Display panel, preparation method and display device

Abstract

The invention discloses a display panel, a preparation method and a display device. The display panel comprises a back plate, a plurality of light-emitting devices arranged on a first main surface, a plurality of first connecting parts arranged on the first main surface, a circuit board and a plurality of connecting wires. The back plate is provided with a first main surface and a second main surface which are opposite to each other, and at least one selected side surface positioned between the first main surface and the second main surface; the selected side surface is connected with and perpendicular to the first main surface. The first connecting parts are arranged side by side in the first direction and close to the selected side surface. The first direction is parallel to the selected side surface and the first major surface. The circuit board is located on one side of the second main surface away from the first main surface. The plurality of connecting wires are arranged at intervals along a first direction; wherein the plurality of connecting wires are connected between the plurality of first connecting parts and the circuit board, and the plurality of connecting wires are attached to the selected side surface in an attaching mode.

Description

Display panel, manufacturing method, and display device Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] The display panel may include a light-emitting device; wherein, when the light-emitting device is, for example, a submillimeter light-emitting diode (Mini Light Emitting Diode, referred to as Mini LED) or a micro light-emitting diode (Micro Light-Emitting Diode, referred to as Micro LED), the border of the display panel is narrow, which is conducive to the development of the display panel towards a narrow border.

[0003] Summary of the Invention

[0004] On the one hand, a display panel is provided, which includes a backplane, a plurality of light-emitting devices, a plurality of first connecting parts, a circuit board, and a plurality of connecting traces. The backplane has a first main surface and a second main surface relative to each other, and at least one selected side surface located between the first main surface and the second main surface. The selected side surface is connected to and perpendicular to the first main surface. A plurality of first connecting parts are arranged side by side along a first direction and close to the selected side surface; the first direction is parallel to the selected side surface and the first main surface. The circuit board is located on a side of the second main surface away from the first main surface. A plurality of connecting traces are arranged along the first direction and spaced apart. Among them, a plurality of connecting traces are connected between the plurality of first connecting parts and the circuit board, and a plurality of connecting traces are attached to the selected side surface by attaching.

[0005] The selected side surface is connected to the first main surface and is perpendicular to the first main surface, thereby narrowing the bezel of the display panel and promoting the development of display panels with narrow bezels. In addition, multiple connection traces are attached to the selected side surface by attaching. In this way, the multiple connection traces are attached to the selected side surface using glue or the like, thereby increasing the reliability of the multiple connection traces.

[0006] In some embodiments, the back plate further has a first transition surface connected between the selected side surface and the second main surface; a section of the first transition surface forms an obtuse angle with the selected side surface and an obtuse angle with the second main surface.

[0007] In some embodiments, the connecting trace includes a main body and a second connecting portion; the main body is attached to the selected side surface; the second connecting portion is arranged in a portion of the main body located on the side of the first main surface away from the second main surface, and the second connecting portion is connected to the first connecting portion.

[0008] In some embodiments, the second connection portion is connected to the first connection portion by eutectic bonding.

[0009] In some embodiments, the main body portion is further attached to the second major surface.

[0010] In some embodiments, the thickness ratio between any two positions of the main body is in the range of 0.9 to 1.1.

[0011] In some embodiments, the connecting trace further includes a third connecting portion, and the third connecting portion is disposed in a portion of the main body portion located on a side of the second main surface away from the first main surface.

[0012] In some embodiments, the third connection portion is connected to the circuit board.

[0013] In some embodiments, the display panel further includes: a plurality of fan-out lines disposed on the second main surface; wherein the plurality of fan-out lines are connected between the plurality of third connection portions and the circuit board.

[0014] In some embodiments, the display panel further includes a first insulating layer and a second insulating layer stacked together, the main body is located between the first insulating layer and the second insulating layer; the first insulating layer has a first opening exposing the main body, and the second connecting portion is connected to the main body through the first opening.

[0015] In some embodiments, the first insulating layer or the second insulating layer has a second opening exposing the main body portion, and the third connecting portion is connected to the main body portion through the second opening.

[0016] On the other hand, a method for preparing a display panel is provided, the method comprising: providing a backplane, the backplane having a first main surface and a second main surface opposite to each other, and at least one selected side surface located between the first main surface and the second main surface; the selected side surface is connected to and perpendicular to the first main surface. A plurality of first connecting portions are formed on the first main surface; the plurality of first connecting portions are arranged side by side along a first direction and close to the selected side surface; the first direction is parallel to the selected side surface and the first main surface. A plurality of light-emitting devices are formed on the first main surface. A circuit board is provided on a side of the second main surface away from the first main surface. A plurality of connecting traces are attached to the selected side surface; the plurality of connecting traces are arranged along the first direction and spaced apart; wherein the plurality of connecting traces are connected between the plurality of first connecting portions and the circuit board.

[0017] In some embodiments, before attaching the plurality of connecting traces to the selected side surface, the method includes: forming a plurality of main portions on the first substrate; forming a plurality of second connecting portions, the plurality of second connecting portions being connected to the plurality of main portions; and attaching the plurality of connecting traces to the selected side surface, including attaching the plurality of main portions away from the first substrate to the selected side surface, the plurality of first connecting portions being connected to the plurality of second connecting portions. The method then includes removing the first substrate.

[0018] In some embodiments, before forming the plurality of main portions on the first substrate, the method includes forming a second insulating layer on the first substrate. After forming the plurality of main portions on the first substrate and before forming the second connecting portions, the method includes forming a first insulating layer on a side of the plurality of main portions away from the second insulating layer. A plurality of first openings are formed in the first insulating layer to expose the plurality of main portions. The step of forming the second connecting portions includes forming a plurality of second connecting portions in the plurality of first openings.

[0019] In some embodiments, before forming the second insulating layer on the first substrate, the method further includes forming a plurality of third connecting portions on the first substrate. After forming the second insulating layer on the first substrate, the method further includes forming the first insulating layer on a side of the plurality of main portions facing away from the second insulating layer, and before forming the first insulating layer on the side of the plurality of main portions facing away from the second insulating layer, the method further includes forming a plurality of second openings in the second insulating layer that expose the plurality of third connecting portions. The method further includes forming the plurality of main portions in the plurality of second openings, wherein the plurality of main portions are connected to the plurality of third connecting portions.

[0020] In some embodiments, after forming the plurality of main portions on the first substrate and before forming the second connecting portions, the method includes forming a plurality of second openings in the first insulating layer to expose the plurality of main portions. The method also includes forming third connecting portions in the plurality of second openings, wherein the plurality of main portions are connected to the plurality of third connecting portions.

[0021] In some embodiments, before the step of disposing the circuit board on the side of the second main surface remote from the first main surface, the step includes: forming a plurality of fan-out lines on the second main surface; the plurality of fan-out lines are connected to the plurality of third connection portions. The step of disposing the circuit board on the side of the second main surface remote from the first main surface includes: bonding the circuit board at ends of the plurality of fan-out lines remote from the plurality of third connection portions.

[0022] In some embodiments, before the step of forming the plurality of main body portions on the first substrate, the method further includes forming a peelable layer on the first substrate. The step of removing the first substrate further includes peeling off the peelable layer.

[0023] In yet another aspect, a display device is provided, comprising the above-mentioned display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0025] FIG1 is a structural diagram of a display device according to some embodiments;

[0026] FIG2 is a top view of a display panel according to some embodiments;

[0027] FIG3 is a bottom view of a display panel according to some embodiments;

[0028] FIG4 is a front view of a display device according to some embodiments;

[0029] FIG5 is a front view of a display panel in the related art according to some embodiments;

[0030] 6 to 8 are structural diagrams of the first connecting portion according to some embodiments;

[0031] 9 and 10 are structural diagrams of a second connecting portion according to some embodiments;

[0032] FIG11 is a block diagram of connection traces according to some embodiments;

[0033] FIG12 is a front view of another display panel according to some embodiments;

[0034] FIG13 is a structural diagram of another connection line according to some embodiments;

[0035] FIG14 is a bottom view of another display panel according to some embodiments;

[0036] FIG15 is a front view of another display panel according to some embodiments;

[0037] FIG16 is a flow chart of a method for manufacturing a display panel according to some embodiments;

[0038] 17 to 22 are diagrams showing a process for preparing connection traces according to some embodiments;

[0039] 23 to 26 are diagrams illustrating a manufacturing process of a display panel according to some embodiments;

[0040] 27 to 30 are diagrams illustrating another process for preparing connecting traces according to some embodiments;

[0041] 31 to 34 are diagrams showing another process for manufacturing a display panel according to some embodiments;

[0042] 35 to 41 are diagrams showing another process for preparing connecting wires according to some embodiments;

[0043] 42 and 43 are diagrams illustrating a manufacturing process of another display panel according to some embodiments. DETAILED DESCRIPTION

[0044] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0045] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that a particular feature, structure, material or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0046] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0047] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0048] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0049] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0050] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0051] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one.

[0052] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0053] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0054] Some embodiments of the present disclosure provide a display device. Referring to FIG1 , the display device XZ is a product having an image (including a static image or a dynamic image, wherein the dynamic image may be a video) display function. The display device XZ may be, for example: a virtual reality (VR) display device or an augmented reality (AR) display device. The display device XZ may also be, for example: a display, a mobile phone (Mobile Phone), a tablet computer (Pad), a laptop computer, a television, a personal digital assistant (PDA), an ultra-mobile personal computer (UMPC), a netbook, a wearable device (such as a smart watch) or a vehicle-mounted display device, etc. This embodiment does not limit the type of the display device XZ.

[0055] The display device XZ includes a display panel 1, and may also include a controller, a frame KT (such as a middle frame, etc.). The frame KT is configured to fix the display panel 1, the controller, etc. The controller is configured to send image data (such as grayscale data) to the display panel 1, for example, it may be a central processing unit (CPU) or a graphics processing unit (GPU), etc. The display panel 1 is configured to receive a data signal (such as a voltage signal) corresponding to the image data, and display an image (i.e., a picture) based on the data signal. The display panel 1 may have a display area AA and a non-display area SA. The display area AA of the display panel 1 is an area on the display panel 1 that can display an image. The area other than the display area AA on the display panel 1 is the non-display area SA. The non-display area SA may be located on at least one side (such as one, or multiple sides) of the display area AA, for example, the display area AA is arranged around the display area AA.

[0056] 2 to 4 , the display panel 1 includes a plurality of sub-pixels 11 located in the display area AA. The plurality of sub-pixels 11 include a first sub-pixel for emitting a first color of light, a second sub-pixel for emitting a second color of light, and a third sub-pixel for emitting a third color of light. The first, second, and third colors are three primary colors (e.g., red, green, and blue). For example, the display panel 1 may include a red sub-pixel, a green sub-pixel, and a blue sub-pixel.

[0057] The display panel 1 also includes a plurality of signal lines, such as a plurality of gate lines and a plurality of data lines. Each sub-pixel 11 can be coupled to a gate line and a data line, and is configured to write a data signal transmitted by the data line in response to a scan signal transmitted by the gate line; and based on the data signal, emit light with a corresponding intensity. Among them, a plurality of gate lines can extend along a first direction X; one (for example, each) gate line can be coupled to the sub-pixels 11 in the same row, and is configured to transmit a scan signal to the sub-pixels 11 in the row. A plurality of data lines can extend along a third direction Y; one (for example, each) data line can be coupled to the sub-pixels 11 in the same column, and is configured to provide a data signal to the sub-pixels 11 in the column.

[0058] The display panel 1 includes a backplane 10. The backplane 10 has a first major surface 1a and a second major surface 1b that are opposed to each other, and at least one (e.g., one, two, four, etc.) selected side surface 1cc located between the first major surface 1a and the second major surface 1b. For example, the display panel 1 has a display side and a non-display side that are opposed to each other, where the display side is the side of the display panel 1 that can display an image; the first major surface 1a can be a surface of the backplane 10 corresponding to the display side, and the second major surface 1b can be a surface of the backplane 10 corresponding to the non-display side. The first major surface 1a and the second major surface 1b can be rectangular in shape.

[0059] Exemplarily, the backplane 10 further includes a plurality of first side surfaces 1c located between the first main surface 1a and the second main surface 1b, and at least one of the plurality of first side surfaces 1c may be a selected side surface 1cc. In some examples, there are four first side surfaces 1c, and at least one of the four first side surfaces 1c may be a selected side surface 1cc. For example, one of the four first side surfaces 1c may be a selected side surface 1cc, or two of the four first side surfaces 1c may be selected side surfaces 1cc, or four of the four first side surfaces 1c may be selected side surfaces 1cc. In some examples, the plurality of first side surfaces 1c are connected to and perpendicular to the first main surface 1a.

[0060] For example, the backplane 10 may include a stacked substrate 13 and a drive circuit layer 12. In this case, the first main surface 1a may be a surface of the substrate 13 that is close to the drive circuit layer 12, and the second main surface 1b may be a surface of the substrate 13 that is away from the drive circuit layer 12. The drive circuit layer 12 may include, for example, a thin film transistor (TFT) or a micro drive chip, and a plurality of signal lines (such as the gate lines and data lines described above). The material of the substrate 13 may be, for example, glass, quartz, plastic, or the like.

[0061] The display panel 1 further includes a plurality of light-emitting devices 20 disposed on the first major surface 1a. For example, the plurality of light-emitting devices 20 may be disposed on the driving circuit layer 12; the plurality of light-emitting devices 20 may be located within the display area AA of the display panel 1. The driving circuit layer 12 is coupled to the plurality of light-emitting devices 20 and is configured to drive the plurality of light-emitting devices 20 to emit light.

[0062] Among them, the light-emitting device 20 may include an organic light-emitting diode (OLED), a quantum dot light-emitting diode (QLED), a mini light-emitting diode (Mini LED), a micro light-emitting diode (Micro LED), etc.

[0063] The display panel 1 further includes a circuit board 40 , a plurality of first connection portions 31 and a plurality of connection traces 50 .

[0064] The plurality of first connection portions 31 are arranged side by side along the first direction X. For example, when the number of selected side surfaces 1cc is one or two, the first direction X is parallel to the selected side surface 1cc and the first major surface 1a. For another example, when the number of selected side surfaces 1cc is four, the first direction can be understood as a ring. In some examples, the plurality of first connection portions 31 are arranged at intervals along the first direction X.

[0065] Multiple first connection portions 31 are located near the selected side surface 1cc. Exemplarily, each first connection portion 31 has a second side surface that is coplanar with the selected side surface 1cc; the second side surface is the side surface of the first connection portion 31 closest to the selected side surface 1cc. Multiple connection traces 50 are arranged along the first direction X and spaced apart. In some examples, the spacing between adjacent connection traces 50 along the first direction X is equal to the spacing between adjacent first connection portions 31.

[0066] The circuit board 40 is located on the side of the second main surface 1b away from the first main surface 1a. Multiple first connecting portions 31 are provided on the first main surface 1a; for example, the multiple first connecting portions 31 can be located within the non-display area SA of the display panel 1. For example, the multiple first connecting portions 31 can be provided on the driving circuit layer 12. In this way, a circuit structure is fabricated on the first main surface 1a using an array process. The circuit structure, for example, includes the multiple first connecting portions 31. The circuit structure can also include multiple signal lines (e.g., gate lines, data lines, etc.). Multiple connecting traces 50 are connected between the multiple first connecting portions 31 and the circuit board 40. In some examples, the multiple first connecting portions 31 are connected to multiple light-emitting devices 20; for example, the multiple first connecting portions 31 are connected to the multiple light-emitting devices 20 via multiple signal lines (e.g., data lines). The circuit board 40 is configured to generate corresponding electrical signals (e.g., data signals) based on the image data output by the controller. The electrical signals (e.g., data signals) can control the light intensity of the light-emitting devices 20. The circuit board 40 may be, for example, a flexible circuit board 40 or the like.

[0067] In the related art, referring to FIG5 , in order to realize the narrow frame of the display panel 1A, the first connecting portion 31 is located on the first main surface 1a, the circuit board 40 is located on the second main surface 1b, and a plurality of connecting traces 50 connect the plurality of first connecting portions 31 and the circuit board 40. The processes for making the connecting traces 50 mainly include a plating process and the like. The plating process requires first making a metal coating by a film-forming method such as sputtering, and then dividing the metal coating into a plurality of connecting traces 50 by an etching process (such as a laser). Among them, the connecting trace 50 extends from the first main surface 1a through the selected side surface 1cc to the second main surface 1b; one end of the connecting trace 50 is connected to the first connecting portion 31, and the other end of the connecting trace 50 is bound to the circuit board 40. However, to prevent the connection trace 50 from breaking at the corner formed by the selected side surface 1cc and the first main surface 1a (which may be referred to as the first corner, and the angle of the first corner is less than or equal to 90°), a second transition surface 1e is used to connect the first main surface 1a and the selected side surface 1cc, so that an obtuse angle is formed between the second transition surface 1e, the first main surface 1a, and the selected side surface 1cc. This can prevent the connection trace 50 from breaking. The provision of the second transition surface 1e widens the border of the display panel 1, for example, by a dimension D.

[0068] Continuing to refer to Figures 2 to 4, the selected side surface 1cc is connected to the first main surface 1a, that is, the selected side surface 1cc is in contact with the first main surface 1a; and the selected side surface 1cc is perpendicular to the first main surface 1a, that is, the angle of the first corner formed by the selected side surface 1cc and the first main surface 1a is 90°. Compared with the display panel 1A in the related art, the display panel 1 of this embodiment removes the second transition surface 1e in the related art, thereby narrowing the frame of the display panel 1, which is conducive to the development of the display panel 1 towards a narrow frame. In addition, the plurality of connecting traces 50 are attached to the selected side surface 1cc by attaching, that is, the plurality of connecting traces 50 are attached to the selected side surface 1cc using glue or the like; thereby increasing the reliability of the plurality of connecting traces 50. In addition, compared with the related art in which a plating process is used to form the connecting trace 50 on the side surface 1cc of the display device 1A, this embodiment attaches the prepared connecting trace 50 to the selected side surface 1cc, thereby also solving the problem of low yield of the connecting trace caused by processing in the related art.

[0069] In this embodiment, when multiple display panels 1 are spliced ​​together, the borders of the display panels 1 are narrowed, and thus, after the adjacent display panels 1 (or display devices) are spliced ​​together, the gap between adjacent display panels 1 (or display devices) is also reduced. For example, when multiple display panels 1 are spliced ​​together, the distance between adjacent display panels 1 in this embodiment is smaller than the distance between adjacent display panels 1A in the related art; that is, the distance between adjacent display panels 1 in this embodiment is reduced by two times D compared to the distance between adjacent display panels 1A in the related art.

[0070] In some embodiments, the connecting trace 50 includes a main portion 52 and a second connecting portion 51. The second connecting portion 51 is disposed in the main portion 52 on the side of the first major surface 1a facing away from the second major surface 1b. Thus, the second connecting portion 51 is connected to the first connecting portion 31. The main portion 52 is attached to the selected side surface 1cc, rather than to the first major surface 1a. This prevents the main portion 52 from bending at the first corner, thereby preventing the multiple connecting traces 50 from breaking at the first corner and improving the reliability of the main portion 52.

[0071] Exemplarily, the second connection portion 51 is connected to the first connection portion 31 using eutectic bonding. For example, a preset temperature (e.g., greater than 400 degrees Celsius) and a predetermined pressure (e.g., 5 kN to 100 kN) are applied to the second connection portion 51 and the first connection portion 31 for a certain period of time (e.g., 5 to 10 seconds) to form a eutectic bond between the second connection portion 51 and the first connection portion 31, thereby connecting the second connection portion 51 to the first connection portion 31. In some examples, the second connection portion 51 contacts the second side surface of the first connection portion 31 and is connected using eutectic bonding.

[0072] In some examples, along the second direction Z, the size of the first connection portion 31 is greater than or equal to 5um (for example, 5um, 6um, 7um, 8um, 9um, 10um, 11um, 12um, etc.); so that when the second connection portion 51 is eutectic bonded to the first connection portion 31, there is sufficient tolerance for position deviation, thereby increasing the reliability of the connection between the first connection portion 31 and the second connection portion 51. The second direction Z is the thickness direction of the backplane 10. Along the third direction Y, the size of the second connection portion 51 is 8um to 12um; so that the bonding force between the second connection portion 51 and the first connection portion 31 after eutectic bonding is greater, thereby increasing the reliability of the connection between the first connection portion 31 and the second connection portion 51. The third direction Y is a direction perpendicular to the selected side surface 1cc. Along the third direction Y, the size of the main body 52 is greater than or equal to 2um.

[0073] In some examples, referring to FIG6 , the first connection portion 31 includes a first conductive layer 311 and a first protective layer 312, with the first protective layer 312 covering the first conductive layer 311. Both the first conductive layer 311 and the first protective layer 312 are made of metal, and the melting point of the first conductive layer 311 is greater than the melting point of the first protective layer 312. Referring to FIG9 , the second connection portion 51 includes a second conductive layer 511 and a second protective layer 512, with the second protective layer 512 covering the second conductive layer 511. Both the second conductive layer 511 and the second protective layer 512 are made of metal, and the melting point of the second conductive layer 511 is greater than the melting point of the second protective layer 512. For example, the melting points of the first conductive layer 311 and the second conductive layer 511 are both greater than the melting point of the first protective layer 312, and the melting points of the first conductive layer 311 and the second conductive layer 511 are both greater than the melting point of the second protective layer 512.

[0074] The first conductive layer 311 and the second conductive layer 511 can be a single metal, such as copper. They can also be metal alloys, such as alloys of the aforementioned metals. The material of the first protective layer 312 and the second protective layer 512 can be a single metal, such as nickel or tin. The material of the first protective layer 312 and the second protective layer 512 can be a metal alloy, such as an alloy of the aforementioned metals (e.g., a copper alloy or a nickel alloy).

[0075] The principle of eutectic bonding between the first connecting portion 31 and the second connecting portion 51 is as follows: at a preset temperature, the first conductive layer 311 and the second conductive layer 511 undergo eutectic melting, becoming liquid and forming a primary bonding pattern; the first protective layer 312 and the second protective layer 512 undergo eutectic melting, becoming liquid and forming a first supplementary bonding pattern. Because the melting point of the first conductive layer 311 is greater than that of the first protective layer 312, and the melting point of the second conductive layer 511 is greater than that of the second protective layer 512, during the cooling process, the first conductive layer 311 and the second conductive layer 511 solidify first; the first protective layer 312 and the second protective layer 512 solidify later. When the primary bonding pattern is solid and the first supplementary bonding pattern is liquid, due to the connection between the primary bonding pattern and the first supplementary bonding pattern, the liquid first supplementary bonding pattern can flow into the voids in the solid primary bonding pattern, thereby filling the voids in the solid primary bonding pattern. The temperature is further lowered, causing the first supplemental bonding pattern to solidify. At this point, both the main bonding pattern and the first supplemental bonding pattern are in a solid state. During eutectic bonding, the voids in the main bonding pattern are filled with the first supplemental bonding pattern, improving the airtightness and stability of the main bonding pattern.

[0076] In one possible implementation, referring to Figures 7 and 8 , the first connection portion 31 further includes a third protective layer 313, which covers the first protective layer 312. Referring to Figure 10 , the second connection portion 51 further includes a fourth protective layer 513, which covers the second protective layer 512. The materials of the third and fourth protective layers 313 and 513 are both metals, and the melting point of the first protective layer 312 is greater than the melting point of the third protective layer 313. The melting point of the second protective layer 512 is greater than the melting point of the fourth protective layer 513. For example, the materials of the third and fourth protective layers 313 and 513 are both gold.

[0077] During the eutectic bonding process between the first connecting portion 31 and the second connecting portion 51, at a predetermined temperature, the third protective layer 313 and the fourth protective layer 513 undergo eutectic melting, becoming liquid and forming a second supplementary bonding pattern. This second supplementary bonding pattern can then fill the voids in the main bonding pattern and the first supplementary bonding pattern, thereby improving the airtightness and stability of the main bonding pattern and the first supplementary bonding pattern.

[0078] The volume ratio of the first conductive layer 311 to the first protective layer 312 is less than or equal to 1. For example, the volume ratio of the first conductive layer 311 to the first protective layer 312 shown in FIG7 is equal to 1. The volume ratio of the first conductive layer 311 to the first protective layer 312 shown in FIG8 is less than 1. The volume ratio of the second conductive layer 511 to the second protective layer 512 is less than or equal to 1. For example, the volume ratio of the second conductive layer 511 to the second protective layer 512 shown in FIG10 is equal to 1.

[0079] As another example, the second connection portion 51 and the first connection portion 31 are welded using solder (eg, tin solder).

[0080] Examples of two display panels are provided below.

[0081] Example 1:

[0082] Continuing with Figures 2-4 , the backplane 10 further comprises a first transition surface 1d, which connects the selected side surface 1cc and the second main surface 1b. In related art, since the connecting trace 50 is formed through a plating process, the thickness of the main body 52 near the first transition surface 1d is less than the thickness of the connecting trace 50 at the selected side surface 1cc, resulting in lower reliability of the connecting trace 50. In this embodiment, however, the manufactured main body 52 is attached to the first transition surface 1d, resulting in a substantially uniform thickness of the main body 52 at different locations.

[0083] Because the cross-section of the first transition surface 1d forms an obtuse angle with the selected side surface 1cc and the second main surface 1b, the main body 52 is also attached to the second main surface 1b. This means that the main body 52 extends from the selected side surface 1cc through the first transition surface 1d and is attached to the second main surface 1b. This reduces the bending angle of the main body 52 at the first transition surface 1d, thereby preventing the main body 52 from breaking due to bending at the first transition surface 1d.

[0084] In some examples, the first transition surface 1d may be an inclined plane, and the tangent plane of the first transition surface 1d is the inclined plane. In other examples, the first transition surface 1d may be an outwardly convex curved surface, such as a quarter-cylinder that is convex outward.

[0085] Exemplarily, the thickness ratio of any two positions of the main body 52 ranges from 0.9 to 1.1 (e.g., 0.9, 1, 1.1). This makes the thickness of the manufactured main body 52 roughly equal at any position, thereby increasing the reliability of the main body 52. ​​In some examples, the thickness ratio of the main body 52 at any two positions of one of the selected side surface 1cc, the first transition surface 1d, and the second main surface 1b ranges from 0.9 to 1.1. In other examples, the thickness ratio of any two of the thickness of the main body 52 at the first distance, the thickness of the main body 52 at the second distance, and the thickness of the main body 52 at the third distance ranges from 0.9 to 1.1; wherein the first distance can be the length of the main body 52 on the selected side surface 1cc (the length of the main body 52 is the dimension in the extension direction), the second distance is the length of the main body 52 on the first transition surface 1d, and the third distance is the length of the main body 52 on the second main surface 1b. The thickness of the main body 52 at the first distance can be understood as the average thickness of the main body 52 at the first distance, or the thickness of the main body 52 at the center of the first distance. The description of the thickness of the main body 52 at the second distance and the thickness of the main body 52 at the third distance can refer to the description of the thickness of the main body 52 at the first distance.

[0086] The display panel 1 also includes a first insulating layer 70 and a second insulating layer 80 stacked together, with the main body 52 located between the first insulating layer 70 and the second insulating layer 80. The first insulating layer 70 has a first opening 71 exposing the main body 52, and the second connecting portion 51 is connected to the main body 52 through the first opening 71. For example, along the third direction Y, the size of the second insulating layer 80 is 3um to 20um (e.g., 3um, 5um, 7um, 10um, 13um, 15um, 17um, 20um, etc.); in this way, the second insulating layer 80 can protect the main body 52 while also preventing the second insulating layer 80 from being too thick, which would result in a thicker frame. The material of the first insulating layer 70 can be an inorganic material such as silicon nitride or silicon oxide. The second insulating layer 80 can be polyimide, etc. As shown in FIG11 , the right surface of the second insulating layer 80 is flush with the upper surface of the first connecting portion 31 and can serve as a processing reference.

[0087] Illustratively, the connecting trace 50 further includes a third connecting portion 54. Multiple third connecting portions 54 are disposed in the main body 52 on the side of the second main surface 1b facing away from the first main surface 1a. Multiple third connecting portions 54 are bonded to the bonding area of ​​the circuit board 40. The third connecting portions 54 can be made of a metal material, such as a single metal such as copper, aluminum, or gold, or an alloy of these metals.

[0088] In some examples, referring again to Figures 2-4 and 11 , second insulating layer 80 has multiple second openings KT exposing multiple main body portions 52, and a third connecting portion 54 is connected to a main body portion 52 through a second opening KT. At this point, first insulating layer 70 is adhered to selected side surface 1cc, first transition surface 1d, and second main surface 1b using an adhesive layer; circuit board 40 is not adhered to second main surface 1b.

[0089] In other examples, referring again to Figures 2, 12, and 13, first insulating layer 70 has multiple second openings KT exposing multiple main body portions 52, and a third connecting portion 54 is connected to a main body portion 52 through a second opening KT. In this case, first insulating layer 70 is adhered to selected side surface 1cc, first transition surface 1d, and second main surface 1b using an adhesive layer; and circuit board 40 is also adhered to second main surface 1b using an adhesive layer.

[0090] In one possible implementation, referring to Figures 11 and 12 , the display panel 1 further includes a plurality of fan-out lines 53, which are also located between the first insulating layer 70 and the second insulating layer 80. The plurality of fan-out lines 53 are connected to the plurality of main body portions 52. A third connecting portion 54 is connected to a fan-out line 53 via a second opening KT. The plurality of fan-out lines 53 may be located on a side of the second main surface 1b away from the first main surface 1a.

[0091] Example 2:

[0092] 2 , 14 , and 15 , the selected side surface 1cc is connected to the second main surface 1b, that is, the selected side surface 1cc is in contact with the second main surface 1b, and the selected side surface 1cc is perpendicular to the second main surface 1b. To prevent the main body 52 from breaking at the corner formed by the selected side surface 1cc and the second main surface 1b (which may be referred to as the second corner, with the angle of the second corner being 90°), the main body 52 does not need to be attached to the second main surface 1b. In other words, the main body 52 can be connected to the circuit board 40 using third connecting portions 54. Multiple third connecting portions 54 are provided in the main body 52 at a portion on the side of the second main surface 1b facing away from the first main surface 1a.

[0093] Exemplarily, the plurality of fan-out lines 53 are arranged on the second main surface 1b, that is, the plurality of fan-out lines 53 are not arranged between the first insulating layer 70 and the second insulating layer 80 as shown in FIG13 , and the main body 52 is located between the first insulating layer 70 and the second insulating layer 80. The plurality of fan-out lines 53 are connected to the plurality of third connecting portions 54. The plurality of fan-out lines 53 are bound to the binding area CC of the circuit board 40. In some examples, a third insulating layer is provided on the second main surface 1b, and the plurality of fan-out lines 53 are located between the second main surface 1b and the third insulating layer; that is, the third insulating layer covers the plurality of fan-out lines 53 provided on the second main surface 1b. The third insulating layer is provided with a plurality of third holes and a plurality of fourth holes that expose the ends of the plurality of fan-out lines 53, the plurality of third connecting portions 54 are connected to the plurality of fan-out lines 53 through the plurality of third holes, and the circuit board 40 is bound to the plurality of fan-out lines 53 through the plurality of fourth holes.

[0094] Exemplarily, along the second direction Z, the distance between the second connection portion 51 and the third connection portion 54 is greater than or equal to the thickness of the back plate 10 .

[0095] An embodiment of the present disclosure also provides a method for manufacturing a display panel, which includes steps S100 to S500. Referring to Figure 16, step S100 provides a backplane 10, wherein the backplane 10 has a first main surface 1a and a second main surface 1b opposite to each other, and at least one selected side surface 1cc located between the first main surface 1a and the second main surface 1b; the selected side surface 1cc is connected to and perpendicular to the first main surface 1a. Step S200 forms a plurality of first connecting portions 31 on the first main surface 1a; the plurality of first connecting portions 31 are arranged side by side along a first direction and close to the selected side surface 1cc; the first direction is parallel to the selected side surface 1cc and the first main surface 1a. Step S300 forms a plurality of light-emitting devices on the first main surface 1a. Step S400 arranges a circuit board 40 on a side of the second main surface 1b away from the first main surface 1a. Step S500 attaches a plurality of connecting traces to the selected side surface 1cc. The plurality of connection lines are arranged along the first direction and spaced apart; wherein the plurality of connection lines are connected between the plurality of first connection portions 31 and the circuit board 40 .

[0096] The description and effects of steps S100, S200, S300, S400, and S500 can be referred to the relevant description of the display panel above and will not be repeated here. In some examples, step S500 can be performed first and then step S400. The material of the first substrate JB can be glass, etc.

[0097] In some embodiments, before attaching multiple connecting traces to the selected side surface 1cc, the steps include: forming multiple main portions 52 on the first substrate JB; forming multiple second connecting portions 51, and connecting the multiple second connecting portions 51 to the multiple main portions 52. In step S500, multiple main portions 52 are attached to the selected side surface 1cc (i.e., the multiple main portions 52 and the first basic unit are attached); and the multiple second connecting portions 51 are connected to the multiple first connecting portions 31, for example, by eutectic bonding. After attaching multiple connecting traces to the selected side surface 1cc, the steps include: removing the first substrate JB.

[0098] For example, referring to Figures 18 to 22, a second insulating layer 80 is formed on the first substrate JB. A plurality of main portions 52 are formed on the second insulating layer 80. A first insulating layer 70 is formed on a side of the plurality of main portions 52 away from the second insulating layer 80, so that the first insulating layer 70 covers the plurality of main portions 52. A plurality of second openings KT and a plurality of first openings 71 are formed in the first insulating layer 70 to expose the plurality of main portions 52. A plurality of second connecting portions 51 are formed in the plurality of first openings 71, and the plurality of main portions 52 are connected to the plurality of second connecting portions 51; a plurality of third connecting portions 54 are formed in the plurality of second openings KT, and the plurality of main portions 52 are connected to the plurality of third connecting portions 54. Thus, connecting traces with the first substrate JB are formed.

[0099] Referring to Figures 23-26 , a plurality of fan-out lines 53 are formed on the second main surface 1b. The main body 52 with the first substrate JB is attached to the selected side surface 1cc. The first connecting portion 31 and the second connecting portion 51 are connected, and the plurality of fan-out lines 53 are connected to the plurality of third connecting portions 54. The first substrate JB is removed. The ends of the plurality of fan-out lines 53 facing away from the plurality of third connecting portions 54 are bonded to the circuit board 40.

[0100] In some examples, referring to Figures 27 to 30 , the step of forming a plurality of main body portions 52 on the first substrate JB includes: forming a plurality of fan-out lines 53 on the first substrate JB, for example, forming the plurality of fan-out lines 53 on the second insulating layer 80; the plurality of fan-out lines 53 are connected to the plurality of main body portions 52. The step of forming a plurality of main body portions 52 on the first substrate JB includes: forming third connecting portions 54 in the plurality of second openings KT; the plurality of main body portions 52 are connected to the plurality of third connecting portions 54.

[0101] Referring to Figures 31-34 , the main body 52 with the first substrate JB is attached to the selected side surface 1cc, with the first connecting portion 31 and the second connecting portion 51 connected. The first substrate JB is removed. The circuit board 40 is then bonded to the plurality of third connecting portions 54. The main body 52 is also attached to the first transition surface 1d and a portion of the second main surface 1b, and the circuit board 40 is then attached to the second main surface 1b.

[0102] As another example, referring to Figures 35 to 41 , a plurality of third connecting portions 54 are formed on the first substrate JB. A second insulating layer 80 is formed on the first substrate JB, covering the plurality of third connecting portions 54. A plurality of second openings KT are formed in the second insulating layer 80, exposing the plurality of third connecting portions 54. A plurality of main portions 52 are formed on the second insulating layer 80, and the plurality of main portions 52 are also formed in the plurality of second openings KT, connecting the plurality of main portions 52 to the plurality of third connecting portions 54. A first insulating layer 70 is formed on a side of the plurality of main portions 52 away from the second insulating layer 80, covering the plurality of main portions 52. A plurality of first openings 71 are formed in the first insulating layer 70, exposing the plurality of main portions 52. A plurality of second connecting portions 51 are formed in the plurality of first openings 71, connecting the plurality of main portions 52 to the plurality of second connecting portions 51.

[0103] In some examples, the step of forming the plurality of main portions 52 on the first substrate JB includes forming a plurality of fan-out lines 53 on the first substrate JB, for example, forming the plurality of fan-out lines 53 on the second insulating layer 80; and connecting the plurality of fan-out lines 53 to the plurality of main portions 52. At this time, the plurality of fan-out lines 53 are also formed in the plurality of second openings KT, and the plurality of fan-out lines 53 are connected to the plurality of third connection portions 54.

[0104] The main body 52 with the first substrate JB is attached to the selected side surface 1cc, connecting the first connecting portion 31 to the second connecting portion 51. Referring to Figures 42 and 43, the first substrate JB is removed. The main body 52 is attached to the first transition surface 1d and a portion of the second main surface 1b. The circuit board 40 is then bonded to the plurality of third connecting portions 54.

[0105] In some examples, referring to Figures 17 to 23 , before forming the plurality of main body portions 52 on the first substrate JB, the steps include: forming a peelable layer BL on the first substrate JB; forming the main body portion 52 on the peelable layer BL. For example, forming a second insulating layer 80 on the peelable layer BL; and forming the main body portion 52 on the second insulating layer 80.

[0106] The step of removing the first substrate JB includes: peeling off the peelable layer BL. This allows the peelable layer BL and the first substrate JB to be separated from the main body 52 (or the second insulating layer 80). For example, the viscosity of a surface of the peelable layer BL close to the main body 52 is less than the viscosity of a surface of the peelable layer BL close to the first substrate JB. During peeling, the peelable layer BL can be peeled off from the main body 52 (or the second insulating layer 80) to prevent the peelable layer BL from peeling off from the first substrate JB. For another example, laser peeling technology can be used to separate the peelable layer BL from the second insulating layer 80, that is, laser energy is used to decompose the peelable layer BL (for example, the material is gallium nitride, etc.), thereby achieving separation of the second insulating layer 80 from the first substrate JB. At this time, the second insulating layer 80 acts as a laser barrier to prevent the laser from affecting the main body 52 or the fan-out line 53, as well as the backplane 10.

[0107] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A display panel, comprising: a backing plate having opposing first and second major surfaces and at least one selected side surface between the first and second major surfaces; The selected side surface is connected to and perpendicular to the first main surface; a plurality of light emitting devices disposed on the first main surface; A plurality of first connection portions disposed on the first main surface, the plurality of first connection portions being disposed side by side along a first direction and close to the selected side surface; The first direction is parallel to the selected side surface and the first major surface; a circuit board, located on a side of the second main surface away from the first main surface; and A plurality of connecting wires are arranged along the first direction and spaced apart; wherein the plurality of connecting wires are connected between the plurality of first connecting portions and the circuit board, and the plurality of connecting wires are attached to the selected side surface by pasting.

2. The display panel according to claim 1, wherein: The back plate also has a first transition surface, which is connected between the selected side surface and the second main surface; a section of the first transition surface forms an obtuse angle with the selected side surface and an obtuse angle with the second main surface.

3. The display panel according to claim 1 or 2, wherein: The connecting trace includes a main body and a second connecting part; the main body is attached to the selected side surface; the second connecting part is arranged in a portion of the main body located on a side of the first main surface away from the second main surface, and the second connecting part is connected to the first connecting part.

4. The display panel according to claim 3, wherein: The second connection portion is connected to the first connection portion by eutectic bonding.

5. The display panel according to claim 3 or 4, wherein: The main body is also attached to the second major surface.

6. The display panel according to any one of claims 3 to 5, wherein: The thickness ratio between any two positions of the main body is in the range of 0.9 to 1.

1.

7. The display panel according to any one of claims 3 to 6, wherein: The connecting wiring also includes: The third connecting portion is arranged at a portion of the main body portion located on a side of the second main surface away from the first main surface.

8. The display panel according to claim 7, wherein: The third connecting portion is connected to the circuit board; Alternatively, the display panel further includes: a plurality of fan-out lines disposed on the second main surface; wherein the plurality of fan-out lines are connected between the plurality of third connection portions and the circuit board.

9. The display panel according to claim 7 or 8, further comprising: A first insulating layer and a second insulating layer are stacked, wherein the main body is located between the first insulating layer and the second insulating layer; The first insulating layer has a first opening exposing the main body, and the second connecting portion passes through the first opening. An opening is connected to the main body.

10. The display panel according to claim 9, wherein: The first insulating layer or the second insulating layer has a second opening exposing the main body, and the third connecting portion is connected to the main body through the second opening.

11. A method for preparing a display panel, comprising: providing a backing plate having opposing first and second major surfaces and at least one selected side surface between the first and second major surfaces; The selected side surface is connected to and perpendicular to the first main surface; A plurality of first connection portions are formed on the first main surface; the plurality of first connection portions are arranged side by side along a first direction and close to the selected side surface; The first direction is parallel to the selected side surface and the first major surface; forming a plurality of light emitting devices on the first main surface; A circuit board is arranged on a side of the second main surface away from the first main surface; as well as, A plurality of connection traces are attached to the selected side surface; the plurality of connection traces are arranged along the first direction and arranged at intervals; wherein the plurality of connection traces are connected between the plurality of first connection portions and the circuit board.

12. The method for preparing a display panel according to claim 11, wherein: Before the step of attaching a plurality of connection traces to the selected side surface, the method includes: forming a plurality of main body portions on the first substrate; forming a plurality of second connection portions, wherein the plurality of second connection portions are connected to the plurality of main body portions; The step of attaching a plurality of connection traces on the selected side surface comprises: Attaching the surfaces of the plurality of main body parts away from the first substrate to the selected side surface, and connecting the plurality of first connecting parts to the plurality of second connecting parts; The first substrate is removed.

13. The method for preparing a display panel according to claim 12, wherein: Before the step of forming a plurality of main body parts on the first substrate, the step includes: forming a second insulating layer on the first substrate; After the step of forming a plurality of main body portions on the first substrate and before the step of forming the second connecting portion, the method comprises: forming a first insulating layer on a side of the plurality of main body portions away from the second insulating layer; forming a plurality of first openings on the first insulating layer to expose the plurality of main body portions; The step of forming the second connecting portion comprises: A plurality of second connection portions are formed in the plurality of first openings.

14. The method for preparing a display panel according to claim 13, wherein: Before the step of forming a second insulating layer on the first substrate, the step includes: forming a plurality of third connection parts on the first substrate; After the step of forming the second insulating layer on the first substrate and before the step of forming the first insulating layer on a side of the plurality of main body portions away from the second insulating layer, the method comprises: A plurality of second openings exposing the plurality of third connection portions are formed on the second insulating layer; The step of forming a plurality of main body portions on the first substrate comprises: The plurality of main body portions are also formed in the plurality of second openings, and the plurality of main body portions are connected to the plurality of third connection portions.

15. The method for preparing a display panel according to claim 13, wherein: After the step of forming a plurality of main body portions on the first substrate and before the step of forming the second connecting portion, the method comprises: forming a plurality of second openings on the first insulating layer to expose the plurality of main body portions; The step of forming the second connecting portion comprises: Third connection parts are formed in the plurality of second openings, and the plurality of main body parts are connected to the plurality of third connection parts.

16. The method for preparing a display panel according to claim 15, wherein: Before the step of arranging a circuit board on a side of the second main surface away from the first main surface, the step includes: forming a plurality of fan-out lines on the second main surface; the plurality of fan-out lines are connected to the plurality of third connection portions; The step of arranging a circuit board on a side of the second main surface away from the first main surface comprises: The circuit board is bound at ends of the plurality of fan-out lines away from the plurality of third connection portions.

17. The method for preparing a display panel according to any one of claims 12 to 16, wherein: Before the step of forming a plurality of main body parts on the first substrate, the step includes: forming a peelable layer on the first substrate; The step of removing the first substrate comprises: Peel off the peelable layer.

18. A display device comprising: The display panel according to any one of claims 1 to 10.

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