An optical module

Abstract

The present disclosure provides an optical module, wherein a first differential output pin of a laser drive chip is connected with a first optical transmitting chip, and a second differential signal pin of the laser drive chip is connected with a second optical transmitting chip. A first temperature regulator is in heat conduction connection with the first optical transmitting chip and the second optical transmitting chip, and is used for adjusting the working temperature of the first optical transmitting chip and the second optical transmitting chip. A micro control unit controls the power supply current of the first temperature regulator, so as to realize the temperature adjustment of the first temperature regulator and change the tuning wavelength of the first optical transmitting chip and the second optical transmitting chip. The present disclosure adopts one laser drive chip to be connected with the modulation end of two optical transmitting chips, reduces the electronic devices, and is helpful for the miniaturization of the circuit board. Moreover, the scheme of adopting two optical transmitting chips only needs to adjust the temperature difference of the optical transmitting chips to be 8℃, so as to realize the 4-wavelength tunable, and reduces the power consumption of the temperature regulator.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of communication, in particular to an optical module. BACKGROUND

[0002] In new business models and application models such as cloud computing, mobile Internet, video, optical communication technology will be used. In optical communication, optical modules are tools for converting optical and electrical signals, and are one of the key devices in optical communication equipment. With the rapid development of 5G networks, optical modules, which are at the core of optical communication, have made great progress. SUMMARY

[0003] The present application provides an optical module to reduce the space occupied by the optical module and improve device utilization.

[0004] To solve the above technical problems, the present application discloses the following technical scheme:

[0005] The present application discloses an optical module, comprising:

[0006] A laser drive chip has a first differential output pin and a second differential output pin;

[0007] A first optical transmitting chip is connected to the first differential output pin;

[0008] A second optical transmitting chip is connected to the second differential output pin;

[0009] A first temperature regulator is thermally connected to the first optical transmitting chip and the second optical transmitting chip to adjust the wavelength of the first optical transmitting chip and the second optical transmitting chip; and

[0010] A micro control unit is electrically connected to the first temperature regulator;

[0011] The first optical transmitting chip has a first power supply pin, a first modulation pin and a first ground pin, the first ground pin is electrically connected to a ground line, the first modulation pin is connected to the first differential output pin, and the first power supply pin is connected to a power supply circuit;

[0012] The micro control unit controls the working temperature of the first temperature regulator to adjust the wavelength of the first optical transmitting chip and the second optical transmitting chip.

[0013] Compared with the prior art, the present application has the following advantages:

[0014] The optical module comprises a first optical transmitting chip, a second optical transmitting chip, a first temperature regulator, a laser drive chip and a micro control unit. The first differential output pin of the laser drive chip is connected with the first optical transmitting chip, and the second differential signal pin of the laser drive chip is connected with the second optical transmitting chip. The first temperature regulator is in heat conduction connection with the first optical transmitting chip and the second optical transmitting chip, and is used for adjusting the working temperature of the first optical transmitting chip and the second optical transmitting chip. The micro control unit is in electrical connection with the first temperature regulator, and is used for controlling the power supply current of the first temperature regulator to realize temperature adjustment of the first temperature regulator. The micro control unit changes the temperature of the first optical transmitting chip and the temperature of the second optical transmitting chip by adjusting the temperature of the first temperature regulator, and changes the tuning wavelength of the first optical transmitting chip and the second optical transmitting chip. For the optical transmitting chip, different temperatures correspond to different wavelengths of signal light. The present disclosure adopts one laser drive chip connected with the modulation end of two optical transmitting chips, reduces electronic devices, and helps miniaturization of the circuit board. Moreover, the scheme of adopting double optical transmitting chips only needs to adjust the temperature difference of the optical transmitting chips to 8℃, and can realize 4-wavelength tuning, thereby reducing the power consumption of the temperature regulator. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the present disclosure, the following will briefly introduce the drawings needed to be used in some embodiments of the present disclosure. Obviously, the drawings described in the following description are only the drawings of some embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art according to these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams, and are not limited to the actual size, actual process, actual time sequence, etc. of the product involved in the embodiments of the present disclosure.

[0016] Figure 1 A local architecture diagram of an optical communication system according to some embodiments of the present application is provided.

[0017] Figure 2 A local structure diagram of a host computer according to some embodiments of the present application is provided.

[0018] Figure 3 A structure diagram of an optical module according to some embodiments of the present application is provided.

[0019] Figure 4 An exploded view of an optical module according to some embodiments of the present application is provided.

[0020] Figure 5 A structure schematic diagram of an optical transmitting part and an optical receiving part according to some embodiments of the present application is provided.

[0021] Figure 6An exploded structural diagram of a light emitting component and a light receiving component according to some embodiments of the present application;

[0022] Figure 7 A cross-sectional structural diagram of a light emitting component and a light receiving component according to some embodiments of the present application;

[0023] Figure 8 A structural diagram of a light emitting component according to some embodiments of the present application;

[0024] Figure 9 An exploded diagram of a light emitting component according to some embodiments of the present application;

[0025] Figure 10 An assembly diagram of a transmitting shell and a pin in a light module according to some embodiments of the present application;

[0026] Figure 11 A structure of a transmitting shell in a light module according to some embodiments of the present application Figure 1 ;

[0027] Figure 12 A partial diagram of a light emitting component according to some embodiments of the present application;

[0028] Figure 13 An optical path diagram of a light emitting component according to some embodiments of the present application Figure 1 ;

[0029] Figure 14 An optical path diagram of a light emitting component according to some embodiments of the present application Figure 2 ;

[0030] Figure 15 An optical path diagram of a light emitting component according to some embodiments of the present application Figure 3 ;

[0031] Figure 16 A circuit diagram of a light emitting component and a circuit board according to some embodiments of the present application Figure 1 ;

[0032] Figure 17 A circuit diagram of a light emitting component according to some embodiments of the present application;

[0033] Figure 18 A circuit diagram of another light emitting component according to some embodiments of the present application;

[0034] Figure 19 A circuit diagram of a light emitting component and a circuit board according to some embodiments of the present application Figure 2 ;

[0035] Figure 20 This is a circuit diagram of a third type of optical emitting component provided according to some embodiments of this application;

[0036] Figure 21 This is a schematic diagram of a light emitting component and circuit board provided according to some embodiments of this application. Figure 3 ;

[0037] Figure 22 This is a schematic diagram of a fourth type of optical emitting component circuit according to some embodiments of this application;

[0038] Figure 23 This is a schematic diagram of a light emitting component, a light receiving component, and a circuit board provided according to some embodiments of this application;

[0039] Figure 24 This is a circuit diagram of an optical emitting component and an optical receiving component according to some embodiments of this application;

[0040] Figure 25 This is a schematic diagram of the structure of an optical receiving component according to some embodiments of this application;

[0041] Figure 26 This is a cross-sectional schematic diagram of an optical receiving component provided according to some embodiments of this application;

[0042] Figure 27 This is a partial schematic diagram of an optical receiving component according to some embodiments of this application;

[0043] Figure 28 This is a partially exploded view of an optical receiving component according to some embodiments of this application. Figure 1 ;

[0044] Figure 29 This is a partially exploded view of an optical receiving component according to some embodiments of this application. Figure 2 . Detailed Implementation

[0045] Optical communication technology establishes information transmission between information processing devices. It loads information onto light and utilizes the propagation of light to transmit the information; the light carrying the information is called an optical signal. The propagation of optical signals within information transmission equipment reduces power loss, enabling high-speed, long-distance, and low-cost information transmission. Information processing devices can process information in the form of electrical signals. Common information processing devices include optical network terminals / gateways, routers, switches, mobile phones, computers, servers, tablets, and televisions, while optical fibers and waveguides are common information transmission devices.

[0046] The optical signal and the electrical signal between the information processing device and the information transmission device are converted by the optical module. For example, the optical fiber is connected to the optical signal input end and / or the optical signal output end of the optical module, and the optical network terminal is connected to the electrical signal input end and / or the electrical signal output end of the optical module. The first optical signal from the optical fiber is transmitted into the optical module, the optical module converts the first optical signal into the first electrical signal, and the optical module transmits the first electrical signal into the optical network terminal. The second electrical signal from the optical network terminal is transmitted into the optical module, the optical module converts the second electrical signal into the second optical signal, and the optical module transmits the second optical signal into the optical fiber. Since the information processing devices can be connected to each other through the electrical signal network, at least one type of information processing device needs to be directly connected to the optical module, and all types of information processing devices do not need to be directly connected to the optical module. The information processing device directly connected to the optical module is called the host computer of the optical module.

[0047] Figure 1 A partial architecture diagram of an optical communication system is provided according to some embodiments of the present application. As shown in the figure, the partial architecture of the optical communication system includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103. Figure 2

[0048] One end of the optical fiber 101 extends to the remote information processing device 1000, and the other end is connected to the optical interface of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can maintain the original optical power. The optical signal is totally reflected multiple times in the optical fiber 101, and the optical signal from the remote information processing device 1000 is transmitted into the optical module 200, or the optical signal from the optical module 200 is propagated to the remote information processing device 1000, realizing long-distance and low-power loss information transmission.

[0049] The number of optical fibers 101 can be one or more (two or more). The optical fiber 101 and the optical module 200 are connected in a plug-in manner, or they can be fixedly connected.

[0050] The host computer 100 has an optical module interface 102, which is configured to connect to the optical module 200, so that the host computer 100 and the optical module 200 establish a one-way / two-way electrical signal connection. The host computer 100 is configured to provide a data signal to the optical module 200, or receive a data signal from the optical module 200, or monitor and control the working state of the optical module 200.

[0051] ​The host computer 100 has external electrical interfaces, such as a Universal Serial Bus (USB) interface, a network interface 104, which can access an electrical signal network. For example, the network interface 104 is configured to access a network cable 103, so that the host computer 100 establishes a one-way / two-way electrical signal connection with the network cable 103.

[0052] An optical network unit (ONU), an optical line terminal (OLT), an optical network terminal (ONT), and a data center server are common host computers. One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100. The network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100.

[0053] For example, the third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal. The optical module 200 transmits the second optical signal to the optical fiber 101. The second optical signal propagates in the optical fiber 101 towards the remote information processing device 1000.

[0054] For example, the first optical signal from the remote information processing device 1000 propagates through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal. The host computer 100 transmits the fourth electrical signal to the local information processing device 2000.

[0055] The optical module is a tool for converting optical signals and electrical signals. In the conversion process of the optical signals and the electrical signals, the information does not change, and the encoding / decoding mode of the information can change.

[0056] Figure 2 A partial structure diagram of a host computer according to some embodiments of the present application is provided. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 3 Only the structure related to the optical module 200 and the host computer 100 is shown. For example, Figure 4As shown, the host computer 100 further comprises a PCB circuit board 105 arranged in the housing, a cage 106 arranged on the surface of the PCB circuit board 105, a heat sink 107 arranged on the cage 106, and an electrical connector (not shown in the figure) arranged inside the cage 106. The heat sink 107 has a protruding structure for increasing the heat dissipation area, and the fin-shaped structure is a common protruding structure.

[0057] The optical module 200 is inserted into the cage 106 of the host computer 100, and the optical module 200 is fixed by the cage 106. The heat generated by the optical module 200 is conducted to the cage 106, and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical interface of the optical module 200 is connected with the electrical connector inside the cage 106.

[0058] Figure 3 FIG. 1 is a structural diagram of an optical module according to some embodiments of the present application, Figure 4 FIG. 2 is an exploded view of an optical module according to some embodiments of the present application. As shown in Figure 3 and Figure 3 As shown, the optical module 200 comprises a housing, a circuit board 300 arranged in the housing, a light emitting component 400, and a light receiving component 500. However, the present application is not limited thereto, and in some embodiments, the optical module 200 comprises one of the light emitting component 400 and the light receiving component 500.

[0059] The housing comprises an upper housing 201 and a lower housing 202. The upper housing 201 is covered on the lower housing 202 to form the above-mentioned housing with two openings 204 and 205. The outer contour of the housing generally presents a square body.

[0060] In some embodiments, the lower housing 202 comprises a bottom plate 2021 and two lower side plates arranged on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021. The upper housing 201 comprises a cover plate, and the cover plate is covered on the two lower side plates of the lower housing 202 to form the above-mentioned housing.

[0061] In some embodiments, the lower housing 202 comprises a bottom plate and two lower side plates arranged on both sides of the bottom plate and perpendicular to the bottom plate. The upper housing 201 comprises a cover plate and two upper side plates arranged on both sides of the cover plate and perpendicular to the cover plate. The two upper side plates and the two lower side plates are combined to realize that the upper housing 201 is covered on the lower housing 202.

[0062] The direction of the line connecting the two openings 204 and 205 can be consistent with the length direction of the optical module 200, or can be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 (the right end of FIG. 1), and the opening 205 is also located at the end of the optical module 200 (the left end of FIG. 1). Figure 4 Figure 5 ​Or, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical interface, and the gold fingers 301 of the circuit board 300 extend from the electrical interface and are inserted into the electrical connector of the host computer; the opening 205 is an optical interface and is configured to access the optical fiber 101 so that the optical fiber 101 is connected to the optical transmitting component 400 and / or the optical receiving component 500 in the optical module 200.

[0063] The assembly of the upper shell 201 and the lower shell 202 facilitates the installation of the components such as the circuit board 300, the optical transmitting component 400, and the optical receiving component 500 into the shells, and the upper shell 201 and the lower shell 202 can protect the components from shape packaging. In addition, when the components such as the circuit board 300, the optical transmitting component 400, and the optical receiving component 500 are assembled, the positioning components, heat dissipation components, and electromagnetic shielding components of these devices can be easily arranged, which is conducive to the automatic implementation of production.

[0064] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which is conducive to electromagnetic shielding and heat dissipation.

[0065] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside the shell of the optical module 200. The unlocking component 600 is configured to achieve the fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0066] For example, the unlocking component 600 is located outside the two lower side plates 2022 of the lower shell 202 and includes a clamping component matched with the cage 106 of the host computer. When the optical module 200 is inserted into the cage 106, the clamping component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the clamping component of the unlocking component 600 moves, thereby changing the connection relationship between the clamping component and the host computer, so as to release the clamping and fixed connection between the optical module 200 and the host computer, and the optical module 200 can be pulled out of the cage 106.

[0067] The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected together according to circuit design through the circuit traces to realize power supply, electrical signal transmission, and grounding, etc. The electronic components may, for example, include capacitors, resistors, transistors, metal-oxide-semiconductor field-effect transistors (MOSFETs). The chips may, for example, include microcontroller units (MCUs), laser drive chips, transimpedance amplifiers (TIAs), limiting amplifiers, clock and data recovery chips (CDRs), power management chips, digital signal processing (DSP) chips.

[0068] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize a bearing function, such as the rigid circuit board can stably bear the above-mentioned electronic components and chips; the rigid circuit board is also convenient for being inserted into an electrical connector in the cage of the host computer.

[0069] The circuit board 300 also includes a gold finger 301 formed on the surface of the end thereof. The gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is in conduction with the electrical connector in the cage 106. The gold finger 301 can be provided only on the surface of one side of the circuit board 300 (for example, the upper surface as shown), or can be provided on the surfaces of both upper and lower sides of the circuit board 300 to provide more pins. The gold finger 301 is configured to establish electrical connection with the host computer to realize power supply, grounding, I2C signal transmission, data signal transmission, etc. Figure 6

[0070] Of course, flexible circuit boards are also used in some optical modules. The flexible circuit board is generally used in cooperation with the rigid circuit board to serve as a supplement to the rigid circuit board.

[0071] The light emitting component 400 and / or the light receiving component 500 are located on the side of the circuit board 300 away from the gold finger 301; in some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then are electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors, respectively; in some embodiments, the light emitting component and / or the light receiving component can be directly provided on the circuit board 300, and can be provided on the surface of the circuit board or on the side of the circuit board.

[0072] ​The optical transmitting part of the optical module in the ONU needs to be able to emit signal light of different wavelengths, but the optical module can only emit signal light of one wavelength at the same time (in the normal working state), and the above function is also called time-division light emission. The optical receiving part of the optical module in the ONU receives signal light of multiple different wavelengths, but only converts signal light of one wavelength into an electrical signal.

[0073] Figure 5 A schematic structural diagram of an optical transmitting part and an optical receiving part according to some embodiments of the present application. Figure 6 A schematic exploded structural diagram of an optical transmitting part and an optical receiving part according to some embodiments of the present application. As shown in Figure 7 and Figure 7 The optical transceiver assembly includes an optical transmitting part and an optical receiving part, and the optical module further includes a first housing 810 and a fiber adapter 700. In the embodiments of the present application, the optical transceiver assembly preferably connects the optical fiber through the fiber adapter, that is, the fiber adapter 700 is inlaid on the first housing 810 and used to connect the optical fiber. Specifically, the first housing 810 is provided with a third port 813 for inserting the fiber adapter 700, and the fiber adapter 700 is inlaid into the third port 813. The optical transmitting part 400 and the optical receiving part 500 establish optical connection with the fiber adapter respectively, and the light emitted and received in the optical transceiver assembly is transmitted through the same optical fiber in the fiber adapter, that is, the same optical fiber in the fiber adapter is the transmission channel for the light in and out of the optical transceiver assembly, and the optical transceiver assembly realizes a single-fiber bidirectional optical transmission mode.

[0074] The first housing 810 is used to carry the optical transmitting part and the optical receiving part. In the embodiments of the present application, the first housing is a round square tube made of metal material, which is beneficial to electromagnetic shielding and heat dissipation. The round square tube is provided with a first port 811, a second port 812 and a third port 813, and the first port 811 and the second port 812 are arranged on the adjacent side walls of the round square tube respectively.

[0075] The first port 811 is arranged on the side wall in the width direction of the round square tube, and the second port 812 is arranged on the side wall in the length direction of the first housing 810.

[0076] The optical receiving part 500 is inlaid into the first port 811, and the optical transmitting part 400 is in thermal contact with the first housing 810 through the first port 811; the optical transmitting part 400 is connected to the second port 812 through the connecting seat 820. The optical receiving part 500 is provided with a heat conduction block 540 outside, and the heat conduction block 540 is in thermal connection with the upper housing, which is convenient for heat dissipation of the optical receiving part 500.

[0077] The light emitting component 400 and the light receiving component 500 are directly press-fitted into the first shell 810, and the first shell 810 is in direct contact or contact through a heat-conducting medium with the light emitting component 400 and the light receiving component 500, respectively. In this way, the round-square tube body can be used for heat dissipation of the light emitting component 400 and the light receiving component 500, and the heat dissipation effect of the light emitting component 400 and the light receiving component 500 is ensured.

[0078] The first shell 810 can be a round-square tube body, or can be an internal hollow shell of other forms.

[0079] Figure 8 A cross-sectional view of a light emitting component and a light receiving component according to some embodiments of the present application is provided. As shown in the figure, the first shell 810 is provided with a first lens 815, which is located between the fiber adapter 700 and the light emitting component 400. The fiber adapter 700 includes a first optical signal and a second optical signal, wherein the first optical signal comes from the optical fiber and enters the optical transceiver assembly from the optical fiber. The first optical signal comes from the light emitting component and enters the optical fiber from the light emitting component. Figure 9

[0080] The first lens 815 has a semi-transparent and semi-reflective coating, and the first lens 815 reflects the first optical signal and transmits the second optical signal. That is, the first lens 815 reflects light from the fiber adapter towards the light emitting component, and transmits light in the opposite direction.

[0081] The first optical signal enters the optical transceiver assembly from the optical fiber, is reflected by the first lens 815, and enters the light receiving component towards the first nozzle. The first optical signal can include signal light of one wavelength, or signal light of two or more wavelengths. The light receiving component filters the first optical signal, and the light receiver of the light receiving component receives signal light of only one wavelength and converts the signal light into an electrical signal.

[0082] A plano-convex lens is provided between the fiber adapter 700 and the first lens 815, which collimates the first optical signal so that the first optical signal changes from a scattered light beam to a parallel light beam. At the same time, the plano-convex lens converges the second optical signal, and the converged second optical signal enters the fiber adapter 700. Alternatively, a plano-convex lens is provided inside the fiber adapter 700, so that the first optical signal changes from a scattered light beam to a parallel light beam. At the same time, the plano-convex lens converges the second optical signal, and the converged second optical signal enters the fiber adapter 700.

[0083] In some embodiments of the present application, in order to reduce the size of the first shell, a displacement prism 817 is further provided in the first shell. The displacement prism 817 is located between the first lens 815 and the light receiving component 500, and displaces the first optical signal reflected by the first lens 815 to the emission light window 415 of the light receiving component 500. ​

[0084] A connecting seat is provided between the light receiving component and the first housing 810. For example, one end of the connecting seat 820 is connected to the first housing 810, and the other end is connected to the second housing 411. The connecting seat 820 also communicates with a second port, thereby enabling communication between the first housing 810 and the second housing 411. In some embodiments, the cross-sectional area of ​​the connecting seat 820 is smaller than the area of ​​the outer wall of the first housing and smaller than the area of ​​one side of the second housing 411. This facilitates the connection between the second housing 411 and the first housing 810 while also ensuring the sealing effect of the second cavity 4110.

[0085] In some embodiments, the outer contour of the connector 820 is cylindrical. When the connector 820 is connected to the first housing 810 by laser welding, the cylindrical shape of the connector 820 facilitates the operation of the laser welding process, thereby facilitating the connection between the connector 820 and the first housing 810.

[0086] For example, a single optical module in an ONU can provide four transmission wavelengths, but at the same time, the optical module only emits a signal light of one wavelength.

[0087] Figure 8 This is a schematic diagram of the structure of a light emitting component according to some embodiments of this application. Figure 9 This is an exploded view of a light emitting component according to some embodiments of this application. Figure 9 and Figure 10 As shown, the light emitting component includes a second cavity 4110, which includes a second housing 411 and a second upper cover 412. An inner cavity is formed on the second housing 411, and the second upper cover 412 covers and connects to the second housing 411, forming a relatively sealed cavity structure with the second housing 411.

[0088] A connecting seat 820 is provided on the side of the second cavity 4110. The second cavity 4110 is connected to the first housing 810 through the connecting seat 820, so that the connection between the second cavity 4110 and the first housing 810 can be easily realized through the connecting seat 820.

[0089] like Figure 11 As shown, a fixing surface 4101 is provided on the top of the second housing 411, and the second upper cover 412 is fixedly connected to the fixing surface 4101; a first through hole 4103 is provided on the second housing 411, the first through hole 4103 communicates with the inner cavity of the second housing 411, and the first through hole 4103 communicates with the connecting seat 820, the first through hole 4103 communicates with the second pipe opening through the connecting seat 820, and the first through hole 4103 is used to output optical signals.

[0090] Figure 1 This is an assembly diagram of the transmitting housing and pins in an optical module according to some embodiments of the present disclosure.Figure 10 Structure of a transmitting housing in an optical module according to some embodiments of the present disclosure Figure 11 As shown in Figure 10 With Figure 12 The second housing 411 includes a bottom plate 4010, a first side plate 4011, a second side plate 4012, a third side plate 4013, and a fourth side plate 4014, the first side plate 4011, the second side plate 4012, the third side plate 4013, and the fourth side plate 4014 are connected with the bottom plate 4010, the first side plate 4011 and the third side plate 4013 are oppositely arranged, and the second side plate 4012 and the fourth side plate 4014 are oppositely arranged, so that the bottom plate 4010, the first side plate 4011, the second side plate 4012, the third side plate 4013, and the fourth side plate 4014 form a housing with an open top.

[0091] The third side plate 4013 is formed with a plurality of insertion holes 4016, the transmitting pins 413 are inserted into the second housing 411 through the insertion holes 4016, and the transmitting pins 413 and the insertion holes 4016 are sealingly connected through the insulating pieces 4017 to achieve the sealing connection between the transmitting pins 413 and the second housing 411.

[0092] In some embodiments, since the glass PIN package is the lowest cost package form in optical devices, the insulating piece 4017 is a glass piece, and the transmitting pins 413 and the second housing 411 are sealingly connected through the glass.

[0093] In some embodiments, in order to avoid signal crosstalk, the spacing between adjacent insertion holes 4016 needs to be greater than 0.2mm, when the optical transmitting assembly includes a plurality of laser groups, a plurality of laser chips need to be connected to a plurality of transmitting pins 413, and the number of insertion holes 4016 on the third side plate 4013 of the second housing 411 is large. In order to ensure the spacing between adjacent insertion holes 4016, the inner side surface of the third side plate 4013 is arranged in a stepped manner, that is, the inner side surface of the third side plate 4013 includes a first surface and a second surface, the second surface can protrude from the first surface, so that the distance between the second surface and the first side plate 4011 is less than the distance between the first surface and the first side plate 4011, and the first surface and the second surface are respectively formed with insertion holes 4016, so as to increase the spacing between adjacent insertion holes 4016, and to arrange more insertion holes 4016 on the third side plate 4013.

[0094] After inserting the transmitting pins 413 into the second housing 411 through the insertion holes 4016, the transmitting pins 413 are connected to the laser groups in the second housing 411 through wire bonding, and the signals transmitted by the transmitting pins 413 drive the laser groups to generate signal light.

[0095] In some embodiments, the transmitting pins 413 include a high-speed pin group and a low-speed pin group, the high-speed pin group is located below the low-speed pin group. The high-speed pin group provides high-speed signals for the laser group in the second shell 411, and the low-speed signal group provides low-frequency power supply for the laser group. The high-speed pin group is at the same height as the laser, reducing the length of the wire bonding between the high-speed pin group and the laser, and reducing signal loss.

[0096] In some embodiments, a first through hole 4103 is formed on the first side plate 4011, the first through hole 4103 penetrates the first side plate 4011 to communicate with the inner cavity of the second shell 411, and the signal light generated by the laser group is emitted out of the second shell 411 through the first through hole 4103.

[0097] In some embodiments, the light emitting component 400 further includes a transmitting light window 415, the transmitting light window 415 is used for transmitting the transmitting light signal and sealing the light transmission hole on the second shell 411. For example, the transmitting light window 415 is embedded in the first through hole 4103, and the transmitting light window 415 is used for relatively sealing the first through hole 4103, which can make the transmitting light signal pass through and seal the first through hole 4103, so as to ensure the sealing performance of the second shell 411. In some embodiments, the transmitting light window 415 is transparent glass.

[0098] In some embodiments, the transmitting light window 415 can be obliquely arranged in the first through hole 4103. By arranging the transmitting light window 415 and the first through hole 4103 in different axes, the transmitting light signal reflected by the transmitting light window 415 can be reduced to return to the transmission light path of the transmitting light signal, and the reflected light can avoid affecting the light emitting performance of the laser group.

[0099] In some embodiments, the light emitting component includes at least one laser group, and the laser group is connected with the corresponding transmitting pin 413 through wire bonding. The transmitting pin 413 transmits electrical signals and data signals to the laser chip to drive the laser chip to generate signal light.

[0100] Referring to Figure 12 , the transmitting pin 413 includes a high-speed signal transmitting pin 4130, a ground transmitting pin 4131 and a power supply transmitting pin 4132. When the laser group in the second shell 411 is connected with the transmitting pin 413 inserted into the socket 4016 through wire bonding, the laser chip is connected with the high-speed signal transmitting pin 4130, the power supply transmitting pin 4132 and the ground transmitting pin 4131 through wire bonding. The power supply transmitting pin 4132 supplies power to the laser chip to make the laser chip generate light. The data signal transmitted by the high-speed signal transmitting pin 4130 modulates the light generated by the laser chip. In this way, the laser chip generates modulated light signals under the action of electrical signals and data signals.

[0101] In some embodiments, the other end of the second housing 411 is provided with a transmitting pin 413, which is used to realize the electrical connection between the electrical device in the second cavity 4110 and the circuit board 300. For example, the transmitting pin 413 is embedded in the other end of the second housing 411, one end of the circuit board 300 is inserted into the second housing 411, and the other end of the transmitting pin 413 is located outside the second housing 411. The transmitting pin 413 is electrically connected to the circuit board 300 through a flexible circuit board. The transmitting pin 413 can also be welded to the circuit board 300.

[0102] Figure 13 A partial schematic view of a light emitting component according to some embodiments of the present application is shown. As shown, the second housing is internally provided with a light emitting assembly and a beam combiner. The light emitting assembly includes a semiconductor refrigerator, a light emitting chip, and a beam combiner. Figure 1

[0103] In some embodiments, the light emitting component includes a beam combiner 416, a first light emitting chip 410, and a second light emitting chip 420. The first light emitting chip 410 is used to emit first and second wavelength signal lights, and the second light emitting chip 420 is used to emit third and fourth wavelength signal lights.

[0104] The beam combiner 416 combines the lights emitted by the first light emitting chip 410 and the second light emitting chip 420 into one beam. For example, the beam combiner can be a polarization beam combining assembly, which changes the polarization direction of the signal lights of the second light emitting chip 420 and the first light emitting chip 410, and combines the lights emitted by the first light emitting chip and the second light emitting chip into one beam.

[0105] After the signal light emitted by the first light emitting chip 410 passes through the polarization beam combining assembly, it enters the fiber adapter through the first housing. After the signal light emitted by the second light emitting chip changes the polarization direction through the polarization beam combining assembly, it is emitted towards the fiber adapter.

[0106] ​For example, the polarization beam combiner includes a polarizing waveplate and a polarizing beam combiner mirror, with the polarizing waveplate located between the second light emitting chip and the polarizing beam combiner mirror. The polarization beam combiner includes a second isolator 4161 and a third isolator 4162, wherein the second isolator 4161 is located in the light output path of the first light emitting chip 410, and the third isolator 4162 is located in the light output path of the second light emitting chip 420. The first polarizing waveplate 41611 is provided on the light output side of the second isolator 4161, and the second polarizing waveplate 41621 is provided on the light output side of the third isolator 4162. In some examples, the signal light emitted by the first light emitting chip is parallel to the circuit board direction, and this signal light is deflected by 45° after passing through the second isolator 4161. The signal light emitted by the second light emitting chip is parallel to the circuit board direction, and this signal light is deflected by 45° after passing through the third isolator. To facilitate beam combining, the deflection angle of the signal light emitted by the first optical emitting chip through the first polarizing plate is 90° different from the deflection angle of the signal light emitted by the second optical emitting chip through the second polarizing plate.

[0107] In some embodiments of this application, in order to make the optical axes of the first light emitting chip, the second light emitting chip and the polarization beam combining assembly lie in the same plane, a beam combining substrate 4165 is provided below the polarization beam combining assembly.

[0108] A beam-combining platform is provided between the beam-combining substrate 4165 and the beam combiner, providing a flat plane with high flatness for the beam combiner, the second isolator, and the third isolator, thereby improving the optical coupling accuracy. The cross-sectional area of ​​the beam-combining platform is larger than the area of ​​the beam-combining substrate 4165, and the beam-combining platform provides installation space for the beam combiner, the second isolator, and the third isolator.

[0109] To facilitate installation, a connecting part 4163 is provided between the second isolator 4161 and the third isolator 4162. One end of the connecting part 4163 is fixedly connected to the second isolator 4161, and the other end of the connecting part 4163 is fixedly connected to the third isolator 4162, so that the connecting part 4163, the second isolator 4161, and the third isolator 4162 are integrated into a single unit. During positioning, only one positioning is required to simultaneously achieve the installation positioning of the second isolator 4161 and the third isolator 4162, which facilitates installation.

[0110] Figure 13 This is a schematic diagram of the optical path of a light emitting component according to some embodiments of this application. Figure 14 .like Figure 2 As shown, in some embodiments, the light emitting component includes a first collimating lens 4104 located between the first light emitting chip 410 and the polarization beam combiner. The first collimating lens 4104 collimates the signal light emitted by the first light emitting chip 410.

[0111] The second collimating lens 4105 is located between the second light emitting chip 420 and the polarization beam combining component, and collimates the signal light emitted by the second light emitting chip 420.

[0112] In some embodiments, the light emitting component includes a second isolator 4161. The second isolator 4161 is located between the first collimating lens 4104 and the polarization beam combining component, and prevents light reflected by the polarization beam combining component from entering the first light emitting chip.

[0113] In some embodiments, the light emitting component includes a third isolator 4162. The third isolator 4162 is located between the second collimating lens and the polarization beam combining component, and prevents light reflected by the polarization beam combining component from entering the second light emitting chip.

[0114] The first polarizing wave plate 41611 is located between the second isolator 4161 and the polarization beam combiner, and the second polarizing wave plate 41621 is located between the third isolator 4162 and the polarization beam combiner. For example, the first polarizing wave plate is located on the light emitting side of the second isolator 4161, and the first polarizing wave plate is located between the second isolator 4161 and the polarization beam combiner 4164. The second polarizing wave plate is located on the light emitting side of the third isolator 4162, and the second polarizing wave plate is located between the third isolator 4162 and the polarization beam combiner.

[0115] In some embodiments, the light emitting component can be provided with two light emitting chips, or three light emitting chips, or even more light emitting chips. The number of wavelengths that can be tuned by the light emitting component is greater than the number of light emitting chips. The number of light emitting chips in the light emitting component is not 1.

[0116] In this example, the light emitting component includes a first light emitting chip 410, a second light emitting chip 420, a first collimating lens 4104, a second collimating lens 4105, a semiconductor cooler 4106, a polarizing plate, and a polarization beam combiner. The semiconductor cooler is in thermal contact with the first light emitting chip and the second light emitting chip, and changes the temperature of the first light emitting chip or the second light emitting chip to adjust the tuning wavelength of the first light emitting chip or the second light emitting chip. The light emitted by the first light emitting component forms collimated light after passing through the first collimating lens 4104, and then transmits through the polarization beam combiner, enters the first housing, and then enters the fiber adapter through the first housing. The temperature of the first light emitting chip or the second light emitting chip is changed by the semiconductor cooler to adjust the tuning wavelength of the first light emitting chip or the second light emitting chip. Compared with the single-chip multi-wavelength second light emitting component, the light emitted by the second light emitting component forms collimated light after passing through the second collimating lens, rotates by a certain angle after passing through the polarizing plate, and then reflects through the polarization beam combiner to enter the first housing, and then enters the fiber adapter through the first housing.

[0117] In the normal working state of the ONU optical module, the first optical transmitting chip 410 emits light while the second optical transmitting chip 420 does not emit light; the second optical transmitting chip 420 emits light while the first optical transmitting chip 410 does not emit light, which is referred to as time-division light emission.

[0118] In the ONU, the wavelength of the signal light emitted by the optical transmitter is adjusted by adjusting the temperature of the optical transmitting chip. The present application provides an optical module, which includes a first optical transmitting chip 410, a second optical transmitting chip 420, a first temperature regulator, a second temperature regulator, a laser drive chip, and a micro control unit 460. In an example, the first optical transmitting chip 410 and the second optical transmitting chip 420 are electro-absorption modulated lasers. The laser drive chip includes a first differential output pin 451 and a second differential output pin 452. The first differential output pin 451 is connected to the first optical transmitting chip 410, and the second differential output pin 452 is connected to the second optical transmitting chip 420. The micro control unit controls the temperature of the first temperature regulator and the second temperature regulator to control the coordinated wavelength of the first optical transmitting chip 410 and the second optical transmitting chip 420, respectively.

[0119] Figure 14 An optical transmitting component optical path schematic according to some embodiments of the present application Figure 15 As shown in Figure 3 , in some embodiments, the optical transmitting component includes a first collimating lens 4104 located between the first optical transmitting chip and the optical wavelength division multiplexer 4165. The first collimating lens 4104 collimates the signal light emitted by the first optical transmitting chip. A second collimating lens is located between the second optical transmitting chip and the beam combiner, and the second collimating lens collimates the signal light emitted by the second optical transmitting chip.

[0120] The beam combiner includes an optical wavelength division multiplexer 4165 and a fourth isolator 4166, wherein the optical wavelength division multiplexer 4165 is located between the fourth isolator 4166 and the first optical transmitting chip and the second optical transmitting chip, and the optical wavelength division multiplexer combines the light emitted by the first optical transmitting chip and the second optical transmitting chip into one beam.

[0121] The optical wavelength division multiplexer 4165 has a first light inlet, and the signal light emitted by the first optical transmitting chip 410 enters the optical wavelength division multiplexer 4165 through the first light inlet, is reflected by the first reflecting surface to the second reflecting surface, and is emitted by the light outlet after being reflected by the second reflecting surface. The signal light emitted by the second optical transmitting chip enters the optical wavelength division multiplexer 4165 through the second light inlet, and is emitted by the light outlet after being transmitted through the second reflecting surface.

[0122] Figure 15 An optical transmitting component optical path schematic according to some embodiments of the present application Figure 16 As shown in Figure 1As shown, the first emitted light emitted by the first light emitting chip 410 directly transmits through the second lens 4045, and the first emitted light beam that transmits through the second lens 4045 is incident on the incident light surface of the third lens 4046; the second incident light surface 4073 of the fourth lens 4047 is provided with a reflecting film, the second emitted light emitted by the second light emitting chip is reflected at the reflecting film of the incident light surface of the fourth lens 4047, the direction of the second emitted light is changed, so that the second emitted light is reflected to the third lens 4046 via the fourth lens 4047. The first emitted light can directly transmit on the first incident light surface 4072 of the third lens 4046, and the reflected second emitted light is reflected on the first incident light surface 4072 of the third lens 4046, so that the reflected second emitted light is reflected to the second lens 4045 via the third lens 4046 again; the second emitted light reflected to the exit light surface 4071 of the second lens 4045 by the third lens 4046 is reflected on the exit light surface 4071 of the second lens 4045 again, so that the second emitted light is reflected to the third lens 4046 via the second lens 4045, and the second emitted light reflected to the third lens 4046 again can directly transmit on the first incident light surface 4072 of the third lens 4046.

[0123] Specifically, the first incident light surface 4072 of the third lens 4046 can be provided with an angle selection film, the angle selection film can selectively transmit the incident light incident on the first incident light surface 4072, that is, the angle selection film is provided with a preset incident light angle, when the incident angle of the light incident on the first incident light surface 4072 meets the preset incident light angle, the light beam can directly transmit through the third lens 4046; when the incident angle of the light incident on the first incident light surface 4072 does not meet the preset incident light angle, the light beam is reflected at the first incident light surface 4072 to change the incident angle of the incident light beam until the incident angle of the light beam meets the preset incident light angle of the first incident light surface 4072.

[0124] In the embodiment of the present application, the incident angle of the first emitted light transmitted by the second lens 4045 meets the preset incident light angle of the first incident light surface 4072 of the third lens 4046, so the first emitted light can directly transmit through the third lens 4046. The incident angle of the second emitted light reflected to the first incident light surface 4072 of the third lens 4046 by the fourth lens 4047 is greater than the preset incident light angle of the first incident light surface 4072 of the third lens 4046, so the second emitted light is reflected at the first incident light surface 4072 again, and the reflected second emitted light is incident on the exit light surface 4071 of the second lens 4045.

[0125] In the embodiment of the present application, the preset incident light angle of the angle selection film arranged on the first incident light surface 4072 of the third lens 4046 can be 0-45°, the incident angle of the first emitted light which is emitted through the first emitting light surface of the second lens 4045 to the first incident light surface 4072 of the third lens 4046 is 37°, which satisfies the preset incident light angle of the angle selection film, and thus the first emitted light can be directly transmitted through the angle selection film; the incident angle of the second emitted light which is reflected by the fourth lens 4047 to the first incident light surface 4072 of the third lens 4046 is 57°, which exceeds the preset incident light angle of the angle selection film, and thus the second emitted light is reflected at the angle selection film.

[0126] The first incident light surface 4072 of the third lens 4046 provided in the embodiment of the present application is not limited to arranging the angle selection film, but can also arrange other film pieces, as long as the film piece can realize that the first emitted light is directly transmitted through the first incident light surface 4072 and the second emitted light is reflected at the first incident light surface 4072, which all belong to the protection scope of the embodiment of the present application.

[0127] In order to make the second emitted light be able to transmit through the third lens 4046, it is necessary to reduce the incident angle of the second emitted light which is emitted to the first incident light surface 4072 of the third lens 4046, and thus the second emitted light which is reflected at the first incident light surface 4072 of the third lens 4046 can be reflected again, and when the second emitted light which is reflected again is emitted to the first incident light surface 4072 of the third lens 4046, the incident angle thereof is reduced, which can satisfy the preset incident light angle of the angle selection film.

[0128] The emitting light surface 4071 of the second lens 4045 is arranged with a half-transmission half-reflection film, and the half-transmission half-reflection film can select wavelength, that is, the light beam of a certain wavelength range can be directly transmitted through the half-transmission half-reflection film, and the light beam exceeding the wavelength range is reflected at the half-transmission half-reflection film. In the embodiment of the present application, the wavelength of the first emitted light satisfies the wavelength range of the half-transmission half-reflection film, and thus the first emitted light can be directly transmitted through the emitting light surface 4071 of the second lens 4045; and the wavelength of the second emitted light does not satisfy the wavelength range of the half-transmission half-reflection film, and thus the second emitted light which is reflected by the third lens 4046 to the emitting light surface 4071 of the second lens 4045 is reflected at the half-transmission half-reflection film, so that the second emitted light is reflected again from the emitting light surface 4071 of the second lens 4045 to the first incident light surface 4072 of the third lens 4046.

[0129] After reflection by the first incident light surface 4072 of the third lens 4046 and further reflection by the exit light surface 4071 of the second lens 4045, the incident angle of the second emitted light entering the first incident light surface 4072 of the third lens 4046 becomes smaller, so that the incident angle of the second emitted light can meet the preset incident light angle of the angle selection film, thereby allowing the reflected second emitted light to be transmitted through the third lens 4046.

[0130] The first emitted light and the second emitted light, after reflection, re-enter the third lens 4046 can be combined within the third lens 4046. That is, the first emitted light and the second emitted light are combined into a single beam within the third lens 4046. This single beam is emitted from the third lens 4046 and coupled to the fiber optic adapter.

[0131] In some embodiments of this application, a second isolator and a third isolator may also be provided. The second isolator is located between the first light-emitting chip and the second lens. The third isolator is located between the second light-emitting chip and the fourth lens.

[0132] In some embodiments of this application, a first collimating lens and a second collimating lens may also be provided, located between the first light emitting chip and the second lens; the second collimating lens may be located between the second light emitting chip and the fourth lens.

[0133] Figure 17 This is a schematic diagram of a light emitting component and circuit board provided according to some embodiments of this application. Figure 14 . Figure 18 This is a schematic diagram of a light emitting component circuit according to some embodiments of this application. Figure 18 As shown, in some embodiments of this application, the optical module includes: a first optical emitting chip 410, a second optical emitting chip 420, a first temperature regulator 440, a second temperature regulator 430, a laser driver chip 450, and a microcontroller unit 460.

[0134] In this example, the first optical emitting chip 410 and the second optical emitting chip 420 are electroabsorption modulated lasers.

[0135] The laser driver chip 450 provides differential signal output, specifically including a first differential output pin 451 and a second differential output pin 452. The first differential output pin 451 is connected to the first light-emitting chip 410, and the second differential output pin 452 is connected to the second light-emitting chip 420. The first differential output pin 451 outputs a first differential signal, and the second differential output pin 452 outputs a second differential signal. The first and second differential signals form a differential-mode signal. In differential transmission, the amplitudes of the first and second differential signals are equal, their phases differ by 180 degrees, and their polarities are opposite.

[0136] The first temperature regulator is in thermal connection with the first light emitting chip 410, and is used for adjusting the working temperature of the first light emitting chip 410. The second temperature regulator is in thermal connection with the second light emitting chip 420, and is used for adjusting the working temperature of the second light emitting chip 420.

[0137] The micro control unit 460 is electrically connected with the first temperature regulator and the second temperature regulator respectively, and is used for controlling the power supply current of the first temperature regulator and the second temperature regulator, so as to realize the temperature regulation of the first temperature regulator and the second temperature regulator.

[0138] In order to realize the temperature control of the first temperature regulator, the first temperature sensor is further included. The first temperature sensor senses the current working temperature of the first light emitting chip 410, and transmits the current working temperature of the first light emitting chip 410 to the micro control unit 460. The micro control unit 460 adjusts the power supply current of the first temperature regulator according to the current working temperature. In order to realize the temperature control of the second temperature regulator, the second temperature sensor is further included. The second temperature sensor senses the current working temperature of the second light emitting chip 420, and transmits the current working temperature of the second light emitting chip 420 to the micro control unit 460. The micro control unit 460 adjusts the power supply current of the second temperature regulator according to the current working temperature.

[0139] The first light emitting chip 410 has a first power supply pin, a first modulation pin and a first ground pin. The first ground pin is electrically connected with the ground wire, the first modulation pin is connected with the laser drive chip 450, and the first power supply pin is connected with the first power supply circuit to provide a bias voltage for the first light emitting chip 410. The first power supply pin is a laser diode (LD) of the first light emitting chip 410, the first modulation pin is an electroabsorption (EA) of the first light emitting chip 410, and receives a first modulation signal of the laser drive chip 450. The first modulation pin is connected with the first differential output pin 451 of the laser drive chip 450 to receive the first modulation signal of the laser drive chip 450, so as to realize the modulation of the first light emitting chip 410.

[0140] The second light emitting chip 420 has a second power supply pin, a second modulation pin and a second ground pin. The second ground pin is electrically connected with the ground wire, the second modulation pin is connected with the laser drive chip 450, and the second power supply pin is connected with the second power supply circuit. The second modulation pin is an electroabsorption of the second light emitting chip 420, and receives a second modulation signal of the laser drive chip 450. The second modulation pin is connected with the second differential output pin of the laser drive chip 450 to receive the second modulation signal of the laser drive chip 450, so as to realize the modulation of the second light emitting chip 420. The first power supply circuit and the second power supply circuit provide a bias voltage.

[0141] The light emitting component circuit further comprises a first DC filter 401. The first DC filter 401 is located between the laser driving chip 450 and the first light emitting chip 410. The first end of the first DC filter 401 is connected with the first differential output pin 451, and the second end of the first DC filter 401 is connected with the first light emitting chip 410. The first DC filter 401 filters out the DC signal of the laser driving chip 450, allows the AC signal of the laser driving chip 450 to pass through, filters out the noise, and improves the stability of the optical communication.

[0142] The light emitting component circuit further comprises a second DC filter 402. The second DC filter 402 is located between the laser driving chip 450 and the second light emitting chip 420. The first end of the second DC filter 402 is connected with the second differential output pin, and the second end of the first DC filter 401 is connected with the second light emitting chip 420. The second DC filter 402 filters out the DC signal of the laser driving chip 450, allows the AC signal of the laser driving chip 450 to pass through, filters out the noise, and improves the stability of the optical communication.

[0143] In some embodiments, the first DC filter and the second DC filter can be capacitors.

[0144] In some embodiments of the present application, the micro control unit 460 changes the temperature of the first light emitting chip 410 by adjusting the temperature of the first temperature regulator and the second temperature regulator, to adjust the temperature of the first light emitting chip 410. For the light emitting chip, different temperatures correspond to different wavelengths of signal light. For example, the first light emitting chip 410 emits first wavelength signal light at a first temperature, and the first light emitting chip 410 emits second wavelength signal light at a second temperature. The second light emitting chip 420 emits third wavelength signal light at the first temperature, and the second light emitting chip 420 emits fourth wavelength signal light at the second temperature.

[0145] In some embodiments of the present application, the tuning wavelength of the first light emitting chip 410 is the first wavelength signal light and the second wavelength signal light, and the tuning wavelength of the second light emitting chip 420 is the third wavelength signal light and the fourth wavelength signal light. For example, the tuning wavelength of the first light emitting chip 410 is 1532.68 nm or 1533.47 nm, and the tuning wavelength of the second light emitting chip 420 is 1534.25 nm or 1535.04 nm; or, the tuning wavelength of the first light emitting chip 410 is 1534.25 nm or 1535.04 nm, and the tuning wavelength of the second light emitting chip 420 is 1532.68 nm or 1533.47 nm.

[0146] The wavelengths of the first, second, third and fourth wavelength signal lights are different from each other, and the difference between the first and second wavelength signal lights is less than a minimum threshold value, and the difference between the third and fourth wavelength signal lights is less than the minimum threshold value. In some embodiments of the present application, the difference between the first and second wavelength signal lights is less than 1 nm, and the difference between the third and fourth wavelength signal lights is less than 1 nm.

[0147] Generally, a temperature adjustment of 8-10℃ can change the wavelength of the light emitting chip. Therefore, in the light emitting component, only a temperature difference of 8℃ needs to be adjusted to achieve the adjustment of four wavelengths. At high-temperature commercial and industrial levels, the refrigeration temperature value required by the temperature adjuster only needs to reach 30℃ or even lower, greatly reducing the power consumption of the temperature adjuster.

[0148] The first temperature and the second temperature are adjacent to the maximum temperature of the operating temperature of the optical module. In some embodiments of the present application, the ambient temperature of the optical module is greater than or equal to the minimum ambient temperature, and the ambient temperature of the optical module is less than or equal to the maximum ambient temperature. The ambient temperature threshold is the difference between the maximum ambient temperature and the minimum ambient temperature. The difference between the operating temperature of the current light emitting chip and the minimum ambient temperature is a low temperature difference, and the ratio of the low temperature difference to the ambient temperature threshold is less than or equal to 80% and greater than or equal to 60%.

[0149] The high temperature difference is the temperature difference that the temperature adjuster needs to cool, and the ratio of the high temperature difference to the ambient temperature threshold is less than or equal to 40%, which is beneficial to reduce the power consumption of the temperature adjuster.

[0150] For example, the ambient temperature of the optical module is 85℃- -40℃, the ambient temperature threshold is 125℃, the first temperature can be set to 40℃, the maximum ambient temperature of the optical module is 85℃, and the difference between the maximum ambient temperature and the first temperature is 45℃. At this time, the ratio of the high temperature difference to the ambient temperature threshold is 36%. The second temperature can be set to 50℃, the maximum ambient temperature of the optical module is 85℃, and the difference between the maximum ambient temperature and the first temperature is 35℃. At this time, the ratio of the high temperature difference to the ambient temperature threshold is 28%.

[0151] In some embodiments of the present application, the first temperature is set to 40±3℃, and the second temperature is set to 50±3℃.

[0152] In some embodiments of the present application, the ambient temperature of the optical module is greater than or equal to the minimum ambient temperature, and the ambient temperature of the optical module is less than or equal to the maximum ambient temperature. The ambient temperature threshold is the difference between the maximum ambient temperature and the minimum ambient temperature. The difference between the operating temperature of the light emitting chip and the minimum ambient temperature is a low temperature difference, and the ratio of the low temperature difference to the ambient temperature threshold is less than or equal to 80% and greater than or equal to 60%.

[0153] For example, the ambient temperature of the optical module is 85°C to -40°C, the ambient temperature threshold is 125°C, the first temperature can be set to 40°C, the lowest ambient temperature of the optical module is -40°C, the difference between the first temperature and the lowest ambient temperature is 80°C, and at this time, the ratio of the high temperature difference to the ambient temperature threshold is 64%. The second temperature can be set to 50°C, the lowest ambient temperature of the optical module is -40°C, the difference between the first temperature and the lowest ambient temperature is 90°C, and at this time, the ratio of the high temperature difference to the ambient temperature threshold is 72%.

[0154] The low temperature difference is the temperature difference required for the temperature regulator to heat, the ratio of the high temperature difference to the ambient temperature threshold is less than or equal to 40%, the ratio of the low temperature difference to the ambient temperature threshold is less than or equal to 80%, and the ratio of the low temperature difference to the ambient temperature threshold is greater than or equal to 60%, which helps to reduce the power consumption of the temperature regulator.

[0155] Table 1 is a table of temperature differences required for adjustment of the first optical emission component, and Table 2 is a table of temperature differences required for adjustment of the second optical emission component. As shown in Table 1, D1 represents the operating temperature of the optical emission chip of the first optical emission component. The first optical emission component is one optical emission chip that emits signal light of different wavelengths at four different temperatures, respectively. T1 is the adjustment temperature difference of the temperature regulator when the ambient temperature is 85°C. T2 is the adjustment temperature difference of the temperature regulator when the ambient temperature is -40°C. In Table 2, D2 represents the operating temperature of the second optical emission component. The second optical emission component is two optical emission chips that emit signal light of different wavelengths at two different temperatures, respectively. T1 is the adjustment temperature difference of the temperature regulator when the ambient temperature is 85°C, referred to as the cooling temperature difference. T2 is the adjustment temperature difference of the temperature regulator when the ambient temperature is -40°C, referred to as the heating temperature difference.

[0156] As shown in Table 1, the maximum cooling temperature difference is 55°C, and the maximum heating temperature difference is 100°C; in Table 2, the maximum cooling temperature difference is 45°C, and the maximum heating temperature difference is 90°C, which helps to reduce power consumption.

[0157] The temperature difference required for adjustment of the optical emission component can actually reflect the power consumption of the temperature regulator, and the greater the temperature difference, the greater the power consumption of the temperature regulator. Under the same temperature difference, the power consumption required for cooling is greater than that required for heating.

[0158] It can be known from the comparison of Table 1 and Table 2 that when two optical transmitting chips are arranged in the optical module, and at the first temperature, the first optical transmitting chip emits the first wavelength signal light, and the second optical transmitting chip emits the third wavelength signal light. At the second temperature, the first optical transmitting chip emits the second wavelength signal light, and the second optical transmitting chip emits the fourth wavelength signal light, and the wavelengths of the first wavelength signal light, the second wavelength signal light, the third wavelength signal light and the fourth wavelength signal light increase in turn. When the working temperature of the optical transmitting chip is the first temperature and the second temperature, the ratio of the low temperature difference value to the environmental temperature threshold value is less than or equal to 80%, and the ratio of the low temperature difference value to the environmental temperature threshold value is greater than or equal to 60%; the ratio of the high temperature difference value to the environmental temperature threshold value is less than or equal to 40%.

[0159]

[0160]

[0161] In some embodiments of the present application, the first temperature regulator and the second temperature regulator are semiconductor refrigerators.

[0162] The present application provides an optical module, comprising: a first optical transmitting chip 410, a second optical transmitting chip 420, a first temperature regulator, a second temperature regulator, a laser drive chip 450 and a micro control unit 460. The first differential output pin 451 of the laser drive chip 450 is connected with the first optical transmitting chip 410, and the second differential output pin 452 of the laser drive chip 450 is connected with the second optical transmitting chip 420. The first temperature regulator is in thermal conductive connection with the first optical transmitting chip 410, and is used for adjusting the working temperature of the first optical transmitting chip 410. The second temperature regulator is in thermal conductive connection with the second optical transmitting chip 420, and is used for adjusting the working temperature of the second optical transmitting chip 420. The micro control unit 460 is electrically connected with the first temperature regulator and the second temperature regulator respectively, and is used for controlling the power supply current of the first temperature regulator and the second temperature regulator, so as to realize the temperature regulation of the first temperature regulator and the second temperature regulator. The micro control unit 460 changes the temperature of the first optical transmitting chip 410 and the temperature of the second optical transmitting chip 420 by adjusting the temperature of the first temperature regulator and the second temperature regulator, and changes the tuning wavelength of the first optical transmitting chip 410 and the second optical transmitting chip 420. For the optical transmitting chip, different temperatures correspond to different wavelengths of signal light. The present application adopts one laser drive chip 450 connected with the modulation end of two optical transmitting chips, reduces the electronic devices, and helps the miniaturization of the circuit board. Moreover, the scheme of adopting double optical transmitting chips only needs to adjust the temperature difference of the optical transmitting chip to 8℃, so as to realize the 4-wavelength tunable, and reduces the power consumption of the temperature regulator.

[0163] Figure 19 Another optical transmitting component circuit schematic diagram is provided according to some embodiments of the present application. As shown in FIG. 6, the optical module comprises a first optical transmitting chip 410, a second optical transmitting chip 420, a first temperature regulator, a second temperature regulator, a laser drive chip 450 and a micro control unit 460.Figure 2 As shown, in some embodiments of the present application, the optical module comprises: a first optical transmitting chip 410, a second optical transmitting chip 420, a first temperature regulator, a laser drive chip 450, and a micro control unit 460. When the first optical transmitting chip 410 and the second optical transmitting chip 420 are electrically pumped absorption modulated lasers, the laser drive chip 450 outputs differential signals, i.e. the laser drive chip 450 comprises: a first differential output pin 451 and a second differential output pin 452. The first differential output pin 451 is connected to the first optical transmitting chip 410, and the second differential output pin 452 is connected to the second optical transmitting chip 420.

[0164] The first temperature regulator is in thermal contact with the first optical transmitting chip 410, and is used to regulate the working temperature of the first optical transmitting chip 410. The first temperature regulator is also in thermal contact with the second optical transmitting chip 420, and is used to regulate the working temperature of the second optical transmitting chip 420.

[0165] The micro control unit 460 is electrically connected to the first temperature regulator, and is used to control the power supply current of the first temperature regulator to achieve temperature regulation of the first temperature regulator.

[0166] In order to achieve temperature control of the first temperature regulator, a first temperature sensor is further included. The first temperature sensor senses the current working temperature of the first optical transmitting chip 410, and transmits the current working temperature of the first optical transmitting chip 410 to the micro control unit 460. The micro control unit 460 adjusts the power supply current of the first temperature regulator according to the current working temperature.

[0167] The first optical transmitting chip 410 has a first power supply pin, a first modulation pin, and a first ground pin. The first ground pin is electrically connected to a ground line, the first modulation pin is connected to the laser drive chip 450, and the first power supply pin is connected to a first power supply circuit. The first modulation pin is an electrically pumped absorption pin of the first optical transmitting chip 410, and receives a first modulation signal of the laser drive chip 450. The first modulation pin is connected to the first differential output pin 451 of the laser drive chip 450, and receives the first modulation signal of the laser drive chip 450 to achieve modulation of the first optical transmitting chip 410.

[0168] The second optical transmitting chip 420 has a second power supply pin, a second modulation pin, and a second ground pin. The second ground pin is electrically connected to a ground line, the second modulation pin is connected to the laser drive chip 450, and the second power supply pin is connected to a second power supply circuit. The second modulation pin is an electrically pumped absorption pin of the second optical transmitting chip 420, and receives a second modulation signal of the laser drive chip 450. The second modulation pin is connected to the second differential output pin of the laser drive chip 450, and receives the second modulation signal of the laser drive chip 450 to achieve modulation of the second optical transmitting chip 420.

[0169] The light emitting component circuit further comprises a first DC filter 401. The first DC filter 401 is located between the laser driving chip 450 and the first light emitting chip 410. The first end of the first DC filter 401 is connected with the first differential output pin 451, and the second end of the first DC filter 401 is connected with the first light emitting chip 410. The first DC filter 401 filters out the DC signal of the laser driving chip 450, allows the AC signal of the laser driving chip 450 to pass through, filters out the noise, and improves the stability of the optical communication.

[0170] The light emitting component circuit further comprises a second DC filter 402. The second DC filter 402 is located between the laser driving chip 450 and the second light emitting chip 420. The first end of the second DC filter 402 is connected with the second differential output pin, and the second end of the first DC filter 401 is connected with the second light emitting chip 420. The second DC filter 402 filters out the DC signal of the laser driving chip 450, allows the AC signal of the laser driving chip 450 to pass through, filters out the noise, and improves the stability of the optical communication.

[0171] In some embodiments of the present application, the micro control unit 460 changes the temperature of the first light emitting chip 410 by adjusting the temperature of the first temperature regulator, so as to adjust the temperature of the first light emitting chip 410. For the light emitting chip, different temperatures correspond to different wavelengths of signal light. For example, the first light emitting chip 410 emits signal light of a first wavelength at a first temperature, and the first light emitting chip 410 emits signal light of a second wavelength at a second temperature. The second light emitting chip 420 emits signal light of a third wavelength at the first temperature, and the second light emitting chip 420 emits signal light of a fourth wavelength at the second temperature. Therefore, in the light emitting component, only one temperature value needs to be changed to realize the adjustment of four wavelengths.

[0172] The temperature regulator can be a semiconductor refrigerator.

[0173] Generally, a temperature adjustment of 8℃ can change the wavelength of the light emitting chip. Therefore, in the light emitting component, only a temperature difference of 8℃ needs to be adjusted to realize the adjustment of four wavelengths. In high-temperature commercial and industrial-grade temperatures, the required refrigeration temperature value of the temperature regulator only needs to reach 30℃ or even lower, greatly reducing the power consumption of the temperature regulator.

[0174] The required refrigeration temperature value of the temperature regulator represents the difference between the ambient temperature of the optical module and the working temperature of the light emitting chip.

[0175] This application provides an optical module, including: a first optical emitting chip 410, a second optical emitting chip 420, a first temperature regulator, a laser driver chip 450, and a microcontroller unit 460. The first differential output pin 451 of the laser driver chip 450 is connected to the first optical emitting chip 410, and the second differential output pin 452 of the laser driver chip 450 is connected to the second optical emitting chip 420. The first temperature regulator is thermally connected to both the first and second optical emitting chips 410 and 420, and is used to regulate the operating temperature of the first and second optical emitting chips 410 and 420. The microcontroller unit 460 is electrically connected to the first temperature regulator and is used to control the power supply current of the first temperature regulator to achieve temperature regulation. By adjusting the temperature of the first temperature regulator, the microcontroller unit 460 changes the temperature of the first and second optical emitting chips 410 and 420, thereby changing the tuning wavelength of the first and second optical emitting chips 410 and 420. For the optical emitting chips, different temperatures correspond to different wavelengths of signal light. This application uses a laser driver chip 450 connected to the modulation ends of two optical emitting chips, reducing the number of electronic components and contributing to the miniaturization of the circuit board. Moreover, the dual-optical-emitting chip scheme only requires adjusting the temperature difference between the optical emitting chips to 8°C to achieve 4-wavelength tunability, reducing the power consumption of the temperature regulator.

[0176] Figure 20 This is a schematic diagram of a light emitting component and circuit board provided according to some embodiments of this application. Figure 19 . Figure 20 This is a circuit diagram of a third type of optical emitting component provided according to some embodiments of this application. Figure 21 and Figure 3 As shown, in some embodiments of this application, the optical module further includes: a first power supply switch 480 and a second channel switch 470. The first input terminal of the first power supply switch 480 is connected to the optical emission power supply circuit, providing luminous current to the optical emission chip. The second input terminal of the first power supply switch 480 is connected to a burst pulse circuit, providing a burst pulse signal. The first power supply switch 480 has a first output terminal and a second output terminal, wherein the first output terminal of the first power supply switch 480 is connected to the second channel switch 470. The optical emission power supply circuit provides a bias voltage.

[0177] In some embodiments, the first power supply switch 480 may also be provided with a second output terminal, and the second output terminal of the first power supply switch 480 is grounded.

[0178] In order to reduce the current flowing through the second output end of the first power supply switch 480 and reduce electromagnetic radiation, a first resistor 403 is further arranged between the first output end of the first power supply switch 480 and the ground wire. The burst pulse signal provided by the burst pulse circuit controls whether the first power supply switch 480 connects channel A or channel B, that is, the burst pulse signal controls whether the first input end of the first power supply switch 480 is connected to the first output end or the second output end. When the first input end of the first power supply switch 480 is connected to the second output end of the first power supply switch 480, the current is connected to the ground wire after passing through the first resistor 403, thereby reducing the current flowing through the first power supply switch 480.

[0179] The first power supply switch 480 controls the on-off of the bias voltage, and the second channel switch controls the light emission selection of the first light emitting chip and the second light emitting chip. When the first input end of the first power supply switch 480 is connected to the second output end of the first power supply switch 480, the bias voltage is not provided to the first light emitting chip 410 and the second light emitting chip 420, that is, neither the first light emitting chip 410 nor the second light emitting chip 420 emits light, so that the light emitting part is turned off.

[0180] The light emitting power supply circuit can be a power supply pin on the golden finger, and the light emitting power supply circuit usually provides a stable light emitting voltage.

[0181] When the first input end of the first power supply switch 480 is connected to the first output end of the first power supply switch 480, the bias voltage is provided to the second channel switch 470. In the ONU, the light emitting part only needs to emit signal light of one wavelength at the same time, and the second channel switch 470 is configured to select to supply power to the first light emitting chip 410 or the second light emitting chip 420 according to the control signal of the micro control unit 460.

[0182] The second channel switch 470 has a power supply input end, a control input end, a third output end and a fourth output end, wherein the power supply input end is electrically connected to the first power supply switch 480, the control input end is electrically connected to the micro control unit 460, the third output end is electrically connected to the first light emitting chip 410, and the fourth output end is connected to the second light emitting chip 420.

[0183] In some embodiments of the present application, the power supply input end is electrically connected to the first output end of the first power supply switch 480, and when the first input end of the first power supply switch 480 is connected to the first output end of the first power supply switch 480, the bias voltage of the light emitting power supply circuit is provided to the second channel switch 470. The micro control unit 460 controls the second channel switch 470 to be connected to the first light emitting chip 410 or the second light emitting chip 420.

[0184] The power supply input end of the second channel switch 470 is connected with the third output end, the light emission power supply circuit is electrically connected with the first light emission chip 410, and the first light emission chip 410 emits light at this time; the light emission power supply circuit is connected with the second light emission chip 420, the power supply input end of the second channel switch 470 is connected with the fourth output end, and the second light emission chip 420 emits light.

[0185] In some embodiments of the present application, the first power supply pin of the first light emission chip 410 is connected with the third output end of the second channel switch 470. The second power supply pin of the second light emission chip 420 is connected with the fourth output end of the second channel switch 470.

[0186] The first light emission chip 410 has a first power supply pin, a first modulation pin and a first ground pin. The first ground pin is electrically connected with the ground wire, the first modulation pin is connected with the laser drive chip 450, and the first power supply pin is connected with the third output end of the second channel switch 470. The first modulation pin is an electrical absorption pin of the first light emission chip 410, and receives the first control signal of the laser drive chip 450. The first modulation pin is connected with the first differential output pin 451 of the laser drive chip 450, receives the first control signal of the laser drive chip 450, and realizes the modulation of the first light emission chip 410.

[0187] The second light emission chip 420 has a second power supply pin, a second modulation pin and a second ground pin. The second ground pin is electrically connected with the ground wire, the second modulation pin is connected with the laser drive chip 450, and the second power supply pin is connected with the fourth output end of the second channel switch 470. The second modulation pin is an electrical absorption pin of the second light emission chip 420, and receives the second control signal of the laser drive chip 450. The second modulation pin is connected with the second differential output pin of the laser drive chip 450, receives the second control signal of the laser drive chip 450, and realizes the modulation of the second light emission chip 420.

[0188] The micro control unit 460 has a preset power supply algorithm, and the channel of the second channel switch 470 is selected according to the data signal of the upper computer. For example, the micro control unit 460 outputs the first control signal, the power supply input end of the second channel switch 470 is connected with the third output end; the micro control unit 460 outputs the second control signal, and the power supply input end of the second channel switch 470 is connected with the fourth output end.

[0189] For convenience of description, the micro control unit 460 has a first control pin and a second control pin, wherein the first control pin is connected with the second channel switch 470, and the signal output by the first control pin is used for controlling the channel of the second channel switch 470. The second control pin is electrically connected with the first temperature regulator, and the signal output by the second control pin is used for controlling the temperature of the first temperature regulator.

[0190] In some embodiments of the present application, the tuning wave of the first optical transmitting chip 410 is the first wavelength signal light and the second wavelength signal light, and the tuning wave of the second optical transmitting chip 420 is the third wavelength signal light and the fourth wavelength signal light. For example, the tuning wavelength of the first optical transmitting chip 410 is 1532.68 nm or 1533.47 nm, and the tuning wavelength of the second optical transmitting chip 420 is 1534.25 nm or 1535.04 nm; or, the tuning wavelength of the first optical transmitting chip 410 is 1534.25 nm or 1535.04 nm, and the tuning wavelength of the second optical transmitting chip 420 is 1532.68 nm or 1533.47 nm.

[0191] The wavelengths of the first wavelength signal light, the second wavelength signal light, the third wavelength signal light and the fourth wavelength signal light are different from each other, and the difference between the first wavelength signal light and the second wavelength signal light is less than a minimum threshold, and the difference between the third wavelength signal light and the fourth wavelength signal light is less than a minimum threshold. In some embodiments of the present application, the difference between the first wavelength signal light and the second wavelength signal light is less than 1 nm, and the difference between the third wavelength signal light and the fourth wavelength signal light is less than 1 nm.

[0192] When the first temperature controller is in thermal contact with the first optical transmitting chip 410 and the second optical transmitting chip 420, the difference between the first wavelength and the second wavelength is less than a minimum threshold. When the emission wavelength of the first optical transmitting chip is adjusted from the first wavelength signal light to the second wavelength signal light, only the temperature of the first temperature controller needs to be controlled by the micro control unit 460, and the wavelength adjustment can be realized. When the first wavelength needs to be adjusted to the second wavelength, only one temperature gradient of the first optical transmitting chip 410 needs to be controlled by the micro control unit 460, and the wavelength adjustment can be realized.

[0193] When the first temperature controller is in thermal contact with the first optical transmitting chip 410 and the second optical transmitting chip 420, the difference between the third wavelength and the fourth wavelength is less than a minimum threshold. When the third wavelength of the second optical transmitting chip 420 is adjusted to the fourth wavelength, only the temperature of the first temperature controller needs to be controlled by the micro control unit 460, and the wavelength adjustment can be realized. And only one temperature gradient of the second optical transmitting chip 420 needs to be controlled by the micro control unit 460, and the wavelength adjustment can be realized.

[0194] The temperature gradient is the temperature difference when the light emitting chip tunes light of different wavelengths. For example, the temperature of the first light emitting chip 410 when it tunes light of the first wavelength is the first temperature, the temperature of the first light emitting chip 410 when it tunes light of the second wavelength is the second temperature, the difference between the first wavelength and the second wavelength is less than the minimum threshold, and the difference between the first temperature and the second temperature is the temperature gradient. Generally, a temperature adjustment of 6-10°C can change the wavelength of the light emitting chip. The temperature gradient can be 6-10°C. In some embodiments of the present application, the temperature gradient is 8°C.

[0195] The first temperature and the second temperature are adjacent to the maximum temperature of the operating temperature of the optical module. In some embodiments of the present application, the ambient temperature of the optical module is greater than or equal to the minimum ambient temperature, and the ambient temperature of the optical module is less than or equal to the maximum ambient temperature. The ambient temperature threshold is the difference between the maximum ambient temperature and the minimum ambient temperature. The difference between the maximum ambient temperature and the operating temperature of the light emitting chip is the high temperature difference, and the ratio of the high temperature difference to the ambient temperature threshold is less than or equal to 40%. The difference between the operating temperature of the light emitting chip and the minimum ambient temperature is the low temperature difference, and the ratio of the low temperature difference to the ambient temperature threshold is less than or equal to 80%, and the ratio of the low temperature difference to the ambient temperature threshold is greater than or equal to 60%.

[0196] For the light emitting component, the operating temperature of the light emitting chip plus the high temperature difference is the maximum ambient temperature; the operating temperature of the light emitting chip minus the low temperature difference is the minimum ambient temperature.

[0197] The application provides an optical module, comprising: a first optical transmitting chip 410, a second optical transmitting chip 420, a first temperature regulator, a laser driving chip 450, a first power supply switch 480, a second channel switch 470 and a micro control unit 460. The first input end of the first power supply switch 480 is connected with an optical transmitting power supply circuit, the second input end of the first power supply switch 480 is connected with a burst pulse circuit, the first output end of the first power supply switch 480 is connected with the second channel switch 470, and the second output end of the first power supply switch 480 is grounded. The second channel switch 470 has a power supply input end, a control input end, a third output end and a fourth output end, wherein the power supply input end is electrically connected with the first power supply switch 480, the control input end is electrically connected with the micro control unit 460, the third output end is electrically connected with the first optical transmitting chip 410, and the fourth output end is connected with the second optical transmitting chip 420. The micro control unit 460 controls the channel of the first power supply switch 480. The application adopts one laser driving chip 450 connected with the modulation ends of two optical transmitting chips, reduces electronic devices and helps the miniaturization of the circuit board. The first power supply switch 480 controls the switching of the optical transmitting chip, the second channel switch 470 controls the selection of the channel of the first optical transmitting chip 410 or the second optical transmitting chip 420, and the temperature of the optical transmitting chip is controlled by using the temperature regulator, so that the temperature difference of the optical transmitting chip that needs to be adjusted is a temperature gradient, 4-wavelength tunable is realized, and the power consumption of the temperature regulator is reduced.

[0198] Figure 22 An optical transmitting component and a circuit board circuit according to some embodiments of the application Figure 21 . An optical transmitting component and a circuit board circuit according to some embodiments of the application Figure 22 A fourth optical transmitting component circuit diagram according to some embodiments of the application. As shown in Figure 23 and Figure 24 , the optical module comprises: a first optical transmitting chip 410, a second optical transmitting chip 420, a third switch 490, a first limiting drive chip 491 and a second limiting drive chip 492. In the example, the first optical transmitting chip 410 and the second optical transmitting chip 420 are distributed feedback (DFB) lasers. The distributed feedback laser has a positive electrode and a negative electrode.

[0199] The first limiting drive chip 491 has a first pad and a second pad. The first pad is connected with a first transmitting pin on a gold finger and receives a first differential signal from a host computer. The second pad is connected with a second transmitting pin on the gold finger and receives a second differential signal from the host computer. The first differential signal and the second differential signal are a group of differential signals, which are transmitting signals.

[0200] The first limiting drive chip 491 has a third pad and a fourth pad, and the first group of differential signals are output by the third pad and the fourth pad after being amplified by the first limiting drive chip 491. The third pad and the fourth pad are connected with the third switch, and the amplified first group of differential signals enter the third switch 490. The first limiting drive chip 491 amplifies the first group of differential signals, and the amplified signals enter the third switch 490.

[0201] The third switch is a single-pole double-throw switch. The first input end of the third switch includes a first port and a second port, and the first port is connected with the third pad and the second port is connected with the fourth pad.

[0202] The second input end of the third switch is connected with the micro control chip, and the second input end receives a control signal from the micro control chip, and selects an output channel according to the control signal.

[0203] The first output end of the third switch is connected with the second limiting drive chip 492, and the second output end of the third switch is connected with the first limiting drive chip 491. When the third switch selects the first output end, the first light emitting chip 410 emits light; when the third switch selects the second output end, the second light emitting chip 420 emits light.

[0204] The first output end of the third switch includes a third port and a fourth port, and the second output end of the third switch includes a fifth port and a sixth port.

[0205] The emission input end of the second limiting drive chip 492 includes a first drive pin and a second drive pin, and the first drive pin is connected with the third port and the second drive pin is connected with the fourth port. The second limiting drive chip 492 receives an electrical signal from the first output end, converts the signal into a drive signal, and drives the first light emitting chip 410. In the example, the first light emitting chip 410 and the second light emitting chip 420 are distributed feedback lasers, which need to receive differential signals to emit light. Therefore, the emission output end of the second limiting drive chip 492 includes a third drive pin and a fourth drive pin, and the third drive pin is connected with the positive electrode of the first light emitting chip 410 and the fourth drive pin is connected with the negative electrode of the first light emitting chip 410.

[0206] The third drive pin of the second limiting drive chip 492 is also connected with the first power supply circuit, and the negative electrode of the first light emitting chip 410 is also connected with the negative electrode port of the second limiting drive chip 492. The first power supply circuit and the ground output end of the second limiting drive chip 492 form a loop to provide a bias current for the first light emitting chip 410.

[0207] The fifth port of the third switch is connected with the fifth pad of the first limiting drive chip 491, and the sixth port of the third switch is connected with the sixth pad of the first limiting drive chip 491. When the third switch selects the second output end, the differential signal is transmitted to the first limiting drive chip 491. In the example, the first limiting drive chip 491 integrates the light drive circuit and the limiting amplification circuit, and converts the signal from the third switch into a drive signal. The first limiting drive chip 491 also has a seventh pad and an eighth pad, and the converted drive signal is transmitted to the second light emitting chip 420. The seventh pad of the first limiting drive chip 491 is connected with the positive electrode of the second light emitting chip 420, and the eighth pad of the first limiting drive chip 491 is connected with the negative electrode of the second light emitting chip 420. In the example, the second light emitting chip 420 is a distributed feedback laser, which needs to receive a differential signal to realize light emission. Therefore, the seventh pad of the first limiting drive chip 491 is connected with the positive electrode of the second light emitting chip 420, and the eighth pad of the first limiting drive chip 491 is connected with the negative electrode of the second light emitting chip 420.

[0208] The first limiting drive chip 491 also has a negative electrode pad, and the negative electrode pad of the first limiting drive chip 491 is connected with the negative electrode of the second light emitting chip 420.

[0209] In the example, the wavelength of the first light emitting chip 410 and the second light emitting chip 420 can be adjusted by temperature. The tuning wavelength of the first light emitting chip 410 is the first wavelength signal light and the second wavelength signal light, and the tuning wavelength of the second light emitting chip 420 is the third wavelength signal light and the fourth wavelength signal light. For example, the tuning wavelength of the first light emitting chip 410 is 1532.68 nm or 1533.47 nm, and the tuning wavelength of the second light emitting chip 420 is 1534.25 nm or 1535.04 nm; or, the tuning wavelength of the first light emitting chip 410 is 1534.25 nm or 1535.04 nm, and the tuning wavelength of the second light emitting chip 420 is 1532.68 nm or 1533.47 nm.

[0210] The wavelengths of the first wavelength signal light, the second wavelength signal light, the third wavelength signal light and the fourth wavelength signal light are different, and the difference between the first wavelength signal light and the second wavelength signal light is less than a minimum threshold, and the difference between the third wavelength signal light and the fourth wavelength signal light is less than a minimum threshold. In some embodiments of the present application, the difference between the first wavelength signal light and the second wavelength signal light is less than 1 nm, and the difference between the third wavelength signal light and the fourth wavelength signal light is less than 1 nm.

[0211] Generally, a temperature adjustment of 8°C can change the wavelength of the light emitting chip. Therefore, in the light emitting component, only an adjustment of a temperature difference of 8°C is required to achieve the adjustment of four wavelengths. At high-temperature commercial and industrial levels, the required refrigeration temperature value of the temperature adjuster only needs to reach 30°C or even lower, greatly reducing the power consumption of the temperature adjuster. In some embodiments of the present application, the light wavelengths emitted by the first light emitting chip 410 and the second light emitting chip at the same temperature are inconsistent. For example, at a first temperature, the signal light emitted by the first light emitting chip 410 has a first wavelength; at the first temperature, the signal light emitted by the second light emitting chip has a third wavelength. At a second temperature, the signal light emitted by the first light emitting chip 410 has a second wavelength; at the second temperature, the signal light emitted by the second light emitting chip has a fourth wavelength.

[0212] The first temperature and the second temperature are adjacent to the maximum temperature of the operating temperature of the optical module. In some embodiments of the present disclosure, the ambient temperature of the optical module is greater than or equal to the minimum ambient temperature, and the ambient temperature of the optical module is less than or equal to the maximum ambient temperature. The ambient temperature threshold is the difference between the maximum ambient temperature and the minimum ambient temperature. The difference between the maximum ambient temperature and the operating temperature of the light emitting chip is a high temperature difference, and the ratio of the high temperature difference to the ambient temperature threshold is less than or equal to 40%.

[0213] For example, the ambient temperature of the optical module is 85°C to -40°C, the ambient temperature threshold is 125°C, the first temperature can be set to 45°C, the maximum ambient temperature of the optical module is 85°C, and the difference between the maximum ambient temperature and the first temperature is 40°C. At this time, the ratio of the high temperature difference to the ambient temperature threshold is 32%. The second temperature can be set to 55°C, the maximum ambient temperature of the optical module is 85°C, the difference between the maximum ambient temperature and the first temperature is 30°C, and at this time, the ratio of the high temperature difference to the ambient temperature threshold is 24%.

[0214] In some embodiments of the present disclosure, the ambient temperature of the optical module is greater than or equal to the minimum ambient temperature, and the ambient temperature of the optical module is less than or equal to the maximum ambient temperature. The ambient temperature threshold is the difference between the maximum ambient temperature and the minimum ambient temperature. The difference between the operating temperature of the light emitting chip and the minimum ambient temperature is a low temperature difference, and the ratio of the low temperature difference to the ambient temperature threshold is less than or equal to 80%, and the ratio of the low temperature difference to the ambient temperature threshold is greater than or equal to 60%.

[0215] For example, the ambient temperature of the optical module is 85℃ to -40℃, the ambient temperature threshold is 125℃, the first temperature can be set to 45℃, the minimum ambient temperature of the optical module is -40℃, the difference between the first temperature and the minimum ambient temperature is 85℃, at this time, the ratio of the high temperature difference to the ambient temperature threshold is 68%. The second temperature can be set to 55℃, the minimum ambient temperature of the optical module is -40℃, the difference between the first temperature and the minimum ambient temperature is 95℃, at this time, the ratio of the high temperature difference to the ambient temperature threshold is 76%.

[0216] In the optical module provided in the present application, the micro control chip controls the channel of the third switch, and a power supply algorithm is preset in the micro control chip, and the channel of the third switch is selected according to the data signal of the upper computer. For example, the micro control unit 460 outputs a first control signal, the first input end of the third switch is connected with the first output end of the third switch, at this time the first light emitting chip 410 emits light; the micro control unit 460 outputs a second control signal, the first input end of the third switch is connected with the second output end of the third switch, at this time the second light emitting chip 420 emits light.

[0217] In some embodiments of the present application, in order to improve the stability of high-speed signals, a plurality of DC filters are arranged in the differential signal circuit to isolate the DC signals. The DC filter can be a capacitor. For example, a capacitor is arranged between the gold finger and the first limiting drive chip 491, a capacitor is arranged between the first limiting drive chip 491 and the third switch, a capacitor is arranged between the second limiting drive chip 492 and the first light emitting chip 410, and a capacitor is arranged between the first limiting drive chip 491 and the second light emitting chip 420.

[0218] For example, a third capacitor 4111 is arranged between the first emitting pin and the first pad of the first limiting drive chip 491, and a fourth capacitor 4112 is arranged between the second emitting pin and the second pad of the first limiting drive chip 491. A fifth capacitor 4113 is arranged between the first port of the third switch and the third pad of the first limiting drive chip 491. A sixth capacitor 4114 is arranged between the second port of the third switch and the fourth pad of the first limiting drive chip 491.

[0219] A seventh capacitor 1445 is arranged between the third drive pin of the second limiting drive chip 492 and the positive electrode of the first light emitting chip 410, and an eighth capacitor 4116 is arranged between the fourth drive pin of the second limiting drive chip 492 and the negative electrode of the first light emitting chip 410.

[0220] A ninth capacitor 4117 is arranged between the seventh pad of the first limiting drive chip 491 and the positive electrode of the second light emitting chip 420, and a tenth capacitor 4118 is arranged between the eighth pad of the first limiting drive chip 491 and the negative electrode of the second light emitting chip 420.

[0221] In some embodiments of the present application, the bias circuit of the first light emitting chip 410 and the second light emitting chip 420 is also provided with an alternating current filter. The alternating current filter can be a resistor or an inductor.

[0222] As shown in the figure, the bias circuit is provided with an alternating current filter. The first power supply circuit is provided with a first alternating current filter and a seventh capacitor between the third driving pin of the second limiting driving chip 492. The second limiting driving chip 492 is provided with a second alternating current filter and an eighth capacitor between the ground output end and the fourth driving pin of the second limiting driving chip 492.

[0223] The second power supply circuit is provided with a third alternating current filter and a ninth capacitor between the seventh pad of the first limiting driving chip 491. The first limiting driving chip 491 is provided with a fourth alternating current filter and a tenth capacitor between the negative pad and the eighth pad of the first limiting driving chip 491.

[0224] In some examples of the present application, the first limiting driving chip 491 is integrated with a light driving circuit and a signal amplification circuit. The second limiting driving chip 492 is also integrated with a light driving circuit and a signal amplification circuit. The light driving circuit of the second limiting driving chip 492 is connected with the first light emitting chip 410, and is used to drive the first light emitting chip 410. The signal amplification circuit of the second limiting driving chip 492 is connected with a light receiving component, which converts the received light signal into a received electric signal. The received electric signal is amplified by the signal amplification circuit of the second limiting driving chip 492 and then transmitted to the upper computer through the gold finger.

[0225] Figure 23 A circuit schematic diagram of a light emitting component, a light receiving component and a circuit board according to some embodiments of the present application is provided. Figure 24 A circuit schematic diagram of a light emitting component and a light receiving component according to some embodiments of the present application is provided. As shown in the figure, Figure 25 and Figure 26 As shown in the figure, the first receiving pin of the light receiving component is connected with the fifth pad of the second limiting driving chip 492, and the second receiving pin of the light receiving component is connected with the sixth pad of the second limiting driving chip 492. The received electric signal is input into the second limiting driving chip 492 through the fifth pad of the second limiting driving chip 492 and the sixth pad of the second limiting driving chip 492. The received electric signal is amplified by the second limiting driving chip 492 and then output through the seventh pad of the second limiting driving chip 492 and the eighth pad of the second limiting driving chip 492.

[0226] The seventh pad of the second limiting driving chip 492 is connected with the first receiving pin of the gold finger, and the seventh pad of the second limiting driving chip 492 is connected with the second receiving pin of the gold finger, so as to transmit the received electric signal to the gold finger.

[0227] In some embodiments of the present application, the light emitting chip can also be a broadband tunable sampled grating laser, and the tuning of different wavelengths can be achieved by adjusting the supply voltage or supply current of the light emitting chip.

[0228] In some embodiments of the present application, when the first light emitting chip 410 and the second light emitting chip are broadband tunable sampled grating lasers, the optical module is provided with a voltage control circuit, and the tuning of different wavelengths can be achieved by adjusting the supply voltage or supply current of the light emitting chip.

[0229] Figure 27 A structural schematic diagram of an optical receiving component according to some embodiments of the present application. Figure 25 A sectional schematic diagram of an optical receiving component according to some embodiments of the present application. Figure 26 A partial schematic diagram of an optical receiving component according to some embodiments of the present application. As shown in Figure 27 , Figure 22 and Figure 28 , the optical receiving component includes a tube base 510, a tube cap 520, and other devices arranged in the tube cap 520 and the tube base 510. The tube cap 520 is arranged at one end of the tube base 510, and the tube base 510 includes a plurality of receiving pins 530 for realizing the electrical connection between the flexible circuit board and other electrical devices in the optical receiving component 500, and further realizing the electrical connection between the optical receiving component 500 and the circuit board 300. The present embodiment is only taken as an example of the structure shown in Figure 1 .

[0230] The tube cap 520 is buckled on the tube base 510 to form an optical receiving space, and the filter support 512, the third temperature regulator 511, the adjustable filter 514, the thermistor 513, the converging lens 515, the optical receiving chip 516, and the transimpedance amplification chip 517 are located in the optical receiving space. The center of the adjustable filter 514, the converging lens 515, and the optical receiving chip 516 is on the same vertical line, and they are coaxially arranged.

[0231] The third temperature regulator 511 can be a thermoelectric cooler (TEC). By adjusting the temperature of the adjustable filter, the kinetic energy of the molecules in the adjustable filter changes when the temperature changes. This can cause thermal expansion and contraction of the adjustable filter, or a reversible change in the molecular structure of the adjustable filter, thereby changing the refractive index emission of the adjustable filter. This causes changes in both the wavelength of the light signal passing through the adjustable filter and the wavelength of the light signal blocked by the adjustable filter. Consequently, light signals with wavelengths corresponding to the changed temperature can pass through the adjustable filter, while other wavelengths are blocked. Therefore, by using the third temperature regulator 511 to keep the adjustable filter at different temperatures, light signals of different wavelengths can pass through the adjustable filter.

[0232] Figure 29 This is a partially exploded view of an optical receiving component according to some embodiments of this application. Figure 2 . Figure 28 A partial exploded view of an optical receiving component provided according to some embodiments of this application. Figure 29 . Figure 28 and Figure 29 The disassembled light-receiving component is shown from different angles. For example... ​ and ​ As shown, the third temperature regulator 511 is located on the tube socket 510, and the filter support 512 is located above the third temperature regulator 511. Specifically, the lower surface of the third temperature regulator 511 is attached to the surface of the tube socket 510, wherein the lower surface of the third temperature regulator 511 is the negative terminal of the third temperature regulator 511, that is, in this application, the negative terminal of the third temperature regulator 511 is connected to the surface of the vertical tube socket 510; the upper surface of the third temperature regulator 511 is the positive terminal of the third temperature regulator 511, and the surface of the tube socket has TEC pins, the positive terminal of the TEC being electrically connected to the TEC pins; the filter support 512 is vertically mounted on the upper surface of the TEC, and the filter support 512 is used to support the adjustable filter 514 and the thermistor 513.

[0233] The filter holder 512 has stepped surfaces of different heights to support different optoelectronic devices. The filter holder 512 includes a first plate and a second plate, wherein the upper surface of the first plate is lower than the upper surface of the second plate. The lower surface of the first plate is connected to the upper surface of the third temperature regulator 511, and the upper surface of the second plate is higher than the upper surface of the first plate. A converging lens 515 and a light-receiving chip 516 are sequentially located below the second plate.

[0234] The upper surface of the filter holder 512 can be a plane or have different heights.

[0235] The second frame plate is provided with a through hole 5123, and the first optical signal is reflected to the displacement prism through the first lens 815, enters the converging lens 515 through the receiving light window and the through hole of the adjustable filter 514.

[0236] The surface temperature of the adjustable filter 514 is collected in real time by the thermistor 513, and the collected surface temperature of the adjustable filter 514 is fed back to the thermoelectric refrigerator driving circuit. The thermoelectric refrigerator driving circuit determines the current input to the third temperature regulator according to the received surface temperature of the adjustable filter 514, realizes heating or refrigeration of the adjustable filter 514, so that the adjustable filter 514 presents different temperatures to receive signal light of different wavelengths.

[0237] The thermistor 513 is located on the upper surface of the first frame plate 5121, and the thermistor 513 is arranged adjacent to the adjustable filter 514. In order to more accurately reflect the temperature of the adjustable filter 514, a gasket 5131 is also provided. The gasket 5131 is located between the thermistor 513 and the first frame plate 5121, and the upper surface of the gasket is flush with the upper surface of the second frame plate 5122, so that the thermistor 513 and the adjustable filter 514 are located at the same height, and the thermistor 513 abuts against the side wall of the adjustable filter 514. The thermal conductivity coefficient of the gasket is smaller than that of the filter support 512.

[0238] In order to facilitate the electrical connection between the thermistor 513 and the outside of the light receiving cavity, the gasket 5131 is provided with a thermistor signal line connected with the receiving pin. In order to reduce the wire length, the light receiving part is provided with a thermistor positive electrode pin 531 and a thermistor negative electrode pin 532. The thermistor positive electrode pin 531 and the thermistor negative electrode pin 532 protrude above the tube seat 510, and the surface of the thermistor positive electrode pin 531 and the thermistor negative electrode pin 532 is higher than the upper surface of the third temperature regulator 511, thereby shortening the distance between the pin and the thermistor 513.

[0239] The converging lens 515 can converge the signal light from the tunable filter 514 and then transmit the converged signal light to the light receiving chip 516. To achieve the installation of the converging lens 515, the light receiving component further comprises the light receiving chip 516 and the transimpedance amplification chip 517 located on the surface of the tube base 510, and the converging lens 515 is arranged above the light receiving chip 516. To facilitate the installation of the converging lens 515, the light receiving component is provided with a lens support 518 which supports the converging lens 515. In some embodiments, the lens support 518 comprises a first lens support column 5181 and a second lens support column 5182. One end of the first lens support column 5181 is connected with the tube base 510, and the other end of the first lens support column 5181 is connected with the converging lens 515. One end of the second lens support column 5182 is connected with the tube base 510, and the other end of the second lens support column 5182 is connected with the converging lens 515. The first lens support column and the second lens support column are respectively located on both sides of the light receiving chip 516, so that light can pass through the converging lens 515 and enter the light receiving chip 516.

[0240] The light receiving chip 516 can receive the signal light from the converging lens 515. The commonly used light receiving chip 516 is a photodetector APD, which is used to receive the optical signal sent by an external device and convert the optical signal sent by the external device into an electrical signal. The input pin of the transimpedance amplification chip 517 is connected with the output pin of the light receiving chip 516, which is used to convert the electrical signal output by the light receiving chip 516 into a voltage signal. The high-frequency signal input pin of the limiting amplification chip is connected with the output pin of the transimpedance amplification chip 517, which is used to amplify the voltage signal output by the transimpedance amplification chip 517. The input pin of the clock data recovery chip is connected with the high-frequency signal output pin of the limiting amplification chip, which is used to shape the voltage signal output by the limiting amplification chip. The output pin of the clock data recovery chip is connected with the golden finger. Through the golden finger, the signal received by the light receiving device can be sent to the upper computer.

[0241] In the application example, the converging lens 515 and the light receiving chip 516 are not in thermal contact with the upper surface of the third temperature regulator 511, which can effectively reduce the deformation of the converging lens 515 and the light receiving chip 516 during the temperature adjustment process of the third temperature regulator 511, and improve the coupling efficiency of light.

[0242] In some embodiments of the present application, the tunable filter 514 can be a single-cavity filter or a double-cavity filter.

[0243] The optical module in the embodiments of the present application comprises an adjustable filter 514, the adjustable filter 514 is a wavelength adjustable filter 514, and the third temperature regulator 511 can adjust the surface temperature of the adjustable filter 514, so that the adjustable filter 514 exhibits different surface temperatures, so that the adjustable filter has the ability to receive signal light of different wavelengths. For example, the TEC adjusts the surface temperature of the adjustable filter 514 to a first temperature, at which the first wavelength signal light can transmit through the adjustable filter 514, and the TEC can also adjust the surface temperature of the adjustable filter 514 to a second temperature, at which the second wavelength signal light can transmit through the adjustable filter 514. Therefore, in the present application, by adjusting the surface temperature of the adjustable filter 514, signal light of different wavelengths can transmit through the adjustable filter 514. The adjustable filter 514 in the present application can replace the plurality of filters in the traditional optical module structure.

[0244] In some embodiments of the present application, the first optical signal comprises signal light of at least two wavelengths. For example, the first optical signal comprises fifth wavelength signal light, sixth wavelength signal light, seventh wavelength signal light and eighth wavelength signal light. The wavelengths of the fifth wavelength signal light, the sixth wavelength signal light, the seventh wavelength signal light and the eighth wavelength signal light are different, and the wavelengths of the fifth wavelength signal light, the sixth wavelength signal light, the seventh wavelength signal light, the eighth wavelength signal light, the first wavelength signal light, the second wavelength signal light, the third wavelength signal light and the fourth wavelength signal light are all different. The wavelengths of the second optical signal comprise 1532.68 nm, 1533.47 nm, 1534.25 nm and 1535.04 nm; the wavelengths of the first optical signal comprise two or more of 1596.34 nm, 1597.19 nm, 1598.04 nm and 1598.89 nm; or the wavelengths of the second optical signal comprise 1596.34 nm, 1597.19 nm, 1598.04 nm and 1598.89 nm, and the wavelengths of the first optical signal comprise two or more of 1532.68 nm, 1533.47 nm, 1534.25 nm and 1535.04 nm.

[0245] The optical receiving component filters the first optical signal, and the optical receiver of the optical receiving component receives only signal light of one wavelength and converts the signal light into an electrical signal. The filtering of the first optical signal by the adjustable filter 514 is achieved by changing the temperature of the filter, that is, the filtering of the first optical signal by the adjustable filter 514 is achieved by changing the thermoelectric cooler.

[0246] In some embodiments of the present application, the filter temperature of the light receiving component is designed based on the temperature-wavelength of the light emitting component to avoid the simultaneous occurrence of the peak power of the transmitting end and the peak power of the receiving end. The higher the temperature, the greater the corresponding wavelength. The greater the temperature difference, the higher the power consumption of the optical module. Generally, the basic temperature of the optical module is higher than the temperature of the filter, so the lower the temperature of the adjustable filter 514, the greater the power consumption of the temperature regulator.

[0247] According to the communication protocol of the optical module, the wavelength of the light emitting component corresponds to the wavelength of the light receiving component one by one. For example, the wavelengths of the first, second, third, and fourth wavelength signal lights increase in turn, and the wavelengths of the fifth, sixth, seventh, and eighth wavelength signal lights increase in turn.

[0248] The emitted light of the light emitting component is the first wavelength signal light, and the corresponding received light of the light receiving component is the sixth wavelength signal light. Correspondingly, the emitted light of the light emitting component is the second wavelength signal light, and the corresponding received light of the light receiving component is the seventh wavelength signal light; the emitted light of the light emitting component is the third wavelength signal light, and the corresponding received light of the light receiving component is the eighth wavelength signal light; the emitted light of the light emitting component is the fourth wavelength signal light, and the corresponding received light of the light receiving component is the eighth wavelength signal light.

[0249] The present application designs the filter temperature of the light receiving component based on the temperature-wavelength of the light emitting component to avoid the simultaneous occurrence of the peak power of the transmitting end and the peak power of the receiving end. When the high temperature difference of the light emitting component is the maximum, the high temperature difference of the light receiving component is not the maximum; when the high temperature difference of the light emitting component is the minimum, the high temperature difference of the light receiving component is not the minimum.

[0250] The emitted light of the light emitting component is the first wavelength signal light, and the corresponding high temperature difference of the light emitting component is the first high temperature difference; the emitted light of the light emitting component is the second wavelength signal light, and the corresponding high temperature difference of the light emitting component is the second high temperature difference; the emitted light of the light emitting component is the third wavelength signal light, and the corresponding high temperature difference of the light emitting component is the third high temperature difference; the emitted light of the light emitting component is the fourth wavelength signal light, and the corresponding high temperature difference of the light emitting component is the fourth high temperature difference.

[0251] For the light receiving component, the high temperature difference plus the working temperature of the adjustable filter is the highest environmental temperature; the working temperature of the adjustable filter minus the low temperature difference is the lowest environmental temperature. The working temperature of the adjustable filter can also be called the temperature of the light receiving component.

[0252] The cumulative temperature difference is the temperature value that needs to be adjusted by the light emitting component and the light receiving component. The greater the cumulative temperature difference, the higher the power consumption of the optical module.

[0253] The received light of the light receiving component is a fifth wavelength signal light, and the high temperature difference value of the corresponding light emitting component is a fifth high temperature difference value; the received light of the light receiving component is a sixth wavelength signal light, and the high temperature difference value of the corresponding light emitting component is a sixth high temperature difference value; the received light of the light receiving component is a seventh wavelength signal light, and the high temperature difference value of the corresponding light emitting component is a seventh high temperature difference value; and the received light of the light receiving component is an eighth wavelength signal light, and the high temperature difference value of the corresponding light emitting component is an eighth high temperature difference value.

[0254] For example, the first high temperature difference, the second high temperature difference value, the third high temperature difference value, and the fourth high temperature difference value decrease in turn, and the seventh high temperature difference value, the eighth high temperature difference value, the fifth high temperature difference value, and the sixth high temperature difference value increase in turn.

[0255] Table three is a working temperature corresponding table of the light emitting component and the light receiving component of the first optical module. As shown in Table three, the highest environmental temperature of the optical module is 85℃, the emitted light of the light emitting component is a wavelength of 1562.68nm, the corresponding optical chip temperature is 25℃, and the emission high temperature difference value is 60℃; the received light of the light receiving component is a wavelength of 1596.34nm, the corresponding working temperature of the adjustable filter is 47℃, and the receiving high temperature difference value is 38℃. At this time, the cumulative temperature difference value of the optical module is 98℃.

[0256] The emitted light of the light emitting component is a wavelength of 1533.47nm, the corresponding optical chip temperature is 35℃, and the emission high temperature difference value is 50℃; the received light of the light receiving component is a wavelength of 1597.19nm, the corresponding working temperature of the adjustable filter is 57℃, and the receiving high temperature difference value is 28℃. At this time, the cumulative temperature difference value of the optical module is 78℃.

[0257] The emitted light of the light emitting component is a wavelength of 1534.25nm, the corresponding optical chip temperature is 45℃, and the emission high temperature difference value is 40℃; the received light of the light receiving component is a wavelength of 1598.04nm, the corresponding working temperature of the adjustable filter is 25℃, and the receiving high temperature difference value is 60℃. At this time, the cumulative temperature difference value of the optical module is 100℃.

[0258] The emitted light of the light emitting component is a wavelength of 1535.04nm, the corresponding optical chip temperature is 55℃, and the emission high temperature difference value is 30℃; the received light of the light receiving component is a wavelength of 1598.59nm, the corresponding working temperature of the adjustable filter is 35℃, and the receiving high temperature difference value is 50℃. At this time, the cumulative temperature difference value of the optical module is 80℃.

[0259]

[0260] The application designs the filter temperature of the light receiving component based on the temperature-wavelength of the light emitting component to avoid the simultaneous occurrence of the peak power of the transmitting end and the peak power of the receiving end. When the low temperature difference value of the light emitting component is maximum, the low temperature difference value of the light receiving component is not maximum; when the low temperature difference value of the light emitting component is minimum, the low temperature difference value of the light receiving component is not minimum.

[0261] The emitting light of the light emitting component is first wavelength signal light, and the corresponding low temperature difference value of the light emitting component is first low temperature difference value; the emitting light of the light emitting component is second wavelength signal light, and the corresponding low temperature difference value of the light emitting component is second low temperature difference value; the emitting light of the light emitting component is third wavelength signal light, and the corresponding low temperature difference value of the light emitting component is third low temperature difference value; the emitting light of the light emitting component is fourth wavelength signal light, and the corresponding low temperature difference value of the light emitting component is fourth low temperature difference value.

[0262] The receiving light of the light receiving component is fifth wavelength signal light, and the corresponding low temperature difference value of the light emitting component is fifth low temperature difference value; the receiving light of the light receiving component is sixth wavelength signal light, and the corresponding low temperature difference value of the light emitting component is sixth low temperature difference value; the receiving light of the light receiving component is seventh wavelength signal light, and the corresponding low temperature difference value of the light emitting component is seventh low temperature difference value; the receiving light of the light receiving component is eighth wavelength signal light, and the corresponding low temperature difference value of the light emitting component is eighth low temperature difference value.

[0263] For example, the first low temperature difference, the second low temperature difference value, the third low temperature difference value, and the fourth low temperature difference value increase in turn, and the seventh high temperature difference value, the eighth high temperature difference value, the fifth high temperature difference value, and the sixth high temperature difference value decrease in turn.

[0264]

[0265] Table four is a working temperature corresponding table of the light emitting component and the light receiving component of the second kind of optical module. As shown in Table four, the lowest environmental temperature of the optical module is -40℃, the emitting light of the light emitting component is wavelength 1562.68nm, the corresponding optical chip temperature is 25℃, and the transmitting low temperature difference value is 65℃; the receiving light of the light receiving component is wavelength 1596.34nm, the corresponding adjustable filter temperature is 47℃, and the receiving low temperature difference value is 87℃. At this time, the cumulative temperature difference value of the optical module is 152℃.

[0266] The emitting light of the light emitting component is wavelength 1533.47nm, the corresponding optical chip temperature is 35℃, and the transmitting low temperature difference value is 75℃; the receiving light of the light receiving component is wavelength 1597.19nm, the corresponding adjustable filter temperature is 57℃, and the receiving low temperature difference value is 97℃. At this time, the cumulative temperature difference value of the optical module is 172℃.

[0267] The light emitted by the optical emitting component has a wavelength of 1534.25nm, corresponding to an optical chip temperature of 45℃, resulting in a high temperature difference of 85℃. The light received by the optical receiving component has a wavelength of 1598.04nm, corresponding to an adjustable filter temperature of 25℃, resulting in a low temperature difference of 65℃. Therefore, the cumulative temperature difference of the optical module is 150℃.

[0268] The light emitted by the optical emitting component has a wavelength of 1535.04nm, corresponding to an optical chip temperature of 55℃, resulting in a high temperature difference of 95℃. The light received by the optical receiving component has a wavelength of 1598.59nm, corresponding to an adjustable filter temperature of 35℃, resulting in a low temperature difference of 75℃. Therefore, the cumulative temperature difference of the optical module is 170℃.

[0269] By staggering the temperature difference between the optical transmitting and receiving components, the simultaneous occurrence of peak power at the transmitting and receiving ends is avoided, thus reducing power consumption. This application designs the filtering temperature of the optical receiving component based on the temperature-wavelength relationship of the optical transmitting component, preventing the simultaneous occurrence of peak power at both ends. When the temperature difference of the optical transmitting component is at its maximum, the temperature difference of the optical receiving component is not at its maximum; conversely, when the temperature difference of the optical transmitting component is at its minimum, the temperature difference of the optical receiving component is not at its minimum. This avoids the simultaneous occurrence of peak power at both ends, reducing power consumption.

[0270] In another example of this application, the light emitting component includes a first light emitting chip and a second light emitting chip, wherein: at a first temperature, the first light emitting chip emits a first wavelength signal light and the second light emitting chip emits a third wavelength signal light; at a second temperature, the first light emitting chip emits a second wavelength signal light and the second light emitting chip emits a fourth wavelength signal light; the first temperature is lower than the second temperature; the wavelengths of the first wavelength signal light, the second wavelength signal light, the third wavelength signal light, and the fourth wavelength signal light increase sequentially.

[0271] The ratio of the high temperature difference of the light-emitting component to the ambient temperature threshold is less than or equal to 40%; the ambient temperature threshold is the difference between the highest and lowest ambient temperatures, and the high temperature difference of the light-emitting component is the difference between the highest ambient temperature and the operating temperature of the light-emitting component. The ratio of the low temperature difference of the light-emitting component to the ambient temperature threshold is less than or equal to 80%, wherein the low temperature difference of the light-emitting component is the difference between the operating temperature of the light-emitting component and the lowest ambient temperature. In this embodiment, the operating temperature of the light-emitting component is a first temperature and a second temperature.

[0272] The light received by the light receiving component includes wavelength in turn increasing: the fifth wavelength signal light, the sixth wavelength signal light, the seventh wavelength signal light, the eighth wavelength signal. The operating temperature of the light receiving component corresponding to the fifth wavelength signal light, the eighth wavelength signal light, the seventh wavelength signal light, the sixth wavelength signal light is in turn reduced. The operating temperature of the tunable filter is the operating temperature of the light receiving component.

[0273]

[0274] Table five is another light module of the light emitting component and the light receiving component operating temperature corresponding table. As shown in table five, the highest ambient temperature of the light module is 85℃, the emission light of the light emitting component is wavelength 1562.68nm, the corresponding light chip temperature is 35℃, the emission high temperature difference is 50℃; The received light of the light receiving component is wavelength 1596.34nm, the corresponding operating temperature of the tunable filter is 57℃, the receiving high temperature difference is 28℃. At this time, the cumulative temperature difference of the light module is 88℃.

[0275] The emission light of the light emitting component is wavelength 1533.47nm, the corresponding light chip temperature is 45℃, the emission high temperature difference is 40℃; The received light of the light receiving component is wavelength 1597.19nm, the corresponding operating temperature of the tunable filter is 25℃, the receiving high temperature difference is 60℃. At this time, the cumulative temperature difference of the light module is 100℃.

[0276] The emission light of the light emitting component is wavelength 1534.25nm, the corresponding light chip temperature is 35℃, the emission high temperature difference is 50℃; The received light of the light receiving component is wavelength 1598.04nm, the corresponding operating temperature of the tunable filter is 35℃, the receiving high temperature difference is 50℃. At this time, the cumulative temperature difference of the light module is 85℃.

[0277] The emission light of the light emitting component is wavelength 1535.04nm, the corresponding light chip temperature is 45℃, the emission high temperature difference is 40℃; The received light of the light receiving component is wavelength 1598.59nm, the corresponding operating temperature of the tunable filter is 47℃, the receiving high temperature difference is 38℃. At this time, the cumulative temperature difference of the light module is 78℃.

[0278] Or as shown in Table six, the light emitting component includes a first light emitting chip and a second light emitting chip, wherein: at a first temperature, the first light emitting chip emits first wavelength signal light, and the second light emitting chip emits third wavelength signal light; at a second temperature, the first light emitting chip emits second wavelength signal light, and the second light emitting chip emits fourth wavelength signal light; the first temperature is less than the second temperature; the wavelengths of the first wavelength signal light, the second wavelength signal light, the third wavelength signal light, and the fourth wavelength signal light increase in turn. The light received by the light receiving component includes fifth wavelength signal light, sixth wavelength signal light, seventh wavelength signal light, and eighth wavelength signal light, whose wavelengths increase in turn. The working temperatures of the light receiving component corresponding to the seventh wavelength signal light, the sixth wavelength signal light, the fifth wavelength signal light, and the eighth wavelength signal light decrease in turn. The working temperature of the adjustable filter is the working temperature of the light receiving component.

[0279]

[0280] By mismatching the high temperature difference of the light emitting component and the high temperature difference of the light receiving component, the peak power of the transmitting end and the peak power of the receiving end can be avoided from appearing at the same time, and the power consumption can be reduced. The temperature-wavelength of the light emitting component is used as the basis to design the filter temperature of the light receiving component, so as to avoid the peak power of the transmitting end and the peak power of the receiving end from appearing at the same time. When the high temperature difference of the light emitting component is the maximum, the high temperature difference of the light receiving component is not the maximum; when the low temperature difference of the light emitting component is the minimum, the high temperature difference of the light receiving component is not the minimum. The peak power of the transmitting end and the peak power of the receiving end can be avoided from appearing at the same time, and the power consumption can be reduced.

[0281] Since the above embodiments are described by referring to other manners, the same parts are the same between different embodiments, and the same parts between different embodiments are referred to each other in this specification. Here, no further elaboration is made.

[0282] It should be noted that, in this specification, the relationship terms such as “first” and “second” are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between the entities or operations. Moreover, the terms “include”, “contain” or any other variants thereof are intended to cover non-exclusive inclusion, so that the circuit structure, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to the circuit structure, article or device. Without more limitations, the element defined by the phrase “including a…” does not exclude the presence of another same element in the circuit structure, article or device including the element.

[0283] Other embodiments of the application will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. It is intended that the specification and examples be considered as exemplary only, with the true scope and spirit of the application being indicated by the contents of the following claims.

[0284] The above-described embodiments of the application do not constitute a limitation in terms of the protection scope of the application.

Claims

1. An optical module characterized by comprising: Comprising: a laser drive chip, the laser drive chip having a first differential output pin and a second differential output pin, a signal carried by the first differential output pin and a signal carried by the second differential output pin being a set of differential mode signals; a first light emitting chip connected with the first differential output pin; a second light emitting chip connected with the second differential output pin; the first light emitting chip and the second light emitting chip being electro-absorption modulated lasers; a first temperature regulator, the first light emitting chip and the second light emitting chip sharing the first temperature regulator to adjust wavelengths of the first light emitting chip and the second light emitting chip; and, a micro control unit electrically connected with the first temperature regulator; wherein the first light emitting chip has a first light emitting pin, a first modulation pin and a first ground pin, the first ground pin being electrically connected with a ground line, the first modulation pin being connected with the first differential output pin, and the first light emitting pin being connected with a power supply circuit; a second modulation pin of the second light emitting chip being connected with the second differential output pin; the micro control unit controlling an operating temperature of the first temperature regulator to adjust wavelengths of the first light emitting chip and the second light emitting chip; at a first temperature, a tuned wavelength of the first light emitting chip being a first wavelength and a tuned wavelength of the second light emitting chip being a third wavelength; at a second temperature, the tuned wavelength of the first light emitting chip being a second wavelength and the tuned wavelength of the second light emitting chip being a fourth wavelength; the first wavelength, the second wavelength, the third wavelength and the fourth wavelength increasing or decreasing in turn.

2. The optical module according to claim 1, characterized by a first straight wave filter being provided between the first modulation pin and the first differential output pin.

3. The optical module according to claim 1, characterized by the second light emitting chip has a second light emitting pin, a second electro-absorption modulation pin and a second ground pin, the second ground pin being electrically connected with a ground line, the second electro-absorption modulation pin being connected with the second differential output pin, and the second light emitting pin being connected with a power supply circuit.

4. The optical module according to claim 1, characterized by Further comprising: a temperature sensor, the temperature sensor being in heat conduction connection with the first temperature regulator; the temperature sensor further being connected with the micro control unit, the micro control unit adjusting an operating voltage of the first temperature regulator according to a temperature of the temperature sensor.

5. The optical module of claim 1, wherein, the first temperature regulator being a semiconductor refrigerator.

6. An optical module characterized by comprising: Comprising: a laser drive chip, the laser drive chip having a first differential output pin and a second differential output pin, a signal carried by the first differential output pin and a signal carried by the second differential output pin being a set of differential mode signals; a first light emitting chip connected with the first differential output pin; a second light emitting chip connected with the second differential output pin; the first light emitting chip and the second light emitting chip being electro-absorption modulated lasers; a first temperature regulator in heat conduction connection with the first light emitting chip to adjust a wavelength of the first light emitting chip; a second temperature regulator in heat conduction connection with the second light emitting chip to adjust a wavelength of the second light emitting chip; and, A micro control unit is electrically connected with the first temperature regulator and the second temperature regulator; The first light emitting chip has a first light emitting pin, a first modulation pin and a first ground pin, the first ground pin is electrically connected with a ground line, the first modulation pin is connected with the first differential output pin, and the first light emitting pin is connected with a power supply circuit; The micro control unit controls the working temperature of the first temperature regulator and the second temperature regulator.

7. The optical module according to claim 6, characterized by The tuning wavelength of the first light emitting chip is a first wavelength and a second wavelength, the tuning wavelength of the second light emitting chip is a third wavelength and a fourth wavelength, the first wavelength, the second wavelength, the third wavelength and the fourth wavelength are different from each other, and the first wavelength, the second wavelength, the third wavelength and the fourth wavelength increase or decrease in turn.

8. The optical module according to claim 6, characterized by Further comprising: A first temperature sensor is in heat conduction connection with the first temperature regulator, and the first temperature sensor is also connected with the micro control unit, and the micro control unit adjusts the working voltage of the first temperature regulator according to the temperature of the first temperature sensor; A second temperature sensor is in heat conduction connection with the second temperature regulator; The second temperature sensor is also connected with the micro control unit, and the micro control unit adjusts the working voltage of the second temperature regulator according to the temperature of the second temperature sensor.

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