A PCB screen printing automatic adjustment method, system, electronic equipment and medium

Abstract

The present invention relates to a PCB silk screen automatic adjustment method, system, electronic device and medium, the method comprising: obtaining a PCB file to be processed, the PCB file to be processed including each component and the silk screen position number corresponding to each component; for each component, marking the silk screen position number corresponding to the component to the coordinates of the center position of the component; for each component, identifying the first area corresponding to the silk screen position number corresponding to the component and the second area corresponding to the component; identifying a target area matching the first area in the area outside the second area corresponding to the component, and adjusting the silk screen position number corresponding to the component from the first area to the target area. Through the method of the present invention, the silk screen position number of each component is automatically marked, which reduces manual intervention and ensures the correctness of the silk screen position number.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB design, and in particular to a PCB screen printing automatic adjustment method, system, electronic equipment and medium. Background Art

[0002] There is an important link in the PCB design process - silk screen adjustment, which includes adjusting the device bit number so that it can clearly identify the location of the device; the adjustment of the 1-pin mark and polarity mark can mark the direction of the device;

[0003] Correct silk screen position numbers can ensure the accuracy of welding. Wrong or ambiguous markings will mislead the welding process, causing the welding problem to be confirmed again, increasing the time taken by the process, and even directly leading to welding errors, which will cause great trouble for subsequent debugging. It often takes a long time to locate the problem. The cause of the problem may be simply an error or inaccuracy in the position of the polarity mark.

[0004] Typically, the silk-screen position numbers and polarity markings are manually adjusted one by one by the designer, which can lead to errors. A secondary check can avoid problems, but it is still impossible to completely eliminate such problems. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a PCB screen printing automatic adjustment method, system, electronic equipment and medium, aiming to solve at least one of the above technical problems.

[0006] In the first aspect, the technical solution of the present invention to solve the above technical problem is as follows: a PCB screen printing automatic adjustment method, the method comprising:

[0007] Obtain a PCB file to be processed, wherein the PCB file to be processed includes each component and a silk screen position number corresponding to each component;

[0008] For each of the components, mark the silk screen number corresponding to the component to the coordinates of the center position of the component;

[0009] For each of the components, identifying a first area corresponding to the silk-screen number corresponding to the component and a second area corresponding to the component;

[0010] For each of the components, a target area matching the first area is identified in an area outside the second area corresponding to the component, and the silk screen number corresponding to the component is adjusted from the first area to the target area.

[0011] The beneficial effect of the present invention is that the present invention automatically matches and marks each component in the PCB file to be processed and the silk-screen position number corresponding to each component, thereby automatically marking the silk-screen position number of each component, reducing manual intervention and ensuring the correctness of the silk-screen position number.

[0012] Based on the above technical solution, the present invention can also be improved as follows.

[0013] Furthermore, for any two adjacent components among all components, the any two adjacent components are respectively a first component and a second component, if there is an overlap between the target area corresponding to the first component and the target area corresponding to the second component, the method further includes:

[0014] If there is one target area corresponding to the first component, and there are at least two target areas corresponding to the second component, the overlapping target area is used as the target area corresponding to the first component, and the target area other than the overlapping target area among the at least two target areas corresponding to the second component is used as the target area corresponding to the second component;

[0015] If there are at least two target areas corresponding to the first component and at least two target areas corresponding to the second component, the overlapping target areas are used as the target areas of any one of the first component and the second component, or the overlapping target areas are not used as the target areas of any one of the first component and the second component;

[0016] If there is one target area corresponding to the first component and one target area corresponding to the second component, determine whether there is an IC device in the first component and the second component. If there is an IC device, the overlapping target area is used as the target area corresponding to the IC device.

[0017] The beneficial effect of adopting the above further scheme is that, for target areas corresponding to any two adjacent overlapping components, the above method can be used to reasonably allocate the overlapping target areas so that each component has a suitable target area for silk-screen position number marking.

[0018] Furthermore, the method further comprises:

[0019] Mark all components whose target areas are not identified.

[0020] The beneficial effect of adopting the above further solution is that all components that are not identified in the target area are marked, which can facilitate the subsequent manual adjustment of the silk screen position number.

[0021] Further, for each of the components, identifying a target area matching the first area in an area outside the second area corresponding to the component includes:

[0022] According to the area size of the first area corresponding to the component, an area outside the second area corresponding to the component with the same area size as the first area is identified as a target area, wherein there is no overlapping area between the target area and the second areas corresponding to other components outside the component.

[0023] The beneficial effect of adopting the above further solution is that the target area can be accurately determined based on the size of the area.

[0024] Further, for each of the components, marking the silk screen number corresponding to the component to the coordinates of the center position of the component includes:

[0025] For each of the components, identifying the coordinates of the center position of the component;

[0026] For each of the components, based on a preset corresponding relationship, the silk screen number corresponding to the component is identified, wherein the corresponding relationship is the corresponding relationship between all components and their corresponding silk screen numbers;

[0027] For each of the components, the silk-screen number corresponding to the component is marked at the coordinates of the center position of the component.

[0028] The beneficial effect of adopting the above further solution is that, based on the coordinates of the center position of the component and the preset corresponding relationship, the silk screen position number corresponding to each component can be accurately marked at the coordinates of the center position of the component.

[0029] In a second aspect, in order to solve the above technical problems, the present invention also provides a PCB screen printing automatic adjustment system, the system comprising:

[0030] An acquisition module is used to acquire a PCB file to be processed, wherein the PCB file to be processed includes each component and a silk screen position number corresponding to each component;

[0031] A silk screen position number marking module, used for marking the silk screen position number corresponding to each component to the coordinates of the center position of the component;

[0032] An area identification module, used for identifying, for each of the components, a first area corresponding to the silk-screen number corresponding to the component and a second area corresponding to the component;

[0033] The silk screen position number adjustment module is used to identify, for each of the components, a target area matching the first area in an area outside the second area corresponding to the component, and adjust the silk screen position number corresponding to the component from the first area to the target area.

[0034] In the third aspect, in order to solve the above-mentioned technical problems, the present invention also provides an electronic device, which includes a memory, a processor, and a computer program stored in the memory and executable on the processor, and when the processor executes the computer program, the PCB screen printing automatic adjustment method of the present application is implemented.

[0035] In a fourth aspect, in order to solve the above-mentioned technical problem, the present invention also provides a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, the PCB screen printing automatic adjustment method of the present application is implemented.

[0036] Additional aspects and advantages of the present application will be partially given in the following description, which will become apparent from the following description, or will be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for describing the embodiments of the present invention are briefly introduced below.

[0038] Figure 1 A schematic flow chart of a PCB screen printing automatic adjustment method provided by an embodiment of the present invention;

[0039] Figure 2 A schematic diagram of the positions of components and silk-screen position numbers before the silk-screen position numbers are adjusted, provided in accordance with an embodiment of the present invention;

[0040] Figure 3 A schematic diagram of a first area corresponding to a silk-screen number of a component and a second area corresponding to the component provided in one embodiment of the present invention;

[0041] Figure 4 A schematic diagram of a target area corresponding to a component provided by an embodiment of the present invention;

[0042] Figure 5 A schematic structural diagram of a PCB screen printing automatic adjustment system provided by one embodiment of the present invention;

[0043] Figure 6 A schematic diagram of the structure of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0044] The principles and features of the present invention are described below. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0045] The technical solution of the present invention and how the technical solution of the present invention solves the above-mentioned technical problems are described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present invention will be described below in conjunction with the accompanying drawings.

[0046] The solution provided by the embodiment of the present invention can be applied to any application scenario where the silk screen position numbers of components in the PCB file need to be automatically adjusted. The solution provided by the embodiment of the present invention can be executed by any electronic device, for example, it can be a user's terminal device, and the above terminal device can be any terminal device that can install applications and access web pages through applications, including at least one of the following: smart phones, tablet computers, laptops, desktop computers, smart speakers, smart watches, smart TVs, and smart car devices.

[0047] The embodiment of the present invention provides a possible implementation method, such as Figure 1 As shown, a flowchart of a PCB screen printing automatic adjustment method is provided. The solution can be executed by any electronic device, for example, a terminal device, or a terminal device and a server. For the convenience of description, the method provided by the embodiment of the present invention will be described below by taking the terminal device as the execution subject as an example. Figure 1 The method may include the following steps:

[0048] S10, obtaining a PCB file to be processed, wherein the PCB file to be processed includes each component and a silk screen position number corresponding to each component;

[0049] S20, for each of the components, marking the silk screen number corresponding to the component to the coordinates of the center position of the component;

[0050] S30, for each of the components, identifying a first area corresponding to the silk-screen number corresponding to the component and a second area corresponding to the component;

[0051] S40, for each of the components, identifying a target area matching the first area in an area outside the second area corresponding to the component, and adjusting the silk screen number corresponding to the component from the first area to the target area.

[0052] This solution automatically matches and marks the components in the PCB file to be processed and the silk-screen position numbers corresponding to each component, automatically marking the silk-screen position numbers of each component, reducing manual intervention and ensuring the correctness of the silk-screen position numbers.

[0053] The scheme of the present invention is further described below in conjunction with the following specific embodiments. In this embodiment, the purpose of automatic adjustment of the silk screen is to adjust the position of the device corresponding to the position number without overlapping with other contents on the board, so that the actual board can directly identify the position number corresponding to each device during use. Usually, the adjustment of the silk screen is manually adjusted one by one by the PCB designer, and it needs to be checked one by one after the adjustment to ensure that there is no omission or misadjustment; this process consumes a lot of time and cannot completely avoid omissions and mistakes. Based on this, this embodiment provides a PCB silk screen automatic adjustment method, which can include the following steps:

[0054] S10, obtaining a PCB file to be processed, wherein the PCB file to be processed includes various components (i.e., graphic marks representing the components) and silk screen position numbers corresponding to the components;

[0055] In PCB design, each component has its own silk screen number as an identification mark. The designer will adjust it to a suitable size and place it next to the corresponding component. In the subsequent PCB production, the factory will print it on the PCB to facilitate the relevant personnel to identify the placement of each component during the subsequent patch, debugging, assembly, maintenance and other processes.

[0056] Among them, the PCB file to be processed can be a PCB file generated based on PCB design software. In this file, various components and the silk screen position numbers corresponding to each component can be displayed. The silk screen position numbers of the PCB that has not been adjusted are messy. The correspondence between the components and the silk screen position numbers cannot be identified on the actual board, and there is even a problem of position number overlap.

[0057] As an example, see Figure 2 As shown in the schematic diagram, due to the unreasonable setting of the positions of the silk-screen position numbers, the areas where some silk-screen position numbers are located overlap with each other, and the areas where some silk-screen position numbers are located overlap with the areas where components are located. In this schematic diagram, the combination of letters and numbers represents the silk-screen position numbers, and the line segments represent the correspondence between the silk-screen position numbers and the components, and one component corresponds to one silk-screen position number.

[0058] S20, for each of the components, marking the silk screen number corresponding to the component to the coordinates of the center position of the component;

[0059] The purpose of the above processing is to accurately associate each component with the corresponding silk-screen position number. Specifically, one possible implementation of the above S20 is:

[0060] S201, for each of the components, identifying the coordinates of the center position of the component;

[0061] S202, for each of the components, based on a preset correspondence relationship, identifying the silk screen position number corresponding to the component, wherein the correspondence relationship is a correspondence relationship between all components and their corresponding silk screen position numbers;

[0062] S203: For each of the components, mark the silk-screen position number corresponding to the component to the coordinates of the center position of the component.

[0063] For each of the components, after marking the silk screen number corresponding to the component at the coordinates of the center position of the component, S30 is executed.

[0064] S30, for each of the components, identifying a first area corresponding to the silk-screen number corresponding to the component and a second area corresponding to the component;

[0065] Among them, for each component, the first area and the second area are identified based on the PCB file processed by step S20, that is, after processing by step S20, the silk screen number of each component is already located at the coordinates of the center position of the corresponding component.

[0066] For each of the components, the first area refers to the area on the PCB board occupied by the silk-screen number corresponding to the component, and the second area refers to the area on the PCB board occupied by the component.

[0067] As an example, see Figure 3 The schematic diagram shown in Figure 3 In the figure, U32 is the silk screen number of a component. The silk screen number is located at the coordinates of the center position of the corresponding component. The first area corresponding to the silk screen number is Figure 3 The rectangular area corresponding to U32 shown in the figure, the second area is Figure 3 The area corresponding to the component where U32 is located is shown in the figure.

[0068] S40, for each of the components, identifying a target area matching the first area in an area outside the second area corresponding to the component, and adjusting the silk screen number corresponding to the component from the first area to the target area.

[0069] For a component, there may be at least one target area corresponding to the component, and the size of the target area is the same as the size of the first area.

[0070] Specifically, one possible implementation of S30 is as follows:

[0071] According to the area size of the first area corresponding to the component, an area outside the second area corresponding to the component with the same area size as the first area is identified as a target area, wherein there is no overlapping area between the target area and the second areas corresponding to other components outside the component.

[0072] As an example, see Figure 4 The schematic diagram shown in Figure 4 In the figure, a, b, c and d are all target areas corresponding to the components corresponding to U32, and the area sizes corresponding to a, b, c and d are the same as the area sizes of the first area corresponding to U32. For any area among a, b, c and d, there is no overlapping area between the area and the second area corresponding to other components on the PCB board.

[0073] Based on the above steps S10 to S30, the same processing can be performed on each component in the PCB file to be processed, so as to adjust the silk screen position number corresponding to each component in the PCB file to be processed.

[0074] Further, for any two adjacent components among all components, the any two adjacent components are respectively a first component and a second component, if there is an overlap between the target area corresponding to the first component and the target area corresponding to the second component, the method further includes:

[0075] If there is one target area corresponding to the first component, and there are at least two target areas corresponding to the second component, the overlapping target area is used as the target area corresponding to the first component, and the target area other than the overlapping target area among the at least two target areas corresponding to the second component is used as the target area corresponding to the second component;

[0076] If there are at least two target areas corresponding to the first component and at least two target areas corresponding to the second component, the overlapping target areas are used as the target areas of any one of the first component and the second component, or the overlapping target areas are not used as the target areas of any one of the first component and the second component;

[0077] If there is one target area corresponding to the first component and one target area corresponding to the second component, determine whether there is an IC device in the first component and the second component. If there is an IC device, the overlapping target area is used as the target area corresponding to the IC device.

[0078] Among them, the overlap between the target area corresponding to the first component and the target area corresponding to the second component means that there is an overlapping area between the target area corresponding to the first component and the target area corresponding to the second component, that is, at least one of the target areas corresponding to the first component is also at least one of the target areas corresponding to the second component.

[0079] As an example, the first component is a component A, the second component is a component B, and the target area corresponding to the component A and the target area corresponding to the component B overlap;

[0080] The first case: device A has one target area, and device B has two target areas, and these two areas include the target area corresponding to device A. In this case, the target area corresponding to device A can be allocated to device A as the target area of ​​device A, and the two target areas corresponding to device B can be reduced to one, and the target area of ​​the two target areas corresponding to device B except the target area corresponding to device A can be used as the target area corresponding to device B.

[0081] The second situation: device A and device B each have at least two target areas, and there is an overlapping area M between the at least two target areas corresponding to device A and the at least two target areas corresponding to device B, and the overlapping area M is one of the at least two target areas corresponding to device A and also one of the at least two target areas corresponding to device B. Then the overlapping area M can be used as the target area corresponding to either device A or device B. In this case, device A and device B can both have their own target areas. Alternatively, the overlapping area M is not used as the target area corresponding to either device A or device B. In this case, the target area except the overlapping area M among the at least two target areas corresponding to device A is used as the target area corresponding to device A, and the target area except the overlapping area M among the at least two target areas corresponding to device B is used as the target area corresponding to device B.

[0082] The third situation: Device A and Device B each have a target area, which is the overlapping area. The target area can be preferentially allocated to the IC device in Device A and Device B. If Device A and Device B are both IC devices, they will not be processed first and will be recorded for subsequent manual processing.

[0083] Furthermore, the method further comprises:

[0084] Mark all components that are not identified in the target area. For example, they can be marked with a specified color to facilitate subsequent manual marking.

[0085] Furthermore, after the above processing, the silk screen position numbers of the components that cannot be assigned to the target area can be manually confirmed and manually adjusted. After the manual adjustment is completed, the software automatically traverses and checks the first area where the silk screen position number is located and the second area where the component is located, marks out any overlaps, and manually confirms until there is no overlap.

[0086] Through the solution of the present invention, the silk-screen position number can be adjusted to the position corresponding to the target area corresponding to the component, and there is no overlap with other contents on the PCB board, so that the silk-screen position number corresponding to each component can be directly identified during the actual board use.

[0087] Based on Figure 1 The same principle as the method shown in , the embodiment of the present invention also provides a PCB screen printing automatic adjustment system 20, such as Figure 5 As shown in , the PCB silk screen automatic adjustment system 20 may include an acquisition module 210, a silk screen position number marking module 220, an area identification module 230 and a silk screen position number adjustment module 240, wherein:

[0088] An acquisition module 210 is used to acquire a PCB file to be processed, wherein the PCB file to be processed includes each component and a silk screen position number corresponding to each component;

[0089] The silk screen position number marking module 220 is used to mark the silk screen position number corresponding to each component to the coordinates of the center position of the component;

[0090] The region identification module 230 is used to identify, for each of the components, a first region corresponding to the silk-screen number corresponding to the component and a second region corresponding to the component;

[0091] The silk screen position number adjustment module 240 is used to identify, for each of the components, a target area matching the first area in an area outside the second area corresponding to the component, and adjust the silk screen position number corresponding to the component from the first area to the target area.

[0092] Optionally, for any two adjacent components among all components, the any two adjacent components are respectively a first component and a second component, if a target area corresponding to the first component overlaps with a target area corresponding to the second component, the system further includes:

[0093] Adjustment module, used to perform the following processing:

[0094] If there is one target area corresponding to the first component, and there are at least two target areas corresponding to the second component, the overlapping target area is used as the target area corresponding to the first component, and the target area other than the overlapping target area among the at least two target areas corresponding to the second component is used as the target area corresponding to the second component;

[0095] If there are at least two target areas corresponding to the first component and at least two target areas corresponding to the second component, the overlapping target areas are used as the target areas of any one of the first component and the second component, or the overlapping target areas are not used as the target areas of any one of the first component and the second component;

[0096] If there is one target area corresponding to the first component and one target area corresponding to the second component, determine whether there is an IC device in the first component and the second component. If there is an IC device, the overlapping target area is used as the target area corresponding to the IC device.

[0097] Optionally, the system further comprises:

[0098] The marking module is used to mark the components whose target areas are not identified among all components.

[0099] Optionally, for each of the components, when the silk screen number adjustment module 240 identifies a target area matching the first area in an area outside the second area corresponding to the component, it is specifically configured to:

[0100] According to the area size of the first area corresponding to the component, an area outside the second area corresponding to the component with the same area size as the first area is identified as a target area, wherein there is no overlapping area between the target area and the second areas corresponding to other components outside the component.

[0101] Optionally, for each of the components, when the silk-screen position number adjustment module 240 marks the silk-screen position number corresponding to the component to the coordinates of the center position of the component, it is specifically used to:

[0102] For each of the components, identifying the coordinates of the center position of the component;

[0103] For each of the components, based on a preset corresponding relationship, the silk screen number corresponding to the component is identified, wherein the corresponding relationship is the corresponding relationship between all components and their corresponding silk screen numbers;

[0104] For each of the components, the silk-screen number corresponding to the component is marked at the coordinates of the center position of the component.

[0105] The PCB silk screen printing automatic adjustment system of the embodiment of the present invention can execute the PCB silk screen printing automatic adjustment method provided by the embodiment of the present invention, and its implementation principle is similar. The actions performed by each module and unit in the PCB silk screen printing automatic adjustment system in each embodiment of the present invention correspond to the steps in the PCB silk screen printing automatic adjustment method in each embodiment of the present invention. For the detailed functional description of each module of the PCB silk screen printing automatic adjustment system, please refer to the description in the corresponding PCB silk screen printing automatic adjustment method shown in the previous text, which will not be repeated here.

[0106] Among them, the above-mentioned PCB silk screen printing automatic adjustment system can be a computer program (including program code) running in a computer device, for example, the PCB silk screen printing automatic adjustment system is an application software; the device can be used to execute the corresponding steps in the method provided in the embodiment of the present invention.

[0107] In some embodiments, the PCB screen printing automatic adjustment system provided by the embodiments of the present invention can be implemented by a combination of software and hardware. As an example, the PCB screen printing automatic adjustment system provided by the embodiments of the present invention can be a processor in the form of a hardware decoding processor, which is programmed to execute the PCB screen printing automatic adjustment method provided by the embodiments of the present invention. For example, the processor in the form of a hardware decoding processor can adopt one or more application-specific integrated circuits (ASICs), DSPs, programmable logic devices (PLDs), complex programmable logic devices (CPLDs), field programmable gate arrays (FPGAs), or other electronic components.

[0108] In other embodiments, the PCB screen printing automatic adjustment system provided by the embodiment of the present invention can be implemented by software. Figure 5 A PCB silk screen automatic adjustment system stored in a memory is shown, which can be software in the form of a program and a plug-in, and includes a series of modules, including an acquisition module 210, a silk screen position number marking module 220, an area identification module 230 and a silk screen position number adjustment module 240, for implementing the PCB silk screen automatic adjustment method provided in an embodiment of the present invention.

[0109] The modules involved in the embodiments of the present invention may be implemented by software or hardware, wherein the name of a module does not limit the module itself in some cases.

[0110] Based on the same principle as the method shown in the embodiments of the present invention, an electronic device is also provided in the embodiments of the present invention, which may include but is not limited to: a processor and a memory; the memory is used to store a computer program; the processor is used to execute the method shown in any embodiment of the present invention by calling the computer program.

[0111] In an alternative embodiment, an electronic device is provided, such as Figure 6 As shown, Figure 6 The electronic device 4000 shown includes: a processor 4001 and a memory 4003. The processor 4001 and the memory 4003 are connected, such as through a bus 4002. Optionally, the electronic device 4000 may also include a transceiver 4004, which may be used for data interaction between the electronic device and other electronic devices, such as data transmission and / or data reception. It should be noted that in actual applications, the transceiver 4004 is not limited to one, and the structure of the electronic device 4000 does not constitute a limitation on the embodiments of the present invention.

[0112] Processor 4001 may be a CPU (Central Processing Unit), a general-purpose processor, a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array) or other programmable logic devices, transistor logic devices, hardware components or any combination thereof. It may implement or execute various exemplary logic blocks, modules and circuits described in conjunction with the disclosure of the present invention. Processor 4001 may also be a combination that implements computing functions, such as a combination of one or more microprocessors, a combination of a DSP and a microprocessor, etc.

[0113] The bus 4002 may include a path to transmit information between the above components. The bus 4002 may be a PCI (Peripheral Component Interconnect) bus or an EISA (Extended Industry Standard Architecture) bus. The bus 4002 may be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 6 Only one thick line is used in the diagram, but this does not mean that there is only one bus or only one type of bus.

[0114] The memory 4003 may be a ROM (Read Only Memory) or other types of static storage devices that can store static information and instructions, a RAM (Random Access Memory) or other types of dynamic storage devices that can store information and instructions, or an EEPROM (Electrically Erasable Programmable Read Only Memory), a CD-ROM (Compact Disc Read Only Memory) or other optical disk storage, optical disk storage (including compressed optical disk, laser disk, optical disk, digital versatile disk, Blu-ray disk, etc.), a magnetic disk storage medium or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of instructions or data structures and can be accessed by a computer, but is not limited to these.

[0115] The memory 4003 is used to store application code (computer program) for executing the solution of the present invention, and the execution is controlled by the processor 4001. The processor 4001 is used to execute the application code stored in the memory 4003 to implement the content shown in the above method embodiment.

[0116] The electronic device may also be a terminal device. Figure 6 The electronic device shown is only an example and should not bring any limitation to the functions and scope of use of the embodiments of the present invention.

[0117] An embodiment of the present invention provides a computer-readable storage medium, on which a computer program is stored. When the computer-readable storage medium is run on a computer, the computer can execute the corresponding contents of the aforementioned method embodiment.

[0118] According to another aspect of the present invention, a computer program product or a computer program is also provided, the computer program product or the computer program comprising computer instructions, the computer instructions being stored in a computer-readable storage medium. A processor of a computer device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the computer device executes the methods provided in the implementation modes of the above-mentioned various embodiments.

[0119] Computer program code for performing the operations of the present invention may be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, C++, and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0120] It should be understood that the flow charts and block diagrams in the accompanying drawings illustrate the possible implementation architecture, functions and operations of the method and computer program product according to various embodiments of the present invention. In this regard, each box in the flow chart or block diagram can represent a module, a program segment, or a part of a code, and the module, the program segment, or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a sequence different from that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented with a dedicated hardware-based system that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0121] The computer-readable storage medium provided by the embodiment of the present invention may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or device, or any combination thereof. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof. In the present invention, a computer-readable storage medium may be any tangible medium containing or storing a program that may be used by or in conjunction with an instruction execution system, device, or device.

[0122] The computer-readable storage medium carries one or more programs. When the one or more programs are executed by the electronic device, the electronic device executes the method shown in the above embodiment.

[0123] The above description is only a preferred embodiment of the present invention and an explanation of the technical principles used. Those skilled in the art should understand that the scope of disclosure involved in the present invention is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the above disclosed concept. For example, the above features are replaced with the technical features with similar functions disclosed in the present invention (but not limited to) to form a technical solution.

Claims

1. A PCB screen printing automatic adjustment method, characterized in that: The following steps are involved: Obtain a PCB file to be processed, wherein the PCB file to be processed includes each component and a silk screen position number corresponding to each component; For each of the components, mark the silk screen number corresponding to the component to the coordinates of the center position of the component; For each of the components, identifying a first area corresponding to the silk-screen number corresponding to the component and a second area corresponding to the component; For each of the components, a target area matching the first area is identified in an area outside the second area corresponding to the component, and the silk-screen position number corresponding to the component is adjusted from the first area to the target area; For any two adjacent components among all components, the any two adjacent components are respectively a first component and a second component, if there is an overlap between a target area corresponding to the first component and a target area corresponding to the second component, the method further includes: If there is one target area corresponding to the first component, and there are at least two target areas corresponding to the second component, the overlapping target area is used as the target area corresponding to the first component, and the target area other than the overlapping target area among the at least two target areas corresponding to the second component is used as the target area corresponding to the second component; If there are at least two target areas corresponding to the first component and at least two target areas corresponding to the second component, the overlapping target areas are used as the target areas of any one of the first component and the second component, or the overlapping target areas are not used as the target areas of any one of the first component and the second component; If there is one target area corresponding to the first component and one target area corresponding to the second component, determine whether there is an IC device in the first component and the second component. If there is an IC device, the overlapping target area is used as the target area corresponding to the IC device.

2. The method according to claim 1, characterized in that The method further comprises: Mark all components whose target areas are not identified.

3. The method according to claim 1, characterized in that For each of the components, identifying a target area matching the first area in an area outside the second area corresponding to the component includes: According to the area size of the first area corresponding to the component, an area outside the second area corresponding to the component with the same area size as the first area is identified as a target area, wherein there is no overlapping area between the target area and the second areas corresponding to other components outside the component.

4. The method according to claim 1, characterized in that: For each of the components, marking the silk screen number corresponding to the component to the coordinates of the center position of the component includes: For each of the components, identifying the coordinates of the center position of the component; For each of the components, based on a preset corresponding relationship, the silk screen number corresponding to the component is identified, wherein the corresponding relationship is the corresponding relationship between all components and their corresponding silk screen numbers; For each of the components, the silk-screen number corresponding to the component is marked at the coordinates of the center position of the component.

5. A PCB screen printing automatic adjustment system, characterized in that: include: An acquisition module is used to acquire a PCB file to be processed, wherein the PCB file to be processed includes each component and a silk screen position number corresponding to each component; A silk screen position number marking module, used for marking the silk screen position number corresponding to each component to the coordinates of the center position of the component; An area identification module, used for identifying, for each of the components, a first area corresponding to the silk-screen number corresponding to the component and a second area corresponding to the component; A silk screen position number adjustment module, used for identifying, for each of the components, a target area matching the first area in an area outside the second area corresponding to the component, and adjusting the silk screen position number corresponding to the component from the first area to the target area; For any two adjacent components among all components, the any two adjacent components are respectively a first component and a second component, if a target area corresponding to the first component overlaps with a target area corresponding to the second component, the system further includes: Adjustment module, used to perform the following processing: If there is one target area corresponding to the first component, and there are at least two target areas corresponding to the second component, the overlapping target area is used as the target area corresponding to the first component, and the target area other than the overlapping target area among the at least two target areas corresponding to the second component is used as the target area corresponding to the second component; If there are at least two target areas corresponding to the first component and at least two target areas corresponding to the second component, the overlapping target areas are used as the target areas of any one of the first component and the second component, or the overlapping target areas are not used as the target areas of any one of the first component and the second component; If there is one target area corresponding to the first component and one target area corresponding to the second component, determine whether there is an IC device in the first component and the second component. If there is an IC device, the overlapping target area is used as the target area corresponding to the IC device.

6. The system according to claim 5, characterized in that The system further comprises: The marking module is used to mark the components whose target areas are not identified among all components.

7. An electronic device, characterized in that: The method comprises a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the method according to any one of claims 1 to 4 when executing the computer program.

8. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method according to any one of claims 1 to 4 is implemented.

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