A reinforced computer with internal heat conduction air duct

Abstract

The invention discloses a reinforced computer with a built-in heat-conducting air duct, and relates to the technical field of computer heat-conducting devices, comprising a computer base, a computer body, a sealing baffle, a heat-conducting mechanism, a reinforcing mechanism and a circuit board. A clamping block is symmetrically fixedly connected in the computer base, and a clamping slot is provided on a side of the computer body close to the clamping block, and the clamping slot and the clamping block cooperate with each other. Four corners of one side of the computer body are provided with mounting holes, and the computer body is movably connected with a sealing baffle through the mounting holes. A heat-conducting mechanism is preset on one side of the computer base, and a circuit board is installed in the computer body, and a reinforcing mechanism is installed on a side of the computer body close to the circuit board. When it is necessary to adjust the airflow distribution in the air duct or optimize the heat dissipation effect according to the internal temperature change, when the telescopic cylinder is extended and retracted, the rack slides on the slide rail, thereby driving the transmission wheel to rotate, and then adjusting the angle of the spoiler to optimize the airflow path.

Description

Technical Field

[0001] The invention relates to the technical field of computer heat conduction devices, in particular to a reinforced computer with a built-in heat conduction air duct. Background Art

[0002] Rugged computers, especially those used in airborne environments, are small, lightweight, and have high heat dissipation requirements (military vehicle-mounted equipment generally requires a high temperature of +55°C, while airborne equipment requires a high temperature of up to +70°C). They require the equipment to have three-proof and even waterproof capabilities. Therefore, a sealed chassis with good three-proof and waterproof capabilities is one of the main development directions of reinforced computers.

[0003] However, the uneven airflow distribution and low heat dissipation efficiency of existing reinforced computers may cause the temperature of some components to be too high, thereby affecting the performance of the computer and even causing hardware damage. The loose contact between the heat sink and the heat conductive plate or the inability to flexibly adjust the position may cause fluctuations in the heat dissipation performance, making the computer perform unstably under different working conditions. Therefore, those skilled in the art provide a reinforced computer with a built-in heat conductive air duct to solve the problems raised in the above background technology. Summary of the invention

[0004] The object of the present invention is to provide a reinforced computer with a built-in heat conduction air duct to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A reinforced computer with a built-in heat-conducting air duct comprises a computer base, a computer body, a sealing baffle, a heat-conducting mechanism, a reinforcing mechanism and a circuit board. A card-connecting block is symmetrically fixedly connected in the computer base, and a card slot is provided on a side of the computer body close to the card-connecting block, the card slot and the card slot cooperate with each other, four corners of one side of the computer body are provided with mounting holes, the computer body is movably connected to the sealing baffle through the mounting holes, a heat-conducting mechanism is preset on one side of the computer base, a circuit board is installed in the computer body, and a reinforcing mechanism is installed on a side of the computer body close to the circuit board.

[0007] As a further solution of the present invention: the heat conduction mechanism includes an air duct, a spoiler, a rotating shaft, a rotating rod, a slide rail, a rack, a transmission wheel, a telescopic cylinder, a cooling fan, a heat conduction hole and a fixed plate. An air duct is preset on one side of the computer base, and rotating shafts are symmetrically embedded on both sides of the air duct. A rotating rod is movably connected between the rotating shafts, a spoiler is installed on the rotating rod, and a fixed plate is fixedly connected to the computer base in the air duct, and a plurality of heat conduction holes are opened on the fixed plate at equal distances.

[0008] As a further solution of the present invention: the spoilers on both sides are symmetrically distributed in an "eight" shape, and a transmission wheel is provided on one side of the rotating rod, a slide rail is fixedly connected to one side of the air duct close to the transmission wheel, a rack is slidably connected to the slide rail, and the gears between the rack and the transmission wheel are meshed with each other.

[0009] As a further solution of the present invention: a cooling fan is embedded in a side of the computer base away from the fixed plate, a telescopic cylinder is fixedly connected to one side of the air duct, and a rack is fixedly connected to the output end of the telescopic cylinder.

[0010] As a further solution of the present invention: the telescopic cylinder and the cooling fan are both electrically connected to an external power supply and a circuit board.

[0011] As a further solution of the present invention: a ventilation hole is provided on a surface of one side of the computer body close to the fixing plate, and the positions of the ventilation hole and the heat conduction hole cooperate with each other.

[0012] As a further solution of the present invention: a wire control panel is arranged on a surface of the computer body on one side away from the sealing baffle, and a through groove is opened on the fixing plate of the computer base, and the wire control panel is located in the through groove.

[0013] As a further solution of the present invention: the reinforcement mechanism includes a heat conducting plate, a heat sink, a hanging ear, a transmission groove, an adjusting rod, a cam, a fixing frame, an adjusting block, a transmission rod, a buckle and a limit piece. A heat conducting plate is installed on the circuit board, and a plurality of heat sinks are arranged at equal distances on the heat conducting plate, and hanging ears are symmetrically fixedly connected on both sides of the heat conducting plate, and limiting pieces are fixedly connected on one side of the computer body close to the hanging ears, the protrusion of the limiting piece and the hanging ear match each other in size, an adjusting rod is movably connected between the limiting pieces, and a cam is fixedly connected to the adjusting rod.

[0014] As a further solution of the present invention: a fixing frame is fixedly connected to both sides of the computer body near the limiter, an adjusting block is slidably connected inside the fixing frame, a gasket is arranged on the surface of the cam, the gasket is made of rubber material, and the cam and the adjusting block cooperate with each other.

[0015] As a further solution of the present invention: adjusting rods are movably connected on both sides of the adjusting block, and the computer body is provided with transmission grooves on both sides of the fixing frame, the adjusting rods are movably connected in the transmission grooves, and a buckle is provided on the side of the adjusting rod away from the adjusting block, and the buckle cooperates with the surface of the heat sink.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. After the cooling fan is started, air flows into the air duct from the side of the computer base away from the fixed plate. The spoiler in the air duct is connected by a rotating shaft and a rotating rod, and is symmetrically distributed in an eight-shaped pattern, which helps to form a more uniform air flow channel in the air duct. The angle of the spoiler can be adjusted by the transmission wheel on the rotating rod, and the transmission wheel is meshed with the rack. When it is necessary to adjust the air flow distribution in the air duct or optimize the heat dissipation effect according to the internal temperature change, when the telescopic cylinder is extended and retracted, the rack slides on the slide rail, thereby driving the transmission wheel to rotate, and then adjusting the angle of the spoiler to optimize the air flow path. A plurality of heat conduction holes are opened at equal distances on the fixed plate. These holes are located on the side surface of the computer body close to the fixed plate to match the position of the ventilation holes. When air flows through the heat conduction holes, it enters the computer body through the ventilation holes, thereby taking away the heat generated inside, enhancing the heat discharge efficiency inside the computer, and ensuring the stable operation of the computer under high load and harsh environment;

[0018] 2. The heat on the circuit board is transferred to the heat sink through the heat conduction plate. The heat sink increases the heat dissipation area and helps to diffuse the heat into the surrounding air more quickly. When the heat sink is installed, the size of the protrusion of the limiter matches the size of the hanging ear, which is used to firmly fix the position of the heat conduction plate and the heat sink to prevent them from moving under vibration or impact. At this time, the position of the cam is changed by adjusting the adjusting rod, so as to adjust the vertical position of the adjusting block on the fixing frame. A buckle is provided on the side of the adjusting rod away from the adjusting block. When the adjusting rod is adjusted to the appropriate position, the buckle stably fixes the heat sink in the predetermined position to ensure that it will not be easily displaced, so that the contact between the heat sink and the heat conduction plate is tighter or looser, thereby optimizing the heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 The diagram is a schematic diagram of the exploded structure of a reinforced computer with a built-in heat-conducting air duct.

[0020] Figure 2 The present invention is a schematic diagram of the overall structure of a reinforced computer with a built-in heat-conducting air duct.

[0021] Figure 3 The present invention is a structural schematic diagram of a computer body in a reinforced computer with a built-in heat-conducting air duct.

[0022] Figure 4 The present invention is a schematic diagram of the heat sink structure of a reinforcement mechanism in a reinforced computer with a built-in heat-conducting air duct.

[0023] Figure 5 The present invention is a structural schematic diagram of a reinforcement mechanism in a reinforced computer with a built-in heat-conducting air duct.

[0024] Figure 6 The present invention is a schematic diagram of the cooperation between a cam and an adjusting block of a reinforcement mechanism in a reinforcement computer with a built-in heat-conducting air duct.

[0025] Figure 7 The present invention is a schematic diagram of the structure of a heat conduction mechanism in a reinforced computer with a built-in heat conduction air duct.

[0026] Figure 8 The present invention is a side view of a heat-conducting mechanism in a reinforced computer with a built-in heat-conducting air duct.

[0027] In the figure: 1. computer base; 2. computer body; 3. sealing baffle; 4. heat conduction mechanism; 401. air duct; 402. spoiler; 403. rotating shaft; 404. rotating rod; 405. slide rail; 406. rack; 407. transmission wheel; 408. telescopic cylinder; 409. cooling fan; 410. heat conduction hole; 411. fixing plate; 5. clamping block; 6. reinforcement mechanism; 601. heat conduction plate; 602. heat sink; 603. hanging ear; 604. transmission groove; 605. adjustment rod; 606. cam; 607. fixing frame; 608. adjustment block; 609. transmission rod; 610. buckle; 611. limiter; 7. circuit board; 8. clamping slot; 9. mounting hole; 10. wire hole panel. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] Example 1

[0030] Reference Figure 1 , Figure 2 , Figure 3 , Figure 7 and Figure 8 This embodiment provides a reinforced computer with a built-in heat conduction air duct, including a computer base 1, a computer body 2, a sealing baffle 3, a heat conduction mechanism 4, a reinforcement mechanism 6 and a circuit board 7. A clamping block 5 is symmetrically fixedly connected in the computer base 1, and a clamping slot 8 is provided on a side of the computer body 2 close to the clamping block 5. The clamping slot 8 and the clamping block 5 cooperate with each other. Four corners of one side of the computer body 2 are provided with mounting holes 9. The computer body 2 is movably connected to the sealing baffle 3 through the mounting holes 9. A heat conduction mechanism 4 is preset on one side of the computer base 1, and a circuit board 7 is installed in the computer body 2. A reinforcement mechanism 6 is installed on a side of the computer body 2 close to the circuit board 7.

[0031] In this embodiment, specifically, the heat conduction mechanism 4 includes an air duct 401, a spoiler 402, a rotating shaft 403, a rotating rod 404, a slide rail 405, a rack 406, a transmission wheel 407, a telescopic cylinder 408, a cooling fan 409, a heat conduction hole 410 and a fixed plate 411. The air duct 401 is preset on one side of the computer base 1, and the rotating shafts 403 are symmetrically embedded on both sides of the air duct 401. The rotating shafts 403 are movably connected with the rotating rods 404, and the spoiler 402 is installed on the rotating rod 404. A fixed plate 411 is fixedly connected to the computer base 1 in the air duct 401, and a plurality of heat conduction holes 410 are opened on the fixed plate 411 at equal distances;

[0032] The spoilers 402 on both sides are symmetrically distributed in an "eight" shape, and a transmission wheel 407 is provided on one side of the rotating rod 404. A slide rail 405 is fixedly connected to one side of the air duct 401 near the transmission wheel 407, and a rack 406 is slidably connected to the slide rail 405. The gears between the rack 406 and the transmission wheel 407 are meshed with each other.

[0033] A cooling fan 409 is embedded in the side of the computer base 1 away from the fixing plate 411, a telescopic cylinder 408 is fixedly connected to one side of the air duct 401, and a rack 406 is fixedly connected to the output end of the telescopic cylinder 408;

[0034] The telescopic cylinder 408 and the cooling fan 409 are both electrically connected to the external power supply and the circuit board 7;

[0035] A ventilation hole is provided on a surface of one side of the computer body 2 close to the fixing plate 411 , and the ventilation hole and the heat conducting hole 410 are matched with each other;

[0036] A wire control panel 10 is disposed on a side surface of the computer body 2 away from the sealing baffle 3, and a through slot 412 is opened on the fixing plate 411 of the computer base 1, and the wire control panel 10 is located in the through slot 411;

[0037] After the cooling fan 409 is started, air flows into the air duct 401 from the side of the computer base 1 away from the fixing plate 411. The spoiler 402 in the air duct 401 is connected to the rotating shaft 403 and the rotating rod 404 and is symmetrically distributed in an eight-shaped pattern, which helps to form a more uniform air flow channel in the air duct. The angle of the spoiler 402 can be adjusted by the transmission wheel 407 on the rotating rod 404, and the transmission wheel 407 is meshed with the rack 406. When it is necessary to adjust the air flow distribution in the air duct or optimize the heat dissipation effect according to the internal temperature change, the telescopic cylinder 408 is extended and retracted. When the gear rack 406 slides on the slide rail 405, the transmission wheel 407 is driven to rotate, and the angle of the spoiler 402 is adjusted to optimize the airflow path. A plurality of heat-conducting holes 410 are provided on the fixing plate 411 at equal distances. These holes are matched with the ventilation holes on the surface of one side of the computer body 2 close to the fixing plate 411. When air flows through the heat-conducting holes 410, it enters the computer body 2 through the ventilation holes, thereby taking away the heat generated inside, thereby enhancing the heat discharge efficiency inside the computer and ensuring the stable operation of the computer under high load and harsh environment.

[0038] Example 2

[0039] Reference Figure 4-Figure 6 , this embodiment is based on the previous embodiment, and is different from the previous embodiment in that the reinforcement mechanism 6 includes a heat conducting plate 601, a heat sink 602, a hanging ear 603, a transmission groove 604, an adjusting rod 605, a cam 606, a fixing frame 607, an adjusting block 608, a transmission rod 609, a buckle 610 and a limiting member 611, a heat conducting plate 601 is installed on the circuit board 7, a plurality of heat sinks 602 are arranged at equal distances on the heat conducting plate 601, and hanging ears 603 are symmetrically fixedly connected on both sides of the heat conducting plate 601, and a limiting member 611 is fixedly connected to one side of the computer body 2 close to the hanging ear 603, and the size of the convex block of the limiting member 611 matches the hanging ear 603, and the limiting member 611 is movably connected with the adjusting rod 605, and the cam 606 is fixedly connected to the adjusting rod 605;

[0040] The computer body 2 is fixedly connected with a fixing frame 607 on both sides close to the limiter 611, and an adjusting block 608 is slidably connected in the fixing frame 607. A gasket is arranged on the surface of the cam 606, and the gasket is made of rubber material. The cam 606 and the adjusting block 608 cooperate with each other.

[0041] The adjusting block 608 has adjusting rods 605 movably connected to both sides thereof, and the computer body 2 has transmission slots 604 on both sides of the fixing frame 607, the adjusting rods 605 are movably connected to the transmission slots 604, and the adjusting rods 605 are provided with buckles 610 on the side of the adjusting rods 605 away from the adjusting block 608, and the buckles 610 cooperate with the surface of the heat sink 602;

[0042] The heat on the circuit board 7 is transferred to the heat sink 602 through the heat conducting plate 601. The heat sink 602 increases the heat dissipation area and helps to diffuse the heat into the surrounding air more quickly. When the heat sink 602 is installed, the size of the protrusion of the limiter 611 matches the size of the ear 603, which is used to firmly fix the position of the heat conducting plate 601 and the heat sink 602 to prevent them from moving under vibration or impact. At this time, the position of the cam 606 is changed by adjusting the adjusting rod 605, so as to adjust the vertical position of the adjusting block 608 on the fixing frame 607. A buckle 610 is provided on the side of the adjusting rod 605 away from the adjusting block 608. When the adjusting rod 605 is adjusted to the appropriate position, the buckle 610 stably fixes the heat sink 602 at a predetermined position to ensure that it will not be easily displaced, so that the contact between the heat sink 602 and the heat conducting plate 601 is tighter or looser, thereby optimizing the heat dissipation performance.

[0043] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0044] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A reinforced computer with a built-in heat-conducting air duct, characterized in that: The computer base (1) comprises a computer body (2), a sealing baffle (3), a heat conduction mechanism (4), a reinforcement mechanism (6) and a circuit board (7); a card block (5) is symmetrically fixedly connected inside the computer base (1); a card slot (8) is provided on a side of the computer body (2) close to the card block (5); the card slot (8) and the card block (5) cooperate with each other; four corners of one side of the computer body (2) are provided with mounting holes (9); the computer body (2) is movably connected to the sealing baffle (3) through the mounting holes (9); a heat conduction mechanism (4) is preset on one side of the computer base (1); a circuit board (7) is installed inside the computer body (2); and a reinforcement mechanism (6) is installed on a side of the computer body (2) close to the circuit board (7); The heat conduction mechanism (4) comprises an air duct (401), a spoiler (402), a rotating shaft (403), a rotating rod (404), a slide rail (405), a rack (406), a transmission wheel (407), a telescopic cylinder (408), a cooling fan (409), a heat conduction hole (410) and a fixed plate (411); an air duct (401) is preset on one side of the computer base (1); rotating shafts (403) are symmetrically embedded on both sides of the air duct (401); a rotating rod (404) is movably connected between the rotating shafts (403); a spoiler (402) is installed on the rotating rod (404); a fixed plate (411) is fixedly connected to the computer base (1) in the air duct (401); and a plurality of heat conduction holes (410) are opened on the fixed plate (411) at equal distances; The spoilers (402) on both sides are symmetrically distributed in an "eight" shape, and a transmission wheel (407) is provided on one side of the rotating rod (404). A slide rail (405) is fixedly connected to one side of the air duct (401) close to the transmission wheel (407), and a rack (406) is slidably connected to the slide rail (405), and the gears between the rack (406) and the transmission wheel (407) are meshed with each other.

2. A reinforced computer with a built-in heat-conducting air duct according to claim 1, characterized in that: A cooling fan (409) is embedded in the side of the computer base (1) away from the fixing plate (411), a telescopic cylinder (408) is fixedly connected to one side of the air duct (401), and a rack (406) is fixedly connected to the output end of the telescopic cylinder (408).

3. The reinforced computer with a built-in heat conduction air duct according to claim 1, characterized in that: The reinforcing mechanism (6) comprises a heat conducting plate (601), a heat sink (602), a hanging ear (603), a transmission groove (604), an adjusting rod (605), a cam (606), a fixing frame (607), an adjusting block (608), a transmission rod (609), a buckle (610) and a limiting member (611). The circuit board (7) is provided with a heat conducting plate (601), a plurality of heat sinks (602) are arranged at equal distances on the heat conducting plate (601), and hanging ears (603) are symmetrically fixedly connected on both sides of the heat conducting plate (601), and a limiting member (611) is fixedly connected to one side of the computer body (2) close to the hanging ear (603), the size of the protrusion of the limiting member (611) matches the hanging ear (603), an adjusting rod (605) is movably connected between the limiting members (611), and the cam (606) is fixedly connected to the adjusting rod (605).

4. The reinforced computer with a built-in heat conduction air duct according to claim 3, characterized in that: A fixing frame (607) is fixedly connected to both sides of the computer body (2) near the limiting member (611), an adjusting block (608) is slidably connected inside the fixing frame (607), a gasket is arranged on the surface of the cam (606), the gasket is made of rubber material, and the cam (606) and the adjusting block (608) cooperate with each other.

5. The reinforced computer with a built-in heat-conducting air duct according to claim 4, characterized in that: The adjusting block (608) is movably connected with adjusting rods (605) on both sides, and the computer body (2) is provided with transmission grooves (604) on both sides of the fixing frame (607), the adjusting rods (605) are movably connected in the transmission grooves (604), and a buckle (610) is provided on the side of the adjusting rod (605) away from the adjusting block (608), and the buckle (610) cooperates with the surface of the heat sink (602).

6. The reinforced computer with a built-in heat-conducting air duct according to claim 1, characterized in that: A wire control panel (10) is provided on a side surface of the computer body (2) away from the sealing baffle (3), and a through slot (412) is provided on the fixing plate (411) of the computer base (1), and the wire control panel (10) is located in the through slot (412).

7. The reinforced computer with a built-in heat-conducting air duct according to claim 1, characterized in that: A ventilation hole is provided on a surface of one side of the computer body (2) close to the fixing plate (411), and the positions of the ventilation hole and the heat conduction hole (410) are matched with each other.

8. The reinforced computer with a built-in heat-conducting air duct according to claim 2, characterized in that: The telescopic cylinder (408) and the cooling fan (409) are both electrically connected to an external power source and a circuit board (7).

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