Circuit board structure and manufacturing method thereof, signal transmission assembly and data center

Abstract

The invention relates to the technical field of circuit boards, and provides a circuit board structure comprising a first circuit board comprising a plurality of signal lines; the plurality of connecting structures are convexly arranged on the surface of the first circuit board, and the connecting structures are electrically connected to one corresponding signal line; and the plurality of connecting structures are also used for being electrically connected with a second circuit board, so that the plurality of signal lines are electrically connected with the second circuit board. According to the circuit board structure provided by the embodiment of the invention, the first circuit board and the connecting structure arranged on the surface of the first circuit board in the protruding manner can replace a high-speed coaxial cable and a connector, so that the space is saved. The embodiment of the invention further provides a manufacturing method of the circuit board structure, a signal transmission assembly and a data center.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a circuit board structure and a manufacturing method thereof, a signal transmission component and a data center. Background Art

[0002] Electronic devices such as servers and switches include multiple functional modules. Existing data centers usually use high-speed coaxial cables to connect different functional modules.

[0003] With the development of technology, the speed of each functional module is gradually increasing, and the number of high-speed coaxial cables and connectors required in the data center is also increasing. High-speed coaxial cables and connectors occupy more space. Summary of the invention

[0004] The purpose of the present application is to provide a circuit board structure and a manufacturing method thereof, a signal transmission component and a data center, which solve the problem that high-speed coaxial cables and connectors occupy a large amount of space.

[0005] An embodiment of the first aspect of the present application provides a circuit board structure, which includes a first circuit board, including multiple signal lines; multiple connection structures, protruding from the surface of the first circuit board, and the connection structures are respectively electrically connected to a corresponding signal line; the multiple connection structures are also used to be electrically connected to the second circuit board, so that the multiple signal lines are electrically connected to the second circuit board.

[0006] The circuit board structure provided in the embodiment of the present application includes a first circuit board and a plurality of connection structures. The first circuit board includes a plurality of signal lines, and can use the plurality of signal lines to transmit signals respectively. The first circuit board replaces a plurality of high-speed coaxial cables. The first circuit board can be connected to the second circuit board through a plurality of connection structures protruding from its surface, that is, the first circuit board does not need to be connected to the second circuit board through a coaxial connector. The circuit board structure provided in the embodiment of the present application replaces the high-speed coaxial cable with the first circuit board, and the circuit board structure also omits the coaxial connector, saving space.

[0007] In some embodiments, the first circuit board includes a first outer metal layer, a second outer metal layer, and at least one inner metal layer arranged between the first outer metal layer and the second outer metal layer, and the signal line is a line in the inner metal layer; the first outer metal layer includes a plurality of first solder pads, the first solder pads are correspondingly connected to the signal lines, the connection structure is connected to the first solder pads and is electrically conductive, and the connection structure is protruded relative to the first solder pads.

[0008] In some embodiments, the circuit board structure also includes a adapter circuit board, the adapter circuit board includes a first surface and a second surface arranged opposite to each other, the multiple connection structures include a plurality of first connection structures protruding from the first surface and a plurality of second connection structures protruding from the second surface, the first connection structures are electrically conductively connected to the second connection structures in a one-to-one correspondence; the second connection structure is connected to the first solder pad and is electrically conductive, and the first connection structure is used to be electrically connected to the second circuit board.

[0009] In some embodiments, the adapter circuit board is bonded to the first circuit board by ACF conductive adhesive, or the adapter circuit board is fixed to the first circuit board by welding.

[0010] In some embodiments, a plurality of via holes filled with conductive material are provided on the adapter circuit board, and the first connection structure and the second connection structure respectively cover opposite sides of the via holes and are connected through the via holes.

[0011] In some embodiments, the conductive material in the via is via copper, the first connection structure includes a first base copper portion and a first electroplated copper portion integral with the via copper, and the second connection structure includes a second base copper portion and a second electroplated copper portion integral with the via copper.

[0012] In some embodiments, the height of the first connection structure is 60 um to 90 um; and / or the height of the second connection structure is 60 um to 90 um.

[0013] An embodiment of the second aspect of the present application proposes a method for manufacturing a circuit board structure, including: providing a first circuit board, the first circuit board including a plurality of signal lines; manufacturing a plurality of connection structures, so that the connection structures are protruding from the surface of the first circuit board and electrically connected to a corresponding signal line, wherein the connection structures are also used to be electrically connected to a second circuit board, so that the plurality of signal lines are electrically connected to the second circuit board.

[0014] The circuit board structure produced by the above production method replaces the high-speed coaxial cable, and the circuit board structure also omits the coaxial connector. Therefore, the circuit board structure has a simple structure and a small size, which reduces the occupied space. In addition, the above production method has high production efficiency and low cost.

[0015] In some embodiments, the production of multiple connection structures includes: producing an adapter circuit board, wherein the adapter circuit board includes a first surface and a second surface arranged opposite to each other, the multiple connection structures include a plurality of first connection structures protruding from the first surface and a plurality of second connection structures protruding from the second surface, and the first connection structures are electrically conductively connected to the second connection structures in a one-to-one correspondence; and fixing the adapter circuit board to the first circuit board so that the second connection structures are electrically connected to the signal lines.

[0016] In some embodiments, the manufacturing of the adapter circuit board includes: providing a substrate, the substrate including a dielectric layer and a base copper layer arranged on both sides of the dielectric layer; drilling a plurality of via holes on the substrate; copper plating on the substrate to fill the via holes with copper and form a copper plating layer on the surface of the substrate; etching the substrate to form a plurality of protruding first connection structures and second connection structures on opposite sides of the dielectric layer, respectively, and the first connection structures and the second connection structures are electrically connected through the via copper.

[0017] In some embodiments, the adapter circuit board is fixedly connected between the first circuit board and the second circuit board, including: bonding the adapter circuit board to the first circuit board through ACF conductive glue, wherein the second surface faces the first circuit board; and pressing the adapter circuit board, the ACF conductive glue and the first circuit board together.

[0018] An embodiment of the third aspect of the present application proposes a signal transmission component, including a circuit board structure, which is the circuit board structure provided by the first aspect or the second aspect, and includes a first circuit board and a plurality of connection structures arranged at opposite ends of the first circuit board, the first circuit board including a plurality of signal lines; a second circuit board, connected to the head end of the signal line through the connection structure at one end of the first circuit board; and a third circuit board, connected to the tail end of the signal line through the connection structure at the other end of the first circuit board.

[0019] An embodiment of the fourth aspect of the present application proposes a data center, including a circuit board structure as in the first aspect, a circuit board manufactured by the method for manufacturing the circuit board structure as in the second aspect, or a signal transmission component as in the third aspect.

[0020] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1A It is a structural schematic diagram of a terminal device in the prior art;

[0023] Figure 1B It is a schematic diagram of the connection between a high-speed coaxial cable and a circuit board module in the prior art;

[0024] Figure 2 A schematic diagram of the structure of a signal transmission component provided in one embodiment of the present application;

[0025] Figure 3 The signal transmission component provided in one embodiment of the present application is Figure 2 Schematic diagram of the cross section along line AA;

[0026] Figure 4 A signal transmission component provided in another embodiment of the present application is provided along Figure 2 Schematic diagram of the cross section of the AA line;

[0027] Figure 5 A schematic diagram of a circuit board structure provided in one embodiment of the present application;

[0028] Figure 6 A schematic diagram of the structure of a transfer circuit board provided in one embodiment of the present application;

[0029] Figure 7 A schematic cross-sectional view of a first circuit board provided in one embodiment of the present application;

[0030] Figure 8 A schematic cross-sectional view of a first circuit board provided in another embodiment of the present application;

[0031] Fig. 9 A schematic diagram of an inner layer circuit in a first circuit board provided in an embodiment of the present application;

[0032] Fig.10 A top view of a transfer circuit board provided in one embodiment of the present application;

[0033] Fig.11 One of the flow charts of the method for manufacturing a circuit board structure provided in one embodiment of the present application;

[0034] Fig.12 A second flowchart of a method for manufacturing a circuit board structure provided in an embodiment of the present application;

[0035] FIG. 13A to FIG. 13D A schematic diagram of the manufacturing process of a transfer circuit board provided in an embodiment of the present application;

[0036] Fig.14 A schematic diagram of assembling a first circuit board and ACF conductive adhesive provided in an embodiment of the present application;

[0037] Fig.15 A schematic diagram of assembling a first circuit board, an ACF conductive adhesive and a transfer circuit board provided in an embodiment of the present application;

[0038] Fig.16 A schematic diagram of assembling a circuit board structure and ACF conductive adhesive provided in one embodiment of the present application;

[0039] Fig.17 This is a schematic diagram of the assembly of a circuit board structure, ACF conductive adhesive and a second circuit board provided in one embodiment of the present application.

[0040] Description of main component symbols:

[0041] 100, circuit board structure; 10, first circuit board; 11, first outer metal layer; 111, first pad; 12, second outer metal layer; 13, inner metal layer; 131, signal line; 131a, differential signal line; 131b, single-ended signal line; 14, insulating dielectric layer; 15, covering film; 16, solder mask; 17, adhesive layer; 171, non-windowed portion; 172, windowed portion; 20, transfer circuit board; 20a, first surface; 20b, second surface; 21, connection structure; 211, first connection structure; 2111, first base copper portion; 2112, first electroplated copper portion; 212, second connection structure; 2121, second base copper portion; 2122, second electroplated copper portion; 22, circuit board body; 23, hole copper; 201, dielectric layer; 202, base copper layer; 203, copper plating layer; 204, via hole; 205, dry film; 30, second circuit board; 31, second solder pad; 40, third circuit board; 50, ACF conductive glue; 51, conductive particles; 1, circuit board module; 2, high-speed coaxial cable; 3, coaxial connector. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0043] It should be noted that when a component is referred to as being "fixed on" or "disposed on" another component, it may be directly or indirectly on the other component. When a component is referred to as being "connected to" another component, it may be directly or indirectly connected to the other component. The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the accompanying drawings and is only for the convenience of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the patent. The terms "first" and "second" are only used for the convenience of description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0044] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0045] References to "one embodiment", "some embodiments" or "an embodiment" described in the specification of this application mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some other embodiments", "in some other embodiments", etc., which appear at different places in this specification, do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. In addition, in one or more embodiments, particular features, structures or characteristics may be combined in any suitable manner.

[0046] Servers, switches and other electronic devices are usually connected using cables. Figure 1A is a schematic diagram of the structure of a terminal device in the prior art, Figure 1B FIG. 1 is a schematic diagram of a connection between a high-speed coaxial cable and a circuit board module in the prior art. Figure 1A As shown, in the terminal device, different circuit board modules 1 are connected via high-speed coaxial cables 2; Figure 1BAs shown, both ends of the high-speed coaxial cable 2 are connected to coaxial connectors 3, which are screwed to the circuit board module 1 to connect the high-speed coaxial cable 2 to the circuit board module 1. With the development of technology, the speed of each functional module is gradually improved, and the number of high-speed coaxial cables 2 required to be installed in the chassis of electronic equipment is increasing. The high-speed coaxial cable 2 and the coaxial connector 3 occupy more space, resulting in insufficient space in the chassis.

[0047] In view of this, an embodiment of the present application provides a circuit board structure, which includes a first circuit board and a plurality of connection structures, wherein the first circuit board includes a plurality of signal lines arranged side by side; the plurality of connection structures are protruding from the surface of the first circuit board, the plurality of connection structures are electrically connected to the signal lines respectively, and the plurality of connection structures are also used to be electrically connected to the second circuit board, so that the plurality of signal lines are electrically connected to the second circuit board. In this way, the first circuit board can transmit signals using a plurality of signal lines, so that the first circuit board replaces a plurality of high-speed coaxial cables; the first circuit board is connected to the second circuit board through the connection structure, that is, the first circuit board does not need to be connected to another circuit board through a coaxial connector. The circuit board structure provided in the embodiment of the present application replaces the high-speed coaxial cable through the first circuit board and the plurality of connection structures and omits the coaxial connector, which saves space and is conducive to reducing the size of the electronic device.

[0048] The circuit board structure in the embodiment of the present application can be applied to a data center, and the circuit board structure can connect different devices in the data center.

[0049] The embodiment of the first aspect of the present application provides a circuit board structure. Figures 2 to 9 The circuit board structure 100 includes a first circuit board 10 and a plurality of connection structures 21. The first circuit board 10 includes a plurality of signal lines 131. The plurality of connection structures 21 are protruding from the surface of the first circuit board 10. The connection structures 21 are electrically connected to a corresponding signal line 131 respectively. The plurality of connection structures 21 are also used to be electrically connected to the second circuit board 30 so that the plurality of signal lines 131 are electrically connected to the second circuit board 30.

[0050] Please refer to Figure 7 The first circuit board 10 is a multi-layer circuit board, preferably a flexible printed circuit board (FPC). The flexible circuit board has the advantages of high wiring density, light weight, thin thickness, and good bending resistance. It can be easily connected between two circuit boards for easy assembly. In other embodiments, the first circuit board 10 can also be a rigid circuit board or a rigid-flexible board.

[0051] The first circuit board 10 includes a plurality of signal lines 131 arranged at intervals, and the plurality of signal lines 131 may be arranged in parallel or non-parallel; the signal lines 131 may extend along the length direction of the first circuit board 10, wherein the signal lines 131 may be straight lines, or the ends of the plurality of signal lines 131 may be bent and extended to meet actual assembly requirements. In addition, the first circuit board 10 is a multi-layer circuit board, and the signal lines 131 may be arranged in the same metal layer of the first circuit board 10, or in different metal layers. In some embodiments, the plurality of signal lines 131 all extend along the length direction of the first circuit board 10.

[0052] The signal line 131 may be a high-speed signal line or a low-speed signal line. The number of the signal lines 131 is two or more, and the plurality of signal lines 131 include at least one of a differential signal line 131a and a single-ended signal line 131b, and the differential signal line 131a includes two differential traces. Optionally, a ground line may be provided between two adjacent groups of signal lines 131, and the ground line may isolate two adjacent groups of signal lines 131 and shield the crosstalk between adjacent signal lines 131.

[0053] The connection structure 21 is a conductive structure protruding from the surface of the first circuit board 10. Optionally, the connection structure 21 is a pad, a combination of a reinforcement member and a pad, a copper column, or the like. Figure 3 As shown, in some embodiments, a plurality of connection structures 21 can be directly made on the first circuit board 10, that is, the connection structure 21 and the first circuit board 10 are an integral structure, and the connection structure 21 can be a boss structure made by the copper layer on the first circuit board 10 or a structure such as solidified conductive carbon oil. Figure 4 As shown, in other embodiments, a plurality of connection structures 21 can be made on the adapter circuit board 20 and the adapter circuit board 20 is connected to the first circuit board 10, so that the connection structure 21 is protruded from the surface of the first circuit board 10; the adapter circuit board 20 also includes a circuit board body 22, and the connection structure 21 protrudes from the circuit board body 22. For example, the circuit board body 22 includes a dielectric layer. It can be understood that the circuit board body 22 can also include at least one dielectric layer and at least one copper layer.

[0054] The signal line 131 has a head end and a tail end. It can be understood that the head end and the tail end of the signal line 131 are respectively connected to the connection structure 21, and the second circuit board 30 can be connected to the head end or the tail end of the signal line 131 through the connection structure 21. Exemplarily, the head end of the signal line 131 is electrically connected to the second circuit board 30 through the connection structure 21, and the tail end of the signal line 131 is electrically connected to the third circuit board 40 through the connection structure 21. It can be understood that in other embodiments, one of the head end and the tail end of the signal line 131 is connected to the second circuit board 30 through the connection structure 21, and the other of the head end and the tail end can also be connected to the third circuit board 40 through other types of connection structures.

[0055] The second circuit board 30 and the third circuit board 40 may be a circuit board module composed of a plurality of circuit boards or a single circuit board. Optionally, the second circuit board 30 and the third circuit board 40 are circuit board modules in a data center.

[0056] The circuit board structure 100 provided in the embodiment of the present application includes a first circuit board 10 and a plurality of connection structures 21. The first circuit board 10 includes a plurality of signal lines 131, and the plurality of signal lines 131 can be used to transmit signals respectively. The first circuit board 10 replaces a plurality of high-speed coaxial cables. The first circuit board 10 is connected to the second circuit board 30 through a plurality of connection structures 21 protruding from its surface, that is, the first circuit board 10 does not need to be connected to the second circuit board 30 through a coaxial connector. The circuit board structure 100 provided in the embodiment of the present application replaces the high-speed coaxial cable with the first circuit board 10, and the circuit board structure 100 also omits the coaxial connector, saving space.

[0057] Please refer to Figures 2 to 9 In some embodiments, the first circuit board 10 includes a first outer metal layer 11, a second outer metal layer 12, and at least one inner metal layer 13 arranged between the first outer metal layer 11 and the second outer metal layer 12, the signal line 131 is a line in the inner metal layer 13, the first outer metal layer 11 includes a plurality of first solder pads 111, each first solder pad 111 is electrically connected to a signal line 131, and the connecting structure 21 is connected to the first solder pad 111 and is electrically conductive, and the connecting structure 21 is protruding relative to the first solder pad 111.

[0058] The first circuit board 10 is a multi-layer circuit board. The first circuit board 10 includes at least three metal layers. The multiple metal layers are stacked along the thickness direction of the first circuit board 10. An insulating dielectric layer 14 is provided between adjacent metal layers. Figure 7 For example, the first circuit board 10 is provided with an inner metal layer 13 . It can be understood that the number of the inner metal layers 13 may be two or more.

[0059] The first circuit board 10 is made of a plurality of stacked sub-boards, which may be flexible copper clad laminates (FCCL), copper foil, etc. Flexible copper clad laminates refer to copper clad laminates formed by bonding copper foil to one or both sides of a flexible insulating material such as a polyester film or a polyimide film through certain process treatment. The dielectric layer in the flexible copper clad laminate serves as the insulating dielectric layer 14 in the first circuit board 10, and the copper foil in the flexible copper clad laminate serves as the metal layer in the first circuit board 10; an adhesive layer 17 is provided between adjacent sub-boards. Optionally, the adhesive layer 17 is a high-frequency pure adhesive layer, which refers to a special adhesive film material used in high-frequency circuits or high-speed transmission lines, and has the characteristics of low dielectric constant and dielectric loss, excellent heat resistance and solder resistance, etc. These characteristics enable the high-frequency pure adhesive layer to maintain the integrity and stability of the signal during high-frequency and high-speed signal transmission.

[0060] During design, multiple high-speed coaxial cables with similar plug-in ports or connection ports can be replaced with signal lines 131 and designed on one circuit board, that is, the first circuit board 10 is used to replace multiple high-speed coaxial cables. Optionally, the number of signal lines 131 is greater than 2 groups, and each group of signal lines 131 includes one or more signal lines 131.

[0061] Optionally, ground wires are provided on both sides of each group of signal lines 131, and the ground wires on both sides of the signal lines 131 can play an isolation and shielding effect in a direction parallel to the board surface of the first circuit board 10, that is, to isolate and shield electromagnetic interference of other factors on the signal lines 131. Specifically, a ground wire is provided between two adjacent groups of signal lines 131, and a ground wire is provided on both sides of the entire signal line composed of multiple signal lines 131, so as to achieve a good shielding and isolation effect.

[0062] Optionally, the first outer metal layer 11 and the second outer metal layer 12 are reference layers of the signal line 131, providing a signal return path for the signal line 131. The function of the signal line 131 is to realize signal transmission from the signal transmitting end to the signal receiving end. In order to realize the signal loop, the reference layer is required to return the signal. The first outer metal layer 11 and the second outer metal layer 12 are the outermost metal layers located on both sides of the first circuit board 10, that is, the top metal layer and the bottom metal layer of the first circuit board 10. The first outer metal layer 11 and the second outer metal layer 12 can isolate and shield the multiple signal lines 131 in the direction perpendicular to the first circuit board 10. Optionally, the first outer metal layer 11 and the second outer metal layer 12 respectively have multiple reference ground lines, each of which corresponds to a signal line 131 and is stacked; or, the first outer metal layer 11 and the second outer metal layer 12 are provided with copper foil covering the multiple signal lines 131. In other embodiments, when the inner metal layer 13 has multiple layers, an inner metal layer 13 between the first outer metal layer 11 and the signal line 131 can also be used as a reference layer for the signal line 131, and / or an inner metal layer 13 between the second outer metal layer 12 and the signal line 131 can be used as a reference layer for the signal line 131.

[0063] like Figure 7 and Fig. 9 As shown, the first outer metal layer 11 includes a plurality of first pads 111 , and the head end and the tail end of the signal line 131 are electrically connected to one of the first pads 111 , respectively.

[0064] In some embodiments, a covering film 15 and a solder mask 16 are provided on the outside of the first outer metal layer 11, and a window is opened in the solder mask 16 at a position corresponding to the first pad 111 to expose the first pad 111, so as to facilitate the electrical connection between the first pad 111 and the connection structure 21. The covering film 15 and the solder mask 16 are both used to cover the first outer metal layer 11, and optionally, the solder mask 16 is disposed above the first pad 111 and has a window to expose the first pad 111, and the covering film 15 covers the rest of the board surface.

[0065] The connection structure 21 is connected and electrically connected to the first pad 111. The connection structure 21 and the first pad 111 are connected to each other by welding or bonding, and the connection structure 21 is also electrically connected to the first pad 111, that is, the connection structure 21 and the first pad 111 are electrically connected.

[0066] Optionally, the orthographic projection of the connection structure 21 on the first circuit board 10 falls within the contour of the first pad 111, that is, the cross-sectional area of ​​the connection structure 21 is less than or equal to the cross-sectional area of ​​the first pad 111, and the connection structure 21 is arranged opposite to the first pad 111, so that the connection structure 21 can abut against the first pad 111 through the window of the solder mask 16. It can be understood that in other embodiments, the cross-sectional area of ​​the connection structure 21 can also be greater than the cross-sectional area of ​​the first pad 111.

[0067] Exemplarily, the first outer metal layer 11 includes a base copper layer and a copper-plated layer. During production, a blind hole penetrating the base copper layer is first produced, and then the blind hole is filled by copper plating and a first copper-plated layer is formed on the surface of the base copper layer. Next, the first copper-plated layer and the first base copper layer are patterned to produce a plurality of first pads 111, and the first pads 111 are electrically connected to the end of the signal line 131 through the blind hole.

[0068] In the circuit board structure 100 provided in the embodiment of the present application, a plurality of signal lines 131 are arranged in the inner metal layer 13, and the first outer metal layer 11 and the second outer metal layer 12 on the first circuit board 10 can provide isolation and shielding protection for the signal lines 131; a plurality of first solder pads 111 are arranged in the first outer metal layer 11, the first solder pads 111 are connected to the signal lines 131, and the connection structure 21 is connected to the first solder pads 111, so that the signal lines 131 can be electrically connected to the second circuit board 30 through the first solder pads 111 and the connection structure 21.

[0069] Please refer to Figure 8 and Fig. 9 , along the thickness direction (Z direction) of the first circuit board 10, the glue layer 17 can be provided on one side or both sides of the signal line 131. In some embodiments, along the extension direction (X direction) of the signal line 131, the glue layer 17 includes a plurality of non-window portions 171 and window portions 172 arranged alternately, and the projection of the window portions 172 on the inner metal layer 13 covers the plurality of signal lines 131 along the width direction (Y direction) of the first circuit board 10. Optionally, the window portions 172 extend to opposite ends of the first circuit board 10 along its width direction.

[0070] The window portion 172 is a hollow area that penetrates the adhesive layer 17, and the window portion 172 can be made by drilling, punching, etc. The non-window portion 171 can play a bonding role, and the first circuit board 10 can form a ground hole connecting the reference layer and the ground wire at the non-window portion 171. The first circuit board 10 forms an air layer at the position of the window portion 172, that is, the first circuit board 10 forms a suspended layered structure at the window portion 172 of the adhesive layer 17. The dielectric loss (Dissipation Factor, DF) value of air is the lowest, which is approximately equal to 0; the DF value of the existing insulating dielectric layer in the FPC industry is usually between 0.006 and 0.001. Therefore, by adding an air layer in the dielectric layer between the signal line 131 and the reference layer, the DF value of the entire dielectric layer can be lowered. The smaller the DF value, the smaller the signal loss.

[0071] In the embodiment of the present application, a window portion 172 is provided in the adhesive layer 17, and an air layer can be formed at the position of the window portion 172, which effectively reduces the signal loss of the signal line 131 and improves the signal transmission quality of the first circuit board 10. At the same time, the signal loss affects the transmission rate. In the case where the length of the signal line 131 is long, if the signal loss of the signal line 131 is large, it may cause the transmission rate of the signal line 131 to fail to meet the use requirements; in the embodiment of the present application, since the window portion 172 in the adhesive layer 17 reduces the signal loss of the signal line 131, the circuit board structure 100 provided in the embodiment of the present application solves the problem that the transmission rate cannot meet the use requirements due to the excessive length of the signal line, and improves the substitutability of the first circuit board 10.

[0072] Please refer to Figure 2 , Figures 4 to 9 In some embodiments, the circuit board structure 100 also includes a transfer circuit board 20, the transfer circuit board 20 includes a first surface 20a and a second surface 20b arranged opposite to each other, a plurality of connection structures 21 include a plurality of first connection structures 211 protruding from the first surface 20a and a plurality of second connection structures 212 protruding from the second surface 20b, the first connection structures 211 and the second connection structures 212 are electrically conductive in a one-to-one correspondence; the second connection structures 212 are connected to the first solder pads 111 and are electrically conductive, and the first connection structures 211 are used to be electrically connected to the second circuit board 30.

[0073] The adapter circuit board 20 is used to electrically connect the first circuit board 10 to another circuit board, so that the signal line 131 can realize signal transmission between the other circuit board. In some embodiments, adapter circuit boards 20 are respectively provided at both ends of the first circuit board 10, one adapter circuit board 20 is connected between the first circuit board 10 and the second circuit board 30, and the other adapter circuit board 20 is connected between the first circuit board 10 and the third circuit board 40.

[0074] The first connecting structure 211 on the first surface 20a of the adapter circuit board 20 is connected to the second circuit board 30, and the second connecting structure 212 on the second surface 20b is connected to the signal line 131 on the first circuit board 10 through the first solder pad 111, so that the adapter circuit board 20 can electrically connect the signal line 131 with the second circuit board 30, and the adapter circuit board 20 replaces the coaxial connector.

[0075] The adapter circuit board 20 can be a flexible circuit board or a rigid circuit board. If the adapter circuit board 20 is a flexible circuit board, the base material of the adapter circuit board 20 can be PI (polyimide), LCP (liquid crystal polymer), PTFE (polytetrafluoroethylene), and the adapter circuit board 20 is soft and resistant to bending; if the adapter circuit board 20 is a rigid circuit board, the base material can be composed of epoxy resin and glass fiber cloth, and the adapter circuit board 20 is rigid, non-bending, and has better support strength.

[0076] Please refer to Figures 4 to 6 The first surface 20a of the adapter circuit board 20 faces the second circuit board 30, and a plurality of first connection structures 211 are convexly provided on the first surface 20a; the second surface 20b faces the first circuit board 10, and a plurality of second connection structures 212 are convexly provided on the second surface 20b. The first connection structures 211 and the second connection structures 212 are both convexly provided relative to the surface of the adapter circuit board 20 to facilitate connection with the first circuit board 10 and the second circuit board 30. The first connection structures 211 and the second connection structures 212 are both conductive structures, such as copper pillars, silver pillars, and solidified conductive carbon oil. The first connection structures 211 and the second connection structures 212 may be the same structure or different structures.

[0077] The first connection structure 211 and the second connection structure 212 are electrically connected in a one-to-one correspondence, so that the adapter circuit board 20 can connect the plurality of signal lines 131 to another circuit board respectively. Figure 5 As shown, the first connection structure 211 and the second connection structure 212 are connected through the metallized through-hole. It can be understood that the first connection structure 211 and the second connection structure 212 can also be connected through the line on the adapter circuit board 20; the first connection structure 211 and the second connection structure 212 can be arranged opposite to each other or staggered, as long as the first connection structure 211 and the second connection structure 212 are connected one by one, then the adapter circuit board 20 is connected between the first circuit board 10 and the second circuit board 30, so that the signal line 131 on the first circuit board 10 can be electrically connected to the second circuit board 30 through the first connection structure 211 and the second connection structure 212 to realize signal transmission.

[0078] The circuit board structure 100 provided in the embodiment of the present application utilizes the first circuit board 10 and the adapter circuit board 20 to replace the traditional high-speed coaxial cable and coaxial connector. The first circuit board 10 and the adapter circuit board 20 are thin and small in size, with high circuit integration, effectively saving space and reducing costs. At the same time, the adapter circuit board 20 is electrically connected to the first circuit board 10, which reduces signal loss and has a simpler structure compared to the way the coaxial connector is connected to the high-speed coaxial cable. The circuit board structure 100 provided in the embodiment of the present application solves the problem that the existing high-speed coaxial cables and coaxial connectors occupy more space in the equipment, solves the high cost problem of multiple high-speed coaxial cables, and solves the problem that the connector requires a large amount of equipment space and the high cost problem.

[0079] Please refer to Figure 4 In some embodiments, the adapter circuit board 20 is bonded to the first circuit board 10 by ACF conductive adhesive 50, or the adapter circuit board 20 is fixed to the first circuit board 10 by welding.

[0080] ACF conductive adhesive, or Anisotropic Conductive Film, is a connection material with unique conductive properties. ACF conductive adhesive 50 is a transparent polymer connection material that has three major properties: bonding, conductivity, and insulation. The working principle of ACF conductive adhesive 50 is based on the arrangement and connection of conductive particles 51 under high temperature and high pressure. During the lamination process, conductive particles 51 (usually metal particles) form a conductive channel in the insulating adhesive film. This structure makes ACF conductive adhesive 50 highly conductive in the vertical direction and highly insulating in the parallel direction.

[0081] like Figure 4 As shown, the ACF conductive adhesive 50 mainly includes a polymer substrate and conductive particles 51 dispersed therein, and the conductive particles 51 are usually metal particles, such as gold, silver, nickel, etc., and can also be tiny particles made of carbon or other conductive materials. The ACF conductive adhesive 50 is arranged between the transfer circuit board 20 and the first circuit board 10. The conductive particles 51 can provide an electrical conduction path between the aligned first pads 111 and the second connection structure 212, and / or the first pads 111 and the second connection structure 212 are in direct contact to achieve electrical connection.

[0082] When manufacturing the circuit board structure 100, the ACF conductive adhesive 50 is first placed on the surface of the first circuit board 10 or the surface of the adapter circuit board 20, and then the adapter circuit board 20 is pressed and connected to the first circuit board 10. On the one hand, the ACF conductive adhesive 50 can bond the adapter circuit board 20 to the first circuit board 10, and on the other hand, the second connection structure 212 on the adapter circuit board 20 can be electrically connected to the first solder pad 111 on the first circuit board 10 through the conductive particles 51 in the ACF conductive adhesive 50, or the second connection structure 212 and the first solder pad 111 are electrically connected through contact. Since the second connection structure 212 protrudes from the surface of the adapter circuit board 20, after the adapter circuit board 20 is pressed together with the first circuit board 10, the second connection structure 212 and the first solder pad 111 arranged opposite thereto are connected through the conductive particles 51, while no continuously stacked conductive particles 51 are formed between the second connection structure 212 and the first solder pad 111 arranged offset therefrom, and between the board surface of the adapter circuit board 20 and the board surface of the first circuit board 10. Therefore, the ACF conductive adhesive 50 can achieve electrical conduction in the vertical direction of the first circuit board 10.

[0083] The first circuit board 10 is provided with a plurality of first pads 111, and the adapter circuit board 20 is provided with a plurality of second connection structures 212. When the adapter circuit board 20 is connected to the first circuit board 10 through the ACF conductive adhesive 50, the plurality of first pads 111 are electrically connected to the corresponding second connection structures 212, and there is no need to individually weld each first pad 111 to the corresponding second connection structure 212. By adopting the above technical solution, the second connection structure 212 is electrically connected to the corresponding first pad 111 through the ACF conductive adhesive 50, and the manufacturing method of the circuit board structure 100 is simple and efficient.

[0084] In other embodiments, the adapter circuit board 20 is fixed to the first circuit board 10 by welding, and the second connection structure 212 and the first solder pad 111 are electrically connected by welding.

[0085] By adopting the above technical solution, the adapter circuit board 20 can be bonded to the first circuit board 10 or welded to the first circuit board 10 through the ACF conductive adhesive 50, which can not only realize the mutual fixation of the adapter circuit board 20 and the first circuit board 10, but also realize the electrical connection between the connecting structure 21 and the first solder pad 111. The fixing method of the adapter circuit board 20 is relatively flexible and easy to implement, and the manufacturing efficiency of the circuit board structure 100 is relatively high.

[0086] Please refer to Figures 4 to 6 In some embodiments, a plurality of via holes filled with conductive material are provided on the adapter circuit board 20 , and the first connection structure 211 and the second connection structure 212 respectively cover opposite sides of the via hole 204 and are connected through the copper hole 23 .

[0087] In some embodiments, the adapter circuit board 20 may be made of a flexible copper clad laminate (FCCL) with copper clad on both sides, the via hole runs through the double-sided copper clad FCCL board, and the via hole 204 is filled with a conductive material (such as copper, conductive ink, etc.); the first connection structure 211 and the second connection structure 212 respectively cover the opposite sides of the via hole and are connected through the conductive material in the via hole. In other embodiments, the adapter circuit board 20 may also be made of multiple FCCL boards.

[0088] The first connecting structure 211 and the second connecting structure 212 cover the via hole, wherein the cross-sectional area of ​​the first connecting structure 211 and the second connecting structure 212 is greater than or equal to the cross-sectional area of ​​the via hole. In the present embodiment, the cross-sectional area of ​​the first connecting structure 211 and the second connecting structure 212 is greater than the cross-sectional area of ​​the via hole, and the orthographic projection of the first connecting structure 211 toward the via hole completely covers the via hole, and the orthographic projection of the second connecting structure 212 toward the via hole 204 also completely covers the via hole, so as to facilitate the connection between the first circuit board 10 and another circuit board.

[0089] By adopting the above technical solution, the first connecting structure 211 and the second connecting structure 212 respectively cover the opposite sides of the conductive hole and are connected through the conductive material in the conductive hole. There is no need to set a circuit structure for connecting the first connecting structure 211 and the second connecting structure 212 in the adapter circuit board 20. The adapter circuit board 20 has a simple structure, is easy to manufacture, and has a high manufacturing efficiency.

[0090] like Figure 6 As shown, in some embodiments, the conductive material in the via hole is a via copper 23, and the first connection structure 211 includes a first base copper portion 2111 and a first electroplated copper portion 2112 integral with the via copper 23.

[0091] The second connection structure 212 includes a second base copper portion 2121 and a second electroplated copper portion 2122 integrally formed with the via copper 23 .

[0092] Please also refer to Figure 6 , FIG. 13A to FIG. 13D In some embodiments, the transfer circuit board 20 is made of a double-sided copper-clad FCCL board. Fig.13A As shown, the FCCL board includes a dielectric layer 201 and base copper layers 202 arranged on both sides of the dielectric layer 201. In the process of manufacturing the adapter circuit board 20, a via hole 204 is firstly manufactured on the adapter circuit board 20, and the via hole 204 penetrates the dielectric layer 201 and the two base copper layers 202; Fig. 13B As shown, copper is plated on the transfer circuit board 20 to form a hole copper 23 and two layers of copper plating 203; then, as shown in Fig. 13C and Fig.13DAs shown, the transfer circuit board 20 is patterned to form a first connection structure 211 and a second connection structure 212. The first connection structure 211 includes a first base copper portion 2111 and a first electroplated copper portion 2112, wherein the first base copper portion 2111 is formed by patterning the base copper layer 202, and the first electroplated copper portion 2112 is formed by patterning the copper plating layer 203; the second connection structure 212 includes a second base copper portion 2121 and a second electroplated copper portion 2122 electroplated together with the hole copper 23, wherein the second base copper portion 2121 is formed by patterning the second base copper layer 202, and the second electroplated copper portion 2122 is formed by patterning the copper plating layer 203.

[0093] It can be seen that the first connection structure 211 and the second connection structure 212 are both copper columns and both include a base copper portion and an electroplated copper portion. The first connection structure 211 and the second connection structure 212 are an integral structure arranged on both sides of the conductive hole 204. The two are symmetrically arranged and electrically conductive through the copper hole 23, which facilitates the connection between the first circuit board 10 and another circuit board.

[0094] like Figure 6 As shown, in some embodiments, the height H1 of the first connection structure 211 is 60 um to 90 um; and / or the height H2 of the second connection structure 212 is 60 um to 90 um.

[0095] The height H1 of the first connection structure 211 refers to the height of the first connection structure 211 protruding from the board surface of the adapter circuit board 20 along the thickness direction of the adapter circuit board 20. The height H2 of the second connection structure 212 refers to the height of the second connection structure 212 protruding from the board surface of the adapter circuit board 20 along the thickness direction of the adapter circuit board 20.

[0096] The height of the first connection structure 211 may be 60um to 90um, for example, the height of the first connection structure 211 is 60um, 65um, 70um, 75um, 80um, 85um, 90um, etc. The height of the second connection structure 212 may be 60-90um, for example, the height of the second connection structure 212 is 60um, 65um, 70um, 75um, 80um, 85um, 90um, etc.

[0097] Please also refer to Figures 4 to 9, a solder mask 16 is usually provided on the surface of the first circuit board 10, and a window in the solder mask 16 exposes the first pad 111. The thickness of the solder mask 16 is usually 20-30um, the initial thickness of the ACF conductive adhesive 50 is about 40um, and the thickness of the ACF conductive adhesive 50 after lamination is about 30um. If the height of the second connection structure 212 is lower than the total thickness of the solder mask 16 and the ACF conductive adhesive 50, there may be a risk of poor connection between the second connection structure 212 and the first pad 111. Therefore, the height of the second connection structure 212 is set to be greater than or equal to the total thickness of the solder mask 16 and the ACF conductive adhesive 50.

[0098] The first connecting structure 211 is used to connect the second circuit board 30 or the third circuit board 40. The surface of the second circuit board 30 or the third circuit board 40 is provided with a solder mask layer, and the thickness of the solder mask layer is usually 20 to 30 um. In the embodiment of the present application, the height of the first connecting structure 211 is greater than or equal to the total thickness of the solder mask layer and the ACF conductive adhesive 50.

[0099] By setting the height range of the first connecting structure 211 and the second connecting structure 212 to be greater than or equal to 60um, the second connecting structure 212 is stably connected to the first circuit board 10, and the first connecting structure 212 is stably connected to another circuit board (for example, the second circuit board 30 or the third circuit board 40), thereby reducing the risk of poor connection; at the same time, by setting the height range of the first connecting structure 211 and the second connecting structure 212 to be less than or equal to 90um, so as to avoid the first connecting structure 211 and the second connecting structure 212 being too large in height and occupying too much space, the processing difficulty of the adapter circuit board 20 can also be reduced, thereby improving production efficiency.

[0100] Preferably, the height of the first connection structure 211 and the second connection structure 212 is 60 um to 80 um, which can not only improve the connection stability between the adapter circuit board 20 and another circuit board, but also reduce the height space occupied by the adapter circuit board 20 .

[0101] Please refer to Figure 6 and Fig.10 In some embodiments, the first connection structure 211 is cylindrical or square columnar, multiple first connection structures 211 are arranged in a matrix, the length of the first connection structure 211 in a direction parallel to the adapter circuit board 20 is 300um~450um, and the spacing between the first connection structures 211 is 800um~1000um, and / or, the second connection structure 212 is cylindrical or square columnar, multiple second connection structures 212 are arranged in a matrix, the length of the second connection structure 212 in a direction parallel to the adapter circuit board 20 is 300um~450um, and the spacing between the second connection structures 212 is 800um~1000um.

[0102] The first connection structure 211 and the second connection structure 212 are made by etching a copper layer, and both the first connection structure 211 and the second connection structure 212 can be cylindrical or square. The signal lines 131 on the first circuit board 10 are arranged side by side, and the first pads 111 corresponding to the signal lines 131 are arranged in sequence. In this way, the plurality of first connection structures 211 are arranged in a matrix, so that the adapter circuit board 20 can be conveniently electrically connected to the first circuit board 10, so that the plurality of first connection structures 211 are connected to the first pads 111 one by one.

[0103] The length of the first connection structure 211 is 300um-450um. For a cylindrical first connection structure 211, the diameter of the first connection structure 211 is 300um-450um. For a square column first connection structure 211, the side length of the first connection structure 211 is 300um-450um.

[0104] Similarly, the length of the second connection structure 212 is 300um-450um. For a cylindrical second connection structure 212, the diameter of the second connection structure 212 is 300um-450um. For a square columnar second connection structure 212, the side length of the second connection structure 212 is 300um-450um.

[0105] In this embodiment, the sizes of the first connection structure 211 and the second connection structure 212 meet the above range, so that the first connection structure 211 and the second connection structure 212 can be conveniently electrically connected to the pad.

[0106] In addition, the spacing between the first connection structures 211 and the spacing between the second connection structures 212 satisfy the above range, which can reduce the risk of poor connection.

[0107] The circuit board structure 100 provided in the embodiment of the present application can be applied to a signal transmission component, and the signal transmission component also includes a second circuit board 30 connected to the circuit board structure 100 .

[0108] Please refer to Figure 4 In some embodiments, the adapter circuit board 20 is fixedly connected to the second circuit board 30 through the ACF conductive adhesive 50, a plurality of second solder pads 31 are provided on the second circuit board 30, and the first connection structure 211 is connected to the second solder pads 31 and is electrically conductive.

[0109] The first connection structure 211 is arranged opposite to the second pad 31. Optionally, the orthographic projection of the first connection structure 211 toward the second circuit board 30 falls within the contour range of the second pad 31, that is, the cross-sectional area of ​​the first connection structure 211 is less than or equal to the cross-sectional area of ​​the second pad 31. The conductive particles 51 in the ACF conductive adhesive 50 can provide a conductive path between the first connection structure 211 and the second pad 31, or the first connection structure 211 directly contacts the second pad 31 to achieve conduction.

[0110] When manufacturing a signal transmission component, there is no need to connect the first connection structure 211 and the second solder pad 31 one by one by welding. It is only necessary to bond the adapter circuit board 20 and the second circuit board 30 by ACF conductive adhesive 50, which not only realizes the relative fixation of the adapter circuit board 20 and the second circuit board 30, but also realizes the one-to-one correspondence between the multiple first connection structures 211 and the multiple second solder pads 31.

[0111] In this way, the two sides of the adapter circuit board 20 are respectively bonded to the first circuit board 10 and the second circuit board 30 by the ACF conductive adhesive 50, and the manufacturing efficiency is high. The adapter circuit board 20 does not need to be fixed to the PCB module by fasteners such as screws, and the signal transmission component where the circuit board structure 100 is located can be made smaller and thinner.

[0112] In other embodiments, the adapter circuit board 20 may also be connected to the second circuit board 30 by welding.

[0113] Please refer to Figure 2 and Figure 4 In some embodiments, the signal transmission component also includes a third circuit board 40, and at least two adapter circuit boards 20 are provided, wherein one adapter circuit board 20 is electrically connected to one end of the signal line 131 and the second circuit board 30, and the other adapter circuit board 20 is electrically connected to the other end of the signal line 131 and the third circuit board 40.

[0114] The third circuit board 40 may be a circuit board module or a single circuit board. Optionally, the third circuit board 40 is a circuit board module in an electronic device.

[0115] One of the second circuit board 30 and the third circuit board 40 is electrically connected to the head end of the signal line 131 through the adapter circuit board 20, and the other is electrically connected to the tail end of the signal line 131 through the adapter circuit board 20, so that the signal line 131 on the first circuit board 10 can transmit signals between the second circuit board 30 and the third circuit board 40. In the circuit board structure 100 provided in the above embodiment, the first circuit board 10 and the adapter circuit boards 20 at both ends replace the high-speed coaxial cable and the coaxial connectors at both ends, which not only reduces the space occupation, but also reduces the signal loss between the coaxial connector and the circuit board connection.

[0116] Please refer to Figure 4 Some embodiments of the present application provide a circuit board structure 100, including a first circuit board 10 and a transfer circuit board 20, wherein the first circuit board 10 includes a plurality of signal lines 131, and the transfer circuit board 20 has a first surface 20a and a second surface 20b arranged opposite to each other, wherein a plurality of first connection structures 211 are convexly provided on the first surface 20a, and a plurality of second connection structures 212 are convexly provided on the second surface 20b, and the first connection structures 211 and the second connection structures 212 are connected in a one-to-one correspondence; the second surface 20b is connected to the first circuit board 10, and the second connection structures 212 are directly opposite to and electrically connected to the first pads 111 on the first circuit board 10, and the first surface 20a is used to connect to the second circuit board 30, and the first connection structures 211 are used to directly opposite to and electrically connect to the second pads 31 on the second circuit board 30. In this way, the first circuit board 10 and the transfer circuit board 20 replace the traditional coaxial cable and coaxial connector, reducing the occupied space and reducing the connection loss.

[0117] Please refer to Figures 4 to 11 The embodiment of the second aspect of the present application provides a method for manufacturing a circuit board structure 100, which is used to manufacture the circuit board structure 100 provided in the first aspect. The method for manufacturing the circuit board structure 100 includes:

[0118] Step S1 : providing a first circuit board 10 , wherein the first circuit board 10 includes a plurality of signal lines 131 .

[0119] The first circuit board 10 is a high-speed multi-layer circuit board, preferably a flexible circuit board, and the base material of the first circuit board 10 can be made of high-frequency material.

[0120] In some embodiments, the method for manufacturing the first circuit board 10 includes one or more steps such as cutting, drilling, inner layer circuit manufacturing, lamination, drilling, shadow copper plating, outer layer circuit manufacturing, laminating covering film 15, manufacturing solder mask 16, nickel gold deposition, testing, and shape punching.

[0121] In some embodiments, the signal line 131 is disposed in the inner metal layer 13 of the first circuit board 10, the first circuit board 10 includes a first outer metal layer 11, a second outer metal layer 12, and at least one inner metal layer 13 disposed between the first outer metal layer 11 and the second outer metal layer 12, and the signal line 131 is disposed in the inner metal layer 13.

[0122] Step S2 : manufacturing a plurality of connection structures 21 , so that the connection structures 21 are protruded from the surface of the first circuit board 10 and are electrically connected to a corresponding signal line 131 .

[0123] The connection structure 21 is also used to be electrically connected to the second circuit board 30 , so that the plurality of signal lines 131 are electrically connected to the second circuit board 30 .

[0124] In some embodiments, the connection structure 21 is directly formed on the first circuit board 10; in other embodiments, the connection structure 21 is formed on the adapter circuit board 20, and the adapter circuit board 20 is fixed to the first circuit board 10 so that the connection structure 21 protrudes from the surface of the first circuit board 10.

[0125] The circuit board structure 100 manufactured by the above manufacturing method includes a first circuit board 10 and a connection structure 21 protruding from the first circuit board 10. The first circuit board 10 is provided with a plurality of signal lines 131, so that the first circuit board 10 can replace a plurality of high-speed coaxial cables. The first circuit board 10 can be connected to the second circuit board 30 through the plurality of connection structures 21 protruding from its surface, that is, the first circuit board 10 does not need to be connected to the second circuit board 30 through a coaxial connector. The circuit board structure 100 manufactured by the above manufacturing method replaces the high-speed coaxial cable, and the circuit board structure 100 also omits the coaxial connector. Therefore, the circuit board structure 100 has a simple structure and a small volume, which reduces the occupied space. In addition, the above manufacturing method has high manufacturing efficiency and low cost.

[0126] Please refer to Figures 4 to 12 Step S2 is to manufacture a plurality of connection structures 21, including:

[0127] Step S21: Make an adapter circuit board 20, the adapter circuit board 20 includes a first surface 20a and a second surface 20b arranged opposite to each other, and a plurality of connection structures 21 include a plurality of first connection structures 211 protruding from the first surface 20a and a plurality of second connection structures 212 protruding from the second surface 20b, and the first connection structures 211 and the second connection structures 212 are electrically connected one by one.

[0128] The transfer circuit board 20 can be a flexible circuit board or a rigid circuit board. The first connection structure 211 and the second connection structure 212 are both conductive structures, such as copper pillars, pads, etc. In some embodiments, the first connection structure 211 and the second connection structure 212 are both copper pillars and are connected through the metallized via 204; the first connection structure 211 and the second connection structure 212 are respectively arranged on both sides of the via 204 and are arranged opposite to each other.

[0129] Step S22 : fixing the adapter circuit board 20 to the first circuit board 10 , so that the second connection structure 212 is electrically connected to the signal line 131 .

[0130] The adapter circuit board 20 can be connected to the first circuit board 10 through the ACF conductive adhesive 50. It can be understood that the adapter circuit board 20 can also be connected to the first circuit board 10 through welding or other methods.

[0131] After the adapter circuit board 20 is fixedly connected between the first circuit board 10 and the second circuit board 30, the second connection structure 212 faces the first circuit board 10 and is electrically connected to the signal line 131. In some embodiments, a plurality of first solder pads 111 are provided on the first circuit board 10, each of which is connected to a signal line 131, and the second connection structure 212 on the adapter circuit board 20 is connected to the first solder pads 111.

[0132] The first connecting structure 211 on the adapter circuit board 20 is used to connect another circuit board. In some embodiments, the first connecting structure 211 is used to connect the second circuit board 30. A plurality of second solder pads 31 are provided on the second circuit board 30. The first connecting structure 211 is connected to the second solder pads 31, so that the signal line 131, the first solder pad 111, the second connecting structure 212, the first connecting structure 211 and the second solder pad 31 are electrically connected in sequence.

[0133] The circuit board structure 100 manufactured by the above manufacturing method includes a first circuit board 10 and an adapter circuit board 20. The second connection structure 212 protruding on one side of the adapter circuit board 20 is electrically connected to the first circuit board 10, and the first connection structure protruding on the other side of the adapter circuit board 20 is used to electrically connect to the second circuit board 30, so that the adapter circuit board 20 can electrically connect the first circuit board 10 with the second circuit board 30, replacing the coaxial connector used in conjunction with the high-speed coaxial cable; the circuit board structure 100 manufactured by the above manufacturing method has a simple structure and a small size, which reduces the occupied space. In addition, the above manufacturing method first manufactures the adapter circuit board 20 and then fixes the adapter circuit board 20 on the first circuit board 10. The adapter circuit board 20 can be manufactured separately, the manufacturing method is flexible, the yield is high, and there is no need to change the structure of the first circuit board 10, so that the overall manufacturing efficiency of the circuit board structure 100 is high and the cost is low.

[0134] Please refer to FIG. 13A to FIG. 13D Step S21 manufactures the adapter circuit board 20, including the following steps.

[0135] like Fig.13A As shown, a substrate is provided, the substrate includes a dielectric layer 201 and a base copper layer 202 arranged on both sides of the dielectric layer 201, and then a plurality of via holes 204 are drilled on the substrate, and the via holes 204 are through holes that penetrate the dielectric layer 201 and the base copper layer 202 on both sides of the dielectric layer 201.

[0136] like Fig. 13B As shown, copper is plated on the substrate to fill the via hole 204 with copper 23 and form a copper plated layer 203 on the surface of the substrate.

[0137] like FIG. 13C to FIG. 13DAs shown, the substrate is etched to form a plurality of protruding first connection structures 211 and second connection structures 212 on two opposite sides of the dielectric layer 201 , respectively. The first connection structures 211 and the second connection structures 212 are electrically connected through the copper holes 23 .

[0138] Among them, etching the substrate by photolithography includes the following steps: Fig. 13C As shown, a dry film 205 is attached to the surface of the substrate. Figure 6 and Fig.13D As shown, the copper layer on the surface of the substrate layer is patterned by exposure, development, etching, and stripping to form a first connection structure 211 and a second connection structure 212 .

[0139] In some embodiments, the specific process of manufacturing the adapter circuit board 20 is: cutting, drilling, shading (or copper deposition), copper electroplating, film lamination, exposure and development, etching, nickel-gold deposition, and punching.

[0140] The substrate selected for the adapter circuit board 20 can be a double-sided copper-clad substrate, the thickness of the base copper layer 202 is 35um, and the thickness of the dielectric layer 201 is 25um~50um. After cutting the double-sided substrate into a single sheet of material, it is subjected to drilling, black shadow or copper deposition, copper plating processes, copper plating and hole filling are performed in the hole, and the thickness of the copper layer on the surface of the substrate is thickened to 60um~90um, that is, the thickness of the base copper layer 202 and the copper plating layer 203 is 60um~90um; and then after film pasting, exposure, development, etching, and film stripping, it is made into a copper column with a height of 60um~90u on both sides (that is, the first connection structure 211 and the second connection structure 212), and the first connection structure 211 and the second connection structure 212 are connected through the copper hole 23. The copper column can be designed into a cylindrical or square column according to the graphic design, and the copper column is arranged in a matrix. The punched single-piece adapter circuit board 20 is assembled into a coil tape.

[0141] The adapter circuit board 20 manufactured by the above-mentioned manufacturing method has a plurality of first connection structures 211 and second connection structures 212 protruding from its two sides, and the first connection structures 211 and the second connection structures 212 are electrically conductive one by one to facilitate the connection between the first circuit board 10 and the second circuit board 30. The connection reliability of the above-mentioned adapter circuit board 20 is high, and compared with the coaxial connector, the thickness of the above-mentioned adapter circuit board 20 is thinner, which reduces the occupied space and reduces the signal loss.

[0142] Please refer to Fig.14 , Fig.15In some embodiments, step S22 fixes the adapter circuit board 20 to the first circuit board 10, including: bonding the adapter circuit board 20 to the first circuit board 10 through the ACF conductive adhesive 50, wherein the second surface 20b faces the first circuit board 10; and pressing the adapter circuit board 20, the ACF conductive adhesive 50 and the first circuit board 10.

[0143] Exemplarily, the ACF conductive adhesive 50 of the coil is punched into single pieces of conductive adhesive with the same size as the adapter circuit board 20, and assembled into a coil tape; the ACF conductive adhesive 50 is bonded to the first pad 111 of the first circuit board 10 that has been processed by an automatic bonding machine, and the surface release film is removed after pre-pressing; the adapter circuit board 20 in the coil tape packaging method is bonded to the ACF conductive adhesive 50 by the automatic bonding machine, and then false pressing is performed by vacuum rapid pressing equipment, the false pressing temperature is 80-100°C, the pressure is 5-10kg, the vacuum time is 1-3 seconds, the pressing time is 3-5 seconds, and the false pressed laminated structure includes a 50um release film, a product to be pressed and a 50um release film, that is, the following is obtained. Figure 5 A circuit board structure 100 is shown.

[0144] In some embodiments, after manufacturing the circuit board structure 100 , the adapter circuit board 20 and the first circuit board 10 are bonded to the second circuit board 30 via ACF conductive adhesive 50 , wherein the ACF conductive adhesive 50 is disposed between the first surface 20 a of the adapter circuit board 20 and the second circuit board 30 .

[0145] For details, please refer to Fig.16 , paste a layer of ACF conductive glue 50 on the transfer circuit board 20. The size of the ACF conductive glue 50 is consistent with the size of the transfer circuit board 20. After false pressing, remove the release film; please refer to Fig.17, through the positioning of the fixture, the stacked false pressure-bonded adapter circuit board 20 and the first circuit board 10 are assembled on the second circuit board 30, and false pressure is performed by vacuum rapid pressing equipment. The false pressing temperature is 80-100°C, the pressure is 5-10kg, the vacuum time is 1-3 seconds, the pressing time is 3-5 seconds, and the false pressing laminated structure includes a 50um release film, a product to be pressed and a 50um release film; then, using a vacuum rapid pressing equipment, the second circuit board 30, the adapter circuit board 20, and the first circuit board 10 are melt-bonded by two layers of ACF conductive glue 50 under the action of high temperature and high pressure. The vacuum rapid pressing temperature is 160-180°C, the vacuum time is 10-20 seconds, the pressing time is 100-150 seconds, and the pressed laminated structure is a 70-130um TPX film, a product to be pressed and a 50um70-130um TPX film. After vacuum rapid lamination, the second circuit board 30 and the first circuit board 10 are connected through the adapter circuit board 20, thereby achieving the effect of high-speed signal transmission between different circuit boards. The pressed products are tested for signal loss, and batch production can be carried out after passing the test.

[0146] By adopting the above technical solution, the first circuit board 10 and the adapter circuit board 20, as well as the adapter circuit board 20 and the second circuit board 30 are connected respectively by the ACF conductive adhesive 50, and the manufacturing efficiency is high.

[0147] In other embodiments, the ACF conductive adhesive 50 may be eliminated, and the adapter circuit board 20 is connected to the first circuit board 10 and the second circuit board 30 by welding.

[0148] Please refer to Figure 2 An embodiment of the third aspect of the present application proposes a signal transmission component, including a circuit board structure 100, a second circuit board 30 and a third circuit board 40 provided in the first aspect or the second aspect, the circuit board structure 100 includes a first circuit board 10 and a plurality of connection structures 21 arranged at opposite ends of the first circuit board 10, the first circuit board 10 includes a plurality of signal lines 131; the second circuit board 30 is connected to the head end of the signal line 131 through the connection structure 21 at one end of the first circuit board 10, and the third circuit board 40 is connected to the tail end of the signal line 131 through the connection structure 21 at the other end of the first circuit board 10.

[0149] Both ends of the signal line 131 are respectively connected to the second circuit board 30 and the third circuit board 40 through the connecting structure 21, so that the signal line 131 can transmit signals between the second circuit board 30 and the third circuit board 40. In this way, the signal transmission component can replace the high-speed coaxial cable and the coaxial connector through the first circuit board 10 and the connecting structure 21, saving space.

[0150] In some embodiments, the circuit board structure 100 also includes a adapter circuit board 20, which includes a first surface 20a and a second surface 20b arranged opposite to each other, and a plurality of connection structures 21 include a plurality of first connection structures 211 protruding from the first surface 20a and a plurality of second connection structures 212 protruding from the second surface 20b, the first connection structures 211 are connected to the second connection structures 212 in a one-to-one correspondence, the second connection structures 212 are connected to the first circuit board 10, and the first connection structures 211 are connected to the second circuit board 30.

[0151] Please refer to Figures 2 to 17 An embodiment of the fourth aspect of the present application provides a data center, including a circuit board structure 100 provided in the first aspect, a circuit board structure 100 manufactured by the manufacturing method provided in the second aspect, or a signal transmission component provided in the third aspect.

[0152] The data center includes multiple devices, such as servers, switches, routers, etc.; the second circuit board 30 and the third circuit board 40 are circuit boards or circuit board modules in different devices, and the first circuit board 10 transmits signals between different circuit boards or circuit board modules through the signal line 131.

[0153] The data center provided in the embodiment of the present application includes a circuit board structure 100. The circuit board structure 100 can replace high-speed coaxial cables and coaxial connectors, saving installation space.

[0154] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A circuit board structure, characterized in that: The circuit board structure comprises: A first circuit board includes a plurality of signal lines; A plurality of connection structures are protrudingly provided on the surface of the first circuit board, and the connection structures are electrically connected to a corresponding signal line; the plurality of connection structures are also used to be electrically connected to the second circuit board, so that the plurality of signal lines are electrically connected to the second circuit board.

2. The circuit board structure according to claim 1, characterized in that: The first circuit board comprises a first outer metal layer, a second outer metal layer and at least one inner metal layer disposed between the first outer metal layer and the second outer metal layer, and the signal line is a line in the inner metal layer; The first outer metal layer includes a plurality of first pads, the first pads are connected to the signal lines correspondingly, the connection structure is connected to the first pads and is electrically conductive, and the connection structure is protruding relative to the first pads.

3. The circuit board structure according to claim 2, wherein: The circuit board structure further includes a transfer circuit board, the transfer circuit board includes a first surface and a second surface arranged opposite to each other, the plurality of connection structures include a plurality of first connection structures convexly arranged on the first surface and a plurality of second connection structures convexly arranged on the second surface, and the first connection structures are electrically connected to the second connection structures in a one-to-one correspondence; The second connection structure is connected to the first pad and is electrically conductive, and the first connection structure is used to be electrically connected to the second circuit board.

4. The circuit board structure according to claim 3, characterized in that: The adapter circuit board is bonded to the first circuit board by ACF conductive adhesive, or the adapter circuit board is fixed to the first circuit board by welding.

5. The circuit board structure according to claim 3, characterized in that: The adapter circuit board is provided with a plurality of conducting holes filled with conductive material, and the first connecting structure and the second connecting structure are respectively covered on opposite sides of the conducting holes and are connected through the conducting holes.

6. The circuit board structure according to claim 5, characterized in that: The conductive material in the via is via copper, the first connection structure includes a first base copper portion and a first electroplated copper portion integral with the via copper, and the second connection structure includes a second base copper portion and a second electroplated copper portion integral with the via copper.

7. The circuit board structure according to claim 3, characterized in that: The height of the first connection structure is 60um to 90um; and / or, The height of the second connection structure is 60um to 90um.

8. A method for manufacturing a circuit board structure, characterized in that: include: Providing a first circuit board, wherein the first circuit board includes a plurality of signal lines; A plurality of connection structures are manufactured, so that the connection structures are protruded from the surface of the first circuit board and are electrically connected to a corresponding signal line, wherein the connection structures are also used to be electrically connected to the second circuit board so that the plurality of signal lines are electrically connected to the second circuit board.

9. The method for manufacturing a circuit board structure according to claim 8, wherein: The method of making a plurality of connection structures comprises: Manufacturing a transfer circuit board, wherein the transfer circuit board comprises a first surface and a second surface arranged opposite to each other, the plurality of connection structures comprises a plurality of first connection structures convexly arranged on the first surface and a plurality of second connection structures convexly arranged on the second surface, and the first connection structures are electrically connected to the second connection structures in a one-to-one correspondence; The adapter circuit board is fixedly connected to the first circuit board, so that the second connection structure is electrically connected to the signal line.

10. The method for manufacturing a circuit board structure according to claim 9, characterized in that: The manufacturing of the transfer circuit board comprises: Providing a substrate, the substrate comprising a dielectric layer and base copper layers arranged on both sides of the dielectric layer; Drilling a plurality of via holes on the substrate; Plating copper on the substrate to fill the via holes with copper and form a copper plating layer on the surface of the substrate; The substrate is etched to form a plurality of protruding first connection structures and second connection structures on two opposite sides of the dielectric layer, respectively. The first connection structures and the second connection structures are electrically connected through the copper holes.

11. The method for manufacturing a circuit board structure according to claim 9 or 10, characterized in that: The step of fixing the adapter circuit board to the first circuit board comprises: Bonding the transfer circuit board to the first circuit board by ACF conductive adhesive, wherein the second surface faces the first circuit board; The adapter circuit board, the ACF conductive adhesive and the first circuit board are pressed together.

12. A signal transmission component, characterized in that: include: A circuit board structure, wherein the circuit board structure is a circuit board structure according to any one of claims 1 to 7 or a circuit board structure manufactured by the manufacturing method of the circuit board structure according to any one of claims 8 to 11, wherein the circuit board structure comprises a first circuit board and a plurality of the connection structures provided at opposite ends of the first circuit board, wherein the first circuit board comprises a plurality of signal lines; A second circuit board, connected to the head end of the signal line through the connection structure at one end of the first circuit board; The third circuit board is connected to the tail end of the signal line through the connection structure at the other end of the first circuit board.

13. A data center, characterized in that: It includes a circuit board structure as described in any one of claims 1-7, a circuit board structure manufactured by the method for manufacturing a circuit board structure as described in any one of claims 8-11, or a signal transmission component as described in claim 12.

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