Auxiliary systems for electronic packaging equipment

By utilizing the relative motion of the pressure component during the movement of the ball supply assembly to make the ball planting mesh adhere to the substrate, the gap problem caused by substrate warping is solved, and the ball planting yield is improved.

CN119208203BActive Publication Date: 2026-03-13SHANGHAI TECHSENSE CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-09-23
Publication Date
2026-03-13

AI Technical Summary

Technical Problem

In the existing technology, substrate warping causes gaps between the substrate and the ball-mounting stencil, resulting in solder balls leaking into the gaps, poor ball-mounting effect, and reduced ball-mounting yield.

Method used

The ball-feeding assembly uses a pressure component on the advancing side to press down the ball-planting mesh, while a pressure component in the opposite direction lifts it up, ensuring that the ball-planting mesh adheres to the substrate. This ensures that the ball-planting mesh is completely adhered to the substrate.

Benefits of technology

It improves the ball placement yield, ensuring that all welding balls fall correctly into the mesh of the ball placement net, thus enhancing the ball placement effect.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention provides an auxiliary system for electronic packaging equipment, including a ball-feeding mechanism, a ball-feeding assembly, and auxiliary tooling. The ball-feeding assembly is positioned above the ball-feeding mechanism and provides implantation components to the implantation sites of the ball-feeding mechanism. The auxiliary tooling includes pressure components positioned on both sides of the ball-feeding assembly in its direction of movement. During the movement of the ball-feeding assembly, the ball-feeding assembly on the forward side presses down to apply pressure to the ball-feeding mechanism, while the pressure component on the back side of the ball-feeding assembly lifts up. By lowering the pressure component on the forward side of the ball-feeding assembly under the drive of a cylinder during the ball-laying process to compress the ball-laying mesh, and raising the pressure component on the opposite side under the drive of a cylinder to disengage from the ball-laying mesh, the ball-laying mesh is made to fully adhere to the substrate, thereby ensuring that the solder balls can correctly fall into the mesh openings of the ball-laying mesh, thus improving the ball-laying yield.
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Description

Technical Field

[0001] This invention relates to the field of ball-planting machine technology, and more specifically, to an auxiliary system for electronic packaging equipment. Background Technology

[0002] Ball-mounting technology is a key electronic packaging technology used for the electrical connection between integrated circuit chips and printed circuit boards (PCBs). This technology involves precisely placing implanted components (usually solder alloys) at the implanted component locations on the chip.

[0003] A ball-mounting machine is a specialized piece of equipment that performs the ball-mounting process. It typically features an automated feeding system, a precision heating and cooling system, a precision position control system, and a quality control system. This ball-mounting machine needs to be flexible enough to adapt to different package types (such as the number of balls, ball diameter, and spacing) and different chip specifications. Therefore, modern ball-mounting machines usually have adjustable parameters and process settings to meet the needs of different customers and applications.

[0004] In existing technologies, if the substrate warps, gaps will form between the substrate and the ball-mounting stencil, causing solder balls to leak into the gaps and resulting in defects. This leads to poor ball-mounting performance and a significant reduction in ball-mounting yield, indicating areas for improvement. Summary of the Invention

[0005] In view of the deficiencies in the prior art, the purpose of this invention is to provide an auxiliary system for electronic packaging equipment.

[0006] An auxiliary system for an electronic packaging device according to the present invention includes a ball-feeding mechanism, a ball-feeding assembly, and an auxiliary fixture. The ball-feeding assembly is disposed above the ball-feeding mechanism and provides an implantation member to the implantation site of the ball-feeding mechanism. The auxiliary fixture includes pressure components disposed on both sides of the ball-feeding assembly in the direction of movement. During the movement of the ball-feeding assembly, the ball-feeding assembly on the forward side of the ball-feeding assembly presses down to apply pressure to the ball-feeding mechanism, and the pressure component on the back side of the ball-feeding assembly lifts up.

[0007] Preferably, the ball-supplying mechanism includes a ball-planting net and a base plate, the base plate being located below the ball-planting net, and the points on the base plate where the implantation component is disposed coinciding with the mesh of the ball-planting net to form an implantation site for accommodating the implantation component; the downward pressure applied by the pressure component acts on the ball-planting net, causing the ball-planting net to adhere to the base plate.

[0008] Preferably, the pressure assembly includes one or more of a plunger assembly, a roller assembly, and a drum assembly.

[0009] Preferably, the ball supply assembly includes a conveying device and a ball supply device, wherein the conveying device drives the ball supply device to move in a plane above the ball-supplying mechanism; and the ball supply device stores and supplies implantation components to the implantation site of the ball-supplying mechanism.

[0010] Preferably, the ball supply device includes a ball box, a ball storage trough, and a ball outlet. The ball box is equipped with an internal space for storing implanted components. The internal space of the ball box is connected to the ball storage trough, and the bottom opening of the ball box is the ball outlet.

[0011] Preferably, the uppermost opening of the ball storage tank is connected to a ball inlet tube, the upper end of which extends into the interior space of the ball box to a certain height; a vibration device is installed on the ball box, which drives the implanted component inside the ball box to bounce.

[0012] Preferably, the auxiliary tooling further includes a bracket for mounting the pressure assembly, and at least one set of brackets is provided on the front and rear sides of the ball supply assembly in the direction of movement; each set of brackets gradually approaches the ball outlet of the ball supply assembly from top to bottom, and the bottom of each set of brackets is configured to mount one or more of a plunger assembly, a roller assembly, and a drum assembly.

[0013] Preferably, the auxiliary tooling further includes a cylinder seat and a cylinder, the cylinder seat is disposed on the ball supply assembly, the cylinder is obliquely mounted on the cylinder seat, and the bracket is connected to the output end of the cylinder.

[0014] Preferably, the tilt angle of the cylinder output shaft is the same as the tilt angle of the bracket.

[0015] Preferably, multiple plunger assemblies are arranged at intervals on the bracket along a direction perpendicular to the movement direction of the ball supply assembly; multiple roller assemblies are arranged at intervals on the bracket along a direction perpendicular to the movement direction of the ball supply assembly; and the roller assembly is mounted on the bracket with its axis perpendicular to the movement direction of the ball supply assembly.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. In the ball-laying process, the pressure component on one side of the ball-feeding assembly in the forward direction is lowered by a cylinder to press the ball-laying mesh, while the pressure component on the opposite side is raised by a cylinder to detach from the ball-laying mesh, so that the ball-laying mesh is completely attached to the substrate, thereby ensuring that the solder balls can fall correctly into the mesh of the ball-laying mesh, thus improving the ball-laying yield. Attached Figure Description

[0018] Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0019] Figure 1This is an exploded view of the sphere box assembly, which is the main feature of this invention.

[0020] Figure 2 This is a front view of the main sphere box assembly of the present invention;

[0021] Figure 3 This is a three-dimensional structural diagram illustrating the main embodiment of the present invention;

[0022] Figure 4 This is a side cross-sectional view that mainly illustrates Embodiment 1 of the present invention;

[0023] Figure 5 for Figure 4 An enlarged schematic diagram of the plunger position in the center;

[0024] Figure 6 This is a schematic diagram illustrating the plunger installation of Embodiment 1 of the present invention;

[0025] Figure 7 This is a schematic diagram of the structure of the present invention, which mainly involves adding an elastic baffle next to the ball outlet of the ball box;

[0026] Figure 8 This invention is mainly illustrated by an enlarged lateral cross-sectional view of the ball opening position;

[0027] Figure 9 This is a schematic diagram illustrating the structure of the second embodiment of the present invention, which utilizes an elastic roller.

[0028] Figure 10 This is a schematic diagram illustrating the structure of the elastic roller in Embodiment 3 of the present invention;

[0029] Figure 11 This is a schematic diagram illustrating the installation of the elastic roller in Embodiment 3 of the present invention.

[0030] As shown in the figure:

[0031] 200 ball-planting net plunger assembly 621

[0032] Ball supply assembly 400, plunger head 622

[0033] Ball box 410, roller assembly 623

[0034] Ball storage tank 411, roller assembly 624

[0035] Ball outlet 412, elastic baffle 625

[0036] Cover plate 413, bracket 640

[0037] Socket 414, Vertical bar 641

[0038] Goal tube 415, crossbar 642

[0039] Horizontal drive mechanism 420, cylinder base 650

[0040] Horizontal slide rail 421, inclined mounting surface 651

[0041] Supporting slide plate 423, cylinder 652

[0042] Lifting drive mechanism 430, vibrator 660 Detailed Implementation

[0043] The present invention will now be described in detail with reference to specific embodiments. These embodiments will help those skilled in the art to further understand the present invention, but do not limit the invention in any way. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the present invention. These all fall within the protection scope of the present invention.

[0044] It should be emphasized that the implantable component of this application can be either a columnar structure or a spherical structure. The device of the technical solution of this application is particularly suitable for spherical implantable components, but can also be used for columnar implantable components.

[0045] Example 1

[0046] like Figures 1 to 8 As shown, an auxiliary system for electronic packaging equipment according to the present invention includes a ball-feeding mechanism, a ball-feeding assembly 400, and an auxiliary tooling. The ball-feeding assembly 400 is disposed above the ball-feeding mechanism and provides an implantation member to the implantation site of the ball-feeding mechanism. The auxiliary tooling includes pressure components disposed on both sides of the ball-feeding assembly 400 in the direction of movement. During the movement of the ball-feeding assembly 400, the ball-feeding assembly 400 on the forward side of the ball-feeding assembly 400 presses down to apply pressure to the ball-feeding mechanism, and the pressure component on the back side of the ball-feeding assembly 400 lifts up.

[0047] Specifically, the ball-supplying mechanism includes a ball-planting mesh 200 and a substrate. The substrate is located below the ball-planting mesh 200, and the points on the substrate where the implantation components are disposed coincide with the mesh of the ball-planting mesh 200 to form implantation sites for accommodating the implantation components. The downward pressure applied by the pressure assembly acts on the ball-planting mesh 200, causing the ball-planting mesh 200 to adhere to the substrate.

[0048] More specifically, the substrate is stably mounted below the ball-planting net 200 by a support device. This application proposes a feasible method for supporting the substrate, which does not specifically limit the content to be protected by this application: the support platform is supported by four support legs. The support platform has an opening. The ball-planting net 200 is fixed in the opening. The ball-planting net 200 is preferably a steel mesh, but other materials can also be used.

[0049] The support device is located below the planting net 200 and includes a fixed plate, a carrier plate located below the fixed plate, a support plate located below the carrier plate, and four guide posts. The fixed plate is located below the planting net 200 and fixed at both ends to the support platform. The four guide posts are vertically fixed between the fixed plate and the support plate. The carrier plate has four linear bearings. These four linear bearings are fitted onto the four guide posts to allow the carrier plate to move up and down along the guide posts. The fixed plate has an opening in the middle. Corresponding to the opening on the carrier plate, there is a platform for positioning and placing the substrate. Rubber limiting pads are provided at the base of each of the four guide posts.

[0050] A handle is provided on the lower surface of the carrier plate. By gripping the handle, the carrier plate can be lifted, allowing the substrate on the carrier plate to pass through the opening in the fixing plate and be raised to the lower surface of the ball-planting net 200. Once the substrate is on the lower surface of the ball-planting net 200, the carrier plate and the fixing plate can be fixed with bolts, ensuring that the substrate is stably positioned on the lower surface of the ball-planting net 200 during ball planting. In this embodiment, the lifting and lowering of the carrier plate is achieved manually. Alternatively, a motor or cylinder 652 can be used to drive the lifting and lowering of the carrier plate to automate the support device.

[0051] The ball supply assembly 400 includes a conveying device and a ball supply device. The conveying device drives the ball supply device to move in a plane above the ball-supplying mechanism. The ball supply device stores and supplies implantation components to the implantation site of the ball-supplying mechanism.

[0052] The ball supply device includes a ball box 410, a ball storage trough 411, and a ball outlet 412. The ball box 410 has an internal space for storing implanted components, and the internal space of the ball box 410 is connected to the ball storage trough 411. The bottom opening of the ball box 410 is the ball outlet 412. The top opening of the ball storage trough 411 is connected to a ball inlet tube 415, the upper end of which extends into the internal space of the ball box 410 to a certain height. A vibration device is installed on the ball box 410, which drives the implanted components inside the ball box 410 to vibrate. Specifically, the ball box 410 has a ball storage trough 411 at its bottom. The bottom of the ball storage trough 411 has a ball outlet 412. The top opening of the ball storage trough 411 has a cover plate 413. The cover plate 413 has insertion holes 414 spaced apart. Each insertion hole 414 is fixed with a ball inlet tube 415. The ball inlet tube 415 is connected to an external ball supply device. The ball supply device can inject the implanted component into the ball storage tank 411 through the ball inlet tube 415. Preferably, the ball storage tank 411 of the ball box 410 is an inverted trapezoidal narrow groove, and the ball outlet 412 is a narrow opening with a width between 1 mm and 2 mm.

[0053] The conveying device includes a horizontal drive mechanism 420 and a lifting drive mechanism 430. The horizontal drive mechanism 420 includes a horizontal slide rail 421, a horizontal linear module, and a support slide plate 423. The horizontal slide rail 421 and the horizontal linear module are fixed to the support platform and have openings on both sides. One end of the support slide plate 423 is mounted on the horizontal slide rail 421, and the other end is mounted on the horizontal linear module. A through hole is provided in the support slide plate 423. This through hole allows the support slide plate 423 to pass over the opening in the fixed plate as it slides.

[0054] The lifting drive mechanism 430 is fixed to the support slide plate 423 and located on one side of the hole. The ball box 410 is installed on the lifting drive mechanism 430 and located above the hole. Under the lifting drive of the lifting drive mechanism 430, the ball box 410 can pass through the hole so that the ball outlet 412 reaches above the ball planting net 200. The lifting drive mechanism 430 is a vertical linear module.

[0055] Both the horizontal linear module and the vertical linear module are motor-driven linear modules. Since they are existing technologies and can be purchased directly from the market, their specific structures will not be described in detail here.

[0056] The pressure assembly is configured to move along with the ball supply assembly 400 on the ball supply mechanism. The relative movement of the pressure assembly and the upper surface of the ball supply mechanism includes translation and / or rolling. The pressure assembly includes one or more of the following: plunger assembly 621, roller assembly 623, and roller assembly 624.

[0057] The auxiliary fixture also includes a bracket 640 for mounting the pressure assembly, with at least one set of brackets 640 on each of the front and rear sides of the ball supply assembly 400 in the direction of movement. The auxiliary fixture also includes a cylinder seat 650 and a cylinder 652. The cylinder seat 650 is mounted on the ball supply assembly 400, and the cylinder 652 is mounted at an angle on the cylinder seat 650. The bracket 640 is connected to the output end of the cylinder 652. The tilt angle of the output shaft of the cylinder 652 is the same as the tilt angle of the bracket 640. Each set of brackets 640 gradually approaches the ball outlet 412 of the ball supply assembly 400 from top to bottom.

[0058] The bottom of any set of brackets 640 is configured to mount one or more of the following: plunger assembly 621, roller assembly 623, and roller assembly 624. Specifically, this embodiment uses plunger assembly 621 as an example to illustrate the pressure component:

[0059] The bottom of any bracket 640 is configured for mounting plunger assemblies 621, of which multiple plunger assemblies 621 are spaced apart on the bracket 640 in a direction perpendicular to the movement direction of the ball supply assembly 400. Each plunger assembly 621 includes a resilient plunger with a spherical plunger head 622 that presses against the ball-feeding net 200 under the action of an internal spring. The resilient plunger is commercially available.

[0060] The bracket 640 comprises two vertical rods 641 and a horizontal rod 642 connecting the lower ends of the two vertical rods 641. A cylinder seat 650 is located on the left and right sides of the ball box 410 on the supporting slide plate 423. The cylinder seat 650 has symmetrically distributed inclined mounting surfaces 651, with the outer side lower than the inner side. A cylinder 652 is mounted on each inclined mounting surface 651. The upper end of the vertical rod 641 is connected to the cylinder 652, and elastic plungers are arranged and fixed on the horizontal rod 642, with the plunger heads 622 facing downwards. In this embodiment, due to the use of an inclined mounting surface 651, both the cylinder 652 and the bracket 640 are installed at an incline. This results in the plunger head 622 of the elastic plunger being installed at an incline on both sides of the ball box 410, deflected towards the ball box 410. Furthermore, the outer walls of the front and rear sides of the ball box 410 are inclined walls with the bottom sloping inwards. The wall thickness of the front and rear sides of the ball box 410 at the ball outlet 412 is 1.2mm to 1.8mm. This allows the plunger head 622 of the plunger assembly 621 to be as close as possible to the ball outlet 412 (i.e., the elastic force point is as close as possible to the ball-laying point). To ensure linear and uniform force points, as many elastic plungers as possible should be arranged on both sides of the ball-laying box 410.

[0061] It should be noted that the elastic plungers of the technical solution of this application are arranged at as many intervals as possible along the length of the crossbar 642. The number and size of the elastic plungers can be selected according to the actual working conditions. The more elastic plungers there are, the more reasonable arc deformation can be achieved when pressed onto the ball planting net 200, and the situation of pressing out a single pit at the pressing point will not occur.

[0062] In this embodiment, the drive mechanism of the bracket 640 is a cylinder 652. Of course, other drive mechanisms can also be used, such as a linear module driven by a motor.

[0063] The plunger assembly 621 can be raised and lowered under the synchronous drive of two cylinders 652 on the same side. During the ball-laying process, the row of plunger assemblies 621 on the forward side descends under the drive of cylinders 652 to press against the ball-laying net 200, while the plunger assembly 621 on the opposite side rises under the drive of cylinders 652, disengaging from the ball-laying net 200. During the ball-laying process, the row of plunger assemblies 621 on the forward side presses down on the ball-laying net 200 with elastic force, making the ball-laying net 200 completely adhere to the substrate.

[0064] Furthermore, it also includes a vibration device that acts on the ball box 410. The vibration device includes a vibrator 660, which is also installed on the top of the ball box 410. Through the vibration of the vibrator 660, the solder balls inside the ball box 410 can be made to bounce, which can effectively improve the ball laying yield.

[0065] The positioning groove of the stage has vacuum suction holes. The substrate is positioned in the positioning groove of the stage and held in place by vacuum suction, while being fixed by means of fasteners or bolts.

[0066] In a further preferred embodiment, elastic baffles 625 are provided on both the front and rear sides of the ball outlet 412 of the ball supply assembly 400 along the translational direction of the ball supply assembly 400, and the elastic baffles 625 contact the upper surface of the ball planting net 200. Specifically, elastic baffles 625 are also added on both the front and rear sides of the ball outlet 412 of the ball box 410. Specifically, the elastic baffles 625 are fixed to the outer walls of the front and rear sides of the ball box 410, with their ends extending beyond the lower bottom surface of the ball box 410 and bending inward to contact the ball planting net 200. Adding elastic baffles 625 can prevent the implantation components from leaking out from the side during the ball laying process. The elastic baffles 625 are made of stainless steel or spring steel.

[0067] As can be seen from the above detailed description, the electronic packaging equipment of the present invention can adapt to the ball-laying operation on warped substrates. During the ball-laying process, it can avoid gaps between the substrate and the ball-laying mesh 200, thereby ensuring that the solder balls can fall correctly into the mesh of the ball-laying mesh 200, thus improving the ball-laying yield.

[0068] It should be noted that, in addition to being used for ball-laying on substrates, the technical solution of this application can also be used for ball-laying on other products, such as chips or wafers.

[0069] Example 2

[0070] Based on Embodiment 1, this specific embodiment of the electronic packaging device according to the present invention will be further described using roller assembly 623 as an example of the pressure component:

[0071] like Figure 9 As shown, in this specific embodiment, roller assembly 623 is used instead of plunger assembly 621 in embodiment one. Other structures are the same as in embodiment one, and will not be elaborated further here. Multiple roller assemblies 623 are arranged at intervals on the bracket 640 along a direction perpendicular to the movement direction of the ball supply assembly 400. Each roller assembly 623 includes elastic rollers, which consist of an elastic telescopic column and a roller mounted on the lower end of the elastic telescopic column. These elastic rollers can also be purchased directly from the market.

[0072] Similarly, during the ball-laying process, a row of elastic rollers on the forward direction side descends under the drive of cylinder 652 to press down on the ball-laying net 200, while the elastic rollers on the opposite direction side rise under the drive of cylinder 652 and detach from the ball-laying net 200.

[0073] Example 3

[0074] Based on Embodiment 1, this specific embodiment of the electronic packaging device according to the present invention will be further described using roller assembly 624 as an example of the pressure component:

[0075] like Figure 10 and Figure 11 As shown, in this specific embodiment, a roller assembly 624 is used instead of the plunger assembly 621 in Embodiment 1. The roller assembly 624 is mounted on the bracket 640 with its axis perpendicular to the movement direction of the ball supply assembly 400. The roller assembly 624 includes an elastic roller, and an elastic roller is connected between the lower ends of the two vertical rods 641. This elastic roller can be purchased directly from the market, and its surface has an elastic coating, which can be rubber or plastic.

[0076] The roller assembly 624 can preferably be a hollow roller, which can be made of metal. It utilizes the deformation recovery ability of the hollow metal structure to act on the planting net 200, so that when it is pressed on the planting net 200, the planting net 200 will produce an arc deformation, and no single pit will be pressed out.

[0077] Similarly, during the ball-laying process, the elastic roller on the forward direction side descends under the drive of cylinder 652 to press the ball-laying net 200, while the roller on the opposite direction side rises under the drive of cylinder 652 and disengages from the ball-laying net 200.

[0078] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0079] Specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above, and those skilled in the art can make various changes or modifications within the scope of the claims, which do not affect the essence of the present invention. Unless otherwise specified, the embodiments and features described in this application can be arbitrarily combined with each other.

Claims

1. An auxiliary system for electronic packaging equipment, characterized in that, It includes a ball-supplying mechanism, a ball-supplying assembly, and auxiliary tooling. The ball-supplying assembly is positioned above the ball-supplying mechanism and provides an implantation component to the implantation site of the ball-supplying mechanism. The auxiliary tooling includes pressure components arranged on both sides of the ball supply assembly in the direction of movement. During the movement of the ball supply assembly, the pressure component on the forward side of the ball supply assembly presses down to apply pressure to the ball supply mechanism, and the pressure component on the back side of the ball supply assembly lifts up. The ball-supplying mechanism includes a ball-planting net and a base plate. The base plate is located below the ball-planting net, and the points on the base plate where the implantation component is disposed coincide with the mesh of the ball-planting net to form an implantation site for accommodating the implantation component. The downward pressure applied by the pressure component acts on the ball-planting mesh, causing the ball-planting mesh to adhere to the substrate; The pressure assembly includes one or more of the following: a plunger assembly, a roller assembly, and a drum assembly; The auxiliary tooling includes a bracket for mounting a pressure assembly, the bottom of which is configured to mount one or more of a plunger assembly, a roller assembly, and a drum assembly; Multiple plunger assemblies are arranged at intervals on the support along a direction perpendicular to the movement direction of the ball supply assembly; the plunger assembly includes an elastic plunger, the plunger head of which is spherical and is pressed against the ball planting net under the action of an internal spring. The roller assembly has multiple rollers arranged at intervals on the bracket along a direction perpendicular to the movement direction of the ball supply assembly. The roller assembly includes elastic rollers, which are composed of elastic telescopic columns and rollers installed at the lower end of the elastic telescopic columns. The roller assembly is mounted on the support with its axis perpendicular to the direction of movement of the ball supply assembly, and the roller assembly includes a roller capable of recovering its deformation.

2. The auxiliary system for electronic packaging equipment as described in claim 1, characterized in that, The ball supply assembly includes a conveying device and a ball supply device, wherein the conveying device drives the ball supply device to move in a plane above the ball supply mechanism; The ball supply device stores and supplies implantation components to the implantation site of the ball-supplying mechanism.

3. The auxiliary system for electronic packaging equipment as described in claim 2, characterized in that, The ball supply device includes a ball box, a ball storage tank, and a ball outlet. The ball box is equipped with an internal space for storing implanted components. The internal space of the ball box is connected to the ball storage tank, and the bottom opening of the ball box is the ball outlet.

4. The auxiliary system for electronic packaging equipment as described in claim 3, characterized in that, The ball storage tank has an opening at the top connected to a ball inlet tube, the upper end of which extends into the interior space of the ball box to a certain height. The ball box is equipped with a vibration device, which drives the implanted component inside the ball box to bounce.

5. The auxiliary system for electronic packaging equipment as described in claim 1, characterized in that, At least one set of brackets is provided on each of the front and rear sides of the ball supply assembly in the direction of movement. Each set of brackets gradually approaches the ball outlet of the ball supply assembly from top to bottom, and the bottom of each set of brackets is configured to mount one or more of a plunger assembly, a roller assembly, and a drum assembly.

6. The auxiliary system for electronic packaging equipment as described in claim 5, characterized in that, The auxiliary tooling also includes a cylinder seat and a cylinder. The cylinder seat is configured on the ball supply assembly, the cylinder is mounted obliquely on the cylinder seat, and the bracket is connected to the output end of the cylinder.

7. The auxiliary system for electronic packaging equipment as described in claim 6, characterized in that, The tilt angle of the cylinder output shaft is the same as the tilt angle of the bracket.

8. The auxiliary system for electronic packaging equipment as described in claim 5, characterized in that, Multiple plunger assemblies are arranged at intervals on the support along a direction perpendicular to the movement direction of the ball supply assembly; Multiple roller assemblies are arranged at intervals on the bracket along a direction perpendicular to the movement direction of the ball supply assembly; The roller assembly is mounted on the support with its axis perpendicular to the direction of movement of the ball supply assembly.

Citation Information

Patent Citations

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