Substrate security system

Abstract

A substrate security system includes (i) a control unit configured to trigger a substrate recovery related process; (ii) a sensing unit configured to generate sensing information indicative of one or more regions associated with a substrate handling station of a substrate evaluation system during execution of the substrate recovery related process; (iii) an AI processing unit configured to apply an AI process to the sensing information to determine a recovery-related state of the substrate; and (iv) a response unit configured to respond to the recovery related state of the substrate.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of and priority to U.S. Patent Application No. 18 / 214,435, filed on June 26, 2023, and entitled “SUBSTRATE SAFETY SYSTEM,” which is incorporated herein by reference in its entirety. Background Art

[0003] The substrate may be evaluated by a substrate evaluation system such as a charged particle substrate evaluation system. A charged particle substrate evaluation system is configured to evaluate a substrate by irradiating the substrate with one or more charged particle beams.

[0004] Examples of substrate evaluation systems include: (i) defect review systems such as the Applied Materials Technologies, Inc., San Jose, California TM Defect Review Scanning Electron Microscope SEMVISION Inc. TM , (ii) metering systems, such as APPLIEDMATERIALS TM PROVision TM 3E Ebeam TM Metrology systems, (iii) Electron beam inspection systems, such as APPLIEDMATERIALS TM PRIMEVISION TM , or (iv) critical dimension scanning electron microscopy, such as APPLIEDMATERIALS TM VERITYSEM TM , etc. Charge particle evaluation systems can be manufactured by companies such as HITACHI in Tokyo, Japan. TM or KLA, Milpitas, CA TM The company's suppliers manufacture them, or they can be manufactured by other suppliers.

[0005] Irradiating the substrate by one or more charged particle beams requires positioning the substrate within a vacuum chamber.The substrate evaluation system includes one or more vacuum chambers and further includes one or more interfaces for receiving the substrate from a non-vacuum environment.

[0006] The substrate evaluation system includes one or more substrate handling stations for moving substrates to a vacuum chamber, moving substrates from a vacuum chamber, moving substrates between vacuum chambers, moving substrates from a vacuum chamber to a non-vacuum environment, moving substrates from a non-vacuum environment to a vacuum chamber, and the like.

[0007] The emergency substrate retrieval process may be triggered when there is ambiguity regarding the location of the substrate, for example, when the location of the substrate according to the software monitor determines that the substrate is at a first location and the hardware monitor determines that the substrate is at a second location different from the first location.

[0008] During an emergency substrate retrieval process, a human operator may be required to manually control the position of the substrate within the substrate evaluation system and even manually control the unloading of the substrate from the substrate evaluation system.

[0009] When manually controlling the position of the substrate, a human operator may damage and even crack the substrate.

[0010] It has been found that the emergency substrate recovery process may be triggered by error.

[0011] There is an increasing need to reduce the risk imposed on a substrate by manual control of the position of the substrate within a substrate evaluation system. Summary of the invention

[0012] A substrate safety system is provided, comprising: (a) a control unit configured to trigger a substrate recovery-related process; (b) a sensing unit configured to generate sensing information indicating one or more areas associated with a substrate handling station of a substrate evaluation system during the substrate recovery-related process; (c) an artificial intelligence (AI) processing unit configured to apply AI processing to the sensing information to determine a recovery-related state of a substrate; and (d) a response unit configured to respond to the recovery-related state of the substrate.

[0013] A method for enhancing the safety of a substrate is provided, the method comprising: (a) triggering a substrate recovery-related process by a control unit; (b) generating, by a sensing unit and during the substrate recovery-related process, sensing information indicating one or more areas associated with a substrate handling station of a substrate evaluation system; (c) applying, by an artificial intelligence (AI) processing unit, AI processing to the sensing information to determine a recovery-related state of a substrate; and (d) responding, by a response unit, to the recovery-related state of the substrate.

[0014] A non-transitory computer-readable medium for enhancing the safety of a substrate is provided, the non-transitory computer-readable medium storing instructions that, once executed by a substrate safety system, cause the substrate safety system to: (a) trigger a substrate recovery-related process by a control unit of the substrate safety system; (b) generate sensing information indicating one or more areas associated with a substrate handling station of a substrate evaluation system by a sensing unit of the substrate safety system and during the substrate recovery-related process; (c) apply artificial intelligence (AI) processing to the sensing information by an AI processing unit of the substrate safety system to determine a recovery-related state of a substrate; and (d) respond to the recovery-related state of the substrate by a response unit of the substrate safety system. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The subject matter regarded as the invention is particularly pointed out and distinctly claimed in the concluding portion of the specification. Figure 1 The invention, both as to its organization and method of operation, together with its specimens, features, and advantages, may be best understood by reference to the following detailed description when read in conjunction with the accompanying drawings:

[0016] Figure 1 An example of a substrate safety system is illustrated;

[0017] Figure 2 An example of a substrate safety system is illustrated, and a cross section of a substrate assessment system is also illustrated;

[0018] Figure 3 An example of a substrate, a substrate handling station, a first illumination element, a second illumination element, a first sensing element, and a second sensing element is illustrated;

[0019] Figure 4 An example of a method for enhancing the safety of a substrate is illustrated;

[0020] Figure 5 An example of a substrate safety system is illustrated; and

[0021] Figure 6 An example of a method for enhancing the safety of a substrate is illustrated.

[0022] It will be appreciated that for simplicity and clarity of illustration, the elements shown in the various drawings are not necessarily drawn to scale. For example, for clarity, the dimensions of some of the elements may be exaggerated relative to other elements. In addition, reference numerals may be repeated between the various drawings to indicate corresponding or similar elements where deemed appropriate. DETAILED DESCRIPTION

[0023] In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of embodiments of the present disclosure.

[0024] However, those skilled in the art will appreciate that the current embodiments of the present disclosure can be practiced without these specific details. In other instances, well-known methods, processes, and components have not been described in detail to avoid obscuring the current embodiments of the present disclosure.

[0025] The subject matter which is regarded as embodiments of the present disclosure is particularly pointed out and distinctly claimed in the concluding portion of the specification. However, embodiments of the present disclosure, both as to organization and method of operation, together with objects, features, and advantages thereof, may be best understood by reference to the following detailed description when read in connection with the accompanying drawings.

[0026] It will be appreciated that for simplicity and clarity of illustration, the elements shown in the various drawings are not necessarily drawn to scale. For example, for clarity, the dimensions of some of the elements may be exaggerated relative to other elements. In addition, reference numerals may be repeated between the various drawings to indicate corresponding or similar elements where deemed appropriate.

[0027] Since most of the illustrated embodiments of the present disclosure can be implemented using electronic components and circuits known to those skilled in the art, in order to understand and appreciate the basic concepts of the current embodiments of the present disclosure and to avoid confusion or ambiguity in the teachings of the current embodiments of the present disclosure, the details will not be interpreted to any greater extent than is considered necessary as illustrated above.

[0028] Any reference in the specification to a method shall mutatis mutandis apply to a system capable of carrying out the method and to a computer program product storing instructions which, when executed, cause the performance of the method.

[0029] Any reference in the specification to a system shall apply mutatis mutandis to a method executable by the system and shall apply mutatis mutandis to a computer program product storing instructions executable by the system.

[0030] Any reference in the specification to a computer program product shall apply mutatis mutandis to methods that may be performed when the instructions stored in the computer program product are executed and shall apply mutatis mutandis to systems configured to execute the instructions stored in the computer program product.

[0031] The term "and / or" means additionally or alternatively. For example, A and / or B means only A, or only B, or A and B.

[0032] A substrate safety system may be provided. The substrate safety system enhances substrate safety associated with substrate recycling because the substrate safety system accurately determines recycling-related status of the substrate and responds based on the recycling-related status of the substrate.

[0033] The substrate can be a bare wafer, a patterned wafer, a solar panel, etc.

[0034] The term "recycling-related status of a substrate" means information about a substrate related to a recycling process of the substrate. In particular, the recycling-related status of a substrate provides an indication of whether the substrate needs to be recycled.

[0035] According to an embodiment, when recycling of the substrate is required, the recycling-related status of the substrate also provides instructions on how to recycle the substrate.

[0036] Examples of recycling-related states of a substrate may include a cracked substrate, a misaligned substrate, a missing substrate, and a correctly positioned substrate. It should be noted that a substrate may be both cracked and misaligned, both cracked and correctly positioned, and so on.

[0037] The term "one or more areas associated with a substrate handling station" means one or more areas belonging to or close to the substrate handling station. Close means within the reach of the substrate handling station. Substrates within the reach of the substrate handling station can be manipulated by the substrate handling station.

[0038] One or more regions associated with the substrate handling station are positioned to provide an indication of a recovery-related status of the substrate. For example, when the substrate is properly positioned and unbroken, the region associated with the substrate handling station may be positioned downstream of the substrate (or at least downstream of a portion of the substrate) such that when the substrate is properly positioned and unbroken, at least a portion of the region is obscured by the substrate.

[0039] When the substrate is missing, misplaced, or broken, the region may not be obscured by the substrate. When the substrate is correctly positioned, the region may be positioned at a location where the edge of the substrate obscures a portion of the region.

[0040] A substrate safety system may be provided that may determine a recycling-related status of a substrate independent of other sources of information regarding the recycling-related status of the substrate.

[0041] In the event that the substrate evaluation system or any other substrate monitor fails or is not trusted, an independent determination of the recycling-related status of the substrate is beneficial. When different assessments of the position of the substrate are provided from two different entities, for example, having (i) software executed by the substrate evaluation system (e.g., an operating system such as JAVA TM or SEMorai TM This may occur when (i) a first substrate position estimate is obtained and (ii) a second substrate position estimate from a hardware sensor of the substrate evaluation system that is different from the first substrate position estimate.

[0042] Figure 1An example of a substrate safety system 10 is illustrated, which includes a control unit 20 configured to trigger a substrate recycling related process.

[0043] An irradiation unit 30 is configured to irradiate one or more areas associated with a substrate handling station of a substrate evaluation system during performance of a substrate recovery related process.

[0044] The sensing unit 40 is configured to generate sensing information indicative of one or more regions.

[0045] An artificial intelligence (AI) processing unit 50 is configured to apply AI processing to the sensed information to determine a recycling-related state of the substrate.

[0046] The response unit 60 is configured to respond to the recycling-related status of the substrate.

[0047] Figure 1 Also illustrated is a memory unit 70 configured to store instructions, and additionally or alternatively information such as sensed information.

[0048] At least one of the control unit 20, the AI ​​processing unit 50, and the response unit 60 may include one or more processing circuits or may be implemented using one or more processing circuits. The processing circuit may be implemented as a central processing unit (CPU) and / or one or more other integrated circuits (such as an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a full custom integrated circuit, an AI processor, etc., or a combination of such integrated circuits).

[0049] The recycling-related state of the substrate may be a cracked substrate, a misplaced substrate, a missing substrate, or a correctly placed substrate.

[0050] The recycling-related status of the substrate may be a broken substrate, a misplaced substrate, a missing substrate, or an existing substrate. A properly placed substrate may be classified as an existing substrate instead of a misplaced substrate.

[0051] The response unit 60 may be configured to respond with at least one of the following responses:

[0052] a. Request execution of manual unloading of a substrate from a transfer station.

[0053] b. Request execution of unloading of a substrate from the substrate evaluation system controller of the transfer station.

[0054] c. Instruct execution of unloading of the substrate from the substrate evaluation system controller of the handling station.

[0055] d. Send instructions unrelated to the recycling of the substrate.

[0056] e. Stop the substrate recovery process.

[0057] f. Provides information about the exact location of the substrate.

[0058] The AI ​​processing unit 50 is configured to apply a classification process to determine substrate recycling related status.

[0059] The AI ​​processing unit 50 may have been trained to apply a classification process based on one or more coverage parameters related to coverage of each of the one or more regions by the substrate. The coverage parameters represent coverage of the one or more regions by the substrate.

[0060] For example, training may include training a convolutional neural network (CNN), such as a ResNet18 neural network pre-trained using IMAGNET1000, with four classification heads for four different recycling-related states of the substrate. The CNN is tuned to data specific to images related to substrates in different recycling-related states.

[0061] There may be multiple regions, and the sensing unit may include multiple sensors. Each region may be associated with one or more sensors.

[0062] Having multiple regions, especially when the regions cover only a small portion of the entire substrate (e.g., up to 5%, 10%, 15% of the substrate), allows sensing and / or image processing to be focused on a smaller area, thereby simplifying the sensing unit and reducing the cost of the sensing unit.

[0063] It should be noted that the substrate safety system 10 may be used to monitor multiple substrate handling stations rather than just a single substrate handling station.

[0064] For example, the substrate evaluation system may include an additional substrate handling station. The irradiation unit is configured to irradiate one or more additional areas associated with the additional substrate handling station during execution of the substrate recovery-related process. The sensing unit is configured to generate additional sensing information indicating the one or more areas. The AI ​​processing unit is configured to apply AI processing to the sensing information and the additional sensing information to determine a recovery-related state of the substrate.

[0065] Figure 2 An example of a substrate safety system 10 is illustrated, and a cross-section of a substrate evaluation system 100 is also illustrated.

[0066] The substrate evaluation system 100 includes a factory interface 110 , a load lock chamber 120 , and a substrate evaluation vacuum chamber 130 within which a substrate is evaluated.

[0067] The factory interface 110 may be any suitable enclosure, such as, for example, an equipment front end module (EFEM).

[0068] The factory interface 110 may be configured to receive substrates from substrate carriers 99 (eg, front opening unit (FOUP)) docked at respective load ports 112 of the factory interface. One of the substrate carriers 99 is illustrated as a storage substrate 200.

[0069] The factory interface robot 114 is configured to transfer substrates between the substrate carrier 99 and the load lock chamber 120 .

[0070] The load lock chamber 120 includes one or more slit valves and / or doors, such as door 122 , configured to open when receiving and / or releasing substrates to and / or from the factory interface robot 114 .

[0071] The load lock chamber 120 includes one or more additional slit valves and / or additional doors (such as the additional door 126 ) configured to open when receiving a substrate to and / or releasing a substrate from the substrate evaluation vacuum chamber 130 .

[0072] The load lock chamber includes a substrate supporting unit 128 for supporting a substrate in the load lock chamber.

[0073] A vacuum environment, a clean environment, and / or a temperature-controlled environment may be maintained within the load lock chamber 120 and / or the substrate evaluation vacuum chamber 130 .

[0074] The substrate evaluation vacuum chamber 130 includes a mechanical stage 132 for supporting a substrate and moving the substrate within the substrate evaluation vacuum chamber 130 .

[0075] exist Figure 2 In FIG. 1 , each of the factory interface robot 114 , the load lock chamber 120 , and the robot stage 132 is considered as a substrate handling station.

[0076] Irradiation unit ( Figure 2 ) includes eight irradiation elements 31, and the sensing unit includes eight sensing elements 41. At least one pair of sensing elements and one pair of irradiation elements are allocated to each substrate transfer station. Four sensing elements 41 and four irradiation elements 31 are allocated to the load lock chamber.

[0077] The illumination element is a light source (such as a lamp, a light emitting diode (LED), etc.).

[0078] The sensing element is an image sensing element (such as a camera).

[0079] There may be any number of illumination elements per substrate handling station, there may be one illumination element per substrate handling station or there may be two or more illumination elements per substrate handling station.

[0080] There may be any number of sensing elements per substrate handling station, there may be one sensing element per substrate handling station or there may be two or more sensing elements per substrate handling station.

[0081] Different numbers of sensing elements may be assigned to two different substrate handling stations.

[0082] The same number of sensing elements may be assigned to two different substrate handling stations.

[0083] Different numbers of illumination elements may be assigned to two different substrate handling stations.

[0084] The same number of illumination elements may be assigned to two different substrate handling stations.

[0085] exist Figure 2 In the embodiment, the control unit 20 , the AI ​​processing unit 50 , and the response unit 60 are located outside the substrate evaluation system 100 .

[0086] It should be noted that the substrate safety system 10 is configured to monitor and Figure 2 The substrate evaluation system 100 may be configured to evaluate the status of one or more substrates within the system. The substrate evaluation system may include any number of chambers and / or any number of components and / or units.

[0087] Figure 3 Examples of the substrate 200 and the substrate transport station 210 , the first irradiation element 31 , the second irradiation element 32 , the first sensing element 41 , and the second sensing element 42 are illustrated.

[0088] The first illumination element 31 illuminates a first area 201 associated with the substrate handling station 210 , and the first sensing element 41 acquires an image of the first area 201 .

[0089] The second illumination element 32 illuminates a second area 202 associated with the substrate handling station 210 , and the second sensing element 42 acquires an image of the second area 202 .

[0090] In the first example, the substrate 200 is correctly positioned on the substrate handling station 210 .

[0091] a. The image of the first region 201 illustrates a first edge region of a substrate 200 positioned at a desired location (eg, at a desired distance from an edge of the substrate handling station) and also illustrates a first portion 211 of the substrate handling station 210 not covered by the substrate 200 .

[0092] b. The image of the second region 202 illustrates a second edge region of the substrate 200 positioned at a desired location (eg, at a desired distance from an edge of the substrate handling station) and also illustrates a second portion 212 of the substrate handling station 210 not covered by the substrate 200 .

[0093] In the second example, the substrate 200 is misaligned and located closer to the first portion 211 of the substrate handling station.

[0094] a. The image of the first region 201 illustrates a first edge region of the substrate 200 that is misaligned (positioned at a distance less than the desired distance from the edge of the substrate handling station) and also illustrates a first portion 211 of the substrate handling station 210 that is not covered by the substrate 200 and is smaller than the first portion 211 of the first example.

[0095] b. The image of the second region 202 illustrates a second edge region of the substrate 200 that is misaligned (positioned at a distance beyond the desired distance from the edge of the substrate handling station) and also shows a second portion 212 of the substrate handling station 210 that is not covered by the substrate 200 and is smaller than the second portion 212 of the first example.

[0096] In the third example, the substrate 200 is missing.

[0097] a. The image of the first area 201 and the image of the second area 202 illustrate only the substrate transfer station 210 .

[0098] In the fourth example, the substrate 200 has a cracked edge, which is captured in the image of the first area.

[0099] Figure 4 An example of a method 400 for enhancing security of a substrate is illustrated.

[0100] The method 400 may begin at step 410 by a control unit triggering a substrate recycling related process.

[0101] Step 410 is followed by step 420 of performing substrate recovery related processes.

[0102] Step 420 includes steps 422 , 424 , 426 , and 428 .

[0103] Step 422 includes irradiating, by an irradiation unit, one or more areas associated with a substrate handling station of the substrate evaluation system.

[0104] Step 422 is followed by step 424 of generating, by the sensing unit, sensed information indicative of one or more regions associated with a substrate handling station of the substrate evaluation system.

[0105] Step 424 is followed by step 426 where an artificial intelligence (AI) processing unit applies AI processing to the sensed information to determine a recycling-related state of the substrate.

[0106] According to an embodiment, step 426 includes applying a classification process to determine a substrate recycling related status.

[0107] According to an embodiment, the AI ​​processing unit has been trained to apply a classification process based on one or more coverage parameters related to coverage of each of the one or more regions by the substrate.

[0108] According to an embodiment, the recycling-related status of the substrate is selected between a cracked substrate, a misplaced substrate, a missing substrate, and a correctly placed substrate.

[0109] Step 426 is followed by step 428 where the response unit responds to the recycling-related status of the substrate.

[0110] Step 428 may include at least one of the following:

[0111] a. Request execution of manual unloading of a substrate from a transfer station.

[0112] b. Request execution of unloading of a substrate from the substrate evaluation system controller of the transfer station.

[0113] c. Instruct execution of unloading of the substrate from the substrate evaluation system controller of the handling station.

[0114] d. Send instructions unrelated to the recycling of the substrate.

[0115] e. Stop the substrate recovery process.

[0116] f. Provides information about the exact location of the substrate.

[0117] Step 420 may be applied to more than one substrate handling station. For example, the substrate evaluation system may include additional substrate handling stations. Step 422 may include irradiating one or more additional regions associated with the additional substrate handling stations during performance of the substrate recovery-related process. Step 424 may include generating additional sensing information indicative of the one or more additional regions. Step 424 may include applying AI processing to the sensing information and the additional sensing information to determine a recovery-related state of the substrate.

[0118] According to an embodiment, the sensing unit is configured to obtain sensing information about one or more areas without irradiating the one or more areas. For example, the sensing unit can be an ultrasonic sensor and / or a radar, and / or a thermal sensor, which can generate sensing information without an irradiation unit.

[0119] Figure 5An example of a substrate safety system 10' is illustrated, the system comprising:

[0120] a. A control unit 20, which is configured to trigger substrate recycling related processes.

[0121] b. A sensing unit 40 configured to generate sensing information indicative of one or more regions associated with a substrate handling station of a substrate evaluation system during performance of a substrate recovery related process.

[0122] c. An artificial intelligence (AI) processing unit 50 configured to apply AI processing to the sensed information to determine a recycling-related state of the substrate.

[0123] d. A response unit 60 configured to respond to a recycling-related status of the substrate.

[0124] Figure 5 Also illustrated is a memory unit 70 configured to store instructions, and additionally or alternatively information such as sensed information.

[0125] Figure 4 An example of a method 400 ′ for enhancing security of a substrate is illustrated.

[0126] The method 410 may begin with a control unit triggering a substrate recycling related process at step 410 .

[0127] Step 410 is followed by step 420' of performing substrate recovery related processes.

[0128] Step 420 ′ includes step 424 ′, step 426 , and step 428 .

[0129] Step 424 ′ includes generating, by a sensing unit, sensed information indicative of one or more regions associated with a substrate handling station of the substrate evaluation system.

[0130] Step 424' is followed by step 426 where an artificial intelligence (AI) processing unit applies AI processing to the sensed information to determine a recycling-related state of the substrate.

[0131] Step 426 is followed by step 428 where the response unit responds to the recycling-related status of the substrate.

[0132] In the foregoing specification, embodiments of the present disclosure have been described with reference to specific examples thereof. It will, however, be evident that various modifications and changes may be made therein without departing from the broader spirit and scope of the appended claims.

[0133] Furthermore, the terms "front," "back," "top," "bottom," "above," "below," and the like, if any, in the specification and claims are used for descriptive purposes and are not necessarily used to describe permanent relative positions. It is understood that the terms so used are interchangeable where appropriate such that the embodiments of the disclosure described herein are, for example, capable of operation in other orientations than those illustrated or otherwise described herein.

[0134] Each signal described herein can be designed as positive logic or negative logic. In the case of a negative logic signal, the signal is active low, where the logical true state corresponds to a logic level of zero. In the case of a positive logic signal, the signal is active high, where the logical true state corresponds to a logic level of one. It should be noted that any of the signals described herein can be designed as a negative logic signal or a positive logic signal. Therefore, in alternative embodiments, those signals described as positive logic signals can be implemented as negative logic signals, and those signals described as negative logic signals can be implemented as positive logic signals.

[0135] Additionally, the terms "asserting" or "setting" and "negating" (or "deasserting" or "clearing") are used herein when referring to causing a signal, status bit, or similar device to its logically true or logically false state, respectively. If the logically true state is a logic level one, the logically false state is a logic level zero. If the logically true state is a logic level zero, the logically false state is a logic level one.

[0136] Those skilled in the art will recognize that the boundaries between logic blocks are merely illustrative and that alternative implementations may merge logic blocks or circuit elements or impose alternative decompositions of functionality on various logic blocks or circuit elements. Thus, it should be understood that the architectures depicted herein are merely exemplary and that, in fact, many other architectures may be implemented that achieve the same functionality.

[0137] Any reference to the terms "comprising," or "having," or "including" should be applied mutatis mutandis to "consisting of" and / or should be applied mutatis mutandis to "consisting essentially of.

[0138] Any arrangement of components that achieve the same functionality is effectively "associated" such that the desired functionality is achieved. Thus, any two components combined herein to achieve a particular functionality may be considered "associated" with each other such that the desired functionality is achieved, regardless of the architecture or intervening components. Likewise, any two components so associated may also be considered "operably connected" or "operably coupled" to each other to achieve the desired functionality.

[0139] Furthermore, those skilled in the art will recognize that the boundaries between the operations described above are merely illustrative. Multiple operations may be combined into a single operation, a single operation may be distributed among additional operations, and operations may be performed at least partially overlapping in time. Furthermore, alternative implementations may include multiple instances of a particular operation, and the order of the operations may be altered in various other implementations.

[0140] Also, for example, in one embodiment, the illustrated examples may be implemented as circuitry located on a single integrated circuit or within the same device. Alternatively, the examples may be implemented as any number of separate integrated circuits or separate devices interconnected with each other in a suitable manner.

[0141] Also, for example, the examples or portions thereof may be implemented as soft or code representations of physical circuitry or logical representations convertible into physical circuitry, such as in any appropriate type of hardware description language.

[0142] However, other modifications, changes, and substitutions are possible. Accordingly, the specification and drawings are to be regarded in an illustrative rather than a restrictive sense.

[0143] In the claims, any reference numerals placed between brackets shall not be construed as limiting the claims. The word 'comprising' does not exclude the presence of other elements or steps than those listed in the claims. In addition, the terms "a" or "an" as used herein are defined as one or more than one. Moreover, the use of introductory phrases such as "at least one" and "one or more" in the claims shall not be construed as implying that any particular claim containing such introduced claim elements is limited to an embodiment containing only one such element by introducing another claim element with the indefinite article "a" or "an", even when the same claim includes the introductory phrases "one or more" or "at least one" and indefinite articles such as "a" or "an". The same is true for the use of definite articles. Unless otherwise stated, terms such as "first" and "second" are used to arbitrarily distinguish the elements described by such terms. Therefore, these terms are not necessarily intended to indicate the time or other priority of such elements. The fact that certain measures are stated in different claims does not indicate that the combination of these measures cannot be used advantageously.

[0144] While certain features of the embodiments have been illustrated and described herein, many modifications, permutations, changes, and equivalents will now occur to those of ordinary skill in the art. It is therefore to be understood that the appended claims are intended to cover all such modifications and changes that fall within the true spirit of the invention.

Claims

1. A substrate safety system, comprising: a control unit configured to trigger a substrate recycling-related process; a sensing unit configured to generate sensing information indicative of one or more regions associated with a substrate handling station of a substrate evaluation system during performance of the substrate recovery-related process; an artificial intelligence (AI) processing unit configured to apply AI processing to the sensed information to determine a recycling-related state of the substrate; as well as A response unit is configured to respond to the recycling-related status of the substrate.

2. The substrate safety system of claim 1, wherein the recycle-related status of the substrate is selected between a cracked substrate, a misplaced substrate, a missing substrate, and a correctly placed substrate. 3 . The substrate safety system of claim 1 , wherein the response unit is configured to respond by requesting performance of a manual unloading of the substrate from the substrate handling station.

4. The substrate safety system of claim 1, wherein the response unit is configured to respond by requesting execution of an unloading of the substrate from a substrate evaluation system controller of the transfer station. 5 . The substrate safety system of claim 1 , wherein the response unit is configured to respond by sending an indication that recycling of the substrate is not relevant. 6 . The substrate safety system of claim 1 , wherein the AI ​​processing unit is configured to apply a classification process to determine the substrate recycling related status. 7 . The substrate safety system of claim 6 , wherein the AI ​​processing unit is trained to apply the classification process based on one or more coverage parameters related to coverage of each of the one or more regions by the substrate. 8 . The substrate safety system of claim 1 , wherein the one or more areas are a plurality of areas, and wherein the sensing unit comprises a plurality of sensors.

9. A substrate safety system according to claim 1, wherein the substrate evaluation system includes an additional substrate handling station; wherein the sensing unit is configured to generate additional sensing information indicating one or more additional areas associated with the additional substrate handling station; and wherein the AI ​​processing unit is configured to apply the AI ​​processing to the sensing information and the additional sensing information to determine the recovery-related state of the substrate. 10 . The substrate safety system according to claim 1 , further comprising an illumination unit configured to illuminate the one or more areas.

11. A method for enhancing the safety of a substrate, the method comprising: The control unit triggers the substrate recovery-related process; generating, by a sensing unit and during performance of said substrate retrieval-related process, sensed information indicative of one or more regions associated with a substrate handling station of a substrate evaluation system; applying, by an artificial intelligence (AI) processing unit, AI processing to the sensed information to determine a recycling-related state of the substrate; as well as A response unit is provided to the recycling-related state of the substrate.

12. The method of claim 11, wherein the recycling-related state of the substrate is selected between a cracked substrate, a misplaced substrate, a missing substrate, and a correctly placed substrate.

13. The method of claim 11, wherein the response comprises requesting performance of a manual unloading of the substrate from the substrate handling station.

14. The method of claim 11, wherein the response comprises execution of a request for the substrate to be unloaded from a substrate evaluation system controller of the transfer station.

15. The method of claim 11, wherein the responding comprises sending an indication that recycling of the substrate is not relevant.

16. The method of any one of claims 11 to 15, wherein the applying of the AI ​​process comprises applying a classification process to determine the substrate recycling related status.

17. The method of claim 16, wherein the AI ​​processing unit is trained to apply the classification process based on one or more coverage parameters related to coverage of each of the one or more regions by the substrate.

18. The method of claim 11, further comprising irradiating the one or more regions by an irradiation unit.

19. The method of claim 11, wherein the one or more regions are a plurality of regions, and wherein the sensing unit comprises a plurality of sensors.

20. A non-transitory computer readable medium for enhancing security of a substrate, the non-transitory computer readable medium storing instructions that, upon execution by a substrate security system, cause the substrate security system to: The control unit of the substrate safety system triggers a substrate recovery-related process; generating, by a sensing unit of the substrate safety system, sensing information indicative of one or more areas associated with a substrate handling station of a substrate evaluation system; applying, by an artificial intelligence (AI) processing unit of the substrate safety system, AI processing to the sensed information to determine a recycling-related status of the substrate; as well as A response unit of the substrate safety system is used to respond to the recycling-related status of the substrate.

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