Display device

Abstract

The organic EL display device (1) includes a light-emitting element layer (60) supported by a substrate layer (10) and including a plurality of organic EL elements (62). The display device has a bezel region (FA) provided around a display region (DA). A touch panel line (130) is provided in the bezel region and extends from the display region side toward the outside of the bezel region so as to extend across first and second frame-shaped barrier walls (W1, W2) surrounding the display region. An organic layer (74) diffused in the display region is provided inside the first and second barrier walls. Recesses (88) are provided on the first and second barrier walls such that the height of the portion where the touch panel line extends is lower than the height of the other portions.

Description

Technical Field

[0001] The present disclosure relates to a display device. Background Art

[0002] In recent years, organic EL display devices with organic electroluminescence (EL) elements have been put into practical use. As an organic EL display device, there is a known structure in which an organic EL element is covered and sealed with a sealing film. For example, Patent Document 1 discloses a sealing structure in which a sealing film is laminated with a flattened resin layer and a barrier layer by more than one layer. In this sealing structure, an annular barrier portion surrounding an electronic element portion is formed on a substrate, and a flattened resin layer is formed on the inner side of the barrier portion. Prior art literature Patent Literature

[0003] Patent Document 1: Japanese Patent Application Publication No. 2012-253036 Summary of the invention Technical Problems to be Solved by the Invention

[0004] In an organic EL display device, when a sealing structure such as that disclosed in Patent Document 1 is adopted, the planarization resin layer is formed by applying a liquid material using an inkjet method, a dispenser, or the like, and then curing the liquid material. The barrier is a wall for blocking the wetting and diffusion of the liquid material forming the planarization resin layer. Therefore, from the viewpoint of making the barrier function reliable, it is preferred that the barrier be relatively high, for example, designed to be relatively high at a height of several μm.

[0005] In the case where an organic EL display device provided with such a barrier is set as a single-chip display device with a touch panel, a touch panel is made on a sealing film. In this case, it is necessary to lead wiring from a touch area for detecting a touch position on the touch panel to a frame area. The wiring is formed in a manner that crosses the barrier. In this case, when the wiring is patterned, the resist used for masking flows from the top surface of the barrier before exposure and becomes thinner on the top surface. Therefore, the wiring may be interrupted at the top of the patterning due to etching during formation, resulting in a disconnection.

[0006] An object of the technology disclosed herein is to suppress disconnection of wiring on a wall when forming wiring in a frame region of a display device. Solutions for solving problems

[0007] The technology disclosed in the present invention takes a display device as an object. The display device involved in the technology disclosed in the present invention has a display area for displaying an image and a frame area arranged around the display area. The frame area is provided with: a wall body, which is arranged in a frame shape in a manner to surround the display area; and wiring, which extends in a manner that the wall body spans from the display area to the outside of the frame area. In addition, a recess is provided on the wall body in a manner that the height of the portion where the wiring extends is lower than the height of the other portions. Effects of the Invention

[0008] According to the technology disclosed in the present invention, it is possible to suppress disconnection of wiring on a wall when forming wiring in a frame region of a display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a plan view schematically illustrating the structure of an organic EL display device according to an embodiment. Figure 2 is along Figure 1 A cross-sectional view of an organic EL display device taken along line II-II. Figure 3 It is a plan view illustrating a schematic structure of a display panel. Figure 4 It is a plan view illustrating a schematic configuration of a touch panel. Figure 5 is an example composed of Figure 3 FIG. 5 is a top view of pixels and various display wirings in a display area of ​​a portion surrounded by a dashed line shown in FIG. Figure 6 is an example of the structure and Figure 5 A top view of pixels and display wiring in a display area at corresponding locations. Figure 7 is along Figure 5 A cross-sectional view of an organic EL display device taken along line VII-VII. Figure 8 is an equivalent circuit diagram illustrating a pixel circuit. Fig. 9 This is a cross-sectional view illustrating a structure for leading out a touch panel line in an organic EL display device according to an embodiment. Fig.10 This is a plan view illustrating the structure of the intersection of the touch panel line and the first barrier ribs and the second barrier ribs in the organic EL display device according to the embodiment. Fig.11 is along Fig.10 A cross-sectional view of an organic EL display device taken along line XI-XI. Fig.12 is along Fig.10 A cross-sectional view of the organic EL display device taken along line XII-XII. Fig.13 is along Fig.10 A cross-sectional view of the organic EL display device taken along line XIII-XIII. Fig.14 is a diagram illustrating a state in which a resist is applied when patterning a touch panel line in a manufacturing process of an organic EL display device according to an embodiment of the present invention. Fig.11 A cross-sectional view of the part. Fig.15 is a diagram illustrating a state in which a resist is applied when patterning a touch panel line in a manufacturing process of an organic EL display device according to an embodiment of the present invention. Fig.12 A cross-sectional view of the part. Fig.16 is a diagram illustrating a state in which a resist is applied when patterning a touch panel line in a manufacturing process of an organic EL display device according to an embodiment of the present invention. Fig.13 A cross-sectional view of the part. Fig.17 is a diagram corresponding to the embodiment of the present invention, illustrating a state in which a resist is developed when patterning a touch panel line in a manufacturing process of an organic EL display device. Fig.13 A cross-sectional view of the part. Fig.18 is a diagram illustrating a state in which a touch panel line is patterned in a manufacturing process of an organic EL display device according to an embodiment of the present invention. Fig.13 A cross-sectional view of the part. Fig.19 It is a plan view illustrating the structure of the intersection of the touch panel line and the first barrier ribs and the second barrier ribs in the organic EL display device according to the first modification. Fig. 20 is along Fig.19 A cross-sectional view of the organic EL display device taken along line XX-XX. Fig.21 is a diagram illustrating a state in which a resist is applied when patterning a touch panel line in a manufacturing process of an organic EL display device according to a first modification example, corresponding to Fig. 20 A cross-sectional view of the part. Fig. 22 is a diagram corresponding to the first modification example, illustrating a state in which a resist is developed when patterning a touch panel line in a manufacturing process of an organic EL display device. Fig. 20 A cross-sectional view of the part. Fig.23 is a diagram illustrating a state in which a touch panel line is patterned in a manufacturing process of an organic EL display device in a first variant, corresponding to Fig. 20 A cross-sectional view of the part. Fig.241 is a plan view illustrating the structure of the intersection of the touch panel line and the first barrier ribs and the second barrier ribs in the organic EL display device according to the second modification. Fig.25 This is a cross-sectional view illustrating a structure for leading out touch panel lines in an organic EL display device according to a third modification. Fig.26 It is a cross-sectional view illustrating a stacked structure of first barrier walls, second barrier walls, and third barrier walls in an organic EL display device according to a third modification. Fig. 27 It is a cross-sectional view illustrating a stacked structure of a portion where a touch panel line extends among first barrier walls, second barrier walls, and third barrier walls in an organic EL display device according to a third modification. Fig.28 is a diagram illustrating a state in which a resist is applied when patterning a touch panel line in a manufacturing process of an organic EL display device of a comparative example, corresponding to Fig.12 A cross-sectional view of the part. Fig.29 is a diagram illustrating a state in which a touch panel line is patterned in a manufacturing process of an organic EL display device of a comparative example, corresponding to Fig.12 A cross-sectional view of the part. DETAILED DESCRIPTION

[0010] Hereinafter, exemplary embodiments are described in detail based on the accompanying drawings. In the following embodiments, an organic EL display device is taken as an example as a display device involved in the technology of the present disclosure. In addition, the accompanying drawings are used to conceptually illustrate the technology of the present disclosure. Therefore, the accompanying drawings may exaggerate or simplify the size, ratio or number to facilitate understanding of the technology of the present disclosure.

[0011] In the following embodiments, the record of setting or forming other films, layers, elements, etc. on a certain film, layer, element, etc., not only means the situation where other elements exist directly above the certain element, but also includes the situation where other films, layers, elements, etc., are sandwiched between the two elements.

[0012] In addition, in the following embodiments, the description that a certain component is connected to other components means electrical connection unless otherwise specified. The description refers not only to the case of direct connection within the scope of the subject matter of the technology disclosed herein, but also to indirect connection through other components. The description also includes the case where other components are integrated with a certain component, that is, a part of a certain component constitutes another component.

[0013] In addition, in the following embodiments, the description that a certain component is in the same layer as other components means that the certain component is formed by the same process as other components. The description that a certain component is a lower layer of other components means that the certain component is formed by a process earlier than other components. The description that a certain component is an upper layer of other components means that the certain component is formed by a process later than other components.

[0014] In addition, in the following embodiments, the record that a certain component is identical or equivalent to other components does not only mean a state that the certain component is completely identical with other components, but also includes a state that is substantially identical or substantially equivalent, such as a certain component and other components vary within the range of manufacturing deviation or tolerance.

[0015] In addition, in the following embodiments, the descriptions such as "first, second, third ..." are used to distinguish the sentences with the descriptions, and do not limit the number or order of the sentences.

[0016] Implementation Methods The organic EL display device 1 of this embodiment is used in various devices such as multifunctional mobile phones called smartphones, mobile devices such as tablet terminals, personal computers (PCs), and television devices. The organic EL display device 1 of this example is a display device with a touch panel that allows input operations to be performed by touching the screen.

[0017] - Composition of organic EL display device - The organic EL display device 1 has a function of detecting a touch position on a screen displaying an image while displaying the image. Figure 1 and Figure 2 As shown, the organic EL display device 1 includes a display panel DP and a touch panel TP. The display panel DP and the touch panel TP constitute a panel body PL. Although not shown, a polarizing plate and a cover panel are sequentially stacked on the front side of the panel body PL.

[0018] The organic EL display device 1 is provided with a display area DA, a touch area TA, and a frame area FA. The display panel DP has the display area DA and the frame area FA (see Figure 3 The touch panel TP has a touch area TA and a frame area FA (see Figure 4 The display area DA and the touch area TA are set to overlap each other at the same position and with the same size. The frame area FA is provided around the display area DA and the touch area TA.

[0019] The display area DA is an area where images are displayed. The display area DA constitutes a screen. The display area DA is set to be, for example, rectangular. The display area DA may also be a roughly rectangular shape with at least one side being in an arc shape, at least one corner being in an arc shape, at least one side having a cutout, or any other arbitrary shape.

[0020] like Figure 5 As shown, the display area DA is composed of a plurality of pixels PX. The plurality of pixels PX are arranged in a matrix. Each pixel PX is composed of three sub-pixels SP. The three sub-pixels SP are a sub-pixel SPr having a light-emitting area E that emits red light, a sub-pixel SPg having a light-emitting area E that emits green light, and a sub-pixel SPb having a light-emitting area E that emits blue light. The three sub-pixels SPr, SPr, and SPb are arranged in a stripe shape, for example.

[0021] Figure 1 and Figure 2 The touch area TA shown is an area for detecting a touch position touched by a contact body. The contact body is, for example, a user's finger, a stylus, etc. The touch area TA is, for example, set to a rectangular frame shape. The touch area TA is set to a shape corresponding to the shape of the display area DA. That is, the touch area TA may also be a roughly rectangular shape as described above, or may adopt any other shape.

[0022] The frame area FA is an area that constitutes a non-display portion outside the screen. The frame area FA is set to be, for example, a rectangular frame. The frame area FA may also be a frame shape other than a rectangular frame. The frame area FA includes a terminal portion T and a bending portion B. The terminal portion T is a portion for connecting to an external circuit. As the terminal portion T, a first terminal portion T1 and a second terminal portion T2 are provided.

[0023] The first terminal portion T1 and the second terminal portion T2 are provided at a portion constituting one side of the frame area FA. The first terminal portion T1 is located near the outer edge of the frame area FA. The first terminal portion T1 is a portion that supplies a signal to the display panel DP. The second terminal portion T2 is located closer to the display area DA than the first terminal portion T1. The second terminal portion T2 is a portion that applies a voltage to the touch panel TP.

[0024] The bent portion B is disposed between the terminal portion T (strictly speaking, the second terminal portion T2) in the frame area FA and the display area DA. Figure 1 The bent portion B is a portion bent along a bending axis extending in the lateral direction, that is, in the first direction X. The bent portion B extends laterally over the entire frame area DA in the first direction X. In the bent portion B, a slit SL is formed in the TFT layer 20 described later.

[0025] The slit SL is formed into a through groove along the extension direction of the bent portion B in a manner that penetrates the TFT layer 20 (specifically, a laminate composed of the primer film 22, the gate insulating film 32, the first interlayer insulating film 34a, and the second interlayer insulating film 34b) to expose the substrate layer 10. A filling layer FL is provided in the slit SL. The slit SL is filled with the filling layer FL. The filling layer FL is formed of an organic resin material such as polyimide resin, acrylic resin, and polysiloxane.

[0026] The frame area FA of the organic EL display device 1 is bent at 180° in a U-shaped manner at the bent portion B. In this way, both the first terminal portion T1 and the second terminal portion T2 are arranged on the back side ( Figure 2 The first terminal portion T1 and the second terminal portion T2 are respectively connected to a wiring substrate CB such as a FPC (Flexible Printed Circuit).

[0027] 〈Display Panel〉 The display panel DP adopts an active matrix driving method. In the display panel DP of the active matrix driving method, the light emission of each sub-pixel SP is converted and controlled by a thin film transistor (Thin Film Transistor; hereinafter referred to as TFT) 30, and the image is displayed through the operation of the TFT 30. Figure 2 As shown, the display panel DP includes a substrate layer 10 , a TFT layer 20 , a light emitting element layer 60 and a sealing film 70 .

[0028] 〈Substrate layer〉 The substrate layer 10 is a layer constituting the base of the display panel DP. The substrate layer 10 has flexibility. The substrate layer 10 is formed of an organic resin material such as a polyimide resin, a polyamide resin, an epoxy resin, etc. The substrate layer 10 may include an inorganic insulating layer stacked therein, such as silicon oxide, and a resin layer including the organic resin material as described above. The substrate layer 10 may also adopt a structure in which an inorganic insulating layer such as silicon oxide and a resin layer made of the above-mentioned organic resin material are stacked. Although not shown in the figure, a protective film is attached to the back of the substrate layer 10.

[0029] 〈TFT layer〉 The TFT layer 20 is disposed between the substrate layer 10 and the light emitting element layer 60. Figure 3 , Figure 5 to Figure 7 As shown, the TFT layer 20 includes a drive circuit DC, a plurality of TFTs 30, a plurality of capacitors 40, and various wirings 50. The drive circuit DC, various wirings 50, TFTs 30, and capacitors 40 are provided on the primer film 22. The primer film 22 is provided on substantially the entire surface of the substrate layer 10.

[0030] like Figure 3As shown, the driving circuit DC is provided in the frame area FA, on a side ( Figure 3 The driving circuit DC includes a gate driver and an emission driver. The driving circuit DC is formed monolithically on the display panel DP. The driving circuit DC is arranged closer to the display area DA side than the groove 48 described later.

[0031] like Figure 7 As shown, the plurality of TFTs 30 are all configured as top gate type. A plurality of TFTs 30 are provided for each sub-pixel SP. The TFT 30 is an example of an active element. The plurality of TFTs 30 respectively include a semiconductor layer 31, a gate insulating film 32, a gate electrode 33, an interlayer insulating film 34, a first terminal electrode 35, and a second terminal electrode 36.

[0032] The semiconductor layer 31 is provided in an island shape on the primer film 22. The semiconductor layer 31 is separated for each TFT 30. The semiconductor layer 31 may be provided continuously. The semiconductor layer 31 is formed of, for example, low temperature polycrystalline silicon (LTPS). The semiconductor layer 31 may also be formed of an oxide semiconductor such as indium gallium zinc oxide (In-Ga-Zn-O).

[0033] The gate insulating film 32 is provided so as to cover the plurality of semiconductor layers 31. The gate insulating film 32 is continuously formed on the primer film 22. The gate insulating film 32 may be provided in an island shape on each semiconductor layer 31 and separated for each TFT 30. The gate electrode 33 is provided on the gate insulating film 32. The gate electrode 33 overlaps with the semiconductor layer 31 via the gate insulating film 32.

[0034] The interlayer insulating film 34 is composed of a first interlayer insulating film 34a and a second interlayer insulating film 34b. The first interlayer insulating film 34a and the second interlayer insulating film 34b are sequentially stacked on the gate insulating film 32. The interlayer insulating film 34 is provided in a manner covering a plurality of gate electrodes 33. Contact holes 37 are formed in the gate insulating film 32 and each interlayer insulating film 34. A pair of contact holes 37 is provided for each TFT 30.

[0035] A pair of contact holes 37 penetrates through the semiconductor layer 31 on both sides of the region (intrinsic region) overlapping with the gate electrode 33. The first terminal electrode 35 and the second terminal electrode 36 are provided on the interlayer insulating film 34. The first terminal electrode 35 and the second terminal electrode 36 are separated from each other and are connected to the conductive region of the semiconductor layer 31 via the contact holes 37, respectively.

[0036] At least one capacitor 40 is provided for each sub-pixel SP. The capacitor 40 includes a first capacitor electrode 42 and a second capacitor electrode 44. The first capacitor electrode 42 is provided on the gate insulating film 32. The second capacitor electrode 44 is provided on the first interlayer insulating film 34a. The first capacitor electrode 42 and the second capacitor electrode 44 overlap each other via the first interlayer insulating film 34a.

[0037] The TFT layer 20 has a planarization film 46. The planarization film 46 is provided so as to cover the drive circuit DC, the plurality of TFTs 30, and the plurality of capacitors 40. The surface of the TFT layer 20 is planarized by the planarization film 46. The planarization film 46 is composed of a first planarization film 46a and a second planarization film 46b. The first planarization film 46a and the second planarization film 46b are sequentially stacked on the second interlayer insulating film 34b.

[0038] The first planarization film 46a and the second planarization film 46b are respectively formed of an organic resin material such as polyimide resin, acrylic resin, or a polysiloxane-based SOG (Spin On Glass) material. The planarization film 46 is spread over the entire display area DA and the inner peripheral side of the frame area FA. Figure 3 , Fig.11 and Fig.12 As shown, a groove 48 is formed in a portion of the planarization film 46 where the frame area FA is located.

[0039] The groove 48 is formed in a frame shape so as to surround the display area DA. The groove 48 may also be formed in a substantially C shape that opens on the terminal portion side when viewed from above. The groove 48 penetrates the planarization film 46 and divides the planarization film 46 into the inner peripheral side and the outer peripheral side of the frame area FA. The groove 48 prevents moisture and the like from penetrating into the display area DA from the outer peripheral side of the frame area FA.

[0040] like Figure 3 and Figure 7 As shown in FIG. 1 , various wirings 50 include a first frame line 50fa, a second frame line 50fb, a plurality of lead lines 50h, a plurality of gate lines 50g, a plurality of source lines 50s, a plurality of emission control lines 50e, a power line 50p, and a plurality of relay lines 50r. The first frame line 50fa, the second frame line 50fb, and the lead lines 50h are provided in the frame area FA. The gate lines 50g, the source lines 50s, the emission control lines 50e, the power lines 50p, and the relay lines 50r are provided in the display area DA.

[0041] like Figure 3As shown, the first frame line 50fa is formed in a frame shape on the side closer to the display area DA than the drive circuit DC in the frame area FA. The first frame line 50fa has an extension portion 50c extending toward the first terminal portion T1. The extension portions 50c are respectively provided on both sides of the first direction X of the portion on the terminal portion T side of the first frame line 50fa. The first frame line 50fa is located on the interlayer insulating film 34. A high-level power supply voltage (ELVDD) is supplied to the first frame line 50fa through the wiring substrate CB.

[0042] The second frame line 50fb is formed in a substantially C-shape in the frame area FA so as to extend further to the outer peripheral side than the drive circuit DC. Both ends of the second frame line 50fb are located on the terminal portion T side of the frame area FA, and extend toward the first terminal portion T1 along the extension portion 50c of the first frame line 50fa. The second frame line 50fb is located on the interlayer insulating film 34. A low-level power supply voltage (ELVSS) is supplied to the second frame line 50fb through the wiring substrate CB.

[0043] A plurality of lead wires 50h are respectively led out from the display area DA and extend to the first terminal portion T1. The end of each lead wire 50h located at the first terminal portion T1 and the ends of the first frame line 50fa and the second frame line 50fb respectively constitute a terminal. The first terminal portion T1 is provided with a plurality of terminals. Each lead wire 50h is composed of a lower layer lead wire 50hl and an upper layer lead wire 50hu.

[0044] Each lower layer lead line 50hl is formed with a portion between the display area DA and the bent portion B and a portion between the bent portion B and the first terminal portion T1 in the frame area FA. A plurality of lower layer lead lines 50hl are arranged at intervals from each other in the first direction X and extend parallel to each other in the second direction Y. Each lower layer lead line 50hl is located on the primer film 22. Each lower layer lead line 50hl located closer to the display area DA than the bent portion B is connected to the source line 50s.

[0045] Each upper lead line 50hu is formed on the filling layer FL in a manner spanning the bent portion B. The plurality of upper lead lines 50hu are arranged at intervals from each other in the first direction X, and extend parallel to each other in the second direction Y. Each upper lead line 50hu is located on the interlayer insulating film 34. The upper lead line 50hu is connected to a lower lead line 50hl located closer to the display area DA than the bent portion B, and a lower lead line 50hl located closer to the terminal portion T than the bent portion B.

[0046] Each terminal of the first terminal portion T1 is connected to a source driver via a wiring substrate CB. An anisotropic conductive bonding material such as ACF (Anisotropic Conductive Film) is used for connection between each terminal and the wiring substrate CB. The source driver is a circuit that controls image display by supplying signals to wiring (source line 50s, etc.) and a driving circuit DC included in the display panel DP.

[0047] like Figure 5 As shown, the plurality of gate lines 50g are wirings for transmitting gate signals. The plurality of gate lines 50g are arranged in the display area DA at intervals in the second direction Y and extend parallel to each other in the first direction X. The gate lines 50g are provided for each row of sub-pixels SP. Each gate line 50g is located on the primer film 22. Each gate line 50g is connected to a gate driver of the drive circuit DC.

[0048] The plurality of emission control lines 50e are wirings for transmitting emission signals. The plurality of emission control lines 50e are arranged at intervals from each other in the second direction Y and extend parallel to each other in the first direction X. The emission control lines 50e are provided for each row of sub-pixels SP. Each emission control line 50e is located on the primer film 22. Each emission control line 50e is connected to an emission driver of the drive circuit DC.

[0049] The plurality of source lines 50s are wirings for transmitting source signals. The plurality of source lines 50s are arranged in the display area DA at intervals in the first direction X and extend parallel to each other in the second direction Y. The source line 50s is provided for each column of the sub-pixels SP. Each source line 50s is located on the interlayer insulating film 34. Each source line 50s is connected to a source driver via a lead line 50h.

[0050] The power line 50p is a wiring for applying a predetermined high-level power supply voltage (ELVDD). The power line 50p in this example is composed of a plurality of first power lines 50pa and a second power line 50pb. The plurality of first power lines 50pa are arranged in the display area DA at intervals in the first direction X and extend parallel to each other in the second direction Y. The first power line 50pa is provided for each row of sub-pixels SP. Each first power line 50pa is located on the second interlayer insulating film 34b.

[0051] like Figure 6As shown, the second power line 50pb is formed in a lattice shape in the first direction X and the second direction Y. The second power line 50pb is located on the first planarization film 46a. Although not shown, the second power line 50pb is connected to each first power line 50pa via a contact hole formed in the first planarization film 46a. Each first power line 50pa is connected to the first frame line 50fa. The first power line 50pa may also be located on the first interlayer insulating film 34a.

[0052] like Figure 7 As shown, a plurality of relay lines 50r are wirings for relaying the connection between the organic EL element 62 and the TFT 30. The relay line 50r is provided for each sub-pixel SP. Each relay line 50r is formed in an island shape on the first planarizing film 46a. The relay line 50r is connected to the second terminal electrode 36 of the specified TFT 30 (third TFT 30C) via the contact hole 47 formed on the first planarizing film 46a. In addition, the pixel electrode 63 of the organic EL element 62 is connected to the relay line 50r via the contact hole 48 formed on the second planarizing film 46b.

[0053] The primer film 22, the gate insulating film 32, the first interlayer insulating film 34a and the second interlayer insulating film 34b are made of, for example, an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, etc. The primer film 22, the gate insulating film 32, the first interlayer insulating film 34a and the second interlayer insulating film 34b are composed of a single layer film or a stacked film made of an inorganic insulating material.

[0054] Each gate electrode 33, each first capacitor electrode 42, each gate line 50g, each emission control line 50e and each lower layer lead line 50hl are formed of the same material in the same layer. Each first terminal electrode 35, each second terminal electrode 36, first frame line 50fa, second frame line 50fb, each upper layer lead line 50hu, each source line 50s and each first power supply line 50pa are formed of the same material in the same layer. Each second power supply line 50pb and each relay line 50r are formed of the same material in the same layer.

[0055] The various wirings 50 and electrodes in the display panel DP are formed of metal materials such as aluminum (Al), tungsten (W), molybdenum (Mo), tantalum (Ta), chromium (Cr), titanium (Ti), copper (Cu), etc. These various wirings 50 and electrodes are composed of a single layer film or a stacked film made of a metal material.

[0056] <Light-emitting element layer> like Figure 7As shown, the light emitting element layer 60 is provided on the TFT layer 20, and the light emitting element layer 60 includes a plurality of organic EL elements (organic electroluminescent elements) 62. The organic EL element 62 is an example of a light emitting element. The organic EL element 62 is configured as a top emission type. In the top emission type organic EL element 62, light emitted by the organic EL layer 64 is taken out from the sealing film 70 side. The organic EL element 62 includes a pixel electrode 63, an organic EL layer 64 and a common electrode 65.

[0057] The pixel electrode 63 is provided on each sub-pixel SP. The pixel electrode 63 is arranged in a matrix corresponding to the sub-pixels SP. The pixel electrode 63 is provided on the planarization film 46. The pixel electrode 63 has a property of reflecting light. The pixel electrode 63 functions as an anode. The pixel electrode 63 is preferably made of a conductive material with a large work function.

[0058] The light emitting element layer 60 includes a plurality of pixel electrodes 63 and an edge cover 66. The edge cover 66 is provided on the planarization film 46 to divide the plurality of pixel electrodes 63. The edge cover 66 is formed in a lattice shape and covers the peripheral edge of each pixel electrode 63. The edge cover 66 is made of, for example, an organic resin material such as polyimide resin, acrylic resin, or a polysiloxane-based SOG material. The region of the edge cover 66 corresponding to each opening 67 constitutes a light emitting region E.

[0059] The organic EL layer 64 is provided on each pixel electrode 63 in the opening 67 of the edge cover 66. The organic EL layer 64 has a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer and an electron injection layer which are sequentially provided on the pixel electrode 63. The hole injection layer, the hole transport layer, the light emitting layer, the electron transport layer and the electron injection layer are made of known compounds suitable for their respective functions. The organic EL layer 64 emits light by applying a current between the pixel electrode 63 and the common electrode 65.

[0060] The common electrode 65 is continuously provided in common with the plurality of sub-pixels SP. The common electrode 65 covers the edge cover 66 and is disposed on each organic EL layer 64, and overlaps with each pixel electrode 63 via the organic EL layer 64. The common electrode 65 has the property of transmitting light. The common electrode 65 functions as a cathode. The common electrode 65 preferably uses a conductive material with a small work function. The common electrode 65 diffuses to the frame area FA and is connected to the second frame line 50fb (see Fig.11 and Fig.12 ).

[0061] The plurality of TFTs 30, capacitors 40, and organic EL elements 62 provided for each sub-pixel SP constitute a structure as shown in FIG. Figure 8The pixel circuit PC shown. The pixel circuit PC controls the light emission of the organic EL element 62 based on the gate signal supplied to the gate line 50g, the emission signal supplied to the emission control line 50e, the source signal supplied to the source line 50s, the high-level power supply voltage (ELVDD) supplied to the power supply line 50p, and the low-level power supply voltage (ELVSS) supplied to the common electrode 65.

[0062] exist Figure 8 In the equivalent circuit diagram of , the first terminal electrode 35 of the TFT 30 is indicated by a circled number 1, and the second terminal electrode 36 of the TFT 30 is indicated by a circled number 2. In addition, the first capacitor electrode 42 of the capacitor 40 is indicated by a squared number 1, and the second capacitor electrode 44 of the capacitor 40 is indicated by a squared number 2. The plurality of TFTs 30 constituting the pixel circuit PC of this example are a first TFT 30A, a second TFT 30B, and a third TFT 30C.

[0063] In the first 1TFT30A, the gate electrode 33 is connected to the corresponding gate line 50g, the first terminal electrode 35 is connected to the corresponding source line 50s, and the second terminal electrode 36 is connected to the corresponding second 2TFT30B. In the second 2TFT30B, ​​the gate electrode 33 is connected to the second terminal electrode 36 of the corresponding first 1TFT30A, the first terminal electrode 35 is connected to the corresponding power line 50p, and the second terminal electrode 36 is connected to the corresponding third 3TFT30C.

[0064] In the third 3TFT30C, the gate electrode 33 is connected to the corresponding emission control line 50e, the first terminal electrode 35 is connected to the second terminal electrode 36 of the corresponding second 2TFT30B, ​​and the second terminal electrode 36 is connected to the pixel electrode 63 of the corresponding organic EL element 62. In the capacitor 40, the first capacitor electrode 42 is connected to the power supply line 50p, and the second capacitor electrode 44 is connected to the second terminal electrode 36 of the first 1TFT30A and the gate electrode 33 of the second 2TFT30B.

[0065] Sealing film like Figure 7 As shown, the sealing film 70 is provided on the light emitting element layer 60. The sealing film 70 covers the plurality of organic EL elements 62 and protects each organic EL element 62 (especially the organic EL layer 64) from moisture, oxygen, etc. The sealing film 70 has, for example, a TFE (Thin Film Encapsulation) structure. Such a sealing film 70 has a first inorganic layer 72, an organic layer 74, and a second inorganic layer 76. The first inorganic layer 72, the organic layer 74, and the second inorganic layer 76 are sequentially provided on the light emitting element layer 60 and diffused in the display area DA.

[0066] The first inorganic layer 72 and the second inorganic layer 76 are respectively made of inorganic insulating materials such as silicon oxide, silicon nitride, silicon oxynitride, etc. The organic layer 74 is an example of a coating film. That is, the coating film in this example is included in the sealing film 70. The organic layer 74 is made of an organic resin material such as acrylic resin, epoxy resin, silicone resin, polyurea resin, polyparaxylene resin, polyimide resin, polyamide resin, etc.

[0067] 〈Touch Panel〉 like Figure 2 As shown, the touch panel TP is provided on the display panel DP. That is, the touch panel TP is provided on the upper layer of the organic layer 74 which is a coating film. The touch panel TP is an On Cell (embedded) type touch panel. The touch panel TP adopts a projected electrostatic capacitance method (projected capacitance method). Figure 4 and Figure 7 As shown, the touch panel TP includes a plurality of first sensing electrodes 100 , a plurality of second sensing electrodes 110 , a plurality of touch panel lines 130 , an interlayer insulating film 140 , and an overcoat film 150 .

[0068] The plurality of first detection electrodes 100 are arranged in a matrix in the touch area TA. The plurality of second detection electrodes 110 are also arranged in a matrix in the touch area TA. The first detection electrodes 100 and the second detection electrodes 110 are both electrodes for touch position detection. The first detection electrodes 100 and the second detection electrodes 110 are arranged alternately in a direction inclined relative to the first direction X and the second direction Y.

[0069] The first detection electrodes 100 are formed in a rhombus shape, for example. Corners of the first detection electrodes 100 adjacent to each other in the first direction X face each other. Corners of the first detection electrodes 100 adjacent to each other in the second direction Y also face each other. Corners of the first detection electrodes 100 adjacent to each other in the first direction X are connected to each other via the first connection line 102. The plurality of first detection electrodes 100 arranged in the first direction X constitute a first electrode group 104.

[0070] The second detection electrodes 110 are formed in a rhombus shape, for example. The corners of the second detection electrodes 110 adjacent to each other in the first direction X face each other. The corners of the second detection electrodes 110 adjacent to each other in the second direction Y also face each other. The corners of the second detection electrodes 110 adjacent to each other in the second direction Y are connected to each other via the second connection line 112. The plurality of second detection electrodes 110 arranged in the second direction Y constitute a second electrode group 114.

[0071] A plurality of touch panel lines 130 are provided in the frame area FA. The touch panel lines 130 are wirings included in the touch panel TP. Each touch panel line 130 is led out from the touch area TA on the touch panel TP and extends to the second terminal portion T2. ​​The end of each touch panel line 130 located at the second terminal portion T2 constitutes a terminal. The second terminal portion T2 is provided with a plurality of terminals. As the touch panel lines 130, a plurality of first touch panel lines 130a and a plurality of second touch panel lines 130b are provided.

[0072] The first touch panel line 130a is provided for each first electrode group 104. Each first touch panel line 130a is connected to the first detection electrode 100 located at the end of the first electrode group 104. Each first touch panel line 130a passes through one side or the other side (in the first direction X) of the frame area FA. Figure 4 In the example shown, a portion of the side (the left side or the right side) is led back from the touch area TA to the second terminal portion T2.

[0073] The first touch panel lines 130 a connected to the adjacent first electrode groups 104 are led out to different sides of the frame area FA. The first touch panel lines 130 a located on the same side of the frame area FA are arranged to extend in parallel with each other at intervals and straddle the bend B. Each of the first touch panel lines 130 a may be routed to the second terminal portion T2 via only a portion of a side in the first direction X that constitutes the frame area FA.

[0074] The second touch panel line 130b is provided for each second electrode group 114. Each second touch panel line 130b is connected to the second detection electrode 110 located at the end of the second electrode group 114. Each second touch panel line 130b leads a portion of the side of the frame area FA that constitutes the terminal portion T side to the second terminal portion T2. ​​A plurality of second touch panel lines 130b extend in parallel with intervals between each other and are provided to cross the bend portion B.

[0075] The touch detection circuit (not shown) is connected to each terminal of the second terminal portion T2 via the wiring substrate CB. An anisotropic conductive bonding material such as ACF is used for the connection between these terminals and the wiring substrate CB. The touch detection circuit is a circuit that detects changes in electrostatic capacitance generated between the first detection electrode 100 and the second detection electrode 110 included in the touch panel TP and the contact body when the touch area TA is touched by the contact body.

[0076] A plurality of first detection electrodes 100, a plurality of first connection lines 102, and a plurality of first touch panel lines 130a are provided on the sealing film 70. Each of the first detection electrodes 100, each of the first connection lines 102, and each of the first touch panel lines 130a is formed of the same material in the same layer. An interlayer insulating film 140 is provided in a manner covering the plurality of first detection electrodes 100, the plurality of first connection lines 102, and the plurality of first touch panel lines 130a.

[0077] The interlayer insulating film 140 is made of the same inorganic insulating material as the first interlayer insulating film 34a of the TFT layer 20. The interlayer insulating film 140 is composed of a single layer film or a stacked film made of an inorganic insulating material. A plurality of second detection electrodes 110, a plurality of second connection lines 112, and a plurality of second touch panel lines 130b are provided on the interlayer insulating film 140. Each second detection electrode 110, each second connection line 112, and each second touch panel line 130b are formed of the same material in the same layer.

[0078] The above-mentioned various wirings and electrodes in the touch panel TP are made of a conductive oxide having a property of transmitting light. As such conductive oxides, for example, indium tin oxide (ITO) and indium zinc oxide (IZO) can be cited. These wirings and electrodes are composed of a single layer film or a laminated film made of a conductive oxide. The first touch panel line 130a and the second touch panel line 130b can also be formed of the same metal material as the various wirings and electrodes in the display panel DP.

[0079] The outer coating film 150 is provided in a manner covering the plurality of second detection electrodes 110 and the plurality of second connection lines 112 in the touch area TA. The outer coating film 150 is provided to cover the first touch panel line 130a via the interlayer insulating film 140 at locations other than the second terminal portion T2 in the frame area FA, and directly cover the second touch panel line 130b. The outer coating film 150 is made of an organic resin material having a light-transmitting property, such as an acrylic resin.

[0080] 〈Blocking Section〉 like Figure 3 , Fig. 9 and Fig.10 As shown in FIG. 1 , a blocking portion 80 is provided in the frame region FA of the organic EL display device 1. The blocking portion 80 plays a role in blocking the organic resin material from diffusing to the outside of the frame region FA when the liquid organic resin material forming the organic layer 74 contained in the sealing film 70 is applied during the manufacturing process of the organic EL display device 1. The blocking portion 80 is composed of a plurality of blocking walls WL. As the blocking walls WL in this example, a first blocking wall W1 and a second blocking wall W2 are provided.

[0081] The first barrier wall W1 is an example of a first wall body (wall body). The second barrier wall W2 is an example of a second wall body (wall body). The first barrier wall W1 is formed in a frame shape on the periphery of the planarization film 46. The first barrier wall W1 is arranged at a distance from the planarization film 46. The second barrier wall W2 is formed in a frame shape on the periphery of the first barrier wall W1. The first barrier wall W1 and the second barrier wall W2 are arranged at a distance from each other in the width direction of the frame area FA. The first barrier wall W1 and the second barrier wall W2 each function as a dam to block the organic resin material when forming the organic layer 74.

[0082] like Figure 11 to Figure 13 As shown, the first barrier wall W1 and the second barrier wall W2 respectively have a first wall layer 84 and a second wall layer 86. The first wall layer 84 is provided on the interlayer insulating film 34. The first wall layer 84 is supported by the substrate layer 10 via the primer film 22, the gate insulating film 32 and the interlayer insulating film 34. The first wall layer 84 of this example is formed of the same material in the same layer as the second planarizing film 46b. The second wall layer 86 is provided on the first wall layer 84. The second wall layer 86 of this example is formed of the same material in the same layer as the edge cover 66.

[0083] A second frame line 50fb extends from the lower layer of the first barrier wall W1 and the second barrier wall W2. The common electrode 65 covers the inner surface of the groove 48, and is sandwiched between the first wall layer 84 and the second wall layer 86 of the first barrier wall W1, and overlaps with a portion of the inner peripheral side of the first wall layer 84 of the second barrier wall W2. In addition, the common electrode 65 is connected to the second frame line 50fb between the planarization film 46 and the first barrier wall W1, and between the first barrier wall W1 and the second barrier wall W2.

[0084] The first inorganic layer 72 forming the sealing film 70 covers the first barrier wall W1 and the second barrier wall W2 respectively, and extends to the outer peripheral side of the second barrier wall W2. The organic layer 74 is arranged on the first inorganic layer 72 on the inner side of the first barrier wall W1 and the second barrier wall W2. The organic layer 74 may exist between the first barrier wall W1 and the second barrier wall W2. The second inorganic layer 76 covers the organic layer 74 and extends to the outer peripheral side of the second barrier wall W2. The organic layer 74 is surrounded by the first inorganic layer 72 and the second inorganic layer 76, and is sealed between the two layers 72 and 76.

[0085] like Fig. 9 and Fig.10 As shown, each touch panel line 130 crosses the first barrier wall W1 and the second barrier wall W2 on the terminal portion T side of the frame area FA. Each touch panel line 130 extends from the display area DA side to the outside of the frame area FA in a manner that crosses the first barrier wall W1 and the second barrier wall W2 ( Fig.12An example of a first touch panel line 130a is shown.) These plurality of touch panel lines 130 extend parallel to each other on the first barrier wall W1 and the second barrier wall W2.

[0086] The first barrier wall W1 and the second barrier wall W2 are provided with recessed portions 88. The recessed portions 88 are provided continuously in the portions of the first barrier wall W1 and the second barrier wall W2 where the plurality of touch panel lines 130 extend. In the first barrier wall W1 and the second barrier wall W2, the low wall portion 90 (at the bottom) corresponding to the recessed portions 88 is provided. Fig. 9 and Fig.10 The portion marked with dotted shadows in the figure is lower in height than the general wall portion 92 which is the other portion.

[0087] like Fig.11 As shown, the height h1 of the general wall portion 92 of the first barrier wall W1 and the height h2 of the general wall portion 92 of the second barrier wall W2 are equal to each other. The thickness t1 of the first wall layer 84 of the general wall portion 92 formed by the first barrier wall W1 and the thickness t1 of the first wall layer 84 of the general wall portion 92 formed by the second barrier wall W2 are equal to each other. The thickness t2 of the second wall layer 86 of the general wall portion 92 formed by the first barrier wall W1 and the thickness t2 of the second wall layer 86 of the general wall portion 92 formed by the second barrier wall W2 are equal to each other.

[0088] like Fig.12 As shown, the height h3 of the low wall portion 90 of the first barrier wall W1 and the height h4 of the low wall portion 90 of the second barrier wall W2 are equal to each other. In the first barrier wall W1 and the second barrier wall W2 of this example, the thickness t1 of the first wall layer 84 is equal in the low wall portion 90 and the general wall portion 92, respectively, and the thickness t2 of the second wall layer 86 is different ( Fig.13 An example of the second barrier wall W2 is shown. The thickness t2 of the second wall layer 86 forming the low wall portion 90 by the first barrier wall W1 and the second barrier wall W2 is thinner than the thickness t2 of the second wall layer 86 forming the general wall portion 92 .

[0089] In the first barrier wall W1 and the second barrier wall W2, the angles α and β formed by the side surfaces with respect to the respective forming surfaces of the first wall layer 84 and the second wall layer 86 are, for example, about 30° to 50°. In the first barrier wall W1 and the second barrier wall W2, the heights h3 and h4 of the low wall portion 90 are set to about 60% to 66% of the heights h1 and h2 of the general wall portion 92. For example, the heights h1 and h2 of the general wall portion 92 of the first barrier wall W1 and the second barrier wall W2 are about 5.0 μm to 6.0 μm. In this case, the heights h3 and h4 of the low wall portion 90 of the first barrier wall W1 and the second barrier wall W2 are, for example, about 3.0 μm to 4.0 μm.

[0090] -Operation of organic EL display device- In the organic EL display device 1, in each sub-pixel SP, first, the corresponding emission control line 50e is selected to be inactive, and the organic EL element 62 is in a non-luminescent state. Then, when the gate line 50g corresponding to the organic EL element 62 in the non-luminescent state is selected to be active, a gate signal is input to the first TFT 30A via the gate line 50g, and the first TFT 30A is turned on.

[0091] When the first 1TFT 30A is in the on state, a predetermined voltage corresponding to the source signal transmitted via the source line 50s is applied to the second 2TFT 30B and written into the capacitor 40. Furthermore, when the emission control line 50e is set to be non-selected and becomes active, an emission signal is input to the third TFT 30C through the emission control line 50e, and the third TFT 30C becomes in the on state.

[0092] When the third 3TFT 30C is turned on, a current corresponding to the gate voltage of the second 2TFT 30B is supplied from the power line 50p to the organic EL element 62. As a result, the organic EL layer 64 (light-emitting layer) emits light in each sub-pixel SP. As a result, an image is displayed. In addition, even when the first TFT 30A is turned off, the gate voltage of the second TFT 30B is maintained by the capacitor 40, so that it is maintained for each sub-pixel SP until the gate signal of the next frame is input.

[0093] -Method for manufacturing an organic EL display device- In order to manufacture the organic EL display device 1, first, an organic resin material is applied to the surface of the glass substrate 500 and then baked to form a substrate layer 10. Next, a display panel SP (TFT layer 20, light emitting element layer 60 and sealing film 70) and a touch panel TP are sequentially formed on the substrate layer 10 using known techniques such as photolithography, vacuum evaporation, spin coating, and inkjet.

[0094] In this way, the panel body PL is manufactured on the glass substrate 500. Then, a laser or the like is irradiated from one side of the glass substrate to the back side of the substrate layer 10, and the glass substrate 500 is peeled off from the substrate layer 10. Then, a polarizing plate and a cover panel are sequentially attached to the surface of the panel body PL. In addition, a protective film is attached to the back side of the substrate layer 10. Then, by connecting the wiring substrate CB to the first terminal portion T1 and the second terminal portion T2 of the panel body PL, respectively, the source driver and the touch detection circuit are installed.

[0095] As described above, the organic EL display device 1 can be manufactured.

[0096] In the process of forming the TFT layer 20, a photosensitive resin material is applied to the substrate on which the first terminal electrodes 35, the second terminal electrodes 36, the first frame lines 50fa, the second frame lines 50fb, the lead lines 50h, the source lines 50s, and the first power supply lines 50pa are formed, for example, by a known coating method such as a spin coating method. Then, the coating film of the photosensitive resin material is pre-baked, exposed, developed, and post-baked to pattern the coating film, thereby forming the first planarization film 46a and the first wall layers 84.

[0097] After that, a photosensitive resin material is applied to the substrate on which the second power supply line 50pb and the relay line 50r are formed, for example, by a known coating method such as a spin coating method. Then, the coating film of the photosensitive resin material is pre-baked, exposed, developed, and post-baked to pattern the coating film, thereby forming the edge cover 66 and each second wall layer 86.

[0098] At this time, during the exposure of the coating film of the photosensitive resin material, a gray tone mask or a half tone mask is used to make a height difference in the surface height of each second wall layer 86 constituting the first barrier wall W1 and the second barrier wall W2, and a concave portion 88 is formed on each second wall layer 86. Thus, while the first barrier wall W1 and the second barrier wall W2 are formed, the concave portion 88 is provided on the first barrier wall W1 and the second barrier wall W2 to form a low wall portion 90 and a general wall portion 92.

[0099] When the first barrier wall W1 and the second barrier wall W2 having the concave portion 88 are provided in this manner, in the process of forming the touch panel TP, when the first touch panel line 130a and the second touch panel line 130b are formed, the first touch panel line 130a and the second touch panel line 130b are prevented from being disconnected on the first barrier wall W1 and the second barrier wall W2. The first touch panel line 130a and the second touch panel line 130b are formed by a common method. The process of forming the first touch panel line 130a is described below as an example.

[0100] In the process of forming the first touch panel line 130a, first, on the substrate on which the sealing film 70 is formed, a transparent conductive film 200 made of indium tin oxide (ITO) or the like is formed by, for example, sputtering. Figure 14 to Figure 16 As shown, a resist 202 is applied on a substrate having a transparent conductive film 200 formed thereon by a known coating method such as a spin coating method.

[0101] Next, the coating film of the resist 202 is pre-baked, exposed, developed, and post-baked. Fig.17 As shown in FIG. 1 , the resist 202 is patterned in the region including the concave portion 88 (the region where the first detection electrode 100, the first connection line 102, and the first touch panel line 130a are formed). Then, as shown in FIG. Fig.18 As shown, the transparent conductive film 200 is etched and patterned using the resist 202 as a mask to form the first touch panel line 130a together with the first detection electrode 100 and the first connection line 102. Then, the resist 202 is removed by ashing or the like.

[0102] At this time, if the concave portion 88 is not provided on the first barrier wall W1 and the second barrier wall W2 , the first touch panel line 130 a is easily disconnected.

[0103] The first barrier wall W1 and the second barrier wall W2 are designed to be relatively high to prevent the organic resin material forming the organic layer 74 from diffusing to the outside of the frame area FA. Fig.28 As shown in FIG. 1 , the resist 202 is more likely to flow from the top of the first barrier wall W1 and the second barrier wall W2 to both sides, and becomes unable to properly cover the top of the first barrier wall W1 and the second barrier wall W2. Therefore, when the first touch panel line 130a is patterned, the portion of the transparent conductive film 200 on the first barrier wall W1 and the second barrier wall W2 where the first touch panel line 130a is formed may also be etched. As a result, as shown in FIG. Fig.29 As shown in FIG. 1 , the first touch panel line 130 a is defective and a disconnection occurs on the first touch panel line 130 a . The same problem also occurs on the second touch panel line 130 b .

[0104] In contrast, in the organic EL display device 1 of this example, a recess 88 is provided in the extended portion of the first touch panel line 130a and the second touch panel line 130b of the first barrier wall W1 and the second barrier wall W2, and the portion constitutes a lower low wall portion 90. Therefore, when forming the first touch panel line 130a and the second touch panel line 130b, it is possible to reduce the flow of the resist 202 used for masking from the top of the first barrier wall W1 and the second barrier wall W2 to both sides. Thus, the resist 202 is set to a state where the top of the first barrier wall W1 and the top of the second barrier wall W2 are appropriately covered with the low wall portion 90, and the transparent conductive film 200 can be suppressed from being etched in the portion where the first touch panel line 130a and the second touch panel line 130b are formed. Therefore, the disconnection of the first touch panel line 130a and the second touch panel line 130b on the first barrier wall W1 and the second barrier wall W2 can be prevented.

[0105] - Features of the embodiment - In the organic EL display device 1 of the present embodiment, the first barrier wall W1 and the second barrier wall W2 are provided with recessed portions 88, and the height of the portions of the first barrier wall W1 and the second barrier wall W2 where the touch panel line 130 extends is lower than the height of other portions. Thus, when the touch panel line 130 is formed, disconnection of the first barrier wall W1 and the second barrier wall W2 can be suppressed.

[0106] In the organic EL display device 1 of the present embodiment, the recessed portion 88 is continuously provided over the portions of the first barrier wall W1 and the second barrier wall W2 where the plurality of touch panel lines 130 extend. Thus, the precision required for the position and size of the recessed portion 88 can be reduced compared to the case where a plurality of recessed portions 88 are separately provided for each touch panel line 130. Thus, the first barrier wall W1 and the second barrier wall W2 can be easily provided with a structure in which the touch panel line 130 is not easily disconnected during patterning.

[0107] In the organic EL display device 1 of this embodiment, the recess 88 is provided on the first barrier wall W1 and the second barrier wall W2 , thereby preventing the touch panel line 130 from being disconnected on both the first barrier wall W1 and the second barrier wall W2 . This is beneficial for improving the yield of the organic EL display device 1 .

[0108] In the organic EL display device 1 of the present embodiment, the first barrier wall W1 and the second barrier wall W2 respectively include a first wall layer 84 and a second wall layer 86. In addition, the portion of the second wall layer 86 corresponding to the recess 88 is thinner than the other portions of the second wall layer 86. Thus, the recess 88 can be provided on the first barrier wall W1 and the second barrier wall W2 without increasing the number of wall layers constituting the first barrier wall W1 and the second barrier wall W2. This is conducive to improving the productivity of the organic EL display device 1 and achieving cost reduction.

[0109] In the organic EL display device 1 of this embodiment, an organic EL element 62 is used as a light-emitting element. Since the organic EL element 62 is easily degraded by reacting with moisture and oxygen, it is covered and sealed by a sealing film 70. The sealing film 70 of this example adopts a TFE structure and includes an organic layer 74. In addition, the first barrier wall W1 and the second barrier wall W2 are respectively walls for blocking the liquid organic resin material when forming the organic layer 74 as a coating film.

[0110] In the sealing film 70, the organic layer 74 is much thicker than the first inorganic layer 72 and the second inorganic layer 76 to improve flexibility and relieve stress. Therefore, the first barrier wall W1 and the second barrier wall W2 are designed to be relatively high in order to ensure the function of blocking the liquid organic resin material forming the organic layer 74. The technology disclosed in the present invention is effective in preventing the touch panel line 130 from being disconnected on the first barrier wall W1 and the second barrier wall W2.

[0111] In the organic EL display device 1 of the present embodiment, the first wall layer 84 and the second planarizing film 46b are formed of the same material in the same layer. In addition, the second wall layer 86 and the edge cover 66 are formed of the same material in the same layer. Based on this, in the manufacture of the organic EL display device 1, the first wall layer 84 can be formed by the same process as the second planarizing film 46b, and the second wall layer 86 can be formed by the same process as the edge cover 66. Therefore, the first wall layer 84 and the second wall layer 86 do not need to be formed by an independent process different from other components.

[0112] 《First variant》 like Fig.19 As shown, in the organic EL display device 1 of the first modified example, the blocking portion 80 is composed of a first blocking wall W1 and a second blocking wall W2. The concave portion 88 of this example is also provided in the first blocking wall W1 and the second blocking wall W2, respectively. In addition, in the first blocking wall W1 and the second blocking wall W2, a plurality of concave portions 88 are provided separately for each touch panel line 130. The concave portion 88 of the first blocking wall W1 and the concave portion 88 of the second blocking wall W2 are provided at positions corresponding to each other in the circumferential direction of the frame area FA.

[0113] The lower wall portion 90 (at the bottom of the first barrier wall W1 and the second barrier wall W2) Fig.19 The dotted shaded portion in the figure only constitutes the extended portion of each touch panel line 130 and the narrow portions on both sides thereof. In the first barrier wall W1 and the second barrier wall W2 of this example, the thickness of the first wall layer 84 is the same in the low wall portion 90 and the general wall portion 92, and the thickness of the second wall layer 86 is different ( Fig. 20 An example of the second barrier wall W2 is shown.) The second wall layer 86 forming the low wall portion 90 of the first barrier wall W1 and the second barrier wall W2 is thinner than the second wall layer 86 forming the general wall portion 92 .

[0114] In the first barrier wall W1 and the second barrier wall W2, a convex portion 89 is provided between adjacent concave portions 88. The portion corresponding to the convex portion 89 of the first barrier wall W1 and the second barrier wall W2 constitutes a general wall portion 92. In the circumferential direction of the frame area FA, the low wall portions 90 (concave portions 88) of the first barrier wall W1 and the second barrier wall W2 correspond to each other, and the general wall portions 92 (convex portions 89) correspond to each other. Each touch panel line 130 is set to extend straight between the first barrier wall W1 and the second barrier wall W2, and cross the first barrier wall W1 and the second barrier wall W2 on the low wall portion 90.

[0115] The organic EL display device 1 is manufactured by the same process as in the above-mentioned embodiment. In the manufacture of the organic EL display device 1, when forming each second wall layer 86 constituting the first barrier wall W1 and the second barrier wall W2, a gray tone mask or a half tone mask is used to form a recessed portion 88 on each second wall layer 86, so that the recessed portion 88 is formed on the first barrier wall W1 and the second barrier wall W2, and the low wall portion 90 and the general wall portion 92 are formed in the two walls 82A and 82B at the same time as the first barrier wall W1 and the second barrier wall W2 are formed.

[0116] In addition, the first touch panel line 130a and the second touch panel line 130b are formed by a common method in manufacturing the organic EL display device 1. Hereinafter, the process of forming the first touch panel line 130a will be described as an example.

[0117] In the process of forming the first touch panel line 130a, first, on the substrate on which the sealing film 70 is formed, a transparent conductive film 200 made of indium tin oxide (ITO) or the like is formed by, for example, sputtering. Fig.21 As shown, a resist 202 is applied on a substrate having a transparent conductive film 200 formed thereon by a known coating method such as a spin coating method.

[0118] Next, the coating film of the resist 202 is pre-baked, exposed, developed, and post-baked. Fig. 22 As shown in FIG. 1 , the resist 202 is patterned in the region including each concave portion 88 (the region where the first detection electrode 100, the first connection line 102, and the first touch panel line 101 are formed). Then, as shown in FIG. Fig.23 As shown, the transparent conductive film 200 is etched using the resist 202 as a mask, thereby patterning to form the first touch panel line 130a together with the first detection electrode 100 and the first connection line 102. Then, the resist 202 is removed by ashing or the like.

[0119] -Features of the First Modification Example- In the organic EL display device 1 of the first modification, a plurality of recesses 88 are provided for each touch panel line 130. Thus, compared with the case where the recesses 88 are continuously provided over the portions where the plurality of touch panel lines 130 extend, it is possible to limit the region serving as the low wall portion 90 in the first barrier wall W1 and the second barrier wall W2. Thus, in the manufacture of the organic EL display device 1, when the organic layer 74 is formed, the risk of the organic resin material leaking out to the outside of the second barrier wall W2 can be reduced.

[0120] Second variant like Fig.24As shown, in the organic EL display device 1 of the second modified example, the blocking portion 80 is composed of a first blocking wall W1 and a second blocking wall W2. The concave portion 88 of this example is also provided in the first blocking wall W1 and the second blocking wall W2, respectively. In addition, in the first blocking wall W1 and the second blocking wall W2, a plurality of concave portions 88 are provided separately for each touch panel line 130. The concave portion 88 of the first blocking wall W1 and the concave portion 88 of the second blocking wall W2 are provided at positions staggered from each other in the circumferential direction of the frame area FA.

[0121] The lower wall portion 90 (at the bottom of the first barrier wall W1 and the second barrier wall W2) Fig.24 The dotted shadow portion in the figure only constitutes the extended portion of each touch panel line 130 and the narrow portions on both sides thereof. In the first barrier wall W1 and the second barrier wall W2 of this example, the thickness of the first wall layer 84 is the same in the low wall portion 90 and the general wall portion 92, and the thickness of the second wall layer 86 is different. The second wall layer 86 of the low wall portion 90 forming the first barrier wall W1 and the second barrier wall W2 is thinner than the second wall layer 86 forming the general wall portion 92.

[0122] In the first barrier wall W1 and the second barrier wall W2, a convex portion 89 is provided between adjacent concave portions 88. The portions corresponding to the convex portions 89 of the first barrier wall W1 and the second barrier wall W2 constitute a general wall portion 92. In the circumferential direction of the frame area FA, the low wall portion 90 of the first barrier wall W1 corresponds to the general wall portion 92 of the second barrier wall W2, and the low wall portion 90 of the second barrier wall W2 corresponds to the general wall portion 92 of the first barrier wall W1. Each touch panel line 130 is arranged to bend between the first barrier wall W1 and the second barrier wall W2, and to cross the first barrier wall W1 and the second barrier wall W2 on the low wall portion 90.

[0123] -Features of the Second Modification Example- In the organic EL display device 1 of the second modified example, the concave portion 88 of the first barrier wall W1 and the concave portion 88 of the second barrier wall W2 are arranged at positions that are offset from each other in the circumferential direction of the frame area FA. As a result, the concave portion 88 of the first barrier wall W1 and the concave portion 88 of the second barrier wall W2 can be relatively far away, so that the concave portion 88 of the second barrier wall W2 is separated from the flow direction of the organic resin material forming the organic layer 74 when it flows in the concave portion 88 of the first barrier wall W1. As a result, in the manufacture of the organic EL display device 1, when the organic layer 74 is formed, the risk of the organic resin material leaking to the outside of the second barrier wall W2 can be further reduced.

[0124] 《Third variant》 like Fig.25As shown, in the organic EL display device 1 of the third modified example, in addition to the first barrier wall W1 and the second barrier wall W2, the barrier portion 80 further includes a third barrier wall W3. The first barrier wall W1 and the second barrier wall W2 are formed by stacking a first wall layer 84 and a second wall layer 86. The third barrier wall W3 includes a third wall layer 87 in addition to the first wall layer 84 and the second wall layer 86. The third wall layer 87 is provided in a lower layer of the first wall layer 84. The third wall layer 87 is formed of the same material in the same layer as the first planarization film 46a.

[0125] The first barrier wall W1, the second barrier wall W2, and the third barrier wall W3 are provided with recessed portions 88. The recessed portions 88 are continuously provided over the portions of the first barrier wall W1, the second barrier wall W2, and the third barrier wall W3 where the plurality of touch panel lines 130 extend. In the first barrier wall W1, the second barrier wall W2, and the third barrier wall W3, the low wall portions 90 ( Fig.25 The portion marked with a dotted line in the figure) is lower in height than the general wall portion 92 which is the other portion.

[0126] like Fig.26 As shown, the height h2 of the general wall portion 92 of the second barrier wall W2 is higher than the height h1 of the general wall portion 92 of the first barrier wall W1. The height h3 of the general wall portion 92 of the third barrier wall W3 is higher than the height h2 of the general wall portion 92 of the second barrier wall W2. The thickness t2 of the second wall layer 86 of the general wall portion 92 formed by the second barrier wall W2 is thicker than the thickness t2 of the second wall layer 86 of the general wall portion 92 formed by the first barrier wall W1. The thickness t2 of the second wall layer 86 of the general wall portion 92 formed by the third barrier wall W3 is equal to or thicker than the thickness t2 of the second wall layer 86 of the general wall portion 92 formed by the second barrier wall W2.

[0127] like Fig. 27 As shown, the low wall portion 90 of the first barrier wall W1, the low wall portion 90 of the second barrier wall W2, and the low wall portion 90 of the third barrier wall W3 are formed at the same height. In the first barrier wall W1, the second barrier wall W2, and the third barrier wall W3 of this example, the thickness of the first wall layer 84 is equal in the low wall portion 90 and the general wall portion 92, respectively, and the thickness of the second wall layer 86 is different. The second wall layer 86 forming the low wall portion 90 by the first barrier wall W1, the second barrier wall W2, and the third barrier wall W3 is thinner than the second wall layer 86 forming the general wall portion 92.

[0128] In the third barrier wall W3, the angles α, β, and γ formed by the side surface with respect to the respective forming surfaces of the first wall layer 84, the second wall layer 86, and the third wall layer 87 are, for example, about 30° to 50°. In the third barrier wall W3, the height h6 of the low wall portion 90 is set to about 55% to 62% of the height h5 of the general wall portion 92. For example, the height h5 of the general wall portion 92 of the third barrier wall W3 is about 5.5 μm to 6.5 μm. In this case, the height h6 of the low wall portion 90 of the third barrier wall W3d is, for example, about 3.0 μm to 4.0 μm.

[0129] 《Other Implementation Methods》 In the above embodiment, the recessed portion 88 is continuously provided in the portion where the plurality of touch panel lines 130 extend. In the above second and third modified examples, a plurality of recessed portions 88 are separately provided for each touch panel line 130, but the present invention is not limited thereto. The recessed portion 88 only needs to be provided so that the height of the portion where the touch panel line 130 extends in the first barrier wall W1 and the second barrier wall W2 is lower than the height of the other portions.

[0130] In the above embodiment, in the low wall portion 90 and the general wall portion 92 of the first barrier wall W1 and the second barrier wall W2, the thickness t1 of the first wall layer 84 is the same, and the thickness t2 of the second wall layer 86 is different, but the present invention is not limited thereto. In the first barrier wall W1 and the second barrier wall W2, the thickness t1 of the first wall layer 84 may be different in the low wall portion 90 and the general wall portion 92, respectively, and the thickness t2 of the second wall layer 86 may be the same. In this case, the thickness t1 of the first wall layer 84 forming the low wall portion 90 by the first barrier wall W1 and the second barrier wall W2 is thinner than the thickness t1 of the first wall layer 84 forming the general wall portion 92. In addition, in the first barrier wall W1 and the second barrier wall W2, the thickness t1 of the first wall layer 84 and the thickness t2 of the second wall layer 86 may be different in the low wall portion 90 and the general wall portion 92, respectively.

[0131] In the above embodiment, the recessed portion 88 is provided on both the first barrier wall W1 and the second barrier wall W2, but the present invention is not limited thereto. The recessed portion 88 may be provided only on the first barrier wall W1 or only on the second barrier wall W2.

[0132] In the above embodiment, the first barrier wall W1 and the second barrier wall W2 are respectively double-layer structures composed of the first wall layer 84 and the second wall layer 86, but are not limited thereto. For example, the first barrier wall W1 and the second barrier wall W2 may also be triple-layer structures having the third wall layer 87 made of the same material as the first planarizing film 46a on the same layer, as in the third barrier wall W3 of the third modification.

[0133] In the above embodiment, the first wall layer 84 and the second planarization film 46b are formed of the same material in the same layer, and the second wall layer 86 and the edge cover 66 are formed of the same material in the same layer, but it is not limited thereto. The first wall layer 84 may be formed of the same material in the same layer as the first planarization film 46a. In this case, the second wall layer 86 may be formed of the same material in the same layer as the second planarization film 46b.

[0134] In the above embodiment, the planarization film 46 of the display panel DP is composed of two layers of the first planarization film 46a and the second planarization film 46b, but is not limited thereto. The planarization film 46 may also be composed of one layer. In this case, for example, the first wall layer 84 is formed of the same material in the same layer as the planarization film 46, and the second wall layer 86 is formed of the same material in the same layer as the edge cover 66.

[0135] Although in the above embodiment, an organic EL layer 64 is provided for each sub-pixel SP, the present invention is not limited thereto. The organic EL layer 64 may also be provided continuously and commonly on a plurality of sub-pixels SP. In this case, the organic EL display device 1 may also have a color filter or the like to perform a color tone expression in each sub-pixel SP.

[0136] In the above embodiment, each pixel PX is composed of sub-pixels SP of three colors, but the present invention is not limited thereto. The sub-pixels SP constituting each pixel PX are not limited to three colors, but may be four or more colors. In addition, the three sub-pixels SP constituting each pixel PX are arranged in a stripe arrangement, but the present invention is not limited thereto. The arrangement of the plurality of sub-pixels SP may also be other arrangements such as a pen-tile arrangement.

[0137] In the above embodiment, the plurality of TFTs 30 constituting the pixel circuit PC are the first TFT 30A, the second TFT 30B, and the third TFT 30C, but the present invention is not limited thereto. The plurality of TFTs 30 constituting the pixel circuit PC may be two, or four or more. In addition, in the above embodiment, the TFT 30 is configured as a top gate type, but the present invention is not limited thereto. The TFT 30 may also be configured as a bottom gate type.

[0138] In the above embodiment, the organic EL element 62 is configured as a top emission type, but the present invention is not limited thereto. The organic EL element 62 may also be configured as a bottom emission type in which light emitted by the organic EL layer 64 is extracted from the substrate layer 10 side. In addition, the organic EL element 62 may also be configured as a double-sided emission type in which light emitted by the organic EL layer 64 is extracted from both sides of the substrate layer 10 side and the sealing film 70 side.

[0139] In the above embodiment, the pixel electrode 63 is assumed to be an anode and the common electrode 65 is a cathode, but the present invention is not limited thereto. The organic EL display device 1 may also be configured such that the pixel electrode 63 functions as a cathode and the common electrode 65 functions as an anode. In this case, the organic EL layer 64 has an inverted stacked structure.

[0140] In the above embodiment, the organic EL layer 64 is set to a five-layer structure consisting of a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer, but is not limited thereto. The organic EL layer 64 may also be a three-layer structure consisting of a hole injection layer and hole transport layer, a light-emitting layer, and an electron transport layer and electron injection layer, and any stacked structure may be adopted.

[0141] In the above embodiment, although the organic EL display device 1 with a touch panel is exemplified as the display device, it is not limited to this. The technology disclosed in the present invention can also be applied to an organic EL display device without a touch panel TP. The technology disclosed in the present invention targets wiring extending across the first barrier wall W1 and the second barrier wall W2, even in addition to the touch panel line 130, and helps to prevent the disconnection of the wiring.

[0142] In addition, the technology disclosed in the present invention can also be applied to a display device including a plurality of light-emitting elements driven by current. As such a display device, a display device having a QLED (Quantum-dot Light Emitting Diode) as a light-emitting element using a quantum dot containing layer can be cited. In addition, the technology disclosed in the present invention can also be applied to a liquid crystal display device or a plasma display device.

[0143] As described above, preferred embodiments are described as examples of the technology disclosed herein. However, the technology disclosed herein is not limited thereto, and can also be applied to embodiments that have been appropriately changed, replaced, added, omitted, etc. For the above embodiments, those skilled in the art should understand that various further modifications can be made without departing from the scope of the technology disclosed herein, and such modifications also belong to the scope of the technology disclosed herein. Industrial applicability

[0144] As described above, the technology of the present disclosure is useful for a display device. Description of Reference Numerals

[0145] DA display area FA border area TP Touch Panel WL barrier wall W1 first barrier wall (first wall, wall) W2 second barrier wall (second wall body, wall body) W3 third barrier wall (wall body) 1Organic EL display device (display device) 10 substrate layer 20TFT layer (thin film transistor layer) 30TFTT (Thin Film Transistor) 46 Flattening film 46a First planarization film (planarization film) 46b Second planarization film (planarization film) 60 light emitting element layer 62Organic EL element (organic electroluminescent element) 63 pixel electrodes 70 Sealing Film 74 organic layer (coating film) 84 First wall layer 86 Second wall layer 88 concavity 130 touch panel line (wiring) 130a first touch panel line (wiring) 130b second touch panel line (wiring)

Claims

1. A display device comprising: A display area that displays an image; and a frame area, which is arranged around the display area, The frame region is provided with a wall body provided in a frame shape so as to surround the display region, and a wiring line is extended from the display region side to the outside of the frame region so as to cross the wall body. The display device is characterized in that A recess is provided on the wall so that the height of the portion where the wiring extends is lower than the height of other portions.

2. The display device according to claim 1, It is characterized in that A plurality of the wirings are provided on the wall so as to extend parallel to each other. The recessed portion is continuously provided over a portion of the wall body where the plurality of wirings extend.

3. The display device according to claim 2, It is characterized in that As the wall body, a first wall body and a second wall body arranged on the periphery of the first wall body are provided. The recessed portions are respectively disposed on the first wall and the second wall.

4. The display device according to claim 1, It is characterized in that A plurality of the wirings are provided on the wall so as to extend parallel to each other. A plurality of the recesses are separately provided for each of the wirings.

5. The display device according to claim 4, It is characterized in that As the wall body, a first wall body and a second wall body arranged on the periphery of the first wall body are provided. The recessed portions are respectively disposed on the first wall and the second wall.

6. The display device according to claim 5, It is characterized in that The recessed portion of the first wall body and the recessed portion of the second wall body are provided at positions offset from each other in the circumferential direction of the frame region.

7. The display device according to any one of claims 1 to 6, It is characterized in that The wall body comprises a first wall layer supported by a substrate layer and a second wall layer arranged on the first wall layer. A portion of one or both of the first wall layer and the second wall layer corresponding to the recessed portion is thinner than other portions of the wall layer.

8. The display device according to any one of claims 1 to 7, It is characterized in that A coating film is provided on the inner side of the wall body and diffused in the display area. The wall body is a barrier wall for blocking the liquid material when forming the coating film.

9. The display device according to claim 8, It is characterized in that include: substrate layer; a light emitting element layer, which is supported by the substrate layer and includes a plurality of light emitting elements; as well as a sealing film provided on the light emitting element layer in a manner covering the plurality of light emitting elements, The coating film is included in the sealing film.

10. The display device according to claim 9, It is characterized in that comprising a thin film transistor layer, which is disposed between the substrate layer and the light emitting element layer and comprises a plurality of thin film transistors, The thin film transistor layer includes a planarization film provided so as to cover the plurality of thin film transistors. The light emitting element layer includes a plurality of pixel electrodes and an edge cover provided in a manner of dividing the plurality of pixel electrodes. The first wall layer and the planarization film are formed in the same layer and made of the same material. The second wall layer is formed of the same material as the edge cover in the same layer.

11. The display device according to claim 9 or 10, It is characterized in that The light emitting element is an organic electroluminescent element.

12. The display device according to any one of claims 8 to 11, It is characterized in that An in-cell touch panel is provided on an upper layer than the coating film. The wiring is a touch panel line included in the touch panel.

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