A low-ice-adhesion surface, its preparation method, and a low-ice-adhesion skin.

Abstract

This invention provides a low-ice adhesion surface, a preparation method, and a low-ice adhesion skin, relating to the field of aviation de-icing. The invention includes: a substrate having a coating surface; an adhesive layer disposed on the coating surface to form an adhesive surface; a microparticle layer comprising micron-sized particles distributed on the adhesive surface to form a rough surface; and a soft elastic layer covering the rough surface, wherein the surface of the soft elastic layer facing away from the microparticle layer is a flat surface; wherein the elastic modulus of the microparticle layer is greater than the elastic modulus of the soft elastic layer. Compared with existing technologies, this invention has the advantage of making ice layers easier to detach by combining the dual effects of heating and microstructure, and significantly reducing the energy consumption of aircraft during de-icing, thus improving the energy efficiency of aircraft.

Description

Technical Field

[0001] This invention relates to the field of surface anti-icing technology, and in particular to a low-ice-adhesion surface, its preparation method, and a low-ice-adhesion skin. Background Technology

[0002] During flight, aircraft encounter various weather conditions, one of the most challenging being icing. When an aircraft is flying at high altitudes, if it encounters supercooled water droplets (water below 0°C but not yet frozen), these droplets will rapidly freeze onto the aircraft's surface, especially in critical areas such as wings, propellers, and air intakes. Icing significantly increases the aircraft's weight, alters its aerodynamic characteristics, leading to reduced lift, increased drag, and potentially causing engine failure or inaccurate instrument readings. These factors severely impact aircraft handling and flight safety, increasing the risk of accidents.

[0003] To address icing issues, traditional de-icing systems are widely used in aviation, transportation, and power facilities, primarily including thermal de-icing, electrothermal de-icing, and mechanical de-icing. These systems actively remove ice through heating, purging, or mechanical vibration. However, these methods have a significant disadvantage: high energy consumption. During long-duration flights or in harsh environments, this leads to reduced aircraft energy efficiency. Summary of the Invention

[0004] To address the aforementioned issues, this application provides a low-ice-adhesion surface, a preparation method, and a low-ice-adhesion skin.

[0005] In a first aspect, this application provides a low-ice-adhesion surface, employing the following technical solution:

[0006] A low-ice-adhesion surface, comprising:

[0007] Substrate, having a coated surface;

[0008] An adhesive layer is provided on the coated surface to form an adhesive surface;

[0009] A microparticle layer, comprising micron-sized particles, is sprayed onto the adhesive surface to form a roughened surface; and,

[0010] A soft elastic layer is applied to the rough surface, and the surface of the soft elastic layer facing away from the microparticle layer is a flat surface.

[0011] The elastic modulus of the microparticle layer is greater than that of the soft elastic layer.

[0012] Preferably, the microparticle layer includes a thermally conductive curing layer and a particle arrangement layer, wherein the particle arrangement layer is formed by the micron particles arranged on the bonding surface;

[0013] The thermally conductive curing layer is disposed on the surface of the particle arrangement layer opposite to the substrate.

[0014] Preferably, the thickness of the thermally conductive curing layer is smaller than the particle size of the micron-sized particles;

[0015] And / or, thermally conductive nanoparticles are distributed within the thermally conductive curing layer;

[0016] And / or, the micron-sized particles are sprayed onto the bonding surface to form the particle arrangement layer;

[0017] And / or, the thermally conductive curing layer is sprayed onto the surface of the particle arrangement layer opposite to the substrate;

[0018] And / or, the soft elastic layer is coated and formed on the surface of the thermally conductive curing layer opposite to the microparticle layer.

[0019] Preferably, the microparticle layer has at least two layers, and the adhesive layer is provided between adjacent microparticle layers.

[0020] Preferably, among the micron particles in adjacent microparticle layers, the particle size of the micron particles in the microparticle layer closer to the substrate is smaller than the particle size of the micron particles in the microparticle layer farther from the substrate.

[0021] Preferably, the microparticle layer near the substrate has thermal conductivity;

[0022] And / or, the microparticle layer away from the substrate has heat-absorbing properties.

[0023] Secondly, this application provides a low-ice adhesion skin, which adopts the following technical solution:

[0024] A low-ice-adhesion skin, comprising the low-ice-adhesion surface described in the above technical solution.

[0025] Thirdly, this application provides a method for preparing a low-ice-adhesion surface, employing the following technical solution:

[0026] A method for preparing a low-ice-adhesion surface includes the following steps:

[0027] Forming an adhesive surface: Covering the substrate surface with an adhesive layer to form an adhesive surface;

[0028] Forming a rough surface: When the adhesive layer is wet, micron-sized particles are sprayed onto the adhesive surface. After the adhesive layer dries, a rough surface is formed.

[0029] A soft elastic layer is formed over the rough surface, and the surface of the soft elastic layer facing away from the rough surface is a flat surface.

[0030] Preferably, the micron-sized particles are sprayed onto the bonding surface using a gas-driven method.

[0031] Preferably, the soft elastic layer is formed on the rough surface by a scraping method;

[0032] And / or, after the adhesive layer dries, the rough surface is purged with gas.

[0033] The present invention has the following advantages and beneficial effects:

[0034] By creating a rough surface on the substrate (aircraft skin surface), covering it with a soft elastic layer, and ensuring the surface of the soft elastic layer facing away from the rough surface remains flat, this structural design effectively reduces the adhesion force of the ice layer to the soft elastic layer, making the ice layer easier to detach. The uneven microstructure of the rough surface can act as crack initiation points, promoting crack propagation between the ice layer and the soft elastic layer, thereby reducing the adhesion strength of the soft elastic layer and making the ice layer easier to detach.

[0035] This invention also offers the following advantages: the microparticle layer can transfer the heat generated by the aircraft's de-icing system to the soft elastic layer, causing a rapid temperature increase at the interface between the soft elastic layer and the ice layer, thereby further promoting ice removal. Furthermore, the microparticle layer possesses high toughness, preventing damage to low-adhesion surfaces from external impacts during de-icing. This solution effectively promotes ice removal during the de-icing process, significantly reducing the aircraft's de-icing energy consumption and improving its energy efficiency. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 This is a schematic diagram of the structure when the microparticle layer in the embodiment of this application has three layers.

[0038] Figure 2 This is a schematic diagram of the structure of this embodiment.

[0039] Figure 3 This is a schematic diagram of the preparation process in an embodiment of this application.

[0040] The diagram is marked as follows:

[0041] 100, Substrate; 110, Coated Surface; 200, Adhesive Layer; 210, Adhesive Surface; 300, Microparticle Layer; 310, Rough Surface; 320, Thermally Conductive Curing Layer; 330, Particle Arrangement Layer; 400, Soft Elastic Layer. Detailed Implementation

[0042] To make the objectives, technical solutions, and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other implementations obtained by those of ordinary skill in the art without inventive effort are within the scope of protection of the present invention.

[0043] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0044] The applicant discovered that existing technologies for de-icing aircraft surfaces by heating them require high energy consumption. The main reason is that during flight, the aircraft surface temperature is extremely low, thus requiring significant heat to melt the ice in contact with the surface. Only after the ice in contact with the aircraft surface melts can it separate from the surface and eventually detach. This process results in extremely high energy consumption during de-icing, which is detrimental to improving the aircraft's energy efficiency.

[0045] This application reduces de-icing energy consumption by optimizing the surface structure of an aircraft. Specifically, a rough surface is designed on the aircraft surface, and a soft elastic layer is applied over this rough surface, ensuring that the elastic modulus of the soft elastic layer is lower than that of the rough surface. This design creates a stress localization structure on the aircraft surface. Due to the uneven microstructure of the rough surface, the stress distribution on the surface of the soft elastic layer becomes uneven. The soft elastic layer in the raised parts of the rough surface generates greater stress, while the soft elastic layer in the recessed parts generates less stress. This uneven stress distribution helps to induce cracks between the soft elastic layer and the ice layer, accelerating the removal of the ice layer. Compared to traditional methods that rely solely on heating to remove the ice layer from the aircraft surface, this solution, by combining heating and the stress localization structure, makes the ice layer easier to remove and requires less energy during the removal process, thereby improving the energy efficiency of the aircraft.

[0046] The following combination Figures 1 to 3 The present application provides a detailed description of a low-ice adhesion surface, its preparation method, and a low-ice adhesion skin through specific embodiments and application scenarios.

[0047] The first aspect of this embodiment describes in detail a low-ice-adhesion surface.

[0048] Reference Figure 1 , Figure 2 This application provides a low-ice adhesion surface, comprising a substrate 100, an adhesive layer 200, a microparticle layer 300, and a soft elastic layer 400 sequentially disposed therefrom. The substrate 100 is capable of conducting heat; for example, the substrate 100 has high thermal conductivity. For example, the substrate 100 is the skin of an aircraft. In some embodiments, the substrate 100 is in contact with a heating device of the aircraft, i.e., the heating device of the aircraft generates heat and can transfer the generated heat to the substrate 100. In some embodiments, the outer wall of the substrate 100 is a coating surface 110, i.e., the side of the substrate 100 facing away from the interior of the aircraft is the coating surface 110.

[0049] In some embodiments, the adhesive layer 200 is disposed on the coating surface 110. The adhesive layer 200 has a certain adhesive force and can adhere to the coating surface 110 by its own adhesive force, so that the adhesive layer 200 can also firmly adhere to the coating surface 110 during flight. For example, the adhesive layer 200 can be formed by spraying an adhesive onto the coating surface 110. In some embodiments, the side of the adhesive layer 200 facing away from the coating surface 110 is the adhesive surface 210. The adhesive surface 210 has a certain adhesive force and can adhere the desired structure to the adhesive surface 210, so that the desired structure can remain outside the substrate 100 during flight.

[0050] In some embodiments, the microparticle layer 300 includes micron-sized particles, exemplarily defined as granular structures with a size measured in micrometers. It is understood that the surface of the micron-sized particles can be regular or irregular. Preferably, the micron-sized particles have an irregular surface, which makes the surface microstructure more uneven, forming a more complex gradient structure. Here, "irregular surface" refers to the irregular shape of the micron-sized particles. In some embodiments, the micron-sized particles are one or more of carbon micron-sized particles, iron oxide particles, aluminum nitride, and copper particles. The material of the micron-sized particles can be selected according to actual needs; this embodiment does not impose specific limitations on the material of the micron-sized particles.

[0051] Reference Figure 1 , Figure 2In some designs, micron-sized particles are distributed on the bonding surface 210 to form a rough surface 310. For example, the micron-sized particles are irregularly arranged or distributed on the bonding surface 210 to form a more complex microstructure with uneven surfaces. For instance, the micron-sized particles are adhered to the bonding surface 210 by spraying. Understandably, due to the inherent irregularity of the spraying process, the micron-sized particles will form an irregular distribution on the bonding surface 210, thereby increasing the non-uniformity of the microstructure. This non-uniformity makes the resulting stress distribution more uneven, which helps the ice layer to detach more easily. When the micron-sized particles are attached to the bonding surface 210, because the micron-sized particles lack adhesiveness, they can only adhere to the bonding layer 200, preventing the micron-sized particles from being laminated. Therefore, the micron-sized particles adhered to the bonding layer are only one layer, meaning the thickness of the micron-sized particles adhered to the bonding layer is approximately the same as the particle size.

[0052] Understandably, when micron-sized particles are arranged on the bonding surface 210, gaps are formed between them, causing the areas covered with micron-sized particles to appear raised, while the gap areas appear recessed. By spraying micron-sized particles, these gaps are less likely to be blocked by excess particles, thus forming a well-defined uneven microstructure. This uneven microstructure helps to generate unevenly distributed stress, making it easier for the ice layer to detach. Understandably, compared with existing technologies that generate uneven microstructures through etching, 3D printing, etc., the spraying method used in this solution can produce a more uneven microstructure while having lower manufacturing costs and significantly improved manufacturing efficiency. In addition, due to the irregular surface of the micron-sized particles themselves and the uneven force on the micron-sized particles during the spraying process, their embedding depth on the bonding surface 210 is inconsistent, resulting in a microstructure with very good unevenness. In contrast, the etching or 3D printing methods used in existing technologies usually produce more uniform microstructures, which leads to weaker stress distribution unevenness, higher costs, and is not conducive to the detachment of the ice layer.

[0053] Reference Figure 1 , Figure 2In some embodiments, the soft elastic layer 400 covers the rough surface 310, and the surface of the soft elastic layer 400 facing away from the microparticle layer 300 is a smooth surface. The smooth surface of the soft elastic layer 400 facing away from the microparticle layer 300 means that the side of the soft elastic layer 400 facing away from the interior of the aircraft is smooth. It can be understood that the side of the soft elastic layer 400 facing away from the interior of the aircraft is the outermost side of the aircraft, meaning that ice on the aircraft will adhere to the surface of the soft elastic layer 400. A smooth surface means that the side of the soft elastic layer 400 facing away from the aircraft does not have uneven microstructures. It can be understood that the smooth surface of the soft elastic layer 400 can reduce the adhesion of the ice layer, making it easier for the ice layer to detach from the soft elastic layer 400. For example, the soft elastic layer 400 includes a polydimethylsiloxane layer or a transparent resin layer. The polydimethylsiloxane layer facilitates the entry of light into the microparticle layer 300, which is beneficial for the microparticles to absorb sunlight and raise their temperature. When the temperature of the microparticles rises, the heat will be transferred to the soft elastic layer 400, which helps to separate the ice layer from the soft elastic layer 400 and reduce the energy consumption during the aircraft de-icing process.

[0054] In some designs, the elastic modulus of the microparticle layer 300 is greater than that of the soft elastic layer 400. This greater elastic modulus of the microparticle layer 300 contributes to the generation of uneven stress on the smooth surface of the soft elastic layer 400, making it easier for the ice layer to detach.

[0055] Reference Figure 1 , Figure 2 According to an optional embodiment, the microparticle layer 300 includes a thermally conductive curing layer 320 and a particle arrangement layer 330. The particle arrangement layer 330 is formed by arranging micron-sized particles on the bonding surface 210, and the thermally conductive curing layer 320 is disposed on the surface of the particle arrangement layer 330 facing away from the substrate 100. It is understood that the micron-sized particles have irregular shapes, and they only adhere to the bonding layer 200. Therefore, after being arranged on the bonding surface 210, some particles may have weak adhesion to the bonding layer 200 and be prone to detachment. To solve this problem, a thermally conductive curing layer 320 can be formed on the particle arrangement layer 330. The thermally conductive curing layer 320 can cure and adhere the particle arrangement layer 330, making it a whole, thereby enhancing the stability of the particle arrangement layer 330 and making it less prone to detachment of the micron-sized particles. For example, a particle arrangement layer 330 is sprayed onto the bonding surface 210, and a thermally conductive curing layer 320 is sprayed onto the particle arrangement layer 330 on the side away from the bonding surface 210.

[0056] For example, the thermally conductive curing layer 320 includes a resin layer, such as a polyurethane resin layer. The polyurethane resin can provide good elastic support and adhesion, so that the micron particles are tightly bonded to the adhesive layer 200, thereby reducing the possibility of the particles falling off the adhesive layer 200.

[0057] According to an optional embodiment, the thickness of the thermally conductive curing layer 320 is smaller than the particle size of the micron-sized particles. This avoids the situation where a thicker thermally conductive curing layer 320 would fill in the uneven microstructure formed by the micron-sized particles. That is, after the thermally conductive curing layer 320 is provided on the particle arrangement layer 330, the side of the thermally conductive curing layer 320 facing away from the particle arrangement layer 330 is an uneven, rough surface 310.

[0058] Reference Figure 1 , Figure 2 According to an optional embodiment, thermally conductive nanoparticles are distributed within the thermally conductive curing layer 320. These nanoparticles improve the thermal conductivity of the thermally conductive curing layer 320, making it easier for heat to be transferred to the soft elastic layer 400, thereby accelerating the detachment of the ice layer from the soft elastic layer 400. Exemplarily, the thermally conductive nanoparticles are carbon nanotubes, graphene, alumina, boron nitride, etc., and the particle size is in the nanometer range. It is understood that the thermally conductive nanoparticles can be added to the polyurethane resin layer, and these nanoparticles can be uniformly distributed within the thermally conductive curing layer 320 using stirring and ultrasonic dispersion techniques. Exemplarily, the volume of the added thermally conductive nanoparticles accounts for 5% of the total volume of the polyurethane resin layer. Adding too many thermally conductive nanoparticles may cause them to clump together, affecting the overall performance of the thermally conductive curing layer 320. Therefore, the amount of added thermally conductive nanoparticles is controlled to improve the thermal conductivity of the thermally conductive curing layer 320 while maintaining its performance essentially unchanged.

[0059] Reference Figure 1 , Figure 2 According to an optional embodiment, micron-sized particles are sprayed onto the adhesive surface 210 to form a particle arrangement layer 330. The uneven microstructure formed by the spraying method has higher irregularity, which is beneficial for generating uneven stress distribution on the soft elastic layer 400. Exemplarily, the micron-sized particles are driven by gas to fly onto the adhesive layer 200 and adhere to it. Using a gas-driven method can achieve more efficient adhesion of micron-sized particles. The airflow can also blow off micron-sized particles with insufficient adhesion, thereby making the formed particle arrangement layer 330 more stable. In addition, the airflow can also accelerate the drying process of the adhesive layer 200, allowing it to cure the micron-sized particles on the surface of the substrate 100 more quickly, thereby improving production efficiency.

[0060] According to an optional embodiment, the soft elastic layer 400 is coated and formed on the surface of the thermally conductive curing layer 320 opposite to the microparticle layer 300. This coating method allows the soft elastic layer 400 to effectively cover the uneven microstructure of the rough surface 310, helping to form a smooth surface on the side of the soft elastic layer 400 opposite to the microparticle layer 300.

[0061] According to an optional embodiment, the microparticle layer 300 is provided with at least two layers, and an adhesive layer 200 is provided between adjacent microparticle layers 300. The multi-layered microparticle structure can form a more complex and uneven microstructure, which helps to generate uneven stress on the soft elastic layer 400, making it easier for the ice layer to detach. In some embodiments, the previous microparticle layer 300 is required to solidify before each layer is sprayed. For example, the first microparticle layer 300 needs to solidify before the second layer is sprayed, and the second microparticle layer 300 needs to solidify before the third layer is sprayed. This improves coating quality, ensures stronger adhesion between layers, thereby improving the overall integrity and durability of the coating. It also avoids problems such as plastic deformation, cracking, or peeling caused by incomplete drying of the coating. Furthermore, it enhances the protective effect; the multi-layered cured coating can form a thicker and more uniform protective layer, better resisting damage from external impacts, abrasion, corrosion, etc.

[0062] In some embodiments, in order to accelerate the solidification or curing of the microparticle layer 300, the sprayed microparticle layer 300 can be placed in a space at 100 degrees Celsius for about 5 hours to cure.

[0063] Reference Figure 1 , Figure 2 In some embodiments, after the first microparticle layer 300 is formed, the amount of the second microparticle layer 300 needs to be adjusted according to the roughness of the first microparticle layer 300. For example, when the surface roughness of the first microparticle layer 300 is too high, the amount of micron-sized particles in the second microparticle layer 300 can be reduced, thereby reducing the roughness. It is understood that when the surface roughness of the first microparticle layer 300 is too low, the amount of micron-sized particles in the second microparticle layer 300 can be increased. It is understood that when there are three or more layers of micron-sized particles, this process continues, dynamically adjusting the content of micron-sized particles in the next microparticle layer 300 to be sprayed based on the roughness of the previous layer 300. This dynamic adjustment helps improve the smoothness of the surface formed by multiple sprayings, ensuring that the thickness of the sprayed surface remains basically consistent throughout, and avoiding localized areas of excessive thickness or thinness.

[0064] According to an optional embodiment, the micron particles in adjacent microparticle layers 300 have different particle sizes. The particle size of the micron particles in the microparticle layer 300 closer to the substrate 100 is smaller than the particle size of the micron particles in the microparticle layer 300 farther from the substrate 100. That is, the particle size of the micron particles in different microparticle layers 300 is different, and the particle size of the micron particles farther away from the substrate 100 is larger.

[0065] Reference Figure 1 , Figure 2For example, the microparticle layer 300 is provided with three layers. First, a first microparticle layer 300 is formed on the substrate 100; then, an adhesive layer 200 is coated on the first microparticle layer 300, and a second microparticle layer 300 is formed on the adhesive layer 200; then, an adhesive layer 200 is coated again on the second microparticle layer 300, and a third microparticle layer 300 is formed thereon; finally, a soft elastic layer 400 is coated on the third microparticle layer 300. This multi-layer design allows for the construction of more complex and non-uniform microstructures. It is understood that the micron-sized particles in the first microparticle layer 300 are smaller than the micron-sized particles in the second microparticle layer 300, and the micron-sized particles in the second microparticle layer 300 are smaller than the micron-sized particles in the third microparticle layer 300.

[0066] In some embodiments, the total volume ratio of the micron-sized particles in the first microparticle layer 300, the second microparticle layer 300, and the third microparticle layer is 3:2:1. It is understood that by first spraying a microparticle layer 300 with smaller particle sizes and then spraying a layer with larger particle sizes, the uneven microstructures in the first-sprayed microparticle layer 300 can be exposed, thereby forming a gradient structure. Exemplarily, because the micron-sized particles in the later-sprayed microparticle layer 300 are larger, the gaps between adjacent micron-sized particles are larger. These larger gaps can accommodate the uneven microstructures formed by the smaller micron-sized particles in the first-sprayed microparticle layer 300, thereby enhancing the gradient difference of the overall uneven microstructure.

[0067] In some embodiments, the micron particles in the first microparticle layer 300 have a particle size of [8, 15] micrometers, the micron particles in the second microparticle layer 300 have a particle size of [40, 55] micrometers, and the micron particles in the third microparticle layer 300 have a particle size of [130, 155] micrometers.

[0068] In some embodiments, the thickness of the first microparticle layer 300 is 10-20 micrometers, the thickness of the second microparticle layer 300 is 50-60 micrometers, and the thickness of the third microparticle layer 300 is 150-160 micrometers.

[0069] exist Figure 2 In the second microparticle layer 300, some microparticles from the first microparticle layer 300 are exposed between the microparticles. Similarly, in the third microparticle layer 300, some microparticles from both the first and second microparticle layers 300 are exposed between the microparticles. This multi-layered microparticle layer 300 design creates a rough surface with varying roughness gradients, resulting in a more complex microstructure with uneven surfaces. This leads to a more uneven surface stress distribution in the soft elastic layer 400, making it easier for the ice layer to detach.

[0070] It is understandable that during the spraying of the thermally conductive curing layer 320, due to its certain fluidity, the sprayed thermally conductive curing layer 320 will flow towards the bottom of the micron-sized particles, thus forming a layer like... Figure 2 The structure is shown. The thermally conductive curing layer 320 is thinner in the upper middle part of the micron-sized particles, while it accumulates at the bottom. After curing, the thermally conductive curing layer 320 at the bottom provides better support and fixation for the micron-sized particles, making the resulting rough surface 310 more stable. This, in turn, endows the microparticle layer 300 with higher toughness, effectively preventing damage from external impacts.

[0071] According to an optional embodiment, the microparticle layer 300 near the substrate 100 is thermally conductive. This facilitates the transfer of heat from the substrate 100 to the flexible layer 400, preventing heat from being blocked by at least two microparticle layers 300 and thus unable to be effectively transferred to the flexible layer 400. Exemplarily, the thermally conductive curing layer 320 and / or the microparticles in the microparticle layer 300 near the substrate 100 are thermally conductive. For example, these microparticles are aluminum nitride or copper particles, etc.

[0072] According to an optional embodiment, the microparticle layer 300 away from the substrate 100 is heat-absorbing. The microparticle layer 300 away from the substrate 100 refers to the microparticle layer 300 furthest from the substrate 100. Exemplarily, when the microparticle layer 300 has three layers, the microparticle layer 300 away from the substrate 100 is the third microparticle layer 300. It is understood that when the microparticle layer 300 has multiple layers, the microparticle layer 300 away from the substrate 100 refers to the last microparticle layer 300, and the last microparticle layer 300 refers to the last microparticle layer 300 formed by spraying. In some embodiments, the thermally conductive curing layer 320 in the microparticle layer 300 away from the substrate 100 is heat-absorbing, and / or the micron-sized particles are heat-absorbing.

[0073] The second aspect of this embodiment provides a detailed description of a low-ice adhesion skin.

[0074] A low-ice-adhesion skin includes the low-ice-adhesion surface described in the above embodiments. This gives the skin the beneficial effects of the aforementioned low-ice-adhesion surface, which will not be elaborated further here. The skin referred to in this application refers to the skin of an aircraft.

[0075] The third aspect of this embodiment provides a detailed description of a method for preparing a low-ice-adhesion surface.

[0076] Reference Figure 3 A method for preparing a low-ice-adhesion surface includes the following steps:

[0077] S10, Forming adhesive surface 210: An adhesive layer 200 is covered on the surface of the substrate 100 to form adhesive surface 210.

[0078] It is understood that coating or spraying a material with adhesive properties onto the surface of the substrate 100 can form an adhesive layer. For example, the adhesive layer 200 may be formed by spraying an adhesive.

[0079] S20, Forming a rough surface 310: When the adhesive layer 200 is in a wet state, micron-sized particles are sprayed onto the adhesive surface 210. After the adhesive layer 200 dries, a rough surface 310 is formed.

[0080] It is understood that the adhesive layer 200 being in a wet state means that the adhesive layer 200 is not cured or solidified. For example, the adhesive layer 200 is an adhesive sprayed onto the surface of the substrate 100. While the adhesive is not cured or solidified, micron-sized particles are sprayed onto the adhesive layer 200 so that the micron-sized particles impact the adhesive layer 200 and are then adhered to it by the adhesive layer 200.

[0081] S30. A soft elastic layer 400 is formed over the rough surface 310, and the surface of the soft elastic layer 400 facing away from the rough surface 310 is a flat surface.

[0082] For example, a soft elastic layer 400 is scraped onto the rough surface 310, so that the soft elastic layer 400 fills the uneven microstructure of the rough surface 310 and makes the surface of the soft elastic layer 400 facing away from the rough surface 310 a flat surface.

[0083] In some embodiments, step S20 further includes the following step:

[0084] S21. After the adhesive layer 200 dries, the micron-sized particles are cured with the adhesive layer 200 to form a particle arrangement layer 330.

[0085] S22. A thermally conductive curing layer 320 is sprayed on the side of the particle arrangement layer 330 away from the adhesive layer 200. After the thermally conductive curing layer 320 is cured, a rough surface 310 is formed.

[0086] For example, the thermally conductive curing layer 320 can be formed by resin spraying, such as by spraying polyurethane resin onto the particle arrangement layer 330.

[0087] In some embodiments, if the microparticle layer 300 has at least two layers, steps S20, S21 and S22 are repeated until the required number of microparticle layers 300 are formed, and then step S30 is performed.

[0088] According to an optional embodiment, the micron-sized particles are sprayed onto the bonding surface 210 using a gas-driven method.

[0089] Understandably, the micron-sized particles are sprayed onto the adhesive layer 200 using a spraying device that uses gas as the driving force to propel the micron-sized particles onto the adhesive layer 200. For example, the gas can be a dry, clean gas such as nitrogen.

[0090] According to an optional embodiment, the soft elastic layer 400 is formed on the rough surface 310 by a scraping method.

[0091] A relatively smooth surface can be formed by scraping, while effectively filling the uneven microstructure formed by the micro-particle layer 300, thereby improving the surface strength of the skin.

[0092] According to an optional embodiment, after the adhesive layer 200 dries, the rough surface 310 is purged with gas.

[0093] Some micron-sized particles may not have a strong bond with the adhesive layer 200. Therefore, by blowing away the particle distribution layer 330 with gas, the particles with weaker adhesion can be blown off, thereby improving the stability of the rough surface 310.

[0094] The above description is only a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with this technical field can easily think of changes or replacements within the technical scope disclosed by the present invention, which should be covered by the scope of protection of the present invention.

Claims

1. A low-ice-adhesion surface, characterized in that, include: The substrate (100) has a coated surface (110); An adhesive layer (200) is provided on the coating surface (110) to form an adhesive surface (210); A microparticle layer (300) comprising micron-sized particles, the micron-sized particles being sprayed onto the adhesive surface (210) to form a rough surface (310); as well as A soft elastic layer (400) covers the rough surface (310), and the surface of the soft elastic layer (400) facing away from the microparticle layer (300) is a flat surface; the flat surface means that the side of the soft elastic layer (400) facing away from the substrate has no uneven microstructure. The elastic modulus of the microparticle layer (300) is greater than that of the soft elastic layer (400). The microparticle layer (300) is provided with at least two layers, and the adhesive layer (200) is provided between adjacent microparticle layers (300); Among the micron particles in adjacent microparticle layers (300), the micron particles in the microparticle layer (300) closer to the substrate (100) have a smaller particle size than the micron particles in the microparticle layer (300) farther from the substrate (100).

2. The low-ice adhesion surface according to claim 1, characterized in that, The microparticle layer (300) includes a thermally conductive curing layer (320) and a particle arrangement layer (330), wherein the particle arrangement layer (330) is formed by the micron particles arranged on the adhesive surface (210); The thermally conductive curing layer (320) is disposed on the surface of the particle arrangement layer (330) opposite to the substrate (100).

3. A low-ice adhesion surface according to claim 2, characterized in that, The thickness of the thermally conductive curing layer (320) is smaller than the particle size of the micron-sized particles; And / or, thermally conductive nanoparticles are distributed within the thermally conductive curing layer (320); And / or, the micron particles are sprayed onto the adhesive surface (210) to form the particle arrangement layer (330); And / or, the thermally conductive curing layer (320) is sprayed onto the surface of the particle arrangement layer (330) opposite to the substrate (100); And / or, the soft elastic layer (400) is coated on the surface of the thermally conductive curing layer (320) opposite to the microparticle layer (300).

4. A low-ice adhesion surface according to any one of claims 1-3, characterized in that, The microparticle layer (300) near the substrate (100) is thermally conductive; And / or, the microparticle layer (300) away from the substrate (100) has heat absorption properties.

5. A low-ice adhesion skin, characterized in that, Includes the low ice adhesion surface as described in any one of claims 1-4.

6. A method for preparing a low-ice-adhesion surface, characterized in that, The preparation of a low-ice-adhesion surface according to any one of claims 1 to 4 includes the following steps: Forming an adhesive surface (210): An adhesive layer (200) is applied to the surface of the substrate (100) to form an adhesive surface (210); Forming a rough surface (310): When the adhesive layer (200) is in a wet state, micron-sized particles are sprayed onto the adhesive surface (210). After the adhesive layer (200) dries, a rough surface (310) is formed. A soft elastic layer (400) is formed over the rough surface (310), and the surface of the soft elastic layer (400) facing away from the rough surface (310) is a flat surface.

7. The method for preparing a low-ice-adhesion surface according to claim 6, characterized in that, The micron-sized particles are sprayed onto the bonding surface (210) using a gas-driven method.

8. The method for preparing a low-ice-adhesion surface according to claim 7, characterized in that, The soft elastic layer (400) is formed on the rough surface (310) by a scraping method; And / or, after the adhesive layer (200) is dried, the rough surface (310) is purged with gas.

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