Display device and display

Abstract

This application provides a display device and a display. The display device includes a protection module, an integrated circuit module, and a display panel. The integrated circuit module is disposed on the display panel. The protection module is disposed on the integrated circuit module and covers the integrated circuit module. The protection module includes at least one hollow structure. The orthographic projection of the hollow structure onto the display panel overlaps with the orthographic projection of the integrated circuit module onto the display panel. By providing a hollow structure on the protection module, the bonding area between the protection module and the integrated circuit module can be reduced, thus mitigating the noise phenomenon of the display device.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display device and a display. Background Technology

[0002] In current display device module designs, to improve the overall radio frequency (RF) interference situation of the display, a chip cover tape is applied over the driver chip and flexible printed circuit (FPC) to provide shielding and prevent the components on the FPC and the driver chip from affecting the RF signal. However, due to the height differences (typically understood as the step difference between two planes) on the flexible circuit board, i.e., the components on the flexible circuit board protrude or are uneven, the chip cover tape can easily become incompletely applied at locations with larger height differences on the flexible circuit board. Figure 1a and Figure 1b As shown, a loose bonding phenomenon can also occur between the driver chip and the chip protective film, but it occurs less frequently than on flexible circuit boards. Loose bonding will cause abnormal noises when pressing the corresponding position, and the loose bonding area will further expand over time and due to vibrations during transportation, such as... Figure 1c As shown, this can lead to increased abnormal noise, which may affect the diagnosis of malfunctions in the display device. Summary of the Invention

[0003] The purpose of this application is to provide a display device and a monitor to reduce the abnormal noise phenomenon of the display device. The specific technical solution is as follows:

[0004] In a first aspect, embodiments of this application provide a display device, the display device comprising:

[0005] Protection module, integrated circuit module and display panel;

[0006] The integrated circuit module is disposed on the display panel; the protection module is disposed on the integrated circuit module and covers the integrated circuit module;

[0007] The protection module includes at least one hollow structure;

[0008] The hollow structure and the integrated circuit module overlap in their projections onto the display panel.

[0009] In one possible implementation, the hollow structures are arranged in the gaps between the components of the integrated circuit module.

[0010] In one possible implementation,

[0011] The hollow structure includes at least one cavity; the cavity is a cuboid, cylinder, triangular prism, or "building block cross axis".

[0012] In one possible implementation,

[0013] The cavity is filled with a cushioning material; the cushioning material is foam, silicone gel, or thermoplastic polyester.

[0014] In one possible implementation,

[0015] The hollow structure is a cut-line structure; wherein, the cut-line structure is a grid structure formed by alternating cavities and non-cavities, and the cavities in the cut-line structure are cuboids, cylinders or triangular prisms.

[0016] In one possible implementation,

[0017] The cavity of the cut line structure is filled with a cushioning material; the cushioning material is foam, silicone gel, or thermoplastic polyester.

[0018] In one possible implementation,

[0019] A portion of the integrated circuit module is exposed to the cutout structure; the cutout structure is perpendicular to the integrated circuit module.

[0020] In one possible implementation, the display device further includes a buffer layer;

[0021] The buffer layer is disposed between the integrated circuit module and the protection module, and the buffer layer covers the integrated circuit module;

[0022] The material of the buffer layer is foam, silicone gel, or thermoplastic polyester.

[0023] In one possible implementation, the integrated circuit module includes a driver chip and a flexible circuit board;

[0024] The driving chip and the flexible circuit board are disposed on the display panel, and the driving chip and the flexible circuit board have a first gap;

[0025] The protection module is disposed on the driver chip and the flexible circuit board, and the protection module covers the driver chip and the flexible circuit board.

[0026] In one possible implementation, the display device further includes:

[0027] Glass cover plate, optical adhesive layer, polarizer;

[0028] The optical adhesive layer is disposed on the glass cover plate, the polarizer is disposed on the side of the optical adhesive layer away from the glass cover plate, the display panel is disposed on the side of the polarizer away from the glass cover plate, and the integrated circuit module is disposed on the side of the display panel away from the glass cover plate.

[0029] In one possible implementation, the integrated circuit module includes a driver chip and a flexible circuit board;

[0030] The optical adhesive layer is disposed on the glass cover plate, the polarizer is disposed on the side of the optical adhesive layer away from the glass cover plate, the display panel is disposed on the side of the polarizer away from the glass cover plate, the driving chip and the flexible circuit board are disposed on the side of the display panel away from the glass cover plate, and the driving chip and the flexible circuit board have a first gap; the protection module is disposed on the driving chip and the flexible circuit board, and the protection module covers the driving chip and the flexible circuit board.

[0031] In one possible implementation, the display device further includes:

[0032] Glass cover plate, optical adhesive layer, polarizer, U-shaped protective film, pressure-sensitive adhesive layer, titanium alloy protective film, first gasket; the display panel is a U-shaped display panel;

[0033] The optical adhesive layer is disposed on the glass cover plate, the polarizer is disposed on the side of the optical adhesive layer away from the glass cover plate, the first part of the U-shaped display panel is disposed on the side of the polarizer away from the glass cover plate, the first part of the U-shaped protective film is disposed on the first part of the U-shaped display panel away from the glass cover plate, the pressure-sensitive adhesive layer is disposed on the first part of the U-shaped protective film away from the glass cover plate, the titanium alloy protective film is disposed on the pressure-sensitive adhesive layer away from the glass cover plate, the first gasket is disposed on the titanium alloy protective film away from the glass cover plate, the second part of the U-shaped protective film is disposed on the first gasket away from the glass cover plate, the second part of the U-shaped display panel is disposed on the second part of the U-shaped protective film away from the glass cover plate, and the integrated circuit module is disposed on the second part of the U-shaped display panel away from the glass cover plate.

[0034] In one possible implementation, the display device further includes: a second pad;

[0035] The second pad is disposed on the outside of the U-shaped portion of the display panel.

[0036] In one possible implementation, the integrated circuit module includes a driver chip and a flexible circuit board;

[0037] The optical adhesive layer is disposed on the glass cover plate. The polarizer is disposed on the optical adhesive layer on the side away from the glass cover plate. The first portion of the U-shaped display panel is disposed on the polarizer on the side away from the glass cover plate. The first portion of the U-shaped protective film is disposed on the first portion of the U-shaped display panel on the side away from the glass cover plate. The pressure-sensitive adhesive layer is disposed on the first portion of the U-shaped protective film on the side away from the glass cover plate. The titanium alloy protective film is disposed on the pressure-sensitive adhesive layer on the side away from the glass cover plate. The first gasket is disposed on the titanium alloy protective film on the side away from the glass cover plate. The second part of the U-shaped protective film is disposed on the side of the first gasket away from the glass cover plate. The second part of the U-shaped display panel is disposed on the side of the second part of the U-shaped protective film away from the glass cover plate. The driving chip and the flexible circuit board are disposed on the side of the second part of the U-shaped display panel away from the glass cover plate, and the driving chip and the flexible circuit board have a first gap. The protection module is disposed on the driving chip and the flexible circuit board, and the protection module covers the driving chip and the flexible circuit board. The second gasket is disposed on the outside of the U-shaped portion of the display panel.

[0038] Secondly, embodiments of this application provide a display, the display including any of the display devices described in the first aspect above.

[0039] Beneficial effects of the embodiments in this application:

[0040] This application provides a display device and a display. The display device includes a protection module, an integrated circuit module, and a display panel. The integrated circuit module is disposed on the display panel. The protection module is disposed on the integrated circuit module and covers the integrated circuit module. The protection module includes at least one hollow structure. The orthographic projection of the hollow structure onto the display panel overlaps with the orthographic projection of the integrated circuit module onto the display panel. By providing a hollow structure on the protection module, the bonding area between the protection module and the integrated circuit module can be reduced, thus mitigating the abnormal noise phenomenon of the display device.

[0041] Of course, implementing any product or method of this application does not necessarily require achieving all of the advantages described above at the same time. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other embodiments can be obtained based on these drawings.

[0043] Figure 1a This is a side view schematic diagram of the first type of stacked display device module in the related technology;

[0044] Figure 1b This is a side view schematic diagram of a second type of stacking of display device modules in related technologies;

[0045] Figure 1c This is a top-view schematic diagram of a display device module viewed from the chip protective film end, according to related technologies.

[0046] Figure 2 A first structural schematic diagram (stacked side view) of the display device provided in the embodiments of this application;

[0047] Figure 3 A second structural schematic diagram (top view) of the display device provided in the embodiments of this application;

[0048] Figure 4a A third structural schematic diagram (top view) of the display device provided in the embodiments of this application;

[0049] Figure 4b A fourth structural schematic diagram (top view) of the display device provided in the embodiments of this application;

[0050] Figure 4c A fifth structural schematic diagram (top view) of the display device provided in the embodiments of this application;

[0051] Figure 5 A sixth structural schematic diagram (top view) of the display device provided in the embodiments of this application;

[0052] Figure 6 A seventh structural schematic diagram (top view) of the display device provided in the embodiments of this application;

[0053] Figure 7 A top view schematic diagram of an eighth structure of the display device provided in the embodiments of this application;

[0054] Figure 8 A ninth structural schematic diagram (stacked side view) of the display device provided in the embodiments of this application;

[0055] Figure 9 A tenth structural schematic diagram (stacked side view) of the display device provided in the embodiments of this application;

[0056] Figure 10 Eleventh structural schematic diagram (stacked side view) of the display device provided in the embodiments of this application;

[0057] Figure 11A twelfth structural schematic diagram (stacked side view) of the display device provided in the embodiments of this application;

[0058] Figure 12 A thirteenth structural schematic diagram (stacked side view) of the display device provided in the embodiments of this application;

[0059] Figure 13 A fourteenth structural schematic diagram (stacked side view) of the display device provided in the embodiments of this application;

[0060] Figure 14 A fifteenth structural schematic diagram (stacked side view) of the display device provided in the embodiments of this application;

[0061] Figure 15 This is a schematic diagram of a display provided in an embodiment of this application. Detailed Implementation

[0062] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art based on this application are within the scope of protection of this application.

[0063] In current display device module designs, in order to improve the radio frequency interference of the entire display, a chip protective film (IC Cover Tape) is applied over the driver chip and flexible printed circuit (FPC) to achieve a shielding effect and prevent the components of the flexible printed circuit and the driver chip from affecting the radio frequency signal.

[0064] However, due to the height differences in flexible circuit boards (a height difference is generally understood as the step difference between two planes), i.e., the components on the flexible circuit board protrude or are uneven, the chip protective film is prone to forming incomplete adhesion at locations with larger height differences on the flexible circuit board, such as... Figure 1a and Figure 1b As shown, a loose bonding phenomenon can also occur between the driver chip and the chip protective film, but it occurs less frequently than on flexible circuit boards. Loose bonding will cause abnormal noises when pressing the corresponding position, and the loose bonding area will further expand over time and due to vibrations during transportation, such as... Figure 1c As shown, this can lead to increased abnormal noise, which may affect the diagnosis of malfunctions in the display device.

[0065] Figure 1a In this case, the driver chip and flexible circuit board are mounted on the display panel. Figure 1a and Figure 1bThis is a side view of the stacked display device modules. Figure 1c This is a top-down view of the display module when viewed from the chip protective film end. Figure 1b and Figure 1c The dotted lines in the image are for illustrative purposes only and do not represent the actual shape or location of the dotted lines. Figure 1c The direction of expansion shown is merely illustrative and does not represent the actual direction of expansion of the virtual sticker.

[0066] To address the aforementioned problems, embodiments of this application provide a display device and a display.

[0067] The display device 1 provided in the embodiments of this application will be described in detail below. See also: Figure 2 (A stacked side view of display device 1) is a first structural schematic diagram of display device 1 provided in an embodiment of this application, wherein display device 1 includes:

[0068] Protection module 11, integrated circuit module 12 and display panel 13;

[0069] The integrated circuit module 12 is disposed on the display panel 13; the protection module 11 is disposed on the integrated circuit module 12, and the protection module 11 covers the integrated circuit module 12;

[0070] The protection module 11 includes at least one hollow structure 111;

[0071] The hollow structure 111 has an overlapping portion in its orthographic projection on the display panel 13 and the integrated circuit module 12 has an overlapping portion in its orthographic projection on the display panel 13.

[0072] The protection module 11 can be a chip protective film, which may include a conductive layer, an insulating layer, a spacer layer, etc. The layers can be bonded to each other with adhesive. The chip protective film can also be bonded to the integrated circuit module 12 with its own adhesive layer.

[0073] In one example, the integrated circuit module 12 may include a driver chip and a flexible circuit board. The driver chip and the flexible circuit board are disposed on the display panel 13, and there is a gap between the driver chip and the flexible circuit board. The protection module 11 covers the driver chip and the flexible circuit board to reduce the impact of the driver chip and the flexible circuit board components on the radio frequency signal.

[0074] When viewing the display device 1 from the protective module 11 end, a portion of the integrated circuit module 12 can be seen through the cutout structure 111, meaning a portion of the integrated circuit module 12 is exposed to the cutout structure 111. The cutout structure 111 may or may not be perpendicular to the integrated circuit module 12.

[0075] The hollow structure 111 may be composed of only one hollow (cavity), or the hollow structure 111 may include multiple hollows (cavities). When the hollow structure 111 includes multiple hollows (cavities), the hollow structure 111 may be a grid structure formed by alternating hollows and non-hollows, or the hollow structure 111 may be other types of hollow structures. For example, the hollow structure 111 may be a "field" - shaped structure composed of 4 cuboid cavities.

[0076] It can be understood that Figure 2 the hollow structure 111 in

[0077] In the embodiments of the present application, by providing the hollow structure 111 on the protection module 11, the bonding area between the protection module 11 and the integrated circuit module 12 can be reduced, and the abnormal sound phenomenon of the display device can be weakened.

[0078] In a possible implementation manner, referring to Figure 3 , Figure 3 which is the first top view schematic diagram of the display device 1 provided by the embodiments of the present application, each of the hollow structures 111 is arranged in the gaps between the components of the integrated circuit module 12.

[0079] The layout of the hollow structure 111 can be flexibly set according to the positions and layout of the components of the integrated circuit module 12, and the shape of each hollow structure 111 can be flexibly set according to the gaps between the components of the integrated circuit module 12. In one example, if the gap between the components is rectangular, the hollow structure 111 can also be set to be rectangular according to the rectangular gap. In one example, if the gap between the components is "cross" - shaped, the hollow structure 111 can also be set to be "cross" - shaped according to the "cross" - shaped gap. In one example, if the gap between the components is curved "S" - shaped, the hollow structure 111 can also be set to be curved "S" - shaped according to the curved "S" - shaped gap.

[0080] Under the same integrated circuit module 12, the more the number of components, the closer the arrangement of the hollow structures 111, and the fewer the number of components, the looser the arrangement of the hollow structures 111.

[0081] It can be understood that Figure 3 uses the "cross" - shaped gap between the components for illustration, Figure 3 uses the protection module 11 including only one hollow structure 111 for illustration, Figure 3 uses the hollow structure 111 composed of only one hollow for illustration.

[0082] It can be understood that the shape of the gap between the components and the shape of the hollow structure 111 in the embodiments of the present application refer to the two - dimensional shape presented when looking down at the display device 1 from the protection module 11 end.

[0083] In this embodiment of the application, by arranging the hollow structures 111 in the gaps between the components of the integrated circuit module 12, the area of ​​the false bonding can be effectively reduced, and the hollow structures 111 can also prevent the expansion of the false bonding. When the display device is pressed, the stress can also be released through the hollow structures 111, thereby reducing the abnormal noise phenomenon of the display device.

[0084] In one possible implementation, see [link to relevant documentation]. Figure 4a , Figure 4b and Figure 4c The hollow structure 111 is composed of a cavity (hollow).

[0085] The cavity can be a cuboid (appearing as a rectangle when viewed from the top of the display device 1 from the end of the protection module 11), a cylinder (appearing as a circle when viewed from the top of the display device 1 from the end of the protection module 11), a triangular prism (appearing as a triangle when viewed from the top of the display device 1 from the end of the protection module 11), or a "building block cross" (appearing as a "+" shape when viewed from the top of the display device 1 from the end of the protection module 11). The cavity can also be other shapes, and this application does not specifically limit them.

[0086] When viewing the display device 1 from above at the protection module 11 end, the two-dimensional shape of the cavity can be straight or curved, and can be flexibly set according to the gaps between the components of the integrated circuit module 12.

[0087] Understandable, Figure 4a The diagram uses a rectangular prism (horizontal) as an example to illustrate the shape of a cavity. Figure 4a The protective module 11 includes three hollow structures 111 as illustrated (each hollow structure 111 consists of a cavity, that is...) Figure 4a The middle protection module 11 includes 3 cavities.

[0088] Figure 4b The diagram uses a cuboid shape (a mixture of vertical and horizontal) as an example. Figure 4b The protective module 11 includes three hollow structures 111 as illustrated (each hollow structure 111 consists of a cavity, that is...) Figure 4b The middle protection module 11 includes 3 cavities.

[0089] Figure 4c The hollow cavity is illustrated using a cuboid shape (horizontally) and a "building block cross axis". Figure 4c The protective module 11 includes three hollow structures 111 as illustrated (each hollow structure 111 consists of a cavity, that is...) Figure 4c The middle protection module 11 includes 3 cavities.

[0090] It is understood that the layout of the cuboid can be horizontal, vertical, or other directions. This application does not impose specific limitations on this, and the same applies to other shapes, which can be flexibly set.

[0091] It is understood that the shapes such as cuboid, cylinder, triangular prism, and "building block cross axis" in the embodiments of this application refer to the three-dimensional shape of the hollow structure 111 (cavity).

[0092] In this embodiment of the application, by providing a cavity on the protection module 11, the abnormal noise phenomenon of the display device can be reduced.

[0093] In one possible implementation, see [link to relevant documentation]. Figure 5 The cavity is filled with a cushioning material.

[0094] based on Figure 4a The structure shown has a cavity filled with cushioning material. This reduces the area of ​​loose contact and also acts as a buffer when the display device is pressed, thus reducing the noise from the display device.

[0095] In this embodiment, by filling the cavity with buffer material, a buffering effect can be achieved when the display device is pressed, thereby reducing the abnormal noise of the display device.

[0096] In one possible implementation, see [link to relevant documentation]. Figure 6 The hollow structure 111 is a cut line structure.

[0097] The term "cutting line" can be understood as follows: when viewed from above the display device 1 at the end of the protection module 11, the hollow structure 111 presents a two-dimensional shape of "cutting line". The three-dimensional shape based on the "cutting line" is a grid structure formed by alternating hollow and non-hollow sections.

[0098] The hollowed-out portion of the "cutting line" structure can be a cuboid (appearing as a rectangle when viewed from the top of the display device 1 from the end of the protection module 11), a cylinder (appearing as a circle when viewed from the top of the display device 1 from the end of the protection module 11), a triangular prism (appearing as a triangle when viewed from the top of the display device 1 from the end of the protection module 11), or other three-dimensional shapes. This application does not specifically limit these shapes.

[0099] Understandable, Figure 6 The structure shown is based on Figure 4a Further improvements were made to the structure shown.

[0100] When viewing the display device 1 from the protection module 11 end, the "cutting line" can be straight or curved. This application does not impose specific limitations on this and can be flexibly set according to the actual situation. The "cutting lines" can be set without intersection or with intersection. This application does not impose specific limitations on this and can be flexibly set according to the actual situation.

[0101] In this embodiment of the application, by designing the hollow structure 111 as a cut-line structure, compared with the hollow structure 111 under the same conditions consisting of only one cavity, not only is the abnormal noise phenomenon of the display device reduced, but the shielding effect of the integrated circuit module 12 is better, and the integrated circuit module 12 has less impact on the radio frequency signal.

[0102] In one possible implementation, see [link to relevant documentation]. Figure 7 The cut line structure is filled with cushioning material.

[0103] based on Figure 6 The structure shown has a cushioning material filled in the cut line structure. The cushioning material can buffer the display device when it is pressed, reducing the abnormal noise of the display device.

[0104] In this embodiment, by filling the cut line structure with cushioning material, a cushioning effect can be achieved when the display device is pressed, thereby reducing the abnormal noise of the display device.

[0105] In one possible implementation, the cushioning material is foam, silicone gel, or thermoplastic polyester (PET).

[0106] The cushioning material can also be other types of materials, as long as it achieves the cushioning effect.

[0107] In one possible implementation, see Figure 8 The display device 1 further includes a buffer layer 14;

[0108] The buffer layer 14 is disposed between the integrated circuit module 12 and the protection module 11; the buffer layer 14 covers the integrated circuit module 12.

[0109] The material of the buffer layer 14 is foam, silicone gel, or thermoplastic polyester.

[0110] Adding a buffer layer 14 to the integrated circuit module 12 can reduce the height difference of the integrated circuit module 12 and reduce the probability of false mounting. Then, a protective module 11 is attached to the buffer layer 14. The hollow structure 111 of the protective module 11 can further reduce the abnormal noise of the display device. At the same time, the material of the buffer layer 14 has good ductility (ductility is the ability of a material to absorb energy during plastic deformation and fracture), which can absorb some stress during pressing, thus playing a buffering role and reducing the abnormal noise of the display device.

[0111] The cushioning material can also be other types of materials, as long as it achieves the cushioning effect.

[0112] In this embodiment, by adding a buffer layer 14 to the integrated circuit module 12, the height difference of the integrated circuit module 12 can be reduced, and the probability of false bonding can be reduced. At the same time, the material of the buffer layer 14 has good plasticity and toughness, which can absorb some stress during the pressing process, play a buffering role, and reduce the abnormal noise phenomenon of the display device.

[0113] In one possible implementation, see Figure 9 The integrated circuit module 12 includes a driver chip 121 and a flexible circuit board 122;

[0114] The driving chip 121 and the flexible circuit board 122 are disposed on the display panel 13, and the driving chip 121 and the flexible circuit board 122 have a first gap.

[0115] The protection module 11 is disposed on the driver chip 121 and the flexible circuit board 122, and the protection module 11 covers the driver chip 121 and the flexible circuit board 122.

[0116] In this embodiment, the hollow structure 111 on the protection module 11 can reduce the bonding area between the protection module 11 and the driver chip 121 and the flexible circuit board 122, thereby reducing the abnormal noise phenomenon of the display device.

[0117] In one possible implementation, see Figure 10 ,based on Figure 2 The structure shown indicates that the display device 1 further includes:

[0118] 15. Glass cover plate; 16. Optical adhesive layer; 17. Polarizing film;

[0119] The optical adhesive layer 16 is disposed on the glass cover plate 15, the polarizer 17 is disposed on the side of the optical adhesive layer 16 away from the glass cover plate 15, the display panel 13 is disposed on the side of the polarizer 17 away from the glass cover plate 15, and the integrated circuit module 12 is disposed on the side of the display panel 13 away from the glass cover plate 15.

[0120] In one possible implementation, see Figure 11 ,based on Figure 10 As shown in the diagram, the integrated circuit module 12 includes a driver chip 121 and a flexible circuit board 122;

[0121] The optical adhesive layer 16 is disposed on the glass cover plate 15, the polarizer 17 is disposed on the side of the optical adhesive layer 16 away from the glass cover plate 15, the display panel 13 is disposed on the side of the polarizer 17 away from the glass cover plate 15, the driving chip 121 and the flexible circuit board 122 are disposed on the side of the display panel 13 away from the glass cover plate 15, and the driving chip 121 and the flexible circuit board 122 have a first gap; the protection module 11 is disposed on the driving chip 121 and the flexible circuit board 122, and the protection module 11 covers the driving chip 121 and the flexible circuit board 122.

[0122] In one possible implementation, see Figure 12 ,based on Figure 2 The structure shown indicates that the display device 1 further includes:

[0123] Glass cover 15, optical adhesive layer 16, polarizer 17, U-shaped protective film 18, pressure-sensitive adhesive layer 19, titanium alloy protective film 20, first gasket 21; the display panel 13 is a U-shaped display panel;

[0124] The optical adhesive layer 16 is disposed on the glass cover plate 15, the polarizer 17 is disposed on the side of the optical adhesive layer 16 away from the glass cover plate 15, the first portion of the U-shaped display panel 13 is disposed on the side of the polarizer 17 away from the glass cover plate 15, the first portion of the U-shaped protective film 18 is disposed on the first portion of the U-shaped display panel 13 away from the glass cover plate 15, the pressure-sensitive adhesive layer 19 is disposed on the first portion of the U-shaped protective film 18 away from the glass cover plate 15, and the titanium alloy protective film 20... The first gasket 21 is disposed on the side of the pressure-sensitive adhesive layer 19 away from the glass cover plate 15, the second part of the U-shaped protective film 18 is disposed on the side of the first gasket 21 away from the glass cover plate 15, the second part of the U-shaped display panel 13 is disposed on the side of the second part of the U-shaped protective film 18 away from the glass cover plate 15, and the integrated circuit module 12 is disposed on the side of the second part of the U-shaped display panel 13 away from the glass cover plate 15.

[0125] In one possible implementation, see Figure 13 ,based on Figure 12 As shown in the diagram, the display device 1 further includes: a second pad 22;

[0126] The second pad 22 is disposed on the outside of the U-shaped portion of the display panel 13.

[0127] In one possible implementation, see Figure 14 ,based on Figure 13 As shown in the diagram, the integrated circuit module 12 includes a driver chip 121 and a flexible circuit board 122;

[0128] The optical adhesive layer 16 is disposed on the glass cover plate 15. The polarizer 17 is disposed on the side of the optical adhesive layer 16 away from the glass cover plate 15. The first portion of the U-shaped display panel 13 is disposed on the side of the polarizer 17 away from the glass cover plate 15. The first portion of the U-shaped protective film 18 is disposed on the first portion of the U-shaped display panel 13 away from the glass cover plate 15. The pressure-sensitive adhesive layer 19 is disposed on the first portion of the U-shaped protective film 18 away from the glass cover plate 15. The titanium alloy protective film 20 is disposed on the side of the pressure-sensitive adhesive layer 19 away from the glass cover plate 15. The first gasket 21 is disposed on the side of the titanium alloy protective film 20 away from the glass cover plate 15. The second portion of the protective film 18 is disposed on the side of the first gasket 21 away from the glass cover plate 15. The second portion of the U-shaped display panel 13 is disposed on the side of the second portion of the U-shaped protective film 18 away from the glass cover plate 15. The driving chip 121 and the flexible circuit board 122 are disposed on the side of the second portion of the U-shaped display panel 13 away from the glass cover plate 15, and the driving chip 121 and the flexible circuit board 122 have a first gap. The protection module 11 is disposed on the driving chip 121 and the flexible circuit board 122, and the protection module 11 covers the driving chip 121 and the flexible circuit board 122. The second gasket 22 is disposed on the outside of the U-shaped portion of the display panel 13.

[0129] This application also provides a display 3, which can be found in the embodiments of this application. Figure 15 The display 3 includes any of the display devices 1 described in the above embodiments.

[0130] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0131] The various embodiments in this specification are described in a related manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the system embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions of the method embodiments.

[0132] The above description is merely a preferred embodiment of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application are included within the scope of protection of this application.

Claims

1. A display device, characterized by comprising: The display device comprises: a protection module, an integrated circuit module and a display panel; the integrated circuit module is arranged on the display panel; the protection module is arranged on the integrated circuit module, and the protection module covers the integrated circuit module; the protection module comprises at least one hollow structure; the hollow structure has an overlapping part in the orthographic projection of the display panel and the orthographic projection of the integrated circuit module on the display panel; each hollow structure is arranged in the gap of the components of the integrated circuit module.

2. The display device according to claim 1, wherein the hollow structure comprises at least one cavity; the cavity is a cuboid, a cylinder or a triangular prism or a "building block cross shaft".

3. The display device according to claim 2, wherein the cavity is filled with a buffer material; the buffer material is foam or silicone gel or thermoplastic polyester.

4. The display device according to claim 1, wherein the hollow structure is a cutting line structure; the cutting line structure is a grid structure formed by alternating cavities and non-cavities, and the cavity in the cutting line structure is a cuboid, a cylinder or a triangular prism.

5. The display device according to claim 4, wherein the cavity of the cutting line structure is filled with a buffer material; the buffer material is foam or silicone gel or thermoplastic polyester.

6. The display device according to claim 1, wherein part of the integrated circuit module is exposed to the hollow structure; the hollow structure is perpendicular to the integrated circuit module.

7. The display device according to claim 1, wherein The display device further comprises a buffer layer; the buffer layer is arranged between the integrated circuit module and the protection module, and the buffer layer covers the integrated circuit module; wherein the material of the buffer layer is foam or silicone gel or thermoplastic polyester.

8. The display device according to claim 1, wherein The integrated circuit module comprises a driving chip and a flexible circuit board; the driving chip and the flexible circuit board are arranged on the display panel, and the driving chip and the flexible circuit board have a first interval; the protection module is arranged on the driving chip and the flexible circuit board, and the protection module covers the driving chip and the flexible circuit board.

9. A display, characterized by The display comprises the display device according to any one of claims 1-8.

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