Server and Data Center

Abstract

The present application relates to the technical field of operation and maintenance architectures, and discloses a server and a data center, including: a chassis, a midplane module, a data processing module, a fan module, an expansion module, and a power supply module. The midplane module is disposed inside the chassis and extends along a first direction. The midplane module is built with circuits for signal transmission. At least one data processing module is provided, and the data processing module is located on one side of the midplane module along a second direction and is wirelessly connected to the midplane module. The fan module is wirelessly connected to the midplane module. The expansion module is wirelessly connected to the midplane module and is used for connecting expansion devices. The power supply module is wirelessly connected to the midplane module. Among them, the expansion module, the fan module, the data processing module, and the power supply module are arranged in the chassis along the first direction and perform signal interaction with each other through the midplane module, which can solve or improve the problems that the server cannot meet the PUE index and has high noise.

Description

Technical Field

[0001] This application relates to the technical field of operation and maintenance architecture, specifically to servers and data centers. Background Art

[0002] The high-power components used inside a server mainly include the CPU (Central Processing Unit) and GPU (Graphics Processing Unit), etc. The power consumption of the processor has increased significantly. The maximum power consumption of the processor is above 500W, even exceeding 700W, or even higher.

[0003] In related technologies, servers mainly rely on air cooling. As the power consumption of the processor continues to increase, air cooling has gradually reached the heat dissipation bottleneck; at the same time, as the requirements for PUE (Power Usage Effectiveness) in data centers become increasingly strict, under the influence of high-power processors and the trend of reducing energy consumption, it is necessary to focus on how to improve air cooling.

[0004] To improve the system heat dissipation of the server, the fan speed can be increased, but this will increase the fan power consumption, resulting in an increase in the power consumption of the server system, affecting the PUE index of the data center, and increasing the fan speed will also increase the noise of the data center. Summary of the Invention

[0005] This application provides a server and a data center to solve or improve the problems that the server cannot meet the PUE index and has high noise.

[0006] On the one hand, this application provides a server with intersecting first and second directions, including: a chassis, a midplane module, a data processing module, a fan module, an expansion module, and a power module. The specific solutions are as follows.

[0007] The midplane module is arranged inside the chassis and extends along the first direction. The midplane module has built-in circuits for signal transmission;

[0008] At least one data processing module is provided. The data processing module is located on one side of the midplane module along the second direction and is wirelessly connected to the midplane module;

[0009] The fan module is wirelessly connected to the midplane module;

[0010] The expansion module is wirelessly connected to the midplane module and is used to connect expansion devices;

[0011] The power module is wirelessly connected to the midplane module;

[0012] Among them, the expansion module, the fan module, the data processing module, and the power module are arranged in the chassis along the first direction, and signal interaction is performed between them through the midplane module.

[0013] By arranging a midplane module extending along the first direction in the chassis, arranging the expansion module, the fan module, the data processing module, and the power module in the chassis along the first direction, and all being wirelessly connected to the midplane module, the control signals and power supply signals between the expansion module, the fan module, the data processing module, and the power module can be transmitted through the midplane module. Thus, there is no need to set up cables, the resistance of the heat dissipation air flow generated by the fan module can be reduced, the flow rate of the heat dissipation air flow can be increased, the air-cooled heat dissipation effect inside the server can be improved, the energy consumption of the fan module can be reduced, the PUE index requirements can be met, and the noise can be reduced.

[0014] In an optional implementation manner, one data processing module is provided on each side of the midplane module along the second direction.

[0015] In an optional implementation manner, the data processing module located on one side of the midplane module and the data processing module located on the other side of the midplane module are arranged in central symmetry, and the axis of symmetry of the data processing modules on both sides of the midplane module is perpendicular to both the first direction and the second direction.

[0016] In an optional implementation manner, the data processing module includes a drawer component and a main board unit. The main board unit is arranged on the drawer component. Slots are provided on both side surfaces of the chassis along the second direction. The drawer component is inserted into the slots so that the main board unit is connected to the midplane module along the second direction through hot pluggable connection.

[0017] In an optional implementation manner, the expansion module and the power module are respectively connected to two ends of the midplane module along the first direction. The fan module and the data processing module are located between the expansion module and the power module; among them, the expansion module and the power module are inserted into the chassis along the first direction, and the expansion module is hot pluggably connected to the midplane module.

[0018] In an optional implementation manner, the expansion module includes at least one expansion module. A plurality of expansion slots are provided on one end surface of the expansion module along the first direction. The other end surface of the expansion module along the first direction is hot pluggably connected to the midplane module.

[0019] In an alternative embodiment, the power supply module includes a first signal board, a power supply unit, and an expansion unit. The first signal board extends along the second direction, and the first signal board is plugged into the middle backplane module along the first direction. At least one power supply unit and at least one expansion unit are provided. The power supply unit and the expansion unit are arranged side by side along the second direction and are both wirelessly connected to the first signal board.

[0020] In an alternative embodiment, both the power supply unit and the expansion unit are hot-pluggably connected to a side surface of the first signal board along the first direction, and the other side surface of the first signal board along the first direction is hot-pluggably connected to the middle backplane module.

[0021] In an alternative embodiment, a plurality of ventilation holes are provided on the first signal board; and / or, ventilation grooves are provided on the expansion module.

[0022] In an alternative embodiment, the fan module includes a fan unit and a second signal board. The second signal board extends along the second direction. A plurality of fan units are provided. The plurality of fan units are arranged side by side along the second direction and are wirelessly connected to the second signal board. The second signal board is wirelessly connected to the middle backplane module. The plurality of fan units are divided into two groups and are respectively located on both sides of the middle backplane module.

[0023] In an alternative embodiment, a wind guiding component is further included. The fan module is disposed between the expansion module and the data processing module. Two wind guiding components are provided, which are respectively located on both sides of the middle backplane module and are both located between the fan module and the power supply module.

[0024] In an alternative embodiment, a first control module is provided on the second signal board. The first control module can control the rotational speed difference between the fan units located on both sides of the middle backplane module to be 30% - 45%.

[0025] In an alternative embodiment, a main board high-speed signal plug, a main board low-speed signal plug, and a main board power supply plug that are plugged into the middle backplane module are provided at an edge portion of the main board unit close to the middle backplane module. The main board high-speed signal plug, the main board low-speed signal plug, and the main board power supply plug are spaced apart along the first direction;

[0026] Among them, the main board high-speed signal plug is used to provide high-speed signals to expansion devices, the main board low-speed signal plug is used to provide low-speed control signals and PCIE signals to expansion devices, and to provide low-speed control signals to the fan module and the power supply module.

[0027] In an alternative embodiment, the midplane module includes a board body and a fixing bracket, and the board body is fixed in the chassis through the fixing bracket;

[0028] And / or, on one side of the board body along the second direction, a first expansion interface, a fan control interface, a motherboard high-speed signal interface, a motherboard low-speed signal interface, a motherboard power supply interface, and a first power supply interface are sequentially arranged along the first direction; on the other side of the board body along the second direction, a first expansion interface, a fan power supply interface, a motherboard power supply interface, a motherboard low-speed signal interface, a motherboard high-speed signal interface, and a second expansion interface are sequentially arranged along the first direction; wherein, the two first expansion interfaces located on both sides of the midplane module are respectively used to connect with two expansion modules in the expansion module to transmit control signals and power supply signals; the two groups of motherboard high-speed signal interfaces, the motherboard low-speed signal interfaces, and the motherboard power supply interfaces located on both sides of the midplane module are respectively used to connect with the data processing modules located on both sides of the midplane module; the fan control interface and the fan power supply interface are used to connect with the fan module; the first power supply interface and the second expansion interface are used to connect with the power module.

[0029] On the other hand, the present application also provides a data center, including the server in any of the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the related art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the related art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0031] Figure 1 It is a framework diagram of a server according to an embodiment of the present application;

[0032] Figure 2 It is a front view of an expansion module in a server according to an embodiment of the present application;

[0033] Figure 3 It is a rear view of an expansion module in a server according to an embodiment of the present application;

[0034] Figure 4 It is a rear view of another expansion module in a server according to an embodiment of the present application;

[0035] Figure 5 It is a framework diagram of a fan module in a server according to an embodiment of the present application;

[0036] Figure 6 It is a framework diagram of the motherboard unit in a server according to an embodiment of the present application;

[0037] Figure 7 It is a framework diagram of one side of the midplane module in a server according to an embodiment of the present application;

[0038] Figure 8 It is a framework diagram of the other side of the midplane module in a server according to an embodiment of the present application;

[0039] Figure 9 It is a framework diagram of the second information board in a server according to an embodiment of the present application;

[0040] Figure 10 It is a view of a server according to an embodiment of the present application with an expansion module end provided;

[0041] Figure 11 It is a view of a server according to an embodiment of the present application with a power module end provided;

[0042] Figure 12 It is a view of a server according to an embodiment of the present application with a drawer component side provided;

[0043] Figure 13 It is a framework diagram of the expansion unit in a server according to an embodiment of the present application;

[0044] Figure 14 It is a framework diagram of the power supply unit in a server according to an embodiment of the present application.

[0045] Explanation of reference numerals:

[0046] X, the first direction; Y, the second direction;

[0047] 1, midplane module; 2, data processing module; 3, fan module; 4, expansion module; 5, power module;

[0048] 11, first expansion interface; 12, fan control interface; 13, motherboard high-speed signal interface, 14, motherboard low-speed signal interface; 15, motherboard power supply interface; 16, second expansion interface; 17, fan power supply interface; 18, first power supply interface;

[0049] 21, drawer component; 22, motherboard unit;

[0050] 221, motherboard high-speed signal plug; 222, motherboard low-speed signal plug; 223, motherboard power supply plug;

[0051] 31, fan unit; 32, second signal board;

[0052] 321. Fan control plug; 322. Fan power supply plug; 323. First control module;

[0053] 41. Expansion module; 42. Ventilation slot; 43. First expansion plug;

[0054] 51. First signal board; 52. Power supply unit; 53. Expansion unit;

[0055] 511. First power supply plug; 512. Second expansion plug; 513. Second power supply socket; 514. Third expansion socket;

[0056] 521. Second power supply plug; 531. Third expansion plug. Detailed implementation manners

[0057] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the protection scope of the present application.

[0058] In the related art, servers mainly rely on air cooling. During the process of the continuous increase in the power consumption of processors, air cooling has gradually reached the heat dissipation bottleneck; at the same time, with the increasingly strict requirements for PUE (Power Usage Effectiveness) in data centers, under the influence of high-power processors and the trend of reducing energy consumption, it is necessary to focus on how to improve air cooling.

[0059] To improve the system heat dissipation of the server, the fan speed can be increased, but this will increase the fan power consumption, resulting in an increase in the power consumption of the server system and affecting the PUE index of the data center. Moreover, increasing the fan speed will increase the noise in the data center.

[0060] Therefore, the present application provides a server and a data center to solve or improve the problems that the server cannot meet the PUE index and has high noise.

[0061] The following combines Figures 1 to 14 , and describes the embodiments of the present application.

[0062] According to the embodiments of the present application, on the one hand, a server is provided, having an intersecting first direction X and second direction Y, as Figure 1 shown, including a chassis, a midplane module 1, a data processing module 2, a fan module 3, an expansion module 4, and a power module 5. The specific solutions are as follows.

[0063] AsFigure 1 As shown, the middle backplane module 1 can be fixedly arranged in the chassis by means of snap connection or screwing with the studs in the chassis, and extends along the first direction X. The middle backplane module 1 has a built-in circuit for signal transmission, specifically including control signals, power supply signals, etc.; at least one data processing module 2 is provided, and the data processing module 2 is located on one side of the middle backplane module 1 along the second direction Y and is wirelessly connected to the middle backplane module 1; the fan module 3 is wirelessly connected to the middle backplane module 1; the expansion module 4 is wirelessly connected to the middle backplane module 1 for connecting expansion devices; the power module 5 is wirelessly connected to the middle backplane module 1.

[0064] Among them, the expansion module 4, the fan module 3, the data processing module 2, and the power module 5 are arranged in the chassis along the first direction X, and signal interaction is carried out among them through the middle backplane module 1. Specifically, the signal interaction includes various signals such as control signals and power supply signals that need to be transmitted for the operation of the service area system.

[0065] Specifically, the included angle between the first direction X and the second direction Y can be 60° - 90°, specifically 60°, 70°, 80°, and 90°, preferably 90° ( Figure 1 as shown in the figure), of course, according to specific requirements, it can also be other angles.

[0066] It should be noted that the above "wireless connection" means not connected by cables, and can be connected by means of plug insertion, welding, etc.

[0067] It should be explained that "the data processing module 2 is located on one side of the middle backplane module 1 along the second direction Y" means that the data processing module 2 and the middle backplane module 1 are arranged side by side along the second direction Y.

[0068] It should also be noted that in "the expansion module 4, the fan module 3, the data processing module 2, and the power module 5 are arranged in the chassis along the first direction X", the arrangement order of the expansion module 4, the fan module 3, the data processing module 2, and the power module 5 along the first direction X can be arranged arbitrarily. For example, the fan module 3 can be set at any position along the first direction X in the chassis, and the specific positions are the two ends and the middle position along the first direction X in the chassis, etc. The expansion module 4, the data processing module 2, and the power module 5 can also be adjusted arbitrarily according to specific heat dissipation and other requirements along the first direction X in the chassis.

[0069] Specifically, the chassis can be a metal box, a plastic box, etc., and can be selected according to specific requirements, such as a box with a waterproof material.

[0070] In this embodiment, as Figure 1As shown in the figure, by arranging a middle backplane module 1 extending along the first direction X in the chassis, and arranging the expansion module 4, the fan module 3, the data processing module 2, and the power supply module 5 along the first direction X in the chassis, and all of them are wirelessly connected to the middle backplane module 1, it is possible to realize the transmission of control signals and power supply signals between the expansion module 4, the fan module 3, the data processing module 2, and the power supply module 5 through the middle backplane module 1. Thus, there is no need to set up cables, which can reduce the resistance of the heat dissipation air flow generated by the fan module, increase the flow rate of the heat dissipation air flow, thereby improving the air-cooled heat dissipation effect inside the server, reducing the energy consumption of the fan module 3, meeting the PUE index requirements, and reducing noise.

[0071] In one embodiment, as Figure 1 shown, a data processing module 2 is arranged on both sides of the middle backplane module 1 along the second direction Y, that is, the number of data processing modules 2 is two.

[0072] In this embodiment, by arranging a data processing module 2 on both sides of the middle backplane module 1, the volume of the server can be reduced, and the occupied area of the server can be decreased.

[0073] In some embodiments not shown, a plurality of data processing modules 2 are arranged on both sides of the middle backplane module 1 along the second direction Y; specifically, the number of data processing modules 2 can be 3 to 6, specifically 3, 4, 5, and 6; specifically, if there are multiple data processing modules 2 on one side of the middle backplane module 1, the multiple data processing modules 2 can be arranged side by side along the first direction X and connected to the middle backplane module 1; or the multiple data processing modules 2 can be arranged at intervals and overlapped along the third direction and connected to the middle backplane module 1, where the third direction forms an angle with both the first direction X and the second direction Y. Preferably, any two of the first direction X, the second direction Y, and the third direction are perpendicular to each other.

[0074] In one embodiment, as Figure 1 、 Figure 7 and Figure 8 shown, the data processing module 2 on one side of the middle backplane module 1 is centrosymmetrically arranged with the data processing module 2 on the other side of the middle backplane module 1. The axis of symmetry of the data processing modules 2 on both sides of the middle backplane module 1 is perpendicular to both the first direction X and the second direction Y; that is, the models of the data processing modules 2 on both sides of the middle backplane module 1 are the same. After rotating the data processing module 2 on one side of the middle backplane module 1 by 180° around the center of symmetry, it can be installed on the other side of the middle backplane module 1; that is to say, the universality of the data processing module 2 can be realized.

[0075] In the specific use process, as Figure 1 、 Figure 7 and Figure 8As shown, there are multiple connection parts on the data processing module 2 for connecting to the midplane module 1, and they are of different types. For example, a main board high-speed signal plug 221, a main board low-speed signal plug 222, and a main board power supply plug 223 are provided on the data processing module 2, which are respectively used for plugging into the main board high-speed signal socket 13, the main board low-speed signal socket 14, and the main board power supply socket 15 on the midplane module 1. Then, the main board high-speed signal socket 13, the main board low-speed signal socket 14, and the main board power supply socket 15 located on both sides of the midplane module 1 are also centrosymmetrically arranged.

[0076] In this embodiment, by centrosymmetrically arranging the data processing modules 2 located on both sides of the midplane, the data processing modules 2 located on both sides of the midplane module 1 can be made universal, reducing the development cost of the server.

[0077] In some embodiments not shown, the data processing modules 2 located on both sides of the midplane module 1 can be symmetrically arranged, and the symmetry center plane is perpendicular to the second direction Y; that is, the data processing modules 2 located on both sides of the midplane module 1 are of different models. At this time, the plug-in structures located on both sides of the midplane module 1 for connecting to the data processing module 2 are also symmetric structures.

[0078] In some embodiments not shown, the data processing module 2 located on one side of the midplane module 1 and the data processing module 2 located on the other side of the midplane module 1 are centrosymmetrically arranged, and the axis of symmetry of the data processing modules 2 located on both sides of the midplane module 1 is parallel to the first direction X. At this time, the plug-in structures located on both sides of the midplane module 1 for connecting to the data processing module 2 are also centrosymmetric structures.

[0079] In one embodiment, as Figure 6 and Figure 12 shown, the data processing module 2 includes a drawer component 21 and a main board unit 22. The main board unit 22 can be fixedly arranged on the drawer component 21 by means of a clamping structure or screw connection. As Figure 12 shown, slots are provided on both side surfaces of the chassis along the second direction Y, and the drawer component 21 is plugged into the slots so that the main board unit 22 is connected to the midplane module 1 through hot plugging along the second direction Y.

[0080] Specifically, as Figure 6 and Figure 12As shown, the pull-out component 21 can be a drawer with slide rails installed on both sides, and correspondingly, slide grooves are installed at the positions corresponding to the slide rails in the slot, and an avoidance portion is provided at the position of the drawer close to the mid-back panel module 1, so that the plug on the mainboard unit 22 can be connected to the mid-back panel module 1 through a hot-swap board; of course, the pull-out component 21 can also be a flat plate or other types of structures, as long as it can be blindly plugged into the slot to facilitate blind plugging of the mainboard unit 22 and the mid-back panel module 1.

[0081] In this embodiment, the mainboard unit 22 is fixed on the pull-out component 21, and slots are provided on both sides of the chassis along the second direction Y, and the pull-out component 21 and the slots are plugged in along the second direction Y, thereby not only achieving blind plug-in of the mainboard unit 22 and the mid-backplane module 1, but also facilitating disassembly and assembly; at the same time, the mainboard unit 22 and the mid-backplane module 1 are connected through hot plugging, and when there are multiple data processing modules 2 in the server, the server can be repaired without cutting off the power supply.

[0082] In one embodiment, Figure 1 As shown, the expansion module 4 and the power module 5 are respectively connected to the two ends of the mid-backplane module 1 along the first direction X by plugging, and the fan module 3 and the data processing module 2 are located between the expansion module 4 and the power module 5; Figure 1 As shown, the expansion module 4 and the power module 5 are plugged into the chassis along the first direction X, and the expansion module 4 is hot-pluggably connected to the mid-backplane module 1 .

[0083] Specifically, Figure 2 As shown, the expansion module 4 may be provided with a plurality of connection parts for connecting with expansion devices (such as a solid state drive, a mechanical hard drive, etc.) without cables.

[0084] More specifically, both the expansion module 4 and the power module 5 are provided with a guide portion to cooperate with the guide groove portion in the chassis, so that the expansion module 4 and the chassis are blindly plugged along the first direction X, and the power module 5 and the chassis are blindly plugged along the first direction X. Furthermore, the guide portion can be provided on the edge of the expansion module 4 or the edge of the power module 5, and extend to a rectangular parallelepiped or other structure along the first direction X. As long as it can slide and cooperate with the guide groove portion, the blind installation of the expansion module 4 or the power module 5 along the first direction X can be realized.

[0085] It is worth noting that the plugging direction of the expansion module 4 and the chassis is opposite to the plugging direction of the power module 5 and the chassis.

[0086] In this embodiment, if Figure 1As shown, by respectively arranging the power module 5 and the expansion module 4 at both end positions of the midplane module 1 along the first direction X and plugging them into the midplane module 1 along the first direction X, it is convenient to disassemble and repair the power module 5 and the expansion module 4 when a failure occurs. At the same time, the expansion module 4 is connected to the midplane module 1 through hot pluggable connection, enabling the expansion module 4 to be removed for maintenance without cutting off the power supply of the server, thereby improving the maintenance convenience of the server.

[0087] In a specific embodiment, as Figure 1 shown, the expansion module 4 includes at least one expansion module 41. As Figure 2 shown, a plurality of expansion plug slots are provided on one end face of the expansion module 41 along the first direction X. As Figure 3 and Figure 4 shown, the other end face of the expansion module 41 along the first direction X is connected to the midplane module 1 through hot pluggable connection. Specifically, the number of expansion modules 41 can be 1 to 4, specifically any one of 1, 2, 3, and 4. Preferably, as Figure 1 and Figure 10 shown, the number of expansion modules 41 is preferably 2. When the number of expansion modules 41 exceeds 3, the expansion modules 41 can be wirelessly connected to a circuit board, and the circuit board is then connected to the midplane module 1 through hot pluggable connection.

[0088] Specifically, as Figures 2 to 4 shown, taking the number of expansion modules 41 being 2 as an example, the expansion module 41 is an NVME backplane (NVME, that is, Non-Volatile Memory express, which is a high-performance storage access and transmission protocol). The two NVME backplanes are arranged side by side along the second direction Y.

[0089] On one of the NVME backplanes, as Figure 2 shown, 12 SFF 8639 connectors (also known as U.2 connectors, which are a backplane interface widely used in industrial solid-state drives (SSDs) or hard disk drives (HDDs)) are provided on the side facing the outside of the chassis for expanding 12 NVME SSDs. As Figure 3 shown, the lower right corner of the side facing the inside of the chassis is a first expansion plug 43, specifically a high-density connector, which is used to plug into the midplane module 1 to realize the input of the uplink signal, the input of the low-speed signal, and the power supply of the expansion device.

[0090] On the other NVME backplane, as Figure 2As shown, 12 SFF 8639 connectors (also known as U.2 connectors, which are a type of backplane interface widely used in industrial-grade solid-state drives (SSDs) or hard disk drives (HDDs)) are provided on the side facing the outside of the chassis for expanding 12 NVME SSDs; as Figure 4 As shown, at the lower left corner of the side facing the inside of the chassis is a first expansion plug 43, specifically a high-density connector, which is used to plug into the mid-backplane module 1 to realize the input of the uplink signal, the input of the low-speed signal, and the power supply of the expansion device.

[0091] The 48 PCIE lane signals of the uplink of the two NVME backplanes respectively come from two data processing modules 2, and the low-speed signals of the two NVME backplanes respectively come from the baseboard management controllers of the two data processing modules 2, which are used to monitor the status of 12 NVME SSDs, and the power supply is taken from the mid-backplane.

[0092] Specifically, as Figures 2 to 4 As shown, a plurality of ventilation slots 42 are arranged on the expansion module 41 to facilitate air intake.

[0093] In this embodiment, the expansion module 4 includes at least one expansion sub-module 41. A plurality of expansion slots are provided on one end face of the expansion sub-module 41 along the first direction X. The other end face of the expansion sub-module 41 along the first direction X is connected to the mid-backplane module 1 through hot plugging. Thus, when there are multiple expansion sub-modules 41, disassembly, installation, and maintenance can be carried out in groups, improving the operation efficiency of the server during maintenance.

[0094] In one embodiment, as Figure 1 As shown, the power module 5 includes a first signal board 51, a power supply unit 52, and an expansion unit 53. The first signal board 51 extends along the second direction Y. The first signal board 51 is plugged into the mid-backplane module 1 along the first direction X. At least one power supply unit 52 and at least one expansion unit 53 are provided. The power supply unit 52 and the expansion unit 53 are arranged side by side along the second direction Y and are both wirelessly connected to the first signal board 51.

[0095] It should be noted that the first signal board 51 can transmit interaction signals such as control signals and power supply signals required by the power supply unit 52 and the expansion unit 53 and other components.

[0096] Specifically, the expansion unit 53 is a PCIE expansion board for plugging in a PCIE Riser.

[0097] In this embodiment, by setting the expansion unit 53 in the power module 5, expansion devices can be further added to the server.

[0098] In a specific embodiment, as Figure 1As shown, both the power supply unit 52 and the expansion unit 53 are connected to one side of the first signal board 51 along the first direction X through hot-swap connection, and the other side of the first signal board 51 along the first direction X is connected to the mid-backplane module 1 through hot-swap connection.

[0099] Specifically, as Figure 11 shown, the power supply unit 52 is an AC power supply, and the number is 1 to 2, preferably 2; the expansion unit 53 is a PCIE expansion board, and the number is 1 to 2, preferably 2. Among them, the two expansion units 53 are respectively connected to the two data processing modules 2 for signal connection.

[0100] Specifically, as Figure 9 shown, a second expansion plug 512 and a first power supply plug 511 are provided in the upper middle part of the side of the first signal board 51 close to the mid-backplane module 1 for plugging with the mid-backplane module 1; the second expansion plug 512 realizes the information interaction between the expansion device in the expansion unit 53 and the data processing module 2, and the first power supply plug 511 realizes the power supply to the mid-backplane module 1.

[0101] As Figure 9 shown, at least one third expansion socket 514 and at least one second power supply socket 513 are provided on the side of the first signal board 51 far from the mid-backplane module 1. The third expansion socket 514 is used for plugging with the third expansion plug 531 on the expansion unit 53. As Figure 14 shown, the second power supply socket 513 is used for plugging with the second power supply plug 521 on the power supply unit 52.

[0102] More specifically, as Figure 9 shown, the second power supply socket 513 is a CRPS socket (Common Redundant Power Supply, a standardized server power supply specification); as Figure 13 shown, the third expansion socket 514 is a PCIE Riser (PCIE + power supply) - female head, connected to the expansion unit 53, and the power supply is directly taken from the first signal board 51. The 32 upstream PCIE lanes come from one data processing module 2. As Figure 13 shown, each expansion unit 53 can expand 1 x16 slot and 2 x8 slots.

[0103] The second expansion plug 512 is a low-speed signal - male head, which is connected to the second expansion interface 16 of the mid-backplane module 1. The second expansion interface 16 is specifically a PCIE Riser ~ female head. The upstream PCIE signals come from 32 PCIE Lanes of 2 data processing modules 2 respectively, and the low-speed signals come from the baseboard management controllers of the two data processing modules 2, which are respectively connected to 2 expansion units 53 for monitoring and management of PCIE devices, and are also connected to the power supply unit 52 for power monitoring and management. The power supply unit 52 can also be called PSU (Power Supply Unit, that is, power supply unit).

[0104] In one embodiment, a plurality of ventilation holes are provided on the first signal board 51; and / or, as Figure 2 shown, a ventilation slot 42 is provided on the expansion module 4; specifically, the shape of the ventilation holes can be set according to the shape of other components on the first signal board 51, and the common shapes include rectangle, circle, etc.; the ventilation slot 42 is provided between two adjacent expansion devices on the expansion module 4, and is rectangular, and can also be set to other shapes according to requirements, such as circle, etc.

[0105] In this embodiment, by providing ventilation holes on the first signal board 51 and a ventilation slot 42 on the expansion module 4, the resistance to the air-cooled airflow can be reduced, the heat dissipation efficiency can be improved, the energy consumption of the fan module can be reduced, and the noise can be reduced.

[0106] In one embodiment, as Figure 1 and Figure 5 shown, the fan module 3 includes a fan unit 31 and a second signal board 32. The second signal board 32 extends along the second direction Y. A plurality of fan units 31 are provided, and the plurality of fan units 31 are arranged side by side along the second direction Y, and are wirelessly connected to the second signal board 32 by plugging or welding. The second signal board 32 is wirelessly connected to the mid-backplane module 1 by plugging or welding. As Figure 1 shown, the plurality of fan units 31 are divided into two groups and are respectively located on both sides of the mid-backplane module 1.

[0107] Specifically, the fan unit 31 is a 6056 fan module; the number of fan units 31 is 4 to 8, specifically any one of 4, 6, and 8. Preferably, the number of fan units 31 is 6 (as described in the figure), and 3 are provided on each side of the mid-backplane module 1.

[0108] Specifically, as Figure 5 shown, a fan control plug 321 and a fan power supply plug 322 are provided on the second signal board 32 to be plugged into the fan control interface 12 and the fan power supply interface 17 on the mid-backplane module 1. More specifically, both the fan control plug 321 and the fan power supply plug 322 are a kind of high-density connector.

[0109] In this embodiment, as Figure 1 shown, multiple fan units 31 are wirelessly connected to the second signal board 32. The second signal board 32 is connected to the middle backplane module 1. The multiple fan units 31 are divided into two groups and are respectively located on both sides of the middle backplane module 1. And they are respectively speed-controlled by the data processing modules 2 located on both sides of the middle backplane module 1 to perform air-cooling on the data processing modules 2 located on both sides of the middle backplane module 1, which can improve the accuracy of system temperature control.

[0110] In one embodiment, each fan unit 31 is plugged into the chassis along the first direction X, and each fan unit 31 is hot-pluggably connected to the second signal board 32 along the first direction X; specifically, a guiding groove extending along the first direction X is provided in the chassis, and a sliding block corresponding to the guiding groove is provided on the outer periphery of the fan unit 31. By the sliding fit between the sliding block and the guiding groove, the fan unit 31 is slidably plugged into the chassis to realize the hot-pluggable connection between the fan unit 31 and the second signal board 32.

[0111] During the specific maintenance process of the server, when it is found that a certain fan unit 31 fails, first remove the expansion module 41 corresponding to the position of the faulty fan unit 31 in the expansion module 4 from the front window end of the server, and then remove the faulty fan unit 31 from the front window of the server for replacement, so that the server can be repaired for the fan unit 31 without power-off shutdown.

[0112] In one embodiment, the server further includes a wind guiding component. The fan module 3 is arranged between the expansion module 4 and the data processing module 2. There are two wind guiding components, which are respectively located on both sides of the middle backplane module 1 and are both located between the fan module 3 and the power module 5.

[0113] Specifically, the wind guiding component is two wind guiding plates extending along the first direction X. As for the shape surface of the wind guiding component along the first direction X, it can be selected and set according to specific requirements.

[0114] In this embodiment, by arranging the fan module 3 between the expansion module 4 and the data processing module 2, the air-cooling effect on the data processing module 2 can be enhanced; and by arranging the two wind guiding components on both sides of the middle backplane module 1 and both located between the fan module 3 and the power module 5, the leakage of the air flow can be reduced and the air-cooling effect on the data processing module 2 can be improved.

[0115] In one embodiment, as Figure 5As shown in the figure, a first control module 323 is provided on the second signal board 32, specifically a CPLD (Complex Programmable Logic Device, which is a complex programmable logic device). The first control module 323 can control the rotational speed difference of the fan units 31 on both sides of the mid-backplane module 1 to be 30% - 45%; specifically, the rotational speed difference of the fan units 31 on both sides of the mid-backplane module 1 is any one of 30%, 35%, 40%, and 45%, preferably 40%.

[0116] In the specific usage process, when one data processing module 2 controls the rotational speed of the fan unit 31 on its corresponding side to be 80%, and the other data processing module 2 controls the rotational speed of the fan unit 31 on its corresponding side to be 30%, in order to avoid too large a rotational speed difference between the fan units 31 on both sides of the mid-backplane module 1, causing backflow, the first control module 323 can increase the rotational speed of the fan unit 31 with a lower rotational speed, increasing its rotational speed from 30% to 40%, so that the rotational speed difference is 40%.

[0117] After the first control module 323 detects an abnormality in the baseboard management controller on the data processing module 2 through the hardware watchdog, it can control the fan unit 31 to dissipate heat from the server at full speed.

[0118] In this embodiment, by setting the first control module 323, the rotational speed difference between the fan units 31 on both sides of the mid-backplane module 1 is adjusted, thereby reducing backflow and improving the air-cooling effect.

[0119] In one embodiment, as Figure 6 shown, at the edge part of the motherboard unit 22 close to the mid-backplane module 1, there are a motherboard high-speed signal plug 221, a motherboard low-speed signal plug 222, and a motherboard power supply plug 223 inserted into the mid-backplane module 1. The motherboard high-speed signal plug 221, the motherboard low-speed signal plug 222, and the motherboard power supply plug 223 are arranged at intervals along the first direction X.

[0120] Among them, the motherboard high-speed signal plug 221 is used to provide high-speed signals to the expansion device, and the motherboard low-speed signal plug 222 is used to provide low-speed control signals and PCIE signals to the expansion device, as well as to provide low-speed control signals to the fan module 3 and the power module 5.

[0121] Specifically, the motherboard high-speed signal plug 221 is a PCIE X48 / high-density connector - male head, the motherboard low-speed signal plug 222 is a PCIE X32 / high-density connector - male head, and the motherboard power supply plug 223 is a power supply male head.

[0122] In this embodiment, the main board unit 22 is hot-pluggably connected to the mid-backplane module 1 through the main board high-speed signal plug 221, the main board low-speed signal plug 222, and the main board power supply plug 223, enabling the interaction of various signals.

[0123] In one embodiment, the mid-backplane module 1 includes a board body and a fixing bracket. The board body is fixed in the chassis through the fixing bracket. Specifically, the board body is a circuit board with a thickness of 3 mm to 5 mm, and the fixing bracket is a plastic bracket.

[0124] As Figure 7 shown, on one side of the board body along the second direction Y, a first expansion interface 11, a fan control interface 12, a main board high-speed signal interface 13, a main board low-speed signal interface 14, a main board power supply interface 15, and a first power supply interface 18 are sequentially arranged along the first direction X.

[0125] As Figure 8 shown, on the other side of the board body along the second direction Y, a first expansion interface 11, a fan power supply interface 17, a main board power supply interface 15, a main board low-speed signal interface 14, a main board high-speed signal interface 13, and a second expansion interface 16 are sequentially arranged along the first direction X.

[0126] Among them, the two first expansion interfaces 11 located on both sides of the mid-backplane module 1 are respectively used to connect with two expansion modules 41 in the expansion module 4 to transmit control signals and power supply signals;

[0127] Specifically, as Figure 7 , Figure 8 and Figure 3 shown, the first expansion interface is connected to the first expansion plug 43 on the expansion module 41. The 48 upstream PCIE lane signals come from the processor in the data processing module 2, and the upstream low-speed signals come from the baseboard management controller of the data processing module 2. The power supply comes from the first signal board 51.

[0128] As Figure 7 , Figure 8 and Figure 6 shown, two groups of main board high-speed signal interfaces 13, main board low-speed signal interfaces 14, and main board power supply interfaces 15 located on both sides of the mid-backplane module 1 are respectively used to connect with the data processing modules 2 located on both sides of the mid-backplane module 1.

[0129] Specifically, the high-speed signal interface is a PCIE X48 / high-density connector - female head, which is connected to the PCIE X48 / high-density connector - male head of the motherboard unit 22. The 48 upstream PCIE lane signals come from the processor of the data processing module 2 and are used to provide the PCIE signals of the data processing module 2 to the NVME SSD in the expansion module 4 and the PCIE devices in the expansion unit 53.

[0130] The low-speed signal interface 14 of the motherboard is a PCIE X32 / high-density connector - female head, which is connected to the PCIE X32 / high-density connector - male head of the motherboard unit 22. The 32 upstream PCIE lane signals come from the processor of the data processing module 2 and are used to provide the PCIE signals of the data processing module 2 to the NVME SSD in the expansion module 4 and the PCIE devices in the expansion unit 53. The low-speed signals come from the processor and the baseboard management controller of node 1 and are used to provide the PCIE signals of the data processing module 2 to the NVME SSD in the expansion module 4 and the PCIE devices in the expansion unit 53, and to provide the low-speed control signals output by the data processing module 2 to the power supply unit 52 and the fan module 3.

[0131] As Figure 7 、 Figure 8 and Figure 6 shown, the motherboard power supply interface 15 is a power supply female head, which is connected to the power supply male head of the motherboard unit 22 and is used to supply power to the data processing module 2.

[0132] As Figure 7 、 Figure 8 and Figure 5 shown, the fan control interface 12 and the fan power supply interface 17 are used to connect to the fan module 3. Specifically, the fan control interface 12 is a female head, which is connected to the fan control plug 321 (male head) on the second signal board 32; the upstream controller signals come from the baseboard management controllers of two data processing modules 2, and combined with the heat dissipation regulation strategy, they send out the PWM signal for controlling the rotation speed of the fan unit 31 and the TACH signal for obtaining the fan rotation speed information; the fan power supply interface 17 is a female head, which is connected to the fan power supply plug 322 (male head) on the second signal board 32 to supply power to the fan unit 31.

[0133] As Figure 7 、 Figure 8 and Figure 9 shown, the first power supply interface 18 and the second expansion interface 16 are used to connect to the power module 5. Specifically, the first power supply interface 18 is connected to the first power supply plug 511 on the first signal board 51, and the second expansion interface 16 is connected to the second expansion plug 512 on the expansion unit 53.

[0134] In this embodiment, the middle backplane module 1 is connected to the extension module 4, the fan module 3, the data processing module 2 and the power module 5 through plugs and plug interfaces, which has a simple structure and is easy to install.

[0135] The following is a comprehensive description of all the above solutions using an embodiment.

[0136] This embodiment provides a server having a first direction X and a second direction Y intersecting each other, such as Figure 1 As shown, it includes a chassis, a mid-backplane module 1, a data processing module 2, a fan module 3, an expansion module 4 and a power supply module 5. The specific scheme is as follows.

[0137] like Figure 1 As shown, the mid-backplane module 1 can be fixed in the chassis by snap-fitting or screwing an I-nail with a stud in the chassis, and extends along a first direction X. The mid-backplane module 1 has a built-in circuit for signal transmission, including control signals and power supply signals, etc.; at least one data processing module 2 is provided, and the data processing module 2 is located on one side of the mid-backplane module 1 along the second direction Y, and is wirelessly connected to the mid-backplane module 1; the fan module 3 is wirelessly connected to the mid-backplane module 1; the extension module 4 is wirelessly connected to the mid-backplane module 1, and is used to connect an extension device; the power supply module 5 is wirelessly connected to the mid-backplane module 1.

[0138] Among them, the expansion module 4, the fan module 3, the data processing module 2 and the power supply module 5 are arranged in the chassis along the first direction X, and signal interaction is performed between them through the mid-backplane module 1. Specifically, the signal interaction includes control signals, power supply signals and other various signals that need to be transmitted for the operation of the service area system.

[0139] Specifically, the angle between the first direction X and the second direction Y may be 60° to 90°, specifically 60°, 70°, 80° and 90°, preferably 90° ( Figure 1 Of course, other angles are possible according to specific needs.

[0140] Specifically, the chassis can be a metal box or a plastic box, etc., and can be selected according to specific needs, such as a box with waterproof material.

[0141] Further, such as Figure 1 As shown, a data processing module 2 is disposed on both sides of the mid-backplane module 1 along the second direction Y, that is, the number of the data processing modules 2 is two.

[0142] Further, such as Figure 1 , Figure 7 and Figure 8As shown in the figure, the data processing module 2 located on one side of the middle backplane module 1 is symmetrically arranged with the data processing module 2 located on the other side of the middle backplane module 1. The axis of symmetry of the data processing modules 2 located on both sides of the middle backplane module 1 is perpendicular to both the first direction X and the second direction Y; that is, the models of the data processing modules 2 located on both sides of the middle backplane module 1 are the same. After rotating the data processing module 2 located on one side of the middle backplane module 1 by 180° around the center of symmetry, it can be installed on the other side of the middle backplane module 1; that is to say, the universality of the data processing module 2 can be realized.

[0143] Further, as Figure 6 and Figure 12 shown, the data processing module 2 includes a drawer component 21 and a main board unit 22. The main board unit 22 can be fixedly arranged on the drawer component 21 by means of a clamping structure or screw connection. As Figure 12 shown, slots are provided on both side surfaces of the chassis along the second direction Y. The drawer component 21 is inserted into the slots so that the main board unit 22 is connected to the middle backplane module 1 by hot plugging along the second direction Y.

[0144] Specifically, as Figure 6 and Figure 12 shown, the drawer component 21 can be a drawer with slide rails installed on both sides. Correspondingly, sliding grooves are installed at the positions corresponding to the slide rails in the slots. An avoidance part is provided at the part of the drawer close to the middle backplane module 1 to facilitate the plug on the main board unit 22 to be connected to the middle backplane module 1 by hot plugging; of course, the drawer component 21 can also be of various types of structures such as a flat plate, as long as it can achieve blind plugging with the slot and facilitate the blind plug connection between the main board unit 22 and the middle backplane module 1.

[0145] Further, as Figure 1 shown, the expansion module 4 and the power supply module 5 are respectively connected to the two ends of the middle backplane module 1 along the first direction X by plugging. The fan module 3 and the data processing module 2 are located between the expansion module 4 and the power supply module 5; among them, as Figure 1 shown, the expansion module 4 and the power supply module 5 are plugged into the chassis along the first direction X, and the expansion module 4 is hot-pluggable with the middle backplane module 1.

[0146] Specifically, as Figure 2 shown, the expansion module 4 can be provided with a plurality of connection parts for wireless connection with expansion devices (such as solid state drives, mechanical hard drives, etc.).

[0147] More specifically, both the expansion module 4 and the power module 5 are provided with a guide portion to cooperate with the guide groove portion in the chassis, so that the expansion module 4 and the chassis are blindly plugged along the first direction X, and the power module 5 and the chassis are blindly plugged along the first direction X. Furthermore, the guide portion can be provided on the edge of the expansion module 4 or the edge of the power module 5, and extend to a rectangular parallelepiped or other structure along the first direction X. As long as it can slide and cooperate with the guide groove portion, the blind installation of the expansion module 4 or the power module 5 along the first direction X can be realized.

[0148] It is worth noting that the plugging direction of the expansion module 4 and the chassis is opposite to the plugging direction of the power module 5 and the chassis.

[0149] Further, such as Figure 1 As shown, the expansion module 4 includes at least one expansion module 41, such as Figure 2 As shown, the expansion module 41 is provided with a plurality of expansion slots on one end surface along the first direction X. Figure 3 and Figure 4 As shown, the other end face of the extension module 41 along the first direction X is connected to the mid-backplane module 1 through hot plugging. Specifically, the number of the extension modules 41 can be 1 to 4, specifically any one of 1, 2, 3 and 4. Preferably, as shown in FIG. Figure 1 and Figure 10 As shown, the number of extension modules 41 is preferably 2; when the number of extension modules 41 exceeds 3, the extension modules 41 can be wirelessly connected to a circuit board, and the circuit board is then hot-plugged to the mid-backplane module 1.

[0150] Specifically, Figures 2 to 4 As shown, taking the number of expansion modules 41 as 2 as an example, the expansion module 41 is an NVME backplane (NVME, i.e. Non-Volatile Memory express, is a high-performance storage access and transmission protocol); the two NVME backplanes are both along the second direction Y, and the two NVME backplanes are arranged side by side along the second direction Y.

[0151] On one of the NVME backplanes, such as Figure 2 As shown, 12 SFF 8639 connectors (also known as U.2 connectors, which are a backplane interface widely used in industrial-grade solid-state drives (SSDs) or mechanical hard drives (HDDs)) are arranged on the side facing the outside of the chassis to expand 12 NVME SSDs; Figure 3 As shown, at the lower right corner of the side facing the inside of the chassis is a first expansion plug 43, which is specifically a high-density connector for plugging with the mid-backplane module 1 to implement the input of uplink signals of the expansion device, the input of low-speed signals and power supply.

[0152] On another NVMe backplane, as Figure 2 shown, there are 12 SFF 8639 connectors (also known as U.2 connectors, which are a type of backplane interface widely used in industrial solid-state drives (SSDs) or hard disk drives (HDDs)) provided on the side facing the outside of the chassis for expanding 12 NVMe SSDs; as Figure 4 shown, at the lower left corner of the side facing the inside of the chassis is a first expansion plug 43, specifically a high-density connector, for plugging into the mid-backplane module 1 to achieve the input of the uplink signals, the input of low-speed signals, and power supply of the expansion device.

[0153] The 48 PCIE lane signals of the two NVMe backplanes for the uplink respectively come from two data processing modules 2, and the low-speed signals of the two NVMe backplanes respectively come from the baseboard management controllers of the two data processing modules 2, which are used to monitor the status of 12 NVMe SSDs, and the power supply is taken from the mid-backplane.

[0154] Specifically, as Figures 2 to 4 shown, a plurality of ventilation slots 42 are arranged on the expansion module 41 to facilitate air intake.

[0155] Furthermore, as Figure 1 shown, the power module 5 includes a first signal board 51, a power supply unit 52, and an expansion unit 53. The first signal board 51 extends along the second direction Y, and the first signal board 51 is plugged into the mid-backplane module 1 along the first direction X. At least one power supply unit 52 and one expansion unit 53 are provided. The power supply unit 52 and the expansion unit 53 are arranged side by side along the second direction Y and are both wirelessly connected to the first signal board 51.

[0156] It should be noted that the first signal board 51 can transmit interaction signals such as control signals and power supply signals required by the power supply unit 52 and the expansion unit 53 and other components.

[0157] Specifically, the expansion unit 53 is a PCIE expansion board for plugging in a PCIE Riser.

[0158] Furthermore, as Figure 1 shown, both the power supply unit 52 and the expansion unit 53 are hot-swappably connected to one side of the first signal board 51 along the first direction X, and the other side of the first signal board 51 along the first direction X is hot-swappably connected to the mid-backplane module 1.

[0159] Specifically, as Figure 11 shown, the power supply unit 52 is an AC power supply, and the number is 1 to 2, preferably 2; the expansion unit 53 is a PCIE expansion board, and the number is 1 to 2, preferably 2. Among them, the two expansion units 53 are respectively signal-connected to the two data processing modules 2.

[0160] Specifically, as Figure 9 shown, on the upper middle part of the side of the first signal board 51 close to the middle backplane module 1, a second expansion plug 512 and a first power supply plug 511 are provided for plugging into the middle backplane module 1; the second expansion plug 512 realizes the information interaction between the expansion devices in the expansion unit 53 and the data processing module 2, and the first power supply plug 511 realizes supplying power to the middle backplane module 1.

[0161] As Figure 9 shown, on the upper side of the side of the first signal board 51 far from the middle backplane module 1, at least one third expansion socket 514 and at least one second power supply socket 513 are provided. The third expansion socket 514 is used for plugging into the third expansion plug 531 on the expansion unit 53. As Figure 14 shown, the second power supply socket 513 is used for plugging into the second power supply plug 521 on the power supply unit 52.

[0162] More specifically, as Figure 9 shown, the second power supply socket 513 is a CRPS socket (Common Redundant Power Supply, a standardized server power supply specification); as Figure 13 shown, the third expansion socket 514 is a PCIE Riser (PCIE + power supply) ~ female head, connected to the expansion unit 53, and the power supply directly draws power from the first signal board 51. The 32 upstream PCIE lanes come from one data processing module 2. As Figure 13 shown, each expansion unit 53 can expand 1 x16 slot and 2 x8 slots.

[0163] The second expansion plug 512 is a low-speed signal - male head, connected to the second expansion socket 16 of the middle backplane module 1. The second expansion socket 16 is specifically a PCIE Riser ~ female head. The upstream PCIE signals respectively come from 32 PCIE Lanes of 2 data processing modules 2, and the low-speed signals come from the baseboard management controllers of the two data processing modules 2, which are respectively connected to 2 expansion units 53 for monitoring and management of PCIE devices, and are also connected to the power supply unit 52 for monitoring and management of the power supply. The power supply unit 52 can also be called PSU (Power Supply Unit, that is, the power supply unit).

[0164] Furthermore, a plurality of ventilation holes are provided on the first signal board 51; and / or, as Figure 2As shown, ventilation slots 42 are provided on the expansion module 4; specifically, the shape of the ventilation holes can be set according to the shapes of other components on the first signal board 51, and common shapes include rectangles, circles, etc.; the ventilation slots 42 are arranged between two adjacent expansion devices on the expansion module 4, in a rectangular shape, and can also be set to other shapes according to requirements, such as circles, etc.

[0165] Further, as Figure 1 and Figure 5 shown, the fan module 3 includes a fan unit 31 and a second signal board 32. The second signal board 32 extends along the second direction Y. A plurality of fan units 31 are provided, and the plurality of fan units 31 are arranged side by side along the second direction Y, and are wirelessly connected to the second signal board 32 by plugging or welding. The second signal board 32 is wirelessly connected to the mid-backplane module 1 by plugging or welding, as Figure 1 shown, the plurality of fan units 31 are divided into two groups and are respectively located on both sides of the mid-backplane module 1.

[0166] Specifically, the fan unit 31 is a 6056 fan module; the number of fan units 31 is 4 to 8, specifically any one of 4, 6, and 8. Preferably, the number of fan units 31 is 6 (as described in the figure), with 3 on each side of the mid-backplane module 1.

[0167] Specifically, as Figure 5 shown, a fan control plug 321 and a fan power supply plug 322 are provided on the second signal board 32 to be plugged into the fan control socket 12 and the fan power supply socket 17 on the mid-backplane assembly. More specifically, both the fan control plug 321 and the fan power supply plug 322 are a type of high-density connector.

[0168] Further, each fan unit 31 is plugged into the chassis along the first direction X, and each fan unit 31 is hot-pluggably connected to the second signal board 32 along the first direction X; specifically, a guide groove extending along the first direction X is provided in the chassis, and a slider corresponding to the chute is provided on the outer periphery of the fan unit 31. By sliding the slider in cooperation with the guide groove, the fan unit 31 is slidably plugged into the chassis to achieve the hot-pluggable connection between the fan unit 31 and the second signal board 32.

[0169] During the specific maintenance process of the server, when it is found that a certain fan unit 31 fails, first remove the expansion module 41 corresponding to the position of the faulty fan unit 31 in the expansion module 4 from the front window end of the server, and then remove the faulty fan unit 31 from the front window of the server for replacement, so that the server can be repaired for the fan unit 31 without power-off and shutdown.

[0170] Further, the server further includes a air guiding component. The fan module 3 is disposed between the expansion module 4 and the data processing module 2. There are two air guiding components, which are respectively located on both sides of the midplane module 1 and are both located between the fan module 3 and the power supply module 5.

[0171] Specifically, the air guiding component is two air guiding plates extending along the first direction X. As for the surface shape of the air guiding component along the first direction X, it can be selected and set according to specific requirements.

[0172] Further, as Figure 5 shown, a first control module 323 is disposed on the second signal board 32, specifically a CPLD (Complex Programmable Logic Device, which is a complex programmable logic device). The first control module 323 can control the rotational speed difference between the fan units 31 on both sides of the midplane module 1 to be 30% - 45%; specifically, the rotational speed difference between the fan units 31 on both sides of the midplane module 1 is any one of 30%, 35%, 40% and 45%, preferably 40%.

[0173] During the specific use process, when one data processing module 2 controls the rotational speed of the fan unit 31 on its corresponding side to be 80%, and the other data processing module 2 controls the rotational speed of the fan unit 31 on its corresponding side to be 30%, in order to avoid too large a rotational speed difference between the fan units 31 on both sides of the midplane module 1, causing backflow, the first control module 323 can increase the rotational speed of the fan unit 31 with a lower rotational speed, increasing its rotational speed from 30% to 40%, so that the rotational speed difference is 40%.

[0174] After the first control module 323 detects an abnormality in the baseboard management controller on the data processing module 2 through the hardware watchdog, it can control the fan unit 31 to dissipate heat from the server at full speed.

[0175] Further, as Figure 6 shown, at the edge part of the motherboard unit 22 close to the midplane module 1, there are a motherboard high-speed signal plug 221, a motherboard low-speed signal plug 222 and a motherboard power supply plug 223 inserted into the midplane module 1. The motherboard high-speed signal plug 221, the motherboard low-speed signal plug 222 and the motherboard power supply plug 223 are arranged at intervals along the first direction X.

[0176] Among them, the motherboard high-speed signal plug 221 is used to provide high-speed signals to the expansion device, and the motherboard low-speed signal plug 222 is used to provide low-speed control signals and PCIE signals to the expansion device, as well as to provide low-speed control signals to the fan module 3 and the power supply module 5.

[0177] Specifically, the main board high-speed signal plug 221 is a PCIE X48 / high-density connector - male head, the main board low-speed signal plug 222 is a PCIE X32 / high-density connector - male head, and the main board power supply plug 223 is a power supply male head.

[0178] Further, the mid-backplane module 1 includes a board body and a fixing bracket. The board body is fixed in the chassis through the fixing bracket. Specifically, the board body is a circuit board with a thickness of 3 mm to 5 mm, and the fixing bracket is a plastic bracket.

[0179] As Figure 7 shown, on one side of the board body along the second direction Y, a first expansion interface 11, a fan control interface 12, a main board high-speed signal interface 13, a main board low-speed signal interface 14, a main board power supply interface 15, and a first power supply interface 18 are sequentially arranged along the first direction X.

[0180] As Figure 8 shown, on the other side of the board body along the second direction Y, a first expansion interface 11, a fan power supply interface 17, a main board power supply interface 15, a main board low-speed signal interface 14, a main board high-speed signal interface 13, and a second expansion interface 16 are sequentially arranged along the first direction X.

[0181] Among them, the two first expansion interfaces 11 located on both sides of the mid-backplane module 1 are respectively used to connect with the two expansion modules 41 in the expansion module 4 to transmit control signals and power supply signals;

[0182] Specifically, as Figure 7 , Figure 8 and Figure 3 shown, the first expansion interface is connected to the first expansion plug 43 on the expansion module 41. The 48 PCIE lane signals going upstream come from the processor in the data processing module 2, the low-speed signals going upstream come from the baseboard management controller of the data processing module 2, and the power supply comes from the first signal board 51.

[0183] As Figure 7 , Figure 8 and Figure 6 shown, two groups of main board high-speed signal interfaces 13, main board low-speed signal interfaces 14, and main board power supply interfaces 15 located on both sides of the mid-backplane module 1 are respectively used to connect with the data processing modules 2 located on both sides of the mid-backplane module 1.

[0184] Specifically, the high-speed signal interface is a PCIE X48 / high-density connector - female head, which is connected to the PCIE X48 / high-density connector - male head of the motherboard unit 22. The 48 upstream PCIE lane signals come from the processor of the data processing module 2 and are used to provide the PCIE signals of the data processing module 2 to the NVME SSD in the expansion module 4 and the PCIE devices in the expansion unit 53.

[0185] The low-speed signal interface 14 of the motherboard is a PCIE X32 / high-density connector - female head, which is connected to the PCIE X32 / high-density connector - male head of the motherboard unit 22. The 32 upstream PCIE lane signals come from the processor of the data processing module 2 and are used to provide the PCIE signals of the data processing module 2 to the NVME SSD in the expansion module 4 and the PCIE devices in the expansion unit 53. The low-speed signals come from the processor and the baseboard management controller of node 1 and are used to provide the PCIE signals of the data processing module 2 to the NVME SSD in the expansion module 4 and the PCIE devices in the expansion unit 53, and to provide the low-speed control signals output by the data processing module 2 to the power supply unit 52 and the fan module 3.

[0186] As Figure 7 、 Figure 8 and Figure 6 shown, the motherboard power supply interface 15 is a power supply female head, which is connected to the power supply male head of the motherboard unit 22 and is used to supply power to the data processing module 2.

[0187] As Figure 7 、 Figure 8 and Figure 5 shown, the fan control interface 12 and the fan power supply interface 17 are used to connect to the fan module 3. Specifically, the fan control interface 12 is a female head, which is connected to the fan control plug 321 (male head) on the second signal board 32. The upstream controller signals come from the baseboard management controllers of the two data processing modules 2, and combine with the heat dissipation regulation strategy to issue the PWM signal for controlling the rotation speed of the fan unit 31 and the TACH signal for obtaining the fan rotation speed information. The fan power supply interface 17 is a female head, which is connected to the fan power supply plug 322 (male head) on the second signal board 32 to supply power to the fan unit 31.

[0188] As Figure 7 、 Figure 8 and Figure 9 shown, the first power supply interface 18 and the second expansion interface 16 are used to connect to the power supply module 5. Specifically, the first power supply interface 18 is connected to the first power supply plug 511 on the first signal board 51, and the second expansion interface 16 is connected to the second expansion plug 512 on the expansion unit 53.

[0189] During the assembly process of the above server, asFigure 1 As shown, first fix the second signal board 32 inside the chassis, and then install the mid-backplane module 1 inside the chassis.

[0190] Insert the fan unit 31 into the chassis along the first direction X from the front window of the server, so that the fan unit 31 is in hot-swap connection with the second signal board 32.

[0191] Insert two expansion modules 41 into the front window of the chassis, so that the expansion modules 41 are in hot-swap connection with the mid-backplane module 1.

[0192] Insert two drawer components 21 with the motherboard units 22 fixed respectively into the chassis from the slots on both sides of the chassis, so that the motherboard units 22 are in hot-swap connection with the mid-backplane module 1.

[0193] Insert the first signal board 51 into the chassis along the first direction X from the rear window of the server, so that the first signal board 51 is in hot-swap connection with the mid-backplane module 1.

[0194] Insert the expansion unit 53 and the power supply unit 52 into the chassis along the first direction X, so that both the expansion unit 53 and the power supply unit 52 are in hot-swap connection with the first signal board 51.

[0195] The above assembly method of the server can enable the repair of multiple components without powering off the server.

[0196] According to an embodiment of the present application, on the other hand, a data center is provided, including the server in any one of the above embodiments.

[0197] In this embodiment, the data center includes the above server and has the same technical effects as the above server.

[0198] Although the embodiments of the present application are described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present application, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A server having a first direction (X) and a second direction (Y) intersecting each other, characterized in that: include: Chassis; A mid-backplane module (1) is arranged in the chassis and extends along the first direction (X), the mid-backplane module (1) having a built-in circuit for signal transmission; A data processing module (2), at least one of which is provided, the data processing module (2) being located on one side of the mid-backplane module (1) along the second direction (Y) and being wirelessly connected to the mid-backplane module (1); A fan module (3) wirelessly connected to the mid-backplane module (1); An extension module (4) wirelessly connected to the mid-backplane module (1) and used for connecting an extension device; A power module (5) wirelessly connected to the mid-backplane module (1); The expansion module (4), the fan module (3), the data processing module (2) and the power supply module (5) are arranged in the chassis along the first direction (X), and perform signal exchange with each other through the mid-backplane module (1); One data processing module (2) is arranged on each of the two sides of the mid-backplane module (1) along the second direction (Y); The fan module (3) comprises a fan unit (31), wherein a plurality of the fan units (31) are provided, the plurality of the fan units (31) are arranged side by side along the second direction (Y), and the plurality of the fan units (31) are arranged in two groups and are respectively located on two sides of the mid-backplane module (1).

2. The server according to claim 1, characterized in that: The data processing module (2) located on one side of the mid-backplane module (1) is centrally symmetrically arranged with the data processing module (2) located on the other side of the mid-backplane module (1), and the symmetry axes of the data processing modules (2) located on both sides of the mid-backplane module (1) are perpendicular to both the first direction (X) and the second direction (Y).

3. The server according to any one of claims 1 to 2, characterized in that: The data processing module (2) comprises a drawer component (21) and a mainboard unit (22); the mainboard unit (22) is arranged on the drawer component (21); slots are arranged on both side surfaces of the chassis along the second direction (Y); the drawer component (21) is plugged into the slots, so that the mainboard unit (22) is connected to the mid-backplane module (1) along the second direction (Y) by hot plugging.

4. The server according to any one of claims 1 to 2, characterized in that: The expansion module (4) and the power module (5) are respectively connected to two ends of the mid-backplane module (1) along the first direction (X), and the fan module (3) and the data processing module (2) are located between the expansion module (4) and the power module (5); The expansion module (4) and the power module (5) are plugged into the chassis along the first direction (X), and the expansion module (4) is hot-pluggably connected to the mid-backplane module (1).

5. The server according to claim 4, characterized in that: The expansion module (4) comprises at least one expansion module (41), a plurality of expansion plug-in slots being arranged on one end face of the expansion module (41) along the first direction (X), and another end face of the expansion module (41) along the first direction (X) being connected to the mid-backplane module (1) via hot plugging.

6. The server according to claim 5, characterized in that: The power module (5) comprises a first signal board (51), a power supply unit (52) and an extension unit (53); the first signal board (51) extends along the second direction (Y); the first signal board (51) is plugged into the mid-backplane module (1) along the first direction (X); at least one of the power supply unit (52) and the extension unit (53) are provided; the power supply unit (52) and the extension unit (53) are arranged side by side along the second direction (Y) and are both wirelessly connected to the first signal board (51).

7. The server according to claim 6, characterized in that: The power supply unit (52) and the expansion unit (53) are both connected to one side of the first signal board (51) along the first direction (X) through hot plugging, and the first signal board (51) is connected to the mid-backplane module (1) through hot plugging along another side of the first direction (X).

8. The server according to claim 6, characterized in that: The first signal plate (51) is provided with a plurality of ventilation holes; And / or, a ventilation slot (42) is provided on the extension module (41).

9. The server according to any one of claims 1 to 2, characterized in that: The fan module (3) further comprises a second signal board (32), the second signal board (32) extending along the second direction (Y), the plurality of fan units (31) being wirelessly connected to the second signal board (32), and the second signal board (32) being wirelessly connected to the mid-backplane module (1).

10. The server according to claim 9, characterized in that It also includes an air guide component, wherein the fan module (3) is arranged between the expansion module (4) and the data processing module (2), and two air guide components are arranged, which are respectively located on both sides of the mid-backplane module (1) and are both located between the fan module (3) and the power module (5).

11. The server according to claim 10, characterized in that: The second signal board (32) is provided with a first control module (323), and the first control module (323) is capable of controlling the rotation speed difference of the fan units (31) located on both sides of the mid-back board module (1) to be 30%-45%.

12. The server according to claim 3, characterized in that: The mainboard unit (22) is provided with a mainboard high-speed signal plug (221), a mainboard low-speed signal plug (222) and a mainboard power supply plug (223) plugged into the mainboard module (1) at an edge portion thereof close to the middle backplane module (1); the mainboard high-speed signal plug (221), the mainboard low-speed signal plug (222) and the mainboard power supply plug (223) are arranged at intervals along the first direction (X); The mainboard high-speed signal plug (221) is used to provide a high-speed signal to the expansion device, and the mainboard low-speed signal plug (222) is used to provide a low-speed control signal and a PCIE signal to the expansion device, and to provide a low-speed control signal to the fan module (3) and the power module (5).

13. The server according to claim 1 or 2, characterized in that: The mid-backplane module (1) comprises a plate body and a fixing frame, wherein the plate body is fixed in the chassis via the fixing frame; And / or, on a side surface of the board body along the second direction (Y), a first expansion plug interface (11), a fan control plug interface (12), a mainboard high-speed signal plug interface (13), a mainboard low-speed signal plug interface (14), a mainboard power supply plug interface (15) and a first power supply plug interface (18) are sequentially arranged along the first direction (X); On the other side of the board body along the second direction (Y), a first expansion plug interface (11), a fan power plug interface (17), a mainboard power plug interface (15), a mainboard low-speed signal plug interface (14), a mainboard high-speed signal plug interface (13) and a second expansion plug interface (16) are sequentially arranged along the first direction (X); Wherein, the two first extension plug interfaces (11) located on both sides of the middle backplane module (1) are respectively used to connect to the two extension modules (41) in the extension module (4) to transmit control signals and power supply signals; Two groups of the mainboard high-speed signal plug-in interface (13), the mainboard low-speed signal plug-in interface (14) and the mainboard power supply plug-in interface (15) located on both sides of the mid-backplane module (1) are respectively used to connect to the data processing modules (2) located on both sides of the mid-backplane module (1); The fan control plug interface (12) and the fan power supply plug interface (17) are used to connect to the fan module (3); The first power supply socket (18) and the second extension socket (16) are used to connect to a power supply module (5).

14. A data center, characterized in that: include: A server as claimed in any one of claims 1 to 13.

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