Ultrasonic sensors and their manufacturing methods, ultrasonic testing equipment

Abstract

This application provides an ultrasonic sensor, its manufacturing method, and an ultrasonic testing device. The ultrasonic sensor includes a piezoelectric unit, a first contact electrode, a second contact electrode, a first bent wire, a first external structure, a second bent wire, a second external structure, and a flexible encapsulation. The first contact electrode is connected to a first surface of the corresponding piezoelectric unit, and the second contact electrode is connected to a second surface of the corresponding piezoelectric unit. The flexible encapsulation covers the piezoelectric unit, the first contact electrode, and the second contact electrode. The first contact electrode is electrically connected to the first external structure via the first bent wire, with at least a portion of the first external structure exposed within the flexible encapsulation. The second contact electrode is electrically connected to the second external structure via the second bent wire, with at least a portion of the second external structure exposed within the flexible encapsulation. This design allows for greater flexibility in the ultrasonic sensor, facilitating wider application scenarios.

Description

Technical Field

[0001] This application relates to the field of ultrasonic testing technology, and in particular to an ultrasonic sensor and its manufacturing method, and an ultrasonic testing device. Background Technology

[0002] Ultrasonic testing has applications in fields such as medicine and industrial flaw detection. For example, in medicine, ultrasonic testing is an effective means of detecting chronic diseases such as cardiovascular diseases. During ultrasonic testing, ultrasonic sensors in the equipment are used to emit and receive ultrasonic waves.

[0003] In related technologies, ultrasonic sensors may include piezoelectric modules, which may include multiple piezoelectric units and multiple carrier plates corresponding to the piezoelectric units and arranged in rows and columns. The piezoelectric units can be used to emit and receive ultrasonic waves. The carrier plates have mounting grooves, and the piezoelectric units are fixedly installed in the mounting grooves of the corresponding carrier plates. Each row of carrier plates and each column of carrier plates has a terminal block at its end. The terminal blocks are connected to adjacent carrier plates through a serpentine connection structure. Adjacent carrier plates are also connected through a serpentine connection structure. The serpentine connection structure includes a serpentine planar carrier made of polyimide and copper foils respectively attached to both sides of the serpentine planar carrier. The piezoelectric units installed on each row of carrier plates are electrically connected to the terminal blocks at the end of that row through the serpentine connection structure. The piezoelectric units installed on each column of carrier plates are electrically connected to the terminal blocks at the end of that column through the serpentine connection structure. By setting the serpentine connection structure, the spacing between the terminal blocks and the carrier plates, as well as between two adjacent carrier plates, can be changed, making the ultrasonic sensor stretchable.

[0004] However, among related technologies, ultrasonic sensors have poor flexibility, which limits their application scenarios. Summary of the Invention

[0005] This application provides an ultrasonic sensor and an ultrasonic testing device. A flexible package is used to carry a piezoelectric unit and a connecting component connected to the piezoelectric unit. The external structure of the connecting component is connected to the contact electrode of the piezoelectric unit through a bent wire. This makes the ultrasonic sensor more flexible and helps to broaden the application scenarios of the ultrasonic sensor.

[0006] This application provides an ultrasonic sensor, including a piezoelectric module, a first connecting component, a second connecting component, and a flexible encapsulation. The piezoelectric module includes a piezoelectric unit and a first contact electrode and a second contact electrode corresponding to the piezoelectric unit. The piezoelectric unit includes a first surface and a second surface opposite to each other in its thickness direction. The first contact electrode is fixedly connected to the first surface of the corresponding piezoelectric unit and electrically connected to the first surface of the corresponding piezoelectric unit. The second contact electrode is fixedly connected to the second surface of the corresponding piezoelectric unit and electrically connected to the second surface of the corresponding piezoelectric unit. The flexible encapsulation covers the piezoelectric unit, the first contact electrode, and the second contact electrode. The first connecting component and the second connecting component are spaced apart. The first connecting component includes a first bent wire and a first external structure. One end of the first bent wire is connected to the first contact electrode, and the other end is connected to the first external structure, such that the first contact electrode is electrically connected to the first external structure through the first bent wire. At least a portion of the first bent wire is covered by the flexible encapsulation, and at least a portion of the first external structure is exposed within the flexible encapsulation. The second connection component includes a second bent wire and a second external structure. One end of the second bent wire is connected to the second contact electrode and the other end is connected to the second external structure, such that the second contact electrode is electrically connected to the second external structure through the second bent wire. At least a portion of the second bent wire is covered by a flexible encapsulation, and at least a portion of the second external structure is exposed outside the flexible encapsulation.

[0007] In this embodiment of the ultrasonic sensor, the piezoelectric unit, the first connecting component, and the second connecting component can all be carried by a flexible package, eliminating the need for additional supporting structures. The flexible package exhibits good bending performance in its normal direction. The first contact electrode is electrically connected to the first external structure via a first bent wire, and the second contact electrode is electrically connected to the second external structure via a second bent wire. Both the first and second bent wires are stretchable and bendable. The electrical connections between the first and second contact electrodes have minimal impact on the flexibility of the flexible package. The ultrasonic sensor has fewer inflexible components and a smaller inflexible area, resulting in better flexibility. This allows the ultrasonic sensor to be attached to complex curved surfaces for extended periods, broadening its application scenarios. Furthermore, the flexible package provides a moisture barrier for the piezoelectric unit, first contact electrode, second contact electrode, and other encapsulated electrical structures, protecting them.

[0008] In one possible implementation, the piezoelectric module includes a plurality of piezoelectric units spaced apart. A first connecting component includes a plurality of first bent wires corresponding to and spaced apart from the piezoelectric units. A first external structure includes a plurality of first pin electrodes corresponding to and spaced apart from the piezoelectric units, with at least a portion of the first pin electrodes exposed above the flexible package. A first contact electrode electrically connected to each piezoelectric unit is electrically connected to its corresponding first pin electrode via a corresponding first bent wire. A second external structure includes second pin electrodes, with at least a portion of the second pin electrodes exposed above the flexible package. All second contact electrodes are electrically connected to the same second pin electrode via second bent wires.

[0009] In one possible implementation, the ultrasonic sensor further includes a third bent wire, which is spaced apart from the first connecting component. All the second contact electrodes are electrically connected to each other via the third bent wire, and one of the second contact electrodes is electrically connected to a second pin electrode via the second bent wire, such that all the second contact electrodes are electrically connected to the same second pin electrode via the second bent wire. The flexible package covers the third bent wire.

[0010] In one possible implementation, the orthographic projection of the first connecting component in the thickness direction of the ultrasonic sensor and the orthographic projection of the second connecting component in the thickness direction of the ultrasonic sensor are spaced apart.

[0011] In one possible implementation, the piezoelectric module includes a first row of piezoelectric units and a second row of piezoelectric units arranged side by side. The first row of piezoelectric units includes a plurality of piezoelectric units spaced apart along its extension direction, and the second row of piezoelectric units includes a plurality of piezoelectric units spaced apart along its extension direction. Along the extension direction of the first row of piezoelectric units, the piezoelectric units of the first row and the second row of piezoelectric units are arranged alternately.

[0012] In one possible implementation, the piezoelectric module further includes a first electrical connection unit and a second electrical connection unit corresponding to the piezoelectric unit. The first electrical connection unit and a first contact electrode are sequentially stacked on the first surface of the corresponding piezoelectric unit. The first surface of the piezoelectric unit is joined and fixed to the corresponding first contact electrode through the corresponding first electrical connection unit, thereby electrically connecting the first surface of the piezoelectric unit to the corresponding first contact electrode. Similarly, the second electrical connection unit and the second contact electrode are sequentially stacked on the second surface of the corresponding piezoelectric unit. The second surface of the piezoelectric unit is joined and fixed to the corresponding second contact electrode through the corresponding second electrical connection unit, thereby electrically connecting the second surface of the piezoelectric unit to the corresponding second contact electrode.

[0013] In one possible implementation, the flexible package has a flexible adhesive layer on at least one side of its thickness direction.

[0014] In one possible implementation, the flexible adhesive layer is formed of hydrogel.

[0015] In one possible implementation, the flexible adhesive layer is formed of a water-reducing material.

[0016] In one possible implementation, the acoustic impedance of the flexible adhesive layer is less than that of the flexible package.

[0017] In one possible implementation, a flexible adhesive layer covers the flexible package.

[0018] In one possible implementation, at least one surface of the ultrasonic sensor in its thickness direction is obliquely intersected with the thickness direction of at least one piezoelectric element.

[0019] Another aspect of this application provides an ultrasonic testing device, including an excitation device and an ultrasonic sensor as described in any of the above embodiments, wherein a first external structure and a second external structure of the ultrasonic sensor are electrically connected to the excitation device.

[0020] This application further provides a method for manufacturing an ultrasonic sensor, comprising the steps of:

[0021] A first flexible encapsulation layer and a second flexible encapsulation layer are prepared respectively, wherein the first flexible encapsulation layer includes a first bonding surface and the second flexible encapsulation layer includes a second bonding surface.

[0022] A first conductive layer is provided on the first bonding surface, and the first conductive layer is processed to form a first conductive pattern on the first bonding surface. The first conductive pattern includes a first contact electrode, a first bent wire, and a first external structure. The first contact electrode is connected to the first external structure through the first bent wire, and the first contact electrode corresponds to the piezoelectric unit.

[0023] A second conductive layer is provided on the second bonding surface, and the second conductive layer is processed to form a second conductive pattern on the second bonding surface. The second conductive pattern includes a second contact electrode, a second bent wire, and a second external structure. The second contact electrode is connected to the second external structure through the second bent wire, and the second contact electrode corresponds to the piezoelectric unit.

[0024] Connect the piezoelectric unit to the corresponding first contact electrode.

[0025] After the piezoelectric unit is docked onto the corresponding first contact electrode, the first bonding surface and the second bonding surface are joined to form a first flexible package, so that the piezoelectric unit is docked with the corresponding second contact electrode and a first flexible package structure is formed. The first flexible package structure includes a first flexible package, a first conductive pattern, a second conductive pattern and a piezoelectric unit, and the first flexible package covers the first conductive pattern, the second conductive pattern and the piezoelectric unit.

[0026] At least a portion of the first external structure and at least a portion of the second external structure are exposed in the first flexible package.

[0027] In one possible implementation, the piezoelectric unit is mated to the corresponding first contact electrode, specifically including:

[0028] A first electrical connection unit is provided on the first contact electrode.

[0029] After the first electrical connection unit is set on the first contact electrode, the piezoelectric unit is connected to the first electrical connection unit set on the corresponding first contact electrode, so that the piezoelectric unit and the corresponding first contact electrode are connected through the first electrical connection unit between them.

[0030] The method also includes the following steps:

[0031] A second electrical connection unit is provided on the second contact electrode.

[0032] The first mating surface and the second mating surface are joined to form a first flexible package, so that the piezoelectric unit can be connected to the corresponding second contact electrode to form the first flexible package structure, specifically including:

[0033] After the second electrical connection unit is disposed on the second contact electrode, the first bonding surface and the second bonding surface are joined to form a first flexible package, so that the piezoelectric unit is docked on the second electrical connection unit disposed on the corresponding second contact electrode, so that the piezoelectric unit and the corresponding second contact electrode are docked through the second electrical connection unit between them, and a first flexible package structure is formed. The first flexible package structure includes a first flexible package, a first conductive pattern, a second conductive pattern, a first electrical connection unit, a second electrical connection unit and a piezoelectric unit. The first flexible package covers the first conductive pattern, the second conductive pattern, the first electrical connection unit, the second electrical connection unit and the piezoelectric unit.

[0034] In one possible implementation, the first mating surface and the second mating surface are joined to form a first flexible package, so that the piezoelectric unit is docked with the corresponding second contact electrode, and a first flexible package structure is formed, specifically including:

[0035] The first bonding surface and the second bonding surface are joined to form a first flexible package, so that the piezoelectric unit is docked with the corresponding second contact electrode, and a second flexible package structure is formed. The second flexible package structure includes the first flexible package, the first conductive pattern, the second conductive pattern and the piezoelectric unit. The first flexible package covers the first conductive pattern, the second conductive pattern and the piezoelectric unit.

[0036] The second flexible packaging structure is placed on a mold with a bent bearing surface for secondary packaging to form the first flexible packaging structure, such that at least one surface of the first flexible packaging structure in its thickness direction is obliquely intersected with the thickness direction of at least one piezoelectric unit. The first flexible packaging structure includes the second flexible packaging structure and the second flexible packaging body covering the second flexible packaging structure.

[0037] In one possible implementation, after forming the first flexible packaging structure, the method further includes the step of:

[0038] A flexible adhesive layer is formed on the surface of the first flexible packaging structure. Attached Figure Description

[0039] Figure 1 This is a connection diagram of an ultrasonic testing device provided in an embodiment of this application;

[0040] Figure 2 A perspective view of one side of an ultrasonic sensor in its thickness direction, provided as an embodiment of this application;

[0041] Figure 3 A cross-sectional view of an ultrasonic sensor at the piezoelectric unit provided in an embodiment of this application;

[0042] Figure 4 for Figure 2 A schematic diagram showing the connection between the first contact electrode and the first connection component of the ultrasonic sensor.

[0043] Figure 5 for Figure 2 A schematic diagram showing the connection between the second contact electrode and the second connection component of the ultrasonic sensor.

[0044] Figure 6 A perspective view of one side of an ultrasonic sensor in the thickness direction, provided as an embodiment of this application;

[0045] Figure 7 for Figure 6 A schematic diagram showing the connection between the first contact electrode and the first connection component of the ultrasonic sensor.

[0046] Figure 8 for Figure 6 A schematic diagram showing the connection between the second contact electrode and the second connection component of the ultrasonic sensor.

[0047] Figure 9 A perspective view of yet another ultrasonic sensor provided in an embodiment of this application;

[0048] Figure 10 A schematic diagram illustrating a method for manufacturing an ultrasonic sensor according to an embodiment of this application;

[0049] Figure 11 This is a schematic diagram illustrating another method for manufacturing an ultrasonic sensor provided in an embodiment of this application.

[0050] Explanation of reference numerals in the attached figures:

[0051] 1. Ultrasonic sensor; 2. Excitation device; 3. Processor; 4. Circuit board; 5. Cable; 6. Connector;

[0052] 100, piezoelectric module; 110, piezoelectric unit; 111, first surface; 112, second surface; 120, first contact electrode; 130, second contact electrode; 140, first electrical connection unit; 150, second electrical connection unit; 160, first piezoelectric unit row; 170, second piezoelectric unit row;

[0053] 200, First connecting component; 210, First bent wire; 220, First pin electrode;

[0054] 300, Second connecting component; 310, Second bent wire; 320, Second pin electrode;

[0055] 400. Flexible encapsulation;

[0056] 500, Flexible adhesive layer;

[0057] 600, Third bend in the conductor. Detailed Implementation

[0058] The terminology used in the implementation section of this application is only for explaining specific embodiments of this application and is not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0059] The ultrasonic testing equipment provided in this application embodiment can be applied to fields such as medicine and industrial flaw detection.

[0060] Figure 1 This is a connection diagram of an ultrasonic testing device provided in an embodiment of this application.

[0061] like Figure 1 As shown in the embodiments of this application, the ultrasonic testing device may include an excitation device 2 and an ultrasonic sensor 1. The ultrasonic sensor 1 may include a piezoelectric module 100, and the piezoelectric module 100 may include a piezoelectric unit 110. The excitation device 2 is used to be electrically connected to the piezoelectric unit 110 and to input an excitation voltage to the piezoelectric unit 110 so that the piezoelectric unit 110 generates ultrasonic waves.

[0062] In this embodiment of the application, the ultrasonic testing device may further include a processor 3, and a piezoelectric unit 110 may be electrically connected to the processor 3. The piezoelectric unit 110 is also used to receive the echo of the ultrasonic wave being reflected back, and the piezoelectric unit 110 may transmit the data of the received echo to the processor 3 for processing.

[0063] In this embodiment, the excitation device 2 and the processor 3 can both be disposed on the circuit board 4 and electrically connected to the circuit board 4. The piezoelectric unit 110 can be electrically connected to the circuit board 4 via the cable 5, so that the excitation device 2 and the processor 3 are electrically connected to the piezoelectric unit 110.

[0064] In related technologies, the piezoelectric module of an ultrasonic sensor may include multiple piezoelectric units and multiple carrier plates corresponding to the piezoelectric units and arranged in rows and columns. The carrier plates have mounting grooves, and the piezoelectric units are fixedly installed in the mounting grooves of the corresponding carrier plates. Each row of carrier plates and each column of carrier plates has a terminal block at its end. The terminal block is connected to the adjacent carrier plate through a serpentine connection structure, and two adjacent carrier plates are connected through a serpentine connection structure. The serpentine connection structure includes a serpentine planar carrier made of polyimide and copper foils respectively attached to both sides of the serpentine planar carrier. The piezoelectric units installed on each row of carrier plates are electrically connected to the terminal block at the end of the row through the serpentine connection structure, and the piezoelectric units installed on each column of carrier plates are electrically connected to the terminal block at the end of the column through the serpentine connection structure. The terminal block can be used to electrically connect to a circuit board via a cable, so that the piezoelectric units are electrically connected to the excitation device and processor on the circuit board. By setting the serpentine connection structure, the spacing between the terminal block and the carrier plate and between two adjacent carrier plates can be changed, so that the ultrasonic sensor can be stretched.

[0065] However, in related technologies, piezoelectric units require corresponding carrier plates for support, and copper foils with serpentine connection structures require serpentine planar carriers for support. The bending performance of the carrier plates and serpentine planar carriers in their normal directions is poor, resulting in poor flexibility of the formed ultrasonic sensor. This makes it difficult to attach the ultrasonic sensor to complex curved surfaces for a long time, thus greatly limiting the application scenarios of the ultrasonic sensor.

[0066] Figure 2 This is a perspective view of one side of an ultrasonic sensor in its thickness direction, provided in an embodiment of this application. Figure 3 This is a cross-sectional view of another ultrasonic sensor provided in an embodiment of this application at the piezoelectric unit. Figure 4 for Figure 2 A schematic diagram showing the connection between the first contact electrode and the first connecting assembly of the ultrasonic sensor. Figure 5 for Figure 2 A schematic diagram showing the connection between the second contact electrode and the second connection component of the ultrasonic sensor.

[0067] like Figures 2-4 As shown, and see Figure 1 Based on this, in this embodiment of the application, the piezoelectric module 100 further includes a first contact electrode 120 and a second contact electrode 130 corresponding to the piezoelectric unit 110. The piezoelectric unit 110 includes a first surface 111 and a second surface 112 opposite to each other in its thickness direction. The first contact electrode 120 is fixedly connected to the first surface 111 of the corresponding piezoelectric unit 110 and is electrically connected to the first surface 111 of the corresponding piezoelectric unit 110. The second contact electrode 130 is fixedly connected to the second surface 112 of the corresponding piezoelectric unit 110 and is electrically connected to the second surface 112 of the corresponding piezoelectric unit 110.

[0068] It is understood that the orthographic projection of the first contact electrode 120 in the thickness direction of the corresponding piezoelectric unit 110 can be located within the first surface 111 of the corresponding piezoelectric unit 110. The orthographic projection of the second contact electrode 130 in the thickness direction of the corresponding piezoelectric unit 110 can be located within the second surface 112 of the corresponding piezoelectric unit 110, so that the first contact electrode 120 and the second contact electrode 130 do not affect the area of ​​the inflexible region of the ultrasonic sensor 1.

[0069] For example, the edge of the orthographic projection of the first contact electrode 120 in the thickness direction of the corresponding piezoelectric unit 110 may coincide with the edge of the first surface 111 of the corresponding piezoelectric unit 110. The edge of the orthographic projection of the second contact electrode 130 in the thickness direction of the corresponding piezoelectric unit 110 may coincide with the edge of the second surface 112 of the corresponding piezoelectric unit 110.

[0070] For example, the piezoelectric unit 110 can be made of materials with piezoelectric properties such as piezoelectric ceramics and piezoelectric polymers. For instance, the piezoelectric unit 110 can be made of lead zirconate titanate piezoelectric ceramics (PZT) or polyvinylidene fluoride (PVDF).

[0071] For example, the first contact electrode 120 and the second contact electrode 130 may be made of conductive materials such as copper, silver, and aluminum.

[0072] For example, the first surface 111 of the piezoelectric unit 110 can be fixed to the corresponding first contact electrode 120 by soldering or by bonding with conductive adhesive, so that the first surface 111 of the piezoelectric unit 110 is electrically connected to the corresponding first contact electrode 120. The second surface 112 of the piezoelectric unit 110 can be fixed to the corresponding second contact electrode 130 by soldering or by bonding with conductive adhesive, so that the second surface 112 of the piezoelectric unit 110 is electrically connected to the corresponding second contact electrode 130.

[0073] For example, the piezoelectric unit 110 can be a cylindrical or cubic structure.

[0074] In this embodiment, the ultrasonic sensor 1 further includes a flexible package 400, which covers the piezoelectric unit 110, the first contact electrode 120, and the second contact electrode 130.

[0075] It is understandable that the flexible package 400 is flexible, that is, the flexible package 400 can be bent in its normal direction.

[0076] For example, the flexible encapsulation 400 may be formed of a flexible material such as polydimethylsiloxane (PDMS) or styrene-ethylene butylene styrene (SEBS).

[0077] In this embodiment, the ultrasonic sensor 1 further includes a first connecting component 200 and a second connecting component 300, which are spaced apart. The first connecting component 200 includes a first bent wire 210 and a first external structure. One end of the first bent wire 210 is connected to a first contact electrode 120, and the other end is connected to the first external structure, such that the first contact electrode 120 is electrically connected to the first external structure via the first bent wire 210. At least a portion of the first bent wire 210 is covered by a flexible encapsulation 400, and at least a portion of the first external structure is exposed outside the flexible encapsulation 400. The second connecting component 300 includes a second bent wire 310 and a second external structure. One end of the second bent wire 310 is connected to a second contact electrode 130, and the other end is connected to the second external structure, such that the second contact electrode 130 is electrically connected to the second external structure via the second bent wire 310. At least a portion of the second bent wire 310 is covered by the flexible encapsulation 400, and at least a portion of the second external structure is exposed outside the flexible encapsulation 400.

[0078] It is understandable that the first bent wire 210, the second bent wire 310, and the second external structure are all spaced apart, and the second bent wire 310 is also spaced apart from the first bent wire 210 and the first external structure.

[0079] It is understood that the first bent conductor 210 and the second bent conductor 310 may be, but are not limited to, serpentine, arc-shaped, or zigzag structures.

[0080] For example, the first bent wire 210, the second bent wire 310, the first external structure, and the second external structure can be made of conductive materials such as copper, silver, and aluminum.

[0081] In this way, the piezoelectric unit 110, the first connecting component 200, and the second connecting component 300 can all be supported by the flexible package 400, eliminating the need for other supporting structures for the piezoelectric unit 110, the first connecting component 200, and the second connecting component 300. The flexible package 400 has good bending performance in its normal direction. The first contact electrode 120 is electrically connected to the first external structure through the first bent wire 210, and the second contact electrode 130 is electrically connected to the second external structure through the second bent wire 310. The first bent wire 210 and the second bent wire 310 can be stretched and bent. The electrical connection between the first contact electrode 120 and the first external structure, and the electrical connection between the second contact electrode 130 and the second external structure, have little impact on the flexibility of the flexible package 400. The ultrasonic sensor 1 has fewer inflexible parts and a smaller inflexible area, which gives the ultrasonic sensor 1 better flexibility. This allows the ultrasonic sensor 1 to be attached to relatively complex curved surfaces for a long time, which is beneficial for broadening the application scenarios of the ultrasonic sensor 1. In addition, the flexible package 400 can also provide a moisture barrier for the electrical structures such as the piezoelectric unit 110, the first contact electrode 120, and the second contact electrode 130 it encapsulates, thus protecting the electrical structures such as the piezoelectric unit 110, the first contact electrode 120, and the second contact electrode 130 encapsulated by the flexible package 400.

[0082] It is understood that the first and second external structures of the ultrasonic sensor 1 can be electrically connected to the connector 6. The connector 6 is electrically connected to the circuit board 4 via the cable 5. The first and second external structures can be electrically connected to the excitation device 2 and the processor 3 via the connector 6, the cable 5, and the circuit board 4, so that the piezoelectric unit 110 can be electrically connected to the excitation device 2 and the processor 3. For example, the connection between the first and second external structures and the connector 6 can be encapsulated by an encapsulation structure to ensure a stable electrical connection between the connector 6 and the first and second external structures. In addition, the encapsulation structure can also provide a moisture barrier for the connection between the first and second external structures and the connector 6 to protect the first and second external structures.

[0083] Understandably, the first external structure can be completely exposed by the flexible package 400. In this case, the first bent wire 210 can be partially covered by the flexible package 400 and partially exposed. Similarly, the second external structure can be completely exposed by the flexible package 400. In this case, the second bent wire 310 can be partially covered by the flexible package 400 and partially exposed.

[0084] The ultrasonic testing device provided in this application embodiment can be a wearable device that can be worn on a person or animal, such as a smart watch, smart bracelet, smart belt, smart glasses, or smart leg protector. When the ultrasonic testing device is a wearable device, the ultrasonic sensor 1 can be attached to the surface of the object to be tested on one side of its thickness direction.

[0085] The ultrasonic testing device provided in this application embodiment can also be a non-wearable device such as an ultrasonic testing instrument. When the ultrasonic testing device is a non-wearable device, it can also include a rigid probe. One side surface of the ultrasonic sensor 1 in the thickness direction can be attached to the surface of the probe to cover it. The probe with the ultrasonic sensor 1 attached can be inserted into the area to be tested for detection. In this way, the structure that comes into contact with the object under test is flexible, which can reduce damage to the object under test caused by impact or other factors. For example, when it is necessary to detect the throat of a human body, the probe with the ultrasonic sensor 1 attached can be inserted into the throat of the human body. The flexible structure that comes into contact with the throat of the human body can reduce stimulation to the throat and reduce damage to the throat.

[0086] In some examples, the first bent wire 210 and the second bent wire 310 are both serpentine linear structures, which allows the first bent wire 210 and the second bent wire 310 to be stretched and bent to a large extent, which is beneficial to the stretching and contraction of the ultrasonic sensor 1.

[0087] In some examples, the first contact electrode 120, the first bent wire 210, and the first external structure can be made of the same material, forming a single integrated structure. This facilitates the forming of the first contact electrode 120, the first bent wire 210, and the first external structure, and also ensures more stable current transmission between them. For example, the first contact electrode 120, the first bent wire 210, and the first external structure can be formed by laser cutting from the same copper foil.

[0088] In some examples, the second contact electrode 130, the second bent wire 310, and the second external structure can be made of the same material, forming a single integral structure. This facilitates the forming of the second contact electrode 130, the second bent wire 310, and the second external structure, and also ensures more stable current transmission between them. For example, the second contact electrode 130, the second bent wire 310, and the second external structure can be formed by laser cutting from the same copper foil.

[0089] In embodiments of this application, the piezoelectric module 100 includes a plurality of piezoelectric units 110 spaced apart.

[0090] This improves the resolution of ultrasonic detection by the ultrasonic sensor 1. Furthermore, different piezoelectric units 110 can be used to generate and receive the reflected echoes of the ultrasonic waves, which helps reduce the impact of phantom echoes on ultrasonic detection, reduces the detection blind zone, and improves the near-surface detection capability of the ultrasonic sensor 1.

[0091] It is understandable that when the piezoelectric module 100 includes multiple piezoelectric units 110, the thickness direction of all piezoelectric units 110 can be the same as the thickness direction of the ultrasonic sensor 1, or the thickness direction of some or all of the piezoelectric units 110 can be oblique to the thickness direction of the ultrasonic sensor 1.

[0092] In some embodiments where the piezoelectric module 100 includes a plurality of piezoelectric units 110 spaced apart, the first connection component 200 includes a plurality of first bent wires 210 corresponding to and spaced apart from the piezoelectric units 110, and the first external structure includes a plurality of first pin electrodes 220 corresponding to and spaced apart from the piezoelectric units 110. The first pin electrodes 220 are at least partially exposed outside the flexible package 400, and the first contact electrode 120 electrically connected to each piezoelectric unit 110 is electrically connected to the corresponding first pin electrode 220 through the corresponding first bent wire 210. The second connection component 300 includes a plurality of second bent wires 310 corresponding to and spaced apart from the piezoelectric units 110, and the second external structure includes a plurality of second pin electrodes 320 corresponding to and spaced apart from the piezoelectric units 110. The second pin electrodes 320 are at least partially exposed outside the flexible package 400, and the second contact electrode 130 electrically connected to each piezoelectric unit 110 is electrically connected to the corresponding second pin electrode 320 through the corresponding second bent wire 310.

[0093] In some embodiments where the piezoelectric module 100 includes a plurality of piezoelectric units 110 spaced apart, the piezoelectric module 100 includes a plurality of piezoelectric units 110 spaced apart. The first connection component 200 includes a plurality of first bent wires 210 corresponding to and spaced apart from the piezoelectric units 110. The first external structure includes a plurality of first pin electrodes 220 corresponding to and spaced apart from the piezoelectric units 110. The first pin electrodes 220 are at least partially exposed in the flexible package 400. The first contact electrode 120 of each piezoelectric unit 110 is electrically connected to the corresponding first pin electrode 220 through the corresponding first bent wire 210. That is, the first contact electrode 120 of each piezoelectric unit 110 is independent of each other and is independently electrically connected to the corresponding first pin electrode 220. The second external structure includes a second pin electrode 320, which at least partially exposes the flexible package 400. All the second contact electrodes 130 are electrically connected to the same second pin electrode 320 via a second bent wire 310, that is, all the second contact electrodes 130 are connected to the same second pin electrode 320.

[0094] In this way, when multiple piezoelectric units 110 need to be excited, only the excitation voltage needs to be input to the corresponding multiple first pin electrodes 220 and one second pin electrode 320, which makes it more convenient to excite multiple piezoelectric units 110 and more flexible to control the piezoelectric units 110. In addition, it also helps to reduce the number of second bent wires 310 and second pin electrodes 320, which helps to improve the integration of the ultrasonic sensor 1 and reduce the size of the ultrasonic sensor 1.

[0095] It is understood that by inputting an excitation voltage to the same second pin electrode 320 electrically connected to all the second contact electrodes 130 and the same second pin electrode 220 corresponding to the piezoelectric unit 110 to be excited, the piezoelectric unit 110 to be excited can be excited. For example, when one piezoelectric unit 110 needs to be excited, an excitation voltage is input to the first pin electrode 220 corresponding to that piezoelectric unit 110 and the same second pin electrode 320 electrically connected to all the second contact electrodes 130, thus exciting that piezoelectric unit 110. When three piezoelectric units 110 need to be excited, an excitation voltage is input to the three first pin electrodes 220 corresponding to those three piezoelectric units 110 and the same second pin electrode 320 electrically connected to all the second contact electrodes 130, thus exciting those three piezoelectric units 110. These three piezoelectric units 110 can be arbitrarily distributed.

[0096] Understandably, the second pin electrode 320 can be used for grounding. The second pin electrode 320 can be electrically connected to the ground terminal of connector 6.

[0097] In some implementations where all the second contact electrodes 130 are electrically connected to the same second pin electrode 320 via second bent wires 310, the first connection assembly 200 may include multiple second bent wires 310 corresponding to the piezoelectric unit 110, and each second contact electrode 130 electrically connected to the piezoelectric unit 110 is electrically connected to the same second pin electrode 320 via a corresponding second bent wire 310.

[0098] In other embodiments, the ultrasonic sensor 1 further includes a third bent wire 600, which is spaced apart from the first connection assembly 200, in which all the second contact electrodes 130 are electrically connected to the same second pin electrode 320 via the second bent wire 310. All the second contact electrodes 130 are electrically connected to each other via the third bent wire 600, and one of the second contact electrodes 130 is electrically connected to the second pin electrode 320 via the second bent wire 310, such that all the second contact electrodes 130 are electrically connected to the same second pin electrode 320 via the second bent wire 310. The flexible package 400 covers the third bent wire 600.

[0099] In this way, the electrical connection wiring between multiple second contact electrodes 130 and the same second pin electrode 320 is relatively simple, and the wiring on the flexible package 400 is relatively easy, which is conducive to improving the integration of the ultrasonic sensor 1 and reducing the size of the ultrasonic sensor 1.

[0100] It is understandable that the third bent wire 600 is spaced apart from the first bent wire 210 and the first pin electrode 220.

[0101] It is understood that the third bend conductor 600 may include, but is not limited to, a serpentine structure, an arc structure, or a zigzag structure.

[0102] For example, the third bent wire 600 may be made of conductive materials such as copper, silver, or aluminum.

[0103] In some examples, the second contact electrode 130, the second bent wire 310, the third bent wire 600, and the second external structure can be made of the same material, forming a single integrated structure. This facilitates the forming of the second contact electrode 130, the second bent wire 310, the third bent wire 600, and the second external structure. Furthermore, the current transmission between the second contact electrode 130, the second bent wire 310, the third bent wire 600, and the second external structure is more stable. For example, the second contact electrode 130, the second bent wire 310, the third bent wire 600, and the second external structure can be formed by laser cutting from the same copper foil.

[0104] In this application, the orthographic projection of the first connecting component 200 in the thickness direction of the ultrasonic sensor 1 and the orthographic projection of the second connecting component 300 in the thickness direction of the ultrasonic sensor 1 are spaced apart.

[0105] This allows the first connecting component 200 and the second connecting component 300 to be spaced apart, and parts of the first connecting component 200 and the second connecting component 300 can be located on the same layer in the thickness direction of the ultrasonic sensor 1, making it easier for the flexible package 400 to encapsulate electrical structures such as the piezoelectric unit 110.

[0106] It is understood that the flexible package 400 can be formed by joining a first flexible package layer and a second flexible package layer. The surface of the first flexible package layer for joining with the second flexible package layer is provided with a first connecting component 200 and a first contact electrode 120. The surface of the second flexible package layer for joining with the first flexible package layer is provided with a second connecting component 300 and a second contact electrode 130. The orthographic projection of the first connecting component 200 in the thickness direction of the ultrasonic sensor 1 and the orthographic projection of the second connecting component 300 in the thickness direction of the ultrasonic sensor 1 are spaced apart, which is beneficial to forming a flexible package 400 for encapsulating electrical structures such as the piezoelectric unit 110 by joining the first flexible package layer and the second flexible package layer, and to space the first connecting component 200 and the second connecting component 300 apart.

[0107] It is understood that the portion of the first connecting component 200 covered by the flexible package 400 can be used to contact the flexible package 400 on both sides of its thickness direction. Similarly, the portion of the second connecting component 300 covered by the flexible package 400 can be used to contact the flexible package 400 on both sides of its thickness direction.

[0108] In this embodiment of the application, the piezoelectric module 100 further includes a first electrical connection unit 140 corresponding to the piezoelectric unit 110. The first electrical connection unit 140 and the first contact electrode 120 are sequentially stacked on the first surface 111 of the corresponding piezoelectric unit 110. The first surface 111 of the piezoelectric unit 110 is joined and fixed to the corresponding first contact electrode 120 through the corresponding first electrical connection unit 140, so that the first surface 111 of the piezoelectric unit 110 is electrically connected to the corresponding first contact electrode 120 through the corresponding first electrical connection unit 140.

[0109] For example, the first electrical connection unit 140 may be formed by solder paste or silver paste coated on the first surface 111 of the corresponding piezoelectric unit 110.

[0110] This makes it easier to fix the first contact electrode 120 to the first surface 111 of the corresponding piezoelectric unit 110 and to make the first contact electrode 120 electrically connected to the first surface 111 of the corresponding piezoelectric unit 110. The electrical connection between the first contact electrode 120 and the first surface 111 of the corresponding piezoelectric unit 110 is relatively stable.

[0111] In this application, the piezoelectric module 100 further includes a second electrical connection unit 150 corresponding to the piezoelectric unit 110. The second electrical connection unit 150 and the second contact electrode 130 are sequentially stacked on the second surface 112 of the corresponding piezoelectric unit 110. The second surface 112 of the piezoelectric unit 110 is joined and fixed to the corresponding second contact electrode 130 through the corresponding second electrical connection unit 150, so that the second surface 112 of the piezoelectric unit 110 is electrically connected to the corresponding second contact electrode 130 through the corresponding second electrical connection unit 150.

[0112] For example, the second electrical connection unit 150 may be formed by solder paste or silver paste coated on the second surface 112 of the corresponding piezoelectric unit 110.

[0113] This facilitates fixing the second contact electrode 130 to the second surface 112 of the corresponding piezoelectric unit 110 and making the second contact electrode 130 electrically connected to the second surface 112 of the corresponding piezoelectric unit 110, resulting in a more stable electrical connection between the second contact electrode 130 and the second surface 112 of the corresponding piezoelectric unit 110.

[0114] It is understood that the orthographic projection of the first electrical connection unit 140 in the thickness direction of the corresponding piezoelectric unit 110 can be located within the first surface 111 of the corresponding piezoelectric unit 110. The orthographic projection of the second electrical connection unit 150 in the thickness direction of the corresponding piezoelectric unit 110 can be located within the second surface 112 of the corresponding piezoelectric unit 110, so that the first electrical connection unit 140 and the second electrical connection unit 150 do not affect the area of ​​the inflexible region of the ultrasonic sensor 1.

[0115] For example, the edge of the orthographic projection of the first electrical connection unit 140 in the thickness direction of the corresponding piezoelectric unit 110 may coincide with the edge of the first surface 111 of the corresponding piezoelectric unit 110. The edge of the orthographic projection of the first electrical connection unit 140 in the thickness direction of the corresponding piezoelectric unit 110 may coincide with the edge of the second surface 112 of the corresponding piezoelectric unit 110.

[0116] In this application, the flexible package 400 has a flexible adhesive layer 500 on at least one side of its thickness direction. The flexible adhesive layer 500 can be used to attach to the surface of the object to be tested or the probe.

[0117] This makes it easy to attach the ultrasonic sensor 1 to the surface of the object to be tested or the probe, easy to fix the ultrasonic sensor 1, and easy to attach the ultrasonic sensor 1 tightly to the surface of a biological body or other complex curved surfaces for a long time.

[0118] It is understood that the flexible adhesive layer 500 can be provided on one surface in the thickness direction of the flexible package 400. Alternatively, the flexible adhesive layer 500 can be provided on both surfaces in the thickness direction of the flexible package 400.

[0119] In this application, the flexible adhesive layer 500 is formed of hydrogel.

[0120] Thus, the hydrogel possesses strong biocompatibility, and the flexible adhesive layer 500 formed by the hydrogel facilitates close adhesion to the surface of a living organism. Furthermore, when the flexible adhesive layer 500 is attached to the surface of the organism, the hydrogel can absorb excess moisture from the surface, minimizing its impact on aerobic respiration and reducing bacterial growth, thus improving wearing comfort when the organism sweats. Additionally, when the surface of the organism is dry, the hydrogel can retain its internal moisture, further enhancing wearing comfort. Moreover, the hydrogel can absorb surrounding moisture to act as an ultrasonic coupling agent, eliminating the need to apply an ultrasonic coupling agent to the surface of the object before attaching the ultrasonic sensor 1, thus facilitating ultrasonic testing.

[0121] In this application, the flexible adhesive layer 500 is formed of a water-loss resistant material.

[0122] In this way, the area where the flexible adhesive layer 500 is attached can remain moist for a longer period of time. The moist flexible adhesive layer 500 can be used as an ultrasonic coupling agent for a longer period of time, which is beneficial for long-term ultrasonic monitoring of the object under test.

[0123] It is understood that anti-water loss materials have water-locking and moisture-retaining properties, and can be selected as needed to form the flexible adhesive layer 500 by maintaining hydration at room temperature for 1 week, 1 month, 2 months, etc. For example, the anti-water loss material can be a material that maintains hydration at room temperature for at least 6 months.

[0124] For example, the anti-water loss material is a material with a water-locking substance, which may include, but is not limited to, at least one of glycerol, ethylene glycol, ionic liquid, etc.

[0125] In this embodiment, the flexible adhesive layer 500 can be formed of an anti-dehydration hydrogel. For example, the anti-dehydration hydrogel can be a glycerol gel, which can be made by partially replacing the water in the polyacrylamide hydrogel with glycerol.

[0126] In this way, the anti-water loss hydrogel can absorb the surrounding moisture to keep its surface moist for a longer period of time. When the ultrasonic sensor 1 is attached to the object under test through the flexible adhesive layer 500, the ultrasonic sensor 1 can work continuously without the need to coat the object under test with an ultrasonic coupling agent, which is beneficial for long-term ultrasonic monitoring of the object under test.

[0127] In this application, the acoustic impedance of the flexible adhesive layer 500 is less than that of the flexible package 400.

[0128] In this way, the interface between the flexible adhesive layer 500 and the flexible package 400 has little impact on the transmission of the echo of the ultrasonic wave generated by the piezoelectric unit 110, which is beneficial for the piezoelectric unit 110 to receive the echo.

[0129] Understandably, the acoustic impedance of the flexible adhesive layer 500 is greater than the acoustic impedance of the surface of the object under test it contacts. In other words, the acoustic impedance of the flexible adhesive layer 500 lies between the acoustic impedance of the surface of the object under test it contacts and the acoustic impedance of the flexible encapsulation 400. For example, when the flexible adhesive layer 500 is adhered to human skin, its acoustic impedance lies between the acoustic impedance of the human skin and the acoustic impedance of the flexible encapsulation 400.

[0130] In this application, the flexible adhesive layer 500 covers the flexible encapsulation body 400.

[0131] Thus, the flexible adhesive layer 500 is easily formed on the surface of the flexible package 400. Furthermore, the ultrasonic sensor 1 can be attached to the surface of the object under test or the probe on both sides of its thickness direction, making the ultrasonic sensor 1 convenient to use.

[0132] It is understandable that when the ultrasonic sensor 1 is attached to the object under test, it can be attached to the surface of the object under test through the flexible adhesive layer 500 on either side of the ultrasonic sensor 1 in the thickness direction. When the ultrasonic sensor 1 is attached to the probe, it can be attached to the surface of the probe through the flexible adhesive layer 500 on either side of the ultrasonic sensor 1 in the thickness direction.

[0133] In this application, the thickness of the portion of the flexible package 400 opposite to the first surface 111 of the piezoelectric unit 110 is equal to an odd multiple of one-quarter of the wavelength of the ultrasonic wave generated by the piezoelectric unit 110 propagating within the flexible package 400. In this way, the interference of ultrasonic waves transmitted between the first surface 111 and the object under test is small, and the surface of the ultrasonic sensor 1 facing the first surface 111 can be attached to the object under test.

[0134] In this application, the thickness of the portion of the flexible package 400 opposite to the second surface 112 of the piezoelectric unit 110 is equal to an odd multiple of one-quarter of the wavelength of the ultrasonic wave generated by the piezoelectric unit 110 propagating within the flexible package 400. In this way, the interference of ultrasonic waves transmitted between the second surface 112 and the object under test is small, and the surface of the ultrasonic sensor 1 facing the second surface 112 can be attached to the object under test.

[0135] In some embodiments of this application, the piezoelectric module 100 includes two rows of piezoelectric unit rows arranged side by side, each row of piezoelectric unit rows including a plurality of piezoelectric units 110 spaced apart along its extension direction, and the piezoelectric units 110 of the two rows of piezoelectric unit rows are arranged facing each other.

[0136] Figure 6 A perspective view of one side of an ultrasonic sensor in the thickness direction, provided in an embodiment of this application. Figure 7 for Figure 6 A schematic diagram showing the connection between the first contact electrode and the first connecting assembly of the ultrasonic sensor. Figure 8 for Figure 6 A schematic diagram showing the connection between the second contact electrode and the second connection component of the ultrasonic sensor.

[0137] like Figures 6-8As shown, in some embodiments of this application, the piezoelectric module 100 includes a first piezoelectric unit row 160 and a second piezoelectric unit row 170 arranged side by side. The first piezoelectric unit row 160 includes a plurality of piezoelectric units 110 spaced apart along its extending direction, and the second piezoelectric unit row 170 includes a plurality of piezoelectric units 110 spaced apart along its extending direction. Along the extending direction of the first piezoelectric unit row 160, the piezoelectric units 110 of the first piezoelectric unit row 160 and the piezoelectric units 110 of the second piezoelectric unit row 170 are arranged alternately.

[0138] In this way, the piezoelectric units 110 are arranged more densely in the extending direction of the first piezoelectric unit row 160, which helps to improve the resolution of the ultrasound sensor 1 in the extending direction of the first piezoelectric unit row 160. This facilitates more accurate positioning when performing ultrasound detection on blood vessels, etc.

[0139] Figure 9 This is a perspective view of another ultrasonic sensor provided in an embodiment of this application. In the figure, x1, x2, and x3 represent the thickness directions of three different piezoelectric units 110.

[0140] In this embodiment of the application, at least one surface of the ultrasonic sensor 1 in its thickness direction is obliquely intersected with the thickness direction of at least one piezoelectric unit 110.

[0141] In this way, the ultrasonic waves generated by at least one piezoelectric unit 110 can be transmitted at a certain angle to at least one side surface of the ultrasonic sensor 1 in its thickness direction, so that the ultrasonic waves generated by at least one piezoelectric unit 110 can have a certain angle with the object to be detected, which is beneficial for the application of the ultrasonic sensor 1 in scenarios such as blood flow ultrasound detection, where ultrasonic waves need to be injected into the surface of the object to be detected at a certain angle.

[0142] It is understandable that when the flexible package 400 has a flexible adhesive layer 500 on its surface, the surface of the ultrasonic sensor 1 can be the surface of the flexible adhesive layer 500. When the flexible package 400 does not have a flexible adhesive layer 500 on its surface, the surface of the ultrasonic sensor 1 can be the surface of the flexible package 400.

[0143] Figure 10 This is a schematic diagram of a method for manufacturing an ultrasonic sensor according to an embodiment of this application.

[0144] like Figure 10 As shown, and see Figures 2-8 The manufacturing method of the ultrasonic sensor 1 provided in this application includes the following steps:

[0145] S100: Prepare a first flexible encapsulation layer, wherein the first flexible encapsulation layer includes a first bonding surface.

[0146] Understandably, the first flexible encapsulation layer can be formed from flexible materials such as polydimethylsiloxane (PDMS) or styrene-ethylene butylene styrene (SEBS).

[0147] Specifically, step S100 may include:

[0148] A layer of release agent is sprayed onto the surface of the first substrate.

[0149] A flexible material is coated on the surface of a first substrate sprayed with a release agent to form a first flexible encapsulation layer, the surface of the first flexible encapsulation layer facing away from the first substrate being a first bonding surface.

[0150] Understandably, the thickness of the first flexible encapsulation layer can be an odd multiple of one-quarter of the wavelength of the ultrasonic wave generated by the piezoelectric unit 110 that propagates within the first flexible encapsulation layer.

[0151] S200: Prepare a second flexible encapsulation layer, wherein the second flexible encapsulation layer includes a second bonding surface.

[0152] Understandably, the second flexible encapsulation layer can be formed from flexible materials such as polydimethylsiloxane (PDMS) or styrene-ethylene butylene styrene (SEBS).

[0153] Specifically, step S200 may include:

[0154] A transparent carrier plate is fixedly connected to the surface of the second substrate, wherein the transparent carrier plate can be a polyimide plate.

[0155] A flexible material is coated on the surface of a transparent substrate to form a second flexible encapsulation layer, the surface of which faces away from the second substrate as a second bonding surface.

[0156] Understandably, the thickness of the second flexible encapsulation layer can be an odd multiple of one-quarter of the wavelength of the ultrasonic wave generated by the piezoelectric unit 110 that propagates within the second flexible encapsulation layer.

[0157] S300: A first conductive layer is provided on the first bonding surface, and the first conductive layer is processed to form a first conductive pattern on the first bonding surface. The first conductive pattern includes a first contact electrode 120, a first bent wire 210, and a first external structure. The first contact electrode 120 is connected to the first external structure through the first bent wire 210, and the first contact electrode 120 corresponds to the piezoelectric unit 110.

[0158] Specifically, step S300 may include:

[0159] A conductive foil is laid on the first bonding surface to form a first conductive layer. The conductive foil laid on the first bonding surface can be silver foil, copper foil, aluminum foil, etc.

[0160] The first conductive layer is laser-cut to form a first conductive pattern on the first bonding surface.

[0161] S400: A second conductive layer is provided on the second bonding surface, and the second conductive layer is processed to form a second conductive pattern on the second bonding surface. The second conductive pattern includes a second contact electrode 130, a second bent wire 310, and a second external structure. The second contact electrode 130 is connected to the second external structure through the second bent wire 310, and the second contact electrode 130 corresponds to the piezoelectric unit 110.

[0162] Specifically, step S400 may include:

[0163] A conductive foil is laid on the second bonding surface to form a second conductive layer. The conductive foil laid on the second bonding surface can be silver foil, copper foil, aluminum foil, etc.

[0164] The second conductive layer is laser-cut to form a second conductive pattern on the first bonding surface.

[0165] S500: Connect the piezoelectric unit 110 to the corresponding first contact electrode 120.

[0166] Specifically, step S500 includes:

[0167] S510: A first electrical connection unit 140 is provided on the first contact electrode 120.

[0168] Specifically, step S510 may include:

[0169] The first printing module is laid on the first bonding surface on which the first conductive pattern is formed, wherein the first printing module has mesh holes corresponding to the first contact electrode 120.

[0170] Conductive coating is printed on the first contact electrode 120 by the first printing module. The conductive coating may be solder paste, silver paste, etc.

[0171] Remove the first printed module so that the conductive coating on the first contact electrode 120 forms the first electrical connection unit 140.

[0172] S520: After step S510 is completed, the piezoelectric unit 110 is connected to the first electrical connection unit 140 provided on the corresponding first contact electrode 120, so that the piezoelectric unit 110 and the corresponding first contact electrode 120 are connected through the first electrical connection unit 140 between them.

[0173] Specifically, step S520 includes:

[0174] The mounting module is laid on the first mating surface where the first electrical connection unit 140 is formed, wherein the mounting module has mesh holes corresponding to the first electrical connection unit 140.

[0175] A piezoelectric unit 110 is installed in the mesh of the mounting module, and the piezoelectric unit 110 is connected to the first electrical connection unit 140 provided on the corresponding first contact electrode 120.

[0176] Remove the installation module.

[0177] S600: A second electrical connection unit 150 is provided on the second contact electrode 130.

[0178] Specifically, step S600 includes:

[0179] The second printing module is laid on the second bonding surface on which the second conductive pattern is formed, wherein the second printing module has mesh holes corresponding to the second contact electrode 130.

[0180] The conductive coating is printed on the second contact electrode 130 by the second printing module. The conductive coating can be solder paste, silver paste, etc.

[0181] Remove the second printed module so that the conductive coating on the second contact electrode 130 forms the second electrical connection unit 150.

[0182] S700: After S500 and S600 are completed, the first bonding surface and the second bonding surface are joined to form a first flexible package, so that the piezoelectric unit 110 is docked with the corresponding second contact electrode 130 and a first flexible package structure is formed. The first flexible package structure includes a first flexible package, a first conductive pattern, a second conductive pattern and a piezoelectric unit 110. The first flexible package covers the first conductive pattern, the second conductive pattern and the piezoelectric unit 110.

[0183] Step S700 specifically includes:

[0184] S710: After S500 and S600 are completed, the first mating surface and the second mating surface are joined to form a first flexible package, so that the piezoelectric unit 110 is docked on the second electrical connection unit 150 provided on the corresponding second contact electrode 130, so that the piezoelectric unit 110 and the corresponding second contact electrode 130 are docked through the second electrical connection unit 150 between them, and a first flexible package structure is formed. The first flexible package structure includes a first flexible package, a first conductive pattern, a second conductive pattern, a first electrical connection unit 140, a second electrical connection unit 150 and a piezoelectric unit 110. The first flexible package covers the first conductive pattern, the second conductive pattern, the first electrical connection unit 140, the second electrical connection unit 150 and the piezoelectric unit 110.

[0185] Specifically, step S710 includes:

[0186] After S500 and S600 are completed, remove the first substrate and the second substrate.

[0187] The second bonding surface is covered by a transparent carrier plate and attached to the first bonding surface, so that the first bonding surface and the second bonding surface are joined to form a first flexible package, so that the piezoelectric unit 110 is docked on the second electrical connection unit 150 provided on the corresponding second contact electrode 130, so that the piezoelectric unit 110 and the corresponding second contact electrode 130 are docked through the second electrical connection unit 150 between them, and the first flexible package structure is formed.

[0188] Remove the transparent substrate.

[0189] S800: Exposing at least a portion of the first external structure and at least a portion of the second external structure to the first flexible package.

[0190] It is understood that a window may be opened on at least one of the first and second encapsulation layers before the first bonding surface and the second bonding surface are joined to form the first flexible package, so that at least a portion of the first external structure and at least a portion of the second external structure are exposed through the window to the first flexible package after the first bonding surface and the second bonding surface are joined to form the first flexible package.

[0191] It is understandable that, after the first mating surface and the second mating surface are joined to form the first flexible package, a window may be opened on the first flexible package to expose at least a portion of the first external structure and at least a portion of the second external structure.

[0192] S900: After step S700 is completed, a flexible adhesive layer 500 is formed on the surface of the first flexible packaging structure.

[0193] It is understandable that the flexible adhesive layer 500 can be formed on the surface of the first flexible encapsulation structure by chemical grafting.

[0194] Specifically, step S900 may include:

[0195] A nitrogen gas flow is used to dry the surface of the first flexible packaging structure in order to activate the surface of the first flexible packaging structure.

[0196] The first flexible encapsulation structure, after being dried by a nitrogen gas flow, is immersed in a hydrophobic initiator for a predetermined time.

[0197] The first flexible encapsulation structure, after being immersed in the hydrophobic initiator for a preset time, is immersed in an aqueous solution containing a hydrogel monomer containing a hydrophilic initiator and glycerol, and then irradiated with ultraviolet light to graft the glycerol gel onto the surface of the first flexible encapsulation structure.

[0198] Thus, the process for preparing the flexible ultrasonic sensor 1 is simple, efficient, and has a low manufacturing cost, making it easy to prepare the ultrasonic sensor 1 with a large-area piezoelectric unit array 110.

[0199] Figure 11 This is a schematic diagram illustrating another method for manufacturing an ultrasonic sensor provided in an embodiment of this application.

[0200] like Figure 11 As shown, and see Figure 9 In some embodiments of this application, to form an ultrasonic sensor 1 in which at least one surface of the ultrasonic sensor 1 in its thickness direction is obliquely perpendicular to the thickness direction of at least one piezoelectric unit 110, step S700 may specifically include:

[0201] S720: The first bonding surface and the second bonding surface are joined to form a first flexible package, so that the piezoelectric unit 110 is docked with the corresponding second contact electrode 130 and a second flexible package structure is formed. The second flexible package structure includes a first flexible package, a first conductive pattern, a second conductive pattern and a piezoelectric unit 110. The first flexible package covers the first conductive pattern, the second conductive pattern and the piezoelectric unit 110.

[0202] Specifically, the first bonding surface and the second bonding surface are joined to form a first flexible package, so that the piezoelectric unit 110 is mated to the second electrical connection unit 150 provided on the corresponding second contact electrode 130, and the piezoelectric unit 110 and the corresponding second contact electrode 130 are mated through the second electrical connection unit 150 between them to form a second flexible package structure. The second flexible package structure includes a first flexible package, a first conductive pattern, a second conductive pattern, a first electrical connection unit 140, a second electrical connection unit 150 and a piezoelectric unit 110. The first flexible package covers the first conductive pattern, the second conductive pattern, the first electrical connection unit 140, the second electrical connection unit 150 and the piezoelectric unit 110.

[0203] S730: The second flexible packaging structure is placed on a mold with a bent bearing surface for secondary packaging to form a first flexible packaging structure, such that at least one side surface of the first flexible packaging structure in its thickness direction is obliquely intersecting the thickness direction of at least one piezoelectric unit 110. The first flexible packaging structure includes a second flexible packaging structure and a second flexible packaging body covering the second flexible packaging structure.

[0204] It is understandable that the first flexible package and the second flexible package can be made of the same material to facilitate the bonding of the second flexible package to the surface of the first flexible package.

[0205] It is understandable that when the second flexible packaging structure is not used for secondary packaging, the flexible package 400 of the ultrasonic sensor 1 includes the first flexible package. After the second flexible packaging structure is used for secondary packaging, the flexible package 400 of the ultrasonic sensor 1 includes the first flexible package and the second flexible package.

[0206] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0207] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0208] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An ultrasonic sensor, characterized by It includes a piezoelectric module, a first connecting component, a second connecting component, and a flexible package; The piezoelectric module includes a piezoelectric unit and a first contact electrode and a second contact electrode corresponding to the piezoelectric unit; The piezoelectric unit includes a first surface and a second surface opposite to each other in its thickness direction. The first contact electrode is fixedly connected to the first surface of the corresponding piezoelectric unit and is electrically connected to the first surface of the corresponding piezoelectric unit. The second contact electrode is fixedly connected to the second surface of the corresponding piezoelectric unit and is electrically connected to the second surface of the corresponding piezoelectric unit. The flexible package covers the piezoelectric unit, the first contact electrode, and the second contact electrode. The first connecting component and the second connecting component are spaced apart, and the orthographic projection of the first connecting component in the thickness direction of the ultrasonic sensor and the orthographic projection of the second connecting component in the thickness direction of the ultrasonic sensor are distributed at intervals. The first connection component includes a first bent wire and a first external structure. One end of the first bent wire is connected to the first contact electrode and the other end is connected to the first external structure, such that the first contact electrode is electrically connected to the first external structure through the first bent wire. At least a portion of the first bent wire is covered by the flexible encapsulation, and at least a portion of the first external structure is exposed to the flexible encapsulation. The second connection component includes a second bent wire and a second external structure. One end of the second bent wire is connected to the second contact electrode and the other end is connected to the second external structure, such that the second contact electrode is electrically connected to the second external structure through the second bent wire. At least a portion of the second bent wire is covered by the flexible package, and at least a portion of the second external structure is exposed to the flexible package. The piezoelectric module includes a plurality of piezoelectric units spaced apart; The first connection component includes a plurality of first bent wires corresponding to and spaced apart from the piezoelectric unit, and the first external structure includes a plurality of first pin electrodes corresponding to and spaced apart from the piezoelectric unit. The first pin electrodes are at least partially exposed in the flexible package. The first contact electrode electrically connected to each piezoelectric unit is electrically connected to the corresponding first pin electrode through the corresponding first bent wire. The second external structure includes a second pin electrode, which is at least partially exposed in the flexible package, and all the second contact electrodes are electrically connected to the same second pin electrode via the second bent wire.

2. The ultrasonic sensor of claim 1, wherein, It also includes a third bent wire, which is spaced apart from the first connecting component; All the second contact electrodes are electrically connected to each other via the third bent wire, and one of the second contact electrodes is electrically connected to the second pin electrode via the second bent wire, such that all the second contact electrodes are electrically connected to the same second pin electrode via the second bent wire, and the flexible package covers the third bent wire.

3. The ultrasonic sensor according to any one of claims 1-2, wherein, The piezoelectric module includes a first row of piezoelectric units and a second row of piezoelectric units arranged in parallel. The first piezoelectric unit row includes a plurality of piezoelectric units spaced apart along its extending direction, and the second piezoelectric unit row includes a plurality of piezoelectric units spaced apart along its extending direction; Along the extending direction of the first piezoelectric unit row, the piezoelectric units of the first piezoelectric unit row and the piezoelectric units of the second piezoelectric unit row are arranged alternately.

4. The ultrasonic sensor according to any one of claims 1-2, characterized in that, The piezoelectric module further includes a first electrical connection unit and a second electrical connection unit corresponding to the piezoelectric unit; The first electrical connection unit and the first contact electrode are stacked sequentially on the first surface of the corresponding piezoelectric unit. The first surface of the piezoelectric unit is joined and fixed to the corresponding first contact electrode through the corresponding first electrical connection unit, so that the first surface of the piezoelectric unit is electrically connected to the corresponding first contact electrode through the corresponding first electrical connection unit. The second electrical connection unit and the second contact electrode are stacked sequentially on the second surface of the corresponding piezoelectric unit. The second surface of the piezoelectric unit is joined and fixed to the corresponding second contact electrode through the corresponding second electrical connection unit, so that the second surface of the piezoelectric unit is electrically connected to the corresponding second contact electrode through the corresponding second electrical connection unit.

5. The ultrasonic sensor according to any one of claims 1-2, characterized in that, The flexible package has a flexible adhesive layer on at least one side of its thickness direction.

6. The ultrasonic sensor according to claim 5, characterized in that, The flexible adhesive layer is formed of hydrogel.

7. The ultrasonic sensor according to claim 6, characterized in that, The flexible adhesive layer is formed of a water-reducing material.

8. The ultrasonic sensor according to any one of claims 6-7, characterized in that, The acoustic impedance of the flexible adhesive layer is less than that of the flexible package.

9. The ultrasonic sensor according to any one of claims 6-7, characterized in that, The flexible adhesive layer covers the flexible package.

10. The ultrasonic sensor according to any one of claims 1-2 and 6-7, characterized in that, The ultrasonic sensor has at least one surface in its thickness direction that is obliquely intersecting the thickness direction of at least one of the piezoelectric elements.

11. An ultrasonic testing device, characterized in that, It includes an excitation device and an ultrasonic sensor as described in any one of claims 1-10, wherein a first external structure and a second external structure of the ultrasonic sensor are electrically connected to the excitation device.

12. A method for manufacturing an ultrasonic sensor, characterized in that, Including the following steps: A first flexible encapsulation layer and a second flexible encapsulation layer are prepared respectively, wherein the first flexible encapsulation layer includes a first bonding surface and the second flexible encapsulation layer includes a second bonding surface; A first conductive layer is provided on the first bonding surface, and the first conductive layer is processed to form a first conductive pattern on the first bonding surface. The first conductive pattern includes a first contact electrode, a first bent wire, and a first external structure. The first contact electrode is connected to the first external structure through the first bent wire, and the first contact electrode corresponds to the piezoelectric unit. A second conductive layer is provided on the second bonding surface, and the second conductive layer is processed to form a second conductive pattern on the second bonding surface. The second conductive pattern includes a second contact electrode, a second bent wire, and a second external structure. The second contact electrode is connected to the second external structure through the second bent wire, and the second contact electrode corresponds to the piezoelectric unit. Connect the piezoelectric unit to the corresponding first contact electrode; After the piezoelectric unit is docked onto the corresponding first contact electrode, the first bonding surface and the second bonding surface are joined to form a first flexible package, so that the piezoelectric unit is docked with the corresponding second contact electrode and a first flexible package structure is formed. The first flexible package structure includes a first flexible package, a first conductive pattern, a second conductive pattern and the piezoelectric unit, and the first flexible package covers the first conductive pattern, the second conductive pattern and the piezoelectric unit. At least a portion of the first external structure and at least a portion of the second external structure are exposed outside the first flexible package.

13. The method according to claim 12, characterized in that, The first mating surface and the second mating surface are joined to form a first flexible package, so that the piezoelectric unit is connected to the corresponding second contact electrode, and a first flexible package structure is formed, specifically including: The first bonding surface and the second bonding surface are joined to form a first flexible package, so that the piezoelectric unit is docked with the corresponding second contact electrode, and a second flexible package structure is formed. The second flexible package structure includes the first flexible package, the first conductive pattern, the second conductive pattern and the piezoelectric unit. The first flexible package covers the first conductive pattern, the second conductive pattern and the piezoelectric unit. The second flexible packaging structure is placed on a mold with a bent bearing surface for secondary packaging to form the first flexible packaging structure, such that at least one surface of the first flexible packaging structure in its thickness direction is obliquely intersecting the thickness direction of at least one of the piezoelectric units. The first flexible packaging structure includes the second flexible packaging structure and a second flexible packaging body covering the second flexible packaging structure.

14. The method according to claim 12 or 13, characterized in that, After forming the first flexible packaging structure, the method further includes the step of: A flexible adhesive layer is formed on the surface of the first flexible packaging structure.

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