Driving circuit board assembly and display device

Abstract

The utility model discloses a drive circuit board assembly and a display device, the drive circuit board assembly comprises a circuit board, an electronic device group, a buffer member and a protective layer, the buffer member is fixedly arranged at one thickness side of the circuit board and is arranged at the peripheral side of the corresponding electronic device group at an interval, and the protective layer is fixedly arranged at one side of the electronic device group and the buffer member away from the circuit board. In the thickness direction of the circuit board, the part, where the buffer piece is located, of the protective layer does not protrude out of the part, where the electronic device set is located, of the protective layer. Therefore, when the protective layer is subjected to an acting force, the buffer piece can play a certain buffering role, and meanwhile, the buffer piece can support the protective layer, so that the transition of the protective layer covering the electronic device group, the buffer piece and the circuit board is smoother, the virtual sticking condition of the protective layer is reduced, and the abnormal sound phenomenon of the driving circuit board assembly is weakened.

Description

Technical Field

[0001] This utility model relates to the field of display technology, and in particular to a driver circuit board assembly and a display device. Background Technology

[0002] In current display device designs, a protective layer is applied to the driver circuit board to mitigate radio frequency interference and prevent it from affecting radio frequency signals. However, due to height differences between electronic components on the driver circuit board (a step difference is generally understood as the difference between two planes), the protective layer can easily become loosely attached at locations with significant height differences. This loose attachment can cause the protective layer to deform considerably when pressed, resulting in unusual noises. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a drive circuit board assembly and a display device. By setting a buffer, the buffer can play a certain role in cushioning the deformation of the protective layer. At the same time, the buffer can support the protective layer, so that the transition of the protective layer covering the electronic device assembly, the buffer, and the circuit board is smoother, thereby reducing the problem of the protective layer not adhering properly and thus reducing the abnormal noise phenomenon of the drive circuit board assembly.

[0004] According to a first aspect of the present invention, a drive circuit board assembly includes: a circuit board, at least one group of electronic components, at least one buffer, and a protective layer. The electronic component group protrudes from one side of the thickness of the circuit board and includes at least one electronic component. The buffer is fixed to one side of the thickness of the circuit board and is spaced apart from the outer periphery of the corresponding electronic component group. The protective layer is fixed to the side of the electronic component group and the buffer away from the circuit board and covers the electronic component group, the buffer, and the circuit board. In the thickness direction of the circuit board, the portion of the protective layer at the location of the buffer does not protrude beyond the portion of the protective layer at the location of the electronic component group.

[0005] According to the embodiment of the present invention, in the drive circuit board assembly, buffer members are spaced apart on the outer periphery of the electronic device group, and a protective layer covers the electronic device group, the buffer members, and the circuit board. When the drive circuit board assembly is pressed, the buffer members can buffer the force acting on the protective layer to reduce the deformation of the protective layer, thereby reducing the abnormal noise phenomenon of the drive circuit board assembly. At the same time, the buffer members can also support the protective layer so that the transition of the protective layer covering the electronic device group, the buffer members, and the circuit board is smoother, the protective layer is less likely to rebound, and the protective layer is less likely to detach from the electronic device group, the buffer members, and the circuit board, thereby reducing the loose adhesion of the protective layer and further reducing the abnormal noise phenomenon of the drive circuit board assembly.

[0006] In some embodiments, multiple groups of electronic devices spaced apart along a first direction constitute a device row. Each group of electronic devices includes multiple adjacent electronic devices. The interval between two adjacent groups of electronic devices is greater than the interval between two adjacent electronic devices in the group. The first direction is perpendicular to the thickness direction of the circuit board. In the device row, at least two adjacent groups of electronic devices are provided with a buffer; and / or, at least one side of the device row in the first direction is provided with a buffer.

[0007] In some embodiments, in the second direction, the two ends of the buffer do not extend beyond the corresponding ends of the electronic device group adjacent to it in the first direction, the second direction is perpendicular to the first direction and perpendicular to the thickness direction of the circuit board.

[0008] In some embodiments, the drive circuit board assembly is configured to satisfy at least one of the following conditions: the height of the buffer is H1, the maximum protrusion height of the electronic device group adjacent to the buffer in the first direction is H2, and 0.4≤H1 / H2≤0.8; the dimension of the buffer in the first direction is L1, the maximum protrusion height of the electronic device group adjacent to the buffer in the first direction is H2, and H2≤L1; the dimension of the buffer in the second direction is L2, the dimension of the electronic device group adjacent to the buffer in the first direction in the second direction is L3, and 0.6≤L2 / L3≤1; the second direction is perpendicular to the first direction and perpendicular to the thickness direction of the circuit board.

[0009] In some embodiments, the device rows are multiple rows and spaced apart along the second direction, and a buffer is provided between at least two adjacent rows of device rows. The second direction is perpendicular to the first direction and perpendicular to the thickness direction of the circuit board.

[0010] In some embodiments, corresponding electronic device groups belonging to two adjacent device rows are at least partially facing each other in a second direction, and a buffer is provided between the portions of the two facing each other; and / or, an electronic device group is located between two adjacent electronic device groups in a first direction, and a buffer is provided on the side of the electronic device group facing the corresponding two adjacent electronic device groups.

[0011] In some embodiments, the drive circuit board assembly further includes an adhesive element bonded between the circuit board and the protective layer. The device row has three or more electronic device groups, and buffer elements are provided between any two adjacent electronic device groups. The spacing between at least two adjacent electronic device groups is a first spacing, and the spacing between any other two adjacent electronic device groups is a second spacing. The second spacing is greater than the first spacing, and an adhesive element is provided between adjacent electronic device groups with the second spacing. And / or, an adhesive element is provided on at least one side of the two sides of the device row in the first direction.

[0012] In some embodiments, the second spacing is greater than twice the size of the corresponding buffer in the first direction.

[0013] In some embodiments, in the second direction, the two ends of the adhesive do not extend beyond the corresponding ends of the electronic device group adjacent to it in the first direction, the second direction being perpendicular to the first direction and perpendicular to the thickness direction of the circuit board.

[0014] In some embodiments, an adhesive and a buffer are provided between two adjacent electronic device groups having a second spacing, and / or, at least one side of the device arrangement in the first direction is provided with an adhesive and a buffer, and the drive circuit board assembly is configured to satisfy at least one of the following conditions: the height of the adhesive is H3, the height of the buffer corresponding to the adhesive is H1, and 0.4≤H3 / H1≤0.8; the dimension of the adhesive in the first direction is L4, the dimension of the buffer corresponding to the adhesive in the first direction is L1, and 1≤L4 / L1≤5; the dimension of the adhesive in the second direction is equal to the dimension of the buffer corresponding to it in the second direction.

[0015] In some embodiments, in the first direction, the two ends of the protective layer are respectively fixedly connected to one side of the circuit board thickness.

[0016] In some embodiments, the electronic components are sandwiched between the protective layer and the circuit board, and at least one buffer is sandwiched between the protective layer and the circuit board; and / or, the protective layer is configured as a multilayer structure disposed along the thickness direction of the circuit board, and at least one buffer is sandwiched between two adjacent layers of the protective layer.

[0017] The display device according to a second aspect of the present invention includes a display panel and a driving circuit board assembly according to a first aspect of the present invention, wherein the driving circuit board assembly is disposed on the back side of the display panel and is electrically connected to the display panel.

[0018] According to the second aspect of the present invention, the display device employing the above-described drive circuit board assembly facilitates the reduction of abnormal noise in the display device.

[0019] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0020] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0021] Figure 1 This is a schematic diagram of a drive circuit board assembly according to some embodiments of the present invention;

[0022] Figure 2This is a partial schematic diagram of a drive circuit board assembly according to some embodiments of the present invention;

[0023] Figure 3 yes Figure 1 A schematic diagram of the drive circuit board assembly with the protective layer removed;

[0024] Figure 4 yes Figure 1 Another schematic diagram showing the drive circuit board assembly with the protective layer removed;

[0025] Figure 5 This is another partial schematic diagram of a drive circuit board assembly according to some embodiments of the present invention;

[0026] Figure 6 This is another partial schematic diagram of a drive circuit board assembly according to some embodiments of the present invention;

[0027] Figure 7 This is a schematic diagram of a drive circuit board assembly according to some embodiments of the present invention;

[0028] Figure 8 yes Figure 7 Enlarged view of point A circled in the image;

[0029] Figure 9 This is a schematic diagram of a display device according to some embodiments of the present invention.

[0030] Reference numerals: 1. Driver circuit board assembly; 2. Display device.

[0031] Circuit board 10

[0032] Electronic Components Group 20, Electronic Components 22, Component Row 24

[0033] Buffer 30

[0034] Protective layer 40, first part 41, second part 42, third part 43

[0035] Adhesive component 50

[0036] Display panel 60, display section 62, non-display section 64

[0037] Glass cover 70, optical adhesive layer 71, polarizer 72, under-screen material 73, adhesive layer 74, protective film 75, first protective film 75a, second protective film 75b, flexible circuit board 76. Detailed Implementation

[0038] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0039] The following disclosure provides numerous different embodiments or examples for implementing various structures of the present invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention; however, those skilled in the art will recognize the applicability of other processes and / or the use of other materials.

[0040] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0041] Hereinafter, with reference to the accompanying drawings, a drive circuit board assembly 1 according to a first aspect embodiment of the present invention will be described.

[0042] like Figures 1-4 As shown, the drive circuit board assembly 1 includes: a circuit board 10, at least one set of electronic components 20, at least one buffer 30, and a protective layer 40. The electronic component set 20 protrudes from the thickness side of the circuit board 10 and includes at least one electronic component 22. The buffer 30 is fixed to the aforementioned thickness side of the circuit board 10 and is spaced apart from the outer periphery of the corresponding electronic component set 20. The protective layer 40 is fixed to the side of the electronic component set 20 and the buffer 30 away from the circuit board 10 and covers the electronic component set 20, the buffer 30, and the circuit board 10. In the thickness direction of the circuit board 10, the portion of the protective layer 40 at the location of the buffer 30 does not protrude from the portion of the protective layer 40 at the location of the electronic component set 20.

[0043] As can be seen, the electronic component assembly 20, the buffer 30, and the protective layer 40 are located on the same side of the circuit board 10 in its thickness direction. The protective layer 40 covers the electronic component assembly 20, the buffer 30, and the circuit board 10, and is fixed to the electronic component assembly 20 and the buffer 30. The protective layer 40 can block dust and other contaminants, keep the electronic component 22 clean, and reduce the performance degradation or failure of the drive circuit board assembly 1 caused by dust accumulation. At the same time, the protective layer 40 can absorb and disperse the energy of external impacts, protecting the electronic component 22 from damage. When the drive circuit board assembly 1 is used in the display device 2, the protective layer 40 can also provide a certain electromagnetic shielding effect, so that the drive circuit board assembly 1 is less likely to interfere with the normal operation of the display device 2. The buffer 30 is provided on the outer periphery of the electronic device group 20. For example, the buffer 30 is provided on one side of the electronic device group 20, or the buffer 30 is formed as a closed ring and the buffer 30 surrounds the electronic device group 20, or the buffer 30 is formed as an open ring and the buffer 30 surrounds the electronic device group 20, so that the arrangement of the buffer 30 is more flexible and can be adapted to different installation environments.

[0044] It should be noted that the term "ring" in this article is interpreted broadly, meaning it is not limited to "circular rings," but can also include "polygonal rings," etc. Furthermore, "ring" includes open rings (i.e., non-closed rings, such as C-shaped, U-shaped, Ω-shaped, etc.) and closed rings.

[0045] Furthermore, the protective layer 40 is fixedly mounted on the buffer member 30, which supports the protective layer 40. When the drive circuit board assembly 1 is impacted, the buffer member 30 can buffer the force acting on the protective layer 40, making the protective layer 40 less prone to large deformation. This reduces the likelihood of excessive noise caused by large deformation of the protective layer 40, thus mitigating the noise phenomenon of the drive circuit board assembly 1. In the thickness direction of the circuit board 10, the portion of the protective layer 40 at the location of the buffer member 30 does not protrude beyond the portion of the protective layer 40 at the location of the electronic device group 20. Alternatively, in the thickness direction of the circuit board 10, the portion of the protective layer 40 at the location of the electronic device group 20 may protrude beyond the portion of the protective layer 40 at the location of the buffer member 30, or the portion of the protective layer 40 at the location of the electronic device group 20 may be flush with the portion of the protective layer 40 at the location of the buffer member 30.

[0046] It is understood that in the embodiments of this application, the buffer 30 is fixed to the thickness side of the circuit board 10, which may include: the buffer 30 being directly fixed to the thickness side surface of the circuit board 10, or the buffer 30 being indirectly fixed to the thickness side surface of the circuit board 10; for example, the buffer 30 is fixed to the circuit board 10 by adhesive, or the buffer 30 is fixed to the circuit board 10 by adhesive through a part of the protective layer 40.

[0047] Taking the thickness direction of the circuit board 10 as the vertical direction and the electronic component group 20 as the upper side of the circuit board 10 as an example, the portion of the protective layer 40 at the location of the electronic component group 20 is higher than the portion of the protective layer 40 at the location of the buffer member 30 (that is, the upper surface of the portion of the protective layer 40 opposite to the electronic component group 20 is higher than the upper surface of the portion of the protective layer 40 opposite to the buffer member 30), or the upper surface of the portion of the protective layer 40 opposite to the electronic component group 20 is flush with the upper surface of the portion of the protective layer 40 opposite to the buffer member 30; for example, the height of the buffer member 30 protruding from the circuit board 10 is less than the height of the electronic component group 20 protruding from the circuit board 10.

[0048] The protective layer 40 is prone to incomplete adhesion in areas with significant height differences. In related technologies, the protective layer transitions directly from the electronic component assembly to the circuit board, where the height difference between the electronic component assembly and the circuit board is large, making incomplete adhesion of the protective layer easy to occur. This application addresses this by using a buffer 30 on the outer periphery of the electronic component assembly 20, ensuring that the portion of the protective layer 40 at the location of the buffer 30 does not protrude beyond the portion of the protective layer 40 at the location of the electronic component assembly 20 in the thickness direction of the circuit board 10. This allows the protective layer 40 to adhere more seamlessly from the electronic component assembly 20. The transition from the buffer 30 to the circuit board 10 is smoother. The protective layer 40 covering the part between the electronic device assembly 20 and the circuit board 10 has a smoother transition. When the protective layer 40 is pressed and rebounds, the smoother transition of the protective layer 40 can reduce the tensile stress on the protective layer 40, that is, reduce the rebound force on the protective layer 40. This makes the rebound deformation of the protective layer 40 smaller, and the protective layer 40 is less likely to detach from the circuit board 10, the buffer 30 and the electronic device assembly 20. This reduces the problem of the protective layer 40 not adhering properly, and thus reduces the abnormal noise phenomenon of the drive circuit board assembly 1.

[0049] For example, such as Figure 2As shown, the protective layer 40 includes a first part 41, a second part 42, and a third part 43. The first part 41 covers and is attached to the electronic component assembly 20, the second part 42 covers and is attached to the buffer 30, and the third part 43 covers and is attached to the circuit board 10. The first part 41 is bent and connected to one end of the second part 42, and the third part 43 is bent and connected to the other end of the second part 42. The height of the buffer 30 is less than the height of the electronic component assembly 20. Compared to the first part being directly connected to the third part, the height difference between the first part and the third part is larger, which can easily lead to incomplete adhesion of the protective layer. This application addresses this by setting the buffer 30 so that the first part 41 is indirectly connected to the third part 43 through the second part 42. The height difference between the first part 41 and the second part 42 is smaller than the height difference between the first part 41 and the third part 43, and the height difference between the second part 42 and the third part 43 is smaller than the height difference between the first part 41 and the third part 43, making the transition of the protective layer 40 smoother and reducing the abnormal noise of the drive circuit board assembly 1.

[0050] According to the embodiment of the present invention, in the drive circuit board assembly 1, buffer members 30 are spaced apart on the outer periphery of the electronic device group 20, and a protective layer 40 covers the electronic device group 20, the buffer members 30, and the circuit board 10. When the drive circuit board assembly 1 is pressed, the buffer members 30 can buffer the force acting on the protective layer 40 to reduce the deformation of the protective layer 40, thereby reducing the abnormal noise phenomenon of the drive circuit board assembly 1. At the same time, the buffer members 30 can also support the protective layer 40 so that the transition of the protective layer 40 covering the electronic device group 20, the buffer members 30, and the circuit board 10 is smoother, the protective layer 40 is less likely to rebound, and the protective layer 40 is less likely to detach from the circuit board 10, the electronic device group 20, and the buffer members 30, thereby reducing the loose adhesion of the protective layer 40 and further reducing the abnormal noise phenomenon of the drive circuit board assembly 1.

[0051] For example, the protective layer 40 can be bonded to the electronic device group 20, the buffer 30, and the circuit board 10 (e.g., the protective layer 40 is an IC cover tape, which is bonded to the electronic device group 20, the buffer 30, and the circuit board 10), or the protective layer 40 can cover the electronic device group 20, the buffer 30, and the circuit board 10 in other ways. The electronic device group 20 can include multiple electronic devices 22, which are arranged relatively closely and have small height differences, so that the protective layer 40 can directly cover the multiple electronic devices 22, thereby reducing the problem of the protective layer 40 being poorly attached. There can be multiple buffers 30, which are arranged around the outer periphery of the electronic device group 20 and spaced apart in the circumferential direction of the electronic device group 20, in order to reduce the problem of the protective layer 40 being poorly attached.

[0052] Optionally, the buffer 30 is foam, such as EVA foam. EVA foam has good plasticity and toughness (plasticity and toughness is the ability of a material to absorb energy during plastic deformation and fracture) and sound absorption ability. It can absorb some stress during the pressing of the drive circuit board assembly 1, play a certain buffering role on the protective layer 40, and reduce the abnormal noise phenomenon of the drive circuit board assembly 1.

[0053] Furthermore, the inventors of this application discovered through experiments that in some technologies, when the protective layer is bonded to the electronic component assembly and circuit board, even with partial adhesive-free treatment of the protective layer and electronic component assembly (e.g., the protective layer is bonded to the circuit board but not connected to the electronic component assembly), the protective layer still emits abnormal noise when pressed. In other technologies, the protective layer is bonded to both the electronic component assembly and the circuit board, and the protective layer uses a material with good sound absorption; however, the protective layer still emits abnormal noise when pressed. Multiple production confirmations revealed that the abnormal noise problem of the drive circuit board assembly is caused by the deformation of the protective layer. This application improves the abnormal noise problem of the drive circuit board assembly 1 by incorporating a buffer 30 to prevent the protective layer 40 from undergoing significant deformation.

[0054] like Figures 3-6 As shown, in some embodiments, multiple groups of electronic device groups 20 spaced apart along a first direction constitute a device row 24. Each electronic device group 20 includes multiple adjacent electronic devices 22. The spacing between two adjacent groups of electronic device groups 20 is greater than the spacing between two adjacent electronic devices 22 within the same group. The first direction is perpendicular to the thickness direction of the circuit board 10. In the device row 24, at least two adjacent groups of electronic device groups are provided with a buffer 30. In electronic device groups 20, if the spacing between two adjacent electronic devices 22 is small and the height difference between them is small, the protective layer 40 can directly cover multiple electronic devices 22. However, if the spacing between two adjacent groups of electronic device groups 20 is large, the protective layer 40 also needs to cover the circuit board 10 between the two groups. By providing a buffer 30 between adjacent groups of electronic device groups 20, the protective layer 40 can then cover the circuit board 10 through the buffer 30, thus... The transition of the protective layer 40 is smoother, which helps to reduce the problem of the protective layer 40 not being properly attached; and / or, at least one side of the device row 24 in the first direction is provided with a buffer 30 so that the protective layer 40 covering the device row 24 can be covered onto the circuit board 10 through the buffer 30, making the transition of the protective layer 40 smoother. For example, there is a certain gap between the two sides of the device row 24 in the first direction and the edge of the circuit board 10. By providing buffers 30 on both sides of the device row 24, the transition of the protective layer 40 is smoother, which helps to reduce the problem of the protective layer 40 not being properly attached.

[0055] Of course, in other embodiments of this application, the size of the device row 24 in the first direction is approximately equal to the size of the circuit board 10 in the first direction, and the protective layer 40 can directly cover the device row 24, without the need to provide buffers 30 on both sides of the device row 24 in the first direction.

[0056] like Figure 3 , Figure 5 and Figure 6 As shown, in some embodiments, in the second direction, the two ends of the buffer 30 do not extend beyond the corresponding ends of the electronic device group 20 adjacent to it in the first direction. The second direction is perpendicular to the first direction and perpendicular to the thickness direction of the circuit board 10. By setting the buffer 30 as described above, the buffer 30 can make full use of the space of the circuit board 10 in the first direction. At the same time, the buffer 30 will not occupy additional space in the second direction, so that the staff can arrange other components (such as flexible circuit board 76, or other electronic device groups 20, etc.) in the second direction of the circuit board 10. The buffer 30 does not easily affect the arrangement of other components, which facilitates the improvement of the applicability of the drive circuit board assembly 1.

[0057] like Figures 1-4 As shown, in some embodiments, the drive circuit board assembly 1 is configured to satisfy at least one of the following conditions A1 to A3:

[0058] In condition A1, the height of the buffer 30 in the thickness direction of the circuit board 10 is H1, and the maximum protrusion height of the electronic device group 20 adjacent to the buffer 30 in the first direction is H2, where 0.4 ≤ H1 / H2 ≤ 0.8. By setting the ratio of the height of the buffer 30 to the maximum protrusion height of the adjacent electronic device group 20 within the range of 0.4 to 0.8, the height difference between the buffer 30 and the adjacent electronic device group 20 is within a suitable range. At the same time, the height difference between the buffer 30 and the circuit board 10 is also within a suitable range. This allows the protective layer 40 to transition more smoothly, which helps to reduce the problem of the protective layer 40 not being properly attached. Moreover, the buffer 30 has sufficient height so that it can effectively buffer the force acting on the protective layer 40, which helps to reduce the possibility of the protective layer 40 undergoing large deformation, thereby reducing the abnormal noise of the drive circuit board assembly 1.

[0059] For example, the height of the buffer 30 is 0.8 mm, and the maximum protrusion height of the adjacent electronic component group 20 is 1.05 mm. The ratio of the height of the buffer 30 to the maximum protrusion height of the adjacent electronic component group 20 is 0.76, which ensures that the height difference between the buffer 30 and the adjacent electronic component group 20 is within a suitable range. Simultaneously, the height difference between the buffer 30 and the circuit board 10 is also within a suitable range, allowing the protective layer 40 to transition more smoothly and reducing the likelihood of incomplete application of the protective layer 40. Of course, H1 / H2 can also be 0.4, 0.5, 0.56, 0.6, 0.7, 0.72, or 0.8, etc.

[0060] In condition A2, the dimension of the buffer 30 in the first direction is L1, and the maximum protrusion height of the electronic device group 20 adjacent to the buffer 30 in the first direction is H2, where H2≤L1. Therefore, the dimension of the buffer 30 in the first direction is greater than or equal to the maximum protrusion height of the adjacent electronic device group 20. When the protective layer 40 covering the electronic device group 20 covers the buffer 30, the buffer 30 has sufficient dimensions, and the protective layer 40 can transition more smoothly, which helps to reduce the problem of the protective layer 40 not being properly attached.

[0061] For example, the buffer 30 has a dimension of 1 mm in the first direction, and the maximum protrusion height of the electronic device group 20 adjacent to the buffer 30 in the first direction is 1 mm. The protective layer 40 covering the electronic device group 20 is connected to the side of the buffer 30 away from the electronic device group 20 in the first direction. After considering the height of the buffer 30 and the gap between the buffer 30 and the adjacent electronic device group 20 in the first direction, the angle between the portion of the protective layer 40 covering the electronic device group 20 and the buffer 30 and the first direction can be less than 45°. That is, when the protective layer 40 covering the electronic device group 20 directly covers the circuit board 40 with a spacing of 1 mm, the angle between the portion of the protective layer 40 covering the electronic device group 20 and the buffer 30 and the first direction makes the transition of the buffer 30 smoother and helps to reduce the problem of the protective layer 40 not being properly attached. The buffer 30 has a dimension of 2mm in the first direction. The maximum protrusion height of the electronic device group 20 adjacent to the buffer 30 in the first direction is 1.05mm. The protective layer 40 covering the electronic device group 20 is connected to the side of the buffer 30 away from the electronic device group 20 in the first direction. After considering the height of the buffer 30 and the gap between the buffer 30 and the adjacent electronic device group 20 in the first direction, the angle between the portion of the protective layer 40 covering the electronic device group 20 and the buffer 30 and the first direction can be less than 28°. That is, when the protective layer 40 covering the electronic device group 20 directly covers the circuit board 40 with a 2mm gap, the angle between the portion of the protective layer 40 covering the electronic device group 20 and the buffer 30 and the first direction makes the transition of the buffer 30 smoother and helps to reduce the problem of the protective layer 40 not being properly attached.

[0062] In condition A3, the dimension of the buffer 30 in the second direction is L2, and the dimension of the electronic device group 20 adjacent to the buffer 30 in the first direction in the second direction is L3, 0.6≤L2 / L3≤1. The second direction is perpendicular to the first direction and perpendicular to the thickness direction of the circuit board 10. By setting the dimensions of the buffer 30 and the adjacent electronic device group 20 in the second direction in the range of 0.6 to 1, the buffer 30 will not occupy a large space in the second direction of the circuit board 10, and will not easily affect the arrangement of other components in the second direction of the circuit board 10. At the same time, the buffer 30 has sufficient length in the second direction so that the buffer 30 can better support and buffer the protective layer 40, which helps to reduce the possibility of large deformation of the protective layer 40.

[0063] like Figure 5 and Figure 6As shown, in some embodiments, the device row 24 is multiple rows and the multiple rows of device rows 24 are spaced apart along the second direction. The second direction is perpendicular to the first direction and perpendicular to the thickness direction of the circuit board 10. That is, the electronic device group 20 can be arranged in multiple rows and columns on the circuit board 10. At least two adjacent rows of device rows 24 are provided with a buffer 30. That is, the protective layer 40 covering one row of device rows 24 can be covered by the buffer 30 and then covered by another row of device rows 24, so that the protective layer 40 can transition more smoothly and reduce the situation of the protective layer 40 being poorly applied.

[0064] like Figure 5 and Figure 6 As shown, in some embodiments, two corresponding electronic device groups 20 belonging to two adjacent rows of device rows 24 are at least partially facing each other in the second direction, and a buffer 30 is provided between the two facing portions. The buffer 30 allows for a smoother transition of the protective layer 40 between the two corresponding electronic device groups 20 belonging to the two adjacent rows of device rows 24, reducing the likelihood of incomplete application of the protective layer 40. Furthermore, by limiting the position of the buffer 30, it is less likely to affect the arrangement of other components on the circuit board 10, thus improving the performance of the drive circuit board. The applicability of component 1; and / or, the electronic device group 20 is located in the first direction between two adjacent electronic device groups 20 of the adjacent device row 24, that is, between adjacent device rows 24. The electronic device group 20 located in one device row 24 is staggered from the two adjacent electronic device groups 20 located in the other device row 24 in the first direction. A buffer 30 is provided on the side of the electronic device group 20 facing the two adjacent electronic device groups 20 so that the protective layer 40 transitions more smoothly between the two adjacent device rows 24, which helps to reduce the loose application of the protective layer 40.

[0065] like Figure 3 and Figure 4 As shown, in some embodiments, the drive circuit board assembly 1 further includes an adhesive 50, which is bonded between the circuit board 10 and the protective layer 40. The device row 24 has three or more electronic device groups 20, and a buffer 30 is provided between any two adjacent electronic device groups 20. The spacing between at least two adjacent electronic device groups 20 is a first spacing, and the spacing between any other two adjacent electronic device groups 20 is a second spacing. The second spacing (e.g.) Figure 3 d2) is greater than the first spacing (e.g. Figure 3 In d1), an adhesive 50 is provided between two adjacent electronic device groups 20 having a second spacing; and / or, an adhesive 50 is provided on at least one side of the device row 24 in the first direction.

[0066] It can be seen that adhesive members 50 can be added to two adjacent electronic device groups 20 with a large gap. The adhesive members 50 are bonded to the protective layer 40, so that the setting position of the protective layer 40 is more stable. When the protective layer 40 covers the buffer member 30, the electronic device group 20 and the circuit board 10, it is not easy to detach. This effectively reduces the loose bonding of the protective layer 40, so that the buffer member 30 can play a good supporting and buffering role, which helps to reduce the abnormal noise of the drive circuit board assembly 1, and at the same time helps to reduce the amount of buffer member 30 used; and / or, at least one side of the device row 24 in the first direction is provided with adhesive members 50, and the adhesive members 50 The protective layer 40 is bonded to the buffer 30 to make its position more stable. When the protective layer 40 covers the buffer 30, electronic component group 20 and circuit board 10, it is not easy to detach. This effectively reduces the loose bonding of the protective layer 40, so that the buffer 30 can play a good supporting and buffering role. This helps to reduce the abnormal noise of the drive circuit board assembly 1. For example, there is a certain gap between the two sides of the component row 24 and the edge of the circuit board 10 in the first direction. By adding adhesive 50 on both sides of the component row 24, the position of the protective layer 40 is more stable, which helps to reduce the loose bonding of the protective layer 40.

[0067] Of course, in other embodiments of this application, the dimensions of the device row 24 in the first direction are approximately equal to the dimensions of the circuit board 10 in the first direction, and the protective layer 40 can directly cover the device row 24, without the need to provide adhesive members 50 on both sides of the device row 24 in the first direction.

[0068] Optionally, the adhesive 50 is made of high-viscosity adhesive to make the bonding effect between the adhesive 50 and the protective layer 40 more stable, which is beneficial to improving the stability of the protective layer 40 setting position.

[0069] like Figure 3 and Figure 4 As shown, in some embodiments, the second spacing (e.g.) Figure 3 d2) is greater than the dimension of the corresponding buffer 30 in the first direction (e.g. Figure 3 The adhesive 50 is provided between two adjacent electronic device groups 20 with a second spacing (L1) twice the size of the first direction. This reduces the limitation on the size of the adhesive 50 in the first direction, so that the adhesive 50 has sufficient size in the first direction, resulting in a larger contact area between the adhesive 50 and the protective layer 40. The adhesive 50 can provide strong adhesive force, making it difficult for the adhesive 50 and the protective layer 40 to separate, which is beneficial to improving the stability of the protective layer 40's position.

[0070] like Figure 3As shown, in some embodiments, in the second direction, the two ends of the adhesive 50 do not extend beyond the corresponding two ends of the electronic device group 20 adjacent to it in the first direction. The second direction is perpendicular to the first direction and perpendicular to the thickness direction of the circuit board 10. Therefore, the width of the adhesive 50 in the second direction is less than or equal to the width of the electronic device group 20 adjacent to it in the second direction. The adhesive 50 and the electronic device group 20 adjacent to it are opposite to each other in the first direction. Through the above-mentioned arrangement of the adhesive 50, the adhesive 50 can make full use of the space of the circuit board 10 in the first direction. At the same time, the adhesive 50 will not occupy additional space in the second direction, so that the staff can arrange other components (such as flexible circuit board 76, or other electronic device groups 20, etc.) in the second direction of the circuit board 10. The adhesive 50 does not easily affect the arrangement of other components, which facilitates the improvement of the applicability of the drive circuit board assembly 1.

[0071] like Figures 1-4 As shown, in some embodiments, an adhesive 50 and a buffer 30 are provided between two adjacent electronic device groups 20 having a second spacing, and / or, at least one side of the device row 24 in the first direction is provided with an adhesive 50 and a buffer 30. In the above arrangements, the adhesive 50 may be disposed adjacent to the corresponding buffer 30, for example, the adhesive 50 and the corresponding buffer 30 are adjacent to each other, and no other components are disposed between them. Exemplarily, in the thickness direction of the circuit board 10, the height of the adhesive 50 may be less than the height of its corresponding buffer 30.

[0072] In the above configuration, the drive circuit board assembly 1 is configured to satisfy at least one of the following conditions B1 to B3:

[0073] In condition B1, in the thickness direction of the circuit board 10, the height of the adhesive 50 is H3, and the height of the buffer 30 corresponding to the adhesive 50 is H1 (for example, an adhesive 50 and a buffer 30 corresponding to the adhesive 50 are provided between two adjacent electronic device groups 20 with a second spacing, and / or, at least one side of the device row 24 in the first direction is provided with an adhesive 50 and a buffer 30 corresponding to the adhesive 50), 0.4≤H3 / H1≤0.8. By setting the ratio of the height of the adhesive 50 to the height of the buffer 30 in the range of 0.4 to 0.8, the height difference between the adhesive 50 and the buffer 30 is within a suitable range, and the height difference between the adhesive 50 and the circuit board 10 is also within a suitable range. Thus, the protective layer 40 can transition more smoothly, which helps to reduce the problem of the protective layer 40 being poorly adhered, thereby reducing the abnormal noise of the drive circuit board assembly 1. In particular, when the two ends of the circuit board 10 extend beyond the corresponding ends of the device row 24 in the first direction, a buffer 30 and an adhesive 50 can be provided on at least one side of the device row 24 in the first direction. When the protective layer 40 needs to cover the electronic device group 20, the buffer 30 and the adhesive 50 in sequence, and then needs to cover the circuit board 10, the adhesive 50 is provided between the buffer 30 and the circuit board 10 so that the height difference between the adhesive 50 and the buffer 30 is within a suitable range. At the same time, the height difference between the adhesive 50 and the circuit board 10 is also within a suitable range. For example, the buffer 30 is provided between the device row 24 and the adhesive 50, so that the transition of the protective layer 40 is smoother and the problem of the protective layer 40 being poorly adhered is reduced.

[0074] For example, the height of the buffer 30 is 0.8 mm, the height of the adhesive 50 is 0.6 mm, and the ratio of the height of the buffer 30 to the height of the adhesive 50 is 0.75. This ensures that the height difference between the adhesive 50 and the buffer 30 is within a suitable range, and the height difference between the adhesive 50 and the circuit board 10 is also within a suitable range. This allows the protective layer 40 to transition more smoothly, reducing the possibility of incomplete application of the protective layer 40. Of course, H3 / H1 can also be 0.4, 0.49, 0.55, 0.6, 0.7, 0.76, or 0.8, etc.

[0075] In condition B2, the dimension of the adhesive 50 in the first direction is L4, and the dimension of the buffer 30 corresponding to the adhesive 50 (e.g., an adhesive 50 and a buffer 30 corresponding to the adhesive 50 are provided between two adjacent electronic device groups 20 with a second spacing, and / or, at least one side of the device row 24 in the first direction is provided with an adhesive 50 and a buffer 30 corresponding to the adhesive 50) in the first direction is L1, 1≤L4 / L1≤5. By setting the ratio of the dimension of the adhesive 50 in the first direction to the dimension of the corresponding buffer 30 in the first direction in the range of 1 to 5, the adhesive 50 has sufficient dimension in the first direction to make the transition of the protective layer 40 covering the part between the adhesive 50 and the corresponding buffer 30 smoother, which is beneficial to reduce the loose adhesion of the protective layer 40. At the same time, the adhesive 50 and the protective layer 40 can also have sufficient contact area to make the adhesive 50 and the protective layer 40 bond more stably.

[0076] For example, the adhesive 50 has a dimension of 3 mm in the first direction, and the corresponding buffer 30 has a dimension of 2 mm in the first direction. The ratio of the dimension of the adhesive 50 in the first direction to the dimension of the corresponding buffer 30 in the first direction is 1.5, so that the transition of the protective layer 40 covering the portion between the adhesive 50 and the corresponding buffer 30 is smoother, while the adhesive 50 and the protective layer 40 still have sufficient contact area. Of course, L4 / L1 can also be 1, 1.8, 2, 2.5, 3, 3.6, 4, 4.2, or 5, etc.

[0077] In condition B3, the dimensions of the adhesive 50 in the second direction (e.g.) Figure 3 L5) and its corresponding buffer 30 (e.g., an adhesive 50 and a buffer 30 corresponding to the adhesive 50 are provided between two adjacent electronic device groups 20 with a second spacing, and / or, an adhesive 50 and a buffer 30 corresponding to the adhesive 50 are provided on at least one side of the device row 24 in the first direction) in the second direction dimension (e.g. Figure 3 The dimensions of the adhesive 50 and the buffer 30 in the second direction are made to be more compatible, so that the protective layer 40 covering the buffer 30 can be smoothly transitioned to the adhesive 50, which helps to reduce the problem of the protective layer 40 not being properly attached.

[0078] In some embodiments, such as Figure 1 and Figure 2As shown, in the first direction, both ends of the protective layer 40 are fixedly connected to one side of the aforementioned thickness of the circuit board 10, that is, both ends of the protective layer 40 are fixedly connected to the side where the electronic component group 10 is located on the circuit board 10. Thus, the protective layer 40 can be fixedly connected not only to the electronic component group 20 and the buffer 30, but also to the circuit board 10, which helps to improve the reliability of the protective layer 40.

[0079] In some embodiments, such as Figure 1 As shown, the electronic component assembly 20 is sandwiched between the protective layer 40 and the circuit board 10. At least one buffer 30 is sandwiched between the protective layer 40 and the circuit board 10. The buffer 30 can be assembled as a separate component, making maintenance of the buffer 30 more convenient and improving its maintenance efficiency; and / or, as shown... Figure 7 and Figure 8 As shown, the protective layer 40 is constructed as a multi-layer structure arranged along the thickness direction of the circuit board 10. For example, the protective layer 40 is arranged sequentially as an insulating layer, a conductive layer, and an insulating layer along the thickness direction, which can meet the different requirements of the drive circuit board assembly 1 for the protective layer 40. At least one buffer 30 is sandwiched between two adjacent layers of the protective layer 40, that is, the buffer 30 and the protective layer 40 can be assembled as a whole structure, so that the assembly of the buffer 30 and the protective layer 40 is more convenient. At the same time, the buffer 30 and the protective layer 40 are not easy to separate, so that the buffer 30 provides stable support and buffering effect for the protective layer 40, which can improve the stability of the operation of the drive circuit board assembly 1.

[0080] The following describes a specific embodiment of the driver circuit board assembly 1 of this application.

[0081] Taking the example that multiple groups of electronic devices 20 on the drive circuit board assembly 1 are all spaced apart along the first direction, i.e., the device row 24 is in a row, the drive circuit board assembly 1 of this application will be explained.

[0082] Example 1, please refer to Figures 1-4 The drive circuit board assembly 1 includes a circuit board 10, multiple electronic component groups 20, multiple buffers 30, multiple adhesives 50, and a protective layer 40.

[0083] The electronic component group 20 is sandwiched between the protective layer 40 and the circuit board 10, and all the buffers 30 are sandwiched between the protective layer 40 and the circuit board 10.

[0084] The electronic device group 20 protrudes from the thickness side of the circuit board 10, and the electronic device group 20 includes multiple electronic devices 22. Multiple groups of electronic device groups 20 arranged at intervals along the first direction form a row of devices 24. The interval between two adjacent groups of electronic device groups 20 is greater than the interval between two adjacent electronic devices 22 in the electronic device group 20. The first direction is perpendicular to the thickness direction of the circuit board 10.

[0085] The buffer 30 is fixed on the thickness side of the circuit board 10, and the buffer 30 is provided between any two adjacent groups of electronic devices 20, and the device row 24 is provided on both sides in the first direction.

[0086] The adhesive 50 is bonded between the circuit board 10 and the protective layer 40. The electronic device group 20 of the device row 24 has three or more, wherein the distance between at least two adjacent electronic device groups 20 is the first distance, and the distance between any other two adjacent electronic device groups 20 is the second distance. The second distance is greater than the first distance. The adhesive 50 is provided between two adjacent electronic device groups 20 with the second distance, and the adhesive 50 is provided on both sides of the device row 24 in the first direction.

[0087] The protective layer 40 is disposed on the thickness side of the circuit board 10, and the protective layer 40 covers and is fixed to the electronic component assembly 20, the buffer 30, the adhesive 50 and the circuit board 10. In the thickness direction of the circuit board 10, the portion of the protective layer 40 at the location of the buffer 30 is lower than the portion of the protective layer 40 at the location of the electronic component assembly 20, and the portion of the protective layer 40 at the location of the adhesive 30 is lower than the portion of the protective layer 40 at the location of the buffer 30.

[0088] Example 2

[0089] Please refer to Figure 7 The structure of the drive circuit board assembly 1 provided in Embodiment 2 is largely the same as that of the drive circuit board assembly 1 in Embodiment 1. The difference is that the protective layer 40 is constructed as a multi-layer structure arranged along the thickness direction of the circuit board 10, and all the buffers 30 are sandwiched between two adjacent layers of the protective layer 40.

[0090] As can be seen, in both Embodiment 1 and Embodiment 2 described above, the buffer members 30 are spaced apart on the outer periphery of the electronic device assembly 20, and the protective layer 40 covers the electronic device assembly 20, the buffer members 30, and the circuit board 10. When the drive circuit board assembly 1 is pressed, the buffer members 30 can buffer the force acting on the protective layer 40 to reduce the deformation of the protective layer 40, thereby reducing the abnormal noise of the drive circuit board assembly 1. At the same time, the buffer members 30 can also support the protective layer to ensure that the protective layer covering the electronic device assembly 20, the buffer members 30, the adhesive 50, and the circuit board 10 is protected. The transition of layer 40 is smoother, and the protective layer 40 is less prone to rebound. The protective layer 40 is less likely to detach from the electronic component assembly 20, the buffer 30, and the circuit board 10, thereby reducing the problem of the protective layer 40 being poorly attached. Moreover, the adhesive 50 is bonded to the protective layer 40, making the setting position of the protective layer 40 more stable. When the protective layer 40 covers the buffer 30, the electronic component assembly 20, and the circuit board 10, it is not easy to detach, effectively reducing the problem of the protective layer 40 being poorly attached. This allows the buffer 30 to play a good supporting and buffering role, which helps to reduce the abnormal noise phenomenon of the drive circuit board assembly 1.

[0091] The display device 2 according to the second aspect of the present invention includes a display panel 60 and a drive circuit board assembly 1 according to the first aspect of the present invention. The drive circuit board assembly 1 is disposed on the back side of the display panel 60 and is electrically connected to the display panel 60.

[0092] As can be seen, the driving circuit board assembly 1 can provide electrical signals to the display panel 60 so that different information can be displayed on the display panel 60. The driving circuit board assembly 1 is located on the back side of the display panel 60 so that the driving circuit board assembly 1 does not easily affect the information display of the display panel 60, which facilitates the miniaturization design of the display device 2.

[0093] According to the second aspect embodiment of the present invention, the display device 2, by employing the above-described drive circuit board assembly 1, facilitates the reduction of abnormal noise in the display device 2.

[0094] like Figure 9 As shown, in some embodiments, the display panel 60 includes a display portion 62 and a non-display portion 64. The non-display portion 64 is bent and connected to the back side of the display portion 62. The drive circuit board assembly 1 is also disposed on the back side of the display portion 62 and is disposed opposite to the display portion 62. The display device 2 further includes: a glass cover plate 70, an optical adhesive layer 71, a polarizer 72, an under-screen material 73, an adhesive layer 74, a protective film 75, and a flexible circuit board 76.

[0095] A glass cover plate 70 is disposed on the front side of the display unit 62. An optical adhesive layer 71 and a polarizer 72 are sandwiched between the glass cover plate 70 and the display unit 62. The polarizer 72 is disposed between the optical adhesive layer 71 and the display unit 62. The optical adhesive layer 71 is sandwiched between the glass cover plate 70 and the polarizer 72. The protective film 75 includes a first protective film 75a and a second protective film 75b. The first protective film 75a is attached to the back side of the display unit 62, and the second protective film 75b is attached to the non-display part 64 facing the display unit. On one side of 62, under-screen material 73 is disposed on the side of the first protective film 75a away from the display part 62, and is bonded to the second protective film 75b through an adhesive layer 74. The drive circuit board assembly 1 is disposed on the side of the under-screen material 73 away from the first protective film 75a. The drive circuit board assembly 1 and the under-screen material 73 are bonded through the adhesive layer 74, and the drive circuit board assembly 1 is disposed opposite to the non-display part 64. The drive circuit board assembly 1 and the non-display part 64 are electrically connected through a flexible circuit board 76.

[0096] Furthermore, it should be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. To avoid unnecessary repetition, this application will not describe the various possible combinations separately. In addition, various different embodiments of this application can also be arbitrarily combined, as long as they do not violate the spirit of this application, they should also be regarded as the content disclosed in this application.

[0097] In the description of this utility model, it should be understood that the terms "center," "lateral," "length," "thickness," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more. In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral connection; it can refer to a mechanical connection or an electrical connection; it can refer to a direct connection or an indirect connection through an intermediate medium; it can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0098] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "on the upper side" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "on the lower side" of the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0099] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A drive circuit board assembly, characterized in that, include: Circuit board; At least one group of electronic devices, the group of electronic devices protruding from the thickness side of the circuit board, and including at least one electronic device; At least one buffer member is fixed to one side of the thickness of the circuit board and spaced apart on the outer periphery of the corresponding electronic device group; A protective layer is fixed to the side of the electronic device assembly and the buffer component facing away from the circuit board, and covers the electronic device assembly, the buffer component and the circuit board. In the thickness direction of the circuit board, the portion of the protective layer at the location of the buffer component does not protrude beyond the portion of the protective layer at the location of the electronic device assembly.

2. The drive circuit board assembly according to claim 1, characterized in that, Multiple groups of electronic devices spaced apart along a first direction form a device row. Each electronic device group includes multiple adjacent electronic devices, and the spacing between two adjacent groups of electronic devices is greater than the spacing between two adjacent electronic devices within a single group. The first direction is perpendicular to the thickness direction of the circuit board. In the device row, at least two adjacent groups of electronic devices are provided with the buffer; and / or, The buffer is provided on at least one side of the two sides of the device arranged in the first direction.

3. The drive circuit board assembly according to claim 2, characterized in that, In the second direction, the two ends of the buffer do not extend beyond the corresponding ends of the electronic device group adjacent to it in the first direction. The second direction is perpendicular to the first direction and perpendicular to the thickness direction of the circuit board.

4. The drive circuit board assembly according to claim 2, characterized in that, The drive circuit board assembly is configured to satisfy at least one of the following conditions: The height of the buffer is H1, and the maximum protrusion height of the electronic device group adjacent to the buffer in the first direction is H2, where 0.4 ≤ H1 / H2 ≤ 0.

8. The dimension of the buffer in the first direction is L1, and the maximum protrusion height of the electronic device group adjacent to the buffer in the first direction is H2, where H2≤L1; The buffer has a dimension of L2 in the second direction, and the electronic device group adjacent to the buffer in the first direction has a dimension of L3 in the second direction, where 0.6 ≤ L2 / L3 ≤ 1. The second direction is perpendicular to the first direction and also perpendicular to the thickness direction of the circuit board.

5. The drive circuit board assembly according to claim 2, characterized in that, The device rows are arranged in multiple rows and spaced apart along the second direction. At least two adjacent rows of the device rows are provided with the buffer. The second direction is perpendicular to the first direction and perpendicular to the thickness direction of the circuit board.

6. The drive circuit board assembly according to claim 5, characterized in that, Two corresponding electronic device groups belonging to two adjacent rows of device rows are at least partially facing each other in the second direction, and a buffer is provided between the portions of the two facing each other; and / or, The electronic device group is located between two adjacent electronic device groups in the first direction, and the buffer is provided on the side of the electronic device group facing the two adjacent electronic device groups.

7. The drive circuit board assembly according to claim 2, characterized in that, The drive circuit board assembly also includes an adhesive component that is bonded between the circuit board and the protective layer. The device row has three or more electronic device groups, and the buffer is provided between any two adjacent electronic device groups. The distance between at least two adjacent electronic device groups is a first distance, and the distance between any other two adjacent electronic device groups is a second distance. The second distance is greater than the first distance, and the adhesive is provided between two adjacent electronic device groups with the second distance. And / or, The adhesive is provided on at least one side of the two sides of the device arranged in the first direction.

8. The drive circuit board assembly according to claim 7, characterized in that, The second spacing is greater than twice the size of the corresponding buffer in the first direction.

9. The drive circuit board assembly according to claim 7, characterized in that, In the second direction, the two ends of the adhesive do not extend beyond the corresponding ends of the electronic device group adjacent to it in the first direction. The second direction is perpendicular to the first direction and perpendicular to the thickness direction of the circuit board.

10. The drive circuit board assembly according to claim 7, characterized in that, The adhesive and the buffer are provided between two adjacent groups of the electronic devices having the second spacing, and / or the adhesive and the buffer are provided on at least one side of the devices arranged on both sides in the first direction, and the drive circuit board assembly is configured to satisfy at least one of the following conditions: The height of the adhesive component is H3, and the height of the buffer component corresponding to the adhesive component is H1, where 0.4 ≤ H3 / H1 ≤ 0.8; The adhesive component has a dimension of L4 in the first direction, and the buffer component corresponding to the adhesive component has a dimension of L1 in the first direction, where 1≤L4 / L1≤5; The dimensions of the adhesive in the second direction are equal to the dimensions of the corresponding buffer in the second direction.

11. The drive circuit board assembly according to claim 2, characterized in that, In the first direction, both ends of the protective layer are fixedly connected to the thickness side of the circuit board.

12. The drive circuit board assembly according to any one of claims 1-11, characterized in that, The electronic component assembly is sandwiched between the protective layer and the circuit board. At least one of the buffer elements is sandwiched between the protective layer and the circuit board; and / or, The protective layer is configured as a multi-layer structure along the thickness direction of the circuit board, and at least one of the buffer elements is sandwiched between two adjacent layers of the protective layer.

13. A display device, characterized in that, The device includes a display panel and a driving circuit board assembly according to any one of claims 1-12, wherein the driving circuit board assembly is disposed on the back side of the display panel and electrically connected to the display panel.

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