Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method thereof and a display device. The display panel comprises a substrate which comprises a glass substrate and a first adhesive layer located on one side of the glass substrate; the light-emitting element layer is located on the side, away from the glass substrate, of the first adhesive layer, and the light-emitting element layer is connected with the glass substrate through the first adhesive layer; the light-emitting element layer comprises a plurality of light-emitting elements, the light-emitting elements are arranged to emit light of a specified color, and the specified color is one of three primary colors. According to the display panel provided by the embodiment of the invention, the connection between the glass substrate and the light-emitting element layer is realized through the adhesive layer, the manufacturing cost of the light-emitting element can be reduced, and the display panel has relatively high yield.

Description

Technical Field

[0001] This article relates to but is not limited to the field of display technology, and in particular to a display panel and a preparation method thereof, and a display device. Background Art

[0002] In recent years, the research boom of Micro-LED (Micro Light Emitting Diode) has continued to heat up. Micro-LED refers to the formation of ultra-small pitch light-emitting diodes by arraying and miniaturizing traditional light-emitting diodes on a circuit substrate. Specifically, it refers to further miniaturizing the length of millimeter-level light-emitting diodes to micrometer level to adapt to display products of various sizes. Micro-LEDs have the advantages of long life and low power consumption. However, micro-LEDs are limited by the size of wafers. Currently, mass-produced chips are generally prepared on 4-inch or 6-inch sapphire substrates or silicon-based substrates. In order to realize the production of micro-LED-driven displays, the chip needs to be solidified or transferred to the driving backplane. The common method of solidification is to use solder paste to fix the chip to the position of the substrate pad, melt the solder paste at high temperature through reflow soldering, and then cool it to solder the chip to the substrate together. This process requires both alignment and adjustment of the pressure and time of the solidification process. If it is not properly controlled, poor welding problems such as cold welding or false welding are prone to occur, resulting in a low qualified rate of display products and high production costs. Summary of the invention

[0003] The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.

[0004] The embodiments of the present disclosure provide a display panel and a method for manufacturing the same, and a display device, which can solve the problems of high manufacturing cost and low yield rate of existing display panels.

[0005] In one aspect, an embodiment of the present disclosure provides a display panel. The display panel includes:

[0006] A substrate, comprising a glass substrate and a first adhesive layer located on one side of the glass substrate;

[0007] A light-emitting element layer is located on a side of the first adhesive layer away from the glass substrate, and the light-emitting element layer is connected to the glass substrate via the first adhesive layer; the light-emitting element layer includes a plurality of light-emitting elements, and the light-emitting elements are configured to emit light of a specified color, where the specified color is one of the three primary colors.

[0008] In an exemplary embodiment, the display panel further comprises a conversion structure layer; the conversion structure layer is located on a side of the light-emitting element layer away from the substrate; the conversion structure layer is configured to convert light of a specified color into light of at least two other colors different from the specified color.

[0009] In an exemplary embodiment, the conversion structure layer includes a first conversion pattern and a second conversion pattern; in the structure of a display panel with a designated color of blue, the material of the first conversion pattern includes quantum dots or quantum rods that emit red light when excited by blue light; the material of the second conversion pattern includes quantum dots or quantum rods that emit green light when excited by blue light.

[0010] In an exemplary embodiment, the light-emitting element includes a first electrode, an epitaxial layer, and a second electrode that are stacked; the epitaxial layer is configured to emit light of a specified color under the electric field drive of the first electrode and the second electrode; a plurality of the light-emitting elements are arranged along a first direction to form a light-emitting element group; a plurality of the light-emitting element groups are arranged along a second direction, and the first direction intersects with the second direction;

[0011] A plurality of the first electrodes in the same light-emitting element group are connected to each other; or / and a plurality of the second electrodes in the same light-emitting element group are connected to each other.

[0012] In an exemplary embodiment, the light-emitting element includes a first electrode, an epitaxial layer, and a second electrode that are stacked; the epitaxial layer is configured to emit light of a specified color under the electric field drive of the first electrode and the second electrode; a plurality of the light-emitting elements are arranged along the second direction to form a light-emitting element group; a plurality of the light-emitting element groups are arranged along the first direction, and the first direction intersects with the second direction;

[0013] A plurality of the first electrodes in the same light-emitting element group are connected to each other; or / and a plurality of the second electrodes in the same light-emitting element group are connected to each other.

[0014] In an exemplary embodiment, the light emitting element includes a first electrode, an epitaxial layer, and a second electrode which are stacked in sequence; the first electrode is closer to the substrate than the epitaxial layer;

[0015] The light emitting element further includes a first connecting electrode, which is located between the first electrode and the epitaxial layer, and the first connecting electrode and the first electrode have at least a partial overlap in their orthographic projections on the display panel, and the first electrode and the epitaxial layer are connected via the first connecting electrode.

[0016] In an exemplary embodiment, the light emitting element includes a first electrode, an epitaxial layer, and a second electrode which are stacked in sequence; the first electrode is closer to the substrate than the epitaxial layer;

[0017] The light emitting element further includes a second connecting electrode, which is located between the second electrode and the epitaxial layer, and the second connecting electrode and the second electrode at least partially overlap in their orthographic projections on the display panel, and the second electrode and the epitaxial layer are connected via the second connecting electrode.

[0018] In an exemplary embodiment, the display panel includes a plurality of sub-pixels, and the plurality of sub-pixels are arranged in one-to-one correspondence with the plurality of light-emitting elements; at least one of the sub-pixels includes a light-emitting area and a non-light-emitting area, the epitaxial layer of the light-emitting element is located in the light-emitting area, the second electrode is located in the non-light-emitting area, and the second connecting electrode is a transparent conductive electrode.

[0019] On the other hand, an embodiment of the present disclosure provides a display device, wherein the display device comprises a display panel as described in any of the above embodiments.

[0020] On the other hand, an embodiment of the present disclosure provides a method for preparing a display panel. The preparation method comprises:

[0021] forming a first adhesive layer on one side of the glass substrate;

[0022] A light-emitting element layer is formed on a side of the first adhesive layer away from the glass substrate, and the light-emitting element layer is connected to the glass substrate via the first adhesive layer; the light-emitting element layer includes a plurality of light-emitting elements, and the light-emitting elements include a first electrode, an epitaxial layer, and a second electrode that are stacked; the light-emitting elements are configured to emit light of a specified color, and the specified color is one of the three primary colors.

[0023] In an exemplary embodiment, forming a light-emitting element layer on a side of the first adhesive layer away from the glass substrate includes:

[0024] forming a first semiconductor thin film, a light-emitting thin film and a second semiconductor thin film in sequence on one side of the substrate;

[0025] Bonding the glass substrate and the substrate relative to each other so that the first adhesive layer is connected to the second semiconductor film;

[0026] peeling off the substrate;

[0027] The first semiconductor film, the light-emitting film and the second semiconductor film are patterned to form an epitaxial layer of the light-emitting element.

[0028] In an exemplary embodiment, sequentially forming a first semiconductor film, a light emitting film, and a second semiconductor film on one side of a substrate further includes:

[0029] A conductive film is formed on a side of the second semiconductor film away from the substrate; and the first adhesive layer is connected to the second semiconductor film via the conductive film.

[0030] In an exemplary embodiment, after forming the epitaxial layer of the light emitting element, the method further includes:

[0031] The conductive film is patterned to form a first electrode of the light emitting element.

[0032] In an exemplary embodiment, the conductive film includes a first conductive film and a second conductive film; after forming the epitaxial layer of the light emitting element, the method further includes:

[0033] The first conductive film and the second conductive film are patterned to form a first electrode and a first connecting electrode of the light emitting element, wherein the first connecting electrode is located between the first electrode and the epitaxial layer.

[0034] In an exemplary embodiment, the substrate includes a first substrate and a second substrate; sequentially forming a first semiconductor film, a light-emitting film, and a second semiconductor film on one side of the substrate further includes:

[0035] forming a second adhesive layer on one side of the second substrate;

[0036] forming a first semiconductor thin film, a light-emitting thin film, and a second semiconductor thin film in sequence on one side of the first substrate;

[0037] Bonding the second substrate to the first substrate so that the second glue layer is connected to the second semiconductor film;

[0038] peeling off the first substrate;

[0039] A conductive film is formed on a side of the first semiconductor film away from the second substrate.

[0040] In an exemplary embodiment, after forming a conductive film on a side of the first semiconductor film away from the second substrate, the method further includes:

[0041] The glass substrate and the second substrate are bonded relative to each other so that the first adhesive layer and the second semiconductor film are connected via the conductive film.

[0042] In an exemplary embodiment, after the first glue layer is connected to the second semiconductor film via the conductive film, the method further includes:

[0043] peeling off the second substrate;

[0044] The first semiconductor film, the light-emitting film and the second semiconductor film are patterned to form an epitaxial layer of the light-emitting element.

[0045] The display panel provided in the embodiment of the present disclosure realizes the connection between the glass substrate and the light-emitting element layer by means of the provided adhesive layer, which can reduce the manufacturing cost of the light-emitting element and has a higher yield rate.

[0046] It is not necessary to achieve all the advantages described above at the same time for any product or method of the present invention to be implemented. Other features and advantages of the present invention will be described in the subsequent description embodiments, and partly become apparent from the description embodiments, or be understood by practicing the present invention. The purposes and other advantages of the embodiments of the present disclosure can be achieved and obtained by the structures particularly pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] The accompanying drawings are used to provide a further understanding of the technical solution of the present invention and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the technical solution of the present invention and do not constitute a limitation on the technical solution of the present invention. The shapes and sizes of the components in the accompanying drawings do not reflect the actual proportions and are only intended to illustrate the contents of the present invention.

[0048] Figure 1 is a schematic diagram of a planar structure of a display panel according to an embodiment of the present disclosure;

[0049] Figure 2 is a schematic diagram of a partial cross-sectional structure of a display panel according to an embodiment of the present disclosure;

[0050] FIG. 3A to FIG. 3O for Figure 2 A schematic diagram of the preparation process of the display panel shown;

[0051] Figure 4 is a schematic diagram of a partial cross-sectional structure of a display panel according to another embodiment of the present disclosure;

[0052] FIG. 5A to FIG. 5Q for Figure 4 Schematic diagram of the preparation process of the display panel shown.

[0053] Description of reference numerals:

[0054] 10-luminescent area; 20-non-luminescent area; 100-substrate, 101-first adhesive layer, 102-rigid substrate;

[0055] 200 - light emitting element, 201 - first electrode, 202 - second electrode, 203 - epitaxial layer, 204 - second connecting electrode, 205 - first connecting electrode, 206 - third connecting electrode, 211 - first doping layer, 212 - second doping layer, 213 - light emitting layer;

[0056] 300 - conversion structure layer, 301 - conversion layer, 302 - color filter layer, 311 - first conversion pattern, 312 - second conversion pattern, 313 - third conversion pattern, 321 - first light-transmitting pattern, 322 - second light-transmitting pattern, 323 - third light-transmitting pattern;

[0057] 400 - encapsulation layer; 500 - passivation layer, 501 - opening; 600 - flat layer; 700 - isolation dam; 800 - black matrix; 111 - first substrate; 112 - second substrate; 113 - second adhesive layer. DETAILED DESCRIPTION

[0058] In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. The embodiments can be implemented in a plurality of different forms. A person of ordinary skill in the art can easily understand the fact that the method and content can be transformed into one or more forms without departing from the purpose and scope of the present disclosure. Therefore, the present disclosure should not be interpreted as being limited to the contents described in the following embodiments. In the absence of conflict, the embodiments in the present disclosure and the features in the embodiments can be arbitrarily combined with each other.

[0059] In the drawings, the size of one or more components, the thickness of a layer, or an area is sometimes exaggerated for the sake of clarity. Therefore, one embodiment of the present disclosure is not necessarily limited to the size, and the shape and size of each component in the drawings do not reflect the true proportion. In addition, the drawings schematically show ideal examples, and one embodiment of the present disclosure is not limited to the shapes or values ​​shown in the drawings.

[0060] The ordinal numbers such as "first", "second", and "third" in the present disclosure are provided to avoid confusion of constituent elements, rather than to limit the quantity. The "plurality" in the present disclosure includes two and more than two.

[0061] In the present disclosure, for the sake of convenience, the words and phrases indicating the orientation or positional relationship, such as "middle", "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., are used to illustrate the positional relationship of the constituent elements with reference to the drawings. This is only for the convenience of describing the present specification and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation of the present disclosure. The positional relationship of the constituent elements is appropriately changed according to the direction in which the constituent elements are described. Therefore, it is not limited to the words and phrases described in the specification, and can be appropriately replaced according to the situation.

[0062] In the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate, or the internal communication of two elements. For ordinary technicians in this field, the meanings of the above terms in the present disclosure can be understood according to the circumstances.

[0063] In the present disclosure, a transistor refers to an element including at least three terminals: a gate electrode, a drain electrode, and a source electrode. A transistor has a channel region between a drain electrode (drain electrode terminal, drain region, or drain) and a source electrode (source electrode terminal, source region, or source), and current can flow through the drain electrode, the channel region, and the source electrode. In the present disclosure, a channel region refers to a region where current mainly flows.

[0064] In the present disclosure, the first electrode may be a drain electrode and the second electrode may be a source electrode, or the first electrode may be a source electrode and the second electrode may be a drain electrode. In the case of using transistors with opposite polarities or when the current direction changes during circuit operation, the functions of the "source electrode" and the "drain electrode" are sometimes interchanged. Therefore, in the present disclosure, the "source electrode" and the "drain electrode" may be interchanged.

[0065] In the present disclosure, "electrical connection" includes the situation where components are connected together through an element having some electrical function. There is no particular limitation on the "element having some electrical function" as long as it can transmit and receive electrical signals between the connected components. Examples of "element having some electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other elements having one or more functions.

[0066] In the present disclosure, "parallel" means a state where the angle formed by two straight lines is greater than -10° and less than 10°, and therefore, a state where the angle is greater than -5° and less than 5° may be included. In addition, "perpendicular" means a state where the angle formed by two straight lines is greater than 80° and less than 100°, and therefore, a state where the angle is greater than 85° and less than 95° may be included.

[0067] In the present disclosure, "film" and "layer" may be interchanged. For example, "conductive layer" may be replaced with "conductive film" in some cases. Similarly, "insulating film" may be replaced with "insulating layer" in some cases.

[0068] The term "about" in the present disclosure refers to a numerical value that is not strictly limited to allow for process and measurement errors.

[0069] The present disclosure provides a display panel. The display panel includes:

[0070] A substrate, comprising a glass substrate and a first adhesive layer located on one side of the glass substrate;

[0071] A light-emitting element layer is located on a side of the first adhesive layer away from the glass substrate, and the light-emitting element layer is connected to the glass substrate via the first adhesive layer; the light-emitting element layer includes a plurality of light-emitting elements, and the light-emitting elements are configured to emit light of a specified color, where the specified color is one of the three primary colors.

[0072] The display panel provided in the embodiment of the present disclosure realizes the connection between the glass substrate and the light-emitting element layer through the adhesive layer, which can reduce the manufacturing cost of the light-emitting element and has a higher yield rate.

[0073] The technical solution of the embodiment of the present disclosure is described in detail below through specific examples.

[0074] Figure 1 FIG. 1 is a schematic diagram of a planar structure of a display panel according to an embodiment of the present disclosure. Figure 1 As shown, the display panel may include a plurality of pixel units P arranged in a matrix manner, and at least one of the plurality of pixel units P includes a plurality of sub-pixels emitting light of different colors. By way of example, at least one of the plurality of pixel units P may include a first sub-pixel P1 emitting a first color light, a second sub-pixel P2 emitting a second color light, and a third sub-pixel P3 emitting a third color light. By way of example, the first sub-pixel P1 may be a red sub-pixel emitting red (R) light, the second sub-pixel P2 may be a green sub-pixel emitting green (G) light, and the third sub-pixel P3 may be a blue sub-pixel emitting blue (B) light. The shape of the sub-pixels in the pixel unit may be a rectangle, a rhombus, a pentagon, a hexagon, etc., and the sub-pixels in the pixel unit may be arranged in horizontal parallel, vertical parallel, or in a herringbone manner. By way of example, as Figure 1 As shown, a plurality of sub-pixels in a pixel unit may be arranged in a first direction X-direction at intervals, and a plurality of first sub-pixels may be arranged in a second direction Y-direction at intervals. A plurality of pixel units may be arranged in pixel rows in the first direction X-direction, and a plurality of pixel units may be arranged in pixel columns in the second direction Y-direction. In an exemplary embodiment of the present disclosure, the first direction and the second direction intersect. For example, the first direction and the second direction are perpendicular to each other, which is not limited in the present disclosure. For example, a pixel unit may include four sub-pixels, which is not limited in the present disclosure.

[0075] In an exemplary embodiment, if Figure 1 As shown, at least one sub-pixel includes a light-emitting area 10 and a non-light-emitting area 20. The shape of the light-emitting area 10 may be a rectangle, a rhombus, a pentagon, a hexagon, etc., which is not limited in the present disclosure. In the embodiment of the present disclosure, the area size of the light-emitting area 10 and the non-light-emitting area 20 of the sub-pixel is not limited. For example, the area of ​​the light-emitting area 10 of the sub-pixel may be larger than the area of ​​the non-light-emitting area 20. For example, the area of ​​the light-emitting area 10 of the sub-pixel may be 1 to 3 times the area of ​​the non-light-emitting area 20, for example, 1.5 times. In some examples, the area ratio of the non-light-emitting area in the sub-pixel can be set according to actual application requirements.

[0076] Figure 2 FIG. 1 is a schematic diagram of a partial cross-sectional structure of a display panel according to an embodiment of the present disclosure. Figure 2 As shown, only one pixel unit is illustrated. In a plane perpendicular to the display panel, the display panel may include a substrate 100, and a light-emitting element layer and a conversion structure layer 300 sequentially arranged on one side of the substrate 100. In an exemplary embodiment of the present disclosure, the light-emitting element layer may include a plurality of light-emitting elements 200. The light-emitting element may be a micro-light-emitting element, such as a Micro-LED. The conversion structure layer 300 is configured to convert a single color of light emitted by the light-emitting element 200 into light of three or more colors. The single color may be one of the three primary colors. For example, the single color may be blue. For example, the three or more colors may be red, green and blue. In the embodiment of the present disclosure, three or more means three or more.

[0077] In an exemplary embodiment, the base 100 may include a rigid substrate 102 and a first adhesive layer 101, wherein the first adhesive layer 101 is located between the rigid substrate 102 and the light emitting element layer, and the light emitting element layer is connected to the rigid substrate 102 through the first adhesive layer 101. The first adhesive layer 101 may be a bonding adhesive. The rigid substrate 102 may be a glass substrate.

[0078] In an exemplary embodiment, the display panel may further include a circuit structure layer disposed on the rigid substrate 102. The circuit structure layer includes at least a light-emitting driving circuit. The light-emitting driving circuit is electrically connected to the light-emitting element. For example, the light-emitting driving circuit may include a plurality of transistors and at least one capacitor. For example, the light-emitting driving circuit may be an 8T2C (i.e., eight transistors and two capacitors) or a 13T1C (i.e., thirteen transistors and one capacitor) structure.

[0079] In an exemplary embodiment, if Figure 2 As shown, the light-emitting element 200 may include an epitaxial layer 203 and a first electrode 201 and a second electrode 202 connected to the epitaxial layer 203. The first electrode 201 is connected to the first end of the epitaxial layer 203, and the second electrode 202 is connected to the second end of the epitaxial layer 203. In some examples, the first electrode 201 of the light-emitting element may be an anode, and the second electrode 202 may be a cathode. The first electrode 201 may be electrically connected to the drain electrode of the transistor in the light-emitting drive circuit, and the second electrode 202 of the light-emitting element may be electrically connected to the common electrode line. However, the embodiments of the present disclosure are not limited to this. The epitaxial layer can emit light of a specified color under the drive of the electric field between the first electrode and the second electrode. For example, the specified color may be blue.

[0080] In an exemplary embodiment, a plurality of light-emitting elements 200 arranged along the first direction X may constitute a light-emitting element group, and a plurality of first electrodes 201 in the same light-emitting element group may be connected to each other. Alternatively, a plurality of light-emitting elements 200 arranged along the second direction Y may constitute a light-emitting element group, and a plurality of first electrodes 201 in the same light-emitting element group may be connected to each other. With such an arrangement, it is possible to achieve synchronous driving of a plurality of light-emitting elements in the same light-emitting element group, simplify the design of the light-emitting driving circuit, and reduce the complexity of the driving control.

[0081] In an exemplary embodiment, a plurality of light-emitting elements 200 arranged along the first direction X may constitute a light-emitting element group, and a plurality of second electrodes 202 in the same light-emitting element group may be connected to each other. Alternatively, a plurality of light-emitting elements 200 arranged along the second direction Y may constitute a light-emitting element group, and a plurality of second electrodes 202 in the same light-emitting element group may be connected to each other.

[0082] In an exemplary embodiment, the materials of the first electrode and the second electrode may be metal materials, such as any one or more of silver (Ag), copper (Cu), aluminum (Al), gold (Au), platinum (Pt), chromium (Cr), titanium (Ti) and molybdenum (Mo), or alloy materials of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb), and may be a single-layer structure or a multi-layer composite structure, such as Mo / Cu / Mo, or Cr / Pt / Au, or Cr / Al / Ti / Pt / Ti / Pt / Au, etc.

[0083] In an exemplary embodiment, if Figure 2 As shown, at least a portion of the first electrode 201 may be located in the light-emitting area 10. At least a portion of the second electrode 202 may be located in the non-light-emitting area 20. The orthographic projections of the first electrode 201 and the second electrode 202 in the display panel do not overlap. By arranging the second electrode in the non-light-emitting area of ​​the sub-pixel, it is possible to avoid the second electrode occupying the area of ​​the light-emitting area in the sub-pixel, increase the display area of ​​the display panel, improve the display quality, and avoid the opaque second electrode absorbing the light emitted by the light-emitting element, which can improve the light extraction efficiency of the light-emitting element.

[0084] In an exemplary embodiment, if Figure 2 As shown, the epitaxial layer 203 may include a first doped layer 211, a light emitting layer 213, and a second doped layer 212 which are sequentially stacked in a direction away from the substrate 100. The first doped layer 211 may be one of a P-type semiconductor layer and an N-type semiconductor layer, and the second doped layer 212 may be the other of the P-type semiconductor layer and the N-type semiconductor layer. For example, the first doped layer 211 may be a P-type semiconductor layer, and the second doped layer 212 may be an N-type semiconductor layer. The light emitting layer 213 may include multiple quantum wells.

[0085] In an exemplary embodiment, if Figure 2 As shown, the light emitting element 200 may further include a first connection electrode 205, and the first connection electrode 205 may be located between the epitaxial layer 203 and the first electrode 201. The epitaxial layer 203, the first connection electrode 205, and the first electrode 201 at least partially overlap in their orthographic projections on the display panel. For example, the epitaxial layer 203, the first connection electrode 205, and the first electrode 201 overlap in their orthographic projections on the display panel.

[0086] In an exemplary embodiment, the material of the first connection electrode may be a transparent conductive material, such as indium tin oxide (ITO) or indium zinc oxide (IZO). The first connection electrode may be a single-layer structure or a multi-layer composite structure, such as ITO / IZO. Setting the material of the first connection electrode to a transparent conductive material can improve the ohmic contact performance between the epitaxial layer 203 and the first electrode 201, and can enhance the light-emitting performance of the light-emitting element.

[0087] In an exemplary embodiment, if Figure 2 As shown, the display panel may further include a passivation layer 500. The passivation layer 500 is located on a side of the epitaxial layer 203 away from the substrate 100, and is located on a side of the second electrode 202 close to the substrate 100. The passivation layer 500 is provided with at least one opening 501, the opening 501 exposes a portion of the surface of the epitaxial layer 203, and the second electrode 202 is electrically connected to the epitaxial layer 203 via the opening 501. For example, the openings 501 may be provided in a one-to-one correspondence with the epitaxial layer 203.

[0088] In an exemplary embodiment, the material of the passivation layer may be silicon oxide (SiOx), hafnium dioxide (HfO 2 ), aluminum oxide (Al 2 O 3 ) can be a single layer, a multi-layer or a composite layer.

[0089] In an exemplary embodiment, if Figure 2 As shown, the light-emitting element 200 may further include a second connection electrode 204. The second connection electrode 204 is located on the side of the epitaxial layer 203 away from the substrate 100, and the second electrode 202 is located on the side of the second connection electrode 204 away from the substrate 100. The orthographic projection of the second connection electrode 204 on the display panel partially overlaps with the orthographic projection of the epitaxial layer 203 on the display panel. Part of the second connection electrode 204 is located in the light-emitting area 10 of the sub-pixel, and the remaining part of the second connection electrode 204 is located in the non-light-emitting area 20 of the sub-pixel. For example, the part of the second connection electrode 204 located in the light-emitting area 10 can contact the surface of the epitaxial layer 203 away from the substrate 100 through the opening 501, and the second electrode 202 contacts the surface of the second connection electrode 204 away from the substrate 100 in the non-light-emitting area 20. The second connection electrode can improve the ohmic contact performance between the epitaxial layer 203 and the second electrode 202, and can improve the light-emitting performance of the light-emitting element.

[0090] In an exemplary embodiment, the material of the second connection electrode may be a transparent conductive material, such as any one of indium tin oxide (ITO) or indium zinc oxide (IZO). The second connection electrode may be a single-layer structure, or a multi-layer composite structure, such as ITO / IZO. By setting the material of the second connection electrode to a transparent conductive material, the second connection electrode may be prevented from occupying the area of ​​the light-emitting region, and the display area of ​​the display panel may be increased.

[0091] In an exemplary embodiment, the display panel may further include a flat layer 600. The flat layer 600 may flatten the film layer height difference caused by the light emitting element, which is beneficial to ensure the consistency of the film layer thickness of the conversion structure layer, and may improve the display quality of the display panel.

[0092] In an exemplary embodiment, the material of the planar layer may be an organic insulating material or an inorganic insulating material. For example, the organic insulating material may be any one or more of epoxy resin, phenolic resin, urea-formaldehyde resin, melamine-formaldehyde resin, furan resin, silicone resin, polyester resin, polyamide resin, acrylic resin, polyurethane, vinyl resin, hydrocarbon resin, polyether resin, etc.

[0093] In an exemplary embodiment, if Figure 2 As shown, the conversion structure layer 300 is located on the side of the planar layer 600 away from the substrate 100. The conversion structure layer 300 may include a conversion layer 301. Alternatively, the conversion structure layer 300 may include a conversion layer 301 and a color filter layer 302 stacked in sequence. The conversion layer 301 is closer to the planar layer 600 than the color filter layer 302.

[0094] The conversion layer 301 may include a plurality of conversion patterns. The plurality of conversion patterns may be arranged in one-to-one correspondence with the plurality of sub-pixels. The plurality of conversion patterns include at least a first conversion pattern 311, a second conversion pattern 312, and a third conversion pattern 313. The first conversion pattern 311 may be arranged in correspondence with the first sub-pixel. The second conversion pattern 312 may be arranged in correspondence with the second sub-pixel. The third conversion pattern 313 may be arranged in correspondence with the third sub-pixel. At least a portion of the first conversion pattern 311 may be located in the light-emitting area of ​​the first sub-pixel. For example, the orthographic projection of the first conversion pattern 311 on the display panel overlaps with the light-emitting area of ​​the first sub-pixel. At least a portion of the second conversion pattern 312 may be located in the light-emitting area of ​​the second sub-pixel. For example, the orthographic projection of the second conversion pattern 312 on the display panel overlaps with the light-emitting area of ​​the second sub-pixel. At least a portion of the third conversion pattern 313 may be located in the light-emitting area of ​​the third sub-pixel. For example, the orthographic projection of the third conversion pattern 313 on the display panel overlaps with the light-emitting area of ​​the third sub-pixel. The first conversion pattern 311 is configured to convert the light of the specified color into red light, the second conversion pattern 312 is configured to convert the light of the specified color into green light, and the third conversion pattern 313 is configured to convert the light of the specified color into blue light. When the specified color is blue, the third conversion pattern 313 only needs to allow the blue light to pass through.

[0095] In an exemplary embodiment, the material of the conversion layer 301 may include a photoresist doped with a photoluminescent material. For example, when the designated color is blue, the photoluminescent material of the first conversion pattern 311 may include quantum dots or quantum rods that are excited by blue light to emit red light. The photoluminescent material of the second conversion pattern 312 may include quantum dots or quantum rods that are excited by blue light to emit green light. The photoluminescent material of the third conversion pattern 313 may include quantum dots or quantum rods that are excited by blue light to emit blue light. When the designated color is blue, the material of the third conversion pattern 313 may be an organic insulating material, and the third conversion pattern 313 only needs to allow blue light to pass through, without the need for conversion between different colors.

[0096] In an exemplary embodiment, the color filter layer 302 may include a plurality of light-transmitting patterns. The plurality of light-transmitting patterns are arranged corresponding to the plurality of sub-pixels. The plurality of light-transmitting patterns include at least a first light-transmitting pattern 321, a second light-transmitting pattern 322, and a third light-transmitting pattern 323. The first light-transmitting pattern 321 may be arranged corresponding to the first sub-pixel. The second light-transmitting pattern 322 may be arranged corresponding to the second sub-pixel. The third light-transmitting pattern 323 may be arranged corresponding to the third sub-pixel. At least a portion of the first light-transmitting pattern 321 may be located in the light-emitting region of the first sub-pixel. For example, the orthographic projection of the first light-transmitting pattern 321 on the display panel overlaps with the light-emitting region of the first sub-pixel. At least a portion of the second light-transmitting pattern 322 may be located in the light-emitting region of the second sub-pixel. For example, the orthographic projection of the second light-transmitting pattern 322 on the display panel overlaps with the light-emitting region of the second sub-pixel. At least a portion of the third light-transmitting pattern 323 may be located in the light-emitting region of the third sub-pixel. For example, the orthographic projection of the third light-transmitting pattern 323 on the display panel overlaps with the light-emitting region of the third sub-pixel. The first light-transmitting pattern 321 is configured to allow only the first color light (e.g., red light) to be emitted, and light of colors other than the first color light cannot be emitted from the light-emitting area of ​​the first sub-pixel. For example, the first light-transmitting pattern may be a red filter. The second light-transmitting pattern 322 is configured to allow only the second color light (e.g., green light) to be emitted, and light of colors other than the second color light cannot be emitted from the light-emitting area of ​​the second sub-pixel. For example, the second light-transmitting pattern may be a green filter. The third light-transmitting pattern 323 is configured to allow only the third color light (e.g., blue light) to be emitted, and light of colors other than the third color light cannot be emitted from the light-emitting area of ​​the third sub-pixel. For example, the third light-transmitting pattern may be a blue filter. By setting a color filter layer, the purity of the color of the light emitted from each sub-pixel can be improved, the accuracy of the color of the displayed image can be ensured, and the display quality of the display panel can be improved.

[0097] In an exemplary embodiment, if Figure 2 As shown, the display panel may further include an isolation dam 700. The isolation dam 700 may be located on a side of the planar layer 600 away from the substrate 100. The isolation dam 700 may be arranged around the conversion pattern, that is, the orthographic projection of the isolation dam 700 on the display panel does not overlap with the orthographic projection of the conversion pattern on the display panel. The isolation dam may be used to define the space occupied by the conversion pattern, and the materials used in the adjacent conversion patterns may be prevented from being doped, thereby improving the display quality.

[0098] In an exemplary embodiment, if Figure 2 As shown, the surface of the isolation dam 700 away from the flat layer 600 may be flush or approximately flush with the surface of the conversion layer 301 away from the flat layer 600. In the process of preparing the conversion layer, the isolation dam may function as a mask.

[0099] In an exemplary embodiment, the material of the isolation dam 700 may be an organic material. The isolation dam 700 may absorb light irradiated to its surface or reflect light irradiated to its surface. In a plane perpendicular to the display panel, the shape of the isolation dam 700 may be an inverted trapezoid, that is, the size of the side of the isolation dam 700 away from the flat layer 600 is larger than the size of the side close to the flat layer 600. Such a setting can prevent the material forming the conversion layer from overflowing during the printing process of the conversion layer.

[0100] In an exemplary embodiment, the display panel may further include an encapsulation layer 400. The encapsulation layer 400 may be located on a side of the isolation dam 700 away from the substrate 100, and the encapsulation layer 400 may be located between the conversion layer 301 and the color filter layer 302. The orthographic projection of the encapsulation layer 400 on the display panel may cover the orthographic projection of the conversion layer 301 on the display panel, and the encapsulation layer 400 may improve the performance of the conversion layer in blocking water and oxygen. The material of the encapsulation layer 400 may be an inorganic material. The inorganic material may include silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), aluminum oxide (Al2O3), and silicon nitride (SiNx). 2 O 3 ) any one or more of ).

[0101] In an exemplary embodiment, if Figure 2 As shown, the display panel may further include a black matrix (BM) 800. The black matrix 800 is located on a side of the encapsulation layer 400 away from the substrate 100. The black matrix 800 may be arranged around the light-emitting area of ​​the sub-pixel, which may avoid light crosstalk between adjacent sub-pixels and improve the display quality of the display panel. The black matrix 800 may be arranged around the light-transmitting pattern, that is, the orthographic projection of the black matrix 800 on the display panel does not overlap with the orthographic projection of the light-transmitting pattern on the display panel. The black matrix may be used to define the space occupied by the light-transmitting pattern, which may avoid doping between the materials used for adjacent light-transmitting patterns and improve the display quality.

[0102] In an exemplary embodiment, if Figure 2 As shown, the surface of the black matrix 800 away from the encapsulation layer 400 and the surface of the color filter layer 302 away from the encapsulation layer 400 may be flush or approximately flush.

[0103] In an exemplary embodiment, the orthographic projection of the black matrix 800 on the display panel can be located within the orthographic projection of the isolation dam 700 on the display panel, which can reduce the occupation of the light-emitting area of ​​the display panel. For example, the orthographic projections of the black matrix 800 and the isolation dam 700 on the display panel can overlap.

[0104] The following is an exemplary description of the preparation process of the display panel. The "patterning process" mentioned in the present disclosure includes processes such as coating photoresist, mask exposure, development, etching, and stripping photoresist for metal materials, inorganic materials, or transparent conductive materials, and includes processes such as coating organic materials, mask exposure, and development for organic materials. Deposition can be carried out by any one or more of sol-gel deposition, sputtering, evaporation, and chemical vapor deposition, coating can be carried out by any one or more of spraying, spin coating, and inkjet printing, and etching can be carried out by any one or more of dry etching and wet etching, which are not limited in the present disclosure. "Thin film" refers to a layer of thin film made by deposition, coating, or other processes of a certain material on a substrate. If the "thin film" does not require a patterning process during the entire production process, the "thin film" can also be called a "layer". If the "thin film" requires a patterning process during the entire production process, it is called a "thin film" before the patterning process and a "layer" after the patterning process. The "layer" after the patterning process contains at least one "pattern". The "A and B are arranged in the same layer" mentioned in the present disclosure means that A and B are formed simultaneously through the same patterning process, and the "thickness" of the film layer is the size of the film layer in the direction perpendicular to the display substrate. In the exemplary embodiments of the present disclosure, "the orthographic projection of B is within the range of the orthographic projection of A" or "the orthographic projection of A includes the orthographic projection of B" means that the boundary of the orthographic projection of B falls within the boundary of the orthographic projection of A, or the boundary of the orthographic projection of A overlaps with the boundary of the orthographic projection of B.

[0105] The manufacturing process of the display panel may include the following steps (101) to (112): FIG. 3A to FIG. 3O As shown, the figure only shows one sub-pixel as an example:

[0106] (101) Forming an epitaxial layer pattern, wherein forming the epitaxial layer pattern may at least include:

[0107] A first adhesive layer 101 is coated on a rigid substrate 102 to form a base, such as Figure 3A shown.

[0108] A first semiconductor film, a light emitting film, a second semiconductor film, a first conductive film and a second conductive film are sequentially deposited on the first substrate 111. Figure 3A As shown. The first semiconductor film may be an n-GaN (gallium nitride) film. The second semiconductor film may be a p-GaN (gallium nitride) film. For example, the first substrate may be a sapphire substrate.

[0109] The aforementioned formed base and the first substrate are bonded by a bonding process, such as Figure 3B As shown, the first adhesive layer 101 is bonded to the second conductive film.

[0110] The first substrate on the aforementioned substrate is peeled off by a process such as laser lift off (LLO). Figure 3C shown.

[0111] In actual production, different lasers can be selected to obtain the required laser wavelength. The selection of laser wavelength requires the energy to be between the wide bandgap of sapphire and the bandgap of GaN, that is, the energy between 3.4eV (electronvolt) and 8.8eV. The laser wavelength is usually selected to be less than 365 nanometers, for example, 308 nanometers.

[0112] Subsequently, the first semiconductor film, the light-emitting film, and the second semiconductor film are patterned by a patterning process to form an epitaxial layer pattern covering the first conductive film. The epitaxial layer pattern may include at least a second doping layer 212, a light-emitting layer 213, and a first doping layer 211. Figure 3D shown.

[0113] (102) forming a first connection electrode, wherein forming the first connection electrode may at least include:

[0114] The first conductive film is patterned by a patterning process to form a first conductive layer pattern located on one side of the second conductive film. The first conductive layer pattern at least includes a first connecting electrode 205, such as Figure 3E shown.

[0115] (103) forming a first electrode, wherein the forming of the first electrode may include at least:

[0116] The second conductive film is patterned by a patterning process to form a second conductive layer pattern located on one side of the substrate. The second conductive layer pattern at least includes a first electrode 201, such as Figure 3F shown.

[0117] (104) forming a passivation layer pattern, the forming of the passivation layer pattern may at least include: depositing a first insulating film on the substrate on which the aforementioned pattern is formed, patterning the first insulating film using a patterning process, and forming a passivation layer pattern located on one side of the second doping layer 212. The passivation layer 500 has at least one opening 501, such as Figure 3G shown.

[0118] The orthographic projection of the opening 501 on the substrate is located within the orthographic projection range of the second doping layer 212 on the substrate, the first insulating film in the opening 501 is removed, exposing a portion of the surface of the second doping layer 212, and the opening 501 is configured to connect a subsequently formed second connecting electrode to the second doping layer 212 through the opening 501.

[0119] (105) forming a second connection electrode, the forming of the second connection electrode may at least include: depositing a third conductive film on the substrate formed with the aforementioned pattern, patterning the third conductive film using a patterning process to form a third conductive layer pattern located on one side of the passivation layer 500, the third conductive layer pattern at least including the second connection electrode 204, such as Figure 3H shown.

[0120] The orthographic projection of the second connecting electrode 204 on the substrate at least partially overlaps with the orthographic projection of the passivation layer 500 on the substrate, and the orthographic projection of the opening 501 on the substrate is located within the range of the orthographic projection of the second connecting electrode 204 on the substrate, and the second connecting electrode 204 is connected to the second doping layer 212 through the opening 501.

[0121] (106) forming a second electrode, wherein the forming of the second electrode may at least include: depositing a fourth conductive film on the substrate formed with the aforementioned pattern, patterning the fourth conductive film using a patterning process to form a fourth conductive layer pattern located on one side of the second connection electrode 204, wherein the fourth conductive layer pattern at least includes the second electrode 202, such as Fig. 3I shown.

[0122] The second electrode 202 is located in the non-luminous area of ​​the sub-pixel, and the orthographic projection of the second electrode 202 on the substrate does not overlap with the orthographic projection of the second doping layer 212 on the substrate, which can avoid the second electrode occupying the luminous area of ​​the display panel and improve the display effect of the display panel.

[0123] (107) forming a planar layer pattern, wherein the forming of the planar layer pattern may at least include: depositing a second insulating film on the substrate on which the aforementioned pattern is formed, patterning the second insulating film using a patterning process to form a planar layer pattern covering the passivation layer, the second connecting electrode, and the second electrode, such as Figure 3J The orthographic projection of the flat layer 600 on the substrate includes the orthographic projection of the passivation layer 500 on the substrate, the orthographic projection of the second connection electrode 204 on the substrate, and the orthographic projection of the second electrode 202 on the substrate. The flat layer 600 can flatten the height difference in the thickness direction of the display panel caused by the light emitting element.

[0124] (108) forming an isolation dam pattern, the formation of the isolation dam pattern may at least include: depositing a third insulating film on the substrate on which the aforementioned pattern is formed, patterning the third insulating film using a patterning process, and forming an isolation dam pattern located on one side of the flat layer 600. The isolation dam 700 may be arranged around the light-emitting area of ​​the sub-pixel, and the isolation dam 700 is used to define a space for subsequently forming a conversion pattern, such as Figure 3K shown.

[0125] (109) forming a conversion layer pattern, the forming of the conversion layer pattern may at least include: forming a conversion layer pattern located on one side of the flat layer 600 by printing or other methods on the substrate on which the aforementioned pattern is formed. The conversion layer 301 and the isolation dam 700 are located on the same side of the flat layer 600, and the orthographic projections of the conversion layer 301 and the isolation dam 700 on the display panel do not overlap, such as Figure 3L As shown. The conversion layer 301 may include a plurality of conversion patterns. The plurality of conversion patterns are arranged corresponding to the plurality of sub-pixels. The plurality of conversion patterns include at least a first conversion pattern, a second conversion pattern and a third conversion pattern.

[0126] (110) forming an encapsulation layer, which may include at least: depositing a fourth insulating film on the substrate having the aforementioned pattern, patterning the fourth insulating film using a patterning process, and forming an encapsulation layer 400 covering the aforementioned substrate, such as Figure 3M The encapsulation layer can be used to enhance the ability of the conversion layer to resist water and oxygen, thereby improving the reliability of the display panel.

[0127] (111) forming a black matrix pattern, wherein the forming of the black matrix pattern may at least include: coating a black pigment or depositing a black chromium (Cr) film on the substrate formed with the aforementioned pattern, patterning the black pigment or the black chromium film using a patterning process to form a black matrix pattern located on one side of the encapsulation layer 400, such as Figure 3N As shown. The black matrix 800 can be arranged around the light-emitting area of ​​the sub-pixel, and the orthographic projection of the black matrix 800 on the display panel at least partially overlaps with the orthographic projection of the isolation dam 700 on the display panel. For example, the orthographic projection of the black matrix 800 on the display panel overlaps with the orthographic projection of the isolation dam 700 on the display panel. The arranged black matrix 800 can define the area where the color filter layer is subsequently formed.

[0128] (112) forming a color filter layer pattern, wherein the forming of the color filter layer pattern may at least include: forming a color filter layer pattern located on one side of the conversion layer 301 by photolithography or the like on the substrate on which the aforementioned pattern is formed. The color filter layer 302 and the black matrix 800 are located on the same side of the encapsulation layer 400, and the orthographic projections of the color filter layer 302 and the black matrix 800 on the display panel do not overlap, such as Fig.3O As shown. The color filter layer 302 may include a plurality of light-transmitting patterns. The plurality of light-transmitting patterns are arranged corresponding to the plurality of sub-pixels. The plurality of light-transmitting patterns include at least a first light-transmitting pattern, a second light-transmitting pattern and a third light-transmitting pattern.

[0129] In an exemplary embodiment, the first connection electrode and the first electrode can be manufactured through the same patterning process, which can reduce the number of manufacturing steps and shorten the manufacturing cycle.

[0130] In an exemplary embodiment, the epitaxial layer, the first connecting electrode and the first electrode can be manufactured by a same patterning process, which can reduce the number of manufacturing steps and shorten the manufacturing cycle.

[0131] Figure 4 FIG. 1 is a schematic diagram of a partial cross-sectional structure of a display panel according to another embodiment of the present disclosure. Figure 4 As shown, the main structure of the display panel shown in this exemplary embodiment is basically the same as that of the previous embodiment, except that the first electrode 201 and the second electrode 202 in this exemplary embodiment are interchanged, that is, the first electrode 201 is connected to the second end of the epitaxial layer 203, and the second electrode 202 is connected to the first end of the epitaxial layer 203. The second electrode 202 can be electrically connected to the drain electrode of the transistor in the light-emitting driving circuit, and the first electrode 201 of the light-emitting element can be electrically connected to the common electrode line. Figure 4 As shown, the epitaxial layer 203 may include a second doping layer 212 , a light emitting layer 213 , and a first doping layer 211 which are sequentially stacked in a direction away from the substrate 100 .

[0132] In an exemplary embodiment, if Figure 4 As shown, at least a portion of the second electrode 202 may be located in the light-emitting region 10. At least a portion of the first electrode 201 may be located in the non-light-emitting region 20. The orthographic projections of the first electrode 201 and the second electrode 202 in the display panel do not overlap. By arranging the first electrode in the non-light-emitting region, the first electrode can avoid occupying the area of ​​the light-emitting region, and the display area of ​​the display panel can be increased.

[0133] In an exemplary embodiment, if Figure 4 As shown, the display panel may further include a passivation layer 500. The passivation layer 500 is located on a side of the epitaxial layer 203 away from the substrate 100, and is located on a side of the first electrode 201 close to the substrate 100. The passivation layer 500 is provided with at least one opening 501, the opening 501 exposes a portion of the surface of the epitaxial layer 203, and the first electrode 201 is electrically connected to the epitaxial layer 203 via the opening 501.

[0134] In an exemplary embodiment, if Figure 4As shown, the light-emitting element 200 may further include a third connection electrode 206. The third connection electrode 206 is located on the side of the epitaxial layer 203 away from the substrate 100. The orthographic projection of the third connection electrode 206 on the display panel partially overlaps with the orthographic projection of the epitaxial layer 203 on the display panel. Part of the third connection electrode 206 is located in the light-emitting area 10, and the remaining part of the third connection electrode 206 is located in the non-light-emitting area 20. For example, the part of the third connection electrode 206 located in the light-emitting area 10 can contact the surface of the epitaxial layer 203 away from the substrate 100 through the opening 501, and the first electrode 201 contacts the surface of the third connection electrode 206 away from the substrate 100 in the non-light-emitting area 20. The third connection electrode can improve the ohmic contact performance between the epitaxial layer 203 and the first electrode 201, and can improve the light-emitting performance of the light-emitting element.

[0135] In an exemplary embodiment, if Figure 4 As shown, the epitaxial layer 203 is located on a side of the second electrode 202 away from the substrate 100, and the epitaxial layer 203 contacts and cooperates with the second electrode 202. The epitaxial layer 203 and the second electrode 202 at least partially overlap in their orthographic projections on the display panel. For example, the epitaxial layer 203 and the second electrode 202 overlap in their orthographic projections on the display panel.

[0136] The manufacturing process of the display panel may include the following steps (201) to (206): FIG. 5A to FIG. 5Q As shown, the figure only shows one sub-pixel as an example:

[0137] (201) Forming an epitaxial layer pattern, wherein forming the epitaxial layer pattern may at least include:

[0138] A second adhesive layer 113 is coated on the second substrate 112, such as Figure 5A As shown. For example, the second substrate may be a silicon substrate. In the embodiment of the present disclosure, the second adhesive layer may be referred to as a temporary bonding adhesive layer.

[0139] A first semiconductor film, a light-emitting film and a second semiconductor film are sequentially deposited on the first substrate 111. Figure 5A As shown. The first semiconductor film may be an n-GaN (gallium nitride) film. The second semiconductor film may be a p-GaN (gallium nitride) film. For example, the first substrate may be a sapphire substrate.

[0140] The second substrate formed above is bonded to the first substrate using a bonding process, such as Figure 5B As shown, the second adhesive layer 113 is bonded to the second semiconductor film.

[0141] The first substrate on the second substrate 112 is peeled off by a laser lift off (LLO) process, such as Figure 5C shown.

[0142] A first conductive film is deposited on the second substrate 112 formed above. Figure 5D shown.

[0143] The first adhesive layer 101 is coated on the rigid substrate 102, the second substrate 112 formed above is connected to the rigid substrate 102 by a bonding process, and the first adhesive layer 101 is bonded to the first conductive film. Figure 5E shown.

[0144] The second substrate on the rigid substrate 102 is peeled off by laser peeling process, such as Fig. 5F shown.

[0145] The second semiconductor film, the light-emitting film, and the first semiconductor film are patterned by a patterning process to form an epitaxial layer pattern. The epitaxial layer pattern may include at least a first doped layer 211, a light-emitting layer 213, and a second doped layer 212. Figure 5G shown.

[0146] (202) forming a second electrode, wherein the forming of the second electrode may at least include:

[0147] The first conductive film is patterned by a patterning process to form a first conductive layer pattern. The first conductive layer pattern at least includes a second electrode 202, such as Figure 5H shown.

[0148] (203) forming a passivation layer pattern, the forming of the passivation layer pattern may at least include: depositing a first insulating film on the rigid substrate on which the aforementioned pattern is formed, patterning the first insulating film using a patterning process, and forming a passivation layer pattern covering the first doping layer 211. The passivation layer 500 has at least one opening 501, such as Fig.5I shown.

[0149] The orthographic projection of the opening 501 on the rigid substrate is located within the orthographic projection range of the first doped layer 211 on the rigid substrate. The first insulating film in the opening 501 is removed to expose a portion of the surface of the first doped layer 211. The opening 501 is configured to connect a subsequently formed third connecting electrode to the first doped layer 211 through the opening 501.

[0150] (204) forming a third connection electrode, the forming of the third connection electrode may at least include: depositing a second conductive film on the rigid substrate having the aforementioned pattern, patterning the second conductive film using a patterning process to form a second conductive layer pattern located on one side of the passivation layer 500, the second conductive layer pattern at least including the third connection electrode 206, such as Figure 5J shown.

[0151] The orthographic projection of the third connecting electrode 206 on the rigid substrate at least partially overlaps with the orthographic projection of the passivation layer 500 on the rigid substrate, and the orthographic projection of the opening 501 on the rigid substrate is located within the range of the orthographic projection of the third connecting electrode 206 on the rigid substrate, and the third connecting electrode 206 is connected to the first doping layer 211 through the opening 501.

[0152] (205) forming a first electrode, the forming of the first electrode may at least include: depositing a third conductive film on the rigid substrate having the aforementioned pattern, patterning the third conductive film using a patterning process to form a third conductive layer pattern located on one side of the third connection electrode 206, the third conductive layer pattern at least including the first electrode 201, such as Figure 5K shown.

[0153] The orthographic projection of the first electrode 201 on the rigid substrate does not overlap with the orthographic projection of the first doping layer 211 on the rigid substrate, which can avoid the first electrode occupying the light-emitting area of ​​the display panel and improve the display effect of the display panel.

[0154] (206) A planarization layer 600, an isolation dam 700, a conversion layer 301, an encapsulation layer 400, a black matrix 800 and a color filter layer 302 are sequentially formed. The preparation process is as follows: Figure 5L to Figure 5Q As shown, the preparation process can refer to the aforementioned exemplary embodiment about FIG. 3J to FIG. 3O The description will not be elaborated here.

[0155] Through the introduction of the above technical solution and its preparation process, it can be seen that the preparation of the display panel provided by the embodiment of the present disclosure can be realized by using the existing mature preparation equipment, with little improvement on the existing process, simple preparation process, low manufacturing cost, and good application prospects. The display panel obtained by the preparation method of the display panel provided by the embodiment of the present disclosure has a high manufacturing yield and a low manufacturing cost.

[0156] The present disclosure also provides a method for preparing a display panel, including:

[0157] forming a first adhesive layer on one side of the glass substrate;

[0158] A light-emitting element layer is formed on a side of the first adhesive layer away from the glass substrate, and the light-emitting element layer is connected to the glass substrate via the first adhesive layer; the light-emitting element layer includes a plurality of light-emitting elements, and the light-emitting elements include a first electrode, an epitaxial layer, and a second electrode that are stacked; the light-emitting elements are configured to emit light of a specified color, and the specified color is one of the three primary colors.

[0159] In an exemplary embodiment, forming a light-emitting element layer on a side of the first adhesive layer away from the glass substrate includes:

[0160] forming a first semiconductor thin film, a light-emitting thin film and a second semiconductor thin film in sequence on one side of the substrate;

[0161] Bonding the glass substrate and the substrate relative to each other so that the first adhesive layer is connected to the second semiconductor film;

[0162] peeling off the substrate;

[0163] The first semiconductor film, the light-emitting film and the second semiconductor film are patterned to form an epitaxial layer of the light-emitting element.

[0164] In the embodiment of the present disclosure, the glass substrate is relatively bonded to the substrate, which means that the glass substrate is farther away from the substrate than the first adhesive layer, and the second semiconductor film is closer to the glass substrate than the substrate. That is, after the glass substrate is relatively bonded to the substrate and before the substrate is peeled off, the first adhesive layer, the first semiconductor film, the light-emitting film, and the second semiconductor film are all located between the glass substrate and the substrate.

[0165] The present disclosure also provides a display device, which includes the display panel of any of the above exemplary embodiments. The display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, etc.

[0166] Although the embodiments disclosed in the present invention are as above, the contents described are only embodiments adopted to facilitate understanding of the present invention and are not intended to limit the present invention. Any technician in the field to which the present invention belongs can make any modifications and changes in the form and details of implementation without departing from the spirit and scope disclosed in the present invention, but the patent protection scope of the present invention shall still be subject to the scope defined in the attached claims.

Claims

1. A display panel, characterized in that: include: A substrate, comprising a glass substrate and a first adhesive layer located on one side of the glass substrate; A light-emitting element layer is located on a side of the first adhesive layer away from the glass substrate, and the light-emitting element layer is connected to the glass substrate via the first adhesive layer; the light-emitting element layer includes a plurality of light-emitting elements, and the light-emitting elements are configured to emit light of a specified color, where the specified color is one of the three primary colors.

2. The display panel according to claim 1, wherein: The display panel further comprises a conversion structure layer; the conversion structure layer is located on a side of the light emitting element layer away from the substrate; the conversion structure layer is configured to convert light of a specified color into light of at least two other colors different from the specified color.

3. The display panel according to claim 2, wherein: The conversion structure layer includes a first conversion pattern and a second conversion pattern; in the structure of a display panel with a designated color of blue, the material of the first conversion pattern includes quantum dots or quantum rods that emit red light when excited by blue light; the material of the second conversion pattern includes quantum dots or quantum rods that emit green light when excited by blue light.

4. The display panel according to claim 1, wherein: The light emitting element comprises a first electrode, an epitaxial layer and a second electrode which are stacked; the epitaxial layer is configured to emit light of a specified color under the electric field drive of the first electrode and the second electrode; A plurality of the light emitting elements are arranged along a first direction to form a light emitting element group; The plurality of light emitting element groups are arranged along a second direction, and the first direction intersects with the second direction; A plurality of the first electrodes in the same light-emitting element group are connected to each other; or / and a plurality of the second electrodes in the same light-emitting element group are connected to each other.

5. The display panel according to claim 1, wherein: The light emitting element comprises a first electrode, an epitaxial layer and a second electrode which are stacked; the epitaxial layer is configured to emit light of a specified color under the electric field drive of the first electrode and the second electrode; A plurality of the light emitting elements are arranged along the second direction to form a light emitting element group; The plurality of light emitting element groups are arranged along a first direction, and the first direction intersects with the second direction; A plurality of the first electrodes in the same light-emitting element group are connected to each other; or / and a plurality of the second electrodes in the same light-emitting element group are connected to each other.

6. The display panel according to any one of claims 1 to 5, characterized in that: The light emitting element comprises a first electrode, an epitaxial layer and a second electrode which are stacked in sequence; the first electrode is closer to the substrate than the epitaxial layer; The light emitting element further includes a first connecting electrode, which is located between the first electrode and the epitaxial layer, and the first connecting electrode and the first electrode have at least a partial overlap in their orthographic projections on the display panel, and the first electrode and the epitaxial layer are connected via the first connecting electrode.

7. The display panel according to any one of claims 1 to 5, characterized in that: The light emitting element comprises a first electrode, an epitaxial layer and a second electrode which are stacked in sequence; the first electrode is closer to the substrate than the epitaxial layer; The light emitting element further includes a second connecting electrode, which is located between the second electrode and the epitaxial layer, and the second connecting electrode and the second electrode at least partially overlap in their orthographic projections on the display panel, and the second electrode and the epitaxial layer are connected via the second connecting electrode.

8. The display panel according to claim 7, wherein: The display panel includes a plurality of sub-pixels, and the plurality of sub-pixels are arranged in one-to-one correspondence with the plurality of light-emitting elements; at least one of the sub-pixels includes a light-emitting area and a non-light-emitting area, the epitaxial layer of the light-emitting element is located in the light-emitting area, the second electrode is located in the non-light-emitting area, and the second connecting electrode is a transparent conductive electrode.

9. A display device, characterized in that: Comprising the display panel as claimed in any one of claims 1 to 8.

10. A method for preparing a display panel, characterized in that: include: forming a first adhesive layer on one side of the glass substrate; A light-emitting element layer is formed on a side of the first adhesive layer away from the glass substrate, and the light-emitting element layer is connected to the glass substrate via the first adhesive layer; the light-emitting element layer includes a plurality of light-emitting elements, and the light-emitting elements include a first electrode, an epitaxial layer, and a second electrode that are stacked; the light-emitting elements are configured to emit light of a specified color, and the specified color is one of the three primary colors.

11. The preparation method according to claim 10, characterized in that: Forming a light-emitting element layer on a side of the first adhesive layer away from the glass substrate includes: forming a first semiconductor thin film, a light-emitting thin film and a second semiconductor thin film in sequence on one side of the substrate; Bonding the glass substrate and the substrate relative to each other so that the first adhesive layer is connected to the second semiconductor film; peeling off the substrate; The first semiconductor film, the light-emitting film and the second semiconductor film are patterned to form an epitaxial layer of the light-emitting element.

12. The preparation method according to claim 11, characterized in that: The method of sequentially forming a first semiconductor film, a light-emitting film, and a second semiconductor film on one side of the substrate further includes: A conductive film is formed on a side of the second semiconductor film away from the substrate; and the first adhesive layer is connected to the second semiconductor film via the conductive film.

13. The preparation method according to claim 12, characterized in that: After forming the epitaxial layer of the light emitting element, the method further comprises: The conductive film is patterned to form a first electrode of the light emitting element.

14. The preparation method according to claim 12, characterized in that: The conductive film includes a first conductive film and a second conductive film; after forming the epitaxial layer of the light emitting element, the method further includes: The first conductive film and the second conductive film are patterned to form a first electrode and a first connecting electrode of the light emitting element, wherein the first connecting electrode is located between the first electrode and the epitaxial layer.

15. The preparation method according to claim 11, characterized in that: The substrate includes a first substrate and a second substrate; and sequentially forming a first semiconductor film, a light-emitting film and a second semiconductor film on one side of the substrate further includes: forming a second adhesive layer on one side of the second substrate; forming a first semiconductor thin film, a light-emitting thin film, and a second semiconductor thin film in sequence on one side of the first substrate; Bonding the second substrate to the first substrate so that the second glue layer is connected to the second semiconductor film; peeling off the first substrate; A conductive film is formed on a side of the first semiconductor film away from the second substrate.

16. The preparation method according to claim 15, characterized in that: After forming a conductive film on a side of the first semiconductor film away from the second substrate, the method further comprises: The glass substrate and the second substrate are bonded relative to each other so that the first adhesive layer and the second semiconductor film are connected via the conductive film.

17. The preparation method according to claim 16, characterized in that: After the first glue layer is connected to the second semiconductor film via the conductive film, the method further comprises: peeling off the second substrate; The first semiconductor film, the light-emitting film and the second semiconductor film are patterned to form an epitaxial layer of the light-emitting element.

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