A method of making a screen print

Abstract

The application discloses a kind of screen printing manufacturing method, including the step of stretching net, hot melting step, top frame step, gluing step, cutting step, immersion step and pattern forming step, the pattern forming step of traditional screen printing manufacturing method is first in steel wire mesh surface pressure film, then through CAD mapping preset pattern, finally through laser cutting according to preset pattern on PI surface, this method is slow, production efficiency is low, the PI solution of the steel wire mesh surface immersed in PI solution is UV cured and forms PI film in the process of forming pattern by the application through LDI technology directly forming pattern on PI surface.The application has the advantages that the time of forming pattern by laser cutting is greatly shortened, the manufacturing process is simplified and modified, the deviation caused by multiple processes is avoided, the product precision is greatly improved, the digitalization and intelligentization of production and manufacturing are realized, the pattern forming efficiency is improved, and mass production of electronic components is facilitated.

Description

Technical Field

[0001] This invention relates to the field of screen printing, and more particularly to a method for producing screen printing. Background Technology

[0002] Screen printing refers to the process of creating a screen printing plate with images and text using a photosensitive method. Screen printing consists of five main elements: the screen printing plate, the squeegee, the ink, the printing table, and the substrate. It utilizes the basic principle that ink can pass through the mesh openings of the screen printing plate in the image areas, while ink cannot pass through the openings in the non-image areas. During printing, ink is poured into one end of the screen printing plate, and a squeegee applies pressure to the ink areas while moving at a constant speed towards the other end. As the squeegee moves, the ink is forced through the mesh openings in the image areas onto the substrate.

[0003] For a long time, screen printing has been used in many industries. Its main processes are: screen stretching → coating → exposure → development → inspection → packaging and shipping. The printing of electronic pastes in the production of passive electronic components has also used this process. Its advantages are its maturity, but it also has many disadvantages, such as short lifespan, low precision, and an environmentally unfriendly process. Later, a laser + PI composite screen printing process emerged. Its process flow is: frame cleaning → applying base adhesive → PE hot-melt → top frame → applying adhesive → screen cutting → PI lamination → CAD drawing → laser cutting → inspection → packaging and shipping. This process eliminates emulsion coating and pattern transfer, replacing the emulsion with a hot-pressed PI film. The laser cuts the desired pattern onto the PI film, improving the pattern and printing precision and significantly extending the lifespan. However, it is inefficient for complex patterns, affecting normal production and preventing large-scale production and supply. Summary of the Invention

[0004] This invention provides a screen printing method to solve the problem that the low efficiency of laser cutting in the existing printing process of electronic paste for passive electronic components prevents the large-scale production of electronic components.

[0005] To solve the above-mentioned technical problems, the present invention discloses the following technical solution:

[0006] This invention provides a method for screen printing, including a screen stretching step, a hot-melt step, a top frame step, an adhesive application step, a cutting step, an immersion step, and a pattern forming step.

[0007] The stretching step involves fixing the stretched polyester mesh to the lower surface of the first mesh frame; the heat-melting step involves placing PE adhesive rings and steel wire mesh sequentially on the lower surface of the polyester mesh, with the PE adhesive rings and steel wire mesh positioned opposite to the internal space of the first mesh frame, and then performing a heat-pressing treatment on the steel wire mesh and the polyester mesh, whereby the heat-melted PE adhesive rings adhere the steel wire mesh to the lower surface of the polyester mesh, forming a polymer layer; the top frame step involves abutting the second mesh frame against the lower surface of the steel wire mesh of the polymer layer; the adhesive application step involves evenly applying adhesive to the mesh. The process involves brushing the steel wire mesh onto its surface, causing it to adhere to the lower surface of the second frame; the cutting step involves cutting the polymer layer along the outer edge of the second frame; the immersion step involves placing the cut second frame with the steel wire mesh into a transparent container filled with PI solution; the pattern forming step involves placing a laser generator below the transparent container and projecting a preset pattern onto the steel wire mesh on the lower surface of the second frame using laser direct writing technology, and then UV curing the PI solution to form a patterned PI polymer layer.

[0008] Furthermore, in the hot-melt step, the PE rubber ring is a square ring, which is positioned opposite the edge of the wire mesh.

[0009] Furthermore, a cleaning step is included before the stretching step, wherein the cleaning step is to clean the first wire frame.

[0010] Furthermore, after the stretching step, a base coat application step is also included. The base coat application step involves evenly applying the base coat to the contact surface between the first mesh frame and the polyester mesh fabric, and letting it stand for a period of time until the base coat is air-dried.

[0011] Furthermore, in the pattern forming step, the laser direct writing technology uses UV light. When the UV light irradiates the PI solution, a PI film is formed on the surface of the wire mesh.

[0012] Furthermore, in the pattern forming step, the PI solution is UV cured using ultraviolet light.

[0013] Furthermore, the temperature of the PI solution is preset to a solution temperature threshold.

[0014] Furthermore, the energy of the UV light is preset to an energy threshold.

[0015] Furthermore, the wavelength of the UV light is preset to a wavelength threshold.

[0016] Furthermore, when the second mesh frame is immersed in the PI solution, the lower surface of the second mesh frame faces the bottom of the transparent container.

[0017] Furthermore, the pattern forming step includes: setting a preset light temperature threshold, so that UV light irradiates the PI solution at the light temperature threshold; setting a preset light duration threshold, so that UV light irradiates the PI solution at the light temperature threshold for the light duration threshold; wherein, the thickness of the PI film can be controlled by setting the preset light temperature threshold and the light duration threshold.

[0018] Compared with the prior art, the present invention has at least the following technical effects: This invention provides a screen printing manufacturing method, including a screen stretching step, a hot-melt step, a top frame step, an adhesive application step, a cutting step, an immersion step, and a pattern forming step. Traditional screen printing methods involve first pressing a film onto the surface of a steel wire mesh, then pre-setting the pattern using CAD drawing, and finally cutting the PI surface according to the pre-set pattern using a laser. This method is slow and inefficient. This invention uses LDI technology to directly form patterns on the PI surface. During the pattern forming process, the PI solution on the surface of the steel wire mesh immersed in the PI solution is UV-cured to form a PI film, greatly shortening the laser cutting time for pattern formation. This simplifies and transforms the manufacturing process, avoids deviations caused by multiple processes, significantly improves product precision, realizes digital and intelligent manufacturing, improves pattern forming efficiency, and facilitates large-scale production of electronic components. Attached Figure Description

[0019] The technical solution of the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0020] Figure 1 This is a flowchart of the screen printing manufacturing method according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the hot-melting step described in an embodiment of the present invention; Figure 3 This is a schematic diagram of the top frame step described in an embodiment of the present invention; Figure 4 This is a schematic diagram of the second mesh frame after the cutting step described in an embodiment of the present invention; Figure 5 This is a schematic diagram of laser direct writing forming a pattern on a steel wire mesh according to an embodiment of the present invention.

[0021] The components in the diagram are labeled as follows: 100 First mesh frame, 200 Polyester mesh, 300 Steel wire mesh, 400 PE rubber ring, 500 Second mesh frame, 510 Lower surface of the second mesh frame, 520 Upper surface of the second mesh frame, 600 Polymer layer, 610 Target polymer layer, 700 PI solution, 800 Transparent container. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0023] The technical solutions in the embodiments of this application will be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. Furthermore, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "up," "down," "left," and "right" generally refer to up, down, left, and right in the actual use or working state of the device, specifically the drawing directions in the accompanying drawings.

[0024] This invention provides a screen printing manufacturing method to solve the problems of low production efficiency and inability to mass-produce passive electronic components due to the difficulty in ensuring laser cutting accuracy and slow laser cutting speed in existing manufacturing processes.

[0025] This application provides a method for screen printing, including step S1) cleaning step, step S2) screen stretching step, step S3) applying base adhesive step, step S4) hot melt step, step S5) top frame step, step S6) applying adhesive step, step S7) cutting step, step S8) immersion step, and step S9) pattern forming step.

[0026] Step S1) Cleaning step: Clean the first wire mesh frame 100 to remove residual glue, debris and dust, check whether the first wire mesh frame 100 is damaged or deformed, and ensure the cleanliness and flatness of the surface of the first wire mesh frame 100.

[0027] Step S2) The stretching step involves fixing the stretched polyester mesh 200 to the lower surface of the first mesh frame. Since the polyester mesh 200 is soft, it is stretched and fixed to the first mesh frame 100 to form a polyester mesh plane with a certain support force, which facilitates its bonding with the wire mesh 300. This can prevent the position of the wire mesh 300 from shifting in subsequent processes, thus ensuring processing accuracy.

[0028] Step S3) Apply base adhesive: Apply base adhesive evenly to the contact surface between the first frame 100 and the polyester mesh 200, and let it stand for a period of time until the base adhesive is dried. Applying base adhesive is to enhance the adhesion between the mesh and the frame and improve the printing quality.

[0029] Step S4) Hot-melt step: PE adhesive ring 400 and steel wire mesh 300 are placed sequentially on the lower surface of the polyester mesh fabric 200, so that the PE adhesive ring 400 and steel wire mesh 300 are positioned opposite to the internal space of the frame of the first mesh frame 100. The PE adhesive ring 400 is a square ring and is positioned opposite to the edge of the steel wire mesh 300. The steel wire mesh 300 and the polyester mesh fabric 200 are subjected to hot-press treatment. The hot-melted PE adhesive ring 400 adheres the steel wire mesh 300 to the lower surface of the polyester mesh fabric 200, forming a polymer layer 600. The thickness of the PE adhesive ring 400 is 150μm~170μm, and the thickness of the polymer layer 600 is determined according to the material requirements.

[0030] Step S5) Top frame step: The second mesh frame 500 is abutted against the lower surface of the wire mesh 300 of the polymer layer 600. The polymer layer 600 attached to the bottom surface of the second mesh frame 500 is defined as the target polymer layer 610. Specifically, the through-hole area enclosed by the second mesh frame 500 is smaller than the through-hole area enclosed by the first mesh frame 100, that is, the second mesh frame 500 can be contained within the frame of the first mesh frame 100. At this time, the second mesh frame 500 is used to hold the wire mesh 300 of the polymer layer 600, so that the target polymer layer 610 forms a flat plane on the lower surface 510 of the second mesh frame, ensuring the flatness of the wire mesh 300 surface, so that the height of the subsequent laser direct writing pattern relative to the wire mesh 300 remains consistent, thereby improving the effect of the laser direct writing pattern of the wire mesh 300.

[0031] Step S6) Applying adhesive: Apply the adhesive evenly to the surface of the wire mesh 300 so that the wire mesh 300 is bonded to the lower surface 510 of the second frame and the target polymer layer 610 is firmly bonded to the lower surface 510 of the second frame.

[0032] Step S7) Cutting step: Cut the polymer layer 600 along the outer edge of the second mesh frame 500 and cut the target polymer layer 610 off the polymer layer 600. At this time, the target polymer layer 610 is adhered to the lower surface 510 of the second mesh frame.

[0033] Step S8) Immersion step: The cut second mesh frame 500 with wire mesh 300 is placed in a transparent container 800 containing PI solution 700. In this embodiment, the transparent container 800 is a quartz glass vessel. The wire mesh 300 of the target polymer layer 610 faces downward, that is, the lower surface 510 of the second mesh frame faces the bottom of the transparent container 800, and the upper surface 520 of the second mesh frame faces outward from the transparent container 800. The target polymer layer 610 and the second mesh frame 500 are immersed in the PI solution 700 in this way to avoid the target polymer layer 610 of the second mesh frame 500 not being fully immersed in the PI solution due to the buoyancy of the PI solution 700, which would affect the formation of a complete PI film with the required thickness on the surface of the wire mesh 300 of the target polymer layer 610.

[0034] Step S9) Pattern Forming Step: Place the laser generator below the transparent container 800 and project the preset pattern onto the wire mesh 300 on the lower surface of the second frame 500 using laser direct writing technology. Perform UV curing treatment on the PI solution 700 to form a PI polymer layer with a pattern. Specifically, the pattern is formed only on the wire mesh 300 using laser direct writing technology and will not damage the integrity of the polyester mesh 200.

[0035] Furthermore, in step S9) the pattern forming step, the laser direct writing technology uses UV light. When the UV light irradiates the PI solution 700, a PI film is formed on the surface of the wire mesh. The thickness of the PI film is determined by the duration of UV light irradiation and the temperature of UV light irradiation.

[0036] In this embodiment, a preset light temperature threshold is used to irradiate the PI solution 700 with UV light at the preset light temperature threshold; a preset light duration threshold is also used to irradiate the PI solution 700 with UV light at the preset light temperature threshold for the preset light duration threshold. The thickness of the PI film can be controlled by presetting the light temperature threshold and the light duration threshold, ensuring that the thickness of the PI film is between 2μm and 25μm, which is considered satisfactory. Different preset light temperature thresholds and light duration thresholds can be used to form PI films of different thicknesses as needed.

[0037] Furthermore, in step S9) pattern formation step, the PI solution 700 is UV cured using ultraviolet light. Specifically, the UV light includes the ultraviolet band. When the preset pattern is engraved on the wire mesh 300 using LDI technology, since the wire mesh 300 is immersed in the PI solution 700, the PI film is formed simultaneously even when the pattern is formed on the wire mesh 300, saving time in the process.

[0038] Furthermore, the temperature of the PI solution 700 is preset to a solution temperature threshold, the solution temperature threshold being in the range of 280℃~300℃.

[0039] Furthermore, the energy of the UV light is preset to an energy threshold of 100 millijoules. By controlling the energy of the UV light, the thickness of the PI film can also be controlled.

[0040] Furthermore, the wavelength of the UV light is preset to a wavelength threshold of 405 nanometers.

[0041] The advantages of this application are that it provides a screen printing manufacturing method, including a screen stretching step, a hot-melt step, a top frame step, an adhesive application step, a cutting step, an immersion step, and a pattern forming step. The pattern forming step of the traditional screen printing manufacturing method is to first press a film on the surface of the wire mesh, then preset the pattern through CAD drawing, and finally cut the PI surface according to the preset pattern by laser. This method is slow and has low production efficiency. The present invention directly forms the pattern on the PI surface through LDI technology. During the pattern forming process, the PI solution on the surface of the wire mesh immersed in the PI solution will be UV cured to form a PI film, which greatly shortens the laser cutting time for pattern forming. It simplifies and transforms the manufacturing process, avoids the deviation caused by multiple processes, greatly improves product accuracy, realizes the digitalization and intelligentization of production and manufacturing, improves the pattern forming efficiency, and facilitates the large-scale production of electronic components.

[0042] The above provides a detailed description of a screen printing method provided by the embodiments of the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of the present invention. Those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for producing screen printing, characterized in that, include: The stretching step involves securing the stretched polyester mesh to the lower surface of the first mesh frame; In the hot-melt step, PE rubber rings and steel wire mesh are placed sequentially on the lower surface of the polyester mesh, so that the PE rubber rings and steel wire mesh are positioned opposite to the internal space of the first mesh frame. The steel wire mesh and the polyester mesh are subjected to hot-press treatment, and the hot-melt PE rubber rings adhere the steel wire mesh to the lower surface of the polyester mesh to form a polymer layer. In the top frame step, the second mesh frame is abutted against the lower surface of the wire mesh of the polymer layer; In the adhesive application step, the adhesive is evenly applied to the surface of the wire mesh, so that the wire mesh is bonded to the lower surface of the second frame. The cutting step involves cutting the polymer layer along the outer edge of the second mesh frame; In the immersion step, the cut-off second mesh frame with wire mesh is placed in a transparent container filled with PI solution. as well as In the pattern formation step, a laser generator is placed below the transparent container, and a preset pattern is projected onto the wire mesh on the lower surface of the second frame using laser direct writing technology. The PI solution is then subjected to UV curing treatment to form a PI polymer layer with a pattern.

2. The method for producing screen printing as described in claim 1, characterized in that, In the hot melt step, The PE rubber ring is a square ring, which is positioned opposite the edge of the wire mesh.

3. The method for producing screen printing as described in claim 1, characterized in that, The following steps are included prior to the mesh stretching step: The cleaning step involves cleaning the first wire frame; The process after the mesh stretching step also includes: In the base coat application step, the base coat is evenly applied to the contact surface between the first mesh frame and the polyester mesh fabric, and left to stand for a period of time until the base coat is air-dried.

4. The method for producing screen printing as described in claim 1, characterized in that, In the pattern forming step, The laser direct writing technology uses UV light. When the UV light irradiates the PI solution, a PI film is formed on the surface of the wire mesh.

5. The method for producing screen printing as described in claim 1, characterized in that, In the pattern forming step, The PI solution is UV-cured using ultraviolet light.

6. The method for producing screen printing as described in claim 1, characterized in that, The temperature of the PI solution is preset to a solution temperature threshold.

7. The method for producing screen printing as described in claim 4, characterized in that, The energy of the UV light is preset to an energy threshold.

8. The method for producing screen printing as described in claim 4, characterized in that, The wavelength of the UV light is preset to a wavelength threshold.

9. The method for producing screen printing as described in claim 1, characterized in that, When the second mesh frame is immersed in the PI solution, the lower surface of the second mesh frame faces the bottom of the transparent container.

10. The method for producing screen printing as described in claim 4, characterized in that, The pattern forming step includes: A preset light temperature threshold is set so that the UV light irradiates the PI solution at the light temperature threshold. A preset illumination duration threshold is set so that the UV light irradiates the PI solution with the illumination temperature threshold for the specified illumination duration threshold. The thickness of the PI film can be controlled by presetting the light temperature threshold and the light duration threshold.

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