A high-resolution imaging method

Abstract

The present invention relates to the field of X-ray imaging, and in particular to a high-resolution imaging method, which comprises adjusting the rotation axis angle of an image generating circuit board according to the actual outer contour of an object to be sampled, fixing the image generating circuit board, and determining the corresponding actual rotation axis angle, determining the sampling surface proportion of each image generating circuit board according to the actual outer contour and the actual rotation axis angle, determining the priority of the corresponding image generating circuit board according to the sampling surface proportion, and determining the verification order of the image generating circuit board according to the priority, converting the verified image signal into a corresponding electrical signal, and calculating the optimal rotation axis angle corresponding to each image generating circuit board according to the resolution through a rotation axis angle monitoring model, thereby further improving the resolution scale of X-ray photons, improving the imaging quality by improving the imaging resolution, and accurately obtaining the precision information and results of high-definition X-ray imaging of the object to be sampled.

Description

Technical Field

[0001] The present invention relates to the field of X-ray imaging, and in particular to a high-resolution imaging method. Background Art

[0002] Due to the strong penetration and fluorescence effect of X-rays, X-ray imaging is widely used in many fields such as medical and biological imaging, industrial monitoring and flaw detection, material science and artwork detection. The wavelength of X-rays is much smaller than that of visible light. In theory, the diffraction resolution of its imaging system can be much higher than that of visible light imaging systems. Usually, the diffraction resolution of X-rays can reach the nanometer level. For example, using X-rays with a wavelength of 0.1 nanometers, the distance from the object to the detection surface is 1 meter, and the aperture of the imaging system is 1 millimeter. Its theoretical diffraction limit resolution is 100 nanometers (in actual measurements, due to the existence of measurement errors, the resolution is usually worse than this theoretical value, and generally, it is considered high resolution if it is not worse by one order of magnitude). However, since the production of X-ray optical devices is a huge challenge to the existing process and technology level, and coherent X-ray sources are extremely expensive and difficult to obtain, it is very difficult to make the resolution of X-ray imaging exceed the resolution of visible light, or even reach its diffraction limit resolution. Currently, the resolution of industrial and medical X-ray imaging is mostly determined by the beam size of the light source, which is generally in the order of millimeters or even centimeters, far below the diffraction-limited resolution and unable to take advantage of the short wavelength of X-rays and therefore low diffraction resolution.

[0003] Chinese patent application publication number: CN108175432A discloses a high-resolution X-ray imaging device for in-vivo tissues, comprising a radiation source (1) emitting electromagnetic radiation and an imaging device (2), characterized in that: the imaging device (2) comprises at least one imaging component (21) and a delivery structure (22) coupled to each imaging component (21); the connected imaging components (21) are connected, and when in use, the imaging component (21) is extended into the human body, fixed in the diagnostic target area, and cooperates with the radiation source (1) arranged outside the human body for imaging; the imaging component (21) is coupled to the delivery structure (22). The present invention can accurately image tissues in the human body, avoids the auxiliary means used in the prior art due to the inability to image, reduces the pain of the patient, and at the same time, the imaging is clear and has no ghosting, which facilitates the doctor's accurate judgment.

[0004] However, the above method has the following problems: the recognition accuracy is not high, and the accuracy information and results of high-definition X-ray imaging of the object to be sampled cannot be obtained. Summary of the invention

[0005] To this end, the present invention provides a high-resolution imaging method to overcome the problem in the prior art that the recognition accuracy is low and the accuracy information and results of high-definition X-ray imaging of the object to be sampled cannot be obtained.

[0006] To achieve the above object, the present invention provides a high-resolution imaging method, which is provided with an image generation strategy, comprising:

[0007] Adjust the rotation angle of the image generation circuit board according to the actual outer contour of the object to be sampled;

[0008] Fixing the image generation circuit board and determining the corresponding actual rotation axis angle;

[0009] Determining the sampling surface proportion of each of the image generation circuit boards according to the actual outer contour and the actual rotation axis angle;

[0010] Determining the priority of the corresponding image generation circuit board according to the sampling surface ratio, and determining the verification order of the image generation circuit board according to the priority;

[0011] Convert the verified image signal into a corresponding electrical signal;

[0012] The rotation axis angle is the angle between the plane of the image generation circuit board and the horizontal line.

[0013] Furthermore, the high-resolution imaging method comprises:

[0014] Turn on the high-voltage power supply device, apply current to the filament through the high-voltage cable, and generate a high-speed electron beam;

[0015] adjusting the electron beam adjustment device to focus the high-speed electron beam and generate X-rays;

[0016] The X-ray passes through the object to be sampled, and the photons in the X-ray that are not absorbed by the object to be sampled hit the image generation circuit board, and generate corresponding electrical signals according to the image generation strategy;

[0017] The image generation circuit board converts the obtained electrical signal into a digital signal and generates a corresponding digital image;

[0018] The communicator outputs the plurality of digital images to a computer terminal via a data line.

[0019] Furthermore, the image generation circuit boards are arranged at equal intervals.

[0020] Wherein, the image generation circuit board is provided with a converter, which can convert the obtained electrical signal into a digital signal and generate a corresponding digital image.

[0021] Furthermore, the high-voltage power supply device applies a filament current within a preset range to the filament through the high-voltage cable, and at the same time, the DC high voltage generated by the high-voltage power supply device is applied between the filament and the anode target through the high-voltage cable;

[0022] The high-voltage power supply device is connected to the filament through the high-voltage cable.

[0023] Furthermore, a high-speed electron beam is formed between the filament and the anode target, and the electron beam adjustment device is adjusted to focus the high-speed electron beam. The focused high-speed electron beam hits the anode target to generate X-rays.

[0024] Furthermore, the X-ray passes through the object to be sampled, and the photons in the X-ray that are not absorbed by the object to be sampled hit the image generation circuit board. The image generation circuit board converts the photons in the X-ray into visible light photons, generates electronic data, and generates corresponding electrical signals.

[0025] Furthermore, the image generation circuit board converts the obtained electrical signal into a digital signal and generates a corresponding digital image, and the communicator outputs a plurality of the digital images to the computer terminal via the data line.

[0026] Wherein, the computer terminal is provided with a resolution threshold.

[0027] The resolution threshold is a corresponding resolution at which the computer terminal can clearly distinguish the contour of the object to be sampled when the object to be sampled is imaged.

[0028] Furthermore, the computer terminal calculates the resolution of the digital image, and when the resolution is higher than the resolution threshold, the computer terminal outputs the digital image.

[0029] Furthermore, when the resolution is lower than the resolution threshold, the computer terminal generates an adjustment instruction, and the adjustment instruction is transmitted to the communicator through the data line.

[0030] Furthermore, the communicator receives the adjustment instruction and adjusts the rotation axis angle of the image generation circuit board.

[0031] Wherein, a shaft angle monitoring model is provided in the communicator, and when the communicator receives the adjustment instruction, the shaft angle monitoring model calculates the corresponding optimal shaft angle according to the resolution.

[0032] Compared with the prior art, the present invention adjusts the rotation axis angle of the image generating circuit board according to the actual outer contour of the object to be sampled, fixes the image generating circuit board, and determines the corresponding actual rotation axis angle, determines the sampling surface ratio of each image generating circuit board according to the actual outer contour and the actual rotation axis angle, determines the priority of the corresponding image generating circuit board according to the sampling surface ratio, and determines the verification order of the image generating circuit boards according to the priority, converts the verified image signal into a corresponding electrical signal, and calculates the optimal rotation axis angle corresponding to each image generating circuit board according to the resolution through the rotation axis angle monitoring model, thereby further improving the resolution scale of X-ray photons, improving the imaging quality by improving the imaging resolution, and accurately obtaining the accuracy information and results of high-definition X-ray imaging of the object.

[0033] Furthermore, by providing an electron beam adjustment device, a high-speed electron beam can be focused to generate X-rays, thereby further improving the imaging quality of the X-rays.

[0034] Furthermore, by setting up a converter, the obtained electrical signal can be converted into a digital signal and a corresponding digital image can be generated, thereby realizing the conversion of electrical signals and digital signals, and providing a prerequisite for improving the resolution of X-ray imaging.

[0035] Furthermore, by setting a resolution threshold, it is convenient to screen the imaging results of each image generation circuit board, so as to optimize the corresponding rotation axis angle.

[0036] Furthermore, by generating adjustment instructions on a computer terminal, the rotation axis angle of the image generation circuit board can be adjusted to an optimal angle, thereby improving the efficiency of adjusting the X-ray imaging resolution.

[0037] Furthermore, by setting up a rotation axis angle monitoring model, the resolution scale of X-ray photons is further improved, the imaging quality is improved by increasing the imaging resolution, and the precision information and results of high-definition X-ray imaging of the object are accurately obtained. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 A flowchart of the image generation strategy of the present invention;

[0039] Figure 2 The present invention is a flowchart of a high-resolution imaging method. DETAILED DESCRIPTION

[0040] In order to make the objects and advantages of the present invention more clearly understood, the present invention is further described below in conjunction with embodiments; it should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0041] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the protection scope of the present invention.

[0042] It should be noted that, in the description of the present invention, terms such as "up", "down", "left", "right", "inside" and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings. This is only for description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0043] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0044] See also Figure 1 As shown, it is a flow chart of the image generation strategy of the present invention, including:

[0045] Step S1, adjusting the rotation axis angle of the image generation circuit board according to the actual outer contour of the object to be sampled;

[0046] Step S2, fixing the image generation circuit board and determining the corresponding actual rotation axis angle;

[0047] Step S3, determining the sampling area ratio of each image-generated circuit board according to the actual outer contour and the actual rotation axis angle;

[0048] Step S4, determining the priority of the corresponding image-generated circuit board according to the sampling surface ratio, and determining the verification order of the image-generated circuit board according to the priority;

[0049] Step S5, converting the verified image signal into a corresponding electrical signal;

[0050] The rotation axis angle is the angle between the plane of the image generation circuit board and the horizontal line.

[0051] Embodiment 1:

[0052] Fix two image generation circuit boards A and B, where the actual rotation axis angle of image generation circuit board A is 60°, and the actual rotation axis angle of image generation circuit board B is 180°. The sampling surface of image generation circuit board A accounts for 50%, and the sampling surface of image generation circuit board B accounts for 100%. It is determined that the priority of image generation circuit board B is higher than that of image generation circuit board A, and image generation circuit board B is determined to be the main image generation circuit board, and image generation circuit board A is the auxiliary image generation circuit board.

[0053] Embodiment 2:

[0054] Fix two image generation circuit boards C and D, among which the actual rotation axis angle of the image generation circuit board C is 45°, and the actual rotation axis angle of the image generation circuit board D is 30°, then the sampling surface proportion of the image generation circuit board C is 70%, and the sampling surface proportion of the image generation circuit board D is 87%. It is determined that the priority of the image generation circuit board D is higher than that of the image generation circuit board C, and the image generation circuit board D is determined to be the main image generation circuit board, and the image generation circuit board C is the auxiliary image generation circuit board.

[0055] By adjusting the rotation axis angle of the image generating circuit board according to the actual outer contour of the object to be sampled, fixing the image generating circuit board and determining the corresponding actual rotation axis angle, determining the sampling surface ratio of each image generating circuit board according to the actual outer contour and the actual rotation axis angle, determining the priority of the corresponding image generating circuit board according to the sampling surface ratio, and determining the verification order of the image generating circuit boards according to the priority, converting the verified image signal into a corresponding electrical signal, and calculating the optimal rotation axis angle corresponding to each image generating circuit board according to the resolution through the rotation axis angle monitoring model, the resolution scale of X-ray photons is further improved, the imaging quality is improved by improving the resolution of imaging, and the accuracy information and results of high-definition X-ray imaging of the object to be sampled are accurately obtained.

[0056] See also Figure 2 As shown, it is a flow chart of a high-resolution imaging method of the present invention, comprising:

[0057] Step St1, turning on the high-voltage power supply device, applying current to the filament through the high-voltage cable, and generating a high-speed electron beam;

[0058] Step St2, adjusting the electron beam adjustment device to focus the high-speed electron beam and generate X-rays;

[0059] Step St3, the X-ray passes through the object to be sampled, and the photons in the X-ray that are not absorbed by the object to be sampled hit the image generation circuit board, and generate corresponding electrical signals according to the image generation strategy;

[0060] Step St4, the image generation circuit board converts the obtained electrical signal into a digital signal and generates a corresponding digital image;

[0061] In step St5, the communicator outputs the multiple digital images to the computer terminal via the data line.

[0062] In a specific implementation, the verification order of the image generation circuit board is determined according to the priority, and the main image generation circuit board and the auxiliary image generation circuit board are determined. The main image generated by the main image generation circuit board and the auxiliary image generated by the auxiliary image generation board are verified based on the auxiliary image using an image algorithm, and the resolution of the main image is optimized to obtain the final digital image.

[0063] Specifically, each image generation circuit board is arranged at equal intervals.

[0064] The image generation circuit board is provided with a converter, which can convert the obtained electrical signal into a digital signal and generate a corresponding digital image.

[0065] By setting up a converter, the obtained electrical signal can be converted into a digital signal and a corresponding digital image can be generated, thus realizing the conversion of electrical signals and digital signals and providing a prerequisite for improving the resolution of X-ray imaging.

[0066] Specifically, the high-voltage power supply device applies a filament current within a preset range to the filament through a high-voltage cable, and at the same time, the DC high voltage generated by the high-voltage power supply device is applied between the filament and the anode target through the high-voltage cable;

[0067] The high voltage power supply device is connected to the filament through a high voltage cable.

[0068] In a specific implementation, the preset range of the filament current is 1.4A to 2A. Preferably, the filament current is set to 1.6A, which has the best effect on improving the X-ray imaging resolution.

[0069] Specifically, a high-speed electron beam is formed between the filament and the anode target. The electron beam adjustment device is adjusted to focus the high-speed electron beam. The focused high-speed electron beam hits the anode target to generate X-rays.

[0070] By setting up an electron beam adjustment device, a high-speed electron beam can be focused to generate X-rays, thereby further improving the imaging quality of X-rays.

[0071] Specifically, X-rays pass through the object to be sampled, and the photons in the X-rays that are not absorbed by the object to be sampled hit the image generation circuit board. The image generation circuit board converts the photons in the X-rays into visible light photons, generates electronic data, and generates corresponding electrical signals.

[0072] Specifically, the image generation circuit board converts the obtained electrical signal into a digital signal and generates a corresponding digital image. The communicator outputs multiple digital images to the computer terminal through a data line.

[0073] Among them, the computer terminal is provided with a resolution threshold.

[0074] The resolution threshold is the corresponding resolution at which the computer terminal can clearly distinguish the outline of the object to be sampled when the object to be sampled is imaged.

[0075] In a specific implementation, the resolution of human skeleton X-ray imaging is 550*1700, and the resolution of liver X-ray imaging is 400*1300. It is understandable that those skilled in the art can determine the corresponding resolution threshold according to the type of object to be sampled.

[0076] By setting the resolution threshold, it is convenient to screen the imaging results of each image generation circuit board, so as to optimize the corresponding rotation axis angle.

[0077] Specifically, the computer terminal calculates the resolution of the digital image, and when the resolution is higher than a resolution threshold, the computer terminal outputs the digital image.

[0078] Specifically, when the resolution is lower than the resolution threshold, the computer terminal generates an adjustment instruction, and the adjustment instruction is transmitted to the communicator through the data line.

[0079] Embodiment 3:

[0080] When performing X-ray imaging of liver tissue, the resolution threshold is set to 400*1300. If the computer terminal calculates the digital image resolution to be 500*1400 and determines that the resolution is higher than the resolution threshold, the computer terminal outputs the digital image. If the computer terminal calculates the digital image resolution to be 300*1200 and determines that the resolution is lower than the resolution threshold, the computer terminal generates an adjustment instruction, which is transmitted to the communicator through the data line. After the communicator receives the adjustment instruction, the shaft angle monitoring model calculates the optimal shaft angle corresponding to the main image generation circuit board and the auxiliary image generation circuit board according to the resolution.

[0081] By generating adjustment instructions on a computer terminal, the rotation axis angle of the image generation circuit board can be adjusted to an optimal angle, thereby improving the efficiency of adjusting the X-ray imaging resolution.

[0082] Specifically, the communicator receives the adjustment instruction and adjusts the rotation angle of the image generation circuit board.

[0083] Among them, a shaft angle monitoring model is provided in the communicator. When the communicator receives an adjustment instruction, the shaft angle monitoring model calculates the corresponding optimal shaft angle according to the resolution.

[0084] By setting up a rotation axis angle monitoring model, the resolution scale of X-ray photons is further improved, the imaging quality is improved by increasing the imaging resolution, and the precision information and results of high-definition X-ray imaging of the object are accurately obtained.

[0085] So far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

[0086] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A high-resolution imaging method, characterized in that: There is an image generation strategy, including: Adjust the rotation angle of the image generation circuit board according to the actual outer contour of the object to be sampled; Fixing the image generation circuit board and determining the corresponding actual rotation axis angle; Determining the sampling surface proportion of each of the image generation circuit boards according to the actual outer contour and the actual rotation axis angle; Determining the priority of the corresponding image generation circuit board according to the sampling surface ratio, and determining the verification order of the image generation circuit board according to the priority; Convert the verified image signal into a corresponding electrical signal; Wherein, the rotation axis angle is the angle between the plane of the image generation circuit board and the horizontal line; The higher the sampling surface ratio is, the higher the priority of the image generation circuit board is; The higher the priority of the image generation circuit board, the higher the corresponding verification order; The computer terminal calculates the resolution of the digital image, and when the resolution is higher than the resolution threshold, the computer terminal outputs the digital image; The image generation circuit board converts the obtained electrical signal into a digital signal and generates a corresponding digital image; When the resolution is lower than the resolution threshold, the computer terminal generates an adjustment instruction, and the adjustment instruction is transmitted to the communicator via the data line; The communicator receives the adjustment instruction and adjusts the rotation axis angle of the image generation circuit board. Wherein, a shaft angle monitoring model is provided in the communicator, and when the communicator receives the adjustment instruction, the shaft angle monitoring model calculates the corresponding optimal shaft angle according to the resolution.

2. The high-resolution imaging method according to claim 1, characterized in that: include: Turn on the high-voltage power supply device, apply current to the filament through the high-voltage cable, and generate a high-speed electron beam; adjusting the electron beam adjustment device to focus the high-speed electron beam and generate X-rays; The X-ray passes through the object to be sampled, and the photons in the X-ray that are not absorbed by the object to be sampled hit the image generation circuit board, and generate corresponding electrical signals according to the image generation strategy; The communicator outputs the plurality of digital images to the computer terminal via the data line.

3. The high-resolution imaging method according to claim 2, characterized in that: The image generating circuit boards are arranged at equal intervals, Wherein, the image generation circuit board is provided with a converter, which converts the obtained electrical signal into the digital signal and generates a corresponding digital image.

4. The high-resolution imaging method according to claim 3, characterized in that: The high-voltage power supply device applies a filament current within a preset range to the filament through the high-voltage cable, and at the same time, the DC high voltage generated by the high-voltage power supply device is applied between the filament and the anode target through the high-voltage cable; The high-voltage power supply device is connected to the filament through the high-voltage cable.

5. The high-resolution imaging method according to claim 4, characterized in that: The high-speed electron beam is formed between the filament and the anode target. The electron beam adjustment device is adjusted to focus the high-speed electron beam. The focused high-speed electron beam collides with the anode target to generate the X-ray.

6. The high-resolution imaging method according to claim 3, characterized in that: The X-ray passes through the object to be sampled, and the photons in the X-ray that are not absorbed by the object to be sampled hit the image generation circuit board. The image generation circuit board converts the photons in the X-ray into visible light photons, generates electronic data, and generates corresponding electrical signals.

7. The high-resolution imaging method according to claim 6, characterized in that: The image generation circuit board converts the obtained electrical signal into the digital signal and generates a corresponding digital image. The communicator outputs a plurality of the digital images to the computer terminal via the data line. Wherein, the computer terminal is provided with a resolution threshold. The resolution threshold is a corresponding resolution at which the computer terminal can clearly distinguish the contour of the object to be sampled when the object to be sampled is imaged.

Images