Display substrate, display panel and display device

Abstract

The invention discloses a display substrate, a display panel and a display device. The display substrate comprises: a substrate (1); the plurality of sub-pixels (2) are positioned on one side of the substrate (1); each sub-pixel (2) in the plurality of sub-pixels (2) comprises a sub-pixel opening area; the inorganic color resistance layer (3) and the sub-pixels (2) are located on the same side of the substrate (1), and the inorganic color resistance layer (3) comprises a plurality of color resistance units (301); the orthographic projection of the color resistance unit (301) on the substrate (1) covers the orthographic projection of the sub-pixel opening area on the substrate (1), and the light emitting color of the color resistance unit (301) is the same as the color of the corresponding sub-pixel (2); the color resistance unit (301) comprises at least two kinds of inorganic sublayers (3011) which are alternately arranged in a laminated mode, and the refractive indexes of the different kinds of inorganic sublayers (3011) are different.

Description

Display substrate, display panel, and display device Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display substrate, a display panel, and a display device. Background Art

[0002] Liquid crystal display products require color filters to achieve full-color displays. Traditionally, the color filters used in liquid crystal display products are absorptive, and approximately two-thirds of the energy of light passing through them is lost, impacting the display product's light utilization.

[0003] Summary of the Invention

[0004] An embodiment of the present disclosure provides a display substrate, the display substrate comprising:

[0005] substrate;

[0006] A plurality of sub-pixels are located on one side of the substrate; each of the plurality of sub-pixels includes a sub-pixel opening area;

[0007] The inorganic color resist layer is located on the same side of the base substrate as the multiple sub-pixels, and includes multiple color resist units; the orthographic projection of the color resist unit on the base substrate covers the orthographic projection of the sub-pixel opening area on the base substrate, and the multiple color resist units include: a first color resist unit, a second color resist unit and a third color resist unit, and at least two of the first color resist unit, the second color resist unit and the third color resist unit have different light output colors; the color resist unit includes at least two inorganic sub-layers arranged alternately, the color resist units with different light output colors contain different numbers of inorganic sub-layers, and the refractive indices of two adjacent inorganic sub-layers are different.

[0008] In some embodiments, at least two of the first color resist unit, the second color resist unit, and the third color resist unit have different thicknesses in a direction perpendicular to the substrate.

[0009] In some embodiments, the difference in thickness between different color resist units in a direction perpendicular to the substrate is less than or equal to 1 micron.

[0010] In some embodiments, the color-resistance unit includes a first portion; and the first portions of different color-resistance units are independently arranged.

[0011] In some embodiments, an absolute value of a distance between the first portions of adjacent different color-resist units is less than or equal to 10 micrometers.

[0012] In some embodiments, the absolute value of the distance between the first portions of adjacent different color-resist units is less than or equal to 3 micrometers.

[0013] In some embodiments, the color resist unit further includes a second portion located on a side of the first portion away from the base substrate; and the second portions of the plurality of color resist units are integrally connected.

[0014] In some embodiments, the first portions of at least two of the first color-resistance unit, the second color-resistance unit, and the third color-resistance unit have different thicknesses in a direction perpendicular to the substrate.

[0015] In some embodiments, the display substrate further includes: a first light-shielding portion, located between the first portion and the base substrate; the orthographic projection of the first light-shielding portion on the base substrate covers the area between the orthographic projections of adjacent first portions on the base substrate, and the orthographic projection of the first light-shielding portion on the base substrate does not overlap with the sub-pixel opening area.

[0016] In some embodiments, the side surface of the first portion includes an inclined surface with an angle greater than or equal to 60° and less than 90° with respect to the plane where the substrate is located.

[0017] In some embodiments, an absolute value of a minimum distance between the inclined surfaces of two adjacent first portions is less than or equal to 5 micrometers.

[0018] In some embodiments, in a region between adjacent sub-pixel opening regions, orthographic projections of adjacent first portions on the substrate overlap;

[0019] Furthermore, the orthographic projection of the first portion on the base substrate and the orthographic projection of the sub-pixel opening area corresponding to the adjacent first portion on the base substrate do not overlap with each other.

[0020] In some embodiments, an orthographic projection of any first portion on the substrate covers an orthographic projection of an area between adjacent sub-pixel openings on the substrate;

[0021] The inorganic color resist layer further includes: an overlapping portion; an orthographic projection of the overlapping portion on the base substrate covers an orthographic projection of an area between adjacent sub-pixel opening areas on the base substrate, and the orthographic projection of the overlapping portion on the base substrate does not overlap with the orthographic projection of the sub-pixel opening area on the base substrate;

[0022] Between adjacent sub-pixel opening areas, the color-resistance unit and the overlapping portion have an overlapping portion whose orthographic projection on the base substrate has a light transmittance of less than 5%.

[0023] In some embodiments, a surface of the first portion away from the substrate includes a first planar region, and an orthographic projection of the first planar region on the substrate covers the sub-pixel opening region.

[0024] In some embodiments, the color resist unit includes a first inorganic sublayer and a second inorganic sublayer; the refractive index of the first inorganic sublayer is greater than the refractive index of the second inorganic sublayer; and the inorganic sublayer closest to the base substrate is the first inorganic sublayer.

[0025] In some embodiments, the material of the first inorganic sub-layer includes one or a combination of the following: silicon nitride, titanium dioxide, titanium pentoxide, niobium pentoxide, zirconium dioxide, yttrium trioxide, zinc sulfide;

[0026] The material of the second inorganic sub-layer includes one of the following or a combination thereof: silicon oxide, magnesium fluoride.

[0027] In some embodiments, the sub-pixel includes: a thin film transistor, and a pixel electrode located on a side of the thin film transistor facing away from the substrate.

[0028] In some embodiments, the inorganic color resist layer is located between the base substrate and the sub-pixel;

[0029] The display substrate further includes a first planarization layer located between the inorganic color resist layer and the sub-pixels.

[0030] In some embodiments, the material of the first planarization layer includes organic silicon.

[0031] In some embodiments, the inorganic color resist layer is located between the thin film transistor and the pixel electrode.

[0032] In some embodiments, the thin film transistor includes: a gate, a source, and a drain; the display panel further includes: a first inorganic insulating layer located between the gate and the source and drain electrodes, and a second planarization layer located between the source and drain electrodes and the pixel electrode;

[0033] The inorganic color resist layer is located between the first inorganic insulating layer and the second planarization layer.

[0034] In some embodiments, the material of the second planarization layer includes resin.

[0035] In some embodiments, the inorganic color resist layer is located on a side of the sub-pixel facing away from the base substrate.

[0036] In some embodiments, the sub-pixel includes a light-emitting device; and the inorganic color resist layer is located on a side of the light-emitting device facing away from the substrate.

[0037] In some embodiments, the color resist units correspond to the sub-pixels in a one-to-one manner.

[0038] In some embodiments, each color-resistance unit corresponds to a plurality of sub-pixels that are arranged continuously and have the same color.

[0039] In some embodiments, the plurality of sub-pixels include: a plurality of red sub-pixels, a plurality of green sub-pixels, and a plurality of blue sub-pixels;

[0040] The first color-resistance unit is a red color-resistance unit corresponding to the red sub-pixel, the second color-resistance unit is a green color-resistance unit corresponding to the green sub-pixel, and the third color-resistance unit is a blue color-resistance unit corresponding to the blue sub-pixel;

[0041] In a direction perpendicular to the base substrate, the thickness of the red color-resistance unit is greater than that of the blue color-resistance unit, and the thickness of the green color-resistance unit is greater than that of the red color-resistance unit.

[0042] An embodiment of the present disclosure provides a method for preparing a display substrate, comprising:

[0043] providing a substrate;

[0044] An inorganic color resist layer and a plurality of sub-pixels are formed on one side of a base substrate; each of the plurality of sub-pixels includes a sub-pixel opening area; the inorganic color resist layer includes a plurality of color resist units; the orthographic projection of the color resist unit on the base substrate covers the orthographic projection of the sub-pixel opening area on the base substrate, the plurality of color resist units include: a first color resist unit, a second color resist unit and a third color resist unit, at least two of the first color resist unit, the second color resist unit and the third color resist unit have different light emitting colors; the color resist unit includes at least two inorganic sub-layers alternately stacked, the color resist units with different light emitting colors contain different numbers of inorganic sub-layers, and the refractive indices of two adjacent inorganic sub-layers are different.

[0045] In some embodiments, forming an inorganic color resist layer on one side of the substrate specifically includes:

[0046] The first parts of the color-resistance units with different light-emitting colors are respectively manufactured. The first part of the color-resistance unit of each light-emitting color is manufactured by the following steps:

[0047] forming a sacrificial layer on one side of the substrate; the sacrificial layer comprises a metal material;

[0048] Performing a patterning process on the sacrificial layer to remove the sacrificial layer in the area corresponding to the color resist unit of the light emitting color;

[0049] forming multiple inorganic sublayers;

[0050] performing patterning on the multi-layer inorganic sub-layer to form a plurality of patterns of the first portion;

[0051] The sacrificial layer is removed.

[0052] In some embodiments, a patterning process is performed on the sacrificial layer to remove the sacrificial layer in the area corresponding to the color-resistance unit of the light-emitting color, specifically including:

[0053] A wet etching process is used to remove the sacrificial layer in the area corresponding to the color resist unit of the light emitting color.

[0054] In some embodiments, after producing a plurality of first parts with different light-emitting colors, the method further includes:

[0055] The second parts of the plurality of color-resistance units are formed on a side of the first part away from the base substrate; the second parts of the plurality of color-resistance units are integrally connected.

[0056] In some embodiments, before forming the inorganic color resist layer, the method further includes:

[0057] A pattern of a first light shielding portion is formed; the orthographic projection of the first light shielding portion on the base substrate covers the area between the orthographic projections of adjacent first portions on the base substrate, and the orthographic projection of the first light shielding portion on the base substrate does not overlap with the sub-pixel opening area.

[0058] An embodiment of the present disclosure provides a display device, which includes the display substrate provided by the embodiment of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0060] FIG1 is a schematic structural diagram of a display substrate provided by an embodiment of the present disclosure;

[0061] FIG2 is a schematic structural diagram of another display substrate provided by an embodiment of the present disclosure;

[0062] FIG3 is a schematic diagram showing the relationship between wavelength and transmittance according to an embodiment of the present disclosure;

[0063] FIG4 is a schematic diagram showing another relationship between wavelength and transmittance provided by an embodiment of the present disclosure;

[0064] FIG5 is a schematic diagram showing another relationship between wavelength and transmittance provided by an embodiment of the present disclosure;

[0065] FIG6 is a schematic structural diagram of another display substrate provided by an embodiment of the present disclosure;

[0066] FIG7 is a schematic structural diagram of another display substrate provided by an embodiment of the present disclosure;

[0067] FIG8 is a schematic structural diagram of another display substrate provided by an embodiment of the present disclosure;

[0068] FIG9 is a schematic structural diagram of another display substrate provided by an embodiment of the present disclosure;

[0069] FIG10 is a schematic structural diagram of another display substrate provided by an embodiment of the present disclosure;

[0070] FIG11 is a schematic structural diagram of another display substrate provided by an embodiment of the present disclosure;

[0071] FIG12 is a schematic structural diagram of another display substrate provided by an embodiment of the present disclosure;

[0072] FIG13 is a schematic structural diagram of another display substrate provided by an embodiment of the present disclosure;

[0073] FIG14 is a schematic structural diagram of another display substrate provided by an embodiment of the present disclosure;

[0074] FIG15 is a schematic structural diagram of another display substrate provided by an embodiment of the present disclosure;

[0075] FIG16 is a schematic structural diagram of another display substrate provided by an embodiment of the present disclosure;

[0076] FIG17 is a schematic structural diagram of another display substrate provided by an embodiment of the present disclosure;

[0077] FIG18 is a schematic structural diagram of another display substrate provided by an embodiment of the present disclosure;

[0078] FIG19 is a schematic structural diagram of another display substrate provided by an embodiment of the present disclosure;

[0079] FIG20 is a schematic structural diagram of another display substrate provided by an embodiment of the present disclosure;

[0080] FIG21 is a schematic structural diagram of another display substrate provided by an embodiment of the present disclosure;

[0081] FIG22 is a schematic structural diagram of another display substrate provided by an embodiment of the present disclosure;

[0082] FIG23 is a schematic structural diagram of another display substrate provided by an embodiment of the present disclosure;

[0083] FIG24 is a schematic structural diagram of another display substrate provided by an embodiment of the present disclosure;

[0084] FIG25 is a schematic flow chart of a method for preparing a display substrate according to an embodiment of the present disclosure;

[0085] 26 to 28 are schematic flow charts of another method for preparing a display substrate according to an embodiment of the present disclosure;

[0086] FIG29 is a schematic structural diagram of a display device provided in an embodiment of the present disclosure.

[0087] 1. Substrate; 2. Subpixel; Subpixel opening 201; Thin film transistor TFT; Gate G; Source S; Drain D; Pixel electrode 202; Inorganic color resist layer 3; Color resist unit 301; Inorganic sublayer 3011; First inorganic sublayer 3011-1; First portion 301-1; Second portion 301-2; Second inorganic sublayer 3011-2; Red subpixel R; Green subpixel G; Blue subpixel B; Red color resist unit r; Green color resist unit g; Blue Color resist unit b; first light shielding portion 4; inclined surface 5; overlapping portion 6; first planarization layer 7; first inorganic insulating layer 8; second planarization layer 9; active layer 10; gate insulating layer 11; common electrode layer 12; buffer layer 13; second protective layer 14; first planar area 15; second light shielding layer 16; scan line 17; data line 18; light emitting device 19; sacrificial layer 20; opposing substrate 21; display substrate 22; liquid crystal layer 23; black matrix 24; second opening area 25. DETAILED DESCRIPTION

[0088] To make the purpose, technical solutions, and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. And, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure can be combined with each other. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0089] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by persons of ordinary skill in the field to which this disclosure belongs. The words "first", "second" and similar terms used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "include" or "comprise" mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0090] It should be noted that the sizes and shapes of the figures in the accompanying drawings do not reflect the actual scale and are only for the purpose of illustrating the present disclosure. The same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions.

[0091] The present disclosure provides a display substrate, as shown in FIG1 and FIG2 , which includes:

[0092] Base substrate 1;

[0093] A plurality of sub-pixels 2 are located on one side of the substrate 1 ; each of the plurality of sub-pixels 2 includes a sub-pixel opening area 201 ;

[0094] The inorganic color resist layer 3 is located on the same side of the base substrate 1 as the multiple sub-pixels 2, and includes multiple color resist units 301; the orthographic projection of the color resist unit 301 on the base substrate 1 covers the orthographic projection of the sub-pixel opening area 201 on the base substrate 1, and the multiple color resist units 301 include: a first color resist unit 26, a second color resist unit 27 and a third color resist unit 28, and at least two of the first color resist unit 26, the second color resist unit 27 and the third color resist unit 28 have different light output colors; the color resist unit 301 includes at least two inorganic sub-layers 3011 arranged alternately, and the color resist units 301 of different light output colors contain different numbers of inorganic sub-layers 3011, and the refractive indices of two adjacent inorganic sub-layers 3011 are different.

[0095] It should be noted that in related technologies, display products use absorptive color filters to emit light corresponding to sub-pixel colors. This light experiences significant energy loss after passing through the color filters, impacting the display product's light utilization. Furthermore, because traditional absorptive color filters are typically made of resin and patterned using photoresist exposure, this process is not suitable for producing small patterns. Therefore, due to the limited size of the color filters, it is difficult to increase the resolution and pixel density of display products.

[0096] It should be noted that inorganic sublayers with different refractive indices are stacked alternately, and light interferes at the interface between the inorganic sublayers with different refractive indices, which increases the reflectivity or transmittance of light within a specific wavelength range. In this way, by setting the refractive index, number of film layers, and thickness of the inorganic sublayer, the alternately stacked multilayer inorganic sublayers can only transmit light within a specific wavelength range.

[0097] The display substrate provided by the embodiment of the present disclosure includes a color resist unit, which is arranged by alternating stacking of at least two inorganic sub-layers, so that the color resist unit transmits light within the wavelength range corresponding to the sub-pixel color. The color resist unit formed by the stacking of inorganic sub-layers does not absorb light, thereby improving the light utilization rate of the display substrate compared to the traditional absorption-type color film. In addition, since the color resist unit is a stack of inorganic sub-layers, it can be patterned using a dry etching process. Compared with the resin color film of the prior art, the size of the color resist unit can be made smaller, which can improve the pixel density of the display product. Therefore, the display substrate provided by the embodiment of the present disclosure can be applied to display products with ultra-high pixel density, such as virtual reality (VR) display products, which increases the application scenarios of the display substrate.

[0098] It should be noted that for VR display products, the resolution is usually 1500 pixel density (PPI) or above, so the pixel size of VR display products is relatively small, usually less than 6 microns, and accordingly, the size of the color filter is also relatively small. However, there are few organic materials suitable for high resolution, and it is difficult to obtain a high-resolution color filter using a photoresist exposure process. In addition, in order to ensure that the color gamut meets the requirements, the color filter thickness of organic materials in the related art is usually greater than 1.5 microns. The high thickness of the color filter is prone to color crosstalk between adjacent sub-pixels and increases the difficulty of subsequent flattening of the color filter. The display substrate provided by the embodiment of the present disclosure uses inorganic sub-layers alternately stacked to form an inorganic color resist layer. A thinner inorganic color resist layer thickness (for example, no more than 1.5 microns) can achieve full-color display, which helps reduce the difficulty of flattening the inorganic color resist layer and thus reduce the difficulty of manufacturing the display substrate. In addition, since the inorganic color resist layer can be patterned using a dry etching process, the accuracy of the dry etching process can be below 2 microns. Even for high-PPI display products with a pixel size of less than 6 microns, the resolution of the color resist unit can meet the requirements.

[0099] It should be noted that FIG1 and FIG2 are schematic diagrams showing the cross-sectional structures of different regions of the substrate.

[0100] In a specific implementation, the light-emitting color of the color-resistance unit is the same as the color of its corresponding sub-pixel.

[0101] In some embodiments, as shown in FIG. 1 and FIG. 2 , different color resist units 301 include inorganic sub-layers 3011 of the same type.

[0102] In some embodiments, as shown in FIG. 1 and FIG. 2 , at least two of the first color resist unit 26 , the second color resist unit 27 , and the third color resist unit 28 have different thicknesses in a direction perpendicular to the base substrate 1 .

[0103] In the display substrate provided by the embodiments of the present disclosure, the color-resistance units for different light-emitting colors comprise the same type of inorganic sublayers. By adjusting the number and thickness of the inorganic sublayers in the color-resistance units, different light-emitting colors can be achieved for each color-resistance unit. This eliminates the need to prepare multiple raw materials and avoids adding additional steps to the display substrate manufacturing process.

[0104] In some embodiments, the difference in thickness between different color resist units in a direction perpendicular to the substrate is less than or equal to 1 micron.

[0105] That is, in the display substrate provided by the embodiment of the present disclosure, the difference in thickness of different color resist units in the direction perpendicular to the base substrate is small, which is conducive to the subsequent planarization process of the inorganic color resist layer and reduces the difficulty of preparing the display substrate.

[0106] In some embodiments, as shown in FIG2 , the plurality of sub-pixels 2 include: a plurality of red sub-pixels R, a plurality of green sub-pixels G, and a plurality of blue sub-pixels B;

[0107] The first color-resist unit 26 is a red color-resist unit r that emits red light, the second color-resist unit 27 is a green color-resist unit g that emits green light, and the third color-resist unit 28 is a blue color-resist unit b that emits blue light; the red color-resist unit r corresponds to the red sub-pixel R, the green color-resist unit g corresponds to the green sub-pixel G, and the blue color-resist unit b corresponds to the blue sub-pixel B;

[0108] In a direction perpendicular to the base substrate 1 , the thickness of the red color-resist unit r is greater than that of the blue color-resist unit b, and the thickness of the green color-resist unit g is greater than that of the red color-resist unit r.

[0109] In a specific implementation, for example, the number of inorganic sub-layers included in the color-resistance units of different light-emitting colors is not exactly the same.

[0110] In a specific implementation, in a direction perpendicular to the substrate, the total thickness of the multiple inorganic sublayers included in the color resist unit is, for example, greater than or equal to 3000 angstroms and less than or equal to 30,000 angstroms. For example, the total thickness of the multiple inorganic sublayers included in the red color resist unit is greater than or equal to 5000 angstroms and less than or equal to 15,000 angstroms, the total thickness of the multiple inorganic sublayers included in the blue color resist unit is greater than or equal to 6000 angstroms and less than or equal to 20,000 angstroms, and the total thickness of the multiple inorganic sublayers included in the green color resist unit is greater than or equal to 3000 angstroms and less than or equal to 12,000 angstroms. Considering the stress requirements, filtering effects, and subsequent difficulty in planarizing the inorganic color resist layer, the total thickness of the multiple inorganic sublayers included in the color resist unit can be, for example, greater than or equal to 5000 angstroms and less than or equal to 15,000 angstroms. The thickness of a single inorganic sublayer is, for example, greater than or equal to 1 nanometer and less than or equal to 1000 nanometers.

[0111] In some embodiments, as shown in FIG. 1 and FIG. 2 , the color resist unit 301 includes a first inorganic sublayer 3011 - 1 and a second inorganic sublayer 3011 - 2 ; the refractive index of the first inorganic sublayer 3011 - 1 is greater than the refractive index of the second inorganic sublayer 3011 - 2 .

[0112] It should be noted that FIG1 and FIG2 illustrate the example of a color resist unit including only the first inorganic sub-layer 3011-1 and the second inorganic sub-layer 3011-2. That is, the color resist unit is formed by alternating stacking of the first inorganic sub-layer 3011-1 and the second inorganic sub-layer 3011-2. Of course, in a specific implementation, the color resist unit may also include more types of inorganic sub-layers.

[0113] In some embodiments, as shown in FIG. 1 and FIG. 2 , the inorganic sub-layer 3011 closest to the base substrate 1 is the first inorganic sub-layer 3011 - 1 .

[0114] In some embodiments, the material of the first inorganic sub-layer includes one or a combination of the following: silicon nitride (SiN), titanium dioxide (TiO2), titanium pentoxide (Ti2O5), niobium pentoxide (Nb2O5), zirconium dioxide (ZrO2), yttrium trioxide (Y2O3), zinc sulfide (ZnS);

[0115] The material of the second inorganic sub-layer 3011 includes one of the following or a combination thereof: silicon oxide (SiO 2 ), magnesium fluoride (MgF 2 ).

[0116] In some embodiments, as shown in FIG1 , FIG2 , and FIG6 , the color resist unit 301 includes a first portion 301 - 1 ;

[0117] The first parts 301 - 1 of the color-resistance units 301 of different light-emitting colors are independently arranged.

[0118] It should be noted that the independent arrangement of the first portions of the color-resist units of different light-emitting colors means that the multiple inorganic sublayers included in the first portions of the color-resist units of different light-emitting colors are independently manufactured. The first portions of the color-resist units of different light-emitting colors can be spaced apart or have overlapping regions.

[0119] It should be noted that if the first portions of the color-resistance units of different light-emitting colors do not overlap with each other, the distance between the first portions of adjacent different color-resistance units is considered to be greater than or equal to 0; if the first portions of the color-resistance units of different light-emitting colors have overlapping areas, the distance between the first portions of adjacent different color-resistance units is considered to be less than 0.

[0120] In some embodiments, an absolute value of a distance between the first portions of adjacent different color-resist units is less than or equal to 10 micrometers.

[0121] In a specific implementation, if the first portions of color-resist units of different light-emitting colors do not overlap, the distance between the first portions of adjacent color-resist units of different light-emitting colors is greater than or equal to 0 and less than or equal to 10 microns. If the first portions of color-resist units of different light-emitting colors overlap, the distance between the first portions of adjacent color-resist units of different light-emitting colors is greater than or equal to -2 microns and less than or equal to 0.

[0122] It should be noted that the absolute value of the distance between the first portions of adjacent color-resistance units of different types can be set based on the required size between adjacent sub-pixel openings, and the specific structure of the adjacent sub-pixel openings can also be considered. For high-resolution display products such as VR, the size between adjacent sub-pixel openings is smaller, and accordingly, the absolute value of the distance between the first portions of adjacent color-resistance units of different types can be further reduced.

[0123] For high-resolution display products, in some embodiments, the absolute value of the distance between the first portions of adjacent different color-resist units is less than or equal to 3 micrometers.

[0124] In a specific implementation, if the first portions of the color-resist units of different light-emitting colors do not overlap, the distance between the first portions of adjacent color-resist units of different colors is greater than or equal to 0 and less than or equal to 3 microns. If the first portions of the color-resist units of different light-emitting colors overlap, the distance between the first portions of adjacent color-resist units of different colors is greater than or equal to -2 microns and less than or equal to 3.

[0125] In some embodiments, as shown in FIG1 and FIG2 , the color resist unit 301 only includes the first portion 301 - 1 , that is, the color resist units 301 of different light emitting colors are independently provided.

[0126] Next, taking the example where the color resist unit only includes the first part, the thickness parameters of the inorganic sub-layer included in the color resist units of different light emitting colors are described with examples.

[0127] As shown in Table 1, the red color resist unit, the green color resist unit, and the blue color resist unit are all formed by alternating stacking of a first inorganic sublayer and a second inorganic sublayer. The material of the first inorganic sublayer is TiO2, and the material of the second inorganic sublayer is SiO2. The smaller the number corresponding to the layer number in Table 1, the closer the inorganic sublayer is to the substrate, that is, the TiO2 layer with a layer number of 1 is the inorganic sublayer closest to the substrate. The red color resist unit and the green color resist unit include 16 inorganic sublayers, and the blue color resist unit includes 9 inorganic sublayers. The total thickness of the red color resist unit is 980 nanometers, the total thickness of the green color resist unit is 1081 nanometers, and the total thickness of the blue color resist unit is 670 nanometers.

[0128] Table 1

[0129] As shown in Table 2, the red color resist unit, the green color resist unit, and the blue color resist unit are all formed by alternating stacking of a first inorganic sublayer and a second inorganic sublayer. The material of the first inorganic sublayer is SiN, and the material of the second inorganic sublayer is SiO2. The smaller the number corresponding to the layer number in Table 2, the closer the inorganic sublayer is to the substrate, that is, the SiN layer with a layer number of 1 is the inorganic sublayer closest to the substrate. The red color resist unit includes 22 inorganic sublayers, the green color resist unit includes 23 inorganic sublayers, and the blue color resist unit includes 19 inorganic sublayers. The total thickness of the red color resist unit is 1846 nanometers, the total thickness of the green color resist unit is 2020 nanometers, and the total thickness of the blue color resist unit is 1713 nanometers. The wavelength-transmittance curves corresponding to the color-resistance unit are shown in Figures 3 to 5, respectively. Figures 3 to 5 also show the wavelength-transmittance relationship of the light emitted by the monochromatic light-emitting device. Curves a, b, and c are the wavelength-transmittance relationship of the light emitted by the blue light-emitting device, the wavelength-transmittance relationship of the light emitted by the green light-emitting device, and the wavelength-transmittance relationship of the light emitted by the red light-emitting device, respectively. Curve d in Figure 3 is the wavelength-transmittance relationship curve of the red color-resistance unit in Table 2, curve e in Figure 4 is the wavelength-transmittance relationship curve of the green color-resistance unit in Table 2, and curve f in Figure 5 is the wavelength-transmittance relationship curve of the blue color-resistance unit in Table 2. As can be seen from Figures 3 to 5, the red color-resistance unit has a higher transmittance for red light and a lower transmittance for blue and green light, the green color-resistance unit has a higher transmittance for green light and a lower transmittance for blue and red light, and the blue color-resistance unit has a higher transmittance for blue light and a lower transmittance for red and green light. That is, by alternately stacking inorganic sublayers with different refractive indices and designing the number and thickness of the inorganic sublayers, the structure formed by the alternating stacking of multiple inorganic sublayers can have the function of a color filter, that is, the output light of the color resist unit formed by the alternating stacking of multiple inorganic sublayers corresponds to the sub-pixel color.

[0130] Table 2

[0131] In a specific implementation, for example, as shown in Tables 1 and 2, the thicknesses of the inorganic sub-layers with the same layer number in the color-resist units of different light-emitting colors may be completely different or not completely the same. Of course, in a specific implementation, the thicknesses of at least some of the inorganic sub-layers with the same layer number in the color-resist units of different light-emitting colors may also be the same. In this way, these inorganic sub-layers can serve as a common layer of the color-resist layer, eliminating the need for patterning.

[0132] In some embodiments, as shown in FIG6 , the color resist unit 301 further includes a second portion 301 - 2 located on a side of the first portion 301 - 1 away from the base substrate 1 ; and the second portions 301 - 2 of the plurality of color resist units 301 are integrally connected.

[0133] It should be noted that since the color resist units are made of inorganic materials, a patterning process is required after the inorganic material film is formed. The patterning process for the inorganic film typically includes an etching process. Since the color resist units are relatively thick—for example, the green color resist unit in the solution corresponding to Table 1 is thicker than 1000 nanometers, and the green color resist unit in the solution corresponding to Table 2 is thicker than 2000 nanometers—etching is more difficult when the film layer is thick.

[0134] In the display substrate provided by the embodiment of the present disclosure, the second parts of the color resist units of different light-emitting colors are connected as one body, that is, only a graphic process is required to form the pattern of the first part, which reduces the thickness of the film layer that needs to be etched and simplifies the difficulty of preparing the color resist units.

[0135] In a specific implementation, both the first and second portions include alternating stacks of first and second inorganic sublayers. For example, the first portion of the color-resist units of different light-emitting colors may include different numbers of inorganic sublayers. The second portion of the color-resist units of different light-emitting colors may include the same number and thickness of inorganic sublayers.

[0136] In some embodiments, as shown in FIG. 6 , the first portions 301 - 1 of at least two of the first color resist unit 26 , the second color resist unit 27 , and the third color resist unit 28 have different thicknesses in a direction perpendicular to the base substrate 1 .

[0137] In some embodiments, as shown in FIG. 6 , the thicknesses of the first portion 301 - 1 of the first color resist unit 26 , the second color resist unit 27 , and the third color resist unit 28 in a direction perpendicular to the base substrate 1 are all different.

[0138] In some embodiments, as shown in FIG6 , in a direction perpendicular to the base substrate 1 , the thickness of the first portion 301-1 of the red color-resist unit r is greater than the thickness of the first portion 301-1 of the blue color-resist unit b, and the thickness of the first portion 301-1 of the green color-resist unit g is greater than the thickness of the first portion 301-1 of the red color-resist unit r. In this way, the thickness of the red color-resist unit r is greater than the thickness of the blue color-resist unit b, and the thickness of the green color-resist unit g is greater than the thickness of the red color-resist unit r, in a direction perpendicular to the base substrate 1.

[0139] In some embodiments, as shown in FIG7 and FIG8 , the display substrate further includes:

[0140] The first light shielding portion 4 is located between the first portion 301-1 and the base substrate 1; the orthographic projection of the first light shielding portion 4 on the base substrate 1 covers the area between the orthographic projections of adjacent first portions 301-1 on the base substrate 1, and the orthographic projection of the first light shielding portion 4 on the base substrate 1 does not overlap with the sub-pixel opening area 201.

[0141] The display substrate provided by the disclosed embodiments has a first light shielding portion disposed between adjacent first portions and between sub-pixel opening regions, thereby preventing light leakage from the region between adjacent sub-pixel opening regions, improving the brightness of light emitted from the sub-pixel opening regions, and thereby enhancing the contrast of the display substrate. Furthermore, the orthographic projection of the first light shielding portion on the base substrate does not overlap with the sub-pixel opening regions, thereby preventing the first light shielding portion from blocking the sub-pixel opening regions and affecting the sub-pixel aperture ratio.

[0142] It should be noted that FIG7 illustrates the color resist unit 301 as including only the first portion 301-1. FIG8 illustrates the color resist unit 301 as including the first portion 301-1 and the second portion 301-2. In the area between the sub-pixel opening areas 201 and between adjacent first portions 301-1, the second portion 301-2 covers the first light shielding portion 4.

[0143] It should be noted that Figures 1, 2, and 6 to 8 illustrate the example of a side surface of the first portion 301-1 being perpendicular to the base substrate 1. However, in the actual fabrication of the inorganic color resist layer, when the first portion is formed by an etching process, due to process limitations, the angle between the side surface of the pattern of the first portion and the base substrate may be less than 90°.

[0144] In some embodiments, as shown in FIG. 9 to FIG. 14 , the side surface of the first portion 301 - 1 includes an inclined surface 5 having an angle less than 90° with the plane where the base substrate 1 is located.

[0145] It should be noted that Figures 9, 11, and 13 illustrate the case where the region between the first portions 301-1 is not provided with the first light shielding portion. The first portion 301-1 has a trapezoidal shape in a cross-section perpendicular to the base substrate 1, with the upper base of the trapezoid being shorter than the lower base. Figures 10, 12, and 14 illustrate the case where the region between the first portions 301-1 is provided with the first light shielding portion 4. The portion of the first portion 301-1 above the first light shielding portion 4 has a trapezoidal shape in a cross-section perpendicular to the base substrate 1, with the upper base of the trapezoid being shorter than the lower base.

[0146] In a specific implementation, the included angle between the inclined surface and the base substrate is greater than or equal to 60° and less than 90°.

[0147] In some embodiments, an absolute value of a minimum distance between the inclined surfaces of two adjacent first portions is less than or equal to 5 micrometers.

[0148] In some embodiments, the inclined surfaces of two adjacent first portions do not overlap. As shown in FIG9 and FIG10 , the minimum distance h1 between the inclined surfaces 5 of two adjacent first portions 301 - 1 is greater than or equal to 0 and less than or equal to 5 μm.

[0149] It should be noted that the minimum distance between the inclined surfaces of two first portions is the distance between the bottom ends of the inclined surfaces of the two first portions. Figures 9 and 10 illustrate an example where h1 is greater than 0. In a specific implementation, the minimum distance between the inclined surfaces 5 of two adjacent first portions 301-1 can also be equal to 0, as shown in Figures 11 and 12.

[0150] It should be noted that when the color resist unit includes a first portion and a second portion, the display substrates shown in FIG. 13 and FIG. 14 according to the embodiments of the present disclosure are illustrated by taking an example where h1 is greater than 0. Of course, in a specific implementation, when the color resist unit includes a first portion and a second portion, h1 may also be set to 0.

[0151] Of course, in some embodiments, as shown in FIG. 15 , in the region between adjacent sub-pixel opening areas 201 , the orthographic projections of adjacent first portions 301 - 1 on the base substrate 1 overlap;

[0152] Furthermore, the orthographic projection of the first portion 301 - 1 on the base substrate 1 and the orthographic projection of the sub-pixel opening area 201 corresponding to the adjacent first portion 301 - 1 on the base substrate 1 do not overlap with each other.

[0153] That is, the areas between the sub-pixel opening areas of adjacent color-resistance units may overlap.

[0154] It should be noted that adjacent first portions overlap only in the region between the sub-pixel opening areas, but do not overlap in the sub-pixel opening areas, which does not affect the light emission color of the sub-pixel opening areas.

[0155] In a specific implementation, in the area between the sub-pixel opening areas, the transmittance of the visible light in the overlapping area of ​​adjacent color-resistance units can be reduced to avoid light crosstalk between the sub-pixels.

[0156] In some embodiments, as shown in FIG16 , the orthographic projection of any first portion 301 - 1 on the base substrate 1 covers the orthographic projection of the area between adjacent sub-pixel opening areas 201 on the base substrate 1 ;

[0157] The inorganic color resist layer 3 further includes: a plurality of overlapping portions 6; the orthographic projection of the overlapping portion 6 on the base substrate 1 covers the orthographic projection of the area between adjacent sub-pixel opening areas 201 on the base substrate 1, and the orthographic projection of the overlapping portion 6 on the base substrate 1 does not overlap with the orthographic projection of the sub-pixel opening area 201 on the base substrate 1.

[0158] In some embodiments, the visible light transmittance of the region where the orthographic projections of adjacent color-resistance units and overlapping portions on the substrate overlap between adjacent sub-pixel openings is less than 5%. This means that visible light cannot pass through the region where the orthographic projections of the color-resistance units and overlapping portions on the substrate overlap. This creates a light-shielding effect between the color-resistance units and overlapping portions in this region, preventing light crosstalk between sub-pixels.

[0159] In some embodiments, the overlapping portion is also formed by alternating stacks of inorganic sublayers with different refractive indices. When the color resist unit includes a first inorganic sublayer and a second inorganic sublayer, the overlapping portion may also include the first inorganic sublayer and the second inorganic sublayer.

[0160] In some embodiments, the number and thickness of the inorganic sub-layers included in the multiple stacking parts are not exactly the same.

[0161] In some embodiments, as shown in FIG. 16 , the overlapping portion 6 is located on a side of the inorganic color resist layer 3 facing away from the base substrate 1 .

[0162] In a specific implementation, the overlapping portion can be formed after the inorganic color resist layer is manufactured.

[0163] Alternatively, in some embodiments, the overlapping portion is located between the inorganic color resist layer and the base substrate, that is, the overlapping portion is formed first and then the inorganic color resist layer is formed. When the display substrate includes a first light shielding layer, the overlapping portion is located between the first light shielding layer and the inorganic color resist layer.

[0164] Alternatively, in some embodiments, the overlapping portion can be arranged in the same layer as the first portion of a certain color resist unit. The overlapping portion corresponding to adjacent red color resist units and green color resist units is the first overlapping portion, the overlapping portion corresponding to adjacent red color resist units and blue color resist units is the second overlapping portion, and the overlapping portion corresponding to adjacent green color resist units and blue color resist units is the third overlapping portion. That is, the first overlapping portion is arranged in the same layer as the first portion of the blue color resist unit, the second overlapping portion is arranged in the same layer as the first portion of the green color resist unit, and the third overlapping portion is arranged in the same layer as the first portion of the red color resist unit. The positions of the first overlapping portion, the second overlapping portion, and the third overlapping portion are related to the manufacturing order of the red color resist unit, the blue color resist unit, and the green color resist unit. If a red color resist unit, a blue color resist unit, and a green color resist unit are manufactured in sequence, then in a direction perpendicular to the base substrate, the first overlapping portion is located between the first portion of the red color resist unit and the first portion of the green color resist unit, the second overlapping portion is located on the side of the first portion of the red color resist unit and the first portion of the blue color resist unit facing away from the base substrate, and the third overlapping portion is located between the base substrate and the first portion of the green color resist unit and the first portion of the blue color resist unit.

[0165] In some embodiments, as shown in Figures 9 to 16 , the surface of the first portion 301 - 1 away from the base substrate 1 includes a first planar region 15 ; the orthographic projection of the first planar region 15 on the base substrate 1 covers the sub-pixel opening region 201 . That is, the width h2 of the first planar region 15 is greater than or equal to the width h3 of the sub-pixel opening region 201 .

[0166] In the display substrate provided by the embodiment of the present disclosure, the first planar area covers the sub-pixel opening area on the base substrate, that is, the area corresponding to the sub-pixel opening area. The first part includes a complete multi-layer inorganic sublayer, and the inclined surface of the first part is only located between the sub-pixel opening areas, thereby ensuring that the color resist unit includes a complete multi-layer inorganic sublayer, and avoiding the change in the thickness of the inorganic sublayer in the area corresponding to the inclined surface affecting the light transmittance.

[0167] In some embodiments, as shown in FIG. 1 , the sub-pixel 2 includes: a thin film transistor TFT, and a pixel electrode 202 located on a side of the thin film transistor TFT facing away from the base substrate 1 .

[0168] That is, the display substrate provided by the embodiment of the present disclosure can be used as an array substrate of a liquid crystal display panel.

[0169] In some embodiments, as shown in Figure 1, the thin film transistor TFT includes: a gate G, a source S and a drain D; the display panel also includes: a first inorganic insulating layer 8 located between the gate G and the source S and drain D, and a second planarization layer 9 located between the source S and drain D and the pixel electrode 202.

[0170] In some embodiments, as shown in FIG1 , the thin film transistor (TFT) further includes an active layer 10. In FIG1 , the thin film transistor (TFT) has a top-gate structure, meaning that the gate electrode G is located on the side of the active layer 10 facing away from the base substrate 1. Of course, in specific implementations, the thin film transistor may also have a bottom-gate structure, meaning that the gate electrode is located between the active layer and the base substrate.

[0171] In some embodiments, as shown in FIG. 1 , the display substrate further includes a gate insulating layer 11 located between the gate G and the active layer 10 .

[0172] In a specific implementation, for example, the thin film transistor does not overlap with the sub-pixel opening area, that is, the thin film transistor is located in an area outside the sub-pixel opening area, for example, the thin film transistor is located in an area between adjacent sub-pixel opening areas, thereby avoiding affecting the light transmittance of the sub-pixel opening area. In a specific implementation, the orthographic projection of the color resist unit on the base substrate can cover the orthographic projection of the thin film transistor on the base substrate.

[0173] In some embodiments, as shown in FIG. 1 , the display substrate further includes a buffer layer 13 located between the base substrate 1 and the thin film transistor TFT.

[0174] In some embodiments, as shown in Figure 1, the display substrate further includes: a first protective layer 13 located on the side of the pixel electrode 202 facing away from the base substrate 1; a common electrode layer 12 located on the side of the first protective layer 13 facing away from the base substrate 1, and a second protective layer 14 located on the side of the common electrode layer 12 facing away from the base substrate 1.

[0175] In some embodiments, as shown in FIG1 , the inorganic color resist layer 3 is located between the base substrate 1 and the sub-pixel 2 ;

[0176] The display substrate further includes a first planarization layer 7 located between the inorganic color resist layer 3 and the sub-pixel 2 .

[0177] In specific implementations, the thin film transistor process involves high temperature processes. To prevent the high temperature processes from affecting the inorganic color resist layer, the first planarization layer may be made of a high temperature resistant material. The first planarization layer may withstand a temperature greater than 300 degrees Celsius (°C), for example.

[0178] In some embodiments, the material of the first planarization layer includes organic silicon (SOG). SOG material is resistant to high temperatures and has good planarization effect, which is beneficial to improving the yield of the display substrate.

[0179] In some embodiments, the thickness of the first planarization layer in a direction perpendicular to the substrate is greater than or equal to 0.5 micrometers and less than or equal to 2 micrometers.

[0180] In some embodiments, as shown in FIG17 , the display substrate further includes a second light shielding layer 16 located between the buffer layer 13 and the thin film transistor TFT, and the orthographic projection of the active layer 10 on the base substrate 1 falls within the orthographic projection of the second light shielding layer 16 on the base substrate 1 .

[0181] Therefore, the second light-shielding layer can shield the active layer of the thin film transistor, thereby preventing light from entering the channel region of the thin film transistor and affecting the working stability of the thin film transistor.

[0182] In a specific implementation, the second light shielding layer and the sub-pixel opening area do not overlap, that is, the second light shielding layer is also located in an area outside the sub-pixel opening area. For example, the second light shielding layer is located in an area between adjacent sub-pixel opening areas, thereby avoiding affecting the light transmittance of the sub-pixel opening area. In a specific implementation, the orthographic projection of the color resist unit on the base substrate can be the orthographic projection of the second light shielding layer on the base substrate.

[0183] In some embodiments, as shown in FIG. 1 , when the inorganic color resist layer 3 is located between the base substrate 1 and the sub-pixel 2 , the buffer layer 13 is located between the first planarization layer 7 and the thin film transistor TFT.

[0184] In some embodiments, as shown in FIG18 , the display substrate further includes a plurality of scan lines 17 and a plurality of data lines 18 . The scan lines 17 and the data lines 18 are arranged to intersect with each other to divide the sub-pixel area. The scan lines 17 extend along a first direction X, and the data lines 18 extend along a second direction Y.

[0185] In a specific implementation, the scan line is electrically connected to the gate electrode, and the data line is electrically connected to the source electrode.

[0186] In a specific implementation, the orthographic projections of the scan line and the data line on the substrate do not overlap with the sub-pixel opening area. When the color resist unit overlaps with the area between the adjacent sub-pixel opening areas in the first direction X, the orthographic projection of the color resist unit on the substrate substrate can overlap with the orthographic projection of the data line on the substrate substrate, and the orthographic projection of the color resist unit on the substrate substrate can also overlap with the orthographic projection of the scan line on the substrate substrate. Taking the data line as an example, as shown in Figure 19, the orthographic projection of the data line 18 on the substrate substrate 1 covers the orthographic projection of the inclined surface 5 of the first part 301-1 on the substrate substrate 1. In a specific implementation, as shown in Figure 19, the side of the data line 18 is also an inclined surface. The data line 18 is, for example, arranged in the same layer as the source and drain (not shown), that is, the data line 18 is located on the side of the first inorganic insulating layer 8 facing away from the substrate 1.

[0187] It should be noted that the film layer between the first planarization layer 7 and the first inorganic insulating layer 8 is omitted in FIG. 19 .

[0188] In a specific implementation, the orthographic projection of the data line on the base substrate overlaps the orthographic projection of the inclined surface of the first portion on the base substrate, so the absolute value of the distance between any position of the inclined surfaces of adjacent first portions does not exceed the line width of the data line. For high-resolution display products, the line width of the data line is smaller. For example, for a display product with 1200PPI, the line width of the data line is greater than or equal to 1.2 microns and less than or equal to 2 microns; for example, when the line width of the data line is equal to 1.2 microns, the absolute value of the distance between any position of the inclined surfaces of adjacent first portions does not exceed 1.2 microns. For a display product with 1500PPI, the line width of the data line is greater than or equal to 1 micron and less than or equal to 1.8 microns; for example, when the line width of the data line is equal to 1 micron, the absolute value of the distance between any position of the inclined surfaces of adjacent first portions does not exceed 1 micron. For display products with a PPI greater than 2000, the line width of the data line is greater than or equal to 1 micron and less than or equal to 1.5 microns; for example, when the line width of the data line is equal to 1.5 microns, the absolute value of the distance at any position between the inclined surfaces of adjacent first parts does not exceed 1.5 microns.

[0189] In a specific implementation, for two color resist units adjacent in the second direction, their orthographic projections on the base substrate cover the orthographic projections of the inclined surface of the first portion on the base substrate. The side surface of the scanning line may also be an inclined scanning line.

[0190] In a specific implementation, the scan line is provided in the same layer as the gate. When the first portions of the plurality of color resist units are disconnected from each other in the second direction, the orthographic projection of the scan line on the base substrate covers the orthographic projection of the inclined surface of the first portion on the base substrate.

[0191] Alternatively, in some embodiments, as shown in FIG. 20 , the inorganic color resist layer 3 is located between the thin film transistor TFT and the pixel electrode 202 .

[0192] In some embodiments, as shown in FIG20 , the inorganic color resist layer 3 is located between the first inorganic insulating layer 8 and the second planarization layer 9. That is, the inorganic color resist layer is formed on the side of the first inorganic insulating layer facing away from the base substrate.

[0193] It should be noted that the insulating layer on the side of the first inorganic insulating layer facing away from the base substrate, such as the second planarization layer, is usually an organic insulating layer. Compared with the organic film layer, the inorganic film layer is not easily damaged in the etching process, especially the dry etching process. Making an inorganic color resist layer on the first inorganic insulating layer can avoid affecting the yield of the display substrate.

[0194] In a specific implementation, an inorganic color resist layer can be formed on the first inorganic insulating layer after forming the source and drain electrodes. The inorganic color resist layer can cover part of the source and drain electrodes, but needs to avoid the area where the pixel electrode and the drain electrode are electrically connected.

[0195] It should be noted that, since the second planarization layer covers the inorganic color resist layer, the second planarization layer includes a material that is resistant to high temperatures. For example, the material included in the second planarization layer is resistant to temperatures greater than 200°C.

[0196] In some embodiments, the material of the second planarization layer includes resin. The resin material is heat-resistant and has a light transmittance greater than 90%. While ensuring the planarization effect, it can avoid damage to the inorganic color resist layer and improve the light utilization rate of the display substrate.

[0197] In some embodiments, the thickness of the second planarization layer in a direction perpendicular to the substrate is greater than or equal to 0.5 micrometers and less than or equal to 2 micrometers.

[0198] Of course, in some embodiments, according to actual needs, it can also be set as shown in FIG. 21 , where the inorganic color resist layer 3 is located on the side of the sub-pixel 2 away from the base substrate 1 .

[0199] In a specific implementation, when the display substrate further includes a common electrode, for example, as shown in FIG21 , the inorganic color resist layer 3 is located on the side of the second protective layer 14 facing away from the base substrate 1. In a specific implementation, the display substrate may further include a third protective layer located on the side of the inorganic color resist layer facing away from the base substrate.

[0200] In specific implementation, the display substrate can also be applied to electroluminescent display products.

[0201] In some embodiments, as shown in FIG. 22 , the sub-pixel 2 includes a light-emitting device 19 ; and the inorganic color resist layer 3 is located on a side of the light-emitting device 19 facing away from the base substrate 1 .

[0202] In a specific implementation, the light-emitting device may be, for example, an electroluminescent device. The electroluminescent device may be, for example, at least one of an organic light-emitting diode device, a quantum dot light-emitting diode device, and a micro-sized inorganic light-emitting diode device. The micro-sized inorganic light-emitting diode device may be, for example, a micro inorganic light-emitting diode device or a mini inorganic light-emitting diode device.

[0203] In a specific implementation, when the light-emitting device is an organic light-emitting diode device or a quantum dot light-emitting diode device, the display substrate further includes: a pixel driving circuit located between the base substrate and the light-emitting device. The pixel driving circuit includes a plurality of thin-film transistors and may also include a capacitor. The display substrate further includes a pixel definition layer, the pixel definition layer includes a first opening area corresponding to the sub-pixel opening area, and the light-emitting device includes an anode, a light-emitting functional layer, and a cathode stacked in the first opening area. In a specific implementation, the pattern of the anode is first made, and then the pixel definition layer is made. The pixel definition layer covers the edge of the anode, and the orthographic projection of the first opening area on the base substrate falls within the orthographic projection of the anode on the base substrate. The anode is electrically connected to the drain of at least one thin-film transistor. The cathodes of different light-emitting devices can be connected as one.

[0204] In some embodiments, as shown in FIG. 22 , the display substrate further includes an encapsulation layer 20 between the light-emitting device 19 and the inorganic color resist layer 3 .

[0205] In a specific implementation, when the light-emitting device is an organic light-emitting diode device or a quantum dot light-emitting diode device, the encapsulation layer includes, for example, an inorganic encapsulation layer, an organic encapsulation layer, and an inorganic encapsulation layer that are stacked.

[0206] In a specific implementation, when the display substrate includes a light-emitting device, the display substrate can serve as a backlight source for a liquid crystal display panel backlight module. Of course, the display substrate can also directly serve as a display panel for display. The display panel can improve color purity by providing a color resistance unit to filter the light emitted by the light-emitting device.

[0207] In some embodiments, as shown in FIG. 23 , the color resist unit 301 corresponds to the sub-pixel 2 on a one-to-one basis.

[0208] Alternatively, in some embodiments, as shown in FIG24 , each color-resistance unit 301 corresponds to a plurality of consecutively arranged sub-pixels 2 of the same color. In FIG24 , a column of sub-pixels 2 arranged in the second direction Y have the same color, and each color-resistance unit 301 extends along the second direction Y and corresponds to a column of sub-pixels 2 arranged in the second direction Y.

[0209] When sub-pixels of the same color are arranged continuously, in the display substrate provided by the embodiment of the present disclosure, each color resist unit corresponds to a plurality of sub-pixels arranged continuously and having the same color, thereby simplifying the difficulty of preparing the color resist unit.

[0210] It should be noted that Figures 23 and 24 illustrate an example in which a column of sub-pixels 2 arranged in the second direction Y have the same color, and the colors of adjacent sub-pixels in the first direction X are different. In a specific implementation, it can also be set that the colors of adjacent sub-pixels in the second direction Y are different. In a specific implementation, the red sub-pixel R, blue sub-pixel B, and green sub-pixel G in Figures 23 and 24 constitute a pixel, and the red sub-pixel R, blue sub-pixel B, and green sub-pixel G are arranged in a row in the first direction X. In a specific implementation, the red sub-pixel R, blue sub-pixel B, and green sub-pixel G included in a pixel can also be arranged in multiple rows, and two adjacent sub-pixels in a pixel can also be staggered, for example, the centers of the two adjacent sub-pixels are continuously non-parallel to the first direction and / or non-parallel to the second direction. Regardless of the sub-pixel arrangement, the display substrate can include the inorganic color resist layer provided by the embodiment of the present disclosure.

[0211] It should be noted that Figures 23 and 24 illustrate the rectangular shape of the color resist unit 301 on the substrate. In specific implementations, the shape of the color resist unit on the substrate can be configured based on the shape of the sub-pixel opening area. For example, the shape of the color resist unit on the substrate can be configured to match the shape of the sub-pixel opening area on the substrate. For example, when the sub-pixel opening area is approximately pentagonal, the shape of the color resist unit on the substrate can also be configured to be pentagonal.

[0212] Based on the same inventive concept, the present disclosure also provides a method for preparing a display substrate, as shown in FIG25 , comprising:

[0213] S101, providing a substrate;

[0214] S102. An inorganic color resist layer and a plurality of sub-pixels are formed on one side of a base substrate; each of the plurality of sub-pixels includes a sub-pixel opening area; the inorganic color resist layer includes a plurality of color resist units; an orthographic projection of the color resist unit on the base substrate covers an orthographic projection of the sub-pixel opening area on the base substrate, and the plurality of color resist units include: a first color resist unit, a second color resist unit, and a third color resist unit, and at least two of the first color resist unit, the second color resist unit, and the third color resist unit have different light emitting colors; the color resist unit includes at least two inorganic sub-layers alternately stacked, and the color resist units with different light emitting colors contain different numbers of inorganic sub-layers, and the refractive indices of two adjacent inorganic sub-layers are different.

[0215] The method for preparing a display substrate provided by the embodiment of the present disclosure forms an inorganic color resist layer by alternately stacking at least two inorganic sub-layers, and the color resist unit included in the inorganic color resist layer transmits light within the wavelength range corresponding to the sub-pixel color. The color resist unit formed by the stack of inorganic sub-layers does not absorb light, thereby improving the light utilization rate of the display substrate compared to the traditional absorption-type color film. Moreover, since the color resist unit is a stack of inorganic sub-layers, it can be patterned using a dry etching process. Compared with the resin color film of the prior art, the size of the color resist unit can be made smaller, which can improve the pixel density of the display product. Therefore, the display substrate provided by the embodiment of the present disclosure can be applied to display products with ultra-high pixel density, such as virtual reality (VR) display products, which increases the application scenarios of the display substrate.

[0216] In some embodiments, S102 forms an inorganic color resist layer on one side of the base substrate, specifically including:

[0217] As shown in FIG26 to FIG28 , the first parts of the color-resistance units with different light-emitting colors are respectively manufactured. The first part of the color-resistance unit of each light-emitting color is comprised by the following steps:

[0218] S1021, forming a sacrificial layer 20 on one side of the base substrate 1;

[0219] S1022, performing a patterning process on the sacrificial layer 20 to remove the sacrificial layer 20 in the area corresponding to the color resist unit 301 of the light emitting color;

[0220] S1023, forming a multi-layer inorganic sublayer 3011;

[0221] S1024, performing patterning processing on the multi-layer inorganic sub-layer 3011 to form a plurality of patterns of the first portion 301-1;

[0222] S1025 , removing the sacrificial layer 20 .

[0223] It should be noted that FIG26 shows the steps for making the first portion 301-1 of the red color-resist unit r, FIG27 shows the steps for making the first portion 301-1 of the blue color-resist unit b, and FIG28 shows the steps for making the first portion 301-1 of the green color-resist unit g. That is, the red color-resist unit, the blue color-resist unit, and the green color-resist unit are sequentially made using the method shown in FIG26 to FIG28. Of course, the red color-resist unit, the blue color-resist unit, and the green color-resist unit can also be made in another order.

[0224] It should be noted that Figures 26 to 28 illustrate the example of a side surface of the first portion 301-1 being perpendicular to the base substrate 1. However, when the first portion is formed using an etching process, due to process limitations, the angle between the side surface of the pattern of the first portion and the base substrate may be less than 90°. In other words, the side surface of the first portion may include an inclined surface.

[0225] The display substrate fabrication method provided by the disclosed embodiments forms a sacrificial layer before forming color-resistance units with the same light-emitting color. This protects the underlying layers of the inorganic color-resist layer. Furthermore, the sacrificial layer can be removed using a dry etching process, thus avoiding damage to the already formed inorganic color-resist layer and the underlying layers.

[0226] In a specific implementation, the sacrificial layer at least covers the sub-pixel opening area.

[0227] In some embodiments, as shown in FIG. 26 , a pattern of the sacrificial layer 20 corresponds to a sub-pixel opening area 201 .

[0228] In a specific implementation, when manufacturing the first portion of the red color-resistance unit, part of the sacrificial layer covers the sub-pixel opening area of ​​the blue sub-pixel, and the remaining part of the sacrificial layer covers the sub-pixel opening area of ​​the green sub-pixel. When manufacturing the first portion of the blue color-resistance unit, part of the sacrificial layer covers the sub-pixel opening area of ​​the red sub-pixel, and the remaining part of the sacrificial layer covers the sub-pixel opening area of ​​the green sub-pixel. When manufacturing the first portion of the green color-resistance unit, part of the sacrificial layer covers the sub-pixel opening area of ​​the blue sub-pixel, and the remaining part of the sacrificial layer covers the sub-pixel opening area of ​​the red sub-pixel.

[0229] Alternatively, in some embodiments, a pattern of a sacrificial layer may correspond to a plurality of sub-pixel opening areas.

[0230] During specific implementation, the multi-layer inorganic sub-layers are patterned, for example, including the steps of photoresist coating, exposure, development, dry etching, etc.

[0231] In some embodiments, a patterning process is performed on the sacrificial layer to remove the sacrificial layer in the area corresponding to the color-resistance unit of the light-emitting color, specifically including:

[0232] A wet etching process is used to remove the sacrificial layer in the area corresponding to the color resist unit of the light emitting color.

[0233] In the method for preparing the display substrate provided in the embodiment of the present disclosure, a wet etching process can be used to remove the sacrificial layer. Compared with a dry etching process, this can avoid damaging the already formed inorganic color resist layer and the film layer below the inorganic color resist layer.

[0234] In some embodiments, the sacrificial layer includes a metallic material.

[0235] In a specific implementation, the sacrificial layer includes one of the following or a combination thereof: molybdenum, aluminum.

[0236] In some embodiments, the thickness of the sacrificial layer is greater than or equal to 100 angstroms and less than or equal to 2000 angstroms.

[0237] In some embodiments, after manufacturing the first part of the color-resistance unit having different light colors, the method further includes:

[0238] The second parts of the plurality of color-resistance units are formed on a side of the first part away from the base substrate; the second parts of the plurality of color-resistance units are integrally connected.

[0239] In some embodiments, before forming the inorganic color resist layer, the method further includes:

[0240] A pattern of a first light shielding portion is formed; the orthographic projection of the first light shielding portion on the base substrate covers the area between the orthographic projections of adjacent first portions on the base substrate, and the orthographic projection of the first light shielding portion on the base substrate does not overlap with the sub-pixel opening area.

[0241] The method for manufacturing a display substrate provided by the disclosed embodiments provides a first light shielding portion between adjacent first portions and between sub-pixel opening regions, thereby preventing light leakage from the region between adjacent sub-pixel opening regions, improving the brightness of light emitted from the sub-pixel opening regions, and thereby enhancing the contrast of the display substrate. Furthermore, the orthographic projection of the first light shielding portion on the base substrate does not overlap with the sub-pixel opening regions, thereby preventing the first light shielding portion from blocking the sub-pixel opening regions and affecting the sub-pixel aperture ratio.

[0242] In some embodiments, further comprising:

[0243] A pattern of an overlapping portion is formed; the orthographic projection of the overlapping portion on the base substrate covers the orthographic projection of the area between adjacent sub-pixel opening areas on the base substrate, and the orthographic projection of the overlapping portion on the base substrate does not overlap with the orthographic projection of the sub-pixel opening area on the base substrate.

[0244] In some embodiments, the pattern of the overlapping portion may be formed after forming the inorganic color resist layer.

[0245] Alternatively, in some embodiments, the pattern of the overlapping portion may be formed before forming the inorganic color resist layer. When the display substrate includes a first light shielding portion, the pattern of the overlapping portion may be formed after forming the pattern of the first light shielding portion, and then the inorganic color resist layer may be formed.

[0246] Alternatively, in some embodiments, the pattern of the overlapping portion may be formed while forming the inorganic color resist layer.

[0247] In some embodiments, the plurality of color resist units include a red color resist unit, a blue color resist unit, and a green color resist unit. The overlapping portion corresponding to adjacent red color resist units and green color resist units is a first overlapping portion, the overlapping portion corresponding to adjacent red color resist units and blue color resist units is a second overlapping portion, and the overlapping portion corresponding to adjacent green color resist units and blue color resist units is a third overlapping portion. The pattern forming the overlapping portion specifically includes:

[0248] The first overlapping portion pattern is formed while forming the first portion of the blue color resist unit, the second overlapping portion pattern is formed while forming the first portion of the green color resist unit, and the third overlapping portion pattern is formed while forming the first portion of the red color resist unit.

[0249] In some embodiments, the display substrate is applied to liquid crystal display, and the display substrate serves as an array substrate of a liquid crystal display panel.

[0250] In some embodiments, forming a sub-pixel specifically includes:

[0251] A thin film transistor and a pixel electrode are formed.

[0252] In some embodiments, before forming the sub-pixel, the method further includes:

[0253] forming a buffer layer;

[0254] Forming a thin film transistor specifically includes:

[0255] An active layer, a gate insulating layer, a gate electrode, a first inorganic insulating layer, a source electrode and a drain electrode are sequentially formed on a side of the buffer layer away from the substrate.

[0256] In some embodiments, before forming the thin film transistor, the method further includes:

[0257] A pattern of a second light shielding layer is formed on the side of the buffer layer facing away from the base substrate.

[0258] In some embodiments, after forming the thin film transistor, the method further includes:

[0259] forming a second planarization layer;

[0260] Forming the pixel electrode specifically includes:

[0261] A pixel electrode pattern is formed on a side of the second planarization layer facing away from the base substrate.

[0262] In some embodiments, after forming the pixel electrode, the method further includes:

[0263] forming a first protective layer;

[0264] forming a common electrode pattern on a side of the first protective layer facing away from the base substrate;

[0265] A second protective layer is formed on a side of the common electrode facing away from the base substrate.

[0266] In some embodiments, after forming the inorganic color resist layer, the method further includes:

[0267] forming a first planarization layer;

[0268] Forming sub-pixels, specifically including:

[0269] A thin film transistor and a pixel electrode are sequentially formed on a side of the first planarization layer facing away from the base substrate.

[0270] In a specific implementation, forming the first planarization layer specifically includes: coating organic silicon as the first planarization layer.

[0271] Alternatively, in some embodiments, forming an inorganic color resist layer and a plurality of sub-pixels on one side of the base substrate specifically includes:

[0272] forming a plurality of thin film transistors on one side of the base substrate;

[0273] forming a plurality of color resist units located on the same layer as the source and drain electrodes of the thin film transistor;

[0274] forming a first planarization layer on a side of the color resist unit facing away from the base substrate;

[0275] A pixel electrode is formed on a side of the first planarization layer facing away from the substrate.

[0276] Alternatively, in some embodiments, forming an inorganic color resist layer and a plurality of sub-pixels on one side of the base substrate specifically includes:

[0277] forming a plurality of thin film transistors and a plurality of pixel electrodes on one side of the base substrate;

[0278] An inorganic color resist layer is formed on the side of the pixel electrode facing away from the base substrate.

[0279] In some embodiments, when the display substrate includes a common electrode, forming the inorganic color resist layer on the side of the pixel electrode facing away from the base substrate specifically includes:

[0280] An inorganic color resist layer is formed on a side of the second protective layer facing away from the base substrate.

[0281] Alternatively, the display substrate is applied to an electroluminescent display.

[0282] In some embodiments, an inorganic color resist layer and a plurality of sub-pixels are formed on one side of a substrate, specifically comprising:

[0283] forming a plurality of light emitting devices on one side of the base substrate;

[0284] An inorganic color resist layer is formed on a side of the plurality of light emitting devices away from the base substrate.

[0285] In some embodiments, forming a light-emitting device specifically includes forming an anode, a light-emitting functional layer, and a cathode.

[0286] In some embodiments, before forming the light-emitting device, the method further includes:

[0287] A pixel driving circuit is formed; the pixel driving circuit includes a thin film transistor and a capacitor.

[0288] In some embodiments, after forming the anode and before forming the light-emitting functional layer, the method further includes:

[0289] A pattern of a pixel definition layer is formed; the pixel definition layer includes a first opening area, and the orthographic projection of the first opening area on the base substrate falls within the orthographic projection of the anode on the base substrate.

[0290] Based on the same inventive concept, an embodiment of the present disclosure further provides a display device, which includes the display substrate provided by an embodiment of the present disclosure.

[0291] In a specific implementation, the display device may be a liquid crystal display device. In some embodiments, as shown in FIG29 , the display device further includes:

[0292] The opposite substrate 21 is arranged opposite to the display substrate 22;

[0293] The liquid crystal layer 23 is located between the display substrate 22 and the counter substrate 21 .

[0294] It should be noted that in the display device provided by the embodiment of the present disclosure, the display substrate, the liquid crystal layer, and the counter substrate constitute a liquid crystal display panel, and the counter substrate does not need to be provided with a color filter. In a specific implementation, as shown in Figure 29, the counter substrate 21 includes a base substrate 1 and a black matrix 24 located on the side of the base substrate 1 facing the liquid crystal layer 23. The black matrix 24 has a plurality of second opening areas 25, and the second opening areas 25 correspond one-to-one to the sub-pixel opening areas. In the display device provided by the embodiment of the present disclosure, since the display substrate includes a color resist unit, the counter substrate does not need to be provided with a color filter located in the second opening area.

[0295] In specific implementation, the orthographic projection of the black matrix on the base substrate needs to cover the orthographic projection of the data line on the base substrate. For high-resolution display products, the line width of the data line is smaller. For example, for a display product with 1200PPI, the line width of the data line is greater than or equal to 1.2 microns and less than or equal to 2 microns, and in the direction perpendicular to the extension of the data line, the line width of the black matrix is ​​greater than or equal to 2.5 microns and less than or equal to 3.5 microns. For a display product with 1500PPI, the line width of the data line is greater than or equal to 1 micron and less than or equal to 1.8 microns, and in the direction perpendicular to the extension of the data line, the line width of the black matrix is ​​greater than or equal to 1 micron and less than or equal to 1.8 microns. For display products greater than 2000PPI, the line width of the data line is greater than or equal to 1 micron and less than or equal to 1.5 microns, and in the direction perpendicular to the extension of the data line, the line width of the black matrix is ​​greater than or equal to 1.5 microns and less than or equal to 2.5 microns.

[0296] In some embodiments, the display device further comprises:

[0297] Backlight module; the display substrate is located on the light-emitting side of the backlight module.

[0298] In some embodiments, the backlight module may also include the display substrate provided by the embodiments of the present disclosure, that is, the display substrate serves as the backlight source of the backlight module.

[0299] The display device provided in the embodiments of the present disclosure is any product or component with a display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigation system. Other essential components of the display device are readily understood by those skilled in the art and are not described here in detail, nor should they be construed as limitations of the present disclosure. The implementation of the display device can be referenced to the aforementioned embodiments of the array substrate and display panel, and any repetitive details will not be repeated.

[0300] In summary, the display substrate provided by the embodiment of the present disclosure includes a color resist unit, which is arranged by alternating stacking of at least two inorganic sub-layers, so that the color resist unit transmits light within the wavelength range corresponding to the sub-pixel color. The color resist unit formed by the stacking of inorganic sub-layers does not absorb light, thereby improving the light utilization rate of the display substrate compared to the traditional absorption-type color film. Moreover, since the color resist unit is a stack of inorganic sub-layers, it can be patterned using a dry etching process. Compared with the resin color film of the prior art, the size of the color resist unit can be made smaller, and the pixel density of the display product can be improved. Therefore, the display substrate provided by the embodiment of the present disclosure can be applied to display products with ultra-high pixel density, such as VR display products, which increases the application scenarios of the display substrate.

[0301] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0302] Obviously, those skilled in the art may make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the embodiments of the present invention. Thus, if such changes and modifications of the embodiments of the present invention fall within the scope of the claims and their equivalents, the present invention is intended to include such changes and modifications.

Claims

1. A display substrate, wherein: The display substrate comprises: substrate substrate; A plurality of sub-pixels are located on one side of the substrate; each of the plurality of sub-pixels comprises a sub-pixel opening area; The inorganic color resist layer is located on the same side of the base substrate as the multiple sub-pixels, and includes multiple color resist units; the orthographic projection of the color resist unit on the base substrate covers the orthographic projection of the sub-pixel opening area on the base substrate, and the multiple color resist units include: a first color resist unit, a second color resist unit and a third color resist unit, and at least two of the first color resist unit, the second color resist unit and the third color resist unit have different light output colors; the color resist unit includes at least two inorganic sub-layers that are alternately stacked, and the color resist units with different light output colors contain different numbers of inorganic sub-layers, and the refractive indices of two adjacent inorganic sub-layers are different.

2. The display substrate according to claim 1, wherein: At least two of the first color-resistance unit, the second color-resistance unit, and the third color-resistance unit have different thicknesses in a direction perpendicular to the substrate.

3. The display substrate according to claim 2, wherein: The difference in thickness between different color resist units in a direction perpendicular to the substrate is less than or equal to 1 micron.

4. The display substrate according to claim 2 or 3, wherein: The color resistance unit includes a first part; the first parts of different color resistance units are arranged independently of each other.

5. The display substrate according to claim 4, wherein: An absolute value of a distance between the first portions of adjacent different color-resist units is less than or equal to 10 micrometers.

6. The display substrate according to claim 5, wherein: An absolute value of a distance between the first portions of adjacent different color-resist units is less than or equal to 3 micrometers.

7. The display substrate according to any one of claims 4 to 6, wherein: The color-resistance unit further includes a second portion located at a side of the first portion away from the base substrate; the second portions of the plurality of color-resistance units are integrally connected.

8. The display substrate according to claim 7, wherein: The first portions of at least two of the first color-resistance unit, the second color-resistance unit, and the third color-resistance unit have different thicknesses in a direction perpendicular to the base substrate.

9. The display substrate according to any one of claims 4 to 8, wherein: The display substrate also includes: a first shading portion, located between the first portion and the base substrate; the orthographic projection of the first shading portion on the base substrate covers the area between the orthographic projections of the adjacent first portion on the base substrate, and the orthographic projection of the first shading portion on the base substrate does not overlap with the sub-pixel opening area.

10. The display substrate according to any one of claims 4 to 9, wherein: The side surface of the first portion includes an inclined surface with an angle greater than or equal to 60° and less than 90° with the plane where the substrate is located.

11. The display substrate according to claim 10, wherein: An absolute value of a minimum distance between the inclined surfaces of two adjacent first parts is less than or equal to 5 micrometers.

12. The display substrate according to claim 10, wherein: In a region between adjacent sub-pixel opening regions, orthographic projections of adjacent first portions on the substrate overlap; Furthermore, an orthographic projection of the first portion on the base substrate and an orthographic projection of the sub-pixel opening area corresponding to the first portion adjacent thereto on the base substrate do not overlap each other.

13. The display substrate according to claim 12, wherein: The orthographic projection of any first portion on the base substrate covers the orthographic projection of the area between adjacent sub-pixel opening areas on the base substrate; The inorganic color resist layer further comprises: an overlapping portion; the orthographic projection of the overlapping portion on the base substrate covers the orthographic projection of the area between the adjacent sub-pixel opening areas on the base substrate, and the orthographic projection of the overlapping portion on the base substrate does not overlap with the orthographic projection of the sub-pixel opening area on the base substrate; Between adjacent sub-pixel opening areas, the color-resistance unit and the overlapping portion have an overlapped portion whose orthographic projection on the base substrate has a light transmittance of less than 5%.

14. The display substrate according to any one of claims 10 to 13, wherein: The surface of the first portion away from the base substrate includes a first plane area, and the orthographic projection of the first plane area on the base substrate covers the sub-pixel opening area.

15. The display substrate according to any one of claims 1 to 14, wherein: The color resist unit includes a first inorganic sublayer and a second inorganic sublayer; the refractive index of the first inorganic sublayer is greater than the refractive index of the second inorganic sublayer; the inorganic sublayer closest to the base substrate is the first inorganic sublayer.

16. The display substrate according to claim 15, wherein: The material of the first inorganic sublayer includes one of the following or a combination thereof: silicon nitride, titanium dioxide, titanium pentoxide, niobium pentoxide, zirconium dioxide, yttrium trioxide, zinc sulfide; The material of the second inorganic sublayer includes one of the following or a combination thereof: silicon oxide, magnesium fluoride.

17. The display substrate according to any one of claims 1 to 16, wherein: The sub-pixel includes: a thin film transistor and a pixel electrode located on a side of the thin film transistor away from the base substrate.

18. The display substrate according to claim 17, wherein: The inorganic color resist layer is located between the base substrate and the sub-pixel; The display substrate further includes: a first planarization layer located between the inorganic color resist layer and the sub-pixel.

19. The display substrate according to claim 18, wherein: The material of the first planarization layer includes organic silicon.

20. The display substrate according to claim 17, wherein: The inorganic color resist layer is located between the thin film transistor and the pixel electrode.

21. The display substrate according to claim 20, wherein: The thin film transistor includes: a gate, a source and a drain; the display panel also includes: a first inorganic insulating layer located between the gate and the source and drain, and a second planarization layer located between the source and drain and the pixel electrode; The inorganic color resist layer is located between the first inorganic insulating layer and the second planarization layer.

22. The display substrate according to claim 21, wherein: The material of the second planarization layer includes resin.

23. The display substrate according to claim 17, wherein: The inorganic color resist layer is located on a side of the sub-pixel away from the base substrate.

24. The display substrate according to any one of claims 1 to 23, wherein: The sub-pixel includes a light-emitting device; the inorganic color resist layer is located on a side of the light-emitting device away from the substrate.

25. The display substrate according to any one of claims 1 to 24, wherein: The color resistance units correspond to the sub-pixels one by one.

26. The display substrate according to any one of claims 1 to 24, wherein: Each of the color-resistance units corresponds to a plurality of sub-pixels that are arranged continuously and have the same color.

27. The display substrate according to any one of claims 1 to 26, wherein: The plurality of sub-pixels include: a plurality of red sub-pixels, a plurality of green sub-pixels, and a plurality of blue sub-pixels; The first color-resistance unit is a red color-resistance unit corresponding to the red sub-pixel, the second color-resistance unit is a green color-resistance unit corresponding to the green sub-pixel, and the third color-resistance unit is a blue color-resistance unit corresponding to the blue sub-pixel; In a direction perpendicular to the base substrate, the thickness of the red color resist unit is greater than the thickness of the blue color resist unit, and the thickness of the green color resist unit is greater than the thickness of the red color resist unit.

28. A method for preparing a display substrate, wherein: The method comprises: providing a substrate base plate; An inorganic color resist layer and a plurality of sub-pixels are formed on one side of the base substrate; each of the plurality of sub-pixels includes a sub-pixel opening area; the inorganic color resist layer includes a plurality of color resist units; the orthographic projection of the color resist unit on the base substrate covers the orthographic projection of the sub-pixel opening area on the base substrate, and the plurality of color resist units include: a first color resist unit, a second color resist unit and a third color resist unit, and at least two of the first color resist unit, the second color resist unit and the third color resist unit have different light emitting colors; the color resist unit includes at least two inorganic sub-layers alternately stacked, and the color resist units with different light emitting colors contain different numbers of inorganic sub-layers, and the refractive indices of two adjacent inorganic sub-layers are different.

29. The method according to claim 28, wherein: An inorganic color resist layer is formed on one side of the base substrate, specifically comprising: The first part of the color-resistance unit with different light-emitting colors is respectively manufactured, and the first part of each light-emitting color is The first part of the color resist unit comprises the following steps: forming a sacrificial layer on one side of the substrate; the sacrificial layer comprises a metal material; Performing a patterning process on the sacrificial layer to remove the sacrificial layer in the area corresponding to the color-resistance unit of the light-emitting color; forming a plurality of layers of the inorganic sublayers; Performing patterning on the multiple layers of the inorganic sub-layers to form a plurality of patterns of the first part; The sacrificial layer is removed.

30. The method of claim 29, wherein: The sacrificial layer is subjected to a patterning process to remove the sacrificial layer in an area corresponding to the color-resistance unit of the light-emitting color, specifically comprising: A wet etching process is used to remove the sacrificial layer in the area corresponding to the color-resistance unit of the light-emitting color.

31. The method of claim 29, wherein: After respectively manufacturing the first part of the color-resistance unit with different light colors, the method further includes: A second part of the plurality of color-resistance units is formed on a side of the first part away from the base substrate; and the second parts of the plurality of color-resistance units are integrally connected.

32. The method according to any one of claims 29 to 31, wherein: Before forming the inorganic color resist layer, the method further comprises: A pattern of a first shading portion is formed; the orthographic projection of the first shading portion on the base substrate covers the area between the orthographic projections of adjacent first portions on the base substrate, and the orthographic projection of the first shading portion on the base substrate does not overlap with the sub-pixel opening area.

33. A display device, wherein: The display device comprises the display substrate according to any one of claims 1 to 27.

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