Micro-led display unit and manufacturing method

Abstract

The application discloses a Micro-LED display unit and a manufacturing method. The method encapsulates red, green and blue light emitting units in a Micro-LED display unit, thereby reducing the operation amount of welding installation in massive transfer. In addition, the method uses a quantum dot material layer and other wavelength conversion units to convert the wavelength of the blue light beam emitted by the blue light LED chip, thereby avoiding the direct use of red light LED chips and green light LED chips with low light emitting efficiency. In order to guarantee the wavelength conversion efficiency, the method uses a blue light LED chip with good wavelength conversion efficiency and wavelength conversion units to generate red light beams and green light beams. At the same time, the method uses another blue light LED chip as the blue light output of the entire display unit to improve the overall color gamut.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display panels, in particular to a Micro-LED display unit and a manufacturing method. BACKGROUND

[0002] As a new generation of display technology, Micro LED has higher brightness, better light-emitting efficiency and lower power consumption than the existing Organic Light-Emitting Diode (OLED) technology, and has great application prospects. Since the yield and cost of the current mass transfer and mass repair technology still cannot realize large-scale productization, the industry proposes a Micro-LED display MIP (Micro-LED in Package) technical solution to accelerate the industrialization process of Micro-LED display, that is, to pre-package the Micro-LED chip in a small display unit in advance, and then transfer the pre-packaged Micro-LED chip display unit to the corresponding PCB and glass-based display circuit by using a more mature technology. This technical solution has the feasibility of high technical maturity and low expected cost. However, due to the low red light emission efficiency and other reasons, the overall light emission efficiency of the LED chip packaged in the display unit is often low. SUMMARY

[0003] The purpose of the present application is to provide a Micro-LED display unit and a manufacturing method which can improve the above problems.

[0004] Embodiments of the present application are implemented as follows:

[0005] In a first aspect, the present application provides a manufacturing method of a Micro-LED display unit, comprising the following steps S1 to S8, wherein S1, S2, etc. are only step identifiers, and the execution order of the method does not necessarily follow the order from small to large, for example, step S2 can be executed before step S1, and the present application does not make any limitation.

[0006] S1, providing a sapphire substrate, preparing an array of M light filtering units on the sapphire substrate, M is a positive integer greater than 2, each light filtering unit includes a blue light filtering unit and a red-green light filtering unit;

[0007] S2, covering the light filtering units with a water and oxygen barrier layer, and then preparing a wavelength conversion unit on the water and oxygen barrier layer, so that the wavelength conversion unit falls within the coverage range of the red-green light filtering unit in the orthographic projection area of the sapphire substrate, and the wavelength conversion unit is used to convert a blue light beam into a red light beam and a green light beam;

[0008] S3, covering the water and oxygen barrier layer above the wavelength conversion unit;

[0009] S4, filling the gap between the wavelength conversion units with black glue, and preparing a light-transmitting filling layer on the wavelength conversion units;

[0010] S5, fixing M light-emitting unit groups on the filling layer, the light-emitting unit groups comprising blue light Micro-LED chips outputting a first waveband and blue light Micro-LED chips outputting a second waveband, the blue light Micro-LED chips outputting the first waveband falling within the orthographic projection area of the blue light filtering unit in the orthographic projection area of the filling layer, and the blue light Micro-LED chips outputting the second waveband falling within the orthographic projection area of the wavelength conversion unit in the orthographic projection area of the filling layer;

[0011] S6, continuing to fill the gap between the Micro-LED chips with black glue;

[0012] S7, cutting the layer structure along the light-emitting direction of the light-emitting unit groups to separate the filtering units to obtain M initial units;

[0013] S8, preparing signal contact pads connecting the Micro-LED chips on the initial units to obtain M Micro-LED display units.

[0014] It can be understood that the present application provides a manufacturing method of a Micro-LED display unit, which encapsulates red, green and blue light-emitting units in one Micro-LED display unit, thereby reducing the operation amount of soldering and mounting in massive transfer. In addition, the present method uses a wavelength conversion unit such as a quantum dot material layer to convert the wavelength of the blue light beam emitted by the blue light LED chip, thereby avoiding the direct use of red light LED chips and green light LED chips with low light-emitting efficiency. In order to guarantee the wavelength conversion efficiency, the present method uses a blue light LED chip with a good wavelength conversion efficiency waveband to cooperate with the wavelength conversion unit to generate a red light beam and a green light beam; at the same time, the present method uses another waveband of blue light LED chip as the blue light output of the entire display unit to improve the overall color gamut.

[0015] In an optional embodiment of the present application, the light-emitting unit group comprises a first blue light Micro-LED chip, a second blue light Micro-LED chip and a third blue light Micro-LED chip, wherein the first blue light Micro-LED chip is used to emit a first waveband of blue light beam, and the second blue light Micro-LED chip and the third blue light Micro-LED chip are used to emit a second waveband of blue light beam.

[0016] It can be understood that the wavelength conversion unit in the present application is a conversion layer filled with quantum dot materials. In order to ensure the wavelength conversion efficiency, a second blue light Micro-LED chip with a second waveband and a center wavelength of 450 nm can be used as a light source for green light conversion. A third blue light Micro-LED chip with a second waveband and a center wavelength of 450 nm can be used as a light source for red light conversion. In order to improve the overall color gamut, a first blue light Micro-LED chip with a first waveband different from the second waveband, such as a first waveband with a center wavelength of 460 nm, can be used as a blue light source.

[0017] In an optional embodiment of the present application, the positive electrodes of the first blue light Micro-LED chip and the second blue light Micro-LED chip are arranged on a first straight line; the negative electrodes of the first blue light Micro-LED chip and the second blue light Micro-LED chip are arranged on a second straight line; the positive electrode of the third blue light Micro-LED chip is arranged on the second straight line, and the negative electrode of the third blue light Micro-LED chip is arranged on the first straight line.

[0018] It can be understood that in a conventional display unit package, three LED chips are often arranged in sequence, so that the positive electrodes of the three LED chips are all located on the same straight line, and the negative electrodes of the three LED chips are also located on the same straight line. However, when preparing the signal contact pad of the display unit subsequently, the electrode wiring of a certain LED chip must often be edge wiring, which often reduces the width of the metal wire, and the resistance effect is obvious when the current passes through, resulting in problems such as serious heating of the display unit. In the present method, the edge LED chip is arranged reversely, which can avoid edge wiring of the edge chip and solve the heating problem of the display unit.

[0019] In an optional embodiment of the present application, the red-green filter unit comprises at least one of the following:

[0020] a red filter and a green filter;

[0021] a first long-pass filter and a second long-pass filter, the cutoff wavelength of the first long-pass filter being equal to the minimum value of the green waveband, and the cutoff wavelength of the second long-pass filter also being equal to the minimum value of the green waveband;

[0022] a cholesteric liquid crystal assembly, the cholesteric liquid crystal assembly comprising a lower electrode, a cholesteric liquid crystal layer and an upper electrode which are stacked in sequence, the cholesteric liquid crystal layer forming a first cholesteric grating under a first electric field drive, being capable of transmitting a red waveband and reflecting other waveband light beams, and forming a second cholesteric grating under a second electric field drive, being capable of transmitting a green waveband and reflecting other waveband light beams.

[0023] In an optional embodiment of the present application, the wavelength conversion unit comprises at least one of the following:

[0024] a first wavelength conversion block containing green quantum dot materials and a second wavelength conversion block containing red quantum dot materials;

[0025] a third wavelength conversion block containing red quantum dot materials and green quantum dot materials.

[0026] In an optional embodiment of the present application, the above method further comprises at least one of the following:

[0027] The coverage area of the first wavelength conversion block is smaller than that of the green filter, and the coverage area of the second wavelength conversion block is smaller than that of the red filter;

[0028] The coverage area of the first wavelength conversion block is smaller than that of the second long-pass filter, and the coverage area of the second wavelength conversion block is smaller than that of the second long-pass filter;

[0029] The sum of the coverage areas of the third wavelength conversion blocks is smaller than that of the cholesteric liquid crystal component.

[0030] In an optional embodiment of the present application, the S8 further comprises the following steps:

[0031] S81, coating an insulating material on the sapphire substrate to wrap each of the initial units;

[0032] S82, punching the insulating material layer formed by the insulating material to expose the electrodes of the LED chips, and preparing signal contact pads connected to the electrodes on the surface of the insulating material layer to obtain M Micro-LED display units.

[0033] In an optional embodiment of the present application, the surface of the insulating material layer in the Micro-LED display unit is a rectangular surface; a first signal contact pad is arranged at a first corner of the rectangular surface, a second signal contact pad is arranged at a second corner of the rectangular surface, a third signal contact pad is arranged at a third corner of the rectangular surface, and a fourth signal contact pad is arranged at a fourth corner of the rectangular surface; the negative electrodes of each LED chip are connected in series through a straight circuit to form a series circuit segment, and the first signal contact pad closest to the head or tail of the series circuit segment is connected to the series circuit segment; the other signal contact pads are respectively connected to the positive electrodes of the LED chips closest thereto.

[0034] In an optional embodiment of the present application, before step S2, the following step is further included: S9, preparing a group of liquid crystal driving touch pads on the sapphire substrate, each of the group of liquid crystal driving touch pads comprising an upper touch pad connected with the upper electrode and a lower touch pad connected with the lower electrode.

[0035] After step S8, the following step is further included: S10, perforating the insulating material layer, the filling layer and the black adhesive to expose the upper touch pad and the lower touch pad, and preparing an upper driving contact pad connected with the upper touch pad and a lower driving contact pad connected with the lower touch pad on the surface of the insulating material layer.

[0036] In a second aspect, the present application discloses a Micro-LED display unit prepared by the method of any one of the first aspect.

[0037] Advantages:

[0038] The present application discloses a Micro-LED display unit and a manufacturing method. The present method encapsulates red, green and blue light emitting units in a Micro-LED display unit, reducing the operation amount of soldering and mounting in the massive transfer. In addition, the present method uses a quantum dot material layer and other wavelength conversion units to convert the wavelength of the blue light beam emitted by the blue light LED chip, avoiding the direct use of red light LED chips and green light LED chips with low light efficiency. In order to guarantee the wavelength conversion efficiency, the present method uses a blue light LED chip with good wavelength conversion efficiency in the wavelength band to cooperate with the wavelength conversion unit to generate red light beams and green light beams; at the same time, the present method uses another blue light LED chip as the blue light output of the entire display unit to improve the overall color gamut.

[0039] In order to make the above objectives, characteristics and advantages of the present application more obvious and easy to understand, the following optional embodiments are described in detail below, and the accompanying drawings are described as follows. BRIEF DESCRIPTION OF DRAWINGS

[0040] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0041] Figures 1 to 10 The flowchart of the first Micro-LED display unit manufacturing method provided by the present application is shown;

[0042] Figure 11 The step diagram of edge wiring during the preparation of the display unit is shown;

[0043] Figures 12 to 15 Fig. 2 shows a schematic diagram of a different step of a second method for manufacturing a Micro-LED display unit according to the present application. DETAILED DESCRIPTION

[0044] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0045] The present application provides a first method for manufacturing a Micro-LED display unit, including the following steps S1 to S8, wherein S1, S2, etc. are only step identifiers, and the execution order of the method does not necessarily follow the order from small to large, for example, step S2 can be executed first and then step S1, which is not limited by the present application.

[0046] S1, a sapphire substrate 10 is provided, and an array of M light filtering units is prepared on the sapphire substrate 10, M is a positive integer greater than 2, each light filtering unit includes a blue light filter 101, a red light filter 103 and a green light filter 102, as shown in Figure 1 .

[0047] The above-mentioned blue light filter 101 is used to transmit blue light beam, and reflect or absorb light beams of other wave bands; the above-mentioned green light filter 102 is used to transmit green light beam, and reflect or absorb light beams of other wave bands; the above-mentioned red light filter 103 is used to transmit red light beam, and reflect or absorb light beams of other wave bands.

[0048] S2, as shown in Figure 2 After covering each light filtering unit with a water and oxygen barrier layer 20, a first wavelength conversion block 111 containing green quantum dot material and a second wavelength conversion block 112 containing red quantum dot material are prepared on the water and oxygen barrier layer 20.

[0049] The above-mentioned water and oxygen barrier layer 20 mainly uses at least one of the following materials: SiO2, Al2O3, TiO2, etc., which plays a role in blocking water and oxygen.

[0050] In the embodiment of the present application, the first wavelength conversion block 111 is used to convert the blue light beam into a green light beam, and the first wavelength conversion block 111 falls within the coverage range of the green light filter 102 in the projection area of the sapphire substrate 10, so that the green light beam converted by the quantum dot material can be filtered by the green light filter 102 sufficiently, and more pure green light is output; the second wavelength conversion block 112 is used to convert the blue light beam into a red light beam, and the second wavelength conversion block 112 falls within the coverage range of the red light filter 103 in the projection area of the sapphire substrate 10, so that the red light beam converted by the quantum dot material can be filtered by the red light filter 103 sufficiently, and more pure red light is output.

[0051] S3, the water and oxygen barrier layer 20 also covers the wavelength conversion unit.

[0052] S4, the gap between the first wavelength conversion block 111 and the second wavelength conversion block 112 is filled with black glue 30, and a light-transmitting filling layer 300 is prepared on the first wavelength conversion block 111 and the second wavelength conversion block 112, as shown in Figure 3 .

[0053] In the embodiment of the present application, after step S2 and before S4, a light-transmitting material layer 113 covering the blue light filter 101 can be prepared on the water and oxygen barrier layer 20, so that the light-transmitting material layer 113 is flush with the first wavelength conversion block 111 and the second wavelength conversion block 112, as shown in Figure 3 .

[0054] The filling layer 300 material described above can be acrylic resin, polyimide, poly-p-phenylene benzobisoxazole, silica gel, etc., and the purpose is to keep the thickness of the entire wavelength conversion block uniform.

[0055] The black glue 30 described above can play a better anti-crosstalk role, avoiding the crosstalk of red light, green light and blue light converted by quantum dots.

[0056] S5, fixing M light-emitting unit groups on the filling layer 300, the light-emitting unit group including a first blue light Micro-LED chip 121 outputting a first waveband and a second blue light Micro-LED chip 122 and a third blue light Micro-LED chip 123 outputting a second waveband; wherein the first blue light Micro-LED chip 121 falls within the projection area of the blue light filter unit in the projection area of the filling layer 300, the second blue light Micro-LED chip 122 falls within the projection area of the first wavelength conversion block 111 in the projection area of the filling layer 300, and the third blue light Micro-LED chip 123 falls within the projection area of the second wavelength conversion block 112 in the projection area of the filling layer 300, as shown in Figure 4 .

[0057] The number of the light emitting unit groups is consistent with the number of the light filtering units, that is, each light emitting unit group corresponds to a single light filtering unit. The LED chip of each light emitting unit group can be clamped into a groove formed on the filling layer 300, or the LED chip can be adhered to the filling layer 300 by using a light-transmitting optical adhesive.

[0058] It can be understood that the wavelength conversion unit in the present application is a conversion layer filled with quantum dot materials. In order to guarantee the wavelength conversion efficiency, a second blue light Micro-LED chip 122 of a second waveband with a center wavelength of 450 nm can be used as a light source for green light conversion; a third blue light Micro-LED chip 123 of a second waveband with a center wavelength of 450 nm can be used as a light source for red light conversion; in order to improve the overall color gamut, a first blue light Micro-LED chip 121 of a first waveband different from the second waveband, such as a first waveband with a center wavelength of 460 nm, can be used as a blue light source.

[0059] S6, continue to fill the gap between the Micro-LED chips with black glue 30, as shown in Figure 5 to prevent the side leakage of the light beam of the blue light Micro-LED chip and improve the light extraction efficiency of the display unit.

[0060] S7, cut off the structure along the light emitting direction of the light emitting unit group to separate the light filtering units to obtain M initial units. As shown in Figure 6 is a single initial unit obtained by cutting.

[0061] S8, prepare a signal contact pad connected to each Micro-LED chip on the initial unit to obtain M Micro-LED display units.

[0062] It can be understood that the present application provides a manufacturing method of a Micro-LED display unit, which encapsulates red, green and blue light emitting units in a Micro-LED display unit, thereby reducing the operation amount of welding and installation in the mass transfer. In addition, the present application uses a quantum dot material layer and other wavelength conversion units to convert the wavelength of the blue light beam emitted by the blue light LED chip, thereby avoiding the direct use of red light LED chips and green light LED chips with low light extraction efficiency. In order to guarantee the wavelength conversion efficiency, the present application uses a blue light LED chip of a wavelength conversion efficiency better waveband to cooperate with the wavelength conversion unit to generate a red light beam and a green light beam; at the same time, the present application uses another waveband of blue light LED chip as the blue light output of the entire display unit to improve the overall color gamut.

[0063] In this embodiment, the position of the red light filter 103 can be replaced by the first long-pass filter. The first long-pass filter can transmit red and green light beams, and reflect or absorb blue light beams with wavelengths smaller than green light. After the blue light beam is converted into a green light beam by the first wavelength conversion block 111, it is filtered by the first long-pass filter, so that the blue light beam that has not been converted by the quantum dot material is absorbed or reflected, and a purer red light is output.

[0064] In this embodiment, the position of the green light filter 102 can be replaced by a second long-pass filter. The second long-pass filter can transmit red and green light beams, and reflect or absorb blue light beams with wavelengths smaller than green light wavelengths. After the blue light beam is converted into a green light beam by the second wavelength conversion block 112, it is filtered by the second long-pass filter, so that the blue light beam that has not been converted by the quantum dot material is absorbed or reflected, and a purer green light is output.

[0065] In an optional embodiment of this application, step S8 includes the following steps S81 to S82.

[0066] S81 uses an insulating material coated on a sapphire substrate to encapsulate each initial cell, such as... Figure 7 As shown, the insulating material constitutes the insulating material layer 40.

[0067] S82, holes are punched in the insulating material layer 40 to expose the six electrodes of the three LED chips, such as... Figure 8 As shown; and signal contact pads for connecting electrodes are prepared on the surface of the insulating material layer 40 to obtain individual Micro-LED display units, such as... Figure 9 The image shows one of the display units.

[0068] In optional embodiments of this application, such as Figure 8 As shown, the first positive electrode 511 of the first blue Micro-LED chip 121 and the second positive electrode 521 of the second blue Micro-LED chip 122 are arranged on the first straight line L1; the first negative electrode 521 of the first blue Micro-LED chip 121 and the second negative electrode 522 of the second blue Micro-LED chip 122 are arranged on the second straight line L2; the third positive electrode 531 of the third blue Micro-LED chip 123 is arranged on the second straight line L2, and the third negative electrode 523 of the third blue Micro-LED chip 123 is arranged on the first straight line L1.

[0069] In an optional embodiment of this application, the surface of the insulating material layer 40 in the Micro-LED display unit is a rectangular surface; such as Figure 9As shown, the first signal contact pad 61 is arranged at the first corner of the rectangular surface, the second signal contact pad 62 is arranged at the second corner of the rectangular surface, the third signal contact pad 63 is arranged at the third corner of the rectangular surface, and the fourth signal contact pad 64 is arranged at the fourth corner of the rectangular surface; the negative electrodes of the LED chips are connected in series through the straight circuit, and the first signal contact pad 61 closest to the head or tail of the series circuit is connected with the series circuit; and the other signal contact pads are connected with the positive electrodes of the LED chips closest thereto.

[0070] It can be understood that in a conventional display unit package, three LED chips are often arranged in sequence, so that the positive electrodes of the three LED chips are located on the same straight line, and the negative electrodes of the three LED chips are also located on the same straight line. However, when the signal contact pads of the display unit are prepared subsequently, the electrode wiring of a certain LED chip must be edge wiring, such as Figure 11 As shown, the edge wiring often reduces the width of the metal wire, and the resistance effect is obvious when the current passes through, resulting in serious heating of the display unit and other problems. In the method, the edge LED chip is arranged reversely, which can avoid edge wiring of the edge chip and solve the heating problem of the display unit.

[0071] In an optional embodiment of the present application, after the step S82, the positive and negative electrodes and the wiring of the LED chip can be packaged by an insulating material, and only four signal contact pads are exposed to facilitate subsequent installation, as shown in Figure 10 .

[0072] The present application also provides a second method for manufacturing a Micro-LED display unit, which is different from the first method in the improvement of steps S1 and S2.

[0073] In the S1 step, each light filtering unit prepared in the method only includes a blue light filter 101 and a cholesteric liquid crystal assembly 70, as shown in Figure 12 Since a single cholesteric liquid crystal assembly 70 is used to replace the red light filter 103 and the green light filter 102, the preparation steps are reduced. As shown in Figure 12 The cholesteric liquid crystal assembly 70 includes a lower electrode 71, a cholesteric liquid crystal layer 72 and an upper electrode 73 which are stacked in sequence. The cholesteric liquid crystal layer 72 forms a first cholesteric grating under a first electric field drive, can transmit a red light band and reflect other bands of light beams, and forms a second cholesteric grating under a second electric field drive, for transmitting a green light band and reflecting other bands of light beams.

[0074] In an optional embodiment of the present application, before step S2, the following step is further included: S9, preparing a group of M liquid crystal driving touch pads on the sapphire substrate 10, each group of liquid crystal driving touch pads including an upper touch pad 81 connected with the upper electrode 73 and a lower touch pad 82 connected with the lower electrode 71, as shown in Figure 12 .

[0075] In the present method, in step S2, after covering the blue light filter 101 and the cholesteric liquid crystal assembly 70 with the water-oxygen barrier layer 20, only a third wavelength conversion block 114 containing red quantum dot material and green quantum dot material is prepared on the water-oxygen barrier layer 20, as shown in Figure 13 . Since the single third wavelength conversion block 114 is used to replace the first wavelength conversion block 111 and the second wavelength conversion block 112, the number of preparation steps is reduced. The sum of the coverage areas of the third wavelength conversion block 114 is less than the coverage area of the cholesteric liquid crystal assembly 70, so that the red light beam and the green light beam converted by the quantum dot material can be fully filtered by the cholesteric liquid crystal assembly 70, preventing unconverted blue light beams from passing through the filter.

[0076] In an optional embodiment of the present application, the water-oxygen barrier layer 20 covers the cholesteric liquid crystal assembly 70, but the upper touch pad 81 and the lower touch pad 82 can be exposed, as shown in Figure 13 .

[0077] In an optional embodiment of the present application, after step S82, the following step is further included: S10, punching the insulating material layer 40, the leveling layer 300, and the black glue 30 to expose the upper touch pad 81 and the lower touch pad 82, as shown in Figure 14 . Then, the upper driving contact pad 91 connected with the upper touch pad 81 and the lower driving contact pad 92 connected with the lower touch pad 82 are prepared on the surface of the insulating material layer 40, as shown in Figure 15 .

[0078] In a second aspect, the present application discloses a Micro-LED display unit prepared by the method of any one of the first aspect.

[0079] The expressions “first”, “second”, “the first” or “the second” used in various embodiments of the present disclosure can modify various components regardless of order and / or importance, but these expressions do not limit the corresponding components. The above expressions are only configured for the purpose of distinguishing elements from other elements. For example, the first user equipment and the second user equipment represent different user equipment, although both are user equipment. For example, without departing from the scope of the present disclosure, the first element can be referred to as the second element, and similarly, the second element can be referred to as the first element.

[0080] When an element (e.g., a first element) is referred to as being “(operatively or communicatively) coupled with” or “(operatively or communicatively) coupled to” or “connected to” another element (e.g., a second element), it should be understood that the one element is either directly connected to the other element or that one element is indirectly connected to the other element through yet another element (e.g., a third element). Conversely, when an element (e.g., a first element) is referred to as being “directly connected” or “directly coupled” to another element (a second element), then no element (e.g., a third element) is interposed between them.

[0081] It has to be noted that, as used herein, the terms “includes,” “including,” “has,” “having” or the like are intended to be open-ended: namely, the foregoing terms are intended to mean that the processes, methods, articles, or apparatuses disclosed herein include, but are not limited to, those stated items, further that: no limitations are placed on the scope of recited components, features, integers, or sections; and, that the sections, components, integers or features that are not explicitly recited are not excluded from the claimed application.

[0082] The above description is only optional embodiments of the present application and the explanation of the principles of the applied technology. It should be understood by those skilled in the art that the scope of the application involved in the present application is not limited to the technical solutions formed by the specific combinations of the above technical features, and also covers other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the above inventive concept. For example, the technical solutions formed by replacing the above features with the technical features disclosed in the present application (but not limited to) having similar functions.

[0083] Depending on the context, the word “if’ as used herein can be interpreted to mean “when” or “while” or “in response to determining” or “in response to detecting.” Similarly, depending on the context, the phrase “if it is determined” or “if it is detected (a stated condition or event)” can be interpreted to mean “upon determining” or “in response to determining” or “upon detecting” or “in response to detecting” (a stated condition or event).

[0084] The above description is merely exemplary of optional embodiments and the principles of the application. It is not intended to limit the scope of the application to the described technical solutions. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the application shall be included in the scope of protection of the application.

[0085] The above description is merely exemplary of optional embodiments and the principles of the application. It is not intended to limit the scope of the application to the described technical solutions. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the application shall be included in the scope of protection of the application.

Claims

1. A method for manufacturing a Micro-LED display unit, characterized in that, The method comprises the following steps: S1, providing a sapphire substrate, and preparing an array of M light filtering units on the sapphire substrate, M being a positive integer greater than 2, each light filtering unit comprising a blue light filtering unit and a red-green light filtering unit; S2, after covering the light filtering units with a water-oxygen barrier layer, preparing a wavelength conversion unit on the water-oxygen barrier layer, so that the wavelength conversion unit falls within the coverage range of the red-green light filtering unit in the orthographic projection area of the sapphire substrate, the wavelength conversion unit being used for converting a blue light beam into a red light beam and a green light beam; S3, also covering the wavelength conversion unit with a water-oxygen barrier layer; S4, filling the gaps between the wavelength conversion units with black glue, and preparing a light-transmitting leveling layer on the wavelength conversion units; S5, fixing M light emitting unit groups on the leveling layer, the light emitting unit groups comprising blue light Micro-LED chips outputting a first waveband and blue light Micro-LED chips outputting a second waveband, the blue light Micro-LED chips outputting the first waveband falling within the orthographic projection area of the blue light filtering unit in the orthographic projection area of the leveling layer, and the blue light Micro-LED chips outputting the second waveband falling within the orthographic projection area of the wavelength conversion unit in the orthographic projection area of the leveling layer; S6, continuing to fill the gaps between the respective Micro-LED chips with black glue; S7, cutting the layers along the light emitting direction of the light emitting unit groups to separate the respective light filtering units, thereby obtaining M initial units; S8, preparing signal contact pads connecting the respective Micro-LED chips on the initial units, thereby obtaining M Micro-LED display units.

2. The method according to claim 1, wherein the light emitting unit groups comprise first blue light Micro-LED chips, second blue light Micro-LED chips, and third blue light Micro-LED chips, wherein the first blue light Micro-LED chips are used for emitting a first waveband of blue light beams, and the second blue light Micro-LED chips and the third blue light Micro-LED chips are used for emitting a second waveband of blue light beams.

3. The method according to claim 2, wherein the positive electrodes of the first blue light Micro-LED chips and the second blue light Micro-LED chips are arranged on a first straight line, the negative electrodes of the first blue light Micro-LED chips and the second blue light Micro-LED chips are arranged on a second straight line, the positive electrode of the third blue light Micro-LED chip is arranged on the second straight line, and the negative electrode of the third blue light Micro-LED chip is arranged on the first straight line.

4. The method according to any one of claims 1 to 3, wherein the red-green light filtering unit comprises at least one of the following: a red light filter and a green light filter. ​ ​ ​ a first long-wave pass filter and a second long-wave pass filter, the first long-wave pass filter having a cut-off wavelength equal to the minimum value of the green light waveband, and the second long-wave pass filter also having a cut-off wavelength equal to the minimum value of the green light waveband; a cholesteric liquid crystal assembly comprising a lower electrode, a cholesteric liquid crystal layer and an upper electrode stacked in sequence, the cholesteric liquid crystal layer forming a first cholesteric grating under a first electric field drive, being capable of transmitting a red light waveband and reflecting other wavebands, and forming a second cholesteric grating under a second electric field drive, being capable of transmitting a green light waveband and reflecting other wavebands.

5. The method of claim 4, wherein the wavelength conversion unit comprises at least one of: a first wavelength conversion block containing green quantum dot material and a second wavelength conversion block containing red quantum dot material; and a third wavelength conversion block containing red quantum dot material and green quantum dot material. The method further comprises at least one of:

6. The method of claim 5, wherein the method further comprises: the first wavelength conversion block has a smaller coverage area than the green filter, and the second wavelength conversion block has a smaller coverage area than the red filter; the first wavelength conversion block has a smaller coverage area than the second long-wave pass filter, and the second wavelength conversion block has a smaller coverage area than the second long-wave pass filter; and the third wavelength conversion block has a smaller coverage area than the cholesteric liquid crystal assembly. The method further comprises the following steps:

7. The method of claim 6, wherein the method further comprises: S81, coating the sapphire substrate with insulating material to wrap each of the initial units; S82, punching the insulating material layer to expose the electrodes of the LED chips, and preparing signal contact pads on the surface of the insulating material layer to connect the electrodes, thereby obtaining M Micro-LED display units.

8. The method of claim 7, wherein the surface of the insulating material layer in the Micro-LED display unit is a rectangular surface, the first signal contact pad is arranged at the first corner of the rectangular surface, the second signal contact pad is arranged at the second corner of the rectangular surface, the third signal contact pad is arranged at the third corner of the rectangular surface, and the fourth signal contact pad is arranged at the fourth corner of the rectangular surface. The negative electrodes of the LED chips are connected in series through a straight circuit to form a series circuit segment, and the first signal contact pad closest to the head or tail of the series circuit segment is connected to the series circuit segment, and the other signal contact pads are connected to the positive electrodes of the LED chips closest to them.

9. The method of claim 8, wherein before step S2, the method further comprises the following step: S9, preparing M groups of liquid crystal drive touch pad groups on the sapphire substrate, each of the liquid crystal drive touch pad groups comprising an upper touch pad connected to the upper electrode and a lower touch pad connected to the lower electrode. ​ ​ ​ After step S8, the following step is further included: S10, the insulating material layer, the filling layer, the black glue are punched to expose the upper and lower touch pads, and the upper and lower driving contact pads connected with the upper and lower touch pads are prepared on the surface of the insulating material layer. 10.A Micro-LED display unit, comprising: prepared by the method of any one of claims 1 to 9.

Images