Light-emitting substrate and display device

Abstract

The invention discloses a light-emitting substrate and a display device. The light-emitting substrate comprises a driving backboard; the light-emitting units are arranged on one side of the driving backboard, and each light-emitting unit comprises at least one light-emitting chip; and the packaging structure is arranged between the driving back plate and the light-emitting unit, and the packaging structure is arranged around the light-emitting unit.

Description

Light-emitting substrate and display device Technical Field

[0001] The present disclosure relates to the field of micro LED display technology, and in particular to a light-emitting substrate and a display device. Background Art

[0002] Light-emitting diodes (LEDs) are widely used in lighting and display technologies due to their small size, low power consumption, long life, high brightness, and active illumination. Micro-LEDs, also known as micro-LEDs, mLEDs, or μLEDs, are a new type of flat-panel display technology. Micro-LED displays feature LED arrays with individual pixel elements. Compared to currently used liquid crystal displays, micro-LED displays offer better contrast, faster response times, and lower energy consumption.

[0003] Summary of the Invention

[0004] The present disclosure provides a light-emitting substrate and a display device, the specific solutions of which are as follows:

[0005] The present disclosure provides a light-emitting substrate, comprising:

[0006] Driver backplane;

[0007] A plurality of light-emitting units are arranged on one side of the driving backplane, each of the light-emitting units including at least one light-emitting chip;

[0008] The packaging structure is arranged between the driving backplane and the light-emitting unit, and the packaging structure is arranged around the light-emitting unit.

[0009] In a possible implementation, in the above-mentioned light-emitting substrate provided in an embodiment of the present disclosure, the driving backplane has a plurality of pads, the light-emitting chip includes a light-emitting body and pins, and the light-emitting body is electrically connected to the corresponding pads through the pins; wherein,

[0010] The packaging structure is arranged between the light-emitting body and the driving backplane, and the thickness of the packaging structure is equal to the distance between the bottom surface of the soldering pad on the side facing away from the light-emitting body and the light-emitting body.

[0011] In a possible implementation, in the above-mentioned light-emitting substrate provided in an embodiment of the present disclosure, the packaging structure includes a first packaging layer and a second packaging layer that are stacked, the first packaging layer and the solder pad are arranged in the same layer, and the thickness of the first packaging layer is the same as the thickness of the solder pad; the second packaging layer and the pin are arranged in the same layer, and the surface of the second packaging layer facing the driving backplane is flush with the surface of the pin facing the driving backplane.

[0012] In a possible implementation, the above-mentioned light-emitting substrate provided in the embodiment of the present disclosure further includes: a connecting layer located between the pad and the pin, and a padding layer located between the first packaging layer and the second packaging layer; the thickness of the padding layer is the same as the thickness of the connecting layer.

[0013] In a possible implementation, in the above-mentioned light-emitting substrate provided in an embodiment of the present disclosure, the material of the raising layer is the same as the material of the connecting layer.

[0014] In a possible implementation, in the above-mentioned light-emitting substrate provided in the embodiment of the present disclosure, the material of the packaging structure is an inorganic material or an organic material.

[0015] In a possible implementation, in the above-mentioned light-emitting substrate provided in an embodiment of the present disclosure, the packaging structure is provided on one side of the light-emitting body, or the packaging structure is provided on one side of the driving backplane.

[0016] In a possible implementation, in the above-mentioned light-emitting substrate provided in an embodiment of the present disclosure, the driving backplane includes a via area arranged on the outside of the light-emitting unit, and the orthographic projection of the packaging structure on the substrate of the driving backplane does not overlap with the orthographic projection of the via area on the substrate of the driving backplane.

[0017] In a possible implementation, in the above-mentioned light-emitting substrate provided in an embodiment of the present disclosure, the shape of the packaging structure is a regular closed ring.

[0018] In a possible implementation, in the above-mentioned light-emitting substrate provided in an embodiment of the present disclosure, the shape of the packaging structure is an irregular closed ring that avoids the via area.

[0019] In a possible implementation, in the above-mentioned light-emitting substrate provided in an embodiment of the present disclosure, the distance between the packaging structure and the pin is greater than or equal to 5 μm, the width of the packaging structure is greater than or equal to 10 μm, and the distance between the packaging structures on the outside of two adjacent light-emitting units is greater than or equal to 3 μm.

[0020] In a possible implementation, the light-emitting substrate provided in the embodiment of the present disclosure further includes an independent support structure disposed between the packaging structure and the light-emitting chip, and the thickness of the support structure is the same as that of the packaging structure.

[0021] In a possible implementation, in the above-mentioned light-emitting substrate provided in an embodiment of the present disclosure, there are multiple support structures, and the multiple support structures are evenly arranged between the packaging structure and the light-emitting chip.

[0022] In a possible implementation, in the above-mentioned light-emitting substrate provided in an embodiment of the present disclosure, the distance between the support structure and the pin is greater than or equal to 1.2 μm.

[0023] In a possible implementation, in the above-mentioned light-emitting substrate provided in an embodiment of the present disclosure, the material of the support structure is an organic material, and the orthographic projection shape of the support structure on the driving backplane includes a rectangle or a circle.

[0024] In a possible implementation, in the above-mentioned light-emitting substrate provided in the embodiment of the present disclosure, one packaging structure is provided on the outer side of each of the light-emitting units.

[0025] In a possible implementation, in the above-mentioned light-emitting substrate provided in an embodiment of the present disclosure, the number of the packaging structures arranged outside each light-emitting unit is greater than one, and the packaging structures outside the same light-emitting unit are arranged at intervals.

[0026] In a possible implementation, in the above-mentioned light-emitting substrate provided in an embodiment of the present disclosure, the light-emitting unit includes a first light-emitting chip, a second light-emitting chip and a third light-emitting chip of different light-emitting colors, the pins include an anode pin and a cathode pin, the anode pins of the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are independently arranged, and the cathode pins of the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are the same pin.

[0027] In a possible implementation, in the above-mentioned light-emitting substrate provided in the embodiment of the present disclosure, the light-emitting chip includes Micro LED or Mini LED.

[0028] Correspondingly, an embodiment of the present disclosure further provides a display device, comprising the above-mentioned light-emitting substrate provided by an embodiment of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] FIG1 is a schematic diagram of a planar structure of a light-emitting substrate provided in an embodiment of the present disclosure;

[0030] FIG2A is a schematic diagram of a cross-sectional structure along the CC' direction in FIG1;

[0031] FIG2B is a schematic structural diagram of the light-emitting chip in FIG2A ;

[0032] FIG2C is a schematic structural diagram of the driving backplane in FIG2A ;

[0033] FIG3A is a schematic diagram of another cross-sectional structure along the CC' direction in FIG1;

[0034] FIG3B is a schematic structural diagram of the light-emitting chip in FIG3A ;

[0035] FIG3C is a schematic structural diagram of the driving backplane in FIG3A ;

[0036] FIG3D is a schematic structural diagram of the light-emitting chip in FIG3A ;

[0037] FIG3E is a schematic structural diagram of the driving backplane in FIG3A ;

[0038] FIG4 is a schematic diagram of another cross-sectional structure of a light-emitting substrate provided in an embodiment of the present disclosure;

[0039] FIG5 is a schematic diagram of another cross-sectional structure of a light-emitting substrate provided in an embodiment of the present disclosure;

[0040] FIG6 is a schematic diagram of a planar structure corresponding to the packaging structure in FIG4 and FIG5;

[0041] FIG7 is a schematic diagram of another planar structure corresponding to the packaging structure in FIG4 and FIG5;

[0042] FIG8 is a schematic diagram of another cross-sectional structure of a light-emitting substrate provided in an embodiment of the present disclosure;

[0043] FIG9 is a schematic diagram of another cross-sectional structure of a light-emitting substrate provided in an embodiment of the present disclosure;

[0044] FIG10 is a schematic diagram of another planar structure corresponding to the outer packaging structure of the light-emitting unit;

[0045] FIG11 is a schematic diagram of another planar structure corresponding to the outer packaging structure of the light-emitting unit. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. And in the absence of conflict, the embodiments in the present disclosure and the features in the embodiments can be combined with each other. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0047] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the usual meanings understood by persons of ordinary skill in the field to which this disclosure belongs. The words “include” or “comprise” and the like used in this disclosure mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. The words “connect” or “connected” and the like are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. “Inside”, “outside”, “upper”, “lower”, etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0048] It should be noted that the sizes and shapes of the figures in the accompanying drawings do not reflect the actual scale and are only for the purpose of illustrating the present disclosure. The same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions.

[0049] Light-emitting diode (LED) chips, as a key technology in display technology, have become a trend in the display industry. Smaller LED sizes make it easier to achieve high resolutions, such as 4K or even 8K resolution smartphones or virtual reality devices.

[0050] For virtual reality devices, the response time of organic light-emitting diode (OLED) panels has been reduced to the microsecond level, with a very good response time level, making it the most ideal choice for virtual reality applications. Light-emitting diode chips can include sub-millimeter light-emitting diode (Mini Light Emitting Diode, referred to as Mini LED) chips and micro light-emitting diode (Micro Light Emitting Diode, referred to as Micro LED) chips. The response time of Micro LED can be reduced to the nanosecond level, which is 1000 times faster than OLED. In addition, Micro LED display devices have greater advantages in contrast, color gamut and flexible display.

[0051] However, during current LED packaging, a gap exists between the LED and the driver backplane after bonding, which results in liquid seeping into the gap during subsequent electroplating and etching processes, causing device failure.

[0052] To solve the above problems, the present disclosure provides a light-emitting substrate, as shown in FIG1 , FIG2A and FIG3A . FIG1 is a schematic diagram of a planar structure of the light-emitting substrate, FIG2A is a schematic diagram of a cross-sectional structure along the CC' direction in FIG1 , and FIG3A is a schematic diagram of another cross-sectional structure along the CC' direction in FIG1 . The light-emitting substrate includes:

[0053] Drive backplane 1;

[0054] A plurality of light-emitting units P are provided on one side of the driving backplane 1 , each light-emitting unit P including at least one light-emitting chip 2 . Specifically, FIG. 1 takes four light-emitting units P as an example, but of course the number of light-emitting units P can be many, and the present disclosure is not limited thereto.

[0055] The packaging structure 3 is disposed between the driving backplane 1 and the light-emitting unit P, and the packaging structure 3 is disposed around the light-emitting unit P.

[0056] The light-emitting substrate provided in the embodiments of the present disclosure utilizes an encapsulation structure surrounding the light-emitting units between the driver backplane and the light-emitting units to individually protect and encapsulate each light-emitting unit, forming a sealed structure for the light-emitting units. This effectively prevents liquid from seeping into the gap between the light-emitting chip and the driver backplane during subsequent electroplating, etching, and cleaning processes, thereby improving overall reliability and device structural stability. Furthermore, the encapsulation structure also supports the light-emitting substrate, enhancing its structural stability.

[0057] In a specific implementation, in the above-mentioned light-emitting substrate provided in the embodiment of the present disclosure, as shown in FIG2A and FIG3A , the driving backplane 1 has a plurality of pads (11 and 12), for example, the pad 11 is an anode pad, and the pad 12 is a cathode pad. The light-emitting chip 2 includes a light-emitting body 21 and pins (22 and 23), for example, the pin 22 is an anode pin, and the pin 23 is a cathode pin. The light-emitting body 21 is electrically connected to the corresponding pads (11 and 12) through the pins (22 and 23), for example, the anode pin (22) of the light-emitting body 21 is electrically connected to the anode pad (11), and the cathode pin (23) of the light-emitting body 21 is electrically connected to the cathode pad (12); wherein,

[0058] The packaging structure 3 is disposed between the light-emitting body 21 and the driver backplane 1, and the thickness of the packaging structure 3 is equal to the distance between the bottom surface of the solder pads (11 and 12) facing away from the light-emitting body 21 and the light-emitting body 21. This can achieve a better bonding effect between the driver backplane 1 and the light-emitting chip 2, improving the overall structural stability and device reliability.

[0059] In a specific implementation, in the above-mentioned light-emitting substrate provided in the embodiment of the present disclosure, as shown in Figures 2A, 2B and 2C, Figure 2B is a structural schematic diagram of the light-emitting chip 2 in Figure 2A, and Figure 2C is a structural schematic diagram of the driving backplane 1 in Figure 2A. The packaging structure 3 includes a first packaging layer 31 and a second packaging layer 32 stacked together. The first packaging layer 31 and the pads (11 and 12) are arranged on the same layer, and the thickness of the first packaging layer 31 is the same as the thickness of the pads (11 and 12). In this way, it is only necessary to change the original composition pattern when forming the pads (11 and 12), and the pattern of the first packaging layer 31 and the pads (11 and 12) can be formed through a single composition process. The second encapsulation layer 32 and the pins (22 and 23) are arranged on the same layer, and the surface of the second encapsulation layer 32 facing the driver backplane 1 is flush with the surface of the pins (22 and 23) facing the driver backplane 1. In this way, it is only necessary to change the original composition pattern when forming the pins (22 and 23). The pattern of the second encapsulation layer 32 and the pins (22 and 23) can be formed through a single composition process. There is no need to add a process for preparing the second encapsulation layer 32 separately, which can simplify the preparation process, save production costs, and improve production efficiency.

[0060] In a specific implementation, in the above-mentioned light-emitting substrate provided in the embodiment of the present disclosure, as shown in Figure 2A, it also includes a connecting layer (not shown) located between the pads (11 and 12) and the pins (22 and 23). The light-emitting chip 2 is generally transferred to the driving backplane 1 through a mass transfer process. The pins (22 and 23) of the light-emitting chip 2 are generally bonded to the pads (11 and 12) of the driving backplane 1 through solder paste (including Sn, In, etc.), and then a reflow process is performed to bond the light-emitting chip 2 to the driving backplane 1, that is, the material of the above-mentioned connecting layer can be solder paste; the light-emitting substrate also includes a padding layer (not shown) located between the first packaging layer 31 and the second packaging layer 32. In order to ensure the effective packaging of the packaging structure 3 and the effective bonding of the light-emitting chip 2 and the driving backplane 1, the thickness of the padding layer is the same as the thickness of the connecting layer.

[0061] Preferably, the material of the padding layer is the same as that of the connecting layer. In this way, the padding layer and the connecting layer can be formed through a one-time process without adding a separate process for preparing the padding layer, which can simplify the preparation process, save production costs, and improve production efficiency.

[0062] It should be noted that the bonding process between the light-emitting chip and the driving backplane is the same as that in the prior art, and this disclosure will not provide a detailed description of this.

[0063] In a specific implementation, when bonding the light-emitting chip 2 and the driving backplane 1, the connection layer (solder paste) can be set on the pins (22 and 23) of the light-emitting chip 2, or the connection layer (solder paste) can be set on the pads (11 and 12) of the driving backplane 1, and then the electrical connection between the light-emitting chip 2 and the driving backplane 1 is achieved through a reflow soldering process.

[0064] In a specific implementation, in the above-mentioned light-emitting substrate provided in the embodiment of the present disclosure, as shown in FIG3A , the material type of the packaging structure 3 is not limited to being made of the original metal film layer of the light-emitting chip 2 and the driver backplane 1 shown in FIG2A . The material of the packaging structure 3 can also be any other material that can achieve the packaging performance and can ensure that its thickness is the same as the distance between the bottom surface of the solder pads (11 and 12) on the side facing away from the light-emitting body 21 and the light-emitting body 21. For example, the material of the packaging structure 3 can be an inorganic material or an organic material. Optionally, the inorganic material can be silicon nitride, silicon oxide, silicon oxynitride, etc., and the organic material can be a resin material, etc.

[0065] In a specific implementation, in the above-mentioned light-emitting substrate provided in the embodiment of the present disclosure, as shown in Figures 3B and 3C, Figure 3B is a structural schematic diagram of the light-emitting chip 2 in Figure 3A, and Figure 3C is a structural schematic diagram of the driving backplane 1 in Figure 3A. The packaging structure 3 can be set on one side of the light-emitting body 21, that is, the packaging structure 3 can be made of inorganic material or organic material on one side of the light-emitting body 21. The thickness of the packaging structure 3 is equal to the distance between the bottom surface of the soldering pad (11 and 12) on the side facing away from the light-emitting body 21 after bonding the light-emitting chip 2 and the driving backplane 1.

[0066] In a specific implementation, in the above-mentioned light-emitting substrate provided in the embodiment of the present disclosure, as shown in Figures 3D and 3E, Figure 3D is a structural schematic diagram of the light-emitting chip 2 in Figure 3A, and Figure 3E is a structural schematic diagram of the driving backplane 1 in Figure 3A. The packaging structure 3 can be set on one side of the driving backplane 1, that is, after the driving backplane 1 is manufactured, the packaging structure 3 can be made of inorganic material or organic material on one side of the driving backplane 1. The thickness of the packaging structure 3 is equal to the distance between the bottom surface of the soldering pad (11 and 12) on the side facing away from the light-emitting body 21 after the light-emitting chip 2 and the driving backplane 1 are bonded.

[0067] In a specific implementation, in the above-mentioned light-emitting substrate provided in the embodiment of the present disclosure, as shown in FIG1 , the light-emitting unit P may include a first light-emitting chip (e.g., a red light-emitting chip R), a second light-emitting chip (e.g., a green light-emitting chip G), and a third light-emitting chip (e.g., a blue light-emitting chip B) of different luminous colors, the pins (22 and 23) including an anode pin 22 and a cathode pin 23, the anode pins 22 (i.e., N electrodes) of the first light-emitting chip (R), the second light-emitting chip (G), and the third light-emitting chip (B) are independently provided, and the cathode pins 22 (i.e., P electrodes) of the first light-emitting chip (R), the second light-emitting chip (G), and the third light-emitting chip (B) are the same pin. The light-emitting unit P in the embodiment of the present disclosure includes light-emitting chips 2 of three colors: red, green, and blue. That is, the light-emitting chips 2 of the three colors are provided as a group, and each group is surrounded by an encapsulation structure 3. Of course, each light-emitting core 2 may also be surrounded by an encapsulation structure 3, or two, three, or more light-emitting units P may be surrounded by an encapsulation structure 3. The present disclosure does not limit this.

[0068] In a specific implementation, in the above-mentioned light-emitting substrate provided in the embodiment of the present disclosure, as shown in FIG2A and FIG3A, the driving backplane 1 can be a silicon-based driving backplane, and the driving backplane 1 can include: a substrate 13, a barrier layer 14, a buffer layer 15, an active layer 16, a first gate insulating layer 17, a first gate layer 18, a second gate insulating layer 19, a second gate layer 20, an interlayer insulating layer 24, a first source-drain metal layer 25, a flat layer 26 and a second source-drain metal layer (11 and 12) stacked in sequence between the substrate 13 and the light-emitting chip 2, wherein the first gate layer 18 includes a gate G and a lead 181, and the first source-drain metal layer 25 includes a source electrode S, a drain electrode D, a data line 251, a ground electrode 252, an active layer 16, a gate G, a source S, and a drain D constitute a thin film transistor, the anode pad (11) is electrically connected to the source S through a first via hole V1 penetrating the flat layer 26, the cathode pad (12) is electrically connected to the ground electrode 252 through a second via hole V2 penetrating the flat layer 26, the data line 251 is electrically connected to the lead 181 through a third via hole V3 penetrating the interlayer insulating layer 24 and the second gate insulating layer 19, the lead 181 is electrically connected to the transfer electrode 27 through a fourth via hole V4 penetrating the first gate insulating layer 17, the buffer layer 15, the barrier layer 14 and the substrate 13, and the transfer electrode 27 is used to input an external electrical signal to the data line 251.

[0069] In a specific implementation, in the above-mentioned light-emitting substrate provided in the embodiment of the present disclosure, as shown in Figures 2A and 3A, the light-emitting body 21 may include an N-type semiconductor layer, a quantum well layer and a P-type semiconductor layer. The N-type semiconductor layer is electrically connected to the anode pin 22, and the P-type semiconductor layer is electrically connected to the cathode pin 23. When the light-emitting chip 2 emits light, a driving current is input to the light-emitting chip 2 through the thin film transistor. The specific light-emitting principle is the same as that in the prior art and will not be described in detail here.

[0070] In a specific implementation, in the above-mentioned light-emitting substrate provided in the embodiment of the present disclosure, as shown in Figures 4 and 5, the driving backplane 1 includes a via area V (for example, V1, V2, V3, and V4) arranged on the outside of the light-emitting unit P. There will be a certain step difference between the via area V and other non-via areas. In order to avoid the existence of gaps during subsequent sealing due to the step difference, which makes the packaging structure 3 unable to seal the light-emitting unit P, the embodiment of the present disclosure sets the orthographic projection of the packaging structure 3 on the substrate 13 of the driving backplane 1 to not overlap with the orthographic projection of the via area V on the substrate 13 of the driving backplane 1. In this way, the packaging structure 3 can avoid the step difference position of the driving backplane 1 to improve the sealing of the packaging structure 3.

[0071] In a specific implementation, in the above-mentioned light-emitting substrate provided in an embodiment of the present disclosure, as shown in FIG6 , FIG6 is a schematic planar structure diagram corresponding to the packaging structure 3 in FIG4 and FIG5 , and the packaging structure 3 is in the shape of a regular closed ring. That is, the packaging structure 3 can be arranged to surround the via region V to avoid overlap between the orthographic projection of the packaging structure 3 and the via region V.

[0072] Optionally, as shown in FIG. 1 and FIG. 6 , the annular shape of the packaging structure 3 is a square, and of course it can also be a circle or other annular shape.

[0073] In a specific implementation, in the above-mentioned light-emitting substrate provided in the embodiment of the present disclosure, as shown in FIG7, FIG7 is another schematic planar structure diagram corresponding to the packaging structure 3 in FIG4 and FIG5. The shape of the packaging structure 3 can also be an irregular closed ring that avoids the via area V. In this way, the packaging structure 3 only needs to avoid the via area V in the via area V, without having to expand the area surrounded by the packaging structure 3 as shown in FIG6, which can improve the resolution of the light-emitting substrate. Specifically, the shape of the packaging structure 3 in the via area V is an arc-shaped example, but it is of course not limited to this, as long as it can avoid the via area V.

[0074] Specifically, the width of the packaging structure 3 is not specifically limited and can be determined according to actual layout capabilities and space. The packaging structure 3 surrounds the entire pixel unit group and can be a closed ring such as a circle or a square.

[0075] In a specific implementation, in the above-mentioned light-emitting substrate provided in the embodiment of the present disclosure, as shown in Figures 1, 2A, 3A, 4 and 5, the distance D1 between the packaging structure 3 and the pins (22 and 23) is greater than or equal to 5 μm, the width W of the packaging structure 3 is greater than or equal to 10 μm, and the distance D2 between the packaging structures 3 on the outsides of two adjacent light-emitting units P is greater than or equal to 3 μm.

[0076] In specific implementations, the above-mentioned light-emitting substrate provided in the embodiments of the present disclosure is shown in Figures 8, 9, and 10. Figures 8 and 9 are schematic diagrams of two other cross-sectional structures of the light-emitting substrate, and Figure 10 is a schematic diagram of another planar structure corresponding to the packaging structure 3 in Figures 8 and 9. The light-emitting substrate further includes an independent support structure 4 disposed between the packaging structure 3 and the light-emitting chip 2. The thickness of the support structure 4 is the same as that of the packaging structure 3. This can improve the support performance of the light-emitting substrate, thereby further enhancing the overall reliability and stability of the device structure.

[0077] In a specific implementation, in the above-mentioned light-emitting substrate provided in the embodiment of the present disclosure, as shown in FIG10 , the number of support structures 4 can be multiple, and the multiple support structures 4 are evenly arranged between the packaging structure 3 and the light-emitting chip 2. In this way, the support performance of the light-emitting substrate in each area is roughly the same, thereby improving the overall stability of the device structure.

[0078] In specific implementation, in order to meet the alignment accuracy design between the driving backplane and the light-emitting chip, in the above-mentioned light-emitting substrate provided in the embodiment of the present disclosure, as shown in Figure 10, the distance D3 between the support structure 4 and the pins (22 and 23) is greater than or equal to 1.2μm.

[0079] In a specific implementation, in the above-mentioned light-emitting substrate provided in the embodiment of the present disclosure, as shown in FIG10 , the material of the support structure 4 can be an organic material, such as a resin material; and the orthographic projection shape of the support structure 4 on the driving backplane 1 is a circle. Of course, the orthographic projection shape of the support structure 4 on the driving backplane 1 can also be other shapes such as a rectangle or a triangle.

[0080] In a specific implementation, as shown in FIG8 and FIG9 , before the driving backplane 1 and the light emitting chip 2 are bonded, the support structure 4 can be provided on one side of the driving backplane 1 or on one side of the light emitting chip 2 .

[0081] In a specific implementation, in the above-mentioned light-emitting substrate provided in the embodiments of the present disclosure, as shown in Figures 1, 6, 7, and 10, an encapsulation structure 3 is provided on the outside of each light-emitting unit P. To improve the encapsulation performance of the light-emitting unit P and the supporting performance of the light-emitting substrate, the number of encapsulation structures 3 provided on the outside of each light-emitting unit P can be greater than one. As shown in Figure 11, the number of encapsulation structures 3 provided on the outside of each light-emitting unit P is two, and the encapsulation structures on the outside of the same light-emitting unit P are arranged at intervals.

[0082] In summary, the above-mentioned light-emitting substrate provided in the embodiment of the present disclosure can realize the separate protection and packaging of the light-emitting unit, avoid the liquid from penetrating into the device during the subsequent electroplating and etching processes, and improve the overall reliability and device structural stability; and the structure of the light-emitting substrate provided by the present disclosure is simple and can be realized through existing processes; in addition, the packaging structure of the present disclosure can be manufactured using the inherent structure of the light-emitting chip and the driving backplane, reducing the separate edge sealing process and reducing costs; and the use of the packaging structure can improve the overall structural stability and device reliability.

[0083] In a specific implementation, in the above-mentioned light-emitting substrate provided in the embodiment of the present disclosure, the light-emitting chip can be a Micro LED. Due to the smaller size of the Micro LED, the pixel resolution of the light-emitting substrate can be improved. Specifically, the size of the Micro LED is generally less than 100μm. Of course, the light-emitting chip can also be other LEDs such as Mini LED, and this disclosure does not limit this. Specifically, when the light-emitting chip is a Mini LED, the size of the Mini LED is 100μm to 200μm.

[0084] Specifically, the light-emitting substrate provided in the embodiment of the present disclosure is used as a display substrate as an example, but it can also be a backlight substrate. If the light-emitting substrate is a backlight substrate, the light-emitting chip is used to provide a light source to cooperate with a passive display panel to realize display.

[0085] The luminescent colors of the luminescent substrate are not limited here and can include any of red, green, or blue. The luminescent substrate can include all three colors simultaneously; of course, it can also include only one color, for example, only red, only green, or only blue. The specific color can be determined based on actual requirements.

[0086] In specific implementation, the above-mentioned light-emitting substrate provided in the embodiment of the present disclosure may further include other functional film layers well known to those skilled in the art, which are not listed here one by one.

[0087] Based on the same inventive concept, embodiments of the present disclosure further provide a display device comprising any of the aforementioned light-emitting substrates provided in the embodiments of the present disclosure. The display device can be any product or component with a display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigation system. The implementation of the display device can be referenced to the aforementioned light-emitting substrate embodiments, and any repetitive details will not be repeated here.

[0088] The disclosed embodiments provide a light-emitting substrate and display device. By providing an encapsulation structure surrounding the light-emitting units between a driver backplane and the light-emitting units, each light-emitting unit can be individually protected and encapsulated, forming a sealed structure for the light-emitting units. This effectively prevents liquid from seeping into the gap between the light-emitting chip and the driver backplane during subsequent electroplating, etching, and cleaning processes, thereby improving overall reliability and device structural stability. Furthermore, the encapsulation structure also supports the light-emitting substrate, enhancing its structural stability.

[0089] Although the preferred embodiments of the present disclosure have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concepts. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present disclosure.

[0090] Obviously, those skilled in the art may make various changes and modifications to the embodiments of the present disclosure without departing from the spirit and scope of the embodiments of the present disclosure. Thus, if such changes and modifications of the embodiments of the present disclosure fall within the scope of the claims of the present disclosure and their equivalents, the present disclosure is intended to include such changes and modifications.

Claims

1. A light-emitting substrate, wherein: include: Driver backplane; A plurality of light-emitting units are arranged on one side of the driving backplane, each of the light-emitting units comprising at least one light-emitting chip; The packaging structure is arranged between the driving backplane and the light-emitting unit, and the packaging structure is arranged around the light-emitting unit.

2. The light-emitting substrate according to claim 1, wherein: The driving backplane has a plurality of pads, the light-emitting chip includes a light-emitting body and pins, and the light-emitting body is electrically connected to the corresponding pads through the pins; wherein, The packaging structure is arranged between the light-emitting body and the driving backplane, and the thickness of the packaging structure is equal to the distance between the bottom surface of the pad facing away from the light-emitting body and the light-emitting body.

3. The light-emitting substrate according to claim 2, wherein: The packaging structure includes a first packaging layer and a second packaging layer which are stacked, wherein the first packaging layer and the pad are arranged on the same layer, and the thickness of the first packaging layer is the same as the thickness of the pad; the second packaging layer and the pin are arranged on the same layer, and the surface of the second packaging layer facing the driving backplane is flush with the surface of the pin facing the driving backplane.

4. The light-emitting substrate according to claim 3, wherein: Also includes: a connection layer located between the pad and the pin, and a pad layer located between the first packaging layer and the second packaging layer; The thickness of the padding layer is the same as the thickness of the connecting layer.

5. The light-emitting substrate according to claim 4, wherein: The material of the padding layer is the same as that of the connecting layer.

6. The light-emitting substrate according to claim 2, wherein: The material of the packaging structure is inorganic material or organic material.

7. The light-emitting substrate according to claim 6, wherein: The packaging structure is arranged on one side of the light-emitting body, or the packaging structure is arranged on one side of the driving backplane.

8. The light-emitting substrate according to any one of claims 1 to 7, wherein: The driving backplane includes a via region disposed outside the light emitting unit, and an orthographic projection of the packaging structure on the substrate of the driving backplane does not overlap with an orthographic projection of the via region on the substrate of the driving backplane.

9. The light-emitting substrate according to claim 8, wherein: The packaging structure is in the shape of a regular closed ring.

10. The light emitting substrate according to claim 8, wherein: The packaging structure is in the shape of an irregular closed ring avoiding the via area.

11. The light-emitting substrate according to any one of claims 2 to 7, wherein: The distance between the packaging structure and the pin is greater than or equal to 5 μm, the width of the packaging structure is greater than or equal to 10 μm, and the distance between the packaging structures outside two adjacent light-emitting units is greater than or equal to 3 μm.

12. The light-emitting substrate according to any one of claims 2 to 7, wherein: It also includes an independent supporting structure that is disposed between the packaging structure and the light-emitting chip, and the thickness of the supporting structure is the same as that of the packaging structure.

13. The light emitting substrate according to claim 12, wherein: There are multiple supporting structures, and the multiple supporting structures are evenly arranged between the packaging structure and the light-emitting chip.

14. The light emitting substrate according to claim 13, wherein: The distance between the support structure and the pin is greater than or equal to 1.2 μm.

15. The light emitting substrate according to claim 14, wherein: The support structure is made of organic material, and the orthographic projection shape of the support structure on the driving backplane includes a rectangle or a circle.

16. The light-emitting substrate according to any one of claims 1 to 15, wherein: One packaging structure is arranged on the outer side of each light emitting unit.

17. The light-emitting substrate according to any one of claims 1 to 15, wherein: The number of the packaging structures arranged outside each light-emitting unit is greater than one, and the packaging structures outside the same light-emitting unit are arranged at intervals.

18. The light-emitting substrate according to any one of claims 1 to 17, wherein: The light-emitting unit includes a first light-emitting chip, a second light-emitting chip and a third light-emitting chip with different light-emitting colors, the pins include an anode pin and a cathode pin, the anode pins of the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are independently arranged, and the cathode pins of the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are the same pin.

19. The light-emitting substrate according to any one of claims 1 to 18, wherein: The light-emitting chip includes Micro LED or Mini LED.

20. A display device, wherein: It comprises the light-emitting substrate as described in any one of claims 1-19.

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