A production line and method for manufacturing LED circuit boards

Abstract

The present application relates to the technical field of circuit board production, and discloses a production line and a production method for LED circuit boards. A production line for LED circuit boards includes a solder paste printer, a patch machine, and a reflow soldering machine. The solder paste soldering machine includes a steel mesh, and the steel mesh is provided with a hollow portion. The hollow portion corresponds to the soldering portion of the circuit board body one by one, and the hollow portion includes a positive electrode slot and two negative electrode slots. The production line also includes a glue sticking mechanism, and the glue sticking mechanism includes a positioning seat and a tape roll mounted on the positioning seat. The positioning seat is provided with a support platform for supporting the steel mesh. The production line also includes a cutting piece, and the cutting piece includes a mounting block and a cutting blade mounted on the mounting block. When the mounting block is attached to the steel mesh, the cutting blade penetrates the positive electrode slot or the negative electrode slot. The present application can minimize the error of the head and tail lights of a row of LED lamps, and improve the reliability and stability of welding.

Description

Technical Field

[0001] The present application relates to the technical field of LED circuit board manufacturing, and in particular to an LED circuit board manufacturing production line and a manufacturing method. Background Art

[0002] When LED SMD lamp beads are installed on the circuit board, the following steps are mainly included: first, use a solder paste printer or a manual screen printing station to evenly apply the solder paste on the circuit board; second, use a mounter or hand tools to accurately mount the LED SMD lamp beads on the solder paste position; finally, the circuit board is preheated and then placed in a reflow soldering machine for reflow soldering. This welding method has the advantages of high welding quality, high production efficiency, and high degree of automation, and is widely used in the field of electronic product manufacturing.

[0003] The solder paste is mainly applied to the positive and negative solder joints of the circuit board. The negative solder pad area of ​​LED lamp beads is generally larger, and the positive solder pad area is relatively small, which helps to reduce the resistance between the pin and the pad and provide a better electrical connection. Correspondingly, the positive solder joint area on the circuit board will also be smaller than the negative solder joint area. When dozens of LED SMD lamp beads are arranged in a straight line on the circuit board, because the negative solder joint area of ​​the circuit board is larger, the lamp beads are easily misaligned during welding, resulting in unsatisfactory linearity of a row of lamp beads. Summary of the invention

[0004] In order to improve the linearity of the arrangement of lamp beads on a circuit board, the present application provides an LED circuit board production line and a production method.

[0005] In a first aspect, the present application provides an LED circuit board production line, which adopts the following technical solution:

[0006] An LED circuit board production line, used for producing LED circuit boards, comprising a circuit board body, a welding part distributed on the circuit board body, one welding part corresponding to one LED lamp, the welding part comprising one positive electrode welding point and two negative electrode welding points, comprising a solder paste printer, a patch machine and a reflow soldering machine, the solder paste soldering machine comprising a steel grid frame and a steel mesh detachably mounted on the steel grid frame, the steel mesh being provided with a hollow part, the hollow part corresponding one-to-one with the welding part of the circuit board body, the hollow part comprising a positive electrode slot and two negative electrode slots;

[0007] The production line also includes a glue sticking mechanism, which includes a positioning seat and a tape roll installed on the positioning seat, and a supporting platform for supporting the steel mesh is provided on the positioning seat;

[0008] The production line also includes a cutting piece, which includes a mounting block and a cutting blade mounted on the mounting block. When the mounting block is attached to the steel mesh, the cutting blade penetrates the positive electrode slot or the negative electrode slot.

[0009] By adopting the above technical solution, each welding part corresponds to an LED lamp, and each welding part includes a positive electrode welding point and two negative electrode welding points. The negative electrode is divided into two areas of welding points, and the two negative electrode welding points are connected in a line. The LED lamp is changed from the original two-point fixed LED lamp to the three-point fixed LED lamp. The spacing left between the two negative electrode points forms a hollow state, and the pulling force of the LED lamp on the circuit board is reduced. It can also ensure that after a row of LED lamps is welded, the row of LED lamps is in a straight line, and the error of the head and tail lights of a row of LED lamps can be minimized. This design enables the LED lamp to be more stably welded on the circuit board, and improves the reliability and stability of welding.

[0010] The production line integrates solder paste printer, chip mounter and reflow soldering machine. The hollow part of the steel mesh corresponds to the welding part, and the negative electrode slot of the hollow part corresponds to the negative electrode solder point, which can reduce the waste of solder paste.

[0011] The tape of the tape roll on the adhesive sticking mechanism is torn off and covered on the supporting platform, so that the adhesive side of the tape can face upward, and the upper surface of the steel mesh that is used to contact the solder paste is attached to the adhesive side of the tape. Alternatively, the steel mesh can be placed on the supporting platform first, and the tape is covered on the steel mesh, and the adhesive side of the tape is attached to the steel mesh downward. Finally, the tape is cut with a cutter, and the hollow part on the steel mesh is also covered with the tape. The tape of the hollow part needs to be cut, and the tape at each welding part of the steel mesh is cut with a cutting piece. After the function of the hollow part is restored, the steel mesh is installed on the solder paste welding machine;

[0012] Since there is tape attached to the steel mesh, the solder paste only contacts the tape. When the steel mesh needs to be cleaned and replaced, the tape can be torn off the steel mesh, thereby increasing the cleaning efficiency of the steel mesh surface.

[0013] Optionally, a mounting shaft is rotatably mounted on one end of the positioning seat, and the positioning seat is also provided with a fixing part for fixing the mounting shaft. The tape roll is fixedly sleeved on the mounting shaft, and a guide roller and a fixed shaft are rotatably mounted on the other end of the positioning seat. The fixed shaft is located below the guide roller, and the tape is adhered to the fixed shaft after passing around the support platform and the guide roller.

[0014] By adopting the above technical solution, the installation shaft is rotated to release the tape roll. After the tape bypasses the support platform, the guide roller is guided by the tape, and the adhesive surface of the tape is adhered to the fixed shaft, so that the tape can be stably attached to the support platform.

[0015] Optionally, three cutting blades are correspondingly arranged on one of the mounting blocks, and the cutting blades are connected end to end to form a ring structure.

[0016] By adopting the above technical solution, three cutting blades can cut one positive electrode slot and two negative electrode slots at the same time, and can cut the hollow parts on the steel mesh as needed. The tape can also seal some of the hollow parts, so that one steel mesh can correspond to multiple circuit boards with different welding parts.

[0017] Optionally, the mounting block is slidably mounted with a push rod, and the push rod is located in the annular structure formed by the cutting blade.

[0018] By adopting the above technical solution, after the cutting blade cuts the tape covering the hollow part, the push rod is pressed by fingers, and the push rod can push away the cut tape. The design of the push rod ensures the smooth progress of the cutting process.

[0019] Optionally, movable needles are slid up and down on the support platform, and the movable needles are distributed in an array. The support platform is also provided with support blocks for supporting the steel mesh, and the support blocks are distributed around the movable needles.

[0020] By adopting the above technical solution, the steel mesh is placed on the support platform and first abuts against the support block, the hollow part of the steel mesh is located above the movable needles of the array, and then the tape is pulled to cover the steel mesh and fixed to the fixed shaft.

[0021] Optionally, the positioning seat is provided with an installation cavity, one end of the movable needle extends into the installation cavity and is connected to a limiting portion, when all the limiting portions are attached to the same inner wall of the installation cavity, the movable needle is flush, and the positioning seat is provided with a push plate for pushing the movable needle and a driving member for driving the push plate to reciprocate in the installation cavity.

[0022] By adopting the above technical solution, the adhesive surface of the tape is covered on the steel mesh with the adhesive surface facing down, and the driving part drives the push plate to push all the movable pins. The movable pins have the effect of pushing the steel mesh upward, and the steel mesh can move slightly upward so that the steel mesh can be fully attached to the tape. Then, when the cutting part is used to cut the tape on the hollow part, the cutting part can also press down the movable pins when penetrating the hollow part, so that the cutting part can smoothly penetrate the steel mesh and cut the tape.

[0023] Optionally, two cutting knives are slidably mounted on the upper surface of the positioning seat, one of the cutting knives is close to the mounting shaft, and the other of the cutting knives is close to the guide roller.

[0024] By adopting the above technical solution, after the tape is pasted on the steel mesh, the cutting knife can cut the two ends of the tape.

[0025] In a second aspect, the present application provides a method for manufacturing an LED circuit board, which adopts the following technical solution:

[0026] A method for manufacturing an LED circuit board is manufactured according to the above-mentioned LED circuit board manufacturing production line. First, a steel plate is placed on a positioning seat, and the tape of a tape roll is pasted on the side of the steel plate that is in contact with the solder paste. Then, the tape covering the hollow part of the steel mesh is cut with a cutting piece. When the pasted steel mesh is installed on a solder paste printer, the circuit board body is fixedly installed on the solder paste printer. The hollow part of the steel mesh corresponds to the welding part of the circuit board body one by one. When the scraper of the solder paste printer pushes the solder paste to be applied on the steel plate, the solder paste is evenly applied on the printed part of the circuit board body through the hollow part. When the welding part of the circuit board is evenly coated with solder paste, the circuit board is sent to a placement machine, and an LED lamp is pasted on the corresponding welding part. Finally, it enters a reflow soldering machine for reflow soldering and fixation.

[0027] In summary, the present application includes at least one of the following beneficial effects:

[0028] 1. The LED lamp is converted into a three-point fixed LED lamp. The space between the two negative poles forms a hollow state. The pulling force of the LED lamp on the circuit board is reduced, and it can ensure that after a row of LED lamps is welded, the row of LED lamps can be in a straight line, and the error of the head and tail lights of a row of LED lamps can be minimized;

[0029] 2. The hollow part of the steel mesh corresponds to the welding part, and the negative electrode slot of the hollow part corresponds to the negative electrode solder point, which can reduce the waste of solder paste. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the overall structure of the circuit board of an embodiment of the present application;

[0031] Figure 2 This is a schematic diagram of the overall structure of the steel mesh in an embodiment of the present application;

[0032] Figure 3 It is a schematic diagram of the overall structure of the glue sticking mechanism of the embodiment of the present application;

[0033] Figure 4 It is a schematic diagram of the structure in which the steel mesh of the embodiment of the present application is placed on the positioning seat;

[0034] Figure 5 This is an enlarged schematic diagram of point A in 4;

[0035] Figure 6 It is a schematic diagram of the structure of the movable needle distribution in the embodiment of the present application;

[0036] Figure 7 is a cross-sectional view of the overall structure of an embodiment of the present application;

[0037] Figure 8 This is an enlarged schematic diagram of point B of 7;

[0038] Fig. 9It is a schematic diagram of the overall structure of the cutting piece of an embodiment of the present application.

[0039] Description of reference numerals: 100, road plate body; 110, welding part; 111, positive electrode welding point; 112, negative electrode welding point; 200, steel mesh; 210, hollow part; 211, positive electrode slot; 212, negative electrode slot; 300, glue sticking mechanism; 310, positioning seat; 311, positioning plate; 312, positioning rod; 313, supporting platform; 314, movable needle; 315, supporting block; 316, installation Cavity; 317, limit part; 318, push plate; 319, driving member; 320, tape roll; 330, mounting shaft; 331, groove; 340, fixed sleeve; 341, connecting rod; 350, guide roller; 360, fixed shaft; 370, cutting knife; 371, slider; 400, cutting member; 410, mounting block; 420, cutting blade; 430, ejector rod; 440, linkage rod. DETAILED DESCRIPTION

[0040] The following is combined with Figure 1-9 This application is described in further detail.

[0041] Reference Figure 1 The LED circuit board includes a circuit board body 100, and a welding part 110 is distributed on the circuit board body 100. One welding part 110 corresponds to one LED lamp, and the welding part 110 includes a positive electrode welding point 111 and two negative electrode welding points 112. The positive electrode area of ​​the LED lamp remains unchanged, and the negative electrode area is divided into two. When the LED lamp and the circuit board body 100 are welded and fixed, one LED lamp has three fixing points, the pulling force of the LED lamp on the circuit board body 100 is reduced, and the two negative electrode welding points 112 form a straight line, which can also better ensure the requirement of a straight line after a row of lamps are welded.

[0042] The embodiment of the first aspect of the present application discloses an LED circuit board production line.

[0043] An LED circuit board production line is used to produce the above-mentioned LED circuit boards, and the production line includes a solder paste printer, a chip mounter and a reflow soldering machine. The solder paste printer includes a steel mesh 200 frame and a steel mesh 200 detachably mounted on the steel mesh frame. The solder paste printer, the chip mounter and the reflow soldering machine are all prior arts, and this application will not elaborate on them.

[0044] Reference Figure 2, the steel mesh 200 is provided with a hollow portion 210, and the hollow portion 210 corresponds to the welding portion 110 one by one. The hollow portion 210 includes a positive electrode slot 211 and two negative electrode slots 212, and the cross-sections of the positive electrode slot 211 and the negative electrode slot 212 are both rectangular structures. When the circuit board is accurately placed on the solder paste printer, the hollow portion 210 of the steel mesh 200 and the welding portion 110 of the circuit board body 100 are aligned one by one, and the solder paste can be evenly applied to the welding portion 110 through the hollow portion 210. The welding portion 110 on the circuit board is first evenly coated with solder paste, and then enters the patch machine for patching, and finally the circuit board body 100 and the LED lamp are soldered and fixed using a reflow soldering machine.

[0045] Reference Figure 3 The production line of the embodiment of the present application also includes a glue sticking mechanism 300, which includes a positioning seat 310 and a tape roll 320 installed on the positioning seat 310, and the tape of the tape roll 320 is a transparent tape. A support platform 313 for supporting the steel mesh 200 is provided on the positioning seat 310. Before the steel mesh 200 is installed in the solder paste welding machine, a layer of tape is first pasted on the positioning seat 310. When the steel mesh 200 is installed in the solder paste printing machine, the side of the steel mesh 200 pasted with the tape is in contact with the solder paste. When cleaning the steel mesh 200, the tape can be torn off to speed up the cleaning efficiency of the steel mesh 200. After the steel mesh 200 is pasted with tape, the tape at the hollow part 210 needs to be punctured so that the solder paste can smoothly enter the hollow part 210 and be evenly applied on the welding part 110 of the circuit board body 100.

[0046] Reference Figure 4 Specifically, the positioning seat 310 includes a positioning plate 311 and a positioning rod 312 for supporting the positioning plate 311 , a mounting shaft 330 is rotatably mounted on one side wall of the positioning plate 311 , and the positioning plate 311 is also provided with a fixing member for fixing the mounting shaft 330 .

[0047] Reference Figure 5 The fixing member is a fixing sleeve 340, which is slidably mounted on the side wall of the positioning plate 311. The sliding direction of the fixing sleeve 340 is the same as the length direction of the mounting shaft 330. A connecting rod 341 is fixedly connected to the inner wall of the fixing sleeve 340. A groove 331 is provided on the outer peripheral side of one end of the mounting shaft 330 close to the fixing sleeve 340. A plurality of grooves 331 are arranged at intervals along the circumference of the mounting shaft 330. When the mounting shaft 330 needs to be fixed, the connecting rod 341 of the fixing sleeve 340 slides into the groove 331, so that the mounting shaft 330 does not continue to rotate.

[0048] Reference Figure 4The tape roll 320 is fixedly sleeved on the mounting shaft 330. When the tape needs to be released, the mounting shaft 330 is rotated. The end of the tape that is pulled out needs to be fixed after passing around the support platform 313, so that the tape remains flat and fits the plane of the steel mesh 200. A guide roller 350 and a fixed shaft 360 are installed on the other side wall of the positioning plate 311 away from the mounting shaft 330. The guide roller 350 is rotatably mounted on the positioning plate 311, and the fixed shaft 360 is fixedly mounted on the positioning plate 311, and a gap is left between the outer peripheral side of the fixed shaft 360 and the side wall of the positioning plate 311. After the tape passes around the guide roller 350, it is attached to the fixed shaft 360.

[0049] The side of the tape with glue can face up or down. If the side of the tape with glue can face up, pull the tape to make it flat, then place the steel mesh 200 on the tape with the side in contact with the solder paste facing down. If the side of the tape with glue can face down, make sure that the side of the steel mesh 200 in contact with the solder paste faces up, then pull the tape so that the side of the tape with glue is attached to the upper surface of the steel mesh 200.

[0050] Reference Figure 4 Two cutting knives 370 are slidably mounted on the upper surface of the positioning plate 311. The cutting knives 370 are fixedly connected with a slider 371. The slider 371 is slidably mounted on the upper surface of the positioning plate 311. The cutting portion of the cutting knives 370 is close to the steel mesh 200. When the tape is attached to the steel mesh 200, the two cutting knives 370 are used to cut the two ends of the tape respectively. The cutting knives 370 are slid, and the cutting portion of the cutting knives 370 contacts the steel mesh 200.

[0051] Reference Figure 6 Specifically, the support platform 313 slides up and down with movable pins 314, and the movable pins 314 are arranged in a rectangular array. The support platform 313 is also fixed with support blocks 315 for supporting the steel mesh 200, and the support blocks 315 are arranged around the movable pins 314, and the support blocks 315 play a major supporting role for the steel mesh 200.

[0052] Reference Figure 7 and Figure 8 More specifically, a mounting cavity 316 is provided on the lower surface of the positioning plate 311, and the upper end of the movable pin 314 extends out of the positioning plate 311, and the lower end of the movable pin 314 extends into the mounting cavity 316. The lower end of the movable pin 314 is connected to a limiting portion 317, and the limiting portion 317 can prevent the movable pin 314 from leaving the mounting cavity 316 upward. A push plate 318 for pushing all movable pins 314 upward is installed in the mounting cavity 316 of the positioning plate 311, and a driving member 319 for driving the push plate 318 to reciprocate up and down is also installed outside the mounting plate. The driving member 319 can be a cylinder, and the piston rod of the cylinder is fixedly connected to the push plate 318.

[0053] Reference Figure 8 When the push plate 318 pushes the movable pin 314 so that the limit portion 317 of the movable pin 314 contacts the upper surface of the installation cavity 316, the upper end of the movable pin 314 is higher than the upper surface of the support block 315, but the upper end of the movable pin 314 is only slightly higher. When sticking the tape on the steel mesh 200, it is preferred to first place the steel mesh 200 on the support block 315, with the side of the tape with glue facing downward. After the tape covers the steel mesh 200, it is first fixed on the fixed shaft 360, and then the push plate 318 pushes all the movable pins 314. After all the movable pins 314 contact the lower surface of the steel mesh 200 upward, the limit portion 317 contacts the upper surface of the installation cavity 316. The movable pin 314 pushes the steel mesh 200 so that the steel mesh 200 can better fit the tape. Before the cutting piece 400 cuts the tape, the push plate 318 leaves the movable pin 314 first, so that the movable pin 314 has space to move downward. When the cutting piece 400 cuts the tape, it will inevitably pass through the steel mesh 200. The movable setting of the movable pin 314 can make way for the cutting blade 420, so that the cutting blade 420 can proceed smoothly.

[0054] Reference Figure 8 The production line also includes a tape cutting member 400 for cutting the hollow portion 210 of the steel mesh 200. The cutting member 400 includes a mounting block 410 and a cutting blade 420 mounted on the mounting block 410. The cutting blades 420 are connected end to end to form a hollow rectangular ring structure. When the mounting block 410 is attached to the steel mesh 200, the cutting blades 420 penetrate the positive electrode slot 211 or the negative electrode slot 212, and the cutting blades 420 can cut off the tape covering the hollow portion 210.

[0055] Reference Figure 8 and Fig. 9 Furthermore, there are three corresponding cutting blades 420 on a mounting block 410. When one cutting blade 420 of the cutting member 400 enters the positive electrode slot 211, the other two cutting blades 420 enter the two negative electrode slots 212 respectively, so that the cutting member 400 can cut the tape at multiple locations at the same time, thereby speeding up the cutting speed. The hollow portion 210 on the steel mesh 200 can be larger than the welding portion 110 on the circuit board body 100, and the cutting member 400 can also cut the tape corresponding to the hollow portion 210 on the steel plate according to the distribution of the welding portion 110 of the circuit board body 100, so that one steel mesh 200 can correspond to circuit boards with different distributions of welding portions 110. For example, multiple rows of hollow portions 210 are distributed on the steel mesh 200, and the positional relationship of a row of hollow portions 210 corresponds to the positional relationship of a row of welding portions 110. However, some circuit board bodies 100 have only one row of welding portions 110 or two rows of welding portions 110. When the solder paste is evenly applied to the circuit board body 100 through the steel mesh 200, only the tape corresponding to the hollow portions 210 is cut, and the other hollow portions 210 continue to be covered by the tape.

[0056] Reference Figure 8 and Fig. 9 Furthermore, the mounting block 410 is also slidably mounted with a push rod 430, the push rods 430 and the cutting blades 420 correspond one to one, and a linkage rod 440 is connected between the three push rods 430, the push rods 430 penetrate the mounting block 410, and one end of the push rods 430 is located in the ring structure formed by the cutting blades 420. When the cutting blades 420 cut the tape, the push rods 430 push the tape out, so that the tape can be better separated from the cutting piece 400.

[0057] The implementation principle of an LED circuit board production line in the embodiment of the present application is:

[0058] The production line integrates a solder paste printer, a placement machine and a reflow soldering machine. The hollow portion 210 on the steel mesh 200 corresponds to the welding portion 110 of the circuit board body 100. One negative electrode soldering point 112 corresponds to one negative electrode slot 212, which can reduce the waste of solder paste. When the LED lamp is soldered to the circuit board body 100, the two negative electrode soldering points 112 can reduce the offset of the LED lamp, and a row of lamps can be better arranged in a straight line after welding. Sticking tape on the steel mesh 200 can speed up the cleaning of the steel mesh 200, and also enable one steel mesh 200 to correspond to circuit boards with different distribution of welding portions 110.

[0059] The embodiment of the second aspect of the present application discloses a method for manufacturing an LED circuit board.

[0060] A method for manufacturing an LED circuit board, manufacturing the above-mentioned LED circuit board according to the above-mentioned LED circuit board manufacturing production line, specifically: firstly placing a steel plate on a positioning seat 310, pasting the tape of the tape roll 320 on the side of the steel plate that contacts with the solder paste, and then using a cutting piece 400 to cut the tape covering the hollow part 210 of the steel mesh 200;

[0061] When the steel mesh 200 is pasted and installed on the solder paste printer, the circuit board body 100 is fixedly installed at the specified position of the solder paste printer. The hollow part 210 of the steel mesh 200 corresponds to the welding part 110 of the circuit board body 100 one by one. When the scraper of the solder paste printer pushes the solder paste to be applied on the steel plate, the solder paste is evenly applied on the printing part of the circuit board body 100 through the hollow part 210. When the welding part 110 of the circuit board is evenly coated with solder paste, the circuit board is sent to the placement machine, the LED lamp is attached to the corresponding welding part 110, and finally enters the reflow soldering machine for reflow soldering and fixation.

[0062] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. An LED circuit board production line, used for producing LED circuit boards, characterized by: The LED circuit board comprises a circuit board body (100), a welding portion (110) is distributed on the circuit board body (100), one welding portion (110) corresponds to one LED lamp, the welding portion (110) comprises a positive electrode soldering point (111) and two negative electrode soldering points (112), the production line comprises a solder paste printer, a patch machine and a reflow soldering machine, the solder paste printer comprises a steel grid frame and a steel mesh (200) detachably mounted on the steel grid frame, the steel mesh (200) is provided with a hollow portion (210), the hollow portion (210) corresponds to the welding portion (110) one by one, and the hollow portion (210) comprises a positive electrode slot (211) and two negative electrode slots (212); The production line further comprises a gluing mechanism (300), the gluing mechanism (300) comprising a positioning seat (310) and a tape roll (320) mounted on the positioning seat (310), the positioning seat (310) being provided with a supporting platform (313) for supporting the steel mesh (200); The production line further comprises a cutting member (400), wherein the cutting member (400) comprises a mounting block (410) and a cutting blade (420) mounted on the mounting block (410), and when the mounting block (410) is attached to the steel mesh (200), the cutting blade (420) penetrates the positive electrode slot (211) and the negative electrode slot (212); The positioning seat (310) is rotatably mounted with a mounting shaft (330), the positioning seat (310) is also provided with a fixing piece for fixing the mounting shaft (330), the adhesive tape roll (320) is fixedly sleeved on the mounting shaft (330), a guide roller (350) and a fixing shaft (360) are mounted on a side of the positioning seat (310) away from the mounting shaft (330), the fixing shaft (360) is located below the guide roller (350), and the adhesive tape is adhered to the fixing shaft (360) after passing through the support platform (313) and the guide roller (350); Three cutting blades (420) are correspondingly arranged on the mounting block (410), and the cutting blades (420) are connected end to end to form a ring structure; The mounting block (410) is penetrated by a push rod (430), the push rod (430) is slidably mounted on the mounting block (410), and one end of the push rod (430) is located in the annular structure formed by the cutting blade (420); The support platform (313) is provided with movable pins (314) that slide up and down, and the movable pins (314) are arranged in an array. The support platform (313) is also provided with support blocks (315) for supporting the steel mesh (200), and the support blocks (315) are arranged around the movable pins (314); The positioning seat (310) is provided with a mounting cavity (316), one end of the movable needle (314) extends into the mounting cavity (316) and is connected to a limiting portion (317), when all the limiting portions (317) are attached to the same inner wall of the mounting cavity (316), the movable needle (314) is flush, and the positioning seat (310) is provided with a push plate (318) in the mounting cavity (316) for pushing the movable needle (314), the push plate (318) being connected to a driving member (319) for driving the push plate (318) to reciprocate; when the push plate (318) pushes the movable needle (314) so ​​that the limiting portion (317) of the movable needle (314) contacts the upper surface of the mounting cavity (316), the upper end of the movable needle (314) is higher than the upper surface of the support block (315).

2. The LED circuit board production line according to claim 1, characterized in that: Two cutting knives (370) are slidably mounted on the upper surface of the positioning seat (310), one of the cutting knives (370) being close to the mounting shaft (330), and the other of the cutting knives (370) being close to the guide roller (350).

3. A method for manufacturing an LED circuit board, manufactured according to an LED circuit board production line according to any one of claims 1-2, characterized in that: First, a steel plate is placed on a positioning seat (310), and the tape of a tape roll (320) is pasted on the side of the steel plate that contacts the solder paste. Then, the tape covering the hollow portion (210) of the steel mesh (200) is cut using a cutting piece (400). When the steel mesh (200) pasted with the tape is installed on a solder paste printer, the circuit board body (100) is fixedly installed on the solder paste printer. The hollow portion (210) of the steel mesh (200) and the welding portion (110) of the circuit board body (100) correspond one to one. When the scraper of the solder paste printer pushes the solder paste to be applied to the steel plate, the solder paste is evenly applied to the welding portion of the circuit board body (100) through the hollow portion (210). When the welding portion (110) of the circuit board is evenly coated with the solder paste, the circuit board is sent to a chip mounter, and an LED lamp is attached to the corresponding welding portion (110). Finally, the circuit board is sent to a reflow soldering machine for reflow soldering and fixation.

Images