Information collection system, inspection substrate, and information collection method

Abstract

The purpose of the present invention is to provide a technique capable of acquiring distance information between a functional member and a substrate in a substrate processing apparatus. An information collection system for acquiring information pertaining to a substrate processing apparatus having a substrate holding unit for holding a substrate and an annular member (26) positioned on the back surface side of the substrate, the information collection system comprising: a disk-shaped main body unit (7) having a bottom surface capable of being held by the substrate holding unit; irradiation units (71, 74) that are fixed to the main body unit (7) and that irradiate measurement waves on the ring-shaped member (26); a detection unit (72) that is fixed to the main body unit and that detects a response to the measurement wave from the irradiation unit; and a calculation unit (73) that acquires information on the interval between the main body (7) and the annular member (26) on the basis of the response detected by the detection unit (72).

Description

Technical Field

[0001] The present disclosure relates to an information collection system, an inspection substrate, and an information collection method. Background Art

[0002] In the manufacturing process of semiconductor devices, semiconductor wafers are transported to a substrate processing device while being stored in a carrier to be processed. Examples of such processing include liquid processing such as formation of a coating film by supplying a coating liquid and development. During such liquid processing, a processing liquid is supplied from a nozzle to a wafer contained in a cup. Patent document 1 describes a developing device having a cup, the cup having an annular protrusion facing the lower surface of the wafer.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2020-13932 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] The present disclosure provides a technology capable of acquiring distance information between a functional component and a substrate in a substrate processing apparatus.

[0008] Solutions for solving problems

[0009] An information collection system according to one embodiment of the present invention is an information collection system for acquiring information related to a substrate processing device having a substrate holding portion for holding a substrate and an annular member located on the back side of the substrate, the information collection system comprising: a circular plate-shaped main body portion having a bottom surface that can be held by the substrate holding portion; an irradiation portion, which is fixed relative to the main body portion and irradiates a measurement wave to the annular member; a detection portion, which is fixed relative to the main body portion and detects a response to the measurement wave from the irradiation portion on the main body portion; and a calculation portion, which acquires information on the interval between the main body portion and the annular member.

[0010] Effects of the Invention

[0011] According to the present disclosure, there is provided a technology capable of acquiring distance information between a functional component and a substrate in a substrate processing apparatus. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a diagram showing a schematic configuration example of an information collection system according to an exemplary embodiment.

[0013] Figure 2This is a diagram showing a schematic configuration example of an information collection system according to an exemplary embodiment.

[0014] Figure 3 This is a diagram showing an example of a schematic configuration of a coating unit in a coating and developing device.

[0015] Figure 4 This is a diagram showing an example of the relationship among the inspection wafer, the control device, and the information collection device.

[0016] Figure 5 It is a diagram showing an example of the hardware configuration of the inspection wafer, the control device, and the information collection device.

[0017] Figure 6 FIG. 1 is a diagram showing an example of the configuration of a distance estimation unit in an inspection wafer.

[0018] Figure 7 (a) Figure 7 (b) is a diagram showing an example of the structure of a distance estimation unit in the inspection wafer.

[0019] Figure 8 (a) Figure 8 (b) is a diagram for explaining an example of processing related to an image captured from an inspection wafer.

[0020] Fig. 9 This is a diagram showing an example of a model for calculating a distance used in the calculation unit.

[0021] Fig.10 This is a diagram showing an example of processing in a computing unit of an inspection wafer.

[0022] Fig.11 This is a diagram for explaining an example of processing in a computing unit of an inspection wafer.

[0023] Fig.12 This is a diagram for explaining an example of processing in a computing unit of an inspection wafer.

[0024] Fig.13 (a) Fig.13 (b) is a diagram for explaining an example of processing in the computing unit of the inspection wafer.

[0025] Fig.14 This is a sequence diagram showing an example of a process procedure between the devices in the information collection system according to one embodiment.

[0026] Fig.15 This is a sequence diagram showing an example of a process procedure between the devices in the information collection system according to one embodiment. DETAILED DESCRIPTION

[0027] Various exemplary embodiments are described below.

[0028] In an exemplary embodiment, an information collection system is provided. The information collection system is an information collection system for acquiring information related to a substrate processing device having a substrate holding portion for holding a substrate and an annular member located on the back side of the substrate, the information collection system comprising: a disk-shaped main body having a bottom surface that can be held by the substrate holding portion; an irradiation portion fixed relative to the main body, the irradiation portion irradiating a measurement wave to the annular member; a detection portion fixed relative to the main body, the detection portion detecting a response to the measurement wave from the irradiation portion; and a calculation portion for acquiring information on the interval between the main body and the annular member based on the response detected in the detection portion.

[0029] According to the above-mentioned information collection system, the ring-shaped member is irradiated with a measuring wave from an irradiation portion fixed to a disk-shaped main body, a response to the measuring wave from the irradiation portion is detected in a detection portion fixed relative to the main body, and information about the interval between the main body and the ring-shaped member is obtained based on the response result. Since the main body can be held on a substrate holding portion, by setting such a structure, the distance information between the functional component and the substrate in the substrate processing device can be obtained.

[0030] The irradiation unit may irradiate light as the measurement wave, and the detection unit may be a camera that captures an image of the annular member irradiated with the light.

[0031] In this case, in the computing unit, the image captured by the camera is used to obtain information about the interval between the main body and the annular member. By setting a structure in which the information about the interval is obtained by using various information contained in the image, more accurate information related to the distance between the functional component and the substrate in the substrate processing device can be obtained.

[0032] It may also be the following manner, wherein the light irradiated from the irradiation portion is a band-shaped light, and the band-shaped light irradiates the annular member in a manner extending in a direction intersecting the circumference of the annular member and from a direction different from a direction perpendicular to the upper end of the annular member, and the calculation portion determines the irradiation position of the band-shaped light on the annular member based on the image captured by the camera, and obtains the information of the interval between the main body and the annular member based on the information of the irradiation position.

[0033] By using the band-shaped light, even if the position between the annular member and the main body changes, the annular member can be easily irradiated with the band-shaped light. In addition, when the annular member is irradiated from a direction different from the direction perpendicular to the upper end of the annular member, the irradiation position of the band-shaped light on the annular member changes according to the distance between the main body and the annular member. Therefore, by setting a structure in which the irradiation position of the band-shaped light on the annular member is determined in the calculation unit, and the interval between the main body and the annular member is obtained based on the information of the irradiation position, more accurate information related to the distance between the functional component and the substrate in the substrate processing device can be obtained.

[0034] The calculation unit may acquire information on the interval between the main body and the annular member based on a model indicating a relationship between an irradiation position of the strip-shaped light on the annular member and the interval between the main body and the annular member.

[0035] By adopting a configuration in which the interval between the main body portion and the annular member is calculated based on a model as described above, more accurate information on the distance between the functional component and the substrate in the substrate processing apparatus can be acquired.

[0036] It may also be the following method, wherein the calculation unit calculates the change in the intensity distribution of light in the circumferential direction of the annular component based on information related to the intensity distribution of light contained in the image captured by the camera, and determines the irradiation position of the band-shaped light on the annular component based on the information of the change.

[0037] With the above-described configuration, the irradiation position of the strip-shaped light can be determined more accurately, and therefore more accurate information on the distance between the functional component and the substrate in the substrate processing apparatus can be acquired.

[0038] It can also be the following method: the upper surface of the annular component has convex-concave portions repeated along the circumferential direction, and the calculation unit uses fast Fourier transform on the image captured by the camera to remove the frequency component of the intensity of light repeated along the circumferential direction of the annular component from the image to determine the irradiation position of the band-shaped light on the annular component.

[0039] When the upper surface of the annular member is provided with circumferentially repeated concave and convex portions, it may be difficult to determine the irradiation position of the band-shaped light due to light scattered by the concave and convex portions. In such a case, by performing the process of removing the frequency component using the fast Fourier transform as described above, the irradiation position of the band-shaped light can be determined more accurately.

[0040] It can also be the following embodiment, wherein the annular member is a liquid processing cup having a back liquid receiving portion, the back liquid receiving portion is located on the back side of the substrate, a convex portion is provided on the back liquid receiving portion to prevent the processing liquid supplied to the substrate from going around to the back side, and the interval between the main body and the annular member is the interval between the main body and the convex portion of the back liquid receiving portion.

[0041] The convex portion of the back liquid receiving portion is a member arranged close to the substrate, and therefore the distance therebetween needs to be accurately grasped. Therefore, by adopting the above-mentioned structure, the distance to the substrate can be grasped more accurately.

[0042] In addition, it may also be the following method, which also includes: an information collecting device, which can communicate with a control device that controls the substrate processing device; and an inspection substrate, which can communicate with the information collecting device, the inspection substrate having the main body, the irradiation part, and the detection part, and the irradiation part and the detection part operate based on the instructions of the information collecting device.

[0043] In this case, the computing unit may be provided on the inspection substrate, and the computing unit may be operated based on an instruction from the information collection device. In addition, the computing unit may be provided on the information collection device.

[0044] In an exemplary embodiment, a substrate for inspection is provided. The substrate for inspection is a substrate for obtaining information related to a substrate processing device having a substrate holding portion for holding a substrate and an annular member located on the back side of the substrate, and the substrate for inspection has: a disk-shaped main body portion having a bottom surface that can be held by the substrate holding portion; an irradiation portion fixed relative to the main body portion, the irradiation portion irradiating a measurement wave to the annular member; and a detection portion fixed relative to the main body portion, the detection portion detecting a response to the measurement wave from the irradiation portion.

[0045] According to the above-mentioned inspection substrate, the ring-shaped member is irradiated with a measuring wave from an irradiation portion fixed to a disk-shaped main body, a response to the measuring wave from the irradiation portion is detected in a detection portion fixed relative to the main body, and information about the interval between the main body and the ring-shaped member is obtained based on the response result. Since the main body can be held on a substrate holding portion, by setting such a structure, the distance information between the functional component and the substrate in the substrate processing device can be obtained.

[0046] The invention may further include a calculation unit for acquiring information on the interval between the main body and the annular member based on the response detected by the detection unit.

[0047] In an exemplary embodiment, an information collection method is provided. The information collection method is an information collection method for obtaining information related to a substrate processing device having a substrate holding portion for holding a substrate and an annular member located on the back side of the substrate, the information collection method comprising: holding the bottom surface of a disk-shaped main body portion by the substrate holding portion; irradiating the annular member with a measuring wave from an irradiation portion fixed relative to the main body portion; detecting a response to the measuring wave from the irradiation portion in a detection portion fixed relative to the main body portion; and obtaining information on the interval between the main body portion and the annular member in a calculation portion based on the response detected in the detection portion.

[0048] According to the above-mentioned information collection method, the ring-shaped member is irradiated with a measuring wave from an irradiation portion fixed to a disk-shaped main body, a response to the measuring wave from the irradiation portion is detected in a detection portion fixed relative to the main body, and information about the interval between the main body and the ring-shaped member is obtained based on the response result. Since the main body can be held on a substrate holding portion, by setting such a structure, the distance information between the functional component and the substrate in the substrate processing device can be obtained.

[0049] In the embodiment, when the irradiation is performed, the irradiation unit irradiates light as the measurement wave, and the detection unit is a camera that captures an image of the annular member irradiated with the light.

[0050] In this case, in the computing unit, the image captured by the camera is used to obtain information about the interval between the main body and the annular member. By setting a structure in which the information about the interval is obtained by using various information contained in the image, more accurate information related to the distance between the functional component and the substrate in the substrate processing device can be obtained.

[0051] It may also be the following manner, that when the irradiation is performed, the light irradiated from the irradiation portion is a band-shaped light, and the band-shaped light irradiates the annular member in a manner extending in a direction intersecting the circumference of the annular member and from a direction different from a direction perpendicular to the upper end of the annular member, and when the acquisition is performed, the calculation portion determines the irradiation position of the band-shaped light on the annular member according to the image captured by the camera, and acquires the information of the interval between the main body and the annular member based on the information of the irradiation position.

[0052] By using a band of light, even if the position between the annular member and the main body changes, the annular member can be easily irradiated with the band of light. In addition, when the annular member is irradiated from a direction different from the direction perpendicular to the upper end of the annular member, the irradiation position of the band of light on the annular member changes according to the distance between the main body and the annular member. Therefore, by setting a structure in which the calculation unit determines the irradiation position of the band of light on the annular member when acquiring, and calculates the interval between the main body and the annular member based on the information of the irradiation position, more accurate information related to the distance between the functional component and the substrate in the substrate processing device can be obtained.

[0053] It may also be the following manner: when performing the acquisition, the calculation unit obtains information on the interval between the main body and the annular member based on a model representing the relationship between the irradiation position of the band-shaped light on the annular member and the interval between the main body and the annular member.

[0054] By adopting a configuration in which the interval between the main body portion and the annular member is calculated based on a model as described above, more accurate information on the distance between the functional component and the substrate in the substrate processing apparatus can be acquired.

[0055] It may also be the following method: when performing the acquisition, the calculation unit calculates the change in the intensity distribution of light in the circumferential direction of the annular component based on information related to the intensity distribution of light contained in the image captured by the camera, and determines the irradiation position of the band-shaped light on the annular component based on the information of the change.

[0056] With the above-described configuration, the irradiation position of the strip-shaped light can be determined more accurately, and therefore more accurate information on the distance between the functional component and the substrate in the substrate processing apparatus can be acquired.

[0057] It can also be the following method, that is, the upper surface of the annular component has convex-concaves and concaves repeated along the circumferential direction, and when performing the acquisition, the operation unit uses fast Fourier transform on the image captured by the camera, removes the frequency component of the intensity of light repeated along the circumferential direction of the annular component from the image, and determines the irradiation position of the band-shaped light on the annular component.

[0058] When the upper surface of the annular member is provided with circumferentially repeated concave and convex portions, it may be difficult to determine the irradiation position of the band-shaped light due to light scattered by the concave and convex portions. In such a case, by performing the process of removing the frequency component using the fast Fourier transform as described above, the irradiation position of the band-shaped light can be determined more accurately.

[0059] [Exemplary Embodiments]

[0060] Hereinafter, various exemplary embodiments will be described in detail with reference to the accompanying drawings. In addition, in each of the drawings, the same reference numerals are given to the same or corresponding parts.

[0061] [Information Collection System]

[0062] Figure 1 An information collection system 1 according to one embodiment of the present disclosure is shown. The information collection system 1 is composed of a substrate processing system 2 , an inspection wafer 7 (inspection substrate), and an information collection device 9 .

[0063] The substrate processing system 2 transfers a workpiece W, which is a circular substrate, between processing modules by a transfer mechanism to process the workpiece W. The processing includes supplying a resist to the workpiece W stored in a cup in a processing module for forming a resist film to form the resist film.

[0064] The inspection wafer 7 is transported in the substrate processing system 2 instead of the workpiece W by the above-mentioned transport mechanism. In addition, it has the following functions: capturing the upper end of the ring constituting the above-mentioned cup to obtain image data, and obtaining information related to the distance (interval) between the workpiece W and the upper end of the ring when the workpiece W is placed on the above-mentioned processing module.

[0065] The information collecting device 9 controls the inspection wafer 7 and acquires the estimation result sent from the inspection wafer 7. In addition, by acquiring the information of the distance between the workpieces W before processing them by the substrate processing system 2 based on the information, the process when forming a resist film on the workpiece W is prevented from becoming abnormal.

[0066] [Substrate processing system]

[0067] The substrate processing system 2 includes a coating and developing device 2A, an exposure device 2B, and a control device 100 (control unit). The exposure device 2B is a device for exposing a resist film (photosensitive coating) formed on a workpiece W (substrate). Specifically, the exposure device 2B irradiates energy rays to the exposure target portion of the resist film by methods such as immersion exposure. The coating and developing device 2A performs a process of coating a resist (chemical solution) on the surface of the workpiece W to form a resist film before the exposure process performed by the exposure device 2B, and performs a development process of the resist film after the exposure process. In addition, a processing module that becomes the object of inspection by the above-mentioned inspection wafer 7 is provided in the coating and developing device 2A. Therefore, in the following embodiments, the coating and developing device 2A is described as a substrate processing device.

[0068] [Substrate processing equipment]

[0069] As an example of a substrate processing apparatus, the structure of a coating and developing apparatus 2A will be described. Figure 1 and Figure 2As shown, the coating and developing device 2A includes a carrier block 4 , a processing block 5 , and an interface block 6 .

[0070] The carrier block 4 is used to carry out the introduction and export of the workpiece W into and from the coating and developing device 2A. For example, the carrier block 4 can support a plurality of carriers C for the workpiece W, and the carrier block 4 has a conveying device A1 including a transfer arm built therein. The carrier C accommodates, for example, a plurality of circular workpieces W. The conveying device A1 takes out the workpiece W from the carrier C and hands it to the processing block 5, receives the workpiece W from the processing block 5 and returns the workpiece W to the carrier C. The processing block 5 has a plurality of processing modules 11, 12, 13, and 14.

[0071] The processing module 11 has a coating unit U1, a heat treatment unit U2, and a conveying device A3 for conveying the workpiece W to these units. The processing module 11 forms a lower film on the surface of the workpiece W through the coating unit U1 and the heat treatment unit U2. The coating unit U1 applies a processing liquid for forming the lower film to the workpiece W. The heat treatment unit U2 performs various heat treatments accompanying the formation of the lower film.

[0072] The processing module 12 (liquid processing unit) is equipped with a coating unit U1, a heat treatment unit U2, and a conveying device A3 for conveying the workpiece W to these units. The processing module 12 performs liquid processing including forming a resist film on the lower film through the coating unit U1 and the heat treatment unit U2. The coating unit U1 applies a processing liquid (resist) for resist film formation to the lower film. The heat treatment unit U2 performs various heat treatments accompanying the formation of the coating film. In addition, the coating unit U1 has a function of forming a coating film formed by the resist liquid on the periphery of the workpiece W.

[0073] The processing module 13 is equipped with a coating unit U1, a heat treatment unit U2, and a conveying device A3 for conveying the workpiece W to these units. The processing module 13 forms an upper film on the resist film by the coating unit U1 and the heat treatment unit U2. The coating unit U1 applies a liquid for forming the upper film to the resist film. The heat treatment unit U2 performs various heat treatments accompanying the formation of the upper film.

[0074] The processing module 14 is equipped with a coating unit U1, a heat treatment unit U2, and a conveying device A3 for conveying the workpiece W to these units. The processing module 14 performs a development process of the resist film subjected to the exposure process and a heat treatment accompanying the development process through the coating unit U1 and the heat treatment unit U2. The coating unit U1 performs a development process of the resist film by coating a developer on the surface of the exposed workpiece W and then washing away the developer with a rinse liquid. The heat treatment unit U2 performs various heat treatments accompanying the development process. As specific examples of the heat treatment, a heat treatment before the development process (PEB: Post Exposure Bake), a heat treatment after the development process (PB: Post Bake), etc. can be cited.

[0075] A rack unit U10 is provided on the carrier block 4 side in the processing block 5. The rack unit U10 is divided into a plurality of cells arranged in the vertical direction. A conveying device A7 including a lifting arm is provided near the rack unit U10. The conveying device A7 lifts and lowers the workpiece W between the cells of the rack unit U10.

[0076] A shelf unit U11 is provided on the interface block 6 side in the processing block 5. The shelf unit U11 is divided into a plurality of small chambers arranged in the vertical direction.

[0077] The interface block 6 is used to transfer the workpiece W to the exposure device 2B. For example, the interface block 6 has a conveying device A8 including a transfer arm built therein, and the interface block 6 is connected to the exposure device 2B. The conveying device A8 transfers the workpiece W arranged in the rack unit U11 to the exposure device 2B. The conveying device A8 receives the workpiece W from the exposure device 2B and returns the workpiece W to the rack unit U11.

[0078] The control of the coating and developing device 2A is performed by the control device 100. The control device 100 holds information related to the processing process for performing the processing related to the workpiece W in the coating and developing device 2A, and controls each part to carry the workpiece W into the coating and developing device 2A to perform the desired processing. In addition, the control device 100 has the following functions: sending and receiving information with the information collection device 9 described later, and notifying the information collection device 9 of the conveying status of the inspection wafer 7 described later when it is carried into the coating and developing device 2A.

[0079] The processing of the workpiece W performed in the substrate processing system 2 is described. The control device 100 controls, for example, the coating and developing device 2A to perform processing on the workpiece W through the following process. First, the control device 100 controls the conveying device A1 to convey the workpiece W in the carrier C to the rack unit U10, and controls the conveying device A7 to arrange the workpiece W in the small chamber for the processing module 11.

[0080] Next, the control device 100 controls the conveying device A3 to convey the workpiece W in the shelf unit U10 to the coating unit U1 and the heat treatment unit U2 in the processing module 11. In addition, the control device 100 controls the coating unit U1 and the heat treatment unit U2 to form a lower film on the surface of the workpiece W. After that, the control device 100 controls the conveying device A3 to return the workpiece W with the lower film formed thereon to the shelf unit U10, and controls the conveying device A7 to place the workpiece W in the processing module 12.

[0081] Next, the control device 100 controls the conveying device A3 to convey the workpiece W of the shelf unit U10 to the coating unit U1 and the heat treatment unit U2 in the processing module 12. The control device 100 controls the coating unit U1 and the heat treatment unit U2 to form a resist film on the lower film of the workpiece W. An example of a liquid processing method performed in the processing module 12 is described below. Thereafter, the control device 100 controls the conveying device A3 to return the workpiece W to the shelf unit U10, and controls the conveying device A7 to arrange the workpiece W in the small chamber for the processing module 13.

[0082] Next, the control device 100 controls the conveying device A3 to convey the workpiece W of the shelf unit U10 to the coating unit U1 and the heat treatment unit U2 in the processing module 13. In addition, the control device 100 controls the coating unit U1 and the heat treatment unit U2 to form an upper film on the resist film of the workpiece W. Thereafter, the control device 100 controls the conveying device A3 to convey the workpiece W to the shelf unit U11.

[0083] Next, the control device 100 controls the conveying device A8 to deliver the workpiece W accommodated in the rack unit U11 to the exposure device 2B. Then, in the exposure device 2B, the resist film formed on the workpiece W is subjected to exposure processing. After that, the control device 100 controls the conveying device A8 to receive the workpiece W subjected to the exposure processing from the exposure device 2B and arrange the workpiece W in the small chamber for the processing module 14 in the rack unit U11.

[0084] Next, the control device 100 controls the conveying device A3 to convey the workpiece W of the shelf unit U11 to the heat treatment unit U2 of the processing module 14. Then, the control device 100 controls the coating unit U1 and the heat treatment unit U2 to perform the heat treatment accompanied by the development treatment and the development treatment. The control device 100 completes the substrate processing of one workpiece W as described above.

[0085] [Coating unit]

[0086] Next, the coating unit U1 of the processing module 12 is described in detail. Figure 3As shown, the coating unit U1 of the processing module 12 includes a rotating holding disk 21 (substrate holding portion), a rotation driving portion 22, a support pin 24, a guide ring 25, a cup 27, an exhaust pipe 28, and a liquid discharge port 29. In addition, the coating unit U1 includes a processing liquid supply portion 31. Sometimes, multiple processing liquid supply portions 31 are provided, but in this embodiment, only one is exemplarily shown.

[0087] The rotating holding plate 21 holds the workpiece W horizontally. The rotating holding plate 21 is connected to the rotation drive unit 22 via a shaft 21a extending in the vertical direction. The rotation drive unit 22 rotates the rotating holding plate 21 at a predetermined rotation speed based on a control signal output from the control device 100.

[0088] A panel 23 is provided around the shaft 21a, and a support pin 24 extending in the vertical direction is provided in a manner penetrating the panel 23. The support pin 24 is a pin capable of supporting the back side of the workpiece W. As an example, three support pins 24 are provided around the shaft of the rotating holding disk 21. The support pin 24 can be raised and lowered by a lifting mechanism (not shown). The support pin 24 delivers the workpiece W between the conveying mechanism (not shown) of the workpiece W and the rotating holding disk 21.

[0089] The guide ring 25 is provided below the workpiece W held by the rotating holding disk 21, and has a function of guiding the processing liquid supplied to the surface of the workpiece W toward the drain port. In addition, a cup 27 for suppressing the scattering of the processing liquid is provided in a manner surrounding the periphery of the guide ring 25. The top of the cup 27 is open so that the workpiece W can be delivered to the rotating holding disk 21. A space serving as a discharge path for the liquid is formed between the side circumference of the cup 27 and the outer peripheral edge of the guide ring 25. In addition, an exhaust pipe 28 is provided below the cup 27, and a drain port 29 for discharging the liquid moving in the above-mentioned space is provided.

[0090] The guide ring 25 is formed to extend from the peripheral edge of the enclosure 23 described above toward the cup 27. The guide ring 25 is a member in the shape of a ring when viewed from above and is located below the workpiece W held on the rotating holding disk 21. The guide ring 25 is configured to be connected to the inner wall of the cup 27 below the guide ring 25 so that the processing liquid does not leak out of the cup 27.

[0091] The upper surface of the guide ring 25 is composed of inclined surfaces 25a and 25b. The inclined surface 25a is located closer to the center of the cup 27 than the inclined surface 25b. The inclined surface 25a is inclined so as to rise as it goes to the outside of the cup 27, and the inclined surface 25b is inclined so as to fall as it goes to the outside of the cup 27. As a result, the longitudinal section of the guide ring 25 is formed into a mountain shape.

[0092] The upper end portion 26 (annular protrusion) formed by the steepening gradient of the inclined surface 25a and the inclined surface 25b of the guide ring 25 is provided at the boundary portion. The upper end portion 26 is formed to protrude upward, and the upper end portion 26 is along the periphery of the workpiece W placed on the above-mentioned rotating holding disk 21 and is close to the peripheral edge of the workpiece W. The upper end portion 26 prevents the processing liquid supplied to the surface of the workpiece W from going around the back of the workpiece W and adhering to a position close to the center of the workpiece W, or the processing liquid mist from adhering to a position close to the center of the back of the workpiece W. The relative position of the guide ring 25 with respect to the cup 27 is sometimes changed. Therefore, the relative height of the upper end portion 26 with respect to the workpiece W and the rotating holding disk 21 supporting the workpiece W may be changed.

[0093] The coating unit U1 is provided with a process liquid supply unit 31 . The process liquid supply unit 31 discharges the process liquid toward the peripheral edge of the surface side of the workpiece W supported by the rotary holding disk 21 from above the workpiece W.

[0094] The processing liquid supply unit 31 is configured to include a nozzle 31a, a processing liquid supply source 31b, and a pipe 31c. An on-off valve controlled by the control device 100 may be provided on the pipe 31c of the processing liquid supply unit 31. The supply and stop of the processing liquid may be switched by switching the open state and the closed state of the on-off valve based on a control signal from the control device 100.

[0095] The nozzle 31a is mounted on an arm extending in the horizontal direction, for example, and can be moved in the horizontal direction. In addition, the nozzle 31a can also be moved in the vertical direction. A moving mechanism is provided for moving the nozzle 31a in the horizontal direction and in the vertical direction, and the nozzle 31a can be moved between a standby position outside the cup 27 and on the workpiece W by the operation of the moving mechanism.

[0096] Examples of the processing liquid supplied from the processing liquid supply unit 31 include processing liquid (e.g., resist liquid) and solvents used when forming a coating film on the periphery of the workpiece W. When multiple processing liquids need to be supplied to the workpiece W, multiple processing liquid supply units 31 may be provided in the coating unit U1.

[0097] When the control device 100 controls the coating unit U1, the processing module 12 performs liquid processing on the workpiece W according to the specified conditions. The control device 100, for example, supplies each processing liquid to the workpiece W through the processing liquid supply unit 31 based on the specified conditions, and controls the rotation of the workpiece W at this time. The control device 100 can also be composed of a plurality of functional modules for performing the above-mentioned liquid processing. Each functional module is not limited to being implemented by executing a program, and can also be implemented by a dedicated circuit (such as a logic circuit) or an integrated circuit (ASIC: Application Specific Integrated Circuit: Application Specific Integrated Circuit) integrating the dedicated circuit.

[0098] [Inspection wafer and information collection device]

[0099] Next, refer to Figure 4 Next, the inspection wafer 7 that is transported to the coating and developing device 2A to perform inspection related to the coating unit U1 in the coating unit U1 is described. The inspection wafer 7 has a function of measuring the distance between the lower surface of the workpiece W and the upper end 26 of the ring when the workpiece W is supported by the rotating holding disk 21. When the coating unit U1 is assembled or adjusted, the distance between the lower surface of the workpiece W and the upper end 26 of the ring sometimes deviates from the appropriate range. If the workpiece W is processed in such a state, the upper end 26 of the ring may contact the workpiece W or the upper end 26 of the ring may be too far away from the workpiece W. In order to prevent such an event from occurring, the inspection wafer 7 is transported to the coating unit U1 instead of the workpiece W, and the inspection wafer 7 is supported on the rotating holding disk 21 in the same manner as the workpiece W, and the image data of the upper end 26 of the ring is acquired by photographing the upper end 26 of the ring by the inspection wafer 7. Then, the distance between the lower surface of the workpiece W (the lower surface of the inspection wafer 7) and the upper end 26 of the ring is calculated based on the image data.

[0100] The inspection wafer 7 is composed of a main body 70, a light source 71 (irradiation unit), a camera 72 (detection unit), a computing unit 73, an optical system 74 (irradiation unit), a device mounting substrate 81 and a battery 82. The main body 70 is a circular substrate of the same size as the workpiece W when viewed from above. The light source 71, the camera 72, the computing unit 73, the optical system 74, the device mounting substrate 81 and the battery 82 are arranged on the main body 70. The main body 70 is transported by the conveying mechanism, the support pins 24 of the coating unit U1, etc., in the same manner as the workpiece W. The lower surface of the main body 70 is constructed as a flat surface in the same manner as the lower surface of the workpiece W, so that the central portion of the back side is adsorbed and held by the rotating holding disk 21. In addition, in Figure 4 The inspection wafer 7 is shown in the state of being held on the rotating holding plate 21 .

[0101] As will be described in detail later, the inspection wafer 7 allows the line light L1 (band-shaped light) from the light source 71 to reach the upper surface of the ring upper end 26. In addition, the camera 72 captures the bright line generated by the line light L1 reaching the upper surface of the ring upper end 26. The optical system 74 is configured to allow the line light L1 to reach the ring upper end 26 and to be able to capture the bright line by the camera 72. In addition, the calculation unit 73 has a function of estimating the distance between the lower surface of the workpiece W (the lower surface of the inspection wafer 7) and the ring upper end 26 based on the image data captured by the camera 72. In this way, the light source 71, the camera 72, the calculation unit 73, and the optical system 74 have a function as a distance estimation unit that estimates the distance between the main body 70 and the ring upper end 26. In addition, the light source 71 and the optical system 74 function as an irradiation unit for causing the line light L1 to reach the upper surface of the ring upper end 26.

[0102] A device mounting substrate 81 is provided in the center of the main body 70. The camera 72 and the computing unit 73 can be connected to the device mounting substrate 81 via a cable (not shown). At this time, the image data acquired by the camera 72 and the computing result of the computing unit 73 can be sent to the device mounting substrate 81 via the cable. The device mounting substrate 81 is composed of a plurality of substrates including a DSP (digital signal processor) substrate, for example, but for convenience, it is shown as one substrate. The device mounting substrate 81 is equipped with various devices. The devices include a device for switching on and off the light irradiation by the light source 71 by wirelessly receiving a signal from the information collection device 9, a device for shooting with the camera 72, and a device (transmitting unit) for sending the computing result of the computing unit 73 to the information collection device 9. In addition, a battery 82 is provided in the center of the main body 70 to supply power to the light source 71, the camera 72, and each device included in the device mounting substrate 81.

[0103] The device mounting substrate 81 may also be composed of a plurality of functional modules for executing the above-mentioned processing in the inspection wafer 7. Each functional module is not limited to being implemented by executing a program, but may also be implemented by a dedicated circuit (such as a logic circuit) or an integrated circuit (ASIC: Application Specific Integrated Circuit) integrating the dedicated circuit.

[0104] The inspection wafer 7 described above operates based on the instruction from the information collection device 9, and transmits the result of the operation to the information collection device 9. In this way, the inspection wafer 7 acquires the instruction from the information collection device 9 by communicating with the information collection device 9, and performs the operation related to the shooting and calculation of the image data for estimating the distance between the lower surface of the workpiece W (the lower surface of the inspection wafer 7) and the ring upper end 26 based on the instruction. In addition, the calculation result in the inspection wafer 7 is transmitted to the information collection device 9.

[0105] On the other hand, the information collection device 9 has a function of moving the inspection wafer 7 at an appropriate time in conjunction with the control device 100. Information indicating the transport status of the inspection wafer 7 in the control device 100, especially information indicating that the inspection wafer 7 is transported to the coating unit U1, is sent from the control device 100 to the information collection device 9. Based on the notification from the control device 100, the information collection device 9 controls the inspection wafer 7 to perform shooting and calculation for estimating the distance between the lower surface of the inspection wafer 7 and the upper end portion 26 of the ring. When the information collection device 9 collects the estimation result from the inspection wafer 7, it determines whether the result is within the range of the specified reference value, and decides whether to continue the subsequent processing based on the result of the determination.

[0106] The information collection device 9 may also be composed of a plurality of functional modules for sending and receiving information between the control device 100 and the inspection wafer 7, and performing determination based on the inspection result of the inspection wafer 7 in the information collection device 9. Each functional module is not limited to being implemented by executing a program, and may also be implemented by a dedicated circuit (e.g., a logic circuit) or an integrated circuit (ASIC: Application Specific Integrated Circuit) in which the dedicated circuit is integrated.

[0107] [Hardware structure of control device, inspection wafer, and information collection device]

[0108] The hardware of the control device 100, the inspection wafer 7 (particularly the device mounting substrate 81), and the information collection device 9 may be composed of, for example, one or more control computers. Figure 5 As shown, the control device 100, the inspection wafer 7, and the information collection device 9 each include a circuit 201 as a hardware structure. The circuit 201 can be composed of circuit elements (circuitry). The circuit 201 can also include a processor 202, a memory 203, a storage device 204, a driver 205, and an input / output port 206.

[0109] The processor 202 executes programs in cooperation with at least one of the memory 203 and the storage device 204, and performs input and output of signals via the input / output port 206, thereby forming the above-mentioned functional modules. The memory 203 and the storage device 204 store various information, programs, etc. used in the control device 100, the inspection wafer 7, and the information collection device 9. The driver 205 is a circuit that drives the functional units respectively associated with the control device 100, the inspection wafer 7, and the information collection device 9. The input / output port 206 performs input and output of signals between the functional units associated with the driver 205.

[0110] In addition, the substrate processing system 2 may have one control device 100, or may have a controller group (control unit) composed of multiple control devices 100. In the case where the substrate processing system 2 has a controller group, for example, multiple functional modules may be implemented by a different control device, or may be implemented by a combination of more than two control devices 100. In the case where the control device 100 is composed of multiple computers (circuits 201), multiple functional modules may be implemented by one computer (circuit 201). In addition, the control device 100 may also be implemented by a combination of more than two computers (circuits 201). The control device 100 may also have multiple processors 202. In this case, multiple functional modules may be implemented by one processor 202, or may be implemented by a combination of more than two processors 202. It is also possible to set a part of the functions of the control device 100 of the substrate processing system 2 in a device different from the substrate processing system 2, and connect to the substrate processing system 2 via a network to implement various actions in this embodiment. For example, if the functions of the processors 202, memories 203, and storage devices 204 of multiple substrate processing systems 2 are centrally implemented by one or more other devices, the information and actions of the multiple substrate processing systems 2 can also be remotely and uniformly managed and controlled.

[0111] [Detailed Structure of the Distance Estimation Unit in the Inspection Wafer]

[0112] Reference Figure 6 to Figure 8 The distance estimation unit of the inspection wafer 7 will be described.

[0113] The main body 70 of the inspection wafer 7 is provided with through holes 75 at positions separated in the circumferential direction of the main body 70 at the peripheral edge thereof. The through holes 75 are strip-shaped and extend in the tangential direction of the main body 70, and the formation position of the through holes 75 is set to a position corresponding to the ring upper end 26 in a plan view when the inspection wafer 7 is supported by the rotating holding disk 21. A camera 72 functioning as an imaging unit and a computing unit 73 connected to the camera 72 are provided at a position close to the center of the main body 70 relative to the through holes 75. The viewing angle of the camera 72 is toward the peripheral end side of the main body 70.

[0114] The light source 71 emits linear light. The light source 71 may be composed of, for example, a laser light source. Figure 6 to Figure 8 In the example shown in FIG. 1 , a line light L1 extending in a direction parallel to the main surface of the main body 70 is emitted from the light source 71. Figure 7 As shown in (b), the length of the line light L1 (the length in the long side direction) is set to be larger than the width (the length in the radial direction) of the ring upper end portion 26. The intention is that the line light L1 will also reach the ring upper end portion 26 when the relative position between the ring upper end portion 26 and the inspection wafer 7 is slightly changed. The line light L1 is reflected by the reflector 74a as an optical system and emitted downward, that is, toward the rotating holding disk 21 side, and passes through the through hole 75 to reach the upper surface of the ring upper end portion 26 located below the main body 70 (see Figure 7 (a)).

[0115] On the other hand, a prism 74b as an optical system is arranged on the optical axis of the camera 72. The prism 74b reflects the ring upper end portion 26 and its surroundings below the main body 70 through the through hole 75. Therefore, the camera 72 can photograph the lower part of the main body 70 through the through hole 75 and the prism 74b. When the inspection wafer 7 is held on the rotating holding plate 21, the prism 74b is located above the ring upper end portion 26, and the camera 72 can photograph a portion of the upper surface of the ring upper end portion 26 in the circumferential direction.

[0116] Figure 8 (a) schematically shows an example of image data acquired through the shooting. Figure 7 As shown in (a), the line light L1 passes through the reflector 74a and reaches the ring upper end 26. Figure 7 As shown in (b) and the like, a bright line Lp where the irradiation intensity of the linear light L1 increases may be formed on the surface of the ring upper end portion 26 at the position where the linear light L1 arrives.

[0117] On the other hand, the camera 72 captures the surface of the ring upper end portion 26 via the prism 74b, thereby acquiring the distribution of scattered light of the line light L1 as image data. Figure 8As shown in (a), an image of a bright line Lp corresponding to the line light L1 appears on the upper end 26 of the ring. Figure 8 As shown in (b) of FIG. 1 , regarding the distribution of light on the ring upper end 26 , it is assumed that a peak (representative point) of light intensity is formed at a position corresponding to the bright line Lp when the direction in which the ring upper end 26 extends is defined as the x coordinate.

[0118] Here, the line light L1 is irradiated not from a direction perpendicular to the surface of the ring upper end portion 26 but from a direction inclined to the surface of the ring upper end portion 26. Therefore, when the distance between the main body portion 70 and the ring upper end portion 26 is closer than the reference (the distance corresponding to the set value), the line light L1 is irradiated at a distance closer than the reference. Figure 7 On the other hand, when the distance between the main body 70 and the ring upper end 26 is farther than the reference, the linear light L1 reaches the main body 70 at a stage earlier than the state shown in (a) (i.e., the state in which the optical path is shortened). Figure 7 The state shown in (a) of FIG. 1 is later than that shown in FIG. 2 (i.e., the state where the optical path becomes longer) and reaches the main body 70. That is, the position of the bright line Lp appearing on the surface of the ring upper end 26 changes depending on the distance between the main body 70 and the ring upper end 26. Thus, for example, Figure 8 As illustrated in (a) of FIG. 1 , when the distance is shorter than the reference, the bright line Lp is displaced in one direction, and when the distance is longer, the bright line Lp is displaced in the other direction.

[0119] As described above, the position of the bright line Lp changes depending on the distance between the main body 70 and the ring upper end 26. The inspection wafer 7 utilizes the above-mentioned characteristics to determine the position of the bright line Lp on the ring upper end 26 in the image data captured by the camera 72 and estimate the distance between the lower surface of the main body 70 and the ring upper end 26 based on the position.

[0120] In the calculation unit 73, the distance between the lower surface of the main body 70 and the upper end 26 of the ring is estimated based on the image data captured by the camera 72. At this time, in the calculation unit 73, a model is prepared based on a plurality of image data captured in a state where the distance between the lower surface of the main body 70 and the upper end 26 of the ring is known. Specifically, a model is prepared in advance by determining the relationship between the x coordinate, that is, the position of the bright line Lp generated by the line light L1 in the image data and the distance between the lower surface of the main body 70 and the upper end 26 of the ring. Fig. 9As illustrated, when the position of the bright line Lp generated by the line light L1 in the image data (the horizontal coordinate of the representative point) is set to x and the distance between the lower surface of the main body 70 and the upper end 26 of the ring is set to y, an approximate function y=f(x) that specifies the relationship xy can be set. The approximate function is prepared in advance as a model for estimating the distance between the lower surface of the main body 70 and the upper end 26 of the ring. Thus, the distance to the upper end 26 of the ring can be estimated using the approximate function as a model based on the position of the bright line Lp generated by the line light L1 in the image data obtained in a state where the distance to the upper end 26 of the ring is unknown. In addition, the model does not need to be one, and for example, it can also be prepared separately according to the type of the guide ring 25 provided in the coating unit U1.

[0121] [Distance estimation method (information collection method)]

[0122] Next, refer to Fig.10 The flowchart shown and Figure 11 to Figure 13 The example shown is used to explain the distance estimation method (information collection method) in the inspection wafer 7 , particularly the method of estimating the distance between the lower surface of the main body 70 and the ring upper end 26 based on the image data in the calculation unit 73 .

[0123] exist Figure 10 to Figure 13 In the example shown, the case where the ring upper end portion 26 is not flat but is subjected to surface processing such as repeated concavities and convexities in the circumferential direction is described. In the case where the ring upper end portion 26 is a flat surface, the bright line Lp is relatively clear in the image data captured by the above method, so it is considered that it is also relatively easy to determine the representative point as the peak of the light intensity. On the other hand, in the case where the ring upper end portion 26 is formed with surface processing marks, for example, Fig.11 As shown in the image D1, the bright line Lp is not clearly shown due to the unevenness of the surface, and the unevenness before and after it also captures the diffused state of the line light L1. Therefore, in the calculation unit 73, the representative point cannot be determined by simply measuring the intensity of light for each pixel in the image data, so the image processing described below is performed.

[0124] First, as step S01, the calculation unit 73 converts the image data acquired by the camera 72 into grayscale. When the image captured by the camera 72 is a grayscale image, this processing may be omitted.

[0125] Next, as step S02, the calculation unit 73 determines the brightest y coordinate from the image data. Fig.11As shown in FIG. 1 , for the image D1, each pixel can be expressed by an xy coordinate with the direction along the ring upper end 26 as the x-axis and the direction perpendicular to the x-axis as the y-axis. However, the image D1 also includes an area where the ring upper end 26 is not captured. Therefore, in the calculation unit 73, as shown in FIG. Fig.11 As shown in FIG. 1 , when the position of each pixel is set to (x, y), the brightness values ​​of all pixels with the same y value are summed up to create a graph G1 related to the cumulative brightness value of each y coordinate. In addition, by calculating the moving average of each point ±py point, a graph G2 is obtained in which the brightness value of each y coordinate is blurred to some extent. In the graph G2, the y coordinate with the maximum brightness value can be determined as the representative y coordinate P1.

[0126] Next, as step S03, the calculation unit 73 calculates the moving average of the representative y coordinates P1±py obtained in step S02 for each x coordinate. Fig.12 As shown in FIG. 1 , the average value (moving average) is calculated based on the brightness values ​​of the pixels with the same x coordinate within the range of the representative y coordinate P1±py determined in step S02. Fig.12 As shown in the graph G3 of FIG. 1 , a graph showing the average value of the brightness value for each x coordinate is obtained. In the graph G3 , the fluctuation of the brightness due to the unevenness (surface processing marks) of the surface of the ring upper end portion 26 shown in the image D1 is expressed as unevenness of the brightness value.

[0127] Next, as step S04, the calculation unit 73 performs processing for eliminating brightness variations caused by surface processing marks. Specifically, by applying FFT (Fast Fourier Transformation) to the data of brightness values ​​obtained as graph G3, the brightness values ​​included in graph G3 are divided into frequency components. The result is Fig.13 The high-frequency components (e.g., components with more than 12 cycles) are cut (zero conversion) from the result and then inverse FFT is applied. The result is as follows: Fig.13 As shown in (b), a graph G5 is obtained in which the high-frequency component has been removed. By applying such a treatment, the continuous concavo-convex components derived from the surface processing marks are removed.

[0128] Next, as step S05, the calculation unit 73 determines a representative point based on the graph G5 from which the components derived from the surface processing marks have been removed. Fig.13 The x-coordinate with the maximum brightness value in the graph G5 shown in (b) of FIG. 1 is set as the representative point, but the following process can also be implemented, for example, to determine the representative point P2 based on information in a wider range. Specifically, when the Fig.13After finding the maximum value of the brightness value in the graph G5 of (b), 75% of the maximum value is set as a threshold value and a range R1 of brightness values ​​exceeding the threshold value is determined, and a range R2 of x coordinates of brightness values ​​included in the range R1 is determined. On this basis, the x coordinate of the center of gravity of the brightness value distribution within the range R2 can also be calculated, and the x coordinate is set as the representative point. By performing such a calculation, the representative point can be calculated by taking into account the change in the brightness value of the x coordinate around the x coordinate where the brightness value becomes a peak. In addition, by setting a structure to use the information of the range R1 of brightness values ​​exceeding 75% relative to the maximum value of the brightness value, it is possible to use information of a range that better maintains the left-right symmetry of the waveform.

[0129] Next, as step S06, the calculation unit 73 estimates the distance between the lower surface of the main body 70 and the ring upper end 26 by applying the x coordinate of the representative point obtained in step S05 to the model. As described above, the calculation unit 73 holds in advance the following information: Fig. 9 A model showing the relationship between the x coordinate in the image data and the distance between the lower surface of the main body 70 and the ring upper end 26 is shown. In the calculation unit 73, the distance between the lower surface of the main body 70 and the ring upper end 26 is calculated by applying the x coordinate of the representative point calculated in step S05 to the model.

[0130] Through the above process, the process of calculating the distance between the lower surface of the main body 70 and the ring upper end 26 based on the image D1 is completed.

[0131] [Control method between control device, information collection device and inspection wafer]

[0132] Reference Fig.14 and Fig.15 The following is a description of the process flow between the control device 100, the information collection device 9, and the inspection wafer 7 of the coating and developing device 2A. As a premise, the control device 100 controls the various parts of the coating and developing device 2A as a substrate processing device. It is assumed that the control device 100 has a process in advance when it replaces the workpiece W and transports the inspection wafer 7, and moves the inspection wafer 7 into the coating unit U1 to inspect it, in addition to the process when the substrate is processed on the workpiece W. In the following example, it is assumed that the control device 100 performs control when the inspection wafer 7 performs inspection. At this time, the information collection device 9 moves the inspection wafer 7 based on the notification from the control device 100. In addition, the inspection wafer 7 is photographed in the coating unit U1 based on the instruction from the information collection device 9, and the distance between the lower surface of the main body 70 and the upper end 26 of the ring is calculated.

[0133] exist Fig.14 , a sequence diagram is shown in which the information collecting device 9 instructs the inspection wafer 7 to start and end an operation individually.

[0134] First, the inspection wafer 7 is transported under the control of the control device 100, and the loading into the coating unit U1 is completed (step S11). Then, the control device 100 notifies the information collection device 9 of the completion of loading. After the information collection device 9 determines the next action based on the notification from the control device 100 (step S12), it instructs the inspection wafer 7 to start data collection (step S13).

[0135] In the inspection wafer 7, when the device mounting substrate 81 obtains the instruction from the information collection device 9, it instructs each part to start the action. As a result, for example, the light source 71 starts to emit the line light L1, the camera 72 starts to repeatedly shoot at a predetermined interval, and the calculation unit 73 starts to calculate the distance between the lower surface of the main body 70 and the upper end 26 of the ring based on the image data (step S14). In addition, the device mounting substrate 81 notifies the information collection device 9 that data collection in the inspection wafer 7 has started. In the information collection device 9, based on the notification from the inspection wafer 7, it is determined that the inspection wafer 7 has become ready, and the control device 100 is instructed to start the action to perform an action based on the conditions for data collection by the inspection wafer 7 (step S15).

[0136] Based on the instruction from the information collection device, the control device 100 controls the coating unit U1 to start the prescribed action (step S16), and controls the coating unit U1 to end the action after performing the pre-specified action (step S17). At this time, the control device 100 notifies the information collection device 9 that the prescribed action in the coating unit U1 has been completed. In the information collection device 9, based on the notification from the control device 100, the inspection wafer 7 is instructed to end the data collection action (step S18). In the inspection wafer 7, when the data collection is ended based on the instruction from the information collection device 9 (step S19). Summarize the information to be notified to the information collection device 9 (step S20), and report the summarized results. As an example, the following structure can be set: for the calculation result of the distance between the lower surface of the main body 70 and the upper end 26 of the ring calculated for each image in the calculation unit 73 of the inspection wafer 7, an outline is made by applying a prescribed process, and the produced result is notified to the information collection device 9.

[0137] In the information collection device 9, when the processing result from the inspection wafer 7 is received, a judgment related to the distance between the lower surface of the main body 70 and the upper end 26 of the ring is performed based on a reference such as whether the result is included in a pre-set reference range. (Step S21). In addition, the information collection device 9 can also determine the next action (step S22) based on the judgment result. For example, it can be set as follows: when the result of the judgment (S21) is that the distance between the lower surface of the main body 70 and the upper end 26 of the ring is included in the reference range (judgment OK), an instruction is issued to the control device 100 to promote the unloading action of the inspection wafer 7. In addition, when the result of the judgment (S21) is that the distance between the lower surface of the main body 70 and the upper end 26 of the ring is included in the reference range (judgment NG), for example, detailed data can be obtained from the inspection wafer 7 instead of an overview. Moreover, it can also be set to perform a detailed inspection of the result in the information collection device 9. In addition, these are examples and can be appropriately changed.

[0138] exist Fig.15 2 shows a sequence diagram in which the information collecting device 9 collectively issues instructions regarding a series of operations to the inspection wafer 7 .

[0139] First, the inspection wafer 7 is transported under the control of the control device 100, and the loading into the coating unit U1 is completed (step S31). Then, the control device 100 notifies the information collection device 9 that the loading is completed. After the information collection device 9 determines the next action based on the notification from the control device 100 (step S32), it indicates the start of data collection to the inspection wafer 7 (step S33). At this time, the information collection device 9 also notifies the inspection wafer 7 of the conditions for ending data collection. As an example, it can be set to notify the end condition of data collection by notifying the data collection time (the time for performing shooting ~ calculation) in the inspection wafer 7 from the information collection device 9. In addition, in the case of wanting to collect the images captured by the camera 72 of the inspection wafer 7, the information collection device 9 can also instruct the inspection wafer 7 to collect images and end the shooting at the stage where a specific number of images (for example, one to) can be collected. Moreover, it can also be set to indicate the image after shooting from the inspection wafer 7 to the information collection device 9.

[0140] In the inspection wafer 7, when the device mounting substrate 81 obtains the instruction from the information collection device 9, the start of the action is instructed to each part. As a result, for example, the light source 71 starts to emit the line light L1, and the camera 72 starts shooting under predetermined conditions. In addition, when there is an instruction from the information collection device 9, the calculation unit 73 starts the process of calculating the distance between the lower surface of the main body 70 and the upper end 26 of the ring based on the image data (step S34). When the data collection under the predetermined conditions is completed, the information to be notified to the information collection device 9 is summarized (step S35), and the summarized results are reported.

[0141] When the information collection device 9 receives the processing result from the inspection wafer 7, it can also make a judgment related to the distance between the lower surface of the main body 70 and the upper end 26 of the ring based on a criterion such as whether the result is included in a pre-set reference range (step S36). In addition, when the purpose is to collect data from the inspection wafer 7 (for example, to obtain an image), the information collection device 9 may not make a judgment and perform the next action. Fig.14 The illustrated case may be appropriately changed according to subsequent processing and the like.

[0142] [effect]

[0143] According to the above-mentioned information collection system 1 and information collection method, a light source 71 as an irradiation unit fixed to a disk-shaped main body 70 irradiates a line light L1 as a measurement wave to the upper end portion 26 of the ring as an annular member. In addition, in a camera 72 as a detection unit fixed relative to the main body 70, a response to the measurement wave from the irradiation unit is detected. And, in the calculation unit 73, information on the interval between the main body and the annular member is obtained based on the response result. Since the main body 70 can be held on the rotating holding disk 21 as a substrate holding unit, by setting it to such a structure, the distance information between the functional component and the substrate in the substrate processing device can be obtained.

[0144] In addition, when light is used as the measurement wave as described above, the computing unit 73 obtains information on the interval between the main body 70 and the ring upper end 26 using the image captured by the camera 72. By setting a structure in which the information on the interval is obtained using various information included in the image, more accurate information on the distance between the functional component and the substrate in the substrate processing apparatus can be obtained.

[0145] Furthermore, the light irradiated from the irradiation portion may also be line light L1 (band-shaped light). In this case, the line light L1 may also irradiate the annular member in a manner extending in a direction intersecting the circumferential direction of the annular member and from a direction different from a direction perpendicular to the upper end of the annular member. When this structure is adopted, the operation portion 73 may determine the irradiation position of the band-shaped light on the annular member based on the image captured by the camera 72, and obtain information on the interval between the main body and the annular member based on the information on the irradiation position.

[0146] By using the band-shaped light, even if the position between the annular member and the main body 70 changes a little, the annular member can be easily irradiated with the band-shaped light. In addition, when the annular member is irradiated from a direction different from the vertical direction relative to the upper end of the annular member, the irradiation position of the band-shaped light on the annular member changes according to the distance between the main body 70 and the annular member. Therefore, as described in the above embodiment, the following structure is set: in the calculation unit 73, the irradiation position of the band-shaped light on the annular member is determined, and the interval between the main body and the annular member is obtained based on the information of the irradiation position. Thus, more accurate information related to the distance between the functional component and the substrate in the substrate processing device can be obtained.

[0147] Alternatively, the computing unit may acquire information about the distance between the main body and the annular member based on a model representing the relationship between the irradiation position of the strip of light on the annular member and the distance between the main body and the annular member. By setting such a structure, more accurate information about the distance between the functional component and the substrate in the substrate processing device can be acquired.

[0148] The calculation unit 73 can also calculate the change in the circumferential light intensity distribution of the annular component based on the information related to the light intensity distribution contained in the image captured by the camera 72, and determine the irradiation position of the strip of light on the annular component based on the change information.

[0149] In addition, as described in the above embodiment, the upper surface of the annular member sometimes has concave and convex portions that are repeated in the circumferential direction. Alternatively, the operation unit 73 may use a fast Fourier transform on the image captured by the camera to remove the frequency component of the intensity of the light that is repeated in the circumferential direction of the annular member from the image to determine the irradiation position of the strip of light on the annular member.

[0150] When the upper surface of the annular member is provided with circumferentially repeated concave and convex portions, it may be difficult to determine the irradiation position of the band-shaped light due to light scattered by the concave and convex portions. In such a case, by performing the process of removing the frequency component using the fast Fourier transform as described above, the irradiation position of the band-shaped light can be determined more accurately.

[0151] The annular member may also be a liquid processing cup having a back liquid receiving portion, the back liquid receiving portion being located on the back side of the substrate, and a convex portion is provided on the back liquid receiving portion to prevent the processing liquid supplied to the substrate from going around to the back. At this time, the interval between the main body 70 and the annular member may also be the interval between the main body 70 and the convex portion of the back liquid receiving portion. In addition, the back liquid receiving portion is equivalent to the above-mentioned guide ring 25, and the upper end portion 26 of the guide ring 25 corresponds to the above-mentioned convex portion. As described above, the upper end portion 26 of the ring is a member arranged close to the workpiece W, and therefore it is required to accurately grasp its distance. Therefore, by setting the above-mentioned structure, the distance to the substrate can be more accurately grasped.

[0152] [Modifications]

[0153] Various exemplary embodiments have been described above, but the present invention is not limited to the exemplary embodiments described above, and various omissions, substitutions, and changes may be made. In addition, elements in different embodiments may be combined to form other embodiments.

[0154] For example, in the above embodiment, a structure in which the line light L1 is irradiated to the ring upper end portion 26 is described, but the line light L1 may be realized by light in a state different from the laser beam. In addition, the measuring wave is not limited to light, and may be a sound wave including ultrasonic waves or the like. In this way, the type of the measuring wave is not limited. In addition, an appropriate device can be selected as the detection unit according to the type of the measuring wave.

[0155] In the above embodiment, an example is described in which the operation unit 73 is mounted on the inspection wafer 7, but the function corresponding to the operation unit 73 may be provided in the information collection device 9. In this case, the image information captured by the camera 72 may be directly sent from the inspection wafer 7 to the information collection device 9.

[0156] In addition, in the above embodiment, the case of measuring the distance between the substrate and the annular member is described, but the functional member used as the object may also be other members included in the substrate processing device. As an example, the inspection wafer described in the above embodiment may also be used for the purpose of obtaining the distance (interval) between the arm that transports the workpiece W in the coating and developing device 2A and the workpiece W.

[0157] According to the above description, it should be understood that various embodiments of the present disclosure are described in this specification for the purpose of explanation, and various changes can be made to the various embodiments of the present disclosure without departing from the scope and spirit of the present disclosure. Therefore, the various embodiments disclosed in this specification are not intended to be limiting, and the true scope and spirit are shown by the attached claims.

[0158] Description of Reference Numerals

[0159] 1: information collection system; 2: substrate processing system; 2A: coating and developing device; 2B: exposure device; 7: inspection wafer (inspection substrate); 9: information collection device; 21: rotating holding disk (substrate holding part); 25: guide ring; 26: upper end of the ring; 27: cup; 70: main body; 71: light source; 72: camera; 73: operation unit; 74: optical system; 74a: reflector; 74b: prism; 75: through hole; 81: equipment mounting substrate; 82: battery; 100: control device, control device (control unit).

Claims

1. An information collection system for acquiring information related to a substrate processing device having a substrate holding portion for holding a substrate and an annular member located on the back side of the substrate, the information collection system comprising: a disk-shaped main body having a bottom surface capable of being held by the substrate holding portion; an irradiation unit fixed relative to the main body, the irradiation unit irradiating the ring-shaped member with a measuring wave; a detection unit fixed relative to the main body, the detection unit detecting a response to the detection wave from the irradiation unit; and A calculation unit acquires information on the interval between the main body and the annular member based on the response detected by the detection unit.

2. The information collection system according to claim 1, in, The irradiation unit irradiates light as the measurement wave, The detection unit is a camera that captures an image of the annular member irradiated with the light.

3. The information collection system according to claim 2, in, The light emitted from the irradiation unit is a strip of light. The strip of light irradiates the annular member in a manner extending in a direction intersecting the circumferential direction of the annular member and from a direction different from a direction perpendicular to the upper end of the annular member. The calculation unit determines an irradiation position of the strip-shaped light on the annular member based on the image captured by the camera, and acquires information on the interval between the main body and the annular member based on the information on the irradiation position.

4. The information collection system according to claim 3, in, The calculation unit acquires information on the interval between the main body and the annular member based on a model indicating a relationship between an irradiation position of the band-shaped light on the annular member and the interval between the main body and the annular member.

5. The information collection system according to claim 3 or 4, in, The calculation unit calculates a change in the light intensity distribution in the circumferential direction of the annular member based on information related to the light intensity distribution included in the image captured by the camera, and determines an irradiation position of the band-shaped light on the annular member based on the change information.

6. The information collection system according to claim 5, in, The upper surface of the annular member has concavities and convexities that are repeated along the circumferential direction. The computing unit uses fast Fourier transform on the image captured by the camera to remove frequency components of the intensity of light that repeats along the circumferential direction of the annular member from the image, thereby determining an irradiation position of the band-shaped light on the annular member.

7. The information collection system according to claim 1, in, The annular member is a liquid processing cup having a back liquid receiving portion, the back liquid receiving portion being located on the back side of the substrate, and a convex portion for preventing the processing liquid supplied to the substrate from going around to the back side is provided on the back liquid receiving portion. The distance between the main body and the annular member is the distance between the main body and the convex portion of the back liquid receiving portion.

8. The information collection system according to claim 1, further comprising: include: an information collecting device capable of communicating with a control device for controlling the substrate processing device; as well as an inspection substrate capable of communicating with the information collecting device, the inspection substrate comprising the main body, the irradiation unit, and the detection unit, The irradiation unit and the detection unit operate based on instructions from the information collection device.

9. The information collection system according to claim 8, in, The computing unit is provided on the inspection substrate, and operates based on an instruction from the information collecting device.

10. The information collection system according to claim 8, in, The computing unit is provided in the information collecting device.

11. An inspection substrate for obtaining information related to a substrate processing device having a substrate holding portion for holding a substrate and an annular member located on the back side of the substrate, the inspection substrate having: a disk-shaped main body having a bottom surface capable of being held by the substrate holding portion; an irradiation unit fixed relative to the main body, the irradiation unit irradiating the ring-shaped member with a measuring wave; as well as A detection unit is fixed to the main body, and detects a response to the detection wave from the irradiation unit.

12. The inspection substrate according to claim 11, in, The device further includes a calculation unit that acquires information on the interval between the main body and the annular member based on the response detected by the detection unit.

13. An information collection method for acquiring information related to a substrate processing device having a substrate holding portion for holding a substrate and a ring-shaped member located on the back side of the substrate, wherein the information collection method include: The bottom surface of the disk-shaped main body is held by the substrate holding portion; irradiating the ring-shaped member with a measuring wave from an irradiation portion fixed relative to the main body; detecting a response to the detection wave from the irradiation portion in a detection portion fixed relative to the main body portion; as well as Based on the response detected by the detection unit, information on the interval between the main body and the annular member is acquired by the calculation unit.

14. The information collection method according to claim 13, in, When performing the irradiation, the irradiation unit irradiates light as the measurement wave. The detection unit is a camera that captures an image of the annular member irradiated with the light.

15. The information collection method according to claim 14, in, When the irradiation is performed, the light irradiated from the irradiation unit is a strip of light, The strip of light irradiates the annular member in a manner extending in a direction intersecting the circumferential direction of the annular member and from a direction different from a direction perpendicular to the upper end of the annular member. When performing the acquisition, the calculation unit determines the irradiation position of the strip-shaped light on the annular member based on the image captured by the camera, and acquires information on the interval between the main body and the annular member based on the information on the irradiation position.

16. The information collection method according to claim 15, in, When performing the acquisition, the calculation unit acquires information on the interval between the main body and the annular member based on a model representing a relationship between an irradiation position of the band-shaped light on the annular member and the interval between the main body and the annular member.

17. The information collection method according to claim 15 or 16, in, When performing the acquisition, the calculation unit calculates the change in the intensity distribution of light in the circumferential direction of the annular component based on information related to the intensity distribution of light contained in the image captured by the camera, and determines the irradiation position of the band-shaped light on the annular component based on the information of the change.

18. The information collection method according to claim 17, in, The upper surface of the annular member has concavities and convexities that are repeated along the circumferential direction. When performing the acquisition, the calculation unit uses fast Fourier transform on the image captured by the camera to remove the frequency component of the intensity of light repeated along the circumference of the annular member from the image to determine the irradiation position of the band-shaped light on the annular member.

Images