Display device, display panel and preparation method of display panel

Abstract

The invention provides a display device, a display panel and a preparation method thereof. The display panel is provided with a display area and a frame area located on the periphery of the display area. The display panel further comprises a dam structure, the dam structure is arranged in the frame area, the dam structure is provided with a thickening structure, a main body structure and an eave structure which are sequentially stacked in the direction from the driving structure layer to the packaging structure layer, and at least one side end of the eave structure extends out of the top surface of the main body structure; and the orthographic projection of the top surface of the thickening structure on the bottom surface of the eave structure does not exceed the bottom surface of the eave structure and extends out of the side end edge of the main body structure. In the dam structure provided by the invention, the orthographic projection of the top surface of the thickening structure on the bottom surface of the eave structure does not exceed the bottom surface of the eave structure and extends out of the side end edge of the main body structure; the probability that the packaging structure layer covering the side end, extending out of the main body structure, of the bottom face of the eave structure and the packaging structure layer covering the top face of the thickening structure form an empty package is reduced, and then the reliability of the display panel is improved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display device, a display panel and a method for manufacturing the same. Background Art

[0002] Organic light emitting diodes (OLED) and other light emitting devices are increasingly widely used in products such as televisions and mobile phones because of their lightness, energy saving, wide color gamut, and high contrast. In the process of preparing OLED, the isolation structure between pixels is prepared by removing the process route of the overhanging structure of the mask to improve the display effect of the pixels. When the thin film encapsulation blocking structure is prepared by removing the process route of the overhanging structure of the mask, cracks, empty packages and other defects are prone to occur in the side and lower area of ​​the eaves structure in the overhanging structure, which in turn affects the subsequent process. Summary of the invention

[0003] The main technical problem solved by the present invention is to provide a display device, a display panel and a manufacturing method thereof, so as to solve the problem of poor reliability of the display panel in the prior art.

[0004] In order to solve the above technical problems, the first technical solution adopted by the present invention is: providing a display panel, comprising a display area and a frame area located around the display area; the display panel comprises a driving structure layer and a packaging structure layer stacked in sequence, and the display panel further comprises a dam structure, the dam structure is arranged in the frame area, and is arranged between the driving structure layer and the packaging structure layer;

[0005] The dam structure comprises a thickening structure, a main structure and an eaves structure which are stacked in sequence along the direction from the driving structure layer to the packaging structure layer, and at least one side end of the eaves structure extends out of the top surface of the main structure; the orthographic projection of the top surface of the thickening structure on the bottom surface of the eaves structure does not extend beyond the side edge of the main structure extending beyond the bottom surface of the eaves structure.

[0006] The thickened structure includes a planar layer and a pixel defining layer, the pixel defining layer is between the planar layer and the main structure, and at least the bottom surface of the eaves structure extends beyond the end of the top surface of the pixel defining layer away from the end of the display area.

[0007] The encapsulation structure layer includes a first inorganic encapsulation layer, an organic encapsulation layer and a second inorganic encapsulation layer stacked in a direction away from the pixel defining layer, and the total thickness of the thickening structure and the main structure is greater than twice the thickness of the first inorganic encapsulation layer.

[0008] Among them, part of the eaves structure extending out of the top surface of the main structure cooperates with the side wall surface of the main structure and the top surface of part of the thickened structure to form a groove on the side wall surface of the dam structure, the first inorganic packaging layer covers the inner wall surface of the groove, the second inorganic packaging layer fills and covers the opening of the groove, and the surface of the second inorganic packaging layer away from the side wall of the dam structure is a plane.

[0009] The minimum distance between the end surface of the first inorganic encapsulation layer away from the display area and the bottom surface of the flat layer in the outermost dam structure is not less than 2 micrometers.

[0010] In order to solve the above technical problems, the second technical solution adopted by the present invention is: to provide a method for preparing a display panel, the method for preparing a display panel comprising:

[0011] A pre-processed panel is obtained, wherein the pre-processed panel has a display area and a frame area surrounding the display area, and the pre-processed panel includes a driving structure layer and a thickening layer stacked in sequence; a blocking structure is arranged on the thickening layer in the frame area; the blocking structure includes a main structure and an eaves structure arranged away from the thickening layer; at least one end of the eaves structure extends out of the top surface of the main structure;

[0012] The thickening layer on the side of the top surface of the eaves structure extending out of the main structure is removed in sequence to form a thickening structure on the side of the main structure away from the eaves structure. The thickening structure and the blocking structure form a dam structure. The orthographic projection of the top surface of the thickening structure on the bottom surface of the eaves structure does not exceed the edge of one end of the bottom surface of the eaves structure extending out of the main structure.

[0013] A packaging structure layer is formed on one side of the driving structure layer where the dam structure is provided.

[0014] The method of sequentially removing a portion of the thickening layer on the side of the top surface of the eaves structure extending out of the main structure to form a thickening structure on the side of the main structure away from the eaves structure includes:

[0015] forming a first photoresist layer on a side of the driving structure layer disposed on the blocking structure;

[0016] A first window is formed on the first photoresist layer, and the surfaces of the blocking structure and the thickened layer around the blocking structure are exposed through the first window; the thickened layer includes a flat layer and a pixel defining layer stacked in a direction away from the driving structure layer;

[0017] At least the thickened layer in the first window that is not covered by the orthographic projection of the eaves structure is removed by dry etching to form a thickened structure on the side of the main structure away from the eaves structure.

[0018] The pre-processing panel further includes a plurality of metal layers arranged at intervals, the metal layers are arranged between the thickening layer and the driving electrode, and the material of the thickening layer is different from the material of the metal layer;

[0019] At least a portion of the thickened layer in the first window that is not covered by the orthographic projection of the eaves structure on the thickened layer is removed by dry etching, comprising:

[0020] The portion of the thickened layer in the first window that is not covered by the orthographic projection of the eaves structure on the thickened layer is removed by dry etching until the metal layer is exposed.

[0021] Wherein, a packaging structure layer is formed on one side of the driving structure layer where the dam structure is provided, including:

[0022] An inorganic material is deposited on the surface of one side of the driving structure layer where the dam structure is arranged to obtain a first inorganic encapsulation layer; the first inorganic encapsulation layer covers all exposed surfaces of the side of the driving structure layer where the dam structure is arranged and the inner wall surface of the groove on the side wall surface of the dam structure; the groove on the side wall surface of the dam structure is formed by the cooperation of a part of the eaves structure extending out of the top surface of the main structure, the side wall surface of the main structure, and a part of the top surface of the thickened structure;

[0023] forming an organic encapsulation layer on the first inorganic encapsulation layer on one side of the dam structure close to the display area;

[0024] Depositing an inorganic material on the organic encapsulation layer and the dam structure to form a first sub-inorganic encapsulation layer;

[0025] The surface of the first inorganic sub-encapsulation layer facing away from the driving structure layer is thinned to obtain a second inorganic sub-encapsulation layer; the thickness of the second inorganic sub-encapsulation layer covered on the inner wall surface of the groove is greater than the thickness of the second inorganic sub-encapsulation layer covered on the top surface of the dam structure;

[0026] An inorganic material is deposited on the exposed surface of the second inorganic sub-encapsulation layer and thinned until the inorganic material fills the groove, and at least the first inorganic sub-encapsulation layer and the second inorganic sub-encapsulation layer serve as the second inorganic encapsulation layer.

[0027] In order to solve the above technical problem, the third technical solution adopted by the present invention is: to provide a display device, including the display panel in the first technical solution.

[0028] The beneficial effects of the present invention are as follows: Different from the prior art, a display device, a display panel and a preparation method thereof are provided, which have a display area and a frame area located around the display area; the display panel includes a driving structure layer and a packaging structure layer stacked in sequence, and the display panel also includes a dam structure, which is arranged in the frame area and arranged between the driving structure layer and the packaging structure layer; the dam structure has a thickening structure, a main structure and an eaves structure stacked in sequence along the direction from the driving structure layer to the packaging structure layer, at least one side end of the eaves structure extends out of the top surface of the main structure; the orthographic projection of the top surface of the thickening structure on the bottom surface of the eaves structure does not extend beyond the side edge of the main structure extending from the bottom surface of the eaves structure. In the dam structure provided by the present application, by making the orthographic projection of the top surface of the thickening structure on the bottom surface of the eaves structure not extend beyond the side edge of the main structure extending from the bottom surface of the eaves structure, the probability of forming an empty package between the packaging structure layer covered by the bottom surface of the eaves structure extending out of the side end of the main structure and the packaging structure layer covered by the top surface of the thickening structure is reduced, thereby improving the reliability of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0030] Figure 1 It is a schematic diagram of a planar structure of a display panel provided by a technical solution in the prior art;

[0031] Figure 2 yes Figure 1 A schematic diagram of the cross-sectional structure of a display panel along the AA direction provided in an embodiment;

[0032] FIG3( a ) is a schematic diagram of a cross-sectional structure of a barrier structure covering a first inorganic encapsulation layer in the prior art;

[0033] FIG3( b ) is a schematic diagram of the cross-sectional structure of the barrier structure covering the second inorganic encapsulation layer in the prior art;

[0034] Figure 4 is a schematic cross-sectional structure diagram of a display panel provided in the first embodiment of the present application;

[0035] Figure 5 is a schematic cross-sectional structure diagram of a dam structure provided in the second embodiment of the present application;

[0036] Figure 6 is a schematic cross-sectional structure diagram of a dam structure provided in the third embodiment of the present application;

[0037] Figure 7 is a schematic diagram of a process for preparing a display panel provided in the present application;

[0038] Figure 8(a) to Figure 8(e) yes Figure 7 A schematic cross-sectional structure diagram of a dam structure corresponding to step S1 in the method for preparing a display panel;

[0039] Fig. 9 yes Figure 7 A schematic flow chart of a specific embodiment of step S3 in the method for preparing a display panel is provided;

[0040] Figure 10(a) to Figure 10(f) yes Fig. 9 A schematic diagram of the cross-sectional structure of the dam structure corresponding to step S3;

[0041] Fig.11 It is a schematic diagram of the structure of a display device provided in one embodiment of the present application.

[0042] In the figure: display device 100; display panel 10; display area 1; frame area 2; driving structure layer 11; substrate 111; driving substrate 112; metal layer 113; thickening layer 12; flat layer 121; pixel defining layer 122; conductive isolation structure 13; conductive structure 131; roof structure 132; encapsulation structure layer 14; first inorganic encapsulation layer 141; organic encapsulation layer 142; second inorganic encapsulation layer 143; first sub-encapsulation layer 1431; second sub-encapsulation layer 1432; dam structure 21; thickening structure 211; main structure 212; eaves structure 213; groove 214; empty package 22; panel to be processed 3; first functional layer 31; second functional layer 32; first photoresist layer 4; first window 41; second photoresist layer 5; second window 52; blocking structure 6. DETAILED DESCRIPTION

[0043] The following describes the embodiments of the present invention in detail with reference to the accompanying drawings.

[0044] In the following description, for the purpose of explanation rather than limitation, specific details such as particular system structures, interfaces, and technologies are provided to provide a thorough understanding of the present invention.

[0045] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] The terms "first", "second" and "third" in the present invention are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second" and "third" can explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. All directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0047] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0048] See also Figure 1 to Figure 3(b) , Figure 1 It is a schematic diagram of a planar structure of a display panel provided by a technical solution in the prior art; Figure 2 yes Figure 1 The embodiment provides a schematic diagram of the cross-sectional structure of the display panel along the AA direction; FIG3(a) is a schematic diagram of the cross-sectional structure after the blocking structure covers the first inorganic encapsulation layer in the prior art; FIG3(b) is a schematic diagram of the cross-sectional structure after the blocking structure covers the second inorganic encapsulation layer in the prior art.

[0049] At present, when a thin film package is prepared directly through a process line of a draping structure without a mask, defects such as cracks and empty packages 22 are prone to occur in the side and lower area of ​​the eaves structure 213 in the draping structure. Specifically, in a direction perpendicular to the display panel 10, the display panel 10 includes a driving structure layer 11, a pixel defining layer 122, and an encapsulation structure layer 14 stacked in sequence. The display panel 10 also includes a blocking structure 6, which is arranged in the frame area 2 and between the driving structure layer 11 and the encapsulation structure layer 14. The blocking structure 6 includes a main structure 212 and an eaves structure 213 stacked in a direction from the driving structure layer 11 to the encapsulation structure layer 14, and the edge of the eaves structure 213 extends out of the top surface of the main structure 212. The encapsulation structure layer 14 includes a first inorganic encapsulation layer 141, an organic encapsulation layer 142, and a second inorganic encapsulation layer 143 stacked in a direction away from the driving structure layer 11. Among them, the organic encapsulation layer 142 is an inkjet printing layer (Ink Jet Print, IJP), and the blocking structure 6 is used to block the leveling of the organic encapsulation layer 142. The first inorganic encapsulation layer 141 and the second inorganic encapsulation layer 143 are stacked on the exposed driving structure layer 11 and the outer wall surface of the blocking structure 6. Since the edge of the eaves structure 213 in the blocking structure 6 extends out of the top surface of the main structure 212 to form the eaves structure 213, the second inorganic encapsulation layer 143 at the end of the extended eaves structure 213 is easily connected to the second inorganic encapsulation layer 143 on the driving structure layer 11, so as to form an air bag 22 between the outer side surface of the main structure 212 and the lower surface of the extended eaves structure 213 and the upper surface of the driving structure layer 11. When the display panel 10 is heated, the air in the air bag 22 is easily expanded and contracted, resulting in cracks in the second inorganic encapsulation layer 143, which affects the encapsulation performance of the encapsulation structure layer 14.

[0050] Furthermore, when it is necessary to set other circuit layers on the packaging structure layer 14 of the display panel 10 , the other circuit layers laid on the packaging structure layer 14 may be at risk of disconnection due to the unstable structure of the packaging structure layer 14 .

[0051] See also Figures 4 to 6 , Figure 4 is a schematic cross-sectional structure diagram of a display panel provided in the first embodiment of the present application; Figure 5 is a schematic cross-sectional structure diagram of a dam structure provided in the second embodiment of the present application; Figure 6 It is a schematic diagram of the cross-sectional structure of the dam structure provided in the third embodiment of the present application.

[0052] Based on the above questions, please refer to Figure 4The present application provides a display panel 10, comprising a display area 1 and a frame area 2 located around the display area 1; the display panel 10 comprises a driving structure layer 11 and a packaging structure layer 14 which are stacked in sequence, and the display panel 10 further comprises a dam structure 21, the dam structure 21 is arranged in the frame area 2, and is arranged between the driving structure layer 11 and the packaging structure layer 14; the dam structure 21 comprises a thickening structure 211, a main structure 212 and an eaves structure 213 which are stacked in sequence along a direction from the driving structure layer 11 to the packaging structure layer 14, at least one side end of the eaves structure 213 extends out of the top surface of the main structure 212; the orthographic projection of the top surface of the thickening structure 211 on the bottom surface of the eaves structure 213 does not extend beyond the side edge of the bottom surface of the eaves structure 213 extending out of the main structure 212.

[0053] In the dam structure 21 provided in the present embodiment, by ensuring that the orthographic projection of the top surface of the thickening structure 211 on the bottom surface of the eaves structure 213 does not extend beyond the bottom surface of the eaves structure 213 and out of the side edge of the main structure 212, the probability of forming an empty package 22 between the packaging structure layer 14 covered by the bottom surface of the eaves structure 213 extending out of the side end of the main structure 212 and the packaging structure layer 14 covered on the top surface of the thickening structure 211 is reduced, thereby improving the reliability of the display panel 10.

[0054] The driving structure layer 11 includes a substrate 111 and a driving substrate 112 which are stacked in sequence.

[0055] In one embodiment, the display panel 10 further includes a metal layer 113, a flat layer 121, and a pixel defining layer 122 which are stacked in sequence. The metal layer 113 is disposed on a side surface of the driving substrate 112 away from the substrate 111. In another embodiment, the metal layer 113 may also be a circuit layer in the driving substrate 112. The flat layer 121 is used to fill the recessed area on the driving substrate 112 or the metal layer 113, and form a smooth and flat surface on the side away from the driving structure layer 11. The material of the flat layer 121 may be silicone resin, acrylic resin, polyimide, etc. The pixel defining layer 122 is disposed on a side surface of the flat layer 121 away from the driving substrate 112. A plurality of mutually spaced windows are disposed on the pixel defining layer 122, each window being a sub-pixel region, and a light-emitting device is disposed in the sub-pixel region. The light-emitting device includes an anode electrode, a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, an electron injection layer, and a cathode electrode which are stacked in a direction away from the driving structure layer 11.

[0056] A conductive isolation structure 13 is provided on the pixel defining layer 122 in the display area 1, and the conductive isolation structure 13 is used to block the phenomenon of light crosstalk between the light-emitting devices in adjacent sub-pixel areas. The conductive isolation structure 13 includes a conductive structure 131 provided on the pixel defining layer 122 and a roof structure 132 provided on the conductive structure 131. The positive projection of the conductive structure 131 on the driving substrate 112 overlaps at least partially with the positive projection of the anode electrode on the driving substrate 112, and the pixel defining layer 122 located in the overlapping area is provided with a plurality of conductive vias, and the conductive structure 131 is connected to the anode electrode through the conductive vias; the anode electrode is electrically connected to the power supply wiring on the driving substrate 112 through the vias, and the conductive structure 131 is electrically coupled to the cathode electrode of the display area 1, thereby realizing the signal connection between the cathode electrode and the signal wiring.

[0057] The border area 2 has at least one independently arranged thickening structure 211, the thickening structure 211 includes a portion of the flat layer 121 and a portion of the pixel defining layer 122 stacked, and a portion of the metal layer 113 is exposed through the gap between adjacent thickening structures 211. The cross-sectional shape of the thickening structure 211 in the first direction can be a regular trapezoid, an inverted trapezoid, a rectangle, etc. The first direction is a direction perpendicular to the display panel 10.

[0058] The main body structure 212 and the eaves structure 213 are sequentially arranged on the side surface of the thickening structure 211 away from the driving structure. The main body structure 212 is arranged at the same layer and spaced apart from the conductive structure 131, and the eaves structure 213 is arranged at the same layer and spaced apart from the roof structure 132. In this embodiment, the width of the orthographic projection of the bottom surface of the main body structure 212 on the top surface of the thickening structure 211 is smaller than the width of the top surface of the thickening structure 211.

[0059] At least one side end of the eaves structure 213 extends out of the top surface of the main structure 212. In one embodiment, one side end of the eaves structure 213 close to the display area 1 or away from the display area 1 extends out of the top surface of the main structure 212. In one embodiment, one side end of the eaves structure 213 close to the display area 1 and one side end of the eaves structure 213 away from the display area 1 both extend out of the top surface of the main structure 212 in a direction away from the central axis of the eaves structure 213 in the first direction.

[0060] The orthographic projection of the top surface of the thickening structure 211 on the bottom surface of the eaves structure 213 does not extend beyond the bottom surface of the eaves structure 213 and out of the side edge of the main structure 212 .

[0061] In one embodiment, when the eaves structure 213 extends out of the top surface of the main structure 212 at one side end close to the display area 1, the orthographic projection of the top surface of the thickening structure 211 on the bottom surface of the eaves structure 213 does not exceed the edge of the side end of the eaves structure 213 close to the display area 1. Furthermore, in order to reduce the probability of the bottom surface of the eaves structure 213 extending out of the side end of the main structure 212 and the encapsulation structure layer 14 covered by the top surface of the thickening structure 211 forming an empty package 22, the orthographic projection of the top surface of the thickening structure 211 on the bottom surface of the eaves structure 213 is located on the side of the edge of the side end of the eaves structure 213 close to the display area 1 away from the display area 1. Among them, the eaves structure 213 extends part of the top surface of the main structure 212 near the side end of the display area 1 and cooperates with the side wall surface of the main structure 212 near the display area 1 and the part of the top surface of the thickening structure 211 near the display area 1 to form a groove 214 on the side wall surface of the dam structure 21 near the display area 1.

[0062] In a specific embodiment, the side end of the eaves structure 213 away from the display area 1 does not extend beyond the top surface of the main structure 212. Specifically, the side end surface of the eaves structure 213 away from the display area 1 is in the same plane as the side wall surface of the main structure 212 away from the display area 1. Or, the orthographic projection of the side end surface of the eaves structure 213 away from the display area 1 on the top surface of the main structure 212 is on the side of the side edge of the top surface of the main structure 212 away from the display area 1 and close to the display area 1. The side end surface of the eaves structure 213 away from the display area 1 forms a step structure with the part of the top surface of the main structure 212 away from the display area 1 and the side wall surface of the main structure 212 away from the display area 1.

[0063] In one embodiment, when the eaves structure 213 extends out of the top surface of the main structure 212 at one side end away from the display area 1, the orthographic projection of the top surface of the thickening structure 211 on the bottom surface of the eaves structure 213 does not exceed the edge of the side end of the eaves structure 213 away from the display area 1. Furthermore, in order to reduce the probability of the bottom surface of the eaves structure 213 extending out of the side end of the main structure 212 and the encapsulation structure layer 14 covered by the top surface of the thickening structure 211 forming an empty package 22, the orthographic projection of the top surface of the thickening structure 211 on the bottom surface of the eaves structure 213 is located on the side of the edge of the side end of the eaves structure 213 away from the display area 1 close to the display area 1. Among them, the eaves structure 213 extends part of the top surface of the main structure 212 away from the side end of the display area 1 and cooperates with the side wall surface of the main structure 212 away from the display area 1 and the part of the top surface of the thickening structure 211 away from the display area 1 to form a groove 214 on the side wall surface of the dam structure 21 away from the display area 1.

[0064] In a specific embodiment, one side end of the eaves structure 213 close to the display area 1 does not extend beyond the top surface of the main structure 212. Specifically, one side end surface of the eaves structure 213 close to the display area 1 is in the same plane as the side wall surface of the main structure 212 close to the display area 1. Or, the orthographic projection of one side end surface of the eaves structure 213 close to the display area 1 on the top surface of the main structure 212 is on the side of the side edge of the top surface of the main structure 212 close to the display area 1 away from the display area 1. One side end surface of the eaves structure 213 close to the display area 1 forms a step structure with a portion of the top surface of the main structure 212 close to the display area 1 and the side wall surface of the main structure 212 close to the display area 1.

[0065] In one embodiment, when the side end of the eaves structure 213 close to the display area 1 and the side end of the eaves structure 213 away from the display area 1 both extend out of the top surface of the main structure 212 in the direction away from the central axis of the eaves structure 213 in the first direction, the orthographic projection of the top surface of the thickening structure 211 on the bottom surface of the eaves structure 213 does not exceed the bottom surface of the eaves structure 213. Further, in order to reduce the probability that the bottom surface of the eaves structure 213 extends out of the side end of the main structure 212 and the encapsulation structure layer 14 covered on the top surface of the thickening structure 211 to form an empty package 22, at least the bottom surface of the eaves structure 213 extends out of the end of the top surface of the pixel defining layer 122 away from the end of the display area 1. In one embodiment, only the bottom surface of the eaves structure 213 extends out of the end of the top surface of the pixel defining layer 122 away from the end of the display area 1. In one embodiment, both opposite ends of the bottom surface of the eaves structure 213 extend out of the end of the top surface of the pixel defining layer 122.

[0066] The eaves structure 213 extends out of the partial top surface of the main structure 212 close to the display area 1 and the partial top surface away from the display area 1, and respectively cooperates with the corresponding side wall surface of the main structure 212 and the top surface of the partial pixel defining layer 122 in the corresponding area, so as to form grooves 214 on the side wall surface of the dam structure 21 close to the display area 1 and the side wall surface away from the display area 1.

[0067] In this embodiment, the cross-sectional shapes of the eaves structure 213, the main structure 212, and the thickening structure 211 in the first direction may all be regular trapezoids or rectangles.

[0068] In one embodiment, the encapsulation structure layer 14 is disposed on the side of the driving structure layer 11 where the dam structure 21 is disposed. The encapsulation structure layer 14 includes a first inorganic encapsulation layer 141, an organic encapsulation layer 142 and a second inorganic encapsulation layer 143 stacked in a direction away from the driving structure layer 11.

[0069] The first inorganic encapsulation layer 141 extends to the frame area 2 in a direction away from the display area 1 and covers the exposed surface of the dam structure 21. The first inorganic encapsulation layer 141 covers the exposed metal layer 113, the side wall surface of the dam structure 21, the inner wall surface of the groove 214, and the top surface of the dam structure 21. In order to reduce the probability of the first inorganic encapsulation layer 141 forming an empty package 22, the total thickness of the thickening structure 211 and the main structure 212 is at least twice the thickness of the first inorganic encapsulation layer 141. In order to facilitate the post-processing of the first inorganic encapsulation layer 141, the minimum distance between the end surface of one side of the first inorganic encapsulation layer 141 away from the display area 1 and the bottom surface of the flat layer 121 in the dam structure 21 arranged on the outermost side is not less than 2 microns.

[0070] The organic encapsulation layer 142 extends to the frame area 2 in a direction away from the display area 1, and the dam structure 21 intercepts the leveling of the organic encapsulation layer 142, reducing the risk of the organic encapsulation layer 142 being leveled to the outside of the frame area 2. The surface of the organic encapsulation layer 142 on one side away from the driving structure layer 11 is not lower than the bottom surface of the eaves structure 213, and is not higher than the top surface of the eaves structure 213.

[0071] The second inorganic encapsulation layer 143 extends to the frame area 2 in a direction away from the display area 1, and covers the exposed organic encapsulation layer 142 and the exposed first inorganic encapsulation layer 141. The second inorganic encapsulation layer 143 covers the organic encapsulation layer 142, and the second inorganic encapsulation layer 143 covers the metal layer 113, the side wall surface of the dam structure 21, the inner wall surface of the groove 214, and the first inorganic encapsulation layer 141 covered on the top surface of the dam structure 21. The second inorganic encapsulation layer 143 fills the groove 214 and covers the opening of the groove 214, and the surface of the second inorganic encapsulation layer 143 away from the side wall of the dam structure 21 is a plane, so that the second inorganic encapsulation layer 143 filled in the groove 214 does not have an empty package 22 phenomenon, and improves the phenomenon of cracks in the wiring on the second inorganic encapsulation layer 143 in the later stage.

[0072] In one embodiment, at least one of the main structure 212 and the eaves structure 213 is made of metal material, and the material of the main structure 212 is different from the material of the eaves structure 213. For example, the material of the main structure 212 and the material of the eaves structure 213 can be different metals. In a specific embodiment, the material of the main structure 212 can be copper, etc.; the material of the eaves structure 213 can be aluminum, etc.; in another embodiment, one of the main structure 212 and the eaves structure 213 is a metal and the other is an insulating material. Among them, the metal includes but is not limited to copper, aluminum, etc.; the insulating material includes but is not limited to polyimide, etc.

[0073] In one embodiment, there may be one or more dam structures 21 . When there are more than one dam structures 21 , the dam structures 21 are spaced apart from each other, and the metal layer 113 is exposed through the gaps between the dam structures 21 .

[0074] In one embodiment, when there are two dam structures 21, the thickening structure 211 in the dam structure 21 close to the display area 1 is independently arranged, that is, the thickening structure 211 in the dam structure 21 is arranged at intervals from the pixel defining layer 122 and the planar layer 121 stacked in the display area 1, such as Figure 6 , to avoid the phenomenon of empty package 22 in the groove 214 when the surface of the side of the organic encapsulation layer 142 away from the driving structure layer 11 does not reach the bottom surface of the eaves structure 213, such as Figure 5 .

[0075] In one embodiment, the present application provides a method for preparing a display panel 10, and the method for preparing the display panel 10 includes the following specific implementation methods. The display panel 10 prepared by the preparation method is the display panel 10 in the above embodiment. In the following embodiment, in order to reduce the manufacturing process, the main structure 212 and the conductive structure 131 are arranged on the same layer and made of the same material; the eaves structure 213 and the roof structure 132 are arranged on the same layer and made of the same material.

[0076] See also Figure 7 , Figure 7 It is a schematic diagram of the process of the method for preparing the display panel provided in the present application.

[0077] S1: Obtain a preprocessed panel, the preprocessed panel having a display area and a border area surrounding the display area, the preprocessed panel comprising a driving structure layer and a thickening layer stacked in sequence; a blocking structure is arranged on the thickening layer in the border area; the blocking structure comprises a main structure and an eaves structure arranged away from the thickening layer; at least one end of the eaves structure extends out of the top surface of the main structure.

[0078] See also Figure 8(a) to Figure 8(e) , Figure 8(a) to Figure 8(e) yes Figure 7 A schematic cross-sectional structure diagram of the dam structure corresponding to step S1 in the method for preparing the display panel.

[0079] Specifically, a driving substrate 112 is covered on one side of the substrate 111 to form a driving structure layer 11. A metal layer 113 is covered on the side of the driving substrate 112 away from the substrate 111, and the metal layer 113 is etched. A flat layer 121 and a pixel defining layer 122 are sequentially stacked on the side of the metal layer 113 away from the driving structure layer 11. The flat layer 121 and the pixel defining layer 122 stacked in a direction away from the driving structure layer 11 constitute a thickening layer 12.

[0080] A plurality of windows are formed on the pixel defining layer 122 of the display area 1, each window being a sub-pixel window, and each sub-pixel area is used to subsequently form a light-emitting device. In this embodiment, the pixel defining layer 122 and the flat layer 121 of the frame area 2 are both full-layer structures without windows.

[0081] The first functional layer 31 and the second functional layer 32 are sequentially covered on the surface of the pixel defining layer 122 away from the driving structure layer 11. The material of the first functional layer 31 and the material of the second functional layer 32 can be the same or different. The materials of the first functional layer 31 and the second functional layer 32 can be metal or insulating layer, which is set according to the actual situation, as shown in FIG8(a).

[0082] In the following embodiments, the first functional layer 31 and the second functional layer 32 are both metals, and the material of the first functional layer 31 is different from the material of the second functional layer 32. For example, the first functional layer 31 is copper, and the second functional layer 32 is aluminum.

[0083] A photoresist layer is covered on the second functional layer 32, and the photoresist layer completely covers the second functional layer 32. A plurality of first openings spaced apart from each other are opened on the photoresist layer by exposure and development, and the openings expose a portion of the second functional layer 32. The exposed second functional layer 32 is removed by wet etching, so that the first functional layer 31 is exposed through the openings. The second functional layer 32 forms a plurality of second preforms.

[0084] The portion of the first functional layer 31 exposed by the window opening is removed by wet etching, and the edge of the first functional layer 31 exposed by the window opening, that is, the portion of the first functional layer 31 covered by the edge of the second preform is also etched away, so that the first functional layer 31 forms a plurality of first preforms. The central axis of the second preform in the direction perpendicular to the surface of the driving structure layer 11 coincides with the central axis of the first preform in the direction perpendicular to the surface of the driving structure layer 11, and the width of the first preform is smaller than the width of the second preform. The first photoresist layer 4 is removed.

[0085] Among them, the first preform in the display area 1 is used as the conductive structure 131, the second preform is used as the roof structure 132, and the conductive structure 131 and the roof structure 132 sequentially stacked on the pixel defining layer 122 of the display area 1 constitute the conductive isolation structure 13 in the above embodiment. The first preform in the frame area 2 is used as the main structure 212, the second preform is used as the eaves structure 213, and the main structure 212 and the eaves structure 213 sequentially stacked on the pixel defining layer 122 of the frame area 2 constitute the blocking structure 6. The panel 3 to be processed is obtained through the above steps, as shown in Figure 8(b).

[0086] S2: sequentially remove part of the thickening layer on one side of the top surface of the eaves structure extending out of the main structure to form a thickening structure on the side of the main structure away from the eaves structure. The thickening structure and the blocking structure constitute a dam structure. The orthographic projection of the top surface of the thickening structure on the bottom surface of the eaves structure does not exceed the edge of one end of the main structure extending out of the bottom surface of the eaves structure.

[0087] Specifically, a first photoresist layer 4 is formed on the side of the driving structure layer 11 disposed on the blocking structure 6; a first window 41 is formed on the first photoresist layer 4, and the blocking structure 6 and the surface of the thickened layer 12 around the blocking structure 6 are exposed through the first window 41. The width of the first window 41 is greater than the width of the gap between two adjacent blocking structures 6, as shown in FIG8(c).

[0088] At least the thickened layer 12 in the first window 41 that is not covered by the orthographic projection of the eaves structure 213 is removed by dry etching to form a thickened structure 211 on the side of the main structure 212 away from the eaves structure 213 .

[0089] In one embodiment, only the portion of the thickened layer 12 in the first window 41 that is not covered by the orthographic projection of the eaves structure 213 on the thickened layer 12 is removed by dry etching. For example, only the pixel defining layer 122 is removed to expose the flat layer 121. Alternatively, the pixel defining layer 122 and a portion of the flat layer 121 are removed, and the thickness of the removed flat layer 121 is less than the total thickness of the flat layer 121.

[0090] In one embodiment, in order to avoid over-etching, the portion of the thickened layer 12 in the first window 41 that is not covered by the orthographic projection of the eaves structure 213 on the thickened layer 12 is removed by dry etching until the metal layer 113 is exposed, as shown in FIG8(d).

[0091] The first photoresist layer 4 is removed.

[0092] In this embodiment, the formed thickening structure 211 and the main structure 212 and the eaves structure 213 stacked on the top surface thereof form a dam structure 21. At least one side end of the eaves structure 213 extends out of the top surface of the main structure 212; the orthographic projection of the top surface of the thickening structure 211 on the bottom surface of the eaves structure 213 does not exceed the side edge of the main structure 212 extending out of the bottom surface of the eaves structure 213. Specifically, the longitudinal axis of the pixel defining layer 122 coincides with the longitudinal axis of the eaves structure 213, and the width of the top surface of the pixel defining layer 122 is smaller than the width of the bottom surface of the eaves structure 213, as shown in FIG8(e).

[0093] S3: forming a packaging structure layer on the side of the driving structure layer where the dam structure is provided.

[0094] See also Fig. 9 as well as Figure 10(a) to Figure 10(f) , Fig. 9 yes Figure 7 A schematic flow chart of a specific embodiment of step S3 in the method for preparing a display panel is provided; Figure 10(a) to Figure 10(f) yes Fig. 9 Schematic diagram of the cross-sectional structure of the dam structure corresponding to step S3.

[0095] S31: depositing an inorganic material on the surface of the driving structure layer on one side of which the dam structure is provided, to obtain a first inorganic encapsulation layer.

[0096] In one embodiment, inorganic material is deposited on the surface of one side of the driving structure layer 11 where the dam structure 21 is set by chemical vapor deposition to obtain a first inorganic encapsulation layer 141. The first inorganic encapsulation layer 141 covers all exposed surfaces on the side of the driving structure layer 11 where the dam structure 21 is set and the inner wall surface of the groove 214 on the side wall surface of the dam structure 21; the groove 214 on the side wall surface of the dam structure 21 is formed by the cooperation of part of the eaves structure 213 extending out of the top surface of the main structure 212, the side wall surface of the main structure 212, and part of the top surface of the thickening structure 211. In order to avoid the formation of an empty bag 22 in the first inorganic encapsulation structure layer 14, the total thickness of the thickening structure 211 and the main structure 212 is at least twice the thickness of the first inorganic encapsulation layer 141, as shown in Figure 10 (a).

[0097] In one embodiment, the second photoresist layer 5 is covered on the first inorganic encapsulation layer 141, the second photoresist layer 5 covers the first inorganic encapsulation layer 141, and the portion of the first inorganic encapsulation layer 141 away from the display area 1 is provided with a second window 51. The second window 51 is provided on the side of the outermost dam structure 21 away from the display area 1. The portion of the first inorganic encapsulation layer 141 away from the display area 1 is exposed through the second window 51, and the exposed first inorganic encapsulation layer 141 is removed by dry etching to perform edge processing on the first inorganic encapsulation layer 141. The minimum distance between the end surface of the first inorganic encapsulation layer 141 away from the display area 1 and the bottom surface of the flat layer 121 in the outermost dam structure 21 is not less than 2 microns, as shown in FIG. 10(b).

[0098] S32: forming an organic encapsulation layer on the first inorganic encapsulation layer on a side of the dam structure close to the display area.

[0099] Specifically, an organic encapsulation material is disposed on the surface of the first inorganic encapsulation layer 141 in the display area 1 by inkjet printing. The organic encapsulation material has fluidity. The organic encapsulation material in the display area 1 flows to the frame area 2. The organic encapsulation material is blocked by the dam structure 21. Then, the organic encapsulation material forms an organic encapsulation layer 142 on the surface of the first inorganic encapsulation layer 141 away from the pixel defining layer 122, as shown in FIG. 10(c).

[0100] S33: forming a second inorganic encapsulation layer on a side of the organic encapsulation layer away from the pixel defining layer.

[0101] Specifically, an inorganic material is deposited on the organic encapsulation layer 142 and the dam structure 21 by vapor deposition to form a first sub-inorganic encapsulation layer 1431 , as shown in FIG. 10( d ).

[0102] Since the orthographic projection of the top surface of the thickened structure 211 on the bottom surface of the eaves structure 213 does not extend beyond the bottom surface of the eaves structure 213 and out of the side edge of the main structure 212, the probability of the first sub-inorganic encapsulation layer 1431 forming an empty bag 22 at the groove 214 is reduced.

[0103] The surface of the first sub-inorganic encapsulation layer 1431 facing away from the driving structure layer 11 is thinned by anisotropic dry etching to obtain a second sub-inorganic encapsulation layer 1432. In the anisotropic dry etching, it is difficult to perform side etching compared with the isotropic dry etching method. Therefore, the film thickness of the first sub-inorganic encapsulation layer 1431 covered on the driving structure layer 11, the side wall surface of the dam structure 21, and the top surface of the dam structure 21 is reduced, while the film thickness of the first sub-inorganic encapsulation layer 1431 covered in the groove 214 formed on the side wall surface of the dam structure 21 is not reduced. That is, the thickness of the second sub-inorganic encapsulation layer 1432 covered on the inner wall surface of the groove 214 is greater than the thickness of the second sub-inorganic encapsulation layer 1432 covered on the top surface of the dam structure 21, as shown in Figure 10 (e).

[0104] After the inorganic material is continuously deposited on the exposed surface of the second inorganic sub-encapsulation layer 1432, a thinning process is performed until the inorganic material fills the groove 214, and at least the first inorganic sub-encapsulation layer 1431 and the second inorganic sub-encapsulation layer 1432 serve as the second inorganic encapsulation layer 143. Specifically, the multi-layer inorganic sub-encapsulation layer formed on the side of the first inorganic encapsulation layer 141 covered on the dam structure 21 away from the dam structure 21 constitutes the second inorganic encapsulation layer 143, as shown in FIG10(f).

[0105] The encapsulation structure layer 14 can be obtained through the above steps.

[0106] In one embodiment, a wiring layer is formed on a side of the packaging structure layer 14 away from the driving structure layer 11 by spraying or other methods.

[0107] See also Fig.11 , Fig.11 It is a schematic diagram of the structure of a display device provided in one embodiment of the present application.

[0108] In the present embodiment, a display device 100 is provided. The display device 100 can be used in the fields of tablets, mobile phones, vehicles, lighting, etc.

[0109] The display device 100 includes a display panel 10, and the specific structure and function of the display panel 10 are the same or similar to the specific structure and function of the display panel 10 in the above embodiment, and can achieve the same technical effect. For details, please refer to the detailed description above and will not be repeated here.

[0110] The display panel 10 in the display device 100 adopts the display panel 10 in the above embodiment, and has a display area 1 and a frame area 2 located around the display area 1; the display panel 10 includes a driving structure layer 11 and a packaging structure layer 14 stacked in sequence, and the display panel 10 also includes a dam structure 21, the dam structure 21 is arranged in the frame area 2, and is arranged between the driving structure layer 11 and the packaging structure layer 14; the dam structure 21 has a thickening structure 211, a main structure 212 and an eaves structure 213 stacked in sequence along the direction from the driving structure layer 11 to the packaging structure layer 14, at least one side end of the eaves structure 213 extends out of the top surface of the main structure 212; the orthographic projection of the top surface of the thickening structure 211 on the bottom surface of the eaves structure 213 does not exceed the bottom surface of the eaves structure 213 and extends out of the side edge of the main structure 212. In the dam structure 21 provided in the present application, by ensuring that the orthographic projection of the top surface of the thickening structure 211 on the bottom surface of the eaves structure 213 does not extend beyond the bottom surface of the eaves structure 213 and out of the side edge of the main structure 212, the probability of forming an empty package 22 between the packaging structure layer 14 covered by the bottom surface of the eaves structure 213 extending out of the side end of the main structure 212 and the packaging structure layer 14 covered on the top surface of the thickening structure 211 is reduced, thereby improving the reliability of the display panel 10.

[0111] The above are only implementation modes of the present invention, and are not intended to limit the patent protection scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A display panel, comprising a display area and a frame area located around the display area; the display panel comprises a driving structure layer and a packaging structure layer stacked in sequence, the display panel further comprises a dam structure, the dam structure is arranged in the frame area and between the driving structure layer and the packaging structure layer; characterized in that: The dam structure comprises a thickening structure, a main body structure and an eaves structure which are sequentially stacked in a direction from the driving structure layer to the packaging structure layer, and at least one side end of the eaves structure extends out of the top surface of the main body structure; The orthographic projection of the top surface of the thickening structure on the bottom surface of the eaves structure does not extend beyond the bottom surface of the eaves structure and beyond the side edge of the main structure.

2. The display panel according to claim 1, characterized in that: The thickening structure includes a planar layer and a pixel defining layer, wherein the pixel defining layer is located between the planar layer and the main structure, and at least the bottom surface of the eaves structure extends beyond the end of the top surface of the pixel defining layer away from the end of the display area.

3. The display panel according to claim 2, characterized in that: The encapsulation structure layer includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer stacked in a direction away from the pixel defining layer, and the total thickness of the thickening structure and the main structure is greater than twice the thickness of the first inorganic encapsulation layer.

4. The display panel according to claim 3, characterized in that: The portion of the eaves structure extending out of the top surface of the main structure cooperates with the side wall surface of the main structure and the portion of the top surface of the thickened structure to form a groove on the side wall surface of the dam structure, the first inorganic encapsulation layer covers the inner wall surface of the groove, the second inorganic encapsulation layer fills and covers the opening of the groove, and the surface of the second inorganic encapsulation layer away from the side wall of the dam structure is a plane.

5. The display panel according to claim 3, characterized in that: The minimum distance between an end surface of the first inorganic encapsulation layer away from the display area and a bottom surface of the planar layer in the outermost dam structure is not less than 2 micrometers.

6. A method for preparing a display panel, characterized in that: The method for preparing the display panel includes: A pre-processed panel is obtained, wherein the pre-processed panel has a display area and a frame area surrounding the display area, the pre-processed panel comprises a driving structure layer and a thickening layer stacked in sequence; a blocking structure is arranged on the thickening layer in the frame area; the blocking structure comprises a main structure and an eaves structure arranged away from the thickening layer; at least one end of the eaves structure extends out of the top surface of the main structure; Sequentially remove the part of the thickening layer on the side of the top surface of the eaves structure extending out of the main structure, so as to form the thickening structure on the side of the main structure away from the eaves structure, wherein the thickening structure and the blocking structure form a dam structure; the orthographic projection of the top surface of the thickening structure on the bottom surface of the eaves structure does not exceed the edge of one end of the main structure extending out of the bottom surface of the eaves structure; A packaging structure layer is formed on a side of the driving structure layer where the dam structure is disposed.

7. The preparation method according to claim 6, characterized in that: The step of sequentially removing a portion of the thickening layer on a side of the eaves structure extending out of the top surface of the main structure to form the thickening structure on a side of the main structure away from the eaves structure includes: forming a first photoresist layer on a side of the driving structure layer disposed on the blocking structure; A first window is formed on the first photoresist layer, through which the blocking structure and the surface of the thickened layer around the blocking structure are exposed; the thickened layer includes a flat layer and a pixel defining layer stacked in a direction away from the driving structure layer; At least the thickened layer in the first window that is not covered by the orthographic projection of the eaves structure is removed by dry etching to form the thickened structure on a side of the main structure away from the eaves structure.

8. The preparation method according to claim 7, characterized in that: The pre-processing panel further comprises a plurality of metal layers arranged at intervals, wherein the metal layers are arranged between the thickening layer and the driving electrode, and the material of the thickening layer is different from the material of the metal layers; The step of removing at least a portion of the thickened layer in the first window that is not covered by the orthographic projection of the eaves structure on the thickened layer by dry etching comprises: The portion of the thickened layer in the first window that is not covered by the orthographic projection of the eaves structure on the thickened layer is removed by dry etching until the metal layer is exposed.

9. The preparation method according to claim 6, characterized in that: The encapsulation structure layer is formed on a side of the driving structure layer where the dam structure is arranged, comprising: An inorganic material is deposited on the surface of the side of the driving structure layer where the dam structure is arranged to obtain a first inorganic encapsulation layer; the first inorganic encapsulation layer covers all exposed surfaces of the driving structure layer on the side where the dam structure is arranged and the inner wall surface of the groove on the side wall surface of the dam structure; the groove on the side wall surface of the dam structure is formed by the cooperation of the part of the eaves structure extending out of the top surface of the main structure, the side wall surface of the main structure and the top surface of part of the thickening structure; forming an organic encapsulation layer on the first inorganic encapsulation layer on a side of the dam structure close to the display area; Depositing an inorganic material on the organic encapsulation layer and the dam structure to form a first sub-inorganic encapsulation layer; The surface of the first inorganic sub-encapsulation layer facing away from the driving structure layer is thinned to obtain a second inorganic sub-encapsulation layer; the thickness of the second inorganic sub-encapsulation layer covered on the inner wall surface of the groove is greater than the thickness of the second inorganic sub-encapsulation layer covered on the top surface of the dam structure; An inorganic material is deposited on the exposed surface of the second inorganic sub-encapsulation layer and thinned until the inorganic material fills the groove, and at least the first inorganic sub-encapsulation layer and the second inorganic sub-encapsulation layer serve as the second inorganic encapsulation layer.

10. A display device, characterized in that: The invention comprises a display panel as claimed in any one of claims 1 to 5.

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