024] Fig. 9 Another embodiment of the present disclosure provides Figure 1 A magnified schematic diagram of the middle A1 region;

[0025] Fig.10 A method for providing an embodiment of the present disclosure Fig. 9 A schematic cross-sectional view of the display panel taken at B1B2;

[0026] Fig.11 A method for providing an embodiment of the present disclosure Fig. 9 A schematic cross-sectional view of the display panel taken at B3B4;

[0027] Fig.12 Another embodiment of the present disclosure provides Figure 1 A magnified schematic diagram of the middle A1 region;

[0028] Fig.13 Another embodiment of the present disclosure provides Figure 1 A magnified schematic diagram of the middle A1 region;

[0029] Fig.14 Another embodiment of the present disclosure provides a Figure 2 A schematic cross-sectional view of the display panel taken at B3B4;

[0030] Fig.15 A schematic diagram of the structure of a display device provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0031] In order to more clearly understand the above-mentioned objectives, features and advantages of the present disclosure, the scheme of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features in the embodiments can be combined with each other without conflict.

[0032] In the following description, many specific details are set forth to facilitate a full understanding of the present disclosure, but the present disclosure may also be implemented in other ways different from those described herein; it is obvious that the embodiments in the specification are only part of the embodiments of the present disclosure, rather than all of the embodiments.

[0033] The present disclosure provides a display panel. Figure 1 A schematic diagram of a display panel structure provided by an embodiment of the present disclosure is shown in FIG. Figure 2 A method provided in the embodiment of the present disclosure Figure 1 A magnified schematic diagram of the A1 region in the middle. Figure 3 A method for providing an embodiment of the present disclosure Figure 2 A schematic cross-sectional view of the display panel taken at B1B2, Figure 4 A method for providing an embodiment of the present disclosure Figure 2 The cross-sectional view of the display panel taken at B3B4 in FIG. Figure 1 and Figure 4 The display panel 100 includes: a first substrate 110; a first buffer layer 120 is located on one side of the first substrate 110; a second substrate 130 is located on the side of the first buffer layer 120 away from the first substrate 110; a second buffer layer 140 is located on the side of the second substrate 130 away from the first substrate 110; wherein the display panel 100 includes a display area 10 and a non-display area 20; the non-display area 20 surrounds the display area 10; the non-display area 20 includes a cutting area 21; the cutting area 21 includes a cutting line L1; the second buffer layer 140 of the cutting area 21 is provided with a first groove 30.

[0034] Exemplarily, the display panel 100 includes a first substrate 110 and a first buffer layer 120, and the first buffer layer 120 is located on one side of the first substrate 110. The first substrate 110 can be a flexible substrate, such as PI (Polyimide), and the first buffer layer 120 is an inorganic layer, and the specific material can be selected according to actual needs. In order to improve the reliability between the film layers of the display panel 100, a second substrate 130 is arranged on the side of the first buffer layer 120 away from the first substrate 110 to better isolate external substances such as water and oxygen, and play a protective buffering role. Among them, the material of the second substrate 130 can be the same as that of the first substrate 110, or it can be different from it.

[0035] If the display panel 100 only includes the first substrate 110, the first buffer layer 120 and the second substrate 130, when cutting, the laser directly cuts from the second substrate 130, and the stress of the second substrate 130 itself is small and diverges to the surroundings. Therefore, the energy generated by the laser will cause the bonding ability between the second substrate 130 and the first buffer layer 120 to weaken, resulting in film peeling. In order to avoid the above problems, the display panel 100 is also provided with a second buffer layer 140, which is located on the side of the second substrate 130 away from the first substrate 110. The second buffer layer 140 is also an inorganic layer, which can be the same as the material used in the first buffer layer 120, or different. The specific material can be selected according to actual needs. The second buffer layer 140 itself has a large stress, and the stress direction points to the first substrate 110 along the Y direction, where the X direction is parallel to the first substrate 110 and the Y direction is perpendicular to the first substrate 110. After the second buffer layer 140 is combined with the second substrate 130, the second buffer layer 140 will apply a force perpendicular to the thickness direction of the two film layers to the second substrate 130, so that the second buffer layer 140 and the second substrate 130 are tightly combined. At the same time, the second substrate 130 and the first buffer layer 120 are more tightly combined, which improves the film layer peeling situation during the cutting process.

[0036] The display panel 100 includes a display area 10 and a non-display area 20. The display area 10 is provided with structures such as a pixel driving circuit and a light-emitting element to play a display role. The non-display area 20 surrounds the display area 10. The non-display area 20 includes a cutting area 21. The cutting area 21 includes a cutting path L1, that is, when the display panel 100 is cut and trimmed, the laser will cut along the cutting path L1. However, the second buffer layer 140 extends from the non-display area 20 to the display area 10. When the laser cuts the second buffer layer 140, the residual energy will cause cracks in the contacted second buffer layer 140, and the cracks will also extend from the non-display area 20 to the display area 10. After cracks appear in the second buffer layer 140 of the display area 10, when light is irradiated to the display area 10, it will be reflected at the crack, resulting in a rainbow pattern phenomenon, which affects the display effect of the display panel. Therefore, a first groove 30 is provided in the second buffer layer 140, referring to Figure 2-Figure 4 ,in, Figure 2 is a part of the cutting area 21, Figure 3 and Figure 4 The cross-sectional view of different parts of the cutting area shows that the connection between the cutting line L1 and the display area is weakened by the first groove 30, thereby improving the problem of cracks extending from the non-display area 20 to the display area 10 and reducing cracks in the display area 10. At least part of the second buffer layer 140 needs to be retained at the cutting line L1 position, so that when cutting along the cutting line L1, the laser does not directly contact the second substrate 130, thereby avoiding the peeling problem between the second substrate 130 and the first buffer layer 120.

[0037] In an embodiment of the present disclosure, since the edge of the display panel needs to be cut when preparing the display panel, a cutting area is provided in the display panel. The cutting area is located in the non-display area of ​​the display panel. The non-display area surrounds the display area and is connected to the display area. To prevent cracks generated by the cutting from spreading toward the display area via the second buffer layer, the present disclosure provides a first groove in the second buffer layer in the cutting area. The first groove weakens the connection between the cutting position and the display area, improves the situation where the cracks extend toward the display area, and prevents the cracks in the display area from emitting light when exposed to light, causing rainbow patterns on the display panel, thereby improving the display effect of the display panel.

[0038] Optionally, first grooves may be provided on both sides of the cutting path (the side close to the display area and the side away from the display area), for example Figure 3 and 4 However, in other embodiments, the first groove may be provided only on one side of the cutting path close to the display area. The provision of the first groove on both sides of the cutting path provided in the present disclosure is only an optional implementation, which can be selected according to actual needs.

[0039] In some embodiments, continue to refer to Figure 1-Figure 4 In the cutting area 21 , the area of ​​the region where the first groove 30 is provided is smaller than the area of ​​the region where the first groove 30 is not provided.

[0040] Exemplarily, the second buffer layer 140 is provided in the cutting area 21 to make the film layer between the second buffer layer 140 and the first substrate 110 more tightly connected by the stress in the second buffer layer 140 pointing to the first substrate 110, so as to avoid the film layer between the second buffer layer 140 and the first substrate 110 from being debonded and peeled off. The stress magnitude of the second buffer layer 140 itself corresponds to the size of its area. The larger the area covered by the second buffer layer 140, the larger the range of stress applied in the direction of the first substrate 110, and the greater the stress. If the area of ​​the second buffer layer 140 is small, the area where stress can be applied in the direction of the first substrate 110 will be reduced, and the stress will also be reduced, and the peeling problem between the film layers cannot be effectively improved. When setting the first groove 30, it is necessary to etch the second buffer layer 140, and the position for setting the second buffer layer 140 will be reduced. Therefore, it should be ensured that the area of ​​the region where the first groove 30 is set is smaller than the area of ​​the region where the first groove 30 is not set, so as to avoid the region where the first groove 30 is set being too large and the area of ​​the retained second buffer layer 140 being too small, resulting in the stress of the second buffer layer 140 itself being insufficient to make the film layer between the second buffer layer 140 and the first substrate 110 more tightly connected, and the problem of film debonding and peeling still occurs.

[0041] It should be noted that the second buffer layer has a certain thickness. The second buffer layer has different thicknesses and different internal stresses. Therefore, in the embodiment of the present disclosure, even if the first groove does not penetrate the second buffer layer, it is still attributed to the area where the first groove is set.

[0042] In some embodiments, Figure 5 Another embodiment of the present disclosure provides a Figure 2 A schematic cross-sectional view of the display panel taken at B1B2, Figure 6 Another embodiment of the present disclosure provides a Figure 2 The cross-sectional view of the display panel taken at B3B4 in FIG. Figure 5 and Figure 6 , and combined with Figure 1 and Figure 2 , along a direction perpendicular to the first substrate 110 , a depth of the first groove 30 is less than a thickness of the second buffer layer 140 .

[0043] Exemplarily, the X direction is a direction parallel to the first substrate 110, and the Y direction is a direction perpendicular to the first substrate 110. When the first groove 30 is set on the second buffer layer 140 in the cutting area 21 along the Y direction, the depth of the first groove 30 can be less than the thickness of the second buffer layer 140. For example, the thickness of the second buffer layer 140 is g1, and the depth of the first groove 30 is h1, and h1<g1. The first groove 30 does not completely isolate the connection between the second buffer layer 140 around the cutting line L1 and the display area 10, but the second buffer layer 140 at the position of the first groove 30 becomes thinner, which can also improve the extension of the crack from the cutting area 21 to the display area 10 to a certain extent, reduce the cracks in the display area 10, and avoid the cracks in the display area from emitting when the light is irradiated, resulting in rainbow lines on the display panel, thereby improving the display effect of the display panel. In addition, the first groove 30 still retains a partial thickness of the second buffer layer 140, which increases the stress of the second buffer layer 140 and can apply greater stress to one side of the second substrate 130, making the film layer between the second buffer layer 140 and the first substrate 110 more tightly connected, thereby better improving the problem of film debonding and peeling.

[0044] It should be noted that the embodiment of the present disclosure does not limit the specific depth of the first groove, as long as it can improve film peeling and crack diffusion to the display area. The specific depth can be set according to actual needs.

[0045] In some embodiments, continue to refer to Figure 1-Figure 4 , along a direction perpendicular to the first substrate 110 , the first groove 30 penetrates the second buffer layer 140 .

[0046] Exemplarily, the X direction is a direction parallel to the first substrate 110, and the Y direction is a direction perpendicular to the first substrate 110. When the first groove 30 is arranged on the second buffer layer 140 in the cutting area 21 along the Y direction, the first groove 30 penetrates the second buffer layer 140, that is, the depth of the first groove 30 is equal to the thickness of the second buffer layer 140. For example, the thickness of the second buffer layer 140 is g1, and the depth of the first groove 30 is h1, and h1=g1. Figure 2 It can be seen that when cutting along the cutting line L1, the first groove 30 can completely isolate the connection between the second buffer layer 140 around the cutting line L1 and the display area 10. Therefore, during laser cutting, even if cracks appear in the second buffer layer 140 around the cutting line L1, they cannot extend to the display area 10, thus avoiding cracks in the display area 10 and causing rainbow patterns on the display panel, thereby improving the display effect of the display panel.

[0047] In some embodiments, Figure 7 Another embodiment of the present disclosure provides a Figure 2 A schematic cross-sectional view of the display panel taken at B1B2, Figure 8 Another embodiment of the present disclosure provides a Figure 2 The cross-sectional view of the display panel taken at B3B4 in FIG. Figure 7 and Figure 8 , and combined with Figure 1 and Figure 2 , along the direction of the cutting line L1 pointing to the display area 10 , the depth of the first groove gradually increases.

[0048] Exemplarily, the X direction is a direction parallel to the first substrate 110, the Y direction is a direction perpendicular to the first substrate 110, C1 represents a direction from the cutting line L1 to the display area 10, and C2 represents a direction from the cutting line L1 to the edge area of ​​the panel cut off. Along the direction from the cutting line L1 to the display area 10, the depth of the first groove 30 gradually increases, that is, the depth of the first groove 30 close to the cutting line L1 is the smallest, and the depth of the first groove 30 gradually increases as it gradually moves away from the cutting line L1 and approaches the display area 10. When cutting the display panel, the cutting is performed at the cutting line L1, so this area is more susceptible to the influence of the laser and causes the film layer to peel off. Reducing the depth of the first groove 30 at the cutting line L1 is equivalent to a larger thickness of the second buffer layer 140 retained here. Accordingly, the stress of the second buffer layer 140 here is also larger, and the force applied to the side where the second substrate 130 is located is larger, which can make the second buffer layer 140 and the first substrate 110 more closely bonded, and improve the problem of film layer peeling. As it moves away from the cutting line L1 and closer to the display area 10, the depth of the first groove 30 gradually increases, and the thickness of the second buffer layer 140 connecting the cutting line L1 area and the display area 10 becomes thinner, which can better weaken the connection between the cutting line L1 area and the display area 10, improve the situation where the cracks in the cutting area 21 extend to the display area 10, reduce the cracks in the display area 10, and avoid the cracks in the display area from emitting light, resulting in rainbow patterns on the display panel, thereby improving the display effect of the display panel.

[0049] Optionally, the first groove 30 may be provided in the direction C2 with the cutting line L1 as the center, and the depth of the first groove 30 is not limited, and may be as follows: Figure 7 and Figure 8 As shown, the depth gradually increases along the cutting line L1 in the direction of the cut panel edge area. In other embodiments, if the first groove 30 is provided on the side, the depth of the first groove 30 may also be unlimited.

[0050] In some embodiments, Fig. 9 Another embodiment of the present disclosure provides Figure 1 A magnified schematic diagram of the A1 region in the middle. Fig.10 A method for providing an embodiment of the present disclosure Fig. 9 A schematic cross-sectional view of the display panel taken at B1B2, Fig.11 A method for providing an embodiment of the present disclosure Fig. 9 The cross-sectional view of the display panel taken at B3B4 in FIG. Figures 9 to 11 , and combined with Figure 1 , the non-display area 20 also includes a crack prevention area 22;

[0051] The second buffer layer 140 of the crack prevention area 22 is provided with a second groove 40 ; the depth of the second groove 40 is less than the thickness of the second buffer layer 140 .

[0052] Exemplarily, the non-display area 20 is also provided with an anti-crack area 22. In the display panel 100 with such a structure, an anti-crack area 22 is provided between the display area 10 and the cutting area 21 on the side of the cutting line L1 close to the display area 10. The second buffer layer 140 of the anti-crack area 22 is provided with a second groove 40. The depth of the second groove 40 is h2, and the thickness of the second buffer layer 140 is g1. The anti-crack area 22 is also used to prevent the cracks on the second buffer layer 140 in the cutting area 21 from extending to the display area 10 when the display panel is cut. Therefore, the depth of the second groove 40 is less than the thickness of the second buffer layer 140, that is, g1<h2, which further improves the problem of crack extension on the display panel film layer, avoids the appearance of rainbow lines on the display panel, and improves the display effect of the display panel.

[0053] Optionally, the edge of the non-display area 20 is also provided with a crack prevention area 22, which can be Fig.10 and Fig.11 A second groove 40 is provided, and the depth of the second groove 40 may also be less than the thickness of the second buffer layer 140. The specific setting method can be selected according to actual needs, and the present disclosure does not make specific restrictions on this aspect.

[0054] In some embodiments, Fig.12 Another embodiment of the present disclosure provides Figure 1 A magnified schematic diagram of the A1 region in the middle, see Fig.12 , the shape of the first groove 30 is a curve or a broken line;

[0055] A plurality of first grooves 30 are arranged along a direction perpendicular to the cutting line L1 .

[0056] For example, Figure 2 A plurality of first grooves 30 are provided in the display panel 100. The shape of the first grooves 30 is a curve. The extension direction of the first grooves 30 is parallel to the direction of the cutting line L1. When cutting the display panel 100, the laser cuts along the cutting line L1, which will overlap with the first grooves 301, but cannot completely cut off the connection between the second buffer layer 140 around the cutting line L1 and the display area 10. Therefore, a first groove 302 is also provided in the direction perpendicular to the cutting line L1. The first groove 302 completely cuts off the connection between the second buffer layer 140 around the cutting line L1 and the second buffer layer 140 of the display area 10. The first grooves 30 at least include the first grooves 301 and the first grooves 302 at different positions. In addition, the first grooves 30 can also be set as a broken line. The specific principle is similar to that of the curve, which will not be repeated.

[0057] When the laser cuts along the cutting line L1, it will cut in the shape of a straight line. If the first groove 30 is set as a straight line, the laser will easily cut along the first groove 30 when it deviates, resulting in direct cutting of the second substrate 130, which will affect the bonding effect of the film layer. Therefore, the shape of the first groove 30 is set as a curve or a broken line, which is different from the straight line formed during cutting, so as to avoid deviation in cutting.

[0058] In some embodiments, Fig.13 Another embodiment of the present disclosure provides Figure 1 A magnified schematic diagram of the A1 region in the middle, see Fig.13 The first groove 30 forms at least one closed pattern 31, and the closed pattern 31 is arranged along the extending direction of the cutting line L1.

[0059] Exemplarily, a first groove 30 is provided, and the first groove 30 forms at least one closed pattern 31. Fig.13 The closed pattern 31 includes four closed patterns 31, which are arranged along the extension direction of the cutting path L1, and the closed pattern 31 is separated from the other second buffer layers 140 by the first groove 30. When the laser cuts along the cutting path L1, it will pass through the closed pattern 31, so it will not directly contact the second substrate 130. The stress of the closed pattern 31 can make the film layer on the side where the second substrate 130 is located more tightly connected to prevent the film layer from falling off. In addition, during the cutting process, even if cracks are formed on the closed pattern 31, each closed pattern 31 is isolated from the second buffer layer 140 of the display area 10, which can improve the extension of the cracks to a certain extent, avoid the second buffer layer 140 of the display area 10 from cracks, cause rainbow patterns on the display panel, and improve the display effect of the display panel. In other embodiments, if the depth of the first groove 30 is the same as the thickness of the second buffer layer 140, the first groove 30 can completely cut off the connection between the closed pattern 31 and the second buffer layer 140 of the display area 10, and the effect of improving the extension of the cracks is best. Furthermore, with this structure, it is only necessary to provide the first groove 30 near the cutting line L1 , which reduces the area required for the first groove 30 and is more conducive to reducing the frame area of ​​the display panel.

[0060] In some embodiments, Fig.14 Another embodiment of the present disclosure provides a Figure 2 In the cross-sectional schematic diagram of the display panel taken along line B3B4, the opening size of the first groove 30 gradually increases in the direction away from the first substrate 110.

[0061] Exemplarily, the opening size of the first groove 30 is smaller in the direction close to the first substrate 110, so the contact area between the second buffer layer 140 and the second substrate 130 is larger, and the opening size of the first groove 30 is larger in the direction away from the first substrate 110. In the direction away from the first substrate 110, the opening size of the first groove 30 gradually increases, and the preparation process is easier. When the first groove 30 is etched in the current manufacturing process, the side wall of the first groove 30 has a certain angle, so the shape of the first groove 30 provided in the embodiment of the present disclosure will be formed, and the opening sizes at different positions are different. Because the contact area between the second buffer layer 140 and the second substrate 130 is larger, the second buffer layer 140 can provide greater stress for the film layer on the side where the second substrate 130 is located, thereby improving the problem of film layer shedding.

[0062] It should be noted that the embodiment of the present disclosure does not specifically limit the specific shape of the first groove and the size of the opening of the first groove, which can be set according to actual needs.

[0063] In some embodiments, reference Figure 2 , the opening size of the first groove 30 is less than or equal to 1 μm.

[0064] Exemplarily, the opening size of the first groove 30 is d1. During the preparation process, the opening size of the first groove 30 should be controlled within a certain range to avoid the opening being too large, which will affect the area of ​​the second buffer layer in the cutting area, resulting in the second buffer layer area being too small, and the stress being reduced, and thus the connection effect of each film layer cannot be improved, which easily causes the problem of debonding and peeling between the film layers. Limiting the opening size of the first groove 30, for example, making its opening size less than or equal to 1μm, will not affect the stress of the second buffer layer. The smaller the opening size, the larger the area of ​​the second buffer layer, and the greater the stress it has, so that the film layer on the second substrate side is more tightly connected, avoiding the risk of film layer falling off.

[0065] It should be noted that the embodiment of the present disclosure does not impose any specific restrictions on the opening size and process of the first groove, which can be selected according to actual needs.

[0066] The present disclosure also provides a display device, including a display panel as in any one of the above display panel embodiments. Therefore, the display device has the technical features of the display panel provided in the embodiments of the present disclosure, and can achieve the beneficial effects of the display panel provided in the embodiments of the present disclosure. For the similarities, reference can be made to the above description of the display panel provided in the embodiments of the present disclosure, and no further description is given here.

[0067] For example, Fig.15 Schematic diagram of a display device provided by an embodiment of the present disclosure. Fig.15As shown, the display device provided by the embodiment of the present disclosure includes the display panel 100 provided by any of the above embodiments of the present disclosure. Fig.15 The embodiments provided only take a mobile phone as an example to illustrate the display device. It can be understood that the display device provided in the embodiments of the present application can be any electronic product with a display function, including but not limited to the following categories: mobile phones, televisions, laptops, desktop displays, tablet computers, digital cameras, smart bracelets, smart glasses, car displays, medical equipment, industrial control equipment, touch interactive terminals, etc. The embodiments of the present invention do not specifically limit this.

[0068] The display device provided by the embodiment of the present disclosure includes the above-mentioned display panel, and thus can also solve the same technical problems as the above-mentioned display panel embodiment and achieve the same technical effects, which will not be repeated here.

[0069] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0070] The above description is only a specific embodiment of the present disclosure, so that those skilled in the art can understand or implement the present disclosure. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to the embodiments described herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display panel, characterized in that: include: a first substrate; A first buffer layer; located on one side of the first substrate; a second substrate; Located on a side of the first buffer layer facing away from the first substrate; A second buffer layer; located on a side of the second substrate facing away from the first substrate; Wherein, the display panel includes a display area and a non-display area; the non-display area surrounds the display area; the non-display area includes a cutting area; the cutting area includes a cutting path; the second buffer layer in the cutting area is provided with a first groove.

2. The display panel according to claim 1, characterized in that: In the cutting region, an area of ​​a region where the first groove is provided is smaller than an area of ​​a region where the first groove is not provided.

3. The display panel according to claim 1, characterized in that: Along a direction perpendicular to the first substrate, a depth of the first groove is less than a thickness of the second buffer layer.

4. The display panel according to claim 1, characterized in that: The first groove penetrates the second buffer layer along a direction perpendicular to the first substrate.

5. The display panel according to claim 1, characterized in that: Along the direction from the cutting road to the display area, the depth of the first groove gradually increases.

6. The display panel according to claim 1, characterized in that: The non-display area also includes a crack prevention area; The second buffer layer in the crack prevention zone is provided with a second groove; the depth of the second groove is less than the thickness of the second buffer layer.

7. The display panel according to claim 1, characterized in that: The shape of the first groove is a curve or a broken line; A plurality of first grooves are arranged along a direction perpendicular to the cutting path.

8. The display panel according to claim 1, characterized in that: The first groove forms at least one closed pattern, and the closed pattern is arranged along the extending direction of the cutting street.

9. The display panel according to claim 1, characterized in that: Along the direction away from the first substrate, the opening size of the first groove gradually increases.

10. The display panel according to claim 1, characterized in that: The opening size of the first groove is less than or equal to 1 μm.

11. A display device, characterized in that: The invention comprises a display panel as claimed in any one of claims 1 to 10.

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