Optical bridge for photonic interposer-to-photonic interposer communication

Abstract

Embodiments disclosed herein include a photonic package. In an embodiment, the photonic package includes a substrate. In an embodiment, a first interposer is over the substrate, and a first die is on the first interposer. In an embodiment, a second interposer is over the substrate, and a second die is on the second interposer. In an embodiment, an optical bridge is between the first interposer and the second interposer.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to photonic packaging, and more particularly to photonic packaging having a photonic interposer to photonic interposer optical communication link. Background Art

[0002] Advances in electronic packaging are trending toward the use of disaggregated die architectures. That is, multiple die are communicatively coupled together without the need for a single larger die that is more difficult to manufacture. In existing disaggregated die architectures, the die are communicatively coupled together through metal conductors fabricated on the package substrate / interposer or through the use of embedded bridges. Embedded bridges provide the ability to have high-density wiring between the die.

[0003] However, as the frequency of signaling increases and the distance between dies increases, signal losses increase significantly on the metal conductors. In addition, as more dies / chiplets are added to the package, the conductor routing for die-to-die communication becomes increasingly complex. BRIEF DESCRIPTION OF THE DRAWINGS

[0004] Figure 1 is a perspective view illustration of a photonic package having a first photonic module and a second photonic module optically coupled together by an optical bridge according to an embodiment.

[0005] Figure 2A is a schematic illustration of a first die on a first photonic interposer optically coupled to a second die on a second photonic interposer using an optical bridge having a grating coupler in accordance with an embodiment.

[0006] Figure 2B is a schematic illustration of a first die on a first photonic interposer optically coupled to a second die on a second photonic interposer using an optical bridge with an evanescent coupler in accordance with an embodiment.

[0007] Figure 2C is a schematic illustration of a first die on a first photonic interposer optically coupled to a second die on a second photonic interposer using an optical bridge including a waveguide having a turn in accordance with an embodiment.

[0008] Figure 3A is a cross-sectional illustration of a substrate according to an embodiment.

[0009] Figure 3B is a cross-sectional illustration of a substrate after a first photon module and a second photon module are coupled to the substrate according to an embodiment.

[0010] Figure 3C is a cross-sectional illustration of a substrate after providing an optical bridge on a first interposer and a second interposer according to an embodiment.

[0011] Figure 3Dis a cross-sectional illustration of the substrate after providing an underfill between the first interposer and the second interposer below the optical bridge according to an embodiment.

[0012] Figure 3E is a cross-sectional illustration of a photonic package with optical bridges over and between photonic interposers according to an embodiment.

[0013] Figure 3F is a cross-sectional illustration of a photonic package with an optical bridge between photonic interposers according to an embodiment.

[0014] Figure 4A is a cross-sectional illustration of a photonic package having a first photonic module and a second photonic module on a substrate according to an embodiment.

[0015] Figure 4B is a cross-sectional illustration of a photonic package after forming an optical bridge in a substrate to optically couple a first photonic module to a second photonic module in accordance with an embodiment.

[0016] Figure 4C is a cross-sectional illustration of a photonic package with an optical bridge between photonic interposers according to an embodiment.

[0017] Figure 4D is a cross-sectional illustration of a photonic package with an optical bridge between photonic interposers and into a base substrate according to an embodiment.

[0018] Figure 5 is a cross-sectional illustration of a photonic system having a first photonic module coupled to a second photonic module via an optical bridge according to an embodiment.

[0019] Figure 6 is a schematic diagram of a computing device constructed according to an embodiment. DETAILED DESCRIPTION

[0020] Photonic packages with photonic interposer to photonic interposer optical communication links according to various embodiments are described herein. In the following description, various aspects of the illustrative embodiments will be described using terms commonly used by those skilled in the art to convey the essence of their work to other technicians in the field. However, it is obvious to those skilled in the art that only some of the described aspects can be used to practice the present invention. For the purpose of explanation, specific quantities, materials, and configurations are set forth in order to provide a thorough understanding of the illustrative embodiments. However, it is obvious to those skilled in the art that the present invention can be practiced without specific details. In other cases, well-known features are omitted or simplified so as not to make the illustrative embodiments difficult to understand.

[0021] Various operations will be described as multiple discrete operations in turn in a manner that is most helpful for understanding the present invention, however, the order of description should not be interpreted as implying that these operations must be order-dependent. In particular, these operations do not need to be performed in the order presented.

[0022] As described above, disaggregated die architectures are becoming increasingly popular, in part due to the difficulty of forming large form factor dies. However, disaggregated die architectures create problems with signaling between dies. For example, as the frequency of signaling increases and the distance between dies increases, signal losses increase significantly on metal conductors. In addition, as more dies / chiplets are added to the package, conductor routing for die-to-die communication becomes increasingly complex.

[0023] Accordingly, embodiments disclosed herein include photonic packages having photonic modules optically coupled to each other via optical bridges. In certain embodiments, the photonic modules may include multiple dies (operating in an electrical mechanism) optically coupled to each other via a photonic interposer. The photonic interposer may include photodetectors and modulators to convert between electrical and optical mechanisms. In some embodiments, the optical bridge is coupled to a waveguide on the photonic interposer. For example, a waveguide on the photonic interposer may be optically coupled to a waveguide on the optical bridge using a grating coupler, an evanescent coupler, or the like.

[0024] Operating in an optical mechanism has significant benefits over electrical interconnects. For example, optical mechanisms allow for higher signaling frequencies. In addition to enabling high signal frequencies, the embodiments disclosed herein may also allow for the use of more digital modulation techniques (e.g., four-state quadrature amplitude modulator (QAM4), multiple access, etc.). Accordingly, the performance of photonic packages is improved compared to packages that operate entirely in an electrical mechanism.

[0025] Reference now Figure 1 , shows a perspective view illustration of a photonic package 100 according to an embodiment. As used herein, a photonic package may refer to a packaging architecture that includes one or more optical interconnects (e.g., waveguides, optical coupling architectures, etc.). However, it should be understood that not all interconnects need to be optical interconnects in order for a package to be considered a photonic package. Additionally, all components of the photonic package 100 need not operate in an optical mechanism. For example, the tube core 135 can operate in an electrical mechanism. Electrical signals to / from the tube core 135 can be converted into optical signals by a modulator, a laser, a photodetector, etc.

[0026] In an embodiment, the photonic package 100 may include a base substrate 105. The base substrate 105 may be any type of packaging substrate. In a particular embodiment, the base substrate 105 may include glass. Although, in other embodiments, the base substrate 105 may include an organic material or a ceramic material. For example, the base substrate 105 may include an organic buildup layer above and below the core. In some embodiments, conductive wiring (not shown) may be provided through the base substrate 105. The conductive wiring may provide an electrical connection to a board (not shown) located below the base substrate 105.

[0027] In an embodiment, a plurality of photon modules 120 may be provided on a base substrate 105. For example, Figure 1 In the first photon module 120 A and the second photon module 120 B is provided over the base substrate 105. However, it should be understood that any number of photonic modules 120 may be provided over the base substrate 105 depending on the requirements of the photonic package 100. In an embodiment, each photonic module 120 may include a photonic interposer 130 and a plurality of dies 135.

[0028] In an embodiment, the photonic interposer 130 may include any substrate configured to allow optical coupling between the dies 135. For example, an optical interconnect 132 may be provided between the dies 135 on the photonic interposer 130. The interconnect 132 may be an optical waveguide. For example, the photonic interposer 130 may include a silicon-on-insulator (SOI) substrate. Although, other materials and waveguides may also be used in alternative embodiments. In an embodiment, the photonic interposer 130 may also include functionality for converting electrical signals from the dies 135 into optical signals (for propagation along the interconnect 132) and for converting the optical signals back into electrical signals. For example, the photonic interposer 130 may include photodetectors, lasers, modulators, and the like. In some embodiments, one or more of the photonic components (e.g., lasers) may be provided outside the photonic interposer 130.

[0029] In an embodiment, the plurality of dies 135 may include any type of computing die. For example, the plurality of dies 135 may include a central processing unit (CPU), a graphics processing unit (GPU), a system on chip (SoC), or any other type of die that performs logic operations. In other embodiments, one or more of the plurality of dies 135 may include a memory die. In a particular embodiment, each of the plurality of dies 135 may be substantially similar to one another. In an embodiment, the plurality of dies 135 may include two or more dies 135. For example, a set of four dies 135 are provided in each photon module 120. Although, it should be understood that more than four dies 135 may be included in other embodiments. Additionally, the first photon module 120 A The number of dies 135 in the second photon module 120 may be equal to B In other embodiments, the first photon module 120 A The number of dies 135 in the second photonic module 120 may be different from that in the second photonic module 120. B The number of dies 135 in FIG.

[0030] In an embodiment, the photonic package 100 may include one or more optical bridges 140. Figure 1 In FIG. 1 , a pair of optical bridges 140 are shown. Although, it should be understood that any number of optical bridges 140 may be used. The optical bridges 140 connect the first photon module 120 to the A Optically coupled to the second photon module 120 B Therefore, the first photon module 120 A The die 135 on the substrate may be communicatively coupled to the second photonic module 120 B The tube core 135 on it.

[0031] In certain embodiments, the optical bridge 140 may include an optical waveguide (not shown). The optical waveguide may be optically coupled to the waveguide 142 on the photonic interposer 130. Any suitable optical coupling architecture may be used (e.g., grating coupling, evanescent coupling, butt coupling, etc.). In an embodiment, the optical bridge 140 may be a glass substrate into which the optical waveguide is patterned. Although other material mechanisms may also be used to provide the optical waveguide.

[0032] In an embodiment, the optical bridge 140 may be provided in the first photon module 120 A The second photon module 120 B For example, Figure 1 The optical bridge 140 in the first photon module 120 A The second photon module 120 BThat is, a portion of the optical bridge 140 may be between the photonic interposers 130, and a portion of the optical bridge 140 may be above the top surface of the photonic interposer 130. In other embodiments (described in more detail below), the optical bridge 140 may be provided in the base substrate 105 or embedded in the base substrate 105.

[0033] Reference now Figure 2A , shows a schematic diagram of a photonic package 200 according to an embodiment. In an embodiment, the photonic package 200 may include a first die 235 A and the second die 235 B . The first tube core 235 A Can be coupled to the first photonic interposer 230 A , and the second die 235 B Can be coupled to the second photonic interposer 230 B For example, the photonic interposer 230 may include a photodetector 237 A and 237 B and modulator 238 A and 238 B The photodetector 237 and the modulator 238 allow the electrical signal of the die 235 to be converted into an optical signal. The optical signal can travel along the waveguide 242 A and 242 B The photodetector 237 may be a micro-ring photodetector, and the modulator 238 may be a micro-ring modulator. Although, it should be understood that any photodetector or modulator architecture may be used.

[0034] In an embodiment, the first photonic interposer 230 A Can be optically coupled to the second photonic interposer 230 via the optical bridge 240 B . In an embodiment, the optical bridge 240 may include a substrate and a waveguide 241 embedded in the substrate. In a specific embodiment, the substrate may be glass, and the waveguide 241 may also be glass. For example, the microstructure of the waveguide 241 may be different from the microstructure of the substrate. Therefore, due to the different refractive indices, total internal reflection may be provided in the waveguide 241. Although glass is provided as an example, it should be understood that the optical waveguide 241 may be implemented by any suitable waveguide / cladding material combination, such as those waveguide / cladding material combinations including silicon or silicon and nitrogen (e.g., SiN).

[0035] In an embodiment, optical waveguide 241 may be optically coupled to waveguide 242 using any coupling architecture 215. A and 242 B In certain embodiments, the optical coupling structure can be a grating coupler 215 A and 215B That is, waveguide 242 A and 242 B The grating on can be used to propagate the optical signal in the adjacent waveguide 241.

[0036] exist Figure 2A In the schematic illustration shown, for simplicity, the first die 235 is shown. A With the second tube core 235 B It should be understood that multiple optical interconnects can be provided across the optical bridge 240. That is, multiple waveguides 241 can be used to connect the first tube core 235. A With the second tube core 235 B Additionally, a single optical bridge 240 may include optical interconnects between multiple different pairs of dies 235 .

[0037] Reference now Figure 2B , shows a schematic diagram of a photonic package 200 according to an additional embodiment. In an embodiment, in addition to the optical bridge 240, Figure 2B The photonic package 200 in may be substantially similar to Figure 2A That is, the photon package 200 may include a photon interposer 230 A and 230 B A pair of dies 235 optically coupled to each other A and 235 B In an embodiment, the photonic interposer 230 A and 230 B The optical bridges 240 may be optically coupled to each other.

[0038] In an embodiment, the optical bridge 240 may include a substrate and an optical waveguide 241. In some embodiments, the optical waveguide 241 and the substrate may include glass. Although, other material combinations may also be used for the optical bridge 240. In an embodiment, the waveguide 241 of the optical bridge 240 may be optically coupled to the photonic interposer 230 via the optical coupling architecture 215. A and 230 B Waveguide 242 A and 242 B .exist Figure 2B In the particular embodiment shown, the optical coupling structure 215 A and 215 B is an evanescent coupling architecture. Although the evanescent coupler ( Figure 2B ) and grating coupler ( Figure 2A ) is shown as a specific example, but it should be understood that any optical coupling architecture may be provided between the optical bridge 240 and the photonic interposer 230. For example, butt coupling or any other type of coupling may be used.

[0039] Reference now Figure 2C , shows a schematic diagram of a photonic package 200 according to an additional embodiment. In an embodiment, in addition to the optical bridge 240, Figure 2C The photonic package 200 in may be substantially similar to Figure 2A That is, the photon package 200 may include a photon interposer 230 A and 230 B A pair of dies 235 optically coupled to each other A and 235 B In an embodiment, the photonic interposer 230 A and 230 B The optical bridges 240 may be optically coupled to each other.

[0040] In an embodiment, the optical bridge 240 may include a substrate and a waveguide 241 embedded in the substrate. In contrast to the waveguide 241 described above, Figure 2C The waveguide 241 in the embodiment includes one or more turns or bends. The nonlinear nature of the waveguide 241 allows the waveguide 242 to be mitigated. A With Waveguide 242 B Any misalignment between the first photonic interposer 230 and the second photonic interposer 230 is avoided, thereby allowing for improved coupling. A The second photonic interposer 230 may be B Thus, waveguide 241 may include one or more bends to direct waveguide 242 A and 242 B Realign.

[0041] In one embodiment, the nonlinear waveguide 241 may be formed using a laser direct writing process. In such an embodiment, the blank optical bridge 240 may be provided in the first photonic interposer 230. A The second photonic interposer 230 B Then, the optical imaging system can determine that the first photonic intermediary layer 230 A The second photonic interposer 230 B Optical imaging can be used to inform the direct laser writing system, which can then pattern the waveguide 241 into the optical bridge 240 to mitigate the first photonic interposer 230. A The second photonic interposer 230 B In the illustrated embodiment, the grating coupler 215 A and 215 B However, it should be understood that the nonlinear waveguide 241 may include any coupling architecture (eg, grating coupler, evanescent coupler, butt coupler, etc.).

[0042] Reference now FIG. 3A to FIG. 3D , shows a series of cross-sectional diagrams depicting a process for forming a photonic package 300 according to an embodiment. In an embodiment, the photonic package 300 is shown with a generic optical bridge 340. However, it should be understood that the optical bridge 340 can be substantially similar to any of the optical bridges described in more detail herein.

[0043] Reference now Figure 3A , shows a cross-sectional illustration of a photonic package 300 at a manufacturing stage according to an embodiment. In an embodiment, the photonic package 300 may include a base substrate 305. In an embodiment, the base substrate 305 may be any packaging substrate. In a specific embodiment, the base substrate 305 is a glass substrate. In the illustrated embodiment, for simplicity, buildup layers, redistribution layers, conductive wiring, etc. are not shown. However, it should be understood that other conductive wiring (e.g., pads, traces, vias, etc.) and layers may be included on the base substrate 305. Although the base substrate 305 is described as a glass substrate, it should be understood that other embodiments may include an organic base substrate 305 or a ceramic base substrate 305. For example, an organic buildup layer may be provided above and below an organic core material. The organic core material may include reinforcements such as glass fibers, etc.

[0044] Reference now Figure 3B , showing the attachment of the photon module 320 according to an embodiment A and 320 B The following is a cross-sectional view of the photonic package 300. In the embodiment, two photonic modules 320 are shown. A and 320 B However, it should be understood that any number of photon modules 320 may be attached to the base substrate 305. In the illustrated embodiment, the photon modules 320 directly contact the base substrate 305. In some embodiments, interconnects (eg, solder balls, etc.) may be provided between the photon modules 320 and the base substrate 305.

[0045] In an embodiment, each of the photon modules 320 may include a photon interposer 330. The photon interposer 330 may include functionality to convert electrical signals into optical signals (or vice versa). For example, the photon interposer 330 may include a photodetector, a laser, a modulator, etc. For simplicity, Figure 3B In an embodiment, the photonic interposer 330 may also include an optical waveguide 332. For example, the optical waveguide 332 may be used to optically couple together the dies 335 provided on the photonic interposer 330.

[0046] In an embodiment, two or more dies 335 may be provided on each of the photonic interposers 330. The die 335 may be a computing die (e.g., a CPU, a GPU, a SoC, etc.) or a memory die. In the illustrated embodiment, the die 335 is shown in direct contact with the underlying photonic interposer 330. However, it should be understood that an interconnect (e.g., a first level interconnect (FLI), etc.) may be provided between the die 335 and the photonic interposer 330.

[0047] Reference now Figure 3C , shows a cross-sectional view of the photon package 300 after attaching the optical bridge 340 according to an embodiment. In an embodiment, the optical bridge 340 is used to connect the first photon module 320 A Optically coupled to the second photon module 320 B The optical bridge 340 may be provided between the photon interposers 330 of each photon module 320. In certain embodiments, the optical bridge 340 spans the gap between the photon interposers 330. The optical bridge 340 may be provided on the top surface of the photon interposer 330. In the illustrated embodiment, a single optical bridge 340 is shown. However, it should be understood that a plurality of optical bridges 340 may be provided between the photon modules 320. A With 320 B Additionally, it should be understood that the plurality of light bridges 340 may be similar to each other or have different structures (eg, different patterning dimensions, etc.).

[0048] In an embodiment, the optical bridge 340 can be any optical bridge substantially similar to the optical bridges described in more detail above. For example, the optical bridge 340 can include a substrate in which one or more optical waveguides are embedded. Figure 3C The optical waveguide is omitted in FIG. In an embodiment, the optical waveguide may be optically coupled to a waveguide on the photonic interposer 330. For example, optical coupling may be implemented using a grating coupler, an evanescent coupler, a butt coupler, or any other coupling architecture.

[0049] In an embodiment, the optical bridge 340 may include glass. The substrate may be glass having a first microstructure, and the optical waveguide may be glass having a second microstructure different from the first microstructure. The different microstructures produce different refractive indices, which enables total internal reflection. Although glass is specifically described for the optical bridge 340, other materials may also be used, such as silicon, silicon and nitrogen (e.g., SiN), etc.

[0050] In an embodiment, the waveguides in the optical bridge 340 can be fabricated before adding the optical bridge 340 to the photonic package 300. In other embodiments, a blank optical bridge 340 can be attached to the photonic package 300. After the optical bridge 340 is attached, direct laser writing can be used to form the optical waveguides in the optical bridge 340. The direct laser writing embodiment allows for mitigation of the first photonic module 320. A The second photon module 320 B Thus, improved optical coupling between the photon modules 320 may be provided.

[0051] Reference now Figure 3D , shows a cross-sectional illustration of the photonic package 300 after applying the bottom filler 347 according to an embodiment. In an embodiment, the bottom filler 347 can be an organic material, an epoxy resin, or any other suitable bottom fill material. The bottom filler 347 can be provided in the gap between the photonic interposers 330. In some embodiments, the bottom filler 347 can also contact the bottom surface of the optical bridge 340. The bottom filler 347 can also extend upward along the sidewalls of the optical bridge 340. In some embodiments, the bottom filler 347 can be omitted.

[0052] Reference now Figure 3E , shows a cross-sectional illustration of a photonic package 300 according to an additional embodiment. As shown, an optical bridge 340 is placed on top of the photonic interposer 330 and also extends down into the gap between the photonic interposers 330. In the illustrated embodiment, the bottom of the optical bridge 340 is above the top surface of the base substrate 305. However, in other embodiments, the bottom of the optical bridge 340 can be on the base substrate 305. Such an embodiment is particularly beneficial for a docking coupling architecture. In an embodiment, any gap between the base substrate 305 and the optical bridge 340 can be filled with air, an index-matched epoxy, or an underfill.

[0053] Reference now Figure 3F , shows a cross-sectional illustration of a photonic package 300 according to yet another embodiment. As shown, an optical bridge 340 is placed on the base substrate 305, between the photonic interposers 330. In an embodiment, the height of the optical bridge 340 can be the same as or higher than the photonic interposers 330. In some embodiments, any gaps (if any) between the photonic interposers 330 and the optical bridge 340 can be filled with a refractive index matching epoxy.

[0054] Reference now FIG. 4A to FIG. 4B , shows a series of cross-sectional diagrams depicting a process for forming a photonic package 400 according to an embodiment. Instead of providing the optical bridge 440 above the photonic interposer 430 , the optical bridge 440 is provided in the base substrate 405 .

[0055] Reference now Figure 4A , shows a cross-sectional view of a photonic package 400 according to an embodiment. In an embodiment, the photonic package 400 may include a base substrate 405. The base substrate 405 may include glass or (one or more) any other suitable substrate material. In an embodiment, a pair of photonic modules 420 A and 420 B is provided over the base substrate 405. Although two photon modules 420 are shown, it should be understood that any number of photon modules 420 may be provided over the base substrate 405.

[0056] The photonic modules 420 may each include a photonic interposer 430 and a plurality of dies 435. The dies 435 may be optically coupled to each other through a silicon photonic layer 432 in the photonic interposer 430. The silicon photonic layer 432 may include waveguides, active components, etc. In an embodiment, the silicon photonic layer 432 is electrically coupled to the dies 435 through vias 431. In an embodiment, the photonic interposer 430 and the dies 435 may be substantially similar to the photonic interposer 330 and the dies 335 described in more detail above.

[0057] Reference now Figure 4B , shows a cross-sectional illustration of a photonic package 400 after forming an optical bridge 440 according to an embodiment. When the base substrate 405 comprises glass, the optical bridge 440 can be formed by laser writing a waveguide (not shown) directly into the base substrate 405. That is, in some embodiments, the optical bridge 440 can be considered part of the base substrate 405. The use of direct laser writing allows any misalignment between the photonic modules 420 to be mitigated. This allows for improved optical coupling between the photonic modules 420.

[0058] Although in Figure 4B 4 shows the optical bridge 440 as part of the base substrate 405, but it should be understood that a separate optical bridge 440 can also be provided below the photon module 420. For example, a cavity can be provided in the base substrate 405, and the optical bridge 440 can be placed in the cavity. In such an embodiment, the optical bridge 440 can be referred to as being embedded or partially embedded in the base substrate 405. Such an embodiment can be particularly beneficial when the base substrate 405 includes an organic material or a ceramic material.

[0059] Reference now Figure 4C, shows a cross-sectional illustration of a photonic package 400 according to additional embodiments. As shown, an optical bridge 440 is provided above the base substrate 405, between the photonic interposers 430. The optical bridge 440 can extend upward beyond the top surface of the photonic interposer 430. In other embodiments, the top of the optical bridge 440 can be coplanar with the top of the photonic interposer 430 or below the top of the photonic interposer 430. Additionally, any gap between the optical bridge 440 and the base substrate 405 can be filled with air, an index-matched epoxy, or an underfill.

[0060] exist Figure 4D In yet another embodiment shown, the optical bridge 440 can be provided in a cavity in the base substrate 405. The optical bridge 440 can extend upward beyond the top surface of the photonic interposer 430. In other embodiments, the top of the optical bridge 440 can be coplanar with the top of the photonic interposer 430 or below the top of the photonic interposer 430. In some embodiments, any gap between the photonic interposer 430 and the optical bridge 440, if present, can be filled with an index-matched epoxy.

[0061] Reference now Figure 5 , shows a cross-sectional illustration of a photon system 590 according to an embodiment. In an embodiment, the photon system 590 includes a board 591, such as a printed circuit board (PCB). In an embodiment, the board 591 can be coupled to a packaging substrate 593 through interconnects 592, such as solder balls. In an embodiment, the packaging substrate 593 can be coupled to a base substrate 505. In other embodiments, the base substrate 505 can be coupled to the board 591 without an intervening packaging substrate 593. The base substrate 505 can include glass or any other suitable packaging substrate material.

[0062] In an embodiment, the photon system 590 may further include two or more photon modules 520. For example, Figure 5 Two photon modules 520 are shown in A and 520 B In an embodiment, each photonic module 520 includes a photonic interposer 530 and a plurality of dies 535. The plurality of dies 535 may be optically coupled together via a waveguide 532 in the photonic interposer 530. The photonic interposer 530 and the plurality of dies 535 may be substantially similar to any of the photonic interposers or dies described in more detail above.

[0063] In an embodiment, the photonic modules 520 may be optically coupled to each other via an optical bridge 540. The optical bridge 540 may include one or more waveguides optically coupled to waveguides in the photonic interposer 530. For example, a grating coupler, an evanescent coupler, a butt coupler, or any other coupling architecture may be used to couple the optical bridge 540 to the photonic interposer 530. In an embodiment, an underfill 547 may be provided below the optical bridge 540, between the photonic interposers 530. Although a particular photonic package is shown as part of the photonic system 590, it should be understood that any photonic package described herein may be similarly integrated into the photonic system 590.

[0064] Figure 6 A computing device 600 is shown according to one embodiment of the present invention. The computing device 600 houses a board 602. The board 602 may include a number of components, including, but not limited to, a processor 604 and at least one communication chip 606. The processor 604 is physically and electrically coupled to the board 602. In some embodiments, the at least one communication chip 606 is also physically and electrically coupled to the board 602. In other embodiments, the communication chip 606 is part of the processor 604.

[0065] These other components include, but are not limited to, volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM), flash memory, graphics processors, digital signal processors, encryption processors, chipsets, antennas, displays, touch screen displays, touch screen controllers, batteries, audio codecs, video codecs, power amplifiers, global positioning system (GPS) devices, compasses, accelerometers, gyroscopes, speakers, cameras, and mass storage devices (such as hard drives, compact disks (CDs), digital versatile disks (DVDs), etc.).

[0066] The communication chip 606 implements wireless communications for transmitting data to and from the computing device 600. The term "wireless" and its derivatives may be used to describe circuits, devices, systems, methods, techniques, communication channels, etc. that can transfer data through a non-solid medium by using modulated electromagnetic radiation. The term does not imply that the associated device does not contain any wires, although in some embodiments they may not. The communication chip 606 may implement any of several wireless standards or protocols, including but not limited to Wi-Fi (IEEE 802.11 series), WiMAX (IEEE 802.16 series), IEEE 802.20, Long Term Evolution (LTE), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPRS, CDMA, TDMA, DECT, Bluetooth, its derivatives, and any other wireless protocols designated as 3G, 4G, 5G and higher versions. The computing device 600 may include multiple communication chips 606. For example, the first communication chip 606 may be dedicated to shorter range wireless communications such as Wi-Fi and Bluetooth, and the second communication chip 606 may be dedicated to longer range wireless communications such as GPS, EDGE, GPRS, CDMA, WiMAX, LTE, Ev-DO and others.

[0067] The processor 604 of the computing device 600 includes an integrated circuit die packaged within the processor 604. In some embodiments of the invention, the integrated circuit die of the processor may be part of a photonic package according to embodiments described herein that includes a pair of photonic modules optically coupled together by an optical bridge. The term "processor" may refer to any device or portion of a device that processes electronic data from registers and / or memory to convert the electronic data into other electronic data that may be stored in registers and / or memory.

[0068] The communication chip 606 also includes an integrated circuit die packaged within the communication chip 606. According to another embodiment of the invention, the integrated circuit die of the communication chip may be part of a photonic package according to embodiments described herein, the photonic package including a pair of photonic modules optically coupled together by an optical bridge.

[0069] The above description of example embodiments of the present invention (including the content described in the Abstract) is not intended to be exhaustive or to limit the present invention to the exact form disclosed. Although specific embodiments and examples of the present invention are described herein for illustrative purposes, those skilled in the relevant art will recognize that various equivalent modifications are possible within the scope of the present invention.

[0070] In view of the above specific embodiments, these modifications can be made to the present invention. The terms used in the following claims should not be interpreted as limiting the present invention to the specific embodiments disclosed in the specification and claims. On the contrary, the scope of the present invention will be determined entirely by the following claims, which will be interpreted according to the established principles of claim interpretation.

[0071] Example 1: A photonic package comprises: a substrate; a first interposer on the substrate; a first die on the first interposer; a second interposer on the substrate; a second die on the second interposer; and an optical bridge between the first interposer and the second interposer.

[0072] Example 2: The photonic package of Example 1, wherein the first interposer and the second interposer are photonic interposers.

[0073] Example 3: The photonic package of Example 2, wherein the first interposer and the second interposer each include a photodetector and a modulator.

[0074] Example 4: A photonic package according to Example 3, wherein the photodetector is a microring photodetector, and wherein the modulator is a microring modulator.

[0075] Example 5: The photonic package of Examples 1-4, wherein the optical bridge comprises a bridge waveguide optically coupled to a first waveguide in the first interposer and a second waveguide in the second interposer.

[0076] Example 6: The photonic package of Example 5, wherein optical coupling between the bridge waveguide and the first waveguide and the second waveguide is achieved via a grating coupler.

[0077] Example 7: The photonic package of Example 5, wherein optical coupling between the bridge waveguide and the first waveguide and the second waveguide is achieved by evanescent coupling.

[0078] Example 8: The photonic package of Examples 1-7, wherein the optical bridge is above a top surface of the first interposer and the second interposer.

[0079] Example 9: The photonic package of Examples 1-8, wherein the optical bridge is embedded in the substrate.

[0080] Example 10: The photonic package of Examples 1-9, wherein the optical bridge comprises a bridge waveguide having a turn.

[0081] Example 11: The photonic package of Example 10, wherein the bridge waveguide is formed using a laser writing process.

[0082] Example 12: The photonic package of Examples 1-11, wherein a third die is provided on the first interposer, and wherein a fourth die is provided on the second interposer.

[0083] Example 13: The photonic package of Example 12, wherein the first die is optically coupled to the third die via a first waveguide in the first interposer, and wherein the second die is optically coupled to the fourth die via a second waveguide in the second interposer.

[0084] Example 14: A photonic package comprises: a first photonic module, the first photonic module comprising: a first plurality of dies operating in an electrical mechanism; a first photonic interposer for optically coupling the first plurality of dies together; a second photonic module, the second photonic module comprising: a second plurality of dies operating in the electrical mechanism; a second photonic interposer for optically coupling the second plurality of dies together; and an optical bridge, wherein the optical bridge optically couples the first photonic module to the second photonic module.

[0085] Example 15: The photonic package of Example 14, wherein the optical bridge spans a gap between the first photonic interposer and the second photonic interposer.

[0086] Example 16: The photonic package of Example 14 or Example 15, wherein the optical bridge is embedded in a substrate below the first photonic module and the second photonic module.

[0087] Example 17: The photonic package of Examples 14-16, wherein the first photonic interposer and the second photonic interposer both include a modulator and a photodetector.

[0088] Example 18: A photonic package according to Example 17, wherein the modulator is a microring modulator, and wherein the photodetector is a microring photodetector.

[0089] Example 19: The photonic package of Examples 14-18, wherein the optical bridge is optically coupled to the first photonic interposer and the second photonic interposer using grating couplers.

[0090] Example 20: The photonic package of Examples 14-18, wherein the optical bridge is optically coupled to the first photonic interposer and the second photonic interposer using evanescent couplers.

[0091] Example 21: The photonic package of Examples 14-20, wherein the first photonic interposer and the second photonic interposer are provided on a substrate, wherein the substrate comprises glass or an organic material.

[0092] Example 22: A photonic system comprising: a board; a packaging substrate located on the board; a first photonic module located on the packaging substrate; a second photonic module located on the packaging substrate; and an optical bridge for optically coupling the first photonic module to the second photonic module.

[0093] Example 23: The photonic system of Example 22, wherein the first photonic module comprises a first photonic interposer and a first plurality of dies, and wherein the second photonic module comprises a second photonic interposer and a second plurality of dies.

[0094] Example 24: The photonic system of Example 23, wherein the optical bridge is on a top surface of the first photonic interposer and the second photonic interposer.

[0095] Example 25: The photonic system of Examples 22-23, wherein the packaging substrate comprises glass.

Claims

1. A photonic package, comprising: substrate; a first interposer over the substrate; a first die on the first interposer; a second interposer over the substrate; a second die on the second interposer; as well as An optical bridge between the first interposer and the second interposer.

2. The photonic package according to claim 1, wherein: The first intermediary layer and the second intermediary layer are photonic intermediary layers.

3. The photonic package according to claim 2, wherein: The first interposer and the second interposer each include a photodetector and a modulator.

4. The photonic package according to claim 3, wherein: The photodetector is a micro-ring photodetector, and wherein the modulator is a micro-ring modulator.

5. The photonic package according to claim 1, wherein: The optical bridge includes a bridge waveguide optically coupled to a first waveguide in the first interposer and a second waveguide in the second interposer.

6. The photonic package according to claim 5, wherein: The optical coupling between the bridge waveguide and the first waveguide and the second waveguide is achieved through a grating coupler.

7. The photonic package according to claim 5, wherein: The optical coupling between the bridge waveguide and the first waveguide and the second waveguide is achieved by evanescent coupling.

8. The photonic package according to claim 1, wherein: The optical bridge is over top surfaces of the first interposer and the second interposer.

9. The photonic package according to claim 1, wherein: The optical bridge is embedded in the substrate.

10. The photonic package according to claim 1, wherein: The optical bridge includes a bridge waveguide having turns.

11. The photonic package according to claim 10, wherein: The bridge waveguide is formed using a laser writing process.

12. The photonic package of claim 1, wherein: A third die is provided on the first interposer, and wherein a fourth die is provided on the second interposer.

13. The photonic package of claim 12, wherein: The first die is optically coupled to the third die through a first waveguide in the first interposer, and wherein the second die is optically coupled to the fourth die through a second waveguide in the second interposer.

14. A photonic package, comprising: A first photon module, the first photon module comprising: a first plurality of dies, the first plurality of dies operating in an electrical regime; a first photonic interposer optically coupling the first plurality of dies together; A second photon module, wherein the second photon module comprises: a second plurality of die, said second plurality of die being operative in said electrical regime; a second photonic interposer optically coupling the second plurality of dies together; and an optical bridge optically coupling the first photonic module to the second photonic module.

15. The photonic package of claim 14, wherein: The optical bridge spans a gap between the first photonic intermediary layer and the second photonic intermediary layer.

16. The photonic package of claim 14, wherein: The optical bridge is embedded in the substrate below the first photon module and the second photon module.

17. The photonic package of claim 14, wherein: The first photonic intermediary layer and the second photonic intermediary layer both include a modulator and a photodetector.

18. The photonic package of claim 17, wherein: The modulator is a micro-ring modulator, and wherein the photodetector is a micro-ring photodetector.

19. The photonic package of claim 14, wherein: The optical bridge is optically coupled to the first photonic interposer and the second photonic interposer using a grating coupler.

20. The photonic package of claim 14, wherein: The optical bridge is optically coupled to the first photonic intermediary layer and the second photonic intermediary layer using evanescent couplers.

21. The photonic package of claim 14, wherein: The first photonic interposing layer and the second photonic interposing layer are provided on a substrate, wherein the substrate comprises glass or an organic material.

22. A photonic system comprising: plate; a packaging substrate on the board; a first photonic module on the packaging substrate; a second photonic module on the packaging substrate; as well as An optical bridge optically couples the first photon module to the second photon module.

23. The photonic system of claim 22, wherein: The first photonic module includes a first photonic interposer and a first plurality of dies, and wherein the second photonic module includes a second photonic interposer and a second plurality of dies.

24. The photonic system of claim 23, wherein: The optical bridge is on top surfaces of the first photonic interposer and the second photonic interposer.

25. The photonic system of claim 22, wherein: The packaging substrate includes glass.

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