Processing apparatus and method for manufacturing display device

Abstract

The invention provides a processing apparatus and a manufacturing method of a display device. The processing apparatus includes: a stage; a support member having a movable support block; and a vacuum device having a main body and a block body, the support block moving in a first direction supports the end region of the display panel and the flexible wiring substrate disposed outside the stage, and sucks the end region of the display panel and the flexible wiring substrate to the main body of the vacuum device, and the vacuum device moves in a second direction, and sucks the end region of the display panel and the flexible wiring substrate to the main body of the vacuum device. And bending the display panel in a bending region of the end region by rotating the main body and the block of the vacuum device by 180 degrees.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2023-111660 filed on July 6, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] An embodiment of the present invention relates to an apparatus for processing a display device having flexibility. Background Art

[0004] Flat panel displays such as organic electroluminescence (EL) display devices have display panels on which thin film transistors (TFT) and organic light-emitting diodes (OLED) are formed. In the past, glass substrates were used as the substrates of display panels, but in recent years, resin films have been used for the substrates, which has promoted the development of flexible displays that can bend display panels. Summary of the invention

[0005] An object of the embodiment is to provide a processing device capable of improving the manufacturing yield of a display device.

[0006] A processing device according to one embodiment includes:

[0007] Carrier;

[0008] a support member having a movable support block; and

[0009] A vacuum device having a main body and a block,

[0010] The display device comprises a flexible display panel and a flexible wiring substrate, wherein the display panel is provided with a display area and an end area and comprises a flexible substrate, and the flexible wiring substrate is connected to a connection portion provided in the end area. In the display device, the display area of ​​the display panel is held on the carrier, and the end area of ​​the display panel and the flexible wiring substrate are arranged outside the carrier.

[0011] The support member is arranged adjacent to the stage and the display panel.

[0012] The support block moves in the first direction to support the end region of the display panel and the flexible wiring substrate disposed outside the carrier.

[0013] The vacuum device moves downwardly toward the support block.

[0014] The support block moves in a direction opposite to the first direction, and the support block retreats from the end region of the display panel and the flexible wiring substrate.

[0015] The vacuum device is raised to make the end area of ​​the display panel and the flexible wiring substrate adsorbed on the main body of the vacuum device.

[0016] The display panel is bent at the bending area of ​​the end area by rotating the main body and the block of the vacuum device by 180 degrees.

[0017] The block of the vacuum device is moved downward to press the areas of the display panel that are the bent areas and that are facing each other.

[0018] In a method for manufacturing a display device according to one embodiment, the display device includes:

[0019] A flexible display panel having a display area and an end area and a flexible substrate; and

[0020] a flexible wiring substrate connected to the connection portion provided in the end region,

[0021] In the above manufacturing method,

[0022] The display area of ​​the display panel is held on a carrier, and the end area of ​​the display panel and the flexible wiring substrate are arranged outside the carrier.

[0023] A support member having a movable support block is arranged adjacent to the stage and the display panel.

[0024] The support block moves in the first direction to support the end region of the display panel and the flexible wiring substrate disposed outside the carrier.

[0025] The vacuum device having a main body and a block moves below the support block.

[0026] The support block moves in a direction opposite to the first direction, and the support block retreats from the end region of the display panel and the flexible wiring substrate.

[0027] The vacuum device is raised to make the end area of ​​the display panel and the flexible wiring substrate adsorbed on the main body of the vacuum device.

[0028] The display panel is bent at the bending area of ​​the end area by rotating the main body and the block of the vacuum device by 180 degrees.

[0029] The block of the vacuum device is moved downward to press the areas of the display panel that are the bent areas and that are facing each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is an overall perspective view of the display device according to the embodiment.

[0031] Figure 2 It is a cross-sectional view showing an example of a schematic structure of a display device.

[0032] Figure 3 This is a diagram showing a schematic configuration of a processing device for bending a flexible wiring substrate.

[0033] Figure 4 It is a top view of the display device and the processing device.

[0034] Figure 5 It is a cross-sectional view of a display device and a processing device.

[0035] Figure 6 It is a top view of the display device and the processing device.

[0036] Figure 7 It is a cross-sectional view of a display device and a processing device.

[0037] Figure 8 It is a top view of the display device and the processing device.

[0038] Fig. 9 It is a cross-sectional view of a display device and a processing device.

[0039] Fig.10 It is a top view of the display device and the processing device.

[0040] Fig.11 It is a cross-sectional view of a display device and a processing device.

[0041] Fig.12 It is a top view of the display device and the processing device.

[0042] Fig.13 It is a cross-sectional view of a display device and a processing device.

[0043] Fig.14 It is a top view of the display device and the processing device.

[0044] Fig.15 It is a cross-sectional view of a display device and a processing device.

[0045] Fig.16 This is a partial plan view showing an example of a schematic structure of a display panel.

[0046] Fig.17 yes Fig.16 A cross-sectional view of the display panel along line A1 - A2 is shown. DETAILED DESCRIPTION

[0047] Hereinafter, various embodiments of the present invention will be described with reference to the accompanying drawings. In addition, the disclosed content is only an example, and for those skilled in the art, the appropriate changes that can be easily thought of to maintain the main purpose of the invention are of course also included in the scope of the present invention. In addition, in order to make the description clearer, there is a case where the width, thickness, shape, etc. of each part are schematically shown in the accompanying drawings compared to the actual state, but it is only an example and does not limit the interpretation of the present invention. In addition, in this specification and each figure, for the same elements as those described above with respect to the existing figures, the same figure mark is sometimes marked and the detailed description is appropriately omitted.

[0048] The embodiments described in this specification do not describe common technical features, but are embodiments that describe the same or corresponding special technical features of the present invention. Figure 1 A processing device and a display device according to one embodiment will be described in detail.

[0049] In the present embodiment, the first direction X, the second direction Y, and the third direction Z are orthogonal to each other, but may intersect at an angle other than 90 degrees. The direction toward the tip of the arrow in the third direction Z is defined as up or above, and the direction opposite to the direction toward the tip of the arrow in the third direction Z is defined as down or below. In addition, the first direction X, the second direction Y, and the third direction Z are sometimes referred to as the X direction, the Y direction, and the Z direction, respectively.

[0050] In the case of "the second member above the first member" and "the second member below the first member", the second member may be in contact with the first member or may be located away from the first member. In the latter case, the third member may be sandwiched between the first member and the second member. On the other hand, in the case of "the second member above the first member" and "the second member below the first member", the second member is in contact with the first member.

[0051] In addition, it is assumed that there is an observation position for observing the processing device and the display device on the front end side of the arrow in the third direction Z, and observation from the observation position toward the XY plane defined by the first direction X and the second direction Y is referred to as a top view. Observation of a cross section of the processing device and the display device in the XZ plane defined by the first direction X and the third direction Z or in the YZ plane defined by the second direction Y and the third direction Z is referred to as a cross-sectional view.

[0052] [Implementation Method]

[0053] Figure 11 is an overall perspective view of a display device according to an embodiment. The display device DSP includes a display area DA and a peripheral area FA provided around the display area DA on a substrate SUB1. The display device DSP includes a plurality of pixels PX arranged in the display area DA. In the display device DSP, light LT from the pixels PX is emitted upward.

[0054] exist Figure 1 In the display panel PNL, a substrate SUB1 and a plurality of pixels PX are included. The surface of the display panel PNL from which light LT is emitted is set as surface FF. The surface on the opposite side of the surface FF in the third direction Z is set as surface RF. The surface FF is an emission surface, a front surface or an upper surface, and the surface RF may also be called a back surface or a lower surface.

[0055] The area EA at the end of the substrate SUB1 is arranged outside the display area DA. The area near the display area DA in the area EA is called the end ES11. The end of the area EA that is away from the display area DA along the second direction Y is set as the end ES12. The surface of the substrate SUB1 from which the light LT is emitted is set as the surface FL. The surface on the opposite side to the surface FL is set as the surface RL. The surface RL is the same surface as the surface RF. In addition, the area EA is also called the end area of ​​the display panel PNL.

[0056] A connection portion WPD is provided in the region EA on the end ES12 side. Wiring from the display region DA extends to the connection portion WPD. The wiring from the display region DA is a scanning line and a signal line from a pixel PX, or a wiring connected to the scanning line and the signal line.

[0057] A region BND is provided between the end ES11 and the end ES12 of the region EA. A region BSF is provided between the region BND and the end ES12. The region BND is a bent region, and the region BSF is a region that is bent and turned upside down. The region BND and the region BSF will be described in detail later.

[0058] A flexible wiring substrate FPC1 is provided at the connection portion WPD in the area EA. The flexible wiring substrate FPC1 has a plurality of wirings arranged along the first direction X. The wirings of the flexible wiring substrate FPC1 are electrically connected to the connection portion WPD via an anisotropic conductive film (ACF). Thus, the wirings from the display area DA and the wirings of the flexible wiring substrate FPC1 are electrically connected.

[0059] At the end of the flexible wiring FPC1, the end close to the connection portion WPD is referred to as the end EF11. The end on the opposite side of the end EF11 along the second direction Y is referred to as the end EF12. The end EF11 is closer to the end ES12 of the substrate SUB1 than the end EF12. In other words, the end EF11 is located between the end EF12 and the end ES12.

[0060] The end EF12 of the flexible wiring substrate FPC1 is electrically connected to the printed circuit substrate PCB. The end of the printed circuit substrate PCB connected to the end EF12 of the flexible wiring substrate FPC1 is set as the end EB11. The end on the opposite side of the end EB11 along the second direction Y is set as the end EB12. The end EB11 is closer to the end ES12 of the substrate SUB1 than the end EB12. In other words, the end EB11 is located between the end EB12 and the end ES12.

[0061] In addition, the flexible wiring board FPC1 and the printed circuit board PCB are sometimes collectively referred to as a flexible wiring board FPC. Alternatively, a configuration in which only the flexible wiring board FPC1 is provided without providing the printed circuit board PCB may be adopted.

[0062] A driving element that outputs an image signal and / or a driving signal may be provided on the flexible printed circuit board FPC1. The signal from the driving element is input to the pixel PX in the display area DA via the flexible printed circuit board FPC1. The pixel PX emits light based on the image signal and various control signals.

[0063] The substrate SUB1 includes a flexible substrate (substrate BA1 described later) and a plurality of pixels PX. The substrate may be formed of, for example, a resin film material, more specifically, acrylic acid, polyimide, polyethylene terephthalate, polyethylene naphthalate, etc. A plurality of pixels PX are provided on the substrate, which include a plurality of switching elements, a plurality of scanning lines, a plurality of signal lines, a plurality of pixel electrodes, a common electrode, a plurality of light-emitting layers, etc. The detailed structure of the pixel PX, etc. will be described later.

[0064] Since the substrate SUB1 has flexibility, the display panel PNL is a flexible display panel, that is, the display panel PNL is a flexible display.

[0065] Figure 2 The display device DSP includes a display panel PNL, a polarizing plate POL, an optical adhesive OCA1, a cover material CG, a protective member BPT, a protective member UVR, a protective member PRS, a protective member DST, and a flexible wiring board FPC.

[0066] exist Figure 2 In the display device DSP shown, the display panel PNL is bent at the region BND. By bending the display panel PNL at the region BND, the region EA including the connection portion WPD is reduced, thereby achieving a narrow frame.

[0067] The region BSF of the display panel PNL overlaps a portion of the display area DA in the direction opposite to the third direction Z. Between a portion of the display area DA and the region BSF, along the direction opposite to the third direction Z, the protection member BPT, the protection member DST, and the protection member SPT are arranged.

[0068] A polarizing plate POL is provided on the surface FF side of the display panel PNL so as to contact the display area DA. The polarizing plate POL is, for example, a circular polarizing plate. By providing the polarizing plate POL, for example, reflection of external light in the display area DA can be suppressed.

[0069] A cover material CG is provided on the polarizing plate POL via an optical adhesive OCA1. The cover material CG may be, for example, a glass or plastic thin plate.

[0070] A protective component BPT is provided on the surface RF side of the display panel PNL. The surface of the protective component BPT that contacts the surface RF of the display panel PNL is set as a surface FB. The surface of the protective component BPT that is opposite to the surface FB is set as a surface RB. The protective component DST is provided in contact with a portion of the surface RB. The protective component BPT substantially overlaps with the display area DA of the display panel PNL. More specifically, the protective component BPT overlaps with a portion of the display area DA and the area EA.

[0071] The surface of the protection member DST that contacts the surface RB of the protection member BPT is set as a surface FP. The surface of the protection member DST that is opposite to the surface FP is set as a surface RP. The protection member SPT is provided in contact with the surface RP. The protection member SPT overlaps with the region BSF.

[0072] The surface of the protective member SPT that contacts the surface RP of the protective member DST is defined as surface FS. The surface of the protective member SPT that is opposite to the surface FS is defined as surface RS. Surface RS contacts the surface RF of the region BSF of the display panel PNL (surface RL of the substrate SUB1).

[0073] The protection member BPT and the protection member SPT can be made of a plate-shaped resin material, such as a plate-shaped polyethylene terephthalate (PET). The protection member BPT and the protection member SPT are attached to the surface RF of the display panel PNL, sandwiching the protection member DST, and facing each other in the third direction Z. Thus, they have the function of protecting the display panel PNL.

[0074] The protective component DST is a component having an adhesive layer on the surface and the back thereof, such as a double-sided tape. The protective component SPT and the protective component BPT are bonded together by the protective component DST. Moreover, the protective component DST is more preferably a resin material having a cushioning property. The protective component DST has the function of keeping the interval of the bent display panel PNL at a fixed level or above. Thus, even if pressure is applied to the display panel PNL in the thickness direction (the third direction Z), the curvature of the region BND will remain within an allowable range.

[0075] The protective member UVR is provided in contact with the surface FL in the area BND of the display panel PNL. The protective member UVR has the function of protecting the bent area BND of the display panel PNL. The protective member UVR is provided in contact with the surface FL of the display panel PNL between the end of the polarizing plate POL and the end EF11 of the flexible wiring substrate FPC.

[0076] The protective component UVR may be made of, for example, a photocurable resin material. The protective component UVR is provided so that there is no gap between the protective component UVR and the polarizer POL. This is because, if there is a gap between the polarizer POL and the protective component UVR, the display panel PNL will be broken from the gap during the process of bending the display panel PNL, and the wiring of the display panel PNL will be disconnected.

[0077] In the vicinity of the end portion ES12 of the display panel PNL, a protection member PRS is provided so as to be in contact with the end portion ES12 , the protection member SPT, and the flexible wiring board FPC.

[0078] The protection member PRS may be made of, for example, a resin material. The protection member PRS has a function of protecting the end portion ES12 of the display panel PNL.

[0079] Figure 3 1 is a diagram showing a schematic structure of a processing device for bending a flexible wiring substrate. The processing device BAP has a stage STG. In the process of bending the flexible wiring substrate FPC1 of the display device DSP, the display area DA in the display panel PNL (substrate SUB1) is arranged on the stage STG, and the end area EA, the flexible wiring substrate FPC1 and the printed circuit board PCB are extended from the stage STG.

[0080] like Figure 3In this way, after the display panel PNL and the like are arranged, the unit having the adsorption and crimping components moves toward the stage STG side, adsorbs and rotates, and bends the area BND of the display panel PNL. In order to enable the unit to contact, no holding structure is provided in the portion extending from the stage STG. Therefore, the area EA of the display panel PNL and the flexible wiring substrate FPC1 extending from the stage STG sag due to their own weight, and there is a concern that the wiring in the display panel PNL and the wiring in the flexible wiring substrate FPC1 will be damaged. If such wiring is disconnected, the display device DSP will become a defective product, and there is a concern that the yield rate will be reduced.

[0081] In order to make the plane FF of the emitted light face downward, the display device DSP is arranged on the stage STG in an upside-down state. Figure 3 In the display device DSP shown, a polarizing plate POL is provided in contact with the display panel PNL. A touch panel TP is bonded to the polarizing plate POL via an optical adhesive OCA1. Furthermore, a cover material CG is provided on the touch panel TP via an optical adhesive OCA2.

[0082] use Figures 4 to 15 , the process of bending the display panel PNL by the processing device BAP is described. Figure 4 , Figure 6 , Figure 8 , Fig.10 , Fig.12 and Fig.14 It is a top view of the display device and the processing device. Figure 5 , Figure 7 , Fig. 9 , Fig.11 , Fig.13 and Fig.15 It is a cross-sectional view of a display device and a processing device.

[0083] like Figure 4 and Figure 5 As shown, the processing device BAP is provided with a support member SPD and a vacuum device VAC in addition to the stage STG. The support member SPD is provided with a support table SPH and a support block SPB. The stage STG is arranged on the stage STD. The stage STG and the stage STD are combined to form a stage device STP.

[0084] The support stage SPH of the support member SPD is disposed adjacent to the stage STG. The support block SPB moves in the direction opposite to the first direction X. The support block SPB is located below the area EA at the end, the flexible wiring substrate FPC1, and the printed circuit substrate PCB, but is not disposed directly below. The support block SPB is disposed at a position separated from the area EA at the end, the flexible wiring substrate FPC1, and the printed circuit substrate PCB in a plan view.

[0085] The vacuum device VAC includes a main body VAD and a block body VAS. Figure 4 and Figure 5 In the process, the vacuum device VAC is separated from the display device DSP and the stage device STP.

[0086] First, with Figure 3 Similarly, the display area DA of the display panel PNL is held on the stage STG. The end area EA, the flexible wiring board FPC1, and the printed circuit board PCB are arranged to extend from the stage STG.

[0087] Next, the support block SPB slides in the direction opposite to the first direction X (see Figure 6 and Figure 7 ). The support block SPB moves to below the area EA, the flexible wiring substrate FPC1 and the printed circuit substrate PCB to support the area EA, the flexible wiring substrate FPC1 and the printed circuit substrate PCB.

[0088] Next, the vacuum device VAC moves in the direction opposite to the second direction Y. The vacuum device VAC is arranged below the support block SPB (see Figure 8 and Fig. 9 ).

[0089] After the vacuum device VAC moves to the bottom of the support block SPB, the support block SPB located under the display panel PNL retreats. Only the vacuum device VAC is arranged under the display panel PNL. Next, the vacuum device VAC moves along the third direction Z, i.e., rises, and the suction area EA, the flexible wiring substrate FPC1, and the printed circuit substrate PCB (see Fig.10 and Fig.11 ).

[0090] Next, the vacuum device VAC is rotated 180° relative to the XY plane (refer to Fig.12 and Fig.13 ). That is, the vacuum device VAC is rotated in such a way that it is turned upside down. The main body VAD of the vacuum device VAC adsorbs the area EA, the flexible wiring substrate FPC1 and the printed circuit substrate PCB. As a result, the display panel PNL is bent at the area BND. The area BSF in the area EA, the flexible wiring substrate FPC1 and the printed circuit substrate PCB are arranged upside down. The area BND is also called a bending area, and the area BSF is called an inverted area.

[0091] The block VAS of the vacuum device VAC is disposed above the area BSF, the protection member DST, and the protection member SPT, and is separated from the protection member DST and the protection member SPT. Fig.13In FIG. 1 , the lengths of the protection component DST and the protection component SPT in the direction parallel to the second direction Y are substantially the same for the convenience of drawing. Figure 2 As shown, the length of the protection member SPT in the direction parallel to the second direction Y is longer than the length of the protection member DST in the direction parallel to the second direction Y.

[0092] Next, the block VAS of the vacuum device VAC moves downward (in the direction opposite to the third direction Z) to press the regions of the bent display panel PNL that face each other in the third direction Z. More specifically, the block VAS moves downward to press the region BSF of the display panel PNL, the protection member DST, and the protection member SPT (see FIG. Fig.14 and Fig.15 ). In more detail, Figure 2 As shown, the display area DA and the area BSF are pressed together at a predetermined interval by pressing together the protection component BPT overlapping the display area DA of the display panel PNL, the protection component SPT overlapping the area BSF, and the protection component DST disposed between the protection component BPT and the protection component SPT. In addition, the protection component BPT and the protection component SPT are also referred to as the first protection component and the second protection component, respectively.

[0093] At this time, the compression of the region BSF of the display panel PNL, the protection member DST, and the protection member SPT may be so-called temporary fixing. Fig.14 and Fig.15 After the described steps, the display panel PNL, the protection component DST, and the protection component SPT may be fixed together by other crimping devices.

[0094] In this embodiment, unlike the stage STG, a support member SPD having a support stage SPH and a support block SPB is prepared. The display panel PNL, the flexible wiring substrate FPC1, and the printed circuit board PCB can be supported by the support block SPB of the support member SPD. Thus, the display panel PNL1 and the flexible wiring substrate FPC1 will not bend due to their own weight. Thus, the wiring in the display panel PNL1 and the wiring of the flexible wiring substrate FPC1 can be prevented from being disconnected.

[0095] Here, the pixel PX of the display panel PNL will be described in more detail.

[0096] Fig.16: is a partial top view showing an example of a schematic structure of a display panel. A plurality of pixels PX include a pixel PXR that emits red light, a pixel PXG that emits green light, and a pixel PXB that emits blue light. The pixel PXR, the pixel PXG, and the pixel PXB are also referred to as the first pixel, the second pixel, and the third pixel, respectively. The pixel PXR is adjacent to the pixel PXB along the first direction X and the second direction Y. The pixel PXG is adjacent to the pixel PXB along the first direction X and the second direction Y. The pixel PXB is adjacent to the pixel PXR along the first direction, and adjacent to the pixel PXG along the second direction Y.

[0097] Fig.17 yes Fig.16 A cross-sectional view of the display panel along line A1 - A2 is shown.

[0098] As described above, the substrate BA1 may be made of a resin film material, such as acrylic, polyimide, polyethylene terephthalate, polyethylene naphthalate, etc. The substrate BA1 may be formed of a single layer of any one of these materials or a plurality of layers.

[0099] An insulating layer UC1 is provided on the base material BA1. The insulating layer UC1 is formed of, for example, a single layer or a stacked layer of a silicon oxide film and a silicon nitride film.

[0100] A light shielding layer BM may be provided on the insulating layer UC1 so as to overlap with the transistor Tr. The light shielding layer BM suppresses changes in transistor characteristics caused by the intrusion of light from the back side of the channel of the transistor Tr. When the light shielding layer BM is formed of a conductive layer, a back gate effect can be provided to the transistor Tr by providing a predetermined potential.

[0101] The insulating layer UC2 is provided in a manner covering the insulating layer UC1 and the light shielding layer BM. As the material of the insulating layer UC2, the same material as that of the insulating layer UC1 can be used. The insulating layer UC2 can also be made of a material different from that of the insulating layer UC1. For example, silicon oxide can be used for the insulating layer UC1, and silicon nitride can be used for the insulating layer UC2. The insulating layers UC1 and UC2 are combined to form the insulating layer UC.

[0102] A transistor Tr is provided on the insulating layer UC. The transistor Tr includes a semiconductor layer SC, an insulating layer GI, a gate electrode GE (scanning line), an insulating layer ILI, a source electrode SE (signal line), and a drain electrode DE. The transistor Tr is a thin film transistor (TFT).

[0103] As the semiconductor layer SC, amorphous silicon, polycrystalline silicon, or an oxide semiconductor is used.

[0104] As the insulating layer GI, for example, a single layer of silicon oxide or silicon nitride is provided or a stacked layer of these is provided.

[0105] As the gate electrode GE, for example, molybdenum-tungsten alloy (MoW) is used. The gate electrode GE may be formed integrally with the scanning line GL.

[0106] The insulating layer ILI is provided so as to cover the semiconductor layer SC and the gate electrode GE. The insulating layer ILI is formed of, for example, a single-layer silicon oxide layer or a silicon nitride layer, or a stack of these layers.

[0107] A source electrode SE and a drain electrode DE are provided on the insulating layer ILI. The source electrode SE and the drain electrode DE are connected to the source region and the drain region of the semiconductor layer SC through contact holes provided in the insulating layer ILI and the insulating layer GI, respectively. The source electrode SE may also be formed integrally with the signal line.

[0108] The insulating layer PAS is provided so as to cover the source electrode SE, the drain electrode DE, and the insulating layer ILI. The insulating layer PLL is provided so as to cover the insulating layer PAS.

[0109] The insulating layer PAS is formed using an inorganic insulating material. For example, a single layer of silicon oxide or silicon nitride or a stack of these inorganic insulating materials can be cited. The insulating layer PLL is formed using an organic insulating material. For example, organic materials such as photosensitive acrylic and polyimide can be cited. By providing the insulating layer PLL, the level difference caused by the transistor TR can be flattened.

[0110] An anode AD is provided on the insulating layer PLL. The anode AD is connected to the drain electrode DE via a contact hole provided in the insulating layer PAS and PLL. The anode provided in the pixel PXR is referred to as the anode ADR, the anode provided in the pixel PXB is referred to as the anode ADB, and the anode provided in the pixel PXG is referred to as the anode ADG. When there is no need to distinguish between the anode ADR, the anode ADG, and the anode ADB, they are simply referred to as the anode AD.

[0111] The anode AD may be formed of a laminate of a reflective electrode and a transparent electrode. The reflective electrode is formed of a conductive material with high reflectivity, such as silver (Ag) or aluminum (Al). The transparent electrode is formed of, for example, indium tin oxide (ITO) or indium zinc oxide (IZO).

[0112] In this embodiment, the structure from the base material BA1 to the insulating layer PLL is referred to as a back plate BPS.

[0113] A bank BK (also referred to as a convex portion or a rib) is provided between adjacent anodes AD. The same organic material as that of the insulating layer PLL is used as a material of the bank BK. The bank BK is opened so that a part of the anode AD is exposed.

[0114] The opening provided in the pixel PXR is referred to as opening OPR, the opening provided in the pixel PXB is referred to as opening OPB, and the opening provided in the pixel PXG is referred to as opening OPG. When it is not necessary to distinguish between the opening OPR, the opening OPB, and the opening OPG, they are simply referred to as opening OP.

[0115] The end of the opening OP is preferably in a gently tapered shape in a cross-sectional view. If the end of the opening OP is in a steep shape, poor coverage may occur in the organic EL layer ELY to be formed later.

[0116] An organic EL layer ELY is provided between adjacent banks BK to overlap with the anode AD. The organic EL layer ELY includes a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer. If necessary, the organic EL layer ELY may also include an electron blocking layer and a hole blocking layer.

[0117] The organic EL layer provided in the pixel PXR is referred to as the organic EL layer ELYR, the organic EL layer provided in the pixel PXB is referred to as the organic EL layer ELYB, and the organic EL layer provided in the pixel PXG is referred to as the organic EL layer ELYG. When there is no need to distinguish the organic EL layer ELYR, the organic EL layer ELYG, and the organic EL layer ELYB, they are simply referred to as the organic EL layer ELY.

[0118] A cathode CD is provided on the organic EL layer ELY. The cathode CD can be formed using, for example, a magnesium-silver alloy (MgAg) film, a single-layer film of silver (Ag), or a laminated film of silver (Ag) and a transparent conductive material. The transparent conductive material can be, for example, indium tin oxide (ITO) or indium zinc oxide (IZO).

[0119] An insulating layer SEY is provided in a manner covering the cathode CD. The insulating layer SEY has a function of preventing moisture from invading the organic EL layer ELY from the outside. As the insulating layer SEY, a material with high gas barrier properties is suitable. As the insulating layer SEY, for example, an insulating layer formed by sandwiching an organic insulating layer between two inorganic insulating layers containing nitrogen can be cited. As the material of the organic insulating layer, acrylic resin, epoxy resin, polyimide resin, etc. can be cited. As the material of the inorganic insulating layer containing nitrogen, for example, silicon nitride and aluminum nitride can be cited.

[0120] The light generated by the organic EL layer ELY is released upward via the cathode CD. That is, the display device DSP (display panel PNL) of the present embodiment has a top emission structure.

[0121] Several embodiments of the present invention have been described, but these embodiments are presented as examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in various other ways, and various omissions, substitutions, and changes can be made without departing from the gist of the invention. These embodiments and their variations are included in the scope and gist of the invention, and are included in the technical solutions recorded in the claims and their equivalents.

Claims

1. A processing device, characterized in that: have: Carrier; a support member having a movable support block; and A vacuum device having a main body and a block, The display device comprises a flexible display panel and a flexible wiring substrate, wherein the display panel is provided with a display area and an end area and has a flexible base material, and the flexible wiring substrate is connected to a connection portion provided in the end area. In the display device, the display area of ​​the display panel is maintained on the carrier, and the end area of ​​the display panel and the flexible wiring substrate are arranged outside the carrier. The support member is arranged adjacent to the stage and the display panel, The support block moves in the first direction to support the end region of the display panel and the flexible wiring substrate disposed outside the stage. The vacuum device moves downwardly toward the support block. The support block moves in a direction opposite to the first direction, and the support block retreats from the end region of the display panel and the flexible wiring substrate. The vacuum device is raised to cause the end area of ​​the display panel and the flexible wiring substrate to be adsorbed onto the main body of the vacuum device. The display panel is bent at the bending area of ​​the end area by rotating the main body and the block of the vacuum device by 180 degrees. The block of the vacuum device moves downward to press the areas of the display panel that are bent and facing each other.

2. The processing device according to claim 1, characterized in that: The display device further includes a printed circuit board connected to the flexible wiring board.

3. The processing device according to claim 1, characterized in that: The substrate is formed of a resin film material of acrylic acid, polyimide, polyethylene terephthalate or polyethylene naphthalate.

4. The processing device according to claim 1, characterized in that: A double-sided tape is arranged between the regions facing each other.

5. The processing device according to claim 1, characterized in that: A photocurable resin material is provided in the bending region.

6. The processing device according to claim 1, characterized in that: The display device further comprises: a first protective member overlapping the display area; and a second protective member overlapping an inverted region in the end region that is different from the bent region, A double-sided tape is arranged between the first protection member and the second protection member.

7. A method for manufacturing a display device, wherein: The display device includes a flexible display panel and a flexible wiring substrate, wherein the display panel has a display area and an end area and has a flexible base material, and the flexible wiring substrate is connected to a connection portion provided in the end area. The manufacturing method of the display device is characterized in that: In the manufacturing method, The display area of ​​the display panel is held on a stage, and the end area of ​​the display panel and the flexible wiring substrate are arranged outside the stage. A support member having a movable support block is arranged adjacent to the stage and the display panel, The support block moves in the first direction to support the end region of the display panel and the flexible wiring substrate disposed outside the stage. The vacuum device having a main body and a block moves below the support block, The support block moves in a direction opposite to the first direction, and the support block retreats from the end region of the display panel and the flexible wiring substrate. The vacuum device is raised to cause the end area of ​​the display panel and the flexible wiring substrate to be adsorbed onto the main body of the vacuum device. The display panel is bent at the bending area of ​​the end area by rotating the main body and the block of the vacuum device by 180 degrees. The block of the vacuum device moves downward to press the areas of the display panel that are bent and facing each other.

8. The method for manufacturing a display device according to claim 7, wherein: The display device further includes a printed circuit board connected to the flexible wiring board.

9. The method for manufacturing a display device according to claim 7, wherein: The substrate is formed of a resin film material of acrylic acid, polyimide, polyethylene terephthalate or polyethylene naphthalate.

10. The method for manufacturing a display device according to claim 7, wherein: A double-sided tape is arranged between the regions facing each other.

11. The method for manufacturing a display device according to claim 7, wherein: A photocurable resin material is provided in the bending region.

12. The method for manufacturing a display device according to claim 7, wherein: The display device further comprises: a first protective member overlapping the display area; and a second protective member overlapping an inverted region in the end region that is different from the bent region, A double-sided tape is arranged between the first protection member and the second protection member.

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