Processing device and processing method for a smart card

By introducing a combination structure of positioning plate and suction plate into the smart card processing device, the problem of poor continuity of welding operation in the prior art is solved, realizing precise welding and continuous welding process of chip and wire, and improving the efficiency of smart card processing.

CN119188108BActive Publication Date: 2025-11-18SHENZHEN LECAI SMART CARD TECH CO LTD
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Patent Information

Application Number
CN202411431114.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-10-14
Publication Date
2025-11-18
Estimated Expiration
2044-10-14

AI Technical Summary

Technical Problem

In existing smart card processing equipment, the process of adsorbing the chip with a suction cup and placing it in the card slot through multiple sets of adjustment mechanisms is quite cumbersome, resulting in poor continuity of welding operations.

Method used

An adsorption assembly including a positioning plate and a suction plate is used. The carrier plate is moved by a chain. When the suction plate moves horizontally, it unfolds and flips the chip into the slot. Precise welding is achieved by the snap-fit ​​structure between the positioning plate and the carrier plate. After welding is completed, the suction plate flattens out to realize a continuous welding process.

Benefits of technology

It improves the continuity and accuracy of the smart card welding process, simplifies the bonding and welding steps between the chip and the wire, and enhances the overall welding efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a processing device and a processing method of an intelligent card, and belongs to the technical field of intelligent card welding devices. The processing device of the intelligent card comprises two chains arranged oppositely and a plurality of object carrying plates installed between the two chains. A groove for placing an intelligent card body is formed on the outer side of the object carrying plate. The outer side of the chain is provided with a side plate, and a supporting plate is fixedly arranged between the two side plates. In actual use, the positioning plate is clamped on the top of the object carrying plate, so that the chip adsorbed by the suction plate can be placed on one side of the lead wire. The chip and the lead wire can be more accurately attached by using the structure, thereby facilitating the welding of the two, and after the welding is completed, the suction plate can be flattened during the process that the object carrying plate leaves the welding station, so that the chip is turned over into the card slot. The whole welding process is more continuous by using the structure.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of smart card welding device, in particular to a smart card processing device and processing method. BACKGROUND

[0002] In the production process of the dual-interface smart card, the ends of the antenna embedded in the card are led out and welded with the corresponding welding points of the chip, and then the chip is installed and fixed in the dug groove, so that the dual-interface card capable of reading and writing the chip in contact and non-contact modes is formed.

[0003] Chinese patent CN110883442B discloses a chip welding device capable of turning over. The chip is moved into the cavity of the chip groove provided on the card through the horizontal driving mechanism and the vertical driving mechanism, and then the chip is separated from the rubber suction cup and compacted by the pressing mechanism, so as to be firmly fixed in the chip groove, thereby realizing the rapid positioning of the chip. In addition, the lower end of the pressing rod is provided with a rubber pad, which can play a buffering role to avoid the chip being damaged due to the excessive pressing distance of the pressing rod.

[0004] The above device adsorbs the chip through the suction cup, and places the welded chip in the card groove through multiple adjusting mechanisms. The overall process is relatively complicated, and the chip needs to be placed in the card groove during the process, which requires stopping the welding operation. Therefore, the continuity of the overall welding operation is poor. In summary, the above device still needs to be improved.

[0005] Therefore, it is necessary to provide a smart card processing device and processing method to solve the above technical problems. SUMMARY

[0006] The present application aims to provide a smart card processing device and processing method to solve the problem that the existing device adsorbs the chip through the suction cup, and places the welded chip in the card groove through multiple adjusting mechanisms. The overall process is relatively complicated, and the chip needs to be placed in the card groove during the process, which requires stopping the welding operation. Therefore, the continuity of the overall welding operation is poor.

[0007] Based on the above idea, the present application provides the following technical scheme: a smart card processing device, comprising two chains arranged oppositely and a plurality of object carriers installed between the two chains. A recess for placing a smart card body is formed on the outer side of the object carrier. Side plates are arranged on the outer side of the chain. A support plate is fixedly arranged between the two side plates. A card slot is formed on the smart card body, and a wire matched with the chip extends from the card slot.

[0008] The upper part of the chain is provided with a storage box for storing chips, a welding head is arranged between the chain and the storage box, a rotating shaft is arranged on one side of the storage box, a plurality of telescopic assemblies are installed outside the rotating shaft, a suction assembly is hinged to one end of the telescopic assembly away from the rotating shaft, the chip in the storage box can be sucked by the suction assembly when the suction assembly rotates to the storage box in a folded state, the chip sucked by the suction assembly can be rotated to the support plate by the rotating shaft and be attached to the wire, and the suction assembly can be unfolded and the chip can be turned over into the card slot when the suction assembly moves in the horizontal direction with the carrier plate.

[0009] As a further scheme of the present application: the suction assembly comprises a positioning plate and a suction plate which are hinged to each other and elastically matched between the positioning plate and the suction plate, the positioning plate is in a parallel state with the rotating shaft, a positioning block is fixedly installed on the outer side of the positioning plate, inclined surfaces are arranged on both sides of one end of the positioning block away from the positioning plate, a positioning groove matched with the positioning block is formed in the top surface of the carrier plate, and a clamping block is elastically installed on the inner wall of the positioning groove, and an insertion slot matched with the clamping block is formed in the side surface of the positioning block.

[0010] As a further scheme of the present application: a magnetic plate is fixedly embedded on the top surface of the support plate, a magnetic strip matched with the magnetic plate is elastically installed on the bottom surface of the carrier plate, and the opposite surface of the magnetic strip and the magnetic plate has different magnetic poles, and a traction rope is fixedly arranged between the magnetic strip and the clamping block.

[0011] As a further scheme of the present application: the telescopic assembly comprises a sliding rod and a rod sleeve slidably arranged outside the sliding rod, and the sliding rod and the rod sleeve are elastically matched, one end of the sliding rod away from the rotating shaft is hinged to the positioning plate, and the other end of the rod sleeve away from the positioning plate is connected to the rotating shaft, a boss is fixedly arranged on one end of the sliding rod close to the rotating shaft, and a pull rope is fixedly arranged between the boss and the suction plate.

[0012] As a further scheme of the present application: a protrusion is fixedly arranged on one end of the sliding rod, a protruding block is fixedly arranged on one end of the rod sleeve close to the rotating shaft, a set of hinged blocks are fixedly arranged outside the positioning plate and the rotating shaft, a connecting shaft is fixedly arranged on the protruding block and the protrusion, a circular hole matched with the connecting shaft is formed in the hinged block, the connecting shaft passes through the circular hole and is rotationally matched with the hinged block through a bearing, a second coil spring is sleeved outside the connecting shaft, and the two ends of the second coil spring are connected with the connecting shaft and the hinged block respectively, a stop rod is fixedly arranged on the outer circumferential surface of the connecting shaft, and a positioning rod matched with the stop rod is fixedly arranged on the inner wall of the circular hole.

[0013] As a further scheme of the present application: a through strip-shaped groove is formed in the circumferential surface of the rod sleeve along the diameter direction thereof, and the boss is slidably arranged in the strip-shaped groove.

[0014] As a further scheme of the present application, the positioning plate is fixedly installed with a pulley, and the pull rope is wound around the pulley.

[0015] As a further scheme of the present application, the spring is fixedly arranged between the inner end face of the rod sleeve and the sliding rod.

[0016] A method for processing by using the processing device of the smart card, comprising the following steps: placing the smart card body in the groove on the carrier plate, moving the smart card body to the welding station by the chain, rotating the positioning plate to the vertical downward state by the rotating shaft and clamping with the carrier plate, so that the chip adsorbed by the suction plate is placed on one side of the smart card body and is attached to the wire; welding the wire and the chip by the welding head; driving the positioning plate to move in the horizontal direction with the carrier plate, in the process, the suction plate is turned to the state parallel to the positioning plate, so that the chip can be turned to the card slot.

[0017] Compared with the prior art, the present application has the following advantages: the positioning plate is clamped on the top of the carrier plate during actual use, so that the chip adsorbed by the suction plate can be placed on one side of the wire, and the structure can more accurately attach the chip and the wire, thereby facilitating the welding of the two, and after the welding is completed, the carrier plate moves away from the welding station, the suction plate can be flattened, thereby turning the chip to the card slot, and the overall welding process is more continuous through this structure. BRIEF DESCRIPTION OF DRAWINGS

[0018] The present application will be further described below in combination with the drawings and examples.

[0019] Figure 1 is a schematic diagram of the overall structure of the present application;

[0020] Figure 2 is a schematic diagram of the enlarged structure at A of the present application; Figure 1

[0021] Figure 3 is a schematic diagram of the support plate structure of the present application;

[0022] Figure 4 is a schematic diagram of the position of the suction plate and the storage box of the present application;

[0023] Figure 5 is a distribution diagram of the telescopic assembly and the adsorption assembly of the present application;

[0024] Figure 6 is a schematic diagram of the chip and the wire when they are attached;

[0025] Figure 7 is a schematic diagram of the sliding rod extending out of the rod sleeve of the present application;

[0026] ​Figure 8 is the B amplification structure schematic diagram of the present application Figure 6 ;

[0027] Figure 9 is the first spring structure schematic diagram of the present application

[0028] Figure 10 is the second spring structure schematic diagram of the present application

[0029] Figure 11 is the magnet structure schematic diagram of the present application

[0030] Figure 12 is the plug-in block structure schematic diagram of the present application

[0031] In the figure: 1, chain; 2, side plate; 3, storage box; 301, notch; 4, object plate; 401, positioning groove; 5, smart card body; 501, card slot; 502, wire; 6, welding head; 7, motor; 8, support plate; 801, magnetic plate; 9, positioning block; 901, inclined surface; 10, positioning plate; 11, suction plate; 1101, suction disc; 12, vertical plate; 13, slide rod; 1301, protrusion; 14, rod sleeve; 1401, protruding block; 15, rotating shaft; 16, jacking rod; 17, chip; 18, pull rope; 19, traction rope; 20, clamping block; 21, magnetic stripe; 22, flow guide groove; 23, round shaft; 24, first spring; 25, second spring; 26, connecting shaft; 27, stop rod; 28, positioning rod; 29, hinged block; 30, magnet; 31, plug-in block; 32, air pump. DETAILED DESCRIPTION

[0032] As Figures 1-5 shown, a smart card processing device and processing method, including two chain 1 and installed between the two chain 1 of a plurality of object plate 4, object plate 4 on the outer side of the recess for placing the smart card body 5, actual use, by driving chain 1 rotation can drive the smart card body 5 to the welding station, the outer side of the chain 1 is provided with side plate 2, between the two side plate 2 is fixedly provided with support plate 8, when the object plate 4 with chain 1 rotation to the horizontal state, the object plate 4 can fall on the support plate 8, so as to support the object plate 4 through the support plate 8;

[0033] The smart card body 5 is provided with a card slot 501, and a lead wire 502 matched with the chip 17 extends from the card slot 501. In actual use, a storage box 3 for storing the chip 17 is arranged above the chain 1, a rotating shaft 15 is arranged on one side of the storage box 3, a plurality of telescopic assemblies are installed on the outer side of the rotating shaft 15 and are evenly distributed in a ring array, an adsorption assembly is hingedly connected to one end of the telescopic assembly away from the rotating shaft 15, the chip 17 in the storage box 3 can be adsorbed by the adsorption assembly when the adsorption assembly rotates to the storage box 3 in a folded state, the chip 17 adsorbed by the adsorption assembly can be rotated to the supporting plate 8 by the rotating shaft 15, so as to facilitate welding with the chip 17, when the adsorption assembly moves in the horizontal direction with the carrier plate 4, the adsorption assembly can be unfolded to drive the chip 17 into the card slot 501, thus the chip 17 and the lead wire 502 on the smart card body 5 are welded, and the chip 17 is clamped into the card slot 501 of the smart card body 5.

[0034] As shown in Figures 2-8 The adsorption assembly includes a positioning plate 10 and a suction plate 11 hingedly connected to each other, and the positioning plate 10 and the suction plate 11 are elastically matched, the positioning plate 10 is in a parallel state with the rotating shaft 15, the suction plate 11 is in an initial state perpendicular to the positioning plate 10, and the positioning plate 10 and the suction plate 11 are arranged in an L shape, the chip 17 in the storage box 3 can be adsorbed by the suction plate 11 when the adsorption assembly rotates to one end of the storage box 3;

[0035] Further, in order to clamp the positioning plate 10 on the supporting plate 8, a positioning block 9 is fixedly installed on the outer side of the positioning plate 10, inclined surfaces 901 are arranged on both sides of one end of the positioning block 9 away from the positioning plate 10, a positioning groove 401 matched with the positioning block 9 is formed in the top surface of the carrier plate 4, and a clamping block 20 is elastically installed in the inner wall of the positioning groove 401, an insertion slot matched with the clamping block 20 is formed in the side surface of the positioning block 9, when the positioning block 9 is inserted into the positioning groove 401 and the clamping block 20 is inserted into the insertion slot, the positioning plate 10 and the carrier plate 4 are locked with each other, so that the carrier plate 4 can move in the horizontal direction with the carrier plate 4.

[0036] A magnetic plate 801 is fixedly embedded in the top surface of the supporting plate 8, a magnetic strip 21 matched with the magnetic plate 801 is elastically installed on the bottom surface of the carrier plate 4, one side of the magnetic strip 21 opposite to the magnetic plate 801 has different magnetic poles, a traction rope 19 is fixedly arranged between the magnetic strip 21 and the clamping block 20, and the traction rope 19 passes through the carrier plate 4 and is in sliding fit with the carrier plate 4, after the chip 17 and the lead wire 502 on the smart card body 5 are welded, the rotating shaft 15 is rotated by 90°, so that the positioning plate 10 and the carrier plate 4 can move to the magnetic plate 801 in the horizontal direction, and the locking of the clamping block 20 on the positioning block 9 is released by the cooperation of the magnetic plate 801 and the magnetic strip 21.

[0037] The telescopic assembly comprises a slide rod 13 and a rod sleeve 14 sleeved outside the slide rod 13, and the slide rod 13 and the rod sleeve 14 are elastically matched. Specifically, one end of the slide rod 13 away from the rotating shaft 15 is hingedly connected with the positioning plate 10, and one end of the rod sleeve 14 away from the positioning plate 10 is connected with the rotating shaft 15. The one end of the slide rod 13 close to the rotating shaft 15 is fixedly provided with a boss, and the boss and the suction plate 11 are fixedly provided with a pull rope 18. Through the structure, when the positioning plate 10 is clamped on the object plate 4 and moves horizontally, the slide rod 13 can pop out and release the pull rope 18, so that the suction plate 11 can be unfolded to a state parallel to the positioning plate 10. In this process, the chip 17 can be placed in the clamping groove 501.

[0038] In actual use, the smart card body 5 to be welded is placed on the object plate 4, and the object plate 4 is moved by the chain 1. At the same time, the rotating shaft 15 can drive a plurality of positioning plates 10 and suction plates 11 to rotate through the telescopic assembly. When one of the suction plates 11 moves to one end of the storage box 3 and is attached to the outermost chip 17, the chip 17 can be fixed on the suction plate 11 through negative pressure. Then, in the process of moving the smart card body 5 to the position below the storage box 3 by the object plate 4, the rotating shaft 15 can drive the positioning plate 10 and the suction plate 11 to rotate to a vertically downward state. In this process, the positioning plate 10 will contact and gradually incline with the object plate 4. When the positioning plate 10 is completely attached to the object plate 4, the positioning plate 10 and the suction plate 11 are rotated to a vertically downward state. At this time, the rotating shaft 15 stops rotating. In addition, in the process of moving the positioning plate 10 relative to the object plate 4, the positioning block 9 on the outer side of the positioning plate 10 will finally be inserted into the positioning groove 401 on the object plate 4. Because the positioning block 9 is provided with a slope 901, the positioning block 9 can extrude the clamping block 20 through the slope 901 in the process of being inserted into the positioning groove 401. When the clamping block 20 is popped out and inserted into the insertion slot, the positioning plate 10 and the object plate 4 are locked with each other. Thus, the operation of the chain 1 is also stopped. Referring to Figure 5 At this time, the positioning plate 10 and the object plate 4 are locked, and the suction plate 11 is in a state perpendicular to the object plate 4, and the chip 17 adsorbed by the suction plate 11 is placed on one side of the lead 502. The welding between the chip 17 and the lead 502 can be completed by the external welding head 6. In actual use, the welding head 6 can be operated by a mechanical hand. Of course, it can also be manually operated by a worker. After the welding is completed, the rotating shaft 15 and the chain 1 are started. In the process of moving the object plate 4 by the chain 1, the positioning plate 10 clamped with the object plate 4 will also move in the horizontal direction. Referring to Figure 7As shown, when the positioning plate 10 moves in the horizontal direction, the sliding rod 13 connected thereto will slide outward relative to the rod sleeve 14, in the process, the pull rope 18 can be loosened, so that the suction plate 11 can gradually rotate to a state parallel to the positioning plate 10, thereby turning the chip 17 into the card slot 501, when the carrier plate 4 moves to the magnetic plate 801, the suction force of the suction plate 11 on the chip 17 can be released, at the same time, the card block 20 can be pulled by the suction force of the magnetic plate 801 on the magnetic stripe 21, so that the card block 20 is separated from the positioning block 9, at this time, the positioning plate 10 and the suction plate 11 can be rotated by the telescopic assembly to reset away from the carrier plate 4, according to the previous description, when the telescopic assembly rotates the suction plate 11 again to the storage box 3, the chip 17 on the outermost side of the storage box 3 can be adsorbed, and thus a complete welding process is completed.

[0039] In summary, the device is provided with the positioning plate 10, which is clamped on the top of the carrier plate 4 during actual use, so that the chip 17 adsorbed by the suction plate 11 can be placed on one side of the wire 502, and the structure can more accurately adhere the chip 17 to the wire 502, thereby facilitating the welding of the two, and after the welding is completed, the carrier plate 4 moves away from the welding station, the suction plate 11 can be flattened, thereby turning the chip 17 into the card slot 501, and the overall welding process is more continuous through this structure.

[0040] In actual use, a protrusion 1301 is fixedly arranged at one end of the sliding rod 13, and a protrusion 1401 is fixedly arranged at one end of the rod sleeve 14 close to the rotating shaft 15, referring to Figures 10-11 As shown, a set of hinge blocks 29 are fixedly arranged outside the positioning plate 10 and the rotating shaft 15, the number of the set of hinge blocks 29 is two, specifically, a connecting shaft 26 is fixedly arranged on the protrusion 1401 and the protrusion 1301, and a circular hole matched with the connecting shaft 26 is formed in the hinge block 29, the connecting shaft 26 passes through the circular hole and rotates with the hinge block 29 through the bearing;

[0041] Further, the connecting shaft 26 is sleeved with a second coil spring 25 outside, the two ends of the second coil spring 25 are fixedly connected with the outer wall of the connecting shaft 26 and the inner wall of the circular hole, and in addition, a stop rod 27 is fixedly arranged on the outer circumferential surface of the connecting shaft 26, a positioning rod 28 matched with the stop rod 27 is fixedly arranged on the inner wall of the circular hole, and the stop rod 27 and the positioning plate 10 are located on one side of the second coil spring 25.

[0042] The side close to the suction plate 11 of the positioning plate 10 is provided with an opening, and the bottom end of the suction plate 11 is arranged in the opening, and a circular shaft 23 is fixedly arranged on each side surface of the suction plate 11 close to the bottom end, referring to Figure 9As shown, mounting holes are arranged on both side walls of the opening of the positioning plate 10, and the circular shaft 23 passes through the mounting holes and is rotatably connected to the positioning plate 10 through bearings. The first coil spring 24 is arranged outside the circular shaft 23, and the two ends of the first coil spring 24 are fixedly connected to the outer wall of the circular shaft 23 and the inner wall of the mounting hole, respectively. Figure 6 As shown, the top rod 16 is fixedly arranged on the positioning plate 10 and located on one side of the suction plate 11. When the suction plate 11 is pulled by the pull rope 18 to adhere to the top rod 16, the suction plate 11 stops rotating and is perpendicular to the positioning plate 10.

[0043] In actual use, the spring is fixedly arranged between the inner end surface of the rod sleeve 14 and the sliding rod 13. After the clamping block 20 is separated from the positioning block 9, the coil spring at one end of the rod sleeve 14 can drive the rod sleeve 14 and the sliding rod 13 to deflect away from the object carrier plate 4, so that the positioning plate 10 is separated from the object carrier plate 4. After the positioning plate 10 is separated from the object carrier plate 4, the coil spring at one end of the sliding rod 13 can drive the positioning plate 10 to reset. When the stop rod 27 contacts the positioning rod 28, the rod sleeve 14 and the positioning plate 10 are reset to the initial state, which is beneficial to the next use. In addition, the spring can drive the sliding rod 13 to slide inward along the rod sleeve 14 to reset. In this process, the suction plate 11 can be pulled by the pull rope 18 to deflect to a state perpendicular to the positioning plate 10 against the action of the first coil spring 24, so as to facilitate the suction plate 11 to adsorb the chip 17 at one end of the storage box 3.

[0044] As shown in the figure, Figures 1-4 As shown, the suction disc 1101 is fixedly arranged on one side of the suction plate 11 close to the storage box 3. The vertical plate 12 is fixedly arranged on the side plate 2, and the rotating shaft 15 passes through the vertical plate 12 and is rotatably connected thereto. The rotating disc is fixedly arranged on one end of the rotating shaft 15 passing through the vertical plate 12. A plurality of air pumps 32 are fixedly arranged on the outer side of the rotating disc. The soft tube is fixedly arranged between the air pump 32 and the suction disc 1101. Specifically, one end of the soft tube is in communication with the air pump 32, and the other end of the soft tube is in communication with the suction disc 1101. In actual use, when the suction plate 11 moves to one end of the storage box 3, the air pump 32 can suck the gas in the suction disc 1101, and the suction disc 1101 can adsorb the chip 17 on the suction plate 11. When the object carrier plate 4 moves to the magnetic plate 801, the air pump 32 stops working, and the suction plate 11 and the chip 17 are separated.

[0045] In order to drive the rotating shaft 15 to rotate, the motor 7 is fixedly arranged on the outer side of the vertical plate 12. The output shaft of the motor 7 and the outer side of the rotating disc are fixedly sleeved with pulleys, and the outer sides of the two pulleys are sleeved with a belt.

[0046] As shown in the figure, Figures 11-12As shown, the magnet 30 is fixedly arranged inside the vertical plate 12, the magnet 30 is a fan shape, and the elastic insertion block 31 is arranged on the hinge block 29 on the rotating shaft 15, the side surface of the convex block 1401 is provided with an insertion slot matched with the insertion block 31, the end of the insertion block 31 close to the magnet 30 is fixedly provided with a magnetic block, and the side of the magnetic block opposite to the magnet 30 has the same magnetic pole. In actual use, when the rotating shaft 15 drives the positioning plate 10 to rotate 90° from the storage box 3, one end of the rod sleeve 14 can be located inside the magnet 30. At this time, the repulsion of the magnet 30 to the magnetic block makes one end of the insertion block 31 inserted into the insertion slot, thereby locking the rod sleeve 14 and the convex block 1401. At this time, the rod sleeve 14 can be kept stable between the rotating shaft 15 during rotation to the vertical downward position, thereby facilitating the stable attachment of the positioning plate 10 to the surface of the object plate 4. When the rod sleeve 14 continues to rotate from the vertical downward position, the magnet 30 and the insertion block 31 will be misaligned.

[0047] Referring to Figure 1 As shown, the chain 1 is provided with a sprocket at both ends, and a support is arranged outside the sprocket. Specifically, a round rod is fixedly installed on the sprocket, the round rod penetrates through the support and is in rotational cooperation with the support. The side plate 2 is fixedly installed between the two supports. One of the supports is fixedly installed with a driving motor 7, so that the end of the round rod penetrating through the support is in transmission connection with the output shaft of the driving motor 7.

[0048] The side plate 2 is fixedly installed with a support, and the storage box 3 is fixedly installed on the top surface of the support. In addition, a driving unit such as a hydraulic rod or a pneumatic cylinder is fixedly installed on the top surface of the support. The extension end of the driving unit extends into the storage box 3 to push the plurality of chips 17 in the storage box 3 to move. Through this structure, the chips 17 can be pushed to one end of the storage box 3 and cooperated with the suction plate 11.

[0049] Referring to Figure 2 As shown, one end of the storage box 3 close to the rotating shaft 15 is in an open state, and an L-shaped notch 301 is formed on the end of the outer surface of the storage box 3 close to the rotating shaft 15. In actual use, when the chip 17 is fixed on the suction plate 11, the chip 17 can be moved out of the notch 301 during the rotation of the suction plate 11 driven by the rotating shaft 15.

[0050] Referring to Figure 5 As shown, a through strip-shaped slot is formed on the circumferential surface of the rod sleeve 14 along the diameter direction thereof. The convex block is slidingly arranged in the strip-shaped slot. A pulley is fixedly installed on the positioning plate 10. The pull rope 18 is wound around the pulley, thereby facilitating the stable deflection of the suction plate 11.

[0051] Referring to Figure 8As shown, the inner wall of the positioning groove 401 is provided with an installation groove matched with the sliding of the clamping block 20, and a first spring is fixed between the inner end face of the installation groove and the clamping block 20. The bottom surface of the object plate 4 is provided with a sliding groove matched with the sliding of the magnetic strip 21, and a second spring is fixed between the top wall of the sliding groove and the magnetic strip 21. In actual use, a flow guide groove 22 is further provided on the object plate 4 and communicates with the sliding groove. The end of the flow guide groove 22 away from the sliding groove extends to the bottom surface of the object plate 4. Of course, the magnetic strip 21 and the sliding groove can be sealingly matched. Through the structure, the magnetic strip 21 slides slowly in the sliding groove, so that the suction cup 1101 and the chip 17 have sufficient time to disengage.

[0052] Referring to Figure 12 As shown, the hinge block 29 is provided with a through groove matched with the sliding of the plug-in block 31, and a baffle is fixed at the end of the through groove close to the magnet 30. A third spring is fixed between the baffle and the plug-in block 31.

Claims

1. A smart card processing apparatus, comprising two chains arranged opposite to each other and a plurality of carrier plates installed between the two chains, wherein the outer surface of the carrier plates is provided with grooves for placing smart card bodies, side plates are provided on the outer sides of the chains, and a support plate is fixedly provided between the two side plates, characterized in that: The smart card body has a card slot, and a wire that cooperates with the chip extends from the card slot; A storage box for storing chips is provided above the chain. A welding head is provided between the storage box and the chain. A rotating shaft is provided on one side of the storage box. Multiple sets of telescopic components are installed on the outside of the rotating shaft. An adsorption component is hinged to the end of the telescopic component away from the rotating shaft. When the adsorption component rotates to the storage box in a folded state, it can adsorb the chip in the storage box. The rotating shaft can rotate the chip adsorbed by the adsorption component to the support plate and make it fit with the wire. When the adsorption component moves horizontally with the carrier plate, the adsorption component can unfold and flip the chip into the slot. The adsorption assembly includes a positioning plate and a suction plate that are hinged to each other, and the positioning plate and the suction plate are elastically fitted together. The positioning plate is in a state parallel to the rotating shaft. A positioning block is fixedly installed on the outer side of the positioning plate. The positioning block has inclined surfaces on both sides at the end away from the positioning plate. The top surface of the carrying plate has a positioning groove that matches the positioning block, and a locking block is elastically installed on the inner wall of the positioning groove. The side of the positioning block has a slot that matches the locking block. A magnetic plate is fixedly embedded on the top surface of the support plate, and a magnetic strip that cooperates with the magnetic plate is elastically installed on the bottom surface of the carrying plate. The magnetic strip and the magnetic plate have different magnetic poles on opposite sides. A traction rope is fixedly provided between the magnetic strip and the card block. The telescopic assembly includes a slide rod and a sleeve that is slidably fitted on the outside of the slide rod. The slide rod and the sleeve are elastically fitted together. The end of the slide rod away from the pivot is hinged to the positioning plate. The end of the sleeve away from the positioning plate is connected to the pivot. A boss is fixedly provided at the end of the slide rod near the pivot. A pull rope is fixedly provided between the boss and the suction plate.

2. The smart card processing apparatus according to claim 1, characterized in that: A protrusion is fixedly provided at one end of the slide rod, and a protrusion is fixedly provided at the end of the rod sleeve near the rotating shaft. A set of hinge blocks are fixedly provided on the positioning plate and the outer side of the rotating shaft. A connecting shaft is fixedly provided on the protrusion and the protrusion. A circular hole is opened on the hinge block to cooperate with the connecting shaft. The connecting shaft passes through the circular hole and rotates with the hinge block through a bearing. A second coil spring is sleeved on the outer side of the connecting shaft. The two ends of the second coil spring are respectively connected to the connecting shaft and the hinge block. A stop bar is fixedly provided on the outer circumference of the connecting shaft, and a positioning rod that cooperates with the stop bar is fixedly provided on the inner wall of the circular hole.

3. The smart card processing apparatus according to claim 1, characterized in that: The sleeve has a through groove along its diameter on its circumference, and the boss is slidably disposed in the groove.

4. The smart card processing apparatus according to claim 1, characterized in that: A pulley is fixedly installed on the positioning plate, and the pull rope passes around the pulley.

5. The smart card processing apparatus according to claim 1, characterized in that: A spring is fixedly installed between the inner end face of the sleeve and the slide rod.

6. A method for processing using a processing apparatus for a smart card as described in any one of claims 1-2, characterized in that, The process includes the following steps: placing the smart card body in a groove on a carrier plate; moving the smart card body to the welding station via a chain; rotating the positioning plate to a vertically downward position via a shaft and engaging it with the carrier plate, so that the chip adsorbed by the suction plate is placed on one side of the smart card body and in contact with the wires; welding the wires to the chip via a welding head; driving the positioning plate to move horizontally with the carrier plate, during which the suction plate flips to a position parallel to the positioning plate, allowing the chip to be flipped into the card slot.

Citation Information

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