Manufacturing method of display panel, display panel and display device

Abstract

The embodiment of the invention discloses a manufacturing method of a display panel, the display panel and a display device. The manufacturing method of the display panel comprises the steps that a transparent conductive layer, a metal layer and a photoresist layer are sequentially formed on a substrate, a first hole is formed in the photoresist layer, the photoresist layer comprises a first protruding part, and the first protruding part is arranged around the first hole; etching the metal layer to form a second opening corresponding to the first opening in the metal layer; ashing the photoresist layer to reserve the first lug boss; and etching the transparent conductive layer to form a third hole corresponding to the second hole in the transparent conductive layer. According to the display panel, the first protruding part can serve as an anti-etching layer, the metal layer covered by the first protruding part cannot be etched, further external expansion of the formed third opening can be avoided, the phenomenon of external expansion of the via hole of the display panel is improved, meanwhile, the metal layer is light-proof and can serve as a light shielding film to play a role in shielding light leakage, and therefore the poor light leakage of the display panel is improved.

Description

Technical Field

[0001] The present application relates to the technical field of display panels, and more specifically, to a method for manufacturing a display panel, a display panel, and a display device. Background Art

[0002] In order to improve the image quality, during the thin-film transistor (TFT) manufacturing process of the display panel used in high-end notebooks, an additional metal layer can be set on the transparent conductive layer as a common electrode, so as to effectively reduce the resistance of the common electrode, improve the uniformity of the common voltage, and improve the greenish phenomenon (Greenish) caused by uneven brightness of the display panel.

[0003] In order to reduce the number of masks, a half-mask process is usually used to complete the transparent conductive layer and the metal layer pattern with one mask. However, due to the different chemical materials of the metal layer and the transparent conductive layer, the vias formed during etching are aggravated and have large deviations due to the isotropic effect of various materials. Summary of the invention

[0004] Embodiments of the present application provide a method for manufacturing a display panel, a display panel, and a display device.

[0005] The manufacturing method of the display panel provided in the embodiment of the present application includes: forming a transparent conductive layer, a metal layer and a photoresist layer in sequence on a base substrate, wherein the photoresist layer is formed with a first opening, the photoresist layer includes a first protrusion, and the first protrusion is arranged around the first opening; etching the metal layer to form a second opening corresponding to the first opening in the metal layer; ashing the photoresist layer to retain the first protrusion; etching the transparent conductive layer to form a third opening corresponding to the second opening in the transparent conductive layer.

[0006] In this way, the first raised portion can be used as an anti-etching layer, and the metal layer covered by the first raised portion will not be etched. Since the first raised portion of the photoresist layer is arranged around the first opening, the metal layer arranged around the first opening is retained, which can prevent the formed third opening from further expanding outward, thereby improving the phenomenon of the via hole of the display panel expanding outward. At the same time, the metal layer is not light-transmissive and can be used as a light-shielding film to block light leakage, thereby improving the poor light leakage of the display panel.

[0007] In some embodiments, the first opening is substantially rectangular, and the first protrusion includes a plurality of first convex strips, each of which is disposed on a side corresponding to the first opening.

[0008] In this way, the metal layer formed according to the first convex strip can prevent the side edge of the third opening formed according to the first opening from expanding outward.

[0009] In some embodiments, the length of each of the first convex strips is substantially consistent with the side length of a corresponding side of the first opening, and the width of each of the first convex strips is greater than or equal to 1.5 microns.

[0010] When the width of the first convex strip is less than 1.5 microns, the width of the formed metal layer is insufficient to effectively block the formed third opening. When the width of the first convex strip is greater than or equal to 1.5 microns, the width of the formed metal layer is sufficient to block the third opening from expanding outward.

[0011] In some embodiments, the photoresist layer further includes a second protrusion, and the second protrusion is used to form a common electrode on the metal layer. The ashing of the photoresist layer includes: ashing the photoresist layer to retain the first protrusion and the second protrusion.

[0012] In this way, the second protrusion can be used as an anti-etching layer, and the metal layer covered by the second protrusion is the second metal part, which will not be etched. The second metal part and the transparent conductive layer form a common electrode layer. Due to the conductivity of the metal layer, the resistance of the formed common electrode layer is reduced, which improves the level drift and signal distortion of the common electrode caused by the large resistance of the common electrode, thereby improving the greening phenomenon of the display panel.

[0013] In some embodiments, after etching the transparent conductive layer, the method further includes: etching the metal layer to retain the first metal portion of the metal layer covered by the first protrusion and the second metal portion of the metal layer covered by the second protrusion; and removing the first protrusion and the second protrusion using a plasma stripping process.

[0014] In this way, a finished display panel can be obtained after removing the first protruding portion and the second protruding portion.

[0015] In some embodiments, three of the first convex strips are respectively arranged on the first side, the second side and the third side of the first opening, the second protrusion is arranged on the fourth side of the first opening, or four of the first convex strips are respectively arranged on the first side, the second side, the third side and the fourth side of the first opening.

[0016] In this way, the first convex strip and the second protrusion can prevent the third opening formed based on the first opening from expanding outward.

[0017] In some embodiments, the distances between the three first protrusions and the second protrusion and the first opening are all less than 2 micrometers, or the distances between the four first protrusions and the first opening are all less than 2 micrometers.

[0018] When the distance between the first convex strip or the second convex portion and the first opening is greater than 2 microns, the formed metal layer is difficult to effectively block the formed third opening. When the distance between the first convex strip or the second convex portion and the first opening is less than or equal to 2 microns, the formed metal layer can effectively block the third opening from expanding outward.

[0019] The display panel provided in the embodiment of the present application includes a base substrate, a transparent conductive layer formed on the base substrate, and a metal layer formed on the transparent conductive layer. The transparent conductive layer is formed with a third opening, and the metal layer includes a first metal part, which is arranged around the third opening.

[0020] In some embodiments, the third opening is substantially rectangular, the first metal portion includes a plurality of second convex strips, and each of the second convex strips is disposed on a side corresponding to the third opening.

[0021] In some embodiments, the metal layer also includes a second metal portion, which is configured to form a common electrode, three second convex strips are respectively arranged on the first side, second side and third side of the third opening, the second metal portion is arranged on the fourth side of the first opening, or four second convex strips are respectively arranged on the first side, second side, third side and fourth side of the first opening.

[0022] In some embodiments, the distances between the three second protrusions and the second metal portion and the third opening are all less than 2 micrometers, or the distances between the four second protrusions and the third opening are all less than 2 micrometers.

[0023] An embodiment of the present application provides a display device, and the display device includes the display panel of the above embodiment.

[0024] The present application provides a method for manufacturing a display panel, a display panel, and a display device. The method for manufacturing a display panel includes: sequentially forming a transparent conductive layer, a metal layer, and a photoresist layer on a substrate, wherein the photoresist layer is formed with a first opening, the photoresist layer includes a first protrusion, and the first protrusion is arranged around the first opening; etching the metal layer to form a second opening corresponding to the first opening in the metal layer; ashing the photoresist layer to retain the first protrusion; etching the transparent conductive layer to form a third opening corresponding to the second opening in the transparent conductive layer.

[0025] The first raised portion can be used as an anti-etching layer, and the metal layer covered by the first raised portion will not be etched. Since the first raised portion of the photoresist layer is arranged around the first opening, the metal layer arranged around the first opening is retained, which can prevent the formed third opening from further expanding outward, thereby improving the phenomenon of the via hole expanding outward on the display panel. At the same time, the metal layer is light-proof and can be used as a light-shielding film to block light leakage, thereby improving the poor light leakage of the display panel.

[0026] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0028] Figure 1 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present application;

[0029] Figure 2 is a schematic diagram of a cross-sectional structure formed by a method for manufacturing a display panel in the related art;

[0030] Figure 3 is a schematic top view of a display panel in the related art;

[0031] Figure 4 is a schematic diagram of a cross-sectional structure formed by a method for manufacturing a display panel according to an embodiment of the present application;

[0032] Figure 5 is a schematic diagram of a cross-sectional structure formed by a method for manufacturing a display panel according to an embodiment of the present application;

[0033] Figure 6 is a schematic cross-sectional structure diagram of a display panel according to some embodiments of the present application;

[0034] Figure 7 is a schematic top view of a display panel according to some embodiments of the present application;

[0035] Figure 8 is a schematic cross-sectional structure diagram of a display panel according to some embodiments of the present application;

[0036] Fig. 9 is a schematic top view of a display panel according to some embodiments of the present application;

[0037] Fig.10 is a schematic diagram of a display device according to an embodiment of the present application.

[0038] Description of main component symbols:

[0039] Display panel 100 , base substrate 10 , first opening 11 , second opening 12 , third opening 13 , transparent conductive layer 20 , metal layer 30 , first metal portion 31 , second metal portion 32 , photoresist layer 40 , first protrusion 41 , second protrusion 42 , display device 1000 . DETAILED DESCRIPTION

[0040] The embodiments of the present application are described in detail below, and the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0041] All directional indications (such as up, down, left, right, front, and back) in the embodiments of the present application are only used to explain the relative positional relationship, movement, etc. between the components under a certain posture (as shown in the drawings). If the specific posture changes, the directional indication will also change accordingly. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0042] In order to improve the image quality, during the thin-film transistor (TFT) manufacturing process of the display panel used in high-end notebooks, an additional metal layer can be set on the transparent conductive layer as a common electrode, so as to effectively reduce the resistance of the common electrode, improve the uniformity of the common voltage, and improve the greenish phenomenon (Greenish) caused by uneven brightness of the display panel.

[0043] In order to reduce the number of masks, a half-mask process is usually used to complete the transparent conductive layer and the metal layer pattern with one mask. However, due to the different chemical materials of the metal layer and the transparent conductive layer, the vias formed during etching are aggravated and have large deviations due to the isotropic effect of various materials.

[0044] Reference Figure 1 as well as Figure 2 , the embodiments of the present application provide a method for manufacturing a display panel, a display panel, and a display device. In the manufacturing process of the display panel, the metal layer will block the further expansion of the via hole during etching, so as to avoid the formed via hole from expanding further and having a large deviation. The display panel of the embodiments of the present application can be obtained by the manufacturing method provided by the embodiments of the present application. Due to the blocking of the metal layer, the phenomenon of the via hole of the display panel expanding outward is improved. At the same time, the metal layer is not light-transmissive and can be used as a light-shielding film to block light leakage, thereby improving the poor light leakage of the display panel.

[0045] Reference Figure 1 , the manufacturing method of the display panel 100 provided in the embodiment of the present application includes:

[0046] Step 01: A transparent conductive layer 20, a metal layer 30 and a photoresist layer 40 are sequentially formed on a base substrate 10, wherein the photoresist layer 40 is formed with a first opening 11, and the photoresist layer 40 includes a first protrusion 41, and the first protrusion 41 is arranged around the first opening 11;

[0047] Step 02: Etching the metal layer 30 to form a second opening 12 corresponding to the first opening 11 in the metal layer 30;

[0048] Step 03: Ashing the photoresist layer 40 to retain the first protrusion 41;

[0049] Step 04: Etching the transparent conductive layer 20 to form a third opening 13 corresponding to the second opening 12 in the transparent conductive layer 20 .

[0050] Specifically, in order to reduce the number of masks in the related art, a half-mask process is usually used to achieve one mask to complete the patterns of the transparent conductive layer 20 and the metal layer 30. However, since the chemical materials of the metal layer 30 and the transparent conductive layer 20 are different, the via hole formed is aggravated and has a large deviation due to the isotropic effect of various materials during etching.

[0051] by Figure 2 For example, the film structure diagram formed by the manufacturing method of the display panel 100 in the related art can refer to the film structure of A1 to A6. Referring to A1 and A2, etching the metal layer 30 in the first opening 11 can obtain the corresponding second opening 12. Referring to A3 and A4, etching the transparent conductive layer 20 in the second opening 12 can obtain the third opening 13.

[0052] Since the metal layer 30 and the transparent conductive layer 20 are made of different chemical materials, the third opening 13 is expanded more and has a larger deviation due to the isotropic effect of various materials during etching.

[0053] by Figure 3 For example, the dotted frame portion represents the designed third opening 13, and the implemented portion represents the third opening 13 after expansion. The expansion of the via hole is aggravated and the deviation of the side length of the third opening 13 becomes larger, resulting in poor light leakage in the display panel 100.

[0054] In the method for manufacturing the display panel 100 according to the embodiment of the present application, the metal layer 30 blocks the via hole from further expanding outward, thereby preventing the formed via hole from expanding outward more and having a larger deviation.

[0055] Reference Figure 4 The film structure diagram formed by the manufacturing method of the display panel 100 can refer to the film structures of B1 to B4. Among them, executing the above step 01 can obtain the film structure of B1, executing the above step 02 can obtain the film structure of B2, executing the above step 03 can obtain the film structure of B3, and executing the above step 04 can obtain the film structure of B4.

[0056] Reference Figure 5The film structure diagram formed by the manufacturing method of the display panel 100 can refer to the film structures of C1 to C4. Among them, executing the above step 01 can obtain the film structure of C1, executing the above step 02 can obtain the film structure of C2, executing the above step 03 can obtain the film structure of C3, and executing the above step 04 can obtain the film structure of C4.

[0057] by Figure 4 For example, referring to B1, when performing step 01, the photoresist layer 40 may be formed with a first opening 11, and the photoresist layer 40 includes a first protrusion 41, and the first protrusion 41 is arranged around the first opening 11.

[0058] Referring to B2, when executing step 02, the photoresist layer 40 can be used as an anti-etching layer, and the metal layer 30 covered by the photoresist layer 40 will not be etched. Since the photoresist layer 40 is arranged around the first opening 11, the formed second opening 12 can be prevented from further expanding outward.

[0059] Referring to B3, when performing step 03, the first protrusion 41 is retained.

[0060] Referring to B4, when executing step 04, the first protrusion 41 can be used as an anti-etching layer, and the metal layer 30 covered by the first protrusion 41 will not be etched, thereby preventing the formed third opening 13 from further expanding outward.

[0061] In this way, the first protrusion 41 can be used as an anti-etching layer, and the metal layer 30 covered by the first protrusion 41 is the first metal part 31, and the first metal part 31 will not be etched. Since the first protrusion 41 of the photoresist layer 40 is arranged around the first opening 11, the first metal part 31 arranged around the first opening 11 is retained, and the formed third opening 13 can be prevented from further expanding outward, thereby improving the phenomenon of the via hole expanding outward in the display panel 100. At the same time, the metal layer 30 is not light-transmissive and can be used as a light-shielding film to block light leakage, thereby improving the poor light leakage of the display panel 100.

[0062] In some embodiments, the photoresist layer 40 further includes a second protrusion 42 , and the second protrusion 42 is used to form a common electrode on the metal layer 30 . Ashing the photoresist layer 40 includes: ashing the photoresist layer 40 to retain the first protrusion 41 and the second protrusion 42 .

[0063] Specifically, in the related art, when the resistance of the common electrode is large, it may cause uneven voltage distribution of the common electrode, thereby causing level drift and signal distortion of the common electrode, which may eventually lead to the appearance of greening of the screen.

[0064] The second protrusion 42 can be used as an anti-etching layer, and the second metal part 32 covered by the second protrusion 42 will not be etched. The second metal part 32 can be on the transparent conductive layer 20 and form a common electrode with the transparent conductive layer 20. Of course, the first metal part 31 can also cooperate with the second metal part 32 to form a common electrode on the transparent conductive layer 20 and the transparent conductive layer 20, and the high conductivity of the metal layer 30 is used to reduce the resistance of the common electrode, thereby improving the greening phenomenon of the display panel 100.

[0065] In some embodiments, after step 04: etching the transparent conductive layer 20, the method further comprises:

[0066] Step 05: Etching the metal layer 30 to retain the first metal portion 31 of the metal layer 30 covered by the first protrusion 41 and the second metal portion 32 of the metal layer 30 covered by the second protrusion 42;

[0067] Step 06: Use a plasma stripping process to remove the first protrusion 41 and the second protrusion 42.

[0068] Reference Figure 4 The film structure diagram formed by the manufacturing method of the display panel 100 can refer to the film structure of B5 and B6. Among them, executing the above step 05 can obtain the film structure of B5, and executing the above step 06 can obtain the film structure of B6.

[0069] Reference Figure 5 The film structure diagram formed by the manufacturing method of the display panel 100 can refer to the film structures of C5 and C6. Among them, executing the above step 05 can obtain the film structure of C5, and executing the above step 06 can obtain the film structure of C6.

[0070] by Figure 4 For example, referring to B5, when executing step 05, the first metal part 31 of the metal layer 30 covered by the first protrusion 41 and the second metal part 32 of the metal layer 30 covered by the second protrusion 42 are retained. Referring to B6, the photoresist is removed, and the finished product of the display panel 100 can be obtained.

[0071] The display panel 100 provided in the embodiment of the present application includes a base substrate 10, a transparent conductive layer 20 and a metal layer 30. The transparent conductive layer 20 is formed on the base substrate 10, and the transparent conductive layer 20 is formed with a third opening 13. The metal layer 30 is formed on the transparent conductive layer 20, and the metal layer 30 includes a first metal portion 31, and the first metal portion 31 is arranged around the third opening 13.

[0072] Specifically, the film layer structure diagram of the display panel 100 can be referred to Figure 6 , the corresponding top view can be referred to Figure 7During the manufacturing process of the display panel 100, the metal layer 30 covered by the first protrusion 41 and the second protrusion 42 is retained, and the metal layer 30 covered by the first protrusion 41 prevents the third opening 13 from expanding outward. In the display panel 100 formed, the metal layer 30 covered by the first protrusion 41 is the first metal part 31, and the first metal part 31 is arranged around the third opening 13.

[0073] In some embodiments, the first metal portion 31 and the second metal portion 32 are disposed around the third opening 13 .

[0074] Specifically, the film layer structure diagram of the display panel 100 can refer to Figure 8 , the corresponding top view can be referred to Fig. 9 During the manufacturing process of the display panel 100, the metal layer 30 covered by the first protrusion 41 and the second protrusion 42 is retained, and the metal covered by the first protrusion 41 and the second protrusion 42 prevents the third opening 13 from expanding outward. In the display panel 100 formed, the first metal part 31 and the second metal part 32 are arranged around the third opening 13.

[0075] In some embodiments, the first opening 11 is substantially rectangular, and the first protrusion 41 includes a plurality of first convex strips, each of which is disposed on a side corresponding to the first opening 11 .

[0076] Specifically, Figure 4 For example, referring to B1, when performing step 01, the photoresist layer 40 may be formed with a first opening 11. Referring to B2, when performing step 02, the metal layer 30 inside the first opening 11 is etched to form a second opening 12. Referring to B3, when performing step 03, the first protrusion 41 is retained. Referring to B4, when performing step 04, the first protrusion 41 may be used as an anti-etching layer, the metal layer 30 covered by the first protrusion 41 will not be etched, and the transparent conductive layer 20 inside the second opening 12 is etched to form a third opening 13.

[0077] It can be understood that the second opening 12 is formed based on the first opening 11, and the orthographic projection of the second opening 12 on the substrate 10 is substantially consistent with the orthographic projection of the first opening 11 on the substrate 10. The third opening 13 is formed based on the second opening 12, and the orthographic projection of the third opening 13 on the substrate 10 is substantially consistent with the orthographic projection of the second opening 12 on the substrate 10. Therefore, the orthographic projection of the third opening 13 on the substrate 10 is substantially consistent with the orthographic projection of the first opening 11 on the substrate 10.

[0078] The orthographic projection of the first opening 11 on the substrate may be a rectangle or a figure approximately similar to a rectangle. The orthographic projection of the third opening 13 on the substrate may be a rectangle or a figure approximately similar to a rectangle.

[0079] When executing step 05, the metal layer 30 covered by the first convex strip is retained, and the metal layer 30 not covered by the first convex strip is etched. When executing step 06, the first protrusion 41 is removed to obtain the corresponding second convex strip.

[0080] It can be understood that the second convex strip is formed based on the first convex strip, and therefore, the orthographic projection of the first convex strip on the base substrate 10 is substantially consistent with the orthographic projection of the second convex strip on the base substrate 10 .

[0081] Each first convex strip can be arranged near a side edge of the first opening 11 to avoid the second opening 12 and the third opening 13 formed based on the first opening 11 from expanding outward, resulting in that in the formed display panel 100, each second convex strip can be arranged near a side edge of the second opening 12.

[0082] In some embodiments, the photoresist layer 40 also includes a second protrusion 42, which is used to form a common electrode on the metal layer 30, and the three first protrusions are respectively arranged on the first side, the second side and the third side of the first opening 11, the second protrusion 42 is arranged on the fourth side of the first opening 11, or the four first protrusions are respectively arranged on the first side, the second side, the third side and the fourth side of the first opening 11.

[0083] In some embodiments, the metal layer 30 also includes a second metal portion 32, which is configured to form a common electrode, and the three second convex strips are respectively arranged on the first side, the second side and the third side of the third opening 13, the second metal portion 32 is arranged on the fourth side of the first opening 11, or the four second convex strips are respectively arranged on the first side, the second side, the third side and the fourth side of the first opening 11.

[0084] Specifically, Figure 6 and Figure 7 For example, the second protrusion 42 can be arranged away from the first opening 11, and the four first protrusions of the first protrusion 41 can be arranged near the four sides of the first opening 11. The four second protrusions prevent the second opening 12 and the third opening 13 formed based on the first opening 11 from expanding outward, resulting in that in the display panel 100, the four second protrusions can be arranged near the four sides of the second opening 12.

[0085] by Figure 8 as well as Fig. 9For example, the first protrusion 41 can be arranged near one side of the first opening 11, and the three first protrusions of the first protrusion 41 can be arranged on the three sides of the first opening 11. The second protrusion 42 and the three second protrusions prevent the second opening 12 and the third opening 13 formed based on the first opening 11 from expanding outward, resulting in that in the display panel 100 formed, the three second protrusions can be arranged near the three sides of the second opening 12, and the second protrusion 42 is arranged near the fourth side of the second opening 12.

[0086] In some embodiments, the length of each second convex strip is substantially consistent with the side length of a corresponding side of the third opening 13, and the width of each second convex strip is greater than or equal to 1.5 microns.

[0087] In some embodiments, the length of each first convex strip is substantially consistent with the side length of the corresponding side of the first opening 11 , and the width of each first convex strip is greater than or equal to 1.5 microns.

[0088] Specifically, since the orthographic projection of the third opening 13 on the base substrate 10 is substantially consistent with the orthographic projection of the first opening 11 on the base substrate 10, the orthographic projection of the first convex strip on the base substrate 10 is substantially consistent with the orthographic projection of the second convex strip on the base substrate 10. Therefore, the length and width of the first convex strip are substantially consistent with the corresponding second convex strip, and the distance between the first convex strip and the first opening 11 is substantially consistent with the distance between the second convex strip and the third opening 13.

[0089] By reference Figure 7 and Fig. 9 For example, the length of the first ridge and the second ridge can be set to a, the width of the first ridge and the second ridge can be set to b, the distance between the first ridge and the first opening 11 and the distance between the second ridge and the third opening 13 can be set to c.

[0090] Among them, a can be substantially consistent with the side length of the first opening 11 or the side length of the third opening 13 , ensuring that when the third opening 13 expands outward, the formed metal layer 30 can block the third opening 13 .

[0091] In some embodiments, the first opening 11 and the third opening 13 may be set to be a rectangle with a side length greater than or equal to 13 microns. The first opening 11 and the third opening 13 may be a rectangle with a length of 13 microns, 14 microns, 15 microns, 16 microns, 17 microns, 18 microns, 20 microns, 23 microns, 26 microns, etc., and a width of 13 microns, 14 microns, 15 microns, 16 microns, 17 microns, 18 microns, 20 microns, 23 microns, 26 microns, etc. a may be consistent with the length or width of the first opening 11 and the third opening 13.

[0092] In some embodiments, b can be set to be greater than or equal to 1.5 microns. When b is greater than or equal to 1.5 microns, the width of the first ridge near the first opening 11 is large enough, and the second ridge formed can effectively prevent the third opening 13 from expanding. When b is less than 1.5 microns, the width of the first ridge near the first opening 11 is insufficient, and the second ridge formed is difficult to effectively prevent the third opening 13 from expanding. b can be set to 1.5 microns, 1.6 microns, 1.8 microns, 2.0 microns, 2.4 microns, 2.8 microns, 3.0 microns, 3.2 microns, 3.4 microns, 3.6 microns, 4.0 microns, 4.2 microns, 4.6 microns and 5 microns.

[0093] In some embodiments, the thickness of the second convex strip may be less than or equal to 5 microns, and may be specifically set to 2.0 microns, 2.4 microns, 2.8 microns, 3.0 microns, 3.2 microns, 3.4 microns, 3.6 microns, 4.0 microns, 4.2 microns, 4.6 microns and 5 microns.

[0094] In some embodiments, the distances between the three first protrusions and the second protrusion 42 and the first opening 11 are all less than 2 micrometers, or the distances between the four first protrusions and the first opening 11 are all less than 2 micrometers.

[0095] In some embodiments, the distances between the three second protrusions and the second metal portion 32 and the third opening 13 are all less than 2 micrometers, or the distances between the four second protrusions and the third opening 13 are all less than 2 micrometers.

[0096] Specifically, since the orthographic projection of the third opening 13 on the base substrate 10 is substantially consistent with the orthographic projection of the first opening 11 on the base substrate 10, the orthographic projection of the first convex strip on the base substrate 10 is substantially consistent with the orthographic projection of the second convex strip on the base substrate 10. Therefore, the distance between the first convex strip and the first opening 11 is substantially consistent with the distance between the second convex strip and the third opening 13.

[0097] In addition, the second portion is formed based on the second protruding portion 42, and the orthographic projection of the second portion on the base substrate 10 is substantially consistent with the orthographic projection of the second protruding portion 42 on the base substrate 10. Therefore, the distance between the second protruding portion 42 and the first opening 11 is substantially consistent with the distance between the second portion and the third opening 13.

[0098] By reference Figure 6 For example, the second protrusion 42 can be arranged away from the first opening 11, and the four first protrusions of the first protrusion 41 can be arranged near the four sides of the first opening 11. Figure 7 , the distance between the first convex strip and the first opening 11 and the distance between the second convex strip and the third opening 13 can be set to c.

[0099] In some embodiments, c can be set to be less than or equal to 2 microns. When c is less than or equal to 2 microns, the distance between the first convex strip and the first opening 11 is small enough, and the second convex strip formed can effectively prevent the third opening 13 from expanding outward. When c is greater than 2 microns, the distance between the first convex strip and the first opening 11 is not small enough, and the second convex strip formed is difficult to effectively prevent the third opening 13 from expanding outward. b can be set to 0 microns, 0.1 microns, 0.2 microns, 0.3 microns, 0.4 microns, 0.6 microns, 0.8 microns, 1.0 microns, 1.2 microns, 1.5 microns, 1.6 microns, 1.8 microns, 2.0 microns.

[0100] By reference Figure 8 For example, the second protrusion 42 can be disposed near the first opening 11 , and the three first protrusions of the first protrusion 41 can be disposed near the three sides of the first opening 11 . The second protrusion 42 is disposed near the fourth side of the first opening 11 .

[0101] Reference Fig. 9 The distance between the first protrusion and the first opening 11 and the distance between the second protrusion and the third opening 13 can be set to d, and the distance between the second protrusion 42 and the first opening 11 and the distance between the second part and the third opening 13 can be set to e.

[0102] In some embodiments, d can be set to be less than or equal to 2 microns. When d is less than or equal to 2 microns, the distance between the first ridge and the first opening 11 is small enough, and the second ridge formed can effectively prevent the third opening 13 from expanding outward. When d is greater than 2 microns, the distance between the first ridge and the first opening 11 is not small enough, and the second ridge formed is difficult to effectively prevent the third opening 13 from expanding outward. b can be set to 0 microns, 0.1 microns, 0.2 microns, 0.3 microns, 0.4 microns, 0.6 microns, 0.8 microns, 1.0 microns, 1.2 microns, 1.5 microns, 1.6 microns, 1.8 microns, 2.0 microns.

[0103] In some embodiments, e can be set to be less than or equal to 2 microns. When e is less than or equal to 2 microns, the distance between the first convex strip and the first opening 11 is small enough, and the second convex strip formed can effectively prevent the third opening 13 from expanding outward. When e is greater than 2 microns, the distance between the first convex strip and the first opening 11 is not small enough, and the second convex strip formed is difficult to effectively prevent the third opening 13 from expanding outward. b can be set to 0 microns, 0.1 microns, 0.2 microns, 0.3 microns, 0.4 microns, 0.6 microns, 0.8 microns, 1.0 microns, 1.2 microns, 1.5 microns, 1.6 microns, 1.8 microns, 2.0 microns.

[0104] In some embodiments, the length and width of the transparent conductive layer 20 can be set to be greater than or equal to 13 micrometers. The length of the transparent conductive layer 20 can be 13 micrometers, 14 micrometers, 15 micrometers, 16 micrometers, 17 micrometers, 18 micrometers, 20 micrometers, 23 micrometers, 26 micrometers, etc., and the width can be 13 micrometers, 14 micrometers, 15 micrometers, 16 micrometers, 17 micrometers, 18 micrometers, 20 micrometers, 23 micrometers, 26 micrometers, etc.

[0105] In some embodiments, the width of the second protrusion 42 can be set to be greater than or equal to 1.5 microns, and the width of the second protrusion 42 can be 1.5 microns, 1.6 microns, 1.8 microns, 2.0 microns, 2.4 microns, 2.8 microns, 3.0 microns, 3.2 microns, 3.4 microns, 3.6 microns, 4.0 microns, 4.2 microns, 4.6 microns and 5 microns.

[0106] Reference Fig.10 The embodiment of the present application provides a display device 1000, and the display device 1000 includes the display panel 100 of the above embodiment. The display device 1000 includes all the beneficial effects of the display panel 100, which are not described one by one here.

[0107] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.

[0108] In addition, the term "connection" should be understood in a broad sense, for example, it can include fixed connection, detachable connection, or integral connection; it can include direct connection, indirect connection through an intermediate medium, and internal communication between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0109] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0110] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A method for manufacturing a display panel, characterized in that: include: A transparent conductive layer, a metal layer and a photoresist layer are sequentially formed on a substrate, wherein the photoresist layer is formed with a first opening, and the photoresist layer includes a first convex portion, and the first convex portion is arranged around the first opening; etching the metal layer to form a second opening in the metal layer corresponding to the first opening; ashing the photoresist layer to retain the first protrusion; The transparent conductive layer is etched to form a third opening in the transparent conductive layer corresponding to the second opening.

2. The method for manufacturing a display panel according to claim 1, characterized in that: The first opening is substantially rectangular, and the first protrusion includes a plurality of first convex strips, each of which is arranged on a side corresponding to the first opening.

3. The method for manufacturing a display panel according to claim 2, characterized in that: The length of each of the first convex strips is substantially consistent with the side length of a corresponding side of the first opening, and the width of each of the first convex strips is greater than or equal to 1.5 microns.

4. The method for manufacturing a display panel according to claim 2, wherein: The photoresist layer further includes a second protrusion, and the second protrusion is used to form a common electrode on the metal layer, and the ashing of the photoresist layer includes: The photoresist layer is ashed to retain the first protrusion and the second protrusion.

5. The method for manufacturing a display panel according to claim 4, characterized in that: After etching the transparent conductive layer, the method further includes: etching the metal layer to retain a first metal portion of the metal layer covered by the first protrusion and a second metal portion of the metal layer covered by the second protrusion; The first protrusion and the second protrusion are removed by a plasma stripping process.

6. The method for manufacturing a display panel according to claim 4, characterized in that: The three first convex strips are respectively arranged on the first side, the second side and the third side of the first opening, and the second convex portion is arranged on the fourth side of the first opening, or The four first protrusions are respectively disposed on a first side, a second side, a third side and a fourth side of the first opening.

7. The method for manufacturing a display panel according to claim 6, characterized in that: The distances between the three first protrusions and the second protrusion and the first opening are all less than 2 micrometers, or The distances between the four first protrusions and the first opening are all less than 2 micrometers.

8. A display panel, characterized in that: include: substrate substrate; A transparent conductive layer formed on the base substrate, wherein the transparent conductive layer is formed with a third opening; A metal layer is formed on the transparent conductive layer, wherein the metal layer includes a first metal portion, and the first metal portion is disposed around the third opening.

9. The display panel according to claim 8, characterized in that: The third opening is substantially rectangular, the first metal portion includes a plurality of second convex strips, and each of the second convex strips is disposed on a side corresponding to the third opening.

10. The display panel according to claim 9, characterized in that: The length of each of the second convex strips is substantially consistent with the side length of a corresponding side of the third opening, and the width of each of the second convex strips is greater than or equal to 1.5 microns.

11. The display panel according to claim 9, characterized in that: The metal layer further includes a second metal portion, the second metal portion is configured to form a common electrode, the three second convex strips are respectively arranged on the first side, the second side and the third side of the third opening, and the second metal portion is arranged on the fourth side of the first opening, or The four second protrusions are respectively disposed on the first side, the second side, the third side and the fourth side of the first opening.

12. The display panel according to claim 11, characterized in that: The distances between the three second protrusions and the second metal portion and the third opening are all less than 2 micrometers, or The distances between the four second protrusions and the third openings are all less than 2 micrometers.

13. A display device, characterized in that: The display device comprises the display panel according to any one of claims 8 to 12.

Images