Crystal optical axis surface processing equipment and system

Abstract

The invention discloses crystal optical axis surface machining equipment and system, and belongs to the technical field of crystal machining equipment. The crystal optical axis surface machining equipment comprises a single-wire cutting mechanism, an angle adjusting mechanism, a crystal clamping mechanism and a stress detector. The crystal clamping mechanism, the angle adjusting mechanism and the stress detector are all integrated in the single-wire cutting mechanism platform, and the crystal clamping mechanism is adopted for one-time clamping to be matched with the angle adjusting mechanism, so that rough machining and finish machining can be carried out on a crystal bar through a cutting wire in the single-wire cutting mechanism platform. In other words, the crystal bar does not need to be clamped in multiple machining and detecting devices in a circulating and reciprocating mode, the crystal bar can be detected and machined through the crystal optical axis surface machining device, the directional machining process of the crystal bar optical axis surface is effectively simplified, and the directional machining efficiency of the crystal bar optical axis surface is improved.

Description

Technical Field

[0001] The present application relates to the technical field of crystal processing equipment, and in particular to a crystal optical axis surface processing equipment and system. Background Art

[0002] Crystals (e.g., fluoride crystals) are widely used in laser, infrared, ultraviolet optics, high-energy detection and other fields. They are excellent materials for making infrared optical system components such as optical prisms, lenses and windows. They can also be used to make large-size lenses for laser lithography, as well as used as fluorescent and up-conversion luminescent materials.

[0003] At present, the crystal orientation processing step is usually to grind the crystal on a single-axis machine to correct the deflection angle. After the deflection angle between the polished optical axis plane (i.e., crystal plane) and the ideal optical axis plane is within ±10°, the crystal is placed on an X-ray orientation instrument for detection to measure the deflection angle between the actual optical axis plane and the ideal optical axis plane, and then the crystal is placed on a single-axis machine to fine-tune the deflection angle. In this way, the above steps are repeated until the deflection angle between the actual optical axis plane and the ideal optical axis plane is within 12′.

[0004] However, the above steps require continuous disassembly and assembly of the crystal, resulting in low efficiency of crystal optical axis surface orientation processing. Summary of the invention

[0005] The embodiment of the present application provides a crystal optical axis surface processing device and system. It can solve the problem of low efficiency of crystal optical axis surface orientation processing in the prior art. The technical solution is as follows:

[0006] In one aspect, a crystal optical axis surface processing device is provided, the crystal optical axis surface processing device comprising:

[0007] Single-wire cutting mechanism, angle adjustment mechanism, crystal clamping mechanism and stress detector;

[0008] The single-wire cutting mechanism extends along a first direction, the single-wire cutting mechanism has a first installation position and a second installation position distributed along the first direction, and the single-wire cutting mechanism has a cutting line moving along the first direction;

[0009] The angle adjustment mechanism is installed at the first installation position, and the single-wire cutting mechanism can drive the angle adjustment mechanism to rotate around a first axis, and the extension direction of the first axis is parallel to the first direction;

[0010] The crystal clamping mechanism is installed on a side of the angle adjustment mechanism away from the first installation position, and the crystal clamping mechanism is used to clamp the crystal rod;

[0011] The stress detector is installed at the second installation position and is movably connected to the single-wire cutting mechanism. The stress detector is arranged adjacent to the crystal clamping mechanism, and the crystal rod is distributed between the polarizer and the analyzer of the stress detector.

[0012] Wherein, when the stress detector moves so that the optical axis of the polarizer of the stress detector is coaxial with the crystal axis of the crystal rod, the angle adjustment mechanism is used to drive the crystal to move through the crystal clamping mechanism to present a target image in the analyzer of the stress detector, and can drive the crystal rod to rotate around a second axis through the crystal clamping mechanism, and the extension direction of the second axis is perpendicular to the first direction and is not parallel to the central axis of the crystal rod.

[0013] Optionally, the angle adjustment mechanism comprises: a universal shaft adjustment component and a tilt angle adjustment component, the bottom of the tilt angle adjustment component is installed at the first installation position, the bottom of the universal shaft adjustment component is fixed to the top of the tilt angle adjustment component, and the end of the universal shaft adjustment component away from the tilt angle adjustment component is fastened to the crystal clamping mechanism;

[0014] Wherein, the universal joint adjustment component is configured to: drive the crystal to move through the crystal clamping mechanism to present the target image in the analyzer of the stress detector; the tilt angle adjustment component is configured to: drive the crystal rod to rotate around the second axis through the crystal clamping mechanism.

[0015] Optionally, the universal shaft adjustment assembly includes: a ball joint base fixedly mounted on the tilt angle adjustment assembly, and a universal shaft ball joint rotatably mounted in the ball joint base, the universal shaft ball joint having a connecting piece, and the universal shaft ball joint is connected to the crystal clamping mechanism via the connecting piece.

[0016] Optionally, the tilt angle adjustment assembly includes: a first sliding table, a second sliding table, a transmission member and a driving member, the first sliding table has a first curved surface, the second sliding table has a second curved surface that slides with the first curved surface, the first sliding table is installed at the first installation position on a side away from the second sliding table, and the second sliding table is fastened to the universal shaft adjustment assembly on a side away from the first sliding table; the transmission member is located between the first sliding table and the second sliding table and is respectively connected to the first sliding table and the second sliding table in a transmission manner; the driving member is connected to the transmission member in a transmission manner;

[0017] Wherein, the first arc surface and the second arc surface are both distributed around the second axis.

[0018] Optionally, the crystal clamping mechanism comprises: at least one group of locking components, each group of the locking components comprises two V-shaped clamps disposed opposite to each other, and two locking members, each of the locking members being respectively fastened to a group of ends of the two V-shaped clamps;

[0019] Wherein, the crystal rod is installed between two V-shaped clamps in each set of locking components.

[0020] Optionally, the crystal clamping mechanism further includes: a rubber pad located between the V-shaped clamp and the crystal rod, and two sides of the rubber pad are in contact with the crystal rod and the V-shaped clamp respectively.

[0021] Optionally, the single-wire cutting mechanism has a rotating driving platform arranged at the first mounting position, and the angle adjustment mechanism is mounted on the rotating driving platform;

[0022] Wherein, the rotary driving platform can drive the angle adjustment mechanism to rotate around the first axis.

[0023] Optionally, the crystal optical axis surface processing equipment further comprises: a driving mechanism installed at the second installation position, and the stress detector is transmission-connected to the driving mechanism;

[0024] Wherein, the driving mechanism is configured to: drive the stress detector to move so that the optical axis of the polarizer of the stress detector is coaxial with the crystal axis of the crystal rod.

[0025] Optionally, the driving mechanism includes: a driving screw, an adapter and a lifting bracket, the driving screw is installed at the second installation position and is threadedly connected to the adapter, the lifting bracket is slidably connected to the adapter along the first direction, the stress detector is connected to the lifting bracket, and the extension direction of the driving screw is parallel to the extension direction of the second axis;

[0026] Wherein, the driving screw is configured to: when rotating under the action of external force, drive the stress detector to move through the adapter and the lifting bracket.

[0027] On the other hand, a crystal optical axis surface processing system is provided, the crystal optical axis surface processing system comprising: an X-ray orienting instrument and the crystal optical axis surface processing equipment, the crystal optical axis surface processing equipment is the crystal optical axis surface processing equipment given above.

[0028] The beneficial effects brought by the technical solution provided by the embodiment of the present application include at least:

[0029] A crystal optical axis surface processing device may include: a single-wire cutting mechanism, an angle adjustment mechanism, a crystal clamping mechanism and a stress detector. By integrating the crystal clamping mechanism, the angle adjustment mechanism and the stress detector in a single-wire cutting platform, the crystal rod can be roughly processed and finely processed using a cutting line in the single-wire cutting mechanism platform by clamping the crystal clamping mechanism once and cooperating with the angle adjustment mechanism. That is, there is no need to cyclically move and clamp the crystal rod in multiple processing and detection equipment, and the crystal optical axis surface processing device can be used to complete the detection and processing of the crystal rod, which effectively simplifies the directional processing process of the crystal rod optical axis surface and improves the efficiency of the directional processing of the crystal rod optical axis surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0031] Figure 1 It is a structural schematic diagram of a crystal optical axis surface processing device provided in an embodiment of the present application;

[0032] Figure 2 yes Figure 1 A front view of a crystal optical axis surface processing device is shown;

[0033] Figure 3 It is a structural schematic diagram of another crystal optical axis surface processing device provided in an embodiment of the present application;

[0034] Figure 4 is a structural schematic diagram of a universal shaft adjustment assembly provided in an embodiment of the present application;

[0035] Figure 5 is a structural schematic diagram of a tilt angle adjustment assembly provided in an embodiment of the present application;

[0036] Figure 6 It is a structural schematic diagram of a crystal optical axis surface processing device provided in an embodiment of the present application;

[0037] Figure 7 It is a partial structural schematic diagram of a driving mechanism provided in an embodiment of the present application.

[0038] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0039] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

[0040] Please refer to Figure 1 and Figure 2 , Figure 1 is a structural schematic diagram of a crystal optical axis surface processing device provided in an embodiment of the present application, Figure 2 yes Figure 1 The front view of the crystal optical axis surface processing device 000 is shown. The crystal optical axis surface processing device 000 may include: a single wire cutting mechanism 100 , an angle adjustment mechanism 200 , a crystal clamping mechanism 300 and a stress detector 400 .

[0041] The single-wire cutting mechanism 100 in the crystal optical axis surface processing device 000 may extend along the first direction f1, and the single-wire cutting mechanism 100 may have a first installation position w1 and a second installation position w2 distributed along the first direction f1, and the single-wire cutting mechanism 100 may have a cutting line 101 moving along the first direction f1. Here, the cutting line 101 in the single-wire cutting mechanism 100 may be driven by the single-wire cutting mechanism to move along the first direction f1, so as to cut a wafer from the crystal rod A.

[0042] The angle adjustment mechanism 200 in the crystal optical axis surface processing equipment 000 can be installed at the first installation position w1 of the single-wire cutting mechanism 100, and the single-wire cutting mechanism 100 can drive the angle adjustment mechanism 200 to rotate around the first axis L1, and the extension direction of the first axis L1 can be parallel to the first direction f1.

[0043] The crystal clamping mechanism 300 in the crystal optical axis surface processing device 000 is installed on the side of the angle adjustment mechanism 200 away from the first installation position w1 of the single wire cutting mechanism 100, and the crystal clamping mechanism 300 can be used to clamp the crystal rod A. For example, the crystal rod A can be cylindrical, and the crystal rod A can be a magnesium fluoride crystal.

[0044] The stress detector 400 in the crystal optical axis surface processing device 000 can be installed at the second installation position w2 of the single-wire cutting mechanism 100 and can be movably connected with the single-wire cutting mechanism 100. The stress detector 400 can be arranged adjacent to the crystal clamping mechanism 300, and the crystal rod A can be distributed between the polarizer 401 and the analyzer 402 in the stress detector 400. For example, the stress detector 400 can also have a light source (not shown in the figure) located on the side of the polarizer 401 away from the analyzer 402, and the light source can emit light to the polarizer 401.

[0045] Wherein, when the stress detector 400 moves on the single-wire cutting mechanism 100 so that the optical axis of the polarizer 401 of the stress detector 400 is coaxial with the crystal axis of the crystal rod A, the angle adjustment mechanism 200 can be used to drive the crystal rod A to move through the crystal clamping mechanism 300, so as to present the target image in the analyzer 402 of the stress detector 400, and can drive the crystal rod A to rotate around the second axis L2 through the crystal clamping mechanism 300, the extension direction of the second axis L2 can be perpendicular to the first direction f1 and not parallel to the central axis of the crystal rod A (the central axis extends along the axial direction of the crystal rod), the relative position between the second axis L2 and the angle adjustment mechanism 200 remains constant, but the second axis corresponds to the angle adjustment mechanism and moves with it. Here, the target image presented in the analyzer 402 of the stress detector 400 can be a crystal conoscopic diagram.

[0046] For example, in the process of orienting the optical axis surface of the crystal rod, the crystal clamping mechanism 300 can first be used to clamp the crystal rod A; then the position of the stress detector 400 on the platform of the single-wire cutting mechanism 100 is adjusted to make the crystal axis of the crystal rod A coaxial with the optical axis of the polarizer 401 in the stress detector 400; then, the angle adjustment mechanism 200 is used to adjust the placement angle of the crystal rod A until the crystal conoscopic diagram is seen at the center of the analyzer 402 in the stress detector 400; then, the cutting line 101 of the single-wire cutting mechanism 100 is manipulated to move in the crystal rod A. A wafer is cut from the body rod A to complete the rough processing of the crystal rod A, and an external X-ray orientation device is used to obtain the first deflection angle between the actual crystal plane (i.e., the optical axis plane) cut out by the wafer and the ideal crystal plane; finally, the deflection angle between the actual crystal plane and the ideal crystal plane of the crystal rod A is corrected by the single-line cutting mechanism 100 and the angle adjustment mechanism 200 with reference to the first deflection angle, and a crystal plane is cut out again on the crystal rod A using the cutting line 101, that is, the crystal rod A is finely processed, and at this time, the second deflection angle between the crystal plane and the ideal crystal plane is the required deflection angle. For example, the deflection angle range of the first deflection angle can be ±10°, and the deflection angle range of the second deflection angle can be ±12′.

[0047] In the embodiment of the present application, the crystal clamping mechanism 300, the angle adjustment mechanism 200 and the stress detector 400 are all integrated in the single-wire cutting mechanism 100 platform, and the crystal clamping mechanism 300 is clamped once in conjunction with the angle adjustment mechanism 200, and the crystal rod A can be roughly processed and finely processed using the cutting wire 101 in the single-wire cutting mechanism 100 platform. That is, there is no need to cyclically move and clamp the crystal rod A in multiple processing and testing equipment, and the crystal optical axis surface processing equipment 000 can be used to complete the detection and processing of the crystal rod A, which effectively simplifies the directional processing process of the crystal rod optical axis surface and improves the efficiency of the directional processing of the crystal rod optical axis surface.

[0048] In summary, the embodiment of the present application provides a crystal optical axis surface processing device, which may include: a single-wire cutting mechanism, an angle adjustment mechanism, a crystal clamping mechanism, and a stress detector. By integrating the crystal clamping mechanism, the angle adjustment mechanism, and the stress detector in the single-wire cutting platform, the crystal rod can be rough-processed and fine-processed using the cutting wire in the single-wire cutting mechanism platform by clamping the crystal clamping mechanism once in conjunction with the angle adjustment mechanism. That is, there is no need to cyclically reciprocate and clamp the crystal rod in multiple processing and detection equipment, and the crystal optical axis surface processing device can be used to complete the detection and processing of the crystal rod, which effectively simplifies the directional processing process of the crystal rod optical axis surface and improves the efficiency of the directional processing of the crystal rod optical axis surface.

[0049] Optional, please refer to 1 and Figure 3 , Figure 3 It is a structural schematic diagram of another crystal optical axis surface processing device provided in an embodiment of the present application. The angle adjustment mechanism 200 in the crystal optical axis surface processing device 000 may include: a universal shaft adjustment component 201 and a tilt angle adjustment component 202, and the bottom of the tilt angle adjustment component 202 may be installed at the first installation position w1 of the single-wire cutting mechanism 100. The bottom of the universal shaft adjustment component 201 may be fixed to the top of the tilt angle adjustment component 202, and the end of the universal shaft adjustment component 201 away from the tilt angle adjustment component 202 may be fastened to the crystal clamping mechanism 300. Among them, the universal shaft adjustment component 201 may be configured to: drive the crystal rod A to move through the crystal clamping mechanism 300 to present the target image in the analyzer 402 of the stress detector 400. The tilt angle adjustment component 202 may be configured to: drive the crystal rod A to rotate around the second axis L2 through the crystal clamping mechanism 300. In this case, by providing the universal shaft adjustment component 201, the angle of the crystal rod A can be conveniently adjusted manually during the rough processing of the crystal rod A, so that the crystal rod A can be cut once by the cutting line 101 in the single-wire cutting mechanism 100 to correct the deviation angle between the actual crystal plane and the ideal crystal plane. In addition, by providing the tilt angle adjustment component 202, the angle of the crystal rod A can be accurately adjusted during the fine processing of the crystal rod A, so that the crystal rod A can be cut twice by the cutting line 101 in the single-wire cutting mechanism 100 to further correct the deviation angle between the actual crystal plane and the ideal crystal plane.

[0050] It should be noted that the deflection angle between the actual crystal plane and the ideal crystal plane measured by the X-ray orientation instrument usually includes two angles. Among the six degrees of freedom, one angle is the deflection angle around the first axis L1, and the other angle is the deflection angle around the second axis L2. Therefore, the combination of the single-wire cutting mechanism 100 and the tilt angle adjustment component 202 can respectively complete the deflection correction around the first axis L1 and the deflection correction around the second axis L2.

[0051] In the examples of this application, please refer to Figure 3 and Figure 4 , Figure 4 : is a structural schematic diagram of a universal shaft adjustment assembly provided in an embodiment of the present application. The universal shaft adjustment assembly 201 may include: a ball joint base 201a fixedly mounted on the tilt angle adjustment assembly 202, and a universal shaft ball joint 201b rotatably mounted in the ball joint base 201a, the universal shaft ball joint 201b may have a connecting piece 201c, and the universal shaft ball joint 201b may be connected to the crystal clamping mechanism 300 through the connecting piece 201c. In this case, the torque and stop generated by the cooperation of the ball joint base 201a and the universal shaft ball joint 201b can realize the rotation and stop of the crystal rod A at various angles, thereby improving the convenience of operation. For example, the connecting piece 201c can be tightly connected to the crystal clamping mechanism 300.

[0052] Optional, please refer to Figure 3 , Figure 5 and Figure 6 , Figure 5 is a structural schematic diagram of a tilt angle adjustment assembly provided in an embodiment of the present application, Figure 6 1 is a schematic diagram of the structure of a crystal optical axis surface processing device provided by an embodiment of the present application. The tilt angle adjustment component 202 may include: a first sliding table 202a, a second sliding table 202b, a transmission member (not shown in the figure) and a driving member 202c. The first sliding table 202a may have a first curved surface m1, and the second sliding table 202b may have a second curved surface m2 that slides with the first curved surface m1 in the first sliding table 202a. The side of the first sliding table 202a away from the second sliding table 202b may be installed at the first installation position w1 of the single-wire cutting mechanism 100, and the side of the second sliding table 202b away from the first sliding table 202a may be fastened to the universal shaft adjustment component 201. The transmission member may be located between the first sliding table 202a and the second sliding table 202b and may be respectively connected to the first sliding table 202a and the second sliding table 202b in transmission connection, and one end of the driving member 202c may be connected to the transmission member in transmission connection. The first curved surface m1 in the first sliding platform 202a and the second curved surface m2 in the second sliding platform 202b may both be distributed around the second axis L2.

[0053] In this case, by setting the first sliding table 202a, the second sliding table 202b, the transmission member and the driving member 202c in the tilt angle adjustment component 202, the driving member 202c can be screwed to drive the second sliding table 202b to slide around the second axis L2 on the first arc surface m1 of the first sliding table 202a through the transmission member, thereby driving the crystal clamping mechanism 300 and the crystal rod A to synchronously deflect the corresponding angle. For example, the side of the first sliding table 202a and the side of the second sliding table 202b can have angle reference scale lines (not shown in the figure), so that the operator can easily see the deflection angle of the second sliding table 202b. Alternatively, by presetting the rotation angle of the second sliding table 202b on the first sliding table 202a when the driving member 202c rotates one circle, the rotation angle of the second sliding table 202b on the first sliding table 202a can be known by the number of rotations of the driving member 202c.

[0054] It should be noted that the tilt angle adjustment assembly 202 may be a manual goniometer slide. For example, the side of the second slide 202b away from the first slide 202a may be fastened to the ball joint base 201a in the universal shaft adjustment assembly 201 .

[0055] In the embodiments of the present application, Figure 6 As shown, the crystal clamping mechanism 300 may include: at least one set of locking components 301, each set of locking components may include two V-shaped clamps 301a and two locking components 301b arranged opposite to each other, and each locking component 301b may be respectively fastened to a set of ends of the two V-shaped clamps 301a. Among them, the crystal rod A may be installed between the two V-shaped clamps 301a in each set of locking components 301. In this case, by providing at least one set of locking components in the crystal clamping mechanism, the crystal rod A can be conveniently clamped and disassembled by the two V-shaped clamps 301a and two locking components 301b arranged opposite to each other in each set of locking components. For example, the crystal clamping mechanism 300 may include two sets of locking components 301.

[0056] It should be noted that a V-shaped clamp 301a can be connected to the universal shaft ball joint 201b in the universal shaft adjustment assembly 201. Each locking member 301b can be detachably connected to a set of ends of two V-shaped clamps 301a, and the locking member 301b can be used to adjust the degree of tightening of the two V-shaped clamps 301a. For example, the locking member 301b can be a locking screw, and the end of the V-shaped clamp 301a can have a screw hole corresponding to the locking screw.

[0057] Optional, such as Figure 6As shown, the crystal clamping mechanism 300 may further include: a rubber pad 301c located between the V-shaped clamp 301a and the crystal rod A, and the two sides of the rubber pad 301c may contact the outer side of the crystal rod A and the V-shaped clamp 301a respectively. Here, the rubber pad 301c may be fixed on the V-shaped clamp 301a. In this case, by providing the rubber pad 301c located between the V-shaped clamp 301a and the crystal rod A in the crystal clamping mechanism 300, the rubber pad 301c can play a good protective role on the crystal rod A, and prevent the crystal rod A from being damaged in the crystal clamping mechanism 300.

[0058] In the embodiments of the present application, Figure 6 As shown, the single-wire cutting mechanism 100 may have a rotating drive table 102 disposed at the first mounting position w1, and the angle adjustment mechanism 200 may be mounted on the rotating drive table 102. The rotating drive table 102 can drive the angle adjustment mechanism 200 to rotate around the first axis L1. It should be noted that the rotating drive table 102 can drive the angle adjustment mechanism 200 to rotate around the first axis L1 for one circle. In this way, the angle adjustment mechanism 200 is directly mounted on the rotating drive table 102 in the single-wire cutting mechanism 100, and there is no need to additionally set up other rotating drive mechanisms in the crystal optical axis surface processing equipment, thereby improving the integration of the crystal optical axis surface processing equipment and saving manufacturing costs.

[0059] It should be noted that the tilt angle adjustment component 202 in the angle adjustment mechanism 200 can be connected to the rotation driving platform 102 .

[0060] Optional, please refer to Figure 6 and Figure 7 , Figure 7 It is a partial structural diagram of a driving mechanism provided in an embodiment of the present application. The crystal optical axis surface processing device 000 may also include: a driving mechanism 500 installed at the second installation position w2 of the single-wire cutting mechanism 100, and the stress detector 400 may be connected to the driving mechanism 500 in a transmission manner. The driving mechanism 500 may be configured to: drive the stress detector to move so that the optical axis of the polarizer 401 of the stress detector is coaxial with the crystal axis of the crystal rod A.

[0061] In the present application, the driving mechanism 500 in the crystal optical axis surface processing device 000 may include: a driving screw 501, an adapter 502 and a lifting bracket 503, the driving screw 501 may be installed at the second installation position w2 of the single-wire cutting structure and threadedly connected to the adapter 502, the lifting bracket 503 may be slidably connected to the adapter 502 along the first direction f1, and the stress detector 400 may be connected to the lifting bracket 503. The extension direction of the driving screw 501 may be parallel to the extension direction of the second axis L2. Among them, the driving screw 501 may be configured to: when rotating under the action of an external force, the stress detector 400 is driven to move through the adapter 502 and the lifting bracket 503. For example, the driving mechanism 500 may include: a base 504 fixed at the second installation position w2 of the single-wire cutting mechanism 100, the driving screw 501 may be rotatably connected to the base 504, and the adapter 502 may be threadedly connected to the driving screw 501 and can slide on the base 504.

[0062] In the embodiment of the present application, the single-wire cutting mechanism includes: a lifting drive mechanism and a cutting wire installation mechanism (not shown in the figure), the cutting wire installation mechanism includes: two disks arranged opposite to each other along the length direction of the cutting wire, two connecting plates corresponding to the two disks, the disks are installed on the corresponding connecting plates, and the cutting wire is wound around the two disks and rotated under the drive of the disks. The lifting drive mechanism is configured to: drive the connecting plates to drive the disks and the cutting wire to reciprocate along the first direction f1 to cut the crystal rod A.

[0063] In summary, the embodiment of the present application provides a crystal optical axis surface processing device, which may include: a single-wire cutting mechanism, an angle adjustment mechanism, a crystal clamping mechanism, and a stress detector. By integrating the crystal clamping mechanism, the angle adjustment mechanism, and the stress detector in the single-wire cutting platform, the crystal rod can be rough-processed and fine-processed using the cutting wire in the single-wire cutting mechanism platform by clamping the crystal clamping mechanism once in conjunction with the angle adjustment mechanism. That is, there is no need to cyclically reciprocate and clamp the crystal rod in multiple processing and detection equipment, and the crystal optical axis surface processing device can be used to complete the detection and processing of the crystal rod, which effectively simplifies the directional processing process of the crystal rod optical axis surface and improves the efficiency of the directional processing of the crystal rod optical axis surface.

[0064] The embodiment of the present application also provides a crystal optical axis surface processing system, and the crystal optical axis surface processing system may include: an X-ray orientator (not shown in the figure) and a crystal optical axis surface processing device 000. By way of example, the crystal optical axis surface processing device may be any of the crystal optical axis surface processing devices given above. In this way, in the process of orienting the optical axis surface of the crystal rod, the crystal clamping mechanism 300 may be used to clamp the crystal rod A first; then the position of the stress detector 400 on the platform of the single-wire cutting mechanism 100 is adjusted so that the crystal axis of the crystal rod A is coaxial with the optical axis of the polarizer 401 in the stress detector 400; then the angle adjustment mechanism 200 is used to adjust the placement angle of the crystal rod A until the crystal cone diagram is seen at the center of the analyzer 402 in the stress detector 400; then the cutting line 101 of the single-wire cutting mechanism 100 is manipulated to move in the crystal A wafer is cut from the body rod A, and an X-ray orientation device is used to obtain a first deviation angle between the actual crystal plane (i.e., the optical axis plane) cut from the wafer and the ideal crystal plane, i.e., the crystal rod is rough-machined; finally, the deviation angle between the actual crystal plane and the ideal crystal plane of the crystal rod A is corrected with reference to the first deviation angle through the cooperation of the single-line cutting mechanism 100 and the angle adjustment mechanism 200, and a crystal plane is cut from the crystal rod A again using the cutting line 101, i.e., the crystal rod A is fine-machined, and at this time, the second deviation angle between the crystal plane and the ideal crystal plane is the required deviation angle.

[0065] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It is also understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it is understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it may be the only layer between the two layers or two elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0066] In the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless otherwise clearly defined.

[0067] The above description is only an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A crystal optical axis surface processing device, characterized in that: include: Single-wire cutting mechanism, angle adjustment mechanism, crystal clamping mechanism and stress detector; The single-wire cutting mechanism extends along a first direction, the single-wire cutting mechanism has a first installation position and a second installation position distributed along the first direction, and the single-wire cutting mechanism has a cutting line moving along the first direction; The angle adjustment mechanism is installed at the first installation position, and the single-wire cutting mechanism can drive the angle adjustment mechanism to rotate around a first axis, and the extension direction of the first axis is parallel to the first direction; The crystal clamping mechanism is installed on a side of the angle adjustment mechanism away from the first installation position, and the crystal clamping mechanism is used to clamp the crystal rod; The stress detector is installed at the second installation position and is movably connected to the single-wire cutting mechanism. The stress detector is arranged adjacent to the crystal clamping mechanism, and the crystal rod is distributed between the polarizer and the analyzer in the stress detector. Wherein, when the stress detector moves so that the optical axis of the polarizer of the stress detector is coaxial with the crystal axis of the crystal rod, the angle adjustment mechanism is used to drive the crystal rod to move through the crystal clamping mechanism to present a target image in the analyzer of the stress detector, and can drive the crystal rod to rotate around a second axis through the crystal clamping mechanism, and the extension direction of the second axis is perpendicular to the first direction and is not parallel to the central axis of the crystal rod.

2. The crystal optical axis surface processing equipment according to claim 1, characterized in that: The angle adjustment mechanism comprises: a universal shaft adjustment component and a tilt angle adjustment component, the bottom of the tilt angle adjustment component is installed at the first installation position, the bottom of the universal shaft adjustment component is fixed to the top of the tilt angle adjustment component, and the end of the universal shaft adjustment component away from the tilt angle adjustment component is fastened to the crystal clamping mechanism; Wherein, the universal joint adjustment component is configured to: drive the crystal rod to move through the crystal clamping mechanism to present the target image in the analyzer of the stress detector; the tilt angle adjustment component is configured to: drive the crystal rod to rotate around the second axis through the crystal clamping mechanism.

3. The crystal optical axis surface processing equipment according to claim 2, characterized in that: The universal shaft adjustment assembly includes: a ball joint base fixedly mounted on the tilt angle adjustment assembly, and a universal shaft ball joint rotatably mounted in the ball joint base, the universal shaft ball joint having a connecting piece, and the universal shaft ball joint is connected to the crystal clamping mechanism through the connecting piece.

4. The crystal optical axis surface processing equipment according to claim 2, characterized in that: The tilt angle adjustment assembly comprises: a first sliding table, a second sliding table, a transmission member and a driving member, the first sliding table having a first arc surface, the second sliding table having a second arc surface slidingly cooperating with the first arc surface, the first sliding table being installed at the first installation position on a side away from the second sliding table, and the second sliding table being fastened to the universal shaft adjustment assembly on a side away from the first sliding table; the transmission member is located between the first sliding table and the second sliding table and is respectively connected to the first sliding table and the second sliding table in a transmission manner; the driving member is connected to the transmission member in a transmission manner; Wherein, the first arc surface and the second arc surface are both distributed around the second axis.

5. The crystal optical axis surface processing equipment according to any one of claims 1 to 4, characterized in that: The crystal clamping mechanism comprises: at least one set of locking components, each set of the locking components comprises two V-shaped clamps and two locking components which are arranged opposite to each other, and each of the locking components is respectively fastened to one set of ends of the two V-shaped clamps; Wherein, the crystal rod is installed between two V-shaped clamps in each set of locking components.

6. The crystal optical axis surface processing equipment according to claim 5, characterized in that: The crystal clamping mechanism further includes: a rubber pad located between the V-shaped clamp and the crystal rod, and two sides of the rubber pad are in contact with the crystal rod and the V-shaped clamp respectively.

7. The crystal optical axis surface processing equipment according to any one of claims 1 to 4, characterized in that: The single-wire cutting mechanism has a rotating driving platform arranged at the first installation position, and the angle adjustment mechanism is installed on the rotating driving platform; Wherein, the rotary driving platform can drive the angle adjustment mechanism to rotate around the first axis.

8. The crystal optical axis surface processing equipment according to any one of claims 1 to 4, characterized in that: The crystal optical axis surface processing equipment further comprises: a driving mechanism installed at the second installation position, and the stress detector is transmission-connected to the driving mechanism; Wherein, the driving mechanism is configured to: drive the stress detector to move so that the optical axis of the polarizer of the stress detector is coaxial with the crystal axis of the crystal rod.

9. The crystal optical axis surface processing equipment according to claim 8, characterized in that: The driving mechanism comprises: a driving screw, an adapter and a lifting bracket, wherein the driving screw is installed at the second installation position and is threadedly connected to the adapter, the lifting bracket is slidably connected to the adapter along the first direction, the stress detector is connected to the lifting bracket, and the extending direction of the driving screw is parallel to the extending direction of the second axis; Wherein, the driving screw is configured to: when rotating under the action of external force, drive the stress detector to move through the adapter and the lifting bracket.

10. A crystal optical axis surface processing system, characterized in that: include: An X-ray orientation instrument and a crystal optical axis surface processing device as described in any one of claims 1-9.

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